Conductive polishing head fixing device and conductive polishing head system

Abstract

The present invention discloses a conductive polishing head fixing device, including: a mounting member having a first suction end surface that can be combined with and connected to a polishing head, and that forms at least a first passage, one end of which extends to the first suction end surface; a first conductive member having one end connected to a power source; a conductive interface module having at least a first working end, at least a portion of which is disposed within the first passage and electrically connected to the first conductive member; and a conductive polishing head system. The present invention provides a simple and reliable solution to the problem of polishing head charging. By newly providing a first passage and a second passage in the mounting member and the polishing head, electrical conductivity of the polishing head can be achieved without affecting the existing structure. A conductive interface module is installed, meeting the requirement for easy and quick removal and installation of an electrically conductive polishing head.

Description

[Technical Field]

[0001] The present invention relates to the technical field of semiconductor integrated circuit chip manufacturing, and more particularly to a conductive polishing head fixing device and a conductive polishing head system. [Background technology]

[0002] The manufacturing process of wafer substrates and semiconductor devices includes processes such as polishing and surface planarization, which typically use techniques such as mechanical polishing, chemical mechanical polishing, or planarization. A wafer substrate carrier head (polishing head) applies pressure to the backside of the wafer, and controls parameters such as pressure, polishing head rotation speed, polishing disk rotation speed, and polishing liquid flow rate to polish or planarize the front surface or thin film surface of the wafer substrate with a polishing pad. Compared to mechanical polishing, chemical mechanical polishing and chemical mechanical polishing planarization processes can achieve higher polishing or planarization efficiency by adjusting the composition of the polishing liquid to induce a chemical reaction on the wafer substrate surface, and at the same time, can achieve better polishing or planarization effects, including higher flatness and lower defectivity.

[0003] Based on the conventional chemical mechanical polishing and planarization technology, the current electrochemical mechanical polishing and planarization technology further utilizes the conductive properties of the wafer substrate or the thin film on the wafer substrate surface to form a current path and perform an electrochemical reaction on the wafer substrate or the thin film surface, and by precisely controlling the circuit system, the speed of the surface chemical reaction is improved, thereby further improving the efficiency of the mechanical polishing and planarization process.

[0004] However, this method has various drawbacks, and there is currently no electrochemical mechanical polishing or planarization equipment on the market that is suitable for large-scale mass production.

[0005] The polishing heads used in chemical mechanical polishing and planarization equipment have one characteristic: they must be frequently removed for maintenance, such as replacing consumables and cleaning the crystals. Therefore, polishing heads must be easy to install and remove, stable, and highly reliable. Similar requirements apply to polishing heads suitable for electrochemical mechanical polishing and planarization equipment. However, for electrocharged polishing heads that require connection to external lead wires, connecting and disconnecting the lead wires during installation and removal can be difficult. Summary of the Invention

[0006] SUMMARY OF THE INVENTION In order to overcome the shortcomings of the prior art, the present invention provides a conductive polishing head fixing device and a conductive polishing head system that can realize the conductivity of the polishing head, and that allows easy replacement of the polishing head, thus providing high flexibility in use.

[0007] The solution adopted to solve the technical problem of the present invention is as follows: A conductive polishing head fixing device, which includes: The mounting member has a first suction end surface that can be combined with and connected to the polishing head, and at least a first passage is formed, one end of the first passage extending to the first suction end surface. A first conductive member, one end of which is connected to a power source. A conductive interface module includes at least a first working end, at least a portion of the first working end being disposed within the first passage and electrically connected to the first conductive member.

[0008] Furthermore, the first working end may be made of a conductive material.

[0009] Furthermore, the conductive interface module may include a fixing member made of an insulating material, the fixing member connected to the mounting member, and the first working end connected to the fixing member.

[0010] Furthermore, the mounting member may be connected to a rotary joint, so that the mounting member is rotatable.

[0011] Furthermore, the first passage may extend along the axial direction of the mounting member.

[0012] Furthermore, the first conductive member may be inserted into the first passage.

[0013] Furthermore, the first passage may include a first gas passage and a first mounting passage, and the first conductive member may be inserted into the first mounting passage.

[0014] Furthermore, the first passage may be provided within the mounting member, or the first passage may be provided in an outer region of the mounting member, or the first passage may be provided in an outer wall of the mounting member.

