Carrier with anti-rotation function

Abstract

The carrier includes a carrier body, fingers attached to the carrier body, and an anti-rotation component attached to the carrier body, the fingers configured to support the process kit ring, and the anti-rotation component positioned adjacent a flat inner surface of the process kit ring and configured to prevent rotation of the process kit ring.

Description

[Technical Field]

[0001] FIELD Embodiments of the present disclosure relate to an apparatus and method for transporting content, and more particularly to a carrier for transporting content, such as a process kit ring, in a substrate processing system.

[0002] Substrate processing and other electronic processes often use systems with robotic arms to transfer substrates between chambers.

[0003] The following is a simplified summary of the disclosure in order to provide a basic understanding of some aspects of the disclosure. This summary is not an exhaustive overview of the disclosure. It is not intended to identify key or critical elements of the disclosure, nor is it intended to delineate the scope or claims of particular embodiments of the disclosure. Its sole purpose is to present some concepts of the disclosure in a simplified form as a prelude to the more detailed description that is presented later.

[0004] In one aspect of the present disclosure, a carrier includes a carrier body, fingers attached to the carrier body, and an anti-rotation component attached to the carrier body, the fingers configured to support a process kit ring, and the anti-rotation component positioned adjacent a flat inner surface of the process kit ring and configured to prevent rotation of the process kit ring.

[0005] In another aspect of the present disclosure, an anti-rotation component is provided on a carrier. The anti-rotation component includes a mounting portion defining openings. The mounting portion is configured to receive a corresponding fastener through each opening to mount the mounting portion to a carrier body of the carrier. The anti-rotation component further includes one or more protrusions extending from the mounting portion. The one or more protrusions are configured to be positioned adjacent to a flat inner surface of a process kit ring disposed on the carrier and to prevent rotation of the process kit ring.

[0006] In another aspect of the present disclosure, a carrier includes fingers configured to support a process kit ring. The carrier further includes an anti-rotation component configured to prevent rotation of the process kit ring. The anti-rotation component includes a first protrusion configured to be positioned on a first side of the flat inner surface of the process kit ring adjacent to a first portion of the curved inner surface of the process kit ring. The anti-rotation component further includes a second protrusion configured to be positioned on a second side of the flat inner surface adjacent to a second portion of the curved inner surface of the process kit ring. [Brief explanation of the drawings]

[0007] The present disclosure is illustrated by way of example, and not by way of limitation, in the accompanying drawings, in which like reference numerals indicate similar elements. It should be noted that in the present disclosure, different references to an embodiment do not necessarily refer to the same embodiment, and such references mean at least one embodiment. [Figure 1] 1 illustrates a processing system in accordance with certain embodiments. [Figure 2A] ~ [Figure 2C] 1 illustrates a diagram of a carrier according to certain embodiments. [Figure 3A] ~ [Figure 3C] 1 illustrates a diagram of an anti-rotation component in accordance with certain embodiments. [Figure 4A] ~ [Figure 4B] 1 illustrates a diagram of a carrier supporting a process kit ring, in accordance with certain embodiments. [Figure 5] 1 illustrates a carrier supporting a process kit ring, according to certain embodiments. Detailed Description of the Embodiments

[0008] The present invention relates to a carrier with anti-rotation capabilities (eg, a semiconductor process kit carrier with features that prevent rotation during transport).

[0009] Manufacturing systems are used to produce products. For example, substrate processing systems are used to process and manufacture finished substrates. Robots are used to move objects to and from and within the substrate processing systems. Objects include substrates, process kit rings, etc. Objects must be properly positioned (e.g., properly aligned) within the substrate processing systems. For example, process kit rings must be positioned in a specific orientation within a processing chamber. In conventional systems, objects can become imprecisely positioned (e.g., rotated or misaligned) during transfer to, from, or within the substrate processing system. To correct the position (e.g., rotation or alignment) of an object, devices such as aligner devices and local center finder (LCF) devices are used. These devices can only correct a threshold amount of misalignment. Traditionally, the amount of misalignment (e.g., rotation or misalignment) of an object (e.g., as a result of transfer) can exceed the threshold amount of correction these devices can perform. Improperly placed objects can result in uneven substrate processing, component damage, opening of the substrate processing system and the associated recommissioning process, reduced throughput, reduced substrate quality, increased user time, and increased energy consumption.

[0010] The devices, systems, and methods disclosed herein provide a carrier with anti-rotation features.

[0011] The carrier includes a carrier body, fingers attached to the carrier body, and an anti-rotation component attached to the carrier body. The fingers are configured to support the process kit ring (e.g., a lower surface of the process kit ring is disposed on an upper surface of the fingers). The anti-rotation component (e.g., an anti-rotation feature) is disposed adjacent to a flat inner surface of the process kit ring and configured to prevent rotation of the process kit ring.

[0012] The devices, systems, and methods disclosed herein have significant advantages over conventional solutions. The disclosed carriers prevent rotation of objects placed on the carrier, thereby allowing objects to be positioned more accurately than conventional solutions. This results in improved substrate processing uniformity, reduced damage to components, fewer openings and restarts of the substrate processing system, increased throughput, improved substrate quality, reduced user time, reduced power consumption, etc.

