Welded wafer, tube welding device, and tube welding method

Abstract

The present invention relates to a welded wafer (18), a tube welding device (10), and a tube welding method. The welded wafer (18) includes a first substrate and a second substrate formed in a flat plate shape, a heating element formed between the inner surfaces of the first substrate and the second substrate, and a temperature measurement hole (44) that penetrates the second substrate in the thickness direction and exposes the inner surface of the first substrate. The internal temperature of the welded wafer (18) can be detected by the temperature measurement hole. It is ideal to detect the temperature of the wafer (18) by a non-contact sensor such as an infrared radiation thermometer (70). The wafer is advantageous for use in cutting and melting resin tubes for medical use and the like.

Description

Technical Field

[0001] The present invention relates to a welding wafer, a tube welding apparatus, and a tube welding method for heating and melting a resin tube for connection.

Background Art

[0002] Conventionally, in order to aseptically connect resin tubes such as medical tubes (hereinafter referred to as tubes), a tube welding apparatus that heats and melts the tubes for connection has been used. As such a tube welding apparatus, for example, there is one described in Japanese Patent No. 3220229.

[0003] In the above-described tube welding apparatus, a pair of clamps that hold two tubes to be connected and a heated welding wafer are inserted between the pair of clamps so as to cross the tubes to cut the two tubes. Next, the clamps are moved to oppose the tubes to be connected with the welding wafer interposed therebetween. Then, the welding wafer is pulled out, and the two opposed tubes are butted against each other to weld the two tubes. The welding wafer includes a heating element sandwiched between plate-like substrates, and the heating element heats the welding wafer to a predetermined temperature required for welding.

Summary of the Invention

[0004] However, the conventional welding wafer has a problem that it is difficult to accurately detect the temperature.

[0005] Therefore, an object of one embodiment is to provide a welding wafer, a tube welding apparatus, and a tube welding method capable of accurately detecting the temperature.

[0006] One aspect of the present invention is a welding wafer for welding two resin tubes, comprising a first substrate formed in a flat plate shape, a second substrate joined to the inner surface of the first substrate, a heating element provided between the inner surface of the first substrate and the inner surface of the second substrate, and a temperature measurement hole penetrating the second substrate in the thickness direction and exposing the inner surface of the first substrate.

[0007] Another aspect is a tube welding device for holding two resin tubes with a pair of clamps, having a welding wafer insertable between the pair of clamps, a temperature sensor for detecting the temperature of the welding wafer, a clamp driving unit for moving at least one of the pair of clamps, a wafer driving unit for moving the welding wafer, and a control device for controlling the operations of the clamp driving unit and the wafer driving unit. The welding wafer welds the two resin tubes by cutting the two resin tubes with the welding wafer. The welding wafer comprises a first substrate formed in a flat plate shape, a second substrate joined to the inner surface of the first substrate, a heating element provided between the inner surface of the first substrate and the inner surface of the second substrate, and a temperature measurement hole penetrating the second substrate in the thickness direction and exposing the inner surface of the first substrate. The temperature sensor detects the temperature of the inner surface of the first substrate through the temperature measurement hole.

[0008] Yet another aspect is a tube welding method for welding two resin tubes using a welding wafer. The welding wafer includes a first substrate formed in a flat plate shape, a second substrate joined to the inner surface of the first substrate, a heating element provided between the inner surface of the first substrate and the inner surface of the second substrate, and a temperature measurement hole that penetrates the second substrate in the thickness direction and exposes the inner surface of the first substrate. The tube welding method holds two resin tubes by a pair of clamps, detects the temperature of the welding wafer through the temperature measurement hole using a temperature sensor, and after the temperature of the inner surface of the first substrate detected by the temperature sensor reaches a predetermined temperature, the welding wafer is pushed into the two resin tubes held by the pair of clamps by a wafer driving unit and cut, and the two cut resin tubes are welded together.

[0009] According to the welding wafer, tube welding apparatus, and tube welding method of the above aspect, the temperature of the welding wafer can be accurately detected.

