Inspection Socket

Abstract

A test socket for transmitting a test signal between a first terminal of a device under test and a second terminal of a test circuit board is disclosed. The test socket includes at least one signal probe, one end of which contacts the first terminal of the device under test and the other end of which contacts the second terminal of the test circuit board, and a conductive probe support block, the bottom of which is placed on the test circuit board, supporting the at least one signal probe without contacting it, and having a tunnel recessed from the bottom along a signal line for transmitting the test signal to the second terminal of the test circuit board.

Description

[Technical Field]

[0001] The present invention relates to a test socket for testing the electrical properties of semiconductors for high frequency, high speed and high isolation applications. [Background technology]

[0002] The semiconductor test socket for high frequency, high speed and high isolation includes a signal probe that connects a contact of the semiconductor with a contact of the test circuit board to transmit a test signal, and a metal block that supports the signal probe without contact. The metal block is applied with a ground potential and supports the signal probe without contact while being spaced apart by an insulating support, thereby maintaining the impedance characteristics of the signal probe, for example, 50 Ω.

[0003] The test socket is tested with the bottom of the metal block placed on the test circuit board. The test circuit board is fabricated with the signal line connected to the contacts matched to an impedance of 50 Ω and coupled to the metal block, but the metal block at ground potential adversely affects the impedance of the signal line, degrading RF characteristics. Summary of the Invention [Problem to be solved by the invention]

[0004] The object of the present invention is to solve the above problems and to provide an inspection socket with excellent impedance characteristics. [Means for solving the problem]

[0005] To achieve the above object, there is provided a test socket for transmitting a test signal between a first terminal of a device under test and a second terminal of a test circuit board, the test socket including at least one signal probe having one end contacting the first terminal of the device under test and the other end contacting the second terminal of the test circuit board, and a conductive probe support block having a bottom surface placed on the test circuit board, supporting the at least one signal probe without contact, and having a tunnel recessed from the bottom surface along a signal line for transmitting the test signal to the second terminal of the test circuit board.

[0006] The probe support block may include an insulating member at least partially filling the tunnel.

[0007] The tunnels may have a height of 100 μm or more.

[0008] The signal probe preferably includes a barrel, a first plunger partially inserted into one end of the barrel, and a second plunger partially inserted into the other end of the barrel, and the barrel is not exposed from the tunnel.

[0009] The signal probe may include a barrel, a first plunger partially inserted into one end of the barrel, and a second plunger partially inserted into the other end of the barrel, the probe support block may include an insulating support supporting the other end of the signal probe, and the tunnel may have a height smaller than a length of the insulating support in the longitudinal direction of the signal probe.

[0010] The width of the tunnel may be greater than the width of the signal line.

[0011] The tunnel may include an arched or polygonal tunnel. [Effects of the Invention]

[0012] The test socket according to the embodiment of the present invention forms a tunnel on the bottom surface of the probe support block along the signal line of the test circuit board, thereby preventing the probe support block at ground potential from adversely affecting the impedance characteristics of the signal line of the test circuit board, and improving the RF characteristics. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a perspective view of a test socket according to a first embodiment of the present invention; [Figure 2] 1 is an exploded perspective view of an inspection socket according to a first embodiment of the present invention; [Figure 3] 1 is a perspective view of a probe support block according to a first embodiment of the present invention, as viewed from below. FIG. [Figure 4] FIG. 2 is a cross-sectional view taken along line AA in FIG. [Figure 5] 10 is a graph showing impedance characteristics depending on the height of a tunnel. [Figure 6] 10 is a graph showing insertion loss characteristics depending on the height of the tunnel. [Figure 7] 10 is a graph showing return loss characteristics depending on the height of the tunnel. [Figure 8] 1 is a graph showing a comparison of crosstalk characteristics between the test socket of the present invention and a test socket of the prior art; [Figure 9] FIG. 10 is a perspective view of a probe support block according to a second embodiment of the present invention, as viewed from below. [Figure 10] FIG. 10 is a perspective view of a probe support block according to a third embodiment of the present invention, as viewed from below. DETAILED DESCRIPTION OF THE INVENTION

