Resin composition and lighting device containing the same

Abstract

The resin composition according to the embodiment includes an oligomer, a monomer, a photoinitiator, and an additive. The oligomer includes 10% to 25% by weight based on the entire resin composition. The monomer includes 60% to 70% by weight based on the entire resin composition. The photoinitiator includes 0.5% to 1.2% by weight based on the entire resin composition. The additive includes a first additive containing a radical scavenger and a second additive containing a peroxide decomposer. The photoinitiator contains phosphorus (P). The second additive contains phosphorus (P). The weight percentage of the photoinitiator is greater than the respective weight percentages of the first additive and the second additive.

Description

Technical Field

[0001] Examples relate to a resin composition and a lighting device including the same.

Background Art

[0002] Lighting applications include not only vehicle lighting but also backlights for displays and signboards.

[0003] Light emitting elements, such as light emitting diodes (LEDs), have advantages such as low power consumption, semi-permanent life, fast response speed, safety, and environmental friendliness compared to existing light sources such as fluorescent lamps and incandescent lamps. The light emitting diodes are applied to various lighting devices such as various display devices, indoor lights, or outdoor lights.

[0004] Recently, as a vehicle light source, a lamp that employs a light emitting diode, that is, a lighting device has been proposed. Compared with an incandescent lamp, the light emitting diode is advantageous in that the power consumption is small. However, since the emission angle of the light emitted from the light emitting diode is small, when the light emitting diode is used as a vehicle lamp, it is necessary to increase the light emitting area of the lamp using the light emitting diode.

[0005] Since the size of the light emitting diode is small, the degree of freedom in lamp design can be increased, and it is also economical due to its semi-permanent life.

[0006] On the other hand, since the lamp is applied to a vehicle, heat may be generated above the set temperature during driving of the lamp. Such heat may cause yellowing in the optical resin forming the lamp. Such yellowing may reduce the reliability of the optical resin, and thereby the reliability of the lamp may also be reduced at the same time.

[0007] Therefore, a resin composition that can solve the above problems and a lighting device including the same are required.

Summary of the Invention

Problems to be Solved by the Invention

[0008] The examples aim to provide a resin composition in which the occurrence of yellowing is suppressed and which has improved reliability, and a lighting device including the same.

Means for Solving the Problems

[0009] The resin composition according to the examples includes an oligomer, a monomer, a photoinitiator, and an additive. The oligomer includes 10% to 25% by weight based on the total amount of the resin composition. The monomer includes 60% to 70% by weight based on the total amount of the resin composition. The photoinitiator includes 0.5% to 1.2% by weight based on the total amount of the resin composition. The additive includes a first additive containing a radical scavenger and a second additive containing a peroxide decomposer. The photoinitiator contains phosphorus (P). The second additive contains phosphorus (P). The weight percentage of the photoinitiator is greater than the respective weight percentages of the first additive and the second additive.

[0010] The resin composition according to the examples includes an oligomer, a monomer, a photoinitiator, a first additive, and a second additive. The oligomer includes 10% to 25% by weight based on the total amount of the resin composition. The monomer includes 60% to 70% by weight based on the total amount of the resin composition. The photoinitiator includes 0.5% to 1.2% by weight based on the total amount of the resin composition. The sum of the weight percentage of the first additive and the weight percentage of the second additive includes 0.5% to 1.6% by weight based on the total amount of the resin composition. The first additive contains a radical scavenger. The second additive contains a peroxide decomposer. The photoinitiator contains phosphorus (P). The second additive contains phosphorus (P). The 31 P-NMR peak area of the second additive is 31 10% to 90% or more of the P-NMR peak area of the photoinitiator.

Advantages of the Invention

[0011] The resin composition according to the embodiment can improve the reliability of the resin layer formed by curing the resin composition.

[0012] Specifically, the photoinitiator of the resin composition can have a decomposition temperature within a set size range. Thereby, the photoinitiator can have improved heat resistance. Thereby, when the lighting device including the resin layer is applied to a vehicle or the like and operates, it is possible to reduce the decomposition of the photoinitiator by the heat generated. That is, it is possible to prevent the photoinitiator from decomposing to form radicals. Therefore, the occurrence of yellowing of the resin layer can be reduced.

[0013] In addition, the photoinitiator of the resin composition can absorb light having a wavelength within a set size range. Thereby, it is possible to minimize the absorption of light in the infrared wavelength band by the photoinitiator. Therefore, since it is possible to prevent the photoinitiator from absorbing the blue light emitted from the light-emitting element, it is possible to prevent a reduction in the luminance of the lighting device.

[0014] In addition, the resin composition can include an additive. Thereby, it is possible to reduce the occurrence of yellowing in the resin layer.

[0015] The resin composition according to the embodiment can include a first additive that removes radicals formed in the residual photoinitiator. Further, the resin composition can include a second additive that removes peroxides formed by the radicals formed in the residual photoinitiator. Thereby, the resin composition according to the embodiment can reduce the yellowing of the resin layer and improve the reliability of the lighting module.

Brief Description of the Drawings

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[0017] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the technical idea of the present invention is not limited to some of the described embodiments, and can be realized in various different forms. Within the scope of the technical idea of the present invention, one or more of the constituent elements can be selectively combined and replaced between the embodiments and used.

[0018] Furthermore, unless otherwise clearly defined and described, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as meanings that would be commonly understood by a person of ordinary skill in the art to which the present invention belongs, and commonly used terms, such as dictionary-defined terms, may be interpreted in light of the contextual meaning of the relevant art.

[0019] Furthermore, terms used in the embodiments of the present invention are intended to describe the embodiments and are not intended to limit the present invention. In this specification, the singular form can also include the plural form unless otherwise specified in the phrase, and when it is stated as "A and (and) at least one (or more) of B and C," it can include one or more of all possible combinations of A, B, and C.

[0020] Furthermore, in describing components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. are used only to distinguish the component from other components, and the term does not limit the essence, order, or sequence of the corresponding component.

[0021] Furthermore, when a component is described as being "connected," "coupled," or "connected" to another component, it includes not only cases where the component is directly connected, coupled, or connected to the other component, but also cases where the component is "connected," "coupled," or "connected" by other components between the component and the other component.

[0022] Furthermore, when a component is described as being formed or positioned "above or below" a component, "above" or "below" includes not only the case where the two components are in direct contact with each other, but also the case where one or more other components are formed or positioned between the two components.

[0023] In addition, when expressed as "above or below", it can include not only the upward direction but also the downward direction with respect to one component.

[0024] The lighting device described below can be applied to various lamp devices required for lighting, such as vehicle lamps, household lighting devices, and industrial lighting devices. For example, when applied to a vehicle lamp, it can be applied to headlamps, side mirror lights, side marker lights, fog lamps, tail lamps, stop lamps, daytime running lights, vehicle interior lighting, door scarfs, rear combination lamps, backup lamps, etc. The lighting device of the present invention can also be applied to indoor and outdoor advertising devices, display devices, and various electric vehicle fields. In addition, it can be applied to all lighting-related fields and advertising-related fields that have been currently developed and commercialized or that can be realized by future technological developments.

[0025] Referring to FIGS. 1 to 6, the lighting device 400 according to the embodiment can include a light-emitting element 100 or a light-emitting chip and a resin layer 420 covering the same. The lighting device 400 can include the light-emitting element 100 or the light-emitting chip and a substrate 401 disposed below the resin layer 420. The lighting device 400 can include at least one of at least one diffusion layer 430, a light-shielding portion 425, and / or a light-transmitting layer above the resin layer 420. The lighting device 400 can include a reflecting member 410 disposed between the substrate 401 and the resin layer 420.

[0026] The lighting device 400 according to the embodiment can emit the light emitted from the light-emitting element 100 as a surface light source. The lighting device 400 can be defined as a light-emitting cell or a light source module. The lighting device 400 can include one light-emitting cell or a plurality of light-emitting cells on the substrate 401.

[0027] The resin layer 420 according to the embodiment can be disposed around the light-emitting element 100 or the light-emitting chip. The resin layer 420 can guide the light emitted from the light-emitting element 100 or the light-emitting chip, and the guided light can be emitted in the form of a surface light source through the emission surface.

[0028] The resin layer 420 can be formed of a resin composition. Specifically, the resin layer 420 can be formed of a resin composition that is cured by light. More specifically, the resin layer 420 can be formed of a resin composition that is cured by ultraviolet rays (UV).

[0029] The resin composition can include an oligomer, a monomer, a photoinitiator, and an additive. The oligomer and the monomer can be related to the physical properties and / or chemical properties of the resin layer 420 formed by curing the resin composition.

