Wafer Cassette Packaging Machine

Abstract

The invention relates to an apparatus for packaging wafer cassettes in transport boxes, the apparatus comprising a loading station (101) capable of receiving transport boxes for semiconductor wafers, an element (102) for reading and writing RFID tags attached to the transport boxes, an element (103) for optically inspecting add-on parts of the transport boxes by means of a camera, an element (104) for equipping the transport boxes with desiccant bags, an element (105) for closing the bag surrounding the transport box by means of a welded seam, an element (106) for checking the tightness of the welded seam, an element (107) for attaching a label to the transport box, an element (108) for automatically transporting the transport boxes in the form of a robot arm, an element (109) for storing packaging material and an element (110) capable of receiving transport boxes for semiconductor wafers and storing them for transport.

Description

[Technical field]

[0001] The subject matter of the present invention relates to packaging wafer cassettes, and more particularly to a packaging apparatus for wafer cassettes that can automatically package the wafer cassettes. [Background technology]

[0002] A wafer is a thin sheet used as the raw material for integrated semiconductor circuits (ICs), and is primarily made from silicon material.

[0003] The manufacturing process of silicon semiconductor wafers includes a single crystal growing process for producing a single crystal silicon block, a sawing process for obtaining thin disk-shaped wafers by cutting the single crystal block, an edge grinding process for machining the outer periphery of the wafer to prevent cracks and deformations of the wafer obtained by the sawing process, a lapping process for removing damages remaining on the wafer due to machining to improve the wafer uniformity, a polishing process for polishing the wafer to a mirror finish, and a cleaning process for removing abrasives or foreign matter attached to the semiconductor wafer.

[0004] The semiconductor wafers manufactured using these different processes are placed in cassettes, for example Front Open Shipping Boxes (FOSBs), to avoid contaminants and protect them from external influences. Before being packaged and shipped, they are sealed from the outside using packaging film.

[0005] The quality of the packaging plays a very big role, since the packaged semiconductor wafers are sent directly to the production line of the respective manufacturer of electronic devices and need to be identified there. The labels, for example, need to be positioned accurately and reproducibly. The content of these labels also needs to match exactly with the content of each delivery. Furthermore, the semiconductor wafers need to be in the respective slots of the wafer cassette in the correct order. Furthermore, different requirements of different manufacturers of electronic devices need to be taken into account. As an example, the labels need to be in different positions depending on the customer, or the content of the labels (barcodes and / or characters) differs depending on the customer.

[0006] The specification of US Patent No. 2020219741 describes an apparatus for packaging wafer cassettes, the apparatus comprising: a loading unit into which wafer cassettes are loaded; an accessory inspection unit for analyzing specifications attached to the wafer cassettes and inspecting accessories of the wafer cassettes; a first label attachment unit configured to attach a first label to a wafer cassette after accessory inspection is completed; a primary film packaging unit configured to collect a primary film according to the specifications and package the wafer cassette using the primary film; a secondary film packaging unit configured to collect a secondary film according to the specifications and package the wafer cassette using the secondary film; a second label attachment unit configured to attach a second label to the secondary film used to package the wafer cassette; and a discharge unit configured to provide a fully packaged wafer cassette.

[0007] JP 2015058958 A describes a packaging system having a number of clamps that open and close the bag opening of a side gusset bag in a horizontal position, the bag opening being formed at one end, and a carriage arm that inserts a container or packaged object into the side gusset bag. Summary of the Invention [Problem to be solved by the invention]

[0008] None of the documents mentioned above are able to satisfactorily provide a device capable of solving the problems already mentioned. [Means for solving the problem]

[0009] The object of the present invention is to provide an apparatus which minimizes the above mentioned problems and which also allows an increase in the throughput of the packaging installation. [Brief description of the drawings]

[0010] [Figure 1] 1 shows an exemplary configuration of an apparatus according to the present invention for packaging wafer cassettes. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS ACCORDING TO THE PRESENT PRESENT EMBODIMENT The device according to the invention for packaging wafer cassettes comprises several elements which will be described more precisely below.

[0012] The shipping boxes used are containers made of plastic, for example made of Polycarbonate (PC), which may contain components made of Polybutylene Terephthalate (PBT), Polyolefin Elastomers (POE) or Poly(Ethylethylene) (PEE). These shipping boxes are usually called "Front Opening Shipping Boxes" (FOSBs).

[0013] The apparatus according to the invention comprises an automatic loading station (101) capable of receiving a transport box of semiconductor wafers.

[0014] The FOSB is placed at a loading station (101). The device according to the invention further comprises an element (102) for automatically reading and writing an RFID tag attached to the transport box. Alternatively, exactly one RFID tag can be used. RFID tagging (Radio-Frequency Identification, "electromagnetic wave-based identification") denotes a technology for a transceiver system for automatic and contactless identification and location of objects using radio waves.