[0015] The present invention also discloses a conductive polishing head system, which includes: The mounting member has a first suction end surface and at least a first passage is formed therein, one end of the first passage extending to the first suction end surface. The polishing head has a second suction end face and at least a second passageway is formed, one end of the second passageway extending to the second suction end face. The conductive member includes at least a first conductive member having one end connected to a power source. A conductive interface module includes at least a first working end connected to the first conductive member and a second working end, and at least a portion of the first working end and the second working end are disposed within the first passage and / or the second passage. When the first suction end surface and the second suction end surface are brought into close contact with each other, the first working end and the second working end come into contact with each other and are electrically connected, thereby realizing electrical connection of the polishing head.

[0016] Furthermore, the first working end may be made of a conductive material, and the second working end may be made of a conductive material.

[0017] Furthermore, the conductive member may also include a second conductive member, which is connected to the second working end.

[0018] Further, the conductive interface module may include a fixing member made of an insulating material, the fixing member may be connected to a mounting member or a polishing head, and the first working end or the second working end may be connected to the fixing member.

[0019] Furthermore, the conductive interface module may include a mounting frame made of an insulating material, the mounting frame may be connected to the polishing head or the mounting member, and the second working end or the first working end may be connected to the mounting frame.

[0020] Furthermore, an elastic member may be provided within the mounting frame, and a flange capable of contacting the elastic member may be formed on the outer wall of the second working end or the first working end, and when the elastic member is extended, the flange may contact the inner wall of the mounting frame, and both ends of the second working end or the first working end may protrude from both side openings of the mounting frame.

[0021] Furthermore, the first working end and the second working end may be magnetically attractable to each other.

[0022] Furthermore, the mounting frame may be formed by combining an upper body and a lower body.

[0023] Furthermore, the mounting member may be connected to a rotary joint, and the polishing head may be synchronously rotatable with the mounting member.

[0024] Furthermore, the first passage may extend along the axial direction of the mounting member.

[0025] Furthermore, the first passage may include a first gas passage and a first mounting passage, the first conductive member being inserted into the first mounting passage, the second passage may include a second gas passage and a second mounting passage, and the second conductive member being inserted into the second mounting passage.

[0026] Furthermore, the first gas passage and the second gas passage may be vertically connected to each other.

[0027] Furthermore, an attachment hole may be formed in the first working end and / or the second working end, the first conductive member and / or the second conductive member may be connected to a conductive adapter member, and the conductive adapter member may be threadably engaged with the attachment hole.

[0028] Furthermore, a stopper card slot used for partial insertion of the second working end may be provided on an end surface of the first working end, or a stopper card slot used for partial insertion of the first working end may be provided on an outer surface of the second working end.

[0029] Furthermore, a seal member may be provided on the outside of the conductive interface module, and the first suction end face and the second suction end face may be in close contact with each other to form an extrusion seal on the seal member.

[0030] Furthermore, the polishing head may include an adsorption film used to adsorb the wafer, at least a portion of which may be made of a conductive material and electrically connected to the second working end or the second conductive member.

[0031] Furthermore, the adsorption film may be a flexible film, or a metal film, or a combined metal and non-metal film.

[0032] Furthermore, the polishing head may include a retaining ring for fixing the wafer within the polishing head, at least a portion of which may be made of a conductive material and electrically connected to the second working end or the second conductive member.

[0033] Furthermore, the first passage may be provided within the mounting member, or the first passage may be provided in an outer region of the mounting member, or the first passage may be provided in an outer wall of the mounting member.

[0034] The present invention is a new mechanical structure of an electrochemical mechanical polishing and planarization processing apparatus suitable for large-scale mass production. Its advantage is that it can be relatively easily converted into electrochemical mechanical polishing and planarization processing equipment under conditions that do not affect the basic mechanism of conventional chemical mechanical polishing and planarization processing equipment, and is compatible with conventional functions, i.e., it can be adapted to both charged polishing heads and normal polishing heads.

