Human-computer interface system

Abstract

One variation of the system for a touch sensor includes a substrate, a cover layer, spacer elements, a second electrode, and a controller. The substrate includes a support position disposed on the substrate and a first electrode disposed in the vicinity of the support position. The cover layer defines a touch sensor surface disposed on the substrate. The spacer elements are coupled to the substrate at the support positions and follow a downward displacement of the substrate in response to a force applied to the touch sensor surface. The second electrode is disposed opposite the first electrode to define a nominal gap and is configured to affect an electrical value of the first electrode in response to a displacement of the substrate. The controller is configured to read a set of electrical values from the first sensing electrode and interpret a magnitude of a first force of a first touch input based on the set of electrical values.

Description

Technical Field

[0001] The present invention generally relates to the field of touch sensors, and more particularly, to a novel and useful human-computer interface system in the field of touch sensors.

[0002] Cross-reference to related applications This application claims the benefit of U.S. Provisional Patent Application No. 63 / 350,327, filed on June 8, 2022, the content of which is hereby incorporated by reference in its entirety.

[0003] This application is related to U.S. Application No. 18 / 204,818, filed on June 1, 2023, U.S. Application No. 18 / 102,519, filed on January 27, 2023, and U.S. Application No. 18 / 099,698, filed on January 20, 2023.

Brief Description of the Drawings

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DETAILED DESCRIPTION OF THE INVENTION

[0005] The following description of embodiments of the present invention is not intended to limit the present invention to those embodiments, but rather to enable those skilled in the art to practice and use the present invention. The aspects, configurations, embodiments, implementations, and examples described herein are optional and are not limited to only the aspects, configurations, embodiments, implementations, and examples they describe. The invention described herein can include any and all permutations of any and all of those aspects, configurations, embodiments, implementations, and examples.

[0006] 1. System As shown in FIG. 22, a system 100 for a touch sensor includes a substrate 102 including a first electrode 146, a cover layer 170, a first spacer element 160, a second electrode 147, and a controller 190.

[0007] The substrate 102 includes a first support position disposed proximate a side edge of the substrate 102 and a first electrode 146 (e.g., a sensing electrode) disposed proximate the first support position.

[0008] The cover layer 170 defines a touch sensor surface 172 disposed on the substrate 102.

[0009] The first spacer element 160 is coupled to the substrate 102 at the first support position and is configured to couple the substrate 102 to a base plate 166 and to follow a displacement of the substrate 102 relative to the base plate 166 (i.e., “elastically deform in response to the displacement”) in response to a force applied to the touch sensor surface 172.

[0010] The second electrode 147 (e.g., a driving electrode) is disposed below the substrate 102 to face the first electrode 146, defines a nominal gap between the first electrode 146 and the second electrode 147, and is configured to affect an electrical value of the first electrode 146 in response to a displacement of the first electrode 146 toward the second electrode 147.

[0011] The controller 190 is configured to detect a first touch input at a first position on the touch sensor surface 172, read a set of electrical values from the first electrode 146, and interpret a first force magnitude of the first touch input based on the set of electrical values.

[0012] 2. Application Generally, the system 100 defines a force sensor for a human-computer interface. The system includes a base plate 166 attached to the chassis 192 of the computing device, facing the lowermost layer 140 of the substrate 102 and offset from the lowermost layer 140, extending proximate to a set of spring elements 162; a first set of electrodes (e.g., sensing electrodes) 146 disposed across the lowermost layer 140 of the substrate 102; and a second set of electrodes (e.g., driving electrodes) 147 disposed across the uppermost layer 104 of the base plate 166, facing the lowermost layer 140 of the substrate 102 and offset from this lowermost layer, configured to capacitively couple with the first set of electrodes 146 disposed on the substrate 102, thereby defining an array of capacitive force sensors that exhibit a change in capacitance value (e.g., charge time, discharge time, or RC circuit resonance frequency) as a function of the distance from the substrate 102.

[0013] The system 100 further includes a set of spring elements 162 that vertically support the substrate 102 relative to the base plate 166 (proximate to the second set of electrodes (e.g., driving electrodes) 147) and follow the force applied to the touch sensor surface 172 (e.g., displace from a nominal plane), such that the substrate 102 is movable toward the base plate 166, whereby the capacitance value between each driving electrode on the base plate 166 and the sensing electrode on the substrate 102 changes in proportion to the change in distance between the substrate 102 and the base plate 166.

[0014] Furthermore, system 100 includes a controller 190 configured to perform a scan cycle to interpret forces applied to touch sensor surface 172 and touch inputs. During those scan cycles, controller 190 applies a voltage (e.g., 6 volts) to a second set of electrodes (e.g., drive electrodes) 147 disposed on base plate 166, thereby inducing capacitive coupling of the second set of electrodes (e.g., drive electrodes) 147 to a first set of electrodes (e.g., sense electrodes) 146 on substrate 102. By inducing a relatively low drive voltage on the second set of electrodes (e.g., drive electrodes) 147, system 100 can reduce power consumption during the execution of the scan cycle and maintain a low signal-to-noise ratio of capacitance values read from the first set of electrodes (e.g., sense electrodes) 146 on substrate 102. Thereafter, controller 190 can calculate a change in distance between a sense electrode and a drive electrode pair (forming a capacitive force sensor) in the second set of electrodes 147 based on a change in capacitance value read from a pair of sense and drive electrodes relative to the stored baseline capacitance values of the sense and drive electrodes, and can calculate a force applied to a spring element adjacent to the pair of sense and drive electrodes based on the stored spring constant of the spring element.

[0015] Furthermore, controller 190 can calculate the total force applied to touch sensor surface 172 based on the force applied to each spring element and / or can estimate the force applied by an individual touch input on touch sensor surface 172 by combining the force applied to each spring element with the input position detected via the capacitive touch sensor.

[0016] 2.1 Example: Force-bending layer In one example, system 100 can include a first force-bending layer 152 formed of, for example, flexible polyethylene terephthalate (or "PET") disposed (e.g., bonded) to the bottom surface of substrate 102, and includes a first set of electrodes (e.g., sensing electrodes) 146 disposed (e.g., printed) across the first force-bending layer 152. In this example, when the first force-bending layer 152 is bonded to the bottom surface of substrate 102, each electrode in the first set of electrodes 146 faces (e.g., surrounds) a support position defined on the bottom surface of substrate 102 and is connected to a tail extending from the first force-bending layer 152, and this tail connects the first set of electrodes (e.g., sensing electrodes) 146 to controller 190 (e.g., an external controller 190 via SMT or a controller 190 on substrate 102).

[0017] Similarly, system 100 can include a second force-bending layer 154 (e.g., a flexible PET layer) disposed (e.g., bonded) to the top surface of a base plate 166 disposed opposite substrate 102, and includes a second set of electrodes (e.g., driving electrodes) 147 disposed (e.g., printed) across the second force-bending layer 154. In this example, the first force-bending layer 152 is disposed parallel and offset from the second force-bending layer 154 to align the first set of electrodes 146 with the second set of electrodes 147 in the second force-bending layer 154, and cooperate with the second force-bending layer 154 to define an array of force sensors disposed below the touch sensor surface 172. Further, the second force-bending layer 154 can be electrically connected to the second set of electrodes (e.g., driving electrodes) 147 and have a tail that couples the second set of electrodes (e.g., driving electrodes) 147 to controller 190 (e.g., an external controller 190).

[0018] Accordingly, system 100 drives a second set of electrodes (e.g., drive electrodes) 147 to induce capacitive coupling between a first set of electrodes (e.g., sense electrodes) 146 and the second set of electrodes (e.g., drive electrodes) 147, reads a first set of electrical values (e.g., capacitance values) from the first set of electrodes (e.g., sense electrodes) 146, and can convert the first set of electrical values into the magnitude of the force applied to touch sensor surface 172.

[0019] Accordingly, system 100 receives the application of a load to touch sensor surface 172, causing a vertical displacement of substrate 102 including first force flexure layer 152 towards second force flexure layer 154 that faces first force flexure layer 152, causing a first change in electrical values in an array of force sensors defined by first force flexure layer 152 and second force flexure layer 154, reads electrical values from the array of force sensors, and can interpret the magnitude of the force applied to touch sensor surface 172 based on the set of electrical values from the force sensor array.

[0020] 3. Substrate and touch sensor As shown in FIGS. 6 and 12, system 100 includes substrate 102, which includes a set of (e.g., six-layer) conductive layers etched to form a set of conductive traces, a set of (e.g., five-layer) substrate layers interposed between the stack of conductive layers, and a set of vias connecting the set of conductive traces through the set of substrate layers. For example, substrate 102 can include a six-layer rigid fiber glass PCB.

[0021] In particular, the upper conductive layer and / or the second conductive layer of the substrate 102 can include a set of traces that cooperate to form an array (e.g., a grid array) of pairs 105 of drive electrodes and sense electrodes within the touch sensor. A subsequent conductive layer of the substrate 102 below the touch sensor can include interconnected spiral traces that can cooperate to form a multi-layer inductor 150 of a single or multiple cores, or a single or multiple windings. Further, the lower conductive layer and / or the second-to-last conductive layer of the substrate 102 can include a set of interdigitated electrodes distributed near the periphery of the substrate 102, which can form a sparse array of force sensors.

[0022] 3.1 Resistive touch sensor In one embodiment, the first and second conductive layers of the substrate 102 include rows of drive electrodes and rows of sense electrodes (or vice versa) that terminate in a grid array of pairs 105 of drive electrodes and sense electrodes in the top layer 104 of the substrate 102. In this embodiment, the system 100 further includes force sensing layers 174 that are disposed on top of the upper electrode layer of the substrate 102 (e.g., intervening between the top layer 104 of the substrate 102 and the cover layer 170) and exhibit local changes in contact resistance in a set of pairs 105 of drive electrodes and sense electrodes in response to locally applying a force to the cover layer 170 (i.e., the touch sensor surface 172).

[0023] Accordingly, during the scan cycle, the controller 190 continuously drives the vertical columns of drive electrodes and continuously reads from the horizontal rows of sense electrodes an electrical value (e.g., voltage) indicative of the electrical resistance between a pair 105 of drive and sense electrodes, and based on the deviation of the electrical value from the stored baseline resistance of a subset of pairs 105 of drive and sense electrodes, detects a first input at a first position (e.g., an (x, y) position) on the touch sensor surface 172 and can interpret the magnitude of the force of the first input based on the magnitude of this deviation. As will be described later, the controller 190 can then drive an oscillating voltage to the multi-layer inductor 150 within the substrate 102 during a haptic feedback cycle in response to the magnitude of the force of the first input exceeding a threshold input force.

[0024] That is, the array of pairs 105 of drive and sense electrodes on the first and second conductive layers of the substrate 102 and the force sensing layer 174 cooperate to form a resistive touch sensor readable by the controller 190, thereby enabling detection of the lateral position, longitudinal position, and magnitude of the force (or pressure) of an input (e.g., a finger, stylus, palm) on the touch sensor surface 172.

[0025] 3.2 Capacitive touch sensor In another embodiment, the first and second conductive layers of the substrate 102 include vertical columns of drive electrodes and horizontal rows of sense electrodes (or vice versa) that terminate in a grid array of pairs 105 of drive and sense electrodes on the upper electrode layer (or both the upper electrode layer and the second conductive layer) of the substrate 102.

[0026] During the scan cycle, the controller 190 continuously drives the vertical columns of drive electrodes and continuously reads from the horizontal rows of sense electrodes an electrical value (e.g., voltage, rise time of capacitance, fall time of capacitance, resonance frequency) indicative of the capacitive coupling between a drive electrode and a sense electrode pair 105, and based on the deviation of the electrical value from the electrical value based on the stored baseline capacitance of a subset of drive electrode and sense electrode pairs 105, detects a first input at a first position (e.g., (x, y) position) on the touch sensor surface 172, from the electrical value read from a subset of drive electrode and sense electrode pairs 105 adjacent to the first position. For example, the controller 190 can perform mutual capacitance techniques to read capacitance values between those drive electrode and sense electrode pairs 105 and interpret inputs on the touch sensor surface 172 based on those capacitance values.

[0027] That is, the array of drive electrode and sense electrode pairs 105 on the first and second conductive layers of the substrate 102 and the force sensing layer 174 cooperate to form a capacitive touch sensor readable by the controller 190, thereby enabling detection of the lateral and longitudinal positions of an input (e.g., finger, stylus, palm) on the touch sensor surface 172.

[0028] 3.3 Touch screen In one aspect, the system 100 includes (or interacts with) a touch screen 196 disposed on a substrate, the touch screen including a digital display, a touch sensor disposed across the entire display, and a cover layer disposed over the display and defining the touch sensor surface 172. That is, in this aspect, the controller is configured to drive an oscillating voltage to a multi-layer inductor during a haptic feedback cycle in response to the touch screen 196 detecting an input to the touch sensor surface.

[0029] In particular, in this aspect, the substrate 102 can receive a touch screen or integrate the substrate with the touch screen (i.e., integrate the display and the touch sensor), and in cooperation with the first magnetic element 181 and the controller 190, can vibrate the touch sensor surface on the touch screen 196 in response to an input on the touch sensor surface (e.g., detected by a separate controller connected to the touch screen 196).

[0030] 4. Multilayer inductor As described above, the system 100 includes a multilayer inductor 150 formed by a set of interconnected spiral traces directly formed in a conductive layer within the substrate 102.

[0031] Generally, the total inductance of a single spiral trace may be limited by the thickness of the conductive layer. For this reason, the system 100 can include a stack of overlapping interconnected spiral traces fabricated on a set of adjacent layers of the substrate 102, forming a multilayer, multi-turn, and / or multi-core inductor that exhibits a larger inductance (and thus a greater magnetic coupling to the set of magnetic elements) than a single spiral trace on a single conductive layer of the substrate 102. Those spiral traces can be coaxially aligned around a common vertical axis (e.g., the center on the set of magnetic elements) and can be electrically interconnected by a set of vias passing through intervening substrate layers of the substrate 102.

