System and method for monitoring changes in structures

Abstract

A system and method for monitoring changes in a structure using a deformation gauge capable of measuring changes in position in three dimensions and wirelessly communicating with an external device. The deformation gauge features multiple magnetic field sensors that can detect changes in the magnetic field experienced by the sensor, generated by a separately housed magnet positioned on the structure at a predetermined distance from the sensor. Optionally, a tilt gauge including one or more high or low precision accelerometers can be used to detect any changes in the orientation of the tilt gauge that can be detected and measured in three dimensions. Another type of system includes high and / or low frequency microphones coupled to a target magnet suspended in three dimensions from a vibration damping element that can be used on a ground-based structure or on the ground to detect and analyze seismic activity.

Description

[Technical Field]

[0001] (CROSS-REFERENCE TO RELATED APPLICATIONS)

[0001] This application claims the benefit of priority to U.S. Provisional Patent Application No. 63,416,314, filed October 14, 2022. The contents of U.S. Provisional Patent Application No. 63,416,314, filed October 14, 2022, are incorporated by reference in their entirety.

[0002] (Technical field)

[0002] The present disclosure is in the technical field of engineering and / or construction machinery. More particularly, the present disclosure relates to a system for remotely monitoring changes in defects such as gaps, cracks, or fractures in a structure. [Background technology]

[0003] (Background technology)

[0003] Engineers have developed instruments to help them monitor the condition of structures over time. This can be useful in a variety of situations where it is important to monitor damage to a building or other structure over time or during a specific event or series of events. For example, those performing construction, repair, or demolition work on or near a cracked wall or other structure may need to monitor the condition of the crack while performing work on or near the wall or structure to detect whether the crack is worsening while they are working. Similarly, if they are attempting to repair a crack in a wall, they need to monitor the condition of the crack while they are working. Similarly, some structures, such as bridges, need to be monitored over long periods of time. Currently, divers need to be sent underwater to assess and measure ongoing damage to bridges in order to monitor their safety and plan repairs and maintenance. Consequently, the field needs a device or system that can be used to remotely monitor the condition of bridges over time.

[0004]

[0004] Deformation gauges are instruments commonly used to measure or monitor changes in cracks in the foundations, walls, or masonry of structures. For example, devices sometimes referred to as "string-pot" gauges use a wire rope that is attached to a movable object, such as a section of wall on one side of the crack. The remainder of the device is placed on the other side of the crack and can measure the amount of tension or slack in the wire rope. Movement of the wire rope can be detected by some conventional devices based on the movement of the wire rope relative to the rest of the device. However, this type of device does not separate the movement of the wall into x, y, and z vectors, but rather produces a single measurement that sums the movement in all three directions. As a result, the measurements produced by this device are relatively inaccurate.

[0005] Another type of deformation gauge involves attaching two overlapping pieces of Plexiglass or similar translucent material to either side of a crack in a wall. The Plexiglass has graduations or other means printed on it to detect movement between the two pieces of Plexiglass. As the crack moves, the pieces of Plexiglass move relative to each other, producing a reading that can be taken manually. This type of gauge can detect movement in two planes, but not three, requiring a technician to manually examine the gauge to obtain a reading from it. These readings are subject to human error, and the two pieces of Plexiglass can create a parallax effect that prevents accurate measurements.

[0006]

[0006] There are other devices on the market that do not suffer from the drawbacks listed above. For example, hydraulic strain gauges are designed much like a typical syringe. A larger piston is connected to an object that can cause movement, and that movement causes fluid to move from a larger tube to a smaller one, where the applied pressure can be measured, often with a Bourdon tube. These devices work well for detecting very small movements, but are not useful for detecting movement between two different structures.

[0007]

[0007] There is a great need in this industry for an apparatus and a method of using the apparatus that allows someone to measure the movement of a structure in three dimensions near a defect in a wall or other structure and transmit the data to a remote user or device. Summary of the Invention

[0008] (technical issue)

[0008] The present invention is a method for monitoring changes or movement in a structure. More specifically, the present disclosure details an apparatus for monitoring changes in position between multiple structures or portions of the same structure in three dimensions, and a method for using the apparatus. More specifically, the inventors have developed a novel deformation gauge for monitoring changes in a physical structure over time. The deformation gauge used in this method can resolve structure movement in three dimensions, rather than just one or two. In addition, this does not require a technician to physically observe the deformation gauge to obtain readings from it. Furthermore, the deformation gauge can upload readings to a separate device or store readings in an internal storage device that preserves the readings even if the gauge itself fails or loses power. The method may optionally include the use of a tilt gauge to augment the readings obtained by the deformation gauge.

[0009] (definition) Substantially—In this disclosure, substantially means within 10 degrees or within 10 percent of a stated measurement or orientation.

[0010]

[0010] The feature means that the described structure includes other structures, is attached so as to be integrated with other structures, is on other structures, or is in physical contact with other structures.

[0011] (Problem Solving) A preferred embodiment and the inventors' best contemplated mode of the deformation gauge described herein has two separate components: a target and a sensor array. The target includes a magnet. The magnet is preferably housed in a housing made from a material that does not interfere with the magnet's magnetic field. The sensor array includes a circuit board, also preferably housed in the housing or body, featuring multiple magnetic field sensors (e.g., Hall effect sensors) capable of sensing changes in the magnetic field. The sensor array is used to sample the magnet's magnetic field from multiple positions to accurately determine the position of the sensor array relative to the target magnet in three dimensions.

