Flow guide structure and thermal shielding structure for deposition uniformity and process adjustability, and related methods

The flow guide and thermal shielding structures address non-uniform deposition and inefficient processes in semiconductor processing by optimizing gas distribution and temperature control, enhancing throughput and uniformity while reducing hardware size and costs.

JP2025523666AActive Publication Date: 2025-07-23APPLIED MATERIALS INC
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Patent Information

Application Number
JP2025501274
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-12-20
Filing Date
2023-01-17
Publication Date
2025-07-23
Estimated Expiration
2043-01-17

AI Technical Summary

Technical Problem

Semiconductor substrate processing faces challenges such as non-uniform deposition, inefficient processes, high costs, and limited throughput due to complex hardware dimensions and temperature control issues, particularly in batch epitaxial processing.

Method used

A flow guide structure and thermal shielding structure are implemented within a processing apparatus, dividing the space into multiple levels and zones to facilitate uniform gas distribution and temperature control, using heat sources and gas injection/exhaust systems for improved deposition uniformity and process tunability.

Benefits of technology

Enhances deposition uniformity across substrates, improves throughput, reduces processing time and costs, and optimizes temperature control, resulting in more efficient and uniform film growth with reduced hardware dimensions.

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Abstract

The present disclosure relates to a flow guide structure and a thermal shielding structure for deposition uniformity and process tunability, and related methods. In one embodiment, an apparatus for substrate processing includes a chamber body that includes a processing space. The apparatus includes one or more heat sources. The apparatus includes a flow guide structure positioned within the processing space. The flow guide structure includes one or more first flow dividers that divide the processing space into a plurality of flow levels, and one or more second flow dividers that intersect the one or more first flow dividers and are oriented to divide each of the plurality of flow levels into a plurality of flow sections. The flow guide structure includes one or more third flow dividers that intersect the one or more second flow dividers and are oriented to divide the plurality of flow sections into a plurality of flow zones.
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Citation Information

Patent Citations

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