Color conversion layer for display device and method for forming display device

Abstract

A color conversion array for a multicolor display is provided herein. The color conversion array includes a plurality of features, each feature having a base, a distal end, and a plurality of wells. Each well is defined within one or more of the plurality of features. A first color conversion layer is disposed within a first well of the plurality of wells and converts a first illumination to light of a first color. A second color conversion layer is disposed within a second well of the plurality of wells and converts a second illumination to light of a second color. The first or second major surface of the array is configured to be coupled to a backplane.

Description

[Technical Field]

[0001] FIELD OF THE DISCLOSURE Embodiments of the present disclosure generally relate to color conversion layers for display devices and methods of forming display devices. [Background technology]

[0002] Light-emitting diode (LED) panels use arrays of LEDs, each of which provides an individually controllable pixel element. Such LED panels can be used in computers, touchscreen devices, personal digital assistants (PDAs), mobile phones, television monitors, and AR / VR displays. LED panels using micron-scale LEDs (also known as microLEDs) based on III-V semiconductor technology offer various advantages over OLEDs, including superior energy efficiency, brightness, and lifetime, as well as simplified manufacturing due to fewer material layers in the display stack. However, manufacturing microLED panels presents challenges. MicroLEDs with different color emissions (e.g., red, green, and blue pixels) must be fabricated using separate processes on different substrates.

[0003] Bottom-up integration of color conversion layers based on color-emitting materials such as quantum dots for advanced microLED (e.g., light-emitting diode) displays presents challenges. First, reliably minimizing or virtually eliminating color-emission crosstalk through subpixel isolation is difficult to achieve. As displays increase in pixels per inch (PPI), such as approaching the single-digit micron length scale regime, minimizing crosstalk becomes more challenging. Second, achieving high yields for selective deposition of color-emitting materials is difficult. Third, fabricating subpixel isolation structures directly on the backplane involves multiple detailed operations that can reduce yields.

[0004] Therefore, there is a need for a process for efficiently fabricating high PPI devices with minimized color crosstalk. Summary of the Invention

[0005] In some embodiments, a color conversion array for a multicolor display is provided. The color conversion array includes a plurality of features, each feature having a base, a distal end, and a plurality of wells. Each well is defined within one or more of the plurality of features. A first color conversion layer is disposed within a first well of the plurality of wells and converts a first illumination to light of a first color. A second color conversion layer is disposed within a second well of the plurality of wells and converts a second illumination to light of a second color. The first or second major surface of the array is configured to be coupled to a backplane.

[0006] In some embodiments, a multicolor display is provided. The multicolor display includes a backplane having a backplane circuit and an array of LED dies electrically integrated with the backplane circuit. A color conversion array is coupled to the array of LED dies. The color conversion array includes a plurality of features and a plurality of wells. Each well is defined within one or more of the plurality of features. The plurality of wells includes a first well having quantum dots of a first color and a second well having quantum dots of a second color. Each feature is aligned with a gap between adjacent dies of the array of LED dies. A photorefractive material is disposed over the color conversion array.

[0007] In some embodiments, a multicolor display is provided. The multicolor display includes a backplane having a backplane circuit and an array of LED dies electrically integrated with the backplane circuit. A color conversion array is coupled to the array of LED dies. The color conversion array includes a base portion extending from a first major surface of the color conversion array to a base of a recess disposed within the color conversion array. The color conversion array further includes a plurality of features extending from the base of the recess and a plurality of wells. Each well of the plurality of wells is defined by one or more of the plurality of features and the base of the recess. The plurality of wells includes a first well having quantum dots of a first color and a second well having quantum dots of a second color. Each feature is aligned with a gap between dies of the array of LED dies. A photorefractive material is disposed on a sidewall of the feature.

[0008] In some embodiments, a multicolor display is provided. The multicolor display includes a backplane having a backplane circuit. An array of LED dies is electrically integrated with the backplane circuit. A metal grid is coupled to the array of LED dies. The metal grid includes a plurality of features and a plurality of wells. Each well is defined within one or more of the plurality of features. The plurality of wells includes a first well having quantum dots of a first color and a second well having quantum dots of a second color. Each feature is aligned with a gap between dies in the array of LED dies.

