High-temperature resistant insulating film

Abstract

The present application discloses a method for manufacturing a high-temperature resistant insulating film, which includes applying an uncured material to the upper and lower surfaces of a mica layer and curing the uncured material. The high-temperature resistant insulating film manufactured by the method disclosed herein not only has excellent high-temperature resistance, superior mechanical properties, and outstanding insulating performance, but also features a simple manufacturing process and is significantly cheaper than conventional plastic films.

Description

[Technical Field]

[0001] [Related Applications] This international application claims priority to Chinese Patent Application No. 202211241696.8 filed on October 11, 2022, Chinese Patent Application No. 202222677854.6 filed on October 11, 2022, and Chinese Patent Application No. 202311080805.7 filed on August 25, 2023. Chinese Patent Application No. 202211241696.8, Chinese Patent Application No. 202222677854.6, and Chinese Patent Application No. 202311080805.7 are hereby incorporated by reference in their entireties.

[0002] This application relates to the field of films, and in particular to high temperature resistant insulating films. [Background technology]

[0003] Insulating films are used to separate various electronic devices or components to prevent failures caused by short circuits, dielectric breakdown, etc. between or within the electronic devices or components. Some insulating films also need to be resistant to high temperatures to reduce the effects of localized high temperatures on the electronic devices or components and ensure the normal operation of the various electronic devices or components. Summary of the Invention [Problem to be solved by the invention]

[0004] The present invention provides a high-temperature resistant insulating film for use in electronic devices or components, which has excellent high-temperature resistance while meeting the insulation requirements of the electronic devices or components, and which also has excellent mechanical properties to meet the requirements of the application environment. [Means for solving the problem]

[0005] In a first aspect, the present application provides a method for manufacturing a high-temperature resistant insulation film, the method comprising the steps of applying (spraying) an uncured material to an upper surface and a lower surface of a mica layer of high-temperature resistant insulation; and curing the uncured material to obtain an upper additional layer of high-temperature resistant insulation attached (applied) to the upper surface of the mica layer of high-temperature resistant insulation and a lower additional layer of high-temperature resistant insulation attached to the lower surface of the mica layer of high-temperature resistant insulation, wherein an outer surface of the upper additional layer of high-temperature resistant insulation forms a first outer surface of the high-temperature resistant insulation film of high-temperature resistant insulation, and an outer surface of the lower additional layer of high-temperature resistant insulation forms a second outer surface of the high-temperature resistant insulation film of high-temperature resistant insulation.

[0006] According to the first aspect described above, the step of applying the uncured material to the top and bottom surfaces of the mica layer of the high temperature resistant insulation is performed by a process such as roll coating, blade coating, or spray coating.

[0007] According to the first aspect described above, the step of curing the uncured material is initiated by radiation.

[0008] According to the first aspect, the radiation has a wavelength of 300 nm to 370 nm and a radiation intensity of 60 w / cm 2 ~120w / cm 2 This involves exposure to ultraviolet light.

[0009] According to the first aspect described above, the coating thickness of the uncured material is 0.02 mm to 0.05 mm.

[0010] According to the first aspect above, the uncured material is an epoxy resin coating, and the step of curing the uncured material is by heating the uncured material to 60°C to 120°C.

[0011] According to the first aspect described above, the coating thickness of the uncured epoxy resin coating is 0.02 mm to 0.1 mm.

[0012] According to the first aspect above, the uncured material is a PU coating and the step of curing the uncured material is by drying.

[0013] According to the first aspect described above, the mica layer of the high temperature resistant insulation has a thickness of 0.1 mm to 3 mm, and the hardened upper additional layer of the high temperature resistant insulation and the lower additional layer of the high temperature resistant insulation have a thickness of 100 μm or less.