[0012]

[0012] The Hall effect produces a potential difference or voltage in a conductor carrying a current when the conductor is exposed to a magnetic field. Generally, the effect is greatest when the magnetic field is perpendicular to the flow of charge or current in the conductor. When a current flows through a conductor, typically a semiconductor, the current is exposed to a magnetic field that deflects the charge carriers enough to create a potential difference. The change in voltage is a direct function of and can be used to determine the strength and direction of the magnetic field source. If the strength of the magnetic field generated by a magnet is known and the starting position of the magnet relative to the sensor(s) is known, measurements from the Hall effect sensors can be used to measure the change in position between the sensor and the magnet. Repeated measurements of the change in voltage can be used to "map" or analyze the magnetic field at various points relative to the magnet and sensor. These data can be used to detect changes in the magnetic field, which typically occur when there is some change in position or movement between the magnet and the conductor. Thus, when a target moves relative to the sensor, or vice versa, the change in voltage detected by the three Hall effect sensors can be used to calculate the distance and direction of that movement. This phenomenon can be used to monitor the physical location, and therefore the condition, of physical structures such as support beams, pilings, or walls over time. It can also be used to measure vibrations or subtle movements in naturally occurring structures and formations. These magnetic field sensors use the Hall effect to detect changes in a stimulating current through a coil operably connected to silicon. Different orientations of the sensor's coil result in different measurement axes. Multiple magnetic sensors oriented in different planes can be used to detect and calculate movement in multiple dimensions between the sensor and a target magnet.

[0013]

[0013] Each Hall effect or "magnetic field" sensor can detect changes in the position of the sensor array, and therefore the deformation gauge, in three dimensions and relay the data to a microprocessor which processes and filters the data to generate position data indicative of the location of the target magnet and any positional changes between the target magnet and the sensor array.

[0014]

[0014] The accuracy of Hall effect sensor measurements can be affected by their placement. A preferred embodiment of the device includes a sensor array including three Hall effect sensors arranged on a programmed circuit board such that all three sensors are arranged in a single plane. More accurate measurements can be made by the sensors if that plane is arranged perpendicular or substantially perpendicular to the polar axis of the magnet featuring the target, i.e., the target magnet. Accuracy can be further improved if the polar axis of the magnet also intersects the plane at the center of the triangle formed by the sensors.

[0015]

[0015] During the manufacture of the gauge, the magnetic field is "mapped" or measured at various points in space around the magnet. The higher the resolution, i.e., the more points of the magnetic field that are mapped, the more accurate the measurements produced through use of the device. Knowing the shape of the magnetic field allows the creation of a table that displays interpolated values ​​between the measured points of the magnetic field.

[0016]

[0016] When the device is in use, the magnetic sensor is arranged in three dimensions, namely the x, y and z axes. 1Multiple magnetic field measurements are taken. Individual readings from the sensor are prone to some level of error. The sensor itself has an inherent level of error / noise. Additional noise can arise due to transient environmental factors. As a result, rather than taking a single measurement, the magnetic field sensor takes hundreds of measurements in a fraction of a second and then averages those measurements, thereby reducing any error or noise that may be present in a single or small number of measurements. The measurements are sampled by an analog-to-digital converter and then digitally transmitted to a microprocessor. The generated value is then compared to information generated when the magnet's magnetic field was initially mapped to generate the magnet's position in a coordinate system shared by the magnetic field sensor. This measurement is then compared to earlier measurements to reveal changes in the target magnet's position relative to the magnetic field sensor, indicating some kind of movement between the target and the sensor housing. The measurements can then be transmitted to a separate processor or receiving device that can store and / or display the data. In this way, the data collected and calculated by the deformation gauge is safely stored elsewhere, even if the deformation gauge loses power or is damaged. Other styles of devices include internal memory storage that stores the same data in the event of a power failure or other problem that prevents the transmission of the data. Footnote 1 This is either the use of a combination of sensors that can sense the magnetic field in a single axis or dimension, and / or the use of individual sensors in tandem that can each measure in three axes / dimensions.

[0017]

[0017] Before putting the device into use, the optimal distance between the target magnet and the sensor array is calculated. If the sensor array is placed too close to the target magnet, the Hall effect sensors will become saturated with the magnetic field from the target magnet, preventing them from detecting changes in that field. If the target magnet is too far from the sensor array, the readings produced by the magnetic field sensors will be inaccurate. A process similar to the initial mapping procedure is used to calculate the optimal distance between the target magnet and the magnetic field sensor array. The magnetic field sensors are placed and the distance from each sensor to the magnet is estimated using the following formula: Measurements are repeated over a range of temperatures and times to characterize the change in the magnetic field due to these factors. A mathematical model is then created that represents the magnetic field at the physical location, time, and temperature. Using the known spatial relationship between the sensors and an initial estimate of the target magnet's position, a gradient descent algorithm is used to find the magnet position that best satisfies the distance estimate.

[0018]

[0018] Distance = (f * r) / 2.0 During the ceremony: m=(mx2+my2+mz2) 1 / 2 k=m * 3.0 / 2000.0 r=m0.25 / k f=8.0-(0.93 * r 1 / 2 )

[0019]

[0019] As a result, in use, the sensor housing is positioned a calculated distance away from the target.

[0020]

[0020] The effective distance of the system can be increased or decreased by using magnets of varying field strength. The size of the MEMs element allows for better performance characterization with respect to temperature, higher sensitivity of the capacitive measurement, better temperature correction curve, better resolution and accuracy of the measurements.

[0021]

[0021] In use, the brackets for each component of the deformation gauge are installed on the surface to be monitored before attaching the actual components to the brackets. First, the desired mounting distance for installation is determined. The user identifies a crack or gap in the structure that needs to be monitored. The user determines the spacing of the components by measuring the width of the crack or gap and adding to that measurement a preset distance based on the optimal position for the target magnet as described above.

[0022] The sensor bracket includes a sliding structure or tongue that is attached to both the sensor bracket and the target bracket. After determining the distance between the target bracket and the sensor bracket, the tongue, which is slidably engaged with the sensor bracket and attached at one end to the target bracket, can be extended to the desired length, thereby setting the position of the sensor and target relative to each other. The tongue is then temporarily clamped in place by two small screws that fasten floating plastic tabs to the tongue on the sensor bracket. After the adhesive cures or the bracket is otherwise securely attached, the tongue can be released and retracted back into the body of the sensor bracket. The user then attaches the bracket to the structure characterized by the crack / deformation using a conventional adhesive. The sensor housing and target housing are then attached to their respective brackets, optionally with conventional fasteners such as screws. Once the sensor housing and target housing are securely attached to their respective brackets, the gauge is ready to be used to monitor wall movement on both sides of the crack.