[0009] In some embodiments, a method for forming a multicolor display device is provided. The method includes etching a substrate to form an array including a plurality of wells and a plurality of features. Each well is defined within one or more of the plurality of features. The method includes coating the array with a refractive material and disposing a first color conversion layer within a first well of the plurality of wells. The method includes disposing a second color conversion layer within a second well of the plurality of wells to form a color conversion array. The color conversion array is integrated with a backplane. The backplane includes backplane circuitry.

[0010] In some embodiments, a method for forming a multicolor display device is provided. The method includes depositing a plurality of metal features on a substrate to form a metal grid. The multicolor display includes a plurality of wells, each well defined within or between one or more of the plurality of features. The method includes disposing a first color conversion layer within a first well of the plurality of wells. The method includes disposing a second color conversion layer within a second well of the plurality of wells to form a color conversion array. The color conversion array is integrated with a backplane having backplane circuitry.

[0011] So that the above-mentioned features of the present disclosure can be understood in detail, a more particular description of the present disclosure briefly summarized above can be had by reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that since the present disclosure may admit of other equally effective embodiments, the accompanying drawings illustrate only exemplary embodiments and therefore should not be considered limiting in scope. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a schematic top view of a micro LED array integrated with a backplane, according to some embodiments. [Figure 2]1 is a schematic cross-sectional side view of a substrate suitable for processing into a color conversion array, according to some embodiments. [Figure 3A] 3 is a schematic cross-sectional side view of an etched substrate 300, according to some embodiments. [Figure 3B] 3 is a schematic cross-sectional side view of a coated and etched substrate 300, according to some embodiments. [Figure 4] 1A-1C are schematic cross-sectional side views of a color conversion array during fabrication, according to some embodiments. [Figure 5] 1A-1C are schematic cross-sectional side views of a color conversion array during fabrication, according to some embodiments. [Figure 6] 1A-1C are schematic cross-sectional side views of a color conversion array during fabrication, according to some embodiments. [Figure 7] 1A-1C are schematic cross-sectional side views of a color conversion array during fabrication, according to some embodiments. [Figure 8] 1A-1C are schematic cross-sectional side views of a color conversion array during fabrication, according to some embodiments. [Figure 9] 1 is a schematic cross-sectional side view of a color conversion array prior to integration with a backplane, according to some embodiments. [Figure 10] 1 is a schematic cross-sectional side view of a multi-color display, according to some embodiments. [Figure 11] 1 is a schematic cross-sectional side view of a multi-color display, according to some embodiments. [Figure 12] 3 is a schematic cross-sectional side view of an etched substrate 300, according to some embodiments. [Figure 13] 3 is a schematic cross-sectional top view of an etched substrate 300, according to some embodiments. [Figure 14] 3 is a schematic cross-sectional side view of an etched substrate 300, according to some embodiments. [Figure 15] 1 is a schematic cross-sectional side view of a substrate having a grid structure, according to some embodiments. [Figure 16] 1 is a schematic top view of a backplane, according to some embodiments. [Figure 17]FIG. 1 is a schematic top view of a color conversion array, according to some embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0013] For ease of understanding, wherever possible, like reference numerals have been used to designate like elements common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0014] Provided herein are methods for fabricating display devices and color conversion layers suitable for integration with a backplane that address conventional challenges. In particular, we have found that fabricating closed or open well arrays with structures that allow for selective setting of quantum dot material and subsequent integration with a backplane effectively produces display stacks that are substantially free of color-emission crosstalk. Several approaches have been considered for selectively setting quantum dot material within the wells, including coating a layer of photocurable fluid containing a color conversion agent (CCA) for a first color without mimicking, and then turning on a light source, such as a laser beam, on selected wells to trigger polymerization and immobilize the CCA near selected subpixels. Uncured fluid on unselected subpixels can be removed, and the same process can be repeated with different colored CCAs until all subpixels on the substrate are covered with CCAs of the desired color.