[0030] Also, the photoinitiator can play a role in initiating the photopolymerization of the oligomer and the monomer. That is, when ultraviolet rays are incident on the resin composition, the oligomer and the monomer can start a polymerization reaction by the photoinitiator.

[0031] The additive can include an antioxidant. Specifically, the additive can play a role in preventing the modification of the resin layer 420 formed by curing the resin composition. For example, the additive can play a role in preventing the intermolecular bonds of the resin layer 420 from being broken or preventing the occurrence of a yellowing phenomenon in the resin layer 420 due to intermediate products.

[0032] The resin layer 420 formed by curing the resin composition can include a photoinitiator remaining after curing. Such a photoinitiator can generate radicals by heat, and such radicals can break the intermolecular bonds of the resin layer or form intermediate products that react with the radicals to bond. As a result, a yellowing phenomenon may occur in the resin layer 420, and the reliability of the resin layer may decrease.

[0033] Therefore, hereinafter, a resin composition capable of reducing the yellowing phenomenon of the resin layer 420 will be described in detail.

[0034] The resin composition may include an oligomer, a monomer, a photoinitiator, and an additive.

[0035] The oligomer may be related to the ductility, smoothness, tensile strength, and adhesion properties of the resin layer 420.

[0036] The oligomer may include a urethane acrylate. Specifically, the oligomer may include at least one oligomer of a first oligomer and a second oligomer. For example, the oligomer may include a first oligomer including a tetramethylene glycol-based urethane acrylate. Also, the oligomer may include a second oligomer including an ethylene glycol-based urethane acrylate.

[0037] The oligomer may be included within a range of weight % set with respect to the entire resin composition. Specifically, the oligomer may be included at 8 wt% or more with respect to the entire resin composition. More specifically, the oligomer may be included at 10 wt% to 25 wt% with respect to the entire resin composition.

[0038] When the oligomer is included at less than 10 wt% with respect to the entire resin composition, at least one of the ductility, smoothness, tensile strength, and adhesion properties, which are the properties of the resin layer realized by the oligomer, may decrease. Also, when the oligomer is included at more than 25 wt% with respect to the entire resin composition, the properties of the resin layer realized by the oligomer may be maintained. However, this may affect the composition ratios of other components, and overall, the properties of the resin layer for optical applications may decrease.

[0039] The first oligomer and the second oligomer may be contained in different weight percentages. For example, the second oligomer may be contained in a weight percentage less than that of the second oligomer. Specifically, the weight percentage of the second oligomer may be 10% or more of the weight percentage of the first oligomer. More specifically, the weight percentage of the second oligomer may be 10% to 70% of the weight percentage of the first oligomer.

[0040] For example, the first oligomer may be contained in an amount of 8% by weight or more based on the entire resin composition. Specifically, the first oligomer may be contained in an amount of 8% to 20% by weight based on the entire resin composition.

[0041] Also, the second oligomer may be contained in an amount of 1% by weight or more based on the entire resin composition. Specifically, the second oligomer may be contained in an amount of 1% to 5% by weight based on the entire resin composition.

[0042] By setting the weight percentages of the first oligomer and the second oligomer as described above, the properties of ductility, smoothness, tensile strength, and adhesiveness of the resin composition can be stably formed.

[0043] The monomer may be related to the properties of hardness, transparency, adhesion, and heat resistance of the resin layer.

[0044] The monomer can include an acrylate monomer. Specifically, the monomer can include a first monomer, a second monomer, a third monomer, and a fourth monomer. For example, the monomer can include a first monomer containing IBOA (Isobonyl acrylate). Also, the monomer can include a second monomer containing at least one of EHA (2-Ethylhexyl acrylate) and LA (Lauryl Acrylate). Also, the monomer can include a third monomer containing at least one of CA (Caprolactone acrylate) and 2-(2-Ethoxyethoxy)ethyl acrylate. Also, the monomer can include a fourth monomer containing at least one of GMA (Glycidyl methacrylate) and 3,4-epoxycyclohexylmethyl methacrylate).

[0045] The monomer may be included in a range of weight % set with respect to the entire resin composition. Specifically, the monomer may be included in an amount of 60 wt% or more with respect to the entire resin composition. More specifically, the monomer may be included in an amount of 60 wt% to 70 wt% with respect to the entire resin composition.

[0046] When the monomer is included in an amount of less than 60 wt% with respect to the entire resin composition, at least one of the properties of the resin layer realized by the monomer, such as hardness, transparency, adhesion, and heat resistance, may decrease. Also, when the monomer is included in an amount exceeding 70 wt% with respect to the entire resin composition, the properties of the resin layer realized by the monomer can be maintained. However, this may affect the composition ratios of other components, and overall, the properties of the resin layer for optical applications may decrease.

[0047] The first monomer, the second monomer, the third monomer, and the fourth monomer may be included in different weight percentages. For example, the first monomer may be included in a weight percentage greater than that of the second monomer, the third monomer, and the fourth monomer. Also, the third monomer may be included in a weight percentage greater than that of the second monomer and the fourth monomer.

[0048] For example, the first monomer may be included in 40% by weight or more based on the entire resin composition. More specifically, the first monomer may be included in 40% to 50% by weight based on the entire resin composition.

[0049] Also, the second monomer may be included in 3% by weight or more based on the entire resin composition. More specifically, the second monomer may be included in 3% to 18% by weight based on the entire resin composition.

[0050] Also, the third monomer may be included in 15% by weight or more based on the entire resin composition. More specifically, the third monomer may be included in 15% to 30% by weight based on the entire resin composition.

[0051] Also, the fourth monomer may be included in 7% by weight or more based on the entire resin composition. Specifically, the fourth monomer may be included in 7% to 14% by weight based on the entire resin composition.

[0052] By setting the weight percentages of the first monomer, the second monomer, the third monomer, and the fourth monomer as described above, the properties of the hardness, transparency, adhesion, and heat resistance of the resin composition can be stably formed.

[0053] On the other hand, the monomer can further include a polymerization inhibitor. The polymerization inhibitor can play a role in preventing the resin composition from polymerizing again after being cured to form a resin layer.

[0054] The photoinitiator plays a role in initiating the polymerization of the oligomer and the monomer.

[0055] The photoinitiator can have a degradation temperature TD (Degradation Temperature) of a set size. Specifically, the degradation temperature of the photoinitiator may be 150°C or higher. More specifically, the degradation temperature of the photoinitiator may be 170°C or higher. More specifically, the degradation temperature of the photoinitiator may be 150°C to 250°C.

[0056] When the degradation temperature of the photoinitiator is less than 150°C, yellowing may occur in the resin layer due to the photoinitiator. That is, since the photoinitiator has low thermal stability, the photoinitiator can easily generate radicals by the heat generated during the operation of the lighting device including the resin layer. Thereby, the yellowing occurring in the resin layer can be increased by the radicals generated in the photoinitiator.

[0057] The photoinitiator can include a long-wavelength photoinitiator. That is, the photoinitiator can have a peak with a large wavelength in the wavelength band of the ultraviolet region. Specifically, the photoinitiator can absorb light in a set range of wavelength bands. Specifically, the photoinitiator can absorb light in a wavelength band of 250 nm or more. More specifically, the photoinitiator can absorb light in a wavelength band of 250 nm to 400 nm.

[0058] When the photoinitiator absorbs light in a wavelength band of less than 250 nm, the photoinitiator may become a short-wavelength photoinitiator, and thereby the overall absorption wavelength band of the photoinitiator may extend to the infrared region. Thereby, since the photoinitiator can absorb the light of the lighting device and can absorb the light emitted from the light-emitting element of the lighting device, the luminance of the lighting device may decrease.

[0059] In addition, when the photoinitiator absorbs light in a wavelength band exceeding 400 nm, since the photoinitiator absorbs light in the infrared region, the luminance of the lighting device may decrease.

[0060] The photoinitiator may contain phosphorus (P). The photoinitiator may contain a phosphorus-based photoinitiator. Specifically, the photoinitiator may contain a photoinitiator represented by the following Structural Formula 1. That is, the photoinitiator may contain Diphenyl(2,4,6-trimethylbenzoyl)phosphineoxide (diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide).

[0061] [Structural Formula 1] [Chemical Formula]

[0062] The photoinitiator may be contained within a range of weight % set with respect to the entire resin composition. Specifically, the photoinitiator may be contained in an amount of 0.5 wt% or more with respect to the entire resin composition. More specifically, the photoinitiator may be contained in an amount of 0.5 wt% to 1.2 wt% with respect to the entire resin composition.

