Air shroud with integral heat exchanger

Abstract

A heating module for a substrate processing chamber includes heat lamps coupled to a reflector plate and a heat exchanger. The heat exchanger cools gas within the heating module. A fan within the heating module circulates gas through openings in the reflector plate to cool the heating lamps. The gas is cooled and recirculated by the heat exchanger. One or more shrouds direct the gas as it is circulated.

Description

[Technical field]

[0001] SUMMARY OF THE DISCLOSURE Embodiments of the present disclosure generally relate to a heat exchanger for use with a substrate processing chamber, such as an epitaxial deposition chamber. [Background technology]

[0002] Semiconductor substrates are processed for a wide variety of applications, including the fabrication of integrated and microdevices. During processing, the substrate is placed on a support in a processing chamber. The interior of the processing chamber is placed under vacuum while the substrate is processed by exposure to heat and process gases. Some processing chambers, such as some epitaxial deposition chambers, use lamps to heat the substrate. Temperature control can be facilitated by cooling the lamps and parts of the processing chamber. In some examples, the lamps and parts of the processing chamber are cooled by air flow provided by piping. The piping takes up space and the air flow created can result in uneven temperature distribution across the processing chamber, which can adversely affect the quality of the process being performed on the substrate.

[0003] There is a need for improved systems and processes that facilitate cooling heat lamps and parts of the processing chamber. Summary of the Invention

[0004] FIELD OF THE DISCLOSURE The present disclosure relates generally to heat exchangers for use with substrate processing chambers, such as epitaxial deposition chambers.

[0005] In one embodiment, a heating module for a process chamber suitable for use in semiconductor manufacturing includes an outer housing, a lid on the outer housing, a reflector plate disposed in the outer housing, and a plurality of heat lamps associated with the reflector plate. A first heat exchange module is disposed between the reflector plate and the lid, the first heat exchange module including a plurality of first heat exchange tubes disposed between a first inner shroud and a first outer shroud.

[0006] In another embodiment, a processing chamber suitable for use in semiconductor manufacturing includes a chamber body including an upper window disposed above a lower window, the upper window and the lower window forming a boundary of a processing volume. The processing chamber further includes an upper heating module coupled to the chamber body above the upper window. The upper heating module includes a first outer housing, a first lid on the first outer housing, a first reflector plate disposed in the first outer housing, and a plurality of first heat lamps associated with the first reflector plate. The upper heating module further includes a first heat exchange module disposed between the first reflector plate and the first lid, the first heat exchange module including a plurality of first heat exchange tubes disposed between the first inner shroud and the first outer shroud.

[0007] In another embodiment, a heat exchange module suitable for use in semiconductor manufacturing includes an enclosure. The enclosure includes an inner shroud extending between a first end plate and a second end plate, and an outer shroud extending between the first end plate and the second end plate. The heat exchange module further includes a plurality of heat exchange tubes disposed within the enclosure, and a plurality of inner plates disposed within the enclosure and coupled to each of the heat exchange tubes. The inner shroud, the outer shroud, and each of the heat exchange tubes are curved in a horizontal plane.

[0008] So that the above recited features of the present disclosure may be understood in detail, a more particular description of the present disclosure, briefly summarized above, may be made by reference to embodiments, some of which are illustrated in the accompanying drawings, It should be noted, however, that since the present disclosure may admit of other equally effective embodiments, the accompanying drawings merely illustrate exemplary embodiments and therefore should not be considered limiting in scope. [Brief description of the drawings]

[0009] [Figure 1] 1 is a schematic diagram of a processing chamber. [Figure 2A] 2 is a schematic partial cross-sectional side view of an upper heating module of the processing chamber of FIG. 1. [Figure 2B] FIG. 2B is a detailed view of a portion of FIG. 2A. [Figure 2C] FIG. 2B is a schematic partial cross-sectional plan view of the upper heating module of FIG. 2A. [Figure 2D] FIG. 2 is a schematic isometric view of a heat exchange module. [Figure 2E] FIG. 2B is a schematic diagram of the flow of cooling gas within the upper heating module of FIG. 2A. [Figure 3A] 2 is a schematic partial cross-sectional side view of a lower heating module of the processing chamber of FIG. 1. [Figure 3B] FIG. 3B is a detailed view of a portion of FIG. 3A. [Figure 3C] FIG. 3B is a side view of the lower heating module of FIG. 3A. [Figure 3D] FIG. 3B is a schematic diagram of the flow of cooling gas within the lower heating module of FIG. 3A. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] For ease of understanding, wherever possible, like reference numbers have been used to designate like elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0011] The present disclosure relates to a heat exchanger for use with a substrate processing chamber, such as an epitaxial deposition chamber. The heat exchanger is included in one or more heating modules configured to heat a processing volume along with the processing chamber. The heat exchanger cools a cooling gas, such as air, in the one or more heating modules. One or more fans are operated to direct the cooling gas toward heat lamps in the one or more heating modules and toward an upper window and / or a lower window that define the processing volume. The cooling gas cools the heat lamps, the upper window, and / or the lower window.

[0012] FIG 1 shows a schematic diagram of a processing chamber 100. The processing chamber 100 includes an upper heating module 200 above a chamber body 170 and a lower heating module 300 below the chamber body 170. The upper heating module 200 is shown in more detail in FIGs 2A-2C. The lower heating module 300 is shown in more detail in FIGs 3A-3C.

[0013] Processing chamber 100 can be a processing chamber for performing any thermal process, such as an epitaxial process. Although a processing chamber for an epitaxial process is shown and described, it is contemplated that the concepts of the present disclosure are applicable to other processing chambers capable of providing controlled thermal cycles to heat a substrate for processes such as, for example, thermal annealing, thermal cleaning, thermal chemical vapor deposition, thermal oxidation and thermal nitridation. It is contemplated that processing chamber 100 can be used to process a substrate, including the deposition of materials on the surface of the substrate.

