Systems and methods for improved laser fabrication

Abstract

The problem of plasma shielding in pulsed laser shaping processes is addressed by a system and method that divides a pulsed laser scan line into subsets of irradiation locations. The subsets are typically offset from one another along the scan line. Within each subset, the irradiation locations are separated from one another by a predetermined separation distance. Thus, the irradiation locations in a given subset are interleaved with the irradiation locations in other subsets. The predetermined separation distance is selected at least for the purpose of minimizing plasma shielding effects.

Description

[Technical Field]

[0001] cross reference This application claims priority to U.S. Provisional Patent Application No. 63 / 418,483, entitled "System and Method for Improved Laser Modeling," filed October 22, 2022, which is incorporated herein by reference in its entirety for all purposes. Summary of the Invention

[0002] Lasers are used in a variety of manufacturing processes, such as cutting, welding, drilling, or three-dimensional (3D) printing. In laser manufacturing, rapidly scanning a laser along a surface can offer advantages, such as increasing the speed of the laser manufacturing process. For example, in 3D printing, a laser can be rapidly scanned along a line of metal powder, rapidly heating and melting the powder, and then cooling it to form a line of solid metal. However, previous laser scanning processes have several drawbacks. For example, pulsed lasers may irradiate various locations with high-power laser pulses as they scan over a metal surface or powder. As a result, plasma can form near each location, which can reduce the power of the laser pulse received by the next location along the scan due to a so-called "plasma shielding" effect. Such plasma shielding can lead to reduced quality in the laser manufacturing process. Therefore, systems and methods for improved laser manufacturing are presented herein.

[0003] Various embodiments of the present invention are disclosed in the following detailed description and the accompanying drawings. [Brief explanation of the drawings]

[0004] [Figure 1] FIG. 1 is a schematic diagram illustrating a first system for improved pulsed laser shaping. [Figure 2A] FIG. 2A is a schematic diagram illustrating a first exemplary scan pattern for use with the system described herein with respect to FIG. [Figure 2B] FIG. 2B is a schematic diagram illustrating a first exemplary voltage pattern for use in the system described herein with respect to FIG. [Figure 3A] FIG. 3A is a schematic diagram illustrating a second exemplary scanning pattern for use with the system described herein with respect to FIG. [Figure 3B] FIG. 3B is a schematic diagram illustrating a second exemplary voltage pattern for use in the system described herein with respect to FIG. [Figure 4A] FIG. 4A is a schematic diagram illustrating a third exemplary scanning pattern for use with the system described herein with respect to FIG. [Figure 4B] FIG. 4B is a schematic diagram illustrating a third exemplary voltage pattern for use in the system described herein with respect to FIG. [Figure 5] FIG. 5 is a schematic diagram illustrating a second system for improved pulsed laser shaping. [Figure 6] FIG. 6 shows a flowchart depicting an exemplary method for improved pulsed laser shaping. [Figure 7] FIG. 7 is a block diagram of a computer system that may be used in some embodiments to implement portions of the method for improved pulsed laser shaping. DETAILED DESCRIPTION OF THE INVENTION

[0005] The present invention can be implemented in numerous ways, including as a process, an apparatus, a system, a composition of matter, a computer program product embodied in a computer-readable storage medium, and / or a processor (e.g., a processor configured to execute instructions stored in and / or provided from a memory coupled to a processor). These embodiments, or other forms the present invention may take, may be referred to herein as techniques. In general, the order of steps in disclosed processes may be varied within the scope of the invention. Unless otherwise noted, components, such as processors and memories, described as being configured to perform tasks may be implemented as general-purpose components configured to perform the tasks temporarily at a given time, or as specific components shaped to perform the tasks. As used herein, the term “processor” refers to one or more devices, circuits, and / or processing cores configured to process data, such as computer program instructions.

[0006] A detailed description of one or more embodiments of the present invention is provided in conjunction with the accompanying drawings below. The accompanying drawings illustrate the principles of the present invention. While the present invention will be described herein in connection with such embodiments, the present invention is not limited to any embodiment. The scope of the present specification is limited only by the claims, and the present invention encompasses numerous alternatives, modifications, and equivalents. In this specification, numerous specific details are set forth below in order to provide a thorough understanding of the invention. These details are provided for the purpose of example, and it is possible that the present invention may be practiced according to the claims without some or all of these specific details. For purposes of clarity, technical material that is well known in the art related to the present invention has not been described in detail in this specification so as not to unnecessarily obscure the present invention.

[0007] As used herein, the term "or" is intended to convey both alternative and conjunctive meaning. For example, the phrase "A or B" is intended to be interpreted as including element A alone, element B alone, and element A and element B in combination.

[0008] In the drawings, like numbers refer to like elements.

[0009] Lasers are used in a variety of manufacturing processes, including cutting, welding, drilling, or three-dimensional (3D) printing. In laser manufacturing, rapidly scanning a laser along a surface can offer advantages, such as increasing the speed of the laser manufacturing process. For example, in 3D printing, a laser can be rapidly scanned along a line of metal powder, rapidly heating and melting the powder, which then cools to form a line of solid metal.

[0010] However, conventional laser scanning processes have several drawbacks. For example, pulsed lasers utilize high-power laser pulses that may strike various locations as they scan a metal surface or metal powder. This can result in the formation of plasma near each location, a so-called "plasma shielding" effect that can reduce the power of the laser pulse received by the next location along the scan. Such plasma shielding can degrade the quality of the laser shaping process.

[0011] Therefore, the problem of plasma shielding in pulsed laser shaping processes is addressed by a system and method that divides a pulsed laser scan line into subsets of illumination locations. The subsets are generally offset from one another along the scan line. Within each subset, the illumination locations are separated from one another by a predetermined separation distance. Thus, illumination locations in a given subset are interleaved with illumination locations in other subsets. The predetermined separation distance is selected, at least in part, to minimize plasma shielding effects.

[0012] For each subset, the pulsed laser is scanned along the scan line at a predetermined scan speed, and laser pulses are directed only at the irradiation positions included in the subset. Therefore, the laser shaping operation is performed at the desired irradiation positions without incurring a reduction in shaping quality due to the plasma shielding effect. By repeating this procedure for all subsets, the laser pulses are directed to all irradiation positions included in all subsets, thereby completing the laser shaping operation along the line.

[0013] Disclosed herein is an improved pulsed laser shaping system. The system generally includes a pulsed laser source configured to emit pulsed laser light, an optical scanner configured to receive the pulsed laser light and scan the pulsed laser light along a line on a surface, and a controller coupled to the optical scanner, the controller directing the optical scanner to scan the pulsed laser light along the line at a first predetermined scan speed over a first subset of a plurality of illumination locations, each illumination location in the first subset being separated from another illumination location in the first subset by a first predetermined separation distance, and directing the optical scanner to scan the pulsed laser light along the line at a second predetermined scan speed over a second subset of the plurality of illumination locations, each illumination location in the second subset being separated from another illumination location in the second subset by a second predetermined separation distance, the first subset being different from the second subset. In some embodiments, the controller is further configured to direct the optical scanner to apply a first predetermined offset distance between the second subset and the first subset. In some embodiments, each illumination position of the first subset along the line is different from each illumination position of the second subset along the line. In some embodiments, the controller is further configured to direct the optical scanner to scan the pulsed laser light over a third subset of the plurality of illumination positions at a third predetermined scan speed, wherein each illumination position of the third subset is separated from another illumination position of the third subset by a third predetermined separation distance, the third subset being different from the first subset and the second subset. In some embodiments, the controller is further configured to direct the optical scanner to apply a second predetermined offset distance between the third subset and the second subset.In some embodiments, the controller is further configured to direct the optical scanner to scan the pulsed laser light along the line at a fourth predetermined scan speed over a fourth subset of the plurality of illumination locations, wherein each illumination location in the fourth subset is separated from another illumination location in the fourth subset by a fourth predetermined separation distance, the fourth subset being different from the first subset, the second subset, and the third subset. In some embodiments, the controller is further configured to direct the optical scanner to apply a third predetermined offset distance between the fourth subset and the third subset. In some embodiments, the optical scanner includes a galvanometer. In some embodiments, the controller is configured to direct the galvanometer to scan the pulsed laser light along the line at a first, second, third, or fourth predetermined scan speed by supplying a time-varying voltage to the galvanometer. In some embodiments, the controller is configured to direct the galvanometer to apply the first, second, or third predetermined offset distance by supplying an offset voltage to the galvanometer. In some embodiments, the optical scanner includes a plane mirror and a rotating polygon mirror. In some embodiments, the controller is configured to direct the rotating polygon mirror to scan the pulsed laser light along a line at a first, second, third, or fourth predetermined scan speed by supplying a continuous voltage to the rotating polygon mirror. In some embodiments, the controller is configured to direct the plane mirror to apply a first, second, or third predetermined offset distance by rotating the plane mirror. In some embodiments, the pulsed laser light includes a plurality of laser pulses emitted at a pulse repetition rate, and the first, second, third, or fourth predetermined separation distance is determined based on the first, second, third, or fourth predetermined scan speed and the pulse repetition rate. In some embodiments, the first, second, third, or fourth predetermined separation distance is selected so that the pulsed laser light energy delivered to each irradiation location does not decrease by more than 50% from the pulsed light energy delivered by the pulsed laser source.In some embodiments, the first, second, third, or fourth predetermined separation distance is at least about 1 micrometer (μm). In some embodiments, the ratio of the first, second, third, or fourth predetermined separation distance to the diameter of the pulsed laser beam is at least about 0.5. In some embodiments, the first, second, third, or fourth predetermined scanning speed is at least about 1 meter per second (m / s).

