Adjustment systems, arrangements and methods

Abstract

Disclosed herein is a stand-alone adjustment system for a fluid handling structure of a lithographic apparatus, the adjustment system comprising an inspection system configured to inspect the fluid handling structure and determine one or more different types of adjustments to be performed on a main surface of the fluid handling structure, and an adjustment device configured to perform the determined one or more different types of adjustments to the main surface of the fluid handling structure.

Description

[Technical Field]

[0001] (CROSS-REFERENCE TO RELATED APPLICATIONS)

[0001] This application claims priority to EP application 22191309.8, filed August 19, 2022, which is incorporated herein by reference in its entirety.

[0002]

[0002] The present invention relates to a stand-alone adjustment system for adjusting a fluid handling structure. [Background technology]

[0003] A lithographic apparatus is a machine constructed to apply a desired pattern onto a substrate. Lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs). A lithographic apparatus may, for example, project a pattern (often referred to as a "design layout" or "design") from a patterning device (e.g. a mask) onto a layer of radiation-sensitive material (resist) provided on the substrate (e.g. a wafer). Known lithographic apparatus include so-called steppers, in which each target portion is irradiated by exposing the entire pattern onto the target portion at once, and so-called scanners, in which each target portion is irradiated by scanning the pattern through a radiation beam in a predetermined direction (the "scan" direction) while simultaneously scanning the substrate parallel or anti-parallel to this direction.

[0004]

[0004] As semiconductor manufacturing processes continue to advance, the dimensions of circuit elements have continually decreased, while the number of functional elements, such as transistors, per device has steadily increased for decades, following a trend commonly referred to as "Moore's Law." To keep up with Moore's Law, the semiconductor industry pursues technologies that enable the creation of smaller and smaller features. To project patterns onto a substrate, lithography equipment may use electromagnetic radiation. The wavelength of this radiation determines the minimum size of features that can be patterned on the substrate. Typical wavelengths currently in use are 365 nm (i-line), 248 nm, 193 nm, and 13.5 nm.

[0005]

[0005] Further improvements in the resolution of smaller features may be achieved by providing an immersion fluid with a relatively high refractive index, such as water, onto the substrate during exposure. The effect of the immersion fluid is to enable imaging of smaller features because the exposure radiation will have a shorter wavelength in the fluid than in a gas. The effect of the immersion fluid may also be seen as increasing the effective numerical aperture (NA) of the system, and also increasing the depth of focus.

[0006]

[0006] Immersion fluid may be confined to a localized area between the projection system of the lithographic apparatus and the substrate by the fluid handling structure, and the flow of immersion fluid needs to be well controlled during operation of the lithographic apparatus.

[0007]

[0007] There is a general need to improve techniques for maintaining and repairing fluid handling structures. Summary of the Invention

[0008]

[0008] According to a first aspect of the present invention, there is provided a stand-alone adjustment system for a fluid handling structure of a lithographic apparatus, the adjustment system comprising an inspection system configured to inspect the fluid handling structure and determine one or more different types of adjustments to be performed on a main surface of the fluid handling structure, and an adjustment device configured to perform the determined one or more different types of adjustments on the main surface of the fluid handling structure.

[0009]

[0009] According to a second aspect of the present invention, there is provided a regulation system and a fluid handling structure, wherein the regulation system is according to the first aspect and the fluid handling structure is housed by the regulation system.

[0010] According to a third aspect of the present invention, there is provided an arrangement in a clean room comprising a lithographic apparatus and a conditioning system according to the first aspect.

[0011]

[0011] According to a fourth aspect of the present invention, there is provided a method for readjusting a fluid handling structure of a lithographic apparatus, the method comprising removing the fluid handling structure from the lithographic apparatus, providing the fluid handling structure to a stand-alone adjustment system, inspecting the fluid handling structure to determine one or more different types of adjustment to be performed on a major surface of the fluid handling structure, and performing the determined one or more different types of adjustment to the major surface of the fluid handling structure.

[0012] Further embodiments, features, and advantages of the present invention, as well as the structure and operation of the various embodiments, features, and advantages of the present invention, are described in detail below with reference to the accompanying drawings. [Brief explanation of the drawings]

[0013]

[0013] Embodiments of the present invention will now be described, by way of example only, with reference to the accompanying schematic drawings in which corresponding reference symbols indicate corresponding parts, and in which:

[0014] [Figure 1] 1 shows a schematic overview of a lithographic apparatus; [Figures 2a-2d]

[0015] 1 shows in cross section two different versions of a fluid handling system with different features shown on the left and right side of each version, which may extend all around; [Figure 3]

[0016] 1 shows a schematic representation of a regulation system according to a first embodiment; [Figure 4]

[0017] 1 shows a schematic representation of a regulation system according to a second embodiment;

[0015]

[0018] Features shown in the figures are not necessarily drawn to scale, and the depicted size and / or arrangement is not limiting. It will be understood that these figures include optional features that may not be essential to the invention. Furthermore, not all features of a device are depicted in each figure, and a figure may show only some of the components relevant to the description of a particular feature. In the figures, like parts are designated with like reference numerals. DETAILED DESCRIPTION OF THE INVENTION

[0016]

[0019] In this document, the terms "radiation" and "beam" are used to encompass all types of electromagnetic radiation, including ultraviolet radiation (eg, having a wavelength of 365, 248, 193, 157 or 126 nm).

[0017]

[0020] The terms "reticle," "mask," or "patterning device," as used herein, may be broadly interpreted to refer to a general-purpose patterning device that can be used to impart a patterned cross-section to an incident radiation beam, corresponding to the pattern to be created in a target portion of a substrate. The term "light valve" may also be used in this context. Besides the classic mask (transmissive or reflective, binary, phase-shifting, hybrid, etc.), examples of other such patterning devices include programmable mirror arrays and programmable LCD arrays.

[0018]

[0021] Figure 1 schematically depicts a lithographic apparatus comprising: an illumination system (also referred to as an illuminator) IL configured to condition a radiation beam B (e.g., UV or DUV radiation); a mask support (e.g., mask table) MT constructed to support a patterning device (e.g., mask) MA and connected to a first positioner PM configured to accurately position the patterning device MA according to certain parameters; a substrate support (e.g., substrate table) WT constructed to hold a substrate (e.g., resist-coated wafer) W and connected to a second positioner PW configured to accurately position the substrate support WT according to certain parameters; and a projection system (e.g., a refractive projection lens system) PS configured to project a pattern imparted to the radiation beam B by the patterning device MA onto a target portion C (e.g., comprising one or more dies) on the substrate W. A controller 500 controls the overall operation of the apparatus. The controller 500 may be a centralized control system or a system of multiple separate sub-controllers within various subsystems of the lithographic apparatus.

[0019]

[0022] In operation, the illumination system IL receives the radiation beam B from the radiation source SO, for example via the beam delivery system BD. The illumination system IL may include various types of optical components, such as refractive, reflective, magnetic, electromagnetic, electrostatic and / or other types of optical components, or any combination thereof, for directing, shaping and / or controlling the radiation. The illuminator IL may be used to condition the radiation beam B so that it has a desired spatial and angular intensity distribution in its cross-section in the plane of the patterning device MA.

[0020]

[0023] The term "projection system" PS as used herein should be interpreted broadly to encompass various types of projection systems, including refractive optical systems, catadioptric optical systems, anamorphic optical systems, magnetic optical systems, electromagnetic optical systems and / or electrostatic optical systems, or any combination thereof, as appropriate to the exposure radiation used and / or other factors such as the use of an immersion liquid or the use of a vacuum. Any use of the term "projection lens" herein may be considered as synonymous with the more general term "projection system" PS.

[0021]

[0024] The lithographic apparatus is of a type in which at least a part of the substrate W may be covered with an immersion liquid having a relatively high refractive index, e.g. water, to fill an immersion space 11 between the projection system PS and the substrate W, and is also referred to as immersion lithography. More information about immersion techniques is given in U.S. Patent No. 6,952,253, which is incorporated herein by reference.

[0022]

[0025] The lithographic apparatus may be of a type having two or more substrate supports WT (also called "dual stage"). In such a "multi-stage" machine, the substrate supports WT may be used in parallel, and / or preparation steps for a subsequent exposure of a substrate W may be performed on a substrate W located on one substrate support WT, while another substrate W on another substrate support WT is being used to expose a pattern onto the other substrate W.

[0023]

[0026] In addition to the substrate support WT, the lithographic apparatus may comprise a measurement stage (not depicted). The measurement stage may be arranged to hold a sensor and / or a cleaning device. The sensor may be arranged to measure a property of the projection system PS or a property of the radiation beam B. The measurement stage may hold a number of sensors. The cleaning device may be arranged to clean part of the lithographic apparatus, for example part of the projection system PS or part of a system for providing immersion liquid. The measurement stage may move below the projection system PS when the substrate support WT is spaced apart from the projection system PS.

[0024]

[0027] In operation, a radiation beam B is incident on a patterning device, for example a mask MA, which is held on a mask support MT, and is patterned by a pattern (design layout) present on the patterning device MA. Having traversed the mask MA, the radiation beam B passes through the projection system PS, which focuses the beam onto a target portion C of a substrate W. Using the second positioner PW and position measurement system IF, the substrate support WT can be accurately moved, for example, to position various target portions C at focused and aligned positions in the path of the radiation beam B. Similarly, the first positioner PM, and possibly further position sensors (not explicitly depicted in FIG. 1 ), may be used to accurately position the patterning device MA with respect to the path of the radiation beam B. The patterning device MA and substrate W may be aligned using mask alignment marks M1, M2 and substrate alignment marks P1, P2. The illustrated substrate alignment marks P1, P2 occupy dedicated target portions, but may be located in spaces between the target portions. When the substrate alignment marks P1, P2 are located between target portions C, they are known as scribe-lane alignment marks.

