Device for reducing misalignment between a sputtering target and a shield

Abstract

A spacing guide for use on a dark portion shield of a sputtering chamber has a first end, a second end opposite the first end, and a thickness, and is configured to be placed on the end of the dark portion shield, a horizontal body, a first leg extending laterally from the first end of the horizontal body and configured to abut the outer surface of the dark portion shield, and a second leg extending laterally from the second end of the horizontal body and configured to abut the inner surface of the shield.

Description

Technical Field

[0001] (Cross - Reference to Related Applications) This application claims the benefit of U.S. Patent Application No. 18 / 195,985, filed May 11, 2023, and U.S. Provisional Patent Application No. 63 / 390,052, filed Jul. 18, 2022, both of which are hereby incorporated by reference in their entirety.

[0002] (Field of the Invention) This disclosure relates to devices and methods for reducing misalignment between a sputtering target and a shield.

Background Art

[0003] Physical vapor deposition (PVD) methods are used to form thin films or layers of materials on various substrates. PVD methods can be used, for example, in semiconductor manufacturing processes for forming metallization layers in the manufacture of integrated circuit structures and devices. In one type of PVD process known as sputtering, atoms are ejected from the surface of a sputtering target by irradiation with gas ions such as argon. Thus, the sputtering target is a source of the material to be deposited on the substrate.

[0004] In some current PVD chambers, a process kit or a shadow shield is attached to the body of the PVD chamber. The sputtering target is separated from the shield and attached to a removable lid of the PVD chamber. During use, when the lid is closed, the sputtering target is lowered into the chamber body.

[0005] It has been found that misalignment between the shadow shield and the sputtering target can cause various performance problems such as arc discharge, particle formation, and film non - uniformity. Devices and methods for improved alignment between the shadow shield and the sputtering target are needed.

Summary of the Invention

[0006] These and other needs are addressed by various aspects and configurations of the present disclosure.

[0007] In Example 1, a spacing guide for use on a shadow shield of a sputtering chamber, the spacing guide comprising a horizontal body having a first end, a second end opposite the first end, and a thickness, the horizontal body being configured to be placed on the end of the shadow shield, a first leg extending laterally from the first end of the horizontal body and configured to abut the outer surface of the shadow shield, and a second leg extending laterally from the second end of the horizontal body and configured to abut the inner surface of the shield. The horizontal body, the first leg, and the second leg are formed from an insulating material.

[0008] In Example 2, the horizontal body of the spacing guide of Example 1 has a thickness of from about 1 millimeter to about 30 millimeters.

[0009] In Example 3, the second leg of the spacing guide of Example 1 has a thickness of about 30 millimeters or less.

[0010] In Example 4, the first leg and the second leg of the spacing guide of Example 1 have different widths, lengths, and thicknesses.

[0011] In Example 5, the horizontal body, the first leg, and the second leg of the spacing guide of Example 1 are integrally formed.

[0012] In Example 6, a shadow mask door assembly for use in a sputtering chamber, the shadow mask door assembly comprising: an annular shadow mask having a first end configured to be close to a substrate support and a second end configured to be close to a sputtering target; and a plurality of spacing guides disposed on the second end of the annular shadow mask. Each spacing guide includes a first end, a second end opposite the first end, and a horizontal body having a thickness, the horizontal body being configured to be placed on the second end of the annular shadow mask, a first leg extending laterally from the first end of the horizontal body and configured to abut against the outer surface of the annular shadow mask, and a second leg extending laterally from the second end of the horizontal body and configured to abut against the inner surface of the shield, wherein the horizontal body, the first leg, and the second leg are formed of an insulating material.

[0013] In Example 7, the shadow mask door assembly of Example 6, wherein the plurality of spacing guides are attached to the annular shadow mask by frictional force only.

[0014] In Example 8, the shadow mask door assembly of Example 6, wherein the plurality of spacing guides are attached to the annular shadow mask by fasteners.

[0015] In Example 9, the shadow mask door assembly of Example 6, wherein the spacing guide maintains the misalignment between the sputtering target and the annular shadow mask within about 5 millimeters along the horizontal axis.

[0016] In Example 10, the shadow mask door assembly of Example 9, wherein the spacing guide maintains the misalignment between the sputtering target and the annular shadow mask within about 1 millimeter along the horizontal axis.

