Semiconductor quartz transmittance analyzer using multi-wavelength laser

Abstract

The present invention relates to a semiconductor quartz transmittance analyzer using a multi-wavelength laser, which comprises an upper laser output upper stage, which comprises an upper base plate, a first upper stage mounting table provided on one side of the upper base plate, a laser fiber provided on the first upper stage mounting table and irradiating a laser beam downward, a second upper stage mounting table provided on the other side of the upper base plate, an aperture provided on the second upper stage mounting table and adjusting the size of the laser beam irradiated from the laser fiber, and an upper convex lens provided on the second upper stage mounting table and adjusting the focus of the laser beam whose size has been adjusted; a quartz plate stage moving unit consisting of a moving block movable in the X and Y directions and a quartz plate fixing frame coupled to the moving block for fixing the quartz plate; and a lower laser receiving unit consisting of a lower base plate provided below the upper base plate, a first lower placement stage provided on one side of the lower base plate, a lower convex lens provided on the first lower placement stage for adjusting the focus of the laser beam transmitted through the quartz plate, a second lower placement stage provided on the other side of the lower base plate, and a laser detector provided on the second lower placement stage for detecting the laser beam transmitted through the lower convex lens.

Description

[Technical Field]

[0001] The present invention relates to a semiconductor quartz transmittance analyzer using a multi-wavelength laser. [Background technology]

[0002] In general, in semiconductor manufacturing processes, quartz plates are used to prevent contamination of silicon wafers during high-temperature thermal processes and to support the silicon wafers. However, when high-temperature thermal processes are repeated multiple times, the quartz plates become contaminated, which can result in changes in the transmittance of high-temperature radiant energy and in the distribution of the surface resistance (Rs) of the silicon wafers.

[0003] Therefore, to prevent process defects caused by excessive contamination of quartz plates (for example, reduced yield due to transmittance below 50%), the quartz plates are cleaned and reused at regular intervals. However, because there is no objective data on whether quartz plates can be reused and it relies on subjective judgment, quartz plates are frequently discarded arbitrarily regardless of their condition, which increases semiconductor manufacturing costs and causes environmental pollution.

[0004] The above information disclosed in the Background of the Invention is intended to provide a deeper understanding of the background of the present invention and may include information that does not constitute prior art. Summary of the Invention [Problem to be solved by the invention]

[0005] The problem to be solved by the present invention is to provide a semiconductor quartz transmittance analyzer using a multi-wavelength laser.

[0006] As an example, the problem to be solved by the present invention is to provide a semiconductor quartz transmittance analyzer using a multi-wavelength laser, which can analyze whether the quartz plate can be reused based on objective data by measuring the transmittance of the quartz plate using a laser to determine whether the quartz plate is contaminated during a high-temperature thermal process and whether it is in a cleaned state. [Means for solving the problem]

[0007] The semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention comprises an upper laser output upper stage, which includes an upper base plate, a first upper stage mounting table provided on one side of the upper base plate, a laser fiber provided on the first upper stage mounting table and irradiating a laser beam downward, a second upper stage mounting table provided on the other side of the upper base plate, an aperture provided on the second upper stage mounting table and adjusting the size of the laser beam irradiated from the laser fiber, and an upper convex lens provided on the second upper stage mounting table and adjusting the focus of the laser beam whose size has been adjusted; a stage base plate provided below the upper base plate; The stage may include a quartz plate stage moving unit consisting of a moving block mounted on the stage base plate so as to be movable in the X and Y directions, and a quartz plate fixing frame coupled to the moving block and fixing the quartz plate; and a lower laser receiving unit consisting of a lower base plate mounted below the upper base plate, a first lower mounting table mounted on one side of the lower base plate, a lower convex lens mounted on the first lower mounting table and adjusting the focus of the laser beam transmitted through the quartz plate, a second lower mounting table mounted on the other side of the lower base plate, and a laser detector mounted on the second lower mounting table and detecting the laser beam transmitted through the lower convex lens.

