Lead forming apparatus for forming leads of electronic components and method for forming leads of electronic components

Abstract

The present invention relates to a lead forming apparatus for shaping leads of an electronic component, the lead forming apparatus comprising two cooperating opposing tool parts relatively movable toward and away from each other, a first clamp half attached to one of the tool parts, and a second clamp half attached to the opposite tool part for clamping at least a portion of the lead. The present invention also relates to a method for shaping leads of an electronic component, the method comprising the steps of: a) preparing an electronic component having at least one lead; b) clamping both side surfaces of the at least one lead at clamping locations opposite a tip of the lead adjacent to the electronic component; and c) bending the lead in a first bending direction at a first bending location.

Description

[Technical Field]

[0001] The present invention relates to a lead forming apparatus for forming leads of electronic components, a lead forming assembly including such a lead forming apparatus, methods for using the lead forming apparatus and lead forming assembly, and a method for forming leads of electronic components. [Background technology]

[0002] Leads of electronic components are thin layers of metal that connect wiring from the electronic component to circuits within larger circuits, such as in electrical devices and circuit boards. Electronic components such as chips or integrated circuits often have multiple leads that are used to attach the electronic component. Leads in the form of wires are also called pins. Throughout this document, when the term "lead" is used, it usually refers to elongated leads in the form of metal wires or thin layers.

[0003] Electronic components with leads are often initially manufactured to be encapsulated, but the leads still protrude as straight linear elements from one or more sides of the molded electronic component. At this stage, at least some of the leads may still be fixed to another portion of the lead frame. To singulate (separate) the electronic component from the other portion of the lead frame, the leads must be cut. This cutting of the leads is also called "trimming." As a result of trimming, one end of the lead is attached to the electronic component, but the other end of the lead is no longer attached to the lead frame, so the lead now has a free end (also called the lead tip).

[0004] The released leads may be bent, for example, into a "J" or "S" shape, before mounting. "S-shaped leads" are also called gull-wing leads because they roughly resemble the shape of a seagull's wing. Electronic components equipped with gull-wing leads are supported by these leads when placed on a mounting surface. Each lead extends outward from the electronic component and may be bowed downward toward the mounting surface. The bowed portion of the lead adjacent to the electronic component is called the lead shoulder. Further outward, adjacent to the gull-wing lead shoulder, is the lead heel. The tip, or outer end, of the lead, which is preferably approximately parallel to the mounting surface, is called the lead toe. The lead toe is suitable for attachment to a mounting surface, for example, by soldering.

[0005] While trimming and forming of the leads may be performed as subsequent operations, it is also possible to combine trimming and forming, at least in part. Trimming and forming may actually occur within a single, or combined, device. A carrier carrying a matrix of electronic components is fed by a transport device to a trim and form device, which first trims one or more rows of leads. The carrier then moves, so that the trimmed row of leads arrives in the forming section of the trim and form device. Another row of leads, preferably a row adjacent to the trimmed row of leads, is trimmed, while the already trimmed leads in the forming section are bent to the desired shape. After processing in the trim and form device, the electronic components with singulated, bent leads leave the trim and form device. This trim and form process can be performed at high speed, trimming and forming a group of leads in less than a fraction of a second.

[0006] Trim-and-form machines are known in the art and may include an upper tool part, a lower tool part, and a guide element for holding and guiding the tool parts relative to one another. The tool parts are movable toward and away from one another. One or more punches may be attached to at least one of the tool parts and may extend through a guide plate. A die may also be attached to one of the tool parts, such that an electronic component may be placed between the tool parts such that the component's leads extend above one or more cavities in the die. The cavities may have a shape complementary to the outer surface of the punch. During operation, the leads are clamped in place. The punch is then moved into the cavity of the retained die while the leads are between the punch and the cavity. The complementary shapes of the interacting surfaces of the punch and die determine the shape of the resulting leads.