[0025]

[0028] To clarify the invention, a Cartesian coordinate system is used. The Cartesian coordinate system has three axes: x, y, and z. Each of the three axes is orthogonal to the other two. Rotation about the x axis is referred to as Rx rotation. Rotation about the y axis is referred to as Ry rotation. Rotation about the z axis is referred to as Rz rotation. The x and y axes define a horizontal plane, to which the z axis is perpendicular. The Cartesian coordinate system is not intended to limit the invention and is used merely for clarity. Alternatively, another coordinate system, such as a cylindrical coordinate system, may be used to clarify the invention. The orientation of the Cartesian coordinate system may be different, for example, so that the z axis has a component along the horizontal plane.

[0026]

[0029] Immersion techniques have been introduced into lithography systems to enable improved resolution of smaller features. In an immersion lithography apparatus, a layer of immersion liquid, having a relatively high refractive index, is interposed in an immersion space 11 between the projection system PS of the apparatus (through which a patterned beam is projected towards the substrate W) and the substrate W. The immersion liquid covers at least a portion of the substrate W below the final element of the projection system PS. Thus, at least the part of the substrate W undergoing exposure is immersed in the immersion liquid.

[0027]

[0030] In commercial immersion lithography, the immersion liquid is water. Typically, this water is highly pure, distilled water, such as ultrapure water (UPW), which is commonly used in semiconductor manufacturing facilities. In immersion systems, the UPW is often purified and may undergo additional processing steps before being supplied to the immersion space 11 as the immersion liquid. In addition to water, other liquids with high refractive indices, for example hydrocarbons such as fluorocarbons and / or aqueous solutions, can be used as immersion liquids. Furthermore, it is envisioned that fluids other than liquids may be used in immersion lithography.

[0028]

[0031] Reference will be made herein to localized immersion where, in use, immersion liquid is confined in an immersion space 11 between the final element 100 and a surface facing the final element 100. The facing surface is the surface of the substrate W or a surface of the support stage (or substrate support WT) that is coplanar with the surface of the substrate W. (Note that references in the following text to the surface of the substrate W may also, unless expressly stated otherwise, additionally or alternatively refer to the surface of the substrate support WT, and vice versa.) A fluid handling structure 12 present between the projection system PS and the substrate support WT is used to confine the immersion liquid to the immersion space 11. The immersion space 11, filled with immersion liquid, is smaller in plan than the top surface of the substrate W, and the immersion space 11 remains substantially stationary relative to the projection system PS while the substrate W and the substrate support WT move downwards.

[0029]

[0032] Other immersion systems are also envisaged, such as unconfined immersion systems (so-called "all wet" immersion systems) and bath immersion systems. In an unconfined immersion system, the immersion liquid extends over the surface below the final element 100. The liquid outside the immersion space 11 is present as a thin film. The liquid may cover the entire surface of the substrate W, or the entire surface of the substrate W and a substrate support WT that is coplanar with the substrate W. In a bath system, the substrate W is fully immersed in a bath of immersion liquid.

[0030]

[0033] The fluid handling structure 12 is a structure that supplies immersion liquid to and removes immersion liquid from the immersion space 11, thereby confining the immersion liquid to the immersion space 11. The structure includes features that are part of a fluid supply system. An arrangement disclosed in PCT patent application publication WO 99 / 49504 is an early fluid handling structure that comprises pipes that supply or remove immersion liquid from the immersion space 11 and that operate in response to relative movement of a stage below the projection system PS. In more recent designs, the fluid handling structure extends along at least part of the boundary of the immersion space 11 between the final element 100 of the projection system PS and the substrate support WT or substrate W, to partly define the immersion space 11.

[0031]

[0034] The fluid handling structure 12 may have a selection of different functions, each of which may result from a corresponding feature that enables the fluid handling structure 12 to achieve that function. The fluid handling structure 12 may be referred to by a number of different terms, each of which refers to a function, such as barrier member, seal member, fluid supply system, fluid removal system, liquid confinement structure, etc.

[0032]

[0035] As a barrier member, the fluid handling structure 12 is a barrier to the flow of immersion liquid from the immersion space 11. As a liquid confinement structure, the structure confines the immersion liquid to the immersion space 11. As a seal member, the sealing mechanism of the fluid handling structure 12 forms a seal that confines the immersion liquid to the immersion space 11. The sealing mechanism may comprise an additional gas flow from an opening in the surface of the seal member, for example a gas knife.

[0033]

[0036] In an embodiment, the fluid handling structure 12 may be a fluid supply system for supplying immersion fluid.

[0034]

[0037] In an embodiment, the fluid handling structure 12 may be a fluid confinement system as it at least partially confines the immersion fluid.

[0035]

[0038] In an embodiment, the fluid handling structure 12 may be a barrier member, such as a fluid confinement structure, to provide a barrier to the immersion fluid.

[0036]

[0039] In an embodiment, the fluid handling structure 12 may generate or use a flow of gas, for example to help control the flow and / or position of the immersion fluid.

[0037]

[0040] The gas flow may form a seal that confines the immersion fluid and therefore the fluid handling structure 12 may be referred to as a seal member, and such a seal member may be a fluid confinement structure.

[0038]

[0041] In an embodiment, an immersion liquid is used as the immersion fluid, in which case the fluid handling structure 12 may be a liquid handling system. With reference to the above description, references in this paragraph to features defined in terms of a fluid may be understood to include features defined in terms of a liquid.

[0039]

[0042] The lithographic apparatus comprises a projection system PS. During exposure of a substrate W, the projection system PS projects a patterned radiation beam onto the substrate W. To reach the substrate W, the path of the radiation beam B passes from the projection system PS through immersion liquid confined by a fluid handling structure 12 between the projection system PS and the substrate W. The projection system PS has a lens element at the end of the beam path, which lens element is in contact with the immersion liquid. This lens element in contact with the immersion liquid is sometimes referred to as the "last lens element" or "final element". The final element 100 is at least partly surrounded by the fluid handling structure 12. The fluid handling structure 12 may confine immersion liquid below the final element 100 and above a facing surface.

[0040]

[0043] Figures 2a, 2b, 2c and 2d show different features that may be present in variants of the fluid handling system. The design may share some of the same features as Figures 2a, 2b, 2c and 2d unless described differently. The features described herein may be selected individually or in combination as shown in the figures or as needed. The figures show different versions of the fluid handling system with different features shown on the left and right sides that may extend around the periphery. Thus, for example, the fluid handling system may have the same feature extending around the periphery. For example, the fluid handling system may only have the feature on the left side of Figure 2a, or the right side of Figure 2a, or the left side of Figure 2b, or the right side of Figure 2b, or the left side of Figure 2c, or the right side of Figure 2c, or the left side of Figure 2d, or the right side of Figure 2d. Alternatively, the fluid handling system may comprise any combination of features from these figures at different locations along the periphery. The fluid handling system may include a fluid handling structure 12 as described in the variants below.

[0041]

[0044] Figure 2a shows the fluid handling structure 12 around the bottom surface of the final element 100. The final element 100 has an inverted truncated conical shape. The truncated conical shape has a flat bottom surface and a conical surface. The truncated conical shape protrudes from a plane and has a flat bottom surface. The flat bottom surface is the optically active part of the bottom surface of the final element 100 through which the radiation beam B can pass. The final element 100 may have a coating 30. The fluid handling structure 12 surrounds at least part of the truncated conical shape. The fluid handling structure 12 has an inner surface facing the conical surface of the truncated conical shape. The inner surface and the conical surface may have complementary shapes. The top surface of the fluid handling structure 12 may be substantially flat. The fluid handling structure 12 may fit around the truncated conical shape of the final element 100. The bottom surface of the fluid handling structure 12 may be substantially flat and, in use, may be parallel to the facing surface of the substrate support WT and / or substrate W. The bottom surface of the fluid handling structure 12 may therefore be referred to as the surface facing the surface of the substrate W. The distance between the bottom surface and the facing surface may be in the range 30 to 500 microns, desirably in the range 80 to 200 microns.

[0042]

[0045] The fluid handling structure 12 extends closer to the facing surfaces of the substrate W and substrate support WT than the final element 100. An immersion space 11 is therefore defined between an inner surface of the fluid handling structure 12 and the plane and facing surface of the frustum conical portion. During use, the immersion space 11 is filled with immersion liquid. The immersion liquid fills at least part of the buffer space between complementary surfaces between the final element 100 and the fluid handling structure 12, and in an embodiment at least part of the space between the complementary inner surface and the conical surface.

[0043]

[0046] Immersion liquid is supplied to the immersion space 11 through openings formed in a surface of the fluid handling structure 12. The immersion liquid may be supplied through supply openings 20 in an inner surface of the fluid handling structure 12. Alternatively or additionally, immersion liquid is supplied from a lower supply opening 23 formed in a bottom surface of the fluid handling structure 12. The lower supply opening 23 may surround the path of the radiation beam B and may be formed by a series of openings in an array or a single slit. The immersion liquid is supplied to fill the immersion space 11 below the projection system PS such that the flow through the immersion space 11 is laminar, or at least well-defined. Additionally, the supply of immersion liquid from the lower supply opening 23 prevents the ingress of bubbles into the immersion space 11. This supply of immersion liquid may act as a liquid seal.

[0044]

[0047] Immersion liquid may be recovered from recovery openings 21 formed in the inner surface. Recovery of immersion liquid through the recovery openings 21 may be due to the application of negative pressure, recovery through the recovery openings 21 as a result of the velocity of immersion liquid flow through the immersion space 11, or recovery may be a result of both. The recovery openings 21 may be located opposite the supply openings 20 in plan view. Additionally or alternatively, immersion liquid may be recovered through an overflow recovery section 24 located on the top surface of the fluid handling structure 12. The supply openings 20 and recovery openings 21 may exchange their functions (i.e. reverse the flow direction of liquid). This allows the flow direction to be changed depending on the relative movement of the fluid handling structure 12 and the substrate W.

