Heatsink Component Termination

Abstract

The heat sink component may include a body including a thermally conductive material that is electrically non-conductive. At least one first terminal may be formed on a surface of the body. At least one second terminal may be formed on the surface of the body. A terminal spacing distance may be defined along the surface between the first terminal and the second terminal. A ratio of the length of the surface to the terminal spacing distance may be greater than about 10. Additionally or alternatively, a ratio of the area of the at least one body surface to the total terminal area may be less than 1.2. The component assembly may include a device having a plurality of terminals exposed on the top surface, and a heat source terminal and a heat sink terminal of the heat sink component may be connected to respective terminals of the device.

Description

[Technical Field]

[0001] Related Applications This application is based on and claims the benefit of U.S. Provisional Patent Application No. 63 / 390,655, having a filing date of July 20, 2022, which is incorporated herein by reference. [Background technology]

[0002] For example, electrical circuits, such as power amplifier circuits, generate heat during normal operation. The buildup of heat can cause the temperature of various components of the electrical circuit to increase undesirably. If this heat is not adequately managed, for example by dissipation to a heat sink, the electrical device can overheat, resulting in damage to the electrical components. Summary of the Invention [Means for solving the problem]

[0003] According to one embodiment of the present invention, a heat sink component may include a body including a thermally conductive material that is electrically non-electrically conductive. The body may define a longitudinal direction, a lateral direction, and a thickness direction that are orthogonal to one another. The body may have a plurality of body surfaces, the plurality of body surfaces including a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction. A heat source terminal may be formed on at least one of the plurality of body surfaces. A heat sink terminal may be formed on at least one of the plurality of body surfaces. A terminal spacing distance may be defined along the at least one body surface between the heat source terminal and the heat sink terminal. A ratio of a length of the at least one body surface to the terminal spacing distance may be greater than approximately 10.

[0004] According to another embodiment of the present invention, a heat sink component may include a body including a thermally conductive material that is electrically non-conductive. The body may define a longitudinal direction, a lateral direction, and a thickness direction that are orthogonal to one another. The body may have a plurality of body surfaces, the plurality of body surfaces including a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction. A heat source terminal may be formed on at least one of the plurality of body surfaces. A heat sink terminal may be formed on at least one of the plurality of body surfaces. The at least one body surface may have an area defined by the product of the length of the at least one body surface and the width of the at least one body surface. The heat source terminal may have a heat source terminal area defined by the product of the heat source terminal length and the heat source terminal width. The heat sink terminal can have a heat sink terminal area defined by the product of the heat sink terminal length and the heat sink terminal width. The sum of the heat source terminal area and the heat sink terminal area can be a total terminal area. The ratio of the area of the at least one body surface to the total terminal area can be less than 1.2.

[0005] According to another embodiment of the present invention, a heat sink component may include a body including a thermally conductive material that is electrically non-electrically conductive. The body may define a longitudinal direction, a lateral direction, and a thickness direction that are orthogonal to one another. The body may have a plurality of body surfaces, including a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction. A heat source terminal may be formed on at least one of the plurality of body surfaces. A heat sink terminal may be formed on at least one of the plurality of body surfaces. A terminal spacing distance may be defined along at least one of the body surfaces between the heat source terminal and the heat sink terminal. The terminal spacing distance may be offset from a lateral centerline axis extending along the lateral direction or a longitudinal centerline axis extending along the longitudinal direction.

[0006] According to yet another embodiment of the present invention, a heat sink component may include a body portion including a thermally conductive material that is electrically non-electrically conductive. The body portion may define a longitudinal direction, a lateral direction, and a thickness direction that are orthogonal to one another. The body portion may have a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction. A heat source terminal may be formed on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface. A heat sink terminal may be formed on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface. The heat sink terminal may include a flange extending beyond the body portion.

[0007] According to yet another embodiment of the present invention, a heat sink component may include a body portion including a thermally conductive material that is electrically non-conductive. The body portion may define a longitudinal direction, a lateral direction, and a thickness direction that are orthogonal to one another. The body portion may have a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction. A heat source terminal may be formed on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface. A heat sink terminal may be formed on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface. The heat source terminal may include a pair of bendable leads.

[0008] According to another embodiment of the present invention, a heat sink component may include a body portion including a thermally conductive material that is electrically non-conductive. The body portion may define a longitudinal direction, a lateral direction, and a thickness direction that are orthogonal to one another. The body portion may have a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction. A heat source terminal may be formed on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface. A heat sink terminal may be formed on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface. The heat sink terminal may include a pair of bendable leads.

[0009] According to a further embodiment of the present invention, a heat sink component may include a body portion including a thermally conductive material that is electrically non-conductive. The body portion may define a longitudinal direction, a lateral direction, and a thickness direction that are orthogonal to one another. The body portion may have a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction. A heat source terminal may be formed on the top surface or the bottom surface. A heat sink terminal may be formed on the entire other of the top surface or the bottom surface. The heat source terminal may include a pair of leads.

[0010] According to yet another embodiment of the present invention, a heat sink component may include a body portion including a thermally conductive material that is electrically non-conductive. The body portion may define a longitudinal direction, a lateral direction, and a thickness direction that are orthogonal to one another. The body portion may have a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction. A heat source terminal may be formed on the top surface or the bottom surface. A heat sink terminal may be formed on the entire other of the top surface or the bottom surface. The heat source terminal may include a pair of wire bond pads.

[0011] According to yet another embodiment of the present invention, a component assembly can include a device including a top surface and a plurality of terminals exposed on the top surface. The component assembly can also include a heat sink component, such as a heat sink component described in any one of the various embodiments discussed herein, attached to the device. The heat source terminal can be connected to one of the plurality of terminals of the device, and the heat sink terminal can be connected to another of the plurality of terminals of the device.

[0012] According to another embodiment of the present invention, a method for manufacturing a heat sink component can include providing a body including a thermally conductive material that is electrically non-electrically conductive. The body can define orthogonal longitudinal, lateral, and thickness directions. The body can have a plurality of body surfaces, including a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction. The method can further include forming a heat source terminal on at least one of the plurality of body surfaces, and forming a heat sink terminal on at least one of the plurality of body surfaces, defining a terminal spacing distance along the at least one body surface between the heat source terminal and the heat sink terminal. A ratio of the length of the at least one body surface to the terminal spacing distance can be greater than about 10.

[0013] According to another embodiment of the present invention, a method for manufacturing a heat sink component can include providing a body including a thermally conductive material that is electrically non-electrically conductive. The body can define a longitudinal direction, a lateral direction, and a thickness direction that are orthogonal to one another. The body can have a plurality of body surfaces, the plurality of body surfaces including a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction. The method can further include forming a heat source terminal on at least one of the plurality of body surfaces and forming a heat sink terminal on at least one of the plurality of body surfaces. The at least one body surface can have an area defined by the product of the length of the at least one body surface and the width of the at least one body surface. The heat source terminal can have a heat source terminal area defined by the product of the heat source terminal length and the heat source terminal width. The heat sink terminal can have a heat sink terminal area defined by the product of the heat sink terminal length and the heat sink terminal width. The sum of the heat source terminal area and the heat sink terminal area can be a total terminal area. The ratio of the area of the at least one body surface to the total terminal area can be less than 1.2.

[0014] According to yet another embodiment of the present invention, a method for manufacturing a heat sink component can include providing a body including a thermally conductive material that is electrically non-electrically conductive. The body can define orthogonal longitudinal, lateral, and thickness directions. The body can have a plurality of body surfaces, including a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction. The method can also include forming a heat source terminal on at least one of the plurality of body surfaces, and forming a heat sink terminal on the at least one of the plurality of body surfaces, defining a terminal spacing distance along the at least one body surface between the heat source terminal and the heat sink terminal. The terminal spacing distance may be offset from a lateral centerline axis extending along the lateral direction or from a longitudinal centerline axis extending along the longitudinal direction.

[0015] According to yet another embodiment of the present invention, a method for manufacturing a heat sink component can include providing a body including a thermally conductive material that is electrically non-electrically conductive. The body can define a longitudinal direction, a lateral direction, and a thickness direction that are orthogonal to one another. The body can have a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction. The method can further include forming a heat source terminal on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface. The method can further include forming a heat sink terminal on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface. The heat sink terminal can include a flange extending beyond the body.

[0016] According to another embodiment of the present invention, a method for manufacturing a heat sink component can include providing a body including a thermally conductive material that is electrically non-electrically conductive. The body can define orthogonal longitudinal, lateral, and thickness directions. The body can have a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction. The method can also include forming a heat source terminal on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface. The method can further include forming a heat sink terminal on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface. The heat source terminal can include a pair of bendable leads.

[0017] According to another embodiment of the present invention, a method for manufacturing a heat sink component can include providing a body including a thermally conductive material that is electrically non-electrically conductive. The body can define orthogonal longitudinal, lateral, and thickness directions. The body can have a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction. The method can also include forming a heat source terminal on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface. The method can further include forming a heat sink terminal on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface. The heat sink terminal can include a pair of bendable leads.

[0018] According to yet another embodiment of the present invention, a method for manufacturing a heat sink component can include providing a body including a thermally conductive material that is electrically non-electrically conductive. The body can define a longitudinal direction, a lateral direction, and a thickness direction that are orthogonal to one another. The body can have a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction. The method can also include forming a heat source terminal on the top surface or the bottom surface and forming a heat sink terminal over the entire other of the top surface or the bottom surface. The heat source terminal can include a pair of leads.

[0019] According to yet another embodiment of the present invention, a method for manufacturing a heat sink component can include providing a body including a thermally conductive material that is electrically non-conductive. The body can define a longitudinal direction, a lateral direction, and a thickness direction that are orthogonal to one another. The body can have a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction. The method can also include forming a heat source terminal on the top surface or the bottom surface and forming a heat sink terminal over the entire other of the top surface or the bottom surface. The heat source terminal can include a pair of wire bond pads.