[0007] Leads of electronic components are often coated with surface coatings that improve the lead's conductivity and other electrical and physical properties, allowing for better and / or more reliable attachment. Such coatings may be thin metal layers of palladium, tin, or another suitable metal or alloy. Such thin metal surface coatings are brittle and prone to breakage or peeling during trimming and / or forming. A punch may contact the coated lead and force the lead into a corresponding cavity, a process also known as bending. Contacting the coated lead and applying a force to the lead may stretch one side of the lead while compressing the opposite side of the lead. Such localized stretching and compression of the lead may cause shear forces in the lead coating, resulting in the formation of microcracks in the lead coating. Additionally, portions of the lead coating may be scraped off the lead during the forming process. In addition to the coating, the lead itself, and even the electronic component, may be damaged by bending the lead. Coating that breaks away from the leads can accumulate in the die cavity, contaminating the cavity and requiring periodic cleaning of the trim-and-form equipment. Summary of the Invention [Problem to be solved by the invention]

[0008] Therefore, there is a need for a lead forming apparatus and method that allows for rapid and accurate forming of lead wires while preventing or at least limiting the chance of damaging the leads or the coating on the leads. [Means for solving the problem]

[0009] To this end, in a first aspect, the present invention provides a lead forming apparatus for forming leads of an electronic component, the lead forming apparatus comprising two cooperating opposing tool parts that are relatively movable toward and away from each other, a first clamp half attached to one of the tool parts and a second clamp half attached to the opposite tool part for clamping at least a portion of a lead, at least one first forming punch movably connected to one of the tool parts and at least one second forming punch movably connected to the opposite tool part, and a drive device configured to independently control the cooperating movements of the first forming punch and the second forming punch.

[0010] It has been found that by providing at least one first forming punch and at least one second forming punch, the total force required to punch and form the leads is distributed over two punch strikes instead of one. This reduces the maximum force applied to the leads, as a drive independently controls the coordinated movement of the at least one second forming punch and the at least one first forming punch. Damage to surface coatings present on the top surface of electronic components is reduced compared to standard lead forming apparatuses that use a single punch to form the leads. Additionally, the use of two forming punches instead of one increases lead forming accuracy. The lead shapes produced by the lead forming apparatus described above therefore more closely match the desired shape compared to state-of-the-art lead forming apparatuses.

[0011] Preferably, the at least one first forming punch and the at least one second forming punch are configured to continuously bend the leads of the electronic component while the leads are held between the first and second clamp halves. This allows the bending of the leads of the electronic component to be divided into multiple steps without the need to move the electronic component to a different location within the same machine or to an entirely different machine to perform subsequent bending steps. This reduces the maximum force, i.e., peak force, on the leads while incurring negligible processing time loss.

[0012] As disclosed herein, the forming punch is separate from the clamp halves and also separate from the die. The forming punch is configured to form the leads. This means that the forming punch can deform the leads from one shape to another, particularly by bending the leads. The forming can therefore contact the leads and move them in a predetermined direction, thereby deforming the shape of the leads. The forming punch can cooperate with a die, but this is not required in itself.

[0013] The clamp, clamp halves, and die can contact the leads but cannot independently deform the leads without the assistance of a cooperating forming punch.

[0014] The first clamp half may be movably mounted to one of the tool parts and / or the second clamp half may be movably mounted to the opposite tool part, providing additional freedom to move the clamp halves relative to the first and second forming punches, thus providing greater control over the lead forming process and resulting in more accurately formed leads.

[0015] Preferably, the at least one first forming punch is relatively movable toward and away from the at least one second forming punch, thereby allowing the punches to act on the reed sequentially, effectively distributing the total force required to form the reed over multiple punch strikes.

[0016] At least one first shaping punch may be arranged to bend at least a portion of the lead in one single direction, and at least one second shaping punch may be arranged to bend at least a portion of the lead in one second, opposite direction. Thus, the punches do not bend the lead in multiple directions. This effectively ensures that each punch strike results in a single bend in a single direction, rather than a single punch strike bending the lead in multiple directions. Bending the lead in one direction with a single punch strike requires less force than bending the lead in multiple directions with a single punch strike. Furthermore, shear forces are effectively reduced when bending the lead with multiple punch strikes, where each punch strike results in a single bend in the lead, rather than a single punch strike bending the lead multiple times.

