Method for controlling fluid flow

Abstract

Systems for processing articles are essential in semiconductor manufacturing. In one method for controlling gas flow, a processing system is provided having first and second fluid sources. The first fluid source is coupled to a first flow controller, and the second fluid source is connected to a second flow controller. The first process fluid is then delivered to a process chamber through an outlet of the first flow controller. The first process fluid is also bled through a bleed port of the first flow controller. The flow rate of the first process fluid through the bleed port is controlled to a first flow rate that is lower than a first threshold value.

Description

[Technical Field]

[0001] (CROSS-REFERENCE TO RELATED APPLICATIONS) This application claims priority to U.S. Provisional Application No. 63 / 397,020, filed August 11, 2022, which is incorporated herein by reference in its entirety.

[0002] Mass flow control is one of the key technologies used in semiconductor chip manufacturing. Mass flow controllers are important for delivering known flow rates of process gases and liquids in semiconductor manufacturing and other industrial processes. Such devices are used to measure and precisely control fluid flow in a variety of applications. In a given manufacturing tool, the manufacturing tool's processing system incorporates a variety of flow-control devices to deliver various liquids and gases. As a result, efficient gas and liquid handling is essential for modern semiconductor manufacturing equipment. [Background technology]

[0003] As chip manufacturing technology improves, so too does the demand for flow control devices. Semiconductor manufacturing processes increasingly require improved performance, a wider range of flow capabilities, an increased number of process gases and liquids, and more compact installation of required equipment. Improving the gas and liquid handling of various flow control devices is desirable to increase performance in less space and at lower cost while avoiding undesirable chemical reactions. Summary of the Invention

[0004] The present technology relates to methods for controlling fluid flow in systems for processing articles such as semiconductors. In other embodiments, the technology relates to systems for controlling the flow of process fluids. In yet other embodiments, the technology relates to systems for transporting process fluids. In other embodiments, the technology relates to apparatus for controlling the flow of process fluids. The systems, methods, and apparatus of the present invention can be used in a wide range of processes, such as semiconductor chip manufacturing, solar panel manufacturing, etc.

[0005] In one embodiment, the present invention is a method for controlling fluid flow. In a first step, a processing system is provided. The processing system includes a first fluid supply configured to supply a first process fluid and a second fluid supply configured to supply a second process fluid. The first fluid supply is fluidly coupled to an inlet of a first flow controller, and the second fluid supply is fluidly coupled to a second flow controller. In a second step, the first process fluid is delivered to a processing chamber fluidly coupled to an outlet of the first flow controller. In a third step, the first process fluid is discharged at a first flow rate less than a first threshold to a vent manifold fluidly coupled to a bleed port of the first flow controller.

[0006] In another embodiment, the present invention is a method for controlling fluid flow. In a first step, a processing system is provided. The processing system includes a first fluid supply configured to supply a first process fluid and a second fluid supply configured to supply a second process fluid. The first fluid supply is fluidly coupled to an inlet of a first flow controller, and the second fluid supply is fluidly coupled to a second flow controller. In a second step, the first process fluid is delivered to a processing chamber fluidly coupled to an outlet of the first flow controller. In a third step, the first process fluid is discharged at a first flow rate to a vent manifold fluidly coupled to a bleed port of the first flow controller, while simultaneously discharging a second process fluid at a second flow rate to a vent manifold fluidly coupled to a bleed port of the second flow controller, thereby controlling a concentration of the first process fluid in the vent manifold below a second threshold.

[0007] In one embodiment, the present invention is a method for controlling fluid flow. In a first step, a processing system is provided. The processing system includes a first fluid supply configured to supply a first process fluid and a second fluid supply configured to supply a second process fluid. The first fluid supply is fluidly coupled to an inlet of a first flow controller, and the second fluid supply is fluidly coupled to a second flow controller. In a second step, the first process fluid is discharged at a first flow rate to a vent manifold fluidly coupled to a bleed port of the first flow controller, thereby reducing the concentration of the first process fluid in the vent manifold below a second threshold. In a third step, the first process fluid is delivered to a processing chamber fluidly coupled to an outlet of the first flow controller.

[0008] Further areas of applicability of the present technology will become apparent from the detailed description provided below. It should be understood that the detailed description and specific examples, while indicating the preferred embodiment, are intended for purposes of illustration only and are not intended to limit the scope of the technology. [Brief explanation of the drawings]

[0009] The invention of the present application will become more fully understood from the detailed description and the accompanying drawings, wherein:

[0010] [Figure 1] 1 is a schematic diagram of a processing system for manufacturing semiconductor devices utilizing one or more flow control devices.

[0011] [Figure 2] 2 is a schematic diagram of a mass flow controller, which is one of the flow control devices that can be used in the process of FIG. 1.

[0012] [Figure 3] FIG. 2 is a block diagram illustrating a control system that can be used in the system of FIG. 1.

[0013] [Figure 4] FIG. 2 is a perspective view of a multiple flow control device and manifold system that can be used in the system of FIG. 1.

[0014] [Figure 5] 2 is a perspective view of a mass flow controller and a portion of a manifold system, the mass flow controller being one of the flow control devices utilized in the system of FIG. 1;

[0015] [Figure 6] FIG. 6 is a bottom perspective view of a portion of the mass flow controller and manifold system of FIG.

[0016] [Figure 7] FIG. 6 is a left side view of the mass flow controller and portion of the manifold system of FIG.

