Adjustable holding device for heat sink assembly

Abstract

It is an adjustable holding device for a heat sink assembly. It is a heat sink holding device for holding a heat sink including a spring in proximity to an electronic device within a circuit board. This device includes a first component configured to be mounted on the circuit board and a second component configured to be adjustably mounted on the first component and including an opening configured to hold a part of the spring of the heat sink. When the first component and the second component are mounted together and the first component is mounted on the circuit board, the heat sink holding device is adapted to apply a force to the spring to hold the heat sink in proximity to the electronic device mounted on the circuit board.

Description

Technical Field

[0001] The present invention generally relates to a heat sink assembly, and more specifically to an adjustable retaining device for holding a heat sink capable of applying a spring load to an electronic device within a printed circuit board (PCB).

Background Art

[0002] Electronic devices such as microprocessors and integrated circuits (ICs) need to operate within a specific temperature range in order to operate efficiently. Excessive heat can degrade the performance, reliability, and lifespan of electronic devices, and can even cause failures. Heat sinks are widely used to control excessive heat. A heat sink placed in thermal contact with an electronic device transfers heat from the electronic device by conduction.

Summary of the Invention

Problems to be Solved by the Invention

[0003] According to some embodiments of the present invention, a heat sink retaining device is provided for holding a heat sink including a spring in proximity to an electronic device within a circuit board. The heat sink retaining device includes a first component configured to be mounted on the circuit board, and a second component configured to be adjustably mounted on the first component and including an opening configured to hold a portion of the spring of the heat sink. When the first component and the second component are mounted together and the first component is mounted on the circuit board, the heat sink retaining device is adapted to apply a force to the spring in order to hold the heat sink in proximity to an electronic device mounted on the circuit board.

Means for Solving the Problems

[0004] According to some embodiments of the present invention, a heat sink assembly is provided for holding a heat sink including a spring in proximity to an electronic device within a circuit board. The heat sink assembly includes a circuit board, an electronic device attached to the circuit board, a heat sink including a spring in proximity to the electronic device attached to the circuit board, and a heat sink holding device. The heat sink holding device includes a first component configured to be mounted to the circuit board, and a second component including an opening configured to be adjustably mounted to the first component and configured to hold a portion of the spring of the heat sink. When the first component and the second component are mounted together and the first component is mounted to the circuit board, the heat sink holding device is adapted to apply a force to the spring to hold the heat sink in proximity to the electronic device attached to the circuit board.

[0005] According to some embodiments of the present invention, a method of holding a heat sink including a spring in proximity to an electronic device within a circuit board is provided. The method includes several operations including the steps of providing a circuit board to which an electronic device is attached, providing a heat sink including a spring, and providing a heat sink holding device. The heat sink holding device includes a first component configured to be mounted on the circuit board and a second component including an opening configured to be adjustably mounted on the first component and configured to hold a portion of the spring of the heat sink. When the first component and the second component are mounted together and the first component is mounted on the circuit board, the heat sink holding device is adapted to apply a force to the spring to hold the heat sink in proximity to the electronic device attached to the circuit board. The method further includes the steps of attaching the first component of the heat sink holding device to the circuit board; adjusting the second component of the heat sink holding device relative to the first component such that a portion of the spring can be in the opening of the second component; placing a portion of the spring in the opening of the second component; and locking the first component and the second component together to hold an end of the spring and apply a force to the spring to hold the heat sink in proximity to the electronic device.

[0006] The above summary is not intended to describe every illustrated embodiment or every implementation of the present invention.

Brief Description of the Drawings

[0007] The drawings included in this application are incorporated herein and form a part hereof. These drawings illustrate embodiments of the present invention and serve, together with the description, to explain the principles of the present invention. The drawings are only exemplary of particular embodiments and do not limit the present invention.

[0008]

Figure 1

[0009]

Figure 2

[0010]

Figure 3

[0011]

Figure 4

[0012]

Figure 5

[0013] Although the present invention is capable of accepting various modifications and alternative forms, specific examples thereof are shown in the drawings as examples and are described in detail. However, it should be understood that the intention is not to limit the present invention to the specific embodiments described. In contrast, the present invention is intended to cover all modifications, equivalents, and alternative forms included within the scope of the present invention.

Mode for Carrying Out the Invention

[0014] Aspects of the present invention generally relate to a heat sink assembly, and more specifically, to an adjustable holding device for holding a heat sink capable of applying a spring load to an electronic device within a printed circuit board (PCB). The present invention is not necessarily limited to such applications, but various aspects of the present invention can be understood through the description of various examples using this context.

