Substrate stage, substrate carry-out method, exposure apparatus, and article manufacturing method

The substrate stage with a guided unloading mechanism addresses the complexity and dust challenges of horizontal and vertical substrate movement, ensuring efficient and clean substrate transfer in exposure apparatuses.

JP2026002991APending Publication Date: 2026-01-08CANON KK
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
JP2025179564
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-10-24
Publication Date
2026-01-08

AI Technical Summary

Technical Problem

The substrate unloading operation in exposure apparatuses requires mechanisms that move the substrate stage horizontally and vertically, leading to challenges in designing a compact layout and increased risk of dust and dirt accumulation due to cable interactions, which can negatively impact exposure performance.

Method used

A substrate stage with an unloading mechanism that includes a holding section, a drive section, and a guide mechanism, allowing the holding section to move in a first direction parallel to the substrate surface, guiding it to receive and transfer substrates between mounting tables without the need for separate vertical movement components, thus simplifying the configuration and reducing dust generation.

Benefits of technology

The solution provides a simple and efficient substrate stage configuration that reduces design complexity and dust-related issues, enhancing exposure apparatus performance by minimizing cable interference and maintaining cleanliness.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 2026002991000001_ABST
    Figure 2026002991000001_ABST
Patent Text Reader

Abstract

To provide a substrate stage having a simple structure.SOLUTION: The carry-out mechanism includes a holding unit configured to hold the substrate, a driving unit configured to be driven in a first direction parallel to a contact surface of the substrate where the holding unit and the substrate are in contact with each other, a driving control unit configured to control the driving unit, and a first guide configured to guide a movement of the holding unit, the holding unit is connected to the first guide so as to move in accordance with driving of the driving unit, the first guide guides the holding unit so as to lift the holding unit when the driving control unit controls the driving unit to drive in the first direction, the holding part receives the substrate from a first placing table on which the substrate is placed, moves the substrate placed on the holding part by guiding the holding part along the first direction, and delivers the substrate placed on the holding part to a second placing table provided outside the substrate stage by guiding the holding part so as to lower the holding part.SELECTED DRAWING: Figure 2
Need to check novelty before this filing date? Find Prior Art

Description

[Technical Field]

[0001] The present invention relates to a substrate stage, a substrate carrying-out method, an exposure apparatus, and a method for manufacturing an article. [Background technology]

[0002] In the lithography process used in the manufacture of liquid crystal panels, organic EL displays, semiconductor devices, etc., an exposure apparatus is used to transfer a pattern from an original onto a substrate coated with a photosensitive agent. In the lithography process, an exposure apparatus that can efficiently transport substrates is required to avoid a decrease in productivity.

[0003] Patent Document 1 discloses that substrate exchange can be performed quickly by carrying out the operation of unloading an exposed substrate and carrying in the operation of the next substrate to be exposed in parallel. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-146045 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the substrate unloading operation requires a mechanism to move the substrate stage holding the substrate horizontally and a mechanism to move the substrate stage vertically, and each mechanism requires corresponding moving mounting parts such as electrical cables and tubes. Arranging a large number of cables in a limited space is difficult to design, and there is also a high risk of dust and dirt being generated by cables coming into contact with each other, which could have a negative impact on exposure performance.

[0006] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a substrate stage that is advantageous in terms of having a simple configuration. [Means for solving the problem]

[0007] In order to achieve the above object, one aspect of the present invention provides a substrate stage having an unloading mechanism for unloading a substrate, the unloading mechanism comprising: a holding section for holding the substrate; a drive section capable of driving in a first direction parallel to a contact surface of the substrate where the holding section and the substrate are in contact; a drive control section for controlling the drive section; and a first guide for guiding the movement of the holding section, the holding section being connected to move in accordance with the driving of the drive section, and the first guide, when the drive control section controls the drive section to drive in the first direction, guides the holding section to raise the holding section, thereby causing the holding section to receive the substrate from a first mounting table on which the substrate is placed, by guiding the holding section along the first direction, thereby moving the substrate placed on the holding section, and guiding the holding section to lower the holding section, thereby transferring the substrate placed on the holding section to a second mounting table provided outside the substrate stage. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a substrate stage that is advantageous in terms of having a simple configuration. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic diagram showing the configuration of an exposure apparatus. [Figure 2] FIG. 2 is a schematic diagram of a substrate stage 6 in the first embodiment. [Figure 3] FIG. 3 is a detailed view of a cam follower in the first embodiment. [Figure 4] FIG. 3 is a diagram for explaining a substrate carry-out mechanism in the first embodiment. [Figure 5] FIG. 10 is a diagram for explaining a substrate carry-out mechanism in the second embodiment. [Figure 6] FIG. 10 is a detailed view of a cam follower in the second embodiment. [Figure 7] FIG. 10 is a diagram for explaining wire driving. [Figure 8] 10A and 10B are diagrams for explaining a substrate carry-out mechanism in the third embodiment. [Figure 9] FIG. 10 is a top view of a substrate stage according to a third embodiment. [Figure 10] FIG. 10 is a detailed view of a cam follower in the third embodiment. [Figure 11] FIG. 10 is a top view showing the state in which the substrate is transferred to the buffer stage. [Figure 12] FIG. 10 is a top view of the substrate carry-out mechanism and the ωZ stopper. [Figure 13] FIG. 10 is a diagram showing the optimum shape of the base. [Figure 14] 10 is a flowchart showing the process from the end of exposure of one substrate to the start of exposure of the next substrate. DETAILED DESCRIPTION OF THE INVENTION