[0017] [Figure 8] FIG. 6 is a right side view of the mass flow controller and portion of the manifold system of FIG.

[0018] [Figure 9]FIG. 6 is a front view of a portion of the mass flow controller and manifold system of FIG.

[0019] [Figure 10] FIG. 6 is a rear view of a portion of the mass flow controller and manifold system of FIG. 5.

[0020] [Figure 11] FIG. 6 is a top view of a portion of the mass flow controller and manifold system of FIG.

[0021] [Figure 12] FIG. 6 is a bottom view of the mass flow controller and portion of the manifold system of FIG. 5.

[0022] [Figure 13] 10 is a cross-sectional view of the mass flow controller and manifold system portion of FIG. 9 taken along line XIII-XIII.

[0023] [Figure 14] FIG. 2 is a schematic diagram of another exemplary processing system.

[0024] [Figure 15] 1 is a flowchart illustrating a first method of controlling fluid flow.

[0025] [Figure 16] 10 is a flow chart illustrating a second method for controlling fluid flow. DETAILED DESCRIPTION OF THE INVENTION

[0026] The description of illustrative embodiments according to the principles of the present invention is intended to be read in conjunction with the accompanying drawings, which are to be considered part of the entire description. In describing the embodiments of the present invention disclosed herein, references to directions or positions are for convenience of description only and are not intended to limit the scope of the invention. Relative terms such as "lower," "upper," "horizontal," "vertical," "upper," "below," "top," "bottom," and derivatives thereof (e.g., "horizontally," "downward," "upward," etc.) should be interpreted as referring to directions then described or shown in the drawings under discussion. These relative terms are for convenience of description only and do not require that the device be constructed or operated in a particular orientation, unless expressly stated. Terms such as "mounted," "fixed," "connected," "coupled," "interconnected," and the like refer to relationships in which structures are fixed or attached to one another, directly or indirectly through intervening structures, and both movable and fixed attachment relationships, unless expressly stated otherwise. Furthermore, features and advantages of the present invention will be described with reference to preferred embodiments. Therefore, the present invention should not be expressly limited to preferred embodiments illustrating certain non-limiting combinations of features that may exist alone or in combination with other features, and the scope of the present invention is defined by the claims appended hereto.

[0027] The present invention relates to a system for processing articles that includes a device for controlling fluid flow. In some embodiments, the device can function as a mass flow controller for delivering a known mass flow rate of gas or liquid to a semiconductor or similar process. Semiconductor manufacturing is an industry that requires high performance in controlling fluid flow. As semiconductor manufacturing technology advances, customers recognize the need for flow control devices that provide increased accuracy and repeatability in the flow rate of delivered fluids. Additionally, flow control devices are becoming more complex, utilizing more sophisticated configurations requiring the delivery and removal of various process fluids. The system utilizes a standardized manifold configuration, allowing for rapid assembly and maintenance of the system for processing articles.

[0028] FIG. 1 shows a schematic diagram of an exemplary processing system 1000 for processing an article. The processing system 1000 may utilize multiple flow control devices 100 fluidly coupled to a processing chamber 1300. Each of the multiple flow control devices 100 has a fluid supply 1010 fluidly coupled thereto, each supplying a process fluid to the respective flow control device 100. If desired, multiple fluid supplies 1010 may be fluidly coupled to a single flow control device 100, or multiple flow control devices 100 may be fluidly coupled to a single fluid supply 1010. Each fluid supply 1010 may supply a different process fluid, or some of the fluid supplies 1010 may supply a single process fluid.

[0029] The multiple flow controllers 100 are used to supply one or more different process fluids to a processing chamber 1300 via an outlet manifold 400. Articles such as semiconductors can be processed in the processing chamber 1300. The valves 1100 isolate the flow controllers 100 from the processing chamber 1300, allowing the flow controllers 100 to be selectively connected or disconnected from the processing chamber 1300. The processing chamber 1300 includes one or more applicators for applying the process fluids supplied by the multiple flow controllers 100, allowing the fluids supplied by the multiple flow controllers 100 to be selectively or divergently distributed.

[0030] Additionally, the processing system 1000 may further include a vacuum source 1200 separated from the processing chamber 1300 by a valve 1100 to allow for evacuation of process fluids or to facilitate purging of one or more flow control devices 100 and switching between process fluids within the same flow control device 100. Each of the flow control devices 100 includes an individual bleed port coupled to a vent manifold 500, which is connected to the vacuum source 1200 via the valve 1100. Alternatively, the flow controllers 100 may be mass flow controllers, flow splitters, or other devices that control the flow of process fluids within a processing system. Furthermore, the valve 1100 may be integrated into the flow control device 100, if desired. In some embodiments, this may eliminate the need for certain other valves 1100 within the processing system 1000.

[0031] Processes that can be performed in the processing system 1000 can include wet cleaning, photolithography, ion implantation, dry etching, atomic layer etching, wet etching, plasma ashing, rapid thermal annealing, furnace annealing, thermal oxidation, chemical vapor deposition, atomic layer deposition, physical vapor deposition, molecular beam epitaxy, laser lift-off, electrochemical deposition, chemical mechanical polishing, wafer testing, or other processes that use controlled amounts of process fluids.