[0015] A heat sink is an essential part of any computer system. The heat generated by the continuous and prolonged use of a computer can damage the electronic components within the computer. A heat sink provides a means to move heat away from the heat source and away from critical components. A heat sink can be attached to an electronic component or device that generates heat in order to dissipate the heat from the device. To increase the amount of heat conduction, a heat sink typically includes a large surface area or a number of thermally conductive fins that contact the surrounding (cooling) medium such as air. A heat sink can be large and heavy. Such a heat sink can be made to be prone to tipping during installation, and an uneven load can be applied to a module or chip placed under one of the heat sinks, which can lead to damage to the module or chip.

[0016] Heat sinks are commonly used for heat dissipation of application-specific integrated circuit (ASIC) chips, peripheral component interconnect express (PCIe) modules, and other integrated circuits (ICs). Considerable effort has been put into design and modeling to ensure that the load applied from the heat sink is sufficient to compress the thermal interface material (TIM) on the chip or module placed on the printed circuit board (PCB). A heat sink with a torsion spring utilizes the torsion spring to compress the heat sink onto the heat-generating electronic device.

[0017] Embodiments described in the present disclosure provide an adjustable holding device that can exert a force on, for example, the spring of a spring-holding heat sink to fix the heat sink to an electronic device within a PCB. The adjustable holding device can include, for example, a two-piece or three-piece setup that can be used to hold springs of different sizes. More generally, the adjustable holding device can be used to hold any suitable other type of heat sink, including, for example, those having a spring or a torsion spring.

[0018] One feature or advantage of the disclosed structure is the adjustable nature of the adjustable retaining device for the spring-loaded heatsink, which provides flexibility by having the potential to be applied to springs of different sizes and arm lengths. The ability to adjust the height of the adjustable retaining device is a cost improvement mechanism by enabling such a setup to be applied to a wider range of springs with different diameters and heights. Another feature or advantage is that the adjustable nature of the adjustable retaining device can prevent potential pre-deformation of the torsion spring during the installation process. A further feature or advantage is that the elastomeric layer on the adjustable retaining device provides a damping effect against the shocks and vibrations that the heatsink assembly may experience. Also, the elastomeric layer can prevent potential damage to the torsion spring or the adjustable retaining device.

[0019] Turning to the figures, FIG. 1 shows an example of a torsion spring retaining heatsink installed as part of a heat assembly 100 according to an embodiment of the present invention. As shown, the torsion spring retaining heatsink 102 uses a torsion spring 104 to secure the heatsink 102 to a printed circuit board (PCB) 106 using an adjustable retaining clip 200 attached to the PCB 106, thereby securing it onto a device (not visible in the figure) such as an electronic device, a mechanical device, a chip, a module, etc. According to an exemplary embodiment, the hook end 108 of the torsion spring 104 can be secured to the adjustable retaining clip (or device) 200 as shown. The adjustable retaining clip 200 can exert a force on the hook end 108 and the arm portion 110 of the torsion spring 104, thereby securing the heatsink 102 to an electronic device (not visible in the figure) on the PCB 106. The illustrated heatsink assembly 100 is an example that can be used with the adjustable retaining clip 200 of the present invention, or other embodiments of the adjustable retaining clip. Other suitable heat assemblies are also contemplated.

[0020] For the sake of brevity, the prior art related to the manufacture of semiconductor devices and ICs may or may not be described in detail herein. Also, the various tasks and processing steps or operations described herein can be incorporated into more comprehensive procedures or processes having additional operations or functions not described in detail herein. In particular, since various operations in the manufacture of semiconductor devices and semiconductor-based ICs are well known, for the sake of brevity, many conventional operations are only briefly mentioned herein or are completely omitted without providing details of well-known processes.

[0021] For purposes of description herein, the terms "upper", "lower", "left", "rear", "right", "front", "vertical", "horizontal", and derivatives thereof shall relate to the heat sink 100 assembly oriented in FIG. 1. However, it should be understood that heat sink assemblies that can be used with the adjustable retaining clips 200, 300 (FIGS. 3-4) of the present invention can assume various alternative orientations and step sequences, unless an explicitly opposite designation is made. Also, it should be understood that the specific devices and processes illustrated in the accompanying drawings and described in the following disclosure are merely exemplary embodiments of the inventive concepts defined in the appended claims. Accordingly, other physical characteristics related to the embodiments disclosed herein are not to be considered limiting unless explicitly stated otherwise in the claims.