[0008] In some examples, the laser output upper stage may further include an upper stage opaque window provided on at least three sides of the upper stage base plate of the laser output upper stage, which prevents external light from being transmitted inside; and a stage opaque window provided on at least three sides of the stage base plate of the quartz plate stage moving part, which prevents external light from being transmitted inside.

[0009] In some examples, the upper stage base plate of the laser output upper stage may further include an upper stage through-hole to allow the laser beam to pass through, and the stage base plate of the quartz plate stage moving unit may further include a stage through-hole to allow the laser beam to pass through.

[0010] In some examples, the quartz plate fixing frame may include a first fixing frame coupled to the moving block, a second fixing frame tiltably coupled to the first fixing frame, a third fixing frame coupled to the second fixing frame and on which the quartz plate is seated, and a tilt bolt provided between the first fixing frame and the second fixing frame for adjusting the tilt angle of the second fixing frame relative to the first fixing frame.

[0011] In some examples, the laser fiber of the upper laser output section can irradiate the laser beam at 100 to 500 points in a spiral pattern from the center toward the quartz plate. In some examples, the laser output upper stage may further include a HEPA filter for filtering out external fine dust particles. In some examples, the position of the quartz plate may be located within the Rayleigh range.

[0012] In some examples, the stage base plate of the quartz plate stage moving unit may further include a load cell provided to sense the weight of the quartz plate.

[0013] In some examples, the quartz plate fixing frame may include a circular ring formed in an annular shape, a plurality of connecting bars extending outside the circular ring, and a square ring formed in a square annular shape connected to the plurality of connecting bars.

[0014] In some examples, the stage base plate of the quartz plate stage moving unit may further include a confocal laser scanning microscope provided for measuring the surface roughness of the quartz plate. [Effects of the Invention]

[0015] The present invention provides a semiconductor quartz transmittance analyzer using a multi-wavelength laser.

[0016] As an example, the present invention provides a semiconductor quartz transmittance analyzer using a multi-wavelength laser that can analyze whether a quartz plate can be reused based on objective data by measuring the transmittance of the quartz plate using a laser to determine whether the quartz plate is contaminated during a high-temperature thermal process and whether it is in a clean state. [Brief explanation of the drawings]

[0017] [Figure 1] 1A and 1B are perspective, front, plan, and side views showing an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. [Figure 2] 1A and 1B are perspective, front, plan, and side views showing an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. [Figure 3] 1A and 1B are perspective, front, plan, and side views showing an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. [Figure 4] 1A and 1B are perspective, front, plan, and side views showing an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. [Figure 5] 1A and 1B are perspective, front, plan, and side views showing an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. [Figure 6] 1A and 1B are perspective, front, plan, and side views showing an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. [Figure 7] 1A and 1B are perspective, front, plan, and side views showing an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. [Figure 8] 1A and 1B are perspective and front views showing the upper stage of a laser output of an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. [Figure 9] 1A and 1B are perspective and front views showing the upper stage of a laser output of an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. [Figure 10] 1 is a perspective view showing a lower laser receiving section of an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. FIG. [Figure 11] 1 is a perspective view showing a lower laser receiving section of an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. FIG. [Figure 12] 1A and 1B are perspective views showing an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention in a closed state, an open state, and an exploded state. [Figure 13] 1A and 1B are perspective views showing an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention in a closed state, an open state, and an exploded state. [Figure 14] 1A and 1B are perspective views showing an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention in a closed state, an open state, and an exploded state. [Figure 15] 1A and 1B are a perspective view and an exploded perspective view showing a quartz fixing frame of an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention; [Figure 16] 1A and 1B are a perspective view and an exploded perspective view showing a quartz fixing frame of an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention; [Figure 17] 1A and 1B are a perspective view and an exploded perspective view showing a quartz fixing frame of an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention; [Figure 18] 1 is a diagram showing an exemplary quartz plate and transmission coordinate setting state used in an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. FIG. [Figure 19] 1 is a perspective view showing an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention installed in a darkroom. FIG. [Figure 20] FIG. 10 shows an exemplary HEPA filter that may be further attached to an exemplary multi-wavelength laser-based quartz transmittance analyzer for semiconductors according to the present invention. [Figure 21] 1 is a diagram showing an example for improving the reliability of a quartz transmittance analyzer for semiconductors using an exemplary multi-wavelength laser according to the present invention; [Figure 22] 1 is a diagram showing an example of the installation position of a quartz plate in an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. FIG. [Figure 23] 10 is a diagram showing an exemplary sensing unit, control unit, and display unit that are further attached to an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. FIG. [Figure 24] 10A and 10B are diagrams showing the installation and lifting positions of a load cell further attached to an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. [Figure 25] 10A and 10B are diagrams showing the installation and lifting positions of a load cell further attached to an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. [Figure 26] FIG. 1 is a diagram showing an exemplary fixed frame attached to an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention. [Figure 27] FIG. 10 shows an exemplary confocal laser scanning microscope further attached to the exemplary multi-wavelength laser based semiconductor quartz transmittance analyzer according to the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0018] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0019] The present invention is provided to more completely explain the present invention to those skilled in the art, and the following embodiments can be modified in various forms, and the scope of the present invention is not limited to the following embodiments. Rather, these embodiments are provided to make the present disclosure more complete and complete, and to fully convey the concept of the present invention to those skilled in the art.

