Heat conducting structures, electronic devices, and terminals

Abstract

The present application provides a heat conduction structure, an electronic device, and a terminal. The heat conduction structure includes a heat conduction portion and an insulating ring. The upper and lower sides of the heat conduction portion are at least partially exposed, so that the heat conduction portion can contact a heat-generating component and a heat sink on both sides to conduct heat. The insulating ring can protect the heat conduction portion around the periphery. If the heat conduction structure is aged or damaged, the internal heat conduction portion is unlikely to fall off. Therefore, the heat conduction portion can be arranged as a heat conduction portion of a highly thermally conductive material, specifically, a heat conduction portion made of an electrically conductive material. In this way, the heat conduction ability of the heat conduction structure is enhanced and the risk of short circuits is reduced. When the heat conduction structure is particularly arranged, the insulating ring can be an enclosed ring or an opening can be provided in the insulating ring.

Description

[Technical Field]

[0001] The present application relates to the field of heat dissipation structure technology, and in particular to heat conduction structures, electronic devices, and terminals. [Background technology]

[0002] With the development of electronic technology, the computing power of chips is continuously improved, the power consumption is greatly increased, and the size of chips is becoming smaller and smaller, which causes the chips to generate more and more heat, and the heat density is becoming higher and higher, which brings about a relatively high challenge to the heat dissipation ability of the chips.

[0003] In conventional technology, a heat sink is usually used to dissipate heat from a chip. To ensure that the heat from the chip is efficiently guided to the heat sink, a thermally conductive layer needs to be disposed between the heat sink and the chip. The thermal conductivity of the thermally conductive layer has a relatively significant impact on the heat dissipation ability of the chip. In addition, the structural reliability of the thermally conductive layer is also relatively important, so that the thermally conductive layer can be relatively reliable and unlikely to be damaged when the electronic device is vibrated or otherwise occurs. Summary of the Invention

[0004] The present application provides a heat conducting structure, an electronic device, and a terminal. The insulating ring protects the heat conducting portion, and therefore the heat conducting portion may be made of a heat conducting material to enhance the heat conducting efficiency of the heat conducting structure. [Means for solving the problem]

[0005] According to a first aspect, the present application provides a heat-conducting structure. The heat-conducting structure includes a heat-conducting portion and an insulating ring. The heat-conducting portion is disposed within the insulating ring. The upper and lower sides of the heat-conducting portion are at least partially exposed, so that the heat-conducting portion can contact a heat-generating component and a heat sink on both sides to conduct heat. The insulating ring can protect the heat-conducting portion around the periphery. When the heat-conducting structure is aged or damaged, the aging or damage occurs mainly in the insulating ring, and the internal heat-conducting portion is less likely to fall off. Therefore, the heat-conducting portion can be disposed as a heat-conducting portion made of a highly thermally conductive material, i.e., a heat-conducting portion made of an electrically conductive material. In this way, the heat-conducting ability of the heat-conducting structure is enhanced and the risk of short circuits is reduced. In a specific technical solution, the insulating ring is an enclosed ring or has an opening. The insulating ring may be an enclosed ring and is disposed completely around the heat-conducting portion. In this solution, the insulating ring is disposed completely around the heat-conducting portion. In this way, the heat-conducting portion is less likely to be exposed through the insulating ring. This helps to improve the reliability of the heat conduction structure. Alternatively, the insulating ring may have openings. After the heat conduction structure is installed in the electronic device, the openings in the insulating ring can absorb deformation, so the insulating ring is less likely to wrinkle or be stretched. Specifically, the insulating ring may have one or more openings.

[0006] When the heat transfer structure is specifically positioned, it includes a first side and a second side that are opposite each other. On the first side of the heat transfer structure, the surface of the heat transfer portion and the surface of the insulating ring are flush with each other. On the second side of the heat transfer structure, the surface of the heat transfer portion and the surface of the insulating ring are flush with each other. In other words, the thickness of the heat transfer portion and the thickness of the insulating ring are the same, and both sides of the heat transfer structure are flat. This solution is applicable to scenarios where one side of the heat sink is flat and one side of the heat-generating component is also flat.

[0007] In another technical solution, on the first side of the heat transfer structure, the surfaces of the heat transfer portion and the insulating ring are flush with each other. On the second side of the heat transfer layer, the insulating ring protrudes from the surface of the heat transfer portion. In this embodiment, the heat transfer structure is applicable when one side of the heat-generating component or one side of the heat sink is not flat. Even when the structure on one side is not flat, the heat transfer portion can be ensured to be sealed by using the insulating ring to protect the heat transfer portion and reduce the risk of short circuits.