[0022] FIG. 2 is a cross-sectional view taken along line 2-2 of the heat assembly 100 of FIG. 1 according to an exemplary embodiment of the present invention. FIG. 2 shows a heat sink 102 including a plurality of fins 112 and a base 114, which is compressed against an electronic device 116 by a torsion spring 104. The heat sink 102 can be disposed directly above the electronic device 116 and can serve to dissipate heat from the electronic device 116. A layer of thermal interface material 118 can be compressed between the base 114 of the heat sink 102 and the electronic device 116 as shown. The electronic device 116 is disposed directly above the PCB 106 and is connected to the PCB 106.

[0023] Figure 3 is a schematic perspective view of an adjustable retaining clip 200 according to an embodiment of the present invention. The adjustable retaining clip 200 is also shown as being included in the embodiment of the heat sink assembly 100 of FIG. 1.

[0024] The illustrated adjustable retaining clip 200 includes two (2) parts or components that are adjustable relative to each other and can lock to each other, as indicated by the dashed lines in the figure. The adjustable retaining clip 200 includes two U-shaped components including a U-shaped base component 202 and a U-shaped insertion component 204. The U-shaped base component 202 includes a central or base portion 208 that connects a first leg and a second leg 210. The central portion 208 can be mounted to a PCB (e.g., 106 of FIG. 1) at the bottom surface 206. The U-shaped base component 202 can be mounted to the PCB, for example, by soldering or press-fitting methods. Other suitable methods of mounting the U-shaped base component 202 to the PCB are also contemplated. The U-shaped base component 202 can include a first opening and a second opening or lumen 212 in the first leg and the second leg 210, and the opening or lumen 212 can accommodate or receive a portion of the U-shaped insertion component 204.

[0025] As shown by the arrow in FIG. 3, the first leg and the second leg 214 of the U-shaped insertion component 204 can be slidably inserted into and removed from the opening or lumen 212 of the U-shaped base component 202. The U-shaped insertion component 204 includes a cutout opening 216 in the central portion 218. The cutout opening 216 can have a cylindrical shape and can accommodate one of the hook ends 108 of the torsion spring 104 as shown in FIG. 1 to hold the heat sink 102 in a predetermined position. The cutout opening 216 can include a layer 220 of elastomeric material on its inner wall 222. The elastomeric material layer 220 can provide a damping effect against the shock and vibration that may be experienced by the torsion spring 104 (see FIG. 1) during transportation of the heat sink assembly 100, etc., to reduce the possibility of damage.

[0026] The U-shaped base component 202 can include a plurality of openings 226 along the inner surface 228 of the first leg and the second leg 210. The U-shaped insertion component 204 can include tabs 224 that can lock or fit into the openings 226 located at different positions along the U-shaped base component 202 along the inner surface 230 of each leg 214. The plurality of openings 226 are shown as being included in the inner surface 228 of the U-shaped base component 202, but other positions are also possible. The plurality of openings 226 contribute to the adjustability of the adjustable retaining clip 200. Once the two components 202, 204 are locked together, if it is desired to change the position of the U-shaped insertion component 204, the legs 214 of the U-shaped insertion component 204 can be pushed outward to remove the tabs 224 from a series of the openings 226 included in the plurality of openings 226.

[0027] Figure 4 is a schematic perspective view of an adjustable retaining clip 300 according to an embodiment of the present invention. The adjustable retaining clip 300 shown in Figure 4 includes three (3) parts or components that can be locked together. The adjustable retaining clip 300 includes two U-shaped components including a U-shaped base component 302 and a U-shaped insertion component 304. The U-shaped base component 302 includes a central or base portion 308 connecting a first leg and a second leg 310. The central portion 308 can be mounted on a PCB (e.g., 106 in Figure 1) at the bottom surface 306. The U-shaped base component 302 can be mounted on the PCB by, for example, soldering or press-fitting methods. Other suitable methods for mounting the U-shaped base component 302 on the PCB are also contemplated. The U-shaped base component 302 can include a first opening and a second opening or lumen 312 in the first leg and the second leg 310, and the opening or lumen 312 can accommodate or receive a part of the U-shaped insertion component 304.