[0023] This method can be enhanced by the use of tilt gauges. Tilt gauges use one or more MEMS accelerometers to measure acceleration due to gravity in three dimensions, allowing the device to detect any change in the "tilt" or orientation of a structure relative to the Earth, the source of gravity. While deformation gauges measure the movement of a target magnet relative to the sensor array, tilt gauges measure the movement of the accelerometer(s) relative to gravity. These two data sets can be combined to provide very precise and accurate measurements of the movement of the object or objects to which they are attached. The process of sampling and filtering / processing data from the accelerometers is generally the same as that described above for magnetic field sensors. The accelerometer(s) take hundreds of measurements in a fraction of a second, and then average the measurements to reduce errors or noise that may be present in a single or few measurements. Measurements are sampled by an analog-to-digital converter and then digitally transmitted to a microprocessor. The processor is software capable of, and configured to interpret, data from the accelerometer, magnetic field sensor, and any other components to (a) account for and subtract error, and (b) calculate the position of the associated sensor relative to either the target magnet or the Earth's gravitational field, i.e., the ground.

[0024] The tilt gauge can use more than one accelerometer, a combination of accelerometers and gyroscopes, and / or a combination of low and high precision accelerometers. One or more lower precision accelerometers can be used to sample in conjunction with the high precision accelerometer(s) to detect and thereby filter excess higher frequency vibrations from the Hall effect sensors and high precision accelerometer(s) and / or any other system components.

[0025] Early embodiments of the system used a deformation gauge that was physically separate from the tilt gauge. Newer versions of the system include a single device or housing that contains both the sensor array and target of the deformation gauge and the accelerometer(s) of the tilt gauge.

[0026]

[0026] Mems accelerometers and Hall effect sensors typically use components whose performance is affected by temperature changes. As the external temperature changes, the natural frequency and scale factor of the sensing element changes, causing measurement errors. This system has applications involving system components exposed to extreme conditions.

[0027]

[0027] Additionally, temperature affects the strength of the magnetic field. As the temperature of a magnet decreases, the magnetic field it produces becomes stronger, and as the temperature increases, the magnetic field becomes weaker, up to the point where the magnet is heated enough to lose its magnetic properties. The degree to which changes in temperature affect the magnetic field strength of a magnet of known composition can be calculated.

[0028]

[0028] Consequently, some styles of systems include one or more temperature sensors operably connected to Hall effect sensors, MEMS accelerometers, and / or other components of the system. Thus, the "noise" or change in magnetic field strength as a result of temperature can be calculated and subtracted from the measurements made by the magnetic field sensors.

[0029] Other variations of the system are specifically configured to detect vibrations and can be used to monitor seismic activity. In some of these applications, the target magnet is suspended or supported in three dimensions by springs and / or other vibration-damping mechanisms, thereby enabling more sensitive detection of movement. Still other applications include low-frequency microphones that detect additional reference data at frequencies generated within an appropriate bandpass range. The system can be used on or below the ground to detect vibrations due to earthquakes, or in structures such as buildings to detect how vibrations from seismic activity are vibrating the building. Because one or more of the system components (magnetic sensor, accelerometer(s), target magnet, etc.) are suspended from mounting springs and / or other vibration-damping elements and vibrate independently of the housing, they are effectively low-mass weights that detect vibrations of the entire unit. These frequencies can then be used to filter out seismic vibrations as noise in displacement measurements and as distinct frequency bands of movement of the entire reference frame to which the sensor and target are attached. Data from the accelerometer and magnetic sensor array can be bandpass filtered to remove lower frequency position changes in favor of data from higher frequency movements to detect and analyze short frequency seismic vibrations due to position changes relative to the accelerometer(s) and / or magnetic sensor array. If a microphone is connected to the enclosure through a pressure vent, the microphone can also detect air pressure fluctuations that occur during a seismic event.

[0030]

[0030] These devices can communicate wirelessly with a third device or set of devices that includes means for processing the information from the gauges and providing it to an end user, as well as means for storing the information for later retrieval. Some applications can use wireless modulation techniques such as LoRa to transmit data. As a result, the inventors have created a system or method that uses novel deformation gauges, optionally in conjunction with tilt gauges either separate or integrated with the deformation gauges, to monitor changes in the position of a structure over time. The system generates more accurate data than conventional devices and methods, and does so with minimal human intervention.

[0031] (Advantageous effects of the invention) In a broad embodiment, the present invention is a system for remotely monitoring the condition of a structure. Advantages of the present invention include, without limitation, the ability to remotely monitor changes in cracks or gaps in a structure over time or in response to a specific event without having line of sight to the gauge or without a technician being available to physically examine the gauge. Furthermore, the method allows a user to monitor changes in cracks or gaps or structure movement in three dimensions, rather than just one or two. Furthermore, the method of the present invention further incorporates an inclinometer, allowing a user to measure not only changes in the structure's gaps, but also the structure's orientation relative to the ground. Engineers or technicians working on a building, wall, or bridge can remotely monitor the effect of their work on gaps or cracks in the structure and / or the tilt or movement of the structure in three dimensions. Additionally, this style of system can be used to detect vibrations and thus function as a seismometer, calculating changes in sensor position due to vibrations caused by seismic events and then relaying that data to other components / locations. [Brief explanation of the drawings]