[0008] In yet another technical solution, an insulating ring protrudes from the surface of the heat conducting portion on the first side of the heat conducting structure. On the second side of the heat conducting layer, an insulating ring protrudes from the surface of the heat conducting portion. This solution is primarily applicable when one side of the heat generating component is not flat and one side of the heat sink is not flat. This solution also ensures that the heat conducting portion is sealed by using an insulating ring to protect the heat conducting portion and reduce the risk of short circuits.

[0009] When the insulating ring and the heat conducting portion are specifically provided, the insulating ring can be fixed to the heat conducting portion. In other words, the heat conducting portion and the insulating ring can be manufactured separately and then fastened together. In a specific technical solution, the insulating ring and the heat conducting portion can be fixed and joined by bonding.

[0010] In another technical solution, the insulating ring and the heat conducting part are an integrated structure, which can improve the reliability of the connection between the insulating ring and the heat conducting part, and therefore the heat conducting part is less likely to be damaged.

[0011] Another technical solution involves a gap between the insulating ring and the heat conducting part. This solution can accommodate deformation of the heat conducting part and the insulating ring or can be configured to fit the specific structure of the electronic device. In addition, the heat conducting part and the insulating ring can be two independent components that are manufactured, transported, and installed separately.

[0012] When the insulating ring is specially manufactured, the material of the insulating ring can be at least one of foam, rubber, or sealant, which is relatively low in cost and convenient to manufacture.

[0013] Alternatively, the insulating ring may be made of a heat-conducting material, particularly an insulating material. This solution can improve the heat-conducting area of the heat-conducting structure, which helps to increase the heat-conducting efficiency and heat-conducting capacity of the heat-conducting structure.

[0014] When the insulating ring is made of a thermally conductive material, the material of the insulating ring can specifically include a thermally conductive gel, a thermally conductive insulating tape, a thermally conductive adhesive, or a thermally conductive insulating film. The thermal conductivity of the thermally conductive material may be less than that of the thermally conductive portion, but still has a certain thermal conductivity.

[0015] Specifically, the thermal conductivity of the heat conducting portion is 10 W / (m K) or more. Specifically, the thermal conductivity of the heat conducting portion may alternatively be 30 W / (m K) or more. In this case, the heat conducting efficiency of the heat conducting structure can be improved.

[0016] Particular materials for the heat conducting portion include carbon fiber or graphene.

[0017] In addition, the shape of the heat conducting portion and the shape of the insulating ring are not limited. In a specific technical solution, the edge shape of the heat conducting portion may be the same as the inner edge shape of the insulating ring. This solution can improve the cooperation between the heat conducting portion and the insulating ring. Optionally, the shape may be any possible shape, such as a triangle, a square, a polygon, a circle, an ellipse, or an irregular shape.

[0018] According to a second aspect, the present application further provides an electronic device. The electronic device includes a heat-generating component, a heat sink, and the heat-conducting structure of the first aspect. The heat-conducting structure is disposed between the heat-generating component and the heat sink and configured to conduct heat from the heat-generating component to the heat sink. The heat-conducting structure in this solution has relatively high heat conduction efficiency and relatively high reliability, and can reduce the risk of short circuits.

[0019] When the heat conducting structure is specifically arranged, one side of the insulating ring is arranged in contact with the heat generating component, and the other side is arranged in contact with the heat sink. In this way, the heat conducting part is sealed between the heat generating component, the insulating ring, and the heat sink, so that the heat conducting part is less likely to fall into the circuit area of the electronic device when the heat conducting part is aged or damaged, thus reducing the risk of short circuit.

[0020] In another technical solution, when the heat-generating component is disposed on the circuit board, one side of the insulating ring may be disposed in contact with the circuit board, and the other side of the insulating ring may be disposed in contact with the heat sink. In this solution, the heat-conducting part is sealed between the circuit board, the insulating ring, and the heat sink, so that the heat-conducting part is less likely to fall into the circuit area of the electronic device when the heat-conducting part is aged or damaged. Therefore, the risk of short circuit is reduced.

[0021] In a specific technical solution, the electronic device is an in-vehicle electronic device. Vibrations and the like easily occur during the running process of a vehicle, but the heat conduction structure in this solution is unlikely to break under vibration scenarios. Therefore, the heat dissipation efficiency of the in-vehicle electronic device can be effectively improved.