[0032] Furthermore, the substrate 102 can include conductive layers of various thicknesses. For this reason, the spiral traces in the thick conductive layer of the substrate 102 can be manufactured with a narrower trace width and a greater number of turns, and the spiral traces in the thin conductive layer of the substrate 102 can be manufactured with a wider trace width and a smaller number of turns in order to achieve a similar electrical resistance within each spiral trace across the footprint of the same coil. For example, the lower conductive layer within the substrate 102 can include a layer of a heavier conductive material (e.g., 1 ounce copper with a thickness of about 35 microns) in order to accommodate the narrower trace width and greater number of turns within the footprint of the coil in those conductive layers, thereby increasing the inductance of each spiral trace and enabling a greater magnetic coupling between the multi-layer inductor 150 and the set of magnetic elements during the haptic feedback cycle. Conversely, in this example, the upper layer of the substrate 102 (which includes a large number (e.g., thousands) of pairs 105 of drive electrodes and sense electrodes of the touch sensor) can include a layer of a thinner conductive material.

[0033] 4.1 Single core + even number of coil layers In one aspect shown in FIG. 2, the substrate 102 includes an even number of spiral traces fabricated within the even-numbered substrate layers within the substrate 102, thereby forming a single coil inductor.

[0034] In one example, the substrate 102 includes a top layer 104 and an intermediate layer 106 that include an array of drive electrode and sense electrode pairs 105, a first inductor layer 110, a second inductor layer 120, a third inductor layer 130, and a fourth (e.g., bottom) layer. In this example, the first inductor layer 110 is wound in a first direction and includes a first spiral trace 111 that defines a first end and a second end. In particular, the first spiral trace 111 can define a first planar coil that spirals inwardly in a clockwise direction from a first end at the outer periphery of the first planar coil to a second end proximate to the center of the first planar coil. The second inductor layer 120 is wound in a second direction opposite the first direction and includes a second spiral trace 122 that defines a third end and a fourth end (electrically coupled to the second end of the first spiral trace 111). In particular, the second spiral trace 122 can define a second planar coil that spirals outwardly in a clockwise direction from a third end proximate to the center of the second planar coil to a fourth end at the outer periphery of the second planar coil.

[0035] Similarly, the third inductor layer 130 is wound in the first direction and includes a third spiral trace 133 that defines a fifth end and a sixth end (electrically coupled to the fourth end of the second spiral trace 122). In particular, the third spiral trace 133 can define a third planar coil that spirals inwardly in a clockwise direction from a fifth end at the outer periphery of the third planar coil to a sixth end proximate to the center of the third planar coil. Further, the fourth layer is wound in the second direction and includes a fourth spiral trace 144 that defines a seventh end and an eighth end (electrically coupled to the sixth end of the first spiral trace 111). In particular, the fourth spiral trace 144 can define a fourth planar coil that spirals outwardly in a clockwise direction from a seventh end proximate to the center of the fourth planar coil to an eighth end at the outer periphery of the fourth planar coil.

[0036] Therefore, the second end of the first spiral trace 111 is coupled to the third end of the second spiral trace 122 by the first via, the fourth end of the second spiral trace 122 is coupled to the fifth end of the third spiral trace 133 by the second via, the sixth end of the third spiral trace 133 is coupled to the seventh end of the fourth spiral trace 144 by the third via, and the first, second, third, and fourth spiral traces 111, 122, 133, 144 can cooperate to form a single-core four-layer inductor. The controller 190 (or driver) can be electrically connected to the first end of the first spiral trace 111 and the eighth end of the fourth spiral trace 144 (or the "terminals" of the multilayer inductor 150), and during the haptic feedback cycle, can drive those terminals of the multilayer inductor 150 with an oscillating voltage, thereby inducing an alternating magnetic field through the multilayer inductor 150, which can couple with the magnetic element to vibrate the substrate 102 within the chassis 192. In particular, when the controller 190 drives the multilayer inductor 150 with a first polarity, current flows in a continuous clockwise direction through the first, second, third, and fourth spiral traces 111, 122, 133, 144, and can induce a magnetic field in a first direction around the multilayer inductor 150. When the controller 190 reverses the polarity between the terminals of the multilayer inductor 150, the current reverses direction and flows in a continuous counterclockwise direction through the first, second, third, and fourth spiral traces 111, 122, 133, 144, and can induce a second opposite-direction magnetic field in the multilayer inductor 150.

[0037] Furthermore, in this embodiment, since the multilayer inductor 150 spans an even number of conductive layers within the substrate 102, the terminals of the multilayer inductor 150 can be disposed at the peripheries of the first and last layers of the substrate 102, thereby enabling direct connection to the controller 190 (or driver).

[0038] 4.2 Single core + odd number of coil layers In another embodiment shown in FIG. 1, the multilayer inductor 150 spans odd-numbered (e.g., three or five) conductive layers of the substrate 102. In this embodiment, the conductive layers of the substrate 102 can include two parallel and offset spiral traces that cooperate with other spiral traces within the multilayer inductor 150 to place the terminals of the multilayer inductor 150 at the periphery of the multilayer inductor 150, thereby enabling direct connection to the controller 190 or driver.

[0039] In one example, the substrate 102 includes a top layer 104 and an intermediate layer 106 that include an array of pairs 105 of drive electrodes and sense electrodes, a first inductor layer 110, a second inductor layer 120, a third inductor layer 130, and a fourth (e.g., bottom) layer. In this example, the first inductor layer 110 includes a ground electrode (e.g., a continuous trace) that spans the footprint of the array of pairs 105 of drive electrodes and sense electrodes in the top and intermediate layers 104, 106, is driven to a reference potential by the controller 190, and is configured to shield the pairs 105 of drive electrodes and sense electrodes from electrical noise generated by the multilayer inductor 150.

[0040] In this example, the third inductor layer 130 includes a first spiral trace 111 wound in a first direction and defining a first end and a second end. In particular, the first spiral trace 111 can define a first planar coil that spirals inwardly in a clockwise direction from a first end at the outer periphery of the first planar coil to a second end proximate the center of the first planar coil. The second inductor layer 120 is wound in a second direction opposite the first direction and includes a second spiral trace 122 that defines a third end and a fourth end (electrically coupled to the second end of the first spiral trace 111 in the third inductor layer 130). In particular, the second spiral trace 122 can define a second planar coil that spirals outwardly in a clockwise direction from a third end proximate the center of the second planar coil to a fourth end at the outer periphery of the second planar coil.

[0041] The third inductor layer 130 is wound in a first direction and further includes a third spiral trace 133 that defines a fifth end and a sixth end (electrically coupled to a fourth end of the second spiral trace 122 of the second inductor layer 120). In particular, the third spiral trace 133 can define a third planar coil that spirals inward in a clockwise direction from a fifth end of the outer periphery of the third planar coil toward a sixth end proximate to the center of the third planar coil, and is nested within a first planar coil that spirals inward in a clockwise direction within the third inductor layer 130.

[0042] Furthermore, the fourth layer includes a fourth spiral trace 144 that is wound in a second direction and defines a seventh end and an eighth end (electrically coupled to a sixth end of the first spiral trace 111). In particular, the fourth spiral trace 144 can define a fourth planar coil that spirals outward in a clockwise direction from a seventh end proximate to the center of the fourth planar coil to an eighth end at the outer periphery of the fourth planar coil.

[0043] Therefore, the second end of the first spiral trace 111 in the third inductor layer 130 can be coupled to the third end of the second spiral trace 122 in the second inductor layer 120 by a first via, and the fourth end of the second spiral trace 122 in the second inductor layer 120 can be coupled to the fifth end of the third spiral trace 133 in the third inductor layer 130 by a second via, and the sixth end of the third spiral trace 133 in the third inductor layer 130 can be coupled to the seventh end of the fourth spiral trace 144 in the fourth layer by a third via. The first, second, third, and fourth spiral traces 111, 122, 133, 144 can cooperate to form a three-layer inductor of a single core. The controller 190 can be electrically connected to the first end of the first spiral trace 111 in the third inductor layer 130 and the eighth end of the fourth spiral trace 144 in the fourth layer (or the "terminals" of the multi-layer inductor 150), and during the haptic feedback cycle, can drive those terminals of the multi-layer inductor 150 with an oscillating voltage, thereby inducing an alternating magnetic field through the multi-layer inductor 150, which couples with the magnetic element to vibrate the substrate 102 within the chassis 192. In particular, when the controller 190 drives the multi-layer inductor 150 with a first polarity, current can flow in a continuous clockwise direction through the first, second, third, and fourth spiral traces 111, 122, 133, 144 in the second, third, and fourth layers of the substrate 102, thereby inducing a magnetic field in a first direction around the multi-layer inductor 150. When the controller 190 reverses the polarity between the terminals of the multi-layer inductor 150, the current reverses direction and can flow in a continuous counterclockwise direction through the first, second, third, and fourth spiral traces 111, 122, 133, 144, thereby inducing a magnetic field in a second opposite direction in the multi-layer inductor 150.

[0044] Accordingly, in this embodiment, the substrate 102 can include an even number of single coil layers and an odd number of two-coil layers selectively connected to form a multilayer inductor 150 where two terminals are located at the outer edge of the multilayer inductor 150.

[0045] 4.3 Dual core + even number of coil layers In another embodiment shown in FIGS. 3 and 7, the substrate 102 includes an even number of spiral traces fabricated in even-numbered substrate layers within the substrate 102, forming a dual-core inductor (i.e., two separate single-core inductors connected in series).

[0046] In one example, the substrate 102 includes a top layer 104 and an intermediate layer 106 including an array 105 of pairs of drive electrodes and sense electrodes, a first inductor layer 110, a second inductor layer 120, a third inductor layer 130, and a fourth (e.g., bottom) layer.

[0047] In this example, a first inductor layer 110 is wound in a first direction and includes a first spiral trace 111 that defines a first end and a second end. In particular, the first spiral trace 111 can define a first planar coil that spirals inward in a clockwise direction from a first end at the outer periphery of the first planar coil to a second end proximate to the center of the first planar coil. A second inductor layer 120 is wound in a second direction opposite to the first direction and includes a second spiral trace 122 that defines a third end and a fourth end (electrically coupled to the second end of the first spiral trace 111). In particular, the second spiral trace 122 can define a second planar coil that spirals outward in a clockwise direction from a third end proximate to the center of the second planar coil to a fourth end at the outer periphery of the second planar coil. A third inductor layer 130 is wound in the first direction and includes a third spiral trace 133 that defines a fifth end and a sixth end (electrically coupled to the fourth end of the second spiral trace 122). In particular, the third spiral trace 133 can define a third planar coil that spirals inward in a clockwise direction from a fifth end at the outer periphery of the third planar coil to a sixth end proximate to the center of the third planar coil. Further, a fourth layer is wound in the second direction and includes a fourth spiral trace 144 that defines a seventh end and an eighth end (electrically coupled to the sixth end of the first spiral trace 111). In particular, the fourth spiral trace 144 can define a fourth planar coil that spirals outward in a clockwise direction from a seventh end proximate to the center of the fourth planar coil to an eighth end at the outer periphery of the fourth planar coil.

[0048] Therefore, the second end of the first spiral trace 111 can be coupled to the third end of the second spiral trace 122 by the first via, the fourth end of the second spiral trace 122 can be coupled to the fifth end of the third spiral trace 133 by the second via, the sixth end of the third spiral trace 133 can be coupled to the seventh end of the fourth spiral trace 144 by the third via, and the first, second, third, and fourth spiral traces 111, 122, 133, 144 can cooperate to form a first single-core 4-layer inductor.

[0049] Furthermore, in this example, the first inductor layer 110 is adjacent to the first spiral trace 111, wound in the second direction, and includes a fifth spiral trace that defines a ninth end and a tenth end (coupled to the first end of the first planar coil). In particular, the fifth spiral trace can define a fifth planar coil that spirals inward in the clockwise direction from the ninth end of the outer periphery of the fifth planar coil to the tenth end close to the center of the fifth planar coil. The second inductor layer 120 is adjacent to the second spiral trace 122, wound in the first direction, and includes a sixth spiral trace that defines an eleventh end and a twelfth end (electrically coupled to the tenth end of the fifth spiral trace). In particular, the sixth spiral trace can define a sixth planar coil that spirals outward in the clockwise direction from the eleventh end close to the center of the sixth planar coil to the twelfth end of the outer periphery of the sixth planar coil. The third inductor layer 130 is adjacent to the third spiral trace 133, wound in the second direction, and includes a seventh spiral trace that defines a thirteenth end and a fourteenth end (electrically coupled to the twelfth end of the sixth spiral trace). In particular, the seventh spiral trace can define a seventh planar coil that spirals inward in the clockwise direction from the thirteenth end of the outer periphery of the seventh planar coil to the fourteenth end close to the center of the seventh planar coil. Furthermore, the fourth layer is adjacent to the fourth spiral trace 144, wound in the first direction, and includes an eighth spiral trace that defines a fifteenth end and a sixteenth end (electrically coupled to the fourteenth end of the seventh spiral trace). In particular, the eighth spiral trace can define an eighth planar coil that spirals outward in the clockwise direction from the fifteenth end close to the center of the eighth planar coil to the sixteenth end of the outer periphery of the eighth planar coil.

[0050] Thus, the tenth end of the fifth spiral trace can be coupled to the eleventh end of the sixth spiral trace by the fourth via, the twelfth end of the sixth spiral trace can be coupled to the thirteenth end of the seventh spiral trace by the fifth via, the fourteenth end of the seventh spiral trace can be coupled to the fifteenth end of the eighth spiral trace by the sixth via, and the fifth, sixth, seventh, and eighth spiral traces can cooperate to form a second single-core four-layer inductor.

[0051] Furthermore, the first end of the first spiral trace 111 can be coupled to (e.g., form a continuous trace with) the ninth end of the fifth spiral trace in the first conductive layer. Thus, the first and second single-core four-layer inductors can be fabricated in series to form a four-layer dual-core inductor, and the eighth and sixteenth ends of the fourth and eighth spiral traces can form the terminals of the four-layer dual-core inductor, respectively. For this reason, when the first and second multilayer inductors are driven in the first polarity, current can flow through both of the first multilayer inductors in a continuous circular direction, whereby the first and second multilayer inductors can generate magnetic fields of the same phase and the same direction.