[0063] When the photoinitiator is contained in an amount of less than 0.5 wt% with respect to the entire resin composition, the polymerization reaction between the monomer and the oligomer may be reduced by the photoinitiator, and the resin composition may not be partially cured. Further, when the photoinitiator is contained in an amount exceeding 1.2 wt% with respect to the entire resin composition, the amount of the photoinitiator remaining after the resin composition is cured may increase. As a result, the yellowing formed in the resin layer due to the remaining photoinitiator may increase.

[0064] The additive may contain an antioxidant. The additive may contain a first additive and a second additive.

[0065] The first additive can include a radical scavenger. More specifically, the first additive can remove radicals generated from the photoinitiator or polymerization inhibitor. For example, the first additive can combine with radicals generated from the photoinitiator or polymerization inhibitor to form alcohol.

[0066] The first additive can include an additive represented by at least one of the following Structural Formula 2, Structural Formula 3, and Structural Formula 4.

[0067] For example, the first additive can be Bis(1,2,2,6,6-pentamethyl-4-piperidyl)sebacate of the following Structural Formula 2.

[0068] [Structural Formula 2] [Chemical Formula]

[0069] Or, the first additive can be Bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate of the following Structural Formula 3.

[0070] [Structural Formula 3] [Chemical Formula]

[0071] Or, the first additive can be Bis(1-octyloxy-2,2,6,6-tetramethyl-4-piperidyl)sebacate of the following Structural Formula 4.

[0072] [Structural Formula 4] [Chemical Formula]

[0073] The first additive may be included in a set range of weight %. Specifically, the first additive may be included in an amount of 0.3 wt% or more based on the entire resin composition. The first additive may be included in an amount of 0.3 wt% to 0.9 wt% based on the entire resin composition.

[0074] When the first additive is included in an amount of less than 0.3 wt% based on the entire resin composition, the radical removal effect by the first additive decreases. As a result, yellowing may occur in the resin layer, and the light transmittance of the resin layer may decrease. Further, when the first additive is included in an amount exceeding 0.9 wt% based on the entire resin composition, the light transmittance of the resin layer may decrease due to the color of the first additive. That is, the color of the radical scavenger (for example, yellow) may affect the color of the resin layer. Therefore, the transparency of the resin layer may decrease, and the light transmittance of the resin layer may decrease.

[0075] The second additive may contain a peroxide decomposer. Specifically, the second additive can remove a peroxide which is an intermediate product formed by radicals generated from the photoinitiator or the polymerization inhibitor. For example, the second additive can react with a peroxide which is an intermediate product formed by bonding to a radical generated from the photoinitiator or the polymerization inhibitor to remove the peroxide.

[0076] The second additive may contain phosphorus (P). The second additive may contain a phosphorus-based additive. The second additive may contain an additive represented by at least one of the following Structural Formulas 5, 6, 7, 8, and 9.

[0077] That is, the second additive may be Bis-(2,4-di-tert.-butylphenol)pentaerythritol diphosphite of Structural Formula 5 below.

[0078] [Structural Formula 5] [Chemical Formula]

[0079] Alternatively, the second additive may be Bis(2,6-di-tert-butyl-4-methylphenyl)-pentaerythritol diphosphite of Structural Formula 6 below.

[0080] [Structural Formula 6] [Chemical Formula]

[0081] Alternatively, the second additive may be 3,9-Bis(octadecyloxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane of Structural Formula 7 below.

[0082] [Structural Formula 7] [Chemical Formula]

[0083] Alternatively, the second additive may be 2,2'―Methylene bis(4,6-di-tert-butylphenyl) iso-octanol phosphate of Structural Formula 8 below.

[0084] [Structural Formula 8] [Chemical Formula]

[0085] Alternatively, the second additive may be Tris(2,4-ditert-butylphenyl)phosphite of Structural Formula 9 below.

[0086] [Structural Formula 9] [Chemical Formula]

[0087] The second additive may be included within a range of weight % set with respect to the entire resin composition. Specifically, the second additive may be included in an amount of 0.2 wt% or more with respect to the entire resin composition. More specifically, the second additive may be included in an amount of 0.2 wt% to 0.7 wt% with respect to the entire resin composition.

[0088] When the second additive is included in an amount of less than 0.2 wt% with respect to the entire resin composition, the peroxide cannot be effectively removed by the second additive. Further, when the second additive is included in an amount exceeding 0.7 wt% with respect to the entire resin composition, the additive remaining after the resin composition is cured can form phosphoric acid and cause yellowing in the resin layer.

[0089] Therefore, the total weight of the additives including the first additive and the second additive may be 0.5 wt% to 1.6 wt% with respect to the entire resin composition. Also, the weight % of the additive and the weight % of the photoinitiator may be different. Specifically, the weight % of the photoinitiator may be greater than the weight % of each of the first additive and the second additive.

[0090] When the weight % of the photoinitiator is included in an amount even greater than the weight % of the additive, the reliability of the resin layer can be improved. Specifically, when the weight % of the photoinitiator is included in an amount even greater than the weight % of the additive, the heat resistance and moisture resistance of the resin layer can be increased.

[0091] Also, the weight % of the first additive and the weight % of the second additive may be different. Specifically, the weight % of the first additive may be greater than the weight % of the second additive. For example, within the range of the weight % of the first additive and the second additive, the weight % of the first additive may be greater than the weight % of the second additive.

[0092] By including a greater weight percentage of the first additive than the second additive, the reliability of the resin layer can be improved. Specifically, by including a greater weight percentage of the first additive than the second additive, the heat resistance and moisture resistance of the resin layer can be increased.

[0093] The resin composition can improve the reliability of a resin layer formed by curing the resin composition.

[0094] Specifically, the photoinitiator of the resin composition can have a decomposition temperature within a set size range. Thereby, the photoinitiator can have improved heat resistance. Thereby, when the lighting device including the resin layer is applied to a vehicle or the like and operates, it is possible to reduce the decomposition of the photoinitiator by the generated heat. That is, it is possible to prevent the photoinitiator from decomposing to form radicals. Therefore, the occurrence of yellowing of the resin layer can be reduced.

[0095] Also, the photoinitiator of the resin composition can absorb light having a wavelength within a set size range. Thereby, it is possible to minimize the absorption of light in the infrared wavelength band by the photoinitiator. Therefore, since it is possible to prevent the photoinitiator from absorbing the blue light emitted from the light-emitting element, it is possible to prevent a decrease in the luminance of the lighting device.

[0096] Also, the resin composition can include an additive. Thereby, it is possible to reduce the occurrence of yellowing in the resin layer.

[0097] FIG. 7 is a diagram for explaining the mechanism of yellowing occurring in the resin layer of the lighting device according to the example.

[0098] FIG. 7(a) is a diagram for explaining yellowing caused by the breaking of intermolecular bonds in the resin layer after the resin composition is cured, and FIG. 7(b) is a diagram for explaining yellowing formed by the polymerization inhibitor contained in the monomer.

[0099] Referring to FIG. 7(a), when heat is applied to the residual photoinitiator at a temperature above a set range, it can decompose. The residual photoinitiator can form radicals while decomposing. Such radicals can decompose the bonds of the resin composition polymerized thereby, and as a result, yellowing may occur in the resin layer.

[0100] Also, intermediate products may be generated by the reaction of the radicals, and yellowing may occur in the resin layer due to such intermediate products.

[0101] Referring to FIG. 7(b), the polymerization inhibitor decomposes while reacting with the radicals generated by the residual photoinitiator, and as a result, yellowing may occur in the resin layer.

[0102] The resin composition according to the example can include a first additive that removes the radicals formed in the residual photoinitiator. Also, the resin composition can include a second additive that removes the peroxide formed by the radicals formed in the residual photoinitiator. Thereby, the resin composition according to the example can reduce the yellowing of the resin layer and improve the reliability of the lighting module.

[0103] Hereinafter, the present invention will be described in more detail through resin compositions according to examples and comparative examples. Such examples are merely presented as illustrations for explaining the present invention in more detail. Therefore, the present invention is not limited to such examples.

[0104] Prepare resin compositions of Examples and Comparative Examples 1 to 4 having compositions as shown in Table 1 below.

[0105] Next, after curing the resin composition to form a resin layer, the reliability in high-temperature operation, thermal shock, and high-temperature / high-humidity operation was measured.

[0106] Also, after only changing the weight percentages of the photoinitiator and additives in the resin composition according to the examples in Table 1, the reliability in high-temperature operation, thermal shock, and high-temperature / high-humidity operation was measured.