[0014] Various embodiments of the present invention will now be described with reference to the accompanying drawings. However, it should be understood that this is not intended to limit the present invention to a specific embodiment, but rather includes various modifications, equivalents, and / or alternatives of the embodiments of the present invention. In describing the drawings, similar elements may be designated by similar reference numerals. In the drawings, the same reference numerals or symbols indicate elements performing substantially the same functions, and the size of each element in the drawings may be exaggerated for clarity and convenience. In describing the present invention, if it is determined that a detailed description of known technology or configurations related to the present invention may obscure the gist of the present invention, such detailed description will be omitted.

[0015] In this document, the terms "have," "may have," "include," or "may include" indicate the presence of a given feature (e.g., a value, function, operation, or component such as a part) and do not exclude the presence of additional features.

[0016] In this document, phrases such as "A or B," "at least one of A and / or B," or "one or more of A and / or B" may include all possible combinations of the items listed together. For example, "A or B," "at least one of A and B," or "at least one of A or B" can refer to any of the following: (1) including only A, (2) including only B, or (3) including both A and B.

[0017] In the embodiments of the present invention, terms including ordinal numbers such as first, second, etc. are used only to distinguish one component from another, and singular expressions include plural expressions unless otherwise specified in the context.

[0018] Furthermore, in the embodiments of the present invention, terms such as "upper," "lower," "left side," "right side," "inner," "outer," "inner surface," "outer surface," "front," and "rear" are defined based on the drawings, and do not limit the shape or position of each component.

[0019] The phrase "configured to" used in this document may be translated, depending on the context, as, for example, "suitable for," "having the capacity to," "designed to," "adapted to," "made to," or "capable of." The term "configured to" does not necessarily mean "specifically designed to" in terms of hardware. Instead, in some contexts, the phrase "device configured to" can mean that the device, together with other devices or components, is "capable of."

[0020] FIG. 1 is a perspective view of an inspection socket 1 according to a first embodiment of the present invention, FIG. 2 is an exploded perspective view of the inspection socket 1 according to the first embodiment of the present invention, FIG. 3 is a perspective view of a probe support block 20 according to the first embodiment of the present invention as seen from below, and FIG. 4 is a cross-sectional view taken along line AA in FIG.

[0021] 1 to 4, the test socket 1 includes at least one signal probe 11, at least one ground probe 12, a probe support block 20, and a test circuit board 30. As shown in FIG.

[0022] The signal probe 11 is supported in a non-contact manner by insulating supports 23 and 24 within the probe support block 20. The signal probe 11 transmits a test signal from a second terminal 31 of the test circuit board 30 to a first terminal (not shown) of a device under test, such as a semiconductor. One end of the signal probe 11 contacts the first terminal (not shown) of the device under test, such as a semiconductor, and the other end (bottom end) contacts the second terminal 31 of the test circuit board 30. The signal probe 11 may include a conductive cylindrical barrel 11a, a first plunger 11b partially inserted into one end of the barrel 11a, a second plunger 11c partially inserted into the other end of the barrel 11a, and a spring 11d provided between the first plunger 11b and the second plunger 11c within the barrel 11a to provide elastic force. At least one of the first plunger 11b and the second plunger 11c can slide within the barrel 11a to compress and restore the spring 11d. The signal probe 11 is not limited to the above-mentioned structure, and various types of probes may be applied.