[0017] In Example 11, the shadow mask door assembly of Example 9, wherein the horizontal body has a thickness of about 30 millimeters or less.

[0018] In Example 12, the second leg has a thickness of about 30 millimeters or less, and is the dark part shield door assembly of Example 9.

[0019] In Example 13, the sputtering chamber assembly includes an annular dark part shield having a sputtering target, a first end configured to be close to the substrate support, and a second end configured to be close to the sputtering target, and a plurality of spacing guides disposed on the second end of the annular dark part shield. Each spacing guide includes a first end, a second end opposite to the first end, and a horizontal body having a thickness and configured to be placed on the second end of the annular dark part shield, a first leg extending laterally from the first end of the horizontal body and configured to abut against the outer surface of the annular dark part shield, and a second leg extending laterally from the second end of the horizontal body and configured to abut against the inner surface of the shield. The horizontal body, the first leg, and the second leg are formed of an insulating material.

[0020] In Example 14, the plurality of spacing guides are attached to the annular dark part shield only by frictional force, and is the sputtering chamber assembly of Example 13.

[0021] In Example 15, the plurality of spacing guides are attached to the annular dark part shield by fasteners, and is the sputtering chamber assembly of Example 13.

[0022] In Example 16, the spacing guide maintains the misalignment between the sputtering target and the annular dark part shield within about 1 millimeter along the horizontal axis, and is the sputtering chamber assembly of Example 13.

[0023] In Example 17, the spacing guide is the sputtering chamber assembly of Example 16 that maintains the misalignment between the sputtering target and the annular dark portion shield within 1 millimeter along the vertical axis.

[0024] In Example 18, the horizontal body is the sputtering chamber assembly of Example 13 with a thickness of about 1 millimeter to about 30 millimeters.

[0025] In Example 19, the second leg has a thickness of about 30 millimeters or less and is the sputtering chamber assembly of Example 13.

[0026] Although multiple embodiments are disclosed, those skilled in the art will recognize additional embodiments of the present invention from the forms for carrying out the following inventions that illustrate and describe exemplary embodiments of the present invention. Accordingly, the drawings and the forms for carrying out the invention are not restrictive and should be considered essentially exemplary.

Brief Description of the Drawings

[0027]

Figure 1

Figure 2

Figure 3

Figure 4A

Figure 4B

Figure 5

[0028] Without departing from the scope of the present invention, various changes and additions can be made to the exemplary embodiments considered. For example, the above embodiments refer to specific features, but the scope of these inventions also includes embodiments with various combinations of features and embodiments that do not include all of the above features.

DETAILED DESCRIPTION OF THE INVENTION

[0029] In this specification, components of a sputtering chamber for use in a sputtering chamber to improve the alignment of a sputtering target and a shadow mask, and methods of using the same are disclosed. Embodiments of the present invention can reduce or prevent arc discharge between the sputtering target and the mask by improving the alignment between the sputtering target and the mask. As used herein, alignment refers to a concentric arrangement of the sputtering target and the shadow mask such that the gap of a first distance between the outer edge of the sputtering target and the inner surface of the shadow mask is constant or substantially constant along the perimeter of the sputtering target. During the sputtering process, a film is deposited on the flange of the sputtering target. The alignment between the sputtering target and the shadow mask is measured by removing the sputtering target from the sputtering chamber and measuring the distance from the radially outer edge of the deposited film to the sidewall of the target at several positions around the parameters of the sputtering target. In one embodiment, this distance is determined by measuring with a caliper the distance from the O-ring groove in the flange to the sidewall of the sputtering target, measuring with a caliper the distance from the O-ring groove in the flange to the radially outer edge of the deposited film, and calculating the difference between these two values. The determined maximum distance is the alignment misalignment.

[0030] Embodiments of the present invention can, in addition to or instead of, reduce particle formation by reducing the arc discharge phenomenon. The arc discharge phenomenon generates particles. Since particle deposition on the substrate can damage small functional size devices fabricated on the substrate, particle deposition is undesirable. Therefore, it is desirable to avoid particle formation in the chamber. Embodiments of the present invention can further or in addition improve the uniformity of the deposited film. A large misalignment between the sputtering target and the shadow mask can result in a non-uniform gap between the shadow mask and the sputtering target, which can generate a non-uniform electric field. The non-uniform electric field can result in a non-uniform plasma distribution and thus a non-uniform film deposition on the substrate.

