Manufacturing equipment for organic light-emitting display devices

Abstract

The organic light emitting display device manufacturing apparatus includes a first deposition chamber, a second deposition chamber, and a third deposition chamber. The first deposition chamber includes a first evaporation source that dispenses a third light emitting material for forming a third organic light emitting element through a first nozzle arranged to face a spaced region between adjacent stripe patterns on a substrate having a plurality of stripe patterns. The second deposition chamber includes a second evaporation source that dispenses a first light emitting material for forming the first organic light emitting element through a second nozzle arranged to face a first region of the stripe patterns. The third deposition chamber includes a third evaporation source that dispenses a second light emitting material for forming a second organic light emitting element through a third nozzle arranged to face a second region of the stripe patterns. The second nozzle and the third nozzle are inclined in opposite directions to each other with respect to the moving direction of the substrate.

Description

[Technical field]

[0001] An embodiment of the present invention relates to an apparatus for manufacturing an organic light emitting display device. [Background technology]

[0002] 2. Description of the Related Art Recently, flat panel displays having excellent characteristics such as thinness, light weight, and low power consumption have been widely developed and are being applied to various fields.

[0003] Among flat panel displays, an organic light emitting display is a display device that emits light by injecting charges into an organic light emitting layer formed between a second electrode, which is an electron injection electrode, and a first electrode, which is a hole injection electrode, forming pairs of electrons and holes, which then disappear.

[0004] In order to deposit and form an organic light emitting layer constituting an organic light emitting device for each sub-pixel, a fine metal mask (FMM) is used as a deposition pattern mask.

[0005] However, in manufacturing high-definition (e.g., 500 PPI or more) displays or large-area (e.g., 8th generation or more) displays, it is quite difficult to form an emission layer for each subpixel using FMM, and there is also a limit to further increasing the resolution when using FMM.

[0006] Furthermore, when FMM is used, there is a problem that the yield decreases and the production cost increases.

[0007] Furthermore, when using FMM, it is difficult to optimize deposition, which can result in reduced product life. Summary of the Invention [Problem to be solved by the invention]

[0008] An object of the present invention is to provide an apparatus for manufacturing an organic light emitting display device that can effectively form a light emitting layer without using a deposition pattern mask such as an FMM. [Means for solving the problem]

[0009] According to one aspect of an embodiment of the present application, an apparatus for manufacturing an organic light emitting display device includes: a first deposition chamber including a first evaporation source that discharges a third light emitting material to form a third organic light emitting element through a first nozzle arranged facing a spaced area between adjacent stripe patterns on a substrate having a plurality of stripe patterns; a second deposition chamber including a second evaporation source that discharges a first light emitting material to form the first organic light emitting element through a second nozzle arranged facing a first area of ​​the stripe patterns; and a third deposition chamber including a third evaporation source that discharges a second light emitting material to form the second organic light emitting element through a third nozzle arranged facing a second area of ​​the stripe patterns, wherein the second nozzle and the third nozzle are inclined in opposite directions to each other with respect to a moving direction of the substrate.

[0010] The substrate may include a plurality of pixels, each of the plurality of pixels including a first subpixel, a second subpixel, and a third subpixel, the first subpixel, the second subpixel, and the third subpixel being alternately arranged along the first direction and elongated along the second direction, a tilt angle of the first region and the second region of the stripe pattern being 60 degrees to 95 degrees, and the substrate may move in the first direction during deposition in each of the first deposition chamber, the second deposition chamber, and the third deposition chamber.

[0011] The first deposition chamber may discharge the third light emitting material toward the spaced region to form a third organic light emitting layer commonly for each of the first sub-pixel, the second sub-pixel, and the third sub-pixel.

[0012] The first region has at least one or more first surfaces, and the second deposition chamber is capable of ejecting the first light-emitting material toward the at least one or more first surfaces to form a first organic light-emitting layer on the first sub-pixel.

[0013] The second region has at least one or more second surfaces, and the third deposition chamber is capable of ejecting the second light-emitting material toward the at least one or more second surfaces to form a second organic light-emitting layer on the second sub-pixel.

[0014] During a deposition process in the first deposition chamber, the substrate may move in the first direction or the second direction, and during deposition processes in the second deposition chamber and the third deposition chamber, the substrate may move in the first direction.

[0015] The apparatus for manufacturing an organic light emitting display device may include a rotation chamber between the first deposition chamber and the second deposition chamber, which rotates the substrate by 90 degrees.

[0016] The apparatus for manufacturing an organic light emitting display device may include an input chamber at a front end of the first deposition chamber, and the input chamber may have a function of allowing a substrate to be input in a plurality of directions, i.e., one direction and two directions perpendicular to each other.

[0017] The first luminescent material may be a red luminescent material, the second luminescent material may be a green luminescent material, and the third luminescent material may be a blue luminescent material.

[0018] The first luminescent material may be a green luminescent material, the second luminescent material may be a red luminescent material, and the third luminescent material may be a blue luminescent material. Effect of the Invention

[0019] In the embodiment of the present application, two sub-pixels (first sub-pixel and second sub-pixel) constituting a pixel may be located on the corresponding first region (first inclined surface) and second region (second inclined surface) of the stripe pattern, and another sub-pixel (third sub-pixel) may be located on a spaced region between adjacent stripe patterns. In this case, first to third organic light-emitting layers corresponding to the first to third sub-pixels, respectively, are deposited. At this time, the first to third organic light-emitting layers are deposited on the first to third sub-pixels, respectively, using a self-alignment method.

[0020] This makes it possible to form subpixels in a side-by-side structure for high-definition or large-area display devices that are difficult to manufacture using FMM, thereby improving the performance of the display device, such as power consumption, brightness, and lifespan.

[0021] In addition, the side-by-side structure can be realized by an in-line deposition method, which reduces investment costs and improves productivity (for example, about three times or more).

[0022] In addition, the light-emitting layer can be formed without using FMM, improving yield and reducing manufacturing costs.

[0023] In addition, it is now possible to form the organic light-emitting layer without using FMM, and the product life is extended by optimizing deposition.

[0024] Also, the pixels have a three-dimensional structure instead of a planar structure, which increases the light-emitting area and improves the lifetime (eg, by about four times or more).

[0025] Furthermore, due to the three-dimensional structure of the stripe pattern, at least two or more organic light emitting devices emitting different color lights are arranged on at least two or more sub-pixels, which ensures higher resolution than the existing flat structure and can be adopted for XR (extended reality) related devices such as AR (augmented reality), VR (virtual reality), and MR (mixed reality). [Brief description of the drawings]

[0026] [Figure 1] FIG. 1 is a diagram illustrating an organic light emitting display device according to a first embodiment. [Diagram 2] FIG. 2 is a diagram illustrating a schematic stacked structure of the organic light emitting device according to the first embodiment. [Diagram 3] FIG. 3 is a cross-sectional view that illustrates a stripe pattern and a light-emitting layer according to the first embodiment. [Figure 4] FIG. 4 is a diagram illustrating a schematic diagram of a method for depositing a blue light-emitting layer according to the first embodiment. [Diagram 5] FIG. 5 is a diagram illustrating a schematic diagram of a method for depositing a red light-emitting layer according to the first embodiment. [Figure 6] FIG. 6 is a diagram illustrating a schematic diagram of a method for depositing a green light-emitting layer according to the first embodiment. [Figure 7] FIG. 7 is a schematic diagram illustrating another example of a method for depositing a blue light-emitting layer according to the first embodiment. [Figure 8] FIG. 8A is a diagram illustrating a schematic diagram of a stripe pattern design structure and a deposition apparatus design structure in the first embodiment, and FIG. 8B is a diagram illustrating an enlarged view of a portion of the substrate in FIG. 8A. [Figure 9] FIG. 9 is a diagram illustrating an example of a structure of an organic light emitting display device according to a first embodiment. [Figure 10] FIG. 10 is a diagram illustrating a light exit path when the organic light emitting display device of FIG. 9 is a top emission type. [Figure 11]FIG. 11 is a diagram illustrating a light exit path when the organic light emitting display device of FIG. 9 is a top emission type. [Figure 12] FIG. 12 is a diagram illustrating a light exit path when the organic light emitting display of FIG. 9 is a bottom emission type. [Figure 13] FIGS. 13(a), 13(b), and 13(c) are diagrams illustrating various examples of the shape of the stripe pattern of the first embodiment. [Figure 14] FIG. 14 is a diagram illustrating various examples of the shape of the stripe pattern in the first embodiment. [Figure 15] FIG. 15 is a diagram illustrating various examples of the shape of the stripe pattern in the first embodiment. [Figure 16] FIG. 16 is a diagram illustrating various examples of the shape of the stripe pattern in the first embodiment. [Figure 17] FIG. 17 is a diagram illustrating various examples of the shape of the stripe pattern in the first embodiment. [Figure 18] FIG. 18 is a diagram illustrating a layered structure of each organic light emitting device according to the first embodiment. [Figure 19] FIG. 19 is a schematic diagram illustrating an in-line deposition apparatus for forming an organic light emitting device having the stacked structure of FIG. [Figure 20] FIG. 20 is a diagram illustrating a layered structure of each organic light emitting device according to the second embodiment. [Figure 21] FIG. 21 is a diagram illustrating a layered structure of each organic light emitting device according to the third embodiment. [Figure 22] FIG. 22 is a diagram illustrating an organic light emitting display device according to a second embodiment. [Diagram 23] FIG. 23 is a diagram illustrating an example of a method for forming the protection pattern of FIG. [Figure 24] FIG. 24 is a schematic diagram illustrating an organic light emitting display device according to a third embodiment. [Diagram 25] FIG. 25 is a diagram illustrating a schematic pixel structure of a typical display device. [Figure 26]FIG. 26 is a diagram illustrating a pixel structure of a display device according to an embodiment. [Figure 27] FIG. 27 is a diagram illustrating a schematic design model of a pixel of the display device according to the embodiment of FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0027] Hereinafter, the embodiments will be described in detail with reference to the drawings. In the following description, unless otherwise specified, the display device may be referred to as an organic light emitting display device. The row direction or row lines may represent the X-axis direction as a first direction, and the column direction or column lines may represent the Y-axis direction as a second direction perpendicular to the first direction. In the following description, the row direction, row lines, first direction, X-axis direction, etc. may be used interchangeably. Also, the column direction, column lines, second direction, Y-axis direction, etc. may be used interchangeably.