[0045]

[0048] Additionally or alternatively, immersion liquid may be recovered from below the fluid handling structure 12 through recovery openings 25 formed in its bottom surface. The recovery openings 25 may serve to hold a meniscus 33 of immersion liquid against the fluid handling structure 12. The meniscus 33 forms between the fluid handling structure 12 and the facing surface and acts as a boundary between the liquid space and the gaseous external environment. The recovery openings 25 may be a porous plate that may recover immersion liquid in a single-phase flow. The recovery openings in the bottom surface may be a series of pinned openings 32 through which immersion liquid recovery takes place. The pinned openings 32 may recover immersion liquid in a two-phase flow.

[0046]

[0049] Optionally, radially outwardly relative to the inner surface of the fluid handling structure 12 is a gas knife opening 26. Gas may be supplied at high velocity through the gas knife opening 26 to assist liquid confinement of the immersion liquid in the immersion space 11. The supplied gas may be humidified and may comprise substantially carbon dioxide. Radially outwardly of the gas knife opening 26 is a gas recovery opening 28 for recovering gas supplied through the gas knife opening 26.

[0047]

[0050] Further openings, for example open to atmosphere or a gas source or vacuum, may be present on the bottom side of the fluid handling structure 12, i.e. the surface of the fluid handling structure 12 facing the substrate W. An example of such an optional further opening 50 is shown by the dashed line on the right side of Figure 2a. As shown, the further openings 50 may be supply or extractor members, indicated by double arrows. For example, when configured as a supply, the further openings 50 may be connected to a liquid supply or a gas supply in the same way as any of the supply members. Alternatively, when configured as an extractor, the further openings 50 may be used to extract fluid and may be connected to atmosphere or a gas source or vacuum, for example. For example, at least one further opening 50 may be present between the gas knife opening 26 and the gas recovery opening 28, and / or between the pinning opening 32 and the gas knife opening 26. In an alternative configuration, the fluid handling structure 12 may include the pinning opening 32, the gas knife opening 26 and optionally a lower supply opening 23. The supply openings 20 or collection openings 21 may be formed in an internal surface of the fluid handling structure 12 .

[0048]

[0051] Two different versions of the fluid handling structure 12 on the left and right sides of Figure 2a pin the meniscus 33. The version of the fluid handling structure 12 on the right side of Figure 2a may pin the meniscus 33 in a substantially fixed position relative to the final element 100 by fixed positions of the pinning openings 32. The version of the fluid handling structure 12 on the left side of Figure 2a may pin the meniscus 33 below the recovery opening 25, so that the meniscus 33 may move along the length and / or width of the recovery opening 25. The substrate support WT, which supports the substrate W, is moved relative to the projection system PS so that the radiation beam B is directed onto the entire surface of the substrate W during exposure. To maximise the yield of substrates W exposed by the lithographic apparatus, the substrate support WT (and therefore the substrate W) is moved as fast as possible. However, there is a critical relative speed (often referred to as the critical scan speed) above which the meniscus 33 between the fluid handling structure 12 and the substrate W becomes unstable. An unstable meniscus 33 increases the risk of losing immersion liquid, for example in the form of one or more droplets. Furthermore, an unstable meniscus 33 increases the risk of introducing gas bubbles into the immersion liquid, particularly as the trapped immersion liquid crosses the edge of the substrate W.

[0049]

[0052] Liquid droplets present on the surface of the substrate W can impose a thermal load that can result in defects. They can evaporate leaving behind drying spots, they can move while carrying contaminants such as particles, they can collide with larger bodies of immersion liquid and introduce gas bubbles into the larger bodies, and they can evaporate while imposing a thermal load on the surface on which they are located. Such thermal loads can cause distortions and / or positioning errors when related to the positioning of components of the lithographic apparatus relative to the substrate W whose surface is being imaged. Therefore, the formation of liquid droplets on the surface is undesirable. Therefore, to prevent the formation of such droplets, the speed of the substrate support WT is limited to a critical scan speed at which the meniscus 33 remains stable. This limits the throughput of the lithographic apparatus.

[0050]

[0053] The left-hand side of the fluid handling system in Figure 2a may include a spring 60. The spring 60 may be an adjustable passive spring configured to apply a biasing force to the fluid handling structure 12 in the direction of the substrate W. The spring 60 may therefore be used to control the height of the fluid handling structure 12 above the substrate W. Such adjustable passive springs are described in U.S. Patent No. 7,199,874, which is incorporated herein by reference in its entirety. Other biasing devices, for example using electromagnetic forces, may also be suitable. Although the spring 60 is shown on the left-hand side of Figure 2a, this is optional and does not need to be included in other features of the left-hand side of Figure 2a. The spring 60 is not shown in any of the other figures, but could also be included in other variations of the fluid handling system described in relation to Figure 2a, Figure 2b, Figure 2c or Figure 2d.

[0051]

[0054] Figure 2b shows two different versions of the fluid handling structure 12 on both the left and right sides, which allow movement of the meniscus 33 relative to the final element 100. The meniscus 33 may move in the direction of the moving substrate W. This movement reduces the relative speed between the meniscus 33 and the moving substrate W, which may improve stability and reduce the risk of rupture of the meniscus 33. The speed of the substrate W at which the meniscus 33 ruptures is increased to allow faster movement of the substrate W below the projection system PS, and therefore increased throughput.

[0052]

[0055] Features shown in Figure 2b that are common to Figure 2a share the same reference numerals. The fluid handling structure 12 has an inner surface that is complementary to the conical surface of the frusto-conical shape. The bottom surface of the fluid handling structure 12 is closer to the facing surface than the bottom plane of the frusto-conical shape.

[0053]

[0056] Immersion liquid is supplied to the immersion space 11 through supply openings 34 formed in the inner surface of the fluid handling structure 12. The supply openings 34 are located towards the bottom of the inner surface, possibly below the base of the frusto-conical shape. The supply openings 34 are located around the periphery of the inner surface, spaced around the path of the radiation beam B.

[0054]

[0057] Immersion liquid is recovered from the immersion space 11 through recovery openings 25 in the bottom surface of the fluid handling structure 12. As the facing surface moves beneath the fluid handling structure 12, a meniscus 33 may move over the surface of the recovery openings 25 in the same direction as the movement of the facing surface. The recovery openings 25 may be formed of a porous member. The immersion liquid may be recovered in a single phase. The immersion liquid may be recovered in a two-phase flow. The two-phase flow is received in a chamber 35 in the fluid handling structure 12 and separated into liquid and gas within the chamber 35. The liquid and gas are recovered from the chamber 35 through separate channels 36, 38.

[0055]

[0058] An inner circumferential surface 39 of the bottom of the fluid handling structure 12 extends into the immersion space 11 away from the inner surface to form a plate 40. The inner circumferential surface 39 forms a small aperture that may be sized to match the shape and size of the radiation beam B. The plate 40 may serve to separate the immersion liquid on either side of it. Dispensed immersion liquid flows inward towards the aperture, through the inner aperture and then radially outwards beneath the plate 40 towards the peripheral recovery openings 25.

[0056]

[0059] The fluid handling structure 12 may be divided into two parts, an inner part 12a and an outer part 12b, as shown on the right hand side of Figure 2b. The inner part 12a and the outer part 12b may move relative to each other mainly in a plane parallel to their facing surfaces. The inner part 12a may have a supply opening 34 and may have an overflow collection part 24. The outer part 12b may have a plate 40 and a collection opening 25. The inner part 12a may have an intermediate collection part 42 for collecting immersion liquid flowing between the inner part 12a and the outer part 12b.

[0057]

[0060] The two different versions of the fluid handling structure in Figure 2b therefore allow movement of the meniscus 33 in the same direction as the substrate W, which may increase scanning speeds and improve throughput of the lithographic apparatus. However, the movement speed of the meniscus 33 over the surface of the recovery openings 25 of the fluid handling structure 12 on the left side of Figure 2b may be slow. The fluid handling structure 12 on the right side of Figure 2b allows for faster movement of the meniscus 33 by moving the outer part 12b relative to the inner part 12a and the final element 100. However, it may be difficult to control the intermediate recovery part 42 to ensure that enough immersion liquid is provided between the inner part 12a and the outer part 12b to prevent contact between the inner part 12a and the outer part 12b. Implementations may also include a liquid supply provided to the moving outer part 12b.

[0058]

[0061] Figure 2c shows two different versions of the left and right sides of the fluid handling structure 12 that may be used to pin the meniscus 33 of the immersion liquid to the fluid handling structure 12 as described above in relation to Figures 2a and / or 2b. Features shown in Figure 2c that are common to Figures 2a and / or 2b share the same reference numbers.

[0059]

[0062] The fluid handling structure 12 has an inner surface complementary to the conical surface of the frusto-conical shape. A bottom surface of the fluid handling structure 12 is closer to the facing surface than a bottom plane of the frusto-conical shape. Immersion liquid is supplied to the immersion space 11 through openings formed in the surface of the fluid handling structure 12. The immersion liquid may be supplied through supply openings 34 in the inner surface of the fluid structure 12. Alternatively or additionally, the immersion liquid may be supplied through supply openings 20 in the inner surface of the fluid structure 12. Alternatively or additionally, the immersion liquid may be supplied through lower supply openings 23. The immersion liquid may be recovered via an extraction member, for example via recovery openings 21 and / or overflow recovery 24 formed in the inner surface and / or via one or more openings in the surface of the fluid handling structure 12 as described below.

[0060]

[0063] Two different versions of the fluid handling structure 12, on the left and right sides of Figure 2c, pin the meniscus 33. The version of the fluid handling structure 12 on the right side of Figure 2c may pin the meniscus 33 in a position that is substantially fixed relative to the final element 100, due to the fixed positions of the recovery openings 32a. The version of the fluid handling structure 12 on the left side of Figure 2c may pin the meniscus 33 below the recovery openings 25, so that the meniscus 33 may move along the length and / or width of the recovery openings 25.

