Thermal Management System and Method for a Power Device

Abstract

A thermal management system and method provided for thermal management of a power converter and its components. In one example, a cooling jacket is coupled to a circuit board, and the cooling jacket has an inner surface that simulates a substrate surface profile formed by an outer surface of a printed circuit board and electronic components thereon. A coolant fluid is provided through a coolant fluid path volume defined by the substrate surface profile and the inner surface of the cooling jacket. In another example, a cooling jacket covers an outer surface of an electronic component on a printed circuit board. The cooling jacket receives a coolant fluid at an inlet and directs a jet of the coolant fluid toward the outer surface of the electronic component. The fluid exits the cooling jacket through an opening between the cooling jacket and a surface of the printed circuit board.

Description

Technical Field

[0001] (Cross - Reference to Related Applications) This application claims priority to U.S. Provisional Application No. 63 / 351,893, filed on June 14, 2022, the entire content of which is incorporated herein by reference.

[0002] (Statement Regarding Federally Sponsored Research) Not applicable.

[0003] The technology described herein generally relates to thermal management of power devices, and more particularly, to liquid cooling of power devices.

Background Art

[0004] Various types of power electronics and power converters (collectively referred to as power devices) have been produced and used in many industries and scenarios. Examples of power electronics include power switching devices such as insulated gate bipolar transistors (IGBTs), metal - oxide - semiconductor field - effect transistors (MOSFETs), and gallium nitride (GaN) transistor switches. Examples of power converters include rectifiers that convert alternating current (AC) to direct current (DC), inverters that convert DC to AC, and converters that convert DC to DC. A rectifier that converts AC to DC is also called an AC / DC rectifier and converts AC power to DC power. An inverter that converts DC to AC is also called a DC / AC inverter and converts DC power to AC power. A converter that converts DC to DC is also called a DC / DC converter and converts input DC power from a first DC voltage level to a second DC voltage level.

[0005] Power electronics may be included within a power converter, similar to other electronics, to provide an electronically controlled switching function within a circuit.

[0006] A power converter can be used for various applications, such as rectifying AC grid power to DC power to charge a battery, or inverting DC power from a battery to AC power to drive a motor or supply AC power to the AC grid. Further, the power converter can be used in various scenarios such as in or connected to electric vehicles, engine generators, solar panels, etc.

Summary of the Invention

[0007] Power electronics (e.g., IGBT, MOSFET, SiC, or GaN switches, etc.) can be described in terms of, among other characteristics, power efficiency, power density, and cost. Generally, it is desirable to have power electronics with higher power efficiency, higher power density, and lower cost. Similarly, a power converter can be described, among other characteristics, from the perspectives of power (conversion) efficiency, power density, and cost. Generally, it is desirable to have a power converter with higher power efficiency, higher power density, and lower cost. Disclosed herein are systems and methods related to power electronics and power converters having improved power efficiency, improved power density, and / or reduced cost. In some embodiments described herein, the power device has a non-conductive fluid such as automotive transmission fluid (ATF) as a liquid medium and liquid cooling including direct jet impingement cooling.

[0008] In one embodiment, a thermal management system for a power converter is provided. The system includes a printed circuit board having a first surface, a plurality of electronic components on the printed circuit board, each having an outer surface, wherein the first surface and the outer surfaces of the plurality of electronic components form a substrate surface profile, a cooling jacket coupled to the printed circuit board, the cooling jacket having an inner surface with a surface profile that mimics the substrate surface profile, and a coolant fluid flow path volume defined by the substrate surface profile and the inner surface of the cooling jacket.

[0009] In one embodiment, a thermal management system for a power device is provided. The system includes a printed circuit board having a first surface, at least one electronic component on the printed circuit board, each having an outer surface, and a cooling jacket. The cooling jacket includes a body portion that covers the outer surface of the at least one electronic component, an inlet formed in the body portion and configured to receive a coolant fluid into the cooling jacket and direct a jet of the coolant fluid toward the outer surface of the at least one electronic component, and an overhang portion including an opening between the cooling jacket and the first surface of the printed circuit board that extends beyond a side surface of the at least one electronic component and provides an outlet from the cooling jacket for the coolant fluid directed toward the outer surface.

[0010] In one embodiment, a thermal energy management method is provided. The method includes receiving a coolant fluid at an inlet of a coolant fluid flow path volume defined by an inner surface of a cooling jacket and a substrate surface profile. The substrate surface profile is formed by a first surface of a printed circuit board and outer surfaces of a plurality of electronic components of the printed circuit board. The inner surface has a surface profile that mimics the substrate surface profile. The method further includes cooling the plurality of electronic components by passing through the coolant fluid flow path volume and outputting the coolant fluid at an outlet of the coolant fluid flow path volume.

[0011] In one embodiment, a thermal energy management method is provided. The method includes receiving a coolant fluid at an inlet formed in a body portion of a cooling jacket, the body portion covering outer surfaces of electronic components on a first surface of a printed circuit board. The method further includes directing a jet of the coolant fluid onto the outer surfaces of the electronic components by a channel coupled to the inlet. discharging the coolant fluid from the cooling jacket through an opening in an overhang portion of the cooling jacket, the opening being between the cooling jacket and the first surface of the printed circuit board.

[0012] Regarding the present disclosure, the foregoing or other aspects and advantages will become apparent from the following description. In the specification, reference numerals are assigned in the accompanying drawings that form a part thereof, and one or more embodiments are shown in an illustrative manner. These embodiments do not necessarily represent the entire scope of the invention, but are therefore referred to in the claims and this specification for interpreting the scope of the invention. In the following description, like reference numerals are used for like configurations in each figure.

Brief Description of the Drawings

[0013]

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DETAILED DESCRIPTION OF THE INVENTION

[0014] One or more embodiments are described and illustrated in the following description and the accompanying drawings. These embodiments are not limited to the specific details provided herein and may be modified in various ways. Further, other embodiments may exist that are not described herein. Also, functions performed by a number of components may be aggregated and performed by a single component. Similarly, functions described herein as being performed by one component may be performed by a number of components in a distributed form. Further, a component described as performing a particular function may also be able to perform additional functions not described herein. For example, a device or structure "configured" in a particular way is configured at least in that way, but may also be configured in ways not recited.

[0015] As used herein, "non-transitory computer-readable media" includes all computer-readable media, but does not include transitory, propagating signals. Thus, non-transitory computer-readable media can include, for example, hard disks, CD-ROMs, optical storage devices, magnetic storage devices, ROMs, RAMs (random access memories), register memories, processor caches, or any combination thereof.

[0016] In addition, the terms and terminology used herein are for purposes of explanation and should not be regarded as limiting. For example, the use of "comprising", "including", "containing", "having" and their variants herein means including the items listed thereafter, their equivalents, and additional matters. In addition, the terms "connected" and "coupled" are used in a broad sense and include both direct and indirect connections and couplings, and can refer to physical or electrical connections or couplings. Further, the phrase "and / or" used with two or more items is intended to cover each individual item and the set of each item together. For example, a device including "a and / or b" is intended to cover any of a device having "a" (and not including "b"), a device having "b" (and including "a"), or a device having both "a" and "b". As used herein, terms such as "substantially", "approximately", and "about" can refer to a value that is + or - 1% (i.e., plus or minus 1%), + or - 5%, + or - 10% with respect to an intended amount, value, angle, or other quantity.

[0017] A high-efficiency power converter can convert electrical power without significant energy loss (e.g., from AC to DC, from DC to AC, and / or from DC to DC). A low-efficiency power converter experiences higher losses in energy during power conversion. Such energy losses may appear, for example, as heat generated by the power converter while converting power. The power efficiency for a power converter, inductor, or other electronic component can be expressed as a percentage between 0 and 100% and is determined using the following formula based on the input power to the component and the output power from the component. [Equation 1] Power efficiency = Output power / Input power A power converter with a high power density has a high ratio of the power output by the power converter compared to the physical space occupied by the power converter. The power density can be calculated using the following formula. [Equation 2] Power density = Output power / Volume of the power converter

[0018] Applications that include power electronics (e.g., IGBTs, MOSFETs, and GAN switches, etc.), power converters (e.g., transformers, converters, inverters, etc.), or passive power components (e.g., inductors, capacitors, etc.), especially advanced or state-of-the-art applications, benefit from an increase in the power density (or power per unit volume or mass) of the power electronics and power converters. Effective thermal management is a tool to increase the power density of such systems, and by definition, more output is produced through a given (or smaller) area. Furthermore, effective thermal management can provide a way to lengthen the lifespan of such power devices, converters, or components. Conventional methods of thermal management include air cooling, convective heat transfer using heat sinks, and indirect convection using coolants. However, these solutions are often insufficient because of their limited thermal management capabilities and prevent a substantial increase in the power density for existing power electronics and power converters. Here, devices and methods are disclosed for providing an increase in power density in such systems, providing an increase in power beyond what is achievable by other means in the sense of conventional devices.

[0019] Furthermore, traditional systems that can utilize methods of direct or indirect liquid cooling focus on increasing the flow rate of the liquid, which is often a prohibited matter (e.g., because the required pressure increases), and completely limit the efficiency and / or feasibility of the applicable methods and cannot withstand the thermal limitations further discussed here. Here, devices and methods are disclosed that overcome these drawbacks and enable an improvement in power density while maintaining the efficiency of the entire system.

