Wiring body, display device, and antenna
The wiring body design with a conductor pattern and overlapping conductor layers in trenches enhances connectivity and reduces visibility, addressing connectivity issues in conventional designs.
Patent Information
- Application Number
- JP2022191293
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2022-11-30
- Publication Date
- 2026-01-07
AI Technical Summary
The connectivity between terminals and conductor patterns in conventional wiring bodies is compromised by the visibility of conductor portions, leading to reduced connectivity with external connection terminals.
A wiring body design featuring a conductor pattern with openings, a terminal connected to conductive wires, and a resin layer with trenches, where the terminal is connected to a first conductor layer in a second trench, and a second conductor layer overlaps with the first, enhancing connectivity while minimizing visibility.
Improves connectivity between terminals and conductor patterns while reducing the visibility of conductor portions, ensuring reliable connections with external terminals.
Smart Images

Figure 2026001249000001_ABST
Abstract
Description
[Technical Field]
[0001] The present disclosure relates to a wiring body, a display device, and an antenna. [Background technology]
[0002] Conventionally, a wiring body including an electrode, a terminal, and a resin layer provided on a substrate has been known (for example, Patent Document 1). The terminal is disposed on the surface of the resin layer and is connected to a mesh-shaped conductor pattern of the electrode disposed in a trench in the resin layer. [Prior art documents] [Patent documents]
[0003] [Patent Document 1] Special Publication No. 2015-517193 Summary of the Invention [Problem to be solved by the invention]
[0004] In the wiring body described above, the terminals are disposed on the surface of the resin layer, and the mesh-shaped conductor pattern of the electrodes is disposed in the trenches of the resin layer, which may reduce the connectivity between them and cause problems with the connectivity to external connection terminals. On the other hand, if the number of conductors near the connection points is increased to improve the connectivity between the terminals and the conductor patterns of the electrodes, the visibility of the conductor portions increases.
[0005] Therefore, the present disclosure aims to provide a wiring body, a display device, and an antenna that can improve the connectivity between the terminal and the conductor pattern of the electrode while suppressing an increase in the visibility of the conductor portion, and can improve the connectivity with an external connection terminal. [Means for solving the problem]
[0006] A wiring body according to one aspect of the present disclosure comprises an electrode having a conductor pattern including a plurality of openings, a terminal connected to the electrode, and a resin layer provided on a substrate, wherein the conductor pattern of the electrode is disposed in a first trench provided in the resin layer, and the terminal is connected to at least one of a plurality of conductive wires constituting the conductor pattern, the first conductor layer being disposed in a second trench provided in the resin layer, and a second conductor layer being provided on the resin layer and at least a portion of which overlaps with the first conductor layer.
[0007] A display device according to one aspect of the present disclosure includes the wiring body described above.
[0008] An antenna according to one aspect of the present disclosure includes the wiring body described above. [Effects of the Invention]
[0009] According to one aspect of the present disclosure, it is possible to provide a wiring body, a display device, and an antenna that can improve the connectivity between the terminal and the conductor pattern of the electrode while suppressing an increase in the visibility of the conductor portion, and can improve the connectivity with an external connection terminal. [Brief explanation of the drawings]
[0010] [Figure 1] FIG. 1 is a plan view illustrating an embodiment of a conductive film including a wiring body. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] FIG. 10 is a cross-sectional view showing a conductive film according to a modified example. [Figure 4] 1 is a cross-sectional view showing an embodiment of a display device. [Figure 5] FIG. 2 is a plan view of an antenna including a wiring body. [Figure 6] FIG. 2 is an enlarged view showing the structure in the vicinity of the terminal. [Figure 7] FIG. 7 is an enlarged cross-sectional view taken along line VII-VII shown in FIG. [Figure 8] FIG. 10 is a diagram showing an antenna according to a modified example. [Figure 9] FIG. 10 is a diagram showing an antenna according to a modified example. [Figure 10] 10A to 10C are diagrams illustrating a manufacturing procedure for an antenna according to a modified example. [Figure 11] FIG. 10 is a diagram showing an antenna according to a modified example. DETAILED DESCRIPTION OF THE INVENTION
[0011] Hereinafter, several embodiments of the present disclosure will be described in detail, but the present disclosure is not limited to the following embodiments.
[0012] FIG. 1 is a plan view showing a conductive film including a wiring body 200 according to an embodiment of the present disclosure, and FIG. 2 is a cross-sectional view taken along line II-II in FIG. 1 . The conductive film 20 includes an antenna 300, and the antenna 300 includes the wiring body 200. The conductive film 20 shown in FIGS. 1 and 2 includes a film-like light-transmitting substrate 1 (substrate), a conductive layer 5 provided on one main surface 1S of the light-transmitting substrate 1, and a light-transmitting resin layer 7B provided on one main surface 1S of the light-transmitting substrate 1. The conductive layer 5 includes a conductor portion 3 extending in a direction along the main surface 1S of the light-transmitting substrate 1 and including a pattern including multiple openings 3a, and an insulating resin portion 7A filling the openings 3a of the conductor portion 3. In FIG. 2 , the conductive layer 5 is shown in a deformed state, with the width of the conductor portion 3 emphasized. The thickness of each layer is also shown in a deformed state. Details of the thickness of each layer will be described later. In addition, in the example shown in Figure 1, the conductive layer 5 is formed near one of the short sides of the conductive film 20, but the position where the conductive layer 5 is formed is not particularly limited, and the conductive layer 5 may be formed near the long side.