[0035] The beneficial effects of the present invention are as follows: 1) To provide a simple and reliable solution to the problem of electrostatic charging of polishing heads. 2) The first and second passages are newly established in the mounting member and polishing head, enabling conductivity of the polishing head without affecting the existing structure. 3) A conductive interface module is installed to meet the demand for easy and quick removal and installation of the electrified polishing head. 4) The number of passages in the mounting member and the polishing head can be adjusted according to needs. Multiple wires can be accommodated in one passage, or multiple wires can be connected to one passage, to meet the need for connecting multiple wires. 5) The conductive interface module can be separated into two parts, the mounting member and the polishing head, which is easy for normal removal and maintenance. 6) The two parts of the conductive interface module have different functions and can be linked together to form different functions. [Brief explanation of the drawings]

[0036] [Figure 1] 1 is a cross-sectional view of a fitting structure between a conductive polishing head fixing device and a polishing head according to a first embodiment of the present invention. [Figure 2] 1 is a cross-sectional view of a fitting structure between a conductive polishing head fixing device, a polishing head, and a rotary joint in accordance with the first embodiment of the present invention. [Figure 3] FIG. 10 is a plan view of a conductive polishing head system according to a third embodiment of the present invention. [Figure 4]4 is a cross-sectional view taken along CC in FIG. 3. [Figure 5] FIG. 5 is an enlarged view of the structure A in FIG. [Figure 6] 4 is a cross-sectional view of FIG. 3 taken along line B-B. [Figure 7] FIG. 10 is a plan view of a conductive interface module according to a third embodiment of the present invention. [Figure 8] 8 is a cross-sectional view taken along the line DD in FIG. 7 when the first working end and the second working end are not joined and are not electrically connected. [Figure 9] 8 is a cross-sectional view taken along the line DD in FIG. 7 when the first working end and the second working end are joined together and electrically connected. [Figure 10] FIG. 10 is a plan view of a conductive polishing head system according to a third embodiment of the present invention, in which the first working end extends through the entire first passage. [Figure 11] FIG. 10 is an enlarged view of a portion where a conductive interface module is located in accordance with a third embodiment of the present invention, in which a seal member is provided between the first and second suction end faces. [Figure 12] FIG. 10 is a cross-sectional view of a conductive interface module according to a fifth embodiment of the present invention. [Figure 13] FIG. 10 is a cross-sectional view of a conductive polishing head system according to a sixth embodiment of the present invention. [Figure 14] FIG. 14 is an enlarged view of the structure at E in FIG. [Figure 15] FIG. 11 is a cross-sectional view of a conductive interface module according to a seventh embodiment of the present invention. [Figure 16] FIG. 13 is a cross-sectional view of a conductive polishing head system according to an eighth embodiment of the present invention. [Figure 17] FIG. 13 is a cross-sectional view of a conductive polishing head system according to a ninth embodiment of the present invention. [Figure 18] FIG. 13 is a front view of a conductive polishing head system according to a tenth embodiment of the present invention. [Figure 19] FIG. 19 is a cross-sectional view taken along line FF in FIG. 18. DETAILED DESCRIPTION OF THE INVENTION

[0037] In order to allow those skilled in the art to better understand the aspects of the present invention, the following will clearly and completely describe the technical aspects of the embodiments of the present invention with reference to the drawings in the embodiments of the present invention, but it is clear that the described embodiments are only some embodiments of the present invention and do not represent all embodiments. Based on the embodiments of the present invention, all other embodiments that those skilled in the art can obtain without creative work should fall within the protection scope of the present invention.

[0038] [Embodiment 1] As shown in FIG. 1, the conductive polishing head fixing device includes a mounting member 1, a first conductive member 31, and a conductive interface module 4.

[0039] The mounting member 1 has a first suction end surface 11 that can be combined with and connected to the polishing head 2, and at least a first passage 12 is formed in the mounting member 1, one end of which extends to the first suction end surface 11. Taking the direction shown in FIG. 1 as an example, the first suction end surface 11 is a horizontal surface, the lower end of the first passage 12 extends to the first suction end surface 11, and the first passage 12 extends in the axial direction of the mounting member 1 and penetrates the mounting member 1.

[0040] As shown in FIG. 2, the top of the mounting member 1 can be connected to a rotary joint 5, and the mounting member 1 can rotate.