[0015] FIG. 1 is a schematic top view of a micro LED display 10 including an array 12 of individual micro LEDs 14 integrated with a backplane 16. The micro LED dies 14 are integrated with a backplane circuit 18 so that each micro LED 14 can be individually addressed. For example, the backplane circuit 18 may include a thin film transistor (TFT) active matrix array with a thin film transistor and storage capacitor (not shown) for each micro LED, column address and row address lines 18a, column and row drivers 18b, etc. to drive the micro LEDs 14. Alternatively, the micro LEDs 14 can be driven by a passive matrix within the backplane circuit 18. The backplane 16 can be fabricated using a conventional CMOS process.

[0016] 2-9 depict schematic cross-sectional side views of a color conversion array at various stages of fabrication. FIG. 2 is a schematic cross-sectional side view of a substrate 202 suitable for processing into a color conversion array, according to some embodiments. The substrate 202 can be a transparent substrate, such as glass or a polymer. The substrate 202 can be any solid material, such as PET, silicon dioxide (SiO), fused silica, amorphous silica, ceramic, or a combination thereof. The thickness 201 of the substrate 202 is about 25 μm to about 100 μm, for example, about 50 μm to about 75 μm.

[0017] 3A is a schematic cross-sectional side view of an etched substrate 202 according to certain embodiments of the present disclosure. The substrate 202 can be etched to form an etched substrate 300. The etched substrate 300 has a first major surface 308A and a second major surface 308B. The etched substrate 300 includes a plurality of features 306 and a plurality of wells 302 defined within one or more of the features 306. In some embodiments, the plurality of features 306 is in the form of a grid structure, such as an interconnected grid with square wells.

[0018] The etched substrate 300 can have a boundary region 304 surrounding a plurality of wells 302 and a plurality of features 306. In some embodiments, a laser-induced direct etching process is used to form the plurality of wells 302 and the plurality of features 306. Each of the plurality of wells can have a width 301 at the base of the well between the proximal ends 306A of adjacent features, which can be smaller than a width 303 disposed between the distal ends 306B of adjacent features. In one embodiment, the width 301, 303 of each well is between about 1 μm and about 100 μm. One or more of the plurality of features 306 can have a height 305. In one embodiment, the height 305 is between about 1 μm and substantially the same height as the boundary region 304.

[0019] FIG. 3B shows the etched substrate 300 after being coated with a material 312, such as a refractive material, a light-blocking material, or another opaque material. Without wishing to be bound by theory, coating the etched substrate 300 with a refractive material is believed to block light from penetrating through the multiple features 306 and isolate each of the multiple wells 310 defined within one or more coated features 306. Material 312 can be a metal-containing coating, such as metallic aluminum, metallic silver, dielectric carbon, or a combination thereof. Material 312 is conformally introduced to a thickness of about 50 nm or greater, e.g., about 500 nm to 800 nm. The etched substrate 300 can be coated with material 312 by a deposition process, including, but not limited to, chemical vapor deposition (CVD), atomic layer deposition (ALD), physical vapor deposition (PVD), and plasma-enhanced vapor deposition processes, to achieve a conformal result. Material 312 prevents color cross-contamination when the RGB quantum dots are illuminated during display operation.

[0020] The coated etched substrate 300 can be bonded to a second substrate 402, as shown in FIG. 4. The second substrate 402 is bonded to the coated etched substrate 300 via an adhesive polymer layer 404. In one embodiment, the adhesive polymer layer 404 is formed from a pressure-sensitive polymer, a UV-curable polymer, a thermosetting polymer, or the like. In some aspects, the adhesive polymer layer 404 is transparent, allowing light to pass through. In other aspects, the thickness of the adhesive polymer layer 404 is from about 10 nm to about 50 μm.

[0021] 5, a base matrix 502 is applied within each of the plurality of wells and over the plurality of features. In one embodiment, the base matrix 502 is formed from a material including, but not limited to, acrylate, polyurethane, epoxy, and other optically clear polymers. In one embodiment, the base matrix 502 is conformally coated onto the base matrix 502. In one embodiment, which can be combined with other embodiments herein, the base matrix 502 can be spin coated to provide leak-proof wells.