[0013] The light-transmitting substrate 1 has a degree of light transparency required when the conductive film 20 is incorporated into a display device. Specifically, the total light transmittance of the light-transmitting substrate 1 may be 90 to 100%. The haze of the light-transmitting substrate 1 may be 0 to 5%.
[0014] The light-transmitting substrate 1 may be, for example, a transparent resin film, examples of which include films of polyethylene terephthalate (PET), polycarbonate (PC), polyethylene naphthalate (PEN), cycloolefin polymer (COP), or polyimide (PI). Alternatively, the light-transmitting substrate 1 may be a glass substrate.
[0015] For example, as shown in FIG. 3 , the light-transmitting substrate 1 may be a laminate having a light-transmitting support film 11, and an intermediate resin layer 12 and an underlayer 13 provided in this order on the support film 11. The support film 11 may be the transparent resin film described above. The underlayer 13 is a layer provided for forming the conductor portion 3 by electroless plating or the like. When the conductor portion 3 is formed by another method, the underlayer 13 does not necessarily have to be provided. The intermediate resin layer 12 does not have to be provided between the support film 11 and the underlayer 13.
[0016] The thickness of the light-transmitting substrate 1 or the support film 11 constituting it may be 10 μm or more, 20 μm or more, or 35 μm or more, and may be 500 μm or less, 200 μm or less, or 100 μm or less.
[0017] The intermediate resin layer 12 can improve the adhesion between the support film 11 and the underlayer 13. If the underlayer 13 is not provided, the intermediate resin layer 12 can be provided between the support film 11 and the light-transmitting resin layer 7B to improve the adhesion between the support film 11 and the light-transmitting resin layer 7B.
[0018] The intermediate resin layer 12 may be a layer containing a resin and an inorganic filler. An example of the resin constituting the intermediate resin layer 12 is an acrylic resin. An example of the inorganic filler is silica.
[0019] The thickness of the intermediate resin layer 12 may be, for example, 5 nm or more, 100 nm or more, or 200 nm or more, and may be 10 μm or less, 5 μm or less, or 2 μm or less.
[0020] The underlayer 13 may be a layer containing a catalyst and a resin. The resin may be a cured product of a curable resin composition. Examples of the curable resin contained in the curable resin composition include amino resins, cyanate resins, isocyanate resins, polyimide resins, epoxy resins, oxetane resins, polyesters, allyl resins, phenolic resins, benzoxazine resins, xylene resins, ketone resins, furan resins, COPNA resins, silicone resins, dicyclopentadiene resins, benzocyclobutene resins, episulfide resins, ene-thiol resins, polyazomethine resins, polyvinylbenzyl ether compounds, acenaphthylene, and ultraviolet-curable resins containing functional groups that undergo polymerization under ultraviolet light, such as unsaturated double bonds, cyclic ethers, and vinyl ethers.
[0021] The catalyst contained in the underlayer 13 may be an electroless plating catalyst. The electroless plating catalyst may be a metal selected from Pd, Cu, Ni, Co, Au, Ag, Pd, Rh, Pt, In, and Sn, or may be Pd. The catalyst may be one type alone or a combination of two or more types. Typically, the catalyst is dispersed in the resin as catalyst particles.
[0022] The catalyst content in the underlayer 13 may be 3 mass% or more, 4 mass% or more, or 5 mass% or more, based on the total amount of the underlayer 13, and may be 50 mass% or less, 40 mass% or less, or 25 mass% or less.
[0023] The thickness of the underlayer 13 may be 10 nm or more, 20 nm or more, or 30 nm or more, and may be 500 nm or less, 300 nm or less, or 150 nm or less.
[0024] The light-transmitting substrate 1 may further have a protective layer provided on the main surface of the support film 11 opposite to the light-transmitting resin layer 7B and the conductor portion 3. By providing the protective layer, scratches on the support film 11 are suppressed. The protective layer may be the same layer as the intermediate resin layer 12. The thickness of the protective layer may be 5 nm or more, 50 nm or more, or 500 nm or more, or may be 10 μm or less, 5 μm or less, or 2 μm or less.
[0025] The conductor portion 3 constituting the conductive layer 5 includes a portion having a pattern including openings 3a. The pattern including openings 3a is a mesh-like pattern including a plurality of regularly arranged openings 3a formed by a plurality of linear portions intersecting each other. The conductor portion 3 having a mesh-like pattern can function well as, for example, a radiation conductor and a feed line of the antenna 300. The conductor portion 3 also has a planar pattern without openings 3a. The conductor portion 3 having a planar pattern functions as a terminal and a ground pad portion, which will be described later. The details of the pattern configuration of the conductor portion 3 in the conductive layer 5 will be described later.
[0026] The conductor portion 3 may contain a metal. The conductor portion 3 may contain at least one metal selected from copper, nickel, cobalt, palladium, silver, gold, platinum, and tin, or may contain copper. The conductor portion 3 may be a metal plating formed by a plating method. The conductor portion 3 may further contain a non-metallic element such as phosphorus, as long as appropriate conductivity is maintained.
[0027] The conductor part 3 may be a laminate composed of multiple layers. The conductor part 3 may also have a blackening layer as a surface layer on the side opposite to the light-transmitting substrate 1. The blackening layer can contribute to improving the visibility of a display device incorporating the conductive film.
[0028] The insulating resin portion 7A is made of a light-transmitting resin and is provided so as to fill the opening 3a of the conductor portion 3, and the insulating resin portion 7A and the conductor portion 3 usually form a flat surface.