[0061]

[0064] 2c。 As explained above in relation to Figure 2b, the inner circumferential surface of the bottom of the fluid handling structure 12 may extend into the immersion space 11, away from the inner surface, to form a plate 40 as shown on the left. As explained above, this may form a small aperture, separating the immersion liquid on either side, and / or may cause the immersion liquid to flow inward towards the aperture, through the inner aperture and then radially outward beneath the plate 40 towards the peripheral collection openings 25. This feature is shown on the left side of Figure 2c, although it is optional to combine it with the other features shown. Preferably, as shown on the left side, immersion liquid is supplied to the immersion space 11 through supply openings 34 formed in the inner surface of the fluid handling structure 12. The supply openings 34 are located towards the bottom of the inner surface, possibly below the bottom of the frusto-conical shape. The supply openings 34 are located around the periphery of the inner surface, spaced around the path of the radiation beam B. Alternatively or additionally, immersion liquid may be supplied through supply openings 20 in the inner surface of the fluid structure 12. Alternatively or additionally, immersion liquid is supplied through lower supply opening 23. Supply opening 34 is the preferred liquid supply, but any combination of supply opening 34, supply opening 20 and / or lower supply opening 23 may be provided.

[0062]

[0065] As shown on the left-hand side of Figure 2c, the fluid handling system may include a fluid handling structure 12 as described above and a further device 3000. The fluid handling structure 12 may have an extraction member, such as a recovery opening 25, and a liquid supply opening, such as a lower supply opening 23. It will be appreciated that the fluid handling structure 12 may include any arrangement as disclosed in relation to the left-hand side of Figure 2a, the right-hand side of Figure 2a, the left-hand side of Figure 2b, the right-hand side of Figure 2b or the right-hand side of Figure 2c (described below) in combination with the further device 3000.

[0063]

[0066] The further device 3000 may alternatively be referred to as a droplet catcher. The further device 3000 is provided to reduce the generation of liquid on the surface of the substrate W after the fluid handling structure 12 has moved over the surface. The further device 3000 may include a liquid supply member 3010 and at least one extraction member 3020. The at least one extraction member 3020 may be formed in a shape that surrounds the at least one supply member 3010 in plan view. The at least one liquid supply member 3010 may be configured to provide further liquid to a space 3110 between at least part of the further device 3000 and the surface of the substrate W. The further device 3000 may be configured to recover at least part of the liquid via the at least one extraction member 3020. The further device 3000 may be used to combine liquid left on the surface of the substrate W with the liquid in the space 3110 and then extract the liquid such that the amount of liquid remaining on the surface of the substrate W is reduced.

[0064]

[0067] The further device 3000 is shown in Figure 2c as a separate device from the fluid handling structure 12. The further device 3000 may be positioned adjacent to the fluid handling structure 12. Alternatively, the further device 3000 may be part of, i.e. integral with, the fluid handling structure 12 (however, either configuration can be chosen, as in Figure 2d).

[0065]

[0068] The further device 3000 may be configured to provide a liquid to the space 3110 other than the liquid provided by the fluid handling structure 12 .

[0066]

[0069] Additionally or alternatively, the fluid handling structure 12 may have components as shown on the right-hand side of Figure 2c. More particularly, the fluid handling structure 12 may include at least one liquid supply member, two extraction members (e.g., recovery openings 32a and 32b) and two gas supply members (e.g., gas supply openings 27a and 27b) formed on a surface of the fluid handling structure 12. The gas supply opening 27 may be omitted, i.e. is optional. The at least one liquid supply member may be the same as the lower supply opening 23 in the bottom surface of the fluid handling structure 12 described above, or the supply openings 20 or liquid supply openings 34 formed on an internal surface of the fluid handling structure 12 described in relation to the left-hand side of Figure 2b. The liquid supply members, extraction members and gas supply members may be formed on a surface of the fluid handling structure 12. In particular, these components may be formed on the surface of the fluid handling structure 12 facing the substrate W, i.e., the bottom surface of the fluid handling structure 12.

[0067]

[0070] At least one of the two extraction members may include a porous material 37 therein. The porous material 37 may be provided in an opening, for example a recovery opening 32a through which the fluid handling structure 12 extracts fluid from below the fluid handling structure 12, and may recover immersion liquid in a single phase flow. The other of the two extraction members, for example recovery opening 32b, may recover immersion fluid as a two-phase extractor. The porous material 37 does not have to be flush with the bottom surface of the fluid handling structure 12.

[0068]

[0071] In particular, the fluid handling structure 12 may include a liquid supply member (e.g. lower supply opening 23), a first extraction member radially outward of the liquid supply member (e.g. recovery opening 32a), a first gas supply member radially outward of the first extraction member (e.g. gas supply opening 27a), a second extraction member radially outward of the first gas supply member (e.g. recovery opening 32b), and a second gas supply member radially outward of the second extraction member (e.g. gas supply opening 27b). Similar to Figure 2a, further openings, for example open to atmosphere or a gas source or vacuum, may be present in a bottom surface of the fluid handling structure 12, as already described (in relation to the fluid handling structure 12).

[0069]

[0072] For example, at least one further opening (not shown) may be provided in the bottom surface of the fluid handling structure 12. The further opening is optional. The further opening may be located between the first extraction member (e.g., recovery opening 32a) and the first gas supply member (e.g., gas supply opening 27a) as described in the configurations above. Alternatively or additionally, the further opening may be located between the second extraction member (e.g., recovery opening 32b) and the second gas supply member (e.g., gas supply opening 27b) as described in the configurations above. The further opening may be the same as the further opening 50 described above.

[0070]

[0073] Optionally, the fluid handling structure 12 includes a recess 29. The recess 29 may be provided between the collection openings 32a and 32b or between the gas supply openings 27a and 32b. The shape of the recess 29 may be uniform around the periphery of the fluid handling structure 12 or may optionally include a slope. In the case of a recess 29 provided between the collection openings 32a and 32b, the gas supply openings 27b may be provided in a slope, as shown in Figure 2c. In the case of a recess 29 provided between the supply openings 27a and 32b, the gas supply openings 27b may be provided in a slope, or in a part of the bottom surface of the fluid handling structure 12 that is parallel to the surface of the substrate W. Alternatively, the shape of the recess 29 may vary around the periphery of the fluid handling structure 12. The shape of the recess 29 may be varied to vary the effect of gas supplied from the gas supply member on the fluid below the fluid handling structure 12. Alternatively, the recess 29 may be a negative recess, ie a protruding structure, which reduces the spacing between the fluid handling structure 12 and the substrate W.

[0071]

[0074] Figure 2d shows, in its left and right halves, two different versions of the fluid handling structure 12. The fluid handling structure 12 in the left half of Figure 2d has a liquid injection buffer 41a that holds a buffer volume of immersion liquid, and liquid injection holes 41 that supply immersion liquid from the liquid injection buffer to the space 11. Outside the liquid injection holes 41 are inner liquid recovery apertures 43 for directing liquid to an inner recovery buffer 43a that comprises a porous member. Recesses 29 similar to those described in relation to Figure 2c are provided outside the inner liquid recovery apertures 43. Outside the recesses 29 on the underside of the fluid handling structure 12, there are gas guide grooves 44 into which outer recovery holes 44a open. The outer recovery holes 44a direct a two-phase recovery flow to an outer recovery buffer 44b that also comprises a porous member. At the outermost end, there are gas filled holes 45 that communicate between a gas filled buffer volume 45a and the space below the fluid handling structure 12 for providing a gas flow to contain the immersion liquid. In the above implementations, the meniscus 33 may be pinned to the collection opening 32a or may be movable.

[0072]

[0075] The fluid handling structure 12 in the right half of Figure 2d has a liquid supply opening 20 in its inner sloping surface. On the underside of the fluid handling structure 12 (from the inside to the outside) are an extraction opening 25 with a porous member 37, a first gas knife opening 26a, a second gas knife opening 26b and a third gas knife opening 26c. Each of these openings opens into a groove on the underside of the fluid handling structure 12 which provides a buffer volume. The outermost part of the fluid handling structure 12 is stepped to provide a larger spacing between the fluid handling structure 12 and the substrate W.

[0073]

[0076] 2a-2d show examples of different configurations that can be used as part of a fluid handling system. While the examples presented above refer to specific extraction and recovery elements, it will be understood that the exact same type of extraction and / or recovery element need not be used. In some cases, different terminology is used to describe the element's location, but the same functional features may be provided. Examples of extraction elements mentioned above include recovery opening 21, overflow recovery section 24, recovery opening 25 (optionally including porous plate and / or chamber 35), gas recovery opening 28, nailing opening 32, recovery opening 32a, recovery opening 32b, and / or intermediate recovery section 42. Examples of supply elements mentioned above include supply opening 20, lower supply opening 23, gas knife opening 26, gas supply opening 27a, gas supply opening 27b, and / or supply opening 34. In general, extraction elements used to extract / recover fluids, liquids, or gases are interchangeable with other uses for extracting / recovering fluids, liquids, or gases, respectively. Similarly, supply members used to supply a fluid, liquid or gas may be interchangeable with other uses for supplying a fluid, liquid or gas, respectively. An extraction member may extract / recover a fluid, liquid or gas from a space by being connected to a negative pressure which draws the fluid, liquid or gas into the extraction member. A supply member may supply a fluid, liquid or gas to a space by being connected to an associated supply.

[0074]

[0077] As explained above, immersion liquid may be extracted from the immersion space 11, also referred to herein as the liquid confinement space 11, by an extraction member. As shown in Figures 2a, 2c and 2d, the extraction member may be a recovery opening 21. The extraction member may be located opposite the supply opening 20 in plan view. The extraction member may extract both liquid and gas. The supply opening 20 may supply liquid. Both the extraction member and the supply opening 20 may be provided on an inner surface, i.e. a wall, facing the conical surface of the frusto-conical shape of the final element 100. A continuous flow of water may therefore occur through the liquid confinement space 11 around the final element 100.

