Electronic component

Abstract

To provide an electronic component (thick film mold divider) in which bonding strength between a resistance element and a frame terminal is ensured.SOLUTION: The frame terminals 6 are bent so that the cross-sectional shape of the frame terminals 6 becomes an S-shape so that the separation distances L1, L2, and L3 in the horizontal direction between the uppermost portion and the lowermost portion of the end side surfaces 21a of the resistive elements 8 built in the mold divider 1 in the vertical direction and the portions of the surfaces of the frame terminals 6 corresponding to these uppermost and lowermost portions in the horizontal direction satisfy the relationship of L1> L2 ≥ L3. As a result, a space for filling the bonding material is formed between the frame terminals 6 and the end side surface 21a.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to high voltage electronic components. [Background technology]

[0002] Mold dividers are used as resistors for voltage divider circuits in automotive battery management systems such as BMS (Battery Management Systems). They realize voltage divider resistance consisting of multiple chip resistors in a single package, which reduces the mounting area and enables the creation of voltage divider resistance with higher accuracy.

[0003] As mold dividers enable voltage division in a single package as described above, depending on their specifications, high voltages of 500V or more, or even 1000V or more, may be applied between the electrodes, and insulation must be taken into consideration, so the chip resistor is covered with a resin mold.The electrodes of the chip resistor are then joined to a frame within the mold, allowing it to be connected to an external circuit.

[0004] Therefore, when we focus on the joining structure between the electrodes and the frame in a resin-molded electronic component, for example, the high-voltage electrical device described in Patent Document 1 has a structure in which a passive element (resistor) functioning as a voltage divider is molded in the internal region of a ribbed molded body that functions as a package, and the passive element is connected to a lead frame. The lead frame is formed with segments that sandwich the top edge of the passive element from above and below, and segments that sandwich the sides of the passive element from left and right. The entire passive element and part of the lead frame are covered with an exterior material.

[0005] The surface mount resistor described in Patent Document 2 has a structure that connects the side and bottom surfaces of the resistor to the lead terminals (frame), in consideration of the problem of the electrodes and terminals of the chip resistor coming loose when heated during mounting, etc. In other words, electrodes are formed across the end surfaces and bottom surface of the substrate of the chip resistor, and these electrodes are soldered to plate-shaped lead terminals, with the entire chip resistor and part of the lead terminals being covered with an exterior member.

[0006] On the other hand, Patent Document 3 discloses a configuration in which, in a multilayer capacitor as an electronic component, a portion of the lead terminal and the capacitor are covered with an exterior material, and a convex portion is provided on the opposing end face of the lead terminal to ensure electrical contact between the opposing end face and the terminal portion of the capacitor. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Special Publication No. 2018-522423 [Patent Document 2] Patent Publication No. 2021-141126 [Patent Document 3] Japanese Patent Application Laid-Open No. 2002-043166 DISCLOSURE OF THE INVENTION [Problem to be solved by the invention]

[0008] The joining structure between the electrode and the frame in the high-voltage electrical device described in Patent Document 1 mentioned above has the problem that, even though it can ensure the connection between the lead frame and the passive element (resistor), the processing of the lead frame (forming of the cut pieces) for this purpose is complicated and requires dimensional accuracy to match the resistor, which leads to an increase in the cost of the parts.

[0009] The resistor in Patent Document 2 has a structure in which the surface of the lead terminal (frame) and the surface of the electrode of the chip resistor are in surface contact, so when connecting the lead terminal and the electrode, the solder between them is pushed away and may not be thick enough to serve as a connecting member. Also, for solder connection to the resistor, the lead terminal is bent at a right angle to provide a flat portion and a vertical portion, but bending the lead terminal to provide such a right-angled portion is difficult, and there is a possibility that surface contact between the electrode of the chip resistor and the lead terminal may not be ensured.

[0010] The structure disclosed in Patent Document 3 can sandwich the multilayer capacitor by utilizing the elasticity of the lead terminals themselves. However, in this case, the convex portions provided on the opposing end faces of the lead terminals come into direct contact with the lead terminals, which applies pressure to the terminal portions of the capacitor, potentially damaging the capacitor.