Brief Description of the Drawings

[0010]

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Mode for Carrying Out the Invention

[0011] Hereinafter, preferred embodiments of the welded wafer 18, the tube welding apparatus 10, and the tube welding method will be described in detail with reference to the accompanying drawings.

[0012] As shown in FIG. 1A, the tube welding apparatus 10 according to the present embodiment has a tube placement portion 14 for placing a resin tube 12 to be welded on the upper part. The tube placement portion 14 is provided with two clamps 16 for holding the resin tube 12 and a welded wafer 18 shown in FIG. 1A.

[0013] As shown in the partial enlarged view, each clamp 16 is provided with a support portion 20 and an arm portion 22 separated vertically. The arm portion 22 is rotatably connected to the support portion 20 via a hinge portion 24. On the upper surface of the support portion 20, two groove portions 26 for holding the resin tubes 12 in parallel are provided. The two clamps 16 are arranged side by side with their longitudinal directions parallel. A narrow groove-shaped gap 28 is provided between the two clamps 16, and a welded wafer 18 (not shown in FIG. 1) is detachably mounted in the gap 28.

[0014] Although the usage method is not particularly limited, in the tube welding apparatus 10, usually, the welded wafer 18 is a consumable that is replaced each time welding is performed.

[0015] As shown in FIG. 2A, each welded wafer 18 is formed in a long rectangular shape, and one long side serves as a cut side 34 that cuts into the resin tube 12. A notch portion 36 is provided at a corner adjacent to the cut side 34 to indicate the position of the cut side 34 and to identify the attachment direction of the welded wafer 18 to the tube welding apparatus 10.

[0016] The front surface 38 of the welded wafer 18 is composed of only a smooth plane. On the other hand, as shown in FIG. 2B, an electrode portion 42 and a temperature measurement hole 44 are formed on the back surface 40 of the welded wafer 18. The electrode portion 42 is connected to the connection terminal of the tube welding device 10, and a heating current is supplied to the wiring pattern 56 described later. The temperature measurement hole 44 is used to detect the temperature inside the welded wafer 18.

[0017] The welded wafer 18 is formed by folding and overlapping a single metal thin plate 46 shown in FIG. 3. The metal thin plate 46 is made of a metal such as copper, a copper alloy, or stainless steel, and is formed in a rectangular shape with a dimension of about 80 mm in the long side direction and a dimension of about 20 mm in the short side direction. The thickness of the metal thin plate 46 is, for example, about 0.5 mm.

[0018] The metal thin plate 46 is folded and overlapped along the folding line 48 at the center in the short side direction to form the welded wafer 18. In FIG. 3, the portion below the folding line 48 is the first substrate 50, and the portion above the folding line 48 is the second substrate 52. That is, the first substrate 50 and the second substrate 52 are integrally connected through the portion of the folding line 48.

[0019] The surface appearing in FIG. 3 is the inner surface 46a, which is a surface that does not appear on the outside of the completed welded wafer 18. The inner surface 46a of the metal thin plate 46 is covered with an insulating layer 54 made of resin or the like as shown in FIG. 4. The insulating layer 54 is made of a thermoplastic resin such as an acrylic resin, and functions as an adhesive for joining the first substrate 50 and the second substrate 52 by overlapping them in a heated state.

[0020] As shown in FIG. 3, on the inner surface 46a in the unfolded state, a wiring pattern 56 that constitutes a heating element is formed on a portion of the first substrate 50. The wiring pattern 56 is formed by solidifying a powder of a conductive material such as silver with a binder or the like and has conductivity. It is formed on the insulating layer 54. The wiring pattern 56 includes a plurality of straight portions 56a extending in the long side direction and curved portions 56b connecting these straight portions 56a. The wiring pattern 56 is connected such that each straight portion 56a makes a U-turn by the curved portion 56b to form a single pattern in a ninety-nine-fold shape. The shape of the wiring pattern 56 is not limited to ninety-nine folds, and various variations such as a plate-like pattern can be adopted.