[0075]

[0078] As explained above, the fluid handling system may comprise a fluid handling structure 12 and / or a further device 3000. A fluid handling system generally comprises at least one bottom surface that is substantially planar and, in use, may be parallel to a facing surface of the substrate support WT and / or substrate W. The at least one bottom surface of the fluid handling system may therefore be referred to as the substrate-facing surface 200 of the fluid handling system. The substrate-facing substrate 200 may be a surface of the fluid handling structure 12. The substrate-facing substrate 200 may be a surface of the further device 3000. The substrate-facing substrate 200 may be any other surface of the fluid handling system that faces the substrate W. Furthermore, the substrate-facing surface 200 may be a combination of surfaces of the fluid handling system that face the substrate. For example, the substrate-facing surface 200 may include one or more surfaces of the fluid handling structure 12 and one or more surfaces of the further device 3000.

[0076]

[0079] As shown in the configurations of FIGS. 2a-2d, the substrate-facing surface 200 may be provided with one or more openings. The one or more openings may include, but are not limited to, a fluid supply member and / or a fluid extraction member. Examples of fluid extraction members include, but are not limited to, recovery opening 25, gas recovery opening 28, nailing opening 32, recovery opening 32a, recovery opening 32b, extraction member 3020, liquid recovery aperture 43, and / or outer recovery hole 44a. A fluid extraction member may also be any other opening used to extract / recover fluid, liquid, and / or gas. Examples of fluid supply members include lower supply opening 23, gas knife opening 26, gas supply opening 27a, gas supply opening 27b, liquid supply member 3010, and / or liquid injection hole 41b. A fluid supply member may also be any other opening used to supply fluid, liquid, and / or gas. The one or more openings in the substrate-facing surface 200 may alternatively or additionally include further openings 50 and / or other openings such as gas-filled holes 45. The one or more openings in the substrate-facing surface 200 may include openings for single-phase or two-phase flow of a fluid.

[0077]

[0080] The one or more openings in the substrate facing surface 200 may serve to provide immersion fluid to, remove immersion fluid from, and / or maintain immersion fluid within the immersion space 11. The ability of the one or more openings to fulfill or achieve one or more of these purposes may be adversely affected by manufacturing defects, blockages, contamination, and / or other imperfections in the openings. For example, blockage of an immersion fluid supply member may reduce the inflow rate of immersion liquid into the immersion space 11, which may result in a shortage of immersion fluid within the immersion space 11. As another example, blockage of an immersion fluid extraction member may reduce the extraction capability of the immersion fluid extraction member, which may result in an overflow of immersion fluid within the immersion space 11. As yet another example, blockage of a gas knife opening 26 may reduce the pressure in a gas seal used to retain immersion fluid within the immersion space 11, which may cause immersion fluid to leak from the immersion space 11.

[0078]

[0081] Therefore, defects in one or more openings in the substrate facing surface 200 may adversely affect the performance of the fluid handling system, which in turn may adversely affect the performance of the lithographic apparatus.

[0079]

[0082] As mentioned above, a fluid handling system may comprise a fluid handling structure 12 having openings in its substrate-facing surface. The fluid handling structure 12 is sometimes referred to as an immersion hood (IH). When the fluid handling structure 12 suffers from a defect, such as blockage of one or more openings in its substrate-facing surface, the fluid handling structure 12 needs to be taken out of operation. It is known that the fluid handling structure 12 is then returned to its supplier. The supplier of the fluid handling structure 12 may perform a complete repair and requalification of the fluid handling structure 12 before returning it to its location of use. This is a highly inefficient and time-consuming process, particularly since the supplier may be located on the other side of the world from the location of use of the fluid handling structure 12. Furthermore, most fluid handling structures 12 that are taken out of operation simply require cleaning and / or minor repairs.

[0080]

[0083] Embodiments improve upon known technology by providing a stand-alone conditioning system for reconditioning a fluid handling structure close to its point of use. Embodiments of the conditioning system may perform several processes for cleaning and / or repairing the fluid handling structure.

[0081]

[0084] The conditioning system according to embodiments may be located in the same clean room as the lithographic apparatus. The conditioning system may be a stand-alone system operating independently of the lithographic apparatus. When a decision is made to recondition a fluid handling structure included in the lithographic apparatus, the fluid handling structure may be moved to the conditioning system where the reconditioning takes place. After being reconditioned, the fluid handling structure may be replaced in the lithographic apparatus. Alternatively, a different fluid handling structure that was stored in the conditioning system may be installed in the lithographic apparatus. This results in significantly less downtime for the lithographic apparatus than known techniques. Downtime may be minimized.

[0082]

[0085] FIG. 3 shows a schematic representation of a regulation system 301 according to a first embodiment.

[0083]

[0086] The conditioning system 301 of the first embodiment may comprise a container for containing the fluid handling structure 304. The fluid handling structure 304 may be the fluid handling structure 12 described in Figures 2a to 2d. The conditioning system 301 may comprise a conditioning device 307 for conditioning the fluid handling structure 304 held in the container. The conditioning system 301 may comprise an inspection system that may inspect at least part of the fluid handling structure 304. The inspection system may determine one or more different types of conditioning to perform on the fluid handling structure 304. The conditioning device 307 may then automatically perform a process for cleaning and / or repairing the fluid handling structure 304.

[0084]

[0087] The conditioning system 301 may comprise a fluid inlet manifold 302 for providing a flow of fluid to a fluid handling structure 304 held by the container. The provided fluid may be a liquid flow, such as a flow of ultrapure water. The conditioning system 301 may also comprise a fluid outlet manifold 303 for receiving the flow of fluid that has flowed through the fluid handling structure 304 held by the container. There may be a fluid recirculation system providing a flow path 309 for recirculating the fluid flow to the fluid handling structure 304. Within the flow path 309 there may be a filter 308 that may capture, i.e. collect, particles in the recirculated fluid. The particles may be analysed by the conditioning system 301 and / or provided to another apparatus for analysing the particles. Although not shown in Figure 3, the fluid recirculation system may also include pumps and other devices required for its operation.

[0085]

[0088] The conditioning system 301 may comprise a light emitter 305, which may be a laser light emitter, that may illuminate the fluid handling structure 304. The laser light emitter may emit scattered light. The conditioning system 301 may comprise a light receiver 306, which may be a laser light receiver, for detecting light.

[0086]

[0089] The adjustment system 301 according to an embodiment and the operation of the adjustment system 301 are described in more detail below.

[0087]

[0090] The fluid handling structure 304 may have a main surface which is the surface of the fluid handling structure 304 that faces the substrate W when the fluid handling structure 304 is used in a lithographic apparatus. The main surface of the fluid handling structure 304 may comprise openings for the supply and / or extraction of fluids and may be the part of the fluid handling structure 304 that most often requires cleaning and / or repair.

[0088]

[0091] The regulating device 307 may be arranged to underlie the fluid handling structure 304 which is housed by a vessel of the regulating system 301. The regulating device 307 may include a main surface which may be referred to as an active surface, facing a main surface of the fluid handling structure 304.

[0089]

[0092] The inspection system may be configured to inspect the fluid handling structure 304 before the conditioning device 307 performs a conditioning process on the fluid handling structure 304. The inspection system may comprise a processor for controlling the inspection process and for receiving, generating and transmitting data related to the inspection process. In particular, the inspection system may generate and / or receive inspection data based on the inspection of the fluid handling structure 304. The processor may automatically determine, based on the inspection data, one or more different types of conditioning process to perform on the fluid handling structure 304. The inspection system may automatically generate and send instructions to the conditioning device 307 for performing the determined one or more conditioning processes. For example, the instructions may relate to a particular type of cleaning to be performed on the entire major surface of the fluid handling structure 304, or to only a particular part of the major surface to repair.

[0090]

[0093] The inspection system may comprise one or more cameras for generating images and / or videos of all or part of at least a major surface of the fluid handling structure 304. The inspection system may analyse the images and / or videos to generate inspection data.

[0091]

[0094] The inspection system may control the light emitter 305 to illuminate a major surface of the fluid handling structure 304 and / or shine light through fluid flowed through the fluid handling structure 304. The inspection system may generate inspection data based on the light detected by the light receiver 306. For example, the inspection system may use the light detected by the light receiver 306 to inspect all or part of at least a major surface of the fluid handling structure 304. In particular, the light emitter 305, which may be a laser light emitter, may illuminate all or part of a major surface of the fluid handling structure 304 with scattered light. The inspection system may generate inspection data based on the pattern of light detected by the light receiver 306. The inspection data may include measured dimensions of features such as openings in the fluid handling structure 304. The measured dimensions may include one or more of the diameter, shape, and size of the openings. The inspection system may compare the measured dimensions to reference data, which may include historical data, to detect changes in the dimensions. For example, a drift in the diameter of an opening may be detected by comparison with historical data.

[0092]

[0095] The inspection system may comprise a particle analyser configured to generate inspection data based on analysis of the particles collected by the filter 308, which may detect the presence and type of contaminant particles originating from within the internal flowpaths of the fluid handling structure 304. The types of contaminant particles may include fibres, metals and organic particles. The type or types of adjustments that are determined to be made may therefore depend on the type of contaminant particles detected.

[0093]

[0096] The inspection system may be configured to inspect the fluid handling structure 304 while a conditioning process is being performed on the fluid handling structure 304 by the conditioning device 307. The inspection system may generate and display an indication of the progress of the conditioning process in real time. The inspection system may determine when the conditioning of the fluid handling structure 304 is complete and the fluid handling structure 304 is ready for use in the lithographic apparatus. The inspection system may generate and display a notification when the conditioning of the fluid handling structure 304 is complete. The determination of whether the conditioning of the fluid handling structure 304 is complete may be according to a scenario predefined by a user.

[0094]

[0097] The conditioning device 307 may be able to perform a number of different types of processes to readjust the fluid handling structure 304. Each conditioning process performed by the conditioning device 307 on the fluid handling structure 304 may be performed locally or globally, that is, each conditioning process may be performed on only one or more parts of a major surface of the fluid handling structure 304, or on the whole major surface of the fluid handling structure 304.