[0011] Therefore, if the bonding structure between the electrodes and frame in the conventional electronic components described above is applied to an automotive BMS, the bonding strength between the chip component and the frame inside the mold may be insufficient, making it impossible to accurately divide the voltage using the voltage dividing resistor, which could result in the automotive battery being overcharged or not being charged at all.

[0012] The present invention has been made in consideration of the above-mentioned problems, and its purpose is to provide an electronic component such as a thick-film mold divider that ensures bonding strength between a resistor element (chip component) inside the mold and a frame terminal. [Means for solving the problem]

[0013] As one means for achieving the object and solving the above-mentioned problems, for example, the electronic component of the present invention has the following configuration: That is, the electronic component of the present invention includes a resistance element having electrodes formed on both ends of a plate-like substrate and a resistor formed between the electrodes, an exterior member that covers at least the entire resistance element, and a frame terminal having one end connected to the electrodes and the other end extended to the outside from the exterior member, wherein the frame terminal is bent into a predetermined shape so that the longitudinal distance between an end electrode located on an end face of the resistance element in the longitudinal direction and a portion of the frame terminal facing the end electrode is not uniform.

[0014] For example, the frame terminal is bent so that its cross section in the longitudinal direction has an S-shape. Furthermore, for example, the outer surface of the end electrode is taken as a reference plane, and line segments are drawn in the longitudinal direction from the top to the bottom of the resistance element in the thickness direction, starting from the reference plane, and the line segment that first abuts against the frame terminal is taken as L1, the longitudinal distance between the outer surface of the end electrode and the frame terminal at the bottom of the outer surface in the thickness direction is taken as L2, and the longitudinal distance between the outer surface and the frame terminal when the frame terminal is closest to the side electrode in the longitudinal direction is taken as L3, where the longitudinal distances satisfy the relationship L1 > L2 ≧ L3.

[0015] For example, the frame terminal is characterized in that the part is bent such that while being inclined at a predetermined angle with respect to the longitudinal direction, the cross-sectional shape in the longitudinal direction at this part is linear. Further, for example, taking the outer surface of the end face electrode as a reference plane, among the line segments drawn in the longitudinal direction starting from the reference plane in sequence from the upper part to the lower part in the thickness direction of the resistance element, the line segment that first hits the frame terminal indicates the separation distance L1 in the longitudinal direction between the outer surface and the frame terminal, the separation distance L2 in the longitudinal direction between the outer surface and the frame terminal at the lowermost part in the thickness direction of the outer surface of the end face electrode is taken as L2, and the separation distance L3 in the longitudinal direction between the outer surface and the frame terminal at a part located approximately in the middle between the uppermost and lowermost parts in the thickness direction of the end face electrode is taken as L3, then the separation distance satisfies the relationship L1 > L3 > L2.

[0016] For example, taking the separation distance L4 between the lower surface electrode located at the bottom surface of the end of the resistance element among the electrodes and the frame terminal when they are closest in the thickness direction of the resistance element, and the separation distance L5 between the lower surface electrode and the frame terminal when the lower surface electrode is farthest from the frame terminal in the thickness direction, then the separation distance satisfies the relationship L4 < L5. Further, for example, the space formed between the end face electrode and the lower surface electrode and the frame terminal having the separation distances L1 to L5 is taken as a bonding material reservoir for bonding the end face electrode and the lower surface electrode to the frame terminal.

[0017] Furthermore, for example, the resistance element is arranged at a position where the center of gravity of the resistance element in the longitudinal direction coincides with the center of gravity of the electronic component. Also, for example, with respect to the center of gravity of the electronic component in the longitudinal direction, the center of gravity of the resistance element is displaced toward one of the electrodes formed at both ends of the plate-like substrate to arrange the resistance element. For example, the exterior member is made of an insulating resin mold member and covers the entire resistance element and a part of the frame terminal.