[0028] Alternatively, the first direction may be referred to as the Y-axis direction and the second direction may be referred to as the X-axis direction. In the following description, the sub-pixels SPr, SPg, and SPb may be adjacent to or spaced apart from each other. A pixel P constituting the sub-pixels SPr, SPg, and SPb may be adjacent to or spaced apart from another adjacent pixel P. When the sub-pixels SPr, SPg, and SPb are spaced apart or adjacent pixels P are spaced apart, a black matrix, a bank, a barrier pattern, a color blocking pattern, etc. may be disposed on the spaced area formed by the spaced apart.

[0029] Although elements omitted from the following description may be known in the art, it is obvious that the omitted elements are also within the technical scope of the embodiments. In addition, the elements illustrated in the drawings according to the various embodiments may not necessarily correspond to the corresponding elements in the actual mass-produced products in terms of structure, shape, thickness, width, size, volume, etc., for the convenience of explanation.

[0030] FIG. 1 is a diagram illustrating an organic light emitting display device according to a first embodiment, and FIG. 2 is a diagram illustrating a stacked structure of each organic light emitting element according to the first embodiment.

[0031] 1, an organic light emitting display device 10 according to an embodiment may include a substrate 100 in which a plurality of pixels P are arranged in a matrix form along a column direction (or a first direction) and a row direction (or a second direction) in a display region. Here, the row direction may represent the X-axis direction, and the column direction may represent the Y-axis direction.

[0032] The organic light emitting display device 10 according to the embodiment may be a top emission type display device in which light is emitted toward an upper portion of the substrate 100 to display an image. The organic light emitting display device 10 according to the embodiment may be a bottom emission type display device in which light is emitted toward a lower portion of the substrate 100 to display an image.

[0033] The pixels P may include subpixels of at least three different colors, and may be arranged in the order of a red subpixel SPr, a green subpixel SPg, and a blue subpixel SPb along a first direction (X-axis direction), but are not limited thereto. For example, the red subpixel SPr may be referred to as a first subpixel, the green subpixel SPg may be referred to as a second subpixel, and the blue subpixel SPb may be referred to as a third subpixel. Although not shown, the green subpixel SPg, the red subpixel SPr, and the blue subpixel SPb may be arranged in the order of a first direction (X-axis direction). Although not shown, the red subpixel SPr, the blue subpixel SPb, and the green subpixel SPg may be arranged in the order of a first direction (X-axis direction).

[0034] Meanwhile, in this embodiment, each sub-pixel SPr, SPg, SPb may be arranged in a stripe pattern. Sub-pixels SPr, SPg, SPb of the same color may be arranged in the same column line, and sub-pixels SPr, SPg, SPb of different colors may be arranged alternately in units of column lines. That is, sub-pixels SPr, SPg, SPb of the same color may be arranged in a stripe pattern elongated along the second direction (Y-axis direction). For example, the red sub-pixel SPr may be arranged in a stripe pattern elongated along the second direction. For example, the green sub-pixel SPg may be arranged in a stripe pattern elongated along the second direction adjacent to the red sub-pixel SPr in the first direction. For example, the blue sub-pixel SPb may be arranged in a stripe pattern elongated along the second direction adjacent to the green sub-pixel SPg in the first direction.

[0035] At this time, a red sub-pixel SPr, a green sub-pixel SPg, and a blue sub-pixel SPb arranged adjacent to each other in the row line direction can form a pixel P, which is a unit of color display.

[0036] In this manner, in this embodiment, sub-pixels SPr, SPg, and SPb of different colors are arranged in a side-by-side structure along the row line direction.

[0037] Each of the sub-pixels SPr, SPg, and SPb includes an organic light emitting element that emits light of a corresponding color.

[0038] 2, a red organic light emitting element is disposed on the red sub-pixel SPr, a green organic light emitting element is disposed on the green sub-pixel SPg, and a blue organic light emitting element is disposed on the blue sub-pixel SPb. For example, the red organic light emitting element may be referred to as a first organic light emitting element, the green organic light emitting element may be referred to as a second organic light emitting element, and the blue organic light emitting element may be referred to as a third organic light emitting element, but is not limited thereto.

[0039] The red organic light emitting element, the green organic light emitting element, and the blue organic light emitting element may each include a first electrode E1 as a lower electrode, a second electrode E2 as an upper electrode, and organic light emitting layers R-EML, G-EML, and B-EML interposed between the first electrode E1 and the second electrode E2. That is, the red organic light emitting element may include a red organic light emitting layer R-EML that generates red light, the green organic light emitting element may include a green organic light emitting layer G-EML that generates green light, and the blue organic light emitting element may include a blue organic light emitting layer B-EML that generates blue light. For example, the red organic light emitting layer R-EML may be referred to as a first organic light emitting layer, the green organic light emitting layer G-EML may be referred to as a second organic light emitting layer, and the blue organic light emitting layer B-EML may be referred to as a third organic light emitting layer.

[0040] Here, the first electrode E1 may be one of an anode electrode or a cathode electrode, and the second electrode E2 may be the other one of an anode electrode and a cathode electrode. In this embodiment, the first electrode E1 is an anode electrode, and the second electrode E2 is a cathode electrode.

[0041] Furthermore, the red organic light-emitting device, the green organic light-emitting device, and the blue organic light-emitting device may each include a hole transport structure between the first electrode E1 and the organic light-emitting layer R-EML, G-EML, or B-EML, and an electron transport structure between the organic light-emitting layer R-EML, G-EML, or B-EML and the second electrode E2. The hole transport structure and the electron transport structure may each include a plurality of organic layers. Or, the hole transport structure and the electron transport structure may each include a plurality of organic layers and at least one inorganic layer. For example, the hole transport structure may be referred to as a first transport structure, and the electron transport structure may be referred to as a second transport structure, or vice versa.

[0042] The hole transport structure may include a hole injection layer HIL and / or a hole transport layer HTL, but may also include more organic layers. The hole injection layer HIL and / or the hole transport layer HTL may serve to supply holes to the organic light emitting layers R-EML, G-EML, and B-EML. The electron transport structure functions to inject electrons, and the hole transport layer HTL may include an electron injection layer EIL and / or an electron transport layer ETL, but may also include more organic layers. The electron injection layer EIL and / or the electron transport layer ETL may serve to supply electrons to the organic light emitting layers R-EML, G-EML, and B-EML. The stacked structure of the organic light emitting layer shown in FIG. 2 is an example, and various possible stacked structures are described below.

[0043] A plurality of organic materials included in the hole transport structure and / or the electron transport structure may be commonly disposed in each of the red subpixel SPr, the green subpixel SPg, and the blue subpixel SPb. Thus, the hole transport structure and / or the electron transport structure may be referred to as a common layer. That is, the hole transport structure may be referred to as a first common layer, and the electron transport structure may be referred to as a second common layer, or vice versa. According to the embodiment, even if a common layer is commonly disposed in each of the red subpixel SPr, the green subpixel SPg, and the blue subpixel SPb, the common layers of the red subpixel SPr, the green subpixel SPg, and the blue subpixel SPb may have different thicknesses. This is made possible by a stripe pattern STP having at least two or more regions defining the red subpixel SPr and the green subpixel SPg, and a plurality of evaporation sources that evaporate the red luminescent material, the green luminescent material, and the blue luminescent material in different directions with respect to the substrate 100. Although not shown, the organic materials included in the hole transport structure and / or the electron transport structure may be disposed separately from each other in each of the subpixels SPr, SPg, and SPb.

[0044] Meanwhile, in the embodiment, the blue organic light-emitting layer B-EML is disposed not only on the blue subpixel SPb but also on the red subpixel SPr and the green subpixel SPr. That is, the blue organic light-emitting layer B-EML may be disposed in common to the red subpixel SPr, the green subpixel SPr, and the blue subpixel SPb. In this case, the red organic light-emitting layer R-EML and the green organic light-emitting layer G-EML are disposed on the blue organic light-emitting layer B-EML. In this case, the holes of the hole transport structure are supplied to the red organic light-emitting layer R-EML or the green organic light-emitting layer G-EML via the blue organic light-emitting layer B-EML. Furthermore, the electrons of the electron transport structure are supplied to the red organic light-emitting layer R-EML or the green organic light-emitting layer G-EML. As a result, light is generated in the process in which the light-emitting material is excited by the energy due to the combination of the holes and electrons in the red organic light-emitting layer R-EML or the green organic light-emitting layer G-EML and returns to the ground state.

[0045] Meanwhile, a capping layer CPL may be located on the second electrode E2.

[0046] Meanwhile, in this embodiment, at least two or more inclined surfaces SS1 and SS2 of the stripe pattern STP and a space between the adjacent stripe patterns STP are provided. Furthermore, an evaporation source is disposed facing the inclined surfaces SS1 and SS2 and the space to evaporate the corresponding luminescent material. Thus, the corresponding luminescent material evaporated by the evaporation source is directly deposited on at least two or more inclined surfaces SS1 and SS2 and the space. As a result, a red organic light emitting element is formed as a red sub-pixel SPr on the first inclined surface SS1, a green organic light emitting element is formed as a green sub-pixel SPg on the second inclined surface SS2, and a blue organic light emitting element is formed as a blue sub-pixel SPb on the space. As a result, no FMM is used or the number of FMMs used is significantly reduced, which significantly reduces costs and significantly simplifies the manufacturing process.

[0047] This will be described in more detail with reference to Fig. 3. Fig. 3 is a cross-sectional view showing a stripe pattern and a light emitting layer according to the first embodiment. For convenience of explanation, Fig. 3 mainly shows the stripe pattern and the light emitting layer, and the other components are omitted.