[0023] The ground probe 12 is accommodated and supported in contact with the probe support block 20, setting the probe support block 20 at ground potential. Both ends of the ground probe 12 may contact the ground terminal of the device under test and the ground terminal of the test circuit board 30. The ground probe 12 may include a conductive cylindrical barrel 12a, a first plunger 12b partially inserted into one end of the barrel 12a, a second plunger 12c partially inserted into the other end of the barrel 12a, and a spring 12d provided between the first plunger 12b and the second plunger 12c within the barrel 12a to provide elastic force. At least one of the first plunger 12b and the second plunger 12c may slide within the barrel 12a to compress and restore the spring 12d. The signal probe 12 is not limited to the above-described structure, and various types of probes may be used.

[0024] The probe support block 20 may be made of a conductive material, such as brass, and has a bottom surface placed on the test circuit board 30. The probe support block 20 can accommodate and support at least one signal probe 11 in a non-contact state and at least one ground probe 12 in a contact state.

[0025] The probe support block 20 may include first and second insulating supports 23, 24 for supporting the signal probes 11 in a non-contact manner. The first insulating support 23 may have a shape that surrounds the entire probe accommodating hole that accommodates the signal probe 11. The second insulating support 24 may have a shape that surrounds only both ends of the signal probe 11. The probe support block 20 can support all of the signal probes 11 by either the first insulating support 23 or the second insulating support 24.

[0026] Referring to FIG. 3, the probe support block 20 includes a tunnel 21 recessed from the bottom along a signal line 32 for transmitting a test signal to a second terminal 31 of the test circuit board 30 .

[0027] The tunnel 21 may have a square cross section with an open bottom.

[0028] The tunnel 21 preferably has a height of 100 μm or more.

[0029] The tunnel 21 preferably has a height that does not expose the barrel 11a of the signal probe 11. This is because if the barrel 11a is exposed from the tunnel 21, it will adversely affect the impedance characteristics of the signal probe 11.

[0030] The tunnel 21 preferably has a height smaller than the length of the insulating support 24 that supports the other end of the signal probe 11. This is because if the insulating support 24 is exposed from the tunnel 21, the fixing force of the insulating support 24 may be weakened.

[0031] It is preferable that the tunnel 21 has a width greater than that of the signal line 32 of the test circuit board 30. If the width of the tunnel 21 is narrower than that of the signal line 32, it will be detrimental to the impedance characteristics of the signal line 32.

[0032] Hereinafter, the impedance characteristics, insertion loss characteristics, and return loss characteristics depending on the height of the tunnel 21 will be described with reference to FIGS.

[0033] FIG. 5 is a graph showing impedance characteristics depending on the height of the tunnel 21.

[0034] 5, the height of tunnel 21 was set to 0 μm, 50 μm, 100 μm, 150 μm, 200 μm, 250 μm, and 300 μm, and the impedance was measured at 59 ps. The results were 42.7 Ω at 0 μm, 45.1 Ω at 50 μm, 46.1 Ω at 100 μm, 46.6 Ω at 150 μm, 46.8 Ω at 200 μm, 47.2 Ω at 250 μm, and 47.4 Ω at 300 μm. Therefore, excellent impedance characteristics are achieved when the height of tunnel 21 is at least 100 μm or greater.

[0035] FIG. 6 is a graph showing the insertion loss characteristics depending on the height of the tunnel 21.

[0036] 6, when the height of tunnel 21 was set to 0 μm, 50 μm, 100 μm, 150 μm, 200 μm, 250 μm, and 300 μm, and the frequency (GHz) was measured at an insertion loss of -1.0 dB, the results were 17.1 GHz at 0 μm, 44.3 GHz at 50 μm, 49.7 GHz at 100 μm, 52.2 GHz at 150 μm, 52.5 GHz at 200 μm, 53.1 GHz at 250 μm, and 52.1 GHz at 300 μm. Therefore, when the height 21 of tunnel 21 is at least 100 μm or more, the insertion loss characteristics are excellent.

[0037] FIG. 7 is a graph showing the return loss characteristics depending on the height of the tunnel 21.