[0021] The wiring pattern 56 is provided on the first substrate 50 as a pattern that generates a uniform heat generation density in the vicinity of the cut side 34 (bending line 48) that becomes the side to cut into the resin tube 12 to be connected, and is separated from the opposing side 49 facing the bending line 48. A blank region 58 where the wiring pattern 56 is not formed is formed between the opposing side 49 and the wiring pattern 56. Connection pads 57 are provided at one end and the other end of the wiring pattern 56, respectively. The connection pads 57 are formed wider than the straight portions 56a. The connection pads 57 are provided near the short side on the side where the notch 36 is not formed and are arranged side by side in the short side direction.

[0022] On a portion of the second substrate 52, a pair of contact holes 60 and a temperature measurement hole 44 are formed. The contact holes 60 and the temperature measurement hole 44 are holes formed through the second substrate 52 in the thickness direction and are formed in a circular shape as shown in the figure, for example. When the second substrate 52 is stacked on the first substrate 50, they are formed at a portion corresponding to the connection pads 57. As shown in FIG. 4, in the state where the second substrate 52 is stacked, the connection pads 57 are exposed at the bottom of the contact holes 60. The electrode portion 42 is constituted by the connection pads 57 and the contact holes 60.

[0023] As shown in FIG. 3, the temperature measurement hole 44 is a portion that avoids the wiring pattern 56 of the first substrate 50 and is provided at a position where it does not interfere with the resin tube 12 when the welded wafer 18 is pushed into the resin tube 12. Specifically, the temperature measurement hole 44 is provided in the second substrate 52 at a portion corresponding to the blank region 58 near the opposing side 49 that opposes the bent line 48 (cut side 34).

[0024] As shown in FIG. 4, in a state where the second substrate 52 is superposed on the first substrate 50, the inner surface 46a (insulating layer 54) of the first substrate 50 is exposed at the bottom of the temperature measurement hole 44. From the viewpoint of preventing errors in the temperature measurement results due to heat dissipation, it is preferable that the diameter of the temperature measurement hole 44 be as small as possible. As shown in FIG. 3, the temperature measurement hole 44 is formed to have a size smaller than that of the contact hole 60. Although not particularly limited, the diameter of the temperature measurement hole 44 can be about 1 to 2 mm.

[0025] The welded wafer 18 of this embodiment is formed into a rectangular shape shown in FIG. 3 by press molding after applying an acrylic resin or the like to the inner surface 46a of the metal thin plate 46 to form the insulating layer 54. Next, the contact hole 60 and the temperature measurement hole 44 are punched and formed. Thereafter, an ink containing a conductive material such as silver is applied by a screen printing method or the like on the insulating layer 54 to form the wiring pattern 56. Thereafter, along the bent line 48, the metal thin plate 46 is bent, the second substrate 52 is superposed on the first substrate 50, and while being pressurized and heated, the first substrate 50 and the second substrate 52 are joined through the insulating layer 54, whereby the welded wafer 18 having the cross-sectional structure shown in FIG. 4 is completed.

[0026] The welded wafer 18 is used by being mounted on the tube welding apparatus 10 shown in FIG. 1. As shown in FIG. 5, this tube welding apparatus 10 includes a holder 62, and the holder 62 detachably holds the welded wafer 18. The holder 62 is supported by a wafer driving unit 64 that moves the holder 62 in the vertical direction (the direction crossing the resin tube 12). Near the holder 62, an electrode terminal 66 that contacts the electrode portion 42 of the welded wafer 18 is provided. The wiring pattern 56 of the welded wafer 18 is connected to the heater driver 68 via the electrode terminal 66.

[0027] Further, in the tube welding apparatus 10, a temperature sensor 70 is provided at a position facing the temperature measurement hole 44 of the welded wafer 18. The temperature sensor 70 is, for example, an infrared radiation thermometer, and non - contact - detects the temperature of the inner surface 46a exposed through the temperature measurement hole 44. Note that the temperature sensor 70 is not limited to an infrared radiation thermometer, and may be a contact - type sensor that brings a temperature measurement probe into contact with the inner surface 46a.