[0014] In a second aspect, the present application provides a method for manufacturing a high-temperature-resistant insulation film, the method comprising the steps of: applying an adhesive to an upper surface and a lower surface of a mica layer of the high-temperature-resistant insulation to obtain an upper adhesive (bonding) layer of the high-temperature-resistant insulation and a lower adhesive layer of the high-temperature-resistant insulation, respectively; and adhering an upper additional layer of the high-temperature-resistant insulation to the upper surface of the mica layer of the high-temperature-resistant insulation via the upper adhesive layer of the high-temperature-resistant insulation and adhering the lower additional layer of the high-temperature-resistant insulation to the lower surface of the mica layer of the high-temperature-resistant insulation via the lower adhesive layer of the high-temperature-resistant insulation, whereby an outer surface of the upper additional layer of the high-temperature-resistant insulation forms a first outer surface of the high-temperature-resistant insulation film of the high-temperature-resistant insulation, and an outer surface of the lower additional layer of the high-temperature-resistant insulation forms a second outer surface of the high-temperature-resistant insulation film of the high-temperature-resistant insulation.

[0015] According to the second aspect described above, the steps of adhering the upper additional layer of high-temperature-resistant insulation to the upper surface of the mica layer of high-temperature-resistant insulation via the upper adhesive layer of high-temperature-resistant insulation and adhering the lower additional layer of high-temperature-resistant insulation to the lower surface of the mica layer of high-temperature-resistant insulation via the lower adhesive layer of high-temperature-resistant insulation include applying (applying) a plastic film to each of the upper adhesive layer of high-temperature-resistant insulation and the lower adhesive layer of high-temperature-resistant insulation, and adhering the plastic film to the upper surface and lower surface of the mica layer of high-temperature-resistant insulation, respectively, by a lamination process, thereby obtaining the upper additional layer of high-temperature-resistant insulation and the lower additional layer of high-temperature-resistant insulation.

[0016] According to the second embodiment described above, the temperature and pressure of the lamination process are 95°C to 125°C and 3 MPa to 25 MPa, respectively.

[0017] According to the second aspect above, the application speed of the upper additional layer of high temperature resistant insulation and the lower additional layer of high temperature resistant insulation is between 2 m / min and 20 m / min.

[0018] According to the second aspect, the coating thickness of the high temperature resistant insulating upper adhesive layer and the high temperature resistant insulating lower adhesive layer is 0.01 mm to 0.05 mm.

[0019] According to the second aspect described above, the lamination process ensures that the combined thickness of the upper additional layer of high temperature resistant insulation and the upper adhesive layer of high temperature resistant insulation, as well as the combined thickness of the lower additional layer of high temperature resistant insulation and the lower adhesive layer of high temperature resistant insulation, are both within 100 μm. [Brief explanation of the drawings]

[0020] [Figure 1A] 1 is a schematic diagram of a three-dimensional structure of an example of a high-temperature resistant insulating film according to the present application.

[0021] [Figure 1B] 1B is a cross-sectional view of the high-temperature resistant insulating film shown in FIG. 1A taken along line AA.

[0022] [Figure 1C] 1 is a schematic diagram of a three-dimensional structure of another example of a high-temperature resistant insulating film according to the present application.

[0023] [Figure 1D] 1D is a cross-sectional view of the high-temperature resistant insulating film taken along line BB in FIG. 1C.

[0024] [Figure 2A] 1B is a flowchart illustrating a manufacturing process of the high-temperature resistant insulating film shown in FIG. 1A.

[0025] [Figure 2B] 1B is a flowchart illustrating a manufacturing process of the high-temperature resistant insulating film shown in FIG. 1A.

[0026] [Figure 2C]1 is a schematic diagram of spray coating equipment.

[0027] [Figure 2D] FIG. 1 is a schematic diagram of a stacking device.

[0028] [Figure 3A] 1B is a schematic diagram of the three-dimensional structure of a battery module including the high-temperature resistant insulating film shown in FIG. 1A.

[0029] [Figure 3B] FIG. 3B is an exploded view of the battery module shown in FIG. 3A. DETAILED DESCRIPTION OF THE INVENTION

[0030] Various specific embodiments of the present application are described below with reference to the accompanying drawings, which form a part hereof. While orientational terms such as "front," "rear," "upper," "lower," "left," "right," "top," "bottom," "inner," and "outer" are used herein to describe various exemplary structural components and elements of the present application, it should be understood that these terms are used herein merely for convenience of illustration and are determined based on the exemplary orientations shown in the accompanying drawings. Because the examples disclosed herein can be arranged in different orientations, these orientational terms are for illustrative purposes only and should not be considered limiting.