[0052] The controller 190 (or driver) can be electrically connected to those terminals and can drive those terminals with an oscillating voltage during the haptic feedback cycle, thereby inducing a first alternating magnetic field through a first single-core 4-layer inductor (formed by the first, second, third, and fourth spiral traces 111, 122, 133, 144) and a second alternating magnetic field (in phase with the first alternating magnetic field) through a second single-core 4-layer inductor (formed by the fifth, sixth, seventh, and eighth spiral traces). Specifically, when the controller 190 drives the 4-layer dual-core inductor with a first polarity, the current flows through the first, second, third, and fourth spiral traces 111, 122, 133, 144 in a continuous clockwise direction, inducing a magnetic field in a first direction around the first single-core 4-layer inductor, and also flows through the fifth, sixth, seventh, and eighth spiral traces in a continuous clockwise direction, inducing a magnetic field in a first direction around the second single-core 4-layer inductor. When the controller 190 reverses the polarity between the terminals of the dual-core 4-layer inductor, the current reverses direction and flows through the first, second, third, and fourth spiral traces 111, 122, 133, 144 in a continuous counterclockwise direction, inducing a magnetic field in a second opposite direction around the first single-core 4-layer inductor, and also flows through the fifth, sixth, seventh, and eighth spiral traces in a continuous counterclockwise direction, inducing a magnetic field in a second direction around the second single-core 4-layer inductor.

[0053] 4.4 Dual core + odd number of coil layers In a similar embodiment, the substrate 102 includes an odd number of spiral traces fabricated within odd-numbered substrate layers within the substrate 102 to form a dual-core inductor.

[0054] For example, in this embodiment, the dual-core inductor can include two single-coil three-layer inductors connected in series. In this example, each single-coil three-layer inductor includes an even number of single-coil layers and an odd number of two-coil layers, and they are selectively connected to form a single-coil three-layer inductor including two terminals located at the periphery of the single-coil three-layer inductor as described above.

[0055] 5. Magnetic element Generally, system 100 includes a set of magnetic elements that are rigidly coupled to chassis 192 below multi-layer inductor 150 and magnetically coupled to multi-layer inductor 150 during the haptic feedback cycle, thereby applying a vibrational force to multi-layer inductor 150 to vibrate substrate 102 (and thus touch sensor surface 172) within receptacle 194 during this haptic feedback cycle.

[0056] In particular, the spiral trace within multi-layer inductor 150 can span a coil footprint, for example, a rectangular or oval footprint including a long side parallel to the primary axis of multi-layer inductor 150 and a short side parallel to the secondary axis of multi-layer inductor 150. For example, substrate 102 can be 5 inches wide and 3 inches long, touch sensor surface 172 extends over an area of approximately 5 inches × 3 inches on substrate 102, and the coil footprint of each single-core multi-layer inductor 150 within substrate 102 can be approximately 1.5 inches long and 0.5 inches wide when the primary axis of single-core multi-layer inductor 150 extends horizontally across the width of substrate 102.

[0057] 5.1 Horizontal vibration: Single core multilayer inductor In one embodiment, as shown in FIGS. 2 and 4A, a set of magnetic elements is arranged relative to multi-layer inductor 150 to cause a vibrational force parallel to touch sensor surface 172 (between multi-layer inductor 150 and the magnetic elements) such that substrate 102 vibrates horizontally within a plane parallel to touch sensor surface 172 during the haptic feedback cycle.

[0058] In this embodiment, the system 100 can include a first magnetic element 181, which is disposed within a receptacle 194 defined by the device chassis 192, defines a first magnetic pole facing the multilayer inductor 150, and extends along a first side of the primary axis. In this embodiment, the system 100 can similarly include a second magnetic element 182, which is disposed within the receptacle 194, defines a second magnetic pole facing the multilayer inductor 150, and extends along a second side of the primary axis adjacent to the first magnetic element 181. In particular, the first magnetic element 181 can be disposed immediately adjacent to the second magnetic element. The first and second magnetic elements 181, 182 can be disposed directly under the multilayer inductor 150 and face the multilayer inductor 150 with opposite polarities, as shown in FIG. 4A. When the controller 190 drives the multilayer inductor 150 with an alternating voltage (or current), the multilayer inductor 150 can generate a magnetic field that perpendicularly penetrates the substrate 102 (e.g., a magnetic field perpendicular to the touch sensor surface 172) and can interact with the opposing magnetic fields of the first and second magnetic elements 181, 182. More specifically, when the controller 190 drives the multilayer inductor 150 with a positive voltage during a haptic feedback cycle, the multilayer inductor 150 can generate a magnetic field that perpendicularly penetrates the substrate 102 in a first perpendicular direction, which attracts the first magnetic element 181 (disposed with a first polarity facing the multilayer inductor 150) and repels the second magnetic element 182 (disposed with a second polarity facing the multilayer inductor 150), generating a first lateral force in a first lateral direction and laterally shifting the substrate 102 in the first lateral direction. Next, when the controller 190 reverses the voltage applied to the multilayer inductor 150 during this haptic feedback cycle, the multilayer inductor 150 can generate a magnetic field that perpendicularly penetrates the substrate 102 in the opposite perpendicular direction, which repels the first magnetic element 181 and attracts the second magnetic element 182, generating a second lateral force in a second opposite lateral direction and laterally shifting the substrate 102 in the second lateral direction.

[0059] Thus, by oscillating the polarity of the multilayer inductor 150, the controller 190 causes an oscillatory interaction (i.e., generates attractive and repulsive forces alternately) between the multilayer inductor 150 and the magnetic element, parallel to the touch sensor surface 172, and as a result, the substrate 102 and the touch sensor surface 172 can be oscillated horizontally (e.g., within a plane parallel to the touch sensor surface 172).

[0060] Thus, in this embodiment, the spiral trace of the single-core multilayer inductor 150 can define a first length (e.g., 1.5 inches) along the primary axis of the multilayer inductor 150 and a first width (e.g., 0.5 inches, shorter than the first length) along the secondary axis of the multilayer inductor 150. Further, the first magnetic element 181 can define a length parallel to the primary axis, offset from the primary axis, close to the first length of the spiral trace, and a second width parallel to the secondary axis of the multilayer inductor 150 and approximately half of the first width of the spiral trace. Similarly, the second magnetic element 182 can define a length parallel to the primary axis, offset from the primary axis, close to the first length of the spiral trace, and a width parallel to the secondary axis of the multilayer inductor 150 and approximately half of the first width of the spiral trace. The first and second magnetic elements 181, 182 can be arranged adjacent to both sides of the primary axis of the multilayer inductor 150.

[0061] For example, the set of magnetic elements can be arranged within the receptacle 194 of the device and include a permanent dipole magnet centered directly below the multilayer inductor 150, with the two poles of the set of magnetic elements arranged on both sides of the primary axis of the multilayer inductor 150. As described above, the set of magnetic elements can also include a set of permanent dipole magnets arranged in an antipolarity configuration (e.g., Halbach array).

[0062] Accordingly, the controller 190 (or driver) can polarize the multilayer inductor 150 by applying an alternating voltage across the first and second terminals of the multilayer inductor 150, thereby inducing an alternating current through the set of spiral traces, inducing an alternating magnetic field perpendicular to the touch sensor surface, inducing oscillatory magnetic coupling between the multilayer inductor 150 and the set of magnetic elements, and as a result, vibrating the substrate 102 in a plane parallel to the touch sensor surface 172 during the haptic feedback cycle.

[0063] 5.2 Horizontal vibration: Dual core multilayer inductor Similarly, in the above embodiment where the substrate 102 includes two adjacent single-core multilayer inductors 150 connected in series, the system 100, as shown in FIG. 6, is disposed within the receptacle 194 and defines a first magnetic polarity facing the first single-core multilayer inductor 150, a first magnetic element 181 extending along a first side of the first primary axis of the first single-core multilayer inductor 150; disposed within the receptacle 194, defining a second magnetic polarity facing the first single-core multilayer inductor 150, a second magnetic element 182 extending along a second side of the first primary axis adjacent to the first magnetic element 181; disposed within the receptacle 194, defining a second magnetic polarity facing the second single-core multilayer inductor 150, a third magnetic element extending along a first side of the second primary axis of the second single-core multilayer inductor 150; and disposed within the receptacle 194, defining a first magnetic polarity facing the second single-core multilayer inductor 150, a fourth magnetic element extending along a second side of the second primary axis adjacent to the third magnetic element.

[0064] Accordingly, by oscillating the polarities of the first and second single-core multilayer inductors 150 (which include traces spiraling in the same direction and are thus in phase), the controller 190 induces an oscillatory interaction parallel to the touch sensor surface 172 between the first single-core multilayer inductor 150, the first magnetic element 181, and the second magnetic element 182, and between the second single-core multilayer inductor 150, the third magnetic element, and the fourth magnetic element, thereby causing the substrate 102 and the touch sensor surface 172 to oscillate horizontally (e.g., within a plane parallel to the touch sensor surface 172).

[0065] 5.3 Vertical vibration In another embodiment, as shown in FIGS. 1 and 4B, a set of magnetic elements is arranged relative to the multilayer inductor 150 to cause an oscillatory force perpendicular to the touch sensor surface 172 (between the multilayer inductor 150 and the magnetic elements) so that the substrate 102 oscillates vertically within the chassis 192 during the haptic feedback cycle.

[0066] In the above embodiment where the substrate 102 includes the single-core multilayer inductor 150, the system 100 can include a first magnetic element 181, which is disposed within the receptacle 194 of the chassis 192, defines a first magnetic pole facing the single-core multilayer inductor 150, is disposed substantially centered directly below the multilayer inductor 150, and extends laterally along the primary axis of the multilayer inductor 150. Thus, the first magnetic element 181 can extend primarily in a direction perpendicular to the multilayer inductor 150 and generate a magnetic field positioned substantially at the center of the multilayer inductor 150. More specifically, the first magnetic element 181 can primarily generate a magnetic field that extends perpendicular to the touch sensor surface 172 near the center of the multilayer inductor 150. As shown in FIG. 4B, when the controller 190 drives the multilayer inductor 150 to a positive voltage during a haptic feedback cycle, the multilayer inductor 150 can generate a magnetic field that perpendicularly penetrates the substrate 102 in a first vertical direction, thereby repelling the first magnetic element 181 (having the first polarity disposed facing the multilayer inductor 150), generating a first vertical force in the first vertical direction, and lifting the substrate 102 vertically away from the first magnetic element 181. Thereafter, during this haptic feedback cycle, when the controller 190 reverses the voltage applied to the multilayer inductor 150, the multilayer inductor 150 can generate a magnetic field that perpendicularly penetrates the substrate 102 in a second opposite vertical direction, thereby attracting the first magnetic element 181, generating a second vertical force in the second opposite vertical direction, and pulling the substrate 102 downward toward the first magnetic element 181.

[0067] Accordingly, by oscillating the polarity of the multilayer inductor 150, the controller 190 can cause an oscillatory interaction (i.e., generate attractive and repulsive forces alternately) between the multilayer inductor 150 and the first magnetic element 181 (perpendicular to the touch sensor surface 172), thereby enabling the substrate 102 and the touch sensor surface 172 to oscillate in the vertical direction (e.g., perpendicular to the touch sensor surface 172).

[0068] Furthermore, as shown in FIG. 6, the system 100 can be reconfigured for vertical and horizontal vibrations of the touch sensor surface 172 without making other changes to the system 100 or with minimal changes by replacing a single magnetic element centered directly below the multilayer inductor 150 that spans the entire width of the multilayer inductor 150 with a pair of opposing magnetic elements disposed on each primary axis of the multilayer inductor 150 below the multilayer inductor 150.

[0069] 5.4 Vertical vibration: Dual core multilayer inductor Similarly, in the above embodiment where the substrate 102 includes two adjacent single-core multilayer inductors 150 connected in series in the same phase (i.e., a phase difference of zero degrees), the system 100 can include a first magnetic element 181 that is disposed within the receptacle 194, defines a first magnetic pole facing the first single-core multilayer inductor 150, is centered substantially directly below the first single-core multilayer inductor 150, and extends laterally along the primary axis of the first single-core multilayer inductor 150. The system 100 can similarly include a second magnetic element 182 that is disposed within the receptacle 194 adjacent to the first magnetic element 181, as shown in FIGS. 3 and 4B, defines a first magnetic pole facing the second single-core multilayer inductor 150, is centered substantially directly below the second single-core multilayer inductor 150, and extends laterally along the primary axis of the second single-core multilayer inductor 150.

[0070] Thus, by oscillating the polarities of the first and second single-core multilayer inductors 150 (which are in phase), the controller 190 can induce a vibratory interaction perpendicular to the touch sensor surface 172 between the first single-core multilayer inductor 150 and the first magnetic element 181 and between the second single-core multilayer inductor 150 and the second magnetic element 182, thereby vibrating the substrate 102 and the touch sensor surface 172 in the vertical direction (e.g., perpendicular to the touch sensor surface 172).

[0071] 6. Chassis integration + force sensor As described above, the substrate 102 is flexibly attached to the chassis 192 (e.g., within or on a receptacle 194 defined by the chassis 192), and during the haptic feedback cycle, the substrate 102 is capable of vibrating horizontally or vertically relative to the chassis 192. Typically, the system 100 can include a substrate 102 that includes a first set of electrodes (e.g., sensing electrodes) 146, and a baseplate 166 that includes a second set of electrodes (e.g., driving electrodes) 147 that cooperate with the first set of electrodes 146 to form an array of force sensors (e.g., capacitive force sensors). In particular, the baseplate 166 is mounted within the chassis 192 and includes a second set of electrodes 147 disposed (e.g., printed) across the upper surface of the baseplate 166. Further, the substrate 102 includes a first set of electrodes 146 disposed across the lowermost layer 140 of the substrate 102, and is coupled to the baseplate 166 via a set of spacer elements 160 that align the first set of electrodes 146 with the second set of electrodes 147 to form an array of force sensors. As will be described below, the first set of electrodes 146 disposed across the substrate 102 is interchangeable between a set of sensing electrodes and / or a set of driving electrodes. Similarly, the second set of electrodes 147 disposed across the baseplate 166 is interchangeable between a set of sensing electrodes and / or a set of driving electrodes.