[0014] Further disclosed herein are methods for improved pulsed laser shaping. The methods generally include using a pulsed laser source to emit pulsed laser light; using an optical scanner to receive the pulsed laser light and scan the pulsed laser light at a first predetermined scanning speed across a first subset of a plurality of illumination locations located along a line on a surface, each illumination location in the first subset being separated from another illumination location in the first subset by a first predetermined separation distance; and using the optical scanner to scan the pulsed laser light along the line at a second predetermined scanning speed across a second subset of the plurality of illumination locations, each illumination location in the second subset being separated from another illumination location in the second subset by a second predetermined separation distance, where the first subset is different from the second subset. In some embodiments, the method further includes using the optical scanner to apply a first predetermined offset distance between the second subset and the first subset. In some embodiments, each illumination location in the first subset along the line is different from each illumination location in the second subset along the line. In some embodiments, the method further includes using an optical scanner to scan the pulsed laser light across a third subset of the plurality of illumination locations at a third predetermined scan speed, where each illumination location in the third subset is separated from another illumination location in the third subset by a third predetermined separation distance, where the third subset is different from the first subset and the second subset. In some embodiments, the method further includes using the optical scanner to apply a second predetermined offset distance between the third subset and the second subset. In some embodiments, the method further includes using an optical scanner to scan the pulsed laser light along a line at a fourth predetermined scan speed across a fourth subset of the plurality of illumination locations, where each illumination location in the fourth subset is separated from another illumination location in the fourth subset by a fourth predetermined separation distance, where the fourth subset is different from the first subset, the second subset, and the third subset.In some embodiments, the method further includes using an optical scanner to apply a third predetermined offset distance between the fourth subset and the third subset. In some embodiments, the optical scanner includes a galvanometer. In some embodiments, the method further includes using a galvanometer to scan the pulsed laser light along the line at a first, second, third, or fourth predetermined scan speed by supplying a time-varying voltage to the galvanometer. In some embodiments, the method further includes using a galvanometer to apply the first, second, or third predetermined offset distance by supplying an offset voltage to the galvanometer. In some embodiments, the optical scanner includes a plane mirror and a rotating polygon mirror. In some embodiments, the method further includes using a rotating polygon mirror to scan the pulsed laser light along the line at a first, second, third, or fourth predetermined scan speed by supplying a continuous voltage to the rotating polygon mirror. In some embodiments, the method further includes using a plane mirror to apply the first, second, or third predetermined offset distance by rotating the plane mirror. In some embodiments, the pulsed laser light comprises a plurality of laser pulses emitted at a pulse repetition rate, and the first, second, third, or fourth predetermined separation distance is defined based on the first, second, third, or fourth predetermined scan rate and the pulse repetition rate. In some embodiments, the first, second, third, or fourth predetermined separation distance is selected so that the pulsed laser light energy delivered to each irradiation location does not decrease by more than 50% from the pulsed light energy delivered by the pulsed laser source. In some embodiments, the first, second, third, or fourth predetermined separation distance is at least about 1 micrometer (μm). In some embodiments, the ratio of the first, second, third, or fourth predetermined separation distance to the diameter of the pulsed laser light is at least about 0.5. In some embodiments, the first, second, third, or fourth predetermined scan speed is at least about 1 meter per second (m / s).

[0015] System for improved pulsed laser shaping. As used herein, the term "pulsed laser manufacturing" refers to any manufacturing process that utilizes pulsed laser manipulation, including, but not limited to, pulsed laser additive manufacturing, pulsed laser three-dimensional (3D) printing, pulsed laser welding, pulsed laser sintering, pulsed laser kneeling, pulsed laser cutting, or pulsed laser drilling.

[0016] FIG. 1 is a schematic diagram illustrating a system 100 for improving pulsed laser shaping. In the illustrated example, the system 100 includes a pulsed laser source 110. In some embodiments, the pulsed laser source 110 includes at least one gas laser, such as at least one nitrogen (N) laser or excimer laser. For example, the pulsed laser source 110 is at least one argon dimer (Ar) excimer laser, krypton dimer (Kr) excimer laser, fluorine dimer (F) excimer laser, xenon dimer (Xe) excimer laser, argon fluoride (ArF) excimer laser, krypton chloride (KeCl) excimer laser, krypton fluoride (KrF) excimer laser, xenon bromide (XeBr) excimer laser, xenon chloride (XeCl) excimer laser, or xenon fluoride (XeF) excimer laser. In some embodiments, the pulsed laser source 110 includes at least one dye laser. In some embodiments, pulsed laser source 110 comprises at least one metal vapor laser, such as at least one copper (Cu) metal vapor laser, hi some embodiments, pulsed laser source 110 comprises at least one solid-state laser, such as at least one ruby ​​laser, metal-doped crystal laser, or metal-doped fiber laser.For example, the pulsed laser source 1100 may be at least one of a neodymium-doped yttrium aluminum garnet (Nd:YAG) laser, a neodymium / chromium-doped yttrium aluminum garnet (Nd / Cr:YAG) laser, an erbium-doped yttrium aluminum garnet (Er:YAG) laser, a neodymium-doped yttrium lithium fluoride (Nd:YLF) laser, a neodymium-doped yttrium orthovanadate (ND:YVO4) laser, a neodymium-doped yttrium calcium oxoborate (Nd:YCOB) laser, a neodymium-glass (Nd:glass) laser, a titanium sapphire (Ti:sapphire) laser, These include thulium-doped yttrium aluminum garnet (Tm:YAG) lasers, ytterbium-doped yttrium aluminum garnet (Yb:YAG) lasers, ytterbium-doped glass (Yt:glass) lasers, holmium-doped yttrium aluminum garnet (Ho:YAG) lasers, chromium-doped zinc selenide (CrZnSe) lasers, cerium-doped lithium strontium aluminum fluoride (Ce:LiSAF) lasers, cerium-doped lithium calcium aluminum fluoride (Ce:LiCAF) lasers, erbium-doped glass (Er:glass) lasers, erbium-ytterbium co-doped glass (Er / Yt:glass) lasers, uranium-doped calcium fluoride (U:CaF2) lasers, and samarium-doped calcium fluoride (Sm:CaF2) lasers. In some embodiments, the pulsed laser source 110 is at least one of a gallium nitride (GaN) laser, an indium gallium nitride (InGaN) laser, an aluminum gallium indium phosphide (AlGaInP) laser, an aluminum gallium arsenide (AlGaAs) laser, an indium gallium arsenide phosphide (InGaAsP) laser, a vertical cavity surface emitting laser (VCSEL), or a quantum cascade laser. In some embodiments, the pulsed laser source 110 comprises a nanosecond laser source, a picosecond laser source, or a femtosecond laser source.

[0017] In some embodiments, the pulsed laser source 110 is configured to emit pulsed laser light 112. In some embodiments, the pulsed laser light 112 is emitted by any pulsed laser source 110 described herein. In some embodiments, the pulsed laser light 112 is generated as a train of laser pulses. In some embodiments, the laser pulses have a peak optical power of at least about 1 Watt (W) or more. In some embodiments, the laser pulses have a peak optical power of at most about 1,000 gigawatts (GW) or less. In some embodiments, the laser pulses have a peak optical power within a range defined by any two of the aforementioned values, such as between about 1 W and about 1,000 GW.

[0018] In some embodiments, the laser pulse has a pulse length of at least about 1 femtosecond (fs) or greater. In some embodiments, the laser pulse has a pulse length of up to about 1,000 microseconds (μs). In some embodiments, the laser pulse has a pulse length within a range defined by any two of the foregoing values, such as between about 1 fs and about 1,000 μs.

[0019] In some embodiments, the laser pulses have pulse energies of at least about 1 picojoule (pJ) or greater. In some embodiments, the laser pulses have pulse energies of at most about 1,000 microjoules (μJ) or less. In some embodiments, the laser pulses have pulse energies within a range defined by any two of the foregoing values, such as between about 1 pJ and about 1,000 μJ.

[0020] In some embodiments, the laser pulses have a repetition rate of at least about 1 Hertz (Hz) or greater. In some embodiments, the repetition rate of the laser pulses is at most about 1,000 kilohertz (kHz) or less. In some embodiments, the repetition rate of the laser pulses is within a range defined by any two of the foregoing values, such as between about 1 Hz and about 1,000 kHz.