[0017] In one embodiment, at least one first forming punch may be positioned adjacent to the first clamp half, and at least one second forming punch may be positioned adjacent to the second clamp half. This allows the leads to be shaped or formed by subsequent actions of the at least one first forming punch and the at least one second forming punch while retaining their clamped state. As outlined in this exemplary embodiment, by positioning at least one forming punch adjacent to the first clamp half and at least one second forming punch adjacent to the second clamp half, and both clamp halves and both forming punches in close proximity to one another within a single apparatus, it is not necessary to transport the electronic component and the leads connected to the electronic component between the formation of the leads by the at least one first forming punch and the formation of the leads by the at least one second forming punch. As a result, the process speed of the lead formation is increased while the peak force on the leads is reduced.

[0018] In another embodiment, the at least one first forming punch may comprise at least two forming punches positioned adjacent to each other. This advantageously allows the leads to be bent at least three times while still being clamped, thus further reducing processing time. This is particularly advantageous if at least one of the first forming punch and / or the second forming punch comprises a surface that allows the leads to be bent along it by the other of the at least one first forming punch or the at least one second forming punch, thereby allowing the forming punch to initially act as a forming punch and then act as a die for a subsequent forming operation by another forming punch.

[0019] In accordance with the above, one of the at least two forming punches may have a first side located adjacent to the first clamp half and a second, opposite side located adjacent to another of the at least two forming punches, which advantageously allows the forming punch to be aligned along the length of the lead, allowing subsequent movement of the forming punch to effectively bend the lead.

[0020] The first and second clamp halves are preferably movable in a direction substantially parallel to the direction of the combined motion of the first and second forming punches. When the clamp halves clamp the lead, the lead is supported on both sides of the lead. When either the first or second forming punch moves toward the unclamped portion of the lead in a direction substantially parallel to the clamp halves to begin bending the lead, the lead is fully supported by the clamp halves toward which the lead is bent. The above-described configuration, in which the first and second clamp halves are movable in a direction substantially parallel to the direction of the combined motion of the first and second forming punches, is advantageous because it ensures stable bending of the lead. The risk of the lead being formed by both clamp halves slipping out of the clamp is therefore minimized. For example, if the lead is clamped from the top and opposite bottom of the lead surface, it is advantageous to strike the clamped lead in a direction similar to or the same as the direction in which the lead is clamped (i.e., from the top or from the bottom). In this way, the lead will bend toward the top or bottom due to the punch strike, while the remainder of the lead remains firmly clamped, maximizing the efficiency of the forming process.

[0021] In a preferred embodiment, at least one first forming punch has a convex bending surface and at least one second forming punch has a concave bending surface; or The opposite is trueDuring operation, while the first forming punch moves to its end position, the side of the convex bending surface of the first forming punch closest to one of the clamp halves contacts the unclamped portion of the lead, bending the lead toward one of the clamp halves. The second forming punch then moves toward the first forming punch, i.e., toward the unclamped, bent portion of the lead. The second forming punch then moves this portion of the lead back along the convex bending surface of the first forming punch. This effectively forms the lead into a gull-wing shape with two successive punch strikes. The convex bending surface of the first forming punch is preferably complementary to the concave bending surface of the second forming punch.

[0022] The lead forming apparatus may include at least one trimming punch for trimming the leads. The leads must be cut from the lead frame and trimmed to a predetermined size so that the leads have a desired length that is useful when attaching them to a substrate. Advantageously, both trimming and forming can be performed simultaneously using the up and down movement of a portion of the lead forming apparatus.

