System and method for detecting rotation of a vibratory polisher

Abstract

A system and method for detecting movement of a sample subjected to a polishing operation in a vibratory polisher is disclosed. The system includes a sample holder for securing a sample to be polished. A housing supports a platen on which the sample holder is disposed. The platen allows movement of the sample holder during the polishing operation as the sample holder traverses a polishing fluid dispensed around the platen. One or more sensors are disposed around the housing and operable to monitor movement of the sample holder on the platen relative to the housing.

Description

[Technical Field]

[0001] [CROSS-REFERENCE TO RELATED APPLICATIONS] This application is a non-provisional application of U.S. Provisional Patent Application No. 63 / 430,722, entitled "Systems And Methods To Detect Rotation Of A Vibratory Polisher," filed December 7, 2022, and is hereby incorporated by reference in its entirety. [Background technology]

[0002] Grinding and polishing operations are performed on specimens for many purposes and across a vast number of sectors and industries. In some applications, surface preparation of the specimen by grinding / polishing operations is performed by a grinding / polishing device. For example, the specimen may be contained in a sample holder and polished by moving it through a polishing fluid. The amount of polishing performed on the specimen is determined based on the amount of time the sample holder is polished. However, timing is often an unreliable indicator of the amount of polishing performed on the specimen. Therefore, a more reliable measure of the amount of polishing performed on the specimen is desirable. Summary of the Invention

[0003] As more fully set forth in the claims, a system and method are disclosed for a system for detecting rotation of a sample being polished in a vibratory polisher, substantially as illustrated by and described in connection with at least one of the drawings. [Brief explanation of the drawings]

[0004] [Figure 1] FIG. 1 illustrates an exemplary system for polishing a specimen in a sample holder, according to aspects of the present disclosure.

[0005] [Figure 2] FIG. 2 is a top view of the exemplary system of FIG. 1.

[0006] [Figure 3] 1 illustrates an exemplary method for detecting rotation of a sample being polished in a vibratory polisher, according to aspects of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0007] The drawings are not necessarily to scale. Where appropriate, like or identical reference numbers are used to refer to like or identical components.

[0008] A system and method for detecting the movement of a sample subjected to a polishing operation in a vibratory polisher is disclosed. In particular, the system includes a sample holder for securing a sample to be polished. A housing supports a platen on which the sample holder is disposed. The platen allows for movement of the sample holder during the polishing operation as the sample holder traverses a polishing fluid dispensed around the platen. One or more sensors are disposed around the housing and operable to monitor the movement of the sample holder on the platen relative to the housing.

[0009] The disclosed polishing systems and methods employ a polishing system for performing a polishing operation on one or more samples. The polishing system can be a vibratory polishing system that includes a platen on which a sample, a set of samples, and / or a sample holder (e.g., a puck) is placed. During the polishing operation, the platen holds a polishing fluid and serves as a polishing surface over which the sample moves.

[0010] For example, a vibrating device such as a vibrating bowl supports or is otherwise connected to the platen and forces the sample across a polishing fluid (e.g., an abrasive liquid) on a vibrating polishing surface. The sample tends to rotate around the inner periphery of the platen (surrounded by one or more bumpers), thereby polishing the sample.

[0011] Conventionally, a timer provides the duration that the sample remains on the polishing surface, and the amount of polishing performed on the sample is correlated to the empirically correlated amount of time. However, the timer does not take into account the speed of motion, resulting in an inaccurate determination of the amount of polishing performed on the sample.

[0012] In the disclosed examples, one or more sensors are positioned within, around, and / or in communication with the polishing system so that the movement, velocity, and / or position of the sample are monitored during the polishing operation. In other words, the number of rotations is used as an indicator of the amount of polishing performed on the sample. As a result, the amount of polishing performed on the sample is more closely correlated to the sample's movement and, therefore, the polishing action.

[0013] In some examples, the sensors are in electrical communication with a control system operable to monitor the position and / or relative movement of the sensors. Specifically, the system is operable to track the number of rotations and / or periodic rotational speed (e.g., counted as revolutions per unit time, such as revolutions per minute (RPM) around a circular path) of the sample(s) as they move through the polishing system. In this manner, the sensor data provides an accurate method for calculating and / or otherwise determining the distance traveled by the sample along the polishing surface over a given amount of time. Accordingly, the disclosed systems and methods can determine the total (e.g., rotational) distance traveled, the speed of travel, and / or the number of complete revolutions around the platen during a polishing operation by using sensors and / or timers to indicate end-of-cycle notification.

