SUBSTRATE HEATING DEVICE AND SUBSTRATE PROCESSING APPARATUS EQUIPPED WITH THE SAME

Abstract

The present invention relates to a substrate heating device and a substrate processing apparatus including the same, and more particularly to a substrate heating device used for heating a substrate and a substrate processing apparatus including the same. A substrate heating device according to an embodiment of the present invention comprises a substrate support portion for supporting a substrate, and a plurality of heaters provided at the lower portion of the substrate support portion, the heaters having connection terminals provided at their ends and heating elements extending in one direction from the connection terminals, the plurality of heaters being arranged alternately so that some areas including the ends overlap in a direction intersecting the one direction.

Description

[Technical field]

[0001] The present invention relates to a substrate heating device and a substrate processing apparatus including the same, and more particularly to a substrate heating device used for heating a substrate and a substrate processing apparatus including the same. [Background technology]

[0002] In general, semiconductor devices or display devices are manufactured by depositing various materials on a substrate in the form of thin films and then patterning the deposited materials, which involves a number of different processes, such as a deposition process, an etching process, a cleaning process, and a drying process.

[0003] Here, the deposition process is for forming a thin film having properties required for a semiconductor device or a display device on a substrate. In order to form a thin film on a substrate in the deposition process, it is necessary to sufficiently heat the substrate in advance before carrying out the deposition process, which can shorten the deposition time and improve the deposition efficiency.

[0004] On the other hand, in the case of a large-area substrate, the temperature rise rate associated with heating the substrate is slow, so that the substrate must be preheated before the main process in a preheating chamber, a load lock chamber, etc. If an unheated substrate is carried into a process chamber for the main process, the process time required to heat the substrate in the process chamber will be further extended.

[0005] Conventionally, in order to heat a substrate during a deposition process or to preheat or heat a large-area substrate, a heating device in which linear heaters extending in one direction are arranged in multiple sections along the extension direction is used to heat the substrate. However, in this case, due to the connection terminals provided at the ends of the linear heaters, non-heating areas where no heating parts are arranged between adjacent sections are inevitably generated, which is inconvenient in that it is difficult to heat the substrate uniformly. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Korean Patent Publication No. 10-2012-0040124 Summary of the Invention [Problem to be solved by the invention]

[0007] SUMMARY OF THE PRESENTLY PREFERRED EMBODIMENTS The present invention provides a substrate heating apparatus capable of minimizing a non-heat generating region, and a substrate processing apparatus including the same. [Means for solving the problem]

[0008] A substrate heating device according to an embodiment of the present invention comprises a substrate support portion for supporting a substrate, and a plurality of heaters provided at the lower portion of the substrate support portion, the heaters having connection terminals provided at their ends and heating elements extending in one direction from the connection terminals, the plurality of heaters being arranged alternately so that some areas including the ends overlap in a direction intersecting the one direction.

[0009] The plurality of heaters may include a first heater and a second heater arranged in a staggered manner, and the first heater and the second heater may be arranged such that the connection terminals and the heating elements do not overlap with each other.

[0010] Furthermore, the substrate heating device may further include an electrode to which a power source is connected, and a cover having a through hole and provided on the electrode, and the connection terminal may be electrically connected to the electrode via the through hole.

[0011] Furthermore, the substrate heating device may further include a connection member that passes through the through hole and connects the connection terminal and the electrode.

[0012] Furthermore, the substrate heating apparatus may further include a bolt that is fitted into the through hole so as to fasten the connection member to the electrode.

[0013] Furthermore, the cover may be formed from an insulating material.

[0014] Furthermore, the substrate heating device may further include a reflector provided below the plurality of heaters.

[0015] In addition to the above, the heaters may all be disposed on the reflector, and the peripheral portion of the reflector may be folded so as to enclose the heaters.

[0016] A substrate processing apparatus according to an embodiment of the present invention includes a chamber providing a process space, and any one of the above-described substrate heating devices installed in the process space. Effect of the Invention

[0017] According to an embodiment of the present invention, by arranging multiple heaters so that some areas on the connection terminal side overlap each other, it is possible to minimize non-heating areas, which are areas that are not heated, and to uniformly heat the substrate.