[0032] BRIEF DESCRIPTION OF THE DRAWINGS [Figure 1] FIG. 1 is a perspective view of a deformation gauge as used in a first embodiment of the system. [Figure 2A] FIG. 1 is a perspective view of a deformation gauge with half of the cover or housing removed. [Figure 2B] FIG. 10 is a perspective view of the target housing with the magnet removed. [Figure 2C] FIG. 2 is a cross-sectional view of a target. [Figure 3] FIG. 1 is a top view of a circuit board featuring a Hall effect sensor. [Figure 4A] 4C is a cross-sectional side view of the target housing and the sensor housing taken along line BB shown in FIG. 4B. [Figure 4B] FIG. 10 is a top view of the target housing and the sensor housing. [Figure 4C] FIG. 2 is a cross-sectional top view of a target housing and a sensor housing. [Figure 4D] FIG. 2 is a side view of the target housing and the sensor housing. [Figure 5A] FIG. 10 is a perspective view of a tilt gauge that may be incorporated into other embodiments described herein. [Figure 5B] FIG. 10 is a view of the same tilt gauge with the cover removed to expose the internal components. [Figure 6A] FIG. 10 is a perspective view of a gauge used in a second embodiment of a system configured to detect temperature changes. [Figure 6B] FIG. 2 is a top perspective view of the internal components of the gauge. [Figure 7A] FIG. 10 is a perspective view of a gauge used in another embodiment of a system configured to detect seismic activity. [Figure 7B] FIG. 2 is a top perspective view of the internal components of the gauge. [Figure 8] FIG. 1 is a rear perspective view of a deformation gauge as used in the first embodiment of the system. [Figure 9] FIG. 1 is a perspective view of a deformation gauge installed near the structural portion of a wall. DETAILED DESCRIPTION OF THE INVENTION

[0033] (Description of the embodiment) 1 shows a deformation gauge generally at 10. As mentioned above, deformation gauge 10 has two basic components: target 11 and sensor 16. Target 11 is a housing or casing 12 that surrounds a target magnet. Sensor housing 17 houses the remainder of the components of gauge 10.

[0034] FIG. 2A shows the sensor 16 with the top half of the housing 17 removed. FIG. 2A also shows the alignment tangs 22 that connect both the sensor bracket and the target bracket, described below. The sensor housing 17 houses a first circuit board 24 featuring components such as a microprocessor 33, a wireless module, a charging controller, and other components, including an antenna 28 and internal storage 29. The antenna 28 allows the deformation gauge 10 to transmit data to other devices, while the internal storage 29 allows the gauge 10 to store the data. This is particularly useful in the event of a power outage that prevents data collected by the gauge 10 from being transmitted to other devices for safekeeping; the internal storage 29 allows the same data to be stored locally until it can be safely retrieved. Additionally, there is a second circuit board 25 that includes or features a magnetic sensor array 35, which in the preferred embodiment and best-case scenario is three 3D Hall-effect sensors 26 (see FIG. 3).

[0035] Figure 2B shows the target housing 12 with the magnet 14 removed. The target housing 12 is made from a material that does not interfere with, alter, or interact with the magnetic field generated by the internal magnet 14. Figure 2C shows a cross-sectional view of the same target 11, showing the magnet 14 installed.

[0036] 3 shows the second circuit board 25 of this embodiment in more detail. In a preferred embodiment, and in the best mode of the system contemplated by the inventors, the magnetic sensors, i.e., Hall effect sensors 26, are arranged in a triangular configuration on the second circuit board 25. That is, the sensors 26 are located at the vertices of a triangle projected onto the second circuit board 25. In some implementations, the projected triangle is an equilateral triangle.

[0037] 4A-4D show the optimal placement of target magnet 14 relative to circuit board 25 containing magnetic field sensor 26. These figures show cylindrical target magnet 14 with its longitudinal axis perpendicular or substantially perpendicular to the plane formed by the flat surfaces of printed circuit board 25. This orientation maximizes the Hall effect experienced by magnetic sensor 26.

[0038] Figures 5A and 5B show the tilt gauge 27 with its cover removed to expose its internal mechanisms. The tilt gauge 27 includes at least one accelerometer 34 operably connected to a microprocessor 33. The inventors anticipate using the same sensor bracket 18 to mount the tilt gauge 27. The tilt gauge 27 includes one or more three-dimensional MEMS accelerometers 34. The MEMS accelerometers 34 can measure acceleration due to gravity in three dimensions, allowing the instrument to indicate the tilt gauge's position. The tilt gauge 27 can be placed on the same structure as the deformation gauge 10 to detect changes in the structure's attitude or orientation relative to the ground. The tilt gauge 27 can be used together (or separately) with the deformation gauge to determine the movement of the entire structure rather than movement around a defect in the structure. As shown in Figures 4C and 4D, the same housing may house (1) the magnetic field sensor array 35 and (2) the circuit boards 24, 25 containing the accelerometers integral to the tilt gauge 27.

[0039] As described above, tilt gauge 27 uses accelerometer 34 to detect changes in the tilt gauge's orientation relative to Earth's gravity. A preferred embodiment of tilt gauge 27 includes at least one high-precision accelerometer and may also include at least one low-precision accelerometer 34. The accelerometer 34 may move or vibrate due to external forces, such as a vehicle passing near the sensor. Measurements from the accelerometer(s) are repeatedly sampled hundreds of times over a period of less than one second, as described above, for small time increments to average the measurements and "filter" the data to remove error or "noise."

[0040] 6A and 6B show another embodiment of a monitoring system. One or more temperature sensors 36 can be incorporated into the deformation gauge 10, or the combined deformation gauge 10 and tilt gauge 27, to monitor temperature changes in the magnet, Hall effect sensor, and / or accelerometer(s). As previously mentioned, changes in temperature can affect the strength of the magnetic field generated by the target magnet 12 by a known, calculable amount. Before the system is used, the magnetic field of the target magnet 12 is analyzed and mapped under various temperatures so that measurements from the magnetic field sensors 26 can be used to accurately and precisely calculate the location of the target magnet 12 relative to those sensors 26 when readings are taken in real time. Temperature sensor(s) can be used to monitor the temperature of any of the individual components of the system and / or the housing 17 itself to more accurately determine the position of the target magnet 12 relative to the sensor array 35.

[0041] 7A and 7B show yet another embodiment of a monitoring system that can be used to detect seismic activity. In this style of deformation gauge 10, the target magnet 14 is suspended in three dimensions from a mounting spring 37, or a set of mounting springs 37, or other vibration-damping device. Seismic activity could easily move the entire system in the same direction at once, thereby preventing the system from detecting the overall movement of the structure to which the gauge(s) are attached. However, by suspending the target magnet 14 from one or more mounting springs 37, the magnetic field sensor array 35 can detect the movement of the target magnet 14 while it is suspended, thereby enabling the system to capture changes in movement that move the entire system, such as seismic activity. FIG. 7 also shows an optional microphone 38 that can be incorporated into this style of system. In addition to detecting vibrations due to seismic activity, this microphone detects additional reference data from a predetermined frequency range generated by other components of the system. Data from the accelerometer 34 and magnetic sensor array 35 may be measured and then filtered to remove or filter out lower frequency position changes from higher or shorter frequency vibrations caused by earthquake vibrations.