[0021] In some embodiments, the laser pulses have wavelengths in the ultraviolet (UV), visible, or infrared (IR) portions of the electromagnetic spectrum. In some embodiments, the laser pulses have at least one wavelength of at least about 100 nanometers (nm) or greater. In some embodiments, the laser pulses have at least one wavelength of up to about 10 micrometers (μm). In some embodiments, the laser pulses have at least one wavelength within a range defined by any two of the foregoing values, such as between about 100 nm and about 10 μm.

[0022] In the depicted example, system 100 includes an optical scanner 120. In some embodiments, optical scanner 120 is configured to receive pulsed laser light 112. In some embodiments, optical scanner 120 is configured to direct pulsed laser light 120 toward surface 130. In some embodiments, surface 130 comprises a substantially planar surface. In some embodiments, surface 130 comprises a curved surface. In some embodiments, surface 130 is configured to perform a pulsed laser shaping operation thereon. In some embodiments, optical scanner 120 is configured to scan pulsed laser light 112 along line 140 on surface 130. In some embodiments, line 140 is substantially straight. In some embodiments, line 140 is curved. In some embodiments, optical scanner 120 includes a galvanometer.

[0023] In some embodiments, system 100 includes a controller 150. In some embodiments, controller 150 is coupled to optical scanner 120. In some embodiments, controller 150 is configured to direct optical scanner 120 to scan pulsed laser light 112 along line 140 along only a subset of multiple illumination locations (not shown in FIG. 1 ), as described herein with respect to FIGS.

[0024] FIG. 2A shows a schematic diagram 200 illustrating a first exemplary scan pattern for use with the system 100 described herein with respect to FIG. 1. As shown in FIG. 2A, a line 140 may include multiple illumination positions. For example, as shown in FIG. 2A, the line 140 may include 12 different illumination positions. In some embodiments, the line 140 comprises first and second subsets 210 and 220 of illumination positions, respectively. For example, as shown in FIG. 2A, the first subset 210 may comprise first, second, third, fourth, fifth, and sixth illumination positions 211, 212, 213, 214, 215, and 216, respectively, and the second subset 220 may comprise seventh, eighth, ninth, tenth, eleventh, and twelfth illumination positions 221, 222, 223, 224, 225, and 226, respectively. In some embodiments, the first subset 210 and the second subset 220 are different.

[0025] In some embodiments, each illumination location in first subset 210 is separated by a first predetermined separation distance from another illumination location in first subset 210. For example, in some embodiments, illumination location 211 is separated by a first predetermined separation distance from illumination location 212, which is separated by a first predetermined separation distance from illumination location 213, and so on.

[0026] In some embodiments, each illumination location in second subset 220 is separated by a second predetermined separation distance from another illumination location in second subset 220. For example, in some embodiments, illumination location 221 is separated by a second predetermined separation distance from illumination location 222, which is separated by a second predetermined separation distance from illumination location 223, and so on.

[0027] In some embodiments, the predetermined separation distance is selected so that the energy of the pulsed laser light 112 (not shown in FIG. 2A ) provided to each illumination location on line 140 is reduced by a predetermined percentage from the energy of the pulsed light 112 provided by pulsed laser source 110 (not shown in FIG. 2A ). In some embodiments, the predetermined percentage is at least about 1% or more. In some embodiments, the predetermined percentage is at most about 50% or less. In some embodiments, the predetermined percentage is within a range defined by any two of the aforementioned values, such as between about 1% and about 50%.

[0028] In some embodiments, the first or second predetermined separation distance is at least about 1 μm or more. In some embodiments, the first or second predetermined separation distance is at most about 1,000 μm or less. In some embodiments, the first or second predetermined separation distance is within a range defined by any two of the foregoing values, such as between about 1 μm and about 1,000 μm. In some embodiments, the first and second predetermined separation distances are the same. In some embodiments, the first and second predetermined separation distances are different.

[0029] In some embodiments, the first or second predetermined separation distance and the diameter of the pulsed laser beam 112 (not shown in FIG. 2A ) are related by a ratio. In some embodiments, the ratio is at least about 0.5 or greater. In some embodiments, the ratio is at most about 2.0 or less. In some embodiments, the ratio is within a range defined by any two of the foregoing values, such as between about 0.5 and about 2.0.

[0030] In some embodiments, first subset 210 is offset from second subset 220. For example, as shown in FIG. 2A , illumination location 211 is offset from illumination location 221, illumination location 212 is offset from illumination location 222, and so on. In some embodiments, first subset 210 is offset from second subset 220 by a first predetermined offset distance. In some embodiments, the first predetermined offset distance is at least about 1 μm or more. In some embodiments, the first predetermined offset distance is at most about 1,000 μm or less. In some embodiments, the first predetermined offset distance is within a range defined by any two of the aforementioned values, such as between about 1 μm and about 1,000 μm.

[0031] 2B shows a schematic diagram 250 illustrating a first exemplary voltage pattern for use with the system 100 described herein with respect to FIG. 1. In some embodiments, the voltage pattern is utilized to impart the first exemplary scanning pattern described herein with respect to FIG. 2A. In some embodiments, the voltage pattern is dictated by a galvanometer. In some embodiments, the voltage pattern includes a first voltage ramp 261, a second voltage ramp 262, a third voltage ramp 263, and a fourth voltage ramp 264.

[0032] In some embodiments, during the first voltage ramp 261, the voltage is set to a value V that causes the galvanometer to direct the pulsed laser light to a first illumination location in a first subset of illumination locations.

[0033] In some embodiments, during the second voltage ramp 262, the voltage is ramped up from an initial value V to a final value −V+ΔV. In some embodiments, as the voltage is ramped up through the second voltage ramp 262, the galvanometer directs the pulsed laser light along the remaining illumination locations in the first subset of illumination locations.

[0034] In some embodiments, during the third voltage ramp 263, the voltage is set to a value V-ΔV that causes the galvanometer to direct the pulsed laser light to a first illumination location in the second subset of illumination locations. In some embodiments, the offset voltage ΔV sets a first predetermined offset distance between the first subset and the second subset.

[0035] In some embodiments, during the fourth voltage ramp 264, the voltage is ramped from an initial value V-ΔV to a final value −V. In some embodiments, as the voltage is ramped through the fourth voltage ramp 264, the galvanometer directs the pulsed laser light along the remaining illumination locations in the second subset of illumination locations.

[0036] Thus, returning to the description of FIG. 1 , in some embodiments, controller 150 is configured to cause optical scanner 120 to scan pulsed laser beam 112 along line 140 to a first subset of the plurality of illumination locations. In some embodiments, each illumination location in the first subset is separated from another illumination location in the first subset by any first predetermined separation distance described herein. In some embodiments, controller 150 is configured to direct optical scanner 120 to scan pulsed laser beam 112 along line 140 to the first subset at a first predetermined scanning speed. In some embodiments, the first predetermined scanning speed is at least about 1 meter per second (m / s) or greater. In some embodiments, the first predetermined scanning speed is at most about 10 m / s or less. In some embodiments, the first predetermined scanning speed is within a range defined by any two of the aforementioned values, such as between about 1 m / s and about 10 m / s.

[0037] In some embodiments, the controller 150 is configured to direct the optical scanner 120 to scan the pulsed laser beam 112 along the line 140 for a second subset of the plurality of illumination locations. In some embodiments, each illumination location in the second subset is separated from another illumination location in the second subset by any second predetermined separation distance described herein. In some embodiments, the controller 150 is configured to direct the optical scanner 120 to scan the pulsed laser beam 112 along the line 140 for the second subset at a second predetermined scan speed. In some embodiments, the second predetermined scan speed is any predetermined scan speed described herein. In some embodiments, the first and second predetermined scan speeds are the same. In some embodiments, the first and second predetermined scan speeds are different.

[0038] In some embodiments, the controller 150 is configured to instruct the optical scanner 120 to apply a first predetermined offset distance between the second subset and the first subset.

[0039] In some embodiments, the controller 150 is configured to instruct the galvanometers to scan the pulsed laser light 112 along the line 140 for the first subset and the second subset at first and second predetermined scan rates, respectively, by supplying a time-varying voltage to the galvanometers. In some embodiments, the controller 150 is configured to instruct the galvanometers to apply a first predetermined offset distance between the second subset and the first subset by supplying an offset voltage to the galvanometers.

[0040] In some embodiments, the controller 150 instructs the optical scanner 120 (e.g., a galvanometer) to scan the pulsed laser light over the first and second subsets at first and second predetermined scan rates, respectively, at least about 1 time or more, at most about 10 times, or between about 1 and about 10 times, within a range defined by either of these two values.