[0031] FIG. 1 is a cross-sectional view of a physical vapor deposition chamber 100 including a chamber lid 134 and a chamber body 136. The chamber lid 134 is removable from the chamber body 136 and is shown in the closed position in FIG. 1.

[0032] A sputtering target assembly 138 including a backing plate 146 and a sputtering target 106 can be attached to or removably mounted on the chamber lid 134, for example, by pins or screws (not shown). When the chamber lid 134 is closed, the sputtering surface of the sputtering target 106 faces the substrate support 102. The sputtering target assembly 138 may be composed of only one part.

[0033] The power supply structure 110 and the source distribution plate 122 can be used to distribute power to the sputtering target 106. The power supply structure 110 applies RF energy and optionally DC energy to the sputtering target 106. The supply structure 110 includes a body 112 having a first end 114, a second end 116, and a central opening 115. The first end 114 is coupled to an RF power supply 118 and optionally to a DC power supply 120, which can be used to supply RF power and DC power to the sputtering target 106. The second end 116 is coupled to the chamber lid 134. The central opening 115 extends through the body 112 from the first end 114 to the second end 116. The power supply structure 110 can be manufactured from a conductive material suitable for conducting RF and DC energy from the RF power supply 118 and the DC power supply 120. Those skilled in the art will recognize that a power supply structure having other configurations may be used.

[0034] The source distribution plate 122 can be coupled to the second end 116 of the body 112 and can be used by the conductive member 125 to distribute the energy applied to the peripheral portion of the sputtering target 106 through the power supply structure 110. The source distribution plate 122 can include a hole 124 that is aligned with the central opening 115 of the body 112. The source distribution plate 122 can be manufactured from a conductive material suitable for conducting RF and DC energy from the power supply structure 110.

[0035] The conductive member 125 may be a tubular member having a first end 126 coupled to the source distribution plate 122 and a second end 130 coupled to the backing plate 146 of the sputtering target assembly. The ground shield 140 can cover the outer surface of the chamber lid 134. The ground shield 140 can be manufactured from a suitable conductive material. An insulating gap 139 is provided between the ground shield 140 and the outer surfaces of the source distribution plate 122, the conductive member 125, and the sputtering target 106 (and / or the backing plate 146). The insulating gap prevents RF and DC currents from being sent directly to ground. The insulating gap 139 may be filled with a suitable dielectric material such as air or ceramic.

[0036] The chamber lid 134 can rotate and open from above the chamber body 136. In some cases, the chamber lid 134 may be opened to install or replace the sputtering target or to perform maintenance on the physical vapor deposition chamber 100. In some embodiments, the chamber lid 134 may be movable from a closed position to an open position about a horizontal axis of rotation. For example, the chamber lid 134 may move in an arc about the axis of rotation between the closed position and the open position.

[0037] The chamber body 136 may be formed from a grounded container wall 108 and an upper chamber wall 142 and may include a substrate support 102, an internal volume 144, and a dark shield or process shield 150. The substrate support 102 receives the substrate 104.

[0038] The shadow shield 150 includes an annular body having an inner surface 152 and an outer surface 154 that define a central opening 158. The shadow shield 150 extends downward along the walls of the upper chamber wall 142 and the grounded container wall 108 to below the upper surface of the substrate support 102 and then returns upward to reach the upper surface of the substrate support 102. Opposite ends of the shadow shield 150 are close to the sputtering target 106. The shadow shield 150 is spaced from the sputtering target 106 by a radial gap 170.

[0039] During use, electrons are emitted from the negatively charged sputtering target 106. These electrons collide with argon atoms to form ionized atoms or plasma, which then accelerate toward the negatively charged sputtering target 106. The argon atoms collide with the sputtering target 106, causing a chain reaction of many collisions, and atoms fly out from the sputtering target 106, thereby forming a thin film on the substrate 104. In some embodiments, suitable substrates 104 include wafers used in semiconductor manufacturing. For example, the sputtering target 106 is irradiated with energy until atoms from the surface are released into the surrounding atmosphere and then deposited on the substrate 104. In some embodiments, plasma sputtering is used to deposit a metal thin film on a wafer used in electronic devices.