[0022] FIG. 6 shows a first color conversion layer 602 deposited in a first well 604 of the plurality of wells. The first color conversion layer 602 includes a color conversion agent capable of converting received light having a first wavelength into colored light, e.g., red, green, or blue wavelengths for red, green, or blue subpixels. The first color conversion layer 602 can be quantum dots of the first color and can be deposited using any suitable process, such as selective or non-selective inkjet printing, selective or non-selective spin coating, or selective or non-selective spray coating. The first color conversion layer 602 can be cured using any suitable process, such as selective UV curing using a laser, selective UV curing using a flood light source, selective UV curing from the bottom of each well, or selective UV curing from the top of each well. In one embodiment, the curing process of the first color conversion layer 602 is performed in an inert environment, such as in a process chamber filled with an inert gas, such as argon, nitrogen, or a combination thereof. In some embodiments, a first color conversion layer 602, such as a red color, is filled into all wells and then selectively cured. Selective curing, in some embodiments, involves scanning a laser along a raster path and selectively turning on laser spots at locations in the well array to be cured or fixed. Unfixed or uncured color conversion layer can be washed or removed using a solvent such as isopropyl alcohol.

[0023] This process can be repeated for other additional color conversion layers of other colors. Quantum dots (QDs) are selectively deposited for integration into the backplane. In one embodiment, the thickness of the cured QDs ranges from about 1 μm to about 50 μm. In some embodiments, an external laser source is used and aligned with the base of the well.

[0024] 7 shows a second color conversion layer 702 deposited in a second well 704 of the plurality of wells. The second color conversion layer 702 can be deposited and cured using any of the processes described with respect to the first color conversion layer 602. Additional color conversion layers of additional colors can be further deposited and cured as described with respect to the first and second color conversion layers.

[0025] Once all colors are deposited and cured, additional blocking layers 802, such as protective, passivation, and other layers, can be deposited over the cured color conversion layer, as shown in Figure 8. In one embodiment, which can be combined with other embodiments herein, blocking layer 802 is formed from materials such as SiO2, Si3N4, optically transparent organic and inorganic thin films, etc. Although not shown, other processes, such as planarizing or smoothing of layers or fillers, are also contemplated.

[0026] FIG. 9 shows a color-converting array for a multicolor display after the adhesive polymer layer 404 and second substrate 402 have been removed, for example, with a solvent such as isopropyl alcohol. This color-converting array can then be bonded to a backplane 1002 along the first major surface 308A, as shown in FIG. 10 . The color-converting array may be bonded to the backplane 1002 via an adhesive layer (not shown). In one embodiment, the border region 304 may be trimmed to substantially the size of the well array before being integrated with the backplane 1002. In one embodiment, which can be combined with other embodiments herein, the backplane 1002 is formed from a material including, but not limited to, glass, a flexible polymer film, and the like. The adhesive layer may be spin-coated or drop-cast onto the first major surface 308A. The color-converting array may be aligned to the backplane 1002 and bonded by bonding using any known bonding process, including, but not limited to, thermal bonding, UV bonding, and the like. The bonding temperature may be less than approximately 100°C to reduce damage to the circuitry. The backplane 1002 may include a plurality of micro LED dies 1004 separated by a plurality of gaps 1006. The proximal end 306A of each feature 306 may be aligned with a corresponding gap 1006 between each of the plurality of micro LED dies 1004 of the backplane 1002. In some embodiments, a base portion of the feature 306 may at least partially penetrate the gap 1006 to reduce or eliminate color crosstalk and / or photon leakage from the micro LED die 1004 to adjacent wells.

[0027] Alternatively, the second major surface 308B may be bonded to a backplane 1002, as shown in FIG. 11 . The backplane 1002 may be bonded via an adhesive layer (not shown) such that the distal ends 306B of the features 306 are aligned with the gaps 106 between the micro LED dies 1004. In some embodiments, the distal ends 306B may at least partially penetrate the gaps 106 to enhance color crosstalk isolation. In some embodiments, the distal ends 306B extend to the second major surface 308B of the color conversion array.