[0014] 1, the chamber body 170 includes an upper window 120 and a lower window 130 with a processing volume 140 therebetween. The processing volume 140 is substantially cylindrical. The upper window 120 includes a base 125 secured in the chamber body 300, and the lower window 130 includes a base 135 secured in the chamber body 300. A neck 132 coupled to the lower window 130 is disposed about a shaft 154 of a susceptor support 152. The susceptor support 152 carries a susceptor 150 on which a substrate 110 may be disposed in the processing volume 140.

[0015] It is contemplated that the susceptor 150 may be made from SiC coated graphite. A motor (not shown) rotates the shaft 154 of the susceptor support 152 about its longitudinal axis, thus rotating the susceptor 150 and rotating the substrate 110. The substrate 110 is brought into the chamber body 300 through a loading port 160 and placed on the susceptor 150.

[0016] One or more coolant inlets 182 and coolant outlets 184 are associated with the upper and lower heating modules 200 and 300. The upper and lower heating modules 200 and 300 heat the processing volume 140, such as by providing infrared radiant heat through the upper and lower windows 120 and 130, respectively. It is contemplated that the upper and lower windows 120 and 130 may be constructed from a material, such as quartz, that is substantially optically transparent. It is further contemplated that the material of the upper and lower windows 120 and 130 may be substantially transparent to infrared radiation such that at least 95% of the incident infrared radiation may be transmitted therethrough.

[0017] 2A-2C show schematic diagrams of the upper heating module 200. FIG. 2A is a schematic partial cross-sectional side view of the upper heating module 200, FIG. 2B is a detailed view of a portion of FIG. 2A, and FIG. 2C is a schematic partial cross-sectional top view of the upper heating module 200. The upper heating module 200 includes an outer housing 202. The outer housing 202 is generally an annular body having a lower flange 204 through which one or more fasteners 206 extend for connection to the chamber body 300.

[0018] The outer housing 202 is coupled to a lamp mounting ring 210 disposed therein. The lamp mounting ring 210 is coupled to a reflector mounting ring 230 of a heat lamp assembly 220 by a number of fasteners 216, such as screws, bolts, rods, etc.

[0019] The heat lamp assembly 220 includes a plurality of linear heat lamps 222 that extend across a central opening of the lamp mounting ring 210. An annular heat shield 280 is coupled to and extends below the reflector mounting ring 230. The annular heat shield 280 reflects heat from the linear heat lamps 222 toward the upper window 120. In some embodiments, it is contemplated that the annular heat shield 280 may be made from and / or coated with a reflective material. For example, the annular heat shield 280 may be gold plated.

[0020] The central opening of the lamp mounting ring 210 is substantially circular, and the annular heat shield 280 is substantially cylindrical. When the upper heating module 200 is assembled into the processing chamber 100, each linear heat lamp 222 extends substantially horizontally above the upper window 120. The linear heat lamps 222 are oriented substantially parallel to one another, such as within 5 degrees.

[0021] The reflector mounting ring 230 is disposed around and coupled to the upper surface 226 of the upper reflector plate 224. When the processing chamber 100 is assembled, the upper reflector plate 224 is disposed above the upper window 120. The upper reflector plate 224 is associated with the linear heat lamps 222. The lower surface 248 of the upper reflector plate 224 includes a plurality of linear channels 246 that extend substantially parallel to one another across the lower surface 248. In some embodiments, it is contemplated that the lower surface 248 of the upper reflector plate 224 includes two or more linear channels 246. For example, the lower surface 248 of the upper reflector plate 224 may include three, four, five, six, seven, eight, nine, ten, or more linear channels 246. The plurality of linear heat lamps 222 extend into a plurality of linear channels 246 such that heat from the linear heat lamps 222 is reflected off the sidewalls of the linear channels 246 toward the upper window 120 in addition to being radiated directly toward the upper window 120. As shown in Figures 2A and 2B, each linear heat lamp 222 is located in a corresponding one of the plurality of linear channels 246. It is contemplated that in some embodiments, two or more linear heat lamps 222 may be located in a corresponding one of the plurality of linear channels 246.

[0022] Each rectilinear channel 246 has a cross-sectional profile configured to reflect heat in a predetermined distribution pattern. For example, the predetermined distribution pattern may create a substantially uniform distribution of heat. Alternatively, the predetermined distribution pattern may focus peak irradiance at one or more specific regions on the substrate 110 undergoing processing to allow control of the temperature in those regions. It is contemplated that each rectilinear channel 246 has at least one of a U-shaped cross-section, or a cross-section having geometric straight sides, such as a V-shaped cross-section, a rectangular cross-section, a pentagonal cross-section, a hexagonal cross-section, or a cross-section having more than six sides, or a curved cross-section, such as a portion of a circle, a portion of an ellipse, or a portion of a parabola, or a combination thereof.

[0023] As one example, an elliptical cross-sectional shape may facilitate focusing of infrared radiation from the linear heat lamps 222. As another example, a parabolic cross-sectional shape may facilitate collimating of infrared radiation from the linear heat lamps 222. As a further example, an angular cross-sectional shape may facilitate diffusing of infrared radiation from the linear heat lamps 222. In some embodiments, it is contemplated that one or more linear channels 246 may have a cross-section that is the same as another one or more linear channels 246. In some embodiments, it is contemplated that one or more linear channels 246 may have a cross-section that is different from another one or more linear channels 246. In some embodiments, it is contemplated that one or more linear channels 246 may have a cross-section that changes from a first shape to a second shape along the length of the linear channel 246.

[0024] The lower surface 248 of the upper reflector plate 224 may be designed to provide irradiance peaks at many locations across the substrate 110 undergoing processing to help facilitate a desired thermal profile. In some embodiments, the upper reflector plate 224 is configured to generate up to as many irradiance peaks as the number of lamps in the plurality of linear heat lamps 222. In some embodiments, the upper reflector plate 224 is configured to generate a number of irradiance peaks that is greater than the number of lamps in the plurality of linear heat lamps 222. In some embodiments, it is contemplated that the upper reflector plate 224 may be made from and / or coated with a reflective material. For example, the upper reflector plate 224 may be gold plated. In some embodiments, the upper reflector plate 224 includes multiple portions bonded together to form a disk-shaped plate.

