Testing mechanism for OTA testing of an angle-tilted test device with respect to the surface of a carrier structure

Abstract

The present invention relates to a test mechanism for OTA testing of an angle test device, and the test mechanism includes a carrier structure. The test mechanism includes a device under test socket coupled to the carrier structure, and the device under test socket is configured to establish electrical contact with the inner surface of the angle test device or a connector provided on the inner surface of the angle test device. The device under test socket is configured to position the angle test device such that a first outer surface of the angle test device is inclined at least 15 degrees with respect to the surface of the carrier structure.

Description

Technical Field

[0001] Embodiments according to the present invention relate particularly to a test mechanism for OTA (Over the Air) testing using an angle-tilted device under test with respect to the surface of a carrier structure.

[0002] Embodiments according to the present invention relate to a socket for OTA testing of an L-shaped antenna-in-package module with an automatic test device.

Background Art

[0003] Background of the Invention A test mechanism can be used to test a device under test (e.g., an antenna-in-package device) that can receive and / or emit electromagnetic radiation. Generally, the device under test has a flat shape including two opposing surfaces such that, for example, one surface faces the device under test socket and the other surface faces away from the device under test socket. For example, the device under test can be attached to a device under test socket (e.g., an OTA socket for a radiating near-field test of an antenna-in-package device) such that the surface of the device under test with the antenna faces away from the device under test socket. For example, the orientation of the device under test can be directed such that the surface of the device under test with the antenna faces away from the device under test socket.

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, the shape of the device under test does not have to be planar. For example, the device under test can have an angular shape such as an L-shape. Further, the angular device can be configured to emit and / or receive electromagnetic radiation on at least one outer surface. For example, the angular device under test can have one or more antenna arrays (or other antennas) on one or two outer surfaces.

[0005] Testing an angle test device having wireless communication components on one or more outer surfaces generally requires a high labor effort to place the test device in a test device socket, and it has been found that in such test devices, test results are often degraded by artifacts.

[0006] Therefore, a test mechanism is needed that improves the compromise among test efficiency, accuracy, and reproducibility.

Means for Solving the Problem

[0007] Summary of the Invention One embodiment of the present invention is directed to a test mechanism for OTA testing an angled (e.g., L-shaped) test device (e.g., a device of an L-shaped antenna-in-package), the test mechanism comprising a carrier structure (e.g., a PCB test apparatus or a load board). The test mechanism comprises a test device socket coupled to the carrier structure (e.g., directly, or via an extender assembly and / or a PCB interposer between the carrier structure and the test device socket). The test device socket is configured to establish electrical contact with an inner surface of the angled (e.g., L-shaped) test device (e.g., the inner surface of the angled test device on the opposite side of the second outer surface of the angled test device) or a connector provided on the inner surface of the angled (e.g., L-shaped) test device. The test device socket is configured to position the angled test device such that the first outer surface of the angled (e.g., L-shaped) test device is inclined at least 15 degrees with respect to the surface (e.g., the main surface) of the carrier structure (e.g., a PCB test apparatus or a load board).

[0008] The test device socket enables coupling to an angled test device and a test mechanism. Further, the electrical contact enables transmission (in one or both directions) of power, one or more control signals, measurement signals, or at least one of the signals between the test mechanism and the test device coupled to the test device socket.

[0009] (With respect to the surface of the carrier structure) At an angle of at least 15°, the first outer surface is no longer substantially parallel to the surface of the carrier structure, which means that the surface normal of the first outer surface is inclined (oblique) with respect to the plane of the carrier structure. Accordingly, the main lobe direction of an antenna or antenna structure (which is often substantially orthogonal to the first outer surface of the test device) provided on or within the first outer surface is also usually inclined with respect to the plane of the carrier structure.

[0010] This has been found to help reduce the detrimental effect of the carrier structure on the antenna characteristics (e.g., radiation pattern, impedance) of an antenna or antenna structure provided on or within the first outer surface of the test device.

[0011] Furthermore, by having an inclined first outer surface of the device under test, typically, a test antenna that transmits a signal to be received in an antenna or antenna structure provided on or within the first outer surface of the device under test, and / or a test antenna that receives a signal transmitted by an antenna or antenna structure provided on or within the first outer surface of the device under test, can be arranged offset from a position directly above the device under test (directly above the device under test in a direction perpendicular to the surface of the carrier structure). Thus, the test antenna can be arranged so that the device under test can be efficiently inserted in a "linear" direction (e.g., a path substantially perpendicular to the surface of the carrier structure). This makes it unnecessary to move the test antenna in some cases when inserting the device under test into the device under test socket and / or removing the device under test from the device under test socket, facilitating the handling of the device under test.

[0012] Furthermore, it is also recognized that an inclination of at least 15 degrees of the first outer surface of an angled (e.g., L-shaped) device under test (which typically corresponds to the same inclination of the first surface of the device under test socket in contact with the first inner surface of the device under test) enables (or facilitates) gravity-supported insertion and / or self-alignment of the device under test into the device under test socket. It is recognized that the inclination of the surface of the device under test socket corresponds to the inclination of the first outer surface of the device under test. This enables a smooth, gravity-assisted "sliding" of the device under test into the device under test socket.

[0013] As a result, the first outer surface is angled (e.g., inclined with respect to the surface of the carrier structure) so as to at least partially move away from the carrier structure. When the device under test is angled, the second outer surface disposed beyond the angle is also angled so as to at least partially move away from the carrier structure (e.g., inclined with respect to the surface of the carrier structure). As a result, the electromagnetic field received and / or radiated by any of the outer surfaces (more precisely, by each antenna or antenna structure provided on or within each outer surface) is angled at least partially away from the carrier structure (e.g., each main lobe is inclined with respect to the surface of the carrier structure). As a result, the interference caused by the carrier structure is reduced.

[0014] According to one embodiment, the device under test socket is configured to position the angled device under test such that the second outer surface of the angled (e.g., L-shaped) device under test is inclined by at least 15 degrees with respect to the surface (e.g., the main surface) of the carrier structure (e.g., a PCB test apparatus or a load board).

[0015] The test device is angled, and since both the first and second outer surfaces are inclined by at least 15 degrees with respect to the surface of the carrier structure, the angled test device is provided within a limited angular range in which the first and second outer surfaces face away from the carrier structure. Also, the typical main lobes of the antenna or antenna structure provided on or within the outer surface of the test device are thus typically inclined with respect to the surface of the carrier structure, resulting in low interference and enabling advantageous placement of each test antenna for wirelessly testing the test device. Further, such an orientation improves the probability of self-alignment of the test device when the test device is placed in the test device socket. Using such a design of the test mechanism, the first and second outer surfaces are angled such that the transmission and / or reception path (e.g., the respective main lobe direction of the antenna or antenna structure provided on or within the outer surface of the test device) is not provided perpendicular to the surface of the carrier structure. Thus, structures related to the transmission path (e.g., antennas, antenna structures, mirrors, or shields) may not need to be placed above (or directly above) the test device, facilitating the attachment (insertion) and removal of the test device.

[0016] According to one embodiment, the test socket has (at least) two support surfaces for supporting two inner surfaces of the angled test device, and the two support surfaces are both inclined by at least 15 degrees with respect to the surface (e.g., the main surface) of the carrier structure (e.g., a PCB test device or a load board).

[0017] It is recognized that the angled test device may typically have two inner surfaces that are parallel (or nearly parallel) to the two outer surfaces. Thus, when the inner surfaces of the angled test device abut against the two support surfaces, an inclination of the outer surfaces similar to at least the inclination of the support surfaces occurs. Thus, the support surfaces can achieve the beneficial (e.g., facing in a direction at least partially away from the carrier structure that may cause interference) orientation of the first and second outer surfaces as discussed herein.

[0018] According to one embodiment, the test mechanism is provided on the surface of the carrier structure and includes a support structure having a triangular cross-section (e.g., in a plane perpendicular to the plane in which the carrier structure lies). The support structure can be configured to attach the device under test to the socket (e.g., directly or with one or more layers in between). The cross-section may have the shape of a right triangle (i.e., having an angle of 90°), and the right angle may be provided at the inner end of the device under test.

[0019] The triangular cross-section provides (at least) two support surfaces that can abut against the inner surfaces of the angled surfaces of the device under test. Thus, the triangular cross-section can define the orientation of the outer surface of the device under test. Further, due to the triangular cross-section of the support structure, a simple (or conventional) device under test socket can be used. This enables a cost-effective implementation. In particular, since the inclination of the device under test is achieved by the support structure, the size of the device under test socket itself can be kept appropriately small.

[0020] According to one embodiment, the test mechanism includes a planar conductor structure of a flexible or membrane or elastomer (e.g., a flexible or elastomer printed circuit board). This planar conductor structure may be provided to make a connection between the surface of the carrier structure and the surface of the device under test socket that is inclined with respect to the surface of the carrier structure.

[0021] A flexible or membrane or elastomeric planar conductor structure enables establishing an electrical connection between a carrier structure and a device - under - test socket while conforming to the shape of the surface of the device - under - test socket. The planar conductor structure reduces variations in the surface structure of the device - under - test socket. For example, with a flexible or membrane or elastomeric planar conductor structure, the electrical connection can be adapted to the inclination of the device - under - test socket or the support structure. For example, a flexible or membrane or elastomeric planar conductor structure can conform to the surface of a support structure and may have a bend at a transition from the surface of the carrier structure to the surface of the support structure. Use of such a flexible or membrane or elastomeric planar conductor structure can provide a highly reliable electrical connection while reducing the labor of implementation.

[0022] According to one embodiment, a flexible or membrane or elastomeric planar conductor structure is electrically coupled to the surface of a carrier structure and has at least one bend to conform to the lower surface of a device - under - test socket.

[0023] This bend enables the flexible or membrane or elastomeric planar conductor structure to adapt to the transition of the surface angle between the carrier structure and the device - under - test socket.

[0024] According to one embodiment, a flexible or membrane or elastomeric planar conductor structure extends (at least partially) over the surface of a support structure. The support structure may be provided on the surface of the carrier structure and may have a triangular cross - section (in a plane perpendicular to the plane in which the carrier structure lies, for example). The support structure can be configured to support the device - under - test socket (directly or with one or more layers in between). The flexible or membrane or elastomeric planar conductor structure may be provided partially between the support structure and the device - under - test socket.