[0013] Although portions of this specification refer to process kit rings, this specification is applicable to other types of components (e.g., other types of chamber components in addition to process kit rings, such as edge rings, showerheads, masks, mask handlers, half rings, etc.) Although portions of this specification refer to substrate processing systems, this specification is applicable to other types of systems.

[0014] FIG. 1 illustrates a processing system 100 (e.g., a substrate processing system, a semiconductor manufacturing system, etc.) in accordance with certain embodiments. The processing system 100 includes a factory interface 101 and load ports 128 (e.g., load ports 128A-D). In some embodiments, the load ports 128A-D are directly attached (e.g., sealed) to the factory interface 101. An enclosure system 130 (e.g., a cassette, a front-opening unified pod (FOUP), a process kit enclosure system, etc.) is configured to removably couple (e.g., dock) to the load ports 128A-D. Referring to FIG. 1, enclosure system 130A is coupled to load port 128A, enclosure system 130B is coupled to load port 128B, enclosure system 130C is coupled to load port 128C, and enclosure system 130D is coupled to load port 128D. In some embodiments, one or more enclosure systems 130 are coupled to the load ports 128 to transport wafers and / or other substrates into and out of the processing system 100. Each enclosure system 130 is sealed to its respective load port 128. In some embodiments, a first enclosure system 130A is docked to the load port 128A (e.g., to replace a used process kit ring). Once such an operation is performed, the first enclosure system 130A is undocked from the load port 128A, and a second enclosure system 130 (e.g., a FOUP containing wafers) is docked to the same load port 128A. In some embodiments, a carrier (e.g., including an anti-rotation component attached to the carrier body) is used to transport contents between the enclosure system 130 and other parts of the processing system 100.

[0015] In some embodiments, the load port 128 includes a front interface that forms a vertical opening (or a substantially vertical opening). Additionally, the load port 128 includes a horizontal surface for supporting an enclosure system 130 (e.g., a cassette, a process kit enclosure system, etc.). Each enclosure system 130 (e.g., a wafer FOUP, a process kit enclosure system, etc.) has a front interface that forms a vertical opening. The front interface of the enclosure system 130 is sized to interface (e.g., seal) with the front interface of the load port 128 (e.g., the vertical opening of the enclosure system 130 is approximately the same size as the vertical opening of the load port 128). The enclosure system 130 is positioned on the horizontal surface of the load port 128, and the vertical opening of the enclosure system 130 is aligned with the vertical opening of the load port 128. The front interface of the enclosure system 130 is interconnected (e.g., clamped, fastened, sealed, etc.) with the front interface of the load port 128. The bottom plate (e.g., base plate) of the enclosure system 130 has features that engage with the horizontal surfaces of the load port 128 (e.g., load features such as recesses or receptacles that engage with kinematic pin features of the load port, load port features for pin clearance, and / or enclosure system docking tray latch clamp features, etc.). The same load port 128 can be used for different types of enclosure systems 130 (e.g., process kit enclosure systems, cassettes containing wafers, etc.).

[0016] In some embodiments, enclosure system 130 (e.g., a process kit enclosure system) contains one or more items of contents 110 (e.g., one or more process kit rings, empty process kit ring carriers, process kit rings positioned on process kit ring carriers, placement verification wafers, components of processing system 100, etc.). In some examples, enclosure system 130 is connected to factory interface 101 (e.g., via load port 128) to enable automatic transfer of process kit rings on process kit ring carriers to processing system 100 for replacement of used process kit rings.

[0017] Additionally, in some embodiments, the processing system 100 includes first vacuum ports 103A, 103B connecting the factory interface 101 to each of the degassing chambers 104A, 104B. Second vacuum ports 105A, 105B are connected to each of the degassing chambers 104A, 104B and are disposed between the degassing chambers 104A, 104B and the transfer chamber 106 to facilitate transfer of wafers and contents 110 (e.g., process kit rings) to the transfer chamber 106. In some embodiments, the processing system 100 includes and / or uses one or more degassing chambers 104 and a corresponding number of vacuum ports 103, 105 (e.g., the processing system 100 includes a single degassing chamber 104, a single first vacuum port 103, and a single second vacuum port 105). The transfer chamber 106 includes a plurality of processing chambers 107 (e.g., four processing chambers 107, six processing chambers 107, etc.) arranged around and coupled to the transfer chamber 106. The processing chambers 107 are coupled to the transfer chamber 106 through respective ports 108, such as slit valves. In some embodiments, the factory interface 101 is at high pressure (e.g., atmospheric pressure) and the transfer chamber 106 is at low pressure (e.g., vacuum). Each degassing chamber 104 (e.g., load lock, pressure chamber) has a first door (e.g., first vacuum port 103) that seals the degassing chamber 104 from the factory interface 101 and a second door (e.g., second vacuum port 105) that seals the degassing chamber 104 from the transfer chamber 106. While the first door is open and the second door is closed, the contents are transferred from the factory interface 101 to the degassing chamber 104, the first door is closed and the pressure in the degassing chamber 104 is reduced to match that of the transfer chamber 106, and the second door is opened and the contents are transferred from the degassing chamber 104. A local centering (LCF) device is used to align the contents in the transfer chamber 106 (e.g., before entering the processing chamber 107, after exiting the processing chamber 107).

[0018] In some embodiments, the processing chamber 107 includes one or more of an etch chamber, a deposition chamber (including atomic layer deposition, chemical vapor deposition, physical vapor deposition, or plasma-enhanced versions thereof), an anneal chamber, or the like.