[0040] FIG. 2 is a schematic cross-sectional view of a portion of sputtering chamber 200. In sputtering chamber 200, the shadow shield 250 radially surrounds sputtering target 206 of sputtering target assembly 238. Radially (or along the horizontal axis of FIG. 2), the inner surface 252 of the shadow shield 250 is spaced from the outer or radial surface 288 of the sputtering target 206 by distances 277a and 277b (generally referred to as distance 277). In some embodiments, the distance 277 may be from about 3 millimeters (mm) to about 6 mm, or from about 2 mm to about 4 mm. Misalignment between the sputtering target 106 and the shadow shield 250 results in a non-uniform distance 277 around the parameters of the sputtering target 206. For example, it can result in 277a and 277b not being equal. For example, as shown in FIG. 2, the shadow shield 250 is closer to the sputtering target 206 on the left side, such that distance 277b is greater than distance 277a. In some embodiments, the radial gap 277 does not vary by more than about 5 mm or about 2 mm or about 1 mm around the sputtering target 206. That is, for example, distances 277a and 277b do not vary from each other by more than about 1 mm. As described herein, misalignment between the sputtering target 206 and the shadow shield 250 can cause performance issues. It has been found that the performance of the sputtering target is typically more acceptable or improved when the distance 277 varies by about 1 mm or less around the sputtering target 206, or when the radial misalignment between the sputtering target 206 and the shadow shield 250 is about 1 mm or less.

[0041] In the vertical direction, the end of the shadow shield 250 is also spaced apart from the assembly 238 of the sputtering target and is spaced apart from the backing plate 146 by distances 279 and 279b (generally referred to as distance 279), as shown in FIG. 2. The misalignment between the shadow shield 250 and the sputtering target 206 can result in 279a and 279b not being equal. In some embodiments, the distance 279 does not vary by more than about 1 mm around the sputtering target 206. That is, for example, the distances 279a and 279b do not vary from each other by more than about 1 mm. As described herein, the misalignment between the sputtering target 206 and the shadow shield 250 can cause performance problems. When the distance 279 varies by about 1 mm or less around the sputtering target 206, or in other words, when the vertical misalignment between the sputtering target 206 and the shadow shield 250 is about 1 mm or less, it has been found that the performance of the sputtering target is acceptable or improved.

[0042] The spacing guide 290 is fitted or disposed at the end of the shadow shield 250. A part of the spacing guide 290 is disposed between the end of the shadow shield 250 and the backing plate 246. Another part of the spacing guide 290 is disposed between the radial surface 288 of the sputtering target 206 and the shadow shield 250. The spacing guide 290 maintains the minimum distance between the sputtering target assembly 238 and the shadow shield 250. Radially (or along the horizontal axis in FIG. 2), the inner surface of the shadow shield 250 is spaced apart from the outer or radial surface 288 of the sputtering target 206 by a distance 277. Vertically, the end of the shield 250 is spaced apart from the sputtering target assembly 238 and is spaced apart from the backing plate 146 by a distance 279 as shown in FIG. 2. In FIG. 2, the spacing guide 290 maintains this minimum distance along both the horizontal and vertical axes. However, the spacing guide 290 may be designed to maintain the minimum value along only one of the horizontal and vertical axes. In some embodiments, the spacing guide 290 is designed such that the misalignment between the sputtering target 206 and the shield 250 does not exceed about 1 mm.

[0043] A suitable number of spacing guides 290 can be used to space, align, or distance the shadow shield 250 from the sputtering target 206. In some embodiments, three spacing guides 290 are disposed around and at the end of the shadow shield 250, for example, at equal intervals. In some embodiments, more than three spacing guides 290 may be used on the shadow shield 250.

[0044] FIG. 3 is a perspective view of one embodiment in which spacing guides 290 (three are shown in FIG. 3) are located on or mounted on an end 251 of the shadow mask 250a. As shown, the spacing guides 290 extend from the end 251 of the shadow mask 250a. In this way, the spacing guides 290 can create a minimum distance along the vertical axis between the shadow mask 250a and the sputtering target 206. In some embodiments, the spacing guides 290 are equally spaced around the shadow mask 250a. In other embodiments, the spacing guides 290 are not equally spaced apart.

