Apparatus for cooling data center computer servers by using phase change materials - Patent Application 20070122997

Abstract

The present invention relates to an apparatus (1) for cooling at least a server of a data center computer, the apparatus (1) comprising a phase change material (5) configured for exchanging heat with at least one component of the server and at least one heat exchanger (7) connected to a heat transfer fluid circuit (3). The apparatus (1) is configured, on the one hand, to cool the at least one component of the server by storing heat generated by the component in the phase change material (5), and, on the other hand, to release the heat stored in the phase change material (5) via the heat exchanger (7).

Description

[Technical Field]

[0001] The present invention relates to the field of data center servers, and in particular to the thermal management of said servers, in particular to cooling said servers by using phase change materials. [Background technology]

[0002] A data center is typically a building or space within a building designed to house computer systems and related components, such as communication and storage systems.

[0003] Because the operations performed by the computer systems are technically, scientifically, and / or commercially critical, data centers typically include redundant or backup components and infrastructure for power, data communications connections, environmental controls (e.g., air conditioning, fire suppression, etc.), and various security devices.

[0004] Furthermore, data centers must operate 24 hours a day, 365 days a year. As such, operating a data center involves the consumption of a significant amount of electrical and / or thermal energy. "Consumption of thermal energy" means the need to use energy to regulate the temperature of the computer servers and / or data center, for example, by using electrically powered air conditioning systems to cool the air that enters the computer servers. This temperature regulation is essential to ensure the functionality of the data center and its components, regardless of the country, temperature, or tropical region. Summary of the Invention [Problem to be solved by the invention]

[0005] Therefore, an air conditioning system is typically configured to cool ambient air and circulate the ambient air inside a server (typically from the front to the back of the server) to cool components inside the server. Furthermore, to facilitate air circulation inside the server, ventilation means are typically located behind the server. However, these ventilation means require significant power consumption and maintenance costs (breakdowns, filter replacement, etc.).

[0006] Additionally, it is known to use typically intermittent renewable power sources, such as solar panels and wind turbines, in combination with energy storage batteries, but such battery energy storage solutions are costly and can pose electrical and fire hazards to high-power equipment.

[0007] Therefore, given the constantly increasing number of data centers in use, there is an urgent need to find solutions to keep the servers in these data centers operating in the best possible condition while reducing their power consumption, carbon footprint, and / or operational costs.

[0008] The present invention therefore proposes to solve at least one of the above mentioned problems by means of a cooling solution using phase change materials (PCM) advantageously associated with renewable electricity sources. [Means for solving the problem]

[0009] The present invention therefore relates to an apparatus for cooling at least the servers of a data center computer, said apparatus comprising: The device is a phase change material configured to exchange heat with at least one component of the server; at least one heat exchanger connected to the heat transfer fluid circuit; Equipped with The device is On the one hand, cooling at least one component of the server by storing heat generated by the component in a phase change material; On the other hand, the heat stored in the phase change material is released via a heat exchanger. It is structured as follows.

[0010] Thus, the cooling device allows for easy and fast management of heat within server components by storing thermal energy generated by said server components in a phase change material, e.g., delaying management of the thermal energy stored in said phase change material during periods when thermal management is more environmentally friendly and / or cheaper.

[0011] Advantageously, the phase change material is configured for direct heat exchange with at least one component of the computer server, meaning that heat transfer from the server component to the phase change material for cooling occurs primarily by conduction. The phase change material can be in direct contact with the at least one component or can be in contact via one or more intermediate thermally conductive items (e.g., heat exchangers, thermal paste, flanges, etc.).

[0012] It should also be noted that the phase change material may indirectly exchange heat with at least one component of said server, where "indirect heat exchange" means that the heat exchange between the component and the phase change material occurs via a fluid, such as a gas (e.g., air) or a liquid (e.g., water).

[0013] Advantageously, the cooling device is configured for cooling computer server racks. It should be noted that each rack typically comprises storage components (or hard disks) and at least one hub and / or network switch. The association of each rack with a cooling device according to the present invention allows for optimizing and customizing the thermal management of the rack's components, thereby extending the lifespan of said components and minimizing the power consumption for cooling the computer server rack and its components.