[0025] A planar conductor structure of a flexible or membrane or elastomer can be adapted to a triangular cross-sectional shape and enable electrical contact between a support structure and a device under test socket (and optionally the device under test when coupled to the device under test socket). The planar conductor structure of a flexible or membrane or elastomer can be (at least partially) adapted to the shape (or surface orientation) of the support structure, for example, when supporting the device under test socket, it can define the orientation of the device under test.

[0026] According to one embodiment, the device under test socket has one or more coaxial pogo pins (for example, extending from the lower surface of the device under test socket that contacts the PCB test apparatus, load board, support structure, or planar conductor structure of a flexible or membrane or elastomer to the upper surface of the device under test socket that contacts the second inner surface of the angled device under test) to establish electrical connection with the device under test. Here, for example, the first end of the coaxial pogo pin may contact a pad on the PCB test apparatus, load board, support structure, or planar conductor structure of a flexible or membrane or elastomer, and, for example, the second end of the coaxial pogo pin may contact a pad on the device under test or a connector of the device under test.

[0027] The pogo pins are generally pushable, and when the device under test is coupled to the device under test socket (for example, pushed into the device under test socket by a handler / pusher), it enables the device under test socket to establish electrical contact with the device under test. The coaxial spring enables high-frequency interconnection to the device under test socket.

[0028] According to one embodiment, the test mechanism includes a first antenna or first antenna structure (for example, a single aperture antenna (such as a dual linear polarization or circular polarization)) configured to receive signals radiated from the first outer surface of the device under test and / or configured to emit signals received at the first outer surface of the device under test.

[0029] The first antenna or the first antenna structure enables the OTA testing of a device under test that includes one or more antennas or antenna structures on at least one outer surface. For example, the reception characteristics and / or transmission characteristics of one or more antennas or antenna structures on the first outer surface or the second outer surface of the device under test can be evaluated. However, one or more other characteristics of the device under test can also be determined alternatively or additionally. The orientation of the first outer surface of the device under test (e.g., an inclined, tilted, or oblique orientation with respect to the surface of the carrier structure) and / or the orientation of the second outer surface of the device under test (e.g., an inclined, tilted, or oblique orientation with respect to the surface of the carrier structure) reduces the interference with the carrier structure during (OTA) testing. Further, this orientation eliminates the need to place the first antenna or the first antenna structure directly above the device under test, which can facilitate the insertion and / or removal of the device under test.

[0030] According to one embodiment, the test mechanism comprises a first antenna or a first antenna structure (e.g., a single aperture antenna (e.g., with dual linear polarization or circular polarization)). The aperture (or opening or aperture) of the first antenna or the first antenna structure is provided away from the first outer surface of the angle device under test (e.g., with a pusher having a low dielectric constant material or an electromagnetic transparent material between the first antenna or the first antenna structure and the first outer surface) such that the normal to the first outer surface of the angle device under test extends through the aperture of the first antenna or the first antenna structure (at least when the second antenna or the second antenna structure is disposed in the operating position).

[0031] By providing a normal vector of a first outer surface passing through an aperture plane of the first antenna or the first antenna structure (this can be effectively achieved, for example, by proper alignment of a first surface of a device under test socket in contact with a first inner surface of the device under test), reception and / or radiation of the first antenna or the first antenna structure can be improved (or, in other words, good electromagnetic coupling between an antenna or an antenna structure on a first outer surface of the device under test and the first antenna can be achieved). The spacing can facilitate insertion and / or removal of the device under test. The pusher can optionally improve the fixing of the device under test to the device under test socket and facilitate establishing a reproducible spacing.

[0032] According to one embodiment, an antenna aperture plane of the first antenna or the first antenna structure is inclined with respect to a carrier structure (for example, with respect to a surface or a main surface of the carrier structure).

[0033] This inclination can improve wireless (electromagnetic) coupling between the antenna aperture plane and an antenna or an antenna structure provided on or within the first outer surface which is also inclined. Further, the inclination of the antenna aperture plane may enable a spacing that offsets the first antenna or the first antenna structure laterally from a region directly above the center of the device under test socket (for example, parallel to the surface of the carrier structure), thereby facilitating insertion and / or removal of the device under test (for example, without moving the first antenna or the first antenna structure).

[0034] According to one embodiment, an antenna aperture plane of the first antenna or the first antenna structure is parallel to a first outer surface of the angle device under test.

[0035] The parallel arrangement of the antenna aperture plane and the first outer surface can improve transmission between the antenna aperture plane and an antenna or an antenna structure provided on or within the first outer surface.

[0036] According to one embodiment, the first antenna or the first antenna structure is attached so as to have a fixed position with respect to the device under test socket.

[0037] Such a fixed position enables repeatedly coupling and testing a plurality of devices under test so that the plurality of devices under test have equal or similar geometric relationships with respect to the first antenna or the first antenna structure. As a result, the accuracy and reproducibility of the test can be improved. Further, by using the fixed position of the first antenna or the first antenna structure with respect to the device under test socket, the complexity of the structure can be kept low. Also, by fixing the position of the first antenna or the first antenna structure, the test can be speeded up.

[0038] According to one embodiment, the first antenna or the first antenna structure is mechanically coupled (e.g., attached) to the arm of a handler (configured to insert an angled device under test into the device under test socket and / or configured to push the device under test into the device under test socket) such that the first antenna or the first antenna structure is movable.

[0039] The movable first antenna or the first antenna structure can facilitate access to the device under test socket (e.g., for insertion and / or removal). Further, the movable first antenna or the first antenna structure can allow the position and / or orientation of the first antenna or the first antenna structure with respect to the inclined first outer surface to be adjusted (e.g., when using sockets with different tilt angles or when testing the angle dependence of transmission and / or reception of the device under test). Further, by making the first antenna or the first antenna structure movable, the first antenna or the first antenna structure can be mechanically coupled to a pusher that pushes the device under test into the test socket. Thus, the pusher that may be between the opening surface of the first antenna or the first antenna structure and the device under test can accurately adjust the positional relationship between the first outer surface of the device under test and the first antenna or the first antenna structure.

[0040] According to one embodiment, the first antenna or the first antenna structure is configured to be connected to a signal source and / or a signal receiver via a blind-mate microwave connection (e.g., via a blind-mate (hollow) waveguide connection) when the handler positions the first antenna or the first antenna structure at the operating position (or equivalently, when the handler inserts the angle under test device into the device under test socket, or when the handler pushes the device under test into the device under test socket).

[0041] The signal source enables the first antenna or the first antenna structure to emit a signal (e.g., to be received by the antenna array of the device under test), and / or the signal receiver enables the signal received by the first antenna or the first antenna structure (e.g., emitted by the antenna array of the device under test) to be evaluated. Thus, the use of the signal source and / or the signal receiver facilitates the testing of the device under test. The blind-mate microwave connection facilitates the coupling of the signal source to the first antenna or the first antenna structure and the coupling of the signal receiver to the first antenna or the first antenna structure (e.g., manually and / or automatically). Also, the blind-mate microwave connection enables at least a part of the first antenna or the first antenna structure to be removed, improving the accessibility of the device under test socket.

[0042] According to one embodiment, the test mechanism is such that the second antenna or second antenna structure (e.g., a single aperture antenna (e.g., of dual linear polarization or circular polarization)) is arranged on or within the second outer surface of the angle test device so as to receive signals radiated from an antenna or antenna structure provided on or within the second outer surface of the angle test device (at least when the second antenna or second antenna structure is disposed at the operating position) (or equivalently, when the handler inserts the angle test device into the test socket or when the handler pushes the device under test into the test socket), and / or is configured to emit signals to be received by an antenna or antenna structure provided on or within the second outer surface of the angle test device.

[0043] The second antenna or second antenna structure enables testing of the antenna structure on or within the second outer surface and / or enables wireless testing of one or more other components of the device under test. The second antenna or second antenna structure benefits from the orientation of the second outer surface defined by the device under test socket.

[0044] The first and second antennas or first and second antenna structures can test the signals emitted and / or received (e.g., simultaneously or sequentially) by the antennas or antenna structures provided on or within the first and second outer surfaces without reconnecting (or repositioning) the angle test device in different orientations (e.g., or different device under test sockets).

[0045] For example, both the first antenna or first antenna structure and the second antenna or second antenna structure may be provided such that they do not prevent the insertion of the device under test into the device under test socket of the device under test and / or the removal of the device under test from the device under test socket of the device under test.

[0046] According to one embodiment, the test mechanism includes a second antenna or a second antenna structure (e.g., a single aperture antenna (e.g., dual linear polarization or circular polarization)). The aperture of the second antenna or the second antenna structure is such that the normal to the second outer surface of the angled device under test (or, equivalently, the normal to the second inner surface of the device under test socket that abuts the first inner surface of the device under test) extends through the aperture of the second antenna or the second antenna structure (at least when the second antenna or the second antenna structure is disposed in the operating position) (or, equivalently, when the handler inserts the device under test into the test socket, or when the handler pushes the device under test into the test socket). The second antenna or the second antenna structure is provided away from the second outer surface of the angled device under test by a pusher having a low dielectric constant material or an electromagnetic transparent material between the second antenna or the second antenna structure and the second outer surface. The second (and / or first) outer surface may be configured to emit and / or receive a main lobe in a direction perpendicular to the second (and / or first) outer surface (e.g., by beamforming).

[0047] In other words, one or more antennas or antenna structures may be provided on or in the first outer surface of the device under test and / or on or in the second outer surface of the device under test, and one or more of these antennas or antenna structures may have a main lobe direction that is substantially perpendicular to the respective outer surface.

[0048] By providing the normal to the second outer surface passing through the aperture of the second antenna or the second antenna structure, good reception of signals radiated by an antenna or antenna structure provided on or in the second outer surface on the side of the second antenna or the second antenna structure can be achieved. Alternatively or additionally, good reception of signals emitted by the second antenna or the second antenna structure can also be achieved in this way on the side of the antenna or antenna structure provided on or in the second surface.

[0049] According to one embodiment, the antenna aperture surface of the second antenna or the second antenna structure is inclined with respect to the carrier structure (for example, with respect to the surface or main surface of the carrier structure).