[0029] The light-transmitting resin layer 7B is formed of a resin having light transparency. The light-transmitting resin layer 7B may have a total light transmittance of 90 to 100%. The light-transmitting resin layer 7B may have a haze of 0 to 5%.
[0030] The difference between the refractive index of the light-transmitting substrate 1 (or the refractive index of the support film constituting the light-transmitting substrate 1) and the refractive index of the light-transmitting resin layer 7B may be 0.1 or less. This makes it easier to ensure good visibility of the displayed image. The refractive index (nd25) of the light-transmitting resin layer 7B may be, for example, 1.0 or more, or 1.7 or less, 1.6 or less, or 1.5 or less. The refractive index can be measured using a reflectance spectroscopic film thickness meter. From the viewpoint of uniformity of the optical path length, the conductor portion 3, the insulating resin portion 7A, and the light-transmitting resin layer 7B may have substantially the same thickness.
[0031] The resin forming the insulating resin portion 7A and the light-transmitting resin layer 7B may be a cured product of a curable resin composition (a photocurable resin composition or a thermosetting resin composition). The curable resin composition forming the insulating resin portion 7A and / or the light-transmitting resin layer 7B includes a curable resin, examples of which include acrylic resin, amino resin, cyanate resin, isocyanate resin, polyimide resin, epoxy resin, oxetane resin, polyester, allyl resin, phenol resin, benzoxazine resin, xylene resin, ketone resin, furan resin, COPNA resin, silicon resin, dicyclopentadiene resin, benzocyclobutene resin, episulfide resin, ene-thiol resin, polyazomethine resin, polyvinylbenzyl ether compound, acenaphthylene, and ultraviolet-curable resins containing functional groups that undergo a polymerization reaction under ultraviolet light, such as unsaturated double bonds, cyclic ethers, and vinyl ethers.
[0032] The resin forming the insulating resin portion 7A and the resin forming the light-transmitting resin layer 7B may be the same. Since the insulating resin portion 7A and the light-transmitting resin layer 7B formed from the same resin have the same refractive index, the uniformity of the path length of light passing through the conductive film 20 can be further improved. When the resin forming the insulating resin portion 7A and the light-transmitting resin layer 7B are the same, the insulating resin portion 7A and the light-transmitting resin layer 7B can be easily formed collectively, for example, by forming a pattern from a single curable resin layer using an imprinting method or the like.
[0033] The conductive film 20 can be manufactured by a method including pattern formation using, for example, an imprinting method. One example of a method for manufacturing the conductive film 20 includes preparing a light-transmitting substrate 1 having a support film and, on one main surface of the support film, an intermediate resin layer and a catalyst-containing underlayer. Forming a curable resin layer on the main surface 1S of the light-transmitting substrate 1 facing the underlayer. Forming trenches exposing the underlayer by an imprinting method using a mold with protrusions. Forming conductors 3 filling the trenches by electroless plating, growing metal plating from the underlayer. By curing the curable resin layer with the mold pressed into the curable resin layer, an insulating resin portion 7A having a pattern including openings with the inverse shape of the mold's protrusions and a light-transmitting resin layer 7B are simultaneously formed. The method for forming the insulating resin portion 7A having a pattern including openings is not limited to imprinting; any method, such as photolithography, can be used.
[0034] The conductive film described above can be incorporated into a display device, for example, as a planar transparent antenna. The display device may be, for example, a liquid crystal display device or an organic electroluminescence (EL) display device. FIG. 4 is a cross-sectional view showing an embodiment of a display device incorporating a conductive film. The display device 100 shown in FIG. 4 includes an image display unit 10 having an image display area 10S, a conductive film 20, a polarizing plate 30, and a cover glass 40. The conductive film 20, the polarizing plate 30, and the cover glass 40 are stacked in this order from the image display unit 10 side on the image display area 10S side of the image display unit 10. The configuration of the display device is not limited to the configuration shown in FIG. 4 and can be appropriately modified as needed. For example, the polarizing plate 30 may be provided between the image display unit 10 and the conductive film 20. The image display unit 10 may be, for example, a liquid crystal display unit. The polarizing plate 30 and the cover glass 40 may be those commonly used in display devices. The polarizing plate 30 and the cover glass 40 are not necessarily provided. Light for image display emitted from the image display region 10S of the image display unit 10 passes through a path with a highly uniform optical path length that includes the conductive film 20. This enables a good image display with a high degree of uniformity and suppressed moire.
[0035] Next, with reference to FIG. 5, a detailed description will be given of the configuration of an antenna 300 including a wiring body 200 according to an embodiment of the present disclosure. The antenna 300 includes the conductive layer 5 described above. FIG. 5 is a plan view of the antenna 300. FIG. 5 also shows an enlarged view of a portion of the antenna 300 including the wiring body 200. In the following description, X and Y coordinates are defined relative to a plane parallel to the main surface 1S. The Y axis direction is a direction along the main surface 1S, and in the example shown in FIG. 1, corresponds to a direction perpendicular to the side 20a of the conductive film 20. The central side of the conductive film 20 is defined as the positive side in the Y axis direction, and the outer periphery of the conductive film 20 is defined as the negative side in the Y axis direction. The X axis direction is a direction perpendicular to the Y axis direction along the main surface 1S, and in the example shown in FIG. 1, corresponds to the direction in which the side 20a of the conductive film 20 extends. The side along which the side 20a of the conductive film 20 extends is defined as the positive side in the X axis direction, and the other side is defined as the negative side in the X axis direction.