[0072] 6.1 Substrate As described above, the substrate 102 can include, as shown in FIG. 1, a top layer 104 and a lowermost layer 140 that defines a set of support positions. The substrate 102 further includes a first set of electrodes (e.g., sensing electrodes) 146 disposed across the lowermost layer 140 and adjacent to (e.g., surrounding, abutting) the support positions. The first set of electrodes (e.g., sensing electrodes) 146 can be printed directly across the lowermost layer 140 of the substrate 102 and / or integrated into a rigid or flexible PCB laminated on top of the lowermost layer 140 of the substrate 102.

[0073] 6.1.1 Sensing electrode In one embodiment, the system 100 includes each support position within a set of support positions disposed near the periphery of the bottom layer 140 of the substrate 102, and a first set of electrodes (e.g., sensing electrodes) 146 disposed adjacent to the support positions and on the bottom layer 140.

[0074] For example, the set of support positions can include a first subset of support positions disposed near the corner edges of the bottom layer 140 of the substrate 102 and a second subset of support positions disposed near the side edges between the corner edges of the bottom layer 140 of the substrate 102. In this example, each sensing electrode within the first set of electrodes (e.g., sensing electrodes) 146 can be disposed adjacent to a first side of the support positions within the set of support positions, and can define a shape surrounding the support positions on the first side of the support positions (e.g., a semi-circular shape (e.g., horseshoe-shaped, crescent-shaped) surrounding the support positions and / or a serrated shape surrounding the support positions).

[0075] Additionally or alternatively, in this example, the sensing electrodes within the first set of electrodes (e.g., sensing electrodes) 146 can be disposed near the side edges of the bottom layer 140 of the substrate 102 adjacent to a set of support positions near the outer periphery of the bottom layer 140 of the substrate 102 and / or near the center of the bottom layer 140 of the substrate 102 adjacent to a set of support positions near the center of the bottom layer 140 of the substrate 102. In particular, the sensing electrodes can partially extend near the first side edge of the bottom layer 140 of the substrate 102 and / or can be disposed near the corner edges of the bottom layer 140 of the substrate 102 adjacent to a set of support positions near the outer periphery of the bottom layer 140 of the substrate 102.

[0076] Thus, the system 100 can accommodate sensing electrodes of various shapes and sizes on the bottom layer 140 of the substrate 102 and maintain uniformity across the entire substrate 102, and can reduce the sensitivity to noise during the scan cycle (by the controller 190) for reading capacitance values from the first set of electrodes (e.g., sensing electrodes) 146 on the bottom layer 140 of the substrate 102.

[0077] 6.1.2 Mutual capacitive force sensor In one embodiment shown in FIG. 1, an array of capacitive force sensors (formed by a second set of electrodes (e.g., drive electrodes) 147 of the base plate 166 and a first set of electrodes (e.g., sense electrodes) 146 of the substrate 102) is arranged in a mutual capacitance configuration adjacent to each support position.

[0078] For example, each capacitive force sensor can include a sense electrode disposed on the lowermost layer 140 of the substrate 102 adjacent to a first side of the support position, and a drive electrode (e.g., conductive trace) fabricated on the uppermost layer 104 of the base plate 166 that faces the first side of the support position and is vertically aligned with the sense electrode. In this example, a first set of electrodes (e.g., sense electrodes) 146 and a second set of electrodes (e.g., drive electrodes) 147 within the array of capacitive force sensors can be capacitively coupled to each other, and an air gap between the substrate 102 and the base plate 166 can form an air dielectric between the first set of electrodes (e.g., sense electrodes) 146 and the second set of electrodes (e.g., drive electrodes) 147.

[0079] In the example described above, in response to a force being applied on the touch sensor surface 172, the adjacent spring elements deform (i.e., displace from the nominal plane), whereby a first set of electrodes (e.g., sensing electrodes) 146 of the substrate 102 approach a second set of electrodes (e.g., driving electrodes) 147 on the base plate 166, thereby reducing the air gap between the first set of electrodes (e.g., sensing electrodes) 146 and the second set of electrodes (e.g., driving electrodes) 147. As the distance between the substrate 102 and the base plate 166 decreases, the effective dielectric constant between the first set of electrodes (e.g., sensing electrodes) 146 and the second set of electrodes (e.g., driving electrodes) 147 increases, and as a result, the capacitance between the first set of electrodes (e.g., sensing electrodes) 146 and the second set of electrodes (e.g., driving electrodes) 147 increases. Thus, the capacitance value of the capacitive force sensor can deviate from the baseline capacitance value (e.g., in a form where the charging time of the capacitive force sensor increases and the discharging time of the capacitive force sensor increases, or in a form where the resonant frequency of the capacitive force sensor decreases) when the touch sensor surface 172 is pushed down on the capacitive force sensor.

[0080] In another example, the system 100 includes a first set of electrodes 146 that define a set of sensing electrodes disposed across the periphery of the lowermost layer 140 of the substrate 102, and a second set of electrodes 147 that define a set of driving electrodes disposed in alignment with a set of sensing electrodes near the upper surface of the base plate 166. Thereby, the set of sensing electrodes cooperate with the set of driving electrodes to form an array of capacitive force sensors disposed below the touch sensor surface 172. Thus, the system 100 can drive the set of driving electrodes to induce capacitive coupling between the set of sensing electrodes and the set of driving electrodes, read the capacitance value from the set of sensing electrodes in the substrate 102, and interpret the magnitude of the force applied on the touch sensor surface 172 based on the capacitance value indicative of the vertical displacement of the set of sensing electrodes towards the set of driving electrodes.

[0081] For this reason, in this embodiment, during the scan cycle, the controller 190 can drive each drive electrode in the set of drive electrodes continuously, for example, over a target time interval, by a target voltage, or by an alternating voltage of a specific frequency, etc., and read a set of capacitance values (from each sensing electrode in the set of sensing electrodes) indicating the measured value of the mutual capacitance between the set of sensing electrodes of the capacitive force sensor array and the set of drive electrodes, and based on this set of capacitance values, interpret the distribution of the forces applied on the touch sensor surface 172.

[0082] 6.1.3 Self-capacitive force sensor In one embodiment, an array of capacitive force sensors (formed by a second set of electrodes (e.g., drive electrodes) 147 of the base plate 166 and a first set of electrodes (e.g., sensing electrodes) 146 of the substrate 102) is arranged in a self-capacitance configuration adjacent to each support position.

[0083] For example, each capacitive force sensor can include a single electrode disposed on the lowermost layer 140 of the substrate 102, such as surrounding the support position, and the base plate 166 can be grounded to function as a common second electrode for each capacitive sensor. In this example, the single electrode in the capacitive sensor and the base plate 166 can be capacitively coupled, and the air gap between the substrate 102 and the base plate 166 can form an air dielectric between the capacitive force sensor and the base plate 166.

[0084] Thus, in this embodiment, during a scan cycle, the controller 190 drives the base plate 166 to a reference (e.g., ground) potential, and drives each capacitive sensor (continuously) by, for example, a target voltage or an AC voltage of a specific frequency over a target time interval, and reads a set of capacitance values indicating measured values of the self-capacitance between the capacitive force sensor and the base plate 166 (from each sensing electrode within the first set of electrodes 146 (e.g., sensing electrodes)), and based on this set of capacitance values and the known spring constants in the set of spring elements 162, can interpret the distribution of the forces applied to the touch sensor surface 172.

[0085] In another embodiment, the system 100 can implement a combination of mutual capacitive force sensors and self-capacitive force sensors to interpret the forces applied to the touch sensor surface 172. In this embodiment, the controller 190 can sequentially execute scan cycles to read mutual capacitance values and self-capacitance values from the electrodes on the substrate 102 and the base plate 166.

[0086] 6.1.4 Capacitive coupling In one embodiment, system 100 includes a first set of electrodes (e.g., sensing electrodes) 146, and this first set of electrodes 146 is vertically aligned with a second set of electrodes (e.g., driving electrodes) 147 that are offset from the first set of electrodes, forming a set of force sensors. Specifically, the sensing electrodes within the first set of electrodes (e.g., sensing electrodes) 146 are vertically aligned with the driving electrodes within the second set of electrodes (e.g., driving electrodes) 147, forming a capacitive force sensor. In this embodiment, due to the manufacturing procedure and / or the load applied to the touch sensor surface 172, the alignment between the sensing electrodes and the driving electrodes may be disrupted (or "skewed"), resulting in possible defects in the capacitive coupling between the sensing electrodes and the driving electrodes of the force sensor. Therefore, regardless of the manufacturing process and / or the load applied to the touch sensor surface 172, system 100 can include sensing electrodes spanning a first region and driving electrodes spanning a second region restricted within the first region below the sensing electrodes to ensure the vertical alignment between the sensing electrodes and the driving electrodes of the force sensor. System 100 can include this configuration across the first set of electrodes 146 and the second set of electrodes 147, thereby ensuring the capacitive coupling between the first set of electrodes (e.g., sensing electrodes) 146 and the second set of electrodes (e.g., driving electrodes) 147.

[0087] For example, system 100 can include, in the first set of electrodes (e.g., sensing electrodes) 146, sensing electrodes that span a first region in the bottommost layer 140 of the substrate 102 and surround a support position in the bottommost layer 140 of the substrate 102. Further, system 100 can include, in the second set of electrodes (e.g., driving electrodes) 147, driving electrodes that span a second region (smaller than the first region) on the upper surface of the baseplate 166 and are aligned within the first region of the sensing electrodes, thereby forming a capacitive force sensor.

[0088] Accordingly, system 100 receives the application of a load onto touch sensor surface 172 that results in an oblique displacement between a first set of electrodes (e.g., sense electrodes) 146 and a second set of electrodes (e.g., drive electrodes) 147, reads a set of electrical values from the first set of electrodes (e.g., sense electrodes) 146, and interprets the magnitude of the force applied onto touch sensor surface 172 based on the deviation of the set of electrical values from the baseline electrical values in the set of force sensors.

[0089] 6.1.5 Capacitive touch sensor As described above, system 100 can further include a capacitive touch sensor disposed across top layer 104 of substrate 102. In one embodiment, the capacitive touch sensor includes an array of drive and sense electrodes disposed on top layer 104 of substrate 102 and a cover layer 170 (e.g., a glass film) disposed over substrate 102 that surrounds the array of drive and sense electrodes and forms touch sensor surface 172 (e.g., a “haptic surface”) over substrate 102. In this embodiment, system 100 can include a first amount of capacitive force sensors that form a first amount of pressure sensors between substrate 102 and base plate 166 and a second amount of drive and sense electrodes that form a second amount of pixels (at least two orders of magnitude greater than the first amount) in the capacitive touch sensor.

[0090] Accordingly, system 100 can output the position of a touch input (e.g., (x, y) coordinates) applied on touch sensor surface 172 and the magnitude of the force of the touch input applied at the position on touch sensor surface 172. For example, system 100 can read a first set of electrical values from an array of pairs 105 of drive electrodes and sense electrodes disposed across top layer 104 of substrate 102, and interpret the lateral and longitudinal positions of a first touch input on touch sensor surface 172 based on the first set of electrical values. Thereafter, system 100 reads a second set of electrical values from a first set of electrodes (e.g., sense electrodes) 146 disposed across bottom layer 140 of substrate 102, interprets the magnitude of a first force of the first touch input on touch sensor surface 172 based on the second set of electrical values, and can output the lateral position, longitudinal position, and magnitude of the first force of the first touch input.

[0091] 6.2 Spring element Typically, system 100 includes a set of spring elements 162 that are coupled (e.g., glued, riveted, soldered) to substrate 102 at a set of support positions and are configured to support substrate 102 on base plate 166 that is coupled to chassis 192 of the computing device, and to follow downward displacement of substrate 102 toward base plate 166 in response to a force applied to touch sensor surface 172.

[0092] 6.2.1 Integrated spring element and base plate structure In one embodiment, system 100 includes base plate 166, which includes an integral structure spanning bottom layer 140 of substrate 102 and defines a set of spring elements 162 that align with a set of support positions on substrate 102.

[0093] In one example, the base plate 166 includes a thin-walled structure (e.g., a 20-gauge, or 0.8-millimeter-thick stainless steel sheet) machined, punched, perforated, etched, or laser cut to form bent portions aligned at each support location. Thus, in this example, each spring element can define a bent portion (e.g., a multi-arm spiral flexure) configured to laterally and longitudinally position the system 100 on the chassis 192 and can flex inwardly and outwardly from a nominal plane defined by the thin-walled plate.

[0094] More specifically, in this example, the base plate 166 can include a unitary metallic sheet structure disposed between the substrate 102 and the chassis 192 and defining a nominal plane. Each spring element can be formed (e.g., created) within the unitary metallic structure, can define a stage coupled to a spacer facing the lowermost layer 140 of the substrate 102, and can include a bent portion created within the unitary metallic sheet structure and be configured to return to substantially the nominal plane in response to the absence of a touch input applied to the touch sensor surface 172.

[0095] 6.2.2 Position of spring element In one embodiment, the substrate 102 defines a rectangular geometric shape having support locations near the perimeter of the rectangular geometry and near the center of the rectangular geometry. Thus, a set of spring elements 162 can cooperate to support the perimeter and center of the substrate 102 relative to the base plate 166 of the computing device. In this embodiment, the substrate 102 and the cover layer 170 (disposed on the capacitive touch sensor) can cooperate to form a semi-rigid structure that resists flexure between the set of support locations.

[0096] For example, when the periphery of the substrate 102 is supported by a set of spring elements 162, when a force of about 1.6 Newtons (i.e., 165 grams, corresponding to the force threshold for a "click" input) is applied to the center of the touch sensor surface 172, the substrate 102 and the cover layer 170 can exhibit a deflection of less than 0.3 millimeters from the nominal plane. Thus, the substrate 102 and the cover layer 170 can cooperate to transmit this applied force to the periphery of the substrate 102 and thus to the set of underlying spring elements 162. As described above, the set of spring elements 162 can support the periphery and the center of the substrate 102, and the substrate 102 and the cover layer 170 can form a substantially rigid structure, thereby achieving a ratio of applied force to vertical displacement of the substrate 102 that is approximately constant or linearly varying across the entire area of the touch sensor surface 172.