[0028] As shown by the dashed line in Figure 4, the first leg and the second leg 314 of the U-shaped insertion component 304 can be slidably inserted into and removed from the opening or lumen 312 of the U-shaped base component 302. The U-shaped insertion component 304 includes a cutout opening 316 in the central portion 318. The cutout opening 316 can have a cylindrical shape and can accommodate one of the hook ends 108 of one of the torsion springs 104 as shown in Figure 1 to hold the heat assembly 100 in a predetermined position. The cutout opening 316 can include a layer 320 of an elastomeric material on its inner wall 322. The elastomeric material layer 320 can provide a damping effect against impacts and vibrations that may be experienced by the torsion spring 104 (see Figure 1) during transportation of the heat sink assembly 100, etc., to reduce the possibility of damage.

[0029] The U-shaped insertion component 304 includes a plurality of cylindrical openings 324 disposed along a first leg and a second leg 314 that contribute to the adjustability of the adjustable retaining clip 300. The U-shaped base component 302 also includes cylindrical openings 326 along a first leg and a second leg 310. The third component of the adjustable retaining clip 300 is a pin-fit component 328 that can hold the U-shaped base component 302 and the U-shaped insertion component 304 together using a pin-fit locking technique. The two (2) leg openings 326 on the U-shaped base component 302 and the two (2) leg openings 324 on the U-shaped insertion component 304 can be aligned to a desired position or height to effectively hold the torsion spring 104 within the heat sink assembly 100 (as shown in FIG. 1) in a desired position and exert a load on the heat sink 102 to hold it in a predetermined position. Thereafter, the pin-fit component 328 can be inserted through the two U-shaped components 302, 304 to hold the two U-shaped components 302, 304 together in a desired position or height.

[0030] The pin-fit component 328 can have a central planar portion 330 and includes a first pin and a second pin 332 extending in the same direction from a planar surface 334 on the central planar portion 330. The pins 332 are cylindrical and sized to fit into the cylindrical openings 324, 326 that penetrate both U-shaped components 302, 304. Although the cylindrical shapes of the openings 324, 326 and the pins 332 are shown in the figure, other suitable shapes and arrangements are contemplated in the present invention.

[0031] FIG. 5 is a method 400 for holding a heat sink 102 (see FIG. 1) including a torsion spring 104 proximate to an electronic device 116 (FIG. 2) on a circuit board 106 according to an embodiment of the present invention. An operation 410 of method 400 is to provide a circuit board 106 to which the electronic device 116 is attached. Another operation 420 is to provide a heat sink 102 including a torsion spring 104. A further operation 430 is to provide an adjustable holding clip or device 200 or 300 (in FIGS. 3 and 4).

[0032] The adjustable holding device or clip 200 (e.g., in FIGS. 1 and 3) can include a first component 202 configured to be mounted to the circuit board 106 and a second component 204 configured to be adjustably mounted to the first component 202 and including an opening 216 configured to hold a portion of the torsion spring 104 (FIG. 1) of the heat sink 102. The first component and the second component 202, 204 are mounted together, the first component 202 is mounted to the circuit board 106, and the adjustable holding clip 200 is adapted to apply a force to the torsion spring 104 to hold the heat sink 102 proximate to the electronic device 116 attached to the circuit board 106.

[0033] Yet another operation 440 of method 400 is to attach the first component 202 of the adjustable retaining clip 200 to the circuit board 106. Another operation 450 is to adjust the second component 204 of the adjustable retaining clip 200 relative to the first component 202 such that a portion of the torsion spring 104 can enter the opening 216 of the second component. Method 400 also includes an operation 460 of placing the end 108 of the torsion spring 104 in the opening 216 of the second component 204. A further operation 470 is to lock the first and second components 202, 204 together to hold the end 108 of the torsion spring 104 and apply a force to the torsion spring 104 that holds the heat sink 102 in proximity to the electronic device 116.

[0034] When a three-component adjustable retaining device such as the adjustable retaining clip 300 shown in FIG. 4 is used, another operation in the method can be performed. For example, the third component 328 can lock the first and second components 302, 304 together for mounting the first and second components.

[0035] In this specification, for the purposes of explanation, specific aspects, advantages, and novel features of embodiments of the present invention are described. The disclosed processes and systems should not be construed as limiting in any sense. Instead, the present invention is directed to all novel and non-obvious features and aspects of the various disclosed embodiments, alone and in various combinations and sub-combinations with each other. The processes and systems are not limited to a particular aspect, or feature, or combination thereof, and the disclosed embodiments do not require the presence of one or more specific advantages or the solving of a problem.