[0028] Alternatively, as shown in FIG. 12 , the color conversion array may include a first recess 1200 containing features 306 and wells 302, and a second recess 1201 disposed radially outward from the first recess 1200, the second recess 1201 having a flat surface between a first major surface 308A and a second major surface 308B of the color conversion array. The second recess 1201 may have a radial distance 1202 that may be about 1 millimeter or less. In some embodiments, the features 306 disposed between two wells 302 of the plurality of wells 302 are tapered from the base of the proximal end 306A to the distal end 306BA of each feature 306 at a taper angle θ of about 0 degrees to about 10 degrees. The distance 1204 between the first and second major surfaces may be about 100 μm or less, e.g., about 50 μm or less. The well width 1206 at the base of each well 302 can be from about 1 μm to about 50 μm, such as from about 20 μm to about 30 μm. Each of the plurality of features 306 can have a height 1208 of from about 5 μm to about 30 μm, such as from about 15 μm to about 20 μm.

[0029] FIG. 13 depicts a top view of an exemplary color conversion array 1300, such as any of the color conversion arrays described herein, according to certain embodiments. In some embodiments, the color conversion array 1300 may be sized such that the overall width 1302 of the array portion is between about 5 millimeters and about 300 mm, and the overall height 1304 of the array portion is between about 5 millimeters and about 300 mm. In some embodiments, the distance 1306 from the first side of a first well to the first side of an adjacent well may be between about 3 and about 50 μm. In some embodiments, the feature width 1308 between wells may be between about 1 μm and about 20 μm, e.g., about 10 μm.

[0030] FIG. 14 illustrates a cross-sectional side view of a color conversion array 1400, according to certain embodiments. The color conversion array 1400 may be etched to a depth between a first major surface 1406A and a second major surface 1406B of the color conversion array. The color conversion array 1400 includes a base portion 1401 and a plurality of wells 1410 defined by a plurality of features 1416. Each of the plurality of features 1416 may have a height 1408 extending from the base portion 1401 to the second major surface 1406B. The color conversion array 1400 also includes a thickness 1402 between the first major surface 1406A and the second major surface 1406B. In some embodiments, the thickness 1402 is about 100 μm or less, e.g., about 50 μm or less. Each of the plurality of features 1416 may be tapered at an angle θ between about 0 degrees and about 10 degrees, e.g., between about 6 degrees and about 8 degrees. Each of the plurality of wells 1410 may include a well width 1404 at the base 1414 of each well 1410. In some embodiments, the well width 1404 is between about 1 μm and about 50 μm, e.g., between about 20 μm and about 30 μm. A refractive material may be coated along the sidewalls of the features 1416 to visually separate each of the wells 1410 from one another. The base 1414 of each well 1410 may be left uncoated so that light, such as laser light, can cure the color conversion layer of each well 1410. In particular, the features 1416 may be constructed of a transparent material, such as glass. In one embodiment, the color conversion layer of each well 1410 is cured by a light source having a wavelength of between about 365 nm and about 405 nm. In another embodiment, the wavelength of the light source depends on the type of photoinitiator used in the color conversion layer composition.

[0031] FIG. 15 depicts a cross-sectional side view of a color conversion array including metal features 1512, such as aluminum or silver features. Each metal feature 1512 can have a height 1516 of about 5 μm to about 50 μm, e.g., about 15 μm to about 20 μm. The metal features 1512 can be spaced apart by a distance 1514 of about 2 μm to about 80 μm, e.g., about 25 μm to about 35 μm. The metal features 1512 can have a width 1510 of about 1 μm to about 20 μm, e.g., about 3 μm to about 5 μm. Each of the metal features 1512 can have a base portion at an interface with a substrate 1506, such as a glass substrate having a thickness 1522 of about 1 μm to about 100 μm. The base portions of each metal feature 1512 can be spaced apart by a distance 1508 of about 0.5 μm to about 60 μm, e.g., about 20 μm to about 30 μm. The substrate 1506 can be coupled to the second substrate 1502 via an interposer 1504, such as a double-sided adhesive, a pressure-sensitive adhesive, a thermal release film, a photosensitive release film, etc. In one embodiment, the second substrate 1502 can be a carrier substrate, such as a glass substrate, having a thickness 1518 of about 200 μm to about 1 millimeter.