[0025] 2A and 2B, the upper surface 226 of the upper reflector plate 224 includes a plurality of coolant channels 234. In some embodiments, the plurality of coolant channels 234 extend parallel to the plurality of linear heat lamps 222. A cooling tube 236 is disposed in each coolant channel 234 to carry a coolant, such as water or a refrigerant such as R-22, R-32, or R-410A. In some embodiments, a single cooling tube 236 may be routed into one coolant channel 234 and then routed out of the coolant channel 234 and across to another coolant channel 234. In some embodiments, the number of coolant channels 234 corresponds to the number of linear channels 246. In some embodiments, it is contemplated that the coolant channels 234 and the cooling tubes 236 may be omitted.

[0026] The upper reflector plate 224 includes apertures, such as cooling slots 240, extending from the upper surface 226 to the lower surface 248. The cooling slots 240 are configured to route a cooling gas, such as air, through the upper reflector plate 224. In some embodiments, it is contemplated that the cooling slots 240 may include a plurality of first slots 242 configured to cool the plurality of linear heat lamps 222 to maintain a target lamp temperature. An exemplary target lamp temperature is less than 800 degrees Celsius. As shown in FIG. 2A, the first slots 242 are configured to direct the cooling gas generally toward each linear heat lamp 222. In some embodiments, it is contemplated that the cooling slots 240 may include a plurality of second slots 244 for directing the cooling gas toward the upper window 120. An exemplary target temperature of the upper window 120 is between about 200 degrees Celsius and about 600 degrees Celsius.

[0027] It is contemplated that the number, size, and / or flow area of ​​the first slots 242 relative to the second slots 244 may be configured according to a desired ratio of cooling gas to be flowed through each of the first slots 242 and the second slots 244. For example, it is contemplated that the desired total flow rate of cooling gas through the first slots 242 may be greater than, equal to, or less than the desired total flow rate of cooling gas through the second slots 244. Similarly, it is contemplated that the actual total flow rate of cooling gas through the first slots 242 may be greater than, equal to, or less than the actual total flow rate of cooling gas through the second slots 244. Thus, it is contemplated that the number of first slots 242 may be greater than, equal to, or less than the number of second slots 244. Additionally, it is contemplated that the size of the first slots 242 may be greater than, equal to, or less than the size of the second slots 244. It is further contemplated that the flow area of ​​the first slot 242 can be greater than, equal to, or less than the flow area of ​​the second slot 244 .

[0028] In some embodiments, it is contemplated that the cooling slots 240 are configured to provide sufficient back pressure to provide a desired flow pattern through the cooling slots 240. For example, the number, size, and / or flow area of ​​the cooling slots 240 may be configured such that the flow rate of cooling gas through one first slot 242 may be greater than, equal to, or less than the flow rate of cooling gas through another first slot 242. Similarly, the number, size, and / or flow area of ​​the cooling slots 240 may be configured such that the flow rate of cooling gas through one second slot 244 may be greater than, equal to, or less than the flow rate of cooling gas through another second slot 244.

[0029] A top plate 250 is coupled to the outer housing 202 and serves as a lid for the upper heating module 200. One or more temperature sensors, such as one or more pyrometers 254, are mounted to a base 256 on the top plate 250. In some embodiments, it is contemplated that the base 256 may include a heat exchanger to provide cooling by a suitable fluid, such as water, supplied via a connecting hose (not shown). Each pyrometer 254 may be mounted to measure the surface temperature of a separate portion of the substrate 110 undergoing processing. In some embodiments, each pyrometer 254 may measure the surface temperature of a separate portion of the upper window 120. Such measurements are facilitated via a corresponding pyrometer tube 258.

[0030] The upper heating module 200 includes one or more heat exchange modules 400 mounted above the heat lamp assembly 220. Figure 2D is a schematic isometric view of the heat exchange module 400. Although the upper heating module 200 is shown as including two heat exchange modules 400, in some embodiments, the upper heating module 200 can include fewer or more heat exchange modules 400, such as one, three, four, five, or more.

[0031] 2A-2D, each heat exchange module 400 includes one or more heat exchange tubes 404 mounted in an enclosure 410. The enclosure 410 includes an inner shroud 412 and an outer shroud 414, each extending between two end plates 416. As shown, the inner shroud 412, the outer shroud 414, and the heat exchange tubes 404 are curved in a horizontal plane. However, in some embodiments, the inner shroud 412, the outer shroud 414, and the heat exchange tubes 404 are not curved in a horizontal plane. In one example, the inner shroud 412, the outer shroud 414, and the heat exchange tubes 404 may each be arranged in a straight line in a horizontal plane. In a further example, the inner shroud 412, the outer shroud 414, and the heat exchange tubes 404 may each be arranged in a line in a horizontal plane that includes one or more obtuse angles. In such an example, each of the inner shroud 412, the outer shroud 414, and the heat exchange tubes 404 may be arranged on a line similar to two or more sides of a polygon.

[0032] As shown in FIGS. 2B and 2C , each heat exchange tube 404 is connected to a coolant inlet 182 and a coolant outlet 184. Each heat exchange tube 404 is configured to transport coolant from the coolant inlet 182 to the coolant outlet 184. As shown, each heat exchange tube 404 is connected in parallel to the coolant inlet 182 and the coolant outlet 184. Each heat exchange tube 404 is arranged in multiple passes along the enclosure 410 between end plates 416. The multiple passes are facilitated by one or more U-bends 406 in each heat exchange tube 404. As shown, each heat exchange tube 404 is arranged in four passes. However, in some embodiments, each heat exchange tube 404 may be arranged in any suitable number of passes, such as one, two, three, four, five, six, or more passes. Each end plate 416 of the enclosure 410 provides support to each heat exchange tube 404. As shown, in some embodiments, each heat exchange tube 404 passes through each end plate 416, with at least a portion of each U-shaped bend 406 outside the enclosure 410.