[0042] FIG. 8 shows the target bracket 13, the sensor bracket 18, and the alignment tang 22. The brackets 13, 18, and the alignment tang 22 are used to position the components of the gauge 10 relative to the crack or other defect to be measured. More specifically, the user first determines the mounting location of each bracket 13, 18. Because the magnet 14 used in the preferred embodiment is strong enough to saturate the Hall Effect sensor 26 if it is placed too close to the magnet 14, the user must determine the placement of the target 11 relative to the sensor 16. This involves measuring the size of the crack, or at least the width of the crack, where the deformation gauge 10 will be placed. The user must space the target 11 from the sensor 16 so that if the structure to which the system is mounted is reconfigured to bring the magnetic sensor 26 closer to the target magnet 12, the sensor 26 will not be saturated by the magnetic field, nor will the sensor 26 be so far away from the target magnet 12 that it will no longer be an effective detector. In the preferred embodiment and inventors' best mode, a cylindrical neodymium magnet 14 is disposed in the target housing 12 and, in use, is positioned a pre-calculated distance away from the Hall Effect sensor 26. The preferred embodiment and inventors' best mode of the device includes a scale 23 on the alignment tang 22 to allow the user to easily measure the distance between the sensor bracket 18 and the target bracket 13 during installation.

[0043] The alignment tang 22 is disposed in a groove 19 located in the sensor bracket 18. The alignment tang 22 slides in and out of this groove 19. Additionally, there is a tab 20. The tab 20 is disposed so that it overlaps a portion of the groove 19 and is thereby disposed above the alignment tang 22. When the alignment tang is extended away from the sensor bracket to position the target bracket 13, the tab 20 can be tightened using a screw or other conventional fastener so that the tab 20 is tightened against the alignment tang 22, thereby locking it into position.

[0044] After the user determines the desired distance between the target 11 and the sensor 16, the user attaches the target bracket 13 and the sensor bracket 18 to a surface that features (or contains) a crack, gap, space, fracture, or similar defect. The target bracket 13 is theoretically advanced to one side of the crack, while the sensor bracket 18 is positioned on the other side of the crack. First, the user determines the position of the sensor relative to the crack and measures the crack or defect itself to determine where to place the target bracket. The target bracket 13 and the sensor bracket 18 are attached by an elongated structure, an alignment tang 22, which is attached to both the target bracket 13 and the sensor bracket 18. After determining the position of both brackets, the alignment tang 22, which is slidably engaged with the sensor bracket 18, is extended away from the sensor bracket 18 the desired calculated distance. The alignment tang 22 is attached to the target bracket 13 at the end opposite the end attached to the sensor bracket 18. By extending the tangs, the user moves the target bracket 13 away from the sensor bracket 18. The user then locks the alignment tangs 22 in place on the bracket. In a preferred embodiment, the user tightens the adjacently located screws 21 against the alignment tangs 22, thus tightening the screws 21 securely fastens the alignment tangs 22 in place. The bracket is physically attached to the wall with conventional fasteners or adhesive, and then the alignment tangs 22 are retracted back into the sensor bracket 18. The target 11 and sensor 16 are then attached to their respective brackets 13, 18, and the gauge 10 is ready for use.

[0045] FIG. 9 shows one possible application of the system, with the gauges in place on a structure. The structure, a wall 30, is characterized by a crack 31. The deformation gauges 10 are positioned so that the sensor 16 is on one side of the crack and the target 11 is on the other side of the crack. In addition, the same structure also has an attached tilt gauge 27. This configuration allows a user to remotely monitor any changes in the crack 31 or the tilt of the wall 30. Each gauge 10, 27 is operatively connected to or includes a transmitter capable of transmitting data collected by the gauge to an external storage device. Each gauge is further equipped with electronic storage that allows measurements to be stored on or within the gauge itself. This allows a user to store data collected over time and / or retrieve data after the gauge loses power or otherwise ceases to function.

[0046] In a broad embodiment, the present invention is a system for remotely monitoring the condition of a structure. Advantages of the present invention include, without limitation, the ability to remotely monitor changes in cracks or gaps in a structure over time or in response to specific events without having line of sight to the gauge or without a technician being available to physically examine the gauge. Furthermore, the method allows a user to monitor changes in cracks or gaps or movement of the structure in three dimensions, rather than just one or two. Furthermore, the method of the present invention further incorporates an inclinometer, allowing a user to measure not only changes in the gaps in the structure, but also the orientation of the structure relative to the ground. Engineers or technicians working on a building, wall, or bridge can remotely monitor the effect of their work on gaps or cracks in the structure and / or tilt or movement of the structure in three dimensions.

[0047] Reference to features, advantages, or similar language throughout this specification does not imply that all of the features and advantages that can be realized by the present invention are to be present in any single embodiment of the present invention. Rather, this feature and advantage language is understood to mean that a particular feature, advantage, or characteristic described in connection with an embodiment is included in at least one embodiment of the present invention. Thus, discussions of features, advantages, and similar language throughout this specification may, but do not necessarily, refer to the same embodiment.

[0048] Furthermore, the above-described features, advantages, and characteristics of the present invention may be combined in any suitable manner in one or more embodiments. Those skilled in the art will recognize that the present invention may be practiced without one or more of the specific features or advantages of a particular embodiment. In other cases, additional features and advantages may be recognized in certain embodiments that may not be present in all embodiments of the present invention.

[0049] It will be understood that the above-described embodiments are merely illustrative of the application of the principles of the present invention. The present invention may be embodied in other specific forms without departing from its spirit or essential characteristics. The described embodiments, including the best mode, are to be considered in all respects only as illustrative and not restrictive. The scope of the present invention is therefore indicated by the appended claims, if any, taken together with the above description.