[0023] In another embodiment, the lead forming apparatus includes at least one third forming punch movably mounted on one of the tool sections for bending the leads. This advantageously allows the forming of the leads to be divided into more subsequent punch strokes. Therefore, the total force on the leads per punch stroke is further reduced. As a result, the leads and coatings are less likely to be damaged by lead forming. For example, a first forming punch may bend the leads in a first direction, and after bending the leads in the first direction, a second forming punch may bend the leads in a second, opposite direction while the first forming punch remains in place. The leads can then be clamped by the other two clamp halves, and a third forming punch may further bend the leads in the first direction, resulting in the formation of gull-wing leads. This ensures that the heel-to-toe legs of the gull-wing leads are substantially parallel to the top and bottom surfaces of the electronic component attached to the leads. This further enables the electronic component to be effectively attached via the legs of the leads.

[0024] Preferably, the first and second clamp halves each have at least a partially flat lead contact surface. This ensures a large total surface area of ​​contact between the leads and both clamp halves. As a result, the frictional force between the clamp halves and the leads is increased. As a result, the leads are more securely held in place throughout the forming and / or trimming process, and the leads can be more accurately formed into the desired shape.

[0025] At least one of the first clamp half and the second clamp half may be arranged to at least partially shape the lead. When the punch strikes a portion of the lead adjacent to where the lead is clamped, the lead can be shaped not only by the punch but also by the first clamp half and / or the second clamp half. This can be achieved, for example, by providing one of the first clamp half and the second clamp half with a partially rounded or inclined surface at the location where the lead will be shaped, adjacent to where the lead is clamped. The shaping punch may be capable of shaping the lead by striking the lead against the surface of the clamp half during operation.

[0026] The first clamp half and the second clamp half are preferably provided with multiple contact surfaces for clamping multiple leads. This allows multiple leads to be bent with a single blow, significantly reducing the forming time required for each lead. Accordingly, the first forming punch and / or the second forming punch may be provided with multiple contact surfaces for bending multiple leads.

[0027] In one embodiment, the first and second clamp halves may be positioned to directly contact at least a portion of an electrical component lead. Direct contact is defined herein as contact without the presence of an intermediate object. Clamp halves that directly contact at least a portion of an electrical component lead do not clamp the lead through, for example, an intermediate electronic component. Therefore, clamping pressure is not applied to parts of the electronic component other than the lead, preventing accidental damage to the electronic component.

[0028] At least a portion of the lead clamping surface of the second clamp half may be positioned opposite at least a portion of the first forming punch that forms the die-like surface, and at least another portion of the lead clamping surface of the second clamp half may be positioned opposite at least a portion of the first clamp half that forms the clamp-like surface, and the die-like surface and the clamp-like surface may not be positioned on the same plane. Similarly, at least a portion of the lead clamping surface of the first clamp half may be positioned opposite at least a portion of the second forming punch that forms the die-like surface, and at least another portion of the lead clamping surface of the first clamp half may be positioned opposite at least a portion of the second clamp half that forms the clamp-like surface, and the die-like surface and the clamp-like surface may not be positioned on the same plane, and the reverse configuration is also possible.

[0029] Advantageously, the die-like surface and the clamp-like surface are not coplanar, but are arranged, for example, in planes that are arranged at an angle to one another, which allows the leads to be at least partially bent along the die-like surfaces of the clamp halves. The clamp halves can thus have a dual function, acting as a die for the action of at least one forming punch and also as clamp halves for clamping the leads of the electrical component.

[0030] In a second aspect, the present invention relates to a lead forming assembly including a lead forming apparatus according to the present invention, the lead forming apparatus comprising: a lead trimming and / or pre-forming section including an upper trimming clamp half movably mounted on a first tool part, a lower trimming clamp half movably mounted on a second tool part, and a third trimming punch; a lead forming section including a first clamp half and a second clamp half, at least one first forming punch and at least one second forming punch; and a final forming section including an upper final forming clamp movably mounted on the first tool part, a lower final forming clamp movably mounted on the second tool part, and at least one third forming punch. This assembly allows first trimming the leads, then forming the leads, and finally pushing the formed leads in a desired direction. The total force required to form the leads is substantially distributed over at least three steps. As a result, the maximum force exerted on the leads at any one time is reduced, reducing or even completely preventing damage to the leads, surface coatings, and electronic components. Combining the lead trimming and / or pre-forming section, lead forming section, and final forming section into one assembly also enables high-speed trimming and forming of the leads.