[0020] In some embodiments, a direct liquid cooling scheme is disclosed for higher efficiency and higher power operation of power electronics and power converters using novel mechanical designs, and for control of a system (e.g., operation within thermal limits in transient and steady states) enabling improved performance with respect to both operating efficiency and operating envelope. These features enable high power density for those systems. Further, relative to manufacturer limits and specifications, the devices and methods included herein effectively exceed their data sheet values for rated current and enable reduction of resistive losses for devices in operation. Further, the lifetime of such devices can benefit from suppression of degradation resulting from the results of thermal cycle testing. The need for such enhanced operation can be important for high output density power converters and devices, which have, in particular, high current load requirements, variable power requirements (e.g., wide load requirements such as traction applications with high peak loads and low partial loads), and / or high continuous operation conditions. The disclosed thermal management system is carefully designed and controlled to prevent both coolant thermal breakdown and system thermal breakdown.

[0021] In some embodiments, a thermal management system for a power electronics or power conversion device uses a cooling device in contact with the power electronics or power conversion device to provide a flow of fluid (a coolant, such as oil or automatic transmission fluid, etc.) that impinges on the operating device, which, for a given flow velocity of the fluid, allows the flow space of the fluid to be narrowed so that both the flow velocity of the fluid and the heat transfer coefficient (HTC) increase. In this way, this cooling device makes it possible to increase the surface area to volume ratio of the cooling region and use the fluid more effectively. Since the velocity is maintained relatively high, the residence time of the fluid remains relatively low. In this way, the absolute temperature rise of the coolant is also kept low, preventing thermal breakdown of the fluid. This temperature rise is often observed when attempting to bring the device into direct contact with the fluid via either spraying or flooding. Further, in some of the examples provided herein, the fluid may be directed to the top and / or bottom of the device being cooled, which is not typical of conventional cooling methods. Additionally, in some of the examples provided herein, the device ensures that the entire thermal isolation cross-section of the power electronics or power converter being cooled remains fully wetted by the coolant, maximizing thermal isolation.

[0022] Thermal management systems and methods for power electronics and power converters are disclosed, which can perform power switching and power conversion with improved power efficiency, improved power density, and / or reduced cost. In some of the embodiments described herein, the power electronics and power converters include thermal management systems and methods that use a non-conductive fluid, such as a non-conductive automotive transmission fluid (ATF), or other conductive dielectrics such as a liquid medium, and involve direct jet impingement cooling.

[0023] FIG. 1 shows a power converter system 100 according to some embodiments. The power converter system 100 includes an electronic controller 105, a first load / power source 110, a power converter 115, an LC filter 120, a contactor 125, a second power / load 130, a third power / load 135, one or more sensors 140, and a cooling system 155.

[0024] During operation, the electronic controller 105 generally controls the power switching elements of the power converter 115 using high-frequency control signals to perform power conversion (i) from the first load / power source 110 functioning as a power source to the second power / load 130 or the third power / load 135 functioning as a load (depending on the state of the contactor 125), or (ii) from the second power / load 130 or the third power / load 135 functioning as a power source (depending on the state of the contactor 125) to the first load / power source 110 functioning as a load. Thus, when the first load / power source 110 is functioning as the supply source of the power converter 115, the second supply source / load 130 (or the third supply source / load 135 depending on the state of the contactor 125) is functioning as the load of the power converter 115. Conversely, when the first load / supply source 110 is functioning as the load of the power converter 115, the second supply source / load 130 (or the third supply source / load 135 depending on the state of the contactor 125) is functioning as the supply source of the power converter 115.

[0025] The first load / power source 110 may be either a direct current (DC) load, a DC power source, or both a DC load and a DC power source (i.e., depending on the mode of the power converter 115, it functions as a DC power source in some examples and as a DC load in other examples). In some examples, the first load / power source 110 is a battery. The second power source / load 130 and the third power source / load 135 may be either a DC load, both a DC load and a DC power source, an AC load, an AC power source, or both an AC load and an AC power source (i.e., depending on the mode of the power converter 115, it functions as an AC power source in some examples and as an AC load in other examples). In some cases, the second power source / load 130 is an electric motor and the third power source / load 135 is an AC generator or an AC power supply grid. In some examples, both the second power source / load 130 and the third power source / load 135 are DC batteries. In some examples of the system 100, the second power source / load 130 is connected to the LC filter 120 that does not have the intermediate contactor 125, and the contactor 125 and the third power source / load 135 do not exist in the system 100.

[0026] The first load / power source 110 is coupled to the power converter 115 on the first side of the power converter 115, and the second power source / load 130 (or the third power source / load 135 depending on the state of the contactor 125) is coupled to the power converter 115 on the second side of the power converter 115. The first side may also be referred to as the input side or the output side of the power converter 115, depending on the mode of the power converter, or as the DC side of the power converter 115. The second side may also be referred to as the input side or the output side of the power converter, or as the DC side or the AC side of the power converter 115, depending on the mode of the power converter and the type of power of the second and / or third power source / load 130, 135. In some embodiments, the second side of the power converter 115 may be an AC side having a single-phase AC power source or an AC power source of another number of phases.

[0027] In one embodiment, the power converter 115 operates at a high DC voltage level. For example, in one operation, the DC side of the power converter 115 has a DC voltage of at least 200V, at least 600V, at least 800V, at least 1000V, at least 1200V, from 200V to 1200V, from 600V to 1200V, from 800V to 1200V, or another range of DC voltage (e.g., between the input terminals of the power converter 115). Such a high DC voltage level may be desirable in some cases, such as in certain types of electric vehicles. For example, some current electric vehicles (e.g., passenger cars and hybrid electric vehicles) operate at a DC bus voltage between about 200V and 400V. This DC bus voltage for passenger electric vehicles may increase in the future. Additionally, some current electric vehicles (e.g., class 4 - 8, off - road, or other larger electric vehicles) can operate at a DC bus voltage exceeding 1000V. However, a high DC voltage level can pose challenges to a typical power converter system, such as an increase in heat generation, an increase in the size of components and / or an increase in the cost to handle the increased heat generated during operation, and / or a limitation in operation due to thermal limitations of circuit components. The embodiments described herein provide improved cooling of the power converter system to mitigate or eliminate one or more of these issues, and ultimately provide a power converter system with reduced power density, reduced cost, and / or improved efficiency.

[0028] Sensor 140 includes, for example, one or more current sensors, one or more voltage sensors, and / or one or more temperature sensors. For example, sensor 140 includes respective current sensors and / or voltage sensors and can monitor the current and / or voltage of each phase of one or more of the first load / power supply 110, the second power supply / load 130, the third power supply / load 135, the LC filter 120, or the power converter 115. For example, if the LC filter 120 is a three-phase LC filter, sensor 140 can include at least three current sensors, with one sensing the current in each phase of the three-phase LC filter 120. In some embodiments, additional or fewer sensors 140 are included in system 100. For example, sensor 140 can also include one or more vibration sensors, temperature sensors, etc. In some examples, rather than directly sensing the characteristics, the controller 105 infers the characteristics (e.g., current or voltage) of the power converter 114. In some examples, one or more sensors 140 include one or more temperature sensors for sensing the temperature of system 100 or its components (e.g., power converter 115, electronic controller 105, and / or LC filter 120), and / or one or more temperature sensors for sensing the ambient air temperature within the environment of system 100 or its components (e.g., power converter 115, electronic controller 105, and / or LC filter 120). The temperature sensors can output an indication of the sensed temperature to the electronic controller 105, and this indication can be used as a basis for the electronic controller 105 to control the cooling system 155.

[0029] The electronic controller 105 includes an electronic processor 145 and a memory 150. The memory 150 includes one or more of a read-only memory (ROM), a random access memory (RAM), or other non-transitory computer-readable media. The electronic processor 145 is configured to receive instructions and data from the memory 150 and execute instructions, for example, to perform the functions of the controller 105 described herein. For example, the memory 150 includes control software. Generally, as will be described in more detail below, the electronic processor 145 executes the control software to monitor a system 100 that includes a power converter 115 (e.g., based on sensor data from one or more sensors 140), receive commands (e.g., via an input / output interface), and drive the power converter 115 (e.g., in accordance with the sensor data and / or commands). In some embodiments, instead of or in addition to executing software from the memory 150 to perform the functions of the controller 105 described herein, the electronic processor 145 includes one or more hardware circuit elements configured to perform some or all of this functionality.

[0030] The controller 105, the electronic processor 145, and the memory 150 are each illustrated as a single unit, but in some embodiments, one or more of these components are distributed components. For example, in one embodiment, the electronic processor 145 includes one or more microprocessors and / or hardware circuit elements. In some embodiments, the electronic controller 105, the electronic processor 145, and / or the memory are implemented as a microcontroller device, a field programmable gate array (FPGA), or an application specific integrated circuit (ASIC).

[0031] The cooling system 155 is communicable with the electronic controller 105 and controllable to provide cooling to components of the system 100, such as the power converter 115 (and its power switching elements) and / or the LC filter 120. In some examples, the electronic controller 105 controls the cooling system 155 based on the characteristics of the system 100, as further described below. For example, generally, the electronic controller 105 can increase the cooling effect of the cooling system 155 as the temperature of the system 100 rises, and decrease the cooling effect of the cooling system 155 as the temperature of the system 100 falls. In some examples, to control the cooling system 155 based on temperature as described above, the electronic controller 105 determines the temperature of the system 100 (or its components) based on sensor data received from one or more of the one or more sensors 140 (e.g., a temperature sensor or a current sensor where current may be proportional to temperature), or based on an inference from the behavior of the system 100 when operating (e.g., a higher switching frequency may be inferred to indicate a higher temperature and vice versa). In some embodiments, as further detailed below, the cooling system 155 can include a liquid coolant that directly jet impinges on the components of the system 100 to be cooled.

