Heat Treatment Equipment

Abstract

The present invention relates to equipment for semiconductor manufacturing, and more particularly to a thermal processing apparatus. The apparatus includes a cooler (200), a heater (300), and a transmission unit (400). The cooler (200) includes a cooling plate (210) for cooling a substrate (w), and the heater (300) includes a heating plate (310) for heating the substrate (w). The transmission unit (400) includes a transmission arm (410), a lifting module, and a linear module. The transmission arm (410) supports the substrate (w) and transports the substrate (w) between the cooler (200) and the heater (300). The transmission arm (410) is disposed on the lifting module, and the lifting module drives the transmission arm (410) up and down. The linear module drives the transmission arm (410) to transport the substrate (w) between the cooling plate (210) and the heating plate (310). The internal space of the device is optimized.

Description

[Technical Field]

[0001] The present invention relates to equipment for semiconductor manufacturing, and more particularly to thermal processing equipment. [Background technology]

[0002] Currently, semiconductor devices are formed on semiconductor substrates such as wafers by performing a series of processes such as thin film deposition, photolithography, etching, cleaning, etc. The photolithography process refers to patterning a thin film deposited on a substrate, and includes a process of applying a photoresist solution to the substrate using a coating device to form a photoresist film, an exposure process of irradiating the substrate with light of a predetermined pattern, and a development process of applying a developer to the photoresist film using a developing device to form a photoresist pattern.

[0003] The coating apparatus includes a heat treatment device for performing a heat treatment on the substrate before and after the step of coating the substrate with the photoresist liquid, and the developing apparatus also includes a heat treatment device for performing a heat treatment on the substrate before and after the development step.

[0004] In the prior art, a heat treatment apparatus has a heater for heating a substrate and a cooler for cooling the substrate, and since the internal space of the heat treatment apparatus is limited, there is an urgent need to solve the problem of how to arrange each device in the limited space. Summary of the Invention

[0005] In consideration of the above problems, an object of the present invention is to provide a heat treatment apparatus that optimizes the layout and structure of each component.

[0006] To achieve the above objectives, the present invention provides the following technical solutions:

[0007] A thermal processing apparatus having a cooler, a heater, and a transmission unit, wherein the cooler has a cooling plate for cooling a substrate, the heater has a heating plate for heating the substrate, the transmission unit has a transmission arm, a lifting module, and a linear module, the transmission arm is movably arranged on the lifting module, the lifting module is arranged on the linear module, the transmission arm is used to support the substrate, the lifting module is used to drive the transmission arm up and down, and the linear module is used to drive the transmission arm to transport the substrate between the cooling plate and the heating plate.

[0008] Compared with the prior art, the heat treatment apparatus of the present invention has the following beneficial effects:

[0009] The cooler and heater are integrated into one thermal processing device. The linear module allows the transmission arm to move between the cooler and heater, allowing the substrate to be moved without moving the cooler. The transmission arm is driven by the lifting module and can be raised and lowered to pick up and place the substrate. This avoids placing the pick-up and placement device at the cooler or heater position. This reduces the space occupied and optimizes the internal space of the thermal processing device.

[0010] In order to more clearly describe the embodiments of the present invention and the technical solutions of the prior art, the drawings that need to be used in the description of the embodiments and the prior art are briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without any creative efforts. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a perspective view showing a heat treatment apparatus according to a first embodiment of the present invention. [Figure 2]FIG. 2 is a top view of the heat treatment apparatus according to the first embodiment of the present invention. [Figure 3] FIG. 3 is a schematic structural diagram of a transmission unit according to the first embodiment of the present invention. [Figure 4] FIG. 4 is a schematic structural diagram of a transmission unit according to a second embodiment of the present invention. [Figure 5] FIG. 5 is a schematic structural diagram of a transmission unit according to a third embodiment of the present invention. [Figure 6] FIG. 6 is a schematic structural diagram of a transmission unit according to a fourth embodiment of the present invention. [Figure 7] FIG. 7 is a schematic flow chart of an exemplary substrate transfer method according to a fifth embodiment of the present invention. [Figure 8] FIG. 8 is a schematic structural diagram of a substrate transfer method according to a fifth embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0012] In order to make the objects, features and advantages of the present invention clearer and easier to understand, the technical solutions in the embodiments of the present invention are clearly and completely described below with reference to the accompanying drawings. It is clear that the embodiments described below are only some embodiments of the present invention, and are not all embodiments. All other embodiments that can be obtained by those skilled in the art based on the embodiments of the present invention without any creative efforts fall within the protection scope of the present invention.