[0031] In a third aspect, the present invention relates to the use of a lead forming apparatus according to the invention or a lead forming assembly according to the invention for forming the leads of at least one electronic component.

[0032] In a fourth aspect, the present invention relates to a method for forming leads of an electronic component, the method including: (a) preparing an electronic component having at least one lead; (b) clamping both sides of the at least one lead at a clamping location opposite a tip of the lead adjacent to the electronic component; (c) bending the lead in a first bending direction at a first bending location located between the clamping location and the tip of the lead; and (d) bending the lead in a second bending direction at a second bending location between the first bending location and the tip, where steps (c) and (d) are performed sequentially. This divides the bending of the lead into steps (c) and (d). Each bend formed in the lead requires less force than bending the lead in both the first and second directions simultaneously. This results in reduced or prevented damage to the lead, the surface coating, and the electronic component.

[0033] The first bending direction is preferably opposite to the second bending direction. This effectively ensures that the leads are initially bent in a single direction, rather than simultaneously bending the leads in multiple directions. Bending the leads in one direction requires less force than bending the leads in multiple directions at once. Furthermore, multiple successive bends effectively reduce shear forces, thereby reducing or preventing damage to the leads, electronic components, and surface coatings.

[0034] Alternatively or additionally, steps c) and d) are subsequently performed while the lead remains in the clamping position, which effectively reduces the time required to form the lead into, for example, a gull-wing shape. Since multiple bending steps can be performed using the same clamp halves, the processed lead does not need to bend the lead just once before proceeding to the next forming station.

[0035] Preferably, the leads are cut before step b), which makes it easier to form the leads into a desired length and shape, such as a gull-wing shape.

[0036] After step d), at least one lead may be further bent in the first bending direction, which effectively divides the bending of the lead in the first direction into two separate steps, thereby further reducing the total force applied to the lead at any one time, providing the benefits described above.

[0037] Preferably, during step c), the at least one lead is bent along at least a portion of the surface of at least one clamp half clamping the at least one lead together with another clamp half at a clamping location. This advantageously allows the lead to be partially shaped by the at least one clamp half. The clamp half can act like a stop for the punch, so that the lead is simultaneously engaged by the punch and by a portion of the clamp half over a given length of the lead.

[0038] The leads may be bent during step d) along at least a portion of a surface of a punch that bends the at least one lead in a first bending direction at the first bending location. At least a portion of the surface of the at least one punch that bends the lead in the first bending direction may be shaped to allow the lead to be bent back along this surface toward the punch. The punch thus acts as a die that is struck by another punch, thereby shaping the lead.

[0039] The invention will be further clarified on the basis of the non-limiting exemplary embodiments shown in the following figures. [Brief explanation of the drawings]

[0040] [Figure 1] 1 is a side cross-sectional view of a portion of a prior art lead forming apparatus. [Figure 2A] 1A-1C are side cross-sectional views of a portion of the lead forming apparatus of the present invention in various positions. [Figure 2B] 1A-1C are side cross-sectional views of a portion of the lead forming apparatus of the present invention in various positions. [Figure 3] 1 is a cross-sectional view of a lead forming apparatus according to the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0041] FIG. 1 shows a portion of a prior art lead forming apparatus 1, along with a portion of an electronic component 2 and a lead 3 extending from the electronic component 2. The lead 3 is clamped between a first clamp half 4 and a portion of a die 5. The lead 3 is formed using a first forming punch 6, which is moved downward as indicated by arrow 7. The force applied by the first forming punch 6 bends the lead 3 at a shoulder 8 and a heel 9. Because the lead 3 must be bent at the shoulder 8 and the heel 9, a relatively large downward force is required for the first forming punch 6 to press the lead 3 into the die 5.