[0019] The factory interface 101 includes a factory interface robot 111. The factory interface robot 111 includes a robot arm, such as a Selective Compliance Assembly Robot Arm (SCARA) robot. Examples of SCARA robots include a two-link SCARA robot, a three-link SCARA robot, a four-link SCARA robot, etc. The factory interface robot 111 includes an end effector at the end of the robot arm. The end effector is configured to pick up and handle specific objects, such as wafers. Alternatively or alternatively, the end effector is configured to handle objects, such as carriers or process kit rings (edge ​​rings). The robot arm includes one or more links or members (e.g., wrist members, upper arm members, forearm members, etc.) configured to move to move the end effector in different directions or to different positions.

[0020] The factory interface robot 111 is configured to transfer objects between the enclosure system 130 (e.g., cassettes, FOUPs) and the degassing chambers 104A, 104B (or load ports). While conventional systems involve opening (e.g., disassembling, breaking seals, contaminating) a processing system (e.g., factory interface, transfer chamber, processing chamber) to exchange different types of content, the processing system 100 is configured to facilitate content transfer and exchange without requiring an operator to open (e.g., disassembling, breaking seals, contaminating) the processing system 100. Thus, in some embodiments, a sealed environment is maintained, including the interior volumes of the enclosure system 130 and the factory interface 101, during content exchange (e.g., via a carrier including anti-rotation components).

[0021] The transfer chamber 106 includes a transfer chamber robot 112. The transfer chamber robot 112 includes a robot arm having an end effector at the end of the robot arm. The end effector is configured to handle a particular object, such as a wafer. In some embodiments, the transfer chamber robot 112 is a SCARA robot, but in some embodiments, the transfer chamber robot 112 has fewer links and / or degrees of freedom than the factory interface robot 111.

[0022] Controller 109 controls various aspects of processing system 100. Controller 109 may be and / or include a computing device such as a personal computer, a server computer, a programmable logic controller (PLC), a microcontroller, etc. Controller 109 includes one or more processing devices, which in some embodiments are general-purpose processing devices such as a microprocessor, a central processing unit, etc. More specifically, in some embodiments, the processing devices are complex instruction set computing (CISC) microprocessors, reduced instruction set computing (RISC) microprocessors, very long instruction word (VLIW) microprocessors, or processors that execute other instruction sets or combinations of instruction sets. In some embodiments, the processing devices are one or more special-purpose processing devices such as an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a digital signal processor (DSP), a network processor, etc. In some embodiments, controller 109 includes data storage (e.g., one or more disk drives and / or solid-state drives), main memory, static memory, a network interface, and / or other components. In some embodiments, the controller 109 executes instructions to perform any one or more of the methods or processes described herein. The instructions are stored in a computer-readable storage medium, including one or more of a main memory, a static memory, a secondary storage device, and / or a processing device (during instruction execution). In some embodiments, the controller 109 receives signals from and sends controls to the factory interface robot 111 and the wafer transfer chamber robot 112.

[0023] FIG. 1 schematically illustrates the transfer of contents 110 (e.g., a carrier supporting a process kit ring) to a processing chamber 107. According to one aspect of the present disclosure, the contents 110 are removed from the enclosure system 130 via a factory interface robot 111 disposed in a factory interface 101. The factory interface robot 111 transfers the contents 110 to a respective degassing chamber 104a, 104b via one of the first vacuum ports 103a, 103b. A transfer chamber robot 112 disposed in a transfer chamber 106 removes the contents 110 from one of the degassing chambers 104a, 104b via a second vacuum port 105a or 105b. The transfer chamber robot 112 moves the contents 110 to the transfer chamber 106, where the contents 110 are transferred to a processing chamber 107 via a corresponding port 108. Although not shown in FIG. 1 for clarity, the transfer of contents 110 may include the transfer of process kit rings placed on process kit ring carriers, the transfer of empty process kit ring carriers, the transfer of placement verification wafers, etc.

[0024] 1 illustrates one example of the transfer of contents 110, but other examples are contemplated. In some examples, it is contemplated that the enclosure system 130 is coupled to the transfer chamber 106 (e.g., via a load port attached to the transfer chamber 106). From the transfer chamber 106, the contents 110 are loaded into the processing chamber 107 by the transfer chamber robot 112. Furthermore, in some embodiments, the contents 110 are loaded onto a substrate support pedestal (SSP). In some embodiments, an additional SSP is positioned opposite the illustrated SSP and in communication with the factory interface 101. The processed contents 110 (e.g., used process kit rings) are removed from the processing system 100 in a manner reverse to that described herein. When multiple enclosure systems 130 or a combination of enclosure systems 130 and SSPs are utilized, in some embodiments, one SSP or enclosure system 130 is used for unprocessed contents 110 (e.g., new process kit rings) and another SSP or enclosure system 130 is used to receive processed contents 110 (e.g., used process kit rings).