[0036] The conductive layer 5 of the antenna 300 has an electrode 26 including a radiation electrode 21 and feed lines 25A and 25B, terminals 22A and 22B, and ground pad portions 24A, 24B, and 24C. The antenna 300 has a configuration that is axisymmetric with respect to a center line CL that is parallel to the Y-axis direction.
[0037] The radiation electrode 21 is a region that radiates a signal as the antenna 300. The radiation electrode 21 has a circular shape. The center of the radiation electrode 21 is located on the center line CL. The radiation electrode 21 is located at a position spaced apart from the side portion 20a of the conductive film 20 toward the positive side in the Y-axis direction. The radiation electrode 21 has a diameter R.
[0038] The feed lines 25A and 25B are lines that feed power to the radiation electrode 21. That is, the antenna 300 functions as a dual-polarized antenna. For example, a diagonally polarized signal in the direction in which the inclined portion 25b of the feed line 25A extends can be fed via the feed line 25A, and a diagonally polarized signal in the direction in which the inclined portion 25b of the feed line 25B extends can be fed via the feed line 25B. The feed lines 25A and 25B have a vertical portion 25a that extends perpendicular to the side portion 20a of the conductive film 20 and an inclined portion 25b that is inclined with respect to the Y-axis direction. The vertical portion 25a of the feed line 25A extends from the terminal 22A formed on the side of the side 20a of the conductive film 20 toward the positive side in the Y-axis direction. The vertical portion 25a of the feeder line 25A extends parallel to the center line CL (that is, in the Y-axis direction) at a position spaced from the center line CL toward the negative side in the X-axis direction.
[0039] The inclined portion 25b of the feed line 25A is inclined from the end of the vertical portion 25a on the positive side in the Y-axis direction toward the center line CL (i.e., the positive side in the X-axis direction) as it moves toward the positive side in the Y-axis direction. The end of the inclined portion 25b on the positive side in the Y-axis direction is connected to the outer peripheral edge 21a of the radiation electrode 21. The feed line 25A has a constant width W1 in the vertical portion 25a and the inclined portion 25b. The feed line 25A also has a line length L1, which is the sum of the length of the vertical portion 25a and the length of the inclined portion 25b. Here, the width W1 is the dimension in a direction perpendicular to the extension direction of the vertical portion 25a and the inclined portion 25b in the in-plane direction of the planar antenna 300, and the line length L1 is the dimension along the extension direction of the vertical portion 25a and the inclined portion 25b in the in-plane direction of the planar antenna 300.
[0040] 5, the vertical portion 25a of the feed line 25A is disposed at a position farther toward the negative side in the X-axis direction than the negative end of the radiation electrode 21 in the X-axis direction. Also, the positive end of the vertical portion 25a of the feed line 25A in the Y-axis direction (i.e., the connection portion with the inclined portion 25b) is disposed at a position farther toward the negative side in the Y-axis direction than the negative end of the radiation electrode 21 in the Y-axis direction. However, the positions and shapes of the vertical portion 25a and the inclined portion 25b are not particularly limited. The feed line 25B has a structure that is line-symmetrical to the feed line 25A with respect to the center line CL. In this embodiment, the inclined portion 25b of the feed line 25A and the inclined portion 25b of the feed line 25B are connected to the outer peripheral edge 21a of the radiation electrode 21 so that an imaginary line extending the inclined portion 25b of the feed line 25A and an imaginary line extending the inclined portion 25b of the feed line 25B are perpendicular to each other. In other words, the angle formed by the imaginary line extending the inclined portion 25b of the feed line 25A and the imaginary line extending the inclined portion 25b of the feed line 25B is 90 degrees.
[0041] The terminals 22A and 22B are terminals connected to the power feed lines 25A and 25B, respectively. The terminals 22A and 22B are connected to external input / output terminals to feed power to the radiation electrode 21 via the power feed lines 25A and 25B. The terminals 22A and 22B are arranged near the side 20a of the conductive film 20. The terminals 22A and 22B extend from the negative end of the vertical portion 25a of the power feed lines 25A and 25B in the Y-axis direction to the side 20a toward the negative side in the Y-axis direction. The terminals 22A and 22B extend in the Y-axis direction with a constant width W2. The terminals 22A and 22B extend in the Y-axis direction with a length dimension L2. Here, the width W2 is the dimension perpendicular to the extension direction of the terminals 22A and 22B in the in-plane direction of the planar antenna 300, and the length L2 is the dimension along the extension direction of the terminals 22A and 22B in the in-plane direction of the planar antenna 300.
[0042] The ground pad portions 24A, 24B, and 24C are regions that are electrically grounded. The ground pad portions 24A, 24B, and 24C are connected to ground terminals (not shown). The ground pad portions 24A, 24B, and 24C are insulated from the terminals 22A and 22B by being arranged with a gap GP between them. The ground pad portion 24A is formed in the region between the terminals 22A and 22B so as to extend in the X-axis direction along the side portion 20a. The ground pad portion 24B is formed in the region on the negative side of the terminal 22A in the X-axis direction so as to extend in the X-axis direction along the side portion 20a. The ground pad portion 24C is formed in the region on the positive side of the terminal 22B in the X-axis direction so as to extend in the X-axis direction along the side portion 20a. The ground pad portions 24A, 24B, and 24C extend in a strip shape in the X-axis direction with a constant width in the Y-axis direction. The width of the ground pad portions 24A, 24B, and 24C is the same as the length L2 of the terminals 22A and 22B.