[0020] A full and enabling disclosure of the present invention, including the best mode thereof, directed to one of ordinary skill in the art, is set forth more particularly in the remainder of the specification, which makes reference to the accompanying figures. [Brief explanation of the drawings]

[0021] [Figure 1A]FIG. 1 is a perspective view of an exemplary heat sink component having a terminal spacing distance between a first terminal and a second terminal, according to an embodiment of the present disclosure. [Figure 1B] FIG. 1B is a perspective view of the bottom surface of the heat sink component of FIG. 1A. [Figure 2] FIG. 1 is a perspective view of a bottom surface of an exemplary heat sink component having first and second terminals spaced apart from an edge of a body portion of the heat sink component and a terminal spacing distance between the first and second terminals, according to an embodiment of the present disclosure. [Figure 3] FIG. 1 is a perspective view of an exemplary heat sink component having fully encased first and second terminals according to an embodiment of the present disclosure. [Figure 4] FIG. 1 is a perspective view of an exemplary heat sink component having partially encased first and second terminals according to an embodiment of the present disclosure. [Figure 5] FIG. 2 is a perspective view of a bottom surface of an exemplary heat sink component having a plurality of terminals configured for land grid array type mounting, according to aspects of the present disclosure. [Figure 6A] FIG. 1 illustrates a perspective view of an exemplary heat sink component having an offset terminal spacing distance, according to aspects of the present disclosure. [Figure 6B] FIG. 1 illustrates a perspective view of an exemplary heat sink component having an offset terminal spacing distance, according to aspects of the present disclosure. [Figure 7A] 1A-1C are diagrams of exemplary heat sink components having one or more flanges extending beyond the body of the respective heat sink component, according to aspects of the present disclosure. [Figure 7B] 1A-1C are diagrams of exemplary heat sink components having one or more flanges extending beyond the body of the respective heat sink component, according to aspects of the present disclosure. [Figure 7C]1A-1C are diagrams of exemplary heat sink components having one or more flanges extending beyond the body of the respective heat sink component, according to aspects of the present disclosure. [Figure 7D] 1A-1C are diagrams of exemplary heat sink components having one or more flanges extending beyond the body of the respective heat sink component, according to aspects of the present disclosure. [Figure 7E] 1A-1C are diagrams of exemplary heat sink components having one or more flanges extending beyond the body of the respective heat sink component, according to aspects of the present disclosure. [Figure 7F] 1A-1C are diagrams of exemplary heat sink components having one or more flanges extending beyond the body of the respective heat sink component, according to aspects of the present disclosure. [Figure 8A] FIG. 1 is a perspective view of an exemplary heat sink component having at least one lead extending from a first terminal and / or a second terminal, according to an embodiment of the present disclosure. [Figure 8B] FIG. 1 is a perspective view of an exemplary heat sink component having at least one lead extending from a first terminal and / or a second terminal, according to an embodiment of the present disclosure. [Figure 8C] FIG. 1 is a perspective view of an exemplary heat sink component having at least one lead extending from a first terminal and / or a second terminal, according to an embodiment of the present disclosure. [Figure 9A] FIG. 1 is a perspective view of an exemplary heat sink component having a first terminal formed on a first surface and a second terminal formed entirely on a second surface opposite the first surface, in accordance with an embodiment of the present disclosure. [Figure 9B] FIG. 1 is a perspective view of an exemplary heat sink component having a first terminal formed on a first surface and a second terminal formed entirely on a second surface opposite the first surface, in accordance with an embodiment of the present disclosure. [Figure 10A] 1 illustrates an exemplary device of a component assembly according to aspects of the present disclosure. [Figure 10B] 10B illustrates an exemplary component assembly including the device of FIG. 10A and the heat sink component of FIG. 1A, according to an embodiment of the present disclosure. [Figure 11] FIG. 1 illustrates an exemplary heat sink component array according to aspects of the present disclosure. [Figure 12] 1 is a flowchart of a method for manufacturing a heat sink component according to an aspect of the present disclosure. [Figure 13] 1 is a flowchart of a method for manufacturing a heat sink component according to an aspect of the present disclosure. [Figure 14] 1 is a flowchart of a method for manufacturing a heat sink component according to an aspect of the present disclosure. [Figure 15] 1 is a flowchart of a method for manufacturing a heat sink component according to an aspect of the present disclosure. [Figure 16] 1 is a flowchart of a method for manufacturing a heat sink component according to an aspect of the present disclosure. [Figure 17] 1 is a flowchart of a method for manufacturing a heat sink component according to an aspect of the present disclosure. [Figure 18] 1 is a flowchart of a method for manufacturing a heat sink component according to an aspect of the present disclosure. [Figure 19] 1 is a flowchart of a method for manufacturing a heat sink component according to an aspect of the present disclosure. [Figure 20] 1 is a flowchart of a method for manufacturing a heat sink component array according to an aspect of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0022] Repeat use of reference characters in the present specification and drawings is intended to represent the same or like features or elements of the invention.

[0023] DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS It should be understood by those skilled in the art that this discussion is merely a description of exemplary embodiments and is not intended to limit the broader aspects of the invention, which broader aspects are embodied in the exemplary constructions.

[0024] Generally speaking, the present invention is directed to a heat sink component having excellent heat dissipation capabilities. For example, the heat sink component can include terminations configured to optimize the performance of the heat sink component. The heat sink component can include a body including a thermally conductive material that is electrically non-conductive. The body can define a thickness direction, a longitudinal direction, and a lateral direction that are orthogonal to one another. The body can have a top surface, a bottom surface opposite the top surface along the thickness direction, and multiple side surfaces extending between the top and bottom surfaces, such as a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction. One or more heat source terminals can be formed on one or more of the multiple body surfaces. One or more heat sink terminals can be formed on one or more of the multiple body surfaces.

[0025] As used herein, a layer "formed on" an object can include a layer formed directly on the object as well as a layer formed on one or more intermediate layers between the layer and the object. Additionally, formed "on" a bottom surface refers to formed from the center of the component outward.

[0026] The heat source terminals can be connected to one or more respective electrical devices or components and configured to conduct heat from the electrical devices or components into the heat sink component. The heat sink terminals can be configured to conduct heat away from the heat sink component. For example, one or more heat sink terminals can connect the heat sink component with a heat sink and transfer heat from one or more respective electrical devices or components through the heat sink component to the heat sink.

[0027] In some embodiments, one heat source terminal and one heat sink terminal can be formed on a bottom surface of the body portion of the heat sink component. The heat source terminal can have a heat source terminal area defined by the product of a heat source terminal length and a heat source terminal width. The heat source terminal length can extend in a longitudinal direction defined by the body portion of the heat sink component, and the heat source terminal width can extend in a lateral direction defined by the body portion of the heat sink component. The heat sink terminal can have a heat sink terminal area defined by the product of the heat sink terminal length and the heat sink terminal width. The heat sink terminal length can extend in the longitudinal direction, and the heat sink terminal width can extend in the lateral direction.

[0028] A terminal spacing distance can be defined between the heat sink terminal and the heat source terminal. For example, the heat source terminal and the heat sink terminal can be spaced apart from one another in a longitudinal direction, such that the terminal spacing distance can be defined in the longitudinal direction. The terminal spacing distance can be a longitudinal gap between the heat source terminal and the heat sink terminal. In some embodiments, the heat source terminal and the heat sink terminal can be spaced apart from one another in a laterally direction, such that the terminal spacing distance is defined in the laterally direction, such as the terminal spacing distance can be a lateral gap between the heat source terminal and the heat sink terminal.

[0029] In some embodiments, the terminal spacing distance can be minimized, for example, to maximize the size of the heat source terminal, the heat sink terminal, or both the heat source terminal and the heat sink terminal. For example, in some embodiments, the heat source terminal and the heat sink terminal can be formed on a bottom surface of a body portion of the heat sink component. The bottom surface can have a longitudinal length between a first end of the body portion and a second end of the body portion, with the second end being opposite the first end in the longitudinal direction. Furthermore, the bottom surface can have a lateral width between a first side of the body portion and a second side of the body portion, with the second side being opposite the first side in the lateral direction. The bottom surface can have an area defined by the product of the length of the bottom surface and the width of the bottom surface. A ratio can be defined between the area of the bottom surface and the total terminal area, where the total terminal area can be the sum of the heat source terminal area and the heat sink terminal area.

[0030] In some embodiments, the ratio of the bottom surface area to the total terminal area can be less than about 2, in some embodiments less than about 1.5, in some embodiments less than about 1.2, in some embodiments less than about 1.1, in some embodiments less than about 1.05, and in some embodiments less than about 1.02.

[0031] In some embodiments, the ratio of the length of the bottom surface to the terminal spacing distance can be greater than about 2, in some embodiments, greater than about 3, in some embodiments, greater than about 5, in some embodiments, greater than about 7, in some embodiments, greater than about 10, in some embodiments, greater than about 15, in some embodiments, greater than about 20, in some embodiments, greater than about 25, in some embodiments, greater than about 30, and in some embodiments, greater than about 35.

[0032] In some embodiments, the terminal spacing distance can be less than about 250 microns, in some embodiments less than about 200 microns, in some embodiments less than about 150 microns, in some embodiments less than about 100 microns, in some embodiments less than about 75 microns, in some embodiments less than about 50 microns, in some embodiments less than about 40 microns, in some embodiments less than about 30 microns, and in some embodiments less than about 20 microns.

[0033] In some embodiments, the heat source terminal and the heat sink terminal can be formed on a body surface of the plurality of body surfaces, such that the body surface is symmetrical about both a longitudinal centerline axis extending in a longitudinal direction and a lateral centerline axis extending in a lateral direction. The longitudinal centerline axis can be equidistant from a first side of the body and a second side of the body, the second side being laterally opposite the first side. The lateral centerline axis can be equidistant from a first end of the body and a second end of the body, the second end being longitudinally opposite the first end.

[0034] In some embodiments, the lateral centerline axis may bisect the terminal spacing distance. In some embodiments, the longitudinal centerline axis may bisect the terminal spacing distance.

[0035] The terminal spacing distance can be offset, for example, so that the body surface is not symmetrical about both the lateral centerline axis and the longitudinal centerline axis. In some embodiments, the terminal spacing distance can be offset from the lateral centerline axis. For example, the terminal spacing distance can be offset so that the terminal spacing distance is closer to the first end or the second end of the body than when the lateral centerline axis bisects the terminal spacing distance. In some embodiments, the terminal spacing distance can be offset from the longitudinal centerline axis. For example, the terminal spacing distance can be offset so that the terminal spacing distance is closer to the first side or the second side of the body than when the longitudinal centerline axis bisects the terminal spacing distance.