[0025] The processing system 100 includes a chamber, such as a factory interface 101 (e.g., an equipment front-end module (EFEM)), and adjacent chambers adjacent to the factory interface 101 (e.g., a load port 128, an enclosure system 130, a degassing chamber 104 of an SSP, a load lock, etc.). One or more chambers are sealed (e.g., each chamber is hermetically sealed). The adjacent chambers are sealed to the factory interface 101. In some embodiments, one or more chambers (e.g., the factory interface 101 and / or adjacent chambers) are supplied with an inert gas (e.g., one or more of nitrogen, argon, neon, helium, krypton, or xenon) to provide one or more inert environments. In some examples, the factory interface 101 is an inert EFEM that maintains an inert environment (e.g., an inert EFEM mini-environment) within the factory interface 101, and a user does not need to enter the factory interface 101 (e.g., the processing system 100 is configured so that manual access within the factory interface 101 is not required).

[0026] In some embodiments, a gas flow (e.g., inert gas, nitrogen) is provided to one or more chambers (e.g., factory interface 101) of processing system 100. In some embodiments, the gas flow is greater than a leakage rate through one or more chambers to maintain a positive pressure in the one or more chambers. In some embodiments, the inert gas in factory interface 101 is recirculated. In some embodiments, a portion of the inert gas is exhausted. In some embodiments, a gas flow rate of non-recirculated gas into factory interface 101 is greater than the exhaust gas flow rate and the gas leakage rate to maintain a positive inert gas pressure in factory interface 101. In some embodiments, factory interface 101 is coupled to one or more valves and / or pumps to provide a gas flow rate to and from factory interface 101. A processing device (e.g., controller 109) controls the gas flow rate to and from factory interface 101. In some embodiments, the processing device receives sensor data from one or more sensors (e.g., oxygen sensors, humidity sensors, motion sensors, door operation sensors, temperature sensors, pressure sensors, etc.) and determines the flow rate of inert gas to and / or from the factory interface 101 based on the sensor data.

[0027] The enclosure system 130 allows for the transport and exchange (e.g., via carriers that include anti-rotation components) of different types of content 110 without opening the sealed environment within the factory interface 101 and adjacent chambers. When the enclosure system 130 is docked to the load port 128, it is sealed to the load port 128. The enclosure system 130 provides access to a purge port so that the interior of the enclosure system 130 can be purged before opening the enclosure system 130, minimizing disturbance to the inert environment within the factory interface 101.

[0028] 2A-C show views of a carrier 200, according to certain embodiments. FIG. 2A shows the carrier 200 supporting a process kit ring 250, according to certain embodiments. FIG. 2B shows the carrier 200 without the process kit ring 250, according to certain embodiments. FIG. 2C shows the carrier 200 without the fingers 220 and anti-rotation component 230.

[0029] The carrier 200 includes a carrier body 210 (e.g., substantially rigid), fingers 220, an anti-rotation component 230, and fasteners 240 (e.g., screws, bolts, rivets, etc.). The fingers 220 are attached to the carrier body 210 (e.g., each secured via a fastener 240). The fingers 220 are configured to support a process kit ring 250. In some embodiments, the carrier 200 includes at least three fingers 220. In some embodiments, the carrier 200 includes three fingers 220. Each finger 220 forms a lip, and the lower surface of the process kit ring 250 is disposed on the lip. In some embodiments, the fingers 220 are configured to horizontally align the process kit ring 250 with the carrier body 210.

[0030] An anti-rotation component 230 is attached to the carrier body 210 (e.g., secured via fasteners 240). The anti-rotation component 230 is configured to be positioned adjacent to a flat inner surface 252 of the process kit ring 250 to prevent rotation of the process kit ring 250. In some embodiments, the anti-rotation component 230 comprises a thermoplastic resin. In some embodiments, the anti-rotation component 230 comprises polybenzimidazole (PBI) fibers.

[0031] The carrier body 210 can have openings 212 (e.g., windows, slots, etc.) formed therein. In some embodiments, the openings 212 are used by tool automation (e.g., aligner devices, LCF devices) to ensure placement accuracy through the carrier 200 (e.g., to view objects on the other side of the carrier 200). In some embodiments, the openings 212 are used to reduce the mass of the carrier 200 (e.g., carrier body 210), such as to reduce the mass of the carrier 200, provide visibility through the carrier body 210, allow light or objects to pass through the carrier body 210, etc.

[0032] The process kit ring 250 may be circular (e.g., ring) having a substantially flat upper surface, a substantially flat lower surface, a curved outer surface, a curved inner surface, and a flat inner surface 252. The flat inner surface 252 can be used to position the process kit ring 250.

[0033] 2C , carrier body 210 can form openings 216 configured to receive fasteners 240. In some embodiments, openings 216 are threaded to removably receive fasteners 240. In some embodiments, fasteners 240 are threaded to be secured in threaded openings 216. In some embodiments, fasteners 240 are threaded to be secured to threaded fingers 220 and / or anti-rotation component 230. In some embodiments, each fastener 240 includes a first portion and a second portion (e.g., a bolt and nut, etc.) configured to be secured to one another, and fingers 220 and / or anti-rotation component 230 to be secured to carrier body 210.

[0034] Fingers 220 and / or anti-rotation component 230 are configured to be removably attached to carrier body 210 via fasteners 240 and openings 216. In some embodiments, each finger 220 and / or anti-rotation component 230 defines an opening, and fastener 240 is configured to be inserted into the opening in finger 220 and / or anti-rotation component 230 and opening 216 in carrier body 210, thereby removably attaching finger 220 and / or anti-rotation component 230 to carrier body 210.