[0022] According to a third aspect, the present application further provides a terminal, which includes the electronic device of the second aspect, and has a relatively strong heat dissipation capability and a relatively good operating condition. [Brief explanation of the drawings]

[0023] [Figure 1] FIG. 2 is a schematic diagram of a top structure of a heat conduction structure according to an embodiment of the present application; [Figure 2] 1 is a schematic diagram of a cross-sectional structure of a heat conduction structure according to an embodiment of the present application; [Figure 3] FIG. 10 is a schematic diagram of another top structure of a heat conduction structure according to an embodiment of the present application; [Figure 4] FIG. 10 is a schematic diagram of another top structure of a heat conduction structure according to an embodiment of the present application; [Figure 5] FIG. 10 is a schematic diagram of another top structure of a heat conduction structure according to an embodiment of the present application; [Figure 6] FIG. 10 is a schematic diagram of another top structure of a heat conduction structure according to an embodiment of the present application; [Figure 7] FIG. 10 is a schematic diagram of another top structure of a heat conduction structure according to an embodiment of the present application; [Figure 8] FIG. 10 is a schematic diagram of another top structure of a heat conduction structure according to an embodiment of the present application; [Figure 9] FIG. 10 is a schematic diagram of another top structure of a heat conduction structure according to an embodiment of the present application; [Figure 10] FIG. 10 is a schematic diagram of another top structure of a heat conduction structure according to an embodiment of the present application; [Figure 11] 1 is a schematic diagram of a structure of an electronic device according to an embodiment of the present application; [Figure 12] FIG. 10 is a schematic diagram of another cross-sectional structure of a heat conduction structure according to an embodiment of the present application; [Figure 13] FIG. 2 is a schematic diagram of another structure of an electronic device according to an embodiment of the present application. [Figure 14] FIG. 10 is a schematic diagram of another cross-sectional structure of a heat conduction structure according to an embodiment of the present application; [Figure 15] FIG. 2 is a schematic diagram of another structure of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION OF THE INVENTION

[0024] The terms used in the following embodiments are intended to describe particular embodiments only and are not intended to limit the present application. As used in this specification and the appended claims of this application, the singular terms "one," "a," "the foregoing," "this," and "the one" are intended to include expressions such as "one and more," unless the context clearly dictates otherwise.

[0025] References herein to "one embodiment," "some embodiments," etc., indicate that one or more embodiments of the present application include the particular feature, structure, or characteristic described with reference to the embodiment. Thus, the appearance of statements such as "in one embodiment," "in some embodiments," "in some other embodiments," "in other embodiments," etc. in various places throughout this specification do not necessarily refer to the same embodiment. Instead, these statements mean "one or more, but not all, of the embodiments," unless specifically emphasized otherwise. The terms "including," "comprising," "having," and all variations thereof mean "including, but not limited to," unless specifically specified otherwise.

[0026] To facilitate understanding of the foldable terminal provided in the embodiments of the present application, the application scenarios of the foldable terminal will be described below first. With the development of electronic technology, the requirements for heat dissipation from heat-generating components such as chips have become increasingly apparent. In conventional technology, heat dissipation from heat-generating components is typically achieved by using a heat sink. To ensure heat dissipation, a thermally conductive structure must be disposed between the heat-generating component and the heat sink. The thermally conductive structure has thermal conductivity and can conduct heat from the heat-generating component to the heat sink for heat dissipation. In addition, the thermally conductive structure is typically flexible, thereby achieving relatively reliable contact between the heat-generating component and the heat sink and increasing the contact area to improve the heat dissipation effect of the heat-generating component. Materials for the thermally conductive structure include insulating materials and conductive materials. Thermally conductive structures with relatively good thermal conductivity are typically made of conductive materials. However, heat-generating components such as chips are typically used in electrical structures such as circuit boards. Therefore, in some scenarios, if the thermally conductive structure is made of a conductive material, a short circuit may occur. In particular, in a scenario where vibrations are severe and the heat transfer structure is used for a long period of time, the heat transfer structure is easily damaged. The damaged portion of the heat transfer structure may fall, and the fallen heat transfer structure may fall onto a circuit structure such as a circuit board. In this case, a short circuit may be caused. Therefore, the present application provides a heat transfer structure and an electronic device.

[0027] To make the objectives, technical solutions and advantages of the present application clearer, the following further describes the present application in detail with reference to the accompanying drawings.