[0043] As described above, terminal 22A, which is a signal line, is sandwiched between ground pad portions 24A and 24B on both sides in the X-axis direction. Terminal 22B, which is a signal line, is sandwiched between ground pad portions 24A and 24C on both sides in the X-axis direction. In this way, terminals 22A and 22B are coplanar lines.
[0044] As shown in FIG. 5, the antenna 300 has a mesh-shaped conductor pattern 50 as the conductor portion 3. Among the components of the antenna 300, the radiation electrode 21 and the feed lines 25A and 25B (electrodes) have the mesh-shaped conductor pattern 50. The mesh-shaped conductor pattern 50 includes a plurality of first conductive wires 51 and a plurality of second conductive wires 52. The first conductive wires 51 are linear conductor portions 3 extending parallel to the Y-axis direction. The plurality of first conductive wires 51 are arranged to be spaced apart from each other in the X-axis direction. The plurality of first conductive wires 51 are arranged to be spaced apart at an equal pitch. The second conductive wires 52 are linear conductor portions 3 extending parallel to the X-axis direction. The plurality of second conductive wires 52 are arranged to be spaced apart from each other in the Y-axis direction. The plurality of second conductive wires 52 are arranged to be spaced apart from each other at an equal pitch. The thickness of the conductive wires 51 and 52 is not particularly limited, but may be set to, for example, 1 to 3 μm. The pitch of the conductive wires 51, 52 is not particularly limited, and may be set to, for example, 100 to 300 μm. Note that the first conductive wire 51 does not have to be parallel to the Y-axis direction as long as it extends in the Y-axis direction, and the second conductive wire 52 does not have to be parallel to the X-axis direction as long as it extends in the X-axis direction.
[0045] In this embodiment, the radiation electrode 21 and the feed lines 25A and 25B have end conductive lines that form their outer peripheries. The shape of the radiation electrode 21 formed by these end conductive lines is circular. Note that the circular radiation electrode 21 is not limited to a strict perfect circle and includes variations due to manufacturing errors and the like. The end conductive lines that form the outer periphery of the radiation electrode 21 may not only be composed of curves but may also include straight or wavy lines. Furthermore, the radiation electrode 21 and the feed lines 25A and 25B may not include end conductive lines. In this case, it is sufficient that the shape formed by connecting the tips of the first conductive line 51 or the second conductive line 52 included in the mesh-shaped conductor pattern 50 is circular.
[0046] The terminal 22 has a second conductor layer 56 that extends in a planar manner over substantially the entire area of the terminal 22. Note that when referring to the "terminal 22," there is no distinction between the terminal 22A and the terminal 22B and it refers to both. In FIG. 5, the second conductor layer 56 is formed over the entire area of the terminal 22, but the area of the second conductor layer 56 is not particularly limited. For example, the area of the second conductor layer 56 may be 95% or more of the area of the entire terminal 22. Note that the ground pad portions 24A, 24B, and 24C also have the second conductor layer 56. However, the ground pad portions 24A, 24B, and 24C may have a mesh-shaped conductor pattern 50.
[0047] Next, the structure of the wiring body 200 will be described with reference to Fig. 6 and Fig. 7. Fig. 6 is an enlarged view showing the structure in the vicinity of the terminal 22. Fig. 7 is an enlarged cross-sectional view taken along line VII-VII shown in Fig. 6. As shown in Figs. 6 and 7, the wiring body 200 further includes the aforementioned light-transmitting substrate 1 (see Fig. 7) on which the electrode 26 and the terminal 22 are provided, and the aforementioned insulating resin part 7A (resin layer) provided on the light-transmitting substrate 1. The terminal 22 has a first conductor layer 57 and a second conductor layer 56.
[0048] As shown in FIG. 6 , the first conductor layer 57 is connected to at least one of the terminal conductor wires 51 a of the multiple conductor wires 51 constituting the conductor pattern 50. The first conductor layer 57 has a first portion 58 extending in the X-axis direction (first direction), which is the arrangement direction of the multiple terminal conductor wires 51 a, so as to connect the multiple terminal conductor wires 51 a. The first portion 58 extends in the X-axis direction so as to connect all of the multiple terminal conductor wires 51 a. The first portion 58 has a rectangular shape with its longitudinal direction in the X-axis direction. The second conductor layer 56 is arranged so that at least a portion thereof overlaps with the first conductor layer 57. In this embodiment, a portion of the end of the second conductor layer 56 on the positive side in the Y-axis direction overlaps with a region of the first conductor layer 57 on the negative side in the Y-axis direction. The area of the second conductor layer 56 that does not overlap with the first conductor layer 57 is larger than the area that overlaps with the first conductor layer 57. In this way, the first conductor layer 57 is provided in a region near the end of the second conductor layer 56. The first conductor layer 57 and the second conductor layer 56 may be formed by plating.
[0049] As shown in FIG. 7 , the insulating resin portion 7A has a first trench 60 corresponding to the conductive pattern 50 of the electrode 26 and a second trench 64 corresponding to the first conductive layer 57 of the terminal 22. The insulating resin portion 7A has a mesh-like first trench 60. The first trench 60 is configured by a pattern of grooves 61 between one insulating resin portion 7A and an adjacent insulating resin portion 7A. The grooves 61 are formed in a pattern corresponding to the mesh structure of the conductive pattern 50 of the electrode 26. Therefore, the mesh pattern of the first trenches 60 and the conductive pattern 50 of the electrode 26 match. The grooves 61 are formed so as to penetrate the insulating resin portion 7A and reach the main surface 1S of the light-transmitting substrate 1.