[0041] The number of first passages 12 may be one or more. As shown in Fig. 2, the first passage 12 includes a first gas passage 121 and a first mounting passage 122, and a first conductive member 31 is inserted into the first mounting passage 122. The number of first gas passages 121 and first mounting passages 122 is not limited, and their functions are also not limited. For example, the first gas passage 121 may be electrically conductive, or may be provided with an ultrasonic device, a microwave device, an electromagnetic device, a magnetic attraction device, or a light guide device, or may allow a liquid or the like to pass through.

[0042] One end of the first conductive member 31 is connected to a power source (not shown), and the first conductive member 31 is inserted into the first passage 12. The first conductive member 31 may occupy most of the axial length of the first passage 12, or may occupy only a portion of the axial length. Of course, the entire axial length of the first passage 12 may be occupied by the first working end 41 of the conductive interface module 4, and the first conductive member 31 may be connected to the first working end 41 and located outside the first passage 12. In this embodiment, the first conductive member 31 is a wire.

[0043] The conductive interface module 4 includes at least a first working end 41, at least a portion of which is disposed within the first passage 12, and which is electrically connected to the first conductive member 31. In this embodiment, the first working end 41 is made of a conductive material. However, in other embodiments, as long as the conductive function can be achieved, there is no specific limitation, and the first working end 41 may be made partially of a conductive material and partially of a non-conductive material.

[0044] To facilitate the assembly connection between the first working end 41 and the mounting member 1, the conductive interface module 4 further includes a fixing member 43 made of an insulating material and connected to the mounting member 1, and the first working end 41 connected to the fixing member 43. The connection between the fixing member 43 and the mounting member 1 can be a bolt connection or the like, and the connection between the first working end 41 and the fixing member 43 can be an interference fit connection, and is not particularly limited.

[0045] Of course, as shown in FIG. 2, the first working end 41 may be a cylindrical conductor embedded in the mounting member 1 without the need for a fixing member 43 .

[0046] [Embodiment 2] The polishing head system includes a conductive polishing head fixing device and a polishing head 2. The structures of the mounting member 1, the first conductive member 31, and the conductive interface module 4 in the conductive polishing head fixing device are the same as those in the first embodiment, and therefore, the description thereof will be omitted.

[0047] The polishing head 2 is a conventional polishing head, and is non-conductive, with its upper surface being a second suction end surface 21 that can be in close contact with the first suction end surface 11. Each polishing head 2 has multiple air bags inside, and by controlling the amount of air pressure inside the air bags, pressure is generated in each area on the back surface of the wafer, thereby controlling the polishing effect.

[0048] When the first suction end surface 11 and the second suction end surface 21 come into close contact with each other, a negative pressure is generated in the first gas passage 121, and the polishing head 2 can be adsorbed to the mounting member 1 and rotated, and the mounting member 1 and the polishing head 2 can rotate integrally, thereby realizing the wafer polishing process.

[0049] [Embodiment 3] As shown in FIGS. 3 to 10, the conductive polishing head system includes a mounting member 1, a polishing head 2, a conductive member, and a conductive interface module 4.

[0050] The mounting member 1 has a first suction end surface 11, and at least a first passage 12 is formed in the mounting member 1, with one end of the first passage 12 extending to the first suction end surface 11. Taking the direction shown in FIG. 4 as an example, the first suction end surface 11 is a horizontal plane, the lower end of the first passage 12 extends to the first suction end surface 11, and the first passage 12 extends in the axial direction of the mounting member 1 and penetrates the mounting member 1.

[0051] The top of the mounting member 1 may be connected to a rotation joint 5, and the mounting member 1 may rotate about its own centerline.

[0052] The number of first passages 12 may be one or more, and the first passages 12 include a first gas passage 121 and a first mounting passage 122. The first conductive member 31 is inserted into the first mounting passage 122. The number of first gas passages 121 and first mounting passages 122 is not limited, and the functions thereof are also not limited.

[0053] The polishing head 2 has a second suction end surface 21, and at least a second passage 22 is formed in the polishing head 2, with one end of the second passage 22 extending to the second suction end surface 21. Taking the direction shown in FIG. 4 as an example, the second suction end surface 21 is a horizontal plane, the upper end of the second passage 22 extends to the second suction end surface 21, and the second passage 22 extends along the axial direction of the polishing head 2.