[0045] FIGS. 4A and 4B are perspective views of another embodiment in which a portion along the end 251 of the shadow mask 250b has been removed by a notch 253 to accommodate the spacing guide 290 (shown in the enlarged view of FIG. 4B). FIG. 4B is an enlarged view of the shadow mask 250b with the spacing guide 290 disposed within the notch 253. As shown in FIG. 4B, in some embodiments, the upper portion of the spacing guide 290 projects or extends from the end of the shadow mask 250b. In other embodiments, the upper portion of the spacing guide 290 is aligned or substantially aligned with the end of the shadow mask 250b. In some embodiments, the spacing guide 290 projects radially from the inner surface of the shadow mask 250B. In some embodiments, the spacing guides 290 are equally spaced around the shadow mask 250b. In other embodiments, the spacing guides 290 are not equally spaced apart.

[0046] FIG. 5 is a perspective view of a spacing guide 290 according to an embodiment. The spacing guide 290 includes a horizontal body 291, a first leg 293, and a second leg 295. The first leg 293 extends vertically or laterally from a first end 297 of the horizontal body 291. The second leg 295 extends vertically or laterally from a second end 299 of the horizontal body 291. The horizontal body 291, the first leg 293, and the second leg 295 may be separate individual components that are connected to form the spacing guide 290. Alternatively, the horizontal body 291, the first leg 293, and the second leg 295 may be formed as one integral component. The spacing guide 290 may be formed from any suitable insulating material, such as Teflon or ceramic.

[0047] The horizontal body 291 has a width W1, a length L1, and a thickness T1. The length L1 is selected such that when the spacing guide 290 is positioned on the shadow shield 250, the first leg 293 and the second leg 295 respectively abut against the inner surface 252 and the outer surface 254 of the shadow shield 250. In some embodiments, the length L1 is selected such that the spacing guide 290 is held on the shadow shield 250 by gravity and / or friction and no other connectors or fasteners such as screws or pins are required. In some embodiments, the spacing guide 290 may be connected to the shadow shield 250 by a fastener. For example, a fastener such as a screw or a pin may be disposed through the ends of the horizontal body 291 and the shadow shield 250. The length L1 is selected such that the spacing guide 290 can be positioned on the shadow shield 250. If the length L1 is too short, the spacing guide 290 will not stay on the shadow shield 250. In addition, the length L1 is selected to be accommodated within the space defined by the shield and the target sidewall of the shadow shield 250. If the length L1 is too long, the spacing guide 290 will not fit into the space between the shadow shield 250 and the sputtering target 206. In some embodiments, the length L1 is from about 10 mm to about 100 mm, such as from about 15 mm to about 30 mm. After the spacing guide 290 is installed, the space defined by the shadow shield 250 and the sidewall of the sputtering target 206 is partially occupied by the spacing guide 290, and the remaining space remains empty.

[0048] The width W1 is selected such that the horizontal body 291 is suitably stable and has a desired ease of handling. If the width W1 is too small, the spacing guide 290 may be insufficient, unstable, or fragile. If the width W1 is too large, the spacing guide 290 may not conform to the curvature of the shadow shield 250 and installation may become difficult. In some embodiments, the width W1 may be from about 1 mm to about 100 mm, such as from about 5 mm to about 50 mm or from about 10 mm to about 30 mm.

[0049] The thickness T1 is selected to produce a stable horizontal body 291. If the thickness T1 is too small, the horizontal body 291 may easily tear or break. If the thickness T1 is too large, the horizontal body 291 may be too hard and may have difficulty conforming to the shape of the shadow shield 250. Additionally, if the thickness T1 is too large, it may become difficult to accommodate the spacing guide 290 within the narrow space between the shadow shield 250 and the sputtering target 206. In some embodiments, the thickness T1 can be selected to provide a minimum distance between the shadow shield 250 and the radial surface 288 of the sputtering target 206. In some embodiments, the thickness T1 can be at least about 2 mm. This can help reduce or eliminate arcing due to vertical misalignment between the shadow shield 250 and the surface 206b of the sputtering target assembly 238, as the thickness T1 of the spacing guide can prevent direct contact between the shadow shield and the surface 206b of the sputtering target assembly. In some embodiments, the thickness T1 can be from about 1 mm to about 30 mm, or from about 2 mm to about 20 mm, or from about 3 mm to about 10 mm. In embodiments where the spacing guide 290 fits within the notch 253 of the shadow shield 250, the thickness T1 can be greater than about 30 mm.