[0028] FIG. 1 is a schematic diagram of a top view structure of a heat conduction structure according to an embodiment of the present application. FIG. 2 is a schematic diagram of a cross-sectional structure of a heat conduction structure according to an embodiment of the present application. Please refer to FIGS. 1 and 2. The heat conduction structure 1 in this embodiment of the present application includes a heat conduction portion 11 and an insulating ring 12. The heat conduction portion 11 is disposed within the insulating ring 12. Specifically, the insulating ring 12 is disposed around the periphery of the heat conduction portion 11, and the upper and lower sides of the heat conduction portion 11 are at least partially exposed. In this manner, the heat conduction portion 11 can contact a heat-generating component and a heat sink on both sides to conduct heat. The upper and lower sides of the heat conduction portion 11 are divided into a side consisting of the heat conduction portion 11 that contacts the heat-generating component and a side consisting of the heat conduction portion 11 that contacts the heat sink. In this embodiment, the periphery of the heat conduction portion 11 is protected by the insulating ring 12. Even if the heat conduction structure 1 is deteriorated or damaged over time, the deterioration or damage will occur mainly in the insulating ring 12, and the internal heat conduction portion 11 is unlikely to fall off. Therefore, the heat conduction portion 11 may be arranged as a heat conduction portion 11 made of a highly heat conductive material, or may be made of an electrically conductive material. In this way, the heat conduction ability of the heat conduction structure 1 is enhanced, and the risk of a short circuit is unlikely to occur.

[0029] In certain embodiments, the aging resistance of the insulating ring 12 may be stronger than that of the heat conducting portion 11. In this way, when the heat conducting portion 11 ages, the insulating ring 12 will be subject to a relatively low degree of aging and will be less likely to be damaged, thus providing a relatively good protective effect for the heat conducting portion 11. In addition, the mechanical strength of the insulating ring 12 may be even greater than that of the heat conducting portion 11. In this way, the insulating ring 12 will be less likely to be damaged in the vibration process. Therefore, with this solution, the vibration isolation ability of the heat conducting structure 1 is relatively good.

[0030] In certain embodiments, the material of the insulating ring 12 may be at least one of foam, rubber, and sealant. The material is flexible and easy to install. In addition, the material is easy to manufacture and relatively inexpensive.

[0031] In another specific embodiment, the insulating ring 12 may alternatively be made of a thermally conductive material. The thermally conductive material has a certain thermal conductivity. Indeed, the thermal conductivity of the thermally conductive material may be lower than that of the thermally conductive portion 11. Therefore, the insulating ring 12 can also conduct heat to increase the thermal conduction area of the thermally conductive structure 1 and enhance the thermal conduction effect of the thermally conductive structure 1. For example, the thermally conductive material may be a thermally conductive gel, a thermally conductive insulating tape, a thermally conductive adhesive, or a thermally conductive insulating film. The thermally conductive adhesive may be formed by thermal curing or room temperature curing. In other words, the thermally conductive adhesive may be a thermally curing thermally conductive adhesive or a room temperature curing thermally conductive adhesive. In addition, the insulating ring 12 may alternatively be made of a thermally conductive gel, etc.

[0032] Specifically, the heat-conducting portion 11 may be made of an electrically conductive material and therefore has relatively good thermal conductivity. For example, the thermal conductivity of the heat-conducting portion 11 is 10 W / (m·K) or more. Thermal conductivity is the heat transferred through an area of 1 square meter in a certain time for a 1 meter (m) thick material with a temperature difference of 1 degree (K or °C) on both surfaces under stable heat transfer conditions. The unit of thermal conductivity is watts per meter·degree (W / (m·K)). K may be replaced with °C in this specification. For example, the thermal conductivity of the heat-conducting portion 11 may be 11 W / (m·K), 15 W / (m·K), 18 W / (m·K), 20 W / (m·K), 22 W / (m·K), 25 W / (m·K), 26 W / (m·K), 30 W / (m·K), 35 W / (m·K), 40 W / (m·K), etc., which are not listed one by one in this specification. For example, the material of the heat-conducting portion 11 includes carbon fiber or graphene. The thermal conductivity of these two materials is relatively strong, which helps to enhance the thermal conductivity of the heat-conducting structure 1.

[0033] Please continue to refer to FIG. 1. When the insulating ring 12 is specially positioned, it may be a surrounded ring. In other words, the insulating ring 12 is not provided with an opening 121 and is positioned around the entire periphery of the heat conducting portion 11. In this solution, the insulating ring 12 is positioned completely around the heat conducting portion 11. In this way, the heat conducting portion 11 is less likely to be exposed through the insulating ring 12. This helps to improve the reliability of the heat conducting structure 1. In addition, the insulating ring 12 has an integral structure and is easy to install.

[0034] In certain embodiments, the insulating ring 12 may be an integrated structure. In other words, the enclosed ring is manufactured through a one-step molding process. In this embodiment, the manufacturing process of the insulating ring 12 is simplified, and the overall strength of the insulating ring 12 is relatively high.

[0035] Alternatively, in another specific embodiment, the insulating ring 12 can form an enclosed ring by a fixed connection such as bonding. In conclusion, the method of forming the enclosed ring is not limited in this application, provided that the enclosed ring can be formed.