[0031] In this application, unless otherwise specified, all equipment and materials may be purchased from the market or are commonly used in the industry. The methods in the following examples are conventional methods in this field unless otherwise specified.

[0032] The mica layer in this application is formed by adhering mica paper or mica powder with an adhesive and then subjecting it to a heat press, with the mica accounting for approximately 90% by weight and the adhesive accounting for approximately 10% by weight. In one example, the adhesive is an organic silicone adhesive. The mica paper or mica powder can be phlogopite, muscovite, or other synthetic mica. In a specific example, the mica layer is a commercially available mica sheet or mica board.

[0033] 1A and 1B show a specific structure of a high-temperature resistant insulating film 100 according to one example of the present application. As shown in Fig. 1A and 1B, the high-temperature resistant insulating film 100 includes a mica layer 101, an upper additional layer 102, and a lower additional layer 103. For example, the thickness of the mica layer 101 is 0.1 mm to 3 mm, and the thicknesses of the upper additional layer 102 and the lower additional layer 103 are each 100 µm or less.

[0034] 1A and 1B , the inner surface of the upper additional layer 102 is attached to the upper surface of the mica layer 101, and the outer surface of the upper additional layer 102 forms a first outer surface (i.e., the upper outer surface) of the high-temperature-resistant insulating film 100. In the example shown in Figures 1A and 1B , the inner surface of the upper additional layer 102 is attached directly to the upper surface of the mica layer 101. The inner surface of the lower additional layer 103 is attached to the lower surface of the mica layer 101, and the outer surface of the lower additional layer 103 forms a second outer surface (i.e., the lower outer surface) of the high-temperature-resistant insulating film 100. In this example, the inner surface of the lower additional layer 103 is attached directly to the lower surface of the mica layer 101.

[0035] The upper additional layer 102 and the lower additional layer 103 are made of a different material from the mica layer 101. The upper additional layer 102 and the lower additional layer 103 may be made of the same material or different materials. In this example, the upper additional layer 102 and the lower additional layer 103 are made of the same material. The materials of the upper additional layer 102 and the lower additional layer 103 have an uncured state and a cured state. When the materials of the upper additional layer 102 and the lower additional layer 103 are in an uncured state, they are applied to and adhered to the upper and lower surfaces of the mica layer 101, respectively. When the materials of the upper additional layer 102 and the lower additional layer 103 are in a cured state, they form an upper reinforcing layer and a lower reinforcing layer, respectively. The upper reinforcing layer and the lower reinforcing layer refer to additional layers that improve the mechanical performance of the mica layer.

[0036] The cured state of the upper and lower additional layers 102, 103 is a chemically crosslinked cured coating. In the manufacturing process, an uncured material is first applied to the upper and lower surfaces of the mica layer 101 by a process such as roll coating, blade coating, or spray coating, and then the uncured material is converted to a cured state to obtain the cured upper and lower additional layers 102, 103. In some examples, the conversion of the upper and lower additional layers 102, 103 from an uncured state to a cured state is initiated by radiation. In a specific example, the uncured material that can be cured by radiation is a commercially available UV light-curable adhesive coating with a coating thickness of 0.02 mm to 0.05 mm, and the coating is cured with a wavelength of 300 nm to 370 nm and a radiation intensity of 60 watts / cm. 2 ~120w / cm 2The upper and lower additional layers 102, 103 can be converted to a cured state by exposure to ultraviolet light of 1000 .mu.m or less. In some other examples, the conversion of the upper and lower additional layers 102, 103 from an uncured state to a cured state is achieved by heating or drying. In a particular example, the uncured material that can be cured by heating or drying is an epoxy resin coating having a coating thickness of 0.02 mm to 0.1 mm, and this coating may be converted to a cured state by heating to 60°C to 120°C. In another particular example, the uncured material that can be cured by heating or drying is a PU (polyurethane) coating, and this coating may be converted to a cured state by air drying.