[0014] In the disclosed systems and methods, one or more sensors for detecting sample holders can be located at predetermined fixed locations around the moving surface. These sensors can be integrated into a bowl surrounding the oscillating circular polishing surface, along the border of the polishing surface, and / or externally to the housing, as a list of non-limiting examples. The sensors detect movement of the sample holder pack as it moves circularly.

[0015] In some examples, one or more of the sensors can be specifically designed to collect data corresponding to a particular sample, sample holder, and / or application. For example, one or more of the sensors can be mounted differently from another sensor, such as in a different horizontal and / or vertical orientation, to monitor specific data. This unique orientation allows a given sensor to identify a pack of particular interest, such as the first or last pack, and / or other aspects of multiple sample holders of interest (e.g., size, velocity relative to other sample holders, physical characteristics of the samples or sample holders, etc.). Using the sensor data, a computer or controller algorithmically determines various aspects of sample holder movement and adjusts the frequency and / or amplitude (vibration speed, and therefore power to control sample movement) in real time while providing cycle progress notification to the operator.

[0016] Advantages of the disclosed systems and methods include, but are not limited to, providing dynamic determination of completion of a polishing operation based on travel distance and / or speed, and employing monitoring of travel distance increases the predictability and / or repeatability of the polishing operation for a given sample and / or system by monitoring actual movement around the polishing surface (rather than just time).

[0017] In some instances, providing detection of movement speed / speed change can provide operator and / or other improvements to polishing operations. By way of a list of non-limiting examples, determinations of sample movement can be used to determine low polishing fluid levels (and provide corresponding notifications), automatic polishing rate optimization of power and frequency (e.g., to control system vibration and sample speed), and / or identify sample holder performance issues.

[0018] In a disclosed example, a system for performing a polishing operation on a sample includes a sample holder for securing the sample to be polished, a housing for supporting a platen operable to allow movement of the sample holder during the polishing operation, and one or more sensors for monitoring movement of the sample holder relative to the housing.

[0019] In some examples, a controller operable to receive data from one or more sensors. In examples, the controller counts the number of rotations of the sample holder relative to the housing and determines the amount of polishing of the sample based on the number of rotations. In examples, the controller determines the distance traveled by the sample based on the number of rotations. In examples, the controller controls one or more operating parameters of the system based on the number of rotations.

[0020] In some examples, the one or more operating parameters is a rotation speed of the sample.

[0021] In some examples, an actuator is provided for controlling movement of the sample holder. In examples, the controller is operable to control the actuator to adjust the rotational speed of the sample holder based on measurements from the one or more sensors. In some examples, the bowl is connected to the actuator, and the actuator causes vibration of the bowl to move the sample holder.

[0022] In some examples, the one or more sensors include a magnetic sensor, a Hall Effect sensor, an optical sensor, an inductive sensor, or a mechanical sensor.

[0023] In some examples, the one or more sensors are disposed in a fixed position relative to the housing or the platen, and each of the one or more sensors is operable to detect movement of the sample holder as it moves around the platen.

[0024] In some examples, a user interface is attached to the housing, the user interface providing information or instructions to an operator or receiving commands from an operator.

[0025] In some examples, the one or more sensors are disposed within a system that includes one or more of the housing, the cover, or the platen.

[0026] In some disclosed examples, a system for performing a polishing operation on a sample includes a sample holder for securing the sample to be polished, a bowl for vibrating the sample holder, and one or more sensors for monitoring movement of the sample holder relative to the bowl.

[0027] In some instances, an actuator for controlling the rate of vibration of the bowl and therefore the rate of movement of the sample holder.

[0028] In some examples, the controller is operable to receive data from one or more sensors, count the number of rotations of the sample holder relative to the housing, and determine the amount of polishing of the sample based on the number of rotations.

[0029] In an example, the controller compares the number of rotations of the sample holder to a list of rotations corresponding to the amount of polishing and determines the amount of polishing of the sample based on the number of rotations.

[0030] In some examples, the sample holder comprises a sensor tag operable to be read by one or more sensors. In some examples, the sample holder includes a material operable to trigger one or more sensors. In examples, the material is a ferrous metal.

[0031] In some disclosed examples, a system for performing a polishing operation on a sample includes a housing for supporting the sample to be polished, a platen operable to allow movement of the sample during the polishing operation, and one or more sensors for monitoring movement of the sample relative to the housing.

[0032] In some examples, a controller operable to receive data from one or more sensors, count the number of rotations of the sample relative to the housing, and determine an amount of grinding of the sample based on the number of rotations.