[0097] In another example, the system 100 includes a base plate 166 that includes a set of spring elements 162, and the set of spring elements is formed near the periphery of the base plate 166 and faces the lowermost layer 140 of the substrate 102. In particular, each spring element within the set of spring elements 162 is disposed adjacent to the lateral edge of the base plate 166 and defines a first stage that faces a support position within a set of support positions in the lowermost layer 140 of the substrate 102, and is configured to follow the downward displacement of the substrate 102 toward the base plate 166 in response to a force applied to the touch sensor surface 172. In this example, the system 100 includes each spacer element that couples (e.g., via the spacer element) adjacent support positions within a set of support positions on the lowermost layer 140 of the substrate 102 and is disposed adjacent to a drive electrode within a second set of drive electrodes (e.g., drive electrodes) 147 that face the substrate 102.

[0098] Accordingly, system 100 receives the application of a touch input onto touch sensor surface 172, deforms (i.e., displaces from a nominal plane) a set of spring elements 162 disposed below substrate 102, displaces substrate 102 toward base plate 166, and based on that displacement, can affect the capacitance value between a first set of electrodes (e.g., sense electrodes) 146 and a second set of electrodes (e.g., drive electrodes) 147. Accordingly, system 100 can read an electrical value from the first set of electrodes (e.g., sense electrodes) 146 during displacement of substrate 102 and base plate 166, and can interpret the magnitude of the force applied onto touch sensor surface 172 based on the electrical value.

[0099] 6.2.3 Spring force Furthermore, in the above-described embodiments, system 100 can include a first subset of spring elements 162 (characterized by a first spring constant) coupled to a first subset of support positions proximate to the corners of substrate 102 and a second subset of spring elements 162 (characterized by a second spring constant smaller than the first spring constant) coupled to a second subset of support positions proximate to the edges of substrate 102.

[0100] 6.2.4 Individual spring elements In another embodiment, system 100 includes a set of individual spring elements (e.g., adhesively or press-fit) disposed within respective spring receptacles 194 of base plate 166, and they are coupled (e.g., adhesively) to the lowermost layer 140 of substrate 102 across a set of support positions.

[0101] 6.2.5 Pre-loaded spring element As described above, the substrate 102 can also be biased against the set of spring elements 162 of the base plate 166, thereby applying a preload to the spring elements and achieving a target nominal air gap between the set of sensing electrodes of the substrate 102 and the second set of electrodes (e.g., drive electrodes) 147 of the base plate 166, and achieving a baseline capacitance value that falls within the sensing range of each capacitive sensor.

[0102] Accordingly, the system 100 can enable the controller 190 to detect each sensing electrode that moves in both the direction towards and away from each drive electrode on the base plate 166 based on a change in capacitance in response to, for example, a force applied to the touch sensor surface 172 on the capacitive sensor and a force applied to the touch sensor surface 172 at a position away from the capacitive sensor.

[0103] 6.3 Base plate Typically, the base plate 166 is coupled to the substrate 102 adjacent to the set of spring elements 162 and is configured to affect the capacitance values of an array of capacitive force sensors that respond to the displacement of the substrate 102 towards the base plate 166.

[0104] 6.3.1 Driving electrode structure In one embodiment, the system 100 includes a base plate 166 that includes an integral structure spanning the lowermost layer 140 of the substrate 102 and a second set of electrodes (e.g., drive electrodes) 147 disposed on the uppermost layer 104 of the base plate 166 that are vertically aligned with the first set of electrodes (e.g., sensing electrodes) 146 on the lowermost layer 140 of the substrate 102.

[0105] In one example, a second set of electrodes (e.g., drive electrodes) 147 includes conductive traces provided across the top layer 104 of the substrate 102 that are aligned with a first set of electrodes (e.g., sense electrodes) 146 on the bottom layer 140 of the substrate 102, the conductive traces being formed from conductive ink (e.g., Ag, C, Cu, etc.), conductive polymer (e.g., PEDOT:PSS), patternable conductive material (e.g., graphene, ITO, metal mesh), and / or rolled annealed metal, etc. In this example, the second set of electrodes (e.g., drive electrodes) 147 can be printed directly onto the top layer 104 of the base plate 166 and / or integrated into a rigid or flexible PCB laminated on top of the top layer 104 of the base plate 166. Thus, in this example, each drive electrode can define a segment of a conductive trace (such as a continuous trace provided across the base plate 166) configured to be aligned with the first set of electrodes (e.g., sense electrodes) 146 in the bottom layer 140 of the substrate 102, thereby defining an array of capacitive sensors.

[0106] Accordingly, the system 100 can drive a second set of electrodes (e.g., drive electrodes) 147 on the top layer 104 of the base plate 166 (e.g., with a target voltage (e.g., 6 volts) and / or an alternating voltage of a specific frequency over a target time interval), and can read a set of capacitance values indicative of mutual capacitance measurements in the array of capacitive force electrodes from the sense electrodes in the bottom layer 140 of the substrate 102 that are aligned with the second set of electrodes (e.g., drive electrodes) 147. As a result, the system 100 can improve the signal-to-noise ratio from the capacitance values read from the capacitive force sensors (e.g., by applying a drive voltage less than 6 volts), thereby being able to interpret the exact magnitude of the force input applied to the touch sensor surface 172.

[0107] In another embodiment, a second set of electrodes (e.g., drive electrodes) 147 is disposed across a first region of the top layer 104 of the base plate 166 and aligns with a first subset of sense electrodes disposed across the bottom layer 140 of the substrate 102, and a first subset of drive electrodes, and a second subset of drive electrodes disposed across a second region of the top layer 104 of the base plate 166 and aligns with a second subset of sense electrodes disposed across the bottom layer 140 of the substrate 102.

[0108] In one variation of this embodiment, a single drive line in the top layer 104 of the base plate 166 can connect the first subset of drive electrodes and the second subset of drive electrodes. Further, each sense electrode of the first subset of sense electrodes and the second subset of electrodes is individually connected to a sense line in the lower layer 140 of the substrate 102.

[0109] In another variation of this embodiment shown in FIGS. 4A and 4B, the first subset of drive electrodes and the second subset of drive electrodes are connected to a pair of drive lines in the top layer 104 of the substrate 102. Further, the first subset of sense electrodes can be connected by a first sense line, and the second subset of sense electrodes can be connected by a second sense line in the bottom layer 140 of the substrate 102. Thus, the system 100 can selectively drive pairs of electrodes spanning specific regions of the touch sensor surface 172 and selectively read capacitance values from the sense electrodes spanning those specific regions of the touch sensor surface 172 to interpret inputs and force magnitudes in those specific regions.

[0110] For example, a first subset of drive electrodes includes a first conductive trace that spans a first region on the top layer 104 of the base plate 166, and this first conductive trace defines a first segment that aligns with a first subset of sense electrodes in the lower layer 140 of the substrate 102. Further, in this example, a second subset of drive electrodes includes a second conductive trace that spans a second region on the top layer 104 of the base plate 166, and this second conductive trace defines a second segment that aligns with a second subset of sense electrodes disposed across the lower layer 140 of the substrate 102.

[0111] Accordingly, in response to detecting a touch input in a first region on the touch sensor surface 172, system 100 can drive a first subset of drive electrodes provided across the top layer 104 of the base plate 166 (e.g., with a target voltage (e.g., 6 volts) and / or an alternating voltage of a specific frequency over a target time interval), and can read a set of capacitance values indicative of the measured mutual capacitance of the capacitive force electrode array in the first region from a first subset of sense electrodes disposed across the bottom layer 140 of the substrate 102 and aligned with the first subset of drive electrodes. As a result, system 100 can selectively interpret the magnitude of the force input applied to multiple regions of the touch sensor surface 172 to increase the accuracy of the capacitance values read from the sense electrodes while saving power during the scan cycle of system 100.

[0112] 6.3.2 Integrated base plate and spring element In one embodiment, the base plate 166 defines a single integral (e.g., metal) structure that defines a second set of electrodes (e.g., drive electrodes) 147 and a set of spring elements 162 disposed across the top layer 104 of the base plate 166, and is disposed below the substrate 102. In this embodiment, the integral metal structure can define a nominal plane between the receptacle 194 of the chassis 192 and the substrate 102, and a set of support positions on the bottom layer 140 of the substrate 102 and a set of capacitive coupling regions adjacent to (e.g., aligned with, coaxial with) the first set of electrodes 146 (e.g., sense electrodes).

[0113] In this embodiment, each spring element can be formed within the integral metal structure (e.g., by etching or laser cutting), each spring element can extend from an adjacent capacitive coupling region, define a stage coupled (e.g., via spacer elements) to a corresponding support position on the bottom layer 140 of the substrate 102, and be configured to return to a substantially nominal plane in response to the absence of a touch input applied to the touch sensor surface 172.

[0114] Further, in this embodiment, the second set of electrodes (e.g., drive electrodes) 147 can be formed within the integral metal structure (e.g., by conductive traces printed on the base plate 166), disposed proximate to their adjacent capacitive coupling regions, and configured to capacitively couple with the sense electrodes of the bottom layer 140 of the substrate 102 to define a set of capacitive force sensors.

[0115] In the above embodiment, since the integral structure can be rigidly attached to the chassis 192 of the computing device, the capacitive coupling regions can be rigidly positioned relative to the substrate 102 within the nominal plane, and the stage of the spring elements can be moved in a direction perpendicular to the capacitive coupling regions defined by the nominal plane and the integral metal structure.

[0116] Accordingly, each sensing electrode on the bottommost layer 140 of the substrate 102 can capacitively couple with an adjacent drive electrode on an adjacent capacitive coupling region of the integrated metal structure. When a force is applied on the touch sensor surface 172 proximate to the capacitive force sensor, it moves towards this adjacent capacitive coupling region, thereby causing a change in the capacitance value of the capacitive force sensor in proportion to the compression of the adjacent spring element, and thus in proportion to the portion of the force applied to the spring element.

[0117] Furthermore, in this embodiment, the integrated metal structure can be directly fixed to the chassis 192 of the computing device. Alternatively, the integrated metal structure can be attached (e.g., fixed, riveted, welded, crimped) to another chassis 192 interface and then fixed or otherwise attached to the chassis 192.

[0118] 6.3.3 Spacer element As described in U.S. Patent Application No. 17 / 191,631 (which is hereby incorporated by reference in its entirety), the topmost layer 104 of the substrate 102 includes an array of pairs 105 of drive and sensing electrodes arranged in a first density in a grid array, and the bottommost layer 140 of the substrate 102 includes a first set of electrodes 146 (e.g., a sparse outer peripheral array of sensing electrodes as described above) arranged at a second density lower than the first density and proximate to the periphery of the substrate 102. In this embodiment, the system 100 further includes a set of spacer elements 160 (e.g., short elastic posts or buttons, adhesive films) coupled to the bottommost layer 140 of the substrate 102 at each support position within a set of support positions of the substrate 102 for supporting the substrate 102 on the device chassis 192. In particular, each spacer element 160 is arranged (e.g., coupled) at a support position on the bottommost layer 140 of the substrate 102 proximate to the first set of electrodes (e.g., sensing electrodes) 146 and is configured to compress in response to a load applied on the touch sensor surface 172 that compresses the spacer element 160 with respect to the substrate 102, thereby affecting the electrical value between a first electrode on the substrate 102 and a second electrode disposed below the substrate 102.

[0119] Accordingly, in this embodiment, the controller 190 can read a first set of electrical values (indicating capacitive coupling between the drive and sense electrode pairs 105) from the set of drive and sense electrode pairs 105, and based on the deviation of the electrical values (read from a subset of the drive and sense electrode pairs 105 adjacent to the first position) from the baseline capacitance values stored for the subset of the drive and sense electrode pairs 105, detect a first input at a first position on the touch sensor surface 172. Also, during this same scan cycle, the controller 190 can read a second set of electrical values (e.g., capacitive coupling) (indicating compression of the set of spacer elements 160) from the first set of electrodes 146, and interpret the magnitude of the force of the first input based on the magnitude of the deviation of the electrical values (e.g., capacitance values) from the baseline electrical values across the set of electrodes, and in response to the magnitude of the force of the first input exceeding a threshold input force, apply an oscillating voltage to the multilayer inductor 150 during a haptic feedback cycle.

[0120] Typically, in this configuration, the set of spacer elements 160 is interposed between the lowermost layer 140 of the substrate 102 and the bottom surface of the receptacle 194 to support the substrate 102 vertically within the receptacle 194.

[0121] In one embodiment, each spacer element 160 is coupled to the bottom surface of the substrate 102 and the bottom surface of the receptacle 194 and includes a coupon formed of a low durometer or elastic material that flexes (or "shears") laterally in response to an alternating magnetic coupling between the multilayer inductor 150 and a set of magnetic elements during a haptic feedback cycle, enabling the substrate 102 to translate laterally within the receptacle 194. In another embodiment, each spacer element 160 includes a coupon coupled to the bottom surface of the substrate 102 and a bottom surface coated with or including a low friction material that is configured to support the substrate 102 vertically on the receptacle 194 while sliding the bottom surface of the receptacle 194 to enable the substrate 102 to translate laterally within the receptacle 194 during a haptic feedback cycle. In yet another embodiment, as described further below, each spacer element 160 is attached to a spring or flexure element (attached to the chassis 192), thereby enabling the spacer element 160 to move laterally within the receptacle 194 while supporting the substrate 102 vertically within the receptacle 194.