[0037] 1C and 1D show a specific structure of a high-temperature-resistant insulating film 130 according to another embodiment of the present invention. As shown in FIGS. 1C and 1D, the high-temperature-resistant insulating film 130 includes a mica layer 101, an upper additional layer 102, an upper adhesive layer 122, a lower additional layer 103, and a lower adhesive layer 123. For example, the thickness of the mica layer 101 is 0.1 mm to 3 mm, the total thickness of the upper additional layer 102 and the upper adhesive layer 122 is 100 μm or less, and the total thickness of the lower additional layer 103 and the lower adhesive layer 123 is also 100 μm or less. In this embodiment, the upper additional layer 102 and the lower additional layer 103 do not have adhesive properties; in other words, they cannot directly adhere to the upper and lower surfaces of the mica layer 101 by themselves. Meanwhile, the upper adhesive layer 122 and the lower adhesive layer 123 do not provide reinforcement; in other words, they cannot improve the mechanical performance of the mica layer 101.

[0038] 1C and 1D , the inner surface of the upper additional layer 102 is attached to the upper surface of the mica layer 101 via the upper adhesive layer 122, and the outer surface of the upper additional layer 102 forms a first outer surface (i.e., upper outer surface) of the high-temperature-resistant insulating film 130. The inner surface of the lower additional layer 103 is attached to the lower surface of the mica layer 101 via the lower adhesive layer 123, and the outer surface of the lower additional layer 103 forms a second outer surface (i.e., lower outer surface) of the high-temperature-resistant insulating film 130.

[0039] The upper additional layer 102 and the lower additional layer 103 are made of a different material from the mica layer 101. The upper additional layer 102 and the lower additional layer 103 may be made of the same material or different materials. In this example, the upper additional layer 102 and the lower additional layer 103 are made of the same material. In some examples, the upper additional layer 102 and the lower additional layer 103 are plastic films, such as PET (polyethylene terephthalate) films or PP (polypropylene) films. The upper adhesive layer 122 and the lower adhesive layer 123 are adhesives, such as hot melt adhesives or thermosetting adhesives. In this example, the adhesive is a hot melt adhesive. The upper additional layer 102 and the lower additional layer 103 form upper reinforcing layers and lower reinforcing layers, respectively, and improve the mechanical performance of the mica layer 101. The upper adhesive layer 122 and the lower adhesive layer 123 do not function as reinforcing layers.

[0040] Specifically, in the manufacturing process, first, a hot melt adhesive is applied to the upper and lower surfaces of the mica layer 101 by a process such as roll coating, blade coating, or spray coating to obtain the upper adhesive layer 122 and the lower adhesive layer 123, respectively; then, a plastic film is applied to each of the upper adhesive layer 122 and the lower adhesive layer 123; and finally, the plastic film is attached to the upper and lower surfaces of the mica layer 101 by a lamination process to form the upper additional layer 102 and the upper adhesive layer 122, and the lower additional layer 103 and the lower adhesive layer 123. In some examples, the coating thickness of the upper adhesive layer 122 and the lower adhesive layer 123 is 0.01 mm to 0.05 mm.

[0041] Those skilled in the art will understand that the materials for the upper and lower additional layers 102, 103 are not limited to the examples given above.

[0042] Various examples of the high-temperature resistant insulating film described herein have excellent high-temperature resistance and can withstand temperatures of 600°C to 700°C or higher. Furthermore, the high-temperature resistant insulating film exhibits outstanding high-temperature resistant insulating properties and maintains its insulating properties even at temperatures of 600°C to 700°C. The high-temperature resistant insulating film also has excellent mechanical performance, with a tensile strength exceeding 100 MPa. Compared to conventional plastic-based insulating films, the high-temperature resistant insulating film described herein not only provides excellent high-temperature resistance at elevated temperatures, but is also cost-effective.

[0043] The applicant has noticed that commercially available mica sheets or boards tend to fragment and delaminate during transportation or assembly with other components due to the adhesive bonding and pressing required during their manufacturing process. In certain electronic product application environments, the flaked fragments can adversely affect the performance stability of the electronic product and are harmful to the environment.