[0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to designate the same components, and redundant explanations will be omitted.

[0011] First Embodiment The configuration of an exposure apparatus in this embodiment will be described. The exposure apparatus in this embodiment is an apparatus used in lithography processes when manufacturing devices such as semiconductor devices and flat panel displays (FPDs). The exposure apparatus transfers the pattern of an original (mask) onto a substrate coated with resist, thereby forming a latent image pattern in a pattern area on the substrate. The exposure apparatus in this embodiment is a so-called step-and-scan scanning exposure apparatus that transfers the pattern of the original onto multiple pattern areas on the substrate via a projection optical system.

[0012] 1 is a schematic diagram showing the configuration of an exposure apparatus 100 in this embodiment. In this embodiment, a coordinate system is defined with the surface on which the substrate P is placed as the XY plane, and the direction perpendicular to the XY plane as the Z direction. The exposure apparatus 100 can include an illumination optical system 1, an alignment measurement unit 2a, off-axis measurement units 2b and 2c, an original stage 3, a control unit 4, a projection optical system 5, and a substrate stage 6.

[0013] Light emitted from a light source (not shown) illuminates the original M via an optical system within the illumination optical system 1. The illumination optical system 1 has a member that defines the area that illuminates the original M, and for example, a strip-shaped or arc-shaped light is illuminated onto the original M.

[0014] The original M and substrate P (e.g., a glass substrate, a wafer) are held by an original stage 3 and a substrate stage 6, respectively, and are positioned at positions that are approximately optically conjugate via the projection optical system 5 (the object plane and image plane of the projection optical system 5).

[0015] The projection optical system 5 is, for example, a mirror projection type projection optical system composed of multiple mirrors, has a predetermined projection magnification (for example, 1x, 1 / 2x, 2x, etc.), and projects the pattern formed on the original M onto the substrate P.

[0016] The original stage 3 and the substrate stage 6 scan in a direction (Y direction in this embodiment) perpendicular to the optical axis direction (Z direction) of the projection optical system 5, in synchronization with each other, at a speed ratio according to the projection magnification of the projection optical system 5.

[0017] The exposure apparatus 100 can complete the exposure process for one substrate P by sequentially repeating the stepwise movement of the substrate stage 6 for each of the multiple pattern areas on the substrate P. When transferring the pattern of the original M to each pattern area on the substrate P in this way, the pattern area and the original M may need to be aligned.

[0018] The exposure apparatus 100 has an alignment measurement unit 2a between the illumination optical system 1 and the original M, and the alignment measurement unit 2a includes at least one alignment scope. In this embodiment, the alignment measurement unit 2a has two alignment scopes that are spaced a predetermined distance apart in the X direction. Furthermore, the exposure apparatus 100 is configured so that each alignment scope can be driven in the XY plane. Therefore, the alignment measurement unit 2a can observe each of the alignment marks formed in the pattern area on the substrate P and each of the alignment marks formed on the original M via the projection optical system 5.

[0019] Furthermore, off-axis measurement units 2b and 2c are provided between the projection optical system 5 and the substrate P, and the off-axis measurement units 2b and 2c each include at least one off-axis scope. In this embodiment, the off-axis measurement units 2b and 2c each have two off-axis scopes spaced a predetermined distance apart in the X direction. Furthermore, the exposure apparatus 100 is configured so that each off-axis scope can be driven in the XY plane. Therefore, the off-axis measurement units 2b and 2c can observe each of the alignment marks formed in the pattern area on the substrate P. The control unit 4 controls each unit of the exposure apparatus 100.