[0014] According to a possible feature, the apparatus comprises at least one renewable electrical energy source, such as a photovoltaic panel, a wind turbine, or the like, configured to power components of said apparatus, such as the heat transfer fluid circuit and its sub-components.

[0015] According to a possible feature, the device comprises an electronic monitoring unit configured to monitor the release of heat stored in the phase change material, for example the release being a function of the power supply available from renewable electrical energy sources and / or the price of energy.

[0016] It should be noted that advantageously, the release of heat monitored by the electronic monitoring unit is delayed, meaning that the moment when the phase change material stores heat and the moment when this heat is released or stored are different and independent moments, e.g., the release is a function of the power supply from renewable electrical energy sources and / or energy prices, which allows for a greener and / or cheaper way to cool servers.

[0017] Thus, the present invention allows the use of energy to cool a phase change material to be delayed until the most opportune moment, allowing the phase change material to be cooled to charge a refrigerator, for example, at night when electricity prices are favorable, and the charged refrigerator can then be used to reduce, or at least decrease, electricity consumption during the day (when electricity prices are typically higher).

[0018] According to another possible feature, the heat transfer fluid circuit is thermally coupled to a "heat pump" type circuit or cooling system. Advantageously, the heat transfer fluid circuit is configured to be connected to a heat sink that allows the heat stored in the phase change material to be released. A "heat pump" type circuit or cooling system is generally a system that requires electrical power to operate.

[0019] According to a first possible embodiment of the invention, the device comprises a ventilation unit configured to circulate an air flow through said server and over the phase change material.

[0020] Advantageously, a ventilation unit is installed to suck air out of the servers. To suck air out of the servers, particularly in maintenance operations, it is advantageous to leave the front of the servers easily accessible for various operations and the rear of the servers where the ventilation unit is installed. Furthermore, the ventilation unit advantageously comprises at least one fan motor assembly and a battery.

[0021] According to a possible feature of the first mode, the airflow from the ventilation unit is led to at least one cooling unit comprising the heat exchanger and the phase change material. For example, these cooling units are substantially columnar. The airflow cooled as it flows through the column of the cooling unit is then discharged into the ambient air of the building and / or server room or (directly) directed to the air inlet of at least one computer server.

[0022] According to another possible feature of the first mode, the heat exchanger of the cooling unit comprises: The heat exchanger of the cooling unit is a first structure in which the conduit is designed for a heat transfer fluid of a heat transfer fluid circuit; a second structure surrounding the first structure and configured to cool the airflow from the ventilation unit (by heat transfer to the phase change material); Equipped with The first structure and the second structure are configured such that there is a gap between the structures that defines a housing in which the phase change material is disposed.

[0023] According to another possible feature of the first mode, the airflow from the ventilation unit is directed downwards through the cooling unit, and the airflow warmed by the servers then passes through the cooling unit, for example passing through columns of said unit along its length, facilitating heat transfer from the airflow to the phase change material.

[0024] According to another possible feature of the first mode, the heat transfer fluid circuit is configured such that the heat transfer fluid flows upward through the heat exchanger, and advantageously the phase change material is first re-solidified at the level of the material located at the bottom of said cooling unit.

[0025] According to another possible feature of the first mode, the ventilation rate of the ventilation unit is configured such that the temperature of the air at the server and / or components of said server (measured by sensors at suitable locations) is substantially stable.

[0026] According to a second possible embodiment of the invention, the device comprises a thermally conductive member connecting at least one of the components of the server to the phase change material, the thermally conductive member being in thermal contact with the component whose temperature needs to be reduced, for example via a thermally conductive paste. For example, the thermally conductive member is made of a material with good thermal conductivity, such as a metal such as copper or aluminum.

[0027] According to another possible feature of the second mode, the thermally conductive member further comprises a Peltier thermoelectric module that can accelerate the temperature drop of the component and improve or even force the heat transfer to the phase change material.

[0028] According to another possible feature of the second mode, the phase change material is contained in said heat exchanger connected to the heat transfer fluid circuit.