[0044] In contrast, the surface of the high-temperature resistant insulating film in the present application is no longer the mica layer but the outer surface of each additional layer, which effectively prevents the mica layer from generating debris, and even if debris does occur, it is unlikely to peel off, thereby avoiding any adverse effects on the performance stability of electronic products.

[0045] Furthermore, the present applicant has found that, although the thickness of the upper and lower additional layers is relatively thin compared to the mica layer, the upper and lower additional layers can significantly improve the mechanical performance of the mica layer. For example, the high-temperature-resistant insulating film of the present application has superior flex resistance and break resistance compared to existing mica sheets or boards. The high-temperature-resistant insulating film is less likely to break even when subjected to bending stress. As a specific example, after existing mica boards are bent twice at 60 degrees, they break, generating fragments that peel off. In contrast, the high-temperature-resistant insulating film described herein can be repeatedly bent 7 to 9 times without breaking or generating fragments that peel off.

[0046] 2A to 2D, a method for manufacturing high-temperature-resistant insulating films 100 and 130 will be described in detail below. FIG. 2A shows the manufacturing process for high-temperature-resistant insulating film 100. FIG. 2B shows the manufacturing process for high-temperature-resistant insulating film 130. FIG. 2C is a schematic diagram of spray coating equipment for applying uncured material to the upper and lower surfaces of mica layer 101. FIG. 2D is a schematic diagram of lamination equipment for pressing a plastic film onto adhesive layers 122 and 123 of high-temperature-resistant insulating film 130.

[0047] 2A and 2C, in step 231, an uncured material is applied to the upper and lower surfaces of the mica layer 101 by a spray coating process. Specifically, in the manufacturing process, a pair of nozzles 207 of a spray coating device are fixed above and below the mica layer 101, respectively. The mica layer 101 is transported from left to right between the pair of nozzles 207, and the uncured upper and lower additional layers 102 and 103 are applied to the upper and lower surfaces of the mica layer 101, respectively. After spraying is completed, step 232 begins. In step 232, the uncured upper and lower additional layers 102 and 103 are cured by methods such as radiation, heating, or drying to obtain the high-temperature-resistant insulating film 100.

[0048] As shown in FIGS. 2B and 2D , in step 234, hot melt adhesive is applied to the upper and lower surfaces of the mica layer 101, resulting in a mica layer 101 coated with an upper adhesive layer 122 and a lower adhesive layer 123. Then, in step 235, a lamination process is used to attach plastic films to the upper adhesive layer 122 and the lower adhesive layer 123, respectively. Specifically, during the manufacturing process, the mica layer 101 coated with the upper adhesive layer 122 and the lower adhesive layer 123 is transported from left to right between a pair of rollers 206. At the same time, plastic films are also transported through the pair of rollers 206 and applied from above the upper adhesive layer 122 and below the lower adhesive layer 123, respectively. The application speed of the plastic films is between 2 m / min and 20 m / min. The pair of rollers 206 rotate in opposite directions, and the plastic films are bonded to the corresponding adhesive layers through heating and pressing, thereby adhering the plastic films to the upper and lower surfaces of the mica layer 101, respectively. In this example, the roller 206 above the mica layer 101 rotates counterclockwise, and the roller 206 below the mica layer 101 rotates clockwise to press the plastic film against the upper adhesive layer 122 and the lower adhesive layer 123. The pressure applied by the two rollers 206 to the mica layer 101 and the plastic film passing between the rollers 206 is 3 MPa to 25 MPa, and the temperature when the mica layer 101 and the plastic film pass between the two rollers 206 (i.e., the lamination temperature) is controlled in the range of 95°C to 125°C.

[0049] The high-temperature resistant insulating films described herein can be utilized in various electronic products or devices to aid in heat dissipation, including electrical equipment such as battery modules, heating coils, or electric motors.