[0095]

[0098] The types of reconditioning processes that the conditioning device 307 may perform may include one or more of a repair process, a polishing process, a coating process, and a process of applying an additive to the fluid handling structure 304.

[0096]

[0099] The conditioning device 307 may comprise an abrasive pad for abrading away scratches on the major surface of the fluid handling structure.

[0097]

[0100] The adjusting device 307 may comprise a laser to cut, remove, reshape and / or mechanically modify parts of the fluid handling structure 304. The adjusting device 307 may use a laser to change the shape of some of the openings. The adjusting device 307 may use a laser or another device to unblock openings in the fluid handling structure 304.

[0098]

[0101] The conditioning device 307 may perform ion deposition to fill cracks in the major surface of the fluid handling structure 304. The conditioning device 307 may apply an additive to the major surface of the fluid handling structure 304. The additive may be a plastic or metallic material.

[0099]

[0102] The fluid handling structure 304 may be modular. A repair process performed by the regulation device 307 may involve replacing one or more modules of the fluid handling structure 304.

[0100]

[0103] The conditioning system 301 may comprise a mechanical device (not shown in Figure 3) arranged to impact the fluid handling structure 304. This may create shock waves in the fluid handling structure 304 that loosen stuck components of the fluid handling structure 304. This may facilitate the testing and conditioning process.

[0101]

[0104] Although not shown in Figure 3, the fluid recirculation system may include a fluid temperature control system that monitors the temperature of the fluid recirculated by the fluid recirculation system and may heat or cool the fluid as needed to maintain or change the desired temperature. The fluid temperature control system may be provided in the flow path 309.

[0102]

[0105] Although not shown in Figure 3, the fluid recirculation system may comprise a fluid flow control system. The fluid flow control system may control the flow rate of fluid in the fluid recirculation system. The fluid flow control system rapidly stops and starts the flow of fluid to generate pressure waves in the fluid. The pressure waves may detach parts of the fluid handling structure 304 that are stuck together, thereby facilitating the inspection and / or adjustment process of the fluid handling structure 304. The fluid flow control system may be provided in the flow path 309.

[0103]

[0106] The conditioning system 301 may further comprise a temperature control system for controlling the temperature of the fluid handling structure 304. The temperature of the fluid handling structure 304 may be changed and maintained at a temperature suitable for each testing and conditioning process.

[0104]

[0107] The conditioning system 301 may further comprise one or more storage sections (not shown in Figure 3) for storing the plurality of fluid handling structures 304. There may be a first storage section for storing the plurality of fluid handling structures 304 that require readjustment by the conditioning device 307. There may be a second storage section for storing the plurality of fluid handling structures 304 that have been readjusted by the conditioning device 307. The conditioning system 301 may automatically select a fluid handling structure 304 in the first storage section for readjustment, readjust the selected fluid handling structure 304 and then store the readjusted fluid handling structure 304 in the second storage section. The conditioning system 301 may determine the order in which the fluid handling structures 304 are to be readjusted and may then readjust the fluid handling structures 304 sequentially. Advantageously, the second storage section stocks one or more fluid handling structures 304 that are ready for use. When a fluid handling structure 304 of a lithographic apparatus requires readjustment, the fluid handling structure 304 may be quickly removed from the lithographic apparatus and replaced with another fluid handling structure 304 that is ready for use.

[0105]

[0108] As explained above, the conditioning system 301 may be located in the same clean room as the lithographic apparatus. The conditioning system 301 is a stand-alone system that operates independently of the lithographic apparatus.

[0106]

[0109] The conditioning system 301 may comprise a conveyor system (not shown in Figure 3) for automatically transferring a fluid handling structure 304 requiring readjustment from the lithographic apparatus to the conditioning system 301. The conveyor system may also automatically transfer a readjusted and ready-to-use fluid handling structure 304 from the conditioning system 301 to the lithographic apparatus. Alternatively, the fluid handling structure 304 may be transferred manually between the lithographic apparatus and the conditioning system 301.

[0107]

[0110] The fluid recirculation system of the conditioning system 301 may be provided and operate completely independently of the fluid flow system of the lithographic apparatus.

[0108]

[0111] To provide and control the inspection system and adjustment device 307, the adjustment system 301 may include a computer, a server, a mainframe host, a terminal, a personal computer, any type of mobile computing device, etc., or a combination thereof.

[0109]

[0112] A non-transitory computer-readable medium may be provided that stores instructions for the processor of the controller of the inspection system and conditioning device 307. Common forms of non-transitory medium include, for example, a floppy disk, flexible disk, hard disk, solid-state drive (SSD), magnetic tape or other magnetic data storage medium, compact disk read-only memory (CD-ROM), other optical data storage medium, any physical medium with a pattern of holes, random access memory (RAM), programmable read-only memory (PROM), and erasable programmable read-only memory (EPROM), FLASH-EPROM or other flash memory, non-volatile random access memory (NVRAM), cache, registers, other memory chips or cartridges, and networked versions thereof.

[0110]

[0113] Rouging is a type of corrosion layer that can form on the internal and external surfaces of the fluid handling structure 12 that come into contact with water. Rouging increases the risk of particle generation in the immersion fluid and also leads to a poor appearance of the fluid handling structure 12. The fluid handling structure 12 is currently discarded if rouging occurs.

[0111]

[0114] According to a second embodiment, there is provided a conditioning system for performing rouge de-rouge on a fluid handling structure. Rouge de-rouge is a process of removing the effects of rouge formation so as to return the fluid handling structure 12 to a state substantially as if the rouge formation had not occurred. The fluid handling structure is de-rougeed by flowing an acid over the surface on which the rouge has formed. The fluid handling structure after rouge de-rouge may then be reused in a lithographic apparatus.

[0112]

[0115] Figure 4 shows schematically a conditioning system 401 according to a second embodiment. The conditioning system 401 of the second embodiment may comprise both a fluid supply system 402 and a rouge removal system 403. The fluid supply system 402 generates various fluid flows which are supplied to the rouge removal system 403. The rouge removal system 403 is configured to receive a fluid handling structure 418 having a rouge-formed surface and to perform rouge removal on the rouge-formed surface of the fluid handling structure 418 using fluids received from the fluid supply system 402. The fluid handling structure 418 may be the fluid handling structure 12 described in Figures 2a to 2d.

[0113]

[0116] Fluid supply system 402 includes an acid supply 406, a diluent supply 407, an ultrapure water (UPW) supply 404, an extra clean dry air (XCDA) supply 405, an acid supply pump 412, a heater 411, a diluent supply regulator 413, a pH meter 414, a UPW supply valve 408, an XCDA supply valve 409, an acid supply valve 410, and a fluid supply 415. Although not shown in Figure 4, there may be a control system for automatically controlling the operation of at least the diluent supply regulator 413, the UPW supply valve 408, the XCDA supply valve 409, and the acid supply valve 410.

[0114]

[0117] Fluid supply 415 is the fluid output of fluid supply system 402. Fluid supply system 402 is controllable so that the fluid output through fluid supply 415 is acid, UPW, XCDA, or there is no fluid output through fluid supply 415.

[0115]

[0118] Acid is output from acid supply 406 to provide acid to fluid supply 415. pH meter 414 may measure the pH of the acid. If the pH of the acid needs to be changed, diluent supply regulator 413 may be automatically controlled so that the acid is mixed in the appropriate ratio with a diluent, such as water, from diluent supply 407. Acid supply pump 412 may pressurize the acid, and heater 411 may heat the acid to a temperature appropriate for rouge removal. Acid supply valve 410 may be automatically controlled so that the acid flows into fluid supply 415 at an appropriate rate. UPW supply valve 408 and XCDA supply valve 409 may be closed so that only acid is supplied to fluid supply 415.

[0116]

[0119] To provide UPW to fluid supply 415, UPW supply valve 408 is controlled to allow UPW to flow at an appropriate rate from UPW supply 404 to fluid supply 415. Acid supply valve 410 and XCDA supply valve 409 may be closed so that only UPW is supplied to fluid supply 415.

[0117]

[0120] To provide XCDA to fluid supply 415, XCDA supply valve 409 is controlled to flow XCDA from XCDA supply 405 to fluid supply 415 at an appropriate rate. Acid supply valve 410 and UPW supply valve 408 may be closed so that only XCDA is supplied to fluid supply 415.

[0118]

[0121] When UPW supply valve 408, XCDA supply valve 409, and acid supply valve 410 are all closed, no fluid is supplied to fluid supply 415.

[0119]

[0122] The rouge removal system 403 comprises a rouge removal table 419, a liquid bath 420, an agitation fan 417, one or more o-rings 416, a cover 424, a suction line 421, a drain pump 422, and a drain 423. The rouge removal system 403 is arranged to receive a fluid handling structure 418 on which rouge has formed, i.e., a fluid handling structure 418 having a surface on which rouge has formed. The rouge removal system 403 is arranged to receive fluid from a fluid supply 415 of the fluid supply system 402. Although not shown in FIG. 4 , there may also be a control system for automatically controlling the operation of the rouge removal system 403. The same control system may automatically control the operation of both the fluid supply system 402 and the rouge removal system 403.