[0050] The first leg 293 and the second leg 295 extend laterally from the horizontal body 291 and are perpendicular to the horizontal body 291. The first leg 293 has an inner surface 293a and an outer surface 293b. The inner surface 293a is configured to be adjacent to or abut against the outer surface 254 of the shadow shield 250. The second leg 295 has an inner surface 295a and an outer surface 295b. The inner surface 295a is configured to be adjacent to or abut against the inner surface 252 of the shadow shield 250.

[0051] The first leg 293 has a width W2, a length L2, and a thickness T2. The thickness T2 is selected such that the first leg 293 is thick enough to maintain strength and thin enough to be installed within the narrow space between the shadow shield 150 and the upper chamber wall 142.

[0052] The second leg 295 has a thickness T3. In some embodiments, the thickness T3 is selected to maintain a minimum gap between the inner surface 252 of the shadow shield 250 and the sputtering target assembly 238. In some embodiments, the thickness T3 may be at least 1 mm. This limits the radial misalignment between the shadow shield 250 and the radial surface 288 of the sputtering target 206. In some embodiments, the thickness T3 may be from about 1 mm to about 20 mm, or from about 2 mm to about 15 mm, or from about 3 mm to about 10 mm.

[0053] One of ordinary skill in the art will recognize that the second leg 295 also has a width and a length. In some embodiments, the first leg 293 and the second leg 295 have the same shape. In other embodiments, the first leg 293 and the second leg 295 may have different shapes. For example, the first leg 293 and the second leg 295 may have different thicknesses.

[0054] Misalignment between the shadow shield and the target assembly can account for more than 50% of all sputtering target-related performance issues in a sputtering chamber. Data suggests that a small amount of misalignment, such as less than about 1 mm, can improve or at least not adversely affect the performance of the sputtering target. However, misalignment greater than about 1 mm can adversely affect the performance of the sputtering target. For example, misalignment between the sputtering target and the shadow shield can lead to defects along the outer radial perimeter of the sputtering target. Additionally, misalignment can also result in arc discharge, particle issues, and / or film uniformity problems.

[0055] The spacing guide 290 physically and electrically separates the sputtering target 206 from the shadow shield 250. The spacing guide 290 can space the sputtering target 206 from the shadow shield 250 by a distance of more than about 3 mm and less than or equal to about 10 mm around the circumference or perimeter of the sputtering target 206, measured radially or horizontally. Similarly, the spacing guide 290 can space the sputtering target from the shadow shield 250 vertically by a distance of more than about 3 mm and less than or equal to about 10 mm around the circumference or perimeter of the sputtering target 206. If the spacing is too small, an irregular target surface or accumulated flakes may cause an electrical short circuit and an arc discharge. If the spacing is too large, plasma leakage may occur between the shadow shield and the assembly surfaces 206b or 288 of the sputtering target, which may also cause an electrical short circuit. Therefore, it is important to keep the spacing within this range. By maintaining the radial and / or vertical spacing, the alignment of the sputtering target 206 and the shadow shield 250 is improved. In some embodiments, the spacing guide 290 reduces the arc discharge phenomenon during the sputtering process.

[0056] The method of using the spacing guide 290 is also provided. In some embodiments, the spacing guide 290 is disposed on a commercially available shadow shield 250 such that one leg 295 of the spacing guide 290 is placed along the inner surface 252 of the shadow shield 250 and the other leg 293 of the spacing guide 290 is placed along the outer surface 254 of the shadow shield. The inner surface of the horizontal body of the spacing guide 290 is placed on or directly adjacent to the end of the shadow shield 250. In some embodiments, three spacing guides 290 are equally spaced around the shadow shield 250. In other embodiments, the three spacing guides 290 are not equally spaced around the shadow shield 250. When the sputtering chamber is closed, such as when the sputtering chamber is in use, the spacing guide 290 maintains a minimum distance in the horizontal and / or vertical directions between the shadow shield 250 and the sputtering target 206.

[0057] In some embodiments, the shadow shield 250 is modified to receive the spacing guide 290. For example, as shown in FIG. 4, a portion of the shadow shield 250b can be removed to form a groove or notch in which the spacing guide 290 is disposed. In some embodiments, three spacing guides 290 are equally spaced around the shadow shield 250b. In other embodiments, more than three spacing guides are used. When the sputtering chamber is closed, such as when the sputtering chamber is in use, the spacing guide 290 can prevent the shadow shield 250 from approaching the sputtering target 206 too closely, and thus maintain the minimum horizontal distance between the shadow shield 250 and the sputtering target 206.