[0041] 3A shows a schematic diagram 300 illustrating a second exemplary scan pattern for use with the system 100 described herein with respect to FIG. 1. As shown in FIG. 3A, the line 140 may include multiple illumination positions. For example, as shown in FIG. 3A, the line 140 may include 12 different illumination positions. In some embodiments, the line 140 comprises first, second, and third subsets 310, 320, and 330 of illumination positions, respectively. 3A, first subset 310 may include first, second, third, and fourth illumination locations 311, 312, 313, and 314, respectively, second subset 320 may include fifth, sixth, seventh, and eighth illumination locations 321, 322, 323, and 324, respectively, and third subset 330 may include ninth, tenth, eleventh, and twelfth illumination locations 331, 332, 333, and 334, respectively. In some embodiments, first subset 310, second subset 320, and third subset 330 are different.

[0042] In some embodiments, each illumination location in first subset 310 is separated from another illumination location in first subset 310 by any first predetermined separation distance described herein. For example, in some embodiments, illumination location 311 is separated from illumination location 312 by a first predetermined separation distance, which is separated from illumination location 313 by a first predetermined separation distance, and so on.

[0043] In some embodiments, each illumination location in second subset 320 is separated from another illumination location in second subset 320 by any second predetermined separation distance described herein. For example, in some embodiments, illumination location 321 is separated from illumination location 322 by a second predetermined separation distance, which is separated from illumination location 323 by a second predetermined separation distance, and so on.

[0044] In some embodiments, each illumination location in third subset 330 is separated from another illumination location in third subset 330 by a third predetermined separation distance. In some embodiments, the third predetermined separation distance includes any predetermined separation distance described herein. For example, in some embodiments, illumination location 331 is separated from illumination location 332 by a third predetermined separation distance, which is separated from illumination location 333 by a third predetermined separation distance, and so on. In some embodiments, the first, second, and third predetermined separation distances are the same. In some embodiments, the first, second, and third predetermined separation distances are different.

[0045] In some embodiments, first subset 310 is offset from second subset 320. For example, as shown in FIG. 3A , illumination position 311 is offset from illumination position 321, illumination position 312 is offset from illumination position 322, etc. In some embodiments, first subset 310 is offset from second subset 320 by any first predetermined offset distance described herein. In some embodiments, second subset 320 is offset from third subset 330. For example, as shown in FIG. 3A , illumination position 321 is offset from illumination position 331, illumination position 322 is offset from illumination position 332, etc. In some embodiments, second subset 320 is offset from third subset 330 by a second predetermined offset distance. In some embodiments, the second predetermined offset distance includes any predetermined offset distance described herein.

[0046] 3B shows a schematic diagram 350 illustrating a second exemplary voltage pattern for use with the system 100 described herein with respect to FIG. 1. In some embodiments, the voltage pattern is utilized to impart the second exemplary scan pattern described herein with respect to FIG. 3A. In some embodiments, the voltage pattern is dictated by a galvanometer. In some embodiments, the voltage pattern includes a first voltage ramp 361, a second voltage ramp 362, a third voltage ramp 363, a fourth voltage ramp 364, a fifth voltage ramp 365, and a sixth voltage ramp 366.

[0047] In some embodiments, during the first voltage ramp 361, the voltage is set to a value V that causes the galvanometer to direct the pulsed laser light to a first illumination location in a first subset of illumination locations.

[0048] In some embodiments, during the second voltage ramp 362, the voltage is ramped from an initial value V to a final value −V+2ΔV. In some embodiments, as the voltage is ramped through the second voltage ramp 362, the galvanometer directs the pulsed laser light along the remaining illumination locations in the first subset of illumination locations.

[0049] In some embodiments, during the third voltage ramp 363, the voltage is set to a value V-ΔV that causes the galvanometer to direct the pulsed laser light to a first illumination location in the second subset of illumination locations. In some embodiments, the offset voltage ΔV sets a first predetermined offset distance between the first subset and the second subset.

[0050] In some embodiments, the voltage is ramped from an initial value V-ΔV to a final value -V+ΔV during the fourth voltage ramp 364. In some embodiments, as the voltage is ramped through the fourth voltage ramp 364, the galvanometer directs the pulsed laser light along the remaining illumination locations in the second subset of illumination locations.

[0051] In some embodiments, during the fifth voltage ramp 365, the voltage is set to a value V-2ΔV that causes the galvanometer to direct the pulsed laser light to a first illumination location in a third subset of illumination locations. In some embodiments, the offset voltage ΔV sets a second predetermined offset distance between the second and third subsets.

[0052] In some embodiments, during the sixth voltage ramp 366, the voltage is ramped from an initial value V to a final value −V. In some embodiments, as the voltage is ramped through the sixth voltage ramp 366, the galvanometer directs the pulsed laser light along the remaining illumination locations in the third subset of illumination locations.

[0053] Thus, returning to the description of FIG. 1 , in some embodiments, the controller 150 is configured to direct the optical scanner 120 to scan the pulsed laser beam 112 along the line 140 for a third subset of the plurality of illumination locations. In some embodiments, each illumination location in the third subset is separated from another illumination location in the third subset by any third predetermined separation distance described herein. In some embodiments, the controller 150 is configured to direct the optical scanner 120 to scan the pulsed laser beam 120 along the line 140 for the third subset at a third predetermined scan speed. In some embodiments, the third predetermined scan speed is any predetermined scan speed described herein. In some embodiments, the first, second, and third predetermined scan speeds are the same. In some embodiments, the first, second, and third predetermined scan speeds are different.

[0054] In some embodiments, the controller 150 is configured to instruct the optical scanner 120 to apply a second predetermined offset distance between the third subset and the second subset.

[0055] In some embodiments, the controller 150 is configured to instruct the galvanometers to scan the pulsed laser light 112 along the first, second, and third subsets at first, second, and third predetermined scan rates, respectively, by supplying time-varying voltages to the galvanometers. In some embodiments, the controller 150 is configured to instruct the galvanometers to apply a first predetermined offset distance between the second subset and the first subset and a second predetermined offset distance between the third subset and the second subset, by supplying offset voltages to the galvanometers.

[0056] In some embodiments, the controller 150 is configured to instruct the optical scanner 120 (e.g., a galvanometer) to scan the pulsed laser light at first, second, and third predetermined scanning speeds for the first, second, and third subsets, respectively, at least about once or more, at most about 10 times, or within a range defined by any two of the aforementioned values, such as a value between about 1 and about 10 times.

[0057] FIG. 4A shows a schematic diagram 400 illustrating a third exemplary scan pattern for use with the system 100 described herein with respect to FIG. 1. As shown in FIG. 4A, the line 140 may include multiple illumination positions. For example, as shown in FIG. 4A, the line 140 may include 12 different illumination positions. In some embodiments, the line 140 includes first, second, third, and fourth subsets 410, 420, 430, and 440 of illumination positions, respectively. For example, as shown in FIG. 4A, the first subset 410 may include first, second, and third illumination positions 411, 412, and 413, respectively, and the second subset 420 may include fourth, fifth, and sixth illumination positions 421, 422, and 423, respectively. The third subset 430 may include the seventh, eighth, and ninth irradiation locations 431, 432, and 433, respectively, and the fourth subset 440 may include the tenth, eleventh, and twelfth irradiation locations 441, 442, and 443, respectively. In some embodiments, the first subset 410, the second subset 420, the third subset 430, and the fourth subset 440 are different.

[0058] In some embodiments, each illumination location in first subset 410 is separated from another illumination location in first subset 410 by any first predetermined separation distance described herein. For example, in some embodiments, illumination location 411 is separated from illumination location 412 by a first predetermined separation distance, which is separated from illumination location 413 by a first predetermined separation distance, and so on.

[0059] In some embodiments, each illumination location in second subset 420 is separated from another illumination location in second subset 420 by any second predetermined separation distance described herein. For example, in some embodiments, illumination location 421 is separated from illumination location 422 by a second predetermined separation distance, illumination location 422 is separated from illumination location 423 by a second predetermined separation distance, and so on.

[0060] In some embodiments, each illumination location in third subset 430 is separated from another illumination location in third subset 430 by any third predetermined separation distance described herein. For example, in some embodiments, illumination location 431 is separated from illumination location 432 by a third predetermined separation distance, which is separated from illumination location 433 by a third predetermined separation distance, and so on.

[0061] In some embodiments, each illumination location in fourth subset 440 is separated from another illumination location in fourth subset 440 by a fourth predetermined separation distance. In some embodiments, the fourth predetermined separation distance includes any predetermined separation distance described herein. For example, in some embodiments, illumination location 441 is separated from illumination location 442 by a fourth predetermined separation distance, which is separated from illumination location 443 by a fourth predetermined separation distance, and so on. In some embodiments, the first, second, third, and fourth predetermined separation distances are the same. In some embodiments, the first, second, third, and fourth predetermined separation distances are different.

[0062] In some embodiments, first subset 410 is offset from second subset 420. For example, as shown in FIG. 4A , illumination position 411 is offset from illumination position 421, illumination position 412 is offset from illumination position 422, etc. In some embodiments, first subset 410 is offset from second subset 420 by any first predetermined offset distance described herein. In some embodiments, second subset 420 is offset from third subset 430. For example, as shown in FIG. 4A , illumination position 421 is offset from illumination position 431, illumination position 422 is offset from illumination position 432, and so on. In some embodiments, second subset 420 is offset from third subset 430 by any second predetermined offset distance described herein.