[0020] In addition, the thickness and size of each layer in the following drawings have been exaggerated for convenience and clarity of explanation, and the same reference numerals in the drawings refer to the same elements. As used herein, the term "and / or" includes any one and all combinations of one or more of the listed items. In addition, in this specification, the term "connected" refers not only to a case where member A and member B are directly connected, but also to a case where member A and member B are indirectly connected via member C interposed between them.

[0021] The terms used in this specification are used to describe particular embodiments and are not intended to limit the present invention. As used in this specification, the singular forms can include the plural forms unless the context clearly dictates otherwise. Also, as used in this specification, the words "comprise," "include," and / or "comprising," "including," specify the presence of a stated shape, number, step, operation, member, element, and / or group thereof, but do not exclude the presence or addition of one or more other shapes, numbers, operations, members, elements, and / or groups.

[0022] In this specification, terms such as "first," "second," and the like are used to describe various members, components, regions, layers, and / or portions, but it is clear that these members, components, regions, layers, and / or portions should not be limited by these terms. These terms are used only to distinguish one member, component, region, layer, or portion from another region, layer, or portion. Therefore, a first member, component, region, layer, or portion described below can refer to a second member, component, region, layer, or portion without departing from the teachings of the present invention.

[0023] Terms relating to space, such as "beneath," "below," "lower," "above," and "upper," may be used to facilitate understanding of one element or feature shown in the drawings relative to another. These terms relating to space are intended to facilitate understanding of the present invention in accordance with various process or use states of the present invention, and are not intended to limit the present invention. For example, if an element or feature in the drawings is inverted, an element or feature described as "beneath" or "below" would become "upper" or "upper." Therefore, "beneath" is a concept that encompasses "upper" or "below."

[0024] The controller and / or other related devices or components of the present invention may be implemented using any suitable hardware, firmware (e.g., application-specific semiconductors), software, or a suitable combination of software, firmware, and hardware. For example, various components of the controller and / or other related devices or components of the present invention may be formed on a single integrated circuit chip or on separate integrated circuit chips. Various components of the controller may be implemented on a flexible printed circuit film, a tape carrier package, a printed circuit board, or the same substrate as the controller. Various components of the controller may be processes or threads executed by one or more processors in one or more computing devices, which may execute computer program instructions and interact with other components to perform various functions described below. The computer program instructions may be stored in a memory executable by the computing device using standard memory devices, such as random access memory. The computer program instructions may also be stored on other non-transitory computer-readable media, such as a CD-ROM, a flash drive, or other non-transitory computer-readable media. Additionally, those skilled in the art to which the present invention pertains will appreciate that the functionality of various computing devices may be combined with one another, integrated into a single computing device, or the functionality of a particular computing device may be distributed across one or more other computing devices without departing from the exemplary embodiments of the present invention.