[0054] The conductive member includes at least a first conductive member 31, one end of which is connected to a power source and which is inserted into the first passage 12. In this embodiment, most of the axial length of the first passage 12 is occupied by the first conductive member 31, or a portion of the axial length may be occupied by the first conductive member 31. Of course, as shown in FIG. 10 , the entire axial length of the first passage 12 may be occupied by the first working end 41 of the conductive interface module 4, and the first conductive member 31 may be connected to the first working end 41 and located outside the first passage 12. In this embodiment, the first conductive member 31 is a wire.

[0055] The conductive interface module 4 includes at least a first working end 41 and a second working end 42. At least a portion of the first working end 41 is disposed within the first passage 12, and the first working end 41 is electrically connected to the first conductive member 31. At least a portion of the second working end 42 is disposed within the second passage 22. In this embodiment, the first working end 41 and the second working end 42 are made of a conductive material. However, in other embodiments, the first working end 41 and the second working end 42 may be partially made of a conductive material or partially made of a non-conductive material, and are not particularly limited as long as they can achieve a conductive function.

[0056] To facilitate assembly and connection between the second working end 42 and the polishing head 2, the conductive interface module 4 further includes a mounting frame 44 made of an insulating material. The mounting frame 44 is connected to the polishing head 2, and the specific connection method is not limited. The mounting frame 44 is non-conductive, isolating the second working end 42 from the polishing head 2 to prevent electrical leakage. The second working end 42 is connected to the mounting frame 44. Specifically, the mounting frame 44 is formed by fitting an upper body 443 and a lower body 444 together. An elastic member 441 is installed within the mounting frame 44. The outer wall of the second working end 42 forms a flange 442. One end of the elastic member 441 abuts on the flange 442, and the other end abuts on the lower body 444 of the mounting frame 44. When the elastic member 441 is extended, the flange 442 abuts against the upper body 443 of the mounting frame 44, and both ends of the second working end 42 extend from the upper and lower openings of the mounting frame 44, respectively, ensuring that the second working end 42 effectively contacts and is electrically conductive with the first working end 41.

[0057] When the first suction end surface 11 and the second suction end surface 21 are in close contact with each other, the first working end 41 and the second working end 42 come into contact and conduct, thereby realizing the electrical connection of the polishing head 2. In other words, the power source is electrically connected to the polishing head 2 via the first conductive member 31, the first working end 41, and the second working end 42, thereby realizing the charging of the polishing head 2.

[0058] To ensure an effective connection between the first working end 41 and the second working end 42 and to ensure the formation of a conductive path, a stopper card slot 411 is provided on the end surface of the first working end 41, and a portion of the second working end 42 is inserted into the stopper card slot 411.

[0059] To further ensure an effective connection between the first working end 41 and the second working end 42, the first working end 41 and the second working end 42 can be magnetically attracted, that is, the first working end 41 and the second working end 42 are not only conductive but also magnetic.

[0060] Since the working area of ​​the polishing head 2 is wet, there is a possibility that liquid may seep in between the polishing head 2 and the mounting member 1, which presents two risks. 1) The liquid may cause the second working end 42 and the first working end 41 to be electrically connected to the polishing head 2 or the mounting member 1, resulting in a short circuit. 2) The liquid may corrode the second working end 42 and the first working end 41.

[0061] 11, a seal member 47 is installed on the outside of the conductive interface module 4, and when the first suction end face 11 and the second suction end face 21 are brought into close contact with each other, the seal member 47 exerts an extrusion sealing effect. The seal member 47 can be fitted into the mounting groove of the second suction end face 21, or it can be fitted into the mounting groove of the first suction end face 11, but is not limited to this. Achieving a seal between the first suction end face 11 and the second suction end face 21 will prevent water from entering the conductive interface module 4, thereby avoiding the risks of water leakage and corrosion.

[0062] [Embodiment 4] In this embodiment, the conductive member further includes a second conductive member 32 connected to the second working end 42 .

[0063] In other words, in embodiment 3, the second working end 42 can be used to directly electrically connect to the polishing head 2, but in this embodiment, the second conductive member 32 is electrically connected to the polishing head 2, and the power source passes through the first conductive member 31, the first working end 41, the second working end 42 and the second conductive member 32 to connect to the polishing head 2, thereby realizing charging of the polishing head 2.