[0063] In some embodiments, third subset 430 is offset from fourth subset 440. For example, as shown in FIG. 4A , illumination location 431 is offset from illumination location 441, illumination location 432 is offset from illumination location 442, and so on. In some embodiments, third subset 430 is offset from fourth subset 440 by a third predetermined offset distance. In some embodiments, the third predetermined offset distance includes any predetermined offset distance described herein.

[0064] 4B shows a schematic diagram 450 illustrating a third exemplary voltage pattern for use with the system 100 described herein with respect to FIG. 1. In some embodiments, the voltage pattern is utilized to impart the third exemplary scan pattern described herein with respect to FIG. 4A. In some embodiments, the voltage pattern is dictated by a galvanometer. In some embodiments, the voltage pattern includes a first voltage ramp 461, a second voltage ramp 462, a third voltage ramp 463, a fourth voltage ramp 464, a fifth voltage ramp 465, a sixth voltage ramp 466, a seventh voltage ramp 467, and an eighth voltage ramp 468.

[0065] In some embodiments, during the first voltage ramp 461, the voltage is set to a value V that causes the galvanometer to direct the pulsed laser light to a first illumination location in a first subset of illumination locations.

[0066] In some embodiments, during the second voltage ramp 462, the voltage is ramped from an initial value V to a final value −V +3ΔV. In some embodiments, as the voltage is ramped through the second voltage ramp 462, the galvanometer directs the pulsed laser light along the remaining illumination locations in the first subset of illumination locations.

[0067] In some embodiments, during the third voltage ramp 463, the voltage is set to a value V-ΔV that causes the galvanometer to direct the pulsed laser light to a first illumination location in a second subset of illumination locations. In some embodiments, the offset voltage ΔV sets a first predetermined offset distance between the first subset and the second subset.

[0068] In some embodiments, during the fourth voltage ramp 464, the voltage is ramped from an initial value V-ΔV to a final value -V+2ΔV. In some embodiments, as the voltage is ramped through the fourth voltage ramp 464, the galvanometer directs the pulsed laser light along the remaining illumination locations in the second subset of illumination locations.

[0069] In some embodiments, during the fifth voltage ramp 465, the voltage is set to a value V-2ΔV that causes the galvanometer to direct the pulsed laser light to a first illumination location in a third subset of illumination locations. In some embodiments, the offset voltage ΔV sets a predetermined second offset distance between the second and third subsets.

[0070] In some embodiments, the voltage is ramped from an initial value of V-2ΔV to a final value of -V+ΔV during the sixth voltage ramp 464. In some embodiments, as the voltage is ramped through the sixth voltage ramp 466, the galvanometer directs the pulsed laser light along the remaining illumination locations in the third subset of illumination locations.

[0071] In some embodiments, during the seventh voltage ramp 467, the voltage is set to a value V-3ΔV that causes the galvanometer to direct the pulsed laser light to a first illumination location in a fourth subset of illumination locations. In some embodiments, the offset voltage ΔV sets a third predetermined offset distance between the third and fourth subsets.

[0072] In some embodiments, during the eighth voltage ramp 468, the voltage is ramped from an initial value V-3ΔV to a final value −V. In some embodiments, as the voltage is ramped through the eighth voltage ramp 468, the galvanometer directs the pulsed laser light along the remaining illumination locations in the fourth subset of illumination locations.

[0073] Thus, returning to the description of FIG. 1 , in some embodiments, the controller 150 is configured to direct the optical scanner 120 to scan the pulsed laser beam 112 along the line 140 through a fourth subset of the plurality of illumination locations. In some embodiments, each illumination location in the fourth subset is separated from another illumination location in the fourth subset by any fourth predetermined separation distance described herein. In some embodiments, the controller 150 is configured to direct the optical scanner 120 to scan the pulsed laser beam 112 along the line through the fourth subset at a fourth predetermined scan speed. In some embodiments, the fourth predetermined scan speed is any predetermined scan speed described herein. In some embodiments, the first, second, third, and fourth predetermined scan speeds are the same. In some embodiments, the first, second, third, and fourth predetermined scan speeds are different.

[0074] In some embodiments, the controller 150 is configured to instruct the optical scanner 120 to apply a third predetermined offset distance between the fourth subset and the third subset.

[0075] In some embodiments, the controller 150 is configured to instruct the galvanometers to scan the pulsed laser light 112 along lines for the first, second, third, and fourth subsets at first, second, third, and fourth predetermined scan rates, respectively, by supplying time-varying voltages to the galvanometers. In some embodiments, the controller 150 is configured to instruct the galvanometers to apply first, second, and third predetermined offset distances between the second subset and the first subset, between the third subset and the second subset, and between the fourth subset and the third subset, respectively, by supplying offset voltages to the galvanometers.

[0076] In some embodiments, the controller 150 instructs the optical scanner 120 (e.g., a galvanometer) to scan the pulsed laser light at first, second, third, and fourth predetermined scan rates for the first, second, third, and fourth subsets, respectively, a number of times within a range defined by any two of the aforementioned values, such as at least about 1 time or more, at most about 10 times, or a value between about 1 time and about 10 times.

[0077] 2A, 3A, and 4A represent each irradiation position as a circle. In the examples shown in FIGS. 2A, 3A, and 4A, each circle represents a full width at half maximum (FWHM) distribution of laser pulse energy. In the examples shown in FIGS. 2A, 3A, and 4A, the circles are drawn so as not to overlap each other within the FWHM distribution. However, the present disclosure is not intended to be so limited. In some embodiments, the irradiation positions partially overlap within the FWHM distribution. In some embodiments, the irradiation positions do not overlap within the FWHM distribution.

[0078] 2B, 3B, and 4B illustrate scan patterns utilizing galvanometers, the present disclosure is not intended to be limited thereto. For example, as shown in FIG. 5, in some embodiments, the system 100 described herein with respect to FIG. 1 may utilize an optical scanner 120 comprised of a plane mirror 510 and a scanning mirror 520. In some embodiments, the scanning mirror 520 comprises a galvanometer or a rotating polygon mirror. In some embodiments, the controller 150 is configured to direct the scanning mirror 520 to scan the pulsed laser light 112 along the line 140 at a first, second, third, or fourth predetermined scan rate by supplying a continuous or time-varying voltage to the scanning mirror 520. In some embodiments, the controller 150 is configured to direct the plane mirror 510 to apply a first, second, third, or fourth predetermined offset distance by rotating the plane mirror 510 to a predetermined rotation angle. By changing the predetermined rotation angle of the plane mirror 510, the pulsed laser light 112 can be directed to different positions on the line 140, thereby applying different predetermined offset distances.

[0079] 1, 2A, 2B, 3A, 3B, 4A, 4B, and 5 describe the use of two, three, or four subsets of illumination locations, but the present disclosure is not intended to be limited thereto. For example, in some embodiments, controller 150 is configured to direct optical scanner 120 to scan pulsed laser light 112 along line 140 to a fifth, sixth, seventh, eighth, ninth, tenth, or additional subset of the plurality of illumination locations at a fifth, sixth, seventh, eighth, ninth, tenth, or additional predetermined scan speed (each of which may comprise any predetermined scan speed described herein). In some embodiments, each illumination location of a fifth, sixth, seventh, eighth, ninth, tenth, or additional subset is separated from another illumination location of the fifth, sixth, seventh, eighth, ninth, tenth, or additional subset by a fifth, sixth, seventh, eighth, ninth, tenth, or additional predetermined separation distance, where each separation distance may include any predetermined separation distance described herein.

[0080] 6 is a flowchart illustrating an exemplary method 600 for improved pulsed laser shaping. In the illustrated example, at 610, a pulsed laser source is used to emit pulsed laser light. In some embodiments, the pulsed laser source includes any pulsed laser source described herein with respect to FIG. 1. In some embodiments, the pulsed laser light includes any pulsed laser light described herein with respect to FIG. 1.

[0081] In the illustrated example, an optical scanner is used to receive pulsed laser light and scan the pulsed laser light at a first predetermined scanning speed across a first subset of a plurality of illumination locations along a line on the surface. In some embodiments, the optical scanner includes any optical scanner described herein with respect to FIG. 1. In some embodiments, the first predetermined scanning speed includes any first predetermined scanning speed described herein with respect to FIG. 1 or FIG. 2A. In some embodiments, the first subset includes any first subset described herein with respect to FIG. 1 or FIG. 2A. In some embodiments, the line includes any line described herein with respect to FIG. 1. In some embodiments, the surface includes any surface described herein with respect to FIG. 1. In some embodiments, each illumination location in the first subset is separated from another illumination location in the first subset by a first predetermined separation distance, as described herein with respect to FIGS. 1 and 2A. In some embodiments, the first predetermined separation distance includes any first predetermined separation distance described herein with respect to FIG. 1 or FIG. 2A.