[0107] For high-temperature operation, the reliability after 1000 hours at a temperature of 105°C was evaluated. For thermal shock, the reliability after 1000 cycles at temperatures of -40°C and 105°C was evaluated. For high-temperature / high-humidity operation, the reliability after 1000 hours at a temperature of 85°C and a humidity of 85% was evaluated.

[0108]

Table 1

[0109] (Irgacure TPO: Diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide, Additive 1: Bis(1, 2,2,6,6-pentametyl-4-piperidyl)sebacate

[0110] Additive 2: Bis-(2,4-di-tert-butylphenol)pentaerythritol diphosphite))

[0111]

Table 2

[0112] Referring to Table 2, it can be seen that the resin layer cured by the resin composition according to Example 1 has improved reliability compared to the resin layers cured by the resin compositions according to Comparative Examples 1 to 4.

[0113] That is, since the weight percentages of the photoinitiator and additives in the resin composition satisfy the set range, the resin layer cured by the resin composition according to the example can have stable reliability in high-temperature operation, thermal shock, and high-temperature / high-humidity operation.

[0114] On the other hand, since the resin layer cured by the resin compositions according to Comparative Examples 1 to 4 satisfies the range in which the weight percentages of the photoinitiator and additives of the resin composition are set, it cannot have stable reliability in high-temperature / high-humidity operation.

[0115]

Table 3

[0116] (Photoinitiator: Diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide,

[0117] Additive 1: Bis(1, 2, 2, 6, 6-pentamethyl-4-piperidyl)sebacate

[0118] Additive 2: Bis-(2,4-di-tert-butylphenol)pentaerythritol diphosphite))

[0119] Referring to Table 3, it can be seen that the resin layer cured by the resin composition according to the examples has improved reliability within the range of the weight percentages of the over-photoinitiator and additives set.

[0120] That is, referring to Table 3, it can be seen that the resin layer cured by the resin composition according to the examples has improved reliability when the weight percentage of the photoinitiator of the resin composition is included at not less than the total weight percentage of the additives.

[0121] Also, it can be seen that the resin layer cured by the resin composition according to the examples has improved reliability when the weight percentage of Additive 1 of the resin composition is included at not less than the weight percentage of Additive 2. That is, it can be seen that the resin layer cured by the resin composition according to the examples has improved reliability when the weight percentage of the radical scavenger of the resin composition is included at not less than the weight percentage of the peroxide decomposer.

[0122] Figures 8 to 10 are31 It is a figure for explaining the relative ratio of the peak areas of the photoinitiator and the peroxide decomposer in the resin layer measured by P-NMR.

[0123] Figs. 8 to 10 were measured while fixing the weight % of the photoinitiator in the resin layer and changing the weight % of the second additive. 31 P-NMR peak data.

[0124] Specifically, Fig. 8 shows the relative peak data when the resin layer contains 1 wt% of the photoinitiator and 0.1 wt% of the second additive. Fig. 9 shows the relative peak data when the resin layer contains 1 wt% of the photoinitiator and 0.3 wt% of the second additive. Fig. 10 shows the relative peak data when the resin layer contains 1 wt% of the photoinitiator and 0.7 wt% of the second additive. Here, the relative peak data means the relative data of the relative position of the second additive detected by chemically shifting based on the photoinitiator peak position and the area of the second additive detected with 100 as the reference for the area of the photoinitiator peak. Specifically, referring to Fig. 8, the peak position of the photoinitiator is 13.10, and the position of the second additive detected by chemically moving from there is 116.5, indicating that the area of the second additive at this time is 14.26% of the area of the photoinitiator.

[0125] of the resin layer 31 For P-NMR, after dissolving the resin layer in a CDCl3 solvent or a trifluoroacetic acid solvent to form a sample, measurement was carried out using the same amount of the sample. Subsequently, the peaks and peak areas of the photoinitiator and the second additive were measured.

[0126] Referring to Figs. 8 to 10, the photoinitiator and the second additive in the resin composition according to the examples can have different peak areas. Specifically, in the resin composition, the peak area of the photoinitiator with a large peak height may be larger than the peak area of the second additive with a small peak height.

[0127] The peak area of the photoinitiator and the peak area of the second additive can have a ratio within a set range. Specifically, the peak area of the second additive may be 10% or more of the peak area of the photoinitiator. More specifically, the peak area of the second additive may be 40% or more of the peak area of the photoinitiator. Even more specifically, the peak area of the second additive may be 90% or less of the peak area of the photoinitiator.

[0128] For example, the peak area of the second additive may be from 10% to 90% of the peak area of the photoinitiator.

[0129] When the peak area of the second additive is less than 10% of the peak area of the photoinitiator, yellowing of the resin layer can increase. As a result, the reliability of the lighting device to which the resin layer is applied may decrease. Also, when the peak area of the second additive exceeds 90% of the peak area of the photoinitiator, the second additive can form phosphoric acid, and yellowing of the resin layer can increase. As a result, the reliability of the lighting device to which the resin layer is applied may decrease.

[0130] Hereinafter, with reference to FIGS. 1 to 6, other configurations of the lighting device will be described in detail.

[0131] Substrate 401

[0132] Referring to FIGS. 1 to 4, the substrate 401 can include a printed circuit board PCB (Printed Circuit Board). The substrate 410 can include, for example, at least one of a resin-based printed circuit board (PCB), a PCB having a metal core, a flexible PCB, a ceramic PCB, or an FR-4 substrate. When the substrate 401 is arranged as a metal core PCB with a metal layer disposed at the bottom, the heat dissipation efficiency of the light-emitting element 100 can be improved.

[0133] The substrate 401 can be electrically connected to the light-emitting element 100. The substrate 401 includes a wiring layer (not shown) on the upper portion, and the wiring layer can be electrically connected to the light-emitting element 100. When a plurality of the light-emitting elements 100 are arranged on the substrate 401, the plurality of light-emitting elements 100 can be connected in series, parallel, or series-parallel by the wiring layer. The substrate 401 can function as a base member or a support member disposed below the light-emitting element 100 and the resin layer 420.

[0134] The upper surface of the substrate 401 can have an X-Y plane. The upper surface of the substrate 401 can be a flat plane or can have a curved surface. The thickness of the substrate 401 can be a height in the vertical direction or the Z direction. Here, the X direction in the X-Y plane may be the first direction, and the Y direction may be the second direction. The Z direction may be a direction orthogonal to the first and second directions. The length of the substrate 401 in the first direction may be greater than the width in the second direction. The length of the substrate 401 in the first direction may be two times or more, for example, four times or more than the width Y1 in the second direction. The plurality of light-emitting elements 100 can be arranged on the substrate 401 at a predetermined interval in the first direction. The substrate 401 can be provided in a linear or curved bar shape in the direction of the longer length. The substrate 401 can include a light-transmissive material through which light is transmitted through the upper and lower surfaces. The light-transmissive material can include at least one of PET (Polyethylene terephthalate), PS (Polystyrene), and PI (Polyimide).

[0135] The substrate 401 can include, for example, the reflective member 410. The reflective member 410 can be an insulating layer or a reflective material layer that protects a circuit pattern having pads disposed on the substrate 401.

[0136] Light-emitting element 100

[0137] Referring to FIGS. 1 to 4, the light-emitting element 100 is disposed on the substrate 401 and emits light in a first direction. The light-emitting element 100 emits light with the highest intensity in the first direction. The light-emitting element 100 can have an emission surface 81 from which light is emitted, and the emission surface 81 can be disposed, for example, in a third direction or a vertical direction with respect to the horizontal upper surface of the substrate 401. The emission surface 81 can be a vertical plane or can include a concave surface or a convex surface. As shown in FIGS. 7 and 8, the light-emitting element 100 is, for example, disposed on the substrate 401 and can be electrically connected to the pads 403 and 405 of the substrate 401 by the conductive bonding members 203 and 205. The conductive bonding members 203 and 205 can be a solder material or a metal material.

[0138] As another example, the light-emitting elements 100 may be arranged in at least one row in a second direction on the substrate 401, or may be arranged in two rows or more. The one row or two or more rows of light-emitting elements 100 may be arranged in the first direction of the substrate 401, or may be arranged in different directions from each other. The light-emitting elements 100 may be arranged in an M×N matrix, and M and N may be integers of 2 or more.

[0139] As another example, the light-emitting element 100 can be arranged as a first light-emitting element from one end of the substrate 401 and a second light-emitting element in the emission direction of the first light-emitting element. The first light-emitting element and the second light-emitting element irradiate light in the direction of the other end of the substrate 401 or in the first direction. That is, the first light-emitting element irradiates light in the direction of the second light-emitting element, and the second light-emitting element irradiates light in the direction of the other end of the substrate 401 or in the direction opposite to the side where the first light-emitting element is arranged.