[0029] According to another possible feature of the second mode, the heat exchanger comprises: The heat exchanger is a first structure in which the conduit is designed for a heat transfer fluid of a heat transfer fluid circuit; a second structure surrounding the first structure, in contact with at least one component of the server, and configured to cool (by heat transfer to the phase change material) the at least one component of the server; Equipped with The first structure and second structure are configured such that there is a gap between the structures that defines a housing in which the phase change material is disposed.

[0030] According to another possible feature, the device comprises a heat transfer fluid circuit including at least a pump and a heat exchanger associated with the refrigerant fluid circuit, and is configured to operate, for example, in a "heat pump" mode.

[0031] According to another possible feature, the device comprises at least two temperature sensors from the following list: a temperature sensor for the airflow at the outlet of the server, a temperature sensor for the airflow at the inlet of the cooling unit, a temperature sensor for the airflow at the outlet of the cooling unit, a temperature sensor for the phase change material, a measuring device for the latent heat load rate (freezing) of the phase change material, such as a temperature sensor and / or a pressure sensor.

[0032] According to another possible feature, the electronic monitoring unit is configured to monitor the "heat pump" type circuit, the heat transfer fluid circuit, the ventilation unit and / or the cooling device, in particular the electronic monitoring unit is configured to monitor the flow rate of the heat transfer fluid through said circuit, the flow rate of the fluid through the "heat pump" type circuit, the flow rate of the air through any item of cooling device and / or the ventilation unit, etc.

[0033] Advantageously, said electronic monitoring unit is configured for adjusting a flow parameter of at least one fluid (air, heat transfer fluid, etc.) depending on the real-time power consumption of the server or one of the racks of said server in order to stabilize the temperature of the server or one of the components of said server.

[0034] According to a second possible embodiment of the present invention, all heat-generating components of the rack are directly attached to cooling units and / or heat-transfer fluid conduits containing some kind of phase-change material. This configuration is useful for new autonomous rack designs that include integrated cooling systems. The phase-change material allows heat to be stored and then released directly within the rack without the need for powerful ventilation. Other weak heat-generating components can be cooled by convection or slight ventilation with low power.

[0035] The present invention also relates to the use of a heat sink to optimize the "recharging" (typically solidification by cooling) of the phase change material in response to the presence of harvested intermittent energy. In the long-term absence of such intermittent energy, the cooling unit is powered directly from the mains.

[0036] Of note is the advantage that the PCM can be cooled and solidified at approximately 15°C (non-limiting) without being restricted to other climatic conditions (from desert to polar regions), while simultaneously condensing and removing excess moisture from the cooling air stream.

[0037] When directly cooling heat-generating components, it is advantageous to use a phase-change material that solidifies at an ambient temperature of, but not limited to, about 20°C to about 24°C in order to prevent condensation inside the column and rack.

[0038] It should be noted that any refrigerant fluid can be used to cool the phase change material, such as a chilled water network (or other gas or liquid) from a heat pump, or other cooling means, including those based on the Peltier effect. [Brief explanation of the drawings]

[0039] The invention will be better understood and other objects, details, features and advantages will become more apparent from the following description of certain embodiments of the invention, which are given for informational purposes only and in a non-limiting manner with reference to the accompanying drawings. [Figure 1] 1 is a schematic and partial view of an example of a cooling device according to the present invention, designed for temperature regulation of at least one server. [Figure 2] 2 is a schematic diagram illustrating an example of a cooling device according to an embodiment of the present invention. [Figure 3] 3 is a schematic diagram and partial view of an example of a cooling unit in a cooling device according to an embodiment of the present invention. [Figure 4] 5 is a schematic diagram illustrating an example of a cooling device according to another embodiment of the present invention, referred to as FIG. 4. [Figure 5] 5 is a schematic perspective view of an example of a heat exchanger of the cooling unit shown in FIG. 4. FIG. [Figure 6] 6 is a schematic cross-sectional view of an example of a heat exchanger of the cooling unit shown in FIG. 4. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0040] Furthermore, it should be noted that in the various figures, identical components are generally designated by the same reference numerals.

[0041] FIG. 1 is a schematic and partial view of an example of a cooling apparatus 1 according to a first embodiment, designed for cooling at least one server S or a group of computer servers (the servers may be organized into one or more "racks") in a data center.