[0050] This inclination can improve the electromagnetic coupling between the antenna aperture surface of the second antenna or the second antenna structure and the antenna or antenna structure provided on or within the second outer surface that is also inclined. Further, the inclination of the antenna aperture surface of the second antenna or the second antenna structure may enable the second antenna or the second antenna structure to be provided at an offset distance in a lateral direction (for example, a direction parallel to the surface of the carrier structure) with respect to the device under test socket, thereby facilitating the insertion and / or removal of the device under test.

[0051] According to one embodiment, the antenna aperture surface of the second antenna or the second antenna structure is parallel to the second outer surface of the angle device under test (or equivalently, parallel to the second surface of the device under test socket that contacts the second inner surface of the device under test).

[0052] The parallel arrangement of the antenna aperture surface of the second antenna or the second antenna structure and the second outer surface can improve the electromagnetic coupling between the antenna aperture and the second outer surface.

[0053] According to one embodiment, the second antenna or the second antenna structure is attached so as to have a fixed position with respect to the device under test socket.

[0054] Such a fixed position enables multiple devices under test to be repeatedly coupled and tested so that the multiple devices under test have equal or similar geometric relationships with respect to the second antenna or the second antenna structure. As a result, the accuracy and reproducibility of the test can be improved.

[0055] According to one embodiment, the second antenna or the second antenna structure is mechanically coupled (e.g., attached) to the arm of a handler configured to insert a device under test into a device under test socket such that the second antenna or the second antenna structure is movable.

[0056] The movable second antenna or second antenna structure may facilitate access to the device under test socket (e.g., for insertion and / or removal of the device under test). Further, the movable second antenna or second antenna structure may enable adjustment of the position and / or orientation of the second antenna or second antenna structure relative to an angled second outer surface (e.g., when using sockets having different tilt angles or when testing the angle dependence of transmission and / or reception of the device under test).

[0057] According to one embodiment, the first antenna or the first antenna structure and / or the second antenna or the second antenna structure is part of a pusher for pushing a device under test into a device under test socket. Alternatively, the first antenna or the first antenna structure and / or the second antenna or the second antenna structure may be configured to move with a pusher for pushing a device under test into a device under test socket (where, for example, the pusher is provided such that when the device under test is inserted into the device under test socket, the pusher or a part of the pusher is between the first antenna or the first antenna structure and the first outer surface of the angled device under test). (Here, for example, the pusher is provided such that when the device under test is inserted into the device under test socket, the pusher or a part of the pusher is between the second antenna or the second antenna structure and the second outer surface of the angled device under test).

[0058] Thus, for example, at least a part of the first and / or second antenna or the first and / or second antenna structure is movable with the pusher and can thus be moved (e.g., to facilitate the coupling of the angle test device to the test device socket) or repositioned (e.g., its orientation). For example, if the pusher is configured to push the test device into the test device socket, the pusher can facilitate the coupling and positioning of the second antenna or the second antenna structure during the coupling of the test device to the test device socket. Since the positional relationship between the first and second antennas or the first and second antenna structures and the test device can be well defined by the spacer (e.g., when the spacer directly abuts against the outer surface of the test device and the antenna opening surfaces of the first and second antennas or the first and second antenna structures), when the first and second antennas or the first and second antenna structures are movable with the pusher, the position of these components, and thus the reproducibility of the test, is higher.

[0059] According to one embodiment, the second antenna or the second antenna structure is configured to be connected to a signal source and / or a signal receiver via a blind mating microwave connection (e.g., via a blind mating waveguide connection) when the handler positions the second antenna or the second antenna structure in the operating position (or equivalently, when the handler inserts the angle test device into the test socket, or when the handler pushes the test device into the test socket).

[0060] The signal source enables the second antenna or second antenna structure to emit a signal (e.g., to be received by the antenna array of the device under test), and / or the signal receiver enables the signal received by the second antenna or second antenna structure (e.g., emitted by the antenna array of the device under test) to be evaluated. Thus, the use of the signal source and / or signal receiver facilitates the testing of the device under test. The blind mating microwave connection facilitates the coupling of the signal source to the first antenna or first antenna structure and / or the coupling of the signal receiver to the second antenna or second antenna structure (e.g., manually and / or automatically). Also, the blind mating microwave connection enables at least a portion of the second antenna or second antenna structure to be removed, improving the accessibility of the device under test socket.

[0061] According to one embodiment, the test mechanism comprises a pusher for pushing the device under test into the test socket. The pusher may be configured such that when the pusher is in the pushing position, the first pushing surface is parallel to the first outer surface of the device under test and when the pusher is in the pushing position, the second pushing surface is parallel to the second outer surface of the device under test.

[0062] Thus, the first and second pushing surfaces can simultaneously abut (push against) the first and second outer surfaces (e.g., when the pusher is pushed towards the carrier structure). Thus, the pusher can exert a relatively homogeneous force on the device under test. Further, the first and second pushing surfaces can fix the position and orientation of the device under test in a reliable manner.

[0063] According to one embodiment, the testing mechanism includes a pusher for pushing an angle device under test into a test socket. The pusher is configured such that when the pusher is in the pushing position, for example, for pushing the angle device under test into the device under test socket, a first pushing surface of the pusher is inclined with respect to the carrier structure, for example, inclined with respect to a surface or a main surface. The pusher is configured such that when the pusher is in the pushing position, a second pushing surface of the pusher is inclined with respect to the carrier structure, for example, with respect to the surface or the main surface of the carrier structure.

[0064] The inclination angles of the first and second pressing surfaces improve the alignment of the device under test when the pusher abuts against one or more inclined surfaces of the device under test, when the device under test moves into the device under test socket, or when the device under test is positioned within the device under test socket.

[0065] According to one embodiment, the device under test socket has an angle recess or an angle removal portion configured to support and / or align the angle device under test. The angle recess may have a boundary surrounding at least a portion of the angle recess or the angle removal portion.

[0066] The angle recess or the angle removal portion can improve the alignment of the device under test within the device under test socket. The alignment is at least partially guided by the boundary of the angle recess. The boundary line may be configured to support the pusher, for example, to reduce excessive force applied to the device under test. For example, the angle recess may be configured to assist the self-alignment of the device under test by having, for example, a somewhat inclined side surface.

[0067] According to one embodiment, the device under test socket is such that the second inner surface of the angled device under test on the opposite side of the second outer surface of the angled device under test (and / or the first inner surface of the angled device under test on the opposite side of the second outer surface of the angled device under test, or the first inner surface of the angled device under test on the opposite side of the first outer surface of the angled device under test) is at least 10 mm, or at least 30 mm, or at least 45 mm, or at least 2 wavelengths, or at least 3 wavelengths, or at least 4 wavelengths (e.g., free space wavelength, or wavelength in the medium between the first outer surface of the device under test and the carrier structure) away from the carrier structure (e.g., load board) at the minimum operating frequency of the device under test (e.g., the minimum operating frequency of the module of the antenna-in-package (AiP) that constitutes or is included in the device under test), preferably such that the end of the first outer surface is at least 10 mm, or at least 20 mm, or at least 2 wavelengths, or at least 3 wavelengths, or at least 4 wavelengths, e.g., free space wavelength, or at least 3 wavelengths, or at least 4 wavelengths (e.g., free space wavelength, or wavelength in the medium between the first outer surface of the device under test and the carrier structure) away from the load board at the minimum operating frequency of the device under test).

[0068] It is recognized that the spacing between the inner surfaces of the device under test further reduces the interference of electromagnetic radiation caused by the carrier structure that is emitted by or received by the device under test.

[0069] According to one embodiment, the device-under-test socket has a maximum socket height (e.g., the height at which the inner end of the angled device-under-test is located when the angled device-under-test is placed in the device-under-test socket) of at least 10 mm, or at least 30 mm, or at least 45 mm, or at least two wavelengths, or at least three wavelengths, or at least four wavelengths (e.g., free-space wavelength, or wavelength in the medium between the first outer surface of the device-under-test and the carrier structure) at the minimum operating frequency of the device-under-test (e.g., the minimum operating frequency of the antenna-in-package (AiP) module that constitutes or is included in the device-under-test).

[0070] Such a shape of the device-under-test socket that creates a distance between the device-under-test and the carrier structure is recognized to result in an interference that is sufficiently small with respect to the electromagnetic radiation emitted or received by the device-under-test and caused by the carrier structure.

[0071] According to one embodiment, the first antenna or first antenna structure and the second antenna or second antenna structure are provided such that the device-under-test can be inserted into the device-under-test socket in a direction perpendicular to the surface (e.g., the main surface) of the carrier structure without moving the first antenna and the second antenna. Alternatively or additionally, the first antenna or first antenna structure and the second antenna or second antenna structure may be provided such that the device-under-test can be removed from the device-under-test socket in a direction perpendicular to the surface (e.g., the main surface) of the carrier structure without moving the first antenna and the second antenna.

[0072] Inserting and / or removing the device under test without moving the first and second antenna structures improves the test efficiency and reliability for testing one or more devices under test. Implementing such an arrangement can be facilitated by the fact that at least the first outer surface of the device under test is inclined. Thus, at least the first antenna or the first antenna structure may be laterally offset for an inclined path for transmission of electromagnetic signals (between the first antenna or the first antenna structure and the first outer surface of the device under test).

[0073] According to one embodiment, the spacing between the first antenna or the first antenna structure and the second antenna or the second antenna structure is selected such that the angled device under test can move linearly (e.g., in a straight line) through the spacing in a direction perpendicular to the surface (e.g., the main surface) of the carrier structure. Thus, insertion and removal of the device under test can be performed in a very efficient and rapid manner.

[0074] According to one embodiment, a test mechanism for OTA testing an angled (e.g., L-shaped) device under test (e.g., an L-shaped antenna-in-package device under test) is provided. The test mechanism includes a carrier structure (e.g., a PCB test fixture or a load board), and a device under test socket coupled to the carrier structure (e.g., directly or via an extender assembly and / or a PCB interposer between the carrier structure and the device under test socket). The device under test socket is configured to establish electrical contact with the inner surface of the angled (e.g., L-shaped) device under test (e.g., the inner surface of the angled device under test on the opposite side of the second outer surface of the angled device under test) or a connector provided on the inner surface of the angled (e.g., L-shaped) device under test. The device under test socket is configured to position the angled device under test such that the first outer surface of the angled (e.g., L-shaped) device under test is inclined at least 15 degrees with respect to the surface (e.g., the main surface) of the carrier structure (e.g., a PCB test fixture or a load board). The device under test socket is configured to position the angled device under test such that the second outer surface of the angled (e.g., L-shaped) device under test is inclined at least 15 degrees with respect to the surface (e.g., the main surface) of the carrier structure (e.g., a PCB test fixture or a load board). This test mechanism has the same advantages as the above-described test mechanism. This test mechanism can be optionally supplemented individually and in combination by any of the features, functions, and details disclosed herein.