[0036] 3 is a schematic diagram of another top structure of a heat conduction structure according to an embodiment of the present application. As shown in FIG. 3, in another embodiment, an opening 121 is further provided in the insulating ring 12. In this embodiment, after the heat conduction structure 1 is installed in the electronic device, the opening in the insulating ring 12 can absorb deformation, and therefore the insulating ring 12 is less likely to be wrinkled or stretched.

[0037] The size of the opening is not limited. For example, the width of the opening can range from 0 mm to 5 mm. In other words, the width of the opening can range from 0 mm to 5 mm. In one embodiment, the opening 121 is simply a gap. In other words, the insulating rings 12 are not connected to form an enclosed ring.

[0038] When the opening 121 is specifically provided, the edge shape of the opening 121 is not limited. As shown in FIG. 3, the edge of the opening 121 may be linear. Alternatively, FIG. 4 is a schematic diagram of another top structure of a heat conduction structure according to an embodiment of the present application. As shown in FIG. 4, in another embodiment, the edge of the opening 121 may alternatively be zigzag. In this solution, when the opening 121 is provided, the risk of exposure of the internal heat conduction portion 11 is further reduced, and the reliability of the heat conduction structure 1 is improved. In addition, the edge of the opening 121 may alternatively be arc-shaped, wavy-shaped, etc., which will not be listed one by one in this specification.

[0039] When the opening 121 is specifically provided, the specific position of the opening 121 is not limited. An example in which the shape of the heat conduction structure 1 is square. As shown in FIG. 3 or FIG. 4, in one embodiment, the opening 121 may be disposed at a side position of the heat conduction structure 1. FIG. 5 is a schematic diagram of another top structure of the heat conduction structure according to an embodiment of the present application. As shown in FIG. 5, in another embodiment, the opening 121 may alternatively be disposed at a diagonal position of the heat conduction structure 1.

[0040] Additionally, in certain embodiments, the number of openings 121 included in the insulating ring 12 is not limited. As shown in FIGS. 3 to 5, in one embodiment, the insulating ring 12 may include one opening 121. FIG. 6 is a schematic diagram of another top structure of a heat conduction structure according to an embodiment of the present application. As shown in FIG. 6, in another embodiment, the insulating ring 12 may alternatively include two openings 121, and the two openings 121 may be located on two opposite sides. Indeed, in other embodiments, the insulating ring 12 may alternatively be provided with a plurality of openings 121, for example, three, four, five or more openings 121.

[0041] In certain embodiments, the specific shape of the heat conducting structure 1 is not limited. In one embodiment, the edge shape of the heat conducting portion 11, the inner edge shape of the insulating ring 12, and the outer edge shape of the insulating ring 12 are the same. However, each of the edge shapes is not limited. In one embodiment, each of the edges is square, as shown in FIG. 6. In another embodiment, each of the edges is circular, as shown in FIG. 7.

[0042] Alternatively, Fig. 8 is a schematic diagram of another top structure of a heat conduction structure according to an embodiment of the present application. As shown in Fig. 8, in another embodiment, only the edge shape of the heat conduction portion 11 and the inner edge shape of the insulating ring 12 are the same, and the outer edge shape of the insulating ring 12 can be different from the edge shape. In the embodiment shown in Fig. 8, the edge shape of the heat conduction portion 11 and the inner edge shape of the insulating ring 12 are both circular, and the outer edge shape of the insulating ring 12 is square. In this embodiment, a relatively reliable connection between the heat conduction portion 11 and the insulating ring 12 can be realized, and the insulating ring 12 protects the heat conduction portion 11, so that the heat conduction portion 11 is less likely to be exposed through the insulating ring 12.

[0043] In certain embodiments, the shapes of the heat-conducting portion 11 and the insulating ring 12 may be designed based on the shapes and installation positions of the heat-generating components, which are not listed one by one in this application.

[0044] In a specific embodiment, as shown in Figures 1 to 8, the insulating ring 12 of the heat conducting structure 1 is fixed to the heat conducting portion 11. For example, the insulating ring 12 may be fixed to the heat conducting portion 11 by adhesive bonding or an interference fit assembly. In this solution, the heat conducting structure 1 may be an integrated structure, thus facilitating transportation and installation of the heat conducting structure 1.

[0045] Alternatively, in another embodiment, the insulating ring 12 and the heat conducting portion 11 may be further integrated. In other words, the heat conducting structure 1 is manufactured through a one-step molding process. In this solution, the insulating ring 12 and the heat conducting portion 11 are fixed relatively securely, thus improving the reliability of the heat conducting structure 1, and the heat conducting portion 11 is less likely to be exposed from the insulation.