[0015] The device according to the invention also comprises an element (103) for automatic optical inspection of the accessories of the transport box by means of a camera. It is necessary to prevent damage to the transport box and therefore it is important to carry out the inspection in this respect. All the inspection results, including the camera images, are stored.

[0016] The device according to the invention preferably includes an element for automatically checking the correct loading of the wafer cassette. The task of this element is, for example, to identify incorrectly loaded semiconductors. The wafer cassette has a number of receiving slots spaced apart from one another for holding semiconductor wafers, each of which is prevented from further movement by a lower or upper pad. A common error may be what is known as a cross-slot error, in which a semiconductor wafer is loaded on an incline in the wafer box.

[0017] It is further preferred that the apparatus according to the invention includes a printer for printing the labels used to attach to the boxes.

[0018] The apparatus according to the invention also includes a device (107) for automatically applying labels to the shipping boxes.

[0019] Furthermore, the device according to the invention preferably comprises an element for automatically checking the label attached to the transport box, for example whether it is in the correct position and / or whether the printed content is readable and whether it corresponds to the desired content.

[0020] After the labels have been applied, a camera system is preferably used to check their position with millimeter accuracy. The printed content of the labels is checked as well. All codes and characters must be printed legibly and without errors. Unprinted areas of the label must be free of misprints. The labels are compared to the image generated via the print file using an image comparison to check for reproducibility. All test results are stored.

[0021] Likewise, the device according to the invention includes a device (105) for automatically sealing the inner bag surrounding the transport box by means of a first weld seam.

[0022] The device according to the invention also includes an element (106) for automatically checking the impermeability of the first weld seam. This includes, for example, applying negative pressure to check the impermeability of the weld seam. The packaged FOSB is tested for the degree of impermeability of the bag in a vacuum chamber by a filled gas test. The test results are stored in the EDP.

[0023] The device according to the invention further comprises an element (104) for automatically equipping the transport box with a desiccant pouch. The desiccant pouch is generally filled with silica gel and is suitable for absorbing moisture from the air and thus avoiding the formation of condensation. It is absolutely essential that the desiccant pouch is always located in the same position in the transport box. The desiccant pouch is automatically glued.

[0024] The device according to the invention preferably also comprises an element for sealing the outer bag surrounding the transport box by means of a second welded seam. The material used for the outer bag is usually different from the material used for the inner bag. After the bag is closed, air is withdrawn from the bag and an adjustable defined amount of gas is provided. The bag is then welded. The overlap of the bag is folded and glued.

[0025] The device according to the invention preferably includes an element for automatically checking the impermeability of the second weld seam. This preferably involves the use of negative pressure. The packaged FOSB is tested for the degree of impermeability of the bag in a vacuum chamber by a filled gas test. The test results are stored.

[0026] The device according to the invention further comprises an element (108) for automatically transporting the transport boxes. A transport device in the form of a robot arm is suitable for this.

[0027] Furthermore, the device according to the invention includes an element capable of receiving a transport box for semiconductor wafers and storing said transport box for transport. [Explanation of symbols]

[0028] 101 A loading station capable of receiving a transport box for semiconductor wafers. 102 An element for reading and writing RFID tags attached to transport boxes 103 Element for optically inspecting the accessories of the transport box by means of a camera 104 Elements for equipping shipping boxes with desiccant pouches 105 Element for sealing the bag around the transport box by means of a welded seam 106 Elements for checking the impermeability of weld seams 107 Elements for attaching labels to shipping boxes 108 Element for automatically transporting carrier boxes in the form of a robot arm 109 Elements for storing packaging materials 110 An element capable of receiving a transport box for semiconductor wafers and storing the transport box for transport

Claims

1. 1. An apparatus for packaging wafer cassettes in a shipping box, comprising: a loading station (101) capable of receiving said transport boxes for semiconductor wafers; an element (102) for writing and reading an RFID tag attached to said shipping box; an element (103) for optically inspecting the accessories of said transport box by means of a camera; an element (104) for equipping said shipping box with a desiccant pouch; an element (105) for sealing the bag surrounding said transport box by means of a welded seam; an element (106) for checking the impermeability of the weld seam; An element (107) for attaching a label to said shipping box; an element (108) for automatically transporting said transport box in the form of a robotic arm; an element (109) for containing the packaging material; an element (110) capable of receiving the transport box for the semiconductor wafers and storing the transport box for transport; An apparatus comprising:

2. 2. A method for packaging wafer cassettes in a transport box, characterized in that an apparatus according to claim 1 is used.

Images