[0032] FIG. 2 shows a power conversion circuit 200 according to some embodiments. The circuit 200 includes a power converter 205, an LC filter 210, an AC grid 215, and a DC battery 220. The power conversion circuit 200 provides a circuit topology that can be used in some examples of the power converter 100. For example, the power converter 205 is an embodiment of the power converter 115 in FIG. 1 and includes six MOSFETs (M1 to M6) as power electronics (also called power switching elements). During operation, an electronic controller (e.g., the electronic controller 105 in FIG. 1) supplies a switching control signal to each of the power switching elements of the power converter 205. The switching control signal may be a pulse width modulation (PWM) control signal having a frequency and duty cycle test set by the electronic controller to control the power conversion of the power converter 205. The electronic controller may generate the switching control signal based on sensor data received from one or more sensors 140 (e.g., based on current and / or voltage measurements) using, for example, known control techniques.

[0033] In addition, the LC filter 210 is an example of the LC filter 120, the AC grid 215 is an example of the first load / power source 110, and the AC battery 220 is an example of the second power source / load 130. In this example, the third power source / load 135 and the contactor 125 are not included, but in some embodiments, these elements are included in the circuit 200. Cooling systems and controllers such as the cooling system 155 and the controller 105 in FIG. 1 are not shown in FIG. 2 but may be provided with respect to the system 100 in FIG. 1 and exist as provided throughout the present disclosure. FIG. 2 provides one particular arrangement of these components, but in other examples, the power converter 205 may include a different converter topology, a different number of power electronics, and / or different types of power electronics or semiconductors (e.g., IGBT, GaN, etc.).

[0034] FIG. 3 shows a liquid cooling system 300 according to some embodiments. The liquid cooling system 300 is an example of a cooling system that can be used with the system 100 of FIG. 1 (i.e., functioning as the cooling system 155) and the circuit 200 of FIG. 2. The liquid cooling device 300 includes a coolant pump 305, a coolant manifold 310, a cooling jacket 315 (also referred to as a coolant jacket 315), and a sump 320. The cooling system 300 can also be referred to as a thermal management system 300.

[0035] The coolant pump 305 is configured to pump coolant liquid through the coolant manifold 310 and ultimately through the cooling jacket 315. The sump 320 provides a return path for the liquid coolant that collects the liquid coolant sent by the pump after flowing through the cooling jacket 315 and returns it to the coolant pump 305. In some embodiments, the coolant manifold 310 is not provided, and the coolant pump 305 pumps the liquid coolant directly into the cooling jacket 315. In some examples, a single cooling jacket 315 may be provided for an entire printed circuit board (e.g., see FIGS. 6A - B) or for one or more components on a circuit board. In other examples, the system can include multiple cooling jackets 315 to cool respective components on the same printed circuit board or on both sides of the printed circuit board. For example, each cooling jacket 315 can be associated with one or more circuit elements on a circuit board that are cooled by direct jet impingement of the liquid coolant (e.g., see FIGS. 4A - 4C). In any case, the liquid coolant may be a non - conductive liquid coolant such as a non - conductive automotive transmission fluid (ATF).

[0036] The coolant pump 305 may be controlled by a controller such as controller 105 (e.g., to start pumping, stop pumping, and / or pump at a desired or set rate). In some examples, when the cooling system 300 of FIG. 3 is used in the system 100 as the cooling system 155 (see FIG. 1), the electronic controller 105 controls the cooling system 300. More specifically, the sensed temperature of the system 100 or its components, the ambient temperature sensed in the environment of the system 100 or its components, the current input level, the current output level, the voltage input level, the voltage output level, the power input level, the power output level, the switching frequency of the power converter 115, and / or the duty cycle of the control signal of the power converter 115, etc., the characteristics of the system 100 (e.g., sensed by one or more sensors 140) are used to control the coolant pump 305. Generally, when the controller 105 determines that the characteristics of the system 100 indicate an actual or likely increase in the temperature of the system 100 (or its components), the controller 105 can proportionally enhance the cooling operation (or the heat dissipation provided) of the cooling system 300. Conversely, when the controller 105 determines that the characteristics of the system 100 indicate an actual or possible decrease in the temperature of the system 100 (or its components), the controller 105 can proportionally reduce the cooling operation of the cooling system 300 (or the heat dissipation provided thereby).

[0037] To enhance the cooling effect of the cooling system 300, the controller 105 can supply a control signal (also called a command signal) to the coolant pump 305 to increase the pump speed of the coolant pump 305, and thus the coolant flow rate through the cooling system 300. Similarly, to reduce the cooling operation, the controller 105 can supply a control signal to the coolant pump 305 to decrease the pumping speed of the coolant pump 305, and thus the coolant flow rate through the cooling system 300.

[0038] The thermal management systems and methods provided herein can be used at the system level or at the local module or device level.

[0039] In some embodiments of the thermal management systems and methods provided at the local device level, the systems and methods have the advantage of locally maximizing heat transfer at the location of the fluid jet impingement. Thus, these systems and methods can directly cool each heat-rejecting component through the device and its operation. The heat-rejecting surfaces of components such as FETs, diodes, resistors, etc. are the targets of the cooling capacity. The surface of the thermal management device can maintain high bulk velocities across the entire heat-rejecting surface and ensure that the entire device remains fully wetted during cooling. The injection point may be placed directly above the junction to maximize the cooling efficiency. Further, by locally pressurizing the fluid, the coolant can be evenly pushed into all available spaces. That is, the coolant fluid has no tendency to bypass the heat-rejecting components.

[0040] Figures 4A - 4C illustrate a thermal management system for a power device, and more particularly, a direct jet impingement system 400. System 400 includes, on a printed circuit board (PCB) 410 (see Figure 4A), two neighboring or adjacent heat dissipating electronic components 405 (e.g., FETs), and a shared cooling jacket 415 (see Figure 4B). System 400 can be used in conjunction with cooling system 300 (and thus system 100). For example, cooling jacket 415 is an example of one of the plurality of cooling jackets 315 of Figure 3. In some embodiments, system 300 of Figure 3 can implement each cooling jacket 315 as one of the plurality of cooling jackets 415, and thus provide a cooling system with a set of cooling jackets 415 that cool respective components 405 with a liquid coolant pressurized via direct jet impingement. That is, cooling system 400 directs liquid directly onto two neighboring heat dissipating components 405 (e.g., FETs) through an opening in cooling jacket 415. In some embodiments, cooling jacket 415 fits snugly around electronic component 405, and the inlet is thus positioned a short or tight distance from the surface to be cooled. As used herein, a "tight" clearance, fit, or distance refers to a distance (or space between components) of less than about 1 millimeter (mm), less than 0.75 mm, less than 0.5 mm, less than 0.3 mm, 0.2 - 1 mm, 0.2 - 0.75 mm, 0.2 - 0.5 mm, about 0.25 mm, about 0.5 mm, about 0.75 mm, or about 1 mm. The specific distance for a tight clearance or fit can vary depending on the desired thermal conductivity to block a target amount of heat and the available flow rate and backpressure limitations for a given design. The outlet around the device is restricted to ensure that the flow on the target surface is maintained such that the cavity of the cooling device remains in contact with the liquid and is fully wetted with a high local velocity of the fluid.

[0041] The printed circuit board 410 includes a first surface 418 on which the electronic component 405 is mounted. The electronic component 405 includes a mounting surface (see surface 450 in FIG. 4D) to which the electronic component 405 is attached to the first surface 418 of the printed circuit board 410. The electronic component 405 further includes an outer surface 420 opposite to the mounting surface.

[0042] System 400 has the advantage of a local maximum of heat transfer at the jet impingement location by cooling individual heat dissipating components through the direct jet impingement of a liquid coolant through a local cooling jacket 415. Referring to FIGS. 4B and 4D, the cooling jacket 415 includes a body portion 422 that covers the outer surface of the electronic component 405, injection inlets 425 formed in the body portion, and an overhang portion 426. As shown, the cooling jacket 415 may have a curved transition from the body portion 422 to the overhang portion 426. The injection inlets 425, also referred to as fluid input connectors, are configured to receive the flow of the liquid coolant. As shown, the injection inlets 425 may generally be cylindrical. The injection inlets 425 include a fluid channel or path 428 that connects to the heat generating component to be cooled to an external coolant source flow (e.g., provided by piping connected to a manifold or pump). That is, the liquid coolant is flowed through the fluid channel or path of the injection inlets 425 to provide its direct jet impingement and is output from the fluid channel or path 428 toward the heat generating component 405. In some examples, the channel or path 428 of the injection inlets 425 through the jacket 415 is approximately equal to about 10 times the diameter of the inlet. In some examples, the channel or path 428 can match the diameter of the injection inlets 425 to fit snugly and has a diameter that is substantially smaller (e.g., 3 times, 4 times, 5 times, or more smaller) than the diameter of the supply pipe that provides the liquid coolant to the cooling jacket 415. In other words, the cross-sectional area of the channel or path 428 is smaller than the cross-sectional area of the supply pipe, where the cross-sectional area refers to the surface area of a virtual two-dimensional plane perpendicular to the flow of the coolant fluid. Thus, the channel or path 428 narrows the fluid flow space such that the fluid flow velocity through the channel 428 increases (relative to the velocity of the fluid through the supply pipe), and ultimately, the heat transfer coefficient (HTC) provided by the coolant fluid is higher than the heat transfer coefficient that would occur otherwise without the increase in velocity.The inlet 425 and / or its fluid channel is arranged or aligned to target the heat dissipation cross-section of component 405 (e.g., FET, diode, or resistor) for jet impingement. As shown, the impingement surface is jacketed (by jacket 415), maintaining a high bulk velocity across the entire heat dissipation cross-section and ensuring that the entire surface remains fully wetted. The injection point may be placed directly above the junction to maximize cooling efficiency.