[0025] As an example, the control unit (controller) of the present invention can be operated by a typical commercial computer consisting of a central processing unit, a mass storage device such as a hard disk or solid state disk, a volatile memory device, an input device such as a keyboard or mouse, and an output device such as a monitor or printer.

[0026] 1 to 7 are perspective views, front views, plan views, and side views showing an exemplary semiconductor quartz transmittance analysis device 100 using a multi-wavelength laser according to the present invention; FIGS. 8 and 9 are perspective views and front views showing the laser output upper section 110 of the semiconductor quartz transmittance analysis device 100 using an exemplary multi-wavelength laser according to the present invention; FIGS. 10 and 11 are perspective views showing the laser receiving lower section 130 of the semiconductor quartz transmittance analysis device 100 using an exemplary multi-wavelength laser according to the present invention; and FIGS. 12 to 14 are perspective views showing the window closed state, the window open state, and the disassembled state of the semiconductor quartz transmittance analysis device 100 using an exemplary multi-wavelength laser according to the present invention.

[0027] 1 to 14, an exemplary semiconductor quartz transmittance analyzer 100 using a multi-wavelength laser according to the present invention may include a laser output upper section 110, a quartz plate stage moving section 120, and a laser receiving lower section 130. In some examples, the quartz transmittance analyzer 100 may further include a computer for controlling the device, and a keyboard and / or mouse as input devices and a monitor for displaying information may be connected to the computer.

[0028] The laser output upper section 110 may include an upper section base plate 111 , a first upper stage 112 , a laser fiber 113 , a second upper stage 115 , an aperture 116 , and an upper convex lens 117 .

[0029] The upper base plate 111 may be substantially flat and include an upper through-hole to allow the laser beam to pass through to the bottom. The first upper placement stage 112 may be provided on one side of the upper base plate 111, for example, on one side of the through-hole, in a form extending and protruding upward. The laser fiber 113 may be provided on the first upper placement stage 112 and may irradiate the laser beam through the through-hole. In some examples, a laser module and a laser power supply may be further connected to the laser fiber 113. The second upper placement stage 115 may be provided on the other side of the upper base plate 111, for example, on the other side of the through-hole, in a form extending and protruding upward. The aperture 116 may be provided on the second upper placement stage 115 and may adjust the size of the laser beam irradiated from the laser fiber 113. The upper convex lens 117 is provided on the upper second placement stage 115 and adjusts the focus of the laser beam whose size has been adjusted so that it is irradiated onto the lower part of the through-hole. The quartz plate stage moving part 120 may include a stage base plate 121 , a moving block 122 , and a quartz plate fixing frame 123 .

[0030] The stage base plate 121 is generally flat and may include a large stage through-hole to allow the laser beam to pass through to the bottom. In some examples, the size of the stage through-hole may be larger than the size of the upper stage through-hole. In some examples, a plurality of pillars having a certain length may be provided between the stage base plate 121 and the upper stage base plate 111.

[0031] The moving block 122 may be provided on the stage base plate 121 so as to be movable in the X and Y directions. In some examples, the moving block 122 may include an X block that moves the quartz plate fixing frame 123 in the X direction, and a Y block that moves the quartz plate fixing frame 123 in the Y direction. As is well known, the moving block 122 may include a block, rails, balls, belts, an electric motor, etc.

[0032] The quartz plate fixing frame 123 is coupled to the moving block 122 to fix the quartz plate, and may also include a through-hole so that the laser beam can pass through the quartz plate and be irradiated to the bottom. As described above, the quartz plate fixing frame 123 is coupled to the moving block 122 and can move in the X and Y directions.

[0033] The lower laser receiving unit 130 may include a lower base plate 131 , a first lower mounting stage 132 , a lower convex lens 133 , a second lower mounting stage 134 , and a laser detector 135 .