[0042] The device 1 according to the invention can be adapted to cool each server S, with no limit on the number of servers, and / or to cool a set of servers together.

[0043] The apparatus 1 comprises at least one cooling unit 2 and a ventilation unit V configured to circulate an air flow F through the at least one server S to the cooling unit 2.

[0044] For example, the ventilation unit V may comprise at least one fan and / or fan motor assembly, including, for example, a fan positioned at the rear of the at least one server S to draw air through the at least one server S. The ventilation unit V may also comprise at least one battery for powering the at least one fan and / or fan motor assembly, particularly in the event of a power outage and / or to use electricity that has previously been generated and stored at lower cost (or more environmentally friendly).

[0045] Therefore, the cooling device 1 a phase change material 5 configured to exchange heat (here by an air flow F) with at least one component of said server; at least one heat exchanger 7 connected to the heat transfer fluid circuit 3; Equipped with.

[0046] In particular, FIG. 1 shows an embodiment of the invention, in which the device 1 comprises a cooling unit 2 containing a heat exchanger 7 connected to a heat transfer fluid circuit 3 and a phase change material 5 .

[0047] The device 1 is configured, on the one hand, to cool at least one component of the server S by storing heat generated by one of the components in the server S in a phase change material 5, and, on the other hand, to release the heat stored in the phase change material 5 via the heat exchanger 7 (and the heat transfer fluid circuit 3).

[0048] Here, heat transfer is achieved by air flow F passing through server S, imparting heat to air flow F (thereby warming air flow F), which then imparts heat to phase change material 5 via heat exchanger 7.

[0049] It should be noted that a phase change material 5 (PCM) is a material that is able to change its physical state within a limited temperature range (latent heat) and in this way store and release heat.

[0050] The phase change material 5 advantageously has a melting temperature of -10°C to 25°C (for energy storage), preferably -5°C to 20°C, and more preferably 12°C to 18°C ​​or 18°C ​​to 28°C in the case of direct cooling as described below.

[0051] 2 is a schematic and partial view of an example of an apparatus for cooling 1 according to one embodiment. The cooling unit 2 is substantially cylindrical and contains a heat exchanger 7 connected to a heat transfer fluid circuit 3 and a phase change material 5. It should be noted that the apparatus 1 may include one or more cooling units 2.

[0052] Said cooling unit 2 is therefore configured such that an air flow F from a ventilation unit V passes through the cooling unit 2, the air flow is cooled as it flows through the columns of the cooling unit 2 and is then either discharged into the ambient air of the building and / or server room or directed (directly) to the air inlet of at least one computer server. It is noted that the air flow from the ventilation unit V is preferably directed downwards through the cooling unit 2.

[0053] The heat transfer fluid circuit 3 includes a pump 9 configured to circulate the heat transfer fluid, preferably upwards, through the heat transfer fluid circuit 3, in particular the heat exchanger 7 of the cooling unit 2, and another heat exchanger 23, called a coupling exchanger, that is thermally coupled to a heat sink (not shown).

[0054] The heat transfer fluid circuit 3 is therefore connected to a heat sink that makes it possible to release some of the heat stored in the phase change material 5 by means of the heat transfer fluid.

[0055] FIG. 3 is a schematic cross-sectional view illustrating an example of the cooling unit 2 of the apparatus 1 shown in FIGS. 1 and 2 according to an embodiment of the present invention.

[0056] Therefore, the heat transfer fluid circuit 3 is a pump 9 for circulating a heat transfer fluid through the heat transfer fluid circuit 3; a shut-off valve 11 configured to stop the flow of heat transfer fluid through the heat transfer fluid circuit 3, such that stopping the circulation of the heat transfer fluid limits or stops the accumulation or release of heat between the heat transfer fluid and the phase change material 5; at least one additional and optional air flow circulation means 13, configured to circulate an air flow F along said heat exchanger 7; Equipped with.

[0057] It should be noted that the heat transfer fluid is advantageously water, water glycol (meaning a mixture of water and glycol), glycol, etc., but can also be a refrigerant fluid.

[0058] The additional circulation means 13 may be, for example, a fan motor assembly or fan (i.e., a centrifugal fan) that draws (or "pushes") air through the cooling unit 2 and circulates the air along the heat exchanger 7, thereby cooling or heating the air (and thus the room into which the air flows).