[0048] 1 to 3, a plurality of stripe patterns STP are formed on a substrate 100 of an organic light emitting display device 10, the stripe patterns STP being extended in a column line direction.

[0049] At this time, the stripe pattern STP is repeatedly arranged for each pixel P in the row line direction, that is, it is periodically arranged for each pixel P.

[0050] Such a stripe pattern STP is formed corresponding to a column line region in which two adjacent sub-pixels SP, for example, a red sub-pixel SPr and a green sub-pixel SPg, are formed. That is, the red sub-pixel SPr and the green sub-pixel SPg may be located in a corresponding first region and a second region of the stripe pattern STP, respectively. Each of the sub-pixels SPr and the green sub-pixel SPg may be positioned long along the length direction of the stripe pattern STP. A blue sub-pixel SPb may be positioned in a spaced region between the two adjacent stripe patterns STP, i.e., a third region. The blue sub-pixel SPb may be positioned long along the length direction of the stripe pattern STP.

[0051] The stripe pattern STP is formed in a taper shape in which the width narrows toward the top of the substrate 100 (i.e., in a direction away from the substrate 100), and both side surfaces in the width direction may be inclined surfaces. For convenience of explanation in this embodiment, the inclined side surface located on the left side of the drawing is called a first inclined surface SS1, and the inclined side surface located on the right side is called a second inclined surface SS2. For example, the first inclined surface SS1 may be called a first region, and the second inclined surface SS2 may be called a second region, but this is not limiting.

[0052] As will be described later, the stripe pattern STP is formed to have a constant width along the upper direction of the substrate 100. That is, the stripe pattern STP may have a first inclined surface SS1 and a second inclined surface SS2 each perpendicular to a plane (or ground).

[0053] Meanwhile, the stripe pattern STP is configured to have a top surface (or a top surface) TM connecting the top ends of the first inclined surface SS1 and the second inclined surface SS2 between them. The top surface TM may be configured to have a substantially flat planar shape, but is not limited thereto, and may also have a curved shape.

[0054] A red sub-pixel SPr and a green sub-pixel SPg of the pixel P may be located corresponding to the first and second inclined surfaces SS1 and SS2, respectively. A blue sub-pixel SPb may be located corresponding to a spaced region between adjacent stripe patterns STP.

[0055] Meanwhile, in the organic light emitting display device 10 of this embodiment, the blue light emitting layer B-EML is formed not only in the corresponding blue sub-pixel SPb but also in the red sub-pixel SPr and the green sub-pixel SPg. That is, the blue light emitting layer B-EML is commonly formed on the entire region of the substrate 100, i.e., all the sub-pixels SP, i.e., the red sub-pixel SPr, the green sub-pixel SPg and the blue sub-pixel SPb. This structure is called a blue common structure.

[0056] In such a blue common structure, the blue light-emitting layer B-EML covers the stripe patterns STP and can also cover the spaced regions of the substrate 100 between adjacent stripe patterns STP.

[0057] In this blue common structure, the blue light-emitting layer B-EML located in the blue sub-pixel SPb functions to generate blue light, and the blue light-emitting layers B-EML located in the red and green sub-pixels SPr and SPg, i.e., the blue light-emitting layers B-EML located on the first and second slanted surfaces SS1 and SS2, can function as charge transport layers (e.g., hole transport layers).

[0058] As described above, in this embodiment, it is not necessary to use a separate deposition pattern mask such as FMM when depositing the blue light-emitting layer B-EML.

[0059] The red light-emitting layer R-EML is deposited on the corresponding first tilted surface SS1, and the green light-emitting layer G-EML is deposited on the corresponding second tilted surface SS2. More specifically, the red light-emitting layer R-EML is deposited on the portion of the blue light-emitting layer B-EML located on the corresponding first tilted surface SS1, and the green light-emitting layer G-EML is deposited on the portion of the blue light-emitting layer B-EML located on the corresponding second tilted surface SS2.

[0060] In contrast, in this embodiment, a slanted stripe pattern STP is provided, and due to the shadow effect of the stripe pattern STP, the red luminescent material is selectively deposited on the corresponding first slanted surface SS1 to form a red luminescent layer R-EML in a pattern shape, and the green luminescent material is selectively deposited on the corresponding second slanted surface SS2 to form a green luminescent layer G-EML in a pattern shape.

[0061] In this manner, by using the stripe pattern STP, the red light emitting layer R-EML and the green light emitting layer G-EML are formed in a pattern shape in a desired region by a self-aligned deposition method.

[0062] As a result, there is no need to use a separate deposition pattern mask such as an FMM during deposition for the red light emitting layer R-EML and the green light emitting layer G-EML.

[0063] Hereinafter, a method for depositing the red, green and blue light emitting layers according to the first embodiment will be described with reference to FIGS.

[0064] For convenience of explanation, in FIGS. 4 to 6, a case is shown in which the luminescent material is deposited while the substrate 100 on which the stripe pattern STP is formed is moved rightward in the drawings.

[0065] The substrate 100 is disposed so that the stripe pattern STP faces downward, and evaporation sources 410 to 430 for evaporating the luminescent material to be deposited on the substrate 100 may be disposed below the substrate 100 at a certain distance therefrom.

[0066] Referring to FIG. 4 for the deposition of the blue light-emitting layer B-EML, in the deposition chamber for the blue light-emitting layer B-EML, the substrate 100 on which the stripe pattern STP is formed moves in a row direction (or X direction) perpendicular to the column direction (or Y direction) in which the stripe pattern STP extends, and a blue light-emitting material is deposited on the substrate 100 while the substrate 100 moves.

[0067] In contrast, a first nozzle 415 for ejecting evaporated luminescent material is located on the upper surface of the first evaporation source 410 of the blue luminescent material, and this first nozzle 415 extends in a normal direction (or Z direction) to the plane of the substrate 100, i.e., in a direction perpendicular to the plane of the substrate 100.

[0068] Meanwhile, a first angle limiting plate 416 for limiting a deposition angle and / or a deposition range is provided, and the first angle limiting plate 416 defining an opening 417 having a width wider than the first nozzle 415 (or the first evaporation source 410) is provided above the first nozzle 415. For example, the first angle limiting plate 416 extending in a vertical direction may be disposed on both sides of the first nozzle 415, and the upper end of the first angle limiting plate 416 may be positioned higher than the first nozzle 415. In order to increase the material utilization efficiency of the luminescent material, the deposition apparatus may be configured in such a manner that the distance between the substrate 100 and the first nozzle 415 is reduced and the distance (i.e., the offset value) between the first nozzle 415 and the first angle limiting plate 416 is increased.

[0069] The distance between the substrate 100 and the first nozzle 415 is fixed, and the blue luminescent material is discharged with its size in the hemisphere adjusted according to the offset value of the first angle limiting plate 416 above the first evaporation source 410, and the blue luminescent material is continuously deposited on the entire surface of the substrate 100 according to the appropriate offset value. Here, the red and green sub-pixels SPr and SPg are located corresponding to the inclined surfaces of the stripe pattern STP, and the blue sub-pixel SPb is located corresponding to the flat surface of the substrate 100. As a result, the blue luminescent layers B-EML of the sub-pixels of different colors can have different thicknesses.

[0070] On the other hand, the blue light-emitting layer B-EML is formed to the same thickness for subpixels of the same color. For example, the blue light-emitting layer B-EML of the same thickness is formed in the red subpixels SPr, the blue light-emitting layer B-EML of the same thickness is formed in the green subpixels SPg, and the blue light-emitting layer B-EML of the same thickness is formed in the blue subpixels SPb.

[0071] Referring to FIG. 5 regarding the deposition of the red light-emitting layer R-EML, in the deposition chamber for the red light-emitting layer R-EML, the substrate 100 on which the blue light-emitting layer B-EML is formed is moved in the row direction, and a red light-emitting material is deposited on the substrate 100 while the substrate 100 is moving.

[0072] In contrast, a second nozzle 425 for discharging evaporated luminescent material is located on the upper surface of the second evaporation source 420 of the red luminescent material, and the second nozzle 425 extends in a direction inclined with respect to a direction perpendicular to the plane of the substrate 100. That is, the second nozzle 425 is configured to be inclined so as to face the first inclined surface SS1 of the stripe pattern STP corresponding to the deposition surface of the red luminescent material. At this time, the second angle limiting plate 426 is set to a deposition angle designed to be optimized for the pre-deposition substrate structure, so that the red luminescent layer R-EML is not deposited in the region (or blue sub-pixel SPb) between the adjacent stripe patterns STP. Here, the second angle limiting plate 426 is disposed on the second evaporation source 420 so as to block it. For example, the second angle limiting plate 426 may include a horizontal portion 426a covering the second evaporation source 420 and an extended vertical portion 426b bent in the following direction from the horizontal portion 426a and positioned in a direction opposite to the inclination direction of the second nozzle 425 (i.e., the right direction in the drawing) (i.e., the left direction in the drawing).

[0073] In this manner, the second nozzle 425 is configured to be inclined forward in order to view the first inclined surface SS1, which is the rear inclined surface with respect to the substrate movement direction.

[0074] In this case, when the substrate 100 is viewed from the second nozzle 425, the spaced region between the second inclined surface SS2 and the stripe pattern STP corresponds to a shadow region, and the first inclined surface SS1 corresponds to a visible region.

[0075] This allows the red light emitting material to be discharged from the second nozzle 425 and to be incident on the first inclined surface SS1 substantially perpendicularly.

[0076] Thus, the red light emitting material is deposited substantially on the first inclined surface SS1 to form the red light emitting layer R-EML in the red sub-pixel SPr.

[0077] Referring to FIG. 6 regarding the deposition of the green light-emitting layer G-EML, in the deposition chamber for the green light-emitting layer G-EML, the substrate 100 on which the red light-emitting layer R-EML is formed is moved in the row direction, and a green light-emitting material is deposited on the substrate 100 while the substrate 100 is moving.