[0013] In describing the present invention, when a component is "connected" to another component, the component may be directly connected to the other component, or there may be other components between the two components. When a component is "disposed on" another component, the component may be directly disposed on the other component, or there may be other components between the two components.

[0014] In the following, the technical solutions of the present invention are further described with reference to the accompanying drawings and specific embodiments.

[0015] First embodiment As shown in FIGS. 1 to 3, this embodiment relates to a heat treatment apparatus, and the apparatus 1000 includes a housing, a cooler 200, a heater 300, a transmission unit 400, and a control unit 500.

[0016] The housing has an opening 110 through which the substrate enters and leaves the apparatus 1000. The cooler 200, the heater 300, and the transmission unit 400 are each connected to a control unit 500 and are arranged within the housing. The control unit 500 is used to control the operations of the cooler 200, the heater 300, and the transmission unit 400.

[0017] The cooler 200 has a cooling plate 210 for supporting and cooling the substrate, and the heater 300 has a heating plate 310 for supporting and heating the substrate.

[0018] The transmission unit 400 is disposed within the housing and attached to the side of the cooler 200 away from the heater 300. The transmission unit 400 includes a transmission arm 410, a lifting module, and a linear module. The transmission arm 410 is movably disposed on the lifting module, and the lifting module is movably disposed on the linear module. The transmission arm 410 is used to support a substrate and can be moved between the cooler 200 and the heater 300 by driving the linear module.

[0019] During the operation, the control unit 500 controls the lifting module and the linear module to perform the operation. The transmission arm 410 is disposed on the lifting module, and the lifting module drives the transmission arm 410 up and down. The linear module drives the transmission arm 410 to move linearly between above the cooling plate 210 and above the heating plate 310.

[0020] Specifically, the lifting module includes a first driving unit 450, a first sliding member 481, and a first guide rail 480. The first sliding member 481 is slidably disposed on the first guide rail 480. The linear module includes a first moving member 430, a second driving unit 440, a conveyor belt 460, a second guide rail 490, a second moving member 431, and an auxiliary guide rail 420. The second guide rail 490 is disposed within the housing. The first moving member 430 is movably attached to the second guide rail 490 and disposed on the conveyor belt 460. The first driving unit 450 is disposed on the first moving member 430. The auxiliary guide rail 420 is disposed on one side of the second guide rail 490 and spaced apart from the second guide rail 490. The second moving member 431 is movably disposed on the auxiliary guide rail 420. The first guide rail 480 is disposed on the second moving member 431. In this embodiment, the first driving part 450 is a sliding cylinder, which includes an L-shaped second sliding member and a driving member. The driving member is a cylinder assembly, which includes a track therein. The driving member moves the second sliding member along the track.

[0021] The second driving unit 440 operates the conveyor belt 460, which slides the first moving member 430 on the second guide rail 490. The first moving member 430 moves together with the lifting module, the transmission arm 410, and the second moving member 431. The second driving unit 440 slides the second moving member 431 on the auxiliary guide rail 420, and simultaneously slides the first moving member 430 on the second guide rail 490. The provision of the auxiliary guide rail 420 increases the moving speed of the transmission arm 410 and improves the stability of the device.

[0022] The transmission unit 400 further includes two support members 412a and 412b. The support members 412a and 412b are respectively disposed on the transmission arm 410. One side of the support member 412a is disposed on the second slide member of the first driving unit 450. One side of the support member 412b is disposed on the first slide member 481. When the second slide member is driven and moved, the support member 412a moves together with the second slide member, driving and moving the transmission arm 410 and the other support member 412b together. In other words, the transmission arm 410 slides with both support members 412a and 412b, achieving up and down movement. The first driving unit 450 is used to synchronously drive the two support members 412a and 412b, so that the support members 412a and 412b on both sides move up and down at the same speed.