[0038] 7, the height of tunnel 21 was set to 0 μm, 50 μm, 100 μm, 150 μm, 200 μm, 250 μm, and 300 μm, and the frequency (GHz) was measured at a return loss of -10.0 dB. The results were 11.3 GHz at 0 μm, 43.7 GHz at 50 μm, 49.2 GHz at 100 μm, 51.5 GHz at 150 μm, 52.2 GHz at 200 μm, 53.1 GHz at 250 μm, and 51.5 GHz at 300 μm. Therefore, excellent return loss characteristics are achieved when the height of tunnel 21 is at least 100 μm or more.

[0039] FIG. 8 is a graph comparing the crosstalk characteristics of the test socket of the present invention and the test socket of the prior art.

[0040] 8, the crosstalk between the signal lines 32 in the prior art (tunnel height 0 μm) is −41.89 dB at 20 GHz, while the crosstalk between the signal lines 32 in the present invention (tunnel height 150 μm) is −59.55 dB at 20 GHz. The tunnel 21 prevents short circuits between the bottom surface of the conductive probe support block 20 and the signal lines 32, eliminating the need for an insulating film PI disposed on the signal lines 32. Therefore, the test socket 1 according to the embodiment of the present invention can prevent crosstalk between the signal lines 32.

[0041] FIG. 9 is a perspective view of a probe support block 20 according to a second embodiment of the present invention, seen from below.

[0042] 9, the tunnel 21 of the probe support block 20 may be at least partially filled with an insulating member 25. The insulating member 25 can prevent dust or foreign matter from entering through the tunnel 21 from the outside of the probe support block 20.

[0043] FIG. 10 is a perspective view of a probe support block 20 according to a third embodiment of the present invention, seen from below.

[0044] 10, the probe support block 20 may include an arch-shaped tunnel 21a instead of a square cross-sectional shape with an open bottom. Such an arch-shaped tunnel 21a allows the impedance of the signal line 32 to be maintained constant by keeping the distance from the signal line 32 to the conductive probe support block constant.

[0045] While preferred embodiments of the present invention have been illustrated and described above, the present invention is not limited to the specific embodiments described above, and it goes without saying that various modifications can be made by those skilled in the art to which the invention pertains without departing from the gist of the present invention as claimed in the claims, and these modified embodiments should not be understood separately from the technical ideas and perspectives of the present invention. [Explanation of symbols]

[0046] 1: Test socket 11: Signal probe 12: Ground probe 20: Probe support block 21, 21a: Tunnel 23, 24: Insulating support 25: Insulating member 30: Inspection circuit board 31: Second terminal 32: Signal line

Claims

1. A test socket for transmitting a test signal between a first terminal of a device under test and a second terminal of a test circuit board, at least one signal probe, one end of which contacts a first terminal of the device under test and the other end of which contacts a second terminal of the test circuit board; a conductive probe support block having a bottom surface placed on the test circuit board, the probe support block supporting the at least one signal probe without contact, and a tunnel recessed from the bottom surface along a signal line transmitting a test signal to a second terminal of the test circuit board.

2. The test socket of claim 1 , wherein the probe support block includes an insulating member at least partially filling the tunnel.

3. The test socket of claim 1 , wherein the tunnel has a height of 100 μm or greater.

4. the signal probe includes a barrel, a first plunger partially inserted into one end of the barrel, and a second plunger partially inserted into the other end of the barrel; The test socket of claim 1 , wherein the barrel is not exposed from the tunnel.

5. the signal probe includes a barrel, a first plunger partially inserted into one end of the barrel, and a second plunger partially inserted into the other end of the barrel; the probe support block includes an insulating support that supports the other end of the signal probe; 2. The test socket of claim 1, wherein the tunnel has a height that is less than a length of the insulating support relative to a longitudinal direction of the signal probe.

6. The test socket of claim 1 , wherein the width of the tunnel is greater than the width of the signal line.

7. The test socket of claim 1 , wherein the tunnel comprises an arched or polygonal tunnel.

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