Probe head for testing electrical equipment and method of manufacturing same

Abstract

A probe head capable of simultaneously measuring a plurality of test target devices is disclosed. The probe head according to the present invention is characterized in that it comprises an elastic body formed by laminating a plurality of elastic layers, and an electrode portion is embedded inside the elastic body. This allows the probe head to efficiently absorb impact or load generated when contacting the test target device, and prevents damage to the test target device and the probe head. Furthermore, according to the present invention, the test time can be shortened by simultaneously testing a plurality of electrical devices. Furthermore, by providing independent elasticity between each probe pin, the stability and reliability of the test are further improved.

Description

[Technical field]

[0001] The present invention relates to a probe head for inspecting an electric device, and more particularly, to a probe head capable of inspecting a fine electric device of a micrometer (μm) size and absorbing a shock or load generated during the inspection through an elastic body. [Background technology]

[0002] After an electrical device is manufactured, it is necessary to connect a testing device to the electrical device to test its electrical characteristics. Although testing can be done by a person simply connecting the testing device to the electrodes of the electrical device, it is time-consuming and costly to have a person test each and every product during the production process. Therefore, a probe head that mechanically contacts the electrical device to provide an electrical connection has been developed and is used.

[0003] However, when the probe head repeatedly comes into contact with the device under test, the load caused by the impact or contact action accumulates, which can damage the probe head. In addition, if the heights of multiple contact terminals on the device under test are not the same, not all terminals will come into contact at the same time, which makes it difficult to test multiple terminals at the same time. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Republic of Korea Registered Utility Model No. 20-0458537 (Registered on February 3, 2012) [Patent Document 2] Republic of Korea Registered Utility Model No. 20-0399963 (registered October 24, 2005) Summary of the Invention [Problem to be solved by the invention]

[0005] A technical object of the present invention is to provide a probe head capable of simultaneously measuring a large number of test target devices.

[0006] Another technical object of the present invention is to efficiently absorb the impact or load generated upon contact and prevent damage to the device under test and the probe head. [Means for solving the problem]

[0007] In order to solve the above problems, the present invention provides a probe head including an elastic body formed by laminating a plurality of elastic layers, and an electrode portion embedded inside the elastic body. Effect of the Invention

[0008] The present invention also allows for the testing of multiple electrical devices simultaneously, reducing the testing time required.

[0009] Furthermore, according to the present invention, damage to the device under test is prevented, and the durability of the probe head is improved.

[0010] Furthermore, the probe head according to the present invention has independent elasticity between each probe pin, which further improves the stability and reliability of the test. [Brief description of the drawings]

[0011] [Figure 1] 1 shows a vertical cross-sectional structure of a probe head according to a first embodiment of the present invention. [Diagram 2] 1 shows a state in which a load is applied to one probe pin of a probe head according to a first embodiment of the present invention. [Diagram 3] 3 shows a vertical cross-sectional shape of an electrode portion according to a first embodiment of the present invention. [Figure 4] 13 shows a vertical cross-sectional structure of a probe head according to a second embodiment of the present invention. [Diagram 5]4 is a flowchart showing a method for manufacturing a probe head according to a first embodiment of the present invention. [Figure 6] 4 illustrates a step of laminating a first elastic layer according to a first embodiment of the present invention. [Figure 7] 4 illustrates a step of laminating a second elastic layer according to the first embodiment of the present invention. [Figure 8] 4 illustrates a step of forming an inclined surface by etching the first elastic layer and the second elastic layer according to the first embodiment of the present invention. [Figure 9] 4 illustrates a step of laminating a third elastic layer according to the first embodiment of the present invention. [Figure 10] 4 illustrates steps of forming an electrode portion according to a first embodiment of the present invention. [Figure 11] 1 shows a plan view of a probe head according to a first embodiment of the present invention. [Figure 12] 10 illustrates a step of laminating a fourth elastic layer according to the first embodiment of the present invention. [Figure 13] 1 illustrates a state in which a hole mask is formed during the step of forming a via hole according to a first embodiment of the present invention. [Figure 14] 1 illustrates the formation of a via hole according to a first embodiment of the present invention. [Figure 15] 5A-5C illustrate steps of forming a probe pin according to a first embodiment of the present invention. [Figure 16] 1 illustrates a step of protruding the upper portion of a probe pin according to a first embodiment of the present invention. [Figure 17] 4 illustrates a groove forming step according to a first embodiment of the present invention. [Figure 18] This is an enlarged view of a portion (A) of FIG. [Figure 19] A high temperature plasma treatment step is shown. [Figure 20] 4 illustrates a wet etching process step. [Figure 21] 1 shows the step of connecting a flexible printed circuit board to the electrode portion. [Figure 22] 5 illustrates steps of depositing a first electrode according to a second embodiment of the present invention. [Diagram 23] 11 illustrates a step of laminating a first elastic layer and a step of laminating a second elastic layer according to a second embodiment of the present invention. [Figure 24] 11 illustrates a step of forming an inclined surface by etching the first elastic layer and the second elastic layer according to the second embodiment of the present invention. [Diagram 25] 11 illustrates a step of laminating a third elastic layer according to a second embodiment of the present invention. [Figure 26] 5 illustrates a step of forming a first via mask according to a second embodiment of the present invention. [Figure 27] 10 illustrates a step of forming a first via hole and exposing an edge of a first electrode according to a second embodiment of the present invention. [Figure 28] 5 illustrates steps of forming a via electrode according to a second embodiment of the present invention. [Figure 29] 4 illustrates the steps of depositing a second electrode according to a second embodiment of the present invention. [Diagram 30] 11 illustrates a step of laminating a fourth elastic layer according to a second embodiment of the present invention. [Diagram 31] 5 illustrates a step of forming a second via mask according to a second embodiment of the present invention. [Diagram 32] 11 illustrates a step of forming a second via hole according to a second embodiment of the present invention. [Diagram 33] 5 illustrates steps of forming a probe pin according to a second embodiment of the present invention. [Diagram 34] 11 illustrates a step of protruding an upper portion of a probe pin and an edge of the first electrode according to a second embodiment of the present invention. [Diagram 35] 5 illustrates a groove forming step according to a second embodiment of the present invention. [Diagram 36] 11 illustrates a step of connecting a flexible printed circuit board to a first electrode according to a second embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] The terms used in this specification will be briefly explained, and an embodiment of the present invention will be specifically described. The terms used in this specification are selected as widely used general terms as possible while taking into consideration the functions in the present invention, but this varies depending on the intentions of engineers engaged in the field, precedents, the emergence of new technologies, etc. In addition, in certain cases, there are terms arbitrarily selected by the applicant, and in this case, the meanings thereof will be described in detail in the description of the relevant invention. Therefore, the terms used in this specification should be defined based on the meanings of the terms and the overall content of the present invention, rather than simply the names of the terms.