[0120]

[0123] The fluid handling structure 418 on which the rouge has formed may be positioned on one or more o-rings 416 on the top surface of the rouge removal table 419. The liquid bath 420 is an area into which an acid or other fluid may be supplied and which is at least partially bounded by part of the outer surface of the fluid handling structure 418, the top surface of the rouge removal table 419, and the one or more o-rings 416. The acid or other fluid may flow into a channel between the bottom surface of the fluid handling structure 418 and the top surface of the rouge removal table 419. Both ends of the channel may be bounded by one or more o-rings 416. A cover 424 may be positioned over the main opening through the fluid handling structure 418 to close the area into which the acid or other fluid may flow. The cover 424 may prevent the acid from flowing onto some surfaces of the fluid handling structure 418 that should be protected from the acid. Some surfaces of the fluid handling structure 418 that would be damaged if they came into contact with the acid may comprise adhesives and / or other materials. The cover 424 prevents the acid from reaching and damaging such surfaces of the fluid handling structure 418. The agitation fan 417 may be positioned to generate turbulence when liquid is present in the liquid bath 420. Although not shown in FIG. 4 , the rouge removal table 419 may be mounted on a dynamic platform. The dynamic platform may be capable of bidirectional rotation about all three orthogonal axes, such as the x-axis, y-axis, and z-axis. The rotation may be only partial rotation about each axis rather than full rotation. The dynamic platform may be used to vibrate the fluid handling structure 418 to increase the turbulence of the fluid flow. The turbulence of the fluid flow may increase the extent to which the fluid reaches all of the rouge-formed surfaces of the fluid handling structure 418, the detachment of particles by the fluid, and the mixing of the fluid. The turbulence may also prevent released particles from settling back into the fluid handling structure 418. The acid and other fluids may flow out of the liquid bath 420 through the suction line 421. Fluid may be extracted into suction line 421 by drain pump 422. Fluid in suction line 421 may flow to drain 423.

[0121]

[0124] The conditioning system 401 of the second embodiment may automatically perform the rouge removal process of the fluid handling structure 418. The conditioning system 401 may operate as follows.

[0122]

[0125] The fluid handling structure 418 on which the rouge has formed may be located within the rouge removal system 403. The fluid supply system 402 may produce acid to supply to the rouge removal system 403. The acid from the acid supply 406 may be mixed with a diluent, such as water from a diluent supply 407, to achieve the appropriate pH. The acid may be pressurized to an appropriate pressure by an acid supply pump 412. The acid may be heated by a heater 411 to achieve the appropriate temperature for rouge removal. The acid may then be supplied to the rouge removal system 403 via a fluid supply 415.

[0123]

[0126] The rouge removal system 403 may receive acid from a fluid supply 415. The received acid may be supplied to some, preferably all, of the surfaces of the fluid handling structure 418 where rouge formation may occur. These are surfaces in contact with water. In particular, the acid may be supplied to conduits of the fluid handling structure 418 where rouge formation may occur. This includes all of the fluid supply conduits and fluid extraction conduits. The acid may flow through the conduits into a liquid bath 420. The acid may flow to some, preferably all, of the external surfaces of the fluid handling structure 418 where rouge formation may occur, such as damper surfaces, i.e., the underside or bottom surface of the fluid handling structure 418. The acid may be supplied so as to reach substantially all surfaces onto which the acid may flow. The agitation fan 417 and / or dynamic platform may operate to create turbulence in the flow of acid. The acid may flow continuously into the rouge removal system 403, through the fluid handling structure 418, and into a drain 423. Alternatively, the flow to drain 423 may be stopped temporarily so that the acid that has entered the fluid handling structure 418 is temporarily retained within the fluid handling structure 418. The time that the acid is allowed to contact each surface may be about 120 seconds or less, preferably less than 60 seconds. After the acid has been allowed to remain in contact with the accessible surfaces for the desired time, all of the acid may flow to drain 423.

[0124]

[0127] When acid is supplied to the rouge removal system 403, inlets and outlets of conduits in the fluid handling structure 418 that are not designed to support liquid flow in use, for example conduits that support only gas flow in use, may be sealed to prevent acid from entering. As there is no liquid flow in such conduits, rouge formation is not expected to occur.

[0125]

[0128] Fluid supply system 402 may then generate a flow of UPW that is supplied to rouge removal system 403 via fluid supply 415. The UPW may wash remaining acid from all surfaces that the acid contacted. Agitation fan 417 and / or dynamic platform may operate to create turbulence in the flow of UPW. The UPW may flow to drain 423.

[0126]

[0129] Fluid supply system 402 may then generate a flow of XCDA that is supplied to rouge removal system 403 via fluid supply 415. The XCDA may dry any remaining water from any surfaces that the water contacts. Agitation fan 417 and / or dynamic platform may operate to generate turbulence in the flow of XCDA. The XCDA may flow to drain 423.

[0127]

[0130] The fluid handling structure 418 may then be removed from the rouge removal system 403 and reused in the lithographic apparatus.

[0128]

[0131] Advantageously, the conditioning system 401 of the second embodiment may automatically perform a rouge removal process on a fluid handling structure 418 on which rouge has formed.

[0129]

[0132] In one implementation of the second embodiment, the pH of the acid may be varied throughout the acid supply process. In particular, a low pH acid may be used at the beginning of the acid supply process to achieve rapid rouge removal. The pH of the acid may then be increased to slow the rouge removal rate and improve rouge removal control. The pH value of the acid may be controlled by varying the mixing ratio of the acid from the acid supply 406 and the diluent from the diluent supply 407.

[0130]

[0133] In another implementation of the second embodiment, there may be more than one acid supply 406, and each acid supply 406 may contain a different acid. A control system may then select the acid to use for a particular purpose. For example, a first acid may be used to remove resist and a second acid may be used to remove rouge.

[0131]

[0134] In another implementation of the second embodiment, the pH value of the acid may be set based on a determination or measurement by a system (not shown) separate from the regulation system 401. This allows an operator of the regulation system 401 to manually set the pH value.

[0132]

[0135] In another implementation of the second embodiment, a detector or sensor (not shown) may measure the level of rouge formation and / or contamination on the surface of the fluid handling structure 418. The rouge removal process may be controlled based on the measured rouge formation and / or contamination. The detector may, for example, be a photodetector such as a camera.

[0133]

[0136] In another implementation of the second embodiment, a pH sensor or meter (not shown) may measure the pH of the acid in the fluid supply 415 and the acid in the suction line 421. The acid supply process may be controlled based on measurements by the pH sensor or meter. In particular, the rouge removal process may be continued until the pH of the acid in the suction line 421 is substantially the same as the pH of the acid in the fluid supply 415.

[0134]

[0137] In another implementation of the second embodiment, similar to the fluid recirculation system described in the first embodiment, the acid that passes through the rouge removal system 403 may be filtered and returned to the fluid supply system 402. The acid may then be re-fed to the rouge removal system 403.

[0135]

[0138] Any two or more implementations of the second embodiment above may be used in combination with each other.

[0136]

[0139] The adjustment system 401 of the second embodiment may be a stand-alone adjustment system separate from the adjustment system 301 of the first embodiment. Alternatively, the adjustment system 401 of the second embodiment may be integrated with the adjustment system 301 of the first embodiment.

[0137]

[0140] The embodiments include multiple modifications and variations to the above techniques.

[0138]

[0141] Although the second embodiment is described as a conditioning system 401 for providing rouge removal to a fluid handling structure 418, the second embodiment more generally includes a conditioning system 401 for providing rouge removal to a fluid handling system 418. The conditioning system 401 may also be used to provide rouge removal to other types of structures and systems in which rouge has formed.

[0139]

[0142] The embodiments may be used to recondition any of several known types of fluid handling structures of a fluid handling system, such as those shown in Figures 2a to 2d. The embodiments are not limited to reconditioning the arrangement of particular features of the fluid handling system or its substrate-facing surface. The embodiments may be used to recondition all or part of any fluid handling system.

[0140]

[0143] Although specific reference has been made to the use of embodiments of the present invention in the context of reconditioning a fluid handling system, embodiments of the present invention are not limited thereto. Embodiments include reconditioning any other component of a lithographic apparatus. Embodiments may also be used to recondition devices other than those included in a lithographic apparatus, such as components of a mask inspection apparatus, a metrology apparatus, or any apparatus that measures or processes objects such as wafers (or other substrates) or masks (or other patterning devices). These apparatus may be generally referred to as lithography tools. Such lithography tools may use ambient (non-vacuum) conditions.

[0141]

[0144] Although specific reference is made in this text to the use of an immersion lithography apparatus, it should be understood that embodiments of the present invention are not limited to this type of lithography apparatus, and include, for example, the reconditioning of devices included in extreme ultraviolet (EUV) lithography apparatus.

[0142]

[0145] Although specific reference may be made in this text to the use of lithographic apparatus in IC manufacture, it should be understood that the lithographic apparatus described herein may have other applications, including the manufacture of integrated optical systems, guidance and detection patterns for magnetic domain memories, flat panel displays, liquid crystal displays (LCDs), thin film magnetic heads, etc.

[0143]

[0146] Where the context allows, embodiments of the invention may be implemented in hardware, firmware, software, or any combination thereof. Embodiments of the invention may also be implemented by instructions stored on a machine-readable medium, which may be read and executed by one or more processors. A machine-readable medium may include any mechanism for storing or transmitting information in a form readable by a machine (e.g., a computing device). For example, machine-readable media may include read-only memory (ROM), random-access memory (RAM), magnetic storage media, optical storage media, flash memory devices, electrical, optical, acoustic, or other forms of propagated signals (e.g., carrier waves, infrared signals, digital signals, etc.), and others. Furthermore, firmware, software, routines, and instructions may be described herein as performing particular operations. However, it should be recognized that such description is for convenience only, and that such operations may in fact be caused by a computing device, processor, controller, or other device executing the firmware, software, routines, instructions, etc., and in doing so, may cause actuators or other devices to interact with the physical world.

[0144]

[0147] Although specific reference may be made in this text to embodiments of the invention in relation to lithography apparatus, embodiments of the invention may be used in other apparatus. Embodiments of the invention may form part of a mask inspection apparatus, a metrology apparatus, or any apparatus that measures or processes objects such as wafers (or other substrates) or masks (or other patterning devices). These apparatus may be generally referred to as lithography tools. Such lithography tools may use ambient (non-vacuum) conditions.

[0145]

[0148] Although specific reference has been made above to the use of embodiments of the present invention in connection with optical lithography, it will be appreciated that the present invention is not limited to optical lithography, where the context permits.