[0046] FIG. 9 is a schematic diagram of another top structure of a heat conduction structure according to an embodiment of the present application. As shown in FIG. 9, in another embodiment, a gap 13 further exists between the heat conduction portion 11 and the insulating ring 12. The specific width of the gap 13 is not limited and can range, for example, from 0 mm to 5 mm. This solution can accommodate deformations of the heat conduction portion 11 and the insulating ring 12 or can be configured to fit the specific structure of the electronic device. In this embodiment, the heat conduction portion 11 and the insulating ring 12 can be two independent components that are manufactured, transported, and installed separately.

[0047] FIG. 10 is a schematic diagram of another top structure of a heat conduction structure according to an embodiment of the present application. As shown in FIG. 10 , in any design, the gap 13 may be configured not to completely surround the heat conduction portion 11. For example, when the outer edge shape of the heat conduction portion 11 is quadrilateral, the gap 13 may be disposed at any one side, any two sides, or any three sides, and may be disposed in a closed annular gap. For example, in the embodiment shown in FIG. 10 , the gap 13 is disposed on two opposite sides of the quadrilateral-shaped heat conduction portion 11. In this solution, the gap 13 can be used to absorb deformation of the heat conduction portion 11 and the insulating ring 12, and the heat conduction portion 11 and the insulating ring 12 can be further fixed, thus facilitating the installation and transportation of the heat conduction structure.

[0048] Based on the same inventive concept, the present application also provides an electronic device. Specifically, FIG. 11 is a schematic diagram of the structure of an electronic device according to one embodiment of the present application. As shown in FIG. 11, the electronic device, in any one of the aforementioned embodiments, includes a heat-generating component 2, a heat sink 3, and a heat-conducting structure 1. The heat-conducting structure 1 is disposed between the heat-generating component 2 and the heat sink 3. Specifically, two sides of the heat-conducting portion 11 are in contact with the heat-generating component 2 and the heat sink 3, respectively, to transfer heat between the heat-generating component 2 and the heat sink. The heat-conducting structure 1 in this embodiment has a relatively strong heat-conducting ability. Therefore, the heat-dissipating ability of the electronic device is relatively strong. In addition, the heat-conducting structure 1 is less likely to cause a short circuit in the electronic device, which helps to improve the reliability of the electronic device.

[0049] 11, one side of the insulating ring 12 is disposed in contact with the heat-generating component 2, and the other side is disposed in contact with the heat sink 3. In this solution, the heat-conducting portion 11 is sealed between the heat-generating component 2, the heat sink 3, and the insulating ring 12, so that the probability of the heat-conducting portion 11 being exposed to the outside can be effectively reduced, and the structural reliability of the electronic device is improved.

[0050] See FIGS. 2 and 11 . In a specific embodiment, the heat-conducting structure 1 includes a first side 14 and a second side 15 that are opposite each other. The heat-conducting structure 1 is, in particular, a sheet-like structure. The heat-conducting structure 1 has the first side 14 and the second side 15 that are opposite each other along a direction perpendicular to the surface of the heat-conducting portion 11. On the first side 14 of the heat-conducting structure 1, the surface of the heat-conducting portion 11 and the surface of the insulating ring 12 are coplanar. On the second side 15 of the heat-conducting layer, the surface of the heat-conducting portion 11 and the surface of the insulating ring 12 are coplanar. The manufacturing process of the heat-conducting structure 1 in this solution is relatively simple. This helps to simplify the manufacturing process of the heat-conducting structure 1. In addition, the storage and transportation of the heat-conducting structure 1 are easier. This solution is mainly applicable when one side of the heat-generating component 2 is a planar structure and one side of the heat sink 3 is also a planar structure.

[0051] 12 is a schematic diagram of another cross-sectional structure of a heat conduction structure according to an embodiment of the present application. As shown in FIG. 12, in another embodiment, on a first side 14 of the heat conduction structure 1, the surfaces of the heat conduction portion 11 and the insulating ring 12 are flush with each other. On a second side 15 of the heat conduction structure 1, the insulating ring 12 protrudes from the surface of the heat conduction portion 11. In this embodiment, the heat conduction structure 1 is applicable when one side of the heat-generating component 2 is not flat or when one side of the heat sink 3 is not flat. This solution is mainly applicable when one side of the heat-generating component 2 is flat and one side of the heat sink 3 is provided with a first protrusion 31, when one side of the heat-generating component 2 is provided with a second protrusion 21 and one side of the heat sink 3 is flat, or when the heat-generating component 2 is disposed on a circuit board 4, the heat-generating component 2 protrudes from the circuit board 4, and one side of the heat sink 3 is flat.