[0078] Meanwhile, a third nozzle 435 for discharging evaporated luminescent material is positioned on the upper surface of the third evaporation source 430 of the green luminescent material, and the third nozzle 435 extends in a direction inclined with respect to a direction perpendicular to the plane of the substrate 100. That is, the third nozzle 435 is configured to be inclined so as to face the second inclined surface SS2 of the stripe pattern STP corresponding to the deposition surface of the green luminescent material.

[0079] Here, the third angle limiting plate 436 is disposed above the third evaporation source 430 to block it. For example, the third angle limiting plate 436 may include a horizontal portion 436a that covers the third evaporation source 430 and a vertical portion 436b that is located in a direction opposite to the inclination direction (i.e., leftward in the drawing) of the third nozzle 435 (i.e., rightward in the drawing) and is bent from the horizontal portion 436a in the following direction.

[0080] In this manner, the third nozzle 435 is configured to be inclined backward in order to view the second inclined surface SS2, which is the forward inclined surface based on the substrate movement direction. That is, the third nozzle 435 is configured to be inclined in the opposite direction to the second nozzle 425.

[0081] In this case, when the substrate 100 is viewed from the third nozzle 435, the spaced region between the first inclined surface SS1 and the stripe pattern STP corresponds to a shadow region, and the second inclined surface SS2 corresponds to a visible region.

[0082] This allows the green luminescent material to be discharged from the third nozzle 435 and to be incident on the second inclined surface SS2 substantially perpendicularly.

[0083] Thus, the green light emitting material is deposited substantially on the second inclined surface SS2 to form a green light emitting layer G-EML in the green sub-pixel SPg.

[0084] Meanwhile, in the above description, the red light-emitting layer R-EML is formed followed by the green light-emitting layer G-EML, but the deposition processes may be performed in the opposite order.

[0085] Meanwhile, regarding the formation of the blue light-emitting layer B-EML, the thickness of the blue light-emitting layer B-EML formed in the red and green subpixels SPr and SPg is formed thinner than the thickness of the blue light-emitting layer B-EML formed in the blue subpixel SPb. Furthermore, by minimizing the influence of deposition shadows due to the first inclined surface SS1 and the second inclined surface SS2 of the red and green subpixels SPr and SPg on the thickness of the blue light-emitting layer B-EML, the thickness of the blue light-emitting layer B-EML of the blue subpixel SPb can be made uniform within the substrate.

[0086] 7 in this regard, a fourth angle limiting plate 418 defining an opening 417 of a certain width is disposed between a first evaporation source 410 of a blue luminescent material and the substrate 100. For example, the opening 417 may have a width wider than that of the first evaporation source 410 (or the first nozzle 415).

[0087] Here, the fourth angle limiting plate 418 has an upper end positioned higher than the first angle limiting plate 416 described above, and the deposition angle is narrower than when the first angle limiting plate 416 is used.

[0088] When such a fourth angle limiting plate 418 is used, the incident angle of the blue light emitting material to the substrate 100 becomes narrower so as to be close to perpendicular.

[0089] As a result, the thickness of the blue light-emitting layer B-EML deposited on the first and second inclined surfaces SS1 and SS2 of the red and green sub-pixels SPr and SPg is reduced. For example, the thickness of the blue light-emitting layer B-EML of the red and green sub-pixels SPr and SPg may be approximately 80% or less of the thickness of the blue light-emitting layer B-EML of the blue sub-pixel SPb.

[0090] As described above, when the thickness of the blue light-emitting layer B-EML is thin, the influence of the blue dopant on the organic light-emitting elements of the red and green sub-pixels SPr and SPg can be minimized, thereby improving color perception and device efficiency.

[0091] The first evaporation source 410 can be applied to all common layers (e.g., hole injection layer HIL, hole transport layer HTL, electron injection layer EIL, electron transport layer ETL, capping layer CPL, etc.) in addition to the blue light-emitting layer B-EML. In this case, the thickness of the common layer deposited for each subpixel SP can be optimized by designing an appropriate offset value of the angle limiting plate for the common layer. Therefore, when it is necessary to differentiate the common layer for each subpixel, such as improving the optical characteristics depending on the product, various combinations of evaporation sources and angle limiting plate structures are possible.

[0092] Meanwhile, in order to improve or adjust the thickness uniformity of the common layer, a method of optimizing the structure of the evaporation source as shown in FIG. 4 and FIG. 7 can be used, or a method of changing the movement of the substrate in the deposition apparatus can be used in a different way.

[0093] In this regard, for example, when depositing a common layer including a blue light-emitting layer B-EML, the movement direction of the substrate 100 can be the column direction (second direction) in which the stripe pattern STP is extended, and when depositing a red light-emitting layer R-EML and a green light-emitting layer G-EML, the movement direction of the substrate 100 can be the row direction perpendicular to the column direction. In this case, the influence of the shadow effect due to the stripe pattern STP on the deposition uniformity of the common layer can be minimized, and the design freedom for the angle limiting plate of the evaporation source is increased, thereby improving the material utilization efficiency. In this case, a chamber for rotating the substrate may be added to the deposition apparatus.

[0094] The design structure of the stripe pattern STP and the design structure of the deposition apparatus will be described in more detail with reference to Fig. 8. For convenience of explanation, Fig. 8 takes deposition of the green light emitting layer G-EML as an example, and does not show the blue light emitting layer B-EML and the first electrode E1 formed thereunder. Fig. 8(B) shows an enlarged view of a portion of the substrate of Fig. 8(A).

[0095] In the oblique surface deposition of the luminescent material, the main factors for designing the stripe pattern STP are the height H, the first width W1, and the second width W2. The height H may be the height of the stripe pattern STP. The first width W1 may be the width of the stripe pattern STP projected perpendicularly to the first oblique surface SS1. The second width W2 may be the width of the separation area between adjacent stripe patterns STP.

[0096] A deposition angle θe (or a maximum deposition angle) for depositing the green luminescent material on the second inclined surface SS2 due to the shadow effect can be expressed by the following Equation 1.

[0097] Formula 1: tan θe = H / (W1 + W2)

[0098] In this regard, based on the plane of the substrate 100, an imaginary line can be drawn connecting the lower end point of the effective light-emitting area of ​​the green sub-pixel SPg to one end of the upper surface TM of the stripe pattern STP located in front of it, and this imaginary line can be said to substantially correspond to the deposition angle θe in Equation 1.

[0099] On the other hand, the configuration of the deposition apparatus for the inclined surface deposition as described above is arranged so as to satisfy the deposition angle θe.

[0100] Meanwhile, in the green light emitting layer deposition chamber, a third angle limiting plate 436 is disposed between the third evaporation source 430 of the green light emitting material and the substrate 100 .

[0101] The third angle limiting plate 436 has a width substantially greater than that of the third evaporation source 430 and is configured so as to be able to block the third evaporation source 430 entirely.

[0102] On the other hand, the third nozzle 435 of the third evaporation source 430 is configured to be inclined backward so that the second inclined surface SS2 can be viewed.

[0103] At this time, the third evaporation source 430 and the third angle limiting plate 436 are positioned so that a virtual line connecting the rear end of the third nozzle 435 and the rear end of the third angle limiting plate 436 (i.e., one end in the evaporation direction) is at a deposition angle θe, which can be expressed by the following mathematical equation 2.

[0104] Formula 2: tanθe=TS / Loffset.

[0105] Here, TS is the vertical distance between the substrate 100 and the third evaporation source 430 (more specifically, the third nozzle 435), and Loffset is the shortest horizontal distance from the third evaporation source 430 to a point on the substrate 100 where deposition of the luminescent material is possible.

[0106] It is preferable to design the stripe pattern STP and the deposition apparatus so that the above formulas 1 and 2 are satisfied.

[0107] The structure of the organic light emitting display device according to this embodiment will be described in more detail with reference to FIG.

[0108] 9, in the organic light emitting display device 10 of the present embodiment, a driving circuit DC for driving each sub-pixel SP is formed on a substrate 100. The driving circuit DC may include a plurality of transistors including a driving transistor, at least one capacitor, etc.

[0109] A planarization layer 110 made of an insulating material is formed on the driving circuit DC. A contact hole 111 exposing one electrode of the driving circuit DC is formed in the planarization layer 110. Here, the one electrode of the driving circuit DC may be a drain electrode of any one of the transistors included in the driving circuit DC.

[0110] An auxiliary electrode (or connecting electrode) E11 patterned for each subpixel SP is formed on the planarization layer 110. The auxiliary electrode E11 may be considered to correspond to one electrode layer constituting the first electrode E1, and the auxiliary electrode E11 may contact one electrode of the driving circuit DC through a contact hole 111 of the corresponding subpixel SP. The auxiliary electrode E11 and the first electrode E1 may include different metals, but are not limited thereto. The auxiliary electrode E11 and / or the first electrode E1 may be a single layer or may include multiple metal layers.

[0111] Alternatively, the first auxiliary electrode E11 may be referred to as a first anode electrode, the first electrode E1 may be referred to as a second anode electrode, and the first anode electrode and the second anode electrode may constitute a first electrode.

[0112] A stripe pattern STP is formed on the auxiliary electrodes E11 of the red sub-pixel SPr and the green sub-pixel SPg.

[0113] The stripe pattern STP may be positioned to correspond to an area in which the red sub-pixels SPr and the green sub-pixels SPg are formed.

[0114] At this time, one end of the auxiliary electrode E11 of the red sub-pixel SPr is located outside the first inclined surface SS1 of the stripe pattern STP and is exposed without being covered by the stripe pattern STP.

[0115] The other end of the auxiliary electrode E11 of the green sub-pixel SPg is located outside the second inclined surface SS2 of the stripe pattern STP and is exposed without being covered by the stripe pattern STP.

[0116] Meanwhile, the auxiliary electrode E11 of the blue sub-pixel SPb is located between the adjacent stripe patterns STP and is exposed without being covered by the stripe patterns STP.