[0034] The lower base plate 131 may be substantially flat and may be connected to the lower part of the stage base plate 121 via a plurality of pillars. In some examples, a support plate may also be connected to the lower part of the lower base plate 131 via a plurality of pillars. The lower first mounting table 132 may be connected to one side of the lower base plate 131 in a form that extends and protrudes upward. The lower convex lens 133 is provided on the lower first mounting table 132 and serves to adjust the focus of the laser beam that has passed through the quartz plate. The lower second mounting table 134 may be connected to the other side of the lower base plate 131 in a form that extends and protrudes upward. The laser detector 135 is provided on the lower second mounting table 134 and can detect the laser beam that has passed through the lower convex lens 133 (i.e., the laser beam that has passed through the quartz plate). In some examples, the exemplary quartz transmittance analyzer 100 according to the present invention may further include an upper opaque window 118 and / or a stage opaque window 128 .

[0035] The upper opaque windows 118 are provided on at least three surfaces of the upper base plate 111 of the laser output upper section 110, and prevent dust from entering and external light from being transmitted to the interior, thereby preventing external optical noise from mixing into the laser beam irradiated via the laser fiber 113. In some examples, the upper opaque windows 118 are installed so as to be able to open and close, which allows for smooth maintenance of the internal components.

[0036] The stage opaque windows 128 are provided on at least three surfaces of the stage base plate 121 of the quartz plate stage moving part 120, and prevent dust from entering and external light from being transmitted to the inside, thereby preventing external optical noise from mixing with the laser beam irradiated via the laser fiber 113. In some examples, the stage opaque windows 128 are installed so that they can be opened and closed, which facilitates the insertion and removal of quartz plates and the smooth maintenance of internal components.

[0037] 15 to 17 are perspective and exploded perspective views showing the quartz plate fixing frame 123 of an exemplary semiconductor quartz transmittance analyzer 100 using a multi-wavelength laser according to the present invention.

[0038] As shown in Figures 15 and 16, the quartz plate fixing frame 123 of the exemplary quartz transmittance analyzer 100 according to the present invention may include a first fixing frame 1231, a second fixing frame 1232, a third fixing frame 1233, a tilt bolt 1234, and a tilt indicator 1235.

[0039] The first fixing frame 1231 may be configured as a substantially rectangular flat plate, and is coupled onto the moving block 122. Of course, the first fixing frame 1231 has a through-hole in the center to allow the laser beam to pass through the quartz plate.

[0040] The second fixing frame 1232 may be tiltably coupled to the first fixing frame 1231 and configured in the shape of a substantially rectangular flat plate. Similarly, the second fixing frame 1232 also has a through-hole in the center to allow a laser beam to pass through the quartz plate. In some examples, the second fixing frame 1232 may be coupled to the first fixing frame 1231 so that one side edge thereof is always in contact with the first fixing frame 1231 and moves in a substantially hinge-like manner. In addition, the other side edge of the second fixing frame 1232 may be in contact with the other side edge of the first fixing frame 1231 or may be coupled to the other side edge of the first fixing frame 1231 so that it can be spaced a certain distance apart, thereby allowing the second fixing frame 1232 to tilt at a predetermined angle relative to the first fixing frame 1231. The third fixing frame 1233 is coupled onto the second fixing frame 1232, and the quartz plate can be substantially seated on the top of the third fixing frame 1233.

[0041] A plurality of tilt bolts 1234 are provided between the first fixing frame 1231 and the second fixing frame 1232, and allow the tilt angle of the second fixing frame 1232 relative to the first fixing frame 1231 to be adjustable. For example, two tilt bolts 1234 may be provided, which may be coupled to the other side edges of the first fixing frame 1231 and the second fixing frame 1232. For example, loosening the two tilt bolts 1234 increases the tilt angle of the second fixing frame 1232 from the first fixing frame 1231, and tightening the two tilt bolts 1234 decreases the tilt angle of the second fixing frame 1232 from the first fixing frame 1231.