[0052] FIG. 13 is a schematic diagram of another structure of an electronic device according to an embodiment of the present application. As shown in FIG. 13, in another embodiment, the heat-generating component 2 is disposed on the circuit board 4, and the heat-generating component 2 protrudes from the circuit board 4. In this case, the heat-generating component 2 corresponds to the second protrusion 21. In this case, the heat-conducting structure 1 may be as shown in FIG. 12. On the second side 15 of the heat-conducting structure 1, the insulating ring 12 protrudes from the heat-conducting portion 11, and thus the second side 15 of the heat-conducting structure 1 faces one side of the circuit board 4. Specifically, on the first side 14 of the heat-conducting structure 1, both the heat-conducting portion 11 and the insulating ring 12 are disposed in contact with the heat sink 3. On the second side 15 of the heat-conducting structure 1, the heat-conducting portion 11 is disposed in contact with the heat-generating component 2, and the insulating ring 12 is disposed in contact with the circuit board 4. In this solution, the heat-conducting portion 11 may also be sealed between the heat sink 3, the circuit board 4, and the insulating ring 12, and therefore the heat-conducting portion 11 is less likely to be exposed.

[0053] Indeed, when the heat conducting structure 1 in the embodiment shown in Fig. 11 is used in an electronic device, the heat conducting structure 1 may alternatively be shown in Fig. 11. In this embodiment, the insulating ring 12 has a certain elasticity and is compressed between the heat generating component 2 and the heat sink 3. This solution helps to improve the reliability of protecting the heat conducting part 11 by the insulating ring 12.

[0054] 14 is a schematic diagram of another cross-sectional structure of a heat conduction structure according to an embodiment of the present application. As shown in FIG. 14, in another embodiment, on a first side 14 of the heat conduction structure 1, an insulating ring 12 protrudes from the surface of the heat conduction portion 11. On a second side 15 of the heat conduction layer, the insulating ring 12 protrudes from the surface of the heat conduction portion 11. In this embodiment, the heat conduction structure 1 can be adapted to the shape of one side of the heat-generating component 2 or the shape of one side of the heat sink 3. This solution is mainly applicable when the second protrusion 21 is provided on one side of the heat-generating component 2 and the first protrusion 31 is provided on one side of the heat sink 3, or when the heat-generating component 2 is disposed on a circuit board 4, the heat-generating component 2 protrudes from the circuit board 4, and one side of the heat sink 3 has a planar structure.

[0055] 15 is a schematic diagram of another structure of an electronic device according to an embodiment of the present application. As shown in FIG. 15 , in another embodiment, a heat-generating component 2 is disposed on a circuit board 4, and a second protrusion 21 is provided on the heat-generating component 2. In addition, a first protrusion 31 is provided on the heat sink 3. The heat-conducting structure 1 in this embodiment is shown in FIG. 14. When the heat-conducting structure 1 is disposed between the heat-generating component 2 and the heat sink 3, the first side 14 of the heat-conducting structure 1 faces one side of the heat sink 3, the heat-conducting portion 11 is disposed in contact with the first protrusion 31 of the heat sink 3, and the insulating ring 12 is disposed in contact with the heat sink 3 at a position where the first protrusion 31 is not provided on the heat sink 3. The second side 15 of the heat-conducting structure 1 is disposed facing the heat-generating component 2, the heat-conducting portion 11 is disposed in contact with the heat-generating component 2, and the insulating ring 12 is disposed in contact with the circuit board 4. In this solution, the heat conducting portion 11 may also be sealed between the heat sink 3, the circuit board 4 and the insulating ring 12, and therefore the heat conducting portion 11 is less likely to be exposed.

[0056] Indeed, when the heat conducting structure 1 of the embodiment shown in Fig. 14 is used in an electronic device, the heat conducting structure 1 may alternatively be shown in Fig. 11. In this embodiment, the insulating ring 12 has a certain elasticity and is compressed between the heat generating component 2 and the heat sink 3. This solution helps to improve the reliability of protecting the heat conducting part 11 by the insulating ring 12.

[0057] It should be noted that "disposed in contact with" in the embodiments of this application can include direct contact or indirect contact, and primarily refers to the absence of a gap between two objects. For example, when A is disposed in contact with B, A and B may be in direct contact, or a transition component C may alternatively be disposed between A and B. Specifically, A comes into direct contact with C, and C comes into direct contact with B. In this case, there is no gap between A and B.