[0043] Figure 4C shows the resulting coolant flow volume 430 surrounding the heat-generating component 405 due to direct jet impingement through jacket 415. As shown with respect to the cooling system 300 of FIG. 3, after the liquid coolant circulates through the cooling jacket 415, the coolant is drawn up (e.g., via sump 320 of FIG. 3) and returned to a pump (e.g., pump 305 of FIG. 3) for future circulation through the cooling jacket 415. For example, the fluid exits (e.g., through one or more openings between the jacket 415 and the surface of the printed circuit board 410) and accumulates at the periphery of one or more components being cooled. This path also provides a secondary benefit by locally cooling a portion of the PCB near the heat-generating component being cooled.

[0044] Figures 4D and 4E provide an example of a general coolant flow path 435 through the jacket 415, onto the surface of the FET 405, and out of the jacket 415 through the opening 440 of the overhang portion 426 of the jacket 415 along the surface of the printed circuit board 410. The overhang portion 426 of the jacket 415 is an overhang on the side of the electronic component 405, coupled to the first surface of the printed circuit board 410 and including legs 438 that partially define the opening 440 (see FIG. 4E). Although the examples of FIGS. 4A - 4C illustrate two electronic components 405, in some examples, the system 400 includes one electronic component 405 or more than two electronic components 405. That is, in some examples, the jacket 415 jackets one electronic component 405, and in other examples, the jacket 415 jackets more than two electronic components 405.

[0045] As described above, the cooling device presented in this specification can restrict the flow of fluid so as to provide a device (e.g., FET 405) that is fully wetted during cooling. In contrast, for the form of jet or spray, due to the open direct-impingement coolant flow, the fluid velocity for a given flow rate is lower, and the heat transfer cross-section does not remain fully wetted, resulting in a decrease in heat transfer. This is in contrast to traditional designs that rely on higher flow rates, as proposed in some embodiments of this specification, which limit the flow volume for a given flow rate using a cooling jacket 415.

[0046] Furthermore, when the coolant is freely injected into the device or the atomized coolant is sprayed onto the device, under such operations, the heat transfer coefficient (HTC) is inferior to that of the embodiments disclosed in this specification. For example, the heat transfer coefficient (HTC) obtained from such injection or spraying may not be high enough for the heat insulation required to maximize the output density and efficiency of the system. For example, in this study, the heat transfer coefficient (HTC) required to block 60 W / FET was over 3000 W / m 2 / K. To approach this heat transfer coefficient (HTC), simple spray cooling or direct impingement is not sufficient at a reasonable flow rate for the system (e.g., 10 liters per minute for the entire system in this example) to prevent excessive pumping loss and pressure.

[0047] As described above, since the flow rate cannot increase dramatically in a real-world system, in the embodiments of the cooling system and method described herein, as a result of reducing the cross-sectional area of the coolant flow, the coolant velocity locally increases around the device itself while maintaining the device fully wetted. This is particularly useful in cases where the limited flow rate is not turbulent and the system is limited to laminar heat transfer, such as in viscous fluids like oil or automotive transmission fluid where heat management is not very effective. The flow rate required for such fluids to become turbulent becomes very large again, causing problems with system efficiency and generating abnormal backpressure. However, in the embodiments of the cooling device and method described herein, the constrained flow of the fluid allows for creating a quasi-tortuous path that directs the flow around the corners of the device, along with the limited flow rate. This provides a locally increased heat transfer coefficient (HTC) at the cooling site while maintaining a reasonable system flow rate and backpressure. Further advantages are achieved by directing the coolant flow around each face of the device during cooling and by applying (and cooling) the fluid to the printed circuit boards (PCBs) having heat and copper patterns.

[0048] FIG. 5 shows an example of heat transfer for system 400 with the jacketed direct jet impingement liquid cooling described above.

[0049] Cooling according to each embodiment of the cooling system and method described herein allows power electronics devices to exceed their rated current by more intensively utilizing a given volumetric flow rate of coolant, resulting in a more cooled operating device. Such cooling also reduces ohmic losses and increases efficiency.

[0050] Furthermore, the thermal resistance of the junction-case or junction-mounting portion of a power electronics device represents a substantial overhead for cooling the electronic component, although in some instances, a case-less junction may be used. In an example of a case-less junction, the power electronics device is directly sintered onto a high thermal conductivity substrate such as alumina or silicon nitride, and then can be liquid cooled on its opposite face by any of the techniques discussed herein (e.g., direct jet impingement cooling or jacket liquid cooling), resulting in a lower (and in some cases, dramatically lower) junction-coolant thermal resistance. For example, in some embodiments of system 400, FET 405 is sintered directly onto a high thermal conductivity substrate such as alumina or silicon nitride. The cooling jacket 415 is then positioned on the opposite side of the printed circuit board 410 as FET 405, and the coolant fluid is output as a stream or jet directly onto the substrate (beneath or on the mounting side of FET 405) by the jacket.

[0051] In some examples, a thermal energy management process using the cooling jacket 415, or a variation thereof, is provided. The process can include receiving a coolant fluid at an inlet 425 formed in the body portion 422. As described above, the coolant fluid can be provided by a tube coupled to the inlet 425. A pump or reservoir controlled by a controller may control the flow of the coolant fluid through the piping to the inlet 425 (see, e.g., FIG. 11 and the related description below).

[0052] The process then orients a jet of the coolant fluid toward the outer surface of the electronic component 405 (see, e.g., the fluid along path 435 in FIG. 4D) by a channel 428 coupled to the inlet 425.

[0053] This process then discharges coolant fluid from the cooling jacket through one or more openings 440 within the overhang portion 426 of the cooling jacket 415 (see, e.g., the fluid along path 435 in FIG. 4D and openings 440 in FIG. 4E).

[0054] In some examples, as described above, a heatsink is coupled to the outer surface of the electronic component 405 (e.g., the top surface of the electronic component 405 in FIG. 4D). Thus, in these cases, the jets of coolant fluid impinge on the surface of the heatsink. In other examples, no heatsink is provided. In such cases, jets of coolant fluid directed by channels impinge on the surface of the electronic component 405.

[0055] Similar to the local device designs described above, an entire system can utilize the advantages of the thermal management systems and methods disclosed herein.

[0056] For example, FIG. 6A shows a power converter system 600 with liquid cooling that can be used in the system 100 in some examples. The system 600 includes a PCB 605 having a first surface 606 on which electronic components including twelve FETs 610 and three inductors 615 are mounted. For simplicity of the figure, three of the twelve FETs 610 are labeled. Referring to the system 100 of FIG. 1, the FETs 610 can form the power converter 115 in FIG. 1, and the inductors 615 may be part of the LC filter 120 of FIG. 1. The electronic components each have a mounting surface and an outer surface 608 opposite the mounting surface, and the electronic components may be mounted on the first surface 606 of the PCB 605 through their respective mounting surfaces. Further, the first surface 606 of the PCB 605 and the outer surfaces 608 of the plurality of electronic components can form three-dimensional substrate surface profiles of various heights.

[0057] In the system 600 of FIG. 6A, the power conversion formed by the FET 610 and / or the inductor 615 can be encapsulated within a cooling device that directs fluid across the power conversion. The cooling device may be injection molded or a 3D printed rigid plastic jacket or shell (see jacket 635 in FIG. 6B) that creates a fitting close clearance near the substrate 605 and electronic components (e.g., FET 610 and inductor 615) through which an electrically non-conductive liquid coolant (e.g., oil or a transmission fluid) is pumped to remove heat (i.e., cool the power converter). As used herein, a “tight” clearance, fit, or distance is a distance (or space between components) of less than about 1 millimeter (mm), less than 0.75 mm, less than 0.5 mm, less than 0.3 mm, 0.2 - 1 mm, 0.2 - 0.75 mm, 0.2 - 0.5 mm, about 0.25 mm, about 0.5 mm, about 0.75 mm, or about 1 mm. The specific spacing of the close gap or fit can vary depending on the desired heat transfer rate to remove the target amount of heat and the available flow rate and backpressure limitations for a given design. Further, the jacket may create a clearance distance between its inner surface and various electronic components that may vary from component to component or be substantially the same for all electronic components. Further, the gap distance between the inner surface and the PCB surface may be different from or substantially the same as the gap between the inner surface of the jacket and the electronic components. In some examples, the entire inner surface of the jacket, or a majority (e.g., 50% or more, 60% or more, 70% or more, 80% or more, 90% or more) of the inner surface of the jacket may be tightly fitted to the PCB 605 and its electronic components.

[0058] Accordingly, the cooling jacket 635 includes an inner surface having surface characteristics that mimic (i.e., generally follow, track, or accommodate) the substrate surface characteristics provided by the first surface of the PCB 605 and the outer surfaces of the plurality of electronic components. The jacket 635 may be an example of the jacket 315 of FIG. 3. Similar to other embodiments included herein, a tight gap maintains a high bulk velocity with respect to the heat dissipation surface and results in a high heat transfer rate for a given flow velocity. Additionally, with a tight clearance, rather than having a tendency to bypass all available paths, specifically other cooling systems having a flow that breaks away into the water, the pressurized viscous coolant can be ensured to flow over the heat dissipating components. The improved flow of this embodiment occurs, for example, because the resistance to flow through bypass components is not significantly lower than the resistance to flow over them.