Brief Description of the Drawings

[0075] The drawings are not necessarily to scale and instead generally focus on illustrating the principles of the present invention. In the following description, various embodiments of the present invention are described with reference to the following drawings.

Figure 1

Figure 2A

Figure 2B

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7A

Figure 7B

Figure 8

Figure 9

Mode for Carrying Out the Invention

[0076] Detailed Description of the Embodiment In the following description, elements that are equivalent or have equivalent functions, even if they appear in different figures, are denoted by equivalent or equivalent reference numerals.

[0077] In the following description, a plurality of details are described in order to provide a more overall description of the embodiments of the present invention. However, it will be apparent to those skilled in the art that the embodiments of the present invention can be implemented without these specific details. In other examples, well-known structures and devices are shown in the form of block diagrams rather than in detail in order to avoid obscuring the embodiments of the present invention. Furthermore, the features of different embodiments described hereinafter can be arbitrarily combined with each other unless otherwise specified.

[0078] FIG. 1 shows a schematic cross-section of an example of a test mechanism 100 for OTA testing of an angle test device 140.

[0079] The test mechanism 100 includes a carrier structure 110 and a device-under-test socket 130 coupled to the carrier structure 110. The device-under-test socket 130 is configured to establish electrical contact with an inner surface 142 of the angle test device 140 or a connector (not shown in FIG. 1) provided on the inner surface 140 of the angle test device 140. The device-under-test socket 130 is configured to position the angle test device 140 such that a first outer surface of the angle test device is tilted by an amount of a first angle 120 of at least 15 degrees with respect to a surface 112 of the carrier structure 110.

[0080] The carrier structure 110 may be (or may be configured as) a printed circuit board (PCB) test device or a load board. The carrier structure 110 may have, for example, a region having a flat surface. The device-under-test socket 130 may be provided on the carrier structure 110 (e.g., on a flat surface) and may be coupled to the carrier structure 110 via one or more intermediate devices.

[0081] The test mechanism 100 shown in FIG. 1 can be used, for example, to test the angle test device 140 itself (e.g., without an antenna structure for detecting electromagnetic radiation emitted by the angle test device) or to test the angle test device 140 in combination with one or more additional antennas. For example, the test mechanism 100 may be used to test the power consumption of the device-under-test 140 or the interference between antennas of the device-under-test 140. Alternatively, the test mechanism 100 may be configured to wirelessly test one or more antenna structures of the device-under-test.

[0082] The test device socket 130 is configured to contact the inner surface 142 of the test device, so the outer surface of the test device 140 is completely (or at least mostly) separated from the test device socket 130 and the carrier 110. Thus, the influence of the test device socket 130 and / or the carrier structure 110 on the radiation emitted (and / or received) by the outer surface of the test device 140 (and on its test) is reduced. Further, the first angle 120 of at least 15 degrees enables the first outer surface 144a and the second outer surface 144b to face away from the carrier structure 110. Thus, the first and second outer surfaces 144a, b have improved accessibility from above, for example, for attachment and for transmission and / or reception. The inclined angle facilitates alignment with the surface of the test device socket 130 when a force perpendicular to the surface of the carrier structure 110 (e.g., gravity) is applied to the test device 140.

[0083] The angle test device 140 may be a device of an antenna in package (AiP) (or may have an antenna in package (AiP) device). The test device 140 may have an L-shaped configuration (as abstractly shown in FIG. 1). For example, the test device may be a device having a first plate 141a connected to a second plate 141b, and the plates 141a, 141b are angled with respect to each other at at least substantially 90 degrees (e.g., within a tolerance of ±15 degrees). The angle test device 140 may have a first outer surface 144a (e.g., of the first plate 141a) and a second outer surface 144b (e.g., of the second plate 141b). The first and second outer surfaces 144a, b are angled with respect to each other at at least substantially 270 degrees (e.g., within a tolerance of ±15 degrees). The inner surface 142 of the angle test device 140 may have a first inner surface 142a (e.g., of the first plate 141a) and a second inner surface 142b (e.g., of the second plate 141b), and the first and second inner surfaces 142a, b are angled with respect to each other at at least substantially 90 degrees (e.g., within a tolerance of ±15 degrees). The first inner surface 142a and the first outer surface 144a may be provided parallel to each other. The second inner surface 142b and the second outer surface 144b may be provided parallel to each other.

[0084] FIG. 2A shows a schematic cross-section of a first example of an angle test device 240 that may substitute for the angle test device 140.

[0085] The test device 240 has a first plate 241a and a second plate 241b, and these plates are angled with respect to each other at an angle of 90 degrees (e.g., within a tolerance of ±15 degrees). The first plate 241a has a first outer surface 244a and a first inner surface 242a, and the second plate 241b has a second outer surface 244b and a second inner surface 242b.

[0086] In the example shown in FIG. 2A, the first outer surface 244a has a first antenna array 246a that includes four antenna elements. However, the first outer surface 244a may have (additionally or alternatively) any other form of antenna (e.g., a single antenna and / or a circularly polarized antenna) and any other number of antenna elements or antenna arrays. Alternatively, the second outer surface 244b may have the first antenna array 246a. The first antenna array 246a may be configured to receive and / or transmit electromagnetic radiation.

[0087] The device under test 240 may further include a connector 248, e.g., an array connector. In the example shown in FIG. 2A, the (array) connector 248 is provided on the second inner surface 242b. Alternatively, the (array) connector 248 may be provided on the first inner surface 242a or (e.g., in the case of multiple (array) connectors 248) on the first and second inner surfaces 242a, b. The (array) connector 248 is electrically connected to at least one antenna element (e.g., all antenna elements) of the first antenna array 246a. Thus, an electrical signal applied to the (array) connector 248 can cause the first antenna array 246a to emit electromagnetic radiation. Alternatively or additionally, electromagnetic radiation received by the first antenna array 246a may result in an electrical signal at the (array) connector 248. The (array) connector 248 may be or include one or more ball bonds. The (array) connector 248 may be configured to connect the device under test 140 (e.g., an antenna of a package module) to a system (e.g., a mobile phone or a device under test socket 130) and may enable the transmission of signals such as power signals, digital signals, radio frequency (RF) signals, or intermediate frequency (IF) signals.

[0088] The first antenna array 246a may be directly electrically connected to the (array) connector 248, or may be coupled to the (array) connector 248 indirectly, for example, with additional electrical components interposed therebetween. For example, the additional electrical components may include at least one of an amplifier, a filter, a switch, a resistor, a capacitor, and an integrated circuit. In the example shown in FIG. 2A, the additional electrical components include an antenna circuit 249 (e.g., a silicon die). The antenna circuit 249 may be configured to convert an intermediate frequency (IF) signal into a millimeter wave signal (e.g., in the 5G band such as in the range of 24 GHz to 53 GHz) and / or vice versa. Alternatively or additionally, the antenna circuit 249 may be configured to (at least partially) control the beamforming of the first antenna array 246a.

[0089] FIG. 2B shows a schematic cross-section of a second example of an angle test device 240a that can replace the angle test device 140. The second example of the angle test device 240a essentially corresponds to the first example of the angle test device 240 as shown in FIG. 2A such that identical elements are designated by identical reference numerals, but further includes a second antenna array 246b on the second outer surface 244b. The second antenna array 246b may have similar (or identical) characteristics to the first antenna array 246a. Also, the second antenna array 246b may be electrically connected to at least one of the (array) connector 248 and the antenna circuit 249. Alternatively, the second antenna array 246b may be electrically connected to a separate (array) connector and / or a separate antenna circuit.

[0090] The device-under-test socket 130 may be configured to position the angle device-under-test 140 (e.g., angle device-under-test 240 or angle device-under-test 240a) such that the first outer surface 144a (e.g., first outer surface 244a) of the angle device-under-test 140 is spaced from the surface 112 of the carrier structure 110 and / or faces away from the surface 112 of the carrier structure 110. The device-under-test socket 130 may be configured to position the angle device-under-test 140 such that the normal line 143a of the first outer surface 144a of the angle device-under-test 140 is inclined at an angle of at least 15 degrees with respect to the normal line of the surface 112 of the carrier structure 110. The device-under-test socket 130 may be configured to position the angle device-under-test 140 such that the normal line 143b of the second outer surface 144b of the angle device-under-test 140 is inclined at an angle of at least 15 degrees with respect to the normal line of the surface 112 of the carrier structure 110.

[0091] The device-under-test socket 130 is preferably provided such that the ends of the first and / or second outer surfaces 144a, b are spaced from the carrier structure 110 by at least 10 mm, or at least 20 mm, or at least two wavelengths, or at least three wavelengths, or at least four wavelengths (e.g., free space wavelength or wavelength in the medium between the first and / or second outer surfaces 844a, b of the device-under-test 840 and the carrier structure 810), or at least three wavelengths, or at least four wavelengths at the minimum operating frequency of the angle device-under-test (e.g., the minimum operating frequency of the module of the antenna-in-package (AiP) that constitutes or is included in the device-under-test). The angle device-under-test 140 can operate in a frequency band of the 5G standard, e.g., a band in the range of 24 GHz to 53 GHz (e.g., 5G frequency band 2). In such a case, the minimum operating frequency may be 24 GHz with a wavelength of 12.5 mm. The space between the ends of the first and / or second outer surfaces 144a, b and the surface 112 of the carrier structure 110 may be 25 mm or more (i.e., twice 12.5 mm).

[0092] FIG. 3 shows a perspective view of an angle test device 340 that can replace the angle test device 140.

[0093] The angle test device 340 includes a first outer surface 344a having a first antenna array including four antenna elements, and a second outer surface 344b having a second antenna array including four antenna elements. At least one antenna element may include at least one parasitic patch. In the example shown in FIG. 3, each antenna element includes four parasitic patches. The first outer surface 344a has two central antenna elements 345a, b. There is no metallized surface in the vicinity of the test device 340 that can replace the angle test device 140.