[0018] In addition, an insulating cover is placed between the connection terminals on each heater and the electrodes for supplying power to the connection terminals to prevent the generation of arcs, and the heat emitted from the heaters is concentrated on the substrate via a reflector, thereby improving heating efficiency. [Brief description of the drawings]

[0019] [Figure 1] FIG. 2 illustrates an arrangement of multiple heaters in accordance with an embodiment of the present invention. [Diagram 2] 4A and 4B are diagrams showing how connection terminals and electrodes are connected in accordance with an embodiment of the present invention. [Diagram 3] FIG. 2 is a diagram showing a state in which a substrate heating apparatus according to an embodiment of the present invention is installed in a process chamber. [Figure 4]FIG. 2 is a diagram showing a state in which a substrate heating apparatus according to an embodiment of the present invention is installed in a load lock chamber. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] Hereinafter, the embodiments of the present invention will be described in more detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and may be embodied in various different forms. These embodiments are provided simply to complete the disclosure of the present invention and to fully inform those skilled in the art of the scope of the invention. In describing the present invention, the same reference numerals are used for the same components, and the drawings may be exaggerated to describe the invention in detail, and the same numerals in the drawings indicate the same components.

[0021] FIG. 1 is a diagram showing how a plurality of heaters are arranged in accordance with an embodiment of the present invention, and FIG. 2 is a diagram showing how connection terminals and electrodes are connected in accordance with an embodiment of the present invention.

[0022] A substrate heating apparatus according to an embodiment of the present invention includes a substrate support (200 in Figs. 3 and 4) for placing a substrate thereon, and a substrate heating unit 100 provided below the substrate support for heating the substrate. Here, the substrate support is a component for supporting a substrate, and the substrate support will be described later with reference to Figs. 3 and 4.

[0023] 1 and 2, a substrate heating unit 100 according to an embodiment of the present invention includes a plurality of heaters 110a, 110b each having connection terminals 114a, 114b provided at an end portion and heating elements 112a, 112b extending in one direction from the connection terminals 114a, 114b, and the heaters 110a, 110b are alternately arranged such that a part of the heaters 110a, 110b including the end portions overlap in a direction intersecting the one direction. The heaters 110a, 110b may be arranged such that the connection terminals 114a, 114b and the heating elements 112a, 112b do not overlap with each other.

[0024] The multiple heaters 110a, 110b may include multiple first heaters 110a extending in one direction and arranged in a direction intersecting the one direction, and multiple second heaters 110b extending in one direction and arranged in a direction intersecting the one direction. For example, the first heaters 110a may be formed to extend in the X-axis direction and arranged so that multiple heaters are spaced apart from each other in the Y-axis direction perpendicular to the X-axis direction, and the second heaters 110b may also be formed to extend in the X-axis direction and arranged so that multiple heaters are spaced apart from each other in the Y-axis direction perpendicular to the X-axis direction.

[0025] Each of the first heaters 110a may include a first heating element 112a extending in one direction, i.e., in the X-axis direction, and a first connection terminal 114a provided at an end of the first heating element 112a. Here, the first connection terminal 114a may be provided at one end of the first heating element 112a, or at the other end opposite to the one end, or at both ends. Similarly, each of the second heaters 110b may include a second heating element 112b extending in one direction, i.e., in the X-axis direction, and a second connection terminal 114b provided at one end, the other end, or both ends of the second heating element 112b, as in the case of the first heater 110a.