[0020] 2 is a cross-sectional view of substrate stage 6 in this embodiment. Substrate stage 6 has mounting base 20, X driver 30, air bearings 30a, 50a, Y driver 50, Y guide 60, drive controller 80, X bar mirror 90, and support columns 201, 202. Substrate stage 6 also has Y guide 401, Y driver 402 (driver), Z guide 403, base 404, first guide 410a, second guide 410b, cam followers 420a, 420b, and holders 430a, 430b. In this embodiment, Y guide 401, Y drive unit 402 (drive unit), Z guide 403, base 404, first guide 410a, second guide 410b, cam followers 420a, 420b, and holders 430a, 430b are also collectively referred to as a substrate unloading mechanism (unloading mechanism). The substrate unloading mechanism is a mechanism provided for unloading substrate P after exposure. Furthermore, first guide 410a, second guide 410b, and cam followers 420a, 420b are also collectively referred to as a guide mechanism.

[0021] Mounting table 20 mounts substrate P (e.g., a rectangular glass substrate). X driving unit 30 drives Y driving unit 50 in the X direction via air bearing 30a using a linear motor or the like (not shown). Mounting table 20 is fixed to X driving unit 30 via supports 201 and 202. Y driving unit 50 drives Y guide 60 in the Y direction via air bearing 50a using a linear motor or the like (not shown). A substrate unloading mechanism may be configured on X driving unit 30. Substrate stage 6 is driven and controlled by drive control unit 80. X bar mirror 90 reflects light from an interferometer (not shown) and may be used to position substrate P in the X coordinate. Although not shown in FIG. 1 , a Y bar mirror may be arranged to position substrate P in the Y coordinate.

[0022] Y guide 401 is a Y-direction guide for the substrate discharge mechanism and is configured to be disposed on the upper surface of X driver 30. Y driver 402 drives in the Y direction along Y guide 401. Y driver 402 may be a linear guide or the like. Z guide 403 is a Z-direction guide for the substrate discharge mechanism and is connected to Y driver 402. Z driver 405 is connected to base 404 and drives base 404 in the Z direction by driving along Z guide 403. Cam followers 420a and 420b are cylindrical shafted bearings provided on base 404 and are disposed spaced apart from each other in the Y direction. First guide 410a and second guide 410b are rails with sliding surfaces and are disposed spaced apart from each other in the Z direction. Cam followers 420a and 420b drive along the sliding surfaces of first guide 410a or second guide 410b provided in the substrate discharge mechanism.

[0023] First guide 410a is a guide rail for the outward journey, and 410b is a guide rail for the return journey. The sliding surface of second guide 410b is located lower than the sliding surface of first guide 410a. A force is applied to base 404 and Z drive unit 405 due to their own weight, always driving them in the -Z direction along Z guide 403. Cam followers 420a and 420b contact the sliding surface of first guide 410a or second guide 410b, thereby supporting the weight of base 404 and Z drive unit 405.

[0024] Holding portions 430a and 430b hold substrate P and are formed on the upper surface of base 404. Since the substrate carry-out mechanism is driven at high acceleration in the horizontal direction, it is preferable that holding portions 430a and 430b have high frictional force to prevent substrate P from slipping.

[0025] FIG. 3 is a diagram illustrating the detailed configuration of cam followers 420a and 420b provided on base 404. As shown in FIG. 3(a), base 404 may further include Z guide 421 for deflection, Z drive unit 422 for deflection, spring 423 for deflection, and mechanical stopper 424. These components may be arranged to drive cam follower 420b in the Z direction. Below, a configuration in which only cam follower 420b is configured to be driven in the Z direction and cam follower 420a is fixed will be described, but this is not limiting. For example, depending on the shapes of first guide 410a and second guide 410b, only cam follower 420a may be configured to be driven in the Z direction, or both cam follower 420a and cam follower 420b may be configured to be driven in the Z direction. Furthermore, the configuration may be such that they can be driven in a direction deviated from the Z direction. That is, at least one of cam follower 420a and cam follower 420b may be configured to be capable of being driven up and down.