[0122] In this configuration, the lower conductive layer of the substrate 102 includes a pair of drive and sense electrodes proximate to the location of each spacer element near the outer periphery of the substrate 102, enabling the formation of a force sensor. Thereby, the controller 190 can read the electrical value (or voltage indicative of electrical resistance) of the force sensor proximate to the location of the spacer element and convert this electrical value to the magnitude of the force transmitted from the touch sensor surface 172. In particular, the system 100 can include a plurality of spacer elements 160, and the controller 190 can read electrical values from electrodes in the vicinity of the location of each spacer element, convert those electrical values to the magnitude of the force applied to each spacer element 160, and aggregate those magnitudes of force to the total magnitude of the input force onto the touch sensor surface 172.

[0123] Accordingly, in this configuration, the substrate 102 can define an integrated structure that includes a dense array of pairs 105 of drive and sense electrodes forming a touch sensor, a column of spiral traces forming a multilayer inductor 150, and a sparse array of pairs 105 of drive and sense electrodes forming a set of force sensors that support the substrate 102 on the chassis 192.

[0124] 6.4 Force-bending layer In one embodiment, the system 100 includes a first set of electrodes (e.g., sense electrodes) 146 disposed (e.g., printed) across a first force flexure layer 152 (e.g., a flexible PET layer), and a second set of electrodes (e.g., drive electrodes) 147 disposed (e.g., printed) across a second force flexure layer 154 (e.g., a flexible PET layer) that is parallel and offset from the first force flexure layer 152, defining a set of force sensors. In particular, the system 100 includes a first force flexure layer 152 disposed (e.g., bonded) to the bottom surface of the substrate 102, and a second force flexure layer 154 disposed (e.g., bonded) to the top surface of a base plate 166 that faces the bottom surface of the substrate 102. Accordingly, when the substrate 102 and the base plate 166 are disposed in parallel within the chassis 192 and / or the receptacle 194, the first set of electrodes (e.g., sense electrodes) 146 in the substrate 102 aligns with the second set of electrodes (e.g., drive electrodes) 147 in the base plate 166 to form a set of force sensors below the touch sensor surface 172.

[0125] In one example, a first force-bending layer 152 defines a rectangular geometry that cooperates with the bottom layer 140 of the substrate 102 and includes a first set of electrodes (e.g., sensing electrodes) 146 disposed near the outer periphery of the first force-bending layer 152. Thus, when the first force-bending layer 152 is disposed (e.g., bonded) across the bottom surface of the substrate 102, the first set of electrodes (e.g., sensing electrodes) is disposed (e.g., surrounds) near a set of support positions in the substrate 102. Similarly, a second force-bending layer 154 defines a rectangular geometry that cooperates with the upper surface of the base plate 166 and includes a second set of electrodes (e.g., driving electrodes) 147 disposed near the outer periphery of the second force-bending layer 154. Thus, when the second force-bending layer 154 is disposed (e.g., coupled) across the base plate 166, the second set of electrodes (e.g., driving electrodes) 147 is disposed (e.g., surrounds) near a set of spring elements 162 in the substrate 102 that align with the support positions on the substrate 102.

[0126] Accordingly, the system 100 can include a base plate 166 disposed within the chassis 192 and / or the receptacle 194, and a substrate 102 coupled to the base plate 166 (e.g., via spacer elements) and having a first force-bending layer 152 thereon disposed in a position parallel and offset from a second force-bending layer 154 on the base plate 166, forming a set of force sensors.

[0127] In the above embodiment, a first set of electrodes (e.g., sensing electrodes) 146 are disposed (e.g., etched) across a first force-bending layer 152 to define a set of first conductive traces extending across a first tail connected to the first force-bending layer 152. In this embodiment, the first tail can be electrically connected (e.g., via SMT) to a controller 190 mounted on the substrate 102. Similarly, a second set of electrodes (e.g., driving electrodes) 147 are disposed (e.g., etched) across a second force-bending layer 154 to define a second set of conductive traces extending across a second tail connected to the second force-bending layer 154. The system 100 can include the second tail, which is connected to a separate external controller 190 (e.g., a driver) from the first force-bending layer 152 and / or extends towards the substrate 102 to couple to the controller 190 disposed on the substrate 102. And the system 100 can drive the second set of electrodes (e.g., driving electrodes) 147 to capacitively couple the first set of electrodes (e.g., sensing electrodes) 146, thereby forming a first set of force sensors below the touch sensor surface 172.

[0128] 7. Geometry and shielding of ground plane The substrate 102 can be fabricated with a conductive layer and include a shield trace configured to shield the touch sensor from electrical noise generated by the multilayer inductor 150, e.g., during and after a haptic feedback cycle.

[0129] In one embodiment, the substrate 102 further includes an intermediate layer 106 interposed between the topmost layer 104 including the pairs 105 of drive and sense electrodes and a first inductor layer 110 of the substrate 102 including the topmost spiral trace of the multilayer inductor 150. In this embodiment, the intermediate layer 106 can include a continuous trace region defining an electrical shield 107 configured to shield the set of drive and sense electrodes 105 of the touch sensor from electrical noise generated by the multilayer inductor 150 when driven by a vibration voltage by the controller 190 during a haptic feedback cycle. In particular, the controller 190 can drive the electrical shield 107 of the intermediate layer 106 to a reference voltage potential (e.g., ground, intermediate voltage), continuously during operation, for example, or intermittently during and / or immediately after a haptic feedback cycle. Thus, when driven to the reference potential, the electrical shield 107 can shield the drive and sense electrodes 105 of the touch sensor of the topmost layer 104 from electrical noise.

[0130] Furthermore, as shown in FIG. 1, the electrical shield 107 can include a break (such as in the form of a meandering dashed line across the width of the electrical shield 107) to prevent the circulation of eddy currents within the electrical shield 107. Without it, noise may occur in the drive and sense electrodes 105 of the touch sensor and / or a second magnetic field opposing the magnetic field generated by the multilayer inductor 150 may be induced, potentially suppressing the vibration of the substrate 102 during a haptic feedback cycle.

[0131] Additionally or alternatively, in the above-described configuration where the system 100 includes the electrodes 146 at the positions of the flex spacers of the bottom layer 140 of the substrate 102, a first inductor layer 110 on the substrate 102 (disposed below the top layer 104 and / or the intermediate layer 106 and including the first spiral trace 111 of the multilayer inductor 150) includes an electrical shield 107 that is separate from the first spiral trace 111 and surrounds the first spiral trace. In this embodiment, the controller 190 can drive both this electrical shield 107 of the first inductor layer 110 and the multilayer inductor 150 to a reference voltage potential (e.g., ground, intermediate voltage) (when not in a haptic feedback cycle), thereby shielding those electrodes 146 from electrical noise external to the system 100 and / or shielding the pair of drive and sense electrodes 105 of the touch sensor from electrical noise generated by those electrodes 146. Thus, in this embodiment, the first inductor layer 110 of the substrate 102 (including the first spiral trace 111 of the multilayer inductor 150) can further include a shield electrode trace 112 that is adjacent to the first spiral trace 111 and offset from the first spiral trace, and the controller 190 can drive the shield electrode trace 112 and the first spiral trace 111 to a reference potential to shield a first set of the electrodes 146 (at the position of the spacer element) from electrical noise when reading an electrical value from those electrodes 146.

[0132] For example, in this embodiment, during a scan cycle, the controller 190 can drive the multilayer inductor 150 (or the uppermost spiral trace of the multilayer inductor 150) at a virtual ground potential while scanning and processing resistance (or capacitance) data from the pair 105 of drive and sense electrodes of the touch sensor in the upper conductive layer of the substrate 102. Thereafter, the controller 190 detects an input on the touch sensor surface 172 based on a change in the resistance (or capacitance) value read from the pair 105 of drive and sense electrodes in the touch sensor, releases the multilayer inductor 150 from the virtual reference potential, and during a haptic feedback cycle, can polarize the multilayer inductor 150 via a time-varying current signal in response to the detection of the input on this touch sensor surface 172. More specifically, the controller 190 can ground the electrical shield 107 and the multilayer inductor 150 during a scan cycle to shield the touch sensor from electronic noise, and can pause the scan of the touch sensor during a haptic feedback cycle (e.g., while the multilayer inductor 150 is being polarized) to avoid generating or responding to a noisy touch image during the haptic feedback cycle.

[0133] Thus, in this variation, the power electronics (e.g., the multilayer inductor 150) and the sensor electronics (e.g., the pair 105 of drive and sense electrodes in the touch sensor and the electrode 146 at the position of the spacer element) in both high-resolution and low-resolution sensors can be manufactured respectively on a single integrated substrate 102, thereby eliminating the need for manufacturing and assembling multiple individual substrates for various haptic feedback and touch sensing functions, and enabling the system 100 to perform touch sensing, force sensing, and haptic feedback functions in a thinner package.

[0134] 8. Controller During operation, the controller 190 detects an input to the touch sensor surface 172 based on a change in an electrical (e.g., capacitance or resistance) value between pairs 105 of drive and sense electrodes in a touch sensor incorporated in the top layer 104 of the substrate 102, and characterizes the magnitude of the input force based on those electrical values read from the touch sensor and / or based on electrical values read from electrodes 146 in spacer elements 160 incorporated in the bottom layer 140 of the substrate 102, and / or interprets the input as a "click" input if the magnitude of the input force exceeds a threshold force magnitude (e.g., 160 grams). Next, in response to detecting the input and / or interpreting the input as a "click" input, the controller 190 executes a haptic feedback cycle by temporarily polarizing the multi-layer inductor 150 to induce an alternating magnetic coupling between the multi-layer inductor 150 and a set of magnetic elements, thereby vibrating the substrate 102 within the chassis 192 to provide haptic feedback to the user and provide the user with the tactile sensation that the touch sensor surface 172 moves downward as when a mechanical momentary switch, button or key is depressed.

[0135] 8.1 Controller and operation: Force sensing Generally, the system 100 includes a controller 190 configured to read a set of capacitance values (from an array of capacitive force sensors) indicative of compression of a set of spring elements 162 between the base plate 166 and the substrate 102 during a scan cycle, and interpret the distribution of forces applied to the touch sensor surface 172 during the scan cycle based on this set of capacitance values and a force model indicative of the spring constants of the set of spring elements 162.

[0136] In one example, during a first period of a setup routine or calibration cycle in which no touch input is applied to the touch sensor surface 172, the controller 190 can read capacitance values from the capacitive force sensor array and store those capacitance values as baseline capacitances (corresponding to a state in which no touch input exists on the touch sensor surface 172) of those pressure sensors. Further, during a second period of a setup routine or calibration cycle in which a touch input is applied (e.g., with a stylus or finger) to a first region of the touch sensor surface 172 proximate to the first spring element, the first spring element follows the touch input (i.e., is displaced from the nominal plane), and the substrate 102 advances toward the base plate 166 by a distance proportional to the magnitude of the force of the touch input (as a result, the sensing electrodes on the substrate 102 advance toward the drive electrodes on the base plate 166).

[0137] Accordingly, during a scan cycle in the first period, the controller 190 reads a first capacitance value from the first capacitive force sensor, calculates a first change in capacitance in the first capacitive force sensor during the first period based on the difference between the first capacitance value from the first capacitive force sensor and the stored baseline capacitance value, and interprets a portion of the magnitude of the touch input force applied to the first spring element based on (e.g., in proportion to) the stored force model (e.g., based on the spring constant of the first spring element) showing the relationship between the deviation from the baseline capacitance and the force applied to the first spring element and the first change in capacitance value.

[0138] In this example, for each of the other individual capacitive force sensors of system 100, the controller 190 can execute this process in order to convert the change in capacitance values detected by each pressure sensor during the scan cycle into the magnitude of the portion of the total force of the touch input applied to each spring element. The controller 190 can then sum those portions to calculate the magnitude of the total force of the touch input during the first period. Additionally or alternatively, the controller 190 can fuse the magnitudes of those portions of the force applied to each capacitive force sensor, the known positions of the capacitive force sensors in system 100, and the positions of the multiple simultaneous and individual inputs detected on the touch sensor surface 172 via the capacitive touch sensors to estimate the force applied by each individual input.

[0139] In another example, system 100 can access a force model that shows the relationship between the deviation from a baseline electrical value (e.g., capacitance value) and the force applied to a spring element based on the spring constant of the spring element, and interpret the magnitude of the touch input force based on the set of electrical values and the force model. In another example, system 100 can interpret the magnitude of the touch input force on the touch sensor surface 172 based on the lateral and longitudinal positions of the touch input, the deviation of the set of electrical values in the first set of electrodes (e.g., sensing electrodes) 146 from the baseline electrical value, and the positions of the spring elements within the set of spring elements 162 coupled to the substrate 102.

[0140] 8.2 Negative force In one embodiment, the controller 190 performs a similar method and technique of detecting both an increase and a decrease in the force applied to the capacitive force sensor array during a scan cycle based on the detected decrease and increase in capacitance across the capacitive sensor array, respectively. More specifically, when a force is applied on the touch sensor surface 172 near the first corner of the touch sensor surface 172, both pushing this first corner of the touch sensor surface 172 into the chassis 192 and lifting the second opposite corner of the substrate 102 from the chassis 192 may occur. In that case, the force applied to the capacitive force sensor adjacent to the first corner increases, and the force applied to the capacitive force sensor adjacent to the second corner decreases.

[0141] Accordingly, the controller 190 detects both an increase and a decrease in capacitance in the first and second capacitive force sensors at the first and second corners of the substrate 102, interprets the positive and negative changes in the forces applied to the first and second pressure sensors from the increases and decreases in their capacitances, and combines (e.g., sums) the positive and negative changes in those forces to calculate the exact total force applied near the first corner of the touch sensor surface 172 during the scan cycle.