[0033] The heat exchange module 400 includes one or more inner plates 418 within the enclosure 410. The inner plates 418 are coupled to each heat exchange tube 404. In some embodiments, the inner plates 418 are coupled to at least one of the inner shroud 412 or the outer shroud 414. In some embodiments, the inner plates 418 provide support for each heat exchange tube 404. The inner plates 418 provide a thermal connection with each heat exchange tube 404 and include a surface that is contacted by the cooling gas in the upper heating module 200, which facilitates heat transfer between the cooling gas and the coolant in the heat exchange tubes 404.

[0034] In some embodiments, the heat exchange module 400 includes a baffle 422 that extends upwardly from the enclosure 410. As shown, the baffle 422 is an extension of the outer shroud 414 and is configured to contact the top plate 250 of the upper heating module 200. In some embodiments, the baffle 422 is configured to extend to a location proximate to the top plate 250 of the upper heating module 200. In embodiments where the baffle 422 contacts or is proximate to the top plate 250, the proximity of the baffle 422 to the top plate 250 serves to inhibit the cooling gas from bypassing the enclosure 410 and to direct the cooling gas into the enclosure 410. In some embodiments, the baffle 422 is not configured to terminate in contact or proximate to the top plate 250. In some embodiments, the baffle 422 may be omitted.

[0035] In some embodiments, the heat exchange module 400 includes a skirt 424 that extends downwardly from the enclosure 410. As shown, the skirt 424 is an extension of the inner shroud 412 and is configured to contact the reflector mounting ring 230 of the upper heating module 200. In some embodiments, the skirt 424 is configured to extend to a location proximate to the reflector mounting ring 230 of the upper heating module 200. In embodiments in which the skirt 424 contacts or is proximate to the reflector mounting ring 230, the skirt 424's proximity to the reflector mounting ring 230 serves to inhibit the cooling gas from bypassing the enclosure 410 and to direct the cooling gas into the enclosure 410. In some embodiments, the skirt 424 is not configured to terminate in contact or proximate to the reflector mounting ring 230. In some embodiments, the skirt 424 may be omitted.

[0036] 2B and 2C , a cover 432 extends from the inner shroud 412 of the enclosure 410 to the inner wall 204 of the upper heating module 200. One or more fans 436, each fan 436 including a motor 438, are coupled to the cover 432 and configured to induce a flow of cooling gas through apertures 434 in the cover 432. In some embodiments, one or more additional shrouds 428 are disposed within the upper heating module 200 to direct the flow of cooling gas.

[0037] The enclosure 410, cover 432, fan 436, and annular heat shield 280 (as well as baffle 422, skirt 424, and optional additional shroud 428, if present) divide the space within the upper heating module 200 into a lower region 262 below the cover 432 and fan 436 and above the upper reflector plate 224, an annular region 264 between the outer housing 202 and the annular heat shield 280, and an upper region 266 between the top plate 250, cover 432, fan 436, and enclosure 410.

[0038] In some embodiments, the valve 188 selectively prevents or allows coolant to flow from an external source to the coolant inlet 182 and back out the coolant outlet 184. As shown, in some embodiments, the valve 188 may be operated by a controller 440 configured to control the operation of the fan 436 and / or the flow of the coolant. In some embodiments, the coolant is water. In some embodiments, the coolant is a refrigerant, such as R-22, R-32, or R-410A. In some embodiments, the coolant supplied to the heat exchange tube 404 is the same coolant supplied to the cooling tube(s) 236. In some embodiments, the coolant supplied to the heat exchange tube 404 is different from the coolant supplied to the cooling tube(s) 236.

[0039] 2B, in some embodiments, one or more first sensors 186 and / or one or more second sensors 292 may be disposed in one or more suitable locations in the upper heating module 200. The one or more first sensors 186 may measure one or more parameters related to the coolant, such as pressure, temperature, or flow rate. The one or more second sensors 292 may measure one or more parameters related to the cooling gas, such as pressure, temperature, or flow rate. It is contemplated that the one or more first sensors 186 and / or one or more second sensors 292 and / or each fan motor 438, and / or each pyrometer 254 may be connected to a controller 440.

[0040] In some embodiments, when the upper heating module 200 is connected to the chamber body 170, the upper heating module 200 functions as a sealed vessel through which cooling gas can circulate. In some embodiments, the upper heating module 200 includes vents through which at least a portion of the cooling gas can travel between the interior and exterior of the upper heating module 200.

[0041] 2E is a schematic diagram of the flow of cooling gas in the upper heating module 200. The flow is indicated by arrows. During operation of the upper heating module 200, the controller 440 opens the valve 188 to allow the coolant to flow from the coolant inlet 182, through the heat exchange tube 404, and out the coolant outlet 184. The controller 440 operates the fan 436 via the motor 438. The fan 436 moves the cooling gas through the cooling slots 240 in the upper reflector plate 224 and into the lower region 262. The cooling gas cools the upper reflector plate 224, the heat lamps 222, and associated components attached to the upper reflector plate 224 or the heat lamps 222.

[0042] The cooling gas flows through the interior of the annular heat shield 280 and impinges on the upper window 120. The cooling gas cools the upper window 120, travels around the bottom of the annular heat shield 280, and flows upwardly out of the annular heat shield 280. Heat transfer from the upper reflector plate 224, heat lamps 222, associated components, the annular heat shield 280, and the upper window 120 to the cooling gas increases the temperature of the cooling gas.

[0043] The cooling gas flows into the annular region 264 and then through the enclosure 410 of the heat exchange module 400. The cooling gas contacts the inner plate 418 and the heat exchange tubes 404 and heat from the cooling gas is transferred to the coolant in the heat exchange tubes 404. The temperature of the cooling gas is reduced by the heat transfer from the cooling gas to the coolant. The cooling gas exits the enclosure 410 of the heat exchange module 400 and flows into the upper region 266 and the operation of the fan 436 draws the cooling gas back into the lower region 262.