[0050] The second trench 64 is formed by a groove portion 65 having a shape and size corresponding to the terminal 22. The dimension of the second trench 64 in the planar direction (the direction in which the XY plane extends) is larger than the width W3 of the mesh-shaped first trench 60. The width W4 of the second trench 64 in the Y-axis direction is larger than the width W3 of the first trench 60. The dimension of the second trench 64 in the X-axis direction (not shown) is larger than the width W3 of the first trench 60. The width W4 of the second trench 64 in the Y-axis direction may be approximately equal to the length of the short side of the rectangular first conductor layer 57. The dimension of the second trench 64 in the X-axis direction may be approximately equal to the length of the long side of the rectangular first conductor layer 57. The width W3 of the first trench 60 may be approximately equal to the width of the conductive lines 51, 52. The groove portion 65 is formed to penetrate the insulating resin portion 7A and reach the main surface 1S of the light-transmitting substrate 1.
[0051] The electrode 26 has a conductor layer 55 disposed in the first trench 60. The terminal 22 has a first conductor layer 57 disposed in the second trench 64. The conductor layer 55 of the electrode 26 is composed of conductive wires 51 and 52 of a mesh-shaped conductor pattern 50. The second conductive wire 52 is formed by filling a conductive material into a groove 61 of the first trench 60 that extends in the X-axis direction. The first conductive wire 51 is also formed by filling a conductive material into a groove 61 (not shown) of the first trench 60 that extends in the Y-axis direction. The terminal conductive wire 51a of the first conductive wire 51 is disposed in the first trench 60 and is connected at its end to the first conductor layer 57. The surface 55a of the conductor layer 55 is disposed at approximately the same height as the surface 7b of the insulating resin portion 7A.
[0052] The first conductor layer 57 is formed by filling the groove portion 65 of the second trench 64 with a conductive material. The material of the first conductor layer 57 is not particularly limited, and may be the same as or a different material from that of the conductor pattern 50. A surface 57c of the first conductor layer 57 is disposed at approximately the same height as a surface 7b of the insulating resin portion 7A.
[0053] The second conductor layer 56 is provided on the insulating resin part 7A. The bottom surface 56a of the second conductor layer 56 is provided at the same height as the surface 7b of the insulating resin part 7A and is provided so as to be placed on the surface 7b. The bottom surface 56a of the second conductor layer 56 is provided so as to be in contact with the surface 57c of the first conductor layer 57. This electrically connects the first conductor layer 57 and the second conductor layer 56. The height H3 of the second conductor layer 56 may be the same as, greater than, or smaller than the height H2 of the first conductor layer 57.
[0054] The aspect ratio obtained by dividing the height H1 of the conductive lines 51 and 52 constituting the mesh pattern by the width W3 may be greater than 1 and may be 2 or greater. The aspect ratio obtained by dividing the height H2 of the first conductor layer 57 by the width W4 may be less than 1 and may be 0.02 or less. Although not particularly limited, the height H1 of the conductive lines 51 and 52 may be 1.5 to 5 μm. The height H2 of the first conductor layer 57 may be 1.5 to 5 μm. The width W4 of the first conductor layer 57 may be 50 to 200 μm. The height H3 of the second conductor layer 56 may be 1 to 20 μm.
[0055] Next, the functions and effects of the wiring body 200, the display device 100, and the antenna 300 according to this embodiment will be described.
[0056] The wiring body 200 of this embodiment comprises an electrode 26 having a conductor pattern 50 including a plurality of openings 3a, a terminal 22 connected to the electrode 26, and an insulating resin part 7A provided on the light-transmitting substrate 1, wherein the conductor pattern 50 of the electrode 26 is arranged in a first trench 60 provided in the insulating resin part 7A, and the terminal 22 is connected to at least one of a plurality of conductive wires 51 constituting the conductor pattern 50, and has a first conductor layer 57 arranged in a second trench 64 provided in the insulating resin part 7A, and a second conductor layer 56 provided on the insulating resin part 7A and at least a portion of which overlaps with the first conductor layer 57.
[0057] In the wiring body 200, the conductor pattern 50 of the electrode 26 is disposed in a first trench 60 provided in the insulating resin portion 7A. The first conductor layer 57 is connected to at least one of the multiple conductive wires 51 constituting the conductor pattern 50 and disposed in a second trench 64 provided in the insulating resin portion 7A. This ensures sufficient connectivity between the first conductor layer 57 and the conductor pattern 50 within the insulating resin portion 7A. Furthermore, the first conductor layer 57 can ensure a larger connection area with the second conductor layer 56 than when the second conductor layer 56 is directly connected to the conductive wires 51 of the conductor pattern 50. Therefore, sufficient connectivity is ensured between the second conductor layer 56 on the insulating resin portion 7A and the conductive wires 51 of the conductor pattern 50 via the first conductor layer 57. Furthermore, at least a portion of the second conductor layer 56 overlaps the first conductor layer 57. Therefore, the area of the first conductor layer 57 that can be seen from the outside is reduced, and the visibility of the conductor portion such as the first conductor layer can be suppressed. As a result, the connectivity between the terminal 22 and the conductor pattern 50 of the electrode 26 can be improved while suppressing an increase in the visibility of the conductor portion, and the connectivity with an external connection terminal can be improved.