[0032] 2 shows a schematic diagram of a mass flow controller 101, one type of flow control device 100 that may be used in a processing system 1000. The mass flow controller 101 has a fluid source 1010 of process fluid fluid fluid coupled to an inlet 104. The inlet 104 is fluidly coupled to a proportional valve 120, which may vary the mass and volume of the process fluid flowing through the proportional valve 120. The proportional valve 120 measures the mass flow rate of the process fluid flowing to a P1 volume 106. The proportional valve 120 may provide proportional control of the process fluid without having to be fully open or fully closed, but instead may assume intermediate states such that the mass flow rate of the process fluid may be controlled.

[0033] The P1 volume 106 is fluidly coupled to the proportional valve 120, and the P1 volume 106 is the sum of all volumes within the mass flow controller 101 between the proportional valve 120 and the flow restrictor 160. The pressure transducer 130 is fluidly coupled to the P1 volume 106 and can measure the pressure within the P1 volume 106. The shut-off valve 150 is disposed between the flow restrictor 160 and the proportional valve 120 and can be used to completely stop the flow of process fluid from the P1 volume 106. Alternatively, the flow restrictor 160 can be disposed between the shut-off valve 150 and the proportional valve 120 in another configuration. The flow restrictor 160 is fluidly coupled to the outlet 110 of the mass flow controller 101. In a processing system, the outlet 110 is fluidly coupled to a valve 1100 or directly coupled to a processing chamber 1300. In this embodiment, the flow restrictor 160 is disposed between the shut-off valve 150 and the outlet 110. In another embodiment, the isolation valve 150 is located between the flow restrictor 160 and the outlet 110. Thus, the locations of the isolation valve 150 and the flow restrictor 160 may be reversed.

[0034] Finally, a bleed valve 180 is coupled to the P1 volume 106 and a bleed port 190. In this example, the bleed valve 180 is a proportional valve. The bleed valve 180 may also be an on / off valve or other type of valve suitable for controlling fluid flow. Alternatively, a second flow restrictor 160 may be incorporated between the P1 volume and the bleed port 190. Using a proportional valve as the bleed valve 180 can control the flow rate of fluid through the bleed port 190. A characterized restrictor 160 can help improve control of the fluid flow rate, regardless of whether the bleed valve 180 is a proportional valve or an on / off valve. The flow rate of fluid passing through the bleed valve 180 is preferably characterized so that a flow rate can be estimated corresponding to a predetermined state of the bleed valve 180.

[0035] The first shut-off valve 150 includes a valve seat and a closure member. When the apparatus 100 is supplying process fluid, the first shut-off valve 150 is in an open position, and the valve seat and the closure member are not in contact. This allows the process fluid to flow, with minimal restriction to the fluid flow. When the first shut-off valve 150 is in a closed position, a spring biases the closure member and the valve seat into contact, stopping the flow of process fluid through the first shut-off valve 150.

[0036] The flow restrictor 160 is used in combination with the proportional valve 120 to meter the flow rate of a process fluid. In most embodiments, the flow restrictor 160 provides a predetermined restriction to the flow of the fluid. A first characterized flow restrictor 160 is selected to have a specific flow impedance and is capable of flowing a given mass flow rate of the process fluid within a desired range. The flow restrictor 160 provides a greater resistance to flow than the passages upstream and downstream of the flow restrictor 160.

[0037] Alternatively, the mass flow controller 101 includes one or more P2 pressure transducers downstream of the flow restrictor 160 and the shut-off valve 150. The P2 pressure transducers are used to measure the pressure difference across the flow restrictor 160. In some embodiments, the P2 pressure downstream of the flow restrictor 160 is obtained from another device 100 connected to the process chamber, and the reading is communicated to the mass flow controller 101.

[0038] Alternatively, a temperature sensor can be used to further increase the accuracy of the mass flow controller 101. The temperature sensor can be mounted near the P1 volume 106 in the base of the mass flow controller 101. Additional temperature sensors can be used in a variety of locations, including near the proportional valve 120, the pressure transducer 130, the isolation valve 150, and the bleed valve 180.

[0039] Referring to FIG. 3, a block diagram illustrates the controller 250 of the processing system 1000 of FIG. 1. The block diagram illustrates the device controller 260 and the system controller 200. The device controller 260 provides all control functions for the device 100, which controls the flow within the processing system 1000. The device controller 260 includes a communication interface 262, a proportional valve controller 264, a pressure transducer interface 266, an on / off valve controller 268, a temperature sensor interface 270, a processor 272, and a memory 272. The communication interface 262 is configured to provide a communication link between the device controller 260 and the system controller 200. Alternatively, if the additional accuracy provided by a temperature sensor is not required, the temperature sensor interface 270 can be omitted. Alternatively, a single sensor controller 260 can be operated, or the sensor interface 260 can include a dedicated device controller 260, with each device controller 260 communicating with the system controller 200 and the other device controllers 260 via a communication bus 276.

[0040] The system controller 200 includes a corresponding communication interface 210, a processor 222, and a memory 224. The system controller 200 coordinates all high-level functions necessary to execute the desired process. The communication interface 210 of the system controller 200 sends and receives commands via a communication bus 276. The communication bus 276 connects to the communication interfaces 262 of the equipment controllers 260. The communication bus 276 can connect the system controller 200 to a single equipment controller 200 or to multiple equipment controllers 200, with each equipment controller 200 operating a separate device for controlling the flow 100. Not all equipment controllers 200 need to control gas flow controllers 100; instead, they may control other types of process equipment. Furthermore, multiple communication buses 276 can exist to connect all devices necessary to execute the desired process. In other embodiments, the communication bus 276 can be replaced by multiple direct communication links between the individual controllers 200, 260.