[0044] During operation, the controller 440 monitors operating parameters and adjusts the flow of cooling gas and / or coolant to affect the temperature of the heat lamps 222, the components on the upper reflector plate 224 associated with the heat lamps 222, and / or the upper window 120. The controller monitors the temperature and / or pressure of the cooling gas at various locations in the upper heating module 200 via the sensors 292. In some embodiments, the controller may monitor the flow rate of the cooling gas via the current draw of the motor 438 of the fan 436. The controller monitors the temperature and / or pressure and / or flow rate of the coolant via the sensor 186. By monitoring the pressure and / or flow rate of the coolant, the controller can determine if a coolant leak is occurring in each heat exchange module 400.

[0045] FIGURE 3A is a schematic partial cross-sectional side view of the lower heating module 300, FIGURE 3B is a detailed view of a portion of FIGURE 3A, and FIGURE 3C is a side view of the lower heating module 300 taken perpendicular to the view of FIGURE 3A. The lower heating module 300 includes an outer housing 302. The outer housing 302 is generally an annular body coupled to or integral with an adapter plate 306. Fasteners 308 connect the adapter plate 306 to the chamber body 170 when the processing chamber 100 is assembled.

[0046] The outer housing 302 is coupled to a separator plate 310 disposed therein. The separator plate 310 is coupled to a heat lamp assembly 320. The heat lamp assembly 320 includes a plurality of linear heat lamps 322 that extend across a central opening of the separator plate 310. An annular heat shield 380 is coupled to the separator plate 310. The annular heat shield 380 reflects heat from the linear heat lamps 322 toward the lower window 130. In some embodiments, it is contemplated that the annular heat shield 380 may be made from and / or coated with a reflective material. For example, the annular heat shield 380 may be gold plated.

[0047] The central opening of the separation plate 310 is substantially circular, and the annular heat shield 380 is substantially cylindrical. When the lower heating module 300 is assembled into the process chamber 100, each linear heat lamp 322 extends substantially horizontally below the lower window 130. The linear heat lamps 322 are oriented substantially parallel to one another, such as within 5 degrees.

[0048] A lower reflector plate 324 is coupled to and disposed within the annular heat shield 380. When the process chamber 100 is assembled, the lower reflector plate 324 is disposed below the lower window 130. The lower reflector plate 324 is associated with the linear heat lamps 322. An upper surface 348 of the lower reflector plate 324 includes a plurality of linear channels 346 that extend substantially parallel to one another across the upper surface 348. In some embodiments, it is contemplated that the upper surface 348 of the lower reflector plate 324 includes two or more linear channels 346. For example, the upper surface 348 of the lower reflector plate 324 may include three, four, five, six, seven, eight, nine, ten, or more linear channels 346. The plurality of linear heating lamps 322 extend into a plurality of linear channels 346 such that heat from the linear heating lamps 322 is reflected from the sidewalls of the linear channels 346 toward the lower window 130 in addition to being radiated directly toward the lower window 130. As shown in Figures 3A and 3B, each linear heating lamp 322 is located in a corresponding one of the plurality of linear channels 346. It is contemplated that in some embodiments, two or more linear heating lamps 322 may be located in a corresponding one of the plurality of linear channels 346.

[0049] Each rectilinear channel 346 has a cross-sectional profile configured to reflect heat in a predetermined distribution pattern. For example, the predetermined distribution pattern may create a substantially uniform distribution of heat. Alternatively, the predetermined distribution pattern may focus peak irradiance at one or more specific regions on the underside of the susceptor 150 to allow control of the temperature in those regions. It is contemplated that each rectilinear channel 346 has at least one of a U-shaped cross-section, or a cross-section having geometric straight sides, such as a V-shaped cross-section, a rectangular cross-section, a pentagonal cross-section, a hexagonal cross-section, or a cross-section having more than six sides, or a curved cross-section, such as a portion of a circle, a portion of an ellipse, or a portion of a parabola, or a combination thereof.

[0050] As one example, an elliptical cross-sectional shape may facilitate focusing of infrared radiation from the linear heat lamps 322. As another example, a parabolic cross-sectional shape may facilitate collimating of infrared radiation from the linear heat lamps 322. As a further example, an angular cross-sectional shape may facilitate diffusing of infrared radiation from the linear heat lamps 322. In some embodiments, it is contemplated that one or more linear channels 346 may have a cross-section that is the same as another one or more linear channels 346. In some embodiments, it is contemplated that one or more linear channels 346 may have a cross-section that is different from another one or more linear channels 346. In some embodiments, it is contemplated that one or more linear channels 346 may have a cross-section that changes from a first shape to a second shape along the length of the linear channel 346.

[0051] The upper surface 348 of the lower reflector plate 324 may be designed to provide irradiance peaks at many locations across the underside of the susceptor 150 to help facilitate a desired thermal profile. In some embodiments, the lower reflector plate 324 is configured to generate up to as many irradiance peaks as the number of lamps in the plurality of linear heat lamps 322. In some embodiments, the lower reflector plate 324 is configured to generate a number of irradiance peaks that is greater than the number of lamps in the plurality of linear heat lamps 322. In some embodiments, it is contemplated that the lower reflector plate 324 may be made from and / or coated with a reflective material. For example, the lower reflector plate 324 may be gold plated.

[0052] A neck shield 382 extends through the lower reflector plate 324. The neck shield 382 is configured to be disposed around the neck 132 of the lower window 130. The neck shield 382 reflects heat away from the neck 132 of the lower window 130. In some embodiments, it is contemplated that the neck shield 382 may be made from and / or coated with a reflective material. For example, the neck shield 382 may be gold plated.