[0013] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0014] Fig. 1 shows a vertical cross-sectional structure of a probe head according to a first embodiment of the present invention. In the following drawings including Fig. 1, "upper side" is defined as the direction of the surface where the probe head contacts the device under test (DUT). Also, the description will be based on the assumption that the upper side of each drawing is the upper side.

[0015] The probe head according to the first embodiment of the present invention includes an elastic body (10) formed with a predetermined thickness on the upper surface of a substrate; an electrode portion (20) embedded inside the elastic body (10); a probe pin (30) protruding from the upper side of the elastic body (10); and a second elastic layer (12) embedded inside the elastic body (10).

[0016] The substrate (Sub) is a configuration that facilitates the formation of the probe head structure and supports the manufactured probe head.

[0017] The substrate (Sub) may be made of the same material as commonly used substrates. Preferably, the substrate (Sub) of the probe head according to the present invention is made of an insulating material, and may be made of a material and thickness having sufficient hardness to withstand the load applied when the DUT (device under test) and the probe pins (30) contact each other.

[0018] In a preferred embodiment, the substrate (Sub) is made of a transparent material with a thickness of about 300 μm, which is used to align the probe pins (30) with the device under test, and can be made of any of aluminum oxide (Al2O3), glass, quartz, ceramic, and silicon (Si).

[0019] The elastic body 10 is configured to absorb and disperse the impact and load applied to the probe head when the probe pin 30 comes into contact with the device to be inspected. For this reason, the elastic body 10 is made of a synthetic resin material having a predetermined elasticity and is laminated in the form of a flat plate of a predetermined thickness on the upper surface of the substrate Sub. Preferably, the elastic body 10 is configured to have a thickness of at least 50 μm.

[0020] The elastic body 10 is formed by coating a synthetic resin material on the upper surface of the substrate Sub. According to one embodiment, the elastic body 10 is formed on the upper surface of the substrate Sub by a spin-coating method.

[0021] Preferably, the elastic body (10) is made of a PDMS (polydimethylsiloxane) material. More preferably, the elastic body (10) is made of a combination of PDMS and a Si (silicon)-based material, which has improved adhesive strength. This allows the elastic body (10) to be firmly bonded to the substrate, improving durability.

[0022] In addition, the elastic body (10) is preferably made of a material having a smaller thermal expansion coefficient than the second elastic layer (12). This is because the second elastic layer (12) mainly plays a role in absorbing shock and load, and the elastic body (10) suppresses deformation due to thermal or chemical conditions in the semiconductor process, improving quality. In particular, since the probe head is used in the semiconductor manufacturing process, it is exposed to heat generated and chemicals used in the semiconductor manufacturing process. If the second elastic body (10) deforms due to heat, it may lose elasticity and lose its shock and load absorbing function.

[0023] Furthermore, since the probe head may be manufactured through a process similar to a semiconductor manufacturing process, it is necessary to protect the second elastic layer (12) and the electrode portion (20) from the heat generated and the chemicals used during the manufacture of the probe head.

[0024] In particular, if the second elastic layer (12) is deformed by heat, the surface may become uneven, or buckling or cracks may occur, making deposition of electrodes difficult and causing problems such as malfunction or damage to the manufactured probe head.

[0025] Preferably, the elastic body (10) is a synthetic resin material containing 1-Methoxy-2-propanol acetate, Modified epoxy acrylate, Aliphatic acrylate, Urethane acrylate, Photoactive additives and Polysiloxane additives. The thermal expansion coefficient of the elastic body (10) based on this is 100 ppm / °C (Linear CTE by DMA) or less, which is lower than the thermal expansion coefficient (Linear CTE by DMA) of 340 ppm / °C of PDMS, which is the material used for the second elastic layer (12).

[0026] 1, since the second elastic layer 12 is embedded inside the elastic body 10, the second elastic layer 12 can be protected during a heat generating process such as deposition of the electrode part 20. In addition, since the electrode part 20 is embedded inside the elastic body 10, corrosion due to chemicals can be prevented.

[0027] The probe pin 30 is configured to provide an electrical connection with the testing device by contacting the device to be tested. For this purpose, the probe pin 30 is configured in the form of a metallic pin that protrudes above the elastic body 10 and is connected to the electrode portion 20. The probe pin 30 is configured of a metallic material selected from Cu, Au, Ni, Be, NiCo, NiPd, and BeNi, or a combination thereof.

[0028] The electrode portion (20) is configured to provide an electrical connection between the probe pin (30) and the inspection device. For this purpose, the electrode portion (20) is made of a metal material on the upper surface of the substrate (Sub), and a plurality of electrode portions (20) are appropriately arranged according to the size of the inspection target device and the size of the electrodes of the inspection target device. The electrode portion (20) is made of a commonly used metal such as Ti, Cr, Cu, Au, or Al, or a combination of such metals.