[0059] According to embodiments not shown, the heat exchanger 7 may have different shapes and / or include various elements, which allow air to flow through the center and / or the edges of said heat exchanger 7.

[0060] The cooling unit 2 further comprises a case 32 in which, for example, the heat exchanger 7, the circulation means 13, part of the heat transfer fluid circuit 3, the shut-off valve 11, etc. are arranged.

[0061] The case 32 also comprises an air inlet 32a and an air outlet 32b to allow air circulation by the additional circulation means 13 and / or the ventilation unit V. Furthermore, it is noted that the air inlet 32a can be configured to draw in air from the outside (usually dry) and / or air that has already been thermally conditioned by the cooling unit 2 (also called recycled air).

[0062] Advantageously, the portion of the heat transfer fluid circuit 3 that is not within the case 32 is thermally isolated from the outside, for example by insulation 45. This insulation limits heat loss before the heat transfer fluid reaches the phase change material 5 (this is more important than the loop being far outside the case).

[0063] Furthermore, the cooling unit 2 may also be provided with a sheath where the heat exchanger 7 is preferably arranged, said sheath 21 being advantageously made of a thermally insulating material.

[0064] The cooling unit 2 also includes: an electronic monitoring unit 15 configured, inter alia, to monitor the circulation of the heat transfer fluid through the heat transfer fluid circuit 3 and / or the circulation (flow rate, speed, etc.) of the airflow through the cooling unit 2 and / or said at least one server S (i.e. to monitor the ventilation unit V and / or the additional circulation means 13); a human-machine interface (or user interface) 17, which is all the elements that allow the user to interact with the unit, more specifically to monitor it and / or exchange information with it; Equipped with.

[0065] The human-machine interface may comprise one or more components such as, for example, buttons, a keyboard, a screen, a touchscreen, knobs, indicator lights, and the like.

[0066] 4 shows a schematic and partial view of an example of another example cooling device 1 according to the first embodiment of the present invention, in which the heat sink (of device 1 in FIG. 2) is a heat pump type circuit 4. In turn, the cooling device 1 comprises a heat pump type circuit 4 thermally coupled (e.g., through which a refrigerant fluid flows) to a heat transfer fluid circuit 3 via a heat exchanger 23.

[0067] The heat pump circuit 4 further comprises a compressor C, a pressure regulator D1, a heat exchanger H1 (e.g., operating as an evaporator), and a heat exchanger H2 (e.g., operating as a condenser). The heat pump circuit 4 also advantageously comprises a bypass branch with a direct-acting valve for coupling the heat exchangers. The heat pump circuit 4 and its various components are configured to achieve a thermodynamic cycle in which heat is received from the heat exchanger 23 (i.e., from the heat transfer fluid) and rejected at the heat exchanger H1, for example by transferring heat to an air flow F passing through the heat exchanger H1.

[0068] In another embodiment not shown, the coupling heat exchanger is coupled to, for example, a refrigeration system through which a refrigerant fluid flows.

[0069] However, it should be noted that regardless of the variant or embodiment and without causing any technical problems, the cooling unit 2 can be equipped with at least two (not shown) temperature sensors from the following list: a temperature sensor for the air flow at the outlet of the server, a temperature sensor for the air flow at the inlet of the cooling unit 2, a temperature sensor for the air flow at the outlet of the cooling unit 2, a temperature sensor for the phase change material, a measuring device for the latent heat load rate (freezing) of the phase change material such as a temperature sensor and / or a pressure sensor.

[0070] Therefore, the electronic monitoring unit 15 is advantageously configured to monitor "heat pump" type circuits, heat transfer fluid circuits, ventilation units, additional circulation means and / or cooling devices.

[0071] In particular, the electronic monitoring unit 15 can be configured to monitor the flow rate of the heat transfer fluid through the heat transfer fluid circuit 3, the flow rate of the fluid (e.g., refrigerant fluid) through the heat pump type circuit 4 and / or the flow rate of the air through the ventilation unit V, and in principle any component of the cooling device.