[0026] The first heaters 110a and the second heaters 110b may be lamp heaters formed to extend in one direction. That is, the first heaters 110a and the second heaters 110b may be lamp heaters in which the heating elements 112a and 112b are transparent tubes made of quartz or other materials, or the heating elements 112a and 112b are made of tungsten (W) or other materials and have filaments provided inside the transparent tubes. That is, the first heaters 110a and the second heaters 110b may be lamp heaters in which the heating elements 112a and 112b are provided with transparent tubes and connection terminals 114a and 114b connected to an external power source to heat the filaments at the ends of the heating elements 112a and 112b. The lamp heater may be formed with a transparent tube extending in one direction, i.e., in a straight line. In this way, when the lamp heater extends in a straight line, the area occupied by the lamp heater can be narrowed compared to when the lamp heater extends in a U-shape. Therefore, when the lamp heater is installed in a chamber, the unnecessary area required for the lamp heater can be minimized, and the process space of the chamber can be minimized.

[0027] Conventionally, in order to heat a substrate during a deposition process or to preheat or heat a large-area substrate, a heating device has been used in which, for example, a plurality of first heaters 110a each extending in the X-axis direction and arranged in the Y-axis direction and a plurality of second heaters 110b each extending in the X-axis direction and arranged in the Y-axis direction are spaced apart from each other along the X-axis direction. However, in this case, no heat is generated in the region between the first heaters 110a and the second heaters 110b, resulting in a non-heat generating region where the substrate cannot be heated. Furthermore, no matter how close the multiple first heaters 110a and the multiple second heaters 110b are arranged to each other, the first connection terminal 114a provided at the end of the first heater 110a and the second connection terminal 114b provided at the end of the second heater 110b facing the first connection terminal cannot emit sufficient heat to heat the substrate, and as a result, non-heat generating areas are inevitably generated by the connection terminals 114a, 114b facing each other, making it difficult to heat the substrate uniformly.

[0028] Therefore, in the substrate heating section 100 according to an embodiment of the present invention, a plurality of heaters 110a, 110b each extending in one direction are arranged alternately such that some areas including the ends where the connection terminals 114a, 114b are provided overlap in a direction intersecting the one direction, thereby minimizing non-heat generating areas.

[0029] For example, as shown in FIG. 1, the first heater 110a may extend in the X-axis direction and multiple heaters may be arranged at a distance in the Y-axis direction. The second heater 110b may be arranged on one side of the first heater 110a along the X-axis direction, but the second heater 110b may also extend in the X-axis direction and multiple heaters may be arranged at a distance in the Y-axis direction. In this case, the second heater 110b extends between the multiple first heaters 110a, and the right end of the first heater 110a, i.e., the region including the connection terminal 114a provided on the right side of the first heater 110a, and the left end of the second heater 110b, i.e., the region including the connection terminal 114b provided on the left side of the second heater 110b, are arranged to overlap each other in the Y-axis direction. This makes it possible to minimize the non-heating region along the X-axis direction formed by the connection terminals 114a and 114b.

[0030] On the other hand, the heaters 110a, 110b may be arranged such that the connection terminals 114a, 114b and the heating elements 112a, 112b do not overlap with each other, as shown in Fig. 1. That is, the first connection terminal 114a of the first heater 110a may be arranged so as to overlap only with the left end of the second heating element 112b of the second heater 110b, and the second connection terminal 114b of the second heater 110b may be arranged so as to overlap only with the right end of the first heating element 112a of the first heater 110a, so that the first connection terminal 114a of the first heater 110a and the second connection terminal 114b of the second heater 110b do not overlap with each other, and the first heating element 112a of the first heater 110a and the second heating element 112b of the second heater 110b do not overlap with each other. This allows a constant amount of heat to be emitted by the first heating element 112a and the second heating element 112b over the entire area along the X-axis direction, thereby allowing the substrate to be heated uniformly.

[0031] 1 and 2, an example has been described in which two first heaters 110a are arranged in the Y-axis direction, and two second heaters 110b are arranged in the Y-axis direction to the sides of the first heater 110a along the X-axis direction. However, it goes without saying that the number and arrangement directions of the first heaters 110a and second heaters 110b can be changed in various ways depending on the size and heating amount of the substrate.

[0032] The substrate heating section 100 according to an embodiment of the present invention may further include, in addition to the plurality of heaters 110a, 110b, an electrode 130 and a through hole (not shown) for connecting an external power source to supply power to the plurality of heaters 110a, 110b, and may further include a cover 140 provided on the electrode 130.