[0036] The one or more heat source terminals and the one or more heat sink terminals can have various configurations. In some embodiments, the one or more heat source terminals can be formed on a single body surface of the body of the heat sink component. For example, the one or more heat source terminals can be formed on only the bottom surface, or the one or more heat source terminals can be formed on only the top surface. In some embodiments, the one or more heat sink terminals can be formed on a single body surface of the body. For example, the one or more heat sink terminals can be formed on only the bottom surface, or the one or more heat sink terminals can be formed on only the top surface. The one or more heat source terminals can be formed on the same single body surface as the one or more heat sink terminals, or the one or more heat source terminals can be formed on different body surfaces.

[0037] In some embodiments, the one or more heat source terminals can be fully encased or partially encased, or can be arranged as land grid array (LGA) terminals. For example, the heat source terminals can encase the ends of the body portion, such that the heat source terminals are formed on the top, bottom, end, and first and second side surfaces of the body portion. As another example, the heat source terminals can partially encase the ends of the body portion, such that the heat source terminals are formed on the top, bottom, and end surfaces of the body portion without being formed on the first and / or second side surfaces of the body portion. In a further example, the multiple heat source terminals can be arranged in a grid or other suitable pattern, for example, for LGA-type mounting. For example, in an embodiment in which the multiple heat source terminals are formed on the bottom surface, each heat source terminal of the multiple heat source terminals can be spaced apart from the first end, second end, first side, and second side surfaces, and the multiple side surfaces can be free of conductive material. The one or more heat source terminals can be positioned in a manner that aligns with heat source terminals of a device (eg, a circuit board, an electrical component, etc.) to which the heat sink component is configured to be attached.

[0038] In some embodiments, the one or more heat sink terminals can be fully encased or partially encased, or can be arranged as LGA terminals. For example, the heat sink terminals can encase the ends of the body portion, such that the heat sink terminals are formed on the top, bottom, end, and first and second side surfaces of the body portion. As a further example, the heat sink terminals can partially encase the ends of the body portion, such that the heat sink terminals are formed on the top, bottom, and end surfaces of the body portion without being formed on the first and / or second side surfaces of the body portion. In yet another example, the multiple heat sink terminals can be arranged in a grid or other suitable pattern, for example, for an LGA-type mounting. For example, in an embodiment in which the multiple heat sink terminals are formed on the bottom surface, each heat sink terminal of the multiple heat sink terminals can be spaced apart from the first end, second end, first side, and second side surfaces, and the multiple side surfaces can be free of conductive material. The one or more heat sink terminals can be arranged in a manner that mates with heat sink terminals of a device (eg, a circuit board, an electrical component, etc.) to which the heat sink component is configured to be mounted.

[0039] In some embodiments, the heat sink terminal includes at least one flange extending outwardly beyond the body portion. The at least one flange can increase the bonding area of the heat sink terminal, which can improve thermal conduction through the heat sink component. For example, in some embodiments, the heat sink terminal can be formed on a bottom surface of the body portion adjacent to an end of the body portion, and the heat sink terminal can include a flange extending outwardly from the body portion beyond one of the first side, second side, or end of the body portion. In some embodiments, the flange is a first flange, and the heat sink terminal also includes a second flange extending outwardly from the body portion beyond another of the first side, second side, or end of the body portion. In some embodiments, the heat sink terminal further includes a third flange extending outwardly from the body portion beyond the remaining one of the first side, second side, or end of the body portion. For example, the first flange can extend beyond the first side, the second flange can extend beyond the second side, and the third flange can extend beyond the end of the body portion.

[0040] In some embodiments, the heat source terminal includes at least one flange extending outwardly beyond the body portion. For example, in some embodiments, the heat source terminal can be formed on a bottom surface of the body portion adjacent to an end of the body portion, and the heat source terminal can include a flange extending outwardly from the body portion beyond one of a first side, a second side, or an end of the body portion. In some embodiments, the flange is a first flange, and the heat source terminal also includes a second flange extending outwardly from the body portion beyond another of the first side, the second side, or an end of the body portion. In some embodiments, the heat source terminal further includes a third flange extending outwardly from the body portion beyond the remaining one of the first side, the second side, or an end of the body portion. For example, the first flange can extend beyond the first side, the second flange can extend beyond the second side, and the third flange can extend beyond the end of the body portion.

[0041] In some embodiments, the heat sink terminals can include a flange formed on the top surface and configured to bend downward toward the bottom surface to contact the heat sink. For example, the flange can be formed from a metal having properties (e.g., thickness, material properties, etc.) that allow the metallic flange to bend downward toward the heat sink of a device to which the heat sink component is attached. The flange can contact the heat sink of the device and, in some embodiments, can be secured to the device such that heat conducted from one or more heat source terminals through the body portion to the flange of the heat sink terminal can be conducted away from the heat sink component and into the heat sink of the device, thereby conducting heat away from the heat source.

[0042] The heat sink component can be configured to attach to a device, which can be a circuit board, a multilayer ceramic component, or other suitable electrical device. The heat sink component can have various configurations and / or features for attaching to the device. In some embodiments, the heat source terminal can include at least one lead, can include at least one pair of ribbons or leads, can be configured to be soldered to the device, and / or can include a pair of wire bond pads.

[0043] In some embodiments, the heat sink component can include at least one pair of flexible or bendable leads. In some embodiments, the at least one pair of flexible or bendable leads can extend from the heat source terminals. In some embodiments, the at least one pair of flexible or bendable leads can extend from the heat sink terminals. In some embodiments, the at least one pair of bendable leads can include a first pair of bendable leads extending from the heat source terminals and a second pair of bendable leads extending from the heat sink terminals. For example, the flexible or bendable leads can bend, flex, or otherwise deform to facilitate mounting the heat sink component over an existing component on a circuit board, etc.

[0044] In some embodiments, the heat sink terminals can be formed on the entire body surface of the body of the heat sink component. For example, the heat sink terminals can be formed on the entire bottom surface of the body, such that the heat sink terminals have a length and width coextensive with the length and width of the bottom surface, and none of the bottom surface is exposed. The heat source terminals can be formed on the body surface opposite the body surface entirely covered by the heat sink terminals, and the heat source terminals can include a pair of leads or a pair of wire bond pads for connecting to a device (e.g., a circuit board, a multilayer ceramic capacitor, or other electrical component).

[0045] The component assembly can include a device including a top surface and a plurality of terminals exposed on the top surface, and a heat sink component as described herein. The heat source terminal of the heat sink component can be connected to one of the plurality of terminals of the device, and the heat sink terminal of the heat sink component can be connected to another of the plurality of terminals of the device. In some embodiments, the device includes a circuit board. In some embodiments, the device includes a multilayer ceramic component.

[0046] In some embodiments, the heat sink component can have multiple heat source terminals, and the heat sink component can provide connections between the heat source terminals. For example, the connections can be or include direct electrical connections, such that the heat sink component acts as an interposer between the various heat source terminals. As another example, the connections can be or include thin-film components (e.g., capacitors, inductors, resistors, etc.).

[0047] For example, a first heat source terminal and a second heat source terminal can be formed on a bottom surface of the body, and a first via and a second via can be formed in the body. The first via can be connected to the first heat source terminal, and the second via can be connected to the second heat source terminal. The first and second vias can extend to a top surface of the body. A thin-film component can be formed on the top surface of the body and electrically connected between the first via in the top surface and the second via in the top surface, such that the thin-film component is electrically connected between the two heat source terminals. However, in other embodiments, a conductive trace can be formed on the top surface of the body and electrically connect the vias in the top surface, such that the heat source terminals are electrically connected together by the conductive trace.

[0048] The heat sink component may include one or more thin film components. The one or more thin film components may include one or more of resistors, varistors, capacitors, inductors, and / or combinations thereof, such as thin film filters. The thin film components may include one or more layers of conductive, dielectric, resistive, inductive, or other materials precisely formed using "thin film" technology.

[0049] As one example, the heat sink component may include a thin-film varistor. The varistor may include barium titanate, zinc oxide, or any other suitable dielectric material. Various additives may be included in the dielectric material, for example, to create or enhance the voltage-dependent resistance of the dielectric material. For example, in some embodiments, the additive may include an oxide of cobalt, bismuth, manganese, or a combination thereof. In some embodiments, the additive may include an oxide of gallium, aluminum, antimony, chromium, titanium, lead, barium, nickel, vanadium, tin, or a combination thereof. The dielectric material may be doped with an additive in the range of about 0.5 mole percent to about 3 mole percent, and in some embodiments, in the range of about 1 mole percent to about 2 mole percent. The average grain size of the dielectric material may contribute to the nonlinear properties of the dielectric material. In some embodiments, the average grain size may be in the range of about 1 micron to 100 microns, and in some embodiments, in the range of about 2 microns to 80 microns.

[0050] As another example, the thin-film component can include a thin-film resistor including one or more resistive layers. For example, the resistive layers can include tantalum nitride (TaN), nickel chromium (NiCr), tantalum aluminide, chromium silicon, titanium nitride, titanium tungsten, tantalum tungsten, oxides and / or nitrides of such materials, and / or any other suitable thin-film resistive material. The resistive layers can have any suitable thickness.

[0051] As another example, the thin-film component can include a thin-film capacitor including one or more dielectric layers. By way of example, the dielectric layer can include one or more suitable ceramic materials. Exemplary suitable materials include alumina (AlO), aluminum nitride (AlN), beryllium oxide (BeO), aluminum oxide (AlO), boron nitride (BN), silicon (Si), silicon carbide (SiC), silica (SiO), silicon nitride (SiN), gallium arsenide (GaAs), gallium nitride (GaN), zirconium dioxide (ZrO), mixtures thereof, oxides and / or nitrides of such materials, or any other suitable ceramic material. Additional exemplary ceramic materials include barium titanate (BaTiO), calcium titanate (CaTiO), zinc oxide (ZnO), ceramics containing low-fire glass, or other glass-bonded materials.