[0028] A pair of clamps 16 are provided on both side portions of the holder 62, and these clamps 16 are supported by a clamp driving unit 72. The clamp driving unit 72 drives the clamp 16 in a direction orthogonal to the driving direction of the wafer driving unit 64 (the longitudinal direction of the clamp 16).

[0029] The wafer driving unit 64, the heater driver 68, the temperature sensor 70, and the clamp driving unit 72 of the tube welding apparatus 10 are connected to a control device 74. The tube welding apparatus 10 performs the welding operation of the resin tube 12 under the control of the control operation of the control device 74.

[0030] Next, a tube welding method using the welded wafer 18 and the tube welding apparatus 10 will be described.

[0031] Prior to welding the resin tube 12, the user attaches the welding wafer 18 to the tube welding device 10 shown in FIGS. 1A and 1B. Also, two resin tubes 12 to be connected are set in parallel in the clamp 16. Then, when the user presses the start button of the tube welding device 10, the welding operation of the tube welding device 10 is started.

[0032] As shown in FIG. 6, in step S10, the tube welding device 10 heats the heating element (wiring pattern 56) of the welding wafer 18. That is, the tube welding device 10 supplies current to the electrode portion 42 of the welding wafer 18 via the heater driver 68, and heats the welding wafer 18 by the resistive heating of the wiring pattern 56.

[0033] Next, in step S20, the tube welding device 10 detects the temperature of the welding wafer 18. The temperature sensor 70 detects the temperature of the inner surface 46a of the welding wafer 18 through the temperature measurement hole 44 of the welding wafer 18. In the welding wafer 18, the heat generated in the wiring pattern 56 is transmitted to the surfaces of the first substrate 50 and the second substrate 52 by heat conduction, and the surfaces of the first substrate 50 and the second substrate 52 are heated. On the surfaces of the first substrate 50 and the second substrate 52, heat is released to the outside air, so the temperature is likely to decrease as the distance in the plane direction from the wiring pattern 56 increases, and the temperature variation on the surface is large. In order to measure the temperature near the cut edge 34 that cuts into the resin tube 12, it is preferable to provide the temperature sensor 70 in the vicinity, but it will interfere with the resin tube 12. Therefore, in order to prevent interference with the resin tube 12, it is necessary to detect the temperature of the welding wafer 18 at a position away from the cut edge 34.

[0034] Therefore, the temperature sensor 70 of the present embodiment detects the temperature inside the welding wafer 18 through the temperature measurement hole 44 of the welding wafer 18. Since the inner surface 46a of the welding wafer 18 is less affected by heat release to the outside air, even at a position away from the cut edge 34, the temperature is approximately the same as the temperature near the cut edge 34. Therefore, the temperature sensor 70 can accurately measure the temperature near the cut edge 34.

[0035] The detected temperature of the temperature sensor 70 is input to the control device 74. In step S30, the control device 74 determines whether the predetermined temperature has been reached. Here, the control device 74 determines whether the temperature of the welded wafer 18 has reached a predetermined temperature (for example, 280°C) that is equal to or higher than the melting point of the resin tube 12. In step S30, if the control device 74 determines that the predetermined temperature has not been reached (NO), it returns to step S20 and continues to measure the temperature. In step S30, if the control device 74 determines that the welded wafer 18 has reached the predetermined temperature (YES), it proceeds to step S40.

[0036] In step S40, the tube welding device 10 drives the wafer drive unit 64 to move the welded wafer 18 upward and push it in so as to cross the two resin tubes 12. As a result, the welded wafer 18 cuts the resin tube 12 while being in close contact with the resin tube 12 so as to cut into the resin tube 12 from the cut side 34.

[0037] Next, in step S50, the tube welding device 10 drives the clamp drive unit 72 to arrange the two resin tubes 12 to be welded in a facing position. As a result, one resin tube 12 to be connected and the other resin tube 12 are arranged facing each other with the welded wafer 18 interposed therebetween. Since the ends of the resin tube 12 are in close contact with the heated surface of the welded wafer 18, the ends and the inside of the resin tube 12 are kept in a sterile state.