[0140] The light-emitting element 100 can be an element having a light-emitting chip 71 inside the body or can include a package in which the light-emitting chip 71 is packaged. The light-emitting chip 71 can be molded by a molding member 80. The light-emitting surface 81 can be the surface of the molding member 80. The molding member 80 can be a transparent resin material such as silicon or epoxy. The light-emitting chip 71 can emit at least one of blue, red, green, ultraviolet (UV), and infrared light, and the light-emitting element 100 can emit at least one of white, blue, red, green, and infrared light. The light-emitting element 100 may be a side view type whose bottom is electrically connected to the substrate 401, but is not limited thereto. As another example, the light-emitting element 100 may be an LED chip or a top view package.

[0141] The light-emitting surface 81 of the light-emitting element 100 can be arranged on at least one side surface rather than the upper surface of the light-emitting element 100. The light-emitting surface 81 may be a side surface adjacent to the substrate 401 among the side surfaces of the light-emitting element 100, or may be a side surface perpendicular to the upper surface of the substrate 401. The light-emitting surface 81 is arranged on a side surface between the bottom surface and the upper surface of the light-emitting element 100 and emits light with the highest intensity in the first direction. The light-emitting surface 81 of the light-emitting element 100 may be a surface adjacent to the reflecting member 410, or may be a surface perpendicular to the upper surface of the substrate 401 or the upper surface of the reflecting member 410.

[0142] A part of the light emitted through the light emitting surface 81 of the light emitting element 100 can travel in a direction parallel to the upper surface of the substrate 401, be reflected by the reflecting member 410, or travel in the direction of the upper surface of the resin layer 420. The thickness of the light emitting element 100 may be, for example, 3 mm or less, for example, in the range of 0.8 mm to 2 mm. The length in the second direction (D1 in FIG. 2) of the light emitting element 100 may be 1.5 times or more the thickness of the light emitting element 100. In such a light emitting element 100, the light distribution emitted in the X direction may have a wider light directivity angle in the ±Y direction than in the ±Z direction. The light directivity angle in the second direction of the light emitting element 100 may be 110 degrees or more, for example, 120 degrees to 160 degrees, or 140 degrees or more. The light directivity angle in the third direction of the light emitting element 100 may have a range of 110 degrees or more, for example, 120 degrees to 140 degrees.

[0143] Reflection member 410

[0144] Referring to FIGS. 1 to 4, the reflecting member 410 may be a layer separately disposed above the substrate 401 or a layer that protects the upper portion of the substrate 401. The reflecting member 410 may be disposed, for example, between the substrate 401 and the resin layer 420. The reflecting member 410 may be provided in the form of a film having a metallic or non-metallic material. The reflecting member 410 may be adhered to the upper surface of the substrate 401. The reflecting member 410 may have an area smaller than the upper surface area of the substrate 401. The reflecting member 410 may be separated from the edge of the substrate 401, and the resin layer 420 may adhere to the substrate 401 in the separated region. At this time, it is possible to prevent the edge of the reflecting member 410 from peeling off.

[0145] The reflective member 410 may include an opening 417 in which the lower part of the light-emitting element 100 is disposed. In the opening 417 of the reflective member 410, a portion where the upper surface of the substrate 401 is exposed and the lower part of the light-emitting element 100 is bonded may be disposed. The size of the opening 417 may be the same as or larger than the size of the light-emitting element 100, but is not limited thereto. The reflective member 410 may be in contact with the upper surface of the substrate 401, or may be adhered between the resin layer 420 and the substrate 401, but is not limited thereto. Here, the reflective member 410 may be removed when a highly reflective material is coated on the upper surface of the substrate 401.

[0146] The reflective member 410 may be formed with a thickness thinner than the thickness of the light-emitting element 100. The thickness of the reflective member 410 may include the range of 0.2 mm ± 0.02 mm. The lower part of the light-emitting element 100 may be penetrated through the opening 417 of the reflective member 410, and the upper part of the light-emitting element 100 may protrude. The light-emitting surface 81 of the light-emitting element 100 may be provided in a direction perpendicular to the upper surface of the reflective member 410.

[0147] The reflective member 410 can include a metallic material or a non-metallic material. The metallic material can include metals such as aluminum, silver, and gold. The non-metallic material can include a plastic material or a resin material. The plastic material can be any one selected from the group consisting of polyethylene, polypropylene, polystyrene, polyvinyl chloride, polychlorinated biphenyl, polyethylene terephthalate, polyvinyl alcohol, polycarbonate, polybutylene terephthalate, polyethylene naphthalate, polyamide, polyacetal, polyphenylene ether, polyamideimide, polyetherimide, polyetheretherketone, polyimide, polytetrafluoroethylene, liquid crystal polymer, fluororesin, copolymers thereof, and mixtures thereof. The resin material can have a reflective material such as silicon or epoxy added thereto, for example, metal oxides such as TiO2, Al2O3, and SiO2. The reflective member 410 can be realized as a single layer or multiple layers, and such a layer structure can improve the light reflection efficiency. The reflective member 410 according to an embodiment of the present invention can increase the amount of light so that the light emits a uniform distribution by reflecting the incident light.

[0148] Referring to FIG. 5, the reflective member 410 can include an adhesive layer L1, a reflective layer L2, and a dot layer L3. The adhesive layer L1 can attach the reflective member 410 to the upper surface of the substrate 401. The adhesive layer L1 is a transparent material and can be an adhesive such as a UV adhesive, silicon, or epoxy.

[0149] The reflective layer L2 can contain a plurality of reflective agents La inside a resin material. The reflective agent La can be air bubbles such as air or a medium having the same refractive index as air. The resin material of the reflective layer L2 is a material such as silicon or epoxy, and the reflective agent La can be formed by injecting air bubbles into the resin material. The reflective layer L2 can reflect the light incident by the plurality of reflective agents La or refract it in other directions. The thickness of the reflective layer L2 may be 80% or more of the thickness of the reflective member 410. On the reflective layer L2, a dot layer L3 in which a plurality of dots are arranged can be included. The dot layer L3 can be formed on the reflective layer L2 through printing. The dot layer L3 can contain reflective ink. The dot layer L3 can be printed with a material containing any one of TiO2, CaCO3, BaSO4, Al2O3, Silicon, or PS. Each dot of the dot layer L3 can have a hemispherical or polygonal cross-section. The density of the dot pattern of the dot layer L3 can be further increased as it is farther from the emission surface 81 of the light-emitting element 100. The material of the dot layer L3 can be white.

[0150] By arranging the dot layer L3 on the upper surface of the reflective layer L2 in the emission direction of the light-emitting element 100, the light reflectivity can be improved, the light loss can be reduced, and the luminance of the surface light source can be improved.

[0151] As another example of the lighting device, the reflective member 410 can be removed on the substrate 401. For example, as shown in FIG. 6, a resin layer 420 may be arranged on the substrate 401 without a reflective member, and the resin layer 420 may be in contact with the upper surface of the substrate 401. When there is no reflective member, a problem of metal oxidation may occur when the pads 403 and 405 are exposed on the substrate 401, and the resin layer 420 can suppress the induction of metal oxidation in which the metal material binds to oxygen. That is, the resin layer 420 can suppress the induction of metal oxidation by moisture by removing acrylate having a hydroxy group.

[0152] Resin layer 420

[0153] The resin layer 420 can be formed by curing the above-described resin composition. The resin layer 420 can be disposed on the substrate 401. The resin layer 420 can face or adhere to the substrate 401. The resin layer 420 can be disposed on all or a part of the region of the upper surface of the substrate 401. The lower surface area of the resin layer 420 may be the same as or smaller than the upper surface area of the substrate 401. The resin layer 420 may be formed of a transparent material and can guide or diffuse light. The resin layer 420 can be used instead of a light guide plate and has the effect that the adjustment of the refractive index and the thickness is convenient.

[0154] Since the resin layer 420 is provided as a layer that guides light through the resin substance, it can be provided with a thinner thickness and a ductile plate compared to the case of glass. The resin layer 420 can emit the point light source emitted from the light-emitting element 100 in the form of a line light source or a surface light source.