[0059] In FIG. 6A, the jacketed coolant volume 620 is shown as a thin layer that covers half of the substrate 605 and its electronic components (there is coolant volume 620 on both the upper and lower sides). It is shown for illustrative purposes to cover half of the substrate 605, but the volume 620 may extend over the entire substrate 605. FIG. 6B shows an example of a general coolant flow path 630 that provides a jacketed coolant volume 620 between a portion of the device 600, the outer casing 635, the surface of the PCB 605, and the electronic components 640 (representing, for example, the FET 610 and the inductor 615). The coolant flow path 630 enters from the left of the figure at the inlet 645 and exits to the right at the outlet 650. Thus, the substrate surface shape and the inner surface of the coolant jacket can form or define a coolant agent fluid path volume 655 through which the coolant agent fluid can flow along the flow path 630. As shown, the coolant fluid path volume can include the inlet 645 at the first end of the cooling jacket 635 and the outlet 650 at the second end of the cooling jacket 635, such that the coolant fluid received at the inlet passes over a plurality of electronic components before being discharged at the outlet. In some examples, the inlet 645 has a cross-sectional area that is substantially smaller (e.g., 3 times, 4 times, 5 times, or more smaller) than the cross-sectional area of the supply pipe that supplies liquid coolant to the cooling jacket 415. Here, the cross-sectional area refers to the surface area of a virtual two-dimensional plane perpendicular to the flow of the coolant fluid. Thus, the inlet 645 narrows the fluid flow space such that the fluid flow velocity through the coolant fluid flow path 630 increases (relative to the velocity of the fluid through the supply pipe), and ultimately, the heat transfer coefficient (HTC) provided by the coolant fluid to the components 640 and the PCB 605 is higher than would occur without the velocity increase.

[0060] The diagram of FIG. 6B shows jacket 635 that is only on the upper side of PCB 605. In some examples, as shown in FIG. 6C, jacket 635 is formed by a 3D printed "clam shell" that sandwiches the substrate and its components with a tight clearance, through which pressurized coolant is pumped. That is, jacket 635 may be replicated on the opposite (bottom) side of PCB 605 (similar to bottom side jacket 660), and as a result, in these examples, heat insulation (cooling) is possible on both sides of the substrate, i.e., the top and the bottom. The bottom side jacket forms additional (bottom side) flow paths 665. Although not shown in FIG. 6C, in some embodiments, additional electronic components are also mounted on the bottom surface of the PCB. Bottom side jacket 660 may similarly have a tight clearance with respect to the bottom surface and any electronic components thereon.

[0061] FIG. 6D shows a system 600 having an example of a jacket 635 that provides a jacketed coolant volume 620, coolant flow paths 630, and coolant flow paths 665. FIG. 6E shows a cutaway view of system 600 of FIG. 6D. Jacket 635 includes an inlet 670 aligned with an opening 675 within PCB 605. Coolant fluid enters through inlet 670, and a portion of the fluid passes over the top surface of PCB 605 (similar to coolant flow path 630 for example), and a portion of the fluid passes under the bottom surface of PCB 605 (similar to coolant flow path 665). The coolant fluid flows across components 610, 615 to provide cooling, and then exits through an opening (not shown) that is formally similar to inlet 670 but is located, for example, at the distal end of jacket 635 (opposite the inlet 665) and, in some examples, is located on the underside of PCB 605 and at the bottom of jacket 635. In some examples, similar to the description of FIG. 6B, opening 675 and the bottom of jacket 635 are not provided.

[0062] Generally, the coolant flow should be maintained to be stable for a given system such as system 600.

[0063] FIG. 7A shows an example of thermal isolation or heat transfer from the PCB 605, the FET 610, and the inductor 615, which results from jacketed liquid cooling injected from the left side as shown in FIGS. 6A and 6B.

[0064] To vary the results of thermal management, the orientation of the geometry can be varied within the context of the cooling device. For example, in the system of FIG. 7A, the gate array within a single double-wide file upstream of the central inductor has two potentially detrimental effects. The first is that the heat generated by 60W of power from the twelve FETs 610 is picked up by the central streamline of the cooling and will match the central inductor 615 to a warmer coolant than the other two inductors 615. The second is that the coolant passes through the entire length of the substrate through a 1mm jacket and experiences a substantial pressure drop.

[0065] Substantial improvements may be seen with reorientation of the system. For example, by rotating the array of FETs 610 by 90° and shortening the distance of the substrate through which the coolant fluid flows, the pressure drop experienced and the temperature of the inductor components can be reduced. FIG. 7B shows an example of this reoriented system 700 and its corresponding heat transfer profile. This reoriented system 700 includes the FETs 610 and inductors 615 rearranged on the PCB 605, but is otherwise similar to the system 600 of FIGS. 6A-6B and FIG. 7A (i.e., having a jacket (not shown)). Thus, in FIG. 7B, the PCB, which is generally rectangular in shape, has a length and a width, and the length is greater than the width. The jacket has one or more inlets and one or more outlets on both sides of the width of the PCB, and thus the coolant fluid flows from the inlet to the outlet in a direction along the width of the PCB, which is a shorter distance than when the coolant fluid flows from the inlet to the outlet along the length of the PCB (shown in FIG. 7A). As shown in the example of FIG. 7B, the peak temperature of the FETs 610 decreased by 0.8°C.

[0066] Figure 7C shows a graph plotting pressure drop versus flow rate for two orientations. Notably, the static drop for the rotated orientation (system 700 of FIG. 7B) is 60% lower than that for the original orientation (system 600 of FIG. 7A). The linearity of the loss curve indicates that the losses are dominated by viscous forces rather than inertial forces, and thus, limiting the total stream length through the cooling jacket is advantageous for the losses for a given flow rate and design.

[0067] In some examples of the systems described above, rather than directly liquid-cooling the thermal isolation surface of a given component such that the surface area available for thermal isolation is limited, the component can be coupled (e.g., soldered or mechanically clamped) to a high thermal conductivity heat sink, which itself is directly liquid-cooled. The heat sink can be a traditional finned or pinned heat sink, or a high conductivity material used either simply for the inverter substrate itself or as a local wafer on which the component is mounted, and the opposite side (i.e., opposite the side on which the heat dissipating component is mounted) can be cooled by jacketed or jet impingement liquid cooling or combinations thereof.

[0068] For example, FIG. 8A shows a system 800 having a device (e.g., FET 610) during cooling that can be soldered or mechanically clamped to an aluminum plate 805. More specifically, in a particular example, a first set of six FETs 610 is coupled to a first plate 805, and a second set of six FETs 610 obtained by mirroring the first set of six FETs 610 is coupled to a second plate 805. The design of the plate 805 requires a large surface area relative to the mass (typically requiring a finned or pinned structure), and thus can be significantly different from conventional heat sink designs that increase volume (thereby reducing power density). In a particular example of system 800, the plate 805 limits the extra volume, is relatively thin (only 1.5 mm thick), and is disposed in contact with the upper surfaces of a plurality of FETs 610. The outer boundary of the plate 805 coincides with the outer boundary box of the plurality of FETs 610 (i.e., there is no overhang of the plate beyond the gate).

[0069] This example in FIG. 8A demonstrates that a heat spreader having a simple mechanical configuration such as the plate 805 can result in a substantial improvement (i.e., reduction) in the temperature of power electronics or gates (e.g., FET 610). As shown in FIG. 8B, the maximum temperature rise within the gate decreased by 4 - 6 °C depending on the flow rate. The improvement is greater at low flow rates. At only 2.55 LPM, the peak temperature rise of the gate decreased from 18.8 °C without a spreader to 13.2 °C, with an improvement of 5.6 °C without adding much thermal mass or volume space.

[0070] In other embodiments, the overhang of the plate 805 can be used to create a second coolant channel between the upper surface of the substrate and the lower surface of the overhang of the plate 805. For example, in FIG. 8C, the system 820 is provided with a plate 825 having an overhang 830 that provides a second cooling channel 835. FIG. 8D provides a cutaway view of the system 820 of FIG. 8C, which more clearly shows the second cooling channel 835, as well as the central cooling channel 840 (which is also present in the system 800 of FIG. 8A). The system 820 and the plate 825 are similar to the system 800 and the plate 805 (including having six FETs 610 and three inductors 615) except for the overhang 830 and the resulting second coolant channel 835. These second channels 835 can be used to achieve cryogenic cooling (enhanced cooling effect) by increasing the cooling surface area, providing further interaction with the fluid, and the convective acceleration of the fluid within the system. This second channel can also create a subsystem within the system. This subsystem may be a thermal management system embedded within a primary thermal management system where the fluid is directly managed, thereby imposing discrete velocities. Such velocities may be actively controlled by a pump in some embodiments, or passively controlled by the device itself, for example, in other embodiments. Additionally, there may be local and global velocities predicted in the device layout. Further, this enables maintaining active cooling on both sides of the heat spreader, in contrast to conventional heat sinks that are typically limited to passive or active cooling on one side. The local flow rate velocity required for a given thermal barrier (e.g., determined by operating conditions, duration, trajectory, or direct feedback from sensors) can be estimated by a controller 105 that maintains a global flow rate enabling such local operation. Such an estimation can be performed offline (e.g., using a look-up table, etc.) or online (e.g., solved in real time) through either a proportional-integral-derivative type controller or a model predictive type controller.

[0071] In other embodiments, the heat sink may include a flared inlet collector and / or a side skirt. For example, in FIGS. 8E - 8H, the system 850 includes a plate 855 having a flared inlet collector 860 and a side skirt 865, resulting in a second cooling channel 870. FIG. 8F provides a cutaway view of the system 850 of FIG. 8E, FIG. 8G provides a partial cross - sectional view of the system 850 of FIG. 8E along its length, and FIG. 8H provides another cutaway view of the system 850 of FIG. 8E. The system 850 and the plate 855 are similar to the system 800 and the plate 805 (which also includes having six FETs 610 and three inductors 615) except for the flared inlet collector 860, the side skirt 865, and the second cooling channel 870. The flared inlet collector 860 can direct the coolant fluid passing over the PCB 605 into the second channel 870. Further, since the flow path of the second channel 870 is narrower compared to the opening of the flared inlet collector 860, the velocity of the coolant fluid increases within the channel 870, which can improve heat transfer.

[0072] In some embodiments, the heat spreaders 805, 825, and / or 855 of FIGS. 8A and 8C take on another form, such as having a finned structure or a pinned structure, respectively.