[0018] Furthermore, the electronic component of the present invention is characterized in that it is a thick-film mold divider for high voltage, in which a first resistor is formed between a first electrode and a second electrode, and a second resistor is formed between the second electrode and a third electrode, among the electrodes formed at both ends of the plate-like substrate. [Effects of the Invention]

[0019] According to the present invention, the bonding strength between the resistive element (chip component) built into the mold divider and the frame terminal can be improved, and the function of the resistive element as a high-voltage dividing resistor (divider) can be maintained. [Brief explanation of the drawings]

[0020] [Figure 1] FIG. 1(a) is an external perspective view of a thick film mold divider according to a first embodiment of the present invention, viewed from a first angle, and FIG. 1(b) is an external perspective view of the thick film mold divider viewed from a second angle different from the first angle. [Figure 2] FIG. 2 is a perspective view of a mold divider according to a first example embodiment. [Figure 3] 3 is a cross-sectional view of the mold divider of FIG. 2 taken along the line AA'. FIG. [Figure 4] FIG. 4 is a detailed view of the area surrounded by the dashed line B in FIG. 3. [Figure 5] 10 is a diagram for explaining a method for defining a separation distance L1 between a reference plane and a first frame in the x-axis direction. FIG. [Figure 6] FIG. 10 is a cross-sectional view of a mold divider according to a second embodiment cut along its longitudinal direction. [Figure 7] FIG. 7 is a detailed view of the area surrounded by the dashed line C in FIG. 6. [Figure 8] Figure 8(a) shows a mold divider in which the center line of the mold divider in the x-axis direction is aligned with the center line of the resistor element, and Figure 8(b) shows a mold divider in which the center line of the resistor element is positioned offset toward the first frame from the center line of the mold divider. [Figure 9]10A and 10B are diagrams illustrating a method for disposing a resistive element by displacing it toward the first frame terminal side of the mold divider. DETAILED DESCRIPTION OF THE INVENTION

[0021] Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the following embodiment, a thick film mold divider will be described as an example of an electronic component, but the resistive element contained in the mold is not limited to a thick film divider. In addition to resistive elements, for example, varistor elements, capacitor elements, etc. can also be used.

[0022] <First embodiment> 1(a) and 1(b) are external perspective views of a thick film mold divider (hereinafter simply referred to as a mold divider) according to a first embodiment of the present invention, as viewed from different angles. Fig. 2 is a perspective view of the mold divider according to the first embodiment.

[0023] As shown in Figure 1(a) etc., the mold divider 1 of this embodiment is rectangular in plan view and has a structure in which an upper surface portion 2 having a predetermined thickness in the z-axis direction and a first protrusion portion 3, a second protrusion portion 4 and a third protrusion portion 5 extending vertically (in the z-axis direction) from the underside of the upper surface portion 2 and functioning as legs when the mold divider is mounted on a circuit board are formed.

[0024] The entire molded divider 1, including the upper surface portion 2, the first protrusion portion 3, the second protrusion portion 4, and the third protrusion portion 5, is covered with an exterior material 15 that is integrally molded with an insulating resin (mold resin) such as epoxy resin. At the center of the lower surface side in the z-axis direction of the upper surface portion 2, there is provided a housing portion 9 that houses a molded and sealed resistive element 8, such as a thick-film divider, a thin-film divider, or a thick-film / thin-film chip resistor. By incorporating such a resistive element 8, the molded divider 1 functions as a voltage-dividing resistor.

[0025] As shown in FIG. 1(a), a first electrode terminal (first frame terminal) 6 is formed on the first protrusion 3, and as shown in FIG. 1(b), a second electrode terminal (second frame terminal) 7a and a third electrode terminal (third frame terminal) 7b are formed on the second protrusion 4 in parallel in the y-axis direction.

[0026] That is, in the mold divider 1, a first frame terminal 6 is formed at one end of the resistive element 8 in the longitudinal direction (x-axis direction), and a second frame terminal 7a and a third frame terminal 7b are formed at the other end of the resistive element 8 in the longitudinal direction (x-axis direction).