[0050] 3A and 3B are schematic diagrams showing the structure of an example of a battery module including the high-temperature-resistant insulating film 100 of the present application. FIG. 3A shows the overall structure of a battery module 310, and FIG. 3B shows the exploded structure of the battery module 310. As shown in FIGS. 3A and 3B , the battery module 310 includes several battery units 312 and a housing 311. The housing 311 includes a substantially square box-shaped body 315 and an upper cover 313. The box 315 has an accommodating cavity 308, and the upper cover 313 is disposed on the box-shaped body 315 and surrounds the accommodating cavity 308. A plurality of battery units 312 are accommodated within the accommodating cavity 308 of the box-shaped body 315. Each battery unit 312 has its own connection terminal 305. After the connection terminals 305 of these battery units 312 are electrically connected according to a predetermined circuit, power and / or charging is provided to the outside via a main connection terminal (not shown) disposed in the housing 311.

[0051] The high-temperature-resistant insulating film 100 is positioned between adjacent battery units 312 and also between each battery unit 312 and the box-shaped body 105. In some examples, the high-temperature-resistant insulating film 100 is fixed between adjacent battery units 312 or between each battery unit 312 and the box-shaped body 105 using fasteners such as bolts. In some examples, the high-temperature-resistant insulating film 100 is bonded between adjacent battery units 312 or between each battery unit 312 and the box-shaped body 105 using an adhesive. In addition to providing insulation between adjacent battery units 312, the high-temperature-resistant insulating film 100 also prevents some battery units 312 from generating excessive heat and reaching high temperatures that could damage the entire battery module 310.

[0052] Furthermore, during transportation of the battery module 310, the high-temperature resistant insulating film 100 provides a degree of support and prevents deformation due to mutual compression between the battery units 312.

[0053] If a high-temperature resistant plastic film is used between the battery units 312, not only will the cost increase but there will also be limitations to its support. Furthermore, even a high-temperature resistant plastic film will have limited heat resistance. If the temperature of the battery units 312 becomes too high, even the plastic film may melt or be damaged. On the other hand, if a commercially available conventional mica sheet is used between the battery units 312, heat resistance will be improved, but fragments of the mica sheet may fall off during transportation and installation. These fragments may fall into the box-shaped body 315 and affect the performance of the battery module 310.

[0054] In contrast, the high-temperature-resistant insulating film described in this application uses a mica sheet as an intermediate layer, with additional layers disposed above and below the mica layer. This improves the mechanical performance of the mica layer while maintaining high-temperature resistance. This also prevents the mica layer from spalling, making transportation and installation of the high-temperature-resistant insulating film easier. Furthermore, this design is particularly suitable for heat dissipation and support within a battery unit.

[0055] Finally, the high-temperature resistant insulating film disclosed herein has many beneficial technical effects, at least some of which are listed below. 1. Excellent high temperature resistance, can withstand temperatures of 600℃-700℃ or even higher, meeting the heat resistance requirements of electronic products and equipment. 2. Excellent mechanical performance with a tensile strength exceeding 100 MPa, allowing repeated flexing without damage, ensuring durability during transportation, packaging, and processing by manufacturers of electronic products and equipment. 3. It has outstanding insulation performance, especially at high temperatures, and meets the insulation requirements of electronic products and equipment. 4. The manufacturing process is simple. 5. Easy to use and cost-effective, costing significantly less than typical plastic films.

[0056] While the present disclosure has been described in connection with the illustrative examples outlined above, various alternatives, modifications, variations, improvements, and / or substantial equivalents, whether known or foreseeable now or in the near future, may be apparent to at least those skilled in the art. Accordingly, the illustrative examples of the present disclosure set forth above are illustrative and not intended to be limiting. Various changes may be made without departing from the spirit or scope of the present disclosure. Accordingly, the present disclosure is intended to include all known or previously developed alternatives, modifications, variations, improvements, and / or substantial equivalents. The technical advantages and technical problems described herein are illustrative and not limiting. It should be noted that the examples described herein may have other technical advantages and may solve other technical problems.