[0042] Meanwhile, the tilt indicator 1235 is provided between the first fixing frame 1231 and the second fixing frame 1232 and can mechanically display the tilt angle of the second fixing frame 1232 relative to the first fixing frame 1231. In some examples, the tilt angle is approximately 0° to approximately 8°. In some examples, the tilt indicator 1235 is erected from the first fixing frame 1231, displays the tilt angle, and may include a vertical plate having a through-hole in the vertical direction, and a horizontal protrusion protruding from the second fixing frame 1232 and passing through the vertical through-hole. Therefore, a user can adjust the tilt angle of the second fixing frame 1232 by looking at the position of the horizontal protrusion passing through the vertical through-hole of the vertical plate.

[0043] Meanwhile, in the present invention, the second fixed frame 1232, tilt bolt 1234, and tilt indicator 1235 may be omitted. That is, as shown in Fig. 17, the third fixed frame 1233 may be fixed directly onto the first fixed frame 1231, and the first fixed frame 1231 may be fixed onto the moving block 122 with bolts or the like.

[0044] 18 is a diagram showing an exemplary quartz plate and transmission coordinate setting state used in an exemplary semiconductor quartz transmittance analyzer 100 using a multi-wavelength laser according to the present invention. As shown in FIG. 18, the transmittance of a quartz plate (non-porous quartz) decreases due to contamination as it is used in a semiconductor heat treatment process. To measure the transmittance of the entire area of ​​such a quartz plate, coordinates can be set to irradiate a laser beam at approximately 100 to 500 points in a spiral pattern, for example. As a result, the laser fiber 113 of the upper laser output unit 110 can irradiate the quartz plate with a laser beam according to the coordinates set as described above.

[0045] FIG. 19 is a perspective view showing an exemplary semiconductor quartz transmittance analyzer 100 using a multi-wavelength laser according to the present invention installed in a darkroom. Generally, a transmittance analyzer 100 using a laser beam is affected by external light wavelengths, which can reduce the accuracy of the transmittance analysis value. Therefore, according to the present invention, the quartz transmittance analyzer 100 may be installed in a darkroom as shown in FIG. 19. In some examples, the darkroom is provided with both a front door and a rear door that can be opened and closed, which allows for smooth laser alignment setup work.

[0046] 20 is a diagram showing an exemplary HEPA filter that can be further attached to the exemplary semiconductor quartz transmittance analyzer 100 using a multi-wavelength laser according to the present invention. As shown in FIG. 19, the transmittance analyzer 100 may experience a decrease in laser beam quality due to the influence of internal dust and other factors over time, which can lead to a decrease in transmittance accuracy. Therefore, by further installing a HEPA filter in the transmittance analyzer 100 according to the present invention, it is possible to prevent dust from accumulating inside the device and constantly maintain optimal laser beam quality.

[0047] FIG. 21 is a diagram showing an example of improving the reliability of the semiconductor quartz transmittance analyzer 100 using an exemplary multi-wavelength laser according to the present invention. Generally, when minute external vibrations are applied to a lens, the rate of change in the measured transmittance can increase. Therefore, by reducing the number of lenses as much as possible, the number of variables can be reduced, as well as the laser alignment setup time and deviation period. Furthermore, by shortening the distance between the laser beam and the detector as much as possible, the vibration interval can be reduced, maintaining the quality of the laser beam.

[0048] FIG. 22 shows an example of the installation position of a quartz plate in an exemplary semiconductor quartz transmittance analyzer 100 using a multi-wavelength laser according to the present invention. Generally, when using a lens, it is necessary to identify the position where an image is actually formed for each specifically determined focal length. In the quartz transmittance analyzer 100 according to the present invention, by removing the lower convex lens 133 provided in the lower laser receiving section 130, the position of the light receiving section can be positioned at the position where an image is actually formed. In particular, in the case of perforated quartz, as shown in FIG. 22, it is necessary to avoid the size of the laser beam being close to the perforations (holes), so it is preferable to position the sample (i.e., quartz) as close as possible to the Rayleigh range.