[0023] The support member 412a is driven by the first drive unit 450 to move up and down, thereby driving the transmission arm 410 up and down. The transmission arm 410 can be raised in the vertical direction to load and support a substrate, and can be lowered in the vertical direction to unload the substrate.

[0024] If necessary, the first moving member 430 is removed, and the first driving part 450 is directly and movably disposed on the second guide rail 490. The first driving part 450 moves linearly along the second guide rail 490.

[0025] In one optional embodiment, the support members 412a, 412b and the transmission arm 410 are integrally formed. The linear module further includes a base 470, which is disposed on the lower surface within the housing. The conveyor belt 460 is connected to the base 470.

[0026] Optionally, the lifting module has two first drive units 450. The two first drive units 450 drive the moving support members 412a, 412b, respectively.

[0027] In one optional embodiment, the housing has a plurality of guide grooves 120. The guide grooves 120 are movement paths for guiding the support members 412a or 412b.

[0028] In this embodiment, the housing includes a main housing 100 and an upper plate 130, and the upper plate 130 covers the main housing 100. Two guide grooves 120 are formed in the main housing 100. Two guide grooves 120 are provided on both sides of the upper plate 130 to guide the movement of the support members 412a and 412b. If necessary, one guide groove 120 may be provided in the main housing 100. In another embodiment, multiple guide grooves 120 may be provided in the upper plate 130.

[0029] In this embodiment, the upper plate 130 is disposed below the cooling plate 210 and covers the lifting module and the linear module. The upper plate 130 is used to prevent particles generated during operation of the transmission unit 400 (such as the second drive unit 440) from adhering to the substrate disposed on the cooling plate 210.

[0030] In one optional embodiment, the transmission arm 410 has a pair of arc-shaped support portions 415. Each support portion 415 has at least two protrusions 411 protruding from the inside of the support portion 415. The cooling plate 210 has at least two grooves 220 along its outer periphery. When placing or removing a substrate, the protrusions 411 are received in the grooves 220 by the transmission arm 410. Furthermore, the protrusions 411 are provided with support pins 413, which support the substrate. In this embodiment, the pair of arc-shaped support portions 415 have four protrusions 411, and the cooling plate 210 is provided with four corresponding grooves 220.

[0031] The substrate slides easily during transportation. Furthermore, the support pins 413 are provided with blocking portions 414, which contact the outer edges of the substrate. The blocking portions 414 can prevent the substrate from slipping off the support pins 413.

[0032] Furthermore, the heater 300 has a cover plate 320 that covers the heating plate 310 and forms a closed space. The substrate is heated in the closed space to avoid heat loss during the heating process. Before the substrate is transferred onto the heating plate 310, a third driving unit (not shown) raises the cover plate 320 to a predetermined height. Once the substrate is placed on the heating plate 310, the third driving unit lowers the cover plate 320, and the substrate is subjected to a heating process.

[0033] The first driving unit 450, the second driving unit 440 and the third driving unit in the present application may be a cylinder or a motor.

[0034] Furthermore, the heater 300 has three thimble pins 330, which are connected to a fourth drive unit (not shown). The fourth drive unit extends the thimble pins 330 from the heating plate 310 to support the substrate, or moves the thimble pins 330 to below the heating plate 310 while supporting the substrate. This allows the substrate to be transferred to the heating plate 310.

[0035] In the present invention, the linear module drives the transmission unit 400 to move between the cooler 200 and the heater 300. The lifting module drives the transmission unit 400 to raise and lower, preventing the substrate receiving device from being located at the position of the cooler 200 or the heater 300. This reduces the occupied space and optimizes the internal space of the thermal processing device.

[0036] Second embodiment As shown in FIG. 4, this embodiment provides a heat treatment device in which the structure of a transmission unit 400 is different from that of the first embodiment.