[0052] The thin film component can include one or more layers having a thickness ranging from about 0.001 μm to about 1,000 μm, in some embodiments from about 0.01 μm to about 100 μm, in some embodiments from about 0.1 μm to about 50 μm, and in some embodiments from about 0.5 μm to about 20 μm. Each layer of material forming the thin film component can be applied using specialized techniques based on etching, photolithography, PECVD (plasma-enhanced chemical vapor deposition) processing, or other techniques.

[0053] The body of a heat sink component typically has a low thermal resistivity (e.g., approximately 6.67 x 10 -3 m·°C / W), and generally high electrical resistivity (e.g., about 10 14 The material may include any suitable material having a resistivity (greater than 6.67×10 Ω·cm). -3A thermal resistivity of 1.5 m·°C / W is equivalent to a thermal conductivity of about 150 W / m·°C. In other words, suitable materials for the body of a heat sink component can generally have a high thermal conductivity, such as greater than about 150 W / m·°C.

[0054] For example, in some embodiments, the body of the heat sink component can be made from a material having a thermal conductivity between about 100 W / m·°C and about 300 W / m·°C at about 22°C. In other embodiments, the body of the heat sink component can be made from a material having a thermal conductivity between about 125 W / m·°C and about 250 W / m·°C at about 22°C. In other embodiments, the body of the heat sink component can be made from a material having a thermal conductivity between about 150 W / m·°C and about 200 W / m·°C at about 22°C.

[0055] In some embodiments, the body of the heat sink component can include aluminum nitride, beryllium oxide, aluminum oxide, boron nitride, silicon nitride, magnesium oxide, zinc oxide, silicon carbide, any suitable ceramic material, and mixtures thereof.

[0056] In some embodiments, the body of the heat sink component can include aluminum nitride. For example, in some embodiments, the body of the heat sink component can be made from any suitable composition including aluminum nitride. In some embodiments, the body of the heat sink component can be made primarily of aluminum nitride. For example, the body of the heat sink component can include additives or impurities. In other embodiments, the body of the heat sink component includes beryllium oxide. For example, in some embodiments, the body of the heat sink component can be made from any suitable composition including beryllium oxide. In some embodiments, the body of the heat sink component can be made primarily of beryllium oxide. For example, the body of the heat sink component can include additives or impurities.

[0057] 1A and 1B, the heat sink component 100 can be configured to increase or maximize contact between a heat source, a heat sink, or both, for example, to direct heat from the heat source to the heat sink. Such conduction of heat away from the heat source can help manage the temperature of a component or device that includes the heat source. For example, heat transfer from the heat source to the heat sink can help prevent overheating of the component or device that includes the heat source.

[0058] The heat sink component 100 may include a body 102 including a thermally conductive material that is electrically non-conductive. The body may define a longitudinal direction X, a lateral direction Y, and a thickness direction Z that are orthogonal to each other. The body 102 may have a plurality of body surfaces 104, including a top surface 104a, a bottom surface 104b opposite the top surface 104a along the thickness direction Z, and a plurality of side surfaces, such as a first end surface 104c, a second end surface 104d opposite the first end surface 104c along the longitudinal direction X, a first side surface 104e, and a second side surface 104f opposite the first side surface 104e along the lateral direction Y. As shown in FIGS. 1A and 1B, a plurality of side surfaces 104c, 104d, 104e, 104f extend in the thickness direction Z between the top surface 104a and the bottom surface 104b.

[0059] One or more heat source terminals 106 may be formed on at least one of the body surfaces 104 of the body portion 102. The heat source terminals 106 may be configured to connect with one or more respective electrical devices or components and conduct heat from the electrical devices or components into the heat sink component 100. In the embodiment of FIGS. 1A and 1B, the heat sink component 100 includes one heat source terminal 106 formed on the bottom surface 104b of the body portion 102. In other embodiments, a single heat source terminal 106 may be formed on the top surface 104a or one of the side surfaces 104c, 104d, 104e, and 104f. Other embodiments of the one or more heat source terminals 106 are described in more detail herein.

[0060] One or more heat sink terminals 108 may be formed on at least one of the body surfaces 104 of the body portion 102. The heat sink terminals 108 may be configured to connect with a heat sink (e.g., of a circuit board to which the heat sink component 100 is mounted). As shown in FIGS. 1A and 1B , the depicted embodiment of the heat sink component 100 includes one heat sink terminal 108 formed on the bottom surface 104 b of the body portion 102. In other embodiments, a single heat sink terminal 108 may be formed on the top surface 104 a or one of the side surfaces 104 c, 104 d, 104 e, and 104 f. Further embodiments of the one or more heat sink terminals 108 are described in more detail herein.

[0061] 1B, the heat source terminal 106 can have a heat source terminal area defined by the product of a heat source terminal length 110 and a heat source terminal width 112. The heat source terminal length 110 can extend in a longitudinal direction X defined by the body portion 102, and the heat source terminal width 112 can extend in a lateral direction Y defined by the body portion 102.

[0062] The heatsink terminal 108 may have a heatsink terminal area defined by the product of a heatsink terminal length 114 and a heatsink terminal width 116. The heatsink terminal length 114 may extend in a longitudinal direction X, and the heatsink terminal width 116 may extend in a lateral direction Y.

[0063] 1A , the bottom surface 104b can have an area defined by the product between a length 118 of the bottom surface 104b and a width 120 of the bottom surface 104b. The length 118 of the bottom surface 104b can extend in a longitudinal direction X between a first end 122 of the body portion 102 and a second end 124 of the body portion 102, the second end 124 being opposite the first end 122 in the longitudinal direction X. Furthermore, the width 120 of the bottom surface 104b can extend in a lateral direction Y between a first side 126 of the body portion 102 and a second side 128 of the body portion 102, the second side 128 being opposite the first side 126 in the lateral direction Y. As shown in FIG. 1A , the length 118 and width 120 of the bottom surface 104b are also the length and width of the body portion 102.

[0064] A ratio between the area of the bottom surface 104b and the total terminal area can be defined, where the total terminal area is the sum of the heat source terminal area and the heat sink terminal area. In some embodiments, the ratio of the area of the bottom surface 104b to the total terminal area can be less than about 2, such as less than about 1.5, less than about 1.2, less than about 1.1, less than about 1.05, or less than about 1.02.

[0065] A terminal spacing distance 130 may be defined between the heat source terminal 106 and the heat sink terminal 108. For example, the heat source terminal 106 and the heat sink terminal 108 may be spaced apart from one another in the longitudinal direction X, with the terminal spacing distance 130 defined in the longitudinal direction X and being the longitudinal gap between the heat source terminal 106 and the heat sink terminal 108.

[0066] In other embodiments, the heat source terminal 106 and the heat sink terminal 108 can be spaced apart from one another in the lateral direction Y such that a terminal spacing distance 130 is defined in the lateral direction Y, e.g., the terminal spacing distance 130 can be a lateral gap between the heat source terminal 106 and the heat sink terminal 108. For example, in some embodiments, the heat sink component 100 can have an inverted geometry, such that the heat source terminal 106 can be defined along the first side 126 of the body portion 102 rather than the first end 122, and the heat sink terminal 108 can be defined along the second side 128 of the body portion rather than the second end 124. The heat source terminal 106 and the heat sink terminal 108 can be spaced apart from one another along the lateral direction Y to define the terminal spacing distance 130.

[0067] A ratio can be defined between the length 118 of the bottom surface 104b and the terminal spacing distance 130. In some embodiments, the ratio of the length 118 of the bottom surface 104b to the terminal spacing distance 130 can be greater than about 2, such as greater than about 3, greater than about 5, greater than about 7, greater than about 10, greater than about 15, greater than about 20, greater than about 25, greater than about 30, or greater than about 35.

[0068] 1B , the heat source terminal 106 and the heat sink terminal 108 can be formed on the body surface 104, such as the bottom surface 104b, such that the body surface 104 is symmetrical about both a longitudinal centerline axis 132 extending in the longitudinal direction X and a lateral centerline axis 134 extending in the lateral direction Y. The longitudinal centerline axis 132 can be equidistant from the first side 126 and the second side 128 of the body 102. The lateral centerline axis 134 can be equidistant from the first end 122 and the second end 124 of the body 102. In some embodiments, such as the embodiment illustrated in FIGS. 1A and 1B , the lateral centerline axis 134 can bisect the terminal spacing distance 130. In other embodiments, the longitudinal centerline axis 132 can bisect the terminal spacing distance 130.

[0069] 2, the heat sink component 200 can be configured generally similar to the heat sink component 100 of FIGS. 1A and 1B. The heat sink component 200 can include a body portion 202 and a plurality of body portion surfaces 204, such as a top surface 204a, a bottom surface 204b, a first end surface 204c, a second end surface 204d, a first side surface 204e, and a second side surface 204f. A heat source terminal 206 and a heat sink terminal 208 can be formed on at least one of the body portion surfaces 204; for example, both terminals 206, 208 can be formed on the bottom surface 204b, as shown in FIG. 2. A terminal spacing distance 230 can be defined between the heat source terminal 206 and the heat sink terminal 208.

[0070] 2, the heat source terminal 206 and the heat sink terminal 208 are each spaced apart from a plurality of edges 236 that define the bottom surface 204b. For example, an edge spacing distance 238 can be defined between the heat source terminal 206 and the edge 236 of the bottom surface 204b that extends in the longitudinal direction X. As further illustrated in FIG. 2, the edge spacing distance 238 can be defined between the heat sink terminal 208 and the edge 236 of the bottom surface 204b that extends in the longitudinal direction X.

[0071] 1A and 1B , the heat sink component 300 can be configured generally similar to the heat sink component 100 of FIGS. 1A and 1B . The heat sink component 300 can include a heat source terminal 306, a heat sink terminal 308, a first end 322, a second end 324, a first side 326, and a second side 328. In the embodiment of FIG. 3 , the heat source terminal 306 and the heat sink terminal 308 each completely encase the respective ends 322, 324 of the heat sink component 300. For example, the heat source terminal 306 can be formed on each of the surfaces of the body portion 302 (the ends of which are shown in dashed lines) of the heat sink component 300, such as the top surface, bottom surface, first end surface, second end surface, first side surface, and second side surface of the body portion, and completely encase the first end 322. Similarly, the heat sink terminals 308 may be formed on each of the surfaces of the body portion of the heat sink component 300, such as the top surface, bottom surface, first end surface, second end surface, first side surface, and second side surface of the body portion, and completely enclose the second end 324.