[0094] FIG. 4 shows the results of a simulation of the far-field radiated by an antenna element (e.g., one of the central antenna elements 345a, b) on the first outer surface 344a of the test device 340 depicted in FIG. 3. The far-field shows a prominent lobe directed in a direction perpendicular to the two central antenna elements 345a, b on the first outer surface 344a (however, when the test device 340 is applied to a system (e.g., a system providing a metallized backplane), the radiation in the rear direction can be reduced or suppressed).

[0095] FIG. 5 shows a perspective view of an angle test device 540 that can replace the angle test device 140. The test device 540 includes a first outer surface 544a having a first antenna array including four antenna elements, and a second outer surface 544b having a second antenna array including four antenna elements. The first outer surface 544a has two central antenna elements 545a, b, and there is a metal (e.g., copper) surface 550 at a distance of 2 mm from the first outer surface 544a.

[0096] FIG. 6 shows the results of a simulation of the far field (preferably taking into account the metal surface 550) radiated by an antenna element (e.g., one of the central antenna elements 545a, b) of the first antenna array on the first outer surface 544a of the device under test 530 depicted in FIG. 5. Compared with the results depicted in FIG. 4, the far field does not show as prominently the radiation directed in a direction perpendicular to the antenna elements of the first antenna array on the first outer surface 544a. Instead, the intensity of the far field is more evenly distributed around the device under test 540, and there are separate main lobes in two directions different from the direction of the surface normal on the first outer surface 544a. This result indicates that a nearby metallized surface can affect the far field radiated by the device under test 540 and thus potentially reduce the accuracy and / or reproducibility of the test. For example, the metallized surface can reduce the spatial selectivity of a beamforming antenna array and / or change the direction of the main lobe.

[0097] Accordingly, the angle (and optionally the spacing) between the first outer surface 144a and the surface 112 of the carrier structure 110 as described above is directed in a direction that distances the electric field emitted by and / or received at the first outer surface 114a (and optionally the second outer surface 144b) from the carrier structure 110, and as a result, the accuracy and / or reproducibility of the test can be improved.

[0098] FIG. 7A shows a perspective view of an example of an angle test device 740 that can replace the angle test device 140. The test device 740 has a first inner surface 742a and a second inner surface 742b. In the example shown in FIG. 7A, the test device has a first plate 741a including the first inner surface 742a and a second plate 741b including the second inner surface 742b. The first and second plates 741a, b are mechanically (and optionally electrically) connected by a flexible conductive structure such as three flexible printed circuits 747a, b, c. The first and second plates 741a, b may be movable (e.g., foldable) relative to each other (e.g., to facilitate manufacturing assembly in a system). However, the mobility of the plates may, in some cases, facilitate attachment to the test device. Alternatively, the first and second plates 741a, b may be fixedly provided relative to each other.

[0099] The test device 740 has an (array) connector 748 and a silicon die 749 (or any other antenna circuit) on the second inner surface 742b. The silicon die 749 can be in electrical contact indirectly via the (array) connector 748 or directly via an electrical contact (not shown in FIG. 7A) of the silicon die 749 itself. The test device socket described herein is configured to establish electrical contact with the inner surface of the test device 740, such as the (array) connector 748 on the second inner surface 742b (e.g., by forming each antenna structure).

[0100] FIG. 7B shows a different perspective view of the device under test 740 depicted in FIG. 7A. The device under test 740 has a first outer surface 744a (on the first plate 741a) and a second outer surface 744b (on the second plate 741b). The first and second outer surfaces 744a, b are configured to emit and / or receive electromagnetic radiation (e.g., by forming respective antenna structures). For this purpose, antenna elements (e.g., antenna arrays) may be provided at least partially on the first and / or second surfaces 744a, b, or may be provided at least partially within the first and / or second plates 741a, b. Alternatively, only the first or second outer surface 744a, b may be configured to emit and / or receive electromagnetic radiation.

[0101] As seen in FIG. 1, the second outer surface 144b forms a second angle 122 with the surface 112 of the carrier structure 110. The device under test socket 130 may be configured to position the angle device under test 140 such that the second outer surface 144b of the angle device under test 140 is inclined at a second angle 122 of at least 15 degrees with respect to the surface 112 of the carrier structure 110.

[0102] For example, the first angle 120 may be (at least substantially) 15°, 22.5°, 30°, 45°, 60°, 67.5°, or 75°. Similarly, the second angle 122 may be (at least substantially) 15°, 22.5°, 30°, 45°, 60°, 67.5°, or 75°. The first and second inner surfaces 142a, b may form a right angle. In such a case, the first and second angles 120, 122 are added to 90°. For example, the first and second angles 120 may be 15° and 75°, 22.5° and 67.5°, 30° and 60°, or 45° and 45° (i.e., a right triangle of an isosceles triangle).

[0103] The test socket 130 has (at least) two support surfaces 131a, b that support two inner surfaces 142a, b of the angled device under test 140. The two support surfaces 131a, b may be provided at least substantially at right angles (i.e., 90°). At least one of the two support surfaces 131a, b may be formed recessed within the device under test socket 130. The two support surfaces 131a, b may both be inclined at least 15° with respect to a surface 112 (e.g., a main surface) of the carrier structure 110 (e.g., a PCB test apparatus or a load board). For example, the two support surfaces 131a, b may be provided with respect to each other at at least substantially the same angle (e.g., 90 degrees) as the two inner surfaces 142a, b. At least one of the two support surfaces 131a, b may be provided at first and second angles 120, 122 respectively (e.g., 15°, 22.5°, 30°, 45°, 60°, 67.5° or 75°, or vice versa).

[0104] FIG. 8 shows a schematic cross-section of an example of a test mechanism 800 for OTA testing of an angled device under test 840.

[0105] The test mechanism 800 includes a carrier structure 810 (which may be any carrier structure described herein) and a device under test socket 830 (which may be any device under test socket described herein).

[0106] In the example shown in FIG. 8, the test mechanism 800 is provided on the surface 812 of the carrier structure 810 and includes a support structure 860 having a triangular cross-section (e.g., in a plane perpendicular to the plane in which the carrier structure 810 lies). The support structure 860 may be configured to support the device-under-test socket 830 (e.g., directly or with one or more layers therebetween). The support structure 860 may include attachment features configured to attach the support structure 860 to the carrier structure 110. The attachment features may include at least one of an opening (e.g., configured to receive a screw), a screw, a magnet, and a pin. The support structure 860 may be composed of, or composed of, a dielectric material and / or a metal. The support structure 860 may have (e.g., internal) electrical connections for establishing an electrical connection, for example, between the device-under-test socket 830 and the carrier structure 810 (and / or any other device).

[0107] As shown in FIG. 8, the test mechanism 800 may be provided with a planar conductor structure 862 (e.g., a flexible or membrane or elastomeric printed circuit board) that is flexible or a membrane or an elastomer, provided to make a connection between the surface 812 of the carrier structure 810 and the surface of the device-under-test socket 830 that is inclined with respect to the surface 812 of the carrier structure 810 (e.g., to route an electrical signal to the device-under-test socket 830). In the example shown in FIG. 8, the planar conductor structure 862 covers two surfaces of the support structure 860. Alternatively, the planar conductor structure 862 may cover only one surface (at least in part) of the support structure 860. As yet another alternative, the planar conductor structure 862 may be provided between the support structure 860 and the carrier structure 810.

[0108] As shown in FIG. 8, a flexible or membrane or elastomeric planar conductor structure 862 may be electrically coupled to the surface of the carrier structure 810 and have at least one bend so as to align with the lower surface of the device-under-test socket 830. The flexible or membrane or elastomeric planar conductor structure 862 may (at least partially) extend over the surface of the support structure 860. The support structure 860 may be provided on the surface 812 of the carrier structure 810 and may have a triangular cross-section (e.g., in a plane perpendicular to the plane in which the carrier structure lies). This cross-section may have the shape of an (e.g., right-angled) isosceles triangle.

[0109] The support structure 860 may be configured to support the device-under-test socket 830 (e.g., directly or with one or more layers in between). For this purpose, the support structure 860 may be (directly or indirectly) attached to the device-under-test socket 830 (e.g., to facilitate handling) or may be removable from the device-under-test socket 830 (e.g., for different combinations of device-under-test sockets). The flexible or membrane or elastomeric planar conductor structure 862 may be partially provided between the support structure 860 and the device-under-test socket 830. A further layer (e.g., at least one of a shock-absorbing layer and a height-adjusting layer) may be provided between the planar conductor structure 862 and at least one of the device-under-test socket 830 and the support structure 860.

[0110] In the example shown in FIG. 8, the device-under-test socket 830 has one or more coaxial pogo pins 832 to establish electrical connection with the angled device-under-test 830.

[0111] The coaxial pogo pin 832 may extend, for example, from the lower surface of the device under test socket 830 that contacts a carrier structure 810 (e.g., a PCB test apparatus or a load board), or contacts a support structure 860, or contacts a planar conductor structure 862 of a flexible or membrane or elastomer, to the upper surface of the device under test socket 830 that contacts the inner surface 842 (e.g., the first and / or second inner surface) of the angled device under test 840.

[0112] The first end of the coaxial pogo pin 832 may contact a pad on the carrier structure 810 (e.g., on a PCB test apparatus or on a load board), or on the support structure 860, or on a planar conductor structure 862 of a flexible or membrane or elastomer. The second end of the coaxial pogo pin may contact a pad on the device under test 840, or a connector of the device under test 840. One or both ends of the coaxial pogo pin 832 may be retractable. For example, the first end of the coaxial pin 832 may be retractable when the device under test 840 is inserted into the device under test socket 830. Alternatively or additionally, the second end of the coaxial pin 832 may be retractable when the device under test socket 830 is provided on the support structure 860 and / or on a planar conductor structure 862 of a flexible or membrane or elastomer.

[0113] The test mechanism 800 may include one or more antenna structures. For example, the test mechanism 800 may include a first antenna or first antenna structure 850 (e.g., a single aperture antenna (e.g., of dual linear polarization or circular polarization)) configured to receive signals radiated from the first outer surface 844a of the angled device under test 840 and / or configured to emit signals received at the first outer surface 844a of the angled device under test 840.

[0114] The first antenna or first antenna structure 850 may have an aperture that is fed, for example, by a waveguide.

[0115] The aperture plane of the first antenna or the first antenna structure 850 may be provided away from the first outer surface 844a of the device under test 840 such that the normal to the first outer surface of the device under test (at least when the second antenna or the second antenna structure is disposed in the operating position) extends through the aperture plane of the first antenna or the first antenna structure.