[0037] The transmission section 400 includes a transmission arm 410, a lifting module, a linear module, and two support members 412. The lifting module includes a first drive section 450 and two first guide rails 480, and the linear module includes a second drive section 440 and a conveyor belt 460.

[0038] This linear module further includes two parallel-arranged second guide rails 490 and two first movable members 430. The two second guide rails 490 are disposed on both sides of the conveyor belt 460. The two first movable members 430 are movably attached to the second guide rails 490. Both ends of a connector 432 are disposed on the two first movable members 430, and a middle portion of the connector 432 is disposed on the conveyor belt 460. Therefore, the force of the conveyor belt 460 is transmitted to the two first movable members 430, and the second driving unit 440 drives the two first movable members 430 to move on the respective second guide rails 490. The first driving unit 450 is disposed on the connector 432, and the two first guide rails 480 are disposed on both ends of the connector 432. Each support member 412 is slidably disposed on the corresponding first guide rail 480 by a first sliding member 481. The first drive unit 450 drives the two support members 412 up and down, thereby driving the transmission arm 410 up and down.

[0039] The second driving unit 440 moves the lifting module, the support member 412 and the transmission arm 410 along the two second guide rails 490 by the two first moving members 430 .

[0040] In this embodiment, two support members 412 are formed on one frame.

[0041] The other configurations of this embodiment are the same as those of the first embodiment, and will not be described again here.

[0042] Third embodiment As shown in FIG. 5, this embodiment provides a heat treatment apparatus that differs from the second embodiment in the following respects.

[0043] The transmission arm 410 has a pair of long, strip-shaped support portions 415. The linear module has a second guide rail 490. Each support portion 415 has at least two support pins 413, and the support pins 413 are provided with blocking portions 414. The cooling plate 210 has two slits (not shown) for accommodating the support pins 413. When the first moving member 430 moves on the second guide rail 490, the support pins 413 move within the slits of the cooling plate 210.

[0044] The shape of the support member 412 is different from that of the support member of the second embodiment, and the support member 412 of this embodiment has a strip-like plate structure. Both ends of the support member 412 are connected to the corresponding support portions 415, respectively.

[0045] Other configurations of this embodiment are the same as those of the second embodiment, and will not be described again here.

[0046] Fourth embodiment As shown in FIG. 6, this embodiment provides a heat treatment apparatus that differs from the third embodiment in the following respects.

[0047] The transmission arm 410 has a C-shaped structure, which is composed of two symmetrical parts. The linear module and the lifting module are concentrated under one part of the transmission arm 410. More space is left under the other part of the transmission arm 410 to arrange other components of the device 1000 while avoiding interference between the transmission section 400 and other components. The transmission section does not have a support member 412, and the transmission arm 410 is directly disposed on the first slide member 481.

[0048] The second guide rail 490 and the conveyor belt 460 are arranged in parallel, and the lifting module is arranged on the side of the second guide rail 490 away from the conveyor belt 460 and the second drive unit 440. The lifting module has two first guide rails 480, and the first drive unit 450 drives the first slide member 481 to move up and down along the first guide rails 480. The second drive unit 440 drives the lifting module and the transmission arm 410 to move linearly on the first guide rails 490.

[0049] The transmission arm 410 has at least two protrusions 411 protruding from the inside of the transmission arm 410. The cooling plate 210 has at least two grooves 220 along the outer periphery. When a substrate is placed or removed by the transmission arm 410, the protrusions 411 are received in the grooves 220. Furthermore, the protrusions 411 are provided with support pins 413, which support the substrate. In this embodiment, the transmission arm 410 has four protrusions 411, and the cooling plate 210 is provided with four corresponding grooves 220.