[0072] A terminal spacing distance 330 can be defined between the heat source terminal 306 and the heat sink terminal 308. A ratio can be defined between the length of the body of the heat sink component 300 and the terminal spacing distance 330. In some embodiments, the ratio of the body length to the terminal spacing distance 330 can be greater than about 2, in some embodiments, greater than about 3, in some embodiments, greater than about 5, in some embodiments, greater than about 7, in some embodiments, greater than about 10, in some embodiments, greater than about 15, in some embodiments, greater than about 20, in some embodiments, greater than about 25, in some embodiments, greater than about 30, and in some embodiments, greater than about 35.

[0073] 4, a heat sink component 400 can be configured generally similar to the heat sink component 100 of FIGS. 1A and 1B. The heat sink component 400 can include a body portion 402 having a plurality of body surfaces 404, a heat source terminal 406, a heat sink terminal 408, a first end 422, a second end 424, a first side 426, and a second side 428. In the embodiment of FIG. 4, each of the heat source terminal 406 and the heat sink terminal 408 partially encases a respective end 422, 424 of the heat sink component 400. For example, the heat source terminal 406 can be formed on a plurality of body surfaces 404, such as a top surface, a bottom surface, and a first end surface, of the body portion 402 so as to partially encase the first end 422, as shown in FIG. 4. The heat sink terminal 408 can be formed on multiple body surfaces 404 of the body 402, such as the top surface, bottom surface, and second end surface, so as to partially encase the second end 424.

[0074] A terminal spacing distance 430 can be defined between the heat source terminal 406 and the heat sink terminal 408. A ratio can be defined between the length 418 of the body portion 402 of the heat sink component 400 and the terminal spacing distance 430. In some embodiments, the ratio of the length 418 of the body portion 402 to the terminal spacing distance 430 can be greater than about 2, in some embodiments, greater than about 3, in some embodiments, greater than about 5, in some embodiments, greater than about 7, in some embodiments, greater than about 10, in some embodiments, greater than about 15, in some embodiments, greater than about 20, in some embodiments, greater than about 25, in some embodiments, greater than about 30, and in some embodiments, greater than about 35.

[0075] 5, a heat sink component 500 can be configured generally similar to the heat sink component 100 of FIGS. 1A and 1B. The heat sink component 500 can include a body portion 502, and a plurality of heat source terminals 506 can be formed on a bottom surface 504b of the body portion 502 of the heat sink component 500. The heat sink component 500 can be configured for land grid array-type mounting, and the plurality of heat source terminals 106 can be arranged in various configurations. For example, the heat source terminals 106 can be arranged in a grid or other suitable pattern. The heat source terminals 106 can be arranged in a manner that aligns with the heat source terminals of a device (e.g., a circuit board, an electrical component, etc., such as those shown in FIGS. 10A and 10B) to which the heat sink component 500 is configured to be mounted.

[0076] As shown in Figures 6A and 6B, the heat source terminals and the heat sink terminals can be sized differently from one another, such that the terminal spacing distance is offset from the centerline axis of the body portion. More specifically, in Figures 6A and 6B, the heat sink component 600 can be configured generally similar to the heat sink component 100 of Figures 1A and 1B. The heat sink component 600 can include a body portion 602, a heat source terminal 606 formed on at least one surface 604 of the body portion 602, and a heat sink terminal 608 formed on the at least one surface 604 of the body portion 602. A terminal spacing distance 630 can be defined between the heat source terminal 606 and the heat sink terminal 608.

[0077] In the embodiment depicted in Figure 6A, the heat source terminal 606 and the heat sink terminal 608 are both formed on the bottom surface 604b of the body portion 602. In the embodiment of Figure 6B, the heat source terminal 606 completely encases the first end 622 of the body portion 602 such that the heat source terminal 606 is formed on all surfaces 604 of the body portion 602, and the heat sink terminal 608 completely encases the second end 624 of the body portion 602 such that the heat sink terminal 608 is formed on all surfaces 604 of the body portion 602.

[0078] 6A and 6B, terminal spacing distance 630 can be offset, for example, toward one end or one side of body portion 602. For example, with reference to FIG. 6A, terminal spacing distance 630 can be offset such that bottom surface 604b is asymmetric about both longitudinal centerline axis 632 and lateral centerline axis 634. With reference to FIG. 6B, terminal spacing distance 630 can be offset such that heat sink component 600 is asymmetric about both longitudinal centerline axis 632 and lateral centerline axis 634.

[0079] 6A and 6B. For example, terminal spacing distance 630 can be offset such that terminal spacing distance 630 is closer to second end 624 of body portion 602 than when lateral centerline axis 634 bisects terminal spacing distance 630, as shown in the embodiment of FIG. 1B with respect to spacing distance 130 and lateral centerline axis 134.

[0080] 7A-7F illustrate a heat sink component 700 configured generally similar to the heat sink component 100 of FIGS. 1A and 1B. The heat sink component 700 can include a body portion 702 and a plurality of body portion surfaces 704, including a top surface 704a, a bottom surface 704b, a first end surface 704c, a second end surface 704d, a first side surface 704e, and a second side surface 704f. A terminal spacing distance 730 can be defined between a heat source terminal 706 and a heat sink terminal 708 formed on at least one body portion surface 704, such as bottom surface 704b.

[0081] The heat sink terminal 708 may include at least one flange 740 extending outwardly beyond the body portion 702. For example, in some embodiments, the heat sink terminal 708 may be formed on the bottom surface 704b adjacent the second end 724 of the body portion 702. The heat sink terminal 708 may include a flange 740 extending outwardly from the body portion 702 beyond one of the first side 726, the second side 728, or the second end 724 of the body portion 702. With reference to FIGS. 7B-7D , in some embodiments, the flange 740 is a first flange 740a extending outwardly beyond the first side 726 of the body portion 702, and the heat sink terminal 708 also includes a second flange 740b extending outwardly beyond the second end 724 of the body portion 702. In some embodiments, the heat sink terminal 708 further includes a third flange 740c that extends outward from the body portion beyond the second side 728 of the body portion 702. Other numbers and configurations of flanges 740 can be used as well, such as different sized flanges, different numbers of flanges extending beyond the sides or ends of the body portion, etc.

[0082] 7E , in some embodiments, the heat-source terminal 706 may include at least one flange 742 extending outwardly beyond the body portion 702, which may be provided in addition to or without one or more flanges 740 extending from the heat-sink terminal 708. For example, the heat-source terminal 706 may be formed on the bottom surface 704 b of the body portion 702 adjacent the first end 722 of the body portion 702. The heat-source terminal 706 may include the flange 742 extending outwardly from the body portion 702 beyond one of the first side 726, the second side 728, or the first end 722, for example, outwardly beyond the first side 726 as shown in FIG. 7E . As described with respect to the heat sink terminal 708 and flange 740, in other embodiments, one or more flanges 742 can extend outward from the heat source terminal 706 beyond the body portion 702, with the one or more flanges 742 extending outward beyond a different side or end of the body portion 702 than shown in the illustrated embodiment.

[0083] 7F , in some embodiments, the flanges 740, 742 can be configured to bend or otherwise deform so as to be positioned in contact with a device or a mounting surface of the device (e.g., a circuit board, etc.). For example, the heat sink terminal 708 can be formed on the top surface 704a of the body portion 702 of the heat sink component 700, as depicted in FIG. 7F . The heat sink terminal 708 can include a flange 740 that is configured to bend downward toward the bottom surface 704b of the body portion 702 and, for example, to contact a heat sink of a device 1002 (e.g., such as those described with respect to FIGS. 10A and 10B ) to which the heat sink component 700 is mounted. For example, the flange 740 can be formed from a metal having properties (e.g., thickness, material properties, etc.) that allow the flange 740 to bend downward toward the heat sink of the device 1002. Flange 740 may contact the heat sink of device 1002 and, in some embodiments, may be secured to top surface 1004 of device 1002 using suitable fasteners 744 such that heat conducted from heat source terminal 706 through body portion 702 to flange 740 of heat sink terminal 708 may be conducted into the heat sink of the device and away from heat sink component 700, thereby conducting heat away from the heat source in contact with heat source terminal 706. Fasteners 744 may be any suitable mechanical or other type of fastener, such as screws, adhesive, solder, etc.

[0084] 7A and 7E, one or more of the flanges 740, 742 can be integrally formed with the respective terminals from which the flanges 740, 742 extend. For example, as shown in the exemplary embodiment of FIGS. 7A and 7E, the flange 740 can be integrally formed with the heat sink terminal 708, and as shown in the exemplary embodiment of FIG. 7E, the flange 742 can be integrally formed with the heat source terminal 706. In other embodiments, one or more of the flanges 740, 742 can be bonded or otherwise coupled to the respective terminals from which the flanges 740, 742 extend. For example, as shown in FIGS. 7B-7D, the flanges 740a, 740b, 740c can be coupled to the heat sink terminal 708 in any suitable manner such that the respective flanges 740 extend from the heat sink terminal 708 away from the body portion 702 of the heat sink component 700.

[0085] As described herein, the heat sink component can be configured to attach to a device, such as a circuit board, a multilayer ceramic component, or other suitable electrical device. The heat sink component can have various configurations and / or features for attachment to the device. In various embodiments, the heat source terminal can include at least one lead, can include at least one pair of ribbons or leads, can be configured to be soldered to the device, and / or can include a pair of wire bond pads.

[0086] 8A-8C, a heat sink component 800 can be configured generally similar to the heat sink component 100 of FIGS. 1A and 1B. The heat sink component 800 can include one or more leads 846 extending from a heat source terminal 806, a heat sink terminal 808, or both. The heat source terminal 806 and the heat sink terminal 808 are each formed on one or more surfaces 804 (FIG. 8C) of a body portion 802 (FIG. 8C) of the heat sink component 800. The one or more leads 846 can facilitate attachment of the heat sink component 800 to a device, for example, to an existing component on a circuit board.