[0027] 2, a first electrode 16 is formed at one longitudinal end of the resistor element 8, and a second electrode 17a and a third electrode 17b are formed at the other longitudinal end. A first resistor 31 is formed between the first electrode 16 and the second electrode 17a on the upper surface of the resistor element 8, and a second resistor 32 is formed between the second electrode 17a and the third electrode 17b, thereby forming a voltage-dividing resistor. A protective film (not shown) is present on the upper surface of the insulating substrate 13, covering the entire upper portions of the first resistor 31 and the second resistor 32 and parts of the first electrode 16, the second electrode 17a, and the third electrode 17b.

[0028] 4 and omitted in Fig. 2, end electrodes 20 provided at both longitudinal ends of insulating substrate 13 of resistor element 8 are formed corresponding to the first to third electrodes, respectively, with upper surface electrode 23 being a thick film formed by firing Ag-Pd paste or the like, end surface electrode 21 being a thin film formed by sputtering Ni-Cr, and lower surface electrode 25 being a thick film formed by firing Ag paste or the like. Furthermore, these upper surface electrode 23, end surface electrode 21, and lower surface electrode 25 are covered with a nickel plating layer and a tin plating layer.

[0029] As shown in Figure 2, inside the mold divider 1, one end of the first frame terminal 6 is connected via a bonding material (e.g., solder) to a first electrode 16 of the resistor element 8 accommodated in the accommodation portion 9, one end of the second frame terminal 7a is connected via a bonding material to a second electrode 17a of the resistor element 8, and one end of the third frame terminal 7b is connected via a bonding material to a third electrode 17b of the resistor element 8.

[0030] The first frame terminal 6 is formed by bending a flat plate-like member into a predetermined shape described later. The other end of the first frame terminal 6 extends in the x-axis direction along the lower surface side of the upper surface portion 2, is drawn out to the outside of the exterior material 15 at the point where it reaches the end face of the first protrusion 3 in the x-axis direction, and is then bent and arranged to reach the bottom of the first protrusion 3 while extending in the z-axis direction along the end face of the first protrusion 3 in the x-axis direction.

[0031] The second frame terminal 7a and the third frame terminal 7b are also bent into a predetermined shape, similar to the first frame terminal 6, and the other ends thereof, like the other end of the first frame terminal 6, extend in the x-axis direction along the underside of the upper surface portion 2, are pulled out to the outside of the outer casing material 15 when they reach the end face of the second protrusion portion 4 in the x-axis direction, and are then bent and arranged to reach the bottom of the second protrusion portion 4 while extending in the z-axis direction along the end face of the second protrusion portion 4 in the x-axis direction.

[0032] In the mold divider 1, the first protrusion 3, the second protrusion 4, and the third protrusion 5 not only function as legs when mounted on the circuit board as described above, but also form deep recesses between the first protrusion 3 and the third protrusion 5, and between the second protrusion 4 and the third protrusion 5, thereby contributing to ensuring a longer creepage distance between the frame terminals formed on the protrusions.

[0033] Next, the internal structure of the mold divider 1 will be described in detail. Fig. 3 is a cross-sectional view of the mold divider 1 of Fig. 2 taken along the line A-A'. Fig. 4 is a detailed view of the area surrounded by the dashed line B in Fig. 3, and is a diagram for explaining the positional relationship and joining mode between the resistance element 8 and the first frame terminal 6 in the mold divider 1.

[0034] In Fig. 4, the positional relationship and bonding mode between the second frame terminal 7a and the third frame terminal 7b and the resistor element 8 are similar to the positional relationship and bonding mode between the resistor element 8 and the first frame terminal 6, and therefore will not be illustrated or described here. Also, in Fig. 4, the protective film covering the first resistor 31 is not illustrated. The same applies to Figs. 5 and 7 described below.

[0035] As shown in Figure 4 and other figures, the first frame terminal 6 of the mold divider 1 has a cross-sectional shape that is bent in an S-shape. In the resistor element 8, the end electrode 20 is composed of the upper electrode 23, the end electrode 21, and the lower electrode 25, as described above, and the end electrode 21 and the first frame terminal 6 facing it are arranged a predetermined distance apart so that the distance between their surfaces is not uniform in the x-axis direction. "Not uniform" means that the distance between the end electrode 21 and the first frame terminal 6 varies depending on the opposing portion, or that they are not equally spaced apart.