[0029] Also, the electrode part (20) according to the present invention is characterized in that it is embedded inside the elastic body (10). That is, the elastic body (10) is formed on the upper surface of the substrate (Sub), the electrode part (20) is embedded inside the elastic body (10), and the probe pin (30) protrudes upward from the electrode part (20) by vertically penetrating the elastic body (10). However, "embedded" here does not mean that the entire electrode part (20) is embedded, but that at least a part of it is exposed to the outside of the elastic body (10). This is for the purpose of electrical connection with a testing device.

[0030] In detail, one end of the electrode portion 20 protrudes from the side surface of the elastic body 10 and is connected to a flexible printed circuit board (F-PCB), and the other end is connected to a probe pin 30. The probe pin 30 is formed to protrude upward from the upper surface of the electrode portion 20, and the probe pin 30 comes into contact with the device under test, thereby forming an electrical connection between the electrode portion 20, the probe pin 30, the flexible printed circuit board (F-PCB), and the device under test.

[0031] The second elastic layer (12) is configured to absorb and disperse the impact and load applied to the probe head portion as described above. Preferably, the second elastic layer (12) is made of a material including at least one selected from the group consisting of elastoolefin, thermoplastic olefin, thermoplastic polyurethane, synthetic polyisoprene, chloroprene rubber, styrene-butadiene, epichlorohydrin rubber, polyacrylic rubber, silicone rubber, fluorosilicone rubber, fluoroelastomers, and polydimethylsiloxane.

[0032] Preferably, the second elastic layer (12) is configured in a shape that increases in width from the top to the bottom. Referring to FIG. 1, the second elastic layer (12) has a vertical cross section in the form of a parallelogram with the bottom side larger than the top side. This is to easily distribute the load applied from the top to the bottom. In particular, since the area of ​​the second elastic layer (12) increases toward the bottom, the applied force is distributed over a wider area, preventing the force from concentrating in only a narrow spot.

[0033] Moreover, such a shape of the second elastic layer (12) makes it easier to form the shape of the electrode portion (20) described below, which will be described later with reference to FIGS.

[0034] FIG. 2 shows a state where a load is applied to one probe pin 30 of the probe head according to the first embodiment of the present invention.

[0035] By embedding the electrode portion (20) inside the elastic body (10), when a plurality of electrode portions (20) are provided, the electrode portions (20) are insulated from each other to prevent electrical interference between them.

[0036] In addition, as shown in Figure 3, the impact and load that may occur when the device under test (DUT) comes into contact with the probe tip are absorbed and dispersed by the elasticity of the elastic part, which prevents damage to the device under test and the probe head, improves the operational stability of the probe head, and enables the testing process to be completed quickly.

[0037] Preferably, an isolation is formed in the elastic body 10. The isolation is a space between the probe pin 30 and the elastic body 10, which is formed at a predetermined distance from the outer circumferential surface of the probe pin 30.

[0038] Due to the formation of the grooves (isolation), each probe pin (30) maintains a minute gap with the elastic body (10), and friction with the elastic body (10) is reduced.

[0039] 2, it can be seen that even when the probe pin (30) retracts downward (see the right probe pin in FIG. 2) due to the load during measurement and returns to its normal position after measurement (see the left probe pin in FIG. 2), friction with the elastic layer is prevented. This reduces the risk of malfunction or damage to the probe head caused by friction with the elastic layer.

[0040] Furthermore, each probe pin 30 may have an independent elastic force without interfering with other adjacent probe pins 30. Referring to Fig. 2, since the groove (isolation) separates the probe pin 30 from the elastic body 10, even if the elastic body 10 is deformed due to the retraction of the probe pin, as in the case of the probe pin on the right, it does not affect the adjacent probe pin, as in the case of the probe pin on the left.

[0041] FIG. 3 shows a vertical cross-sectional shape of an electrode portion (20) according to a first embodiment of the present invention.

[0042] The electrode portion (20) is configured in a stepped shape in order to easily transmit impact and load to the elastic body (10) and the second elastic layer (12).

[0043] In detail, one end (201) and the other end (203) of the electrode part (20) are formed at different heights. The other end (203) of the electrode part (20) is higher than the one end (201), and an inclined part (202) is formed whose height increases from the one end (201) to the other end (203) of the electrode part (20).

[0044] The reason for forming the inclined portion 202 instead of a right-angled step is to disperse the force being transmitted and prevent damage to the electrode portion 20. If it were formed in a right-angled shape, it would be difficult to transmit force in the vertical direction, and the force would be concentrated at the bent portion, which could damage the electrode portion 20.

[0045] To prevent this, the electrode part (20) is configured in a step shape with an inclined part (202) to facilitate the transmission of force. The other end (203) and the inclined part (202) form a gentle angle rather than a right angle, so that when an impact or load is applied to the other end (203), the force is easily transmitted to the inclined part (202), and the force is transmitted to the elastic body (10) and the second elastic layer (12) through the elastic deformation of the entire electrode part (20).

[0046] FIG. 4 shows a vertical sectional structure of a probe head according to a second embodiment of the present invention.

[0047] A probe head according to a second embodiment of the present invention includes an elastic body (10') formed with a predetermined thickness on the upper surface of a substrate; a first electrode (21) located below the elastic body (10'); a second electrode (22) embedded inside the elastic body (10') and located above the first electrode (21); a via electrode (31) electrically connecting the first electrode (21) and the second electrode (22); a probe pin (30') protruding above the elastic body (10'); and a second elastic layer (12') embedded inside the elastic body (10').

[0048] The first electrodes (21) are configured to provide electrical connection with the inspection device. For this purpose, the first electrodes (21) are made of a metal material on the upper surface of the substrate (Sub), and a plurality of the first electrodes (21) are appropriately arranged according to the size of the inspection target device and the size of the electrodes of the inspection target device. Both lateral ends protrude beyond the side surfaces of the elastic body (10'). The first electrodes (21) are made of a commonly used metal such as Ti, Cr, Cu, Au, or Al, or a combination thereof.