[0073] In some examples of the above - described systems with an integrated heat sink, the heat sink can be further mechanically clamped to a Thermal - Electric Cooler (TEC) and then liquid - cooled (e.g., in a manner similar to how the heat - generating components or their associated heat sinks are liquid - cooled as described above). In some examples, the TEC can reach a ΔT that is up to 60 °C lower than the ambient temperature, which can further enhance the cooling capacity.

[0074] For the devices and methods discussed herein, the flow can be described as being local to a particular region of the device or global across the system or a subsystem thereof. For example, in embodiments having local and global flows, the heat spreader of FIG. 8A, modified to include an overhang portion, was described above. In another embodiment with local and global flows, it may be described in the context of a gapped PCB structure. This gapped PCB substrate structure can be used to implement a multilevel inverter or another power converter such as an inductor. In certain embodiments such as an inductor, this design configuration is counterintuitive to conventional designs that maximize the copper fill to minimize resistive losses. However, embodiments considered herein, such as using a gapped coil or PCB, may sacrifice copper for thermal management capabilities (e.g., fluid between levels of conductors), which can provide advantages in terms of both packaging (e.g., size) and performance (e.g., efficiency) constraints. Further, the gapped PCB structure enables the use of smaller optimized inductors for specific low-power regions while maintaining the ability for higher power operation under a given thermal headroom burdened by the thermal management system. This is contrary to conventional designs that are sized based on peak operational constraints.

[0075] In some examples, also referred to as a gapped PCB inductor, a gapped PCB structure is provided that includes multiple stacked PCBs having multiple turns (i.e., coil turns positioned or embedded as corresponding PCB traces). The gapped PCB inductor includes a gap between each of the PCBs of the stacked structure, providing a coolant flow path between the PCBs. These flow paths enable direct cooling of both sides of the PCB.

[0076] FIG. 9A shows a portion of a printed circuit board (PCB) 900 that includes three gapped PCB inductors 905. Except for the inductors 905, the PCB 900 may be similar to the PCB 605 and have components similar to those of the PCB 605 (e.g., components 610) and be used within a power converter system (e.g., system 100) in a manner similar to the PCB 605, including. The gapped PCB inductor 905 is illustrated as having a configuration that includes a coil portion including three PCBs 910 each having at least one turn, and a core portion 915. The core portion 915 includes two parts or halves that can sandwich the PCBs 910 on both sides of the PCBs 910. In FIG. 9A, the first part (upper half) of the core portion 915 is illustrated. On the lower surface of the substrate, a second part (lower half) of the core portion 915 having a shape similar to the first part is provided. In some examples, the core portion 915 includes a center leg that extends through a plurality of coil turns (e.g., each). In other examples, the core portion 915 does not include a center leg, and the coil turns have an air core (ignoring any PCB material that may be present within the radius of the coil turns).

[0077] In some of these examples, each gapped PCB inductor 905 or a plurality of gapped PCB inductors 905 are disposed within a duct or jacket such that a coolant fluid is compressed between all of the PCBs of the one or more gapped PCB inductors 905. The duct or jacket fits tightly around the gapped PCB inductor 905 and is similar to the plurality of jackets (e.g., jackets 315, 635, 415, 660, etc.) described herein and / or the jacket 966 of FIG. 9D, the jacket 972 of FIGS. 9F - 9H, or the jacket 980 of FIGS. 9I - 9K described hereinafter. Thus, as illustrated in FIG. 9A, a jacketed coolant volume 920 similar to the jacketed coolant volume 620 of FIG. 6 provides coolant that flows across the electrical components on the PCB 900.

[0078] Figures 9B through 9C illustrate an inductor 950, which is another example of inductor 615. Inductor 950 includes a copper coil or winding 952 wound around a central ferrite core portion 954 and within an outer core portion 956. Inductor 950 is, for example, a "PQ" style inductor having a Litz style winding. In other examples, inductor 950 is a different type of inductor and / or includes a non-Litz style copper winding.

[0079] In addition, inductor 950 includes a window 958 defined by the core and exposing winding 952. Inductor 950 further includes terminals 960 at opposite ends of winding 952. As described with respect to FIG. 9D, window 958 includes an inlet 962 and an outlet 964 through which coolant fluid flows.

[0080] FIG. 9D illustrates a boot 966 that jackets inductor 950. Boot 966 includes a coolant outlet 968 and a coolant outlet 970. Boot 966 directs the flow of coolant fluid 971 through inductor 950 to cool inductor 950. More specifically, during operation, a supply of coolant fluid that enters through window inlet 960 of inductor 950, passes across winding 952, exits through window outlet 964, and then through coolant outlet 970 is provided to coolant inlet 968 (e.g., via a tube). For example, boot 966 can abut outer core portion 956 such that coolant fluid is forced through window 958 of inductor 950. In some examples, the boot is sized slightly larger to provide a gap between boot 966 and the outer surface of outer core portion 956. In such examples, the coolant fluid can also flow around, over, and / or under inductor 950 to provide additional surface area in contact with the coolant fluid and enhance heat transfer through the coolant fluid.

[0081] FIG. 9E shows a fluid velocity diagram for an example of boot 966 and inductor 950 of FIG. 9D.

[0082] Figure 9F shows an exploded view of a clam shell boot 972, which is an example of the boot 966 in Figure 9D, and an inductor 973, which is an example of the inductor 950. The inductor 973 has components similar to those of the inductor 950 with similar labels, except that the core of the inductor 973 is separated into a top 956a and a bottom 956b. The clam shell boot 972 includes a top 972a and a bottom 972b. Figures 9G and 9H show the clam shell boot 972 with the top 972a and the bottom 972b joined or adhered to each other, and Figure 9H shows the boot 972 partially transparent. The clam shell parts 972a, 972b may be adhered to each other via ultrasonic welding, adhesives, or other techniques. In some examples, the top 972b and the bottom 972b have approximately the same height and can be referred to as halves. In other examples, the height varies for these parts. The clam shell boot 972 can further include a lead port 974 through which the lead 960 of the inductor 970 can pass. As shown in the figure, the lead port 974 is formed at the interface of the top 972a and the bottom 972b of the clam shell boot 972. In addition, the inductor lead 960 can be sealed to the boot 972 by welding. The clam shell boot 972 further includes a fluid inlet 976 (an example of the inlet 968 in Figure 9D) at the top 956a and a fluid outlet (an example of the outlet 970, with a shape similar to that of the fluid inlet 976) at the bottom 956b on the opposite side of the clam shell boot 972 (i.e., the back side not shown). Thus, the fluid inlet 976 is at the upper center of the boot 972 above the lead port 974, while the fluid outlet is at the lower half of the back side, thereby enabling the coolant fluid 971 (see Figure 9D) to be forced to cross the inductor 973 both from top to bottom and from front to back.

[0083] As described previously, FIG. 9I shows an exploded view of a substrate seal boot 980, which is another example of the boot 966 in FIG. 9D with an inductor 973 that is an example of the inductor 950 in FIG. 9D. The substrate seal boot 980 can be formed as an integral part or a single part and can seal the printed circuit board 982 on which the inductor 973 is mounted. FIGS. 9J and 9K show the substrate seal boot 980 sealing against the PCB 982, and FIG. 9K shows the boot 980 being partially transparent. The PCB 982 may be an example or part of the aforementioned PCB 605 or PCB 900. The inductor lead 960 is connected to a trace within the PCB 982 and avoids an opening that passes the lead 960 from the boot 980. The boot 980 further includes a fluid inlet 986 (an example of the inlet 968 in FIG. 9D) at or near the upper and front portion of the boot 980, and a fluid outlet (an example of the outlet 970, which is formally similar to the fluid inlet 976) at or near the bottom and opposite side (i.e., the back side not shown) of the boot 980. Thus, the fluid inlet 986 may be at the center of the upper portion of the boot 980, and the fluid outlet may be at the lower half of the back side, thereby enabling the coolant fluid 971 (see FIG. 9D) to be forced to cross the inductor 973 both from top to bottom and from front to back. In some examples, one or both of the inlet 986 and the outlet may include an opening within the PCB 982 for connecting the volume defined by the boot 980 to the inflow and / or outflow of the coolant fluid 971 below the PCB 982. In other examples, one or both of the inlet 986 or the outlet are located elsewhere on the boot 980.

[0084] In some examples, an inductor 950 (e.g., in the form of inductor 970 or gapped inductor 905) having a boot 966 (e.g., in the form of boot 972 or 980) can be an example of inductor 615 or gapped PCB inductor 905, as shown in FIGS. 9D - 9K, and the boot 966 can be integrated (or be part of) a jacket that is similar to jacket 635 covering two or more electrical components and a PCB (see FIGS. 6A - 6C). In some examples, two or more boots 966 (e.g., in the form of boot 972 or boot 980) covering respective corresponding inductors 950 or inductors 970 are coupled in series such that the outlet 970 of the first boot 966 is coupled to the inlet 968 of the second boot 966. In some examples, two or more boots 966 (e.g., in the form of boot 972 or boot 980) covering respective corresponding inductors 950 or inductors 970 are coupled in parallel, such that the inlet 968 of the first boot 966 and the inlet 968 of the second boot 966 are coupled to the same coolant fluid source, and the outlets 970 of the first boot 966 and the second boot 966 are also coupled.