[0142] In one example, system 100 has a substrate 102 that includes a first support position disposed proximate a first side edge of the substrate 102 and a first subset of electrodes within a first set of electrodes (e.g., sensing electrodes) 146 disposed proximate the first position. Further, the substrate 102 includes a second support position disposed proximate a second side edge opposite the first side edge of the substrate 102 and a second subset of electrodes within the first set of electrodes (e.g., sensing electrodes) 146 disposed proximate the second support position. Also, system 100 includes a second set of electrodes (e.g., drive electrodes) 147, which includes a third subset of electrodes disposed beneath the first subset of electrodes to form a first force sensor proximate a first side edge of the touch sensor surface 172 and a fourth subset of electrodes disposed beneath the second subset of electrodes to form a second force sensor proximate a second side edge opposite the first side edge of the touch sensor surface 172. And, system 100 can read a first set of electrical values from the first force sensor proximate the first side edge of the touch sensor surface 172 and interpret a first compressive force applied to the first support position in response to the first set of electrical values deviating from a baseline electrical value of the first force sensor in a first direction. Further, system 100 can read a second set of electrical values from the second force sensor and interpret a second tensile force applied to the second support position in response to the second set of electrical values deviating from the baseline electrical value of the second force sensor in a second direction opposite the first direction. Thus, system 100 can interpret the magnitude of a first touch input force applied to the touch sensor surface 172 based on a combination of the first compressive force and the second tensile force.

[0143] 8.3 Device startup In another embodiment, the controller 190 can perform a scan cycle to detect an input on the touch sensor surface 172 to wake the device from the low power mode. In this embodiment, the controller 190 performs a scan cycle to detect an input on the touch sensor surface 172, reads a set of electrical values from sense electrodes disposed around the bottom layer 140 of the substrate 102, interprets the magnitude of the touch input based on the set of electrical values, and in response to the magnitude of the force exceeding a force threshold, can end the low power mode of the device so that the user can fully operate the device.

[0144] 9. Haptic feedback cycle In this variation, a multi-layer inductor 150 (incorporated in the substrate 102) and a set of magnetic elements (accommodated within the chassis 192 below the multi-layer inductor 150) cooperate to define a compact integrated multi-layer inductor 150 configured to vibrate the substrate 102 and the touch sensor surface 172 in response to polarization of the multi-layer inductor 150 by the controller 190 (e.g., in response to detection of a touch input on the touch sensor surface 172). More specifically, the controller 190, in conjunction with a drive circuit, can supply an alternating (i.e., time-varying) drive current to the multi-layer inductor 150 during a haptic feedback cycle, thereby generating a time-varying magnetic field that periodically reverses direction through the multi-layer inductor 150. Thus, the controller 190 and / or the drive circuit can temporarily polarize the multi-layer inductor 150 to generate a magnetic force between the multi-layer inductor 150 and the set of magnetic elements, whereby the multi-layer inductor 150 (and thus the substrate 102 and the touch sensor surface 172) can be alternately attracted to or repelled from the magnetic poles of the set of magnetic elements, as shown in FIGS. 16 and 17, to vibrate the touch sensor surface 172 relative to the chassis 192.

[0145] In particular, in response to detecting a touch input (on the touch sensor surface 172) having a magnitude of force (or pressure) that exceeds a threshold, the controller 190 drives the multilayer inductor 150 during a "haptic feedback cycle" so as to haptically mimic the actuation of a mechanical snap button, as shown in FIGS. 16 and 17. For example, in response to such a touch input, the controller 190 activates a motor driver to drive the multilayer inductor 150 with a square wave alternating voltage having a target click duration (e.g., 250 milliseconds), which can induce an alternating magnetic field through the multilayer inductor 150, and the alternating magnetic field magnetically couples to a set of magnetic elements to induce a vibrational force between the magnetic elements and the multilayer inductor 150, causing the substrate 102 to vibrate relative to the device's chassis 192.

[0146] 9.1 Standard click and deep click In one variation, in response to applying a force that exceeds a first force magnitude but is less than a second force threshold (hereinafter, a "standard click input"), the controller 190 executes a "standard click haptic feedback cycle" in blocks S110 and S120, and in response to applying a force that exceeds the second force threshold (hereinafter, a "deep click input"), executes a "deep haptic feedback cycle" in blocks S114 and S124. In this variation, during the deep haptic feedback cycle, the controller 190 can drive the multilayer inductor 150 for a longer time (e.g., 750 milliseconds), at a higher amplitude (e.g., by driving the haptic feedback cycle with a higher peak-to-peak voltage), and / or at a different (e.g., lower) frequency, in order to haptically indicate to the user that a deep click input has been detected at the touch sensor surface 172.

[0147] In one example, in response to detecting an input of a force having a magnitude between a low "standard" force threshold and a high "deep" force threshold, the controller 190 outputs a left click control command and can execute a standard click haptic feedback cycle, and in response to detecting an input of a force having a magnitude greater than the high "deep" force threshold, outputs a right click control command function and can execute a deep haptic feedback cycle. Thus, the system 100 can detect inputs of various force magnitudes on the touch sensor surface 172, assign an input type to an input based on the magnitude, and drive the multi-layer inductor 150 according to various schemes based on the detected input type, thereby providing various haptic feedbacks to the user and outputting various control functions based on the detected input type.

[0148] 9.2 Hysteresis In one variation, the controller 190 executes a hysteresis technique to activate a haptic feedback cycle while applying and retracting a single input on the touch sensor surface 172. In particular, in this variation, the controller 190 selectively drives the multi-layer inductor 150 according to a "down click" vibration profile during a haptic feedback cycle in response to detecting a new input (a force greater than a high force threshold, e.g., 165 grams) applied to the touch sensor surface 172, can track this input in contact with the touch sensor surface 172 over multiple scan cycles, and then, in response to detecting that the magnitude of the force of this input has dropped below a low force threshold (e.g., 60 grams), can drive the multi-layer inductor 150 according to an "up click" vibration profile during a subsequent haptic feedback cycle. Thus, the system 100 can reproduce the tactile "feel" of pressing and then releasing a mechanical snap button and can prevent "bouncing" haptic feedback when the magnitude of the input force on the touch sensor surface 172 changes around the force threshold.

[0149] More specifically, when the magnitude of the input force on the touch sensor surface 172 reaches a high force threshold, the controller 190 can execute a single "down click" haptic feedback cycle (suggesting the pressing of a mechanical button) until the input is released from the touch sensor surface 172. However, when the magnitude of this input force falls below the magnitude of a second, lower threshold, the controller 190 can also execute an "up click" haptic feedback cycle (suggesting the release of a pressed mechanical button). Thus, the controller 190 can implement a hysteresis technique to prevent "bouncing" of the haptic response to an input on the touch sensor surface 172, and can notify the user, via haptic feedback, that a force applied to the touch sensor surface 172 has been registered (i.e., has reached the magnitude of the first threshold), and can also notify the user, via additional haptic feedback, that the user's selection has been cleared and that a force applied to the touch sensor surface 172 has been registered (i.e., that the applied force has fallen below the magnitude of the second threshold).

[0150] 10. Multiple multilayer inductors In one variation, system 100 can also include a plurality of multi-layer inductors 150 and pairs of magnetic elements. In one example, system 100 includes a first multi-layer inductor 150 disposed proximate a first edge of substrate 102 and a first magnetic element 181 disposed within chassis 192 below the first multi-layer inductor 150 and thus proximate the first edge of substrate 102. In this example, system 100 can further include a second magnetic element 182 rigidly coupled to chassis 192 and offset from the first magnetic element 181, and a second inductor coupled to substrate 102 below touch sensor surface 172, disposed proximate a second edge of substrate 102 opposite the first edge, and configured to be magnetically coupled to the second magnetic element 182. Further, in this example, controller 190 selectively polarizes the first inductor 150 in response to detection of a touch input on touch sensor surface 172 proximate the first edge of substrate 102 such that peak energy is sensed in the vicinity of this first edge of substrate 102, and can vibrate substrate 102 relative to chassis 192 within the plane of vibration, and selectively polarizes the second inductor in response to detection of a second touch input on touch sensor surface 172 proximate the second edge of substrate 102 such that peak energy is sensed in the vicinity of this second edge of substrate 102, and can vibrate substrate 102 relative to chassis 192 within the plane of vibration.

[0151] In a similar embodiment, system 100 can include a first multilayer inductor 150 (as described above) and a second pair of inductor-magnetic elements that cooperate with the first pair of inductor-magnetic elements to vibrate substrate 102. In this variation, the first pair of inductor-magnetic elements can include a coil attached to substrate 102 offset by a first distance to the right of the center of mass of substrate 102. The first pair of inductor-magnetic elements can also include an array of magnets aligned in a row below the multilayer inductor 150. The array of magnets can cooperate with the multilayer inductor 150 of the first pair of inductor-magnetic elements to define the axis of vibration of the first pair of inductor-magnetic elements. The second pair of inductor-second magnetic elements 182 can include a coil attached to substrate 102 offset by a second distance to the left of the center of mass of substrate 102. The second pair of inductor-second magnetic elements 182 can also include an array of magnets aligned in a row. The array of magnets can cooperate with the multilayer inductor 150 of the second pair of inductor-second magnetic elements 182 to define the axis of vibration of the second pair of inductor-second magnetic elements 182.

[0152] In one embodiment, the magnet array of the pair of first inductor-magnetic elements is arranged in a row parallel to the magnet array of the pair of second inductor-second magnetic elements 182 such that the oscillation axes of the pair of first inductor-magnetic elements are parallel to the oscillation axes of the pair of second inductor-second magnetic elements 182. In this embodiment, the multilayer inductor 150 of the pair of first inductor-magnetic elements can be attached to the substrate 102 offset from the center of mass of the substrate 102 by a first distance equal to a second distance between the multilayer inductor 150 of the pair of second inductor-second magnetic elements 182 and the center of mass. Thus, the midpoint between the multilayer inductor 150 of the pair of first inductor-magnetic elements and the multilayer inductor 150 of the pair of second inductor-second magnetic elements 182 can be coaxial with the center of mass. Thus, the pair of first inductor-magnetic elements and the pair of second inductor-second magnetic elements 182 cooperate to vibrate the substrate 102 along an overall oscillation axis extending parallel to the oscillation axes of the first and second magnets and passing through the center of mass of the substrate 102.

[0153] The controller 190 can drive the pair of first inductor-magnetic elements to vibrate the substrate 102 at a first frequency and can drive the pair of second inductor-second magnetic elements 182 to vibrate at a similar frequency in phase with the vibration of the first multilayer inductor 150. Thus, the first and second multilayer inductors 150 cooperate to linearly vibrate the substrate 102 along the overall oscillation axis. However, the controller 190 can additionally or alternatively drive the first multilayer inductor 150 to vibrate the substrate 102 at a first frequency and drive the second multilayer inductor 150 at a second frequency different from the first frequency and / or with a phase shift from the vibration of the first multilayer inductor 150. Thus, the first and second multilayer inductors 150 cooperate to rotate the substrate 102 about the center of mass (in a plane parallel to the touch sensor surface 172).

[0154] Additionally or alternatively, the controller 190 can selectively drive either the first multilayer inductor 150 or the second multilayer inductor 150 to vibrate for a specific time. The controller 190 can selectively (and exclusively) drive the first multilayer inductor 150 to mimic the feeling of a click on a section of the substrate 102 adjacent to the first multilayer inductor 150. Alternatively, the controller 190 can drive the second multilayer inductor 150 to mimic the feeling of a click on a section of the substrate 102 adjacent to the second multilayer inductor 150 while minimizing vibrations on the section of the substrate 102 adjacent to the first multilayer inductor 150. For example, the controller 190 can selectively drive the first multilayer inductor 150 to execute a haptic feedback cycle to mimic the feeling of a click (or "right" click) on the right side of the substrate 102 while keeping the second multilayer inductor 150 in an inactive state.

[0155] However, the controller 190 can also drive the first multilayer inductor 150 to vibrate according to a specific vibration waveform. At the same time, the controller 190 can drive the second multilayer inductor 150 to vibrate according to a vibration waveform that is out of phase (e.g., 180° out of phase) with the specific vibration waveform of the first multilayer inductor 150. For example, the second multilayer inductor 150 can output a vibration waveform with an amplitude smaller than the amplitude of the specific vibration waveform. In this example, the vibration waveform of the second multilayer inductor 150 can also be shifted 180° in phase with respect to the specific vibration waveform of the first multilayer inductor 150. Therefore, the second multilayer inductor 150 can be configured to cancel out (or reduce the amplitude of) the specific vibration waveform output by the first multilayer inductor 150.

[0156] 11. Separate inductor In one variation, by removing or taking out a certain area of the substrate 102, a shallow recess is formed through a subset of the layers of the substrate 102. For example, an area with a thickness of three layers of the substrate 102 close to the center in the lateral and longitudinal directions of the substrate 102 can be removed from the bottom surface of the substrate 102. Individual thin wire coils are soldered to a set of vias exposed on the bottom surface of the recess, and then installed (e.g., adhered, potted) in the recess so that the exposed surface of the coil is substantially coplanar (e.g., within 100 microns) with the bottom surface of the substrate 102.

[0157] Additionally or alternatively, as described above, the system 100 includes a first integrated inductor manufactured across a plurality of layers of the substrate 102 and a second coil disposed on top of the first integrated inductor and electrically coupled to the first integrated inductor, the second coil being configured to cooperate with the first integrated inductor to form a larger inductor that exhibits a greater magnetic coupling to adjacent magnetic elements. For example, the second coil can include a multi-loop wire coil or a second integrated inductor that is manufactured across a plurality of layers of a second substrate 102 and then coupled and / or soldered to the (first) substrate 102 adjacent to the first integrated inductor.

[0158] 12. Waterproof In one variation shown in FIGS. 9A and 9B, a waterproof membrane 164 is applied over the touch sensor, extends outward from the periphery of the substrate 102, and is held adjacent to the periphery of the receptacle 194 by adhesion, clamping, or other means, and cooperates with the chassis 192 to seal the touch sensor, the substrate 102, the spacer element 160, etc. within the receptacle 194, thereby preventing the ingress of moisture and particles into the receptacle 194 and onto the substrate 102.

[0159] For example, the waterproof membrane 164 can include a silicone or PTFE (e.g., expanded PTFE) film adhered onto the touch sensor with an adhesive. Also, the system 100 can further include a glass or other cover layer 170 coupled onto the waterproof membrane 164 and extending to the periphery of the substrate 102.