[0049] The elastic body (10') is configured to absorb and disperse the impact and load applied to the probe head when the probe pin (30') comes into contact with the device to be inspected, as in the first embodiment. For this reason, the elastic body (10') is made of a synthetic resin material having a certain elasticity and is laminated in the form of a flat plate of a certain thickness on the upper surface of the substrate (Sub). Preferably, the elastic body (10') is configured to have a thickness of at least 50 μm.

[0050] The elastic body 10' is formed by coating the upper surface of the substrate Sub. In one embodiment, the elastic layer 10' is formed on the upper surface of the substrate Sub by a spin-coating method.

[0051] The second electrode (22) provides an electrical connection to the probe pin (30') and is configured to transmit an impact or load to the elastic body (10').

[0052] In detail, the second electrode (22) is embedded inside the elastic body (10') and is located above the first electrode (21).

[0053] The second electrode (22) is electrically connected to the first electrode (21) through a via electrode (31). In detail, the via electrode (31) is formed so as to penetrate vertically from one end of the second electrode (22) through the inside of the elastic body (10') and to be electrically connected to the upper surface of the first electrode (21).

[0054] One end of the probe pin (30') is connected to the other end of the second electrode (22), and the other end penetrates the elastic body (10') and protrudes above the elastic body (10').

[0055] That is, the via electrode 31 is connected to one end of the second electrode 22, and the probe pin 30' is connected to the other end of the second electrode 22. As a result, an impact or load applied to the probe pin 30' is not directly transmitted to the via electrode 31, but is transmitted to the elastic body 10' and the second elastic layer 12' through the elastic deformation of the second electrode 22.

[0056] Thus, in the second embodiment, unlike the electrode portion (20) in the first embodiment, the electrode portion (20) is formed with a structure of a first electrode (21), a via electrode (31), and a second electrode (22). In the first embodiment, the electrode portion (20) does not directly contact the second elastic layer (12'), whereas in the second embodiment, the via electrode (31) penetrates the second elastic layer (12') from top to bottom and directly contacts it. This allows the force applied to the via electrode (31) to be directly transmitted to the second elastic layer (12'), making it easier for the second elastic layer (12') to absorb impacts or loads.

[0057] As in the first embodiment, the second elastic layer (12') is configured so that its width increases from the top to the bottom, which allows the load applied from the top to be easily distributed to the bottom.

[0058] Also, similar to the first embodiment, the elastic body 10' has grooves (isolation) formed therein. By forming the grooves (isolation), each probe pin 30' maintains a small gap between the elastic body 10' and the probe pins 30', and friction with the elastic body 10' is reduced.

[0059] As described above, the probe head according to the first and second embodiments of the present invention can easily absorb shocks or loads generated during testing, prevent damage to the probe head or the device under test, and improve the stability and reliability of testing. In addition, it has the effect of preventing loss of elasticity due to partial or total deformation of the second elastic layer (12, 12') under thermal and chemical conditions, and preventing corrosion of the electrode part (20) or each electrode, thereby improving quality and durability.

[0060] Furthermore, deformation of the arrangement of the probe pins (30, 30') formed on the elastic body (10, 10') can be minimized, allowing each probe pin (30, 30') to have an independent elastic action, further improving reliability during measurement.

[0061] A method for manufacturing a probe head according to each embodiment of the present invention will now be described with reference to FIGS.

[0062] A method for manufacturing a probe head according to a first embodiment of the present invention will be described with reference to FIGS. 5 to 21, and a method for manufacturing a probe head according to a second embodiment of the present invention will be described with reference to FIGS.

[0063] 5 is a flow chart showing a method for manufacturing the probe head according to the first embodiment of the present invention. The probe head according to the first embodiment of the present invention is manufactured by a manufacturing method including the following steps. (S101) laminating a first elastic layer (11) on an upper surface of a substrate; (S102) laminating a second elastic layer (12) on an upper surface of the first elastic layer (11); (S103) forming an inclined surface by etching the first elastic layer (11) and the second elastic layer (12); (S104) laminating a third elastic layer (13) on the substrate, the inclined surface and the upper surface of the second elastic layer (12); (S105) forming an electrode portion (20) by depositing metal on an upper surface of the third elastic layer (13); (S106) laminating a fourth elastic layer (14) on an upper surface of the electrode portion (20); (S107) forming a hole mask on the upper surface of the fourth elastic layer (14) and etching the upper surface of the electrode portion (20) to form a via hole (H1); (S108) filling the via hole (H1) with metal to form a probe pin (30); (S109) Etching the upper side of the fourth elastic layer (14) to a predetermined thickness to make the upper portions of the probe pins (30) protrude.

[0064] 6 illustrates the step (S101) of laminating a first elastic layer (11) according to a first embodiment of the present invention. The first elastic layer (11) is configured to be combined with a third elastic layer (13) and a fourth elastic layer (14) to be described later to form an elastic body (10). In particular, a synthetic resin material is coated on the upper surface of a substrate, and then the first elastic layer (11) is laminated. Preferably, the first elastic layer (11) is formed on the upper surface of a substrate (Sub) by a spin-coating method.

[0065] Moreover, it is preferable that the first elastic layer (11) is made of a material having the highest adhesive strength among the multiple elastic layers described below. This allows the elastic body (10) formed by laminating multiple elastic layers to be firmly bonded to the substrate, improving the durability of the probe head.

[0066] 7 illustrates the step (S102) of laminating the second elastic layer (12) according to the first embodiment of the present invention. The upper surface of the first elastic layer (11) is coated with a synthetic resin material, and then the second elastic layer (12) is laminated.