[0117] The stripe pattern STP may be made of an organic insulating material and may be formed by a printing method or a photolithography method. The organic insulating material may be, but is not limited to, a polyimide-based or acrylic-based resin.

[0118] After forming the stripe pattern STP, a first electrode E1 is patterned for each sub-pixel SP. The first electrode E1 is in contact with an auxiliary electrode E11 located thereunder and connected to a driving circuit DC.

[0119] In this regard, the first electrode E1 of the red sub-pixel SPr is formed along the first inclined surface SS1 of the stripe pattern STP, and the lower end thereof may be in contact with one end of the auxiliary electrode E11.

[0120] The first electrode E1 of the green sub-pixel SPg is formed along the second inclined surface SS2 of the stripe pattern STP, and the lower end thereof may be in contact with the other end of the auxiliary electrode E11.

[0121] Meanwhile, the first electrode E1 of the blue sub-pixel SPb may be located between adjacent stripe patterns STP and may be in full contact with the auxiliary electrode E11 thereunder.

[0122] After forming the first electrode E1, a common layer consisting of a hole injection layer HIL and a hole transport layer HTL may be formed in that order on the substrate 100, and another common layer, a blue light-emitting layer B-EML, may be formed by deposition on top of the hole transport layer HTL.

[0123] The blue light-emitting layer B-EML is formed in common to all of the sub-pixels SPr, SPg, and SPb, on the first and second inclined surfaces SS1 and SS2 of the stripe patterns STP, and in the spaced regions between adjacent stripe patterns STP.

[0124] After forming the blue light-emitting layer B-EML, a red light-emitting layer R-EML is deposited on the blue light-emitting layer B-EML located on the corresponding first inclined surface SS1, and a green light-emitting layer G-EML is deposited on the blue light-emitting layer B-EML located on the corresponding second inclined surface SS2.

[0125] After forming the red light-emitting layer R-EML and the green light-emitting layer G-EML, an electron transport layer ETL and an electron injection layer EIL may be formed as a common layer on the substrate 100, and a second electrode E2 may be formed on the substrate 100. The second electrode E2 may be commonly formed on the entire substrate 100.

[0126] As described above, the red organic light emitting element is disposed on the first inclined surface SS1 of the stripe pattern STP, the green organic light emitting element is disposed on the second inclined surface SS2 of the stripe pattern STP, and the blue organic light emitting element is disposed on the separation region between adjacent stripe patterns STP. The first inclined surface SS1 and the second inclined surface SS2 may have an inclined surface inclined with respect to the separation region. In this case, the first inclined angle of the first inclined surface SS1 and the second inclined angle of the second inclined surface SS2 may be the same or different.

[0127] Therefore, the light emission directions of the red organic light-emitting element, the green organic light-emitting element, and the blue organic light-emitting element are different from each other. For example, red light is emitted in the 10 o'clock direction through the top surface of the red organic light-emitting element. For example, green light is emitted in the 2 o'clock direction through the top surface of the green organic light-emitting element. For example, blue light is emitted in the 12 o'clock direction through the top surface of the blue organic light-emitting element.

[0128] Meanwhile, when the organic light emitting display device 10 configured as described above is a top emission type, the lower electrode including the auxiliary electrode E11 and the first electrode E1 may have a reflective characteristic, and the second electrode E2, which is an upper electrode, may have a transmissive characteristic or a semi-transmissive characteristic. In this regard, for example, the auxiliary electrode E11 may be made of ITO, Ti or Mo, and the first electrode E1 may be made of ITO / (Ag or Ag alloy) / ITO so as to have a high reflectance. Meanwhile, the second electrode E2 may be made of ITO or Mg-Ag. In this case, reference may be made to FIG. 10 for the light path, and FIG. 10 illustrates the light output path of the red sub-pixel SPr as an example.

[0129] As another example, the auxiliary electrode E11 may have a single layer structure of Ag, Ag alloy, or Al, or a multilayer structure containing Ag or Ag alloy (e.g., ITO / (Ag or Ag alloy) / ITO, ITO / (Ag or Ag alloy) / Ti, or ITO / (Ag or Ag alloy) / Mo) to have high reflectance characteristics. Also, the first electrode E1 may be a single layer of ITO, and the second electrode E2 may be made of ITO or Mg-Ag. FIG. 11 may be referred to for the light path in this case, and FIG. 11 illustrates the light output path of the red sub-pixel SPr as an example.

[0130] When the organic light emitting display device 10 configured as above is a bottom emission type, the auxiliary electrode E11 and the first electrode E1 constituting the bottom electrode may both have a transmissive characteristic, and the second electrode E2 may have a reflective characteristic. In this regard, the second electrode E2 may be made of Al, for example. In this case, reference may be made to FIG. 12 for the light path, and FIG. 12 illustrates the light output path of the red sub-pixel SPr as an example.

[0131] Meanwhile, the stripe pattern STP of this embodiment may have various shapes, and in regard to this, reference may be made to FIGS.

[0132] As shown in (a) of FIG. 13 to (c) of FIG. 13, the stripe pattern STP can have at least two or more faces.

[0133] As an example, the stripe pattern STP may have a symmetric polygonal shape (FIG. 13(a)). The stripe pattern STP having such a symmetric polygonal shape has already been described above. For example, the stripe pattern STP may have a first inclined surface SS1, a second inclined surface SS2, and an upper surface TM. In this case, the first inclined surface SS1 and the second inclined surface SS2 may be symmetrical with respect to a vertical line. For example, the interior angle of the first inclined surface SS1 with respect to a plane (or the ground) and the interior angle of the second inclined surface SS2 with respect to the plane may be the same. Here, the interior angle may be referred to as an inclination angle. In this case, the interior angle may be an acute angle. The length of the first inclined surface SS1 or the second inclined surface SS2 may be greater than the length of the upper surface TM. The area of ​​the first inclined surface SS1 or the second inclined surface SS2 may be greater than the area of ​​the upper surface TM.

[0134] Meanwhile, the red light emitting layer R-EML is disposed on the first inclined surface SS1, and the green light emitting layer G-EML is disposed on the second inclined surface SS2. Since the amount of light increases as the area of ​​the red light emitting layer R-EML or the green light emitting layer G-EML increases, the area of ​​the upper surface TM can be minimum or zero, and the area of ​​the first inclined surface SS1 or the second inclined surface SS2 can be maximum. Here, the area of ​​the upper surface TM is controlled so that the height and inclination angle of the stripe pattern STP are the same or similar on each of the sub-pixels SPr, SPg, and SPb of the plurality of pixels P on the substrate 100 by using a patterning technique suited to the resolution of the product. For example, when patterning by a photolithography method, the process cannot be controlled unless there is a certain area or more.

[0135] As another example, the stripe pattern STP may have an asymmetric polygonal shape (FIG. 13(b)).

[0136] For example, the stripe pattern STP may have a first inclined surface SS1, a second inclined surface SS2, and an upper surface TM. In this case, the first inclined surface SS1 and the second inclined surface SS2 may be asymmetric with respect to a vertical line. For example, the interior angle of the first inclined surface SS1 with respect to a plane and the interior angle of the second inclined surface SS2 with respect to a plane may be different. Here, the interior angle may be referred to as an inclination angle. In this case, the interior angle may be an acute angle. The length of the first inclined surface SS1 and the second inclined surface SS2 may be greater than the length of the upper surface TM. The length of the first inclined surface SS1 may be greater than the length of the second inclined surface SS2. The area of ​​the first inclined surface SS1 may be greater than the area of ​​the second inclined surface SS2. Although not shown, the length of the second inclined surface SS2 may be greater than the length of the first inclined surface SS1. The area of ​​the second inclined surface SS2 may be greater than the area of ​​the first inclined surface SS1.

[0137] On the other hand, a red light-emitting layer R-EML is disposed on the first inclined surface SS1, and a green light-emitting layer G-EML is disposed on the second inclined surface SS2.

[0138] Since the red light-emitting layer R-EML, the green light-emitting layer G-EML, and the blue light-emitting layer B-EML have different lifetimes, it is preferable to design the area of ​​each subpixel to be different. Therefore, according to the embodiment, the interior angle (60 degrees to 95 degrees) and the width of the lower surface (W2 in FIG. 8B) of each of the first and second inclined surfaces SS1 and SS2 are optimized as design variables. That is, since the lifetime of the product is determined by the subpixel with the shortest lifetime, the area ratio between the R, G, and B subpixels SPr, SPg, and SPb can be optimized to improve the lifetime of the entire product. When the product lifetime is sufficiently satisfied, the brightness of the product can be improved. Also, when a design margin occurs in the brightness, the power consumption is reduced. Furthermore, a sufficient process margin must be secured in order to increase the productivity and yield. Design margins are optimized in the inclination angle, the distance between the anodes, and the like so that the process margin is sufficiently secured.

[0139] However, according to the embodiment, the area of ​​the inclined surface on which the light-emitting layer with a relatively low brightness is disposed is increased, and the area of ​​the inclined surface on which the light-emitting layer with a relatively high brightness is disposed is decreased. For example, when the brightness of the red light-emitting layer R-EML is low, the area of ​​the first inclined surface SS1 is made larger than the area of ​​the second inclined surface SS2 as shown in (b) of FIG. 13, and the competitiveness of the product in terms of brightness, power consumption, etc. can be ensured by optimizing the life span between pixels. On the other hand, when the brightness of the green light-emitting layer G-EML is low, the area of ​​the second inclined surface SS2 is made larger than the area of ​​the first inclined surface SS1 (not shown), and the competitiveness of the product in terms of brightness, power consumption, etc. can be ensured by optimizing the life span between pixels.

[0140] In this way, by making the inclined surfaces SS1 and SS2 on both sides different, it is possible to compensate for the difference in efficiency and life span between the red organic light emitting element and the green organic light emitting element.

[0141] As yet another example, the stripe pattern STP may have a rectangular shape (FIG. 13(c)).