[0038] Next, in step S60, the tube welding device 10 drives the wafer drive unit 64 to move the welded wafer 18 downward and pull out the welded wafer 18 from between the pair of resin tubes 12. As a result, the molten end of one resin tube 12 and the molten end of the other resin tube 12 are abutted against each other and welded as they are. Thereby, the resin tube 12 is welded while keeping the inside of the resin tube 12 in a sterile state.

[0039] The welded wafer 18, the tube welding device 10, and the tube welding method according to the present embodiment have the following effects.

[0040] The welded wafer 18 according to the present embodiment is a welded wafer 18 for welding two resin tubes 12 to each other, and includes a first substrate 50 formed in a flat plate shape, a second substrate 52 joined to the inner surface 46a of the first substrate 50, a heating element (for example, a wiring pattern 56) provided between the inner surface 46a of the first substrate 50 and the inner surface 46a of the second substrate 52, and a temperature measurement hole 44 that penetrates the second substrate 52 in the thickness direction and exposes the inner surface 46a of the first substrate 50.

[0041] According to the above-described welded wafer 18, since the temperature of the inner surface 46a inside the welded wafer 18 can be detected, even when the position of the temperature measurement hole 44 is provided at a position away from the heating element, the temperature of the surface of the welded wafer 18 near the heating element can be measured relatively accurately.

[0042] In the above-described welded wafer 18, the temperature measurement hole 44 may be provided at a portion avoiding the heating element. According to this configuration, since the temperature can be measured at a position avoiding the influence of the heat generation of the heating element, the measurement error of the temperature of the welded wafer 18 can be suppressed.

[0043] In the above-described welded wafer 18, the first substrate 50 and the second substrate 52 have a cutting edge 34 that cuts into the resin tube 12 to be welded and an opposing edge 49 formed on the side opposite to the cutting edge 34, and the temperature measurement hole 44 may be provided in the vicinity of the opposing edge 49. According to this configuration, the temperature measurement hole 44 can be provided at a position where it does not interfere with the resin tube 12.

[0044] In the above-described welded wafer 18, the first substrate 50 and the second substrate 52 may be integrally formed, and the second substrate 52 may be formed by being folded back toward the inner surface 46a of the first substrate 50 at the cutting edge 34. According to this configuration, since the first substrate 50 and the second substrate 52 can be formed simultaneously by press working, mass productivity is excellent and manufacturing costs can be reduced.

[0045] In the above-described welded wafer 18, the inner surface 46a of the first substrate 50 and the inner surface 46a of the second substrate 52 are each covered with an insulating layer 54, and the heating element may be a wiring pattern 56 formed on the insulating layer 54 of either the first substrate 50 or the second substrate 52. According to this configuration, since the wiring pattern 56 can be formed by a printing method, the manufacturing cost of the welded wafer 18 can be suppressed.

[0046] In the above-described welded wafer 18, the wiring pattern 56 has connection pads 57 at one end and the other end, and contact holes 60 for exposing the connection pads 57 may be formed in either one or both of the first substrate 50 and the second substrate 52. According to this welded wafer 18, current can be passed through the wiring pattern 56 through the contact holes 60.

[0047] In the above-described welded wafer 18, the heating element (wiring pattern 56) may be formed on the insulating layer 54 of the first substrate 50.

[0048] The tube welding apparatus 10 of the present embodiment includes a pair of clamps 16 that hold two resin tubes 12, a welded wafer 18 that is provided so as to be insertable between the pair of clamps 16, a temperature sensor 70 that detects the temperature of the welded wafer 18, a clamp drive unit 72 that moves at least one of the pair of clamps 16, a wafer drive unit 64 that moves the welded wafer 18, and a control device 74 that controls the operations of the clamp drive unit 72 and the wafer drive unit 64. The tube welding apparatus 10 cuts the two resin tubes 12 with the welded wafer 18 and welds the two resin tubes 12 together. The welded wafer 18 includes a first substrate 50 formed in a flat plate shape, a second substrate 52 joined to the inner surface 46a of the first substrate 50, a heating element provided between the inner surface 46a of the first substrate 50 and the inner surface 46a of the second substrate 52, and a temperature measurement hole 44 that penetrates the second substrate 52 in the thickness direction and exposes the inner surface 46a of the first substrate 50. The temperature sensor 70 detects the temperature of the inner surface 46a of the first substrate 50 through the temperature measurement hole 44.