[0041] FIG. 4 shows a perspective view of multiple flow control devices 100 and a manifold system 300. As shown, six devices 100 are arranged side by side. In this example, each device 100 is a mass flow controller 101, although each device 100 may be a different device. Furthermore, not all mass flow controllers 101 need be identical; some may support different fluids, different ranges of flow rates, or other variations necessary to implement a desired process. As shown, the mass flow controllers 101 are attached to a manifold system 300.

[0042] 5-13 show in more detail portion 301 of manifold system 300 and a single mass flow controller 101. This portion 301 provides the mounting features necessary for mounting mass flow controllers 101 or other devices 100 in a standardized configuration. Manifold system 300 consists of both a vacuum manifold and an outlet manifold.

[0043] Referring to FIG. 13, a cross section of a mass flow controller 101 and a portion 301 of a manifold system 300 are shown. The mass flow controller 101 includes a base 103, which is comprised of a first portion 105 and a second portion 107. In some embodiments, the base 103 is one piece and monolithic, while in other embodiments, the base 103 can be formed from two or more portions. The base 103 includes an inlet 104 and an outlet 110, with a flow path extending from the inlet 104 to the outlet 110. The inlet 104 is fluidly coupled to the fluid source 102, as described above. Process fluid flows along the flow path from the inlet 104 to the outlet 110, with the inlet 104 referred to as upstream and the outlet 110 referred to as downstream, which is the normal direction of fluid flow during operation of the mass flow controller 101. Both the inlet 104 and the outlet 110 lie in a plane MM that passes through the center of the mass flow controller 101, as shown in FIGS. 5-12.

[0044] Inlet 104 is fluidly coupled to inlet control valve 151, which serves to control the flow of fluid to mass flow controller 101. The primary function of inlet control valve 151 is to ensure that mass flow controller 101 is shut off for maintenance, service, calibration, etc. Inlet control valve 151 can be operated manually or automatically. In some embodiments, inlet control valve 151 may be omitted.

[0045] Fluid flows from the inlet control valve 151 to the proportional valve 120. The proportional valve 120 includes a valve seat 122 and a closure member 121. The proportional valve is configured to transition from a closed state to an open state, and to any intermediate position between the open and closed states. This allows for a variable volumetric flow rate of gas or liquid through the proportional valve 120. Downstream of the proportional valve 120 is a restrictor 160 characterized as a shutoff valve 150. As discussed above, the shutoff valve 150 can be located upstream or downstream of the restrictor 160. In this embodiment, the volume between the proportional valve 120 and the restrictor 160 is referred to as the P1 volume 106. The P1 volume 106 comprises all of the volume in the flow path between the valve seat of the proportional valve 120 and the restrictor 160.

[0046] The bleed valve 180 and the P1 pressure transducer 130 are fluidly coupled to the P1 volume 106 between the proportional valve 120 and the characterized restrictor 160. The bleed valve 180 includes a closure member and a valve seat. The P1 pressure transducer 130 measures the pressure of the fluid in the P1 volume 106. The bleed valve 180 is configured to discharge fluid from the P1 volume 106 to a bleed port 190. The bleed port 190 is connected to a vent manifold 500 to discharge the process fluid.

[0047] The characterized restrictor 160, as described above, is positioned downstream of the shut-off valve 150 and upstream of the outlet 110. The characterized restrictor 160 is configured to restrict fluid flow, thereby creating a pressure differential between the P1 volume 106 and the P2 volume 111. The P2 volume 111 comprises the volume of the flow path between the characterized restrictor 160 and the outlet 110. The P2 volume 111 is fluidly coupled to the P2 pressure transducer 132, which measures the pressure of the fluid within the P2 volume 111. The restriction to fluid flow of the characterized restrictor 160 is also referred to as the flow impedance, and the flow impedance is sufficiently high so that the pressure drop across the characterized restrictor 160 can be measured using the P1 and P2 pressure transducers 130, 132.

[0048] In some embodiments, the characterized restrictor 160 may be located upstream of the isolation valve 150. In some embodiments, the characterized restrictor 160 may be located at least partially within the isolation valve 150. In still other embodiments, the isolation valve 150 may be omitted. In certain embodiments, the P1 and P2 pressure transducers 130, 132 may also be omitted. In still other embodiments, one or more of the P0, P1, and P2 pressure transducers 131, 130, 132 are differential pressure sensors and are fluidly coupled to one or more of the P0, P1, and P2 volumes 109, 106, 111 to enable differential pressure measurements between the P0, P1, and P2 volumes 109, 106, 111.

[0049] Returning to bleed valve 180 and bleed port 190, it can be seen that bleed valve 180 controls flow through a bleed passage 181 that connects bleed valve 180 and bleed port 190. This bleed passage 181 can take any necessary path to reach mounting portion 112. Mounting portion 112 forms part of base 103 and has a surface 114 that includes bleed port 190 and outlet 110. In a preferred embodiment, surface 114 of mounting portion 112 is flat. Mounting portion 112 allows mass flow controller 101 to be connected to portion 301 of manifold system 300.