[0058] 12 and 14, the thickness of the insulating ring 12 is greater than the thickness of the heat conducting layer. In this case, the strength of the insulating ring 12 is relatively high, and both the impact resistance and aging resistance are relatively strong. This solution helps to improve the service life and reliability of the heat conducting structure 1.

[0059] In a specific embodiment, the heat-generating component 2 may be a chip. This is not particularly limited in the present application. The electronic device may be an in-vehicle electronic device. Vibrations and the like easily occur during the driving process of a vehicle. In the embodiment of the present application, the insulating ring 12 can protect the heat-conducting portion 11. Therefore, scenarios with severe vibrations can be better adapted. This helps to improve the heat dissipation performance of the in-vehicle electronic device of the vehicle, further improving the service life, performance, and the like of the in-vehicle electronic device.

[0060] The present application further provides a terminal. The terminal includes the electronic devices described above. The specific type of the terminal is not limited. For example, the terminal may be a communication terminal such as a server or memory, a mobile terminal such as a notebook computer or a tablet computer, or another terminal such as a vehicle or home device. The terminal has a relatively strong heat dissipation capability and therefore a relatively good operating condition.

[0061] The above description is merely a specific implementation form of the present application and is not intended to limit the scope of protection of the present application. Any variations or replacements that can be easily conceived by those skilled in the art within the technical scope disclosed in the present application shall fall within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be subject to the scope of protection of the claims. [Explanation of symbols]

[0062] 1. Heat conduction structure 11 Heat conduction part 12 Insulation ring 121 Opening 13 Gap 14 First Side 15 Second Side 2. Heat-generating components 21 Second protrusion 3 Heatsink 31 First protrusion 4 Circuit Board

Claims

1. A thermally conductive structure comprising a thermally conductive portion and an insulating ring, wherein the thermally conductive portion is disposed within the insulating ring, and the insulating ring is an enclosed ring or has an opening.

2. 2. The thermal conduction structure of claim 1, wherein the thermal conduction structure comprises a first side and a second side opposite each other, and on the first side of the thermal conduction structure, a surface of the thermal conduction portion and a surface of the insulating ring are coplanar, and on the second side of the thermal conduction structure, a surface of the thermal conduction portion and a surface of the insulating ring are coplanar.

3. 2. The thermal conduction structure of claim 1, wherein the thermal conduction structure includes a first side and a second side opposite each other, and on the first side of the thermal conduction structure, a surface of the thermal conduction portion and a surface of the insulating ring are coplanar, and on the second side of the thermal conduction structure, the insulating ring protrudes from the thermal conduction portion.

4. 2. The thermal conduction structure of claim 1, wherein the thermal conduction structure comprises a first side and a second side opposite each other, and wherein on the first side of the thermal conduction structure, the insulating ring protrudes from the thermal conduction portion, and on the second side of the thermal conduction structure, the insulating ring protrudes from the thermal conduction portion.

5. The heat conducting structure according to claim 1 , wherein the insulating ring is fixed to the heat conducting part.

6. The heat conducting structure according to claim 1 , wherein the insulating ring and the heat conducting portion are an integrated structure.

7. The heat conducting structure according to claim 1 , wherein there is a gap between the insulating ring and the heat conducting portion.

8. The heat conduction structure according to claim 1 , wherein the material of the insulating ring comprises foam, rubber, or a sealant.

9. The heat conduction structure according to claim 1 , wherein the insulating ring is made of a heat conducting material.

10. The heat-conducting structure of claim 9 , wherein the material of the insulating ring comprises a heat-conducting gel, a heat-conducting insulating tape, a heat-conducting adhesive, or a heat-conducting insulating film.

11. The heat conduction structure according to claim 1 , wherein the heat conduction portion has a thermal conductivity of 10 W / (m·K) or more.

12. The heat conducting structure according to claim 1 , wherein the material of the heat conducting portion comprises carbon fiber or graphene.

13. The heat conduction structure according to claim 1 , wherein an edge shape of the heat conduction portion is the same as an inner edge shape of the insulating ring.

14. 14. An electronic device comprising a heat-generating component, a heat sink, and the thermally conductive structure of claim 1 , wherein the thermally conductive structure is disposed between the heat-generating component and the heat sink.

15. 15. The electronic device of claim 14, wherein one side of an insulating ring is placed in contact with the heat-generating component and the other side is placed in contact with the heat sink.

16. 16. The electronic device of claim 14 or 15, wherein the heat-generating component is disposed on a circuit board, and one side of the insulating ring is disposed in contact with the circuit board and the other side is disposed in contact with the heat sink.

17. 17. The electronic device according to claim 14, wherein the electronic device is an in-vehicle electronic device.

18. A terminal, said terminal comprising an electronic device according to any one of claims 14 to 17.

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