[0064] The number of second passages 22 may be one or more. As shown in Fig. 6, the second passage 22 includes a second gas passage 221 and a second mounting passage 222, and the second conductive member 32 is inserted into the second mounting passage 222. The number of second gas passages 221 and second mounting passages 222 is not limited, and the functions thereof are not limited either.

[0065] To ensure effective suction between the mounting member 1 and the polishing head 2, the first gas passage 121 and the second gas passage 221 are connected to each other vertically. The first gas passage 121 and the second gas passage 221 are connected to each other vertically and then connected to a gas port fixed by the upper rotary joint 5.

[0066] [Embodiment 5] In the third embodiment, at least a portion of the first working end 41 is located within the first passage 12 , and at least a portion of the second working end 42 is located within the second passage 22 .

[0067] As shown in FIG. 12, in this embodiment, the same structure as the first working end 41 may be disposed in the second passage 22, or the same structure as the second working end 42 may be disposed in the first passage 12; in other words, the structure of embodiment 3 may be reversed upside down.

[0068] At this time, a stopper card slot is provided on the surface of the second working end, into which a part of the first working end is inserted.

[0069] Of course, in other embodiments, the first working end 41 may protrude from the first adsorption end face 11, and when the first adsorption end face 11 and the second adsorption end face 21 come into close contact with each other, the first working end 41 may extend into the second passage 22 and come into contact with the second working end 42, thereby establishing electrical contact.

[0070] Alternatively, the length by which the second working end 42 protrudes from the second suction end face 21 may be increased, and the first working end 41 may be positioned deep inside the first passage 12, so that when the first suction end face 11 and the second suction end face 21 come into close contact with each other, the second working end 42 extends into the first passage 12 and comes into contact with the first working end 41, thereby establishing electrical contact.

[0071] [Embodiment 6] 5, when the mounting member 1 is attached to the fixing member 43, the end face of the fixing member 43 becomes horizontal with the first suction end face 11. When the mounting frame 44 is attached to the polishing head 2, the end face of the mounting frame 44 becomes horizontal with the second suction end face 21.

[0072] 13 and 14, in this embodiment, the groove 13 for attaching the fixing member 43 and the first working end 41 in the mounting member 1 is formed deeper so as to accommodate most of the second working end 42 and the mounting frame 44. When it is not necessary to charge the polishing head 2, the mounting frame 44 may be removed.

[0073] Of course, in other embodiments, the polishing head 2 may be formed with a deeper groove so that the first working end 41 can also be accommodated.

[0074] [Embodiment 7] Based on the fourth embodiment, to achieve the assembly connection between the first conductive member 31 and the first working end 41, a mounting hole 45 is formed in the first working end 41, and a female thread is formed in the mounting hole 45. The first conductive member 31 is connected to a conductive adapter member 46, specifically, can be wrapped around the outer circumference of the conductive adapter member 46. The conductive adapter member 46 has a male thread that can be screwed into the mounting hole 45, thereby achieving a detachable connection between the first conductive member 31 and the first working end 42.

[0075] Similarly, to achieve the assembly connection between the second conductive member 32 and the second working end 42, a second mounting hole 48 is formed in the second working end 42, and an internal thread is formed in the second mounting hole 48. The second conductive member 32 is connected to a second conductive adapter member 49, specifically, can be wrapped around the outer periphery of the second conductive adapter member 49. The second conductive adapter member 49 has an external thread that can be threaded into the second mounting hole 48, thereby achieving a detachable connection between the second conductive adapter member 49 and the second working end 42.

[0076] Of course, in other embodiments, the first conductive member 31 and the first working end 42 may be directly welded together, or the first working end 42 may be an integral part of the first conductive member 31, but this is not particularly limited.

[0077] [Embodiment 8] In the above-described embodiment, the first passage 12 extends along the axial direction of the mounting member 1. As shown in Fig. 16, the first passage 12 does not necessarily extend along a straight line in the axial direction of the mounting member 1, but may extend in a curved manner. The lower end of the first passage 12 is located at the first suction end surface 11, and the upper end of the first passage 12 may be located at the upper end surface opposite the first suction end surface 11 or at the side wall of the mounting member 1, and is not particularly limited.