[0050] Portion 301 of manifold system 300 is comprised of portion 501 of vent manifold 500 and portion 401 of outlet manifold 400. Portion 301 of manifold system 300 further includes mounting substrate 310, which provides a mechanical connection location with mounting portion 112 of mass flow controller 101. Mounting substrate 310 provides both structural strength and rigidity to mass flow controller 101, ensuring a robust fluid connection between the two components. Mounting portion 112 of mass flow controller 101 is configured to engage mounting substrate 310 to fluidly couple outlet 110 and bleed port 190 to vent manifold 500 and outlet manifold 400. Surface 114 of mounting portion 112 incorporates features necessary to ensure that bleed port 190 and outlet 110 are properly sealed, ensuring a liquid and / or gas tight connection between mounting portion 112 and mounting substrate 310. These features may include recesses or other features necessary to provide space for sealing features, seals, or other components that provide a fluid-tight connection.

[0051] FIG. 14 illustrates an exemplary processing system 2000. Processing system 2000 is similar to processing system 1000, except as described herein. The processing system includes an inert fluid source 1010 that supplies an inert process fluid. This can be an inert liquid or an inert gas. Examples include inert gases such as nitrogen, argon, and helium, or noble gases. Thus, the inert fluid source 1010 supplies a chemically inert fluid. Processing system 2000 also includes two reactive fluid sources 1011. Each reactive fluid source 1011 supplies a reactive fluid, such as hydrofluoric acid, hydrochloric acid, oxygen, or other reactive liquids or gases, as needed. The reactive fluid sources 1011 do not necessarily supply the same reactive fluid; preferably, each supplies a different reactive fluid. Depending on the processing conditions, there may be one or more inert fluid sources 1010 and two or more reactive fluid sources 1011. In yet other embodiments, the inert fluid source 1010 may provide a chemically reactive fluid that does not chemically react with the reactive fluid source 1011. In other words, mixing fluid from the inert fluid source 1010 will not result in a reaction with this fluid of the reactive fluid source 1011, but the fluid from the inert fluid source 1010 will react with other fluids or materials.

[0052] The processing system 2000 comprises a plurality of flow control devices 100, an outlet manifold 400, a vent manifold 500, and a plurality of valves 1100 used to selectively isolate the outlet manifold 400 and the vent manifold 500 from the processing chamber 1300 and the vacuum source 1200. In yet other embodiments, some of the flow control devices 100 may be coupled exclusively to the outlet manifold 400 or the vent manifold 500. Thus, it is contemplated that one of the flow control devices 100 may be coupled exclusively to the outlet manifold 400. It is also contemplated that one of the flow control devices 100 may be coupled exclusively to the vent manifold 500. In some embodiments, the flow control device 100 that supplies the inert fluid from the inert fluid source 1010 may be coupled exclusively to the vent manifold 500.

[0053] 15 illustrates a method for controlling fluid flow using a processing system 2000. First, a processing system 2000 is provided, configured to supply a first process fluid from a first reactive fluid source 1011 to the inlet 104 of a first flow control device 100. The processing system 2000 is also configured to supply a second process fluid from a first inert fluid source 1010 to the inlet 104 of a second flow control device 100. Each of the first and second devices 100 has an outlet 110 fluidly connected to an outlet manifold 400 and a bleed port 190 fluidly connected to a vent manifold 500. The outlet manifold 400 is fluidly coupled to a processing chamber 1300, while the vent manifold 500 is fluidly coupled to a vacuum source 1200. Preferably, the first process fluid is reactive and the second process fluid is inert.

[0054] After providing the processing system 2000, a first process fluid is delivered to the processing chamber 1300. The first process fluid flows from the inlet 104 to the outlet 110 through the first flow controller 100 and through the outlet manifold 400 to the processing chamber 1300. Alternatively, the first process fluid can be flowed to the processing chamber 1300 at a predetermined mass flow rate or volumetric flow rate, depending on the process requirements and the capabilities of the flow controller 100. The first process fluid then exhausts from the first flow controller 100 through the bleed port 190 to the vent manifold 500 and further to the vacuum source 1200.

[0055] The first process fluid is preferably discharged at a first flow rate to maintain a concentration of the first process fluid in the vent manifold 500. Preferably, the first flow rate is below a first threshold and the concentration is below a second threshold. The first and second thresholds are selected to minimize the risk of undesired reactions between the first process fluid and other process fluids in the vent manifold 500. These values ​​are stored in the memory of the controller 250 and are selected by a user, such as a process engineer or technician.

[0056] Alternatively, the first process fluid can be flowed into the processing chamber 1300 through the outlet 110 prior to exhausting the process fluid to the vacuum source 1200 through the bleed port 190. Alternatively, the first process fluid can be flowed into the processing chamber 1300 simultaneously with exhausting to the vacuum source 1200, or the process fluid can be flowed into the process chamber 1300 only until exhausting to the vacuum source 1200. Thus, the first process fluid can be flowed into the processing chamber 1300 prior to or simultaneously with exhausting to the vacuum source 1200. The flow rate through the outlet 110 does not need to be equal to the flow rate through the bleed port 190.

[0057] After the first process fluid is discharged to the vent manifold 500, the second process fluid can be discharged to the vacuum manifold 500 through the bleed port 190 of the second flow controller 100. Thus, the second process fluid is an inert fluid and acts as a buffer between the initial process fluid in the vent manifold 500 and the subsequent process fluid. The second process fluid can be flowed at a controlled flow rate to achieve a target concentration of the first process fluid in the vent manifold 500, or it can simply be flowed at any flow rate to dilute the first process fluid. Finally, the flow of the first process fluid from the outlet 110 to the processing chamber 1300 is stopped. This can be done before or after the second process fluid enters the vent manifold 500. The order of supplying the first process fluid, draining the first process fluid, draining the second process fluid, and stopping the first process fluid can be changed. If desired, the pumping and draining can be performed simultaneously.