[0053] As shown, the lower surface 326 of the lower reflector plate 324 includes a plurality of coolant channels 334. In some embodiments, the plurality of coolant channels 334 extend parallel to the plurality of linear heat lamps 322. A cooling tube 336 is disposed in each coolant channel 334 to carry a coolant, such as water or a refrigerant such as R-22, R-32, or R-410A. In some embodiments, a single cooling tube 336 may be routed into one coolant channel 334 and then routed out of the coolant channel 334 and across to another coolant channel 334. In some embodiments, the number of coolant channels 334 corresponds to the number of linear channels 346. In some embodiments, it is contemplated that the coolant channels 334 and the cooling tubes 336 may be omitted.

[0054] The lower reflector plate 324 includes apertures, such as cooling slots 340, extending from the lower surface 326 to the upper surface 348. The cooling slots 340 are configured to route a cooling fluid, such as a gas, such as air, through the lower reflector plate 324. In some embodiments, it is contemplated that the cooling slots 340 may include a plurality of first slots 342 configured to cool the plurality of linear heat lamps 322 to maintain a target lamp temperature. An exemplary target lamp temperature is less than 800 degrees Celsius. As shown in FIG. 2, the first slots 342 are configured to direct the cooling fluid generally toward each linear heat lamp 322. In some embodiments, it is contemplated that the cooling slots 340 may include a plurality of second slots 344 for directing the cooling fluid toward the lower window 130. An exemplary target temperature of the lower window 130 is between about 400 degrees Celsius and about 600 degrees Celsius.

[0055] It is contemplated that the number, size, and / or flow area of ​​the first slots 342 relative to the second slots 344 may be configured according to a desired ratio of cooling fluid to be flowed through each of the first slots 342 and the second slots 344. For example, it is contemplated that the desired total flow rate of cooling fluid through the first slots 342 may be greater than, equal to, or less than the desired total flow rate of cooling fluid through the second slots 344. Similarly, it is contemplated that the actual total flow rate of cooling fluid through the first slots 342 may be greater than, equal to, or less than the actual total flow rate of cooling fluid through the second slots 344. Thus, it is contemplated that the number of first slots 342 may be greater than, equal to, or less than the number of second slots 344. Additionally, it is contemplated that the size of the first slots 342 may be greater than, equal to, or less than the size of the second slots 344. It is further contemplated that the flow area of ​​the first slot 342 can be greater than, equal to, or less than the flow area of ​​the second slot 344 .

[0056] In some embodiments, it is contemplated that the cooling slots 340 are configured to provide sufficient back pressure to provide a desired flow pattern through the cooling slots 340. For example, the number, size, and / or flow area of ​​the cooling slots 340 may be configured such that the flow rate of cooling fluid through one first slot 342 may be greater than, equal to, or less than the flow rate of cooling fluid through another first slot 342. Similarly, the number, size, and / or flow area of ​​the cooling slots 340 may be configured such that the flow rate of cooling fluid through one second slot 344 may be greater than, equal to, or less than the flow rate of cooling fluid through another second slot 344.

[0057] A bottom cover 350 is coupled to the outer housing 302 and serves as a lid for the lower heating module 300. As shown in FIG. 3C, one or more temperature sensors, such as one or more pyrometers 354, are mounted to a base 356 on the bottom cover 350. In some embodiments, it is contemplated that the base 356 may include a heat exchanger to provide cooling by a suitable fluid, such as water, provided via a connecting hose (not shown). It is contemplated that each pyrometer 354 may be mounted to measure the surface temperature of a separate portion of the lower surface of the susceptor 150. In some embodiments, each pyrometer 354 may measure the surface temperature of a separate portion of the lower window 130. It is further contemplated that such measurements may be facilitated via a corresponding pyrometer tube (not shown) protruding through a hole in the lower reflector plate 324, although in some embodiments, the corresponding pyrometer tube may be omitted.

[0058] 3A and 3B, the lower heating module 300 includes one or more heat exchange modules 400 mounted below the heat lamp assembly 320. Although the lower heating module 300 is shown as including two heat exchange modules 400, in some embodiments the lower heating module 300 may include fewer or more heat exchange modules 400, such as one, three, four, five, or more. Each heat exchange module 400 is configured as described above.

[0059] As shown, in some embodiments, the heat exchange module 400 includes an outer baffle 452 that extends downwardly from the enclosure 410. As shown, the outer baffle 452 is an extension of the outer shroud 414 and is configured to contact the bottom cover 350 of the lower heating module 300. In some embodiments, the outer baffle 452 is configured to extend to a location proximate to the bottom cover 350 of the lower heating module 300. In embodiments in which the outer baffle 452 contacts or is proximate to the bottom cover 350, the proximity of the outer baffle 452 to the bottom cover 350 serves to inhibit the cooling gas from bypassing the enclosure 410 and to direct the cooling gas into the enclosure 410. In some embodiments, the outer baffle 452 is not configured to terminate in contact or proximate to the bottom cover 350. In some embodiments, the outer baffle 452 may be omitted.

[0060] In some embodiments, the heat exchange module 400 includes an inner baffle 454 extending downwardly from the enclosure 410. As shown, the inner baffle 454 is an extension of the inner shroud 412 and is configured to contact the separator plate 310 of the lower heating module 300. In some embodiments, the inner baffle 454 is configured to extend to a location proximate to the separator plate 310 of the lower heating module 200. In embodiments where the inner baffle 454 contacts or is proximate to the separator plate 310, the proximity of the inner baffle 454 to the separator plate 310 acts to inhibit the cooling gas from bypassing the circulation route described below. In some embodiments, the inner baffle 454 is not configured to terminate in contact or proximity to the separator plate 310. In some embodiments, the inner baffle 454 may be omitted.

[0061] As shown, one or more apertures 330 in the separator plate 310 provide a flow path for cooling gas towards the enclosure 410 of the heat exchange module 400 .