[0082] In the illustrated example, at 630, an optical scanner is used to receive pulsed laser light and scan the pulsed laser light across a second subset of the plurality of illumination locations along the line at a second predetermined scan speed. In some embodiments, the second predetermined scan speed comprises any second predetermined scan speed described herein with respect to FIG. 2A . In some embodiments, the second subset comprises any second subset described herein with respect to FIG. 1 or FIG. 2A . In some embodiments, each illumination location in the second subset is separated from another illumination location in the second subset by a second predetermined separation distance, as described herein with respect to FIG. 1 and FIG. 2A . In some embodiments, the optical scanner is used to apply a first predetermined offset distance between the second subset and the first subset, as described herein with respect to FIG. 1 and FIG. 2A . In some embodiments, the first predetermined offset distance comprises any first predetermined offset distance described herein with respect to FIG. 1 or FIG. 2A .

[0083] In some embodiments, method 600 further includes using an optical scanner to receive the pulsed laser light and scan it for a third subset of the plurality of illumination locations along the line at a third predetermined scan speed. In some embodiments, the third predetermined scan speed includes any third predetermined scan speed described herein with respect to FIG. 3A. In some embodiments, the third subset includes any third subset described herein with respect to FIG. 1 or FIG. 3A. In some embodiments, each illumination location in the third subset is separated from another illumination location in the third subset by a third predetermined separation distance, as described herein with respect to FIG. 1 or FIG. 3A. In some embodiments, the optical scanner is used to apply a second predetermined offset between the third subset and the second subset, as described herein with respect to FIG. 1 and FIG. 3A.

[0084] In some embodiments, method 600 further includes using an optical scanner to receive pulsed laser light and scan the pulsed laser light across a fourth subset of the plurality of illumination locations along the line at a fourth predetermined scan rate. In some embodiments, the fourth predetermined scan rate includes any fourth predetermined scan rate described herein with respect to FIG. 4A . In some embodiments, the fourth subset includes any fourth subset described herein with respect to FIG. 1 or FIG. 4A . In some embodiments, each illumination location in the fourth subset is separated from another illumination location in the fourth subset by a fourth predetermined separation distance, as described herein with respect to FIG. 1 or FIG. 4A . In some embodiments, the optical scanner is used to apply a third predetermined offset between the fourth subset and the third subset, as described herein with respect to FIG. 1 and FIG. 4A .

[0085] In some embodiments, the method 600 further includes using an optical scanner to receive the pulsed laser light and scan the pulsed laser light over a fifth, sixth, seventh, eighth, ninth, tenth, or additional predetermined subset of irradiation locations along the line at a fifth, sixth, seventh, eighth, ninth, tenth, or additional predetermined scan speed.

[0086] In some embodiments, the method 600 is implemented using any of the systems described herein, such as the system 100 described herein with respect to FIG.

[0087] In some embodiments, method 600 is repeated at least about once or more, at most about 10 times, or within a range defined by any two of the foregoing values, such as between about 1 and about 10 times.

[0088] In some embodiments, method 600 is repeated multiple times to form multiple additively manufactured or 3D printed lines on a layer of an additively manufactured or 3D printed part or component. In some embodiments, method 600 is repeated multiple times to form multiple layers of an additively manufactured or 3D printed part or component. In some embodiments, an additively manufactured or 3D printed part or component is formed according to instructions providing a layer-by-layer processing path.

[0089] In some embodiments, method 600 is repeated multiple times to ablate multiple lines on a layer of a subtractively built part or component. In some embodiments, method 600 is repeated multiple times to ablate multiple layers of a subtractively built part or component. In some embodiments, a subtractively built part or component is ablated according to instructions that provide a layer-by-layer processing pass.

[0090] In some embodiments, the predetermined scan rate (e.g., a first, second, third, or fourth predetermined scan rate described herein) and pulse repetition rate determine the predetermined separation distance (e.g., a first, second, third, or fourth predetermined separation distance described herein) according to Equation (1).

[0091]

number

[0092] In Equation (1), s is the predetermined separation distance, r is the predetermined scan speed, p is the pulse repetition rate, and D is the diameter of the pulsed laser spot. In Equation (1), the predetermined separation distance is measured as the distance between the outer edges of adjacent illumination locations within a predetermined subset of illumination locations.

[0093] In some embodiments, the predetermined scan rate (e.g., a first, second, third, or fourth predetermined scan rate described herein) and the pulse repetition rate determine the predetermined separation distance (e.g., a first, second, third, or fourth predetermined separation distance described herein) according to equation (2).

[0094]

number

[0095] In equation (2), s is the predetermined separation distance, r is the predetermined scan rate, and p is the pulse repetition rate. In equation (2), the predetermined separation distance is measured as the distance between the centers of adjacent irradiation locations within a predetermined subset of irradiation locations.

[0096] 6 or any of operations 610, 620, and 630 described herein. In some embodiments, the system comprises one or more processors and a memory coupled to the one or more processors. In some embodiments, the one or more processors are configured to perform one or more operations of method 600. In some embodiments, the memory is configured to provide instructions corresponding to the operations of method 600 to the one or more processors. In some embodiments, the instructions are embodied in a tangible computer-readable storage medium.

[0097] FIG. 7 is a block diagram of a computer system 700 used in some embodiments to perform portions of the methods for improved pulsed laser modeling described herein (e.g., any of operations 610, 620, and / or 630 of method 600 described herein with respect to FIG. 6). In some embodiments, a computer system may be utilized as a component in a system for improved pulsed laser modeling described herein. FIG. 7 illustrates one embodiment of a general-purpose computer system. Other computer system architectures and configurations may be used to perform the processes of the present invention. Comprised of various subsystems described below, computer system 700 includes at least one microprocessor subsystem 701. In some embodiments, the microprocessor subsystem comprises at least one central processing unit (CPU) or graphics processing unit (GPU). The microprocessor subsystem can be implemented by a single-chip processor or multiple processors. In some embodiments, the microprocessor subsystem is a general-purpose digital processor that controls the operation of computer system 700. Using instructions retrieved from memory 704, the microprocessor subsystem controls the receipt and manipulation of input data and the output and display of data on output devices.

[0098] The microprocessor subsystem 701 is bidirectionally coupled to memory 704, which may include a first primary storage area, typically random access memory (RAM), and a second primary storage area, typically read-only memory (ROM). As is well known, primary storage can be used as a general storage area and scratchpad memory, as well as for storing input data and processed data. It can also store programming instructions and data in the form of data objects and text objects, as well as other data and instructions for processes running on the microprocessor subsystem. As is also well known in the art, primary storage typically contains the basic operating instructions, program code, data, and objects used by the microprocessor subsystem to perform its functions. The primary storage device 704 can include any suitable computer-readable storage medium, as described below, depending, for example, on whether data access needs to be bidirectional or unidirectional. The microprocessor subsystem 701 can also directly and very quickly retrieve frequently needed data and store it in cache memory (not shown).

[0099] Removable mass storage device 705 provides additional data storage capacity for computer system 700 and may be coupled bidirectionally (read / write) or unidirectionally (read-only) to microprocessor subsystem 701. Storage device 705 may also include computer-readable media such as magnetic tape, flash memory, carrier wave embodied signals, PC cards, portable mass storage devices, holographic storage devices, and other storage devices. Fixed mass storage device 709 may also provide additional data storage capacity. The most common example of mass storage device 709 is a hard disk drive. Mass storage devices 705 and 709 typically store additional programming instructions, data, etc. that are not normally actively used by the microprocessor subsystem. It will be understood that information maintained within mass storage devices 705 and 709 may, if desired, be incorporated into virtual memory as part of primary storage device 704 (e.g., RAM) in standard fashion.

[0100] Bus 706 provides microprocessor subsystem 701 with access to the storage subsystem, and may also be used to provide access to other subsystems and devices. In this embodiment, this includes display monitor 708, network interface 707, keyboard 702, and pointing device 703, as well as auxiliary input / output device interfaces, sound card, speakers, and other subsystems as needed. Pointing device 703 may be a mouse, stylus, trackball, or tablet, and is useful for interacting with a graphical user interface.

[0101] The network interface 707 allows the microprocessor subsystem 701 to be coupled to another computer, computer network, or telecommunications network using a network connection as shown. It is contemplated that the microprocessor subsystem 701 may receive information, such as data objects or program instructions, from another network and output information to another network in the course of performing the method steps described above via the network interface 707. Information, i.e., information represented as a series of instructions executed on the microprocessor subsystem, may be received from and output to another network, for example, in the form of a computer data signal embodied in a carrier wave. An interface card or similar device and appropriate software executed by the microprocessor subsystem 701 may be used to connect the computer system 700 to an external network and transfer data according to standard protocols. That is, method embodiments of the present invention may be performed solely by the microprocessor subsystem 701 or may be performed over a network, such as the Internet, an intranet network, or a local area network, in conjunction with a remote processing subsystem that shares some of the processing. Additional mass storage devices (not shown) may also be connected to the microprocessor subsystem 701 via the network interface 707.