[0035] In some embodiments, different sets of fingers 220 are used for different types of content. In some examples, the different types of content include new content and used content (e.g., a first set of fingers 220 secured to a carrier body 210 to transport used content and a second set of fingers 220 secured to the same carrier body 210 to transport new content). In some examples, the different types of content include content of different sizes and / or shapes (e.g., a first set of fingers 220 secured to a carrier body 210 to transport content of a first size and / or shape and a second set of fingers 220 secured to the same carrier body 210 to transport content of a different size and / or shape). In some examples, the different types of content include one or more of a process kit ring, a chamber component of a substrate processing system, a used chamber component of a substrate processing system, a showerhead, a component having a substantially circular perimeter (e.g., inner perimeter, outer perimeter), etc.

[0036] In some embodiments, different sets of fingers 220 are used for different conditions. In some embodiments, each finger 220 of a first set of fingers 220 includes a first material configured for a first condition, and each finger of a second set of fingers 220 includes a second material configured for a second condition different from the first condition. In some examples, the material of the fingers 220 includes one or more of polyethylene terephthalate (PET), a ceramic material, polytetrafluoroethylene (PTFE) (e.g., Teflon™), ultra-high molecular weight (UHMW) polyethylene, an absorbent material, a non-absorbent material, a coating material, a deformable material, an electrostatic dissipative material, and the like. In some embodiments, the fingers 220 have a particular conductivity (e.g., less than perfect conductivity, conductivity that allows for dissipation at a controlled rate, conductivity that prevents a conduction path for high arch discharges, conductivity that is greater than about 10 5 from about 10 9 In some examples, the different conditions include one or more of corrosive conditions, clean conditions, electrostatic conditions, a particular process (e.g., substrate fabrication process, atomic layer deposition, chemical vapor deposition, physical vapor deposition, plasma-enhanced versions thereof, etc.), a particular chemical (e.g., fluorine, acid, base, etc.), a particular temperature range (e.g., high temperature), a particular pressure range (e.g., high pressure), atmospheric pressure, vacuum pressure, etc.

[0037] In some embodiments, carrier 200 is a customized mechanical adapter that allows for automated handling of process kit rings moving through tools designed for wafer handling. Fingers 220 allow for maintenance of carrier 200 and allow for interchangeability with different finger materials depending on the needs of a particular process kit ring. Carrier 200 with interchangeable fingers 220 not only allows for the continued use of existing process kit rings, but also ensures future compatibility with process kit rings of various sizes and materials.

[0038] In some embodiments, different rigid bodies 210 are used for different contents and / or different conditions. In some embodiments, each carrier body 210 is made of a different type of material. In some examples, carrier body 210 is made of one or more of carbon fiber, aluminum, cast aluminum (e.g., MIC-6™), hard-anodized aluminum, ceramic material, titanium, etc. In some embodiments, carrier body 210 is made of the same or similar material as a robot blade (e.g., end effector). In some embodiments, carrier 200 has no bonded components (e.g., adhesive). In some embodiments, carrier 200 has no heat-fit parts. In some embodiments, all features of carrier 200 are mechanically engaged (e.g., via fasteners 240) or machined into carrier body 210.

[0039] In some embodiments, the carrier 200 includes pads (e.g., mushroom pads, perfluoroelastomer pads, Kalrez™ 8475 friction pads, 9 Kalrez mushroom pads, calibrated mushroom pads, pads integrated into the carrier body 210) for a non-slip interface (e.g., automation interface) with atmospheric robot end effectors (e.g., factory interface robot 111 of FIG. 1 ) and vacuum robot end effectors (e.g., transfer chamber robot 112 of FIG. 1 ). In some embodiments, these pads are used for a non-slip interface with one or more of an LCF device, an aligner device, etc. In some embodiments, the carrier 200 includes pads (e.g., aluminum pads, pads integrated into the carrier body 210) for positioning the carrier 200 within an enclosure system (e.g., enclosure system 130 of FIG. 1 , FOUP) and a load lock (e.g., degassing chamber 104 of FIG. 1 ).

[0040] In some embodiments, carrier body 210 has a substantially planar (e.g., substantially flat) underside. In some embodiments, the underside of carrier body 210 is substantially flat except for pads on the underside of carrier body 210. In some embodiments, carrier 200 (e.g., carrier body 210) does not have kinematic positioning features (e.g., no kinematic positioning features on the underside of carrier body 210). In some embodiments, carrier body 210, anti-rotation component 230, and / or fingers 220 have one or more coatings. In some examples, fingers 220 and / or anti-rotation component 230 have coatings configured for transport of content under particular conditions (e.g., compatible with particular chemicals and / or processes). In some embodiments, fingers 220 have one or more coatings that provide one or more coefficients of friction to allow content to align on the fingers. In some examples, the sidewalls of each finger 220 have a lower coefficient of friction than the first top surface of each finger, allowing content to slide down the sidewalls and stop at the first top surface. In some examples, the tops of the sidewalls of each finger 220 have a lower coefficient of friction than the bottoms of the sidewalls of each finger 220, allowing content to slide down the tops of each sidewall and slow down at the bottoms of each sidewall.

[0041] In some embodiments, the contour of carrier body 210 may differ from that shown in Figures 2A-C. Also, in some embodiments, the size, shape, quantity, etc. of openings 212 and / or openings 216 may differ from that shown in Figures 2A-C.