[0062] A cover 462 extends from the inner shroud 412 of the enclosure 410 to the inner wall 304 of the lower heating module 300. One or more fans 466, each fan 466 including a motor 468, are coupled to the cover 462 and configured to induce a flow of cooling gas through apertures 464 in the cover 462. In some embodiments, one or more additional shrouds 458 are disposed within the lower heating module 300 to direct the flow of cooling gas.

[0063] The enclosure 410, cover 462, and fan 466 (and, if present, outer baffle 452, inner baffle 454, and optional additional shroud 458) divide the space within the lower heating module 300 into a lower region 362 between the bottom cover 350 and cover 462, fan 466, and enclosure 410, and an upper region 366 above the cover 462 and fan 466 and below the lower reflector plate 324. An annular region 364 exists between the outer housing 302 and the annular heat shield 380.

[0064] 3A , in some embodiments, valve 188 selectively prevents or allows coolant to flow from an external source to coolant inlet 182 and back out coolant outlet 184. As shown, in some embodiments, valve 188 may be operated by controller 440. In some embodiments, the coolant is water. In some embodiments, the coolant is a refrigerant, such as R-22, R-32, or R-410A. In some embodiments, the coolant supplied to heat exchange tube 404 is the same coolant supplied to cooling tube(s) 336. In some embodiments, the coolant supplied to heat exchange tube 404 is different from the coolant supplied to cooling tube(s) 336.

[0065] In some embodiments, one or more first sensors 186 and / or one or more second sensors 292 may be disposed in one or more suitable locations in the lower heating module 300. The one or more first sensors 186 may measure one or more parameters related to the coolant, such as pressure, temperature, or flow rate. The one or more second sensors 292 may measure one or more parameters related to the cooling gas, such as pressure, temperature, or flow rate. It is contemplated that the one or more first sensors 186 and / or one or more second sensors 292 and / or each fan motor 468, and / or each pyrometer 354 may be connected to the controller 440.

[0066] In some embodiments, when the lower heating module 300 is connected to the chamber body 170, the lower heating module 300 functions as a sealed vessel through which cooling gas can circulate. In some embodiments, the lower heating module 300 includes vents through which at least a portion of the cooling gas can travel between the interior and exterior of the lower heating module 300.

[0067] 3D is a schematic diagram of the flow of cooling gas in the lower heating module 300. The flow is indicated by arrows. During operation of the lower heating module 300, the controller 440 opens the valve 188 to allow coolant to flow from the coolant inlet 182, through the heat exchange tube 404, and out the coolant outlet 184. The controller 440 operates the fan 466 via the motor 468. The fan 466 moves the cooling gas through the cooling slots 340 in the lower reflector plate 324 and into the upper region 366. The cooling gas cools the lower reflector plate 324, the heat lamps 322, and associated components attached to the lower reflector plate 324 or the heat lamps 322.

[0068] The cooling gas flows through the interior of the annular heat shield 380 and impinges on the lower window 130. The cooling gas cools the lower window 130, travels around the top of the annular heat shield 380, and flows downwardly into the annular region 364. Heat transfer from the lower reflector plate 324, heat lamps 322, associated components, the annular heat shield 380, and the lower window 130 to the cooling gas increases its temperature.

[0069] The cooling gas flows through one or more apertures 330 in the separator plate 310 and into the enclosure 410 of the heat exchange module 400. The cooling gas contacts the inner plate 418 and the heat exchange tubes 404 and heat from the cooling gas is transferred to the coolant in the heat exchange tubes 404. The temperature of the cooling gas is reduced by the heat transfer from the cooling gas to the coolant. The cooling gas exits the enclosure 410 of the heat exchange module 400 and flows into the lower region 362 where operation of the fan 466 draws the cooling gas back into the upper region 366.

[0070] During operation, the controller 440 monitors operating parameters and adjusts the flow of cooling gas and / or coolant to affect the temperature of the heat lamps 322, the components on the lower reflector plate 324 associated with the heat lamps 322, and / or the lower window 130. The controller 440 monitors the temperature and / or pressure of the cooling gas at various locations in the lower heating module 300 via the sensors 292. In some embodiments, the controller 440 may monitor the flow rate of the cooling gas via the current draw of the motor 468 of the fan 466. The controller 440 monitors the temperature and / or pressure and / or flow rate of the coolant via the sensors 186. By monitoring the pressure and / or flow rate of the coolant, the controller 440 can determine if a coolant leak is occurring within each heat exchange module 400.

[0071] It is contemplated that the controller 440 includes a central processing unit (CPU), memory containing instructions, and support circuitry for the CPU. The controller 440 is any form of general-purpose computer processor used in industrial settings to control various chambers and instruments and / or sub-processors thereon or therein. In some embodiments, one or more controllers 440 are used for the controller aspects of the chamber 100.

[0072] The memory, or non-transitory computer-readable medium, is one or more of a readily available memory, such as a random access memory (RAM), a read-only memory (ROM), a floppy disk, a hard disk, a flash drive, or any other form of digital storage, local or remote. The support circuits are coupled to the CPU (processor) to support the CPU. The support circuits include cache, power supplies, clock circuits, input / output circuits and subsystems, and the like. The operations and operating parameters are stored in the memory as software routines that are executed or called to turn the controller 440 into a special purpose controller to control the operation of any of the individual heat exchange modules 400 in the upper heating module 200, the individual heat exchange modules 400 in the lower heating module 300, the individual valves 188 in the upper heating module 200, the individual valves 188 in the lower heating module 300, the individual fans 436 in the upper heating module 200, and / or the individual fans 466 in the lower heating module 300. The controller 440 is configured to perform any of the operations described herein. The instructions stored in the memory, when executed, cause one or more of the operations described herein to be performed.

[0073] In some embodiments, data from any of the sensors 186, 292, and / or any other sensors associated with the processing chamber 100 may be used to provide feedback to the controller 440. In some embodiments, data of the current through any of the fans 436, 466, heat lamps 222, 322, and / or any other electrically powered components associated with the processing chamber 100 may be used to provide feedback to the controller 440. The controller 440 uses the data so provided as input to process commands directed to any of the fans 436, 466, and / or any valves 188.