[0102] An auxiliary input / output device interface (not shown) may be used with computer system 700. The auxiliary input / output device interface may include generic and customized interfaces that enable microprocessor subsystem 701 to send data to, and more generally receive data from, other devices such as microphones, touch-sensitive displays, transducer card readers, tape readers, voice or handwriting recognition devices, biometric readers, cameras, portable mass storage devices, and other computers.

[0103] Additionally, embodiments of the present invention relate to computer storage products with computer-readable media containing program code for performing various computer-implemented operations. A computer-readable medium is any data storage device capable of storing data which can thereafter be read by a computer system. The media and program code may be specially designed and constructed for the purposes of the present invention, or they may be of a type well known to those of ordinary skill in the computer software art. Examples of computer-readable media include, but are not limited to, all of the media described above: magnetic media such as hard disks, floppy disks, and magnetic tape; optical media such as CD-ROM disks; magneto-optical media such as floppy disks; and specially configured hardware devices such as application-specific integrated circuits (ASICs), programmable logic devices (PLDs), ROM, and RAM devices. Computer-readable media may also be distributed as a data signal embodied in a carrier wave over a network of coupled computer systems, thereby storing and executing computer-readable code in a distributed fashion. Examples of program code include both machine code, as produced, for example, by a compiler, or files containing high-level code that may be executed using an interpreter. The computer system shown in Figure 7 is merely an example of a computer system suitable for use with the present invention. Other computer systems suitable for the present invention may include additional or fewer subsystems. Furthermore, bus 706 is illustrative of any interconnection scheme linking the subsystems. Other computer architectures having different configurations of subsystems may also be utilized.

[0104] Enumeration of Embodiments Embodiment 1 A system comprising: a pulsed laser light source configured to emit pulsed laser light; an optical scanner configured to receive the pulsed laser light and scan the pulsed laser light along a line on a surface including a plurality of illumination locations; and a controller coupled to the optical scanner, wherein the controller is configured to direct the optical scanner to scan the pulsed laser light along the line at a first predetermined scanning speed over a first subset of the plurality of illumination locations, wherein each illumination location of the first subset is separated from another illumination location of the first subset by a first predetermined separation distance; and the controller is configured to direct the optical scanner to scan the pulsed laser light along the line at a second predetermined scanning speed over a second subset of the plurality of illumination locations, wherein each illumination location of the second subset is separated from another illumination location of the second subset by a second predetermined separation distance, wherein the first subset is different from the second subset.

[0105]

[0020] Embodiment 2. The system of embodiment 1, wherein the controller is further configured to instruct the optical scanner to apply a first predetermined offset distance between the second subset and the first subset.

[0106] Embodiment 3. The system of embodiment 1 or 2, wherein each illumination position of the first subset along the line is different from each illumination position of the second subset along the line.

[0107] Embodiment 4: The system described in any one of embodiments 1 to 3, wherein the controller is further configured to instruct the optical scanner to scan the pulsed laser light along the line at a third predetermined scanning speed for a third subset of the plurality of irradiation positions, each irradiation position of the third subset being separated from another irradiation position of the third subset by a third predetermined separation distance, and the third subset being different from the first subset and the second subset.

[0108]

[0023] Embodiment 5. The system of embodiment 4, wherein the controller is further configured to instruct the optical scanner to apply a second predetermined offset distance between the third subset and the second subset.

[0109] Embodiment 6: The system described in any one of embodiments 1 to 5, wherein the controller is further configured to instruct the optical scanner to scan the pulsed laser light along the line at a fourth predetermined scanning speed for a fourth subset of the plurality of irradiation positions, each irradiation position of the fourth subset being separated from another irradiation position of the fourth subset by a fourth predetermined separation distance, and the fourth subset being different from the first subset, the second subset, and the third subset.

[0110]

[0023] Embodiment 7: The system of embodiment 6, wherein the controller is further configured to instruct the optical scanner to apply a third predetermined offset distance between the fourth subset and the third subset.

[0111]

[0022] Embodiment 8: The system of any one of embodiments 1 to 7, wherein the optical scanner comprises a galvanometer.

[0112]

[0023] Embodiment 9: The system of embodiment 8, wherein the controller is configured to instruct the galvanometer to scan the pulsed laser light along the line at the first, second, third, or fourth predetermined scan speed by supplying a time-varying voltage to the galvanometer.

[0113]

[0023] Embodiment 10: The system of embodiment 8 or 9, wherein the controller is configured to instruct the galvanometer to apply the first, second, or third predetermined offset distance by supplying an offset voltage to the galvanometer.

[0114]

[0023] Embodiment 11: The system of any one of embodiments 1 to 7, wherein the optical scanner comprises a plane mirror and a rotating polygon mirror.

[0115] Embodiment 12: The system of embodiment 11, wherein the controller is configured to instruct the rotating polygon mirror to scan the pulsed laser light along the line at the first, second, third or fourth predetermined scan speed by supplying a continuous voltage to the rotating polygon mirror.

[0116] Embodiment 13: The system of embodiment 11 or 12, wherein the controller is configured to instruct the plane mirror to apply the first, second or third predetermined offset distance by rotating the plane mirror.

[0117] Embodiment 14: The system of any one of embodiments 1 to 13, wherein the pulsed laser light comprises a plurality of laser pulses emitted at a pulse repetition rate, and the first, second, third, or fourth predetermined separation distance is determined based on a first, second, third, or fourth predetermined scanning speed and a pulse repetition rate.

[0118] Embodiment 15: A system described in any one of embodiments 1 to 14, wherein the first, second, third or fourth predetermined separation distance is selected so that the pulsed laser light energy delivered to each irradiation position does not decrease by more than 50% from the pulsed light energy delivered by the pulsed laser light source.

[0119] Embodiment 16: The system of any one of embodiments 1 to 15, wherein the first, second, third, or fourth predetermined separation distance is at least about 1 micrometer (μm).

[0120] Embodiment 17: The system of any one of embodiments 1 to 16, wherein a ratio of the first, second, third, or fourth predetermined separation distance to a diameter of the pulsed laser beam is at least about 0.5.

[0121] Embodiment 18: The system of any one of embodiments 1 to 17, wherein the first, second, third, or fourth predetermined scanning speed is at least about 1 meter per second (m / s).

[0122] Embodiment 19: A method comprising: using a pulsed laser source to emit pulsed laser light; using an optical scanner to receive the pulsed laser light and scan the pulsed laser light at a first predetermined scanning speed over a first subset of a plurality of illumination positions located along a line on a surface, wherein each illumination position of the first subset is separated from another illumination position of the first subset by a first predetermined separation distance; and using the optical scanner to scan the pulsed laser light along the line at a second predetermined scanning speed over a second subset of the plurality of illumination positions, wherein each illumination position of the second subset is separated from another illumination position of the second subset by a second predetermined separation distance; wherein the first subset is different from the second subset.

[0123]

[0033] Embodiment 20: The method of embodiment 19, further comprising using the optical scanner to apply a first predetermined offset distance between the second subset and the first subset.

[0124]

[0072] Embodiment 21: The method of embodiment 19 or 20, wherein each of the illumination positions of the first subset along the line is different from each of the illumination positions of the second subset along the line.

[0125] Embodiment 22: The method of any one of embodiments 19 to 21, further comprising using the optical scanner to scan the pulsed laser light along the line at a third predetermined scanning speed over a third subset of the plurality of irradiation positions, wherein each irradiation position of the third subset is separated from another irradiation position of the third subset by a third predetermined separation distance, and the third subset is different from the first subset and the second subset.

[0126]

[0072] Embodiment 23. The method of embodiment 22, further comprising using the optical scanner to apply a second predetermined offset distance between the third subset and the second subset.

[0127] Embodiment 24: The method of any one of embodiments 19 to 23, including using the optical scanner to scan the pulsed laser light along the line at a fourth predetermined scanning speed over a fourth subset of the plurality of irradiation locations, wherein each irradiation location of the fourth subset is separated from another irradiation location of the fourth subset by a fourth predetermined separation distance, and the fourth subset is different from the first subset, the second subset, and the third subset.

[0128]

[0072] Embodiment 25. The method of embodiment 24, further comprising using the optical scanner to apply a third predetermined offset distance between the fourth subset and the third subset.

[0129]

[0072] Embodiment 26: The method of any one of embodiments 19 to 25, wherein the optical scanner comprises a galvanometer.

[0130]

[0072] Embodiment 27. The method of embodiment 26, further comprising using the galvanometer to scan the pulsed laser light along the line at the first, second, third or fourth predetermined scan speed by supplying a time-varying voltage to the galvanometer.

[0072] Embodiment 28. The method of embodiment 26 or 27, further comprising using the galvanometer to apply the first, second or third predetermined offset distance by supplying an offset voltage to the galvanometer.

[0131] 29. The method of any one of claims 19 to 25, wherein the optical scanner comprises a plane mirror and a rotating polygon mirror.