[0049] FIG. 23 illustrates an exemplary sensing unit, control unit, and display unit that may be further attached to an exemplary semiconductor quartz transmittance analyzer 100 using a multi-wavelength laser according to the present invention. Contaminated quartz typically undergoes a cleaning process, where the entire surface is etched. This can affect transmittance due to a weight difference between the quartz before and after cleaning, which can change the thickness of the quartz, the path through which the laser beam penetrates. Therefore, the present invention uses a load cell to check the quartz weight, further improving the accuracy of the discard criteria. However, external influences (e.g., vibrations) may require further stability in the load cell weight measurements. As shown in FIG. 23, the exemplary quartz transmittance analyzer 100 according to the present invention may further include a sensor unit including a load cell, a control unit including an amplifier for amplifying the load cell voltage and a microcontroller, and a display unit including a PC monitor. Here, in the present invention, various weight measurement values ​​are sorted in order of magnitude using an insertion sort algorithm. In the first stage, the minimum and maximum values ​​of the amplitude that fluctuate excessively are excluded, and only values ​​within a set amplitude range are selected and sorted. In the second stage, a stable weight value can be derived by averaging only the remaining measurement values, after further excluding a portion of the minimum and maximum values ​​from the data values ​​remaining after processing in the first stage.

[0050] 24 and 25 are diagrams illustrating the installation and elevation positions of a load cell further attached to an exemplary semiconductor quartz transmittance analyzer 100 using a multi-wavelength laser according to the present invention. As shown in FIGS. 24 and 25, a single-point load cell is used in the present invention, for example. The load cell is initially positioned away from the quartz plate and then rises to the quartz plate to sense the weight of the quartz plate. The single-point load cell has the advantage of providing relatively accurate measurements and excellent resolution even when the weight of the quartz plate is not uniformly distributed. Furthermore, as described above, the load cell moves to the vicinity of the center of gravity of the quartz plate and then rises, allowing for weight measurement in a relatively stable state.

[0051] 26 is a diagram showing an exemplary fixing frame 223 attached to an exemplary semiconductor quartz transmittance analyzer 100 using a multi-wavelength laser according to the present invention. As shown in FIG. 26, the exemplary fixing frame to which the quartz plate is fixed may include a circular ring 2231 formed in an annular shape, a plurality (four) of connecting bars 2232 extending outward from the circular ring 2231, and a square ring 2233 formed in a rectangular shape and connected to the plurality of connecting bars 2232. In this way, the exemplary fixing frame 223 according to the present invention can irradiate a laser beam of a constant size by maintaining a constant measurement height for each quartz plate, and can overcome limitations on structural changes due to the laser beam size, particularly in the case of perforated quartz.

[0052] FIG. 27 illustrates an exemplary confocal laser scanning microscope that may be further attached to the exemplary semiconductor quartz transmittance analysis device 100 using a multi-wavelength laser according to the present invention. Generally, contact-type surface roughness measurement equipment may damage the quartz surface, so a non-contact confocal laser scanning microscope is preferred. Here, surface roughness can be measured by irradiating a laser onto the quartz surface and detecting the reflected light. For example, by comparing the degree of surface roughness at a specific position with transmittance data, the quartz's rejection criteria can be clearly determined. As shown in FIG. 27, the present invention may further include a confocal laser scanning microscope mounted on the stage base plate 121 of the quartz plate stage moving unit 120 to measure the surface roughness of the quartz plate.

[0053] Thus, in the present invention, when measuring surface roughness, the confocal microscope located on the rear surface can be moved to the center point of the quartz plate and then measured. In this case, as with transmittance, 32 points may be set, for example, to extract roughness results that are close to circular. Meanwhile, to prevent laser alignment errors, the confocal laser scanning microscope may be installed separately in a separate measurement device.

[0054] Meanwhile, as described above, the laser output upper section 110, the quartz plate stage moving section 120, and the laser receiving lower section 130 constituting the exemplary quartz transmittance analyzer 100 according to the present invention may each be connected and coupled by a plurality of columns. In some cases, when measuring the transmittance of quartz, the movement of the moving block 122 of the quartz plate stage moving section 120 may cause misalignment of each column. Therefore, in the present invention, instead of reducing the number of columns used, the laser output upper section 110, the quartz plate stage moving section 120, and the laser receiving lower section 130 are integrated to reduce the possibility of delays in laser alignment.