[0072] As shown more specifically in FIGS. 5 and 6, which are schematic perspective and cross-sectional views of the heat exchanger 7, the heat exchanger 7 includes: For example, a first structure 110, present in the center, with conduits 110a designed for a heat transfer fluid; For example, a second structure 120 that is concentric with the first structure 110 and is provided around the first structure 110 (i.e., around the conduit 110a); Equipped with.

[0073] The first structure 110 and the second structure 120 are configured such that there is a gap between the first structure 110 and the second structure 120 that defines a housing in which the phase change material 5 is disposed (or stored).

[0074] It should further be noted that the heat exchanger 7, the first structure 110, and the second structure 120 are preferably made as free-standing columns of a metallic thermally conductive material such as aluminum, the number and size of which depends on the energy required to cope with the intermittency of one or more power sources.

[0075] The heat exchanger 7 is manufactured by extrusion, for example, and preferably has an elongated shape so that the conduits for the heat transfer fluid are as long as possible to transfer heat to and recover heat from the phase change material 5.

[0076] Thus, according to a possible embodiment, the heat exchanger 7 comprises two extruded aluminum profiles arranged concentrically with one another, each having a cross section that may be circular, square, rectangular, etc. The first extruded profile, i.e., the first structure 110, comprises in its center a conduit 110a for the heat transfer fluid.

[0077] The air flow F is therefore cooled and / or heated by the second structure 120 of the heat exchanger 7, in particular through its outer surface. Furthermore, the first structure 110 and the second structure 120 are advantageously equipped with fins 111, 121 and 122, which increase the contact area and maximize the heat exchange.

[0078] In particular, the fins 111 of the first structure 110 extend towards the second structure 120 of the heat exchanger 7, and therefore the fins 111 extend into the volume or space in which the phase change material 5 is stored, thereby increasing the contact area between the phase change material 5 and the first structure 110 and facilitating heat exchange between the heat transfer fluid passing through the conduit 110a and the phase change material 5.

[0079] On the other hand, the fins 121 and fins 122 in the second structure 120 may extend away from the second structure 120 (towards the outer surface of the second structure 120), which are referred to as external fins 121, and / or may extend from the inner surface of the second structure 120 towards the first structure 110, which are referred to as internal fins 122.

[0080] The multiple external fins 121 increase the contact area between the thermal regulating flow (in this case air flow F) and the second structure 120, facilitating heat exchange, while the multiple internal fins 122 increase the contact area with the phase change material 5, facilitating heat transfer between the phase change material 5 and the heat transfer fluid and / or air flow F.

[0081] It should be noted that the multiple fins 111 in the first structure 110 and the multiple internal fins 122 are configured in cooperation with each other to ensure a certain gap between the first structure 110 and the second structure 120 and good mechanical resistance of the set.

[0082] It should also be noted that since the sheath 21 specifically surrounds the at least one heat exchanger 7, there is a gap between the inner surface of the sheath 21 and the second structure 120 in the heat exchanger 7, and the gap thus created defines a conduit for a thermal conditioning fluid such as air, making it possible to guide the air flow F and maximize the heat exchange between the air flow F and the heat exchanger 7.

[0083] Advantageously, the periphery defined by the plurality of external fins 121 has a geometric shape such as a square or rectangle, which facilitates manufacturing for attaching the sheath 21 to the heat exchanger 7 .

[0084] Regardless of the variant or embodiment of the present invention, the device 1 advantageously comprises at least one renewable electrical energy source, such as a photovoltaic panel, a wind turbine, etc., configured to supply power to a number of components in the device 1, such as the heat transfer fluid circuit 3 and its sub-components.

[0085] The apparatus comprises an electronic monitoring unit configured to monitor the release of heat stored in the phase change material, for example, the release being a function of the power supply available from renewable electrical energy sources and / or the price of energy.

[0086] In another embodiment (called the second mode), not shown, the phase change material 5 is configured for direct heat exchange with at least one component of the computer server S, meaning that heat transfer from the at least one component of the computer server S to the phase change material 5 occurs primarily by conduction.

[0087] The phase change material 5 may be in direct contact with at least one component or may be in contact via one or more intermediate thermally conductive members (e.g., heat exchangers, thermal paste, flanges, etc.).