[0074] The instructions in the memory of the controller 440 may include one or more machine learning / artificial intelligence algorithms that may be executed in addition to the operations described herein. As an example, the machine learning / artificial intelligence algorithms executed by the controller 440 may tune and change operational parameters based on the received data. The operational parameters may include, for example, pressure, temperature, and flow rate of the coolant and / or cooling gas. The operational parameters may include, for example, the status of each valve 188 to fully open and / or fully closed. The operational parameters may include, for example, the speed of each fan 436, 466. In some embodiments, the one or more machine learning / artificial intelligence algorithms may prompt the controller 440 to initiate corrective action to adjust any operational parameters.

[0075] Embodiments of the present disclosure provide a compact cooling system that is contained within the heating module and does not rely on cooling gas to be delivered through dedicated piping, which allows for a reduction in components (such as piping) associated with the processing chamber, thus saving space and improving access around the processing chamber.

[0076] It is contemplated that elements and features of any one disclosed embodiment may be beneficially incorporated in one or more other embodiments. While the forgoing is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the basic scope thereof, which scope is determined by the following claims.

Claims

1. 1. A heating module for a process chamber suitable for use in semiconductor manufacturing, the heating module comprising: An outer housing; a lid on the outer housing; a reflector plate disposed in the outer housing; a plurality of heat lamps associated with the reflector plate; a first heat exchange module disposed between the reflector plate and the lid, the first heat exchange module including a plurality of first heat exchange tubes disposed between a first inner shroud and a first outer shroud; A heating module comprising:

2. The heating module of claim 1 , wherein the first heat exchange module further comprises a plurality of plates coupled to each first heat exchange tube.

3. The heating module of claim 1 , wherein each first heat exchange tube is coupled to a coolant inlet and a coolant outlet.

4. The heating module of claim 3 , wherein each first heat exchange tube is arranged in a plurality of passes between the first inner shroud and the first outer shroud and includes one or more U-shaped bends.

5. The heating module of claim 1 , wherein the first heat exchange module further comprises a first fan disposed between the reflector plate and the lid.

6. an annular heat shield extends from the reflector plate; The space within the heating module is a first region between the first fan and the lid; a second region between the first fan and the reflector plate; a third region between the annular heat shield and the outer housing; is divided into The first fan, drawing a cooling gas from the first region to the second region; channeling the cooling gas from the second region through a plurality of apertures in the reflector plate and through the annular heat shield; conveying the cooling gas from the annular thermal shield to the third region; conveying the cooling gas from the third region between the first inner shroud and the first outer shroud, around the first heat exchange tubes, and to the first region; configured to deliver the cooling gas within the heating module in a circuit including: The heating module of claim 5.

7. The heating module of claim 6 , wherein the first heat exchange module further comprises a baffle extending from the outer shroud to the lid.

8. The heating module of claim 7 , wherein the first heat exchange module further comprises a skirt extending from the inner shroud to a reflector mounting ring coupled to the reflector plate.

9. 10. The heating module of claim 1, further comprising a second heat exchange module disposed between the reflector plate and the lid, the second heat exchange module including a plurality of second heat exchange tubes disposed between a second inner shroud and a second outer shroud.

10. The heating module of claim 9 , further comprising a second fan disposed between the reflector plate and the lid.

11. The heating module of claim 1 , further comprising a cooling tube coupled to the reflector plate.

12. The heating module of claim 11 , wherein the first heat exchange tube is configured to carry a first coolant and the cooling tube is configured to carry a second coolant different from the first coolant.

13. 1. A heat exchange module suitable for use in semiconductor manufacturing, comprising:

1. An enclosure comprising: an inner shroud extending between the first end plate and the second end plate; an outer shroud extending between the first end plate and the second end plate; an enclosure including: a plurality of heat exchange tubes disposed within the enclosure; a plurality of inner plates disposed within the enclosure and coupled to each of the heat exchange tubes; Equipped with the inner shroud, the outer shroud, and each heat exchange tube are curved in a horizontal plane.

14. The heat exchange module of claim 13 , wherein the inner plate is coupled to at least one of the inner shroud or the outer shroud.

15. 14. The heat exchange module of claim 13, wherein each heat exchange tube is connected in parallel to the coolant inlets and in parallel to the coolant outlets.

16. The heat exchange module of claim 13 , wherein each heat exchange tube is arranged in multiple passes between the inner and outer shrouds and includes one or more U-shaped bends.

17. The heat exchange module of claim 16 , wherein each heat exchange tube passes through the first end plate and the second end plate, and at least a portion of each U-bend is outside the enclosure.

18. 1. A processing chamber suitable for use in semiconductor manufacturing, comprising: a chamber body including an upper window disposed above a lower window, the upper window and the lower window forming a boundary of a processing volume; an upper heating module coupled to the chamber body above the upper window, the upper heating module comprising: A first outer housing; a first lid on the first outer housing; a first reflector plate disposed in the first outer housing; a plurality of first heat lamps associated with the first reflector plate; a first heat exchange module disposed between the first reflector plate and the first lid, the first heat exchange module including a plurality of first heat exchange tubes disposed between a first inner shroud and a first outer shroud; an upper heating module including: A processing chamber comprising:

19. a lower heating module coupled to the chamber body below the lower window, the lower heating module comprising: A second outer housing; a second lid on the second outer housing; and a second reflector plate disposed in the second outer housing; a plurality of second heat lamps associated with the second reflector plate; a second heat exchange module disposed between the second reflector plate and the second lid, the second heat exchange module including a plurality of second heat exchange tubes disposed between a second inner shroud and a second outer shroud; A lower heating module including 20. The processing chamber of claim 18, further comprising:

20. 20. The processing chamber of claim 19, further comprising a controller configured to control operation of a first fan of the first heat exchange module and a second fan of the second heat exchange module.

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