[0033] Here, the substrate heating unit 100 can be disposed in various positions. For example, the substrate heating unit 100 may be disposed on the bottom surface of a chamber that provides a process space, or a plate-like main body having a predetermined thickness may be provided separately and the substrate heating unit 100 may be disposed on the main body.

[0034] The electrode 130 is a component for connecting an external power source to the heaters 110a and 110b. The electrode 130 may be provided, for example, on the bottom surface of the chamber or the top surface of the main body. The electrode 130 may have a bus bar shape in order to simultaneously supply power to the heaters 110a and 110b. For example, the electrode 130 may be formed to extend in the Y-axis direction so as to be electrically connected to the first connection terminals 114a of the first heaters 110a arranged in the Y-axis direction, or may be formed to extend in the Y-axis direction so as to be electrically connected to the second connection terminals 114b of the second heaters 110b. However, the shape of the electrode 130 is not limited thereto and can be changed in various ways.

[0035] The first connection terminals 114a provided on the plurality of first heaters 110a and the second connection terminals 114b provided on the plurality of second heaters 110b are connected to the electrode 130. In this case, the substrate heating unit 100 according to the embodiment of the present invention may further include a cover 140 made of an insulating material to prevent arcing from occurring between the first connection terminals 114a and the electrode 130. For example, the cover 140 may be made of a ceramic or quartz material.

[0036] The cover 140 is provided on the electrode 130, and through holes may be formed in the cover 140 so that the connection terminals 114a, 114b pass through and are connected to the electrode 130. For example, a plurality of through holes may be provided, and the connection terminals 114a, 114b may be connected to the electrode 130 located below the cover 140 via the plurality of through holes. Such a cover 140 may be formed so as to extend in the Y-axis direction on the electrode 130 as shown in the figure, but it goes without saying that the cover 140 may have various shapes, such as being formed so as to entirely cover the electrode 130.

[0037] Meanwhile, the substrate heating unit 100 according to the embodiment of the present invention may further include a connection member 150 that passes through the through-hole and connects the connection terminals and the electrodes. For example, the connection member 150 may include a conductive wire to easily connect the connection terminals 114a, 114b and the electrode 130 extending below the through-hole. That is, the connection terminals 114a, 114b may extend in the X-axis direction from the upper part or the side part of the through-hole above the electrode 130, and the electrode 130 may be disposed to extend in the Y-axis direction from the lower side of the through-hole. In this case, the connection terminals 114a, 114b located above the electrode 130 and the electrode 130 located below the through-hole may be connected to each other via the connection member 150. Such a connection member 150 can be firmly fastened to the electrode 130 by a bolt inserted into the through-hole.

[0038] In addition, the substrate heating unit 100 according to the embodiment of the present invention may further include a reflector 160 provided under the heaters 110a and 110b. Although the reflector 160 is shown to be provided under the electrode 130 in FIG. 2, it goes without saying that the reflector 160 may be provided above the electrode 130 so as to expose the electrode 130. In this case, both of the heaters 110a and 110b may be disposed on the reflector 160, and the periphery of the reflector 160 may be folded to enclose the heaters 110a and 110b so as to guide and release heat released to the lower and side surfaces of the heaters 110a and 110b to the upper side of the reflector 160. That is, the reflector may be folded upward from the periphery of the main body, and may be formed of a metal plate for reflecting heat released to the lower and side surfaces of the heaters 110a and 110b, or may be formed of a metal material, such as being coated with metal.

[0039] FIG. 3 is a diagram showing a state in which a substrate heating device according to an embodiment of the present invention is installed in a reaction chamber.

[0040] 3, the substrate processing apparatus according to the embodiment of the present invention is an apparatus for depositing a thin film, and includes a reaction chamber 10 providing a process space for deposition, a substrate heating device provided in the reaction chamber 10 and including a substrate support part 200 and a substrate heating part 100, and a gas blowing part 20 provided in the reaction chamber 10 to face the substrate support part 200 and for blowing a process gas toward the substrate support part 200. In addition to the above, the substrate processing apparatus may further include an RF power source (not shown) for supplying power to generate plasma in the chamber 10, and a control part (not shown) for controlling the RF power source.