[0042] In some embodiments, the different fasteners 240 are one or more of different sizes, different shapes, different materials, etc. In some embodiments, the material of fasteners 240 includes one or more of aluminum, ceramic, stainless steel, electropolished (EP) stainless steel, etc.

[0043] In some embodiments, the fingers 220 have downwardly extending lips to support content. In some embodiments, the fingers 220 are positioned around the periphery of the carrier body 210 to support content with a circular periphery, such as a process kit ring or showerhead. In some embodiments, the fingers 220 are replaceable to support content with different peripheries. In some embodiments, the fingers 220 are attached to the carrier body 210 via slots that allow the position of the fingers 220 to be adjustable (e.g., radially from a central portion of the carrier body 210) to support content with different peripheries. In some embodiments, as the fingers 220 wear over time, the position of the fingers 220 is adjustable (e.g., radially from a central region 280 of the carrier body 210) to continue to support content with the same periphery. In some embodiments, when the fingers 220 wear out and can no longer continue to support content with the same periphery, the worn fingers 220 are replaced with new fingers 220.

[0044] Carrier 200 includes one or more lower surfaces (e.g., pads) configured to interface with an end effector of a robot arm. Carrier 200 (e.g., carrier body 210) includes one or more lower surfaces (e.g., central flat region 214) configured to interface with a vacuum chuck.

[0045] In some embodiments, carrier body 210 forms a protrusion (e.g., boss) around each opening 216. In some embodiments, the boss is a protruding feature on carrier body 210. In some embodiments, the protrusion is used to position fingers 220 on carrier body 210. In some embodiments, fingers 220 have recesses that match the protrusions. In some embodiments, the protrusions allow fingers 220 to be mounted in the correct orientation on carrier body 210.

[0046] In some embodiments, the carrier 200 is sized and shaped to provide one or more gaps between the process kit ring 250 and one or more portions of the periphery of the carrier 200. In some embodiments, the one or more gaps are used by an aligner device and / or an LCF device to align the carrier 200 and / or the process kit ring 250. In some examples, the one or more gaps allow a light beam to detect the flat inner surface 252 or other registration feature of the process kit ring 250. In some embodiments, the one or more gaps are used by lift pins to lift the process kit ring 250 from the carrier 200 (e.g., within a processing chamber). In some embodiments, the periphery of the carrier 200 is configured to interface with a shelf of an enclosure system (e.g., a FOUP) of a substrate processing system.

[0047] In some embodiments, carrier 200 is a semiconductor process kit carrier for preventing rotation during transport. Carrier 200 can have features (e.g., anti-rotation component 230) for preventing rotation (e.g., rotation of the process kit ring) during transport. Carrier 200 with anti-rotation component 230 can prevent process kit ring 250 from rotating relative to carrier 200 within a FOUP during transport within a facility. Anti-rotation component 230 can secure process kit ring 250 during transport.

[0048] Alignment of the process kit ring 250 within the processing chamber can be utilized for proper operation of the processing chamber. An aligner device can be used to correct small alignment errors (e.g., within a few degrees) of the process kit ring 250 on the carrier 200. The process kit ring 250 is precisely aligned on the carrier 200 relative to the robot end effector and hand-off station, and the aligner device can correct for small rotational misalignments between the process kit ring 250 and the carrier 200.

[0049] The protrusions (e.g., two fins) of the anti-rotation component 230 can contact the inner diameter of the process kit ring 250 on the side of a flat inner surface (e.g., a flat alignment feature) of the process kit ring 250. The protrusions (e.g., two fingers) can prevent the process kit ring 250 from rotating.

[0050] The anti-rotation component 230 aids in aligning the process kit ring with the carrier and can prevent rotation of the process kit ring relative to the carrier 200 during transport. The alignment of the process kit ring with the carrier can be within ±2.5°. The alignment of the process kit ring with the processing chamber can be within approximately ±0.6°.

[0051] The anti-rotation component 230 may be referred to as an anti-rotation piece (eg, made from PBI). In some embodiments, the carrier body 210 is made from aluminum and the anti-rotation component 230 is made from PBI.

[0052] The flat inner surface 252 of the process kit ring 250 may resemble a feature (e.g., a notch, a flat, etc.) on a substrate (e.g., a silicon wafer, a notch in the substrate), an electrostatic chuck (e.g., a flat in the electrostatic chuck), etc., used to align components or contents.

[0053] 3A-3C show diagrams of an anti-rotation component 330 (eg, anti-rotation component 230 of FIGS. 2A-2B), according to certain embodiments.

[0054] In some embodiments, the anti-rotation member includes a first protrusion and a second protrusion. The first protrusion can be configured to be positioned on a first side of the flat inner surface 252 proximate a first portion of the curved inner surface of the process kit ring 350 (e.g., process kit ring 250 in FIG. 2A , content 110 in FIG. 1 ). The second protrusion can be configured to be positioned on a second side of the flat inner surface 252 proximate a second portion of the curved inner surface of the process kit ring 250.

[0055] In some embodiments, the anti-rotation component 330 includes an outer surface configured to be positioned proximate to the curved inner surface of the process kit ring 350 and a lower surface configured to be positioned below the process kit ring 350 to block light between the curved inner and outer surfaces of the process kit ring 350.

[0056] In some embodiments, anti-rotation component 330 includes a lower surface that forms a recess configured to interface with a protrusion on an upper surface of carrier body 310 (eg, carrier body 210 of FIGS. 2A-C).