[0042] FIG. 2A shows a portion of a lead forming apparatus 1 according to the present invention in a first position, along with a portion of an electronic component 2 and a lead 3 extending from the electronic component 2. The lead 3 is clamped between a first clamp half 4 and a second clamp half 4′. The lead 3 is partially formed using a first forming punch 6, which is moved downward as indicated by arrow 7. A force applied by the first forming punch 6, which has a convex surface 10, bends the lead 3 at a shoulder 8 and partially bends the lead 3 at a heel 9. Because the lead 3 is bent primarily at the shoulder 8, only a relatively small downward force is required for the first forming punch 6 to bend the lead 3 toward the second forming punch 6′. The second forming punch 6′, which has a concave surface 11, partially acts as a die for the first forming punch 6 at this stage. The heel 9 is not yet fully formed in this first position and is shaped along the inclined surface 12 of the second clamp half 4' to prevent the lead 3 from bending excessively in the direction of the first arrow 7.

[0043] 2B shows the same portion of the lead forming apparatus 1 according to the present invention as in FIG. 2A, but in a second position. In this second position, the lead 3 has been bent back by the second forming punch 6' in the direction of the second arrow 13 along the convex surface 10 of the first forming punch 6. The complementary concave surface 11 of the second forming punch 6' ensures that the heel 9 is fully formed.

[0044] The force required to bend lead 3 in the direction of arrow 7 to partially form shoulder 8 as shown in FIG. 2A and the force required to bend lead 3 upward to form heel 9 as shown in FIG. 2B are both less than the force required to simultaneously partially form shoulder 8 and heel 9 as shown in FIG. 1.

[0045] FIG. 3 shows a cross section of a lead forming apparatus 1 for forming leads 3 of an electronic component 2. The apparatus includes two opposing cooperating tool parts 14, 14'. The distance between the tool parts 14, 14' is adjustable via a bar 15, allowing the tool parts 14, 14' to be relatively movable toward and away from each other. The lead forming apparatus 1 includes a first clamp half 4 movably mounted on one of the tool parts 14 and a second clamp half 4' movably mounted on the opposite tool part 14' for clamping at least a portion of the leads 3. The cooperating tool parts 14, 14' and the clamp halves 4, 4' are all connected via a drive 16 in the form of a piston 16. Two first forming punches 6 move downward, bending the leads 3 on both sides of the electronic component 2 downward. The leads 3 are also partially bent upward because the second forming punch 6' acts as a stopper for the leads 3. The first forming punch 6 is movably connected to the upper tool part 14, and the second forming punch 6' is both movably connected to the opposing lower tool part 14'. The drive 16 is configured to independently control the coordinated movement of the first forming punch 6 and the second forming punch 6', enabling the lead 3 to be bent into a gull-wing shape.

[0046] The verb "comprise" and its conjugations as used in this patent document should be understood to mean not only "comprise" but also to include the expressions "include," "substantially include," "formed by," and conjugations thereof.

Claims

1. A lead forming apparatus for forming leads of an electronic component, the lead forming apparatus comprising: - two cooperating opposing tool parts which are relatively movable towards and away from each other; a first clamp half attached to one of the tool parts and a second clamp half attached to the opposite tool part for clamping at least a portion of the lead; at least one first forming punch movably connected to one of said tool parts and at least one second forming punch movably connected to said tool part on the opposite side; a drive device configured to independently control the cooperative movement of said first forming punch and said second forming punch; wherein the at least one first forming punch and the at least one second forming punch are configured to continuously bend the leads of the electronic component while holding the leads clamped by the first clamp half and the second clamp half.

2. The lead forming apparatus of claim 1 , wherein the first clamp half is movably connected to one of the tool portions and / or the second clamp half is movably connected to the opposite tool portion.

3. 3. The lead forming apparatus according to claim 1, wherein the at least one first forming punch is relatively movable in a direction toward the at least one second forming punch and in a direction away from the at least one second forming punch.

4. 4. The lead forming apparatus of claim 1, wherein the at least one first forming punch is arranged to bend at least a portion of the lead in a first direction, and the at least one second forming punch is arranged to bend at least a portion of the lead in a second, opposite direction.