[0036] Then, by placing a bonding material 27 (e.g., solder) in the space formed by separating the first frame terminal 6 from the end side surface 21a by a predetermined distance, the first frame terminal 6 and the resistive element 8 are electrically and mechanically connected.

[0037] As shown in FIG. 4, since the first frame terminal 6 has an S-shaped cross-sectional shape, the distance of the first frame terminal 6 from the end side surface 21a of the resistance element 8 varies depending on the part thereof. That is, when the outer surface of the end side surface 21a extending in the vertical direction (z-axis direction) is used as a reference plane, the first frame terminal 6 has an S-shaped cross-sectional shape in which the horizontal distance (separation distance) from the reference plane is not uniform. Therefore, if a plurality of line segments are drawn in the horizontal direction (x-axis direction) from the reference plane toward the first frame terminal 6, the lengths (separation distances) of the line segments when they hit the first frame terminal 6 are not uniform either.

[0038] More specifically, for example, as shown in FIG. 4, when a line segment drawn in the x-axis direction from the uppermost part in the z-axis direction of the end side surface 21a (the point where the reference plane and the upper surface 23a of the upper surface electrode 23 intersect) hits the first frame terminal 6, the length (separation distance) of the line segment is L1. When a line segment drawn in the x-axis direction from the lowermost part in the z-axis direction of the end side surface 21a (the point where the reference plane and the lower surface 25a of the lower surface electrode 25 intersect) hits the first frame terminal 6, the length (separation distance) of the line segment is L2. When the line segment drawn in the x-axis direction from the end side surface 21a is the shortest (the part where the first frame terminal 6 is closest to the end side surface 21a, for example, the intermediate part located approximately in the middle of the above-mentioned uppermost part and the lowermost part), and the line segment length (separation distance) is L3, the first frame terminal 6 is connected to the resistance element 8 via a bonding material 27 (for example, solder) while maintaining an S-shaped bent cross-sectional shape that satisfies the relationship of L1 > L2 ≥ L3 for the above-mentioned separation distances.

[0039] Also, when a line segment is drawn in the z-axis direction from the lower surface 25a of the lower surface electrode 25, if the shortest line segment length (the length (separation distance) of the line segment at the part where the lower surface electrode 25 is closest to the first frame terminal 6) among the line segments hitting the first frame terminal 6 is L4, and the longest line segment length (the length (separation distance) of the line segment at the part where the lower surface electrode 25 is farthest from the first frame terminal 6) among the line segments hitting the first frame terminal 6 is L5, the first frame terminal 6 has a cross-sectional shape that satisfies the relationship of L4 < L5 at the end bottom surface of the resistance element 8.

[0040] 5, depending on the bending mode of the first frame terminal 6 having an S-shaped cross section, a line segment C1 drawn in the x-axis direction from the uppermost point of the end side surface 21a in the z-axis direction may not abut the first frame terminal 6. In this case, multiple line segments (e.g., line segments C2 and C3) are drawn in the x-axis direction from the end side surface 21a, which serves as the reference plane, below the line segment C1 (in the direction toward the bottom of the z-axis), and the length of line segment C3, which is the first to abut the first frame terminal 6 in the z-axis direction, is defined as L1.

[0041] As described above, the mold divider of the first embodiment forms a space with a non-uniform spacing between the frame terminal and the end side surface by bending the frame terminal so that its cross-sectional shape is S-shaped, so that the distances L1, L2, and L3 in the x-axis direction between the top and bottom points of the end side surface of the resistor element built into the mold divider in the z-axis direction, and the point approximately midway between these top and bottom points, and each point on the surface of the frame terminal corresponding to these points in the horizontal direction (x-axis direction) satisfy the relationship L1>L2≧L3.

[0042] Then, by filling the space between the frame terminal and the end side surface with bonding material, the thickness of the bonding material in the x-axis direction (longitudinal direction) of the end side surface of the resistive element of the mold divider is ensured according to the separation distances L1, L2, and L3.