[0116] The distance from the first outer surface 844a can be realized by a pusher 854 including a low dielectric constant material or an electromagnetic transparent material provided between the first antenna or the first antenna structure 850 and the first outer surface 844a. The pusher 854 can be configured to push the device under test 840 into the device under test socket 830. For this purpose, the pusher 854 may include an attachment element configured to attach the pusher 854 to the carrier structure 810 (either directly or indirectly).

[0117] The antenna aperture plane of the first antenna or the first antenna structure 850 may be inclined with respect to the carrier structure 810 (for example, with respect to the surface or the main surface 812 of the carrier structure 810). The antenna aperture plane may be inclined at least substantially at a first angle between the first outer surface 844a and the surface 812 of the carrier structure 810. The antenna aperture plane of the first antenna or the first antenna structure 850 may be provided at least substantially parallel to the first outer surface 844a. In the example shown in FIG. 8, the antenna aperture plane of the first antenna or the first antenna structure 850 and the first outer surface 844a are inclined at 45° with respect to the surface 812 of the carrier structure 810. Alternatively, the antenna aperture plane of the first antenna or the first antenna structure 850 and the first outer surface 844a may be inclined at different angles.

[0118] The first antenna or the first antenna structure 850 may be attached so as to have a fixed position with respect to the device under test socket 830. For this purpose, the first antenna or the first antenna structure 850 and the device under test socket 830 may both have fixed positions with respect to the carrier structure 810. Alternatively, the first antenna or the first antenna structure 850 may have an adjustable position with respect to the device under test socket 830.

[0119] The first antenna or first antenna structure 850 may be mechanically coupled (e.g., attached) to the arm of a handler (e.g., pusher 854) such that the first antenna or first antenna structure 850 is movable.

[0120] The arm of the handler may be configured to insert the device under test 840 into the device under test socket 830 and / or push the device under test 840 into the device under test socket 830.

[0121] The first antenna or first antenna structure 850 may be configured to be connected to the first signal source and / or the first signal receiver 856a via a blind mating microwave connection (e.g., via a blind mating waveguide connection) when the handler positions the first antenna or first antenna structure 850 in the operating position (or equivalently, when the handler inserts the device under test 840 into the device under test socket 830 or when the handler pushes the device under test 840 into the device under test socket 830).

[0122] In the example shown in FIG. 8, the first antenna or first antenna structure 850 has (or is connected to) a first coaxial cable 853a that is connected (or connectable) to the first signal source and / or the first signal receiver 856a. However, any other form of electrical signal transmission may alternatively be used. Alternatively or additionally, the first antenna or first antenna structure 850 may be connected to any other device. The first coaxial cable 853a may extend through the opening. Alternatively, the coaxial cable 853a may extend without passing through the opening (e.g., extending on the same side as the device under test socket 840 and / or the first antenna or first antenna structure 850).

[0123] As shown in FIG. 8, the test mechanism 800 is configured such that the second antenna or second antenna structure 952 (e.g., a single aperture antenna (e.g., of dual linear polarization or circular polarization)) receives signals radiated from the second outer surface 844b of the device under test 840 and / or emits signals received at the second outer surface 844b of the device under test 840 (at least when the second antenna or second antenna structure 852 is disposed in the operating position, or equivalently, when the handler inserts the device under test 840 into the test socket 830, or when the handler pushes the device under test 840 into the test socket 830). The second antenna or second antenna structure 852 may have an aperture fed, for example, by a waveguide.

[0124] The aperture of the second antenna or second antenna structure 852 is provided away from the second outer surface 844b of the device under test 840 (at least when the second antenna or second antenna structure 852 is disposed in the operating position, or equivalently, when the handler inserts the device under test 840 into the test socket 830, or when the handler pushes the device under test 840 into the test socket 830) such that the normal to the second outer surface 844b of the device under test 840 extends through the aperture of the second antenna or second antenna structure 852 (e.g., with a pusher 854 including a low dielectric constant material or an electromagnetic transparent material between the second antenna or second antenna structure 852 and the second outer surface 844b).

[0125] The distance from the second outer surface 844b can be realized using the pusher 854. The pusher 854 may include a low dielectric constant material or an electromagnetic transparent material provided between the second antenna or second antenna structure 852 and the second outer surface 844b. In the example shown in FIG. 8, the test mechanism 800 includes a common pusher 854 for the first and second antennas or first and second antenna structures 850, 852 (and the first and second outer surfaces 844a, b). Alternatively, separate pushers may be provided for each of the first and second antenna structures 850, 852 (and / or their respective first and second outer surfaces 844a, b).

[0126] The antenna aperture plane of the second antenna or the second antenna structure 852 may be inclined with respect to the carrier structure 810 (e.g., with respect to the surface or main surface of the carrier structure). The antenna aperture plane of the second antenna or the second antenna structure 852 may be inclined at least substantially at a second angle between the second outer surface 844b and the surface 812 of the carrier structure 810. The antenna aperture plane of the second antenna or the second antenna structure 852 may be provided at least substantially parallel to the second outer surface 844b. In the example shown in FIG. 8, the antenna aperture plane of the second antenna or the second antenna structure 852 and the second outer surface 844b are inclined at 45° with respect to the surface 812 of the carrier structure 810. Alternatively, the antenna aperture plane of the second antenna or the second antenna structure 852 and the second outer surface 844b may be inclined at different angles.

[0127] The second antenna or the second antenna structure 852 may be attached so as to have a fixed position with respect to the device under test socket 830. For this purpose, the second antenna or the second antenna structure 852 and the device under test socket 830 may both have a fixed position with respect to the carrier structure 810. Alternatively, the second antenna or the second antenna structure 852 may have an adjustable position with respect to the device under test socket 830.

[0128] The second antenna or the second antenna structure 852 may be mechanically coupled (e.g., attached) to the arm of a handler (e.g., in the form of a pusher 854) such that the second antenna or the second antenna structure is movable. The handler may be configured to insert the device under test 840 into the device under test socket 830. The arm of the handler may be configured to insert the device under test 840 into the device under test socket 830 and / or to push the device under test 840 into the device under test socket 830.

[0129] The first antenna or first antenna structure 850 and / or the second antenna or second antenna structure 852 may be part of a pusher for pushing the device under test 840 into the device under test socket 830. The first antenna or second antenna structure 850 and / or the second antenna or second antenna structure 852 may be configured to be movable together with a pusher for pushing the device under test 840 into the device under test socket. For example, the pusher may be provided such that when the device under test 840 is inserted into the device under test socket 830, the pusher or a part of the pusher is between the first antenna or first antenna structure 850 and the first outer surface 844a of the angled device under test 840. For example, the pusher may be provided such that when the device under test 840 is inserted into the device under test socket 830, the pusher or a part of the pusher is between the second antenna or second antenna structure 852 and the second outer surface 844b of the angled device under test 840. The pusher may include one or more openings. The openings are connected to a waveguide configured to transmit electromagnetic waves between the openings and at least one of the first and second antennas or first and second antenna structures 850, 852.

[0130] The second antenna or second antenna structure 852 may be configured to be connected to the second signal source and / or the second signal receiver 856b via a blind mating microwave connection (e.g., via a blind mating waveguide connection) when the handler positions the second antenna or second antenna structure 852 in the operating position (or equivalently, when the handler inserts the device under test into the test socket, or when the handler pushes the device under test into the test socket).

[0131] Note that the test mechanism 800 shown in FIG. 8 has two separate signal sources and / or signal receivers 856a, b. However, the test mechanism 800 may have a common (e.g., single) signal source and / or signal receiver, which may be connected to the first and second antennas or the first and second antenna structures 950, 952 by separate or common electrical connections (such as coaxial cables).

[0132] The pusher 854 may be configured such that when the pusher is in the pushed-in position, the first pushing surface 855a is parallel to the first outer surface 844a of the angled device under test 840, and when the pusher is in the pushed-in position, the second pushing surface 855b is parallel to the second outer surface 844b of the angled device under test 840. In the example shown in FIG. 8, the first and second outer surfaces 844a, b are provided at right angles (i.e., 90°) to each other, and the first and second pushing surfaces 855a, b of the pusher 852 are also provided at right angles to each other. At least one of the first and second pushing surfaces 855a, b may be formed in a recess of the pusher 854, for example, to facilitate alignment between the pusher 854 and the device under test 840. The pusher 854 may further have a recess configured to receive at least a portion of the device under test socket 830 when the pusher 854 pushes the device under test 840 into the device under test socket 830.

[0133] The pusher 854 can be configured such that when the pusher 854 is in the pushed-in position, the first pushing surface 855a of the pusher 854 is inclined with respect to the carrier structure 810. The pusher 854 is configured such that when the pusher 854 is in the pushed-in position, the second pushing surface 855b of the pusher 854 is inclined with respect to the carrier structure 810.

[0134] In the example shown in FIG. 8, the opening surfaces of the first and second antennas or the first and second antenna structures 850, 852 are provided parallel to the first and second outer surfaces 844a, b of the device under test 840 when coupled to the device under test socket 830. As a result, the pusher 854 can have a first outer pusher surface 857a provided parallel to the first pushing surface 855a and a second outer pusher surface 857b provided parallel to the second pushing surface 855b.

[0135] However, the opening surfaces of the first and second antennas or the first and second antenna structures 850, 852 may be provided at an angle different from the outer surfaces 844a, b. For example, the first and second outer surfaces 844a, b may be provided at angles of 40° and 50° respectively with respect to the surface 812 of the carrier structure 810, and the opening surfaces of the first and second antennas or the first and second antenna structures 850, 852 may be provided at 45° with respect to the surface 812 of the carrier structure 810. The pusher 854 may be configured to compensate for the angular misalignment between the opening surfaces of the first and second antennas or the first and second antenna structures 850, 852 and the first and second outer surfaces 844a, b. For example, the first and second outer pusher surfaces 857a may be provided to be inclined 5° with respect to the first and second pushing surfaces 855a, b. Alternatively or additionally, at least one of the first and second antennas or the first and second antenna structures 850, 852 may be configured to be adjustable in at least one of position and orientation.