[0078] Similarly, the second passage 12 does not necessarily extend linearly, but may extend in a curved manner.

[0079] [Embodiment 9] In the above-described embodiment, the first passage 12 is provided inside the mounting member 1. As shown in Fig. 17, the first passage 12 may also be provided in the outer region of the mounting member 1. The outer region includes the outer wall and also the outer peripheral region of the mounting member 1.

[0080] [Embodiment 10] As shown in Figures 18 and 19, the conductive interface module 4 does not necessarily have to have a complex structure like that of embodiment 3 above, but may have a simple structure in which the first working end 41 directly extends across the entire first passage 12, the second working end 42 directly extends across the entire second passage 22, and the upper end of the second working end 42 is horizontal with the second suction end surface 21.

[0081] [Embodiment 11] Based on the above-mentioned embodiment, the polishing head 1 includes an adsorption film 23 for adsorbing a wafer, at least a portion of which is made of a conductive material and electrically connected to the second working end 42 or the second conductive member 32. Specifically, in embodiment 10, the lower end of the second working end 42 extends to the adsorption film 23.

[0082] The adsorption film 23 may be a flexible film, a metal film, or a film made of a combination of metal and non-metal.

[0083] [Embodiment 12] Based on the above-described embodiment, the polishing head 1 includes a retaining ring 24 for fixing the wafer in the polishing head, at least a portion of which is made of a conductive material and is electrically connected to the second working end 42 or the second conductive member 32.

[0084] The retaining ring 24 may be present simultaneously with the adsorption film 23 in the eleventh embodiment, or may be present independently, and is not particularly limited.

[0085] The structures among the above embodiments can be combined in different ways without any particular limitations.

[0086] The above specific embodiments are intended to illustrate the present invention and are not intended to limit the present invention. Any modifications and variations to the present invention within the spirit of the present invention and the scope of protection of the claims are included in the scope of protection of the present invention.

Claims

1. A conductive polishing head fixing device, The device includes a mounting member (1), a first conductive member (31), and a conductive interface module (4), A mounting member (1) has a first suction end surface (11) that can be combined and connected to a polishing head (2), and at least a first passage (12) is formed, one end of the first passage (12) extending to the first suction end surface (11); a first conductive member (31), one end of which is connected to a power source; A conductive polishing head fixing device, characterized in that the conductive interface module (4) includes at least a first working end (41), at least a portion of which is disposed within a first passage (12) and electrically connected to the first conductive member (31).

2. 2. The conductive polishing head fixing device as claimed in claim 1, wherein the first working end (41) is made of conductive material.

3. The conductive polishing head fixing device according to claim 1, characterized in that the conductive interface module (4) further includes a fixing member (43) made of insulating material, the fixing member (43) is connected to the mounting member (1), and the first working end (41) is connected to the fixing member (43).

4. 2. The conductive polishing head fixing device according to claim 1, wherein the mounting member (1) is connected to a rotary joint (5) so that the mounting member (1) is rotatable.

5. 2. The conductive polishing head fixing device according to claim 1, wherein the first passage (12) extends along the axial direction of the mounting member (1).

6. 2. The conductive polishing head fixing device according to claim 1, wherein the first conductive member (31) is inserted into the first passage (12).

7. 2. The conductive polishing head fixing device of claim 1, wherein the first passage (12) includes a first gas passage (121) and a first mounting passage (122), and the first conductive member (31) is inserted into the first mounting passage (122).

8. The first passage (12) is provided in the mounting member (1), or the first passage (12) is provided in an outer area of ​​the mounting member (1); Alternatively, the first passage (12) is provided on the outer wall of the mounting member (1).

9. The polishing device includes a mounting member (1), a polishing head (2), a conductive member, and a conductive interface module (4), A mounting member (1) having a first suction end surface (11) and at least a first passage (12) formed therein, one end of the first passage (12) extending to the first suction end surface (11); a polishing head (2) having a second suction end surface (21) and at least a second passage (22) formed therein, one end of the second passage (22) extending to the second suction end surface (21); The conductive member includes at least a first conductive member (31) having one end connected to a power source; a conductive interface module (4) including at least a first working end (41) connected to the first conductive member (31) and a second working end (42), at least a portion of the first working end (41) and the second working end (42) being disposed within the first passage (12) and / or the second passage (22); A conductive polishing head system characterized in that when the first suction end surface (11) and the second suction end surface (21) come into close contact, the first working end (41) and the second working end (42) come into contact and become conductive, thereby electrically connecting the polishing head (2).