[0155] The resin layer 420 can contain beads (not shown), and the beads can diffuse and reflect incident light to increase the amount of light. The beads can be arranged in the range of 0.01% to 0.3% with respect to the weight of the resin layer 420. The beads may be composed of any one selected from silicon, silica, glass bubble, PMMA (polymethyl methacrylate), urethane, Zn, Zr, Al2O3, and acryl, and the particle size of the beads may be in the range of about 1 μm to about 20 μm, but is not limited thereto.

[0156] Since the resin layer 420 is disposed on the light-emitting element 100, the light-emitting element 100 can be protected, and the loss of light emitted from the light-emitting element 100 can be reduced. The light-emitting element 100 can be embedded below the resin layer 420.

[0157] The resin layer 420 can contact the surface of the light-emitting element 100 and can contact the light-emitting surface 81 of the light-emitting element 100. A part of the resin layer 420 can be disposed in the opening 417 of the reflecting member 410. A part of the resin layer 420 can contact the upper surface of the substrate 401 through the opening 417 of the reflecting member 410. Thereby, when a part of the resin layer 420 contacts the substrate 401, the reflecting member 410 can be fixed between the resin layer 420 and the substrate 401.

[0158] Referring to FIG. 4, the thickness Z1 of the resin layer 420 may be 1.8 mm or more, for example, in the range of 1.8 to 2.5 mm. When the thickness Z1 of the resin layer 420 is thicker than the above range, the luminous intensity may decrease, and due to the increase in the module thickness, it may be difficult to provide as a ductile module. When the thickness Z1 of the resin layer 420 is smaller than the above range, it may be difficult to provide a surface light source with uniform luminous intensity.

[0159] The length of the resin layer 420 in the first direction X may be the same as the length of the substrate 401 in the first direction, and the width of the resin layer 420 in the second direction Y may be the same as the width Y1 of the substrate 401 in the second direction. Thereby, each side surface of the resin layer 420 can be disposed on the same plane as each side surface of the substrate 401. For example, the first and second side surfaces S1, S2 of the substrate 401 can be disposed on vertical surfaces such as both side surfaces of the resin layer 420.

[0160] The resin layer 420 is provided in a size that covers a plurality of light-emitting elements 100 or can be connected to each other. The resin layer 420 may be separated into a size that covers each light-emitting element 100, or may be separated into light-emitting cells each having each light-emitting element 100 / each resin layer 420.

[0161] The upper surface of the resin layer 420 can have a first adhesive force. The upper surface of the resin layer 420 has a first adhesive force and can be adhered to the light-transmitting layer 415.

[0162] Light-transmitting layer 415

[0163] The light-transmitting layer 415 can be an adhesive material such as silicon or epoxy, or can contain a diffusing material. The diffusing material can contain at least one of polyester (PET), PMMA (Poly Methyl Methacrylate), or PC (Poly Carbonate). The light-transmitting layer 415 can include an adhesive region that adheres to the upper surface of the resin layer 420 and a non-adhesive region that is non-adhesive or separated from the upper surface of the resin layer 420. The light-transmitting layer 415 is disposed over 60%, for example over 80%, of the upper surface area of the resin layer 420, and the diffusion layer 430 can be brought into close contact with the resin layer 420 or a lower diffusion layer (not shown).

[0164] Light-shielding portion 425

[0165] The light-shielding portion 425 can face the upper surface of the resin layer 420. The light-shielding portion 425 can overlap the light-emitting element 100 in the vertical direction or the third direction Z. Each of the plurality of light-shielding portions 425 can overlap each of the plurality of light-emitting elements 100 in the vertical direction. The light-shielding portion 425 can be disposed between the resin layer 420 and the diffusion layer 430. When a plurality of diffusion layers 430 are arranged, the light-shielding portion 425 can be disposed between the plurality of diffusion layers.

[0166] The light-shielding portion 425 can be disposed within the light-transmitting layer 415. The light-shielding portion 425 can penetrate the light-transmitting layer 415 and can contact at least one of the resin layer 425 or the diffusion layer 430. The light-shielding portion 425 can include a gap portion 427 that is separated from the inner surface of the light-transmitting layer 415 and / or the upper surface of the resin layer 420. Since the gap portion 427 can provide a refractive index different from that of the light-shielding portion 425, the light diffusion efficiency can be improved. The lower surface S13 of the light-shielding portion 425 can be separated or non-contact with the upper surface of the lower layer, for example, the upper surface of the resin layer 420. The gap portion 427 can be an air region or a vacuum region.

[0167] The interval B1 between the light-shielding portions 425 may be smaller than the interval X1 between the light-emitting elements 100. The light-shielding portion 425 may be separated from the outer surface of the resin layer 420. A plurality of the light-shielding portions 425 may be arranged in the first direction. The plurality of light-shielding portions 425 may include the same shape as each other. The light-shielding portion 425 may be respectively arranged on each light-emitting element 100. Each light-shielding portion 425 may be arranged in a direction perpendicular to each light-emitting element 100 and its peripheral region.

[0168] The light-shielding portion 425 may be arranged higher than the upper surface of the resin layer 420. The light-shielding portion 425 may be 50% or more of the upper surface area of the light-emitting element 100 on the light-emitting element 100, or may be in the range of 50% to 200%. The light-shielding portion 425 may be a region printed with a white material. The light-shielding portion 425 can be printed, for example, using a reflective ink containing any one of TiO2, Al2O3, CaCO3, BaSO4, and Silicon. The light-shielding portion 425 can reflect the light emitted through the light-emitting surface of the light-emitting element 100 and reduce the generation of hot spots on the light-emitting element 100. The light-shielding portion 425 can print a light-shielding pattern using light-shielding ink. The light-shielding portion 425 can be formed in a manner of being printed on the lower surface of the diffusion layer 430. The light-shielding portion 425 is a material that does not block 100% of the incident light, and the transmittance may be lower than the reflectance, and it can function as light-shielding and diffusion of light. The light-shielding portion 425 may be formed as a single layer or multiple layers, and may have the same pattern shape or different pattern shapes from each other. The thickness of the light-shielding portion 425 may be formed with the same thickness. The thickness of the light-shielding portion 425 may be formed with different thicknesses according to the region. The thickness of the light-shielding portion 425 may be such that the center region is the thickest and the edge region is thinner than the center region. The thickness of the light-shielding portion 425 may be proportional to the incident light intensity.

[0169] The size of the light-shielding portion 425 is 50% or more, for example, in the range of 50% to 200%, of the upper surface area of the light-emitting device 100, to block incident light, thereby reducing the problem of the light-emitting device 100 being visible from the outside and reducing hot spots on the area of the light-emitting device 100, thereby providing a uniform light distribution over the entire area.

[0170] As another example, the light-shielding portion 425 may be a recessed air region formed by an etching process on the upper surface of the resin layer 420, or may include a light-shielding film in which the light-shielding material is disposed in the recess. Like the light-shielding portion, the etching region may be disposed in a range of 50% to 200% of the upper surface area of the light-emitting device 100 and may cover the light-emitting surface of the light-emitting device 100. The light-shielding portion 425 may be disposed in a hemispherical, elliptical, or circular shape based on the light-emitting device 100.

[0171] 2 and 4, the width C1 of the light-shielding portion 425 in the second direction Y may be small in a region adjacent to the light emitting device 100 and gradually increase toward the center of the light-shielding portion 425, with the width (e.g., C3) in the second direction Y being largest at the center. The width in the second direction Y may gradually decrease as the distance from the light emitting device 100 increases from the center of the light-shielding portion 425. The maximum width C3 in the second direction Y may be largest at the center of the light-shielding portion 425 and the width in the second direction Y may gradually decrease from the center of the light-shielding portion 425 toward the first direction X. The region of the light-shielding portion 425 that vertically overlaps with the light emitting device 100 may have a flat outer surface, and the width C1 of the flat outer surface in the second direction Y may be larger than the length D1 of the light emitting device 100 in the second direction. The second direction width C1 of the light-shielding portion 425 is arranged to be 0.8 mm or more larger than the length D1 of the light-emitting device 100, so that it can cover both sides of the light-emitting device 100 and prevent hot spots caused by light emitted from the light-emitting device 100.

[0172] The maximum length B3 of the light-shielding portion 425 in the first direction X may be equal to or smaller than the maximum width C3 in the second direction Y. The maximum width C3 may be 13 mm or more, for example, in the range of 13 mm to 17 mm. The maximum width C3 of the light-shielding portion 425 in the second direction Y may vary according to the length D1 of the light-emitting element 100 in the second direction Y. The maximum width C3 of the light-shielding portion 425 in the second direction Y may be arranged in the range of 50% or more, for example, 50% to 90% of the length Y1 of the substrate 401 in the second direction Y.