[0087] As shown in Figure 8A, leads 846 extend from the heat source terminal 806, for example, for attachment to a device. With reference to Figure 8B, a first lead 846a extends from the heat source terminal 806 and a second lead 846b extends from the heat sink terminal 808. As shown in Figure 8C, a first pair of leads 846a extend from the heat source terminal 806 and a second pair of leads 846b extend from the heat sink terminal 808.

[0088] In some embodiments, one or more leads 846 can be flexible or bendable leads. For example, at least one pair of flexible or bendable leads 846 can extend from the heat source terminal 806 and / or the heat sink terminal 808. The flexible or bendable leads 846 can bend, bend, or otherwise deformed to facilitate mounting the heat sink component over an existing component on a circuit board, etc.

[0089] 9A and 9B, a heat sink component 900 can be configured generally similar to the heat sink component 100 of FIGS. 1A and 1B. The heat sink component 900 can include a body portion 902 and a heat sink terminal 908 formed over the entire body surface 904 of the body portion 902. For example, the heat sink terminal 908 can be formed over the entire bottom surface 904b of the body portion 902 such that the heat sink terminal 908 has a length 914 and a width 916 that are coextensive with the length 918 and width 920 of the body portion 902 and the bottom surface 904b. Thus, the heat sink terminal 908 covers the entire bottom surface 904b, and none of the bottom surface 904b is exposed.

[0090] The heat source terminal 906 can be formed on the body surface 904 opposite the body surface 904 that is entirely covered by the heat sink terminal 908. For example, as shown in Figures 9A and 9B, when the heat sink terminal 908 is formed on the bottom surface 904b, the heat source terminal 906 is formed on the top surface 904a, which is opposite the bottom surface 904b in the thickness direction Z. The heat source terminal 906 can include a pair of leads 946 or a pair of wire bond pads 948 for connecting to a device (e.g., a circuit board, a multilayer ceramic capacitor, or other electrical component as described herein).

[0091] Figures 10A and 10B illustrate an embodiment of a component assembly 1000 according to an aspect of the present disclosure. Figure 10A illustrates a device 1002 to which the heat sink component 100 of Figures 1A and 1B may be attached. Figure 10B illustrates the heat sink component 100 attached to the component assembly 1000 of Figure 10A.

[0092] The component assembly 1000 can include a device 1002 including a top surface 1004 and a number of terminals exposed on the top surface 1004, such as one or more heat source terminals 1006 and one or more heat sink terminals 1008.

[0093] 1A and 1B. As shown in FIG. 10B, the heat source terminal 106 of the heat sink component 100 is connected to the heat source terminal 1006 (schematically shown by a dashed-dotted line) of the device 1002, and the heat sink terminal 108 is connected to the heat sink terminal 1008 (schematically shown by a dashed-dotted line) of the device 1002.

[0094] The device 1002 may include a circuit board, a multilayer ceramic component, or other suitable electrical device. The terminals 1006, 1008 of the device 1002 may be connected to embedded devices, electrodes, or components (e.g., capacitors, resistors, inductors, etc.) within the device 1002.

[0095] 11 , in some embodiments, multiple heat sink components 1100, such as two or more heat sink components 1100, can be joined together with one or more heat sink flanges 1140 and / or one or more heat source flanges (not shown). Each heat sink component 1100 can be generally configured similarly to the heat sink component 100 of FIGS. 1A and 1B. For example, each heat sink component 1100 can include a body portion 1102 and multiple body portion surfaces 1104, such as a top surface 1104 a, a bottom surface 1104 b, a first end surface 1104 c, a second end surface 1104 d, a first side surface 1104 e, and a second side surface 1104 f. A heat source terminal 1106 can be formed on at least a portion of at least one of the body portion surfaces 1104, and a heat sink terminal 1108 can be formed on at least a portion of at least one of the body portion surfaces 1104.

[0096] 11, three heat sink components 1100 can be joined together by a first heat sink flange 1140a and a second heat sink flange 1140b, with each heat sink component 1100 having a first side surface 1104e in contact with the first heat sink flange 1140a and a second side surface 1104f in contact with the second heat sink flange 1140b. When joined together using the first heat sink flange 1140a and the second heat sink flange 1140b, the multiple heat sink components 1100 can be referred to as a heat sink component array 1103.

[0097] 11 , the heat sink components 1100 are mounted in a spaced-apart vertical orientation, with multiple heat sink components 1100 spaced apart from one another by a component spacing distance 1101. The component spacing distance 1101 can allow air to move between the heat sink components 1100 joined together by flanges 1140. In other embodiments, a single heat sink component, such as heat sink component 100, can be mounted in a vertical orientation to the heat sink of a device, such as device 1002 (e.g., as described with respect to FIGS. 10A and 10B), as shown in FIG.

[0098] 11 is provided on one side of the heat sink component array 1103. In other embodiments, two or more heat sink flanges 1140 may be provided on the same side of the heat sink component array 1103. In still other embodiments, two or more heat sink flanges 1140 may be provided with the heat sink component array 1103, with at least one heat sink flange 1140 being provided on a different side of the heat sink component array 1103 than another heat sink flange 1140.

[0099] The heat sink flange 1140, and when provided, the heat source flange, can be configured similarly to the flanges 740, 742 described herein. For example, the heat sink flange 1140 can be in contact with one or more heat sink terminals 1108 of one or more heat sink components 1100, while each heat source flange can be in contact with one or more heat source terminals 1106 of one or more heat sink components 1100. Similar to the flange 742 described with respect to FIG. 7E , the heat source flange can be configured to conduct heat from the heat source to the heat sink component 1100 and cool the heat source, e.g., by conducting heat away from the heat source through the heat sink component 1100.

[0100] Additionally, the heat sink flange 1140 and / or the heat source flange can be configured to flex or otherwise deform so as to be positioned in contact with a device or a mounting surface of the device (e.g., a circuit board, etc.). For example, the heat sink terminals 1108 can be formed on the first side surface 1104e of the body portion 1102 of each heat sink component 1100, as depicted in FIG. The first heat sink flange 1140a contacts the heat sink terminals 1108 on the first side surface 1104e of the respective heat sink component 1100, and the first heat sink flange 1140a can be configured, for example, to bend outward or away from the heat sink component 1100 generally parallel to the top and bottom surfaces 1104a and 1104b of the body portion 1102 of the respective heat sink component 1100 to contact the heat sink of the device 1002 (e.g., such as those described with reference to FIGS. 10A and 10B ) to which the heat sink component 1100 is attached. Similarly, the heat sink terminals 1108 can be formed on the second side surface 1104f of the body portion 1102 of the respective heat sink component 1100, as depicted in FIG. 11 . The second heat sink flange 1140b is in contact with the heat sink terminal 1108 on the second side surface 1104f of each heat sink component 1100, and the second heat sink flange 1140b can be configured to bend outward or away from the heat sink component 1100, for example, generally parallel to the top surface 1104a and bottom surface 1104b of the main body portion 1102 of each heat sink component 1100, to contact the heat sink of the device 1002 to which the heat sink component 1100 is attached (e.g., such as those described with reference to Figures 10A and 10B).

[0101] The heat sink flange 1140 can be formed from a metal having properties (e.g., thickness, material properties, etc.) that allow the heat sink flange 1140 to flex outward relative to the heat sink of the device 1002. The heat sink flange 1140 can contact the heat sink of the device 1002 and, in some embodiments, can be secured to the top surface 1004 of the device 1002 using suitable fasteners (not shown) such that heat conducted from the heat source terminals 1106 through the body portion 1102 of the respective heat sink component 1100 to the heat sink flange 1140 in contact with the heat sink terminal 1108 can be conducted away from the heat sink component 1100 and into the heat sink of the device, thereby conducting heat away from the heat source in contact with the heat source terminal 1106. The fasteners can be any suitable mechanical or other type of fastener, e.g., screws, adhesive, solder, etc. For example, the fasteners can be screws or the like that extend through apertures 1146 in the respective heat sink flanges 1140 .

[0102] FIG. 12 is a flowchart of a method 1200 of manufacturing a heat sink component according to an embodiment of the present disclosure. Generally, the method 1200 will be described herein with reference to the heat sink components 100, 200, 300, 400, 500, 600, 700, 800, 900, and 1100 of FIGS. 1A through 11 . However, it should be appreciated that the disclosed method 1200 may be implemented with any suitable heat sink component. Additionally, while FIG. 12 depicts steps performed in a particular order for purposes of illustration and discussion, the methods discussed herein are not limited to any particular order or arrangement. Those skilled in the art will recognize, using the disclosure provided herein, that various steps of the methods disclosed herein may be omitted, rearranged, combined, and / or adapted in various manners without departing from the scope of the present disclosure.

[0103] The method may include, at 1202, providing a body including a thermally conductive material that is electrically non-electrically conductive. The body may define orthogonal longitudinal, lateral, and thickness directions. The body may have a plurality of body surfaces, including a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction.

[0104] The method may include, at 1204, forming a heat source terminal on at least one body surface of the plurality of body surfaces.

[0105] The method may include, at 1206, forming a heat sink terminal on at least one body surface of the plurality of body surfaces and defining a terminal spacing distance along the at least one body surface between the heat source terminal and the heat sink terminal.

[0106] The ratio of the length of the at least one body surface to the terminal spacing distance may be greater than about ten.

[0107] FIG. 13 is a flowchart of a method 1300 of manufacturing a heat sink component according to an embodiment of the present disclosure. Generally, the method 1300 will be described herein with reference to the heat sink components 100, 200, 300, 400, 500, 600, 700, 800, 900, and 1100 of FIGS. 1A through 11 . However, it should be appreciated that the disclosed method 1300 may be implemented with any suitable heat sink component. Additionally, while FIG. 13 depicts steps performed in a particular order for purposes of illustration and discussion, the methods discussed herein are not limited to any particular order or arrangement. Those skilled in the art will recognize, using the disclosure provided herein, that various steps of the methods disclosed herein may be omitted, rearranged, combined, and / or adapted in various manners without departing from the scope of the present disclosure.

[0108] The method may include, at 1302, providing a body including a thermally conductive material that is electrically non-electrically conductive. The body may define orthogonal longitudinal, lateral, and thickness directions. The body may have a plurality of body surfaces, including a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction.