[0032] Figure 16 is a schematic top view of a backplane 1600, according to some embodiments. The backplane 1600 may include an active area 1602 and one or more alignment marks 1604. The backplane 1600 may also include backplane circuitry (not shown). Figure 17 is a schematic top view of a color conversion array 1700, according to some embodiments. The color conversion array 1700 may include a laser diced outline 1702 and one or more alignment marks 1704. The one or more alignment marks 1704 correspond to the one or more alignment marks 1604 of the backplane 1600, thereby allowing the laser diced outline 1702 portion of the color conversion array 1700 to be aligned with the active area 1602 of the backplane 1600.

[0033] Additional Aspects The present disclosure can include the following non-limiting aspects and / or embodiments.

[0034] Clause A1 1. A color conversion array for a multicolor display comprising: a plurality of features, each feature having a base and a distal end; a plurality of wells, each well defined within one or more of the plurality of features; a first color conversion layer disposed within a first well of the plurality of wells, the first color conversion layer converting a first illumination to light of a first color; and a second color conversion layer disposed within a second well of the plurality of wells, the second color conversion layer converting a second illumination to light of a second color, wherein the first major surface or the second major surface of the array is configured to be coupled to a backplane.

[0035] Clause A2 A color conversion array as described in clause A1, wherein each feature located between two of the plurality of wells is tapered from the base to the distal end of each feature, the taper angle being between about 0 degrees and about 10 degrees.

[0036] Clause A3 The color conversion array of clause A1 or clause A2, further comprising alignment marks configured to align with alignment marks disposed on the backplane.

[0037] Clause A4 A color conversion array described in any one of clauses A1 to A3, further comprising a base portion extending from a first major surface of the color conversion array to a base of a first recess disposed within the color conversion array, wherein a plurality of features extend from the base of the first recess, and each well of the plurality of wells is defined by the plurality of features and the base of the first recess.

[0038] Clause A5 A color conversion array as described in clause A4, further comprising a second recess positioned radially outward from the first recess, the base of the second recess being positioned between the second major surface and the base of the first recess.

[0039] Article A6 The color conversion array of any one of clauses A1-A5, wherein a plurality of features are interconnected.

[0040] Article A7 The color conversion array of any one of clauses A1-A6, further comprising a refractive material over the plurality of features.

[0041] Article A8 The color conversion array of clause A7, further comprising a base matrix disposed within each of the plurality of wells.

[0042] Article A9 The color conversion array of any one of clauses A1-A8, further comprising a polymer bonded to the first major surface of the color conversion array.

[0043] Article A10 The color conversion array of any one of clauses A1-A10, further comprising one or more layers above the first and second color conversion layers.

[0044] Clause B1 a backplane having a backplane circuit; an array of LED dies electrically integrated with the backplane circuit; a color conversion array coupled to the array of LED dies, the color conversion array comprising a plurality of features and a plurality of wells, each well defined within one or more of the plurality of features, the plurality of wells comprising a first well having quantum dots of a first color and a second well having quantum dots of a second color, each feature aligned with a gap between the array of LED dies; and a photorefractive material disposed over the color conversion array. Multi-color display.

[0045] Clause B2 The multicolor display of clause B1, wherein a distal end of each feature is aligned with a gap between dies of the array of LED dies.

[0046] Clause B3 The multicolor display of clause B1 or B2, wherein a proximal edge of each feature is aligned with a gap between dies of the array of LED dies.

[0047] Clause B4 A multicolor display described in any one of clauses B1 to B3, wherein each feature located between two wells of the plurality of wells is tapered from the base to the distal end of each feature, the taper angle being between about 0 degrees and about 10 degrees.

[0048] Clause B5 The multicolor display of any one of clauses B1-B4, wherein the color conversion array further comprises alignment marks aligned with alignment marks disposed on the backplane.

[0049] Clause C1 1. A multicolor display comprising: a backplane having backplane circuitry; an array of LED dies electrically integrated with the backplane circuitry; a color conversion array coupled to the array of LED dies, the color conversion array comprising: a base portion extending from a first major surface of the color conversion array to a base of a recess disposed in the color conversion array, a plurality of features extending from the base of the recess, and a plurality of wells, each well defined by the plurality of features and the base of the recess, the plurality of wells comprising a first well having quantum dots of a first color and a second well having quantum dots of a second color, each feature aligned with a gap between the array of LED dies; and a light refractive material disposed on sidewalls of the features.