[0142] For example, the stripe pattern STP may have a first inclined surface SS1, a second inclined surface SS2, and a top surface TM. In this case, the first inclined surface SS1 and / or the second inclined surface SS2 may have a right angle with respect to the horizontal line. That is, the first inclined surface SS1 may have a right angle with respect to the horizontal line. The second inclined surface SS2 may have a right angle with respect to the horizontal line. For example, the interior angle of the first inclined surface SS1 with respect to the plane and the interior angle of the second inclined surface SS2 with respect to the plane may be the same or different. Both the interior angle of the first inclined surface SS1 with respect to the plane and the interior angle of the second inclined surface SS2 with respect to the plane may be right angles. The interior angle of the first inclined surface SS1 with respect to the plane may be a right angle, and the interior angle of the second inclined surface SS2 with respect to the plane may be an angle smaller than 90 degrees. The interior angle of the second inclined surface SS2 with respect to the plane may be a right angle, and the interior angle of the first inclined surface SS1 with respect to the plane may be an angle smaller than 90 degrees.

[0143] The length of the first inclined surface SS1 and the second inclined surface SS2 may be the same as or different from the length of the upper surface TM. The length of the first inclined surface SS1 and the second inclined surface SS2 may be the same as or larger than the length of the upper surface TM. The area of ​​the first inclined surface SS1, the area of ​​the second inclined surface SS2, and the area of ​​the upper surface TM may be the same as or different. The area of ​​the first inclined surface SS1 and the second inclined surface SS2 may be the same as or larger than the area of ​​the upper surface TM. The length of the first inclined surface SS1 and the length of the second inclined surface SS2 may be the same as or different from each other. The area of ​​the first inclined surface SS1 and the area of ​​the second inclined surface SS2 may be the same as each other.

[0144] In (c) of Fig. 13, the stripe pattern STP may have a first inclined surface SS1 and / or a second inclined surface SS2 that are perpendicular to the ground. The stripe pattern STP may also have a top surface. Although not shown, the interior angle of the first inclined surface SS1 and / or the second inclined surface SS2 with respect to the ground may be an obtuse angle, i.e., an angle of 90 degrees or more. When the interior angle of the first inclined surface SS1 and / or the second inclined surface SS2 with respect to the ground is an obtuse angle, the stripe pattern STP may have an inverse tapered shape.

[0145] In the embodiment, the interior angle of the first inclined surface SS1 and / or the second inclined surface SS2 of the stripe pattern STP may be 60 degrees to 95 degrees, but is not limited thereto.

[0146] The red light-emitting layer R-EML is disposed on the first inclined surface SS1, and the green light-emitting layer G-EML is disposed on the second inclined surface SS2. In this case, the narrower the gap between the red light-emitting layer R-EML and the green light-emitting layer G-EML, the more advantageous it is for miniaturization and high PPI side surfaces. Therefore, it is preferable to minimize the length and area of ​​the upper surface TM.

[0147] Referring to FIG. 14, the stripe pattern STP is configured to have an inclined surface that is curved and bulges outward.

[0148] Referring to FIG. 15, the stripe pattern STP is configured to have an inwardly recessed inclined surface as a curved inclined surface.

[0149] Referring to FIG. 16, the stripe pattern STP is configured to have an inclined surface having a curved shape, that is, a protruding portion and a recessed portion.

[0150] 17, the stripe pattern STP may have a polygonal shape. The stripe pattern STP may have a first inclined surface SS1, a second inclined surface SS2, and a top surface TM. In the drawing, the first inclined surface SS1 and the second inclined surface SS2 are illustrated as being symmetrical with respect to a vertical line, but may be asymmetrical with respect to each other.

[0151] For example, the first inclined surface SS1 may have a plurality of first sub-inclined surfaces 311, 312. The interior angles between the plurality of first sub-inclined surfaces 311, 312 may be the same or different from each other. For example, the second inclined surface SS2 may have a plurality of second sub-inclined surfaces 321, 322.

[0152] The interior angles between the second sub-inclined surfaces 321 and 322 may be the same or different. For example, the red light emitting layer R-EML is disposed on the first sub-inclined surfaces 311 and 312. For example, the green light emitting layer G-EML is disposed on the second sub-inclined surfaces 321 and 322. In this case, the red light emitting layer R-EML disposed on the first sub-inclined surfaces 311 and 312 having different interior angles emits red light in different directions. Also, the green light emitting layer G-EML disposed on the second sub-inclined surfaces 321 and 322 having different interior angles emits green light in different directions. As a result, the red light R-EML and the green light G-EML are emitted at a larger radiation angle, and a high-luminance and high-definition image is displayed. For example, there is an advantage that a high-definition display device with 2000 PPI or more can be more effectively realized.

[0153] As described above, the stripe pattern STP of this embodiment is basically tapered in that the width gradually decreases toward the top, and the shape of the inclined surface can be modified in various ways.

[0154] The organic light emitting element of the organic light emitting display device of this embodiment may be manufactured using an in-line type deposition apparatus, which will be described in more detail below. In addition, the embodiment may be adopted in a cluster type if the structure or design of each chamber is changed to be similar or the same as that of the in-line type. That is, if each chamber is modified so that the direction of transport of the substrate 100 or the direction of transport of the evaporation source are similar for a specific organic light emitting layer, for example, a red organic light emitting layer R-EML or a red organic light emitting layer G-EML, the in-line type deposition apparatus may be similarly applied to the cluster type. FIG. 18 is a diagram illustrating a stacked structure of each organic light emitting element according to the first embodiment, and FIG. 19 is a diagram illustrating a schematic in-line type deposition apparatus for forming an organic light emitting element having the stacked structure of FIG. 18.

[0155] In the structure of the organic light emitting device shown in FIG. 1 and FIG. 18, the red, green and blue sub-pixels SPr, SPg and SPb each have a blue light emitting layer B-EML, a hole injection layer and / or hole transport layer HIL, HTL under the blue light emitting layer B-EML, an electron transport layer ETL and / or electron injection layer EIL on the blue light emitting layer B-EML, and a capping layer CPL on the second electrode E2. The arrangement order of the hole injection layer HIL and the hole transport layer HTL can also be changed. In addition, the arrangement order of the electron transport layer ETL and the electron injection layer EIL can also be changed. As described above, the hole injection layer and / or hole transport layer HIL, HTL are included in the hole transport structure, the electron transport layer ETL and the electron injection layer EIL are included in the electron transport structure, and each of the hole transport structure and the electron transport structure can include more organic layers than the above.

[0156] On the other hand, in the red sub-pixel SPr, a red light-emitting layer R-EML is formed on the blue light-emitting layer B-EML, and in the green sub-pixel SPg, a green light-emitting layer G-EML is formed on the blue light-emitting layer B-EML.

[0157] In order to realize such a laminated structure, an in-line deposition apparatus as shown in Fig. 19 can be used. In this regard, the in-line deposition apparatus has a plurality of deposition chambers for depositing a plurality of laminated films constituting an organic light emitting device, for example, first to seventh deposition chambers CH1 to CH7, which are sequentially arranged along one direction in which the substrate 100 moves. The in-line deposition apparatus may further include a first rotation chamber CHr1 and a second rotation chamber CHr2 for rotating the substrate.

[0158] Meanwhile, although not specifically shown, a chamber performing a function other than deposition or rotation may be located at the front end and / or rear end of at least one of the first to seventh deposition chambers CH1 to CH7 and the first and second rotation chambers CHr1 and CHr2. Also, the direction of the stripe pattern STP changes depending on the layout of the panel or the plurality of organic light emitting devices in the substrate 100. Therefore, the substrate 100 is designed to be able to be loaded in two or more directions at the loading step.

[0159] In the first deposition chamber CH1, the hole injection layer and / or the hole transport layer HIL, HTL are commonly deposited on the substrate 100 on which the stripe pattern STP and the first electrode E1 are formed. At this time, in order to deposit the hole injection layer and / or the hole transport layer HIL, HTL to a uniform thickness on the substrate 100, a plurality of first evaporation sources 410 having first nozzles 415 are arranged in the first deposition chamber CH1.

[0160] As another example, in order to differentiate the thickness of the first inclined surface SS1 and / or the second inclined surface SS2, a first evaporation source 410 having a first nozzle 415 perpendicular to the horizontal plane, a second evaporation source 420 having a second nozzle 425 inclined forward, and a third evaporation source 430 having a third nozzle 435 inclined backward are arranged in an appropriate combination.

[0161] Meanwhile, in the first deposition chamber CH1, an evaporation source for depositing the hole injection layer HIL is disposed on the substrate carry-in side, and an evaporation source for depositing the hole transport layer HTL is disposed on the substrate carry-out side.

[0162] In the second deposition chamber CH2, the blue light-emitting layer B-EML is commonly deposited on the substrate 100. In this case, the second deposition chamber CH2 is provided with a plurality of first evaporation sources 410 having vertical first nozzles 415. As a result, the blue light-emitting layer B-EML is continuously formed in the blue, red, and green sub-pixels SPb, SPr, and SPg with a substantially uniform thickness. In addition, in each of the first deposition chamber CH1 and the second deposition chamber CH2, the substrate 100 is moved in the same direction (X-axis direction) as the third deposition chamber CH3 and the fourth deposition chamber CH4 in the direction perpendicular to the column direction (Y-axis direction) in which the stripe pattern STP is extended. In this case, the hole transport layer HTL and the blue organic light-emitting layer B-EML, which are common layers, are deposited with different thicknesses for the red sub-pixel SPr, the green sub-pixel SPg, and the blue sub-pixel SPb. As a result, a deposition technique with improved flexibility is secured for improving the performance of each of the red organic light-emitting device, the green organic light-emitting device, and the blue organic light-emitting device. As a result, a new device with improved performance is realized. In such a case, the first rotating chamber CHr1 is not necessary and can be omitted.