[0058] The first conductor layer 57 may have a first portion 58 extending in the X-axis direction, which is the arrangement direction of the terminal conductive wires 51a, so as to connect the terminal conductive wires 51a that constitute the terminal-side ends of the conductive pattern 50 among the multiple conductive wires 51. In this case, the first conductor layer 57 can increase the number of connections with the terminal conductive wires 51a while minimizing the area. This makes it possible to suppress transmission loss and improve connection reliability.
[0059] The first portion 58 may extend in the X-axis direction so as to connect all of the terminal conductive wires 51 a. In this case, the connectivity between the first conductor layer 57 and the conductive pattern 50 can be improved. This can reduce transmission loss and improve connection reliability.
[0060] The conductive pattern 50 may be a mesh pattern, in which case the visibility of the conductive portion can be prevented from increasing.
[0061] The aspect ratio of the height to width of the conductive lines constituting the mesh pattern may be greater than 1, and the aspect ratio of the height to width of the first conductive layer may be less than 1. In this case, making the conductive lines thinner prevents the visibility of the conductor portion from increasing, and making the first conductive layer wider prevents an increase in sheet resistance, thereby improving the reliability of the connection.
[0062] A display device 100 according to one aspect of the present disclosure includes the wiring body 200 described above.
[0063] According to the display device 100 described above, the same functions and effects as those of the wiring body 200 described above can be obtained.
[0064] An antenna 300 according to one aspect of the present disclosure includes the wiring body 200 described above.
[0065] According to the above-described antenna 300, the same functions and effects as those of the above-described wiring body 200 can be obtained.
[0066] The present disclosure is not limited to the above-described embodiments.
[0067] For example, the shape of the terminal 22 is not limited to that of the above-described embodiment. For example, the configuration shown in FIG. 8(a) may be adopted. In FIG. 8(a), the second conductor layer 56 has a rectangular shape with its longitudinal direction in the X-axis direction. The first conductor layer 57 is connected to a region on the negative side in the X-axis direction at the positive end of the second conductor layer 56 in the Y-axis direction.
[0068] 8(b), the first conductor layer 57 may have a second portion 59 extending from one end of the first portion 58 in the X-axis direction toward the Y-axis direction (second direction) perpendicular to the X-axis direction. In this case, it is possible to improve the reliability of the connection between the first conductor layer 57 and the second conductor layer 56. The second portion 59 extends along the end of the second conductor layer 56 on the negative side in the X-axis direction and is connected to that end.
[0069] 9(a), the first conductor layer 57 may be formed in a frame shape. Here, the first conductor layer 57 has a rectangular frame shape in a plan view. The first conductor layer 57 has a pair of first portions 58 that form long sides and a pair of second portions 59 that form short sides. An outer edge 56b of the second conductor layer 56 is positioned more inward than an outer edge 57a of the first conductor layer 57 in a plan view.
[0070] As shown in FIG. 9(b), a frame-shaped second trench 64 is formed in the insulating resin portion 7A to correspond to the frame-shaped first conductor layer 57. The groove portion 65 of the second trench 64 has an inner wall surface 65b and an outer wall surface 65c. The antenna 300 has regions 70, 71, and 72. The second conductor layer 56 has a region 70 formed to be dispersed on the surface 7b side of the small island portion 80 surrounded by the second trench 64 in the insulating resin portion 7A. The first conductor layer 57 has a region 71 formed to be dispersed on the main surface 1S side of the insulating resin portion 7A. The region 71 is also disposed between the insulating resin portion 7A and the light-transmitting substrate 1. In the region 71, metal particles are dispersed between the insulating resin portion 7A and the light-transmitting substrate 1. The first conductor layer 57 has regions 72 formed so as to be dispersed on the wall surface 65b side of the second trench 64 of the insulating resin portion 7A. The regions 70, 71, and 72 contain a metal different from the metal constituting the conductor pattern 50. The materials of the regions 70, 71, and 72 are not particularly limited, and for example, the same material as the base layer 13 may be used. Note that in FIG. 9(b), to facilitate understanding of the configuration, the regions 70, 71, and 72 are illustrated as being continuously arranged as layers, but they do not necessarily have to be continuously arranged. This also applies to the subsequent figures.
[0071] FIG. 10 shows the procedure for forming the antenna 300. First, as shown in FIG. 10(a), a metal-containing paint for forming the region 71 is applied to the light-transmitting substrate 1, and then an insulating resin portion 7A is imprinted thereon. Next, as shown in FIG. 10(b), a metal-containing paint for forming the region 70 is applied to the surface of the small island portion 80. Next, as shown in FIG. 10(c), the first conductor layer 57 and the second conductor layer 56 are plated. At this time, the metal-containing paint in the region 70 of the small island portion 80 drips down to form the region 72. Note that if the same material as the base layer 13 is used for the regions 70, 71, and 72, the resin contained in the base layer 13 may be removed after application.
[0072] As described above, the first conductor layer 57 may be formed in a frame shape. In this case, it is possible to prevent the metal-containing paint used to form the region from overflowing. This improves the formability of the terminal 22 and prevents short circuits between electrodes.
[0073] The first conductor layer 57 may have a region 72 on the side of the insulating resin portion 7A facing the wall surface 65b of the second trench 64. In this case, the adhesion between the first conductor layer 57 and the wall surface 65b can be improved.
[0074] The outer edge 56b of the second conductor layer 56 may be located, in plan view, inside the outer edge 57a of the first conductor layer 57. In this case, it is possible to prevent the visibility of the conductor portion from increasing.