[0173] Here, the interval X1 between the light-emitting elements 100 may be 25 mm or more, for example, in the range of 25 mm to 30 mm, and may vary according to the characteristics of the light-emitting element 100. By providing the maximum length B3 in the first direction X and the maximum width C3 in the second direction Y passing through the center portion of the light-shielding portion 425 within the above range, hot spots on the light-emitting element 100 can be reduced, and the light uniformity can be improved.

[0174] As shown in FIG. 4, the thickness Z3 of the light-shielding portion 425 may be 0.1 times or less of the thickness Z1 of the resin layer 420, for example, in the range of 0.05 times to 0.1 times. The thickness Z3 of the light-shielding portion 425 may be 100 μm or more, for example, in the range of 100 to 200 μm. When the thickness Z3 of the light-shielding portion 425 is smaller than the above range, there is a limit to reducing hot spots, and when it is larger than the above range, the light uniformity may decrease. The distance Z4 from the upper surface of the light-emitting element 100 to the lower surface of the light-shielding portion 425 may be 0.4 mm or more, for example, in the range of 0.4 mm to 0.6 mm. The distance Z0 between the upper surface of the light-emitting element 100 and the upper surface of the reflecting member 410 may be 0.8 mm or more, for example, in the range of 0.8 mm to 1.4 mm. The region of the light-shielding portion 425 may not overlap the region of the light-transmitting layer 415 in the vertical direction.

[0175] The light-shielding portion 425 can be provided in a size or area that can prevent hot spots caused by light emitted in the emission direction of the light-emitting element 100 on each light-emitting element 100. Further, since the light-emitting element 100 emits light in the side direction, that is, the first direction, the light-shielding portion 425 covers a region where the light-shielding efficiency can be enhanced by the light directivity angle distribution and light reflection characteristics of the light-emitting element 100.

[0176] Diffusion layer 430

[0177] The diffusion layer 430 can be disposed on the resin layer 420. The lower surface of the diffusion layer 430 can include a first region S11 where the light-transmitting layer 415 is disposed and a second region S12 where the light-shielding portion 425 is disposed. The light-shielding portion 425 can be printed on the lower part of the diffusion layer 430 and can be fixed on the resin layer 420 through the light-transmitting layer 415.

[0178] Here, when a lower diffusion layer (not shown) is disposed between the light-transmitting layer 415 and the resin layer 420, the lower diffusion layer may be adhered to the resin layer 420. For example, the upper surface of the resin layer 420 can be adhered to the lower diffusion layer by a first adhesive force having fine cilia. At this time, the diffusion layer 430 and / or the lower diffusion layer can be attached onto the resin layer 420 by applying a predetermined pressure or pressure / heat.

[0179] The diffusion layer 430 can include at least one of a polyester (PET) film, a PMMA (Poly Methyl Methacrylate) material, and a PC (Poly Carbonate). The diffusion layer 430 can be provided as a film made of a resin material such as silicon or epoxy. The diffusion layer 430 can include a single layer or multiple layers.

[0180] The thickness Z2 of the diffusion layer 430 is 25 micrometers or more, and may be, for example, in the range of 25 to 250 micrometers or in the range of 100 to 250 micrometers. Such a diffusion layer 430 can provide the incident light within the above thickness range as a uniform surface light source.

[0181] The diffusion layer 430 and / or the lower diffusion layer can contain at least one or two or more of a diffusing agent such as beads, a phosphor, and ink particles. The phosphor can contain, for example, at least one of a red phosphor, an amber phosphor, a yellow phosphor, a green phosphor, or a white phosphor. The ink particles can contain at least one of a metal ink, a UV ink, or a cured ink. The size of the ink particles may be smaller than the size of the phosphor. The surface color of the ink particles can be any one of green, red, yellow, and blue. The type of the ink can be selectively applied from PVC (Poly vinyl chloride) ink, PC (Polycarbonate) ink, ABS (acrylonitrile butadiene styrene copolymer) ink, UV resin ink, epoxy ink, silicone ink, PP (polypropylene) ink, aqueous ink, plastic ink, PMMA (poly methyl methacrylate) ink, PS (Polystyrene) ink. The ink particles can contain at least one of a metal ink, a UV ink, or a cured ink.

[0182] In the embodiment of the present invention, the light diffused by the resin layer 420 can pass through the light-transmitting layer 415 and be emitted as a surface light source through the diffusion layer 430. At this time, the light-shielding portion 425 can prevent hot spots caused by the incident light.

[0183] In another example of the present invention, a layer of reflective material or an upper substrate may be disposed on top of the resin layer 420. The layer of reflective material or the upper substrate can face the upper surface of the resin layer 420, the light-emitting elements 100 are arranged in at least one row or column, and each light-emitting surface 81 of the light-emitting elements 100 is arranged at the same interval as one side surface of the resin layer 420, and light can be emitted through one side surface of the resin layer 420.

[0184] On the other hand, in the foregoing description, it has been described that the light-emitting element emits light in the lateral direction of the resin layer, but the embodiment is not limited thereto. That is, the light-emitting element may be connected to the substrate 410 in the top view direction. Thereby, the light-emitting element can emit light in the upward direction of the resin layer 401.

[0185] Alternatively, referring to FIG. 11, a plurality of light-emitting elements 100 may be disposed on the substrate 401. The plurality of light-emitting elements 100 may be of a top view type that is electrically connected to the substrate 401. The plurality of light-emitting elements 100 may be arranged at intervals set on the substrate 401. For example, the plurality of light-emitting elements 100 may be arranged at equal intervals in the first direction. Also, the plurality of light-emitting elements 100 may be arranged at equal intervals in the second direction.

[0186] Thereby, the lighting module 400 including the plurality of light-emitting elements 100 can emit light as a surface light source. The lighting module 400 can emit light in the opened upper direction of the housing 300.

[0187] FIG. 12 is a front view showing light-emitting elements on a substrate in a lighting module according to an embodiment, and FIG. 13 is a side view of the light-emitting elements in FIG. 12.

[0188] Referring to FIGS. 12 and 13, the light-emitting element 100 includes a body 10 having a cavity 20, a plurality of lead frames 30, 40 within the cavity 20, and a light-emitting chip 71 disposed on at least one of the plurality of lead frames 30, 40. Such a light-emitting element 100 can be realized as a side-emitting type package.

[0189] The body 10 can include a cavity 20 with the lead frames 30, 40 exposed at the bottom. The plurality of lead frames 30, 40 are separated, for example, into a first lead frame 30 and a second lead frame 40 and coupled to the body 10.

[0190] The body 10 can be formed of an insulating material. The body 10 can be formed of a reflective material. The body 10 can be formed of a material having a reflectance higher than the transmittance with respect to the wavelength emitted from the light-emitting chip, for example, a material having a reflectance of 70% or more. When the reflectance of the body 10 is 70% or more, it can be defined as a non-translucent material or a reflective material. The body 10 can be formed of a resin-based insulating material, for example, a resin material such as polyphthalamide PPA (Polyphthalamide). The body 10 can be formed of a thermosetting resin including a silicon-based, epoxy-based, or plastic material, or a material with high heat resistance and high light resistance. The body 10 includes a white-based resin. In the body 10, an acid anhydride, an antioxidant, a release agent, a light reflecting material, an inorganic filler, a curing catalyst, a light stabilizer, a lubricant, and titanium dioxide can be selectively added. The body 10 can be formed of at least one selected from the group consisting of an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, an acrylic resin, and a urethane resin. For example, an epoxy resin composed of triglycidyl isocyanurate, hydrogenated bisphenol A diglycidyl ether, etc., and an acid anhydride composed of hexahydrophthalic anhydride, 3-methylhexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, etc. are used as a curing accelerator in the epoxy resin. DBU (1,8-Diazabicyclo(5,4,0)undecene-7), ethylene glycol as a co-catalyst, titanium oxide pigment, and glass fiber are added, and a solid epoxy resin composition that has been partially cured by heating to B-stage can be used, but it is not limited thereto. The body 10 may be appropriately mixed with at least one selected from the group consisting of a diffusing agent, a pigment, a fluorescent substance, a reflective substance, a light-shielding substance, a light stabilizer, and a lubricant in the thermosetting resin.

[0191] The body 10 can include a reflective material, for example, a resin material added with a metal oxide, and the metal oxide can include at least one of TiO2, SiO2, and Al2O3. Such a body 10 can effectively reflect the incident light. As another example, the body 10 can be formed of a translucent resin material or a resin material having a phosphor that converts the wavelength of incident light. The bottom of the body 10 can be the side surface corresponding to the substrate 401.