[0057] In some embodiments, the top surface of the carrier body 310 forms one or more protrusions located near a corresponding outer surface of the anti-rotation component 330 to prevent the anti-rotation component 330 from rotating relative to the carrier body 310.

[0058] In some embodiments, the anti-rotation component 330 maintains alignment between the process kit ring 350 and one or more of the carriers 300 (e.g., carrier 200 of FIGS. 2A-C) within approximately ±2.5 degrees, or between the process kit ring 350 and a processing chamber within approximately ±0.6 degrees.

[0059] In some embodiments, the anti-rotation component 330 is configured to be positioned near the flat inner surface of the process kit ring 350 without obstructing the flat inner surface 352 .

[0060] In some embodiments, the anti-rotation component 330 includes a mounting portion 334 forming an opening, the mounting portion 334 configured to receive a corresponding fastener 340 (e.g., fastener 240 in FIGS. 2A-B) through each of the openings to attach the mounting portion 334 to the carrier body 310 of the carrier 300. The anti-rotation component 330 can include one or more protrusions 332 extending from the mounting portion 334, the one or more protrusions 332 configured to be positioned proximate to a flat inner surface of a process kit ring 350 disposed on the carrier 300 and to prevent rotation of the process kit ring 350.

[0061] In some embodiments, the carrier 300 includes fingers configured to support the process kit ring 350. The carrier 300 may further include an anti-rotation component 330 configured to prevent rotation of the process kit ring 350. The anti-rotation component 330 may include a first protrusion and a second protrusion. The first protrusion may be configured to be positioned on a first side of the flat inner surface of the process kit ring 350 adjacent to a first portion of the curved inner surface of the process kit ring 350. The second protrusion may be configured to be positioned on a second side of the flat inner surface adjacent to a second portion of the curved inner surface of the process kit ring 350.

[0062] In some embodiments, at least one of the anti-rotation components 330 or fingers is integral with the carrier body 310 of the carrier 300 .

[0063] The carrier 300 may have a flat inner surface 352 that is visible (e.g., for scanning for alignment). The carrier 300 may limit rotation of the process kit ring 350 to approximately ±1 degree. Protrusions (e.g., side surfaces) on the top surface of the carrier body 310 may prevent rotation of the anti-rotation component 330. A portion of the anti-rotation component 330 may be configured to be positioned below the process kit ring 350 to block light (e.g., block light without contacting the process kit ring 350, block light in an aligner apparatus and / or LCF apparatus).

[0064] The carrier 300 can align the process kit ring 350 and the carrier 300 by ±1 degree (e.g., from the central axis of the carrier 300). The process kit ring 350 and the carrier 300 can be aligned on the same axis (e.g., an axis passing through the center of the anti-rotation component 330). The aligner device can rotate the process kit ring 350 and the carrier 300 about ±2.5 degrees along the same axis.

[0065] In some embodiments, the process kit ring 350 does not contact the anti-rotation component 330 (e.g., there is a space between the inner surface of the process kit ring and the outer surface of the anti-rotation component 330, and there is a space between the bottom surface of the process kit ring 350 and the top surface of the protrusion on the anti-rotation component 330).

[0066] As shown in FIG. 3C, the distal end of the anti-rotation component 330 can have a sloped outer surface that slopes toward the top surface on which the process kit ring 350 is positioned.

[0067] 4A-B show diagrams of a carrier 400 (e.g., one or more of carrier 200 of FIGS. 2A-C, carrier 300 of FIGS. 3A-C, etc.) supporting a process kit ring 450 (e.g., one or more of carrier 200 of FIGS. 2A-C, carrier 300 of FIGS. 3A-C, etc.), according to certain embodiments. Carrier 400 can have an anti-rotation component 430 that includes multiple parts (e.g., a first anti-rotation component 430 disposed on a first side of flat inner surface 452 and a second anti-rotation component 430 disposed on a second side of flat inner surface 452).

[0068] The carrier 400 may expose a flat inner surface 452 on the process kit ring 450 (eg, for scanning for alignment).

[0069] 5 illustrates a carrier 500 (e.g., one or more of carrier 200 of FIGS. 2A-C, carrier 300 of FIGS. 3A-C, carrier 400 of FIGS. 4A-B, etc.) supporting a process kit ring 550 (e.g., one or more of process kit ring 250 of FIG. 2A, process kit ring 350 of FIG. 3B, process kit ring 450 of FIGS. 4A-B, etc.) according to certain embodiments. Carrier 500 can include an anti-rotation component 530 positioned against a flat inner surface 552. Carrier 500 is easy to manufacture due to its basic configuration.

[0070] The foregoing description provides numerous specific details, such as examples of specific systems, components, methods, etc., to provide a thorough understanding of some embodiments of the present disclosure. However, it will be apparent to one skilled in the art that at least some embodiments of the present disclosure can be practiced without these specific details. In other instances, well-known components or methods are not described in detail or are presented in simple block diagram form to avoid unnecessarily obscuring the present disclosure. Thus, the specific details described are merely exemplary. A particular implementation may differ from these example details and still be considered to be within the scope of the present disclosure.

[0071] Throughout this specification, the phrase "one embodiment" or "embodiment" means that a particular feature, structure, or characteristic described in connection with that embodiment is included in at least one embodiment. Thus, the appearances of "one embodiment" or "embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the term "or" means an inclusive "or" rather than an exclusive "or." When the phrase "about" or "approximately" is used herein, it means that the stated nominal value is accurate to within ±10%.