[0160] Furthermore, the chassis 192 can define a flange (or “ledge,” undercut) extending inwardly toward the lateral and longitudinal centers of the receptacle 194. The outer section of the waterproof member extending beyond the substrate 102 can be inserted into the receptacle 194 and brought into contact with the lower surface of the flange. Thereafter, a circumferential retaining bracket or secondary chassis 192 member can be secured to the chassis 192 below the flange and (completely) above the outer periphery of the receptacle 194, thereby clamping the waterproof membrane 164 between the chassis 192 and the circumferential retaining bracket or secondary chassis 192 member to seal the waterproof membrane 164 around the receptacle 194.

[0161] In one embodiment, the waterproof membrane 164 includes a flexure between the outer periphery of the substrate 102 and the receptacle 194. In this embodiment, the flexure can be configured to flex or deform to accommodate vibrations of the substrate 102 during a haptic feedback cycle. For example, the waterproof membrane 164 can include a polyimide film having a semi-circular ridge extending along a gap between the outer periphery of the substrate 102 and the inner periphery of the receptacle 194.

[0162] In a similar embodiment, as described above, the substrate 102 and the touch sensor are disposed on the waterproof membrane 164, and the waterproof membrane is sealed to the chassis 192 along the lower surface of the receptacle 194 by a retaining bracket, such that the touch sensor assembly is disposed completely above the waterproof barrier across the receptacle 194 and the waterproof membrane vibrates to vibrate the touch sensor assembly when the multilayer inductor 150 is actuated.

[0163] The systems and methods described herein can be at least partially embodied and / or executed as a machine configured to receive a computer-readable medium storing computer-readable instructions. The instructions can be executed by a computer-executable component integrated with an application, applet, host, server, network, website, communication service, communication interface, user computer or mobile device, list band, hardware / firmware / software elements of a smartphone, or any suitable combination thereof. Other systems and methods of the embodiments can be at least partially embodied and / or executed as a machine configured to receive a computer-readable medium storing computer-readable instructions. The instructions can be executed by a computer-executable component integrated with a computer-executable component integrated with an apparatus and network of the type described above. The computer-readable medium can be stored on any suitable computer-readable medium, such as RAM, ROM, flash memory, EEPROM, optical device (CD or DVD), hard drive, floppy drive, or any suitable device. The computer-executable component may be a processor, but any suitable dedicated hardware device can (alternatively or additionally) execute the instructions.

[0164] Those skilled in the art will recognize that modifications and changes can be made to the embodiments of the present invention without departing from the scope of the present invention as defined in the appended claims, as will be recognized from the detailed description, drawings, and claims above.

Claims

1. A system, ・ A substrate, o A first support position disposed proximate a side edge of the substrate, o A substrate having a first electrode disposed proximate the first support position; ・ A cover layer defining a touch sensor surface disposed on the substrate, ・ A first spacer element, o Coupled to the substrate at the first support position and o Configured to couple the substrate to a base plate and to follow displacement of the substrate relative to the base plate in response to a force applied to the touch sensor surface, a first spacer element; ・ A second electrode, o Disposed below the substrate and facing the first electrode, defining a nominal gap therebetween, and o Configured to affect an electrical value of the first electrode in response to displacement of the first electrode toward the second electrode, a second electrode; ・ A controller, o Detecting a first touch input at a first position on the touch sensor surface, o Reading a set of electrical values from the first electrode, and o Configured to interpret a magnitude of a first force of the first touch input based on the set of electrical values, a controller. A system characterized by comprising the same.

2. The system according to claim 1, ・ The first electrode includes a first sensing electrode within a set of sensing electrodes disposed near a bottom periphery of the substrate, ・ The second electrode includes a second driving electrode within a set of driving electrodes disposed aligned with the first sensing electrode near an upper surface of the base plate, ・ The controller, o Reads a first set of capacitance values between the first sensing electrode on the substrate and the second driving electrode on the base plate, and o A system characterized in that it is configured to interpret the magnitude of the first force of the first touch input based on the set of capacitance values.

3. In the system according to claim 1, ・ The substrate further includes an array of pairs of driving electrodes and sensing electrodes arranged over the upper surface of the substrate, ・ The cover layer is disposed over the array of pairs of driving electrodes and sensing electrodes, ・ The controller, o Reads a second set of electrical values from the array of pairs of driving electrodes and sensing electrodes, o Based on the second set of electrical values, detects the lateral and longitudinal positions of the first touch input on the touch sensor surface, and o A system characterized in that it is configured to output the lateral position, longitudinal position, and magnitude of the first force of the first touch input.

4. In the system according to claim 1, ・ The base plate includes a first spring element, and this first spring element, o Is disposed near the periphery of the base plate, o Defines a first stage facing the first support position, and o Is configured to follow the downward displacement of the substrate toward the base plate in response to a force applied to the touch sensor surface, ・ The first spacer element is interposed between the first support position and the first stage of the first spring element, ・ A system characterized in that the second electrode is arranged in the vicinity of the first spring element in alignment with the first sensing electrode.

5. In the system according to claim 4, The controller, - Access a force model that shows the relationship between the deviation from the baseline electrical value and the force applied to the first spring element based on the spring constant of the first spring element, and - A system configured to interpret the magnitude of the first force of the first touch input based on the first set of electrical values and the force model. **Claim 6** In the system according to claim 1, - The first electrode o Defines a first sensing electrode, o Spans a first region in the lowermost layer of the substrate, and o Surrounds the first support position in the lowermost layer of the substrate, - The second electrode o Defines a second driving electrode capacitively coupled to the first sensing electrode, o Spans a second region in the base plate that is smaller than the first region, and o Aligns within the first region of the first electrode to form a first capacitive force sensor below the touch sensor surface. **Claim 7** In the system according to claim 1, - The substrate further o Has a second support position disposed close to a second side edge of the substrate opposite to the first side edge, and o Includes a third electrode disposed close to the second support position, - The system further includes a fourth electrode, and the fourth electrode o Is disposed opposite to the third electrode below the substrate to define a nominal gap therebetween, and o Is configured to affect the electrical value of the third electrode in response to displacement of the third electrode towards the fourth electrode, - The controller o In response to the first set of electrical values deviating from the baseline electrical value of the first electrode in a first direction, interpreting a first compressive force applied to the first spacer element at the first support position, o Reading a second set of electrical values from the third electrode, o In response to the second set of electrical values deviating from the baseline electrical value of the third electrode in a second direction opposite to the first direction, interpreting a second tensile force applied to the second spacer element at the second support position, o A system characterized in that it is configured to interpret the magnitude of the first force of the first touch input applied to the touch sensor surface based on a combination of the first compressive force and the second tensile force.

8. In the system according to claim 7, - The second electrode and the fourth electrode are electrically coupled across the base plate, - In response to the controller detecting the first touch input at a first position proximate to the first electrode on the substrate, o Simultaneously applying a target voltage between the second electrode and the fourth electrode, o Reading a first set of electrical values from the first electrode proximate to the first position of the first touch input, and o A system characterized in that it is configured to read a second set of electrical values from the third electrode at a position offset from the first position of the first touch input.

9. In the system according to claim 1, - The substrate, o Defines a first region, and this first region, - The first support position disposed proximate to a first side edge of the substrate, and - The first electrode disposed below the first region of the substrate proximate to the first support position, including, o Defines a second region adjacent to the first region, and this second region, ・ A second support position disposed proximate to a second side edge of the substrate opposite the first side edge, ・ A third electrode disposed below a second region of the substrate proximate to the second support position and including, ・ The system further includes a fourth electrode, the fourth electrode o being disposed below the substrate and opposite the third electrode, defining a nominal gap therebetween, and o being configured to affect the electrical value of the third electrode in response to displacement of the third electrode toward the fourth electrode, ・ The controller o detects a first touch input at a first position within a first region of the substrate, o reads a second set of electrical values from the third electrode in the second region of the substrate, and o is configured to interpret a magnitude of a first force at the first position within the first region based on a combination of the first set of electrical values and the second set of electrical values. A system characterized by that.

10. In the system according to claim 1, ・ The substrate further includes a set of inductor layers including a set of spiral traces, the set of spiral traces being disposed across the set of inductor layers to form a multilayer inductor, ・ The system further includes a first magnetic element defining a first polarity facing the multilayer inductor, ・ The controller applies an oscillating voltage to the multilayer inductor in response to the magnitude of the first force exceeding a target force magnitude, thereby o inducing an alternating magnetic coupling between the multilayer inductor and the first magnetic element, and o being configured to vibrate the substrate and the cover layer with respect to the first magnetic element, ・The first spacer element is configured to enable the substrate and the touch sensor surface to vibrate with respect to the base plate following the magnetic coupling between the multilayer inductor and the first magnetic element. A system characterized by that.

11. In the system according to claim 1, ・Further includes a set of spring elements disposed below the substrate, each spring element in the set of spring elements includes a bent portion, and the bent portion is, o Formed on the base plate, o Defines a stage, and o Is configured to return to a substantially nominal plane in response to the absence of a touch input applied to the touch sensor surface, ・Each spacer element in the set of spacer elements is, o Interposed between the substrate and the set of spring elements, and o Couples the support positions in the set of support positions to the stage of the spring elements in the set of spring elements. A system characterized by that.

12. In the system according to claim 11, The controller is, ・The first lateral position and the first longitudinal position of the first touch input, ・The set of deviations of the electrical values from the baseline electrical value at the first electrode, ・The positions of the spring elements in the set of spring elements coupled to the substrate Based on, it is configured to interpret the magnitude of the first force of the first touch input. A system characterized by that.

13. In the system according to claim 1, ・The substrate includes a first force bending layer, and this first force bending layer is, o Includes a first set of electrodes including the first electrode disposed across the first force bending layer, o Is coupled to the lower surface of the substrate, and extends near the periphery of the substrate, ・ the base plate includes a second force-bending layer, and this second force-bending layer, o includes a second set of electrodes, and this second set of electrodes, ・ is aligned with the first set of electrodes on the substrate, ・ is disposed across the second force-bending layer, and, ・ includes the second electrode, o the second force-bending layer is coupled to the upper surface of the base plate, and, o extends near the periphery of the base plate, a system characterized thereby.

14. In the system according to claim 1, ・ the substrate further comprises a third electrode, and this third electrode, o is disposed near the first support position adjacent to the first electrode, and, o is electrically coupled to the first electrode, ・ the system further comprises a fourth electrode, and this fourth electrode, o is disposed adjacent to the second electrode, o is disposed opposite the third electrode below the substrate to define a nominal gap with the third electrode, and, o is configured to affect the electrical value of the third electrode in response to displacement of the third electrode towards the fourth electrode, ・ the controller, o reads a set of electrical values from the first electrode and the third electrode, and, o is configured to interpret the magnitude of the first force of the first touch input on the touch sensor surface based on the deviation of the set of electrical values from the baseline electrical values, a system characterized thereby.

15. A system, ・ a substrate, o a bottom layer, o a first set of electrodes disposed on the bottom layer of the substrate, a substrate including a support position set disposed in the lowermost layer adjacent to the first set of electrodes; a cover layer disposed on the substrate and defining a touch sensor surface; a set of spring elements, each spring element in the set of spring elements being coupled to the substrate at a support position within the set of support positions and configured to follow a downward displacement of the substrate towards a base plate in response to a force applied to the touch sensor surface; a second set of electrodes, disposed below the substrate and opposite the first set of electrodes, defining a nominal gap therebetween, and configured to affect an electrical value of the first set of electrodes in response to a displacement of the first set of electrodes on the substrate towards the second set of electrodes. A system characterized by comprising: **Claim 16** The system according to claim 15, further comprising a controller, the controller being configured to detect a first touch input at a first position on the touch sensor surface, read a set of electrical values from the first set of electrodes, and interpret a magnitude of a first force of the first touch input based on the set of electrical values. A system characterized by comprising: **Claim 17** The system according to claim 15, wherein the set of spring elements includes a one-piece structure defining a nominal plane, and each spring element in the set of spring elements includes a flexure, the flexure being formed in the one-piece structure, defining a stage, and configured to... In response to the absence of a touch input on the touch sensor surface, it is configured to return to a substantially nominal plane, - The system further includes a set of spacer elements, and each spacer element in the set of spacer elements, - Is interposed between the substrate and the set of spring elements, and - Couples the support positions in the set of support positions to the stages of the spring elements in the set of spring elements. A system characterized by that.

18. In the system according to claim 15, - The first set of electrodes defines a first set of sensing electrodes disposed near the periphery of the lowermost layer of the substrate, - The second set of electrodes is disposed near the upper surface of the base plate so as to be aligned with the first set of sensing electrodes, and forms an array of capacitive force sensors below the cover layer. A second set of drive electrodes is defined, - The controller, - Reads a set of capacitance values from an array of capacitive force sensors below the cover layer, and - Based on the set of capacitance values, it is configured to interpret the magnitude of the first force of the first touch input. A system characterized by that.

19. In the system according to claim 15, - The substrate further includes an array of pairs of drive electrodes and sensing electrodes disposed over the uppermost layer of the substrate, - The cover layer is disposed over the array of pairs of drive electrodes and sensing electrodes, - The controller, - Reads a second set of electrical values from the array of pairs of drive electrodes and sensing electrodes, - Based on the second set of electrical values, detects the lateral and longitudinal positions of the first touch input on the touch sensor surface, and A system configured to output a horizontal position, a vertical position, and a magnitude of a first force of the first touch input.

20. A system, ・ A cover layer defining a touch surface, ・ A first set of sensing electrodes, o Arranged below the cover layer and o A first set of sensing electrodes arranged near a set of support positions on the opposite side of the touch surface, ・ A set of spring elements, where each spring element in the set of spring elements o Is coupled to the substrate at a support position within the set of support positions and o Is configured to follow a downward displacement of the substrate toward the chassis in response to a force applied to the touch surface, a set of spring elements, ・ A second set of drive electrodes, o Arranged below the first set of electrodes to define a nominal gap between the first set of sensing electrodes and o A second set of drive electrodes configured to affect an electrical value of the first set of sensing electrodes in response to a displacement of the nominal gap between the first set of sensing electrodes and the second set of drive electrodes, ・ A set of spacer elements, o Interposed between the set of spring elements and the set of support positions and o A set of spacer elements arranged to align the first set of sensing electrodes with the second set of drive electrodes to form a set of force sensors below the touch surface. A system characterized by comprising.

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