[0085] In some embodiments, the inlets 968, 976, and / or 986 have a diameter that is substantially smaller (e.g., 3 times, 4 times, 5 times, or more times smaller) than the diameter of the supply tube that supplies liquid coolant to the boots 966, 972, 980. In other words, the cross - sectional area of the inlets 968, 976, and / or 986 is smaller than the cross - sectional area of the supply tube, where the cross - sectional area refers to the surface area of a virtual two - dimensional plane perpendicular to the flow of the coolant fluid. Thus, the inlets 968, 976, and / or 986 narrow the space for fluid flow, increasing the velocity of the fluid passing through the inlets (relative to the velocity of the fluid passing through the supply tube), and ultimately, the heat transfer coefficient (HTC) for the inductors 950, 970 provided by the coolant fluid is higher than it would be without the increase in velocity.

[0086] FIG. 10 shows the heat transfer rate of the PCB 900 including the PCB inductor 905 with a gap by the flow of the duct-shaped liquid coolant as described with respect to FIG. 9A.

[0087] In some examples, a process for managing thermal energy using the cooling jacket 635 (see FIG. 6B), or a variation thereof, is provided. This method includes receiving a coolant fluid at an inlet of a coolant fluid flow path volume 655 defined by an inner surface of the cooling jacket 635 and a substrate surface profile formed by a first surface 606 of the printed circuit board 605 and outer surfaces 608 of a plurality of electronic components 640 of the printed circuit board. It should be noted that the inner surface has a surface profile that mimics the substrate surface profile. In some examples, a pump or reservoir controlled by a controller can control the flow of the coolant fluid to the inlet 645 (see, for example, FIG. 11 and related discussions below).

[0088] This process then includes cooling a plurality of electronic components 640 via the coolant fluid passing through the coolant fluid path volume 655 along the coolant flow path 630.

[0089] This process then includes outputting the coolant fluid from an outlet 650 of the coolant fluid path volume 655.

[0090] In some examples of this process, the substrate surface profile is further formed by an outer surface of a heat sink coupled to additional electronic components of the printed circuit board, as shown, for example, in FIG. 8A.

[0091] In some examples of this process, a controller (e.g., controller 105 of FIG. 1) determines the temperatures of a plurality of electronic components based on sensor outputs (e.g., temperature sensors in one or more sensors 140). In response, the controller controls a coolant pump (e.g., coolant pump 305) that controls the flow of coolant fluid flowing within the coolant fluid path volume based on this temperature. For example, generally, as the temperature rises, the controller can increase the flow of the coolant fluid. Similarly, as the temperature drops, the controller can decrease the flow of the coolant fluid through the coolant fluid path volume.

[0092] In each embodiment disclosed herein, the coolant flow within the system may be controlled actively or passively, either locally or across the system (or subsystem). This control can be performed through a single pump, or a set of pumps, in addition to local topological deformations. See, for example, FIG. 3 and its description. Also, FIG. 11 shows, by way of example, a control diagram 1100 for some of the embodiments provided herein. The control diagram 1100 includes a system 1105, a command signal 1110, a controllable pressure reservoir or pump 1115, a device 1120 to be cooled, and a thermal isolation section 1125. In some embodiments, the system 1105 may represent components of the system 100 other than the cooling system 155, and the other components in the diagram of FIG. 11 may represent the cooling system 155 (or features, functions, and their associated components).

[0093] In some embodiments, the system 1105 shown in FIG. 11 may include a motor, an inverter, a battery, one or more sensors, and / or a microcontroller. The system 1105 (e.g., the microcontroller) transmits a command signal 1110 to a controllable pressure reservoir or pump 1115 based on temperature feedback (e.g., from a temperature sensor), the operating point of the system, and / or a model of the system. The reservoir or pump is then controlled based on the command signal 1110 to control the flow of a high-pressure low-temperature coolant to the device 1120. The device 1120 is then cooled via the high-pressure low-temperature coolant. The coolant returns to the reservoir or pump 1115 as a low-pressure low-temperature coolant by carrying away heat (heat break 1125). System feedback (e.g., temperature feedback, pressure feedback, etc.) may further be provided to the system 1105 and / or the command signal 1110 to adjust the control of the reservoir or pump 1115 and ultimately control the cooling action of the device 1120.

[0094] Each embodiment described in this specification may also include embodiments of variable flow rates associated with the operating capabilities or outputs of power conversion devices, or the systems in which they are embedded. For example, in the context of a traction inverter driving a traction motor, higher power operation from the motor control of the traction motor can prompt higher flow rates through the cooling devices and systems used to cool the traction inverter. This cooling system may enforce a minimum fluid flow requirement so that the cooling system does not induce air into the system. In some embodiments, there may be a separate pump as the main fluid loop, or a variable speed positive displacement system using the same pump. In some embodiments, the cooling system includes a source of higher pressure (coolant fluid) and uses an adjustable valve that can turn the higher pressure source on and off as needed. For example, the cooling system can include an auxiliary fluid circuit with a higher pressure supply source that can be pumped into the coolant system for additional (or reduced) coolant flow, in which case the valve controls whether the auxiliary fluid circuit is used and ultimately controls the pressure of the coolant fluid flow.

[0095] As described above, by providing cooling using the above techniques, the power density of the power converter can be increased. In an example, six FET power converters with and without a heat sink and using air cooling were evaluated. Considering the thermal resistance of the components, the maximum heat dissipation can be calculated. The thermal resistance R θJC between the FET junction and the case is 0.45 °C / watt (W), the thermal resistance R θP of the thermal pad is 0.25 °C / W, and the thermal resistance R θH of the heat sink is 173 °C / W. In this example, all six FETs share a common heat sink, and heat effectively passes through the six FETs combined in parallel and the thermal pad connected in series to the heat sink, resulting in the following equation.

Number

[0096] The maximum allowable FET junction temperature T Jmax is 150 °C, and when the ambient temperature Ta is 60 °C, the maximum allowable total FET loss is 310 W, which is approximately 50 W per FET. Here, the maximum allowable output current of this inverter is 15 amperes (A) per phase, which is significantly lower than the capacity of the FETs. The total is 12.47 kW, and the power density is 6.74 kW / L. This result means that the limit on the maximum power for this converter is within the range of the heat sink, and improving the heat sink will increase the power density and output power.

[0097] However, according to direct-contact jet impingement cooling (as described, for example, with respect to FIGS. 4A to 4E), the limiting factor for power output can be improved, resulting in an increase in output power and power density. As an example, the thermal resistance R between the junction and the case θJCWhen applying a heat load to the base of the FET body using the data sheet specified value of 0.45 °C / W, when calculating the effective bulk thermal conductivity of the FET body so that the temperature difference generated in each 60 W FET becomes 27 °C, the rising temperature is the temperature at the junction. As a result of unacceptable thermal contact between the bottom of the FET and the substrate and between the outer periphery of the FET and the coolant, basically all heat is blocked from the upper surface by liquid cooling. The inlet coolant temperature is assumed to be 75 °C, a reasonable value for in-vehicle applications. By varying the jacket clearance and the diameter of the injection port, for a reasonable oil flow (e.g., less than 4 LPM for all 6 FETs) and a reasonable total pressure (e.g., less than 20 psi), a value that can block 60 W per FET in the steady state was determined. Assuming a maximum allowable junction temperature of 150 °C and a maximum allowable ATF temperature of 115 °C. Based on these requirements, the values of the jacket clearance and the inner diameter of the injection port were selected as 0.25 mm and 1 mm, respectively. According to this design, as shown in Figure 12, which is a graph showing the relationship between the junction temperature and the maximum coolant temperature with respect to the flow rate, the minimum flow rate speed required to keep the junction temperature below 150 °C is only 2.5 LPM (total for all 6 FETs), but to keep the maximum coolant temperature below 115 °C, the minimum flow rate is 3.7 LPM, or 0.63 LPM / FET is required. At this flow rate, the average coolant temperature rise of the mass-flow at the outlet is 3.3 °C, and the total heat required at the inlet is 12.9 PSI. The average heat transfer coefficient on the FET is weighted in the jet impingement region and is approximately 3900 Wm -2 K -1 . These results demonstrate that direct contact ATF jet impingement cooling provides improved performance over air-cooled solutions.

[0098] This disclosure describes one or more embodiments and it should be understood that many equivalents, alternatives, variations, and modifications are possible within the scope of this application, separate from what has already been explicitly described. The features of the disclosed embodiments can be combined, rearranged, etc. within the scope of this application to provide further embodiments.

[0099] (Further examples) Example 1: A method, apparatus, and / or non - transitory computer - readable medium storing processor - executable instructions for a non - isolated power converter, comprising: a printed circuit board having a first surface; a plurality of electronic components of the printed circuit board, each having an outer surface, wherein the first surface and the outer surfaces of the plurality of electronic components form a substrate surface profile; a cooling jacket coupled to the printed circuit board, the cooling jacket having an inner surface with a surface profile that mimics the substrate surface profile; and a coolant fluid flow path volume defined by the substrate surface profile and the inner surface of the cooling jacket.

[0100] Example 2: The method, apparatus, and / or non - transitory computer - readable medium of Example 1, wherein the plurality of electronic components includes at least one electronic component attached to the first surface of the printed circuit board via a mounting surface on a side opposite the outer surface.

[0101] Example 3: The method, apparatus, and / or non - transitory computer - readable medium of Example 1 or Example 2, wherein the plurality of electronic components includes at least one integrated electronic component integrated within the printed circuit board, the integrated electronic component occupying a first component area of the printed circuit board corresponding to a portion of the first surface of the printed circuit board, and the cooling jacket covers the portion of the first surface such that coolant fluid received at an inlet of the coolant fluid flow path volume passes through the integrated electronic component before being output at an outlet.

[0102] Example 4: The integrated electronic component is a printed circuit board (PCB) inductor with a gap, The integrated electronic component has at least one coil turn embedded in each of a plurality of printed circuit boards (PCBs) of the PCB inductor with a gap, according to any one of the methods, apparatuses, and / or non-transitory computer-readable media of Examples 1 to 3.