[0033] In some examples, a controller operable to receive data from one or more sensors and determine one or more properties of the sample based on the data.

[0034] In some examples, the one or more characteristics include the type of sample, the color of the sample, the temperature of the sample, the consistency of the sample, or a material property of the sample.

[0035] As used herein, the word "exemplary" means "serving as an example, instance, or illustration." The embodiments described herein are intended to be illustrative only and not limiting. It is to be understood that any described embodiment is not necessarily to be construed as preferred or advantageous over other embodiments. Moreover, the term "embodiments" does not require that all disclosed embodiments include the discussed feature, advantage, or mode of operation.

[0036] As used herein, "and / or" means any one or more of the items in the list connected by "and / or." As an example, "x and / or y" means any element of the three-element set {(x), (y), (x, y)}. In other words, "x and / or y" means "one or both of x and y." As another example, "x, y and / or z" means any element of the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y, z)}. In other words, "x, y and / or z" means "one or more of x, y and z." As used herein, the term "exemplary" means serving as a non-limiting example, instance, or illustration. As used herein, the term "for example" begins a list of one or more non-limiting examples, instances, or illustrations.

[0037] For the purposes of promoting an understanding of the principles of the claimed technology and setting out the best currently understood mode of operation, reference will now be made to the embodiments illustrated in the drawings, and specific language will be used to describe the same. It is to be understood, however, that this is not intended to limit the scope of the claimed technology, and that such changes and further modifications in the devices shown, and such further applications of the principles of the claimed technology shown therein, are contemplated as would normally occur to one skilled in the art to which the claimed technology pertains.

[0038] 1 illustrates an exemplary polishing system 100 including a sample holder 104 for supporting a sample 101 to be subjected to a processing operation, such as polishing and / or grinding. A housing 106 can receive the sample holder 104 and / or the sample 101 itself and is operable to move the sample holder 104. In some examples, a motor or other actuator 108 (e.g., an electromechanical magnetic actuator, a solenoid, etc.) is disposed within the housing 106 and is operable to vibrate, rotate, and / or otherwise rotate the sample 101 and / or sample holder 104. In some examples, the sample holder 104 is mounted or otherwise secured on a bowl 103 configured to rotate, vibrate, or otherwise move the sample holder 104.

[0039] In one example, one or more sensors 110 are positioned around the sample holder 104 during the polishing operation. In some examples, the sensors 110 communicate with the controller or control circuitry 114 via a sensor connection 120. For example, the sensor 110 is triggered each time the sample holder 104 passes the sensor 110. This triggering can generate a response, such as a signal, that is transmitted via the sensor connection 120. Each such signal is received at the controller 114 to increment a counter value that can be used to determine the amount of polishing of the sample.

[0040] In some examples, the interface 112 provides a connection between the sensor 110 and the controller 114, which may be disposed within the housing 106. For example, the interface 112 may be one or more of a contact and / or contactless interface, which may include a physical connection (e.g., conduits, traces, circuit elements, etc.) and / or an electrical connection (e.g., a wireless transceiver, an inductive switch, etc.). The interface 112 allows signals including data (corresponding to sensor measurements) to be transferred to the controller 114 for analysis. The user interface 116 may be attached to the housing 106 and operable to provide information and / or instructions to an operator and to receive commands.

[0041] In some examples, the controller 114 is operable to control one or more parameters of the polishing operation in response to the motion data. For example, the controller 114 can increase and / or decrease the velocity of the sample holder 104 around the platen 102 (e.g., by controlling the actuator 108). This can include stopping motion entirely.

[0042] The controller 114 is further operable to cause the user interface 116 to display information regarding the duration, number of rotations, and / or an estimate of the polishing progress during the polishing operation. In some examples, the controller 114 is connected to a remote device (e.g., a tablet, a smartphone, a network, a remote computer, etc.) and can transmit information (wired or wirelessly) to such a device.

[0043] Figure 2 shows a top view of the example system of Figure 1. As shown, sensors 110 are positioned around the periphery of platen 102 such that rotational movement of sample holder 104 (according to arrow 105) causes sample holder 104 to traverse platen 102 (e.g., in direction 107) by contacting supports, walls, or boundaries 109 around platen 102.

[0044] The sensors 110 can be electrical, contact, and / or non-contact sensors (e.g., magnetic, Hall effect, optical, inductive, mechanical, imaging, etc.) and can be integrated within the interface 109 and / or at other locations around the housing 106. In some examples, the interface 109 acts as a support that surrounds the vibrating polishing surface of the platen 102 to guide the movement of the sample holder.