[0043] That is, when an external force in the x-axis direction is applied to the frame terminal of the mold divider, the stress on the frame terminal is greater in the region of separation distance L1 than in other regions, so the distance between the frame terminal and the end side surface is made greater than in other regions, and the thickness of the bonding material in the x-axis direction in that region is increased. This improves the bonding strength between the resistor element (chip component) inside the mold divider and the frame terminal, and improves the tensile strength of the entire component in the x-axis direction.

[0044] Furthermore, at the bottom surface of the end portion of the resistance element of the mold divider, with respect to the closest distance L4 between the bottom surface electrode and the frame terminal in the z-axis direction and the farthest distance L5 between the bottom surface electrode and the frame terminal, a frame cross-sectional shape that satisfies the relationship L4 < L5 is adopted, and by configuring the space formed thereby to be filled with a bonding material, the thickness of the bonding material between the frame terminal and the end electrode on the bottom surface side of the resistance element is ensured. This not only improves the bonding strength between the resistance element (chip component) and the frame terminal but also improves the tensile strength against the expansion of the mold.

[0045] In addition, since the space formed between the end side surface and the end bottom surface of the resistance element of the mold divider and the frame terminal functions as a bonding material (solder) reservoir, it is possible to prevent the bonding material from spreading or adhering to areas other than the electrodes, and the tensile strength at the end side surface and the end bottom surface is improved.

[0046] Also, since the position and shape of the frame terminal are configured such that they do not directly contact the end side surface of the resistance element, mechanical pressure is not directly applied from the frame terminal to the end electrode, and damage to the resistance element can be avoided.

[0047] In this embodiment example, the case where the first frame terminal 6 is wider than the second frame terminal 7a and the third frame terminal 7b has been described. However, the first frame terminal 6 may be formed to have the same width as the second frame terminal 7a and the third frame terminal 7b, and two first frame terminals 6 may be provided with respect to the electrode 16, that is, the frame terminals may be in pairs.

[0048] <Second Embodiment Example> The mold divider according to the first embodiment example described above has a form in which the frame terminal is bent in an S shape. However, the form of the frame terminal for ensuring the bonding strength between the resistance element (chip component) and the frame terminal within the mold divider is not limited to this.

[0049] Fig. 6 is a cross-sectional view of the mold divider 41 according to the second embodiment cut along its longitudinal direction. Fig. 7 shows the cross-sectional shape of the first frame terminal 36, which is a frame terminal arranged on one end side of the mold divider 41 according to the second embodiment, and is a detailed view of the area surrounded by the dashed line C in Fig. 6.

[0050] The appearance of the molded divider 41 according to the second embodiment, the arrangement of the frame terminals, etc. are the same as those of the molded divider 1 according to the first embodiment. Also, the shapes of the second and third frame terminals 37a and 37b arranged on the other end side of the molded divider 41 are the same as the shape of the first frame terminal 36 on the one end side, and therefore are not shown in Fig. 7.

[0051] 6 and 7, the first frame terminal 36 of the mold divider 41 according to the second embodiment has a portion facing the end electrode 21 of the resistor element 8 that is inclined at a predetermined angle relative to the horizontal direction (x-axis direction), and has a linear cross-sectional shape. The inclination angle θ is, for example, 45°, and the first frame terminal 36 is gradually spaced apart (the separation distance increases) from the end side surface 21a of the end electrode 21 in the direction from the bottom to the top of the z-axis. This creates a space with a non-uniform separation distance between the frame terminal and the end side surface.

[0052] Here, the line length (separation distance) when a line segment drawn in the x-axis direction from the top of end side surface 21a in the z-axis direction hits first frame terminal 36 is defined as L1, the line length (separation distance) when a line segment drawn in the x-axis direction from the bottom of end side surface 21a in the z-axis direction hits first frame terminal 36 is defined as L2, and the line length (separation distance) at an intermediate portion located approximately halfway between the top and bottom is defined as L3.The first frame terminal 36 has a cross-sectional shape that satisfies the relationship L1>L3>L2.

[0053] In this way, while the first frame terminal 36 and the end face electrode 21 of the resistance element 8 satisfy the above relationship, they are separated by a predetermined distance, and a bonding material 37 (for example, solder) is interposed in the space formed between these frame terminals and the electrode, so that the first frame terminal 36 and the resistance element 8 are electrically and mechanically connected.