[0050] While the foregoing description of the invention will enable one of ordinary skill in the art to make and use what is currently contemplated as its best mode, one of ordinary skill in the art will understand and recognize that there are variations, combinations, and equivalents of the specific embodiments, methods, and examples herein. Accordingly, the present invention should not be limited by the above-described embodiments, methods, and examples, but by all embodiments and methods that fall within the scope and spirit of the present invention.

[0051] 10, which illustrates a hardware block diagram of a computing device 600 that may perform functions associated with the operations discussed herein in connection with the techniques illustrated in Figures 1-9. In various embodiments, a computing device or apparatus, such as computing device 600 or any combination of computing devices 600, may be configured as any one or more entities, such as microprocessor 33, as discussed in connection with the techniques illustrated in Figures 1-9, to perform the operations of the various techniques discussed herein.

[0052] In at least one embodiment, computing device 600 may be any apparatus that may include one or more processor(s) 602, one or more memory element(s) 604, storage 606, a bus 608, one or more network processing unit(s) 610 interconnected with one or more network input / output (I / O) interface(s) 612, one or more I / O interface(s) 614, and control logic 620. In various embodiments, instructions associated with the logic for computing device 600 may overlap in any manner and are not limited to the specific assignment of instructions and / or operations described herein.

[0053] In at least one embodiment, processor(s) 602 are at least one hardware processor configured to perform various tasks, operations, and / or functions for computing device 600 as described herein in accordance with software and / or instructions configured for computing device 600. Processor(s) 602 (e.g., a hardware processor) can execute any type of instruction related to data to achieve the operations detailed herein. In one example, processor(s) 602 can transform elements or items (e.g., data, information) from one state or thing to another state or thing. Any of the potential processing elements, microprocessors, digital signal processors, controllers, systems, managers, logic, and / or machines described herein can be construed as being encompassed by the broad term “processor.”

[0054] In at least one embodiment, memory element(s) 604 and / or storage 606 are configured to store data, information, software, and / or instructions related to computing device 600 and / or logic configured for memory element(s) 604 and / or storage 606. For example, any logic described herein (e.g., control logic 620) may, in various embodiments, be stored in computing device 600 using any combination of memory element(s) 604 and / or storage 606. It should be noted that in some embodiments, storage 606 may be augmented with memory element(s) 604 (or vice versa), or may overlap / exist in any other suitable manner.

[0055] In at least one embodiment, bus 608 may be configured as an interface that allows one or more elements of computing device 600 and / or sensors to communicate to exchange information and / or data. Bus 608 may be implemented in any architecture designed to pass control, data, and / or information between processors, memory elements / storage, peripheral devices, and / or any other hardware and / or software components that may be configured for computing device 600.

[0056] In various embodiments, network processor unit(s) 610 may enable communications between computing device 600 and other systems, entities, etc. via network I / O interface(s) 612 (wired and / or wireless) to facilitate operations discussed for various embodiments described herein. In various embodiments, network processor unit(s) 610 may be configured as a combination of hardware and / or software, such as one or more Ethernet driver(s) and / or controller(s), wireless receiver / transmitter / transceiver, baseband processor(s) / modem(s), and / or other similar network interface driver(s) and / or controller(s) now known or later developed, to enable communications between computing device 600 and other systems, entities, etc. to facilitate operations for various embodiments described herein. In various embodiments, the network I / O interface(s) 612 may be configured as one or more Ethernet port(s), any other I / O port(s), and / or antenna(s) / antenna array(s) now known or later developed. Accordingly, the network processor unit(s) 610 and / or the network I / O interface(s) 612 may include suitable interfaces for receiving, transmitting, and / or otherwise wirelessly communicating data and / or information to other processors for monitoring the data.

[0057] In various embodiments, the control logic 620 may include instructions that, when executed, cause the processor(s) 602 to perform operations, which may include, but are not limited to, operations that provide for the overall control operation of a computing device, operations that interact with other entities, systems, etc. described herein, operations that maintain and / or interact with stored data, information, parameters, etc. (e.g., memory element(s), storage, data structures, databases, tables, etc.), combinations thereof, and / or the like to facilitate various operations for the embodiments described herein.

[0058] The programs (e.g., control logic 620) described herein may be identified based on the application(s) in which they are implemented in particular embodiments. However, it should be understood that the names of any particular programs herein are used merely for convenience and that embodiments herein should not be limited solely to the use(s) described in any particular application(s) identified and / or implied by such names.

[0059] In various embodiments, any entity or apparatus as described herein may store data / information in any suitable volatile and / or non-volatile memory items (e.g., magnetic hard disk drives, solid-state hard drives, semiconductor storage devices, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM), application-specific integrated circuits (ASICs), etc.), software, logic (fixed logic, hardware logic, programmable logic, analog logic, digital logic), hardware, and / or any other suitable components, devices, elements, and / or objects that may be appropriate. Any memory items discussed herein should be construed as being encompassed by the broad term “memory element.” Data / information tracked and / or transmitted to one or more entities as discussed herein may be provided in any database, table, register, list, cache, storage, and / or storage structure, all of which may be referenced over any suitable time frame. Any such storage options may also be included within the broad term “memory element” as used herein.

[0060] It will be noted that in certain exemplary embodiments, operations as described herein may be implemented by logic encoded in one or more tangible media, which may include non-transitory tangible media and / or non-transitory computer-readable storage media (e.g., embedded logic provided in an ASIC, digital signal processing (DSP) instructions, software (potentially including object code and source code), etc.), which may store instructions and / or digital information and be used for execution by one or more processor(s) and / or other similar machines, etc. Generally, memory element(s) 604 and / or storage 606 may store data, software, code, instructions (e.g., processor instructions), logic, parameters, combinations thereof, and / or the like used for operations described herein. This includes memory element(s) 604 and / or storage 606, which may store data, software, code, instructions (e.g., processor instructions), logic, parameters, combinations thereof, or the like, that are executed to perform operations in accordance with the teachings of the present disclosure.