[0109] The method may include, at 1304, forming a heat source terminal on at least one body surface of the plurality of body surfaces.

[0110] The method may include, at 1306, forming a heat sink terminal on at least one body surface of the plurality of body surfaces.

[0111] The at least one body surface may have an area defined by the product of the length of the at least one body surface and the width of the at least one body surface. The heat source terminal may have a heat source terminal area defined by the product of the heat source terminal length and the heat source terminal width. The heat sink terminal may have a heat sink terminal area defined by the product of the heat sink terminal length and the heat sink terminal width. The sum of the heat source terminal area and the heat sink terminal area may be a total terminal area. The ratio of the area of the at least one body surface to the total terminal area may be less than 1.2.

[0112] FIG. 14 is a flowchart of a method 1400 of manufacturing a heat sink component according to an embodiment of the present disclosure. Generally, the method 1400 will be described herein with reference to the heat sink components 100, 200, 300, 400, 500, 600, 700, 800, 900, and 1100 of FIGS. 1A through 11 . However, it should be appreciated that the disclosed method 1400 may be implemented with any suitable heat sink component. Additionally, while FIG. 14 depicts steps performed in a particular order for purposes of illustration and discussion, the methods discussed herein are not limited to any particular order or arrangement. Those skilled in the art will recognize, using the disclosure provided herein, that various steps of the methods disclosed herein may be omitted, rearranged, combined, and / or adapted in various manners without departing from the scope of the present disclosure.

[0113] The method may include, at 1402, providing a body including a thermally conductive material that is electrically non-electrically conductive. The body may define orthogonal longitudinal, lateral, and thickness directions. The body may have a plurality of body surfaces, including a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction.

[0114] The method may include, at 1404, forming a heat source terminal on at least one body surface of the plurality of body surfaces.

[0115] The method may include, at 1406, forming a heat sink terminal on at least one body surface of the plurality of body surfaces and defining a terminal spacing distance along the at least one body surface between the heat source terminal and the heat sink terminal.

[0116] The terminal spacing distance may be offset from a lateral centerline axis extending along the lateral direction or from a longitudinal centerline axis extending along the longitudinal direction.

[0117] FIG. 15 is a flowchart of a method 1500 of manufacturing a heat sink component according to an embodiment of the present disclosure. Generally, the method 1500 will be described herein with reference to the heat sink components 100, 200, 300, 400, 500, 600, 700, 800, 900, and 1100 of FIGS. 1A through 11 . However, it should be appreciated that the disclosed method 1500 may be implemented with any suitable heat sink component. Additionally, while FIG. 15 depicts steps performed in a particular order for purposes of illustration and discussion, the methods discussed herein are not limited to any particular order or arrangement. Those skilled in the art will recognize, using the disclosure provided herein, that various steps of the methods disclosed herein may be omitted, rearranged, combined, and / or adapted in various manners without departing from the scope of the present disclosure.

[0118] The method may include, at 1502, providing a body including a thermally conductive material that is electrically non-electrically conductive. The body may define orthogonal longitudinal, lateral, and thickness directions. The body may have a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction.

[0119] The method may include, at 1504, forming a heat source terminal on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface.

[0120] The method may include, at 1506, forming a heat sink terminal on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface.

[0121] The heat sink terminal may include a flange that extends beyond the body portion.

[0122] FIG. 16 is a flowchart of a method 1600 of manufacturing a heat sink component according to an embodiment of the present disclosure. Generally, the method 1600 will be described herein with reference to the heat sink components 100, 200, 300, 400, 500, 600, 700, 800, 900, and 1100 of FIGS. 1A through 11 . However, it should be appreciated that the disclosed method 1600 may be implemented with any suitable heat sink component. Additionally, while FIG. 16 depicts steps performed in a particular order for purposes of illustration and discussion, the methods discussed herein are not limited to any particular order or arrangement. Those skilled in the art will recognize, using the disclosure provided herein, that various steps of the methods disclosed herein may be omitted, rearranged, combined, and / or adapted in various manners without departing from the scope of the present disclosure.

[0123] The method may include, at 1602, providing a body including a thermally conductive material that is electrically non-electrically conductive. The body may define orthogonal longitudinal, lateral, and thickness directions. The body may have a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction.

[0124] The method may include, at 1604, forming a heat source terminal on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface.

[0125] The method may include, at 1606, forming a heat sink terminal on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface.

[0126] The heat source terminals may include a pair of bendable leads.

[0127] FIG. 17 is a flowchart of a method 1700 of manufacturing a heat sink component according to an embodiment of the present disclosure. Generally, the method 1700 will be described herein with reference to the heat sink components 100, 200, 300, 400, 500, 600, 700, 800, 900, and 1100 of FIGS. 1A through 11 . However, it should be appreciated that the disclosed method 1700 may be implemented with any suitable heat sink component. Additionally, while FIG. 17 depicts steps performed in a particular order for purposes of illustration and discussion, the methods discussed herein are not limited to any particular order or arrangement. Those skilled in the art will recognize, using the disclosure provided herein, that various steps of the methods disclosed herein may be omitted, rearranged, combined, and / or adapted in various manners without departing from the scope of the present disclosure.

[0128] The method may include, at 1702, providing a body including a thermally conductive material that is electrically non-electrically conductive. The body may define orthogonal longitudinal, lateral, and thickness directions. The body may have a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction.

[0129] The method may include, at 1704, forming a heat source terminal on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface.

[0130] The method may include, at 1706, forming a heat sink terminal on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface.

[0131] The heat sink terminals may include a pair of bendable leads.

[0132] FIG. 18 is a flowchart of a method 1800 of manufacturing a heat sink component according to an embodiment of the present disclosure. Generally, the method 1800 will be described herein with reference to the heat sink components 100, 200, 300, 400, 500, 600, 700, 800, 900, and 1100 of FIGS. 1A through 11 . However, it should be appreciated that the disclosed method 1800 may be implemented with any suitable heat sink component. Additionally, while FIG. 18 depicts steps performed in a particular order for purposes of illustration and discussion, the methods discussed herein are not limited to any particular order or arrangement. Those skilled in the art will recognize, using the disclosure provided herein, that various steps of the methods disclosed herein may be omitted, rearranged, combined, and / or adapted in various manners without departing from the scope of the present disclosure.

[0133] The method may include, at 1802, providing a body including a thermally conductive material that is electrically non-electrically conductive. The body may define orthogonal longitudinal, lateral, and thickness directions. The body may have a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction.

[0134] The method may include, at 1804, forming a heat source terminal on the top surface or the bottom surface.

[0135] The method may include, at 1806, forming a heat sink terminal over the entire other of the top surface or the bottom surface.

[0136] The heat source terminals may include a pair of leads.

[0137] FIG. 19 is a flowchart of a method 1900 of manufacturing a heat sink component according to an embodiment of the present disclosure. Generally, the method 1900 will be described herein with reference to the heat sink components 100, 200, 300, 400, 500, 600, 700, 800, 900, and 1100 of FIGS. 1A through 11 . However, it should be appreciated that the disclosed method 1900 may be implemented with any suitable heat sink component. Additionally, while FIG. 19 depicts steps performed in a particular order for purposes of illustration and discussion, the methods discussed herein are not limited to any particular order or arrangement. Those skilled in the art will recognize, using the disclosure provided herein, that various steps of the methods disclosed herein may be omitted, rearranged, combined, and / or adapted in various manners without departing from the scope of the present disclosure.

[0138] The method may include, at 1902, providing a body including a thermally conductive material that is electrically non-electrically conductive. The body may define orthogonal longitudinal, lateral, and thickness directions. The body may have a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction.

[0139] The method may include, at 1904, forming a heat source terminal on the top surface or the bottom surface.

[0140] The method may include, at 1906, forming a heat sink terminal over the entire other of the top surface or the bottom surface.

[0141] The heat source terminals may include a pair of wire bond pads.

[0142] FIG. 20 is a flowchart of a method 2000 of manufacturing a heat sink component array according to an embodiment of the present disclosure. Generally, the method 2000 will be described herein with reference to the heat sink components 100, 200, 300, 400, 500, 600, 700, 800, 900, and 1100 of FIGS. 1A through 11 . However, it should be appreciated that the disclosed method 2000 may be implemented with any suitable heat sink component. Additionally, while FIG. 20 depicts steps performed in a particular order for purposes of illustration and discussion, the methods discussed herein are not limited to any particular order or arrangement. Those skilled in the art will recognize, using the disclosure provided herein, that various steps of the methods disclosed herein may be omitted, rearranged, combined, and / or adapted in various manners without departing from the scope of the present disclosure.

[0143] The method, at 2002, can include providing a plurality of heat sink components, each heat sink component having a body including a thermally conductive material that is electrically non-electrically conductive. The body can define mutually orthogonal longitudinal, lateral, and thickness directions. The body can have a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction.

[0144] The method may include, at 2004, forming a heat source terminal on at least one of a top surface, a bottom surface, a first end surface, a second end surface, a first side surface, or a second side surface of a body portion of each heat sink component of the plurality of heat sink components.

[0145] The method may include, at 2006, forming a heat sink terminal on at least one of a top surface, a bottom surface, a first end surface, a second end surface, a first side surface, or a second side surface of a body portion of each heat sink component of the plurality of heat sink components.

[0146] The method may include, at 2008, forming a heat sink flange in contact with a heat sink terminal of each heat sink component of the plurality of heat sink components.

[0147] Optionally, as shown at 2010, method 2000 may include forming a second heat sink flange in contact with a heat source terminal or a heat sink terminal of each heat sink component of the plurality of heat sink components.

[0148] The heat sink flange can join multiple heat sink components together, and the multiple heat sink components can be spaced apart from one another by a component spacing distance.

[0149] Purpose The various embodiments of the heat sink components disclosed herein can have a variety of uses.

[0150] Exemplary applications include power handling systems and monolithic microwave integrated circuits (MMICs). A heat sink component can facilitate heat flow from terminals of a device connected to the heat source terminals of the heat sink device. By way of example, electrical components suitable for various embodiments can be connected to the terminals of the heat sink component. By way of example, devices can include, for example, circuit boards (e.g., with embedded components), power amplifiers, filters, synthesizers, computer components, power supplies, and / or diodes. Specific examples of power amplifier types include gallium nitride (GaN) power amplifiers and high radio frequency amplifiers, etc. As described herein, examples of diodes that may be suitable for connection with thermal components can include diodes specifically adapted for use in lasers, among other types of diodes.