[0088] Therefore, in a second embodiment of the invention, the device 1 comprises a thermally conductive member connecting at least one component of said server S to the phase change material 5 .

[0089] The thermal conductive member is a structure that is in thermal contact with a component that needs to be cooled, for example, via a thermal conductive paste, and is made of a material with excellent thermal conductivity, such as a metal such as copper or aluminum.

[0090] The thermally conductive member may further comprise a Peltier thermoelectric module.

[0091] However, the phase change material 5 is always advantageously contained within a heat exchanger connected to the heat transfer fluid circuit 3 .

[0092] Thus, in this second embodiment, not shown, The heat exchanger is a first structure in which conduits are designed for the heat transfer fluid of the heat transfer fluid circuit; a second structure surrounding the first structure, in contact with at least one component of the server, and configured to cool (by heat transfer to a phase change material) the at least one component of the server; Equipped with.

[0093] The first structure and the second structure are configured such that there is a gap between the structures that defines a housing in which the phase change material is disposed.

[0094] Furthermore, in a variation of the second embodiment of the present invention, all of the heat-generating components of the server S are mounted directly on a column or cooling unit containing the phase change material 5, and the cooling unit is internal to the server (or at least its rack) and is an integral part of the server. [Explanation of symbols]

[0095] 1 device 2 Cooling Unit 3 Heat transfer fluid circuit 4. Heat pump type circuit 5 Phase change materials 7 Heat exchanger

Claims

1. An apparatus (1) for cooling at least the servers of a data center computer, comprising: The device (1) comprises: a phase change material (5) configured to exchange heat with at least one component of said server; at least one heat exchanger (7) connected to the heat transfer fluid circuit (3); Equipped with The device (1) comprises: On the one hand, cooling at least one component of said server by storing heat generated by said component in said phase change material (5); On the other hand, the heat stored in the phase change material (5) is released via the heat exchanger (7). The device (1) is configured as follows.

2. The device (1) comprises at least one renewable electrical energy source configured to power a plurality of components of the device (1), 2. Device (1) according to claim 1, characterized in that:

3. The device (1) comprises an electronic monitoring unit (15) configured to monitor the release of heat stored in the phase change material (5), 3. Device (1) according to claim 1 or 2, characterized in that

4. The heat transfer fluid circuit (3) is thermally coupled to a heat pump type circuit or a cooling system. Device (1) according to any one of claims 1 to 3, characterized in that

5. The device (1) comprises a ventilation unit (V) configured to circulate an air flow (F) through the server and over the phase change material (5), Device (1) according to any one of claims 1 to 4, characterized in that

6. The ventilation unit (V) is installed to suck air out of the server.

6. Device (1) according to claim 5, characterized in that

7. The air flow (F) from the ventilation unit (V) is directed to at least one cooling unit (2) containing the heat exchanger (7) and the phase change material (5).

7. Device (1) according to claim 5 or 6, characterized in that

8. The heat exchanger (7) of the cooling unit (2) a first structure (110) whose conduits (110a) are designed for the heat transfer fluid of said heat transfer fluid circuit (3); a second structure (120) surrounding the first structure (110) and configured to cool the air flow (F) from the ventilation unit (V) (by heat transfer to the phase change material (5)); Equipped with The first structure (110) and the second structure (120) are configured such that there is a gap between the first structure (110) and the second structure (120) that defines a housing in which the phase change material (5) is disposed.

8. Device (1) according to claim 7, characterized in that

9. The air flow (F) from the ventilation unit (V) is directed downwards through a cooling unit (2). Device (1) according to claim 7 or 8, characterized in that

10. The heat transfer fluid circuit (3) is configured so that the heat transfer fluid flows upward through the heat exchanger (7). Device (1) according to any one of claims 7 to 9, characterized in that

11. The device comprises a thermally conductive member connecting at least one component of the server to the phase change material (5). Device (1) according to any one of claims 1 to 4, characterized in that

12. the heat conducting member further comprises a Peltier thermoelectric module; 12. Device (1) according to claim 11, characterized in that

13. A data center comprising at least one server (S) having a device (1) according to any one of claims 1 to 12.

Images