[0050] Clause C2 The multi-color display of clause C1, wherein the base of the recess is transparent to light.

[0051] Clause C3 The multicolor display of clause C1 or C2, wherein each feature is mesa-shaped and a distal end of each feature is substantially coplanar with a major surface of the color conversion array.

[0052] Clause C4 The multicolor display of any one of clauses C1-C3, wherein the photorefractive material is a metal-containing material.

[0053] Clause C5 The multicolor display of any one of clauses C1-C4, wherein the top cross section of at least one well is rectangular.

[0054] Clause D1 1. A multicolor display comprising: a backplane having backplane circuitry; an array of LED dies electrically integrated with the backplane circuitry; and a metal grid coupled to the array of LED dies, wherein the metal grid comprises a plurality of features and a plurality of wells, each well defined within one or more of the plurality of features, the plurality of wells comprising first wells having quantum dots of a first color and second wells having quantum dots of a second color, each feature aligned with a gap between the array of LED dies.

[0055] Clause E1 1. A method for forming a multicolor display device, comprising: etching a substrate to form an array including a plurality of wells and a plurality of features, each well being defined within one or more of the plurality of features; coating the array with a refractive material; disposing a first color conversion layer within a first well of the plurality of wells; and disposing a second color conversion layer within a second well of the plurality of wells to form a color conversion array; and integrating the color conversion array with a backplane, the backplane comprising circuitry.

[0056] Clause E2 The method of clause E1, further comprising bonding the first major surface of the coated array to a base via a polymer.

[0057] Clause E3 The method of clause E1 or clause E2, further comprising dissolving the polymer in a solvent.

[0058] Clause E4 The method of any one of clauses E1-E3, wherein the first color conversion layer comprises red, blue, or green quantum dots.

[0059] Article E5 The method of any one of clauses E1-E4, further comprising spin-coating a base matrix into the plurality of wells and onto the plurality of features.

[0060] Article E6 The method of any one of clauses E1-E5, wherein integrating the color conversion array with the backplane includes aligning registration marks of the color conversion array with registration marks of the backplane.

[0061] Article E7 The method of any one of clauses E1-E6, wherein integrating the color conversion array with the backplane includes aligning distal ends of the plurality of features with gaps between individual LED dies.

[0062] Article E8 The method of any one of clauses E1-E7, wherein integrating the color conversion array with the backplane includes aligning distal ends of the plurality of features with gaps between individual LED dies.

[0063] Article E9 The method of any one of clauses E1-E8, wherein integrating the color conversion array with the backplane includes aligning proximal ends of the plurality of features with gaps between individual LED dies.

[0064] Article E10 The method of any one of clauses E1-E9, wherein integrating the color conversion array with the backplane includes having some of the plurality of features at least partially penetrate gaps between adjacent LED dies.

[0065] Article E11 The method of any one of clauses E1-E10, wherein the step of disposing a first color conversion layer in a first well of the plurality of wells includes the step of curing the quantum dots of the first color by emitting light through a base of the first well.

[0066] Article E12 The method of clause E11, wherein disposing the first color conversion layer in a first well of the plurality of wells includes selectively depositing in the first well.

[0067] Article E13 The method described in clause E11, wherein the step of disposing a first color conversion layer in a first well of the plurality of wells includes the steps of depositing the first color conversion layer in the plurality of wells, selectively curing the first color conversion layer in the first well of the plurality of wells, and removing any uncured first color conversion layer from at least one other well of the plurality of wells.

[0068] Article E14 The method of clause E13, wherein the selectively hardening step includes the steps of scanning a laser spot along a raster path and selectively turning on the laser when aligned with the base of the first well.

[0069] Article E15 The method of clause E13, wherein the step of removing the uncured first color conversion layer includes the step of washing the uncured first color conversion layer from at least one well of the plurality of wells using a solvent such as isopropyl alcohol.