[0136] The test device socket 830 may have an angled recess or angled cutout 834 configured to support and / or align the angled test device 840. In the example shown in FIG. 8, the angled recess or angled cutout 834 has an L-shaped cross-section, for example, in the form of two plates provided at a right angle. The angled recess or angled cutout 834 may have one or two lateral sidewalls (e.g., parallel to the cross-section of the angled recess or angled cutout 834) to reduce lateral movement of the test device 840 within the test device socket 830. The angled recess or angled cutout 834 may be bordered by a step. In the example shown in FIG. 8, the step has a height that is at least substantially the same as the distance between the first inner surface and the first outer surface 844a of the test device 840. As a result, the first outer surface 844 is provided in the same plane as the step of the test device socket 830. Alternatively, the step may have a large height (e.g., to provide support for the pusher 846) or a small height (e.g., not to limit the pressure applied to the test device 840 by the pusher 846). Note in FIG. 8 that the first and second pushing surfaces 855a, b are larger in dimension than the first and second outer surfaces 844a, b. Alternatively, the first and second pushing surfaces 855a, b may be at least substantially the same as or smaller in dimension than the first and second outer surfaces 844a, b.

[0137] The device under test 840 may have a first inner surface 842a of the angled device under test 840 on the side opposite to the first outer surface 844a of the angled device under test 840. The device under test 840 may have a second inner surface 842b of the angled device under test 840 on the side opposite to the second outer surface 844b of the device under test 840. The device under test socket 830 may be provided such that the first inner surface 842a and / or the second inner surface 842b of the angled device under test 840 is spaced from the carrier structure 810 (e.g., a load board) by at least 10 mm, or at least 30 mm, or at least 45 mm, or at least 2 wavelengths, or at least 3 wavelengths, or at least 4 wavelengths (e.g., free space wavelength, or wavelength in the medium between the first outer surface of the angled device under test and the carrier structure) at the minimum operating frequency of the angled device under test.

[0138] For example, the minimum operating frequency may be the minimum operating frequency of a module of an antenna-in-package (AiP) that constitutes or is included in the device under test 840.

[0139] The device under test socket 830 is preferably provided such that the ends of the first and / or second outer surfaces 844a, b are spaced from the load board by at least 10 mm, or at least 20 mm, or at least 2 wavelengths, or at least 3 wavelengths, or at least 4 wavelengths (e.g., free space wavelength, or wavelength in the medium between the first and / or second outer surfaces 844a, b of the device under test 840 and the carrier structure 810) at the minimum operating frequency of the device under test (e.g., the minimum operating frequency of a module of an antenna-in-package (AiP) that constitutes or is included in the device under test).

[0140] The test device socket 830 may have a maximum socket height 836 of at least 10 mm, or at least 30 mm, or at least 45 mm, or at least two wavelengths, or at least three wavelengths, or at least four wavelengths (e.g., free space wavelength, or wavelength in the medium between the ends of the two support surfaces of the test device socket 830 and the carrier structure 810) (e.g., exceeding the surface 812 of the carrier structure 810) at the minimum operating frequency of the angled test device (e.g., the minimum operating frequency of the antenna-in-package (AiP) module that constitutes or is included in the test device 840). The maximum socket height 836 may be a height exceeding the carrier structure 810 at which the inner end of the angled test device 840 is located when the test device 840 is disposed in the test device socket 830. The maximum socket height 836 may be a height exceeding the carrier structure 810 at which the end between the two support surfaces of the test device socket 830 is located.

[0141] The first antenna or first antenna structure 850 and the second antenna or second antenna structure 852 may be provided such that the test device 840 can be inserted into the test device socket 830 in a direction perpendicular to the surface 812 (e.g., the main surface) of the carrier structure 810 without moving the first and second antennas 850, 852. Alternatively or additionally, the first antenna or first antenna structure 850 and the second antenna or second antenna structure 852 may be provided such that the test device 840 can be removed from the test device socket 830 in a direction perpendicular to the surface 812 (e.g., the main surface) of the carrier structure 810 without moving the first antenna or first antenna structure 850 and the second antenna or second antenna structure 852. The pusher 854 can be dimensioned such that the pusher 854 abuts against the test device 840 and the first and second antennas or first and second antenna structures 850, 852 when the test device 840, the pusher 854, and the first and second antennas or first and second antenna structures 850, 852 are in the operating position.

[0142] The spacing between the first antenna or first antenna structure 850 and the second antenna or second antenna structure 852 (e.g., in a direction parallel to the surface 812 of the carrier structure 810) may be selected such that the angle test device can move linearly (e.g., in a straight line) through that spacing in a direction perpendicular to the surface (e.g., the main surface) of the carrier structure. The spacing may be selected such that the antenna device 840 can be moved through that spacing with at least substantially no rotation, or with rotation involving the first or second outer surfaces 844a, b (or inner surfaces) facing at least substantially parallel to the surface 812 of the carrier structure 810. The spacing may be wider than 5, 10, or 20% of the width of the test device 840, with or without rotation.

[0143] FIG. 9 shows a perspective view of an example of a test device socket 930 that can be used in any of the embodiments disclosed herein.

[0144] The test device socket 930 can be configured to receive any test device described herein and to be part of any test mechanism described herein. The test device socket 930 may be configured to be coupled to (e.g., inserted into) any support structure (e.g., support structure 860) described herein, and optionally, additional components such as a flexible or membrane or elastomeric planar conductor structure 862 may be at least partially provided between the test device socket 930 and the support structure.

[0145] The test device socket 930 has an angled recess or angled removal portion 960 configured to support and / or align an angled test device. The angled recess or angled removal portion 960 has a first support table surface 962a configured to abut against a first inner surface of the test device (e.g., the first inner surfaces 142a, 242a, or 742a), and a second support table surface 962b configured to abut against a second inner surface of the test device (e.g., the second inner surfaces 142b, 242b, or 742b). The first support table surface 862a and the second support table surface 962b may be provided at a support table surface angle. The sum of the support table surface angle (e.g., 270 degrees) and the angle between the first inner surface and the second inner surface of the test device (e.g., 90 degrees) is at least substantially 360 degrees. For example, if the first inner surface and the second inner surface of the test device can be provided at an angle of 90 degrees, the support table surface angle may be 270 degrees (the sum of 90 degrees and 270 degrees is 360 degrees).

[0146] Any surface of the device-under-test socket 930 may be configured to establish electrical contact with the inner surface of the device-under-test. For example, the first and / or second support surfaces 962a, b may be configured to establish electrical contact with the inner surface of the device-under-test and / or to provide a ground plane for the antenna structure of the device-under-test. For this purpose, the first and / or second support surfaces 962a, b may have a conductive material (e.g., at least one of gold, copper, iron, and nickel) and may be formed of the conductive material. Alternatively, the first and / or second support surfaces may have or be formed of a dielectric (non-conductive) material (e.g., a wear-resistant material). Optionally, the first and / or second support surfaces 962a, b may have one or more (local) socket connectors 965 (or other contact structures for contacting the device-under-test, such as conductive pads, pogo pins, spring contacts, etc.). The socket connector 965 is provided such that when the device-under-test is provided within the device-under-test socket 960, the connector 965 establishes an electrical connection with the inner surface of the device-under-test or its connector (e.g., array connectors 248, 748).

[0147] The test device socket 930 has a support 964 including a main socket structure 964a and a leg socket structure 964b. The main socket structure 964a and the leg socket structure 964b both have the outer shape of a rectangular cube (optionally including rounded edges), and at least two edges of the leg socket structure 964b are smaller (shorter) than two edges (e.g., corresponding edges) of the main socket structure 964a. The main socket structure 964a and the leg socket structure 964b may have, for example, the same height. The side surface of the leg socket structure 964b is provided in the same plane as the side surface of the main socket structure 964a, and the other three side surfaces of the leg socket structure 964b are recessed with respect to the other three (corresponding) side surfaces of the main socket structure 964a. Thus, the leg socket structure 964b may be received by an opening of a carrier structure (or an extender structure coupled to the carrier structure) such that, for example, lateral movement of the test device socket 930 is restricted by the side surface of the leg socket structure 964b. However, the test device socket may be mounted on the extender structure, in which case the main socket structure 964a is provided on the upper surface of the extender structure and the leg socket structure 964b may be adjacent to the side wall of the extender structure.

[0148] The test device socket 930 may further or alternatively include one or more protrusions 966 extending in a direction from the support 964 (e.g., from the main socket structure 964a) toward the carrier structure. The protrusion 966 may be a shaft (e.g., having a cylindrical shape) and may have a shaft. The protrusion 966 may be received by a recess of the carrier structure. Alternatively or additionally, the test device socket 930 may include one or more through holes configured to receive attachment elements such as pins or screws.

[0149] In the example shown in FIG. 9, the angle recess or angle removal portion 960 extends to the main socket structure 964a and the leg socket structure 964b. Alternatively, the angle recess or angle removal portion 960 may extend only to the main socket structure 964a.

[0150] The angle recess or angle removal portion 960 may have respective side walls 968a, b at both ends thereof (only one of which is directly visible in FIG. 9). The side walls 968a, b face each other and are provided at least substantially parallel to each other (any taper is ignored). In the example shown in FIG. 9, the side walls 968a, b are directed in a direction perpendicular or at least substantially perpendicular to the first and second support surfaces 962a, b. The side walls 968a, b can limit the lateral movement of the device under test within the angle recess or angle removal portion 960, while on the other hand allowing a smooth and well-guided insertion of the device under test into the angle recess or angle removal portion 960 and allowing a smooth extraction of the device under test. Alternatively, the angle recess or angle removal portion 960 may have only one side wall or no side walls, for example, to increase flexibility regarding positioning.

[0151] The angle recess or angle removal portion 960 may have at least one taper such that, for example, the cross-section decreases in a direction from the outside (for example, parallel to the first or second support surface 962a, b) towards the first or second support surface 962b. In the example shown in FIG. 9, the angle recess or angle removal portion 960 has a first and a second taper. According to the first taper, the distance between the side walls 968a, b decreases towards the first support surface 962a. According to the second taper, the three side walls of the main socket structure 964a surrounding the second support surface 962b have a cross-section that decreases towards the second support surface 962b. This taper has a self-centering function and can facilitate the insertion of the device under test into the angle recess or angle removal portion 960.