[0061] As used herein, unless expressly stated otherwise, use of phrases such as "at least one of," "one or more of," "and / or," and variations thereof are open-ended, conjunctive and disjunctive expressions operating on any and all possible combinations of the associated listed items. For example, each of the phrases "at least one of X, Y, and Z," "at least one of X, Y, or Z," "one or more of X, Y, and Z," "one or more of X, Y, or Z," and "X, Y, and / or Z" can mean any of the following: 1) X but not Y and not Z, 2) Y but not X and not Z, 3) Z but not X and not Y, 4) X and Y but not Z, 5) X and Z but not Y, 6) Y and Z but not X, or 7) X, Y, and Z.

[0062] Each exemplary embodiment described herein is included to provide one or more distinct features. However, all disclosed exemplary embodiments are designed to work together as part of a single, larger system or method. The present disclosure expressly contemplates composite embodiments that incorporate multiple previously described features of different exemplary embodiments into a single system or method.

[0063] Furthermore, unless expressly stated otherwise, terms such as "first," "second," and "third" are intended to distinguish the particular nouns they modify (e.g., element, condition, node, module, action, operation, etc.). Unless expressly stated otherwise, the use of these terms is not intended to imply any kind of order, ranking, importance, chronological order, or hierarchy of the modified nouns. For example, "first X" and "second X" are intended to refer to two "X" elements, not necessarily limited by any order, ranking, importance, chronological order, or hierarchy of the two elements. Furthermore, as referred to herein, "at least one of" and "one or more of" can be expressed using the term "(s)" (e.g., one or more element(s)). [Industrial Applicability]

[0064] Reference to features, advantages, or similar language throughout this specification does not imply that all of the features and advantages that can be realized by the present invention are to be present in any single embodiment of the present invention. Rather, this feature and advantage language is understood to mean that a particular feature, advantage, or characteristic described in connection with an embodiment is included in at least one embodiment of the present invention. Thus, discussions of features, advantages, and similar language throughout this specification may, but do not necessarily, refer to the same embodiment.

[0065] Furthermore, the above-described features, advantages, and characteristics of the present invention may be combined in any suitable manner in one or more embodiments. Those skilled in the art will recognize that the present invention may be practiced without one or more of the specific features or advantages of a particular embodiment. In other cases, additional features and advantages may be recognized in certain embodiments that may not be present in all embodiments of the present invention.

[0066] It will be understood that the above-described embodiments are merely illustrative of the application of the principles of the present invention. The present invention may be embodied in other specific forms without departing from its spirit or essential characteristics. The described embodiments, including the best mode, are to be considered in all respects only as illustrative and not restrictive. The scope of the present invention is therefore indicated by the appended claims, if any, taken together with the above description.

[0067] While the foregoing description of the invention will enable one of ordinary skill in the art to make and use what is currently contemplated as its best mode, one of ordinary skill in the art will understand and recognize that there are variations, combinations, and equivalents of the specific embodiments, methods, and examples herein. Accordingly, the present invention should not be limited by the above-described embodiments, methods, and examples, but by all embodiments and methods that fall within the scope and spirit of the present invention.

[0068] Clause 1. A system for detecting changes in a structure, comprising: a deformation gauge, the deformation gauge comprising a target magnet for placement at a predetermined location; and an array of magnetic sensors operably connected to a microprocessor, the microprocessor configured to determine a position of the target magnet based on one or more signals received from the array of magnetic sensors.

[0069] Clause 2. The system of clause 1, wherein the array of magnetic sensors is positioned at the vertices of the projected triangle and is mounted on a single circuit board.

[0070] Clause 3. The system of clause 2, wherein the target magnet is positioned so that the magnetic field of the target magnet is substantially perpendicular to the flow of current in the conductors of the array of magnetic sensors.

[0071] Clause 4. The system of clause 3, further comprising a tilt gauge for determining angular displacement of the structure in three dimensions, the tilt gauge comprising a three-axis accelerometer operably connected to the microprocessor.

[0072] Clause 5. The system of clause 1, further comprising a tilt gauge comprising a triaxial accelerometer operably connected to a microprocessor for determining the angular orientation of the structure.

[0073] Clause 6. The system of clause 5, further comprising a temperature sensor operably connected to measure a temperature of the system.

[0074] Clause 7. The system of clause 6, wherein the microprocessor is further configured to determine the position of the target magnet further based on a temperature of the system.

[0075] Clause 8. The system of clause 2, wherein the array of magnetic sensors is a Hall effect sensor and the projected triangle is an equilateral triangle.

[0076] Clause 9. The system of clause 1, further comprising a low frequency microphone operably connected to the microprocessor for measuring vibrations.

[0077] Clause 10. The system of clause 9, further comprising a mounting spring operatively coupled to the target magnet, the mounting spring configured to suspend the target magnet from the structure.

[0078] Clause 11. The system of clause 1, further comprising a mounting plate configured to position the target magnet at a predetermined location, wherein the predetermined location is determined relative to the array of magnetic sensors.

[0079] Clause 12. A system for detecting changes in a structure, the system comprising: a sensor array including three three-dimensional magnetic sensors arranged in a triangular configuration in a single plane, wherein the sensor array is operably connected to a microprocessor; a target magnet having a magnetic field arranged substantially perpendicular to a plane in which the magnetic sensors are arranged, wherein the microprocessor is configured to detect changes in distance of each sensor relative to the target magnet to determine changes in position of the target magnet in three dimensions; and a tilt gauge comprising a plurality of tri-axial accelerometers operably connected to a microprocessor further equipped with software that interprets data from the plurality of tri-axial accelerometers to detect changes in three dimensional position of the plurality of tri-axial accelerometers relative to the Earth's gravity.

[0080] Clause 13. The system of clause 12, further comprising a temperature sensor operably connected to measure the temperature of the system, the temperature sensor operably connected to a microprocessor, the microprocessor configured to calculate changes in the magnetic field strength of the target magnet caused by temperature fluctuations and compensate for measurements obtained by the sensor array and the plurality of three-axis accelerometers caused by temperature fluctuations.