[0041] The reaction chamber 10 provides a predetermined process space and keeps it airtight. The reaction chamber 10 may include a body 12 having a generally circular or rectangular flat portion and a sidewall portion extending upward from the flat portion to provide a predetermined process space, and a generally circular or rectangular cover 14 located on the body 12 to keep the reaction chamber 10 airtight. However, the reaction chamber 10 is not limited thereto and can be produced in a wide variety of shapes corresponding to the shape of the substrate S.

[0042] Meanwhile, the substrate S carried into the reaction chamber 10 can be placed on the substrate support part 200. In order to place and support the substrate S, the substrate support part 200 can be provided with, for example, an electrostatic chuck or the like to adsorb and hold the substrate S by electrostatic force, or can support the substrate S by vacuum adsorption or mechanical force.

[0043] The substrate support part 200 may be provided in a shape corresponding to the shape of the substrate S, for example, a circular shape or a rectangular shape. The substrate support part 200 may include a substrate support stage on which the substrate S is placed, and an elevator arranged under the substrate support stage to raise and lower the substrate support stage. Here, the substrate support stage may be made larger than the substrate S, and the elevator is provided to support at least one region, for example, the center, of the substrate support stage, and can move the substrate support stage closer to the gas blowing part 20 when the substrate S is placed on the substrate support stage.

[0044] The gas blowing section 20 may include a gas blower 24 disposed inside the chamber 10 and a gas supplier 22 communicating with the gas blower 24 and at least a portion of which extends outside the chamber 10 .

[0045] The gas supplier 22 provides the process gas to the gas blower 24, which is provided at the upper side inside the reaction chamber 10 and blows the process gas toward the substrate S. The gas blower 24 has a predetermined space provided therein, an upper side connected to the gas supplier 22, and a lower side formed with a plurality of blowing holes (not shown) for blowing the process gas onto the substrate S. The gas blower 24 may be fabricated in a shape corresponding to the shape of the substrate, or may be fabricated in a roughly circular or rectangular shape. Here, the gas blower 24 may be provided at a predetermined distance from the sidewall and the cover 14 of the reaction chamber 10. In addition, when a thin film is deposited using plasma, the gas blower 24 may also function as an upper electrode that receives power from an RF power source.

[0046] In order to deposit a thin film, the substrate must be heated to a predetermined temperature. For this purpose, the substrate processing apparatus according to the embodiment of the present invention has a substrate heating unit 100 disposed under a substrate support unit 200, for example, a substrate support table. As described above, the substrate heating unit 100 has an end portion provided with connection terminals 114a, 114b, and includes a plurality of heaters 110a, 110b extending in one direction from the end portion, and the plurality of heaters 110a, 110b may be disposed such that a portion of the heaters 110a, 110b including the end portion overlaps with each other. In addition, the substrate heating unit 100 may further include an electrode 130 to which a power source is connected and a cover 140 having a through hole and disposed on the electrode 130, and may further include a reflector 160 disposed under the plurality of heaters 110a, 110b.

[0047] FIG. 4 is a diagram showing a state in which the substrate heating device according to the embodiment of the present invention is installed in a load lock chamber.

[0048] Referring to FIG. 4, a substrate processing apparatus according to an embodiment of the present invention is an apparatus for transferring a substrate S to a reaction chamber while repeatedly switching between a vacuum state and an atmospheric pressure state, and includes a load lock chamber 60 having a process space for accommodating and heating the substrate S, and a substrate heating apparatus provided in the process space of the load lock chamber 60 and including a substrate support part 200 and a substrate heating part 100.

[0049] Although not shown, the load lock chamber 60 may have a plurality of slots each providing a process space. The load lock chamber 60 may also be provided with a plurality of gates. Here, the plurality of gates may be provided to communicate the transfer chamber with the load lock chamber 60 and to be capable of being opened and closed. One or more of the gates may be provided in the load lock chamber 60. In this case, the load lock chamber 60 may be provided with a gate valve (not shown) for opening and closing the gate.