[0163] The substrate 100 on which the blue light-emitting layer B-EML is formed in the second deposition chamber CH2 may be inserted into the first rotation chamber CHr1 and rotated.

[0164] In this regard, for example, as described above, in the first and second deposition chambers CH1 and CH2, during the corresponding deposition process, the substrate 100 is moved parallel to the row direction in which the stripe pattern STP is extended. Prior to the subsequent deposition process of the green and red light emitting layers G-EML and R-EML, the substrate 100 may be rotated by 90 degrees, and a first rotation chamber CHr1 is provided for this substrate rotation process.

[0165] The substrate 100 rotated 90 degrees by the first rotation chamber CHr1 is inserted into the third deposition chamber CH3, and a corresponding deposition process is performed while the substrate 100 is moved parallel to a row direction perpendicular to the stripe pattern STP. In this regard, in the third deposition chamber CH3, a green light emitting layer G-EML is deposited on the green sub-pixel SPg on the substrate 100. At this time, a plurality of third evaporation sources 430 having third nozzles 435 tilted backward are disposed in the third deposition chamber CH3.

[0166] In the fourth deposition chamber CH4, the red light-emitting layer R-EML is deposited on the red sub-pixel SPr on the substrate 100. At this time, a plurality of second evaporation sources 420 having second nozzles 425 tilted forward are disposed in the fourth deposition chamber CH4.

[0167] The substrate 100 on which the red light emitting layer R-EML is formed in the fourth deposition chamber CH4 may be inserted into the second rotation chamber CHr2 and rotated.

[0168] In this regard, for example, in the third and fourth deposition chambers CH3 and CH4, the substrate 100 is moved along the row direction while the corresponding deposition process is performed, and a process of rotating the substrate 100 by 90 degrees can be performed before the subsequent deposition process, and a second rotation chamber CHr2 is provided for this substrate rotation process.

[0169] The substrate 100 rotated by 90 degrees by the second rotation chamber CHr2 is inserted into the fifth deposition chamber CH5, and a corresponding deposition process is performed while the substrate 100 is moved parallel to the row direction in which the stripe patterns STP are extended.

[0170] In this regard, in the fifth deposition chamber CH5, the electron transport layer ETL is commonly deposited on the substrate 100. At this time, a plurality of first evaporation sources 410 having a first nozzle 415 are arranged in the fifth deposition chamber CH5. As another example, the first evaporation source 410 having the first nozzle 415, the second evaporation source 420 having the second nozzle 425, and the third evaporation source 430 having the third nozzle 435 are arranged together.

[0171] In the sixth deposition chamber CH6, the electron injection layer EIL / second electrode E2 are commonly deposited on the substrate 100. At this time, in the sixth deposition chamber CH6, the electron injection layer EIL and the second electrode E2 are commonly deposited on the substrate 100 using an inorganic (or metal) evaporation source M1 for the electron injection layer and inorganic (or metal) evaporation sources M2 and M3 for the second electrode.

[0172] In the seventh deposition chamber CH7, the capping layer CPL is commonly deposited on the substrate 100. At this time, a plurality of first evaporation sources 410 having a first nozzle 415 are arranged in the seventh deposition chamber CH7. As another example, the first evaporation source 410 having the first nozzle 415, the second evaporation source 420 having the second nozzle 425, and the third evaporation source 430 having the third nozzle 435 are arranged together.

[0173] FIG. 20 is a diagram illustrating a stacked structure of the organic light emitting device according to the second embodiment.

[0174] In the structure of the organic light emitting device shown in Figures 1, 3 and 20, a p-hole transport layer p-HTL and a hole transport layer HTL are commonly deposited on a substrate 100 on which a stripe pattern STP and a first electrode E1 are formed. The p-hole transport layer p-HTL may be a hole injection layer doped with a p-type dopant. The p-hole transport layer p-HTL described below may be referred to as a hole injection layer unless otherwise specified.

[0175] A red hole-transporting layer R-HTL and a green hole-transporting layer G-HTL are deposited on the red sub-pixel SPr and the green sub-pixel SPg, respectively.

[0176] An electron blocking layer EBL is commonly deposited on the substrate 100. The electron blocking layer EBL may be an inorganic semiconductor layer, but is not limited thereto.

[0177] A blue light-emitting layer B-EML is commonly deposited on the substrate 100 .

[0178] A green light-emitting layer G-EML and a red light-emitting layer R-EML are deposited on the green sub-pixel SPg and the red sub-pixel SPr, respectively.

[0179] A hole blocking layer HBL is commonly deposited on the substrate 100 .

[0180] An electron transport layer ETL is commonly deposited on the substrate 100 .

[0181] A second electrode E2 is commonly deposited on the substrate 100 .

[0182] A capping layer CPL is commonly deposited on the substrate 100 .

[0183] Although the above description has been based on steps in a chronological order, the steps may be performed simultaneously or the order of the steps may be changed chronologically.

[0184] To form the organic light emitting device stack structure of FIG. 21, an in-line deposition apparatus similar to the in-line deposition apparatus of FIG. 19 can be used.

[0185] FIG. 21 is a diagram illustrating a stacked structure of the organic light emitting device according to the third embodiment.

[0186] The layered structure of each organic light emitting device shown in FIGS. 1, 3 and 21 is a so-called two-stack structure, in which two light emitting layers of a corresponding color are layered in each sub-pixel SP.

[0187] In this regard, a p-hole transport layer p-HTL and a hole transport layer HTL1 are commonly deposited on the substrate 100 on which the stripe pattern STP and the first electrode E1 are formed. The p-hole transport layer p-HTL may be a hole injection layer doped with a p-type dopant.

[0188] A hole control layer HCL1 is commonly deposited on the substrate 100 .

[0189] A blue light-emitting layer B-EML is commonly deposited on the substrate 100 .

[0190] A green light-emitting layer G-EML and a red light-emitting layer R-EML are deposited on the green sub-pixel SPg and the red sub-pixel SPr, respectively.

[0191] An electron transport layer ETL1 is commonly deposited on a substrate 100 .

[0192] An n-charge generation layer, n-CGL, is commonly deposited on a substrate 100 .

[0193] A p-charge generation layer, p-CGL, is commonly deposited on the substrate 100 .

[0194] Another hole transport layer HTL2 is commonly deposited on the substrate 100 .

[0195] Another hole control layer HCL2 is commonly deposited on the substrate 100 .

[0196] A blue light-emitting layer B-EML is commonly deposited on the substrate 100 .

[0197] A green light-emitting layer G-EML and a red light-emitting layer R-EML are deposited on the green sub-pixel SPg and the red sub-pixel SPr, respectively.

[0198] Another electron transport layer ETL2 is commonly deposited on the substrate 100 .

[0199] A second electrode E2 is commonly deposited on the substrate 100 .

[0200] A capping layer CPL is commonly deposited on the substrate 100 .

[0201] The first electrode E1 is disposed separately for the red subpixel SPr, the green subpixel SPg, and the blue subpixel SPb. The second electrode E2 may be disposed in common for the red subpixel SPr, the green subpixel SPg, and the blue subpixel SPb. For example, the first electrode E1 may be an anode electrode, and the second electrode E2 may be a cathode electrode.

[0202] The two-stack structure may be a structure in which at least two organic light-emitting layers R-EML, G-EML, and B-EML that emit the same color light are arranged above and below an n-charge generation layer n-CGL and a p-charge generation layer p-CGL. A plurality of organic layers are arranged above and below the n-charge generation layer n-CGL and the p-charge generation layer p-CGL.

[0203] Although the above description is based on the steps according to the time sequence, the steps may be performed simultaneously or the order of the steps may be changed. To form the organic light emitting device stack structure of FIG. 21, an in-line deposition apparatus similar to the in-line deposition apparatus of FIG. 19 may be used.

[0204] 22 is a schematic diagram of an organic light emitting display device according to a second embodiment of the present invention, in which a stripe pattern and a light emitting layer are mainly illustrated for ease of explanation, and other components are omitted.

[0205] 22, in the organic light emitting display device 10 of this embodiment, a protection pattern 130 is formed to cover the corners of the first electrode E1, as compared with the organic light emitting display device of the first embodiment.

[0206] In this regard, a step occurs when the first electrode E1 is formed. In particular, when the first electrode E1 is made of, for example, ITO / Ag / ITO and has a reflective function, the step becomes large due to its large thickness.

[0207] Such a step may cause an overcurrent to occur, which may result in an electrical short circuit between the first electrode E1 and the second electrode E2.

[0208] To improve this, a protection pattern 130 may be formed to cover each corner of the first electrode E1. The protection pattern 130 reduces the step, thereby eliminating an electrical short circuit between the first electrode E1 and the second electrode E2.

[0209] For a method of forming the protection pattern 130, refer to FIG.

[0210] Referring to FIG. 23, a first electrode E1 is formed in each sub-pixel by a photolithography process, and then a photoresist pattern 140, which is an etching mask for forming the first electrode E1, is ashed.

[0211] As a result, the corners of the first electrodes E1 of the sub-pixels SP are not covered by the photoresist pattern 140 and are exposed, but for example, the corners can be exposed by approximately 1 μm or more.

[0212] Then, the substrate 100 is immersed in an electrolyte, and a voltage is applied to the first electrode E1 via the driving circuit DC of the sub-pixel SP, so that an organic insulating material or an inorganic insulating material is electrodeposited on the exposed corners of the first electrode E1 to form the protection pattern 130.

[0213] After the protection pattern 130 is formed, the photoresist pattern 140 is removed, and then an organic light emitting layer can be formed.

[0214] 24 is a schematic diagram of an organic light emitting display device according to a third embodiment of the present invention, in which, for ease of explanation, a stripe pattern and a light emitting layer are mainly illustrated, and other components are omitted.

[0215] Referring to FIG. 24, in the organic light-emitting display device 10 of this embodiment, compared to the organic light-emitting display device of the first embodiment described above, a single protective film 120 in which a planarization layer 125 and a stripe pattern STP are integrated can be formed on the driving circuit DC.