[0055] The above description is merely one embodiment for realizing an exemplary semiconductor quartz transmittance analyzer using a multi-wavelength laser according to the present invention, and the present invention is not limited to the above embodiment. As claimed in the following claims, the technical spirit of the present invention is within the scope of the invention to the extent that anyone with ordinary knowledge in the field to which the invention belongs can make various modifications without departing from the gist of the present invention.

Claims

1. a laser output upper stage comprising an upper base plate, a first upper stage mounting table provided on one side of the upper base plate, a laser fiber provided on the first upper stage mounting table and irradiating a laser beam downward, a second upper stage mounting table provided on the other side of the upper base plate, an aperture provided on the second upper stage mounting table and adjusting the size of the laser beam irradiated from the laser fiber, and an upper convex lens provided on the second upper stage and adjusting the focus of the laser beam whose size has been adjusted; a quartz plate stage moving unit comprising: a stage base plate provided below the upper stage base plate; a moving block provided on the stage base plate so as to be movable in the X and Y directions; and a quartz plate fixing frame coupled to the moving block and fixing the quartz plate; and a lower laser receiving section including a lower base plate provided below the upper base plate, a first lower placement stage provided on one side of the lower base plate, a lower convex lens provided on the first lower placement stage for adjusting the focus of the laser beam transmitted through the quartz plate, a second lower placement stage provided on the other side of the lower base plate, and a laser detector provided on the second lower placement stage for detecting the laser beam transmitted through the lower convex lens; A semiconductor quartz transmittance analyzer using a multi-wavelength laser.

2. an upper opaque window provided on at least three sides of the upper base plate of the laser output upper section, for preventing external light from being transmitted to the inside; and and a stage opaque window provided on at least three sides of the stage base plate of the quartz plate stage moving part to prevent external light from being transmitted to the inside. A semiconductor quartz transmittance analyzer using the multi-wavelength laser according to claim 1.

3. the upper stage base plate of the laser output upper stage further includes an upper stage through-hole through which a laser beam passes; The stage base plate of the quartz plate stage moving unit further includes a stage through-hole through which a laser beam passes. A semiconductor quartz transmittance analyzer using the multi-wavelength laser according to claim 1.

4. The quartz plate fixing frame includes a first fixing frame coupled to the moving block, a second fixing frame tiltably coupled to the first fixing frame, a third fixing frame coupled to the second fixing frame and on which the quartz plate is seated, and a tilt bolt provided between the first fixing frame and the second fixing frame for adjusting a tilt angle of the second fixing frame relative to the first fixing frame. A semiconductor quartz transmittance analyzer using the multi-wavelength laser according to claim 1.

5. The laser fiber at the upper stage of the laser output irradiates the laser beam at 100 to 500 points in a spiral from the center toward the quartz plate. A semiconductor quartz transmittance analyzer using the multi-wavelength laser according to claim 1.

6. The upper laser output section further includes a HEPA filter for filtering out fine dust particles from the outside. A semiconductor quartz transmittance analyzer using the multi-wavelength laser according to claim 1.

7. 2. The semiconductor quartz transmittance analyzer using a multi-wavelength laser according to claim 1, wherein the quartz plate is positioned within a Rayleigh range.

8. The stage base plate of the quartz plate stage moving unit further includes a load cell for detecting the weight of the quartz plate. A semiconductor quartz transmittance analyzer using the multi-wavelength laser according to claim 1.

9. The quartz plate fixing frame includes a circular ring formed in an annular shape, a plurality of connecting bars extending outward from the circular ring, and a square ring formed in a square annular shape and connected to the plurality of connecting bars. A semiconductor quartz transmittance analyzer using the multi-wavelength laser according to claim 1.

10. The stage base plate of the quartz plate stage moving unit further includes a confocal laser scanning microscope for measuring the surface roughness of the quartz plate. A semiconductor quartz transmittance analyzer using the multi-wavelength laser according to claim 1.

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