[0081] Clause 14. The system of clause 12, further comprising a mounting spring operatively coupled to the target magnet, the mounting spring configured to suspend the target magnet from the structure.

[0082] Clause 15. The system of clause 14, further comprising a low-frequency microphone operably connected to the microprocessor, the low-frequency microphone configured to measure low-frequency vibrations of the structure, components of the sensor array, and / or the plurality of triaxial accelerometers.

[0083] Clause 16. The system of clause 15, further comprising a high frequency microphone operably connected to the microprocessor, the high frequency microphone configured to measure high frequency vibrations of the structure, the sensor components, and / or the plurality of triaxial accelerometers.

[0084] Clause 17. A method for detecting changes in a structure, the method comprising the steps of: disposing an array of magnetic sensors on the structure; disposing a target magnet on the structure at a predetermined position relative to the array of magnetic sensors; adjusting the array of magnetic sensors based on the position of the target magnet; monitoring, by a microprocessor, one or more signals from the array of magnetic sensors indicative of a magnetic field generated by the target magnet; and determining, by the microprocessor, a change in position of the target magnet based on the monitoring step.

[0085] Clause 18. The method of clause 17, further comprising detecting an ambient temperature by a temperature sensor, wherein determining a change in position of the target magnet is further performed based on the detected ambient temperature.

[0086] Clause 19. The method of clause 17, wherein the step of placing the target magnet on the structure includes the steps of aligning the target magnet with an alignment tang relative to an array of magnetic sensors, attaching the target magnet to the structure, and removing the alignment tang from the target magnet.

[0087] Clause 20. The method of clause 17, wherein the array of magnetic sensors includes three magnetic sensors positioned substantially equidistant from each other.

Claims

1. 1. A system for detecting changes in a structure, comprising: Equipped with a deformation gauge, The deformation gauge is a target magnet for placement at a predetermined location; an array of magnetic sensors operatively connected to a microprocessor, the microprocessor configured to determine a position of the target magnet based on one or more signals received from the array of magnetic sensors; Equipped with system.

2. The system of claim 1 , wherein the array of magnetic sensors is disposed at the vertices of a projected triangle and is mounted on a single circuit board.

3. The system of claim 2 , wherein the target magnet is positioned so that the magnetic field of the target magnet is substantially perpendicular to the flow of current in the conductors of the array of magnetic sensors.

4. 4. The system of claim 3, further comprising a tilt gauge for determining angular displacement of the structure in three dimensions, the tilt gauge comprising a three-axis accelerometer operably connected to the microprocessor.

5. The system of claim 1 further comprising a tilt gauge comprising a three-axis accelerometer operatively connected to the microprocessor for determining the angular orientation of the structure.

6. The system of claim 5 , further comprising a temperature sensor operably connected to measure a temperature of the system.

7. The system of claim 6 , wherein the microprocessor is further configured to determine a position of the target magnet further based on the temperature of the system.

8. The system of claim 2 , wherein the array of magnetic sensors is a Hall effect sensor and the projected triangle is an equilateral triangle.

9. The system of claim 1 further comprising a low frequency microphone operatively connected to the microprocessor for measuring vibrations.

10. The system of claim 9 , further comprising a mounting spring operatively coupled to the target magnet, the mounting spring configured to suspend the target magnet from the structure.

11. The system of claim 1 , further comprising a mounting plate configured to position the target magnet at a predetermined location, wherein the predetermined location is determined relative to the array of magnetic sensors.

12. 1. A system for detecting changes in a structure, comprising: A sensor array including three three-dimensional magnetic sensors arranged in a triangle in a single plane, the sensor array is operably connected to a microprocessor; a sensor array, and a target magnet having a magnetic field disposed substantially perpendicular to the plane in which the magnetic sensor is disposed; the microprocessor is configured to detect changes in distance of each sensor relative to the target magnet to determine changes in position of the target magnet in three dimensions; a deformation gauge having a a tilt gauge comprising a plurality of tri-axial accelerometers operably connected to the microprocessor configured to interpret data from the plurality of tri-axial accelerometers to detect changes in three-dimensional position of the plurality of tri-axial accelerometers relative to the Earth's gravity; A system comprising:

13. 13. The system of claim 12, further comprising a temperature sensor operably connected to measure a temperature of the system, the temperature sensor operably connected to the microprocessor, the microprocessor configured to calculate changes in magnetic field strength of the target magnet caused by temperature fluctuations and compensate for measurements obtained by the sensor array and the plurality of three-axis accelerometers caused by temperature fluctuations.

14. The system of claim 12 , further comprising a mounting spring operatively coupled to the target magnet, the mounting spring configured to suspend the target magnet from the structure.

15. 15. The system of claim 14, further comprising a low-frequency microphone operatively connected to the microprocessor, the low-frequency microphone configured to measure low-frequency vibrations of the structure, components of the sensor array, and / or the plurality of tri-axial accelerometers.

16. 16. The system of claim 15, further comprising a high frequency microphone operatively connected to the microprocessor, the high frequency microphone configured to measure high frequency vibrations of the structure, components of the sensor, and / or the plurality of tri-axial accelerometers.

17. 1. A method for detecting a change in a structure, comprising: disposing an array of magnetic sensors on the structure; placing a target magnet on the structure at a predetermined position relative to the array of magnetic sensors; adjusting the array of magnetic sensors based on the position of the target magnet; monitoring, by a microprocessor, one or more signals from the array of magnetic sensors indicative of the magnetic field produced by the target magnet; determining, by a microprocessor, a change in position of the target magnet based on said monitoring step; A method comprising:

18. 18. The method of claim 17, further comprising the step of detecting an ambient temperature with a temperature sensor, wherein the step of determining a change in position of the target magnet is further based on the detected ambient temperature.

19. the step of disposing the target magnet on the structure comprises: aligning the target magnet with respect to the array of magnetic sensors by an alignment tang; attaching the target magnet to the structure; removing the alignment tang from the target magnet; 18. The method of claim 17, comprising:

20. The method of claim 17 , wherein the array of magnetic sensors comprises three magnetic sensors positioned substantially equidistant from each other.

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