[0216] For example, an organic insulating material may be deposited on the substrate 100 on which the driving circuits DC are formed, and a photolithography process may be performed to form the passivation film 120 including the stripe pattern STP and the planarization layer 125.

[0217] The stripe pattern STP is configured similarly to the stripe patterns in the first and second embodiments, but is formed corresponding to the red sub-pixels SPr and the green sub-pixels SPg.

[0218] A planarization layer 125 that connects the adjacent stripe patterns STP is formed between the adjacent stripe patterns STP. The planarization layer 125 may be located substantially corresponding to the blue sub-pixel SPb.

[0219] On the other hand, the protective film 120 is formed with a contact hole 121 that exposes one electrode of the drive circuit DC of each sub-pixel SP.

[0220] In this regard, for example, a contact hole 121 exposing the driving circuit DC of the red sub-pixel SPr is formed at the boundary between the first inclined surface SS1 of the stripe pattern STP and the planarization layer 125 adjacent thereto.

[0221] A contact hole 121 exposing the driving circuit DC of the green sub-pixel SPg is formed at the boundary between the second inclined surface SS2 of the stripe pattern STP and the planarization layer 125 adjacent thereto.

[0222] Furthermore, in the planarization layer 125, a contact hole 121 is formed that exposes the drive circuit DC for the blue sub-pixel SPb.

[0223] A first electrode E1 for each sub-pixel SP is formed on the passivation layer 120. The first electrode E1 of each sub-pixel SP is connected to a corresponding driving circuit DC through a corresponding contact hole 121.

[0224] Such a first electrode E1 is configured similarly to the first electrode E1 of the first and second embodiments.

[0225] Meanwhile, although not specifically shown, the protective pattern of the second embodiment may be applied to the organic light emitting display device 10 of the third embodiment. In this case, after the first electrode E1 is formed, a protective pattern may be formed to cover the corners of the first electrode E1.

[0226] Table 1 shows a product as an organic light-emitting display device having a stripe pattern according to an embodiment, design values ​​of the stripe pattern, and predicted product performance results. Table 2 shows a comparison result between a display device of the related art and a display device having a stripe pattern according to an embodiment in a phone display product. FIG. 25 is a drawing that illustrates a schematic pixel structure of a general display device, and FIG. 26 is a drawing that illustrates a schematic pixel structure of a display device according to an embodiment (see Table 2). FIG. 27 illustrates a design model of a pixel of the display device according to the embodiment of FIG. 26. Meanwhile, in FIGS. 25 and 26 The unit of the numbers is μm. What is shown as the anode electrodes of the red, green, and blue subpixels in FIG. 27 may be the first electrodes located substantially in the effective light-emitting area as if they were not covered by the protective pattern.

[0227] [Table 1]

[0228] [Table 2]

[0229] Referring to Table 1, in various products (AR / VR, Phone, Pad, TV), the height of the stripe pattern is about 40% to 44% of the pixel size, and the margin of the deposition angle becomes smaller as the PPI becomes smaller. In the embodiment, the pixel area usage is dramatically increased by arranging sub-pixels in at least two regions of the stripe pattern to configure the pixel three-dimensionally. Each of the two regions has at least one or more faces, and may be an inclined surface inclined with respect to the ground.

[0230] By depositing using a self-aligned method without using a deposition pattern mask like FMM, it is possible to reduce the spacing between sub-pixels and between pixels, resulting in an aperture ratio that is approximately three times higher than that of related technologies.

[0231] In addition, the life span of the display device is increased by about 4.8 times as compared to the related art, and in this regard, refer to Equation 3.

[0232] Equation 3: Life ratio = (aperture ratio) n (n=1.4).

[0233] Meanwhile, in the calculation of pixel aperture ratio of the related art, the width of the bank located between the subpixels was assumed to be 20 μm, and the pentile structure (i.e., R, G, B, G arrangement) was assumed only when the PPI was 530, and the remaining PPIs were calculated as an R, G, B full arrangement structure.

[0234] Meanwhile, in order to more accurately confirm the improved points of the display device of the embodiment, reference is made to the pixel structure of the display device of the related art of a 530 PPI mobile phone and the pixel structure of the embodiment shown in Figures 25 and 26. Based on the design dimensions of Figure 26, the aperture ratio, maximum deposition angle, deposition angle margin, etc. of the pixel structure of the display device of the embodiment (e.g., the pixel structure of the third embodiment) are predicted as shown in Figure 27.

[0235] Comparing the display device of the embodiment with the related art, it can be seen that the aperture ratio is about 3.1 times and the lifetime is about 4.8 times higher than the display device of the related art. In the related art, the area of ​​the sub-pixels is differentiated to compensate for the lifetime difference between colors, and a pentile structure is applied to overcome the resolution limit. On the other hand, in the embodiment, it can be confirmed that a new type of organic light emitting display device can be provided since a sufficient design margin for the lifetime can be secured.

[0236] Image quality performance and yield are optimized by adjusting variables such as the height of the stripe pattern, its top margin, and the top and bottom margins of the first electrode (ie, the top and bottom margins on a flat surface).

[0237] The dramatic increase in element life also makes it possible to increase the brightness of the display device, thereby improving the essential performance of the display device.

[0238] Furthermore, in the manufacture of ultra-small organic light-emitting displays such as OLEDoS (OLED on Silicon), where side-by-side arrangement is currently not possible, or in large-area deposition equipment, deposition will become possible without using FMM, opening a new era of display devices.

[0239] In addition, since large-area outdoor OLED displays require improved brightness and lifespan, OLED displays will be able to occupy the market where micro LEDs are currently used.

[0240] Furthermore, when the structure of the embodiment is applied to products using the side-by-side structure of related technology, not only will performance be improved but also costs will be improved through increased productivity, which will expand the scope of application to notebook computers, monitors, automobiles, etc.

[0241] As described above, in the display device of the embodiment, two sub-pixels constituting a pixel are located on a stripe pattern, and an organic light-emitting layer that generates color light of another sub-pixel constituting a pixel located in a spaced area between adjacent stripe patterns is deposited, and organic light-emitting layers that generate color light of the two sub-pixels can be deposited individually on both sloping surfaces of the stripe pattern in a self-aligned manner.

[0242] This makes it possible to form subpixels in a side-by-side structure for high-definition or large-area display devices that are difficult to manufacture using FMM, thereby improving the performance of the display device, such as power consumption, brightness, and lifespan.

[0243] The side-by-side structure can be realized in an in-line manner, reducing investment costs and improving productivity (for example, by about three times or more).

[0244] In addition, the light-emitting layer can be formed without using FMM, improving yield and reducing manufacturing costs.

[0245] Also, the pixels have a three-dimensional structure instead of a planar structure, which increases the light-emitting area and improves the lifetime (eg, by about four times or more).

[0246] Meanwhile, in the above-described embodiment, the in-line deposition apparatus is applied to an organic light emitting display device having a stripe pattern, but the in-line deposition apparatus may also be applied to an organic light emitting display device having a structure other than the structure having the stripe pattern.

[0247] The above-described embodiment is an example of the present invention, and can be freely modified within the spirit and scope of the present invention. Therefore, the present invention includes modifications of the present invention within the scope of the appended claims and their equivalents.

Claims

1. a first deposition chamber including a first evaporation source for discharging a third light emitting material for forming a third organic light emitting device through a first nozzle disposed facing a spaced area between adjacent stripe patterns on a substrate having a plurality of stripe patterns; a second deposition chamber including a second evaporation source for discharging a first light emitting material for forming the first organic light emitting device through a second nozzle disposed opposite to the first region of the stripe pattern; a third deposition chamber including a third evaporation source for discharging a second light emitting material for forming the second organic light emitting element through a third nozzle disposed opposite to the second region of the stripe pattern; The second nozzle and the third nozzle are inclined in opposite directions to each other with respect to a moving direction of the substrate.

2. the substrate includes a plurality of pixels; Each of the plurality of pixels includes a first sub-pixel, a second sub-pixel, and a third sub-pixel, The first sub-pixels, the second sub-pixels, and the third sub-pixels are alternately arranged along the first direction and are elongated along the second direction; The inclination angle of the first region and the second region of the stripe pattern is 60 degrees to 95 degrees, The apparatus of claim 1 , wherein the substrate moves in the first direction during deposition in each of the first deposition chamber, the second deposition chamber, and the third deposition chamber.

3. 3. The apparatus of claim 2, wherein the first deposition chamber ejects the third light emitting material toward the spaced regions to form a third organic light emitting layer common to each of the first sub-pixel, the second sub-pixel, and the third sub-pixel.

4. The first region has at least one first surface, 4 . The apparatus of claim 3 , wherein the second deposition chamber ejects the first light emitting material toward the at least one first surface to form a first organic light emitting layer on the first subpixel.

5. The second region has at least one second surface, 4 . The apparatus of claim 3 , wherein the third deposition chamber ejects the second light emitting material toward the at least one second surface to form a second organic light emitting layer on the second subpixel.

6. During the deposition process in the first deposition chamber, the substrate moves in the first direction or the second direction; The apparatus of claim 1 , wherein the substrate is moved in the first direction during deposition processes in the second deposition chamber and the third deposition chamber.

7. The apparatus of claim 5 , further comprising a rotation chamber configured to rotate the substrate by 90 degrees between the first deposition chamber and the second deposition chamber.

8. 6. The apparatus of claim 5, further comprising an input chamber at a front end of the first deposition chamber, the input chamber being capable of inputting substrates in a plurality of directions, i.e., one direction and two directions perpendicular to each other.

9. the first luminescent material is a red luminescent material; the second luminescent material is a green luminescent material; The apparatus for manufacturing an organic light-emitting display device according to claim 1 , wherein the third light-emitting material is a blue light-emitting material.

10. the first luminescent material is a green luminescent material; the second luminescent material is a red luminescent material; The apparatus for manufacturing an organic light-emitting display device according to claim 1 , wherein the third light-emitting material is a blue light-emitting material.

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