[0072] Although the operations of the methods herein are shown and described in a particular order, the order of the operations of each method may be changed, certain operations may be performed in reverse order, and certain operations may be performed, at least in part, concurrently with other operations. In other embodiments, instructions or sub-operations of different operations are intermittent and / or interleaved.

[0073] As used herein, the terms "above," "below," "between," "disposed on," and "on" refer to the relative location of a layer of material or component with respect to another layer or component. For example, if a layer is disposed on, above, or below another layer, that layer may be in direct contact with the other layer or may have one or more intervening layers. Furthermore, a layer disposed between two layers may be in direct contact with the two layers or may have one or more intervening layers. Similarly, unless otherwise specified, a feature disposed between two features may be in direct contact with the adjacent feature or may have one or more intervening layers.

[0074] It should be understood that the above description is intended to be illustrative, and not limiting. Many other embodiments will be apparent to those skilled in the art upon reading and understanding the above description. Accordingly, the scope of the present disclosure should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.

Claims

1. A career A carrier body; a plurality of fingers attached to the carrier body and configured to support the process kit ring; A carrier comprising an anti-rotation component attached to the carrier body, the anti-rotation component positioned adjacent to a flat inner surface of the process kit ring and configured to prevent rotation of the process kit ring.

2. The anti-rotation component is a first projection configured to be positioned adjacent a first portion of the curved inner surface of the process kit ring on a first side of the flat inner surface; The carrier of claim 1 , further comprising a second protrusion configured to be positioned adjacent a second portion of the curved inner surface of the process kit ring on a second side of the flat inner surface.

3. The anti-rotation component is an outer surface configured to be positioned proximate to a curved inner surface of the process kit ring; The carrier of claim 1 , further comprising a lower surface configured to be positioned below the process kit ring and to block light between the curved inner and outer surfaces.

4. The carrier of claim 1 , wherein the anti-rotation component comprises a lower surface forming a recess configured to interface with a protrusion on the upper surface of the carrier body.

5. The carrier of claim 1 , wherein a top surface of the carrier body defines one or more protrusions disposed proximate a corresponding outer surface of the anti-rotation component to prevent rotation of the anti-rotation component relative to the carrier body.

6. The anti-rotation component is The process kit ring and carrier must be within ±2.5 degrees of tolerance, or 10. The carrier of claim 1, wherein the temperature difference between the process kit ring and the processing chamber maintains alignment within one or more of about ±0.6 degrees.

7. The carrier of claim 1 , wherein the plurality of fingers are configured to horizontally align the process kit ring with respect to the carrier body.

8. The carrier of claim 1 , wherein the anti-rotation component comprises a thermoplastic resin.

9. The carrier of claim 1 , wherein the anti-rotation component comprises polybenzimidazole (PBI) fibers.

10. The carrier of claim 1 , wherein the anti-rotation component is configured to be positioned near a flat inner surface of the process kit ring without obstructing the flat inner surface.

11. an anti-rotation component of a carrier, an attachment portion defining a plurality of openings, the attachment portion configured to receive a corresponding fastener through each of the plurality of openings to attach the attachment portion to a carrier body of the carrier; an anti-rotation component including one or more protrusions extending from a mounting portion, the protrusions configured to be positioned proximate to a flat inner surface of a process kit ring disposed on the carrier and to prevent rotation of the process kit ring;

12. The one or more protrusions may be a first projection configured to be positioned adjacent a first portion of the curved inner surface of the process kit ring on a first side of the flat inner surface; 12. The anti-rotation component of claim 11, comprising a second protrusion configured to be positioned proximate to a second portion of the curved inner surface of the process kit ring on a second side of the flat inner surface.

13. Each of the one or more protrusions comprises: an outer surface configured to be positioned proximate to a curved inner surface of the process kit ring; The anti-rotation component of claim 11 , comprising a lower surface positioned below the process kit ring and configured to block light between the curved inner and outer surfaces.

14. The anti-rotation component of claim 11 , wherein the anti-rotation component comprises a lower surface forming a recess configured to interface with a protrusion on an upper surface of the carrier body.

15. The process kit ring and carrier must be within ±2.5 degrees of tolerance, or The anti-rotation component of claim 11 , wherein the anti-rotation component maintains alignment with one or more of: a temperature difference between the process kit ring and the processing chamber within about ±0.6 degrees.

16. The anti-rotation component of claim 11 , comprising a thermoplastic resin.

17. The anti-rotation component of claim 11 , comprising polybenzimidazole (PBI) fibers.

18. The anti-rotation component of claim 11 configured to be positioned adjacent to a planar inner surface of a process kit ring without obstructing the planar inner surface.

19. A career a plurality of fingers configured to support a process kit ring; an anti-rotation component configured to prevent rotation of the process kit ring, a first protrusion configured to be positioned adjacent a first portion of the curved inner surface of the process kit ring on a first side of the flat inner surface of the process kit ring; A carrier comprising an anti-rotation component comprising a second protrusion configured to be positioned adjacent a second portion of the curved inner surface of the process kit ring on a second side of the flat inner surface.

20. 20. The carrier of claim 19, wherein at least one of the anti-rotation component or the plurality of fingers is integral with the carrier body of the carrier.

Images