5. the at least one first forming punch is located adjacent to the first clamp half; and the at least one second forming punch is located adjacent to the second clamp half; The lead forming apparatus according to claim 1 .

6. The lead forming apparatus of claim 1 , wherein the at least one first forming punch comprises at least two forming punches positioned adjacent to each other.

7. 7. The lead forming apparatus of claim 6, wherein one of the at least two forming punches comprises a first side positioned adjacent to the first clamp half and a second opposite side positioned adjacent to another of the at least two forming punches.

8. 8. The lead forming apparatus of claim 1, wherein the first clamp half and the second clamp half are movable in a direction substantially parallel to a direction of cooperative movement of the first forming punch and the second forming punch.

9. 9. The lead forming apparatus of claim 1, wherein the at least one first forming punch has a convex bending surface and the at least one second forming punch has a concave bending surface, or vice versa.

10. The lead forming apparatus according to claim 1 , further comprising at least one trimming punch for trimming the leads.

11. The lead forming apparatus of claim 1 , further comprising at least one third forming punch movably mounted to one of the tool portions for bending the leads.

12. The lead forming apparatus of claim 1 , wherein the first clamp half and the second clamp half each include an at least partially flat lead contact surface.

13. The lead forming apparatus of claim 1 , wherein at least one of the first clamp half and the second clamp half is positioned to at least partially form the lead.

14. The lead forming apparatus according to claim 1 , wherein the first clamp half and the second clamp half are provided with a plurality of contact surfaces for clamping a plurality of leads.

15. The lead forming apparatus according to claim 1 , wherein the first forming punch and / or the second forming punch are provided with a plurality of contact surfaces for bending a plurality of leads.

16. The lead forming apparatus of claim 1 , wherein the first clamp half and the second clamp half are positioned to directly contact at least a portion of the electrical component lead.

17. at least a portion of the lead clamping surface of the second clamp half is positioned opposite at least a portion of the first forming punch that forms a die-like surface, and at least another portion of the lead clamping surface of the second clamp half is positioned opposite at least a portion of the first clamp half that forms a clamp-like surface; The lead forming apparatus of claim 1 , wherein the die-like surface and the clamp-like surface are not coplanar.

18. A lead forming assembly comprising the lead forming apparatus of any one of claims 10 to 17, wherein the lead forming apparatus comprises: a lead trimming and / or preforming section comprising an upper trimming clamp half movably mounted on said first tool part, a lower trimming clamp half movably mounted on said second tool part, and at least one trimming punch; a lead forming section comprising the first clamp half and the second clamp half, the at least one first forming punch and the at least one second forming punch; a final forming section comprising an upper final forming clamp movably mounted on said first tool part, a lower final forming clamp movably mounted on said second tool part, and said at least one third forming punch; A lead forming assembly comprising:

19. 19. Use of the lead forming apparatus of any one of claims 1 to 17 or the lead forming assembly of claim 18 for forming leads of at least one electronic component.

20. 1. A method for shaping leads of an electronic component, the method comprising: a) providing an electronic component having at least one lead; b) clamping both side surfaces of the at least one lead at a clamping location opposite to the tip of the lead adjacent to the electronic component; c) bending the lead in a first bending direction at a first bending location located between the clamping location and the tip of the lead; d) bending the lead in a second bend direction at a second bend location between the first bend location and the tip; and steps c) and d) are subsequently performed.

21. 21. The method of claim 20, wherein the first bending direction is opposite the second bending direction.

22. 22. The method of claim 20 or 21, wherein steps c) and d) are performed subsequently while the lead remains in the clamped position.

23. 23. The method of any one of claims 20 to 22, wherein the lead is cut before step b).

24. 24. The method of claim 20, wherein after step d), the lead is further bent in the first bending direction.

25. 25. The method of claim 20, wherein the lead is bent during step c) along at least a portion of a surface of at least one clamp half clamping the at least one lead with another clamp half at the clamping location.

26. 26. The method of any one of claims 20 to 25, wherein the lead is bent during step d) along a surface of a punch that bends the lead in a first bending direction at the first bending location.

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