[0103] Example 5: The inductor is disposed within a duct portion of the cooling jacket such that the coolant fluid is pushed between the plurality of PCBs, according to the method, apparatus, and / or non-transitory computer-readable media of Example 4.

[0104] Example 6: Further includes a heat sink coupled to the outer surfaces of at least two of the plurality of electronic components, and the heat sink forms a part of the substrate surface profile such that a coolant fluid received at an inlet passes through the heat sink before being output at an outlet, according to any one of the methods, apparatuses, and / or non-transitory computer-readable media of Examples 1 to 5.

[0105] Example 7: The inner surface of the cooling jacket has a clearance between 0.2 millimeters and 1.0 millimeter with respect to the outer surfaces of the plurality of electronic components, according to any one of the methods, apparatuses, and / or non-transitory computer-readable media of Examples 1 to 6.

[0106] Example 8: The flow path volume of the coolant fluid has an inlet at a first end of the cooling jacket and an outlet at a second end of the cooling jacket, and the coolant fluid received at the inlet passes through the plurality of electronic components before being output at the outlet, according to any one of the methods, apparatuses, and / or non-transitory computer-readable media of Examples 1 to 7.

[0107] Example 9: The method, apparatus, and / or non-transitory computer-readable medium of Example 8, wherein the inlet has a cross-sectional area through which the coolant fluid flows that is smaller than the cross-sectional area of the supply tube that provides the coolant fluid to the inlet.

[0108] Example 10: A printed circuit board having a first surface, at least one electronic component of the printed circuit board, the at least one electronic component each having an outer surface, a cooling jacket having a body portion that covers the outer surface of the at least one electronic component, an inlet formed in the body portion and configured to receive a coolant fluid within the cooling jacket and direct a jet of the coolant fluid toward the outer surface of the at least one electronic component, and an overhang portion including an opening between the cooling jacket and the first surface of the printed circuit board that projects beyond a side surface of the at least one electronic component and provides an outlet from the cooling jacket for the coolant fluid directed toward the outer surface. The method, apparatus, and / or non-transitory computer-readable medium storing processor-executable instructions for a non-isolated power converter.

[0109] Example 11: The method, apparatus, and / or non-transitory computer-readable medium of Example 10, wherein at least one of the at least one electronic component has a mounting surface on a side opposite the outer surface and is attached to the first surface of the printed circuit board via the mounting surface.

[0110] Example 12: The method, apparatus, and / or non-transitory computer-readable medium of Example 10 or Example 11, wherein at least one of the at least one electronic component is at least one integrated electronic component integrated within the printed circuit board, and the integrated electronic component occupies a first component area of the printed circuit board and has a part of the first surface of the printed circuit board.

[0111] Example 13: The integrated electronic component is a PCB inductor with a gap, and the integrated electronic component has at least one coil turn embedded in the printed circuit board, the method, apparatus, and / or non-transitory computer-readable medium of Example 12.

[0112] Example 14: The at least one electronic component has a single electronic component, and the cooling jacket covers the single electronic component, the method, apparatus, and / or non-transitory computer-readable medium of any one of Examples 10 to 13.

[0113] Example 15: The at least one electronic component has a first electronic component and a second electronic component, the injection port is a first injection port that directs the jet of the coolant fluid toward the outer surface of the first electronic component, and the main body further includes a second injection port configured to receive the coolant fluid in the cooling jacket and direct the additional coolant fluid toward the outer surface of the second electronic component, the method, apparatus, and / or non-transitory computer-readable medium of any one of Examples 10 to 14.

[0114] Example 16: The injection port has a channel through which the coolant fluid passes so as to form the jet of the coolant fluid, and the channel has a cross-sectional area through which the coolant fluid flows that is smaller than the cross-sectional area of the supply tube that supplies the coolant fluid to the inlet, the method, apparatus, and / or non-transitory computer-readable medium of any one of Examples 10 to 15.

Claims

1. A printed circuit board having a first surface, A plurality of electronic components on the printed circuit board, each having an outer surface, and the first surface and the outer surfaces of the plurality of electronic components form a substrate surface profile, A cooling jacket coupled to the printed circuit board, the cooling jacket having an inner surface with a surface profile that simulates the substrate surface profile, A coolant fluid flow path volume defined by the substrate surface profile and the inner surface of the cooling jacket, A thermal management system for a power converter, comprising.

2. The thermal management system according to claim 1, wherein the plurality of electronic components includes at least one electronic component attached to the first surface of the printed circuit board via a mounting surface on the side opposite the outer surface.

3. The plurality of electronic components includes at least one integrated electronic component integrated within the printed circuit board, the integrated electronic component occupying a first component area of the printed circuit board corresponding to a portion of the first surface of the printed circuit board, The cooling jacket covers the portion of the first surface such that coolant fluid received at an inlet of the coolant fluid flow path volume passes through the integrated electronic component before being output at an outlet. The thermal management system according to claim 1.

4. The integrated electronic component is a printed circuit board (PCB) inductor with a gap, The integrated electronic component has at least one coil turn embedded in each of the plurality of printed circuit boards (PCBs) of the PCB inductor with a gap. The thermal management system according to claim 3.

5. The thermal management system according to claim 4, wherein the inductor is disposed within a duct portion of the cooling jacket such that the coolant fluid is pushed between the plurality of PCBs.

6. Further comprising a heat sink coupled to the outer surfaces of at least two of the plurality of electronic components, The heat sink forms a portion of the substrate surface profile such that coolant fluid received at an inlet passes through the heat sink before being output at an outlet. The thermal management system according to claim 1.

7. The heat management system according to claim 1, wherein the inner surface of the cooling jacket has a clearance between 0.2 millimeter and 1.0 millimeter with respect to the outer surfaces of the plurality of electronic components.

8. The heat management system according to claim 1, wherein the coolant fluid flow path volume has an inlet at a first end of the cooling jacket and an outlet at a second end of the cooling jacket, and the coolant fluid received at the inlet passes through the plurality of electronic components before being output at the outlet.

9. The heat management system according to claim 8, wherein the inlet has a cross-sectional area through which the coolant fluid flows and is smaller than the cross-sectional area of the supply tube that supplies the coolant fluid to the inlet.

10. A printed circuit board having a first surface, At least one electronic component of the printed circuit board, each having an outer surface, A cooling jacket, A main body portion that covers the outer surfaces of the at least one electronic component, An injection port formed in the main body portion, configured to receive a coolant fluid into the cooling jacket and direct a jet of the coolant fluid toward the outer surfaces of the at least one electronic component, An overhang portion including an opening between the cooling jacket and the first surface of the printed circuit board so as to project beyond a side surface of the at least one electronic component and provide an outlet from the cooling jacket for the coolant fluid directed toward the outer surface, A cooling jacket having the above, and a heat management system for a power device.

11. The heat management system according to claim 10, wherein at least one of the at least one electronic component has a mounting surface on a side opposite to the outer surface and is attached to the first surface of the printed circuit board via the mounting surface.

12. The heat management system according to claim 10, wherein at least one of the at least one electronic component is at least one integrated electronic component integrated in the printed circuit board, and the integrated electronic component occupies a first component area of the printed circuit board and has a part of the first surface of the printed circuit board.

13. The integrated electronic component is a PCB inductor with a gap, The integrated electronic component has at least one coil turn embedded in the printed circuit board. The thermal management system according to claim 12.

14. The at least one electronic component has a single electronic component, The cooling jacket covers the single electronic component, The thermal management system according to claim 10.

15. The at least one electronic component has a first electronic component and a second electronic component, The injection port is a first injection port that directs the jet of the coolant fluid toward the outer surface of the first electronic component, The main body further includes a second injection port configured to receive the coolant fluid in the cooling jacket and direct the additional coolant fluid toward the outer surface of the second electronic component. The thermal management system according to claim 10.

16. The injection port has a channel through which the coolant fluid passes so as to form the jet of the coolant fluid, The channel has a cross-sectional area through which the coolant fluid flows that is smaller than the cross-sectional area of the supply tube that supplies the coolant fluid to the inlet, the thermal management system according to claim 10.

17. Receiving coolant fluid at an inlet of a flow path volume of the coolant fluid defined by an inner surface of the cooling jacket and a substrate surface profile, the substrate surface profile being formed by a first surface of the printed circuit board and outer surfaces of a plurality of electronic components of the printed circuit board, the inner surface having a surface profile that mimics the substrate surface profile, Cooling the plurality of electronic components by passing through the flow path volume of the coolant fluid, Outputting the coolant fluid at an outlet of the flow path volume of the coolant fluid, Thermal energy management method.

18. The substrate surface profile is further formed by an outer surface of a heat sink coupled to a further electronic component of the printed circuit board, the thermal energy management method according to claim 17.

19. Determining the temperature of the plurality of electronic components based on an output of a sensor by a controller, The controller further controlling a coolant pump that controls a flow of the coolant fluid through the flow path volume of the coolant fluid based on the temperature, the thermal energy management method according to claim 17 or 18.

20. Receive a coolant fluid at an inlet formed in a body portion of the cooling jacket, the body portion covering an outer surface of an electronic component on a first surface of a printed circuit board, Direct a jet of the coolant fluid onto the outer surface of the electronic component by a channel coupled to the inlet, Discharge the coolant fluid from the cooling jacket through an opening in an overhang portion of the cooling jacket, the opening being between the cooling jacket and the first surface of the printed circuit board, A thermal energy management method.

21. The heat sink is coupled to the outer surface of the electronic component, The jet of the coolant fluid directed by the channel impinges on a surface of the heat sink, The thermal energy management method according to claim 20.

22. The electronic component is a field effect transistor, The jet of the coolant fluid directed by the channel impinges on a surface of the field effect transistor, The thermal energy management method according to claim 20.

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