[0067] 8 illustrates the step (S103) of forming a slope by etching the first elastic layer 11 and the second elastic layer 12 according to the first embodiment of the present invention. As described above, the second elastic layer 12 is configured so that its width increases from the top to the bottom. To achieve this, the first elastic layer 11 and the second elastic layer 12 are etched so that their sides are sloped.

[0068] Preferably, the interior angle (a) of the slope is formed to be 80° or less.

[0069] 9 illustrates the step (S104) of laminating the third elastic layer (13) according to the first embodiment of the present invention. The third elastic layer (13) is configured to be combined with the above-mentioned first elastic layer (11) and a fourth elastic layer (14) to be described later to form the elastic body (10).

[0070] In detail, the third elastic layer 13 is laminated by coating a synthetic resin with a predetermined thickness on the first elastic layer 11, the inclined surface, and the upper surface of the second elastic layer 12. By laminating the third elastic layer 13 with a uniform thickness, a slope corresponding to the inclined surface is also formed in the third elastic layer 13.

[0071] The third elastic layer (13) is made of the same material as the first elastic layer (11), or is made of a material different from the first elastic layer (11) but having a smaller thermal expansion coefficient than the second elastic layer (12).

[0072] By laminating the third elastic layer (13), the second elastic layer (12) is embedded between the first elastic layer (11) and the third elastic layer (13).

[0073] In the following drawings, the first elastic layer (11) and the third elastic layer (13) are combined and indicated by the reference numeral as an elastic body (10).

[0074] 10 illustrates the step of forming an electrode part 20 (S105) according to the first embodiment of the present invention. Metal is deposited on the upper surface of the third elastic layer 13 to form the electrode part 20.

[0075] More specifically, the electrode portion 20 is deposited on the upper surface of the first elastic layer 11, the inclined portion of the third elastic layer 13, and the upper surface of the third elastic layer 13. However, taking into consideration that the multiple electrode portions 20 are spaced apart, a conventionally known deposition technique such as photolithography may be used, and a detailed description of this will be omitted in this specification.

[0076] Fig. 11 shows a plan view of a probe head according to a first embodiment of the present invention. Referring to Fig. 11, the shape of the electrode portion (20) on the plane can be changed in consideration of the arrangement of each probe pin (30), and is not limited to a specific shape.

[0077] 12 illustrates the step (S106) of laminating the fourth elastic layer (14) according to the first embodiment of the present invention. The fourth elastic layer (14) is configured to be combined with the first elastic layer (11) and the third elastic layer (13) to form the elastic body (10).

[0078] In detail, the fourth elastic layer (14) is laminated by coating the upper surfaces of the electrode portion (20) and the third elastic layer (13) with a synthetic resin to a predetermined thickness. However, the fourth elastic layer (14) is laminated so that the upper surface is flat. This is achieved by repeatedly laminating a plurality of elastic layers.

[0079] The fourth elastic layer (14) is made of the same material as the first elastic layer (11) or the third elastic layer (13), or is made of a material different from the first elastic layer (11) and the third elastic layer (13) but having a smaller thermal expansion coefficient than the third elastic layer (13).

[0080] By laminating the fourth elastic layer (14), the electrode portion (20) is embedded between the third elastic layer (13) and the fourth elastic layer (14).

[0081] In the following drawings, the first elastic layer (11), the third elastic layer (13) and the fourth elastic layer (14) are combined and indicated by the reference numeral of an elastic body (10).

[0082] 13 shows a state where a hole mask is formed (S1071) during the step (S107) of forming a via hole (H1) according to the first embodiment of the present invention. In order to form a via hole (H1) described below, a hole mask is formed on the upper surface of the fourth elastic layer (14). Here, the via hole (H1) refers to a hole formed vertically penetrating from the upper surface of the elastic body (10) to the upper surface of the electrode part (20) at a position where the probe pin (30) is to be formed.

[0083] The hole mask is formed to expose a position (P) of the upper surface of the fourth elastic layer (14) where the via hole (H1) is to be formed, and to mask the other portions.

[0084] Furthermore, it is preferable that the hole mask is applied so as to expose the outer edge (B1) of the fourth elastic layer (14), since the outer portion of the fourth elastic layer (14) must also be etched in order to expose one end of the electrode portion (20) on the side of the probe head.

[0085] 14 shows the formation of a via hole (H1) (S1072) according to the first embodiment of the present invention. The via hole (H1) is formed by etching through a hole mask. Here, the via hole (H1) is etched to a depth that exposes the upper surface of the electrode portion (20). At the same time, as shown in FIG. 14, it is preferable that the edge of the fourth elastic layer (14) is also etched to a predetermined thickness.

[0086] 15 illustrates the step S108 of forming the probe pin 30 according to the first embodiment of the present invention. The probe pin 30 is formed by filling the via hole H1 with metal.

[0087] 16 shows the step (S109) of protruding the upper portion of the probe pin 30 according to the first embodiment of the present invention. The upper side of the fourth elastic layer 14 is etched to a predetermined thickness to protrude the upper portion of the probe pin 30. At the same time, the edge of the fourth elastic layer 14 is also etched to expose one end of the electrode portion 20 on the side of the probe head.

[0088] FIG. 17 shows the step of forming an isolation (S110) according to the first embodiment of the present invention, and FIG. 18 shows an enlarged view of a portion (A) of FIG.

[0089] As described above, in a preferred embodiment of the present invention, an isolation is formed by etching the fourth elastic layer 14 within a predetermined width (d1 in FIG. 18) from the outer circumferential surface of the probe pin 30 after the step of protruding the upper portion of the probe pin 30, thereby isolating a part of the outer circumferential surface of the probe pin 30 from the fourth elastic layer 14.

[0090] Preferably, the isolation is formed by high temperature plasma treatment of the elastomer 10 followed by wet etching using NMP (N-methyl-2-pyrrolidinone), a mixture of NMP and TBAF (Tetrabutylammonium fluoride), or a hydrogen fluoride based solution.