[0192] The first lead frame 30 includes a first lead portion 31 disposed at the bottom of the cavity 20, a first bonding portion 32 extending outside the body 10, and a first heat dissipation portion 33. The first bonding portion 32 is bent from the first lead portion 31 within the body 10 and protrudes outside the body, and the first heat dissipation portion 33 can be bent from the first bonding portion 32.

[0193] The second lead frame 40 includes a second lead portion 41 disposed at the bottom of the cavity 20, a second bonding portion 42 disposed in the outer region of the body 10, and a second heat dissipation portion 43. The second bonding portion 42 is bent from the second lead portion 41 within the body 10, and the second heat dissipation portion 43 can be bent from the second bonding portion 42.

[0194] Here, the light-emitting chip 71 may be disposed, for example, on the first lead portion 31 of the first lead frame 30, and may be connected to the first and second lead portions 31 and 41 by wires, or may be connected to the first lead portion 31 with an adhesive and connected to the second lead portion 41 by a wire. Such a light-emitting chip 71 may be a horizontal chip, a vertical chip, or a chip having a via structure. The light-emitting chip 71 may be mounted in a flip-chip manner. The light-emitting chip 71 can selectively emit light within the wavelength range of ultraviolet to visible light. The light-emitting chip 71 can emit light having, for example, a peak wavelength of ultraviolet or blue. The light-emitting chip 71 can include at least one of II-VI group compounds and III-V group compounds. The light-emitting chip 71 may be formed of a compound selected from the group consisting of, for example, GaN, AlGaN, InGaN, AlInGaN, GaP, AlN, GaAs, AlGaAs, InP, and mixtures thereof.

[0195] One or more light-emitting chips 71 may be disposed in the cavity 20 and emit light with the maximum intensity in the direction of the central axis X0.

[0196] One or more light-emitting chips disposed in the cavity 20 of the light-emitting element 100 according to the embodiment may be provided. The light-emitting chip may be selected from, for example, a red LED chip, a blue LED chip, a green LED chip, and a yellow green LED chip.

[0197] A molding member 80 is disposed in the cavity 20 of the body 11. The molding member 80 includes a light-transmissive resin such as silicon or epoxy and can be formed in a single layer or multiple layers. A phosphor for changing the wavelength of the emitted light can be included on the molding member 80 or on the light-emitting chip 71. The phosphor is adapted to excite a part of the light emitted from the light-emitting chip 71 and emit light of other wavelengths. The phosphor can be selectively formed from among quantum dots, YAG, TAG, silicate, nitride, and oxy-nitride-based substances. The phosphor can include at least one of a red phosphor, a yellow phosphor, and a green phosphor, but is not limited thereto. The exit surface 81 of the molding member 80 may be formed in a flat shape, a concave shape, a convex shape, etc., but is not limited thereto. As another example, a light-transmissive film having a phosphor may be disposed on the cavity 20, but is not limited thereto.

[0198] A lens may be further formed on the upper part of the body 10. The lens can include a structure of a concave lens or / and a convex lens and can adjust the light distribution of the light emitted by the light-emitting element 100.

[0199] Semiconductor elements such as a light-receiving element and a protection element may be mounted on the body 10 or on any one of the lead frames. The protection element can be realized by a thyristor, a Zener diode, or a TVS (Transient Voltage Suppression). The Zener diode protects the light-emitting chip from ESD (electrostatic discharge).

[0200] At least one or a plurality of light-emitting elements 100 are disposed on the substrate 401, and a reflecting member 410 is disposed around the lower part of the light-emitting element 100. The second lead portions 33, 43 are bonded to the pads 403, 405 of the substrate 401 with a conductive adhesive member urch as solder or a conductive tape.

[0201] FIG. 14 is a plan view of a vehicle to which a vehicle lamp is applied.

[0202] Referring to FIG. 14, vehicle lighting can include a first lamp unit 812, a second lamp unit 814, a third lamp unit 816, and the housing 810. Here, each lamp unit can be a light source that serves roles such as a headlamp, a side mirror lamp, a side marker light, a fog lamp, a tail lamp, a stop lamp, a daytime running lamp, vehicle interior lighting, a door scarf, a rear combination lamp, a backup lamp, etc., but is not limited thereto.

[0203] The housing 810 houses the first to third lamp units 812, 814, 816 and can be formed of a light-transmissive material. At this time, the housing 810 can have a bend according to the design of the vehicle body, and the first to third lamp units 812, 814, 816 can realize a surface light source having a curved surface according to the shape of the housing 810.

[0204] The features, structures, effects, etc. described in the above-described embodiments are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc. exemplified in each embodiment can be combined or modified and implemented for other embodiments by those having ordinary knowledge in the field to which the embodiment belongs. Therefore, the content related to such combinations and modifications should be interpreted as being included in the scope of the present invention.

[0205] Also, although the above description has focused on the embodiments, this is merely an illustration and does not limit the present invention. Those with ordinary knowledge in the field to which the present invention pertains will understand that various modifications and applications not exemplified above are possible without departing from the essential characteristics of the present embodiments. For example, each component specifically shown in the embodiments can be implemented with modifications. And the differences related to such modifications and applications should be construed as being included in the scope of the present invention defined by the appended claims.

Claims

1. A resin composition comprising an oligomer, a monomer, a photoinitiator, and an additive, wherein the oligomer comprises 10% to 25% by weight based on the total resin composition, the monomer comprises 60% to 70% by weight based on the total resin composition, the photoinitiator comprises 0.5% to 1.2% by weight based on the total resin composition, the additive comprises a first additive containing a radical scavenger and a second additive containing a peroxide decomposer, the photoinitiator contains phosphorus (P), the second additive contains phosphorus (P), and the weight percentage of the photoinitiator is greater than the respective weight percentages of the first additive and the second additive, a resin composition.

2. The resin composition according to claim 1, wherein the additive comprises 0.5% to 1.6% by weight based on the total resin composition.

3. The resin composition according to claim 2, wherein the weight percentage of the first additive is greater than the weight percentage of the second additive.

4. The resin composition according to claim 3, wherein the weight percentage of the first additive comprises 0.3% to 0.9% by weight based on the total resin composition, and the second additive comprises 0.2% to 0.7% by weight based on the total resin composition.

5. The oligomer comprises a first oligomer containing a tetramethylene glycol-based urethane acrylate and a second oligomer containing an ethylene glycol-based urethane acrylate, the first oligomer is contained in an amount of 8% to 20% by weight based on the total resin composition, and the second oligomer is contained in an amount of 2% to 5% by weight based on the total resin composition, the resin composition according to claim 4.

6. The monomer includes a first monomer containing IBMA (Isobonyl acrylate), a second monomer containing at least one of EHA (2-Ethylhexyl acrylate) and LA (Lauryl Acrylate), a third monomer containing at least one of CA (Caprolactone acrylate) and 2-(2-Ethoxyethoxy)ethyl acrylate, and a fourth monomer containing at least one of GMA (Glycidyl methacrylate) and 3,4-epoxycyclohexylmethyl methacrylate, The first monomer is contained at 40% to 50% by weight based on the whole resin composition, The second monomer is contained at 3% to 18% by weight based on the whole resin composition, The third monomer is contained at 15% to 30% by weight based on the whole resin composition, The resin composition according to claim 5, wherein the fourth monomer is contained at 7% to 14% by weight based on the whole resin composition.

7. The resin composition according to claim 1, wherein the decomposition temperature of the photoinitiator is 50°C to 250°C.

8. The resin composition according to claim 1, wherein the photoinitiator absorbs light in a wavelength band of 50 nm to 400 nm.

9. A resin composition containing an oligomer, a monomer, a photoinitiator, a first additive, and a second additive, The oligomer is contained at 10% to 25% by weight based on the whole resin composition, The monomer is contained at 60% to 70% by weight based on the whole resin composition, The photoinitiator is contained at 0.5% to 1.2% by weight based on the whole resin composition, The sum of the weight percentage of the first additive and the weight percentage of the second additive is contained at 0.5% to 1.6% by weight based on the whole resin composition, The first additive contains a radical scavenger, The second additive contains a peroxide decomposer, The photoinitiator contains phosphorus (P), The second additive contains phosphorus (P), of the second additive ３１ The P-NMR peak area is ３１ a resin composition that is 10% to 90% or more of the P-NMR peak area of the photoinitiator.

10. A substrate, A light-emitting element disposed on the substrate, including a resin layer disposed around the light-emitting element on the substrate; The lighting device, wherein the resin layer contains the resin composition according to any one of claims 1 to 9.

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