[0058] In yet another step, the processing system 2000 can include a third process fluid supplied from the second reactive fluid source 1011 to the inlet 104 of the third flow controller 100. Preferably, the third process fluid is reactive. Alternatively, the third process fluid can be flowed from the outlet 110 of the third flow controller 100 to the processing chamber 1300. Simultaneously or subsequently, the third process fluid can be flowed from the bleed port 190 of the third flow controller 100 to the vent manifold 500.

[0059] The third process fluid is preferably vented at a second flow rate to maintain a concentration of the third process fluid in the vent manifold 500. Preferably, the second flow rate is less than a third threshold and the concentration is less than a fourth threshold. The third and fourth thresholds are selected to minimize the risk of undesired reactions between the third process fluid and other process fluids in the vent manifold 500. These values ​​are stored in the memory of the controller 250 and are selected by a user, such as a process engineer or technician.

[0060] FIG. 16 illustrates another method for controlling flow rates. In the method of FIG. 16, a processing system 2000 is presented. Similar to FIG. 15, the processing system 2000 includes a first reactive fluid supply 1011 coupled to a first flow controller 100 and configured to supply a first process fluid. The processing system 2000 also includes a first inert fluid supply 1010 connected to a second flow controller 100 and configured to supply the first process fluid. Preferably, the first process fluid is reactive and the second process fluid is inert, as described above. The first process fluid is delivered to a vent manifold 500 via a bleed port 190 of the first flow controller 100. The first process fluid is supplied at a first flow rate.

[0061] The first process fluid is then routed to the outlet 110 of the first flow controller and then to the processing chamber 1300. The first process fluid can be delivered to the vent manifold 500 and the processing chamber 1300 simultaneously or sequentially. The first process fluid is preferably vented at a first flow rate to maintain a concentration of the first process fluid in the vent manifold 500. Preferably, the first flow rate is below a first threshold and the concentration is below a second threshold. The first and second thresholds are selected to minimize the risk of undesired reactions between the first process fluid and other process fluids in the vent manifold 500. These values ​​are stored in the memory of the controller 250 and selected by a user, such as a process engineer or technician.

[0062] Thus, depending on the process requirements and other considerations, it is apparent that the first process fluid may be flowed into the processing chamber 1300 before, after, or simultaneously with venting to the vent manifold 500. Additionally, the second process fluid may be routed to the bleed port 190 of the second flow controller and then routed to the vent manifold 500 simultaneously or subsequently to the first process fluid being routed to the vent manifold 500. The delivery of the second process fluid is independent of the delivery of the first process fluid to the processing chamber 1300 and may therefore be simultaneous with or subsequent to the delivery of the first process fluid to the processing chamber 1300. Finally, the flow of the first process fluid to the processing chamber 1300 is stopped.

[0063] Alternatively, a third process fluid can be delivered from a second reactive fluid source 1011 to the inlet 104 of the third flow controller 100. Preferably, the third process fluid is reactive. Alternatively, the third process fluid can be flowed from the outlet 110 of the third flow controller 100 to the processing chamber 1300. Simultaneously or subsequently, the third process fluid can be flowed from the bleed port 190 of the third flow controller 100 to the vent manifold 500.

[0064] The third process fluid is preferably vented at a second flow rate to maintain a concentration of the third process fluid in the vent manifold 500. The second flow rate is preferably below a third threshold and the concentration is preferably below a fourth threshold. The third and fourth thresholds are selected to minimize the risk of undesired reactions between the third process fluid and other process fluids in the vent manifold 500. These values ​​are stored in the memory of the controller 250 and are selected by a user, such as a process engineer or technician.

[0065] Clearly, the concentration and flow rate of each process fluid would be controlled below its respective threshold value so that the process fluids do not interact within the vent manifold 500. An inert process fluid can be used as a buffer, or the inert process fluid can be omitted. Alternatively, the concentration and flow rate of each of the reactive process fluids can be controlled below its respective threshold value, and the inert process fluid can be omitted.

[0066] While the present invention has been described in terms of specific examples, including presently preferred modes for carrying out the invention, those skilled in the art will recognize that there are numerous variations and modifications to the above-described systems and techniques. It is to be understood that other embodiments may be utilized and structural and functional changes may be made without departing from the scope of the present invention. Accordingly, the spirit and scope of the present invention should be construed broadly as set forth in the appended claims.

[0067] Exemplary Claims

[0068] (Exemplary Claim 1) A method for controlling fluid flow, comprising: providing a processing system including a first fluid supply configured to supply a first process fluid, the first fluid supply fluid being fluidly coupled to an inlet of a first flow control device, and a second fluid supply configured to supply a second process fluid, the second fluid supply fluid being fluidly coupled to a second flow control device; directing the first process fluid to a processing chamber fluidly coupled to an outlet of the first flow controller; Discharging the first process fluid at a first flow rate below a first threshold to a vent manifold fluidly coupled to a bleed port of the first flow control device; A method comprising:

[0069] (Exemplary Claim 2) The method of exemplary claim 1, wherein the step of discharging further comprises discharging the second process fluid to an exhaust manifold through a bleed port of the second flow control device.

[0070] (Exemplary Claim 3) The method of exemplary claim 2, wherein the first process fluid is reactive and the second process fluid is inert.