[0050] Fifth embodiment As shown in Figures 7 and 8, this embodiment describes an example of a method for transporting a heat treatment apparatus in the heat treatment apparatus described in the first to fourth embodiments. Diagram (a) of Figure 8 shows a state in which the apparatus is not operating. Diagram (b) shows an operational state in which the transmission arm 410 is raised and supports a substrate W. Diagram (c) shows an operational state in which the transmission unit 400 transports the substrate W to the heater 300. Diagram (d) shows an operational state in which the transmission unit 400 returns after the heater 300 receives the substrate W. Diagram (e) shows an operational state in which the heater 300 bakes the substrate W after the transmission arm 410 has returned to its initial position.

[0051] Referring to Figures 1, 2, 7 and 8, the specific steps are as follows: S1: The first driving unit 450 drives the transmission arm 410 to raise it to a predetermined position. As shown in FIG. 1(b), the substrate W is transported into the apparatus 1000 through the opening 110, and the substrate W is placed on the support pins 413. S2: As shown in Figure (c), the third driving unit (not shown) drives the cover plate 320 to raise it to a predetermined height, and the second driving unit 440 drives the first moving member 430 to move it linearly, thereby moving the substrate W to the position of the heater 300. S3: The thimble pins 330 rise and extend above the heating plate 310 to receive the substrate W on the transmission arm 410. The second drive unit 440 drives the first moving member 430 backward to return the transmission arm 410 to its initial position. As shown in FIG. 3(d), the thimble pins 330 descend below the heating plate 310 to transport the substrate W onto the heating plate 310. S4: As shown in FIG. 1(e), the third driving unit drives the cover plate 320 to descend, so that the cover plate 320 covers the heating plate 310, and the heating plate 310 starts baking the substrate W. S5: After the baking is completed, the third driving unit drives and lifts the cover plate 320. The thimble pins 330 move up to push the substrate W onto the heating plate 310, and the second driving unit 440 drives and moves the transmission arm 410 to the heater 300 to receive the baked substrate W. S6: The second driving unit 440 moves the transmission arm 410 and the substrate W to the position of the cooler 200. S7: The transmission arm 410 descends below the upper surface of the cooling plate 210. The upper surface of the cooling plate 210 receives the substrate W, and the cooling plate 210 cools the substrate W. S8: After the substrate W has been cooled, the first drive unit 450 drives and lifts the transmission arm 410. First, the support pins 413 support the substrate W, and then the transmission arm 410 continues to lift up to a predetermined height, and the substrate W is removed and transported outside the apparatus 1000.

[0052] The above steps S1 to S8 are repeated for the next substrate W.

[0053] The above method shows and describes the substrate transport method of the thermal processing apparatus of the present invention, and it is understood that the substrate can be transported in different transport methods according to different processing requirements based on the thermal processing apparatus of the present invention.

[0054] The above-described embodiments are only used to describe the technical solutions of the present invention and are not intended to limit the technical solutions. Although the present invention has been described in detail above with reference to the above-described embodiments, those skilled in the art should understand that the technical solutions described in the above-described embodiments can be modified, or some technical features can be replaced with equivalents. However, these modifications and replacements do not deviate from the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of each embodiment of the present invention.

Claims

1. A heat treatment device having a cooler (200), a heater (300), and a transmission unit (400), The cooler (200) has a cooling plate (210) for cooling the substrate, and the heater (300) has a heating plate (310) for heating the substrate, The transmission unit (400) includes a transmission arm (410), a lifting module, and a linear module, the transmission arm (410) being movably disposed on the lifting module, and the lifting module being disposed on the linear module; the transmission arm (410) is used to support the substrate, the lifting module is used to drive the transmission arm (410) up and down, and the linear module is used to drive the transmission arm (410) to transport the substrate between the cooling plate (210) and the heating plate (310).

2. 2. The heat treatment device of claim 1, wherein the linear module has a second drive section (440) and a second guide rail (490), and the second drive section (440) is used to slide the lifting module and the transmission arm (410) on the second guide rail (490).

3. 3. The heat treatment device of claim 2, wherein the linear module further comprises a first moving member (430), the lifting module is disposed on the first moving member (430), the first moving member (430) is movably mounted on the second guide rail (490), and the second driving unit (440) drives the first moving member (430) to slide on the second guide rail (490).