[0058] Various modifications and additions can be made to the exemplary embodiments considered without departing from the scope of the present invention. For example, the embodiments described above refer to features, but the scope of the present invention also includes embodiments having different combinations of features and embodiments that do not include all of the features described above.

Claims

1. A spacing guide for use on a dark portion shield of a sputtering chamber, the spacing guide comprising: a first end, a second end opposite the first end, and a horizontal body having a thickness, the horizontal body being configured to be placed on an end of the dark portion shield; a horizontal body; a first leg extending laterally from the first end of the horizontal body and configured to abut an outer surface of the dark portion shield; a second leg extending laterally from the second end of the horizontal body and configured to abut an inner surface of the shield, the horizontal body, the first leg, and the second leg being formed of an insulating material, a spacing guide for use on a dark portion shield of a sputtering chamber.

2. The spacing guide according to claim 1, wherein the horizontal body has a thickness of about 1 millimeter to about 30 millimeters.

3. The spacing guide according to claim 1, wherein the second leg has a thickness of about 30 millimeters or less.

4. The spacing guide according to claim 1, wherein the first leg and the second leg have different widths, lengths, and thicknesses.

5. The spacing guide according to claim 1, wherein the horizontal body, the first leg, and the second leg are integrally formed.

6. A dark portion shield assembly for use in a sputtering chamber, the dark portion shield assembly comprising: an annular dark portion shield having a first end configured to be close to a substrate support and a second end configured to be close to a sputtering target; a plurality of spacing guides disposed on the second end of the annular dark portion shield, each spacing guide comprising: a first end, a second end opposite the first end, and a horizontal body having a thickness, the horizontal body being configured to be placed on the second end of the annular dark portion shield; a horizontal body; a first leg extending laterally from the first end of the horizontal body and configured to abut an outer surface of the annular dark portion shield; A second leg portion that extends laterally from the second end of the horizontal body and is configured to abut against the inner surface of the shield, and the horizontal body, the first leg portion, and the second leg portion are formed of an insulating material, a dark part shield assembly.

7. The dark part shield assembly according to claim 6, wherein the plurality of spacing guides are attached to the annular dark part shield only by frictional force.

8. The dark part shield assembly according to claim 6, wherein the plurality of spacing guides are attached to the annular dark part shield by fasteners.

9. The dark part shield assembly according to claim 6, wherein the spacing guide maintains the misalignment between the sputtering target and the annular dark part shield within about 5 millimeters along the horizontal axis.

10. The dark part shield assembly according to claim 9, wherein the spacing guide maintains the misalignment between the sputtering target and the annular dark part shield within about 1 millimeter along the horizontal axis.

11. The dark part shield assembly according to claim 9, wherein the horizontal body has a thickness of about 30 millimeters or less.

12. The dark part shield assembly according to claim 9, wherein the second leg portion has a thickness of about 30 millimeters or less.

13. A sputtering chamber assembly, the sputtering chamber assembly comprising A sputtering target, and An annular dark part shield having a first end configured to be close to the substrate support and a second end configured to be close to the sputtering target, and A plurality of spacing guides disposed on the second end of the annular dark part shield, each spacing guide comprising A first end, a second end opposite the first end, and a horizontal body having a thickness, the horizontal body being configured to be placed on the second end of the annular dark part shield, a horizontal body, and A first leg portion that extends laterally from the first end of the horizontal body and is configured to abut against the outer surface of the annular dark part shield. A sputtering chamber assembly comprising: a second leg portion extending laterally from the second end portion of the horizontal body and configured to abut against the inner surface of the shield, wherein the horizontal body, the first leg portion, and the second leg portion are formed of an insulating material.

14. The sputtering chamber assembly according to claim 13, wherein the spacing guide maintains misalignment between the sputtering target and the annular dark portion shield within about 1 millimeter along the horizontal axis.

15. The sputtering chamber assembly according to claim 14, wherein the spacing guide maintains the misalignment between the sputtering target and the annular dark portion shield within 1 millimeter along the vertical axis.

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