[0036] Although some of the operations of the disclosed embodiments are described in a particular sequential order for convenience of presentation, it should be understood that this mode of description encompasses permutations unless a particular order is required by specific language set forth below. For example, the operations described sequentially may, in some cases, be rearranged or performed concurrently. Further, for simplicity, the attached figures may not show various ways in which the disclosed processes can be used in combination with other processes. Additionally, the terms "provide" or "achieve" may be used herein to describe the disclosed processes. These terms abstract the actual operations being performed to a high level. The actual operations corresponding to these terms may vary depending on the particular embodiment and will be readily discernible by one of ordinary skill in the art.

[0037] As used in this application and the claims thereof, the singular forms "a", "an", and "the" include the plural unless the context clearly dictates otherwise. Further, the term "includes" means "comprises".

[0038] The description of the various embodiments of the present invention is presented for purposes of illustration but is not intended to be exhaustive or to limit the invention to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope of the described embodiments. The terms used herein are chosen to explain the principles of the embodiments, actual applications, or technical improvements over technologies found in the marketplace, or to enable other ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A first component configured to be mounted on a circuit board; A second component configured to be adjustably mounted on the first component and including an opening configured to hold a part of a spring of a heat sink comprising wherein the first component and the second component are mounted together, and when the first component is mounted on the circuit board, the heat sink holding device is adapted to apply a force to the spring to hold the heat sink in proximity to an electronic device mounted on the circuit board. A heat sink holding device for holding a heat sink including a spring in proximity to an electronic device within a circuit board.

2. The apparatus according to claim 1, wherein the second component is movable relative to the first component to adjust the force applied to the spring to hold the heat sink.

3. The apparatus according to claim 2, wherein the second component is locked to the first component to mount the first component and the second component together.

4. A third component for locking the first component and the second component to mount the first component and the second component together further comprising the apparatus according to claim 1.

5. The apparatus according to claim 1, wherein the second component is U-shaped and includes a first leg and a second leg, and the first leg and the second leg are slidably inserted into a first lumen and a second lumen within the first component respectively, and are adapted to be locked in a predetermined position to adjustably mount the first component and the second component together.

6. The apparatus according to claim 5, wherein the first leg and the second leg of the second component each include a tab that can be locked to one of a plurality of openings at different positions along the first lumen and the second lumen of the first component to enable adjustable mounting, wherein the plurality of openings are configured to fit the tabs.

7. The first leg and the second leg of the second component each include a plurality of openings at different positions along the first leg and the second leg, the first lumen and the second lumen of the first component each include a plurality of openings at different positions along the first lumen and the second lumen, and the apparatus further comprises a first pin and a second pin extending from the first pin, and a third component configured to extend through two of the openings of the first component and corresponding two of the openings on the second component, wherein the third component is adapted to enable attachment of the first component and the second component together. The apparatus according to claim 5. Claim 8 The apparatus according to claim 1, wherein the opening includes an elastomeric coating adapted to enable a damping effect on impacts and vibrations experienced by the spring of the heat sink. Claim 9 A circuit board; An electronic device attached to the circuit board; A heat sink including a spring, proximate to the electronic device attached to the circuit board; and A heat sink holding device according to any one of the preceding claims A heat sink assembly for holding a heat sink including a spring in proximity to an electronic device within a circuit board. Claim 10 Providing a circuit board to which an electronic device is attached; Providing a heat sink including a spring; A first component configured to be attached to the circuit board; and A second component configured to be adjustably attached to the first component and including an opening configured to hold a portion of the spring of the heat sink, wherein when the first component and the second component are attached together and the first component is attached to the circuit board, the heat sink holding device is adapted to enable application of a force to the spring to hold the heat sink in proximity to the electronic device attached to the circuit board. Providing a heat sink holding device; Attaching the first component of the heat sink holding device to the circuit board; Adjusting the second component of the heat sink holding device relative to the first component so that a portion of the spring is in the opening in the second component to enable the first and second components to be mounted; Placing the portion of the spring in the opening in the second component; and Locking the first and second components together to hold the end of the spring and apply the force to the spring to hold the heat sink in proximity to the electronic device A method of holding a heat sink including a spring in proximity to an electronic device within a circuit board, comprising: **Claim 11** The method of claim 10, wherein the second component moves relative to the first component to adjust the force applied to the spring to hold the heat sink. **Claim 12** The method of claim 10, wherein the heat sink holding device further comprises a third component for locking the first and second components together for mounting the first and second components together.

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