[0152] The device-under-test socket 930 may have adjacent openings 969 that intersect with the angle recess or angle removal portion 960. In the example shown in FIG. 9, the device-under-test socket 930 has four adjacent openings 969 provided adjacent to the corner of the second support table surface 962b. Alternatively, the device-under-test socket 930 may have any other number of adjacent openings 969 at any other position adjacent to the second support table surface 962b (and / or the first support table surface 962a). At least one of the adjacent openings 969 may be configured to receive a screw having a screw head configured to abut against the first surface or the second surface on the outside of the device-under-test when the device-under-test is inserted into the angle removal portion 960 and the screw is screwed in. Thus, the adjacent openings 969 can enable the device-under-test to be attached to the device-under-test socket 930. Alternatively or additionally, at least one of the adjacent openings 969 may be configured to receive a gripping element (such as a clamping device or a user's finger) so that the gripping element can touch the device-under-test laterally (for example, for inserting the device-under-test into the device-under-test socket and / or for removing the device-under-test from the device-under-test socket 930). For example, the adjacent openings may be adapted to prevent the device-under-test from tilting when the device-under-test is inserted into the socket 930, for example. However, the adjacent openings can also help to remove the device-under-test from the socket 930.

[0153] The angle recess or angle removal portion 960 may have additional recesses or heights, for example, to conform to the shape of the device-under-test. For example, the angle recess or angle removal portion 960 shown in FIG. 9 has a step 967 on the first support table surface 962a. This step 967 can provide a support surface for the device-under-test, for example, to conform to the structural features of the first inner surface or to form a lower space (for example, for gripping the device-under-test).

[0154] The device under test socket 930 may have a blind mating interface. In the example shown in FIG. 9, the main socket structure 964a has two (e.g., blind) mating recesses 963a, b. Alternatively, the main socket structure 964a may have other quantities of mating recesses. The mating recesses 963a, b are configured to receive (e.g., blind) mating protrusions of a pusher or handler (e.g., handler 754). Alternatively or additionally, the main socket structure 964a may have one or more (e.g., blind) mating protrusions configured to be received by, for example, (e.g., blind) mating recesses of a pusher or handler (e.g., handler 754).

[0155] In conclusion, the socket 930 may receive the device under test and establish electrical contact with the device under test. The device under test may be positioned (aligned) within the angle recess or angle removal portion 960 such that OTA testing of the device under test using an antenna structure or antenna on both outer surfaces of the angled device under test is possible. The device under test is well-aligned within the socket, and the distortion of the radiation characteristics of the antenna or antenna structure of the device under test by the socket can be kept moderately small. The socket can be easily attached to the carrier structure and can be used in any of the embodiments disclosed herein.

Claims

1. A test mechanism for performing an OTA test on an angle test device, wherein the test mechanism comprises a carrier structure, the test mechanism comprises a device under test socket coupled to the carrier structure, the device under test socket is configured to establish electrical contact with the inner surface of the angle test device or a connector provided on the inner surface of the angle test device, and the device under test socket is configured to position the angle test device such that a first outer surface of the angle test device is inclined at least 15 degrees with respect to the surface of the carrier structure, Test mechanism.

2. The device under test socket is configured to position the angle test device such that a second outer surface of the angle test device is inclined at least 15 degrees with respect to the surface of the carrier structure, The test mechanism according to claim 1.

3. The test socket has two support surfaces for supporting two inner surfaces of the angle test device, both of the two support surfaces are inclined at least 15 degrees with respect to the surface of the carrier structure, The test device according to claim 1 or 2.

4. The test mechanism comprises a support structure provided on the surface of the carrier structure and having a triangular cross-section, the support structure is configured to support the device under test socket, The test mechanism according to any one of claims 1 to 3.

5. The test mechanism comprises a flexible or membrane or elastomeric planar conductor structure provided to make a connection between the surface of the carrier structure and the surface of the device under test socket inclined with respect to the surface of the carrier structure, The test mechanism according to any one of claims 1 to 4.

6. The flexible or membrane or elastomeric planar conductor structure is electrically coupled to the surface of the carrier structure and has at least one bend that aligns with the lower surface of the device under test socket, The test mechanism according to claim 5.

7. The flexible or membrane or elastomeric planar conductor structure extends on the surface of the support structure, the support structure is provided on the surface of the carrier structure and has a triangular cross-section, the support structure is configured to support the device under test socket, The planar conductor structure of the flexible or membrane or elastomer is partially provided between the support structure and the device under test socket. The test mechanism according to claim 5 or 6.

8. The device under test socket has one or more coaxial pogo pins to establish electrical connection with the angled device under test. The test mechanism according to any one of claims 1 to 7.

9. The test mechanism comprises a first antenna or first antenna structure configured to receive signals radiated from the first outer surface of the angled device under test and / or to emit signals received at the first outer surface of the angled device under test. The test mechanism according to any one of claims 1 to 8.

10. The test mechanism comprises a first antenna or first antenna structure. The opening surface of the first antenna or first antenna structure is provided away from the first outer surface of the angled device under test such that the surface normal of the first outer surface of the angled device under test extends through the opening surface of the first antenna or first antenna structure. The test mechanism according to any one of claims 1 to 9.

11. The antenna opening surface of the first antenna or first antenna structure is inclined with respect to the carrier structure. The test mechanism according to any one of claims 8 to 10.

12. The antenna opening surface of the first antenna or first antenna structure is parallel to the first outer surface of the angled device under test. The test mechanism according to any one of claims 9 to 11.

13. The first antenna or first antenna structure is mounted to have a fixed position relative to the device under test socket. The test mechanism according to any one of claims 9 to 12.

14. The first antenna or first antenna structure is mechanically coupled to the arm of a handler such that the first antenna or first antenna structure is movable. The test mechanism according to any one of claims 9 to 13.

15. The first antenna or first antenna structure is configured to be connected to a signal source and / or a signal receiver via a blind mating microwave connection when the handler positions the first antenna or first antenna structure in an operating position. The test mechanism according to any one of claims 9 to 14.

16. The test mechanism is configured to receive a signal radiated from the second outer surface of the angle test device and / or includes a second antenna or a second antenna structure configured to emit a signal received at the second outer surface of the angle test device. The test mechanism according to any one of claims 1 to 15.

17. The test mechanism includes a second antenna or a second antenna structure. The opening surface of the second antenna or the second antenna structure is provided away from the second outer surface of the angle test device such that the surface normal of the second outer surface of the angle test device extends through the opening surface of the second antenna or the second antenna structure. The test mechanism according to any one of claims 1 to 16.

18. The antenna opening surface of the second antenna or the second antenna structure is inclined with respect to the carrier structure. The test mechanism according to claim 16 or 17.

19. The antenna opening surface of the second antenna or the second antenna structure is parallel to the second outer surface of the angle test device. The test mechanism according to any one of claims 16 to 18.

20. The second antenna or the second antenna structure is attached so as to have a fixed position with respect to the test device socket. The test mechanism according to any one of claims 16 to 19.

21. The second antenna or the second antenna structure is mechanically coupled to the arm of a handler such that the second antenna or the second antenna structure is movable. The test mechanism according to any one of claims 16 to 20.

22. The first antenna or the first antenna structure and / or the second antenna or the second antenna structure is part of a pusher for pushing the angle test device into the test device socket, or The first antenna or the first antenna structure and / or the second antenna or the second antenna structure is configured to be movable together with a pusher for pushing the angle test device into the test device socket. The test mechanism according to any one of claims 16 to 21.

23. The second antenna or the second antenna structure is configured to be connected to a signal source and / or a signal receiver via a blind mating microwave connection when the handler places the second antenna or the second antenna structure in the operating position. The test mechanism according to any one of claims 16 to 22. **Claim 24** The test mechanism includes a pusher for pushing the angle device under test into the test socket. The pusher is configured such that when the pusher is in the pushing position, a first pushing surface is parallel to the first outer surface of the angle device under test, and The pusher is configured such that when the pusher is in the pushing position, a second pushing surface is parallel to the second outer surface of the angle device under test. The test mechanism according to any one of claims 1 to 23. **Claim 25** The test mechanism includes a pusher for pushing the angle device under test into the test socket. The pusher is configured such that when the pusher is in the pushing position, a first pushing surface of the pusher is inclined with respect to the carrier structure, and The pusher is configured such that when the pusher is in the pushing position, a second pushing surface of the pusher is inclined with respect to the carrier structure. The test mechanism according to any one of claims 1 to 24. **Claim 26** The device under test socket has an angle recess or an angle removal portion configured to support and / or align the angle device under test. The test mechanism according to any one of claims 1 to 25. **Claim 27** The second inner surface of the angle device under test, which is on the opposite side of the second outer surface of the angle device under test, is provided to be separated from the carrier structure by at least 10 mm, or at least 30 mm, or at least 45 mm, or at least two wavelengths, or at least three wavelengths, or at least four wavelengths at the minimum operating frequency of the angle device under test. The test mechanism according to any one of claims 1 to 26. **Claim 28** The test device socket has a maximum socket height of at least 10 mm, or at least 30 mm, or at least 45 mm, or at least two wavelengths, or at least three wavelengths, or at least four wavelengths at the minimum operating frequency of the angle test device. The test mechanism according to any one of claims 1 to 27.

29. The first antenna or first antenna structure and the second antenna or second antenna structure are provided such that the angle test device can be inserted into the test device socket in a direction perpendicular to the surface of the carrier structure without moving the first antenna or first antenna structure and the second antenna or second antenna structure, and / or The first antenna or first antenna structure and the second antenna or second antenna structure are provided such that the angle test device can be removed from the test device socket in a direction perpendicular to the surface of the carrier structure without moving the first antenna or first antenna structure and the second antenna or second antenna structure. The test mechanism according to any one of claims 1 to 28.

30. The distance between the first antenna or first antenna structure and the second antenna or second antenna structure is selected such that the angle test device can move linearly through the distance in a direction perpendicular to the surface of the carrier structure. The test mechanism according to any one of claims 1 to 29.

31. A test mechanism for OTA testing an angle test device, The test mechanism includes a carrier structure, The test mechanism includes a test device socket coupled to the carrier structure, The test device socket is configured to establish electrical contact with the inner surface of the angle test device or a connector provided on the inner surface of the angle test device, The test device socket, - such that the first outer surface of the angle test device is inclined at least 15 degrees with respect to the surface of the carrier structure, and - such that the second outer surface of the angle test device is inclined at least 15 degrees with respect to the surface of the carrier structure, is configured to position the angle test device. Test mechanism.

Images