[0071] (Exemplary Claim 4) The method of exemplary claim 2 or exemplary claim 3, wherein the second process fluid is an inert gas.

[0072] (Exemplary Claim 5) A method according to any one of exemplary claims 2 to 4, characterized in that the second flow control device discharges a second process fluid simultaneously with the discharge of the first process fluid.

[0073] (Exemplary Claim 6) A method according to any one of exemplary claims 2 to 5, characterized in that the second flow control device discharges the second process fluid at a second flow rate and controls the concentration of the first process fluid to be lower than a second threshold value.

[0074] (Exemplary Claim 7) The method according to any one of exemplary claims 1 to 7, wherein the discharging step is performed after the sending step.

[0075] (Exemplary Claim 8) A method according to any one of exemplary claims 1 to 7, wherein the first flow control device includes a flow path extending from the inlet to the outlet and the bleed port, a first proportional valve fluidly connected to the flow path between the inlet and the bleed port, and a second proportional valve fluidly connected to the flow path between the first proportional valve and the bleed port.

[0076] (Exemplary Claim 9) The method of exemplary claim 8, wherein the second proportional valve is configured to discharge the first process fluid at the first flow rate.

[0077] (Exemplary Claim 10) A method according to any one of exemplary claims 1 to 9, wherein the processing system further comprises a controller including a memory, and the memory of the controller stores the first threshold value.

[0078] (Exemplary Claim 11) A method of controlling fluid flow, comprising the steps of providing a processing system including: a first fluid supply configured to supply a first process fluid, the first fluid supply fluid being fluidly coupled to an inlet of a first flow control device; and a second fluid supply configured to supply a second process fluid, the second fluid supply fluid being fluidly coupled to a second flow control device; directing the first process fluid to a processing chamber fluidly coupled to an outlet of the first flow controller; and discharging the first process fluid at a first flow rate to a vent manifold fluidly coupled to a bleed port of the first flow controller and simultaneously discharging the second process fluid at a second flow rate to a vent manifold fluidly coupled to a bleed port of the second flow controller to control a concentration of the first process fluid in the vent manifold below a second threshold.

[0079] (Example claim 12) 12. The method of claim 11, wherein the first flow rate is less than a first threshold value.

[0080] (Exemplary Claim 13) The method of exemplary claim 11 or exemplary claim 12, wherein the first process fluid is reactive and the second process fluid is inert.

[0081] (Exemplary Claim 14) The method according to any one of exemplary claims 11 to 13, wherein the second process fluid is an inert gas.

[0082] (Exemplary Claim 15) The method according to any one of exemplary claims 11 to 14, wherein the discharging step is performed after the sending step.

[0083] (Exemplary Claim 16) A method according to any one of exemplary claims 11 to 15, wherein the first flow control device includes a flow path extending from the inlet to the outlet and the bleed port, a first proportional valve fluidly connected to the flow path between the inlet and the bleed port, and a second proportional valve fluidly connected to the flow path between the first proportional valve and the bleed port.

[0084] (Exemplary Claim 17) The method of exemplary claim 16, wherein the second proportional valve is configured to discharge the first process fluid at the first flow rate.

[0085] (Exemplary Claim 18) A method according to any one of exemplary claims 11 to 17, wherein the processing system further includes a controller including a memory, and the memory of the controller stores the second threshold value.

[0086] (Exemplary Claim 19) A method for controlling fluid flow, comprising: providing a treatment system including a first fluid supply configured to supply a first process fluid, the first fluid supply fluid being fluidly coupled to an inlet of a first flow control device, and a second fluid supply configured to supply a second process fluid, the second fluid supply fluid being fluidly coupled to a second flow control device; Discharging the first process fluid at a first flow rate to a vent manifold fluidly coupled to a bleed port of the first flow control device until a concentration of the first process fluid in the vent manifold is below a second threshold; and delivering the first process fluid to a processing chamber fluidly coupled to an outlet of the first flow controller.

[0087] (Exemplary Claim 20) The method of exemplary claim 19, wherein the step of discharging further comprises discharging the second process fluid to the vent manifold through a bleed port of the second flow control device.

[0088] (Exemplary Claim 21) The method of exemplary claim 20, wherein the first process fluid is reactive and the second process fluid is inert.

[0089] (Exemplary Claim 22) The method of exemplary claim 20 or exemplary claim 21, wherein the second process fluid is an inert gas.

[0090] (Exemplary Claim 23) A method according to any one of exemplary claims 20 to 22, characterized in that the second flow control device discharges the second process fluid simultaneously with the discharge of the first process fluid.

[0091] (Exemplary Claim 24) A method according to any one of exemplary claims 20 to 23, characterized in that the second flow control device discharges the second process fluid at a second flow rate and controls the concentration of the first process fluid to be lower than a second threshold value.

[0092] (Exemplary Claim 25) The method according to any one of exemplary claims 19 to 24, wherein the discharging step is performed before the sending step.

[0093] (Exemplary Claim 26) A method according to any one of exemplary claims 19 to 25, wherein the first flow control device includes a flow path extending from the inlet to the outlet and the bleed port, a first proportional valve fluidly connected to the flow path between the inlet and the bleed port, and a second proportional valve fluidly connected to the flow path between the first proportional valve and the bleed port.

[0094] (Exemplary Claim 27) The method of exemplary claim 26, wherein the second proportional valve is configured to discharge the first process fluid at the first flow rate.