[0050] The load lock chamber 60 may also be provided with a pumping means and a venting means. The pumping means may serve to put the inside of the load lock chamber 60 into a vacuum state. In this case, the pumping means may be provided as, for example, a vacuum pump. The venting means may serve to put the inside of the load lock chamber 60 into an atmospheric pressure state. The venting means can switch the inside of the load lock chamber 60 from a vacuum state to an atmospheric pressure state by blowing a purge gas into the inside of the load lock chamber 60. In this case, an inert gas such as nitrogen can be used as the purge gas. The purge gas blown from the venting means can serve to remove foreign matter attached to the substrate S placed on the substrate support table.

[0051] The substrate S placed in the load lock chamber 60 can be preheated to a predetermined temperature for subsequent processing. For this reason, the substrate processing apparatus according to the embodiment of the present invention has a substrate heating unit 100 disposed below the substrate support unit 200. As described above, the substrate heating unit 100 has an end portion provided with connection terminals 114a, 114b, and includes a plurality of heaters 110a, 110b extending in one direction from the end portion, and the plurality of heaters 110a, 110b may be disposed such that a portion of the heaters 110a, 110b including the end portion overlaps with each other. In addition, the substrate heating unit 100 may further include an electrode 130 to which an external power source is connected and a cover 140 having a through hole and disposed on the electrode 130, and may further include a reflector 160 disposed below the plurality of heaters 110a, 110b.

[0052] As described above, according to an embodiment of the present invention, by arranging multiple heaters so that some areas on the connection terminal side overlap each other, it is possible to minimize non-heating areas, which are areas that do not generate heat, and to uniformly heat the substrate.

[0053] In addition, an insulating cover is placed between the connection terminals on each heater and the electrodes for supplying power to the connection terminals to prevent the generation of arcs, and the heat emitted from the heaters is concentrated on the substrate via a reflector, thereby improving heating efficiency.

[0054] Although the preferred embodiment of the present invention has been described and illustrated using specific terms, these terms are merely for the purpose of clearly describing the present invention, and it is clear that the embodiments of the present invention and the described terms can be modified and changed in various ways without departing from the technical spirit and scope of the claims. These modified embodiments should not be understood separately from the spirit and scope of the present invention, but should be considered to belong to the scope of the claims of the present invention.

Claims

1. a substrate support for placing a substrate thereon; a plurality of heaters provided under the substrate support, the heaters having connection terminals provided at ends and heating elements extending in one direction from the connection terminals; Equipped with A substrate heating device, wherein the plurality of heaters are arranged in a staggered manner such that partial regions including the ends overlap in a direction intersecting the one direction.

2. The plurality of heaters includes a first heater and a second heater that are arranged in a staggered manner, The substrate heating device according to claim 1 , wherein the first heater and the second heater are arranged such that the connection terminals and the heating elements do not overlap each other.

3. An electrode to which a power source is connected; A cover having a through hole and provided on the electrode; Further equipped with The substrate heating device according to claim 1 , wherein the connection terminal is electrically connected to the electrode through the through hole.

4. The substrate heating device according to claim 3 , further comprising a connection member passing through the through hole and connecting the connection terminal and the electrode.

5. The substrate heating apparatus of claim 4 , further comprising a bolt that is inserted into the through hole so that the connecting member is fastened to the electrode.

6. The substrate heating apparatus of claim 3 , wherein the cover is formed from an insulating material.

7. The substrate heating apparatus according to claim 1 , further comprising a reflector plate provided below the plurality of heaters.

8. The plurality of heaters are all disposed on the reflector plate, The substrate heating apparatus according to claim 7 , wherein a peripheral portion of the reflector is formed by folding so as to enclose the plurality of heaters.

9. a chamber providing a process space; The substrate heating device according to claim 1 , which is installed in the process space; The substrate processing apparatus includes:

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