[0054] In addition, at the bottom surface of the end portion of the resistance element 8 of the mold divider 41, regarding the distance L4 where the first frame terminal 36 and the lower surface electrode 25 are closest in the z-axis direction and the distance L5 where the lower surface electrode 25 is farthest from the first frame terminal 36, similar to the first embodiment example, the relationship of L4 < L5 is satisfied.

[0055] Also in the mold divider according to the second embodiment example described above, at the portion of the distance L1 where the stress on the frame terminal becomes larger than other portions, the distance between the frame terminal and the side surface of the end portion of the resistance element is made larger than other portions, and the thickness of the bonding material in the x-axis direction at that portion is increased. Thereby, even when an external force in the x-axis direction is applied to the frame terminal of the mold divider, the bonding strength between the resistance element and the frame terminal in the mold divider is maintained, and the tensile strength of the entire component in the x-axis direction can be improved.

[0056] Further, by making the cross-sectional shape of the frame terminal at the connection portion with the end face electrode into a linear shape inclined at a predetermined angle with respect to the longitudinal direction of the mold divider, for example, the processing of the frame terminal becomes easier than bending the frame terminal at a right angle so as to be parallel to the end face electrode.

[0057] Furthermore, also in the second embodiment example, since the position and shape of the frame terminal of the mold divider are configured not to directly contact the side surface of the end portion of the resistance element, damage caused by the frame terminal to the resistance element can be avoided.

[0058] Both the mold dividers according to the first and second embodiments described above can ensure airtightness of the built-in resistive element by molding it, and the bonding strength between the resistive element and the frame terminal, making it possible to achieve high-precision and appropriate voltage division by the resistive element inside the mold, and reliably preventing overcharging and undercharging when applied to an automotive battery.

[0059] <Regarding the position of the resistor element> Figure 8 is a diagram illustrating the position of a resistor element in a mold divider. Figure 8(a) shows an embodiment in which the center line CL1 of the mold divider 1 in the x-axis direction is aligned with the center line CL2 of the resistor element 8. On the other hand, Figure 8(b) shows an embodiment of a mold divider 11 in which the center line CL2 of the resistor element 8 is displaced in the x-axis direction from the center line CL1 of the mold divider, and the resistor element 8 is disposed.

[0060] As shown in Figure 8(b), by arranging the resistive element 8 so that it is biased toward the first frame terminal 6 of the mold divider 11 in the x-axis direction and shifting the center of gravity of the resistive element 8 toward the first frame terminal 6, a space larger than the first frame terminal 6 side can be formed between the second and third frame terminals 7a, 7b and the end surface electrode 51, and bonding material 57 can be accumulated in that space.

[0061] That is, since the first frame terminal 6 is larger in size than the second and third frame terminals 7a, 7b, a self-alignment effect occurs during solder connection, allowing for smooth positioning relative to the end surface electrode 21. In contrast, for the smaller second and third frame terminals 7a, 7b, a necessary and sufficient amount of bonding material for achieving stable solder application can be stored in a space larger than the first frame terminal 6 side as described above, ensuring sufficient bonding strength with the end surface electrode 51.

[0062] In order to position the resistive element 8 so that it is biased toward the first frame terminal 6 of the mold divider in the x-axis direction, a protrusion 33 may be provided at the portion facing the end surface electrodes 51 of the second and third frame terminals 7a and 7b, as shown in FIG. 9, for example.

[0063] The above-described embodiments have been described to facilitate understanding of the present invention, but are not intended to limit the present invention, and may be modified as appropriate within the scope of the present invention. Furthermore, the components of the present invention may be selected arbitrarily, and inventions having selected configurations are also included in the present invention. [Explanation of symbols]