[0091] 19 shows the stage of high temperature plasma treatment. When the upper surface of the fourth elastic layer (14) is subjected to high temperature plasma treatment, the corner adjacent to the probe pin (30) is deformed and separated from the outer circumferential surface of the probe pin (30).

[0092] Figure 20 shows the wet etching step. The gaps that were created during the high temperature plasma treatment step are further widened through wet etching, thus forming isolation.

[0093] FIG. 21 shows a step (S111) of connecting a flexible printed circuit board (F-PCB) to the electrode portion (20).

[0094] Finally, a flexible printed circuit board (F-PCB) is connected to the exposed portion of the electrode portion (20) to complete the manufacture of the probe head according to the first embodiment of the present invention.

[0095] A method for manufacturing a probe head according to the second embodiment of the present invention will now be described with reference to FIGS.

[0096] The probe head according to the second embodiment of the present invention is manufactured by a manufacturing method including the following steps. (S201) depositing a first electrode (21) on an upper surface of a substrate; (S202) laminating a first elastic layer (11') on an upper surface of the first electrode (21); (S203) laminating a second elastic layer (12') on an upper surface of the first elastic layer (11'); (S204) Etching the first elastic layer 11' and the second elastic layer 12' to form a slope; (S205) laminating a third elastic layer (13') on the substrate, the slope and the upper surface of the second elastic layer (12'); (S206) forming a first via mask (M1') for masking a portion of the upper surface of the third elastic layer (13') excluding the position and edge of the first via hole (H1'); (S207) Etching the third elastic layer (13') through the first via mask (M1') to form a first via hole (H1') that vertically penetrates from the first electrode (21) to the upper surface of the third elastic layer (13') and exposes an edge of the first electrode (21); (S208) filling the first via hole (H1') with metal to form a via electrode (31); (S209) depositing a second electrode (22) on the upper surface of the via electrode (31) and the third elastic layer (13'); (S210) laminating a fourth elastic layer (14') on an upper surface of the third elastic layer (13') and the second electrode (22); (S211) forming a second via mask (M2') for masking a portion of an upper surface of the fourth elastic layer (14') excluding a position and an edge of a second via hole (H2'); (S212) Etching the fourth elastic layer (14') through the second via mask (M2') to form a second via hole (H2') vertically penetrating from the second electrode (22) to the upper surface of the fourth elastic layer (14'); (S213) filling the first via hole (H1') with metal to form a probe pin (30'); (S214) The upper side of the fourth elastic layer (14') is etched to a predetermined thickness to make the upper part of the probe pin (30') and the edge of the first electrode (21) protrude.

[0097] 22 illustrates a step (S201) of depositing a first electrode (21) according to a second embodiment of the present invention. The first electrode (21) is formed by depositing a metal to a predetermined thickness on the upper surface of a substrate.

[0098] 22 is a simplified vertical cross-sectional view, and the first electrode (21) is shown covering the entire top surface of the substrate, but this is not limited to this and may be changed to various shapes taking into account the arrangement of the probe pins (30'). Also, the shape of the first electrode (21) on the plane can be changed taking into account the arrangement of each probe pin (30') and is not limited to a specific shape.

[0099] FIG. 23 illustrates a step (S202) of laminating a first elastic layer (11') and a step (S203) of laminating a second elastic layer (12') according to the second embodiment of the present invention.

[0100] The first elastic layer (11') is configured to be combined with the third elastic layer (13') and the fourth elastic layer (14') to be described later to form the elastic body (10'). In particular, the first elastic layer (11') is laminated by coating a synthetic resin material on the upper surface of the substrate. Preferably, the first elastic layer (11') is formed on the upper surface of the substrate (Sub) by a spin-coating method.

[0101] In addition, it is preferable that the first elastic layer (11') is made of a material having the highest adhesive strength among the multiple elastic layers described below. This allows the elastic body (10') formed by laminating multiple elastic layers to be firmly bonded to the substrate, improving the durability of the probe head.

[0102] After laminating the first elastic layer (11'), a synthetic resin material is coated on the upper surface of the first elastic layer (11') and then the second elastic layer (12') is laminated thereon.

[0103] 24 illustrates the step (S204) of forming an inclined surface by etching the first elastic layer 11' and the second elastic layer 12' according to the second embodiment of the present invention. As described above, the second elastic layer 12' is configured so that its width increases from the top to the bottom. To achieve this, the first elastic layer 11' and the second elastic layer 12' are etched so that the side surfaces are inclined.

[0104] Preferably, the interior angle of the slope is 80° or less.

[0105] 25 shows the step (S205) of laminating a third elastic layer (13') according to the second embodiment of the present invention. The third elastic layer (13') is configured to be combined with the above-mentioned first elastic layer (11') and a fourth elastic layer (14') to be described later to form an elastic body (10'). In detail, the third elastic layer (13') is laminated by coating a synthetic resin on the first elastic layer (11'), the inclined surface and the upper surface of the second elastic layer (12').

[0106] The third elastic layer (13') is made of the same material as the first elastic layer (11'), or is made of a material different from the first elastic layer (11') but having a smaller thermal expansion coefficient than the second elastic layer (12').

[0107] By laminating the third elastic layer (13'), the second elastic layer (12') is embedded between the first elastic layer (11') and the third elastic layer (13').

[0108] In the following drawings, the first elastic layer (11') and the third elastic layer (13') are combined and indicated by the reference numeral as an elastic body (10').

[0109] 26 illustrates the step (S206) of forming a first via mask (M1') according to a second embodiment of the present invention. The first via mask (M1') is formed on the upper surface of the third elastic layer (13') to form a first via hole (H1') described below. Here, the first via hole (H1') refers to a hole formed vertically penetrating from the upper surface of the third elastic layer (13') to the upper surface of the first electrode (21) at a position where the via electrode (31) is to be formed.