10. 10. The conductive polishing head system of claim 9, wherein the first working end (41) is made of a conductive material and the second working end (42) is made of a conductive material.

11. 10. The conductive polishing head system of claim 9, wherein the conductive member further comprises a second conductive member (32), the conductive member being connected to the second working end (42).

12. 10. The conductive polishing head system of claim 9, wherein the conductive interface module (4) further includes a fixing member (43) made of an insulating material, the fixing member (43) is connected to the mounting member (1) or the polishing head (2), and the first working end (41) or the second working end (42) is connected to the fixing member (43).

13. 10. The conductive polishing head system of claim 9, wherein the conductive interface module (4) includes a mounting frame (44) made of insulating material, the mounting frame (44) is connected to the polishing head (2) or the mounting member (1), and the second working end (42) or the first working end (41) is connected to the mounting frame (44).

14. 13. The conductive polishing head system of claim 12, further comprising: an elastic member (441) provided within the mounting frame (44); a flange (442) capable of contacting the elastic member (441) is formed on the outer wall of the second working end (42) or the first working end (41); when the elastic member (441) is extended, the flange (442) contacts the inner wall of the mounting frame (44); and both ends of the second working end (42) or the first working end (41) protrude from both side openings of the mounting frame (44).

15. 10. The conductive polishing head system according to claim 9, wherein the first working end (41) and the second working end (42) are magnetically attractable.

16. 13. The conductive polishing head system according to claim 12, wherein the mounting frame (44) is formed by combining an upper body (443) and a lower body (444).

17. 10. The conductive polishing head system of claim 9, wherein the mounting member (1) is connected to a rotary joint (5), and the polishing head (2) is rotatable in synchronization with the mounting member (1).

18. 10. The conductive polishing head system according to claim 9, wherein the first passage (12) extends along the axial direction of the mounting member (1).

19. The first passage (12) includes a first gas passage (121) and a first mounting passage (122), and the first conductive member (31) is inserted into the first mounting passage (122); The conductive polishing head system of claim 9, wherein the second passage (22) includes a second gas passage (221) and a second mounting passage (222), and the second conductive member (32) is inserted into the second mounting passage (222).

20. 19. The conductive polishing head system according to claim 18, wherein the first gas passage (121) and the second gas passage (221) are vertically connected to each other.

21. The conductive polishing head system of claim 8, wherein the first working end (41) and / or the second working end (42) have a mounting hole (45), the first conductive member (31) and / or the second conductive member (32) are connected to a conductive adapter member (46), and the conductive adapter member (46) can be screwed into the mounting hole (45).

22. A stopper card slot (411) is provided on the end surface of the first working end (41) to be used for partial insertion of the second working end (42); Alternatively, the conductive polishing head system according to claim 9, wherein the second working end has an outer surface provided with a stopper card slot for partially inserting the first working end.

23. 10. The conductive polishing head system of claim 9, wherein a sealing member (47) is provided on the outside of the conductive interface module (4), and the first suction end surface (11) and the second suction end surface (21) are in close contact with each other to form an extrusion seal against the sealing member (47).

24. The conductive polishing head system of claim 11, wherein the polishing head (2) includes an adsorption film (23) used to adsorb the wafer, and at least a portion of the adsorption film (23) is made of a conductive material and is electrically connected to the second working end (42) or the second conductive member (32).

25. 25. The conductive polishing head system of claim 24, wherein the adhesive film (23) is a flexible film, or a metal film, or a metal-nonmetal combined film.

26. The conductive polishing head system of claim 11, characterized in that the polishing head (2) includes a retaining ring (24) that fixes the wafer within the polishing head, at least a portion of which is made of a conductive material and is electrically connected to the second working end (42) or the second conductive member (32).

27. The first passage (12) is provided in the mounting member (1), or the first passage (12) is provided in an outer region of the mounting member (1); Alternatively, the first passage (12) is provided on the outer wall of the mounting member (1).

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