[0064] 1,11,41 Thick film mold divider 2 Top part 2a Upper side of the upper surface 2b Underside of the upper surface 3 First protrusion 4 Second protrusion 5 Third protrusion 6,36 First electrode terminal (first frame terminal) 7a, 37a: Second electrode terminal (second frame terminal) 7b, 37b Third electrode terminal (third frame terminal) 8 Resistive elements 9 Storage section 13 Insulating substrate 15 Exterior materials 16 1st electrode 17a 2nd electrode 17b 3rd electrode 20 End electrode 21,51 End electrode 21a End side 23 Top electrode 25 Bottom electrode 25a Bottom side 27,37,57 Bonding material 31 First Resistor 32 Second Resistor 33 Protrusion L1, L2, L3: Distance between the frame terminal and the end side of the end electrode L4, L5: Distance between frame terminal and bottom electrode

Claims

1. An electronic component comprising: a resistance element having electrodes formed on both ends of a plate-like substrate and a resistor formed between the electrodes; an exterior member covering at least the entire resistance element; and a frame terminal having one end connected to the electrodes and the other end drawn out from the exterior member, The frame terminal is bent into a predetermined shape so that the longitudinal distance between an end electrode located on a longitudinal end face of the resistor element and a portion of the frame terminal facing the end electrode is not uniform.

2. 2. The electronic component according to claim 1, wherein the frame terminal is bent so that the cross section in the longitudinal direction has an S-shape.

3. 3. The electronic component according to claim 2, wherein the outer surface of the end electrode is a reference plane, and line segments are drawn in the longitudinal direction from the top to the bottom of the resistance element in the thickness direction, starting from the reference plane, and the line segment that first abuts against the frame terminal is defined as L1, the longitudinal distance between the outer surface of the end electrode and the frame terminal at the bottom of the outer surface in the thickness direction is defined as L2, and the longitudinal distance between the outer surface of the end electrode and the frame terminal when the frame terminal is closest to the side electrode in the longitudinal direction is defined as L3, so that the longitudinal distances satisfy the relationship L1 > L2 ≧ L3.

4. 2. The electronic component according to claim 1, wherein the frame terminal is bent such that the portion is inclined at a predetermined angle with respect to the longitudinal direction and the cross-sectional shape of the portion in the longitudinal direction is linear.

5. The electronic component according to claim 4, wherein the outer surface of the end electrode is taken as a reference plane, and line segments are drawn in the longitudinal direction from the top to the bottom of the resistor element in the thickness direction, starting from the reference plane, and the line segment that first abuts against the frame terminal is taken as L1, the longitudinal distance between the outer surface of the end electrode and the frame terminal at the bottom of the outer surface in the thickness direction is taken as L2, and the longitudinal distance between the outer surface of the end electrode and the frame terminal at a location approximately midway between the top and bottom of the end electrode in the thickness direction is taken as L3, so that the longitudinal distances satisfy the relationship L1 > L3 > L2.

6. The electronic component according to claim 3 or 5, characterized in that, when the distance between the bottom electrode located on the bottom surface of the end of the resistor element and the frame terminal when the bottom electrode and the frame terminal are closest to each other in the thickness direction of the resistor element is L4, and the distance between the bottom electrode and the frame terminal when the bottom electrode is farthest from the frame terminal in the thickness direction is L5, the distances satisfy the relationship L4 < L5.

7. The electronic component according to claim 3 or 5, characterized in that the spaces formed between the end surface electrodes and the bottom surface electrodes and the frame terminals, having the separation distances L1 to L5, are used as reservoirs of bonding material for joining the end surface electrodes and the bottom surface electrodes to the frame terminals.

8. 2. The electronic component according to claim 1, wherein the resistor element is disposed at a position where the center of gravity of the resistor element in the longitudinal direction coincides with the center of gravity of the electronic component.

9. The electronic component according to claim 1, characterized in that the center of gravity of the resistive element is shifted toward one of the electrodes formed at both ends of the plate-like substrate relative to the center of gravity of the electronic component in the longitudinal direction.

10. 2. The electronic component according to claim 1, wherein the exterior member is made of an insulating resin mold member, and covers the entire resistor element and a part of the frame terminal.

11. The electronic component according to claim 2 or 4, characterized in that the electronic component is a thick film mold divider for high voltage, in which a first resistor is formed between a first electrode and a second electrode of the electrodes formed at both ends of the plate-like substrate, and a second resistor is formed between the second electrode and a third electrode.

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