[0049] According to the above-described tube welding apparatus 10, even when the temperature sensor 70 is disposed at a position where it does not interfere with the resin tube 12, the temperature of the welding wafer 18 can be accurately measured.

[0050] In the above-described tube welding apparatus 10, after the temperature of the inner surface 46a of the first substrate 50 detected by the temperature sensor 70 reaches a predetermined temperature, the control device 74 controls the operation of the wafer driving unit 64 so as to push the welding wafer 18 into the two resin tubes 12 held by the pair of clamps 16. According to this configuration, since the temperature rise of the welding wafer 18 can be quickly detected, the waiting time for the temperature rise of the welding wafer 18 can be reduced, and the welding of the two resin tubes 12 can be performed more quickly.

[0051] In the above-described tube welding apparatus 10, the temperature sensor 70 may be a non-contact type temperature sensor. According to this configuration, even when the welding wafer 18 is frequently replaced, deterioration of the temperature sensor 70 can be prevented.

[0052] The tube welding method of the present embodiment is a tube welding method for welding two resin tubes 12 using a welding wafer 18. The welding wafer 18 includes a first substrate 50 formed in a flat plate shape, a second substrate 52 joined to the inner surface 46a of the first substrate 50, a heating element provided between the inner surface 46a of the first substrate 50 and the inner surface 46a of the second substrate 52, and a temperature measurement hole 44 that penetrates the second substrate 52 in the thickness direction and exposes the inner surface 46a of the first substrate 50. When welding the resin tubes 12, the two resin tubes 12 are held by a pair of clamps 16, the temperature of the welding wafer 18 is detected through the temperature measurement hole 44 by the temperature sensor 70, and after the temperature of the inner surface 46a of the first substrate 50 detected by the temperature sensor 70 reaches a predetermined temperature, the welding wafer 18 is pushed into the two resin tubes 12 held by the pair of clamps 16 by the wafer driving unit 64 and cut, and the two cut resin tubes are welded together.

[0053] According to the above method, since the accurate temperature of the welded wafer 18 is detected by the temperature sensor 70 and then the welded wafer 18 is pushed into the resin tube 12, the welding of the resin tube 12 can be performed reliably and quickly.

[0054] (Second Embodiment) In the metal thin plate 46A (welded wafer 18A) of the present embodiment shown in FIG. 7, a temperature measurement hole 44 is provided on the first substrate 50 side, and no temperature measurement hole 44 is provided on the second substrate 52 side. In a state where the first substrate 50 and the second substrate 52 are overlapped, the inner surface 46a on the second substrate 52 side is exposed in the temperature measurement hole 44. Since the inner surface 46a of the first substrate 50 and the inner surface 46a of the second substrate 52 are in close positions, the inner surface 46a of the second substrate 52 exhibits the same thermal characteristics as the inner surface 46a of the first substrate 50, and accurate temperature measurement can be performed.

[0055] (Third Embodiment) In the welded wafer 18B of the present embodiment shown in FIG. 8, the first substrate 50 and the second substrate 52 are made of separate members. That is, the first substrate 50 and the second substrate 52 are separated at the cut side 34. The first substrate 50 and the second substrate 52 of the welded wafer 18B of the present embodiment are composed of a metal thin plate 46B and an insulating layer 54 provided on the inner surface 46a side thereof, but are not limited thereto. Instead of the metal thin plate 46B, for example, a material that is difficult to bend, such as a ceramic substrate, may be used. Thus, according to the welded wafer 18B of the present embodiment, the range of material selection is increased, and it becomes possible to use a cheaper material.