[0132]

[0072] Embodiment 30: The method of embodiment 29, further comprising using the rotating polygon mirror to scan the pulsed laser light along the line at the first, second, third, or fourth predetermined scan speed by supplying a continuous voltage to the rotating polygon mirror.

[0133]

[0073] Embodiment 31: The method of embodiment 29 or 30, further comprising using the plane mirror to apply the first, second or third predetermined offset distance by rotating the plane mirror.

[0134] Embodiment 32. The method of any one of embodiments 19 to 31, wherein the pulsed laser light comprises a plurality of laser pulses emitted at a pulse repetition rate, and the first, second, third, or fourth predetermined separation distance is determined based on the first, second, third, or fourth predetermined scanning speed and pulse repetition rate.

[0135] Embodiment 33: A method according to any one of claims 19 to 32, wherein the first, second, third or fourth predetermined separation distance is selected such that the pulsed laser light energy delivered to each irradiation position does not decrease by more than 50% from the pulsed light energy delivered by the pulsed laser light source.

[0136]

[0062] Embodiment 34: The method of any one of embodiments 19 to 33, wherein the first, second, third, or fourth predetermined separation distance is at least about 1 micrometer (μm).

[0137]

[0082] Embodiment 35. The method of any one of claims 19 to 34, wherein a ratio of the first, second, third or fourth predetermined separation distance to a diameter of the pulsed laser beam is at least about 0.5.

[0138]

[0072] Embodiment 36. The method of any one of claims 19 to 35, wherein the first, second, third or fourth predetermined scan speed is at least about 1 meter per second (m / s).

Claims

1. a pulsed laser light source configured to emit pulsed laser light; an optical scanner configured to receive the pulsed laser beam and scan the pulsed laser beam along a line on a surface that includes a plurality of irradiation locations; a controller coupled to the optical scanner; Equipped with the controller is configured to direct the optical scanner to scan the pulsed laser light along the line at a first predetermined scan speed over a first subset of the plurality of illumination locations, wherein each illumination location of the first subset is separated from another illumination location of the first subset by a first predetermined separation distance; the controller is configured to direct the optical scanner to scan the pulsed laser light along the line at a second predetermined scan speed over a second subset of the plurality of illumination locations, wherein each illumination location of the second subset is separated from another illumination location of the second subset by a second predetermined separation distance; The first subset is different from the second subset. system.

2. The controller is further configured to instruct the optical scanner to apply a first predetermined offset distance between the second subset and the first subset. The system of claim 1 .

3. Each of the illumination positions of the first subset along the line is different from each of the illumination positions of the second subset along the line.

3. The system according to claim 1 or 2.

4. The controller is further configured to direct the optical scanner to scan the pulsed laser light along the line at a third predetermined scan speed over a third subset of the plurality of illumination locations, each illumination location of the third subset being separated from another illumination location of the third subset by a third predetermined separation distance, the third subset being different from the first subset and the second subset. A system according to any one of claims 1 to 3.

5. The controller is further configured to instruct the optical scanner to apply a second predetermined offset distance between the third subset and the second subset. The system of claim 4.

6. The controller is further configured to direct the optical scanner to scan the pulsed laser light along the line at a fourth predetermined scan speed over a fourth subset of the plurality of illumination locations, wherein each illumination location of the fourth subset is separated from another illumination location of the fourth subset by a fourth predetermined separation distance, and the fourth subset is different from the first subset, the second subset, and the third subset. A system according to any one of claims 1 to 5.

7. The controller is further configured to instruct the optical scanner to apply a third predetermined offset distance between the fourth subset and the third subset. The system of claim 6.

8. The optical scanner includes a galvanometer. A system according to any one of claims 1 to 7.

9. The controller is configured to instruct the galvanometer to scan the pulsed laser light along the line at the first, second, third, or fourth predetermined scan speed by supplying a time-varying voltage to the galvanometer. The system of claim 8.

10. The controller is configured to instruct the galvanometer to apply the first, second, or third predetermined offset distance by providing an offset voltage to the galvanometer.

10. The system according to claim 8 or 9.

11. The optical scanner includes a plane mirror and a rotating polygon mirror. A system according to any one of claims 1 to 7.

12. The controller is configured to instruct the rotating polygon mirror to scan the pulsed laser beam along the line at the first, second, third, or fourth predetermined scan speed by supplying a continuous voltage to the rotating polygon mirror. The system of claim 11.

13. The controller is configured to instruct the plane mirror to apply the first, second, or third predetermined offset distance by rotating the plane mirror.

13. A system according to claim 11 or 12.

14. The pulsed laser light includes a plurality of laser pulses emitted at a pulse repetition rate, and the first, second, third, or fourth predetermined separation distance is defined based on a first, second, third, or fourth predetermined scanning speed and a pulse repetition rate.

14. A system according to any one of claims 1 to 13.

15. The first, second, third, or fourth predetermined separation distance is selected such that the pulsed laser light energy delivered to each irradiation location does not decrease by more than 50% from the pulsed light energy delivered by the pulsed laser light source.

15. A system according to any one of claims 1 to 14.

16. The first, second, third, or fourth predetermined separation distance is at least about 1 micrometer (μm).

16. A system according to any one of claims 1 to 15.

17. a ratio of the first, second, third, or fourth predetermined separation distance to a diameter of the pulsed laser beam is at least about 0.5; 17. A system according to any one of claims 1 to 16.

18. The first, second, third, or fourth predetermined scan speed is at least about 1 meter per second (m / s).

18. A system according to any one of claims 1 to 17.

19. using a pulsed laser light source to emit pulsed laser light; using an optical scanner to receive the pulsed laser light and scan the pulsed laser light at a first predetermined scanning speed over a first subset of a plurality of illumination locations located along a line on the surface, wherein each illumination location in the first subset is separated from another illumination location in the first subset by a first predetermined separation distance; using the optical scanner to scan the pulsed laser light along the line at a second predetermined scan speed over a second subset of the plurality of illumination locations, wherein each illumination location of the second subset is separated from another illumination location of the second subset by a second predetermined separation distance; Including, The first subset is different from the second subset. method.

20. using the optical scanner to apply a first predetermined offset distance between the second subset and the first subset.

20. The method of claim 19.

21. Each of the illumination positions of the first subset along the line is different from each of the illumination positions of the second subset along the line.

21. The method of claim 19 or 20.

22. and further comprising using the optical scanner to scan the pulsed laser light along the line at a third predetermined scan speed to a third subset of the plurality of illumination locations, wherein each illumination location of the third subset is separated from another illumination location of the third subset by a third predetermined separation distance, the third subset being different from the first subset and the second subset.

22. The method of any one of claims 19 to 21.

23. using the optical scanner to apply a second predetermined offset distance between the third subset and the second subset.

23. The method of claim 22.

24. using the optical scanner to scan the pulsed laser light along the line at a fourth predetermined scan speed to a fourth subset of the plurality of illumination locations, wherein each illumination location of the fourth subset is separated from another illumination location of the fourth subset by a fourth predetermined separation distance, and the fourth subset is different from the first subset, the second subset, and the third subset.

24. The method of any one of claims 19 to 23.

25. using the optical scanner to apply a third predetermined offset distance between the fourth subset and the third subset.

25. The method of claim 24.

26. The optical scanner includes a galvanometer.

26. The method of any one of claims 19 to 25.

27. and using the galvanometer to scan the pulsed laser light along the line at the first, second, third, or fourth predetermined scan speed by supplying a time-varying voltage to the galvanometer.

27. The method of claim 26.

28. further comprising using the galvanometer to apply the first, second, or third predetermined offset distance by supplying an offset voltage to the galvanometer.

28. The method of claim 26 or 27.

29. The optical scanner includes a plane mirror and a rotating polygon mirror.

26. The method of any one of claims 19 to 25.

30. and using the rotating polygon mirror to scan the pulsed laser light along the line at the first, second, third, or fourth predetermined scan speed by supplying a continuous voltage to the rotating polygon mirror.

30. The method of claim 29.

31. and further comprising using the plane mirror to apply the first, second, or third predetermined offset distance by rotating the plane mirror.

31. The method of claim 29 or 30.

32. the pulsed laser light includes a plurality of laser pulses emitted at a pulse repetition rate, and the first, second, third, or fourth predetermined separation distance is defined based on the first, second, third, or fourth predetermined scanning speed and the pulse repetition rate.

32. The method of any one of claims 19 to 31.

33. The first, second, third, or fourth predetermined separation distance is selected so that the pulsed laser light energy delivered to each irradiation location does not decrease by more than 50% from the pulsed light energy delivered by the pulsed laser light source.

33. The method of any one of claims 19 to 32.

34. The first, second, third, or fourth predetermined separation distance is at least about 1 micrometer (μm).

34. The method of any one of claims 19 to 33.

35. a ratio of the first, second, third, or fourth predetermined separation distance to a diameter of the pulsed laser beam is at least about 0.5; 35. The method of any one of claims 19 to 34.

36. The first, second, third, or fourth predetermined scan speed is at least about 1 meter per second (m / s).

36. The method of any one of claims 19 to 35.

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