[0075] There may be a region 73 disposed between the first conductor layer 57 and the light-transmitting substrate 1. In this case, the adhesion between the first conductor layer 57 and the light-transmitting substrate 1 can be improved.
[0076] 11, the second conductor layer 56 may be formed by applying a conductive material. In this case, the surface roughness of the second conductor layer 56 may be greater than the surface roughness of the first conductor layer 57. In this case, the connectivity of the external connection terminals to the second conductor layer 56 can be improved.
[0077] [Form 1] an electrode having a conductor pattern including a plurality of openings; a terminal connected to the electrode; a resin layer provided on the substrate, the conductor pattern of the electrode is disposed in a first trench provided in the resin layer; The terminal is a first conductor layer connected to at least one of the plurality of conductive lines constituting the conductor pattern and disposed in a second trench provided in the resin layer; a second conductor layer provided on the resin layer and at least a portion of which overlaps with the first conductor layer; [Form 2] The wiring body described in form 1, wherein the first conductor layer has a first portion extending in a first direction, which is the arrangement direction of the plurality of terminal conductive wires, so as to connect the plurality of terminal conductive wires that constitute the terminal side ends of the conductor pattern among the plurality of conductive wires. [Form 3] The wiring body according to aspect 2, wherein the first portion extends in the first direction so as to connect all of the plurality of terminal conductive wires. [Form 4] A wiring body described in form 2 or 3, wherein the first conductor layer has a second portion extending from one end of the first portion in the first direction in a second direction perpendicular to the first direction. [Form 5] 5. The wiring body according to any one of embodiments 1 to 4, wherein the conductor pattern is a mesh-like pattern. [Form 6] The wiring body according to embodiment 5, wherein the aspect ratio of the conductive lines constituting the mesh pattern, obtained by dividing the height by the width, is greater than 1, and the aspect ratio of the first conductive layer, obtained by dividing the height by the width, is less than 1. [Form 7] 7. The wiring body according to any one of embodiments 1 to 6, wherein the first conductor layer is formed in a frame shape. [Form 8] The wiring body according to embodiment 7, wherein the first conductor layer has a region on the wall surface side of the second trench in the resin layer where a metal different from the metal constituting the conductor pattern is present. [Form 9] The wiring body according to embodiment 7 or 8, wherein an outer edge of the second conductor layer is disposed inside an outer edge of the first conductor layer in plan view. [Form 10] 10. The wiring body according to any one of modes 1 to 9, wherein the second conductor layer has a surface roughness greater than that of the first conductor layer. [Form 11] 11. The wiring component according to any one of embodiments 1 to 10, wherein the first conductor layer has a region on the substrate side where a metal different from the metal constituting the conductor pattern is present. [Form 12] A display device comprising the wiring body according to any one of the first to eleventh aspects. [Form 13] An antenna comprising the wiring body according to any one of the first to eleventh embodiments. [Explanation of symbols]
[0078] 1...light-transmitting substrate (substrate), 1S...main surface of substrate, 7A...insulating resin portion (resin layer), 21...electrode, 22...terminal, 50...conductor pattern, 55...conductor layer, 56...second conductor layer, 57...first conductor layer, 60...first trench, 64...second trench, 72, 73...region, 100...display device, 200...wiring body, 300...antenna.
Claims
1. an electrode having a conductor pattern including a plurality of openings; a terminal connected to the electrode; a resin layer provided on the substrate, the conductor pattern of the electrode is disposed in a first trench provided in the resin layer; The terminal is a first conductor layer connected to at least one of the plurality of conductive lines constituting the conductor pattern and disposed in a second trench provided in the resin layer; a second conductor layer provided on the resin layer and at least a portion of which overlaps with the first conductor layer;
2. 2. The wiring body according to claim 1, wherein the first conductor layer has a first portion extending in a first direction, which is an arrangement direction of the plurality of terminal conductive wires, so as to connect a plurality of terminal conductive wires among the plurality of conductive wires that constitute ends of the terminal side of the conductor pattern.
3. The wiring body according to claim 2 , wherein the first portion extends in the first direction so as to connect all of the plurality of terminal conductive lines.
4. The wiring body according to claim 2 , wherein the first conductor layer has a second portion extending from one end of the first portion in the first direction in a second direction perpendicular to the first direction.
5. The wiring body according to claim 1 , wherein the conductor pattern is a mesh-like pattern.
6. 6. The wiring body according to claim 5, wherein an aspect ratio of the height of the conductive lines constituting the mesh-like pattern divided by the width thereof is greater than 1, and an aspect ratio of the height of the first conductor layer divided by the width thereof is less than 1.
7. The wiring body according to claim 1 , wherein the first conductor layer is formed in a frame shape.
8. The wiring body according to claim 7 , wherein the first conductor layer has a region on the wall surface side of the second trench in the resin layer where a metal different from a metal constituting the conductor pattern is present.
9. The wiring body according to claim 7 , wherein an outer edge of the second conductor layer is disposed inside an outer edge of the first conductor layer in a plan view.
10. The wiring body according to claim 1 , wherein the second conductor layer has a surface roughness greater than that of the first conductor layer.
11. The wiring body according to claim 1 , wherein the first conductor layer has a region on the substrate side where a metal different from a metal constituting the conductor pattern is present.
12. A display device comprising the wiring body according to any one of claims 1 to 11.
13. An antenna comprising the wiring body according to any one of claims 1 to 11.
Citation Information
Patent Citations
Capacitive transparent conductive film and method for manufacturing the same
JP2015517193A