[0095] (Exemplary Claim 28) A method according to any one of exemplary claims 19 to 27, wherein the processing system further comprises a controller including a memory, and the memory of the controller stores the first threshold value.

Claims

1. 1. A method for controlling fluid flow, comprising: providing a processing system including a first fluid supply configured to supply a first process fluid, the first fluid supply fluid being fluidly coupled to an inlet of a first flow control device, and a second fluid supply configured to supply a second process fluid, the second fluid supply fluid being fluidly coupled to a second flow control device; directing the first process fluid to a processing chamber fluidly coupled to an outlet of the first flow controller; Discharging the first process fluid at a first flow rate below a first threshold to a vent manifold fluidly coupled to a bleed port of the first flow control device; A method comprising:

2. 2. The method of claim 1, wherein the step of discharging further comprises discharging the second process fluid through a bleed port of the second flow control device to an exhaust manifold.

3. 3. The method of claim 2, wherein the first process fluid is reactive and the second process fluid is inert.

4. 4. The method of claim 2 or claim 3, wherein the second process fluid is an inert gas.

5. 5. The method of claim 2, wherein the second flow control device discharges a second process fluid simultaneously with the discharge of the first process fluid.

6. 6. The method of claim 2, wherein the second flow control device discharges the second process fluid at a second flow rate and controls the concentration of the first process fluid to be lower than a second threshold value.

7. The method according to any one of claims 1 to 7, characterized in that the step of discharging is performed after the step of sending.

8. 8. The method of claim 1, wherein the first flow control device includes a flow path extending from the inlet to the outlet and to the bleed port, a first proportional valve fluidly connected to the flow path between the inlet and the bleed port, and a second proportional valve fluidly connected to the flow path between the first proportional valve and the bleed port.

9. 9. The method of claim 8, wherein the second proportional valve is configured to discharge the first process fluid at the first flow rate.

10. 10. The method of claim 1, wherein the processing system further comprises a controller including a memory, the memory of the controller storing the first threshold value.

11. 1. A method for controlling fluid flow, comprising: providing a treatment system including a first fluid supply configured to supply a first process fluid, the first fluid supply fluid being fluidly coupled to an inlet of a first flow control device, and a second fluid supply configured to supply a second process fluid, the second fluid supply fluid being fluidly coupled to a second flow control device; directing the first process fluid to a processing chamber fluidly coupled to an outlet of the first flow controller; discharging the first process fluid at a first flow rate to a vent manifold fluidly coupled to a bleed port of the first flow control device and simultaneously discharging the second process fluid at a second flow rate to a vent manifold fluidly coupled to a bleed port of the second flow control device to control a concentration of the first process fluid in the vent manifold below a second threshold; A method comprising:

12. 12. The method of claim 11, wherein the first flow rate is less than a first threshold.

13. 13. The method of claim 11 or claim 12, wherein the first process fluid is reactive and the second process fluid is inert.

14. A method according to any one of claims 11 to 13, characterized in that the second process fluid is an inert gas.

15. The method according to any one of claims 11 to 14, characterized in that the step of discharging is performed after the step of sending.

16. 16. The method of any one of claims 11 to 15, wherein the first flow control device includes a flow path extending from the inlet to the outlet and to the bleed port, a first proportional valve fluidly connected to the flow path between the inlet and the bleed port, and a second proportional valve fluidly connected to the flow path between the first proportional valve and the bleed port.

17. 17. The method of claim 16, wherein the second proportional valve is configured to discharge the first process fluid at the first flow rate.

18. 18. The method of any one of claims 11 to 17, wherein the processing system further comprises a controller including a memory, the memory of the controller storing the second threshold value.

19. 1. A method for controlling fluid flow, comprising: providing a treatment system including a first fluid supply configured to supply a first process fluid, the first fluid supply fluid being fluidly coupled to an inlet of a first flow control device, and a second fluid supply configured to supply a second process fluid, the second fluid supply fluid being fluidly coupled to a second flow control device; Discharging the first process fluid at a first flow rate to a vent manifold fluidly coupled to a bleed port of the first flow control device until a concentration of the first process fluid in the vent manifold is below a second threshold; directing the first process fluid to a processing chamber fluidly coupled to an outlet of the first flow controller; A method comprising:

20. 20. The method of claim 19, wherein the step of draining further comprises draining the second process fluid through a bleed port of the second flow control device to the vent manifold.

21. 21. The method of claim 20, wherein the first process fluid is reactive and the second process fluid is inert.

22. 22. The method of claim 20 or claim 21, wherein the second process fluid is an inert gas.

23. 23. The method of any one of claims 20 to 22, wherein the second flow control device discharges the second process fluid simultaneously with the discharge of the first process fluid.

24. 24. The method of claim 20, wherein the second flow control device discharges the second process fluid at a second flow rate and controls the concentration of the first process fluid to be less than a second threshold value.

25. The method according to any one of claims 19 to 24, characterized in that the step of ejecting is performed before the step of sending.

26. 26. The method of any one of claims 19 to 25, wherein the first flow control device includes a flow path extending from the inlet to the outlet and to the bleed port, a first proportional valve fluidly connected to the flow path between the inlet and the bleed port, and a second proportional valve fluidly connected to the flow path between the first proportional valve and the bleed port.

27. 27. The method of claim 26, wherein the second proportional valve is configured to discharge the first process fluid at the first flow rate.

28. 28. The method of any one of claims 19 to 27, wherein the processing system further comprises a controller including a memory, the memory of the controller storing the first threshold value.

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