4. The transmission section (400) has a support member (412a), one side of which is disposed on the transmission arm (410); 4. The heat treatment apparatus of claim 3, wherein the lifting module has a first driving unit (450), the first driving unit (450) having a second slide member and a driving member, the other side of the support member (412a) being disposed on the second slide member, and the driving member driving the second slide member to slide up and down and driving the transmission arm (410) to lift and lower.

5. The linear module further includes a second moving member (431) and an auxiliary guide rail (420), the lifting module further includes a first sliding member (481) and a first guide rail (480), the first sliding member (481) is slidably disposed on the first guide rail (480), and the first guide rail (480) is disposed on the second moving member (431), the transmission unit (400) further includes another supporting member (412b), both sides of which are disposed on the transmission arm (410) and the first sliding member (481), respectively; 5. The heat treatment apparatus of claim 4, wherein the auxiliary guide rail (420) is spaced apart from the second guide rail (490), the second moving member (431) is movably arranged on the auxiliary guide rail (420), and the second driving unit (440) slides the second moving member (431) on the auxiliary guide rail (420) and simultaneously slides the first moving member (430) on the second guide rail (490).

6. The transmission arm (410) is provided with at least two protrusions (411); 2. The thermal processing apparatus of claim 1, wherein the cooling plate (210) has at least two grooves (220) along its outer periphery, the protrusions (411) are accommodated in the grooves (220) during the process of placing or supporting the substrate by the transmission arm (410), and the protrusions (411) are provided with support pins (413), which are used to support the substrate.

7. 7. The thermal processing apparatus according to claim 6, wherein blocking portions (414) are provided on the support pins (413), and the blocking portions (414) contact the outer edges of the substrate to prevent the substrate from slipping off the support pins (413).

8. The linear module has a connector (432), two parallel-arranged second guide rails (490), and two first moving members (430); the transmission unit (400) has two support members (412), one side of which is disposed on the transmission arm (410); the lifting module has a first driving unit (450), two first slide members (481), and two first guide rails (480); Both ends of the connector (432) are respectively disposed on the two first moving members (430), the two first moving members (430) are respectively movably attached to the corresponding second guide rails (490), and the second driving unit (440) drives the two first moving members (430) to move linearly; 4. The heat treatment device of claim 3, wherein the first drive unit (450) is arranged on the connector (432), the two first guide rails (480) are respectively arranged at both ends of the connector (432), and the support member (412) is slidably mounted on the corresponding first guide rail (480) by a first slide member (481).

9. 2. The thermal processing apparatus of claim 1, wherein the transmission arm (410) has a pair of band-shaped support portions (415), the support portions (415) are arranged under the cooling plate (210), each support portion (415) has at least two support pins (413) for supporting the substrate, and the cooling plate (210) has two slits for accommodating the support pins (413).

10. 7. The heat treatment device according to claim 6, wherein the transmission arm (410) has a pair of arc-shaped support portions (415), each of which has at least two of the protrusions (411) protruding from an inner side of the support portion (415).

11. 2. The thermal processing apparatus of claim 1, further comprising a top plate (130), the top plate (130) being disposed below the cooling plate (210) and covering the lifting module and the linear module.

12. 2. The heat treatment apparatus according to claim 1, further comprising a housing, wherein the cooler (200), the heater (300), and the transmission unit (400) are arranged in the housing, the housing is provided with one or more guide grooves (120), and the transmission unit (400) transports the substrate along the guide grooves.

13. 4. The heat treatment device of claim 3, wherein the transmission arm (410) has a C-shaped structure, the C-shaped structure having two symmetrical parts, the linear module and the lifting module are collectively arranged under a part of the transmission arm (410), and the lifting module is arranged on one side of the second guide rail (490) away from the second drive part (440).

14. 14. The heat treatment device of claim 13, wherein the lifting module comprises a first drive unit (450), two first slide members (481), and two first guide rails (480), the transmission arm (410) is disposed on the first slide member (481), and the first drive unit (450) moves the first slide member (481) up and down along the first guide rails (480).

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