[0110] The first via mask M1' is formed to expose the positions where the first via holes H1' are to be formed on the upper surface of the third elastic layer 13' and to mask the other portions.

[0111] Furthermore, the first via mask (M1') is preferably masked so that the outer edge of the third elastic layer (13') is exposed, because the outer portion of the third elastic layer (13') also needs to be etched in order to expose one end of the first electrode (21) on the side surface of the probe head.

[0112] 27 illustrates the step (S207) of forming a first via hole (H1') and exposing an edge of a first electrode (21) according to a second embodiment of the present invention. The first via hole (H1') is formed by etching through a first via mask (M1'). Here, the first via hole (H1') is etched to a depth that exposes the top surface of the first electrode (21). At the same time, as shown in FIG. 27, the edge of the third elastic layer (13') is also etched, and it is preferable to form a slope surrounding the second elastic layer (12').

[0113] 28 illustrates the step of forming a via electrode 31 (S208) according to a second embodiment of the present invention. The via electrode 31 is formed by filling the first via hole H1' with a metal.

[0114] 29 illustrates the step of depositing the second electrode 22 (S209) according to the second embodiment of the present invention. As described above, one end of the second electrode 22 is deposited at a position to be connected to the via electrode 31, and the other end of the second electrode 22 is deposited at a position to be connected to the probe pin 30'.

[0115] 30 illustrates the step (S210) of laminating a fourth elastic layer (14') according to the second embodiment of the present invention. The fourth elastic layer (14') is configured to be combined with the first elastic layer (11') and the third elastic layer (13') to form an elastic body (10').

[0116] In detail, the fourth elastic layer (14') is laminated by coating the upper surfaces of both side ends of the first electrode (21), the upper surface of the second electrode (22), and the upper surface of the third elastic layer (13') with a synthetic resin to a predetermined thickness. However, the fourth elastic layer (14') is laminated so that its upper surface is flat. This can be achieved by repeatedly laminating a plurality of elastic layers.

[0117] The fourth elastic layer (14') is made of the same material as the first elastic layer (11') or the third elastic layer (13'), or is made of a material different from the first elastic layer (11') and the third elastic layer (13') but having a smaller thermal expansion coefficient than the third elastic layer (13').

[0118] By laminating the fourth elastic layer (14'), the second electrode (22) is embedded between the third elastic layer (13') and the fourth elastic layer (14').

[0119] In the following drawings, the first elastic layer (11'), the third elastic layer (13') and the fourth elastic layer (14') are combined together and are indicated by the reference numeral as an elastic body (10').

[0120] 31 illustrates the step (S211) of forming a second via mask M2' according to a second embodiment of the present invention. In order to form a second via hole H2', which will be described later, a second via mask M2' is formed on the upper surface of a fourth elastic layer 14'. Here, the second via hole H2' refers to a hole formed vertically penetrating from the upper surface of the fourth elastic layer 14' to the upper surface of the second electrode 22 at a position where a probe pin 30' is to be formed.

[0121] The second via mask M2' is formed to expose the positions where the second via holes H2' are to be formed on the upper surface of the fourth elastic layer 14' and to mask the other portions.

[0122] Furthermore, the second via mask (M2') is preferably masked so as to expose the outer edge of the fourth elastic layer (14'), because the outer portion of the fourth elastic layer (14') must also be etched to expose one end of the first electrode (21) on the side surface of the probe head.

[0123] 32 illustrates the step (S212) of forming a second via hole H2' according to a second embodiment of the present invention. The second via hole H2' is formed by etching through a second via mask M2'. Here, the second via hole H2' is etched to a depth that exposes the top surface of the second electrode 22. At the same time, as shown in FIG. 32, it is preferable that the edge of the fourth elastic layer 14' is also etched to a predetermined thickness.

[0124] 33 illustrates the step of forming a probe pin 30' (S213) according to a second embodiment of the present invention. The probe pin 30' is formed by filling the second via hole H2' with metal.

[0125] 34 illustrates the step (S214) of protruding the top of the probe pin 30' and the edge of the first electrode 21 according to the second embodiment of the present invention. The top of the fourth elastic layer 14' is etched to a predetermined thickness to protrude the top of the probe pin 30'. At the same time, the edge of the fourth elastic layer 14' is also etched to expose both lateral ends of the first electrode 21 on the side of the probe head.

[0126] FIG. 35 illustrates the step of forming isolation (S215) according to the second embodiment of the present invention.

[0127] As described above, in a preferred embodiment of the present invention, an isolation is formed by isolating a part of the outer periphery of the probe pin (30') from the fourth elastic layer (14') by etching the fourth elastic layer (14') within a predetermined width from the outer periphery of the probe pin (30') after the step of protruding the upper portion of the probe pin (30').

[0128] FIG. 36 illustrates the step (S216) of connecting a flexible printed circuit board (F-PCB) to the first electrode (21) according to the second embodiment of the present invention.

[0129] Finally, the fabrication of the probe head according to the second embodiment of the present invention is completed by connecting a flexible printed circuit board (F-PCB) to the exposed portion of the first electrode (21).

[0130] The above-described preferred embodiments of the present invention have been disclosed for illustrative purposes, and various modifications, changes and additions may be made by those skilled in the art within the spirit and scope of the present invention, and these modifications, changes and additions should be considered to fall within the scope of the following claims.