Claims

1. 1. A method for producing a high-temperature resistant insulating film, comprising: applying uncured material to the top and bottom surfaces of the mica layer (101); curing the uncured material to obtain an upper additional layer (102) attached to the upper surface of the mica layer (101) and a lower additional layer (103) attached to the lower surface of the mica layer (101), the outer surface of the upper additional layer (102) forming a first outer surface of the high temperature resistant insulation film (100), and the outer surface of the lower additional layer (103) forming a second outer surface of the high temperature resistant insulation film (100); A method for producing a high temperature resistant insulating film, comprising:

2. 2. The method for manufacturing a high-temperature resistant insulating film of claim 1, wherein applying the uncured material to the upper and lower surfaces of the mica layer (101) is performed by at least one of roll coating, blade coating, or spray coating.

3. 10. The method of manufacturing a high temperature resistant insulating film of claim 1, wherein curing the uncured material is initiated by radiation.

4. The radiation has a wavelength of 300 nm to 370 nm and a radiation intensity of 60 watts / cm ２ ~120 watts / cm ２ 4. A method for producing the high temperature resistant insulating film of claim 3, comprising exposing the film to ultraviolet light of 1000 W at 1000 W.

5. 4. The method for manufacturing a high-temperature resistant insulating film according to claim 3, wherein the coating thickness of the uncured material is 0.02 mm to 0.05 mm.

6. 2. The method for manufacturing a high-temperature resistant insulating film according to claim 1, wherein the uncured material is an epoxy resin coating, and curing the uncured material comprises heating the uncured material to 60°C to 120°C.

7. 7. The method for manufacturing a high-temperature resistant insulating film according to claim 6, wherein the coating thickness of the uncured epoxy resin coating is 0.02 mm to 0.1 mm.

8. 10. The method for manufacturing a high-temperature resistant insulating film of claim 1, wherein the uncured material is a PU coating, and curing the uncured material includes drying.

9. 2. The method for manufacturing a high-temperature resistant insulating film according to claim 1, wherein the thickness of the mica layer (101) is 0.1 mm to 3 mm, and the thickness of the cured upper additional layer (102) and lower additional layer (103) is within 100 μm.

10. 1. A method for producing a high-temperature resistant insulating film, comprising: applying adhesive to the upper and lower surfaces of the mica layer (101) to obtain an upper adhesive layer (122) and a lower adhesive layer (123), respectively; Adhering an upper additional layer (102) to the upper surface of the mica layer (101) via the upper adhesive layer (122) and adhering a lower additional layer (103) to the lower surface of the mica layer (101) via the lower adhesive layer (123), so that the outer surface of the upper additional layer (102) forms a first outer surface of the high-temperature resistant insulation film (100), and the outer surface of the lower additional layer (103) forms a second outer surface of the high-temperature resistant insulation film (100); A method for producing a high temperature resistant insulating film, comprising:

11. Adhering the upper additional layer (102) to the upper surface of the mica layer (101) via the upper adhesive layer (122) and adhering the lower additional layer (103) to the lower surface of the mica layer (101) via the lower adhesive layer (123) includes: applying a plastic film to each of the upper adhesive layer (122) and the lower adhesive layer (123); Adhering said plastic films to the upper and lower surfaces of said mica layer (101) respectively by a lamination process, thereby obtaining said upper additional layer (102) and said lower additional layer (103); 11. A method for producing the high temperature resistant insulating film of claim 10, comprising:

12. 12. The method for manufacturing a high-temperature resistant insulating film according to claim 11, wherein the temperature and pressure of the lamination process are 95°C to 125°C and 3 MPa to 25 MPa, respectively.

13. The method for manufacturing a high-temperature resistant insulating film according to claim 11, wherein the application speed of the upper additional layer (102) and the lower additional layer (103) is between 2 m / min and 20 m / min.

14. 11. The method for manufacturing a high-temperature resistant insulating film according to claim 10, wherein the coating thickness of the upper adhesive layer (122) and the lower adhesive layer (123) is 0.01 mm to 0.05 mm.

15. 15. The method for manufacturing a high-temperature resistant insulating film according to claim 14, wherein the lamination process ensures that the total thickness of the upper additional layer (102) and the upper adhesive layer (122) and the total thickness of the lower additional layer (103) and the lower adhesive layer (123) are both within 100 μm.

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