[0151] These and other modifications and variations of the present invention may be practiced by those skilled in the art without departing from the scope of the present invention. In addition, it should be understood that aspects of the various embodiments may be interchanged both in whole or in part. Moreover, those skilled in the art will recognize that the foregoing description is by way of example only and is not intended to limit the invention as further set forth in the appended claims. [Explanation of symbols]

[0152] 100 Heat Sink Components 102 Main body 104 Main body surface 104a Upper surface 104b Bottom surface 104c first end surface 104d second end surface 104e first side surface 104f second side surface 106 Heat source terminal 108 Heat sink terminal 110 Heat source terminal length 112 Heat source terminal width 114 Heatsink terminal length 116 Heatsink terminal width 118 Length of bottom surface 120 bottom surface width 122 first end 124 Second End 126 First Side 128 Second Side 130 Terminal spacing 132 longitudinal centerline axis 134 Lateral Centerline Axis 200 Heat Sink Components 202 Main body 204 Main body surface 204a Upper surface 204b Bottom surface 204c first end surface 204d second end surface 204e first side surface 204f second side surface 206 Heat source terminal 208 Heat sink terminal 210 Heat source terminal length 212 Heat source terminal width 214 Heatsink terminal length 216 Heatsink terminal width 230 Terminal spacing 236 Edge 238 Edge Spacing Distance 300 Heatsink Components 302 Main body 306 Heat source terminal 308 Heatsink terminal 322 first end 324 Second End 326 First Side 328 Second Side 330 Terminal spacing 400 Heatsink Components 402 Main body 404 Main body surface 406 Heat source terminal 408 Heatsink terminal 422 First End 424 Second End 426 First Side 428 Second Side 430 Terminal spacing 500 Heatsink Components 502 Main body 504 Main body surface 504a Upper surface 504b bottom surface 504c first end surface 504d second end surface 504e first side surface 504f second side surface 506 Heat source terminal 508 Heatsink terminal 514 Heatsink terminal length 516 Heatsink terminal width 530 Terminal spacing 600 Heatsink Components 602 Main body 604 Main body surface 604a Upper surface 604b bottom surface 604c first end surface 604d second end surface 604e first side surface 604f second side surface 606 Heat source terminal 608 Heatsink terminal 622 first end 624 Second End 626 First Side 628 Second Side 630 Terminal spacing 632 Longitudinal centerline axis 634 Lateral Centerline Axis 700 Heatsink Components 702 Main body 704 Main body surface 704a Upper surface 704b bottom surface 704c first end surface 704d second end surface 704e first side surface 704f second side surface 706 Heat source terminal 708 Heatsink terminal 722 First End 724 Second End 726 First Side 728 Second Side 730 Terminal spacing 740 flange 740a First flange 740b Second flange 740c Third Flange 742 flange 800 Heatsink Components 802 Main body 804 Main body surface 804a Top surface 804b bottom surface 804c first end surface 804d second end surface 804e first side surface 804f second side surface 806 Heat source terminal 808 Heatsink terminal 822 first end 824 Second End 826 First Side 828 Second Side 830 Terminal spacing 846 leads 846a First Lead 846b Second Lead 900 Heatsink Components 902 Main body 904 Main body surface 904a Upper surface 904b bottom surface 904c first end surface 904d second end surface 904e first side surface 904f second side surface 906 Heat source terminal 908 Heatsink terminal 914 length 916 width 918 length 920 width 922 first end 924 Second End 926 First Side 928 Second Side 946 leads 948 Wire Bond Pad 1002 devices 1004 Upper surface 1006 Heat source terminal 1008 Heat sink terminal 1100 Heat Sink Components 1101 Component Spacing Distance 1102 Main body 1103 Heatsink Component Array 1104 Main body surface 1104a Upper surface 1104b Bottom surface 1104c first end surface 1104d second end surface 1104e first side surface 1104f second side surface 1106 Heat source terminal 1108 Heat sink terminal 1140 Heatsink flange 1140a First heat sink flange 1140b Second heat sink flange 1146 Aperture X Longitudinal direction Y horizontal direction Z thickness direction

Claims

1. 1. A heat sink component comprising: a body comprising a thermally conductive material that is electrically non-electrically conductive, the body defining mutually perpendicular longitudinal, lateral, and thickness directions, the body having a plurality of body surfaces including a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction; a heat source terminal formed on at least one of the plurality of body surfaces; a heat sink terminal formed on the at least one body surface of the plurality of body surfaces; Including, a terminal spacing distance defined along the at least one body surface between the heat source terminal and the heat sink terminal; The heat sink component, wherein a ratio of the length of the at least one body surface to the terminal spacing distance is greater than about 10.

2. the at least one body surface has an area defined by the product of the length of the at least one body surface and a width of the at least one body surface; the heat source terminal has a heat source terminal area defined by the product of a heat source terminal length and a heat source terminal width; the heatsink terminal has a heatsink terminal area defined by the product of a heatsink terminal length and a heatsink terminal width; the sum of the heat source terminal area and the heat sink terminal area is a total terminal area; The heat sink component of claim 1 , wherein a ratio of the area of the at least one body surface to the total terminal area is less than 1.

2.

3. The heat sink component of claim 1 , wherein the at least one body surface is the bottom surface.

4. The heat sink component of claim 1 , wherein the at least one body surface is the top surface.

5. the body portion has a first end spaced apart from a second end along the longitudinal direction; the heat source terminal encases the first end such that the heat source terminal is formed on at least the top surface, the bottom surface, and the first end surface; 2. The heat sink component of claim 1, wherein the heat sink terminal encases the second end such that the heat sink terminal is formed on at least the top surface, the bottom surface, and the second end surface.

6. the at least one body surface is the bottom surface, and the heat source terminal is spaced apart from each of the first end surface, the second end surface, the first side surface, and the second side surface; The heat sink component comprises: one or more additional heat source terminals formed on the bottom surface, each additional heat source terminal of the one or more additional heat source terminals being spaced apart from the first end surface, the second end surface, the first side surface, and the second side surface; The heat sink component of claim 1 further comprising:

7. The heat sink component of claim 1 , wherein the terminal spacing distance is defined in the longitudinal direction.

8. The heat sink component of claim 1 , wherein the terminal spacing distance is defined by the lateral direction.

9. 2. The heat sink component of claim 1, wherein the heat source terminal and the heat sink terminal are formed on the at least one body surface such that the at least one body surface is symmetrical about both the longitudinal centerline axis extending in the longitudinal direction and the lateral centerline axis extending in the lateral direction.

10. The heat sink component of claim 9 , wherein the lateral centerline axis bisects the terminal spacing distance.

11. The heat sink component of claim 9 , wherein the longitudinal centerline axis bisects the terminal spacing distance.

12. The heat sink component of claim 1 , wherein the terminal spacing distance is offset from the laterally extending lateral centerline axis.

13. The heat sink component of claim 1 , wherein the terminal spacing distance is offset from the longitudinally extending centerline axis.

14. 2. The heat sink component of claim 1, wherein the at least one body surface is the bottom surface, the heat sink terminal is disposed adjacent the second end surface, and the heat sink terminal includes a first flange extending beyond one of the first side surface, the second side surface, or the second end surface.

15. The heat sink component of claim 14 , wherein the heat sink terminal includes a second flange extending beyond another of the first side surface, the second side surface, or the second end surface.

16. 16. The heat sink component of claim 15, wherein the heat sink terminal includes a third flange extending beyond the remaining one of the first side surface, the second side surface, or the second end surface.

17. The heat sink component of claim 1 , wherein the heat source terminal includes at least one flange.

18. The heat sink component of claim 1 , wherein the heat source terminals include at least one pair of leads.

19. The heat sink component of claim 1 , further comprising at least one pair of bendable leads extending from the heat source terminals.

20. The heat sink component of claim 1 , further comprising at least one pair of bendable leads extending from said heat sink terminals.

21. The heat sink component of claim 1 , further comprising a first pair of bendable leads extending from the heat source terminals and a second pair of bendable leads extending from the heat sink terminals.

22. The heat sink component of claim 1 , comprising a material having a thermal conductivity of about 150 W / m·°C to about 300 W / m·°C at about 22°C.

23. 1. A heat sink component comprising: a body comprising a thermally conductive material that is electrically non-electrically conductive, the body defining mutually perpendicular longitudinal, lateral, and thickness directions, the body having a plurality of body surfaces including a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction; a heat source terminal formed on at least one of the plurality of body surfaces; a heat sink terminal formed on the at least one body surface of the plurality of body surfaces; Including, the at least one body surface has an area defined by the product of a length of the at least one body surface and a width of the at least one body surface; the heat source terminal has a heat source terminal area defined by the product of a heat source terminal length and a heat source terminal width; the heatsink terminal has a heatsink terminal area defined by the product of a heatsink terminal length and a heatsink terminal width; the sum of the heat source terminal area and the heat sink terminal area is a total terminal area; A heat sink component, wherein the ratio of the area of the at least one body surface to the total terminal area is less than 1.

2.

24. 1. A component assembly comprising: a device including a top surface and a plurality of terminals exposed above said top surface; Heat sink components and Including, The heat sink component comprises: a body comprising a thermally conductive material that is electrically non-electrically conductive, the body defining mutually perpendicular longitudinal, lateral, and thickness directions, the body having a plurality of body surfaces including a top surface, a bottom surface opposite the top surface along the thickness direction, a first end surface, a second end surface opposite the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite the first side surface along the lateral direction; a heat source terminal formed on at least one of the plurality of body surfaces; a heat sink terminal formed on the at least one body surface of the plurality of body surfaces; Including, a terminal spacing distance defined along the at least one body surface between the heat source terminal and the heat sink terminal; a ratio of the length of the at least one body surface to the terminal spacing distance is greater than about 10; A component assembly, wherein the heat source terminal is connected to one of the plurality of terminals of the device and the heat sink terminal is connected to another of the plurality of terminals of the device.

Images