[0070] Clause F1 1. A method for forming a multicolor display device, comprising: depositing a plurality of metal features on a substrate to form a metal grid including a plurality of wells, each well defined within or between one or more of the plurality of features; disposing a first color conversion layer within a first well of the plurality of wells; disposing a second color conversion layer within a second well of the plurality of wells to form a color conversion array; and integrating the color conversion array with a backplane, the backplane comprising circuitry.

Claims

1. a plurality of features, each feature having a base and a distal end; a plurality of wells, each well defined within one or more of the plurality of features; a first color conversion layer disposed in a first well of the plurality of wells and configured to convert a first illumination into light of a first color; a second color conversion layer disposed in a second well of the plurality of wells, the second color conversion layer converting a second illumination into light of a second color, the second color conversion layer being configured such that the first major surface or the second major surface of the color conversion array is coupled to a backplane; and A color conversion array for a multicolor display, comprising:

2. 2. The color conversion array of claim 1, wherein each feature located between two wells of the plurality of wells is tapered from the base to the distal end of each feature at a taper angle, the taper angle being between about 0 degrees and about 10 degrees.

3. The color conversion array of claim 1 , further comprising alignment marks configured to align with alignment marks disposed on the backplane.

4. a base portion extending from the first major surface of the color conversion array to a base of a first recess disposed within the color conversion array, the plurality of features extending from the base of the first recess, and each well of the plurality of wells being defined by the plurality of features and the base of the first recess; The color conversion array of claim 1 further comprising:

5. 5. The color conversion array of claim 4, further comprising a second recess disposed radially outward from the first recess, the base of the second recess being disposed between the second major surface and the base of the first recess.

6. The color conversion array of claim 1 , wherein the plurality of features are interconnected.

7. The color conversion array of claim 1 , further comprising a refractive material over the plurality of features.

8. The color conversion array of claim 7 , further comprising a base matrix disposed within each of the plurality of wells.

9. The color conversion array of claim 1 , further comprising a polymer bonded to the first major surface of the color conversion array.

10. The color conversion array of claim 1 further comprising one or more layers above the first and second color conversion layers.

11. a backplane having backplane circuitry; an array of LED dies electrically integrated with the backplane circuitry; a color conversion array coupled to the array of LED dies, the color conversion array comprising a plurality of features and a plurality of wells, each well defined within one or more of the plurality of features, the plurality of wells comprising a first well having quantum dots of a first color and a second well having quantum dots of a second color, each feature aligned with a gap between the array of LED dies; and a photorefractive material disposed over the color conversion array; and Multi-color display.

12. 12. The multi-color display of claim 11, wherein a distal end of each feature is aligned with a gap between dies of the array of LED dies.

13. 12. The multi-color display of claim 11, wherein a proximal edge of each feature is aligned with a gap between dies of the array of LED dies.

14. 13. The multicolor display of claim 12, wherein each feature located between two wells of the plurality of wells tapers from the base of each feature to the distal end at a taper angle, the taper angle being between about 0 degrees and about 10 degrees.

15. 12. The multi-color display of claim 11, wherein the color conversion array further comprises registration marks aligned with registration marks disposed on the backplane.

16. a backplane having backplane circuitry; an array of LED dies electrically integrated with the backplane circuitry; a color conversion array coupled to the array of LED dies; a base portion extending from the first major surface of the color conversion array to a base of a recess disposed within the color conversion array; a plurality of features extending from the base of the recess; and a color conversion array comprising a plurality of wells, each well defined by the plurality of features and the base of the recess, the plurality of wells including first wells having quantum dots of a first color and second wells having quantum dots of a second color, each feature aligned with a gap between the array of LED dies; and a photorefractive material disposed on the sidewalls of the feature; Multi-color display.

17. 17. The multicolor display of claim 16, wherein the base of the recess is transparent to light.

18. 17. The multicolor display of claim 16, wherein each feature is mesa-shaped, and the distal end of each feature is substantially coplanar with a major surface of the color conversion array.

19. 17. The multicolor display of claim 16, wherein the photorefractive material is a metal-containing material.

20. 17. The multicolor display of claim 16, wherein the top cross section of at least one well is rectangular.

Images