[0131] The present invention is not limited to the above-described embodiments and the accompanying drawings, since various substitutions, modifications and alterations can be made by a person having ordinary knowledge in the technical field to which the present invention belongs without departing from the technical spirit of the present invention. [Explanation of symbols]

[0132] 10: Elastic body 11: First elastic layer 12: Second elastic layer 13: Third elastic layer 14: Fourth elastic layer 20: Electrode part 21: 1st electrode 22: 2nd electrode 30: Probe pin 31: Via electrode

Claims

1. An elastic body (10) formed with a predetermined thickness on the upper surface of a substrate; an electrode portion (20) embedded inside the elastic body (10) and having one end (201) protruding beyond a side surface of the elastic body (10); a probe pin (30) having one end connected to the other end (203) of the electrode portion (20) and the other end penetrating the elastic body (10) and protruding above the elastic body (10); a second elastic layer (12) embedded inside the elastic body (10) and positioned below the other end (203) of the electrode portion (20); The elastic body (10) is A probe head comprising a material having a smaller thermal expansion coefficient than the second elastic layer (12).

2. The second elastic layer (12) is 2. The probe head according to claim 1, wherein the width of the probe head increases from the top to the bottom.

3. The height of the other end (203) of the electrode portion (20) is higher than the height of the one end (201), The probe head according to claim 2, wherein a sloped portion (202) is formed between the one end (201) and the other end (203) of the electrode portion (20), the sloped portion (202) having a height increasing from the one end (201) to the other end (203).

4. The elastic body (10) is 2. The probe head as set forth in claim 1, wherein an isolation is formed at a predetermined width from an outer circumferential surface of the probe pin.

5. an elastic body (10') formed on the upper surface of the substrate with a predetermined thickness; a first electrode (21) formed on the upper surface of the substrate and positioned below the elastic body (10'), with both lateral ends protruding beyond the side surfaces of the elastic body (10'); a second electrode (22) embedded inside the elastic body (10') and positioned above the first electrode (21); a via electrode (31) that vertically penetrates the inside of the elastic body (10') from one end of the second electrode (22) and is electrically connected to an upper surface of the first electrode (21); a probe pin (30') having one end connected to the other end of the second electrode (22) and the other end penetrating the elastic body (10') and protruding above the elastic body (10'); a second elastic layer (12') embedded inside the elastic body (10') and positioned above the first electrode (21) and below the second electrode (22); The elastic body (10') is The probe head is characterized in that it is made of a material having a smaller thermal expansion coefficient than the second elastic layer (12').

6. The second elastic layer (12') is 6. The probe head according to claim 5, wherein the width of the probe head increases from the top to the bottom.

7. The via electrode (31) is A probe head according to claim 5, characterized in that it vertically penetrates the second elastic layer (12').

8. The elastic body (10') is 6. The probe head as set forth in claim 5, wherein an isolation is formed at a predetermined width from an outer circumferential surface of the probe pin.

9. laminating a first elastic layer (11) on the upper surface of the substrate; laminating a second elastic layer (12) on an upper surface of the first elastic layer (11); forming a slope by etching the first elastic layer (11) and the second elastic layer (12); laminating a third elastic layer (13) on the substrate, the inclined surface and the upper surface of the second elastic layer (12); forming an electrode portion (20) on an upper surface of the third elastic layer (13) by depositing metal; laminating a fourth elastic layer (14) on the upper surfaces of the electrode portion (20) and the third elastic layer (13); forming a hole mask on the upper surface of the fourth elastic layer (14) and etching the fourth elastic layer (14) to the upper surface of the electrode portion (20) to form a via hole (H1); filling the via hole (H1) with metal to form a probe pin (30); and etching the upper side of the fourth elastic layer (14) to a predetermined thickness to cause the upper portions of the probe pins (30) to protrude.

10. The first elastic layer (11) is 10. The method for manufacturing a probe head according to claim 9, characterized in that the second elastic layer (12) is made of a material having a lower thermal expansion coefficient than the second elastic layer (12).

11. After the step of protruding the upper portion of the probe pin (30), 10. The method of claim 9, further comprising the step of etching the fourth elastic layer (14) within a predetermined width from an outer circumferential surface of the probe pin (30) to separate a portion of the outer circumferential surface of the probe pin (30) from the fourth elastic layer (14).

12. depositing a first electrode (21) on an upper surface of the substrate; laminating a first elastic layer (11') on an upper surface of the first electrode (21); laminating a second elastic layer (12') on the upper surface of the first elastic layer (11'); forming a slope' by etching the first elastic layer (11') and the second elastic layer (12'); laminating a third elastic layer (13') on the substrate, the inclined surface and the upper surface of the second elastic layer (12'); forming a first via mask (M1') for masking a portion of the upper surface of the third elastic layer (13') except for a position and an edge of a first via hole (H1'); etching the third elastic layer (13') through the first via mask (M1') to form a first via hole (H1') vertically penetrating from the first electrode (21) to an upper surface of the third elastic layer (13') and exposing an edge of the first electrode (21); filling the first via hole (H1') with metal to form a via electrode (31); depositing a second electrode (22) on the upper surface of the via electrode (31) and the third elastic layer (13'); laminating a fourth elastic layer (14') on the upper surface of the third elastic layer (13') and the second electrode (22); forming a second via mask (M2') for masking a portion of the upper surface of the fourth elastic layer (14') except for a position and an edge of a second via hole (H2'); forming a second via hole H2' vertically penetrating from the second electrode 22 to an upper surface of the fourth elastic layer 14' by etching the fourth elastic layer 14' through the second via mask M2'; filling the first via hole (H1') with metal to form a probe pin (30'); and etching an upper side of the fourth elastic layer (14') to a predetermined thickness to cause an upper portion of the probe pin (30') and an edge of the first electrode (21) to protrude.

13. The first elastic layer (11') is 13. The method of claim 12, wherein the second elastic layer (12') is made of a material having a lower thermal expansion coefficient than the second elastic layer (12').

14. After the step of protruding the upper portion of the probe pin (30'), 13. The method of claim 12, further comprising the step of etching the fourth elastic layer (14') within a predetermined width from an outer circumferential surface of the probe pin (30') to separate a portion of the outer circumferential surface of the probe pin (30') from the fourth elastic layer (14').

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