[0045] In some examples, one or more sensors 110A can be mounted within the housing 106, such as below the platen 102. Advantageously, the sensors within the housing 106 are connected to the controller 114 without the use of external sensors or cables. Thus, the sensors and / or wiring are not exposed to an abrasive environment (such as chemicals) and cannot come into contact with moving, vibrating, and / or rotating parts.

[0046] In some examples, multiple sensors, including multiple types of sensors, can be disposed within system 100. For example, sensor 110 can be a first type of sensor, while sensor 110A can be a second, different type. Another sensor 110B can be disposed within cover 122, as shown in FIG. 2A.

[0047] These sensors communicate electrically (e.g., wired and / or wirelessly) to transfer sensor data to the controller 114. In some examples, the sensors 110 themselves have wires, traces, conduits, and / or other communication interfaces that connect directly with the controller 114, while in other examples, the sensors 110 transmit signals to the controller 114 via connectors 120. In examples, one or more of the sensors, connectors, traces, wires, traces, conductors, etc. are not exposed and therefore not visible to an operator. In some examples, the sensors and / or associated connections are protected from environmental contaminants by covers, surface treatments, housings, etc., thereby ensuring that the sensors and connections are not exposed to corrosive chemicals.

[0048] In some examples, an imaging device can be used to capture images of the sample holder during the polishing operation. Such images can capture multiple parameters of the sample holder, such as color, size, shape, temperature, etc., as well as indicia corresponding to sample or sample holder information, such as barcodes, quick release codes, text, images, etc. The images and / or information extracted from the images can be transmitted to the controller 114 to determine one or more characteristics of the sample or sample holder, including, by way of a non-limiting list of examples, speed, and type of sample or sample holder.

[0049] In some examples, the platen 102, the interface 109, the bowl 103, and / or the sensor 110 itself are configured to be detachable from the housing 106. In such examples, an electrical connector may be disposed on one or more of the aforementioned components to allow a connection to be made between the sensor 110 and the controller 114 (e.g., via the connector 120).

[0050] In some examples, the sample holder 104 (or puck) can include one or more features and / or characteristics to facilitate sensor operation and measurement. For example, the features / characteristics can include one or more of an optical target, a metal composition, a height of the sample holder, molded features, and a radio frequency tag (e.g., RFID), as a non-limiting list of examples. In particular, the features / characteristics can trigger a response (e.g., send a signal, increment a counter, etc.) when the sample holder passes a corresponding sensor.

[0051] In some examples, three sensors 110 are shown, however, single sensors as well as four or more sensors can be used to suit any particular application.

[0052] 3 shows a flowchart depicting example instructions 300 that may be executed by an operator and / or the controller / controller circuitry 114 of FIG. 1 to detect rotation of a sample being polished in a vibratory polisher, as disclosed herein. In block 302, a sample is placed in a sample holder. In block 304, the sample holder is placed on a platen that can be coated with a polishing fluid. In block 306, the vibratory polisher is activated, moving the sample holder across the platen. In block 308, one or more sensors monitor the movement of the sample holder relative to the housing of the vibratory polisher.

[0053] At block 3010, motion information from the sensor is transmitted and received at the control circuitry. At block 312, the control circuitry counts the number and / or frequency of rotation of the sensor moving past the sensor based on the received motion information. At block 314, the control circuitry determines (e.g., calculates) one or more parameters related to the movement of the sample holder based on the number of rotations. For example, the parameters can include one or more of the amount of distance traveled, the speed of movement, or the number of rotations around the platen, as a non-limiting list of examples.

[0054] In block 316, the control circuitry compares the determined or calculated parameters associated with the sample holder to a list of parameters corresponding to polishing amounts. The list may be stored in memory within system 100 (e.g., containing the control circuitry) and / or in a remote device. In block 318, the polishing amount is determined based on the comparison. In some examples, the control circuitry may calculate the polishing amount based on a formula and associated variables without needing to access a list. In block 320, the polishing amount is transmitted, displayed, and / or otherwise made available to an operator or other system.

[0055] In some additional or alternative examples, at block 322, the control circuitry is operable to control the motor to adjust the rotational speed of the sample holder based on the determined or calculated parameters to adjust the amount or rate of polishing.

[0056] The method and system can be implemented in hardware, software, and / or a combination of hardware and software. Exemplary implementations include application specific integrated circuits and / or programmable control circuits.