[0056] (Fourth Embodiment) In the metal thin plate 46C of the present embodiment shown in FIG. 9, the temperature measurement hole 44A provided in the second substrate 52 intersects the opposing side 49. The temperature measurement hole 44A is formed as a notch with the opposing side 49 side open. The welded wafer 18C formed by the metal thin plate 46C of the present embodiment also provides the same effects as the welded wafer 18 described with reference to FIGS. 2 to 4.

[0057] In the above, although the preferred embodiments of the present invention have been described with examples, it goes without saying that the present invention is not limited to the above embodiments, and various modifications are possible without departing from the spirit of the present invention.

Claims

1. A welding wafer for welding two resin tubes, comprising: a first substrate formed in a flat plate shape; a second substrate joined to the inner surface of the first substrate; a heating element provided between the inner surface of the first substrate and the inner surface of the second substrate; a temperature measurement hole that penetrates the second substrate in the thickness direction and exposes the inner surface of the first substrate; The welding wafer provided with the above.

2. The welding wafer according to claim 1, wherein the temperature measurement hole is provided at a position avoiding the heating element.

3. The welding wafer according to claim 1 or 2, wherein the first substrate and the second substrate have a cut side that cuts into the resin tube to be welded and an opposing side formed on the opposite side of the cut side, The temperature measurement hole is provided in the vicinity of the opposing side.

4. The welding wafer according to claim 3, wherein a part of the temperature measurement hole intersects the opposing side.

5. The welding wafer according to claim 3 or 4, wherein the first substrate and the second substrate are integrally formed, and the second substrate is folded back toward the inner surface of the first substrate at the cut side.

6. The welding wafer according to any one of claims 1 to 5, wherein the inner surfaces of the first substrate and the second substrate are each covered with an insulating layer, and the heating element is composed of a wiring pattern formed on the insulating layer of either the first substrate or the second substrate.

7. The welding wafer according to claim 6, wherein the wiring pattern has connection pads at one end and the other end, and contact holes for exposing the connection pads are formed in either one or both of the first substrate and the second substrate.

8. The welding wafer according to claim 6 or 7, wherein the temperature measurement hole is provided in the first substrate, and the heating element is formed on the insulating layer of the first substrate.

9. A pair of clamps for holding two resin tubes, a welding wafer provided so as to be insertable between the pair of clamps, a temperature sensor for detecting the temperature of the welding wafer, a clamp driving unit for moving at least one of the pair of clamps, a wafer driving unit for moving the welding wafer, and a control device for controlling the operations of the clamp driving unit and the wafer driving unit, and the welding wafer cuts the two resin tubes and welds the two resin tubes together, a tube welding device, The welding wafer is, A first substrate formed in a flat plate shape, A second substrate joined to the inner surface of the first substrate, A heating element provided between the inner surface of the first substrate and the inner surface of the second substrate, A temperature measurement hole that penetrates the second substrate in the thickness direction and exposes the inner surface of the first substrate, and includes, The temperature sensor detects the temperature of the inner surface of the first substrate through the temperature measurement hole, a tube welding device.

10. The tube welding device according to claim 9, After the temperature of the inner surface of the first substrate detected by the temperature sensor reaches a predetermined temperature, the control device controls the operation of the wafer driving unit so as to push the welding wafer into the two resin tubes held by the pair of clamps, a tube welding device.

11. The tube welding device according to claim 9 or 10, The temperature sensor is a non-contact type temperature sensor, a tube welding device.

12. A tube welding method for welding two resin tubes together using a welding wafer, The welding wafer is, A first substrate formed in a flat plate shape, A second substrate joined to the inner surface of the first substrate, A heating element provided between the inner surface of the first substrate and the inner surface of the second substrate, A temperature measurement hole that penetrates the second substrate in the thickness direction and exposes the inner surface of the first substrate, and includes, The tube welding method is, Holding two resin tubes with a pair of clamps, Detecting the temperature of the welding wafer through the temperature measurement hole by a temperature sensor, After the temperature of the inner surface of the first substrate detected by the temperature sensor reaches a predetermined temperature, the wafer driving unit pushes the welding wafer into the two resin tubes held by the pair of clamps to cut them, Welding the two cut resin tubes together, a tube welding method.

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