[0146]

[0149] Embodiments include the following numbered clauses: 1. A stand-alone conditioning system for a fluid handling structure of a lithographic apparatus, comprising: an inspection system configured to inspect the fluid handling structure and to determine one or more different types of adjustments to make to a major surface of the fluid handling structure; a conditioning device configured to perform the determined one or more different types of conditioning on a major surface of the fluid handling structure. 2. The adjustment system of clause 1, wherein the inspection system is configured to inspect the adjustment process and generate an indication of the progress of the adjustment process in real time. 3. A conditioning system according to clause 1 or 2, wherein the inspection system is configured to determine when conditioning of the fluid handling structure is complete and ready for use according to a user predefined scenario. 4. A conditioning system according to any one of clauses 1 to 3, wherein the inspection system is configured to generate a notification when conditioning of the fluid handling structure is completed. 5. A conditioning system according to any one of clauses 1 to 4, wherein a major surface of the fluid handling structure is a substrate-facing surface when the fluid handling structure is for use in a lithographic apparatus. 6. The adjustment device comprises a major surface; 6. A regulating system according to any one of clauses 1 to 5, wherein the regulating device is configured such that a main surface of the regulating device faces a main surface of the fluid handling structure when the fluid handling structure is housed by the regulating system. 7. A regulating system according to clause 6, wherein the regulating device is configured such that a major surface of the regulating device is below a major surface of the fluid handling structure when the fluid handling structure is housed by the regulating system. 8. The type of adjustment that the adjustment device is configured to make to the fluid handling structure is Repair process, Polishing process, coating process, a process for applying an additive to the fluid handling structure; A process for replacing modular components of a fluid handling structure; and Process for performing rouge removal on at least part of a fluid handling structure 8. The regulation system of any one of clauses 1 to 7, comprising one or more of: 9. Further comprising a fluid recirculation system; a fluid recirculation system configured to recirculate a flow of fluid to the fluid handling structure when the fluid handling structure is accommodated by the regulation system; An adjustment system described in any one of clauses 1 to 8, wherein the inspection system is configured to perform an analysis of the recirculated fluid and determine the type of one or more adjustments to be performed based on the analysis. 10. The fluid recirculation system includes a filter disposed in the fluid flow path for collecting contaminants in the fluid; 10. The conditioning system of clause 9, wherein the inspection system is configured to analyze the contaminants collected by the filter such that the type of one or more conditioning determined to be performed depends on the type of contaminant. 11. The conditioning system of clause 9 or 10, further comprising a fluid temperature control system configured to control the temperature of the fluid recirculated by the fluid recirculation system. 12. A regulation system as described in any one of clauses 9 to 11, further comprising a fluid flow control system configured to control the flow of fluid in the fluid recirculation system so that a pressure wave is generated in the fluid. 13. A regulation system according to any one of clauses 1 to 12, further comprising a temperature control system for controlling the temperature of the fluid handling structure. 14. A regulation system according to any one of clauses 1 to 13, further comprising a mechanical device arranged to generate shock waves in the fluid handling structure. 15. The inspection system further: an optical emitter configured to illuminate a major surface of the fluid handling structure and / or fluid flowed within the fluid handling structure; a light receiver configured to detect light from the illumination; 15. An adjustment system according to any one of clauses 1 to 14, wherein the inspection system is configured to determine the type of one or more adjustments to perform based on the received light. 16. The modulation system of any one of clauses 1 to 15, wherein the emitted light is configured to emit scattered light. 17. A conditioning system according to any one of clauses 1 to 16, wherein the inspection system is configured to measure dimensions of features of the fluid handling structure and compare the measured dimensions with reference data. 18. The adjustment system of clause 17, wherein the feature comprises an aperture and the measured dimension comprises one or more of the diameter, shape, and size of the aperture. 19. A regulation system according to any one of clauses 1 to 18, further comprising a storage section for storing a plurality of fluid handling structures. 20. A regulation system according to any one of clauses 1 to 19, wherein the regulation system is configured to automatically regulate a plurality of fluid handling structures in sequence. 21. The regulation system a fluid supply system; a rouge removal system; 21. A conditioning system according to any one of clauses 1 to 20, wherein the rouge removal system is configured to receive acid from the fluid supply system and to perform rouge removal with the received acid on at least a part of the fluid handling structure. 22. A regulation system and a fluid handling structure, wherein the regulation system is according to any one of clauses 1 to 21, A regulation system and a fluid handling structure, wherein the fluid handling structure is housed by the regulation system. 23. A lithography apparatus; and a conditioning system according to any one of clauses 1 to 21. 24. An arrangement according to clause 23, further comprising a conveyor system for automatically transporting the fluid handling structure from the lithographic apparatus to the conditioning system. 25. Further comprising a fluid handling structure; 26. An arrangement according to clause 24, wherein the fluid handling structure is housed by a conditioning system. 26. A method of readjusting a fluid handling structure of a lithographic apparatus, the method comprising: Removing the fluid handling structure from the lithographic apparatus; Providing a fluid handling structure for a stand-alone regulation system; Inspecting the fluid handling structure to determine one or more different types of adjustment to make to a major surface of the fluid handling structure; and The method comprises performing the determined one or more different types of adjustment to a major surface of the fluid handling structure. 27. The method according to clause 26, wherein the regulation system is as defined in any one of clauses 1 to 21. 28. The method according to clause 26 or 27, wherein the conditioning system and the lithographic apparatus are located in the same clean room.

[0147]

[0150] While specific embodiments of the present invention have been described above, it will be appreciated that the invention may be practiced otherwise than as described. The above description is intended to be illustrative and not limiting. Thus, it will be apparent to those skilled in the art that modifications may be made to the invention as described without departing from the scope of the claims set forth below.

Claims

1. 1. A stand-alone adjustment system for a fluid handling structure of a lithographic apparatus, comprising: an inspection system configured to inspect the fluid handling structure and to determine one or more different types of adjustments to make to a major surface of the fluid handling structure; a conditioning device configured to apply the determined one or more different types of conditioning to the main surface of the fluid handling structure.

2. 2. The conditioning system of claim 1, wherein the inspection system is configured to inspect the conditioning process and generate an indication of the progress of the conditioning process in real time, and / or the inspection system is configured to determine when the conditioning of the fluid handling structure is complete and ready for use according to a user predefined scenario, and / or the inspection system is configured to generate a notification when the conditioning of the fluid handling structure is complete, and / or the inspection system is configured to measure dimensions of features of the fluid handling structure and compare the measured dimensions with reference data, and / or the main surface of the fluid handling structure is a substrate facing surface when the fluid handling structure is for use in a lithographic apparatus.

3. The adjustment system of claim 2 , wherein the feature comprises an aperture, and the measured dimension comprises one or more of a diameter, a shape, and a size of the aperture.

4. the adjustment device comprises a major surface; the regulating device is configured such that the major surface of the regulating device faces the major surface of the fluid handling structure when the fluid handling structure is housed by the regulating system; and / or A regulation system according to any preceding claim, wherein the regulation system is configured to automatically regulate a plurality of fluid handling structures in sequence.

5. 5. The regulating system of claim 4, wherein the regulating device is configured such that the major surface of the regulating device is below the major surface of the fluid handling structure when the fluid handling structure is housed by the regulating system.

6. the type of adjustment that the adjustment device is configured to perform on the fluid handling structure Repair process, Polishing process, coating process, applying an additive to the fluid handling structure; a process for replacing a modular component of the fluid handling structure; and The conditioning system of claim 1 , comprising one or more processes for performing rouge removal on at least part of the fluid handling structure.

7. further comprising a fluid recirculation system; 7. The conditioning system of claim 1, wherein the fluid recirculation system is configured to recirculate a flow of fluid to the fluid handling structure when the fluid handling structure is accommodated by the conditioning system, and the inspection system is configured to perform an analysis of the recirculated fluid and to determine one or more types of conditioning to perform based on the analysis.

8. the fluid recirculation system including a filter disposed in the fluid flow path for collecting contaminants in the fluid; 8. The conditioning system of claim 7, wherein the inspection system is configured to analyse the contaminants collected by the filter, such that the type of the one or more adjustments determined to be made depends on the type of the contaminant, and / or further comprises a fluid temperature control system configured to control a temperature of the fluid recirculated by the fluid recirculation system, and / or further comprises a fluid flow control system configured to control a flow of the fluid in the fluid recirculation system so that pressure waves are generated in the fluid, and / or further comprises a temperature control system for controlling the temperature of the fluid handling structure, and / or further comprises a temperature control system for controlling the temperature of the fluid handling structure, and / or further comprises a temperature control system for controlling the temperature of the fluid handling structure, and / or further comprises a storage section for storing a plurality of fluid handling structures.

9. The inspection system further comprises: an optical emitter configured to illuminate the main surface of the fluid handling structure and / or fluid flowing within the fluid handling structure; 9. The adjustment system of claim 1, further comprising: an optical receiver configured to detect light from the illumination; and wherein the inspection system is configured to determine a type of one or more adjustments to perform based on the received light.

10. The adjustment system of claim 9 , wherein the emitted light is configured to emit scattered light.

11. The regulation system comprises: a fluid supply system; 11. The conditioning system of claim 1, comprising a rouge removal system configured to receive acid from the fluid supply system and to perform rouge removal on at least a part of the fluid handling structure with the received acid.

12. 1. A regulation system and a fluid handling structure comprising: The regulation system is according to any one of claims 1 to 11, A regulation system and a fluid handling structure, wherein the fluid handling structure is housed by the regulation system.

13. a lithography apparatus; 12. Arrangement in a clean room comprising a conditioning system according to any one of claims 1 to 11.

14. further comprising a conveyor system for automatically transferring a fluid handling structure from the lithographic apparatus to the conditioning system; and / or further comprising a fluid handling structure; The arrangement of claim 13 , wherein the fluid handling structure is housed by the regulation system.

15. 1. A method of reconditioning a fluid handling structure of a lithographic apparatus, said method comprising: Removing the fluid handling structure from the lithographic apparatus; providing the fluid handling structure in a stand-alone regulation system; inspecting the fluid handling structure to determine one or more different types of adjustment to make to a major surface of the fluid handling structure; and performing the determined one or more different types of adjustment to the major surface of the fluid handling structure.

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