[0057] The above description and accompanying drawings illustrate the principles, preferred embodiments, and modes of operation. However, the present disclosure should not be construed as limited to the particular embodiments described above. Additional variations on the above-described embodiments will be apparent to those skilled in the art.

[0058] Although the present method and / or system has been described with reference to certain specific embodiments, those skilled in the art will recognize that various modifications and equivalents may be substituted without departing from the scope of the present method and / or system. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the present disclosure without departing from the scope of the present disclosure. For example, blocks and / or components of the disclosed examples may be combined, divided, rearranged, and / or otherwise modified. Therefore, the present method and / or system is not limited to the particular embodiments disclosed. Instead, the present method and / or system includes all embodiments falling within the scope of the appended claims, both literally and under the doctrine of equivalents. While the controller and method are described as being used in conjunction with a grinding / polishing and / or hardness / density testing system, the present teachings are applicable to other systems and operations as well.

[0059] All references referred to in this application, including published journal articles or memoirs, published or corresponding U.S. or foreign patent applications, issued or foreign patents, or any other literature, are hereby incorporated by reference in their entirety, including all data, tables, figures, and text presented within the referenced references.

Claims

1. 1. A system for performing a polishing operation on a sample, comprising: a sample holder for fixing a sample to be polished; a housing for supporting a platen, the platen operable to allow movement of the sample holder during a polishing operation; one or more sensors for monitoring movement of the sample holder relative to the housing; A system comprising:

2. The system of claim 1 , further comprising a controller operable to receive data from the one or more sensors.

3. The controller counting the number of rotations of the sample holder relative to the housing; determining a polishing amount of the sample based on the rotation speed; The system of claim 2 , further operable to:

4. The system of claim 2 , wherein the controller is further configured to control one or more operating parameters of the system based on the rotational speed.

5. The system of claim 4 , wherein the one or more operating parameters is a rotation speed of the sample.

6. The system of claim 2 further comprising an actuator for controlling the movement of the sample holder.

7. The system of claim 6 , wherein the controller is operable to control the actuator to adjust the rotational speed of the sample holder based on measurements from the one or more sensors.

8. The system of claim 6 , further comprising a bowl connected to the actuator, the actuator causing vibration of the bowl to move the sample holder.

9. The system of claim 1 , wherein the one or more sensors include a magnetic sensor, a Hall Effect sensor, an optical sensor, an inductive sensor, or a mechanical sensor.

10. 2. The system of claim 1, wherein the one or more sensors are positioned in a fixed position relative to the housing or the platen, each of the one or more sensors is operable to detect movement of the sample holder as it moves around the platen, and the one or more sensors are positioned within the system including one or more of the housing, cover, or platen.

11. 1. A system for performing a polishing operation on a sample, comprising: a sample holder for fixing a sample to be polished; a bowl for vibrating the sample holder; one or more sensors for monitoring movement of the sample holder relative to the bowl; A system comprising:

12. 12. The system of claim 11, further comprising an actuator for controlling the rate of vibration of the bowl and, therefore, the rate of movement of the sample holder.

13. A controller, receiving data from the one or more sensors; Counting the number of rotations of the sample holder relative to the bowl; determining a polishing amount of the sample based on the rotation speed; The system of claim 11 , further comprising a controller operable to:

14. The controller comparing the number of rotations of the sample holder to a list of rotations corresponding to polishing amounts; determining a polishing amount of the sample based on the rotation speed; The system of claim 13 , further operable to:

15. The system of claim 11 , wherein the sample holder comprises a sensor tag operable to be read by the one or more sensors.

16. The system of claim 11 , wherein the sample holder comprises a material operable to trigger the one or more sensors.

17. The system of claim 16 , wherein the material is a ferrous metal.

18. 1. A system for performing a polishing operation on a sample, comprising: a sample to be polished; a housing for supporting a platen, the platen operable to allow movement of the sample during a polishing operation; one or more sensors for monitoring movement of the sample relative to the housing; A system comprising:

19. A controller, receiving data from the one or more sensors; counting the number of rotations of the sample relative to the housing; determining a polishing amount of the sample based on the rotation speed; 20. The system of claim 18, further comprising a controller operable to:

20. A controller, receiving data from the one or more sensors; determining one or more characteristics of the sample based on the data, the one or more characteristics including a type of sample, a color of the sample, a temperature of the sample, a consistency of the sample, or a material property of the sample; 20. The system of claim 18, further comprising a controller operable to:

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