[0026] Deflecting Z guide 421 is fixed to base 404, and deflecting Z drive unit 422 drives in the Z direction along deflecting Z guide 421. In this embodiment, cam follower 420b is connected to deflecting Z drive unit 422, and cam follower 420a is connected to base 404. Deflecting spring 423 is connected to deflecting Z drive unit 422 and base 404. Mechanical stopper 424 is connected to base 404 and is arranged so that a portion of the upper surface of deflecting Z drive unit 422 and a portion of the lower surface of mechanical stopper 424 are in contact. Since mechanical stopper 424 and deflecting Z drive unit 422 are always in contact, mechanical stopper 424 is arranged to generate tension in deflecting spring 423. For the avoiding spring 423, a spring having a spring constant such that the tension is greater than the gravity of the cam follower 420b and the avoiding Z drive part 422 can be used.

[0027] When an external force equal to or greater than a predetermined value is applied to cam follower 420b in the -Z direction, deflection spring 423 expands, as shown in FIG. 3(b), and cam follower 420b and deflection Z drive unit 422 are driven in the -Z direction along deflection Z guide 421. When the external force falls below a predetermined value, deflection spring 423 drives cam follower 420b and deflection Z drive unit 422 in the +Z direction. Then, as shown in FIG. 3(a), cam follower 420b and deflection Z drive unit 422 come to rest at a position where mechanical stopper 424 and deflection Z drive unit 422 come into contact. In this way, the Z direction positions of cam follower 420b and deflection Z drive unit 422 always return to the same position even when subjected to an external force. To improve reproducibility, the contact surface of mechanical stopper 424 that comes into contact with the flat surface of deflection Z drive unit 422 is preferably spherical. Alternatively, the contact surface of deflection Z drive unit 422 may be spherical, and the contact surface of mechanical stopper 424 may be flat. To reduce the load on deflection Z guide 421, it is also preferable that the center of cam follower 420b and the Y coordinate position of deflection Z guide 421 coincide.

[0028] Next, the substrate carry-out operation of the substrate carry-out mechanism will be described with reference to Fig. 4. In Fig. 4, the substrate carry-out operation is the operation of carrying out the substrate P for which exposure processing has been completed from the substrate stage 6 to a buffer table 70 arranged outside the exposure apparatus 100. As shown in Fig. 4, the buffer table 70 is made up of a base plate and pins, and is configured so that the substrate P can be received by the pins.

[0029] The substrate unloading operation is divided into an outgoing operation and a returning operation. First, the outgoing operation will be described with reference to Figures 4(a) to 4(f). Here, the outgoing operation is the operation performed by the substrate unloading mechanism from the origin position to transfer the substrate P to the buffer table 70.

[0030] 4(a) is a diagram showing a state in which the substrate discharge mechanism is at the origin position. At this time, the standby position of the substrate discharge mechanism is located below the upper surface of the mounting table 20, the mounting table 20 holds the substrate P, and the holders 430a and 430b do not hold the substrate P.

[0031] When the substrate unloading operation starts, Y drive unit 402 drives in the -Y direction along Y guide 401, and as a result of this driving, Z guide 403, Z drive unit 405, base 404, and cam followers 420a and 420b, which are connected to Y drive unit 402, also drive in the -Y direction. Cam followers 420a and 420b drive along the sliding surface of first guide 410a.

[0032] As shown in FIG. 4(b), when Y driver 402 is further driven in the -Y direction, cam follower 420b is also driven in the +Z direction along first guide 410a, and base 404 and Z driver 405 connected to cam follower 420b are driven along Z guide 403. The amount of drive in the Z direction during this drive depends on the shape of first guide 410a, and the upper surfaces of holders 430a and 430b become higher than the upper surface of mounting table 20. Furthermore, the shape of first guide 410a can be designed so that when the substrate unloading mechanism unloads substrate P, the substrate P is at a height that does not contact mounting table 20 due to deflection of substrate P in the Z direction. As a result of this drive, the upper surfaces of holders 430a and 430b come into contact with the lower surface of substrate P, and substrate P is held by holders 430a and 430b, and substrate P is lifted in the +Z direction according to the amount of drive of first guide 410a in the Z direction.

[0033] That is, while Y driving unit 402 is driven in a predetermined linear direction, first guide 410a can guide holders 430a, 430b in a direction (diagonal direction) different from the linear direction. Furthermore, the linear direction is a direction parallel to the contact surface of substrate P where substrate P comes into contact with holders 430a, 430b. First guide 410a is configured to be able to lift holders 430a, 430b as Y driving unit 402 is driven. Specifically, first guide 410a or second guide 410b has a shape that includes a guide that extends in the linear direction (first direction) and a guide that extends in a direction (diagonal direction) different from the linear direction.

[0034] As shown in FIG. 4(c), when Y driver 402 is further driven in the −Y direction, cam followers 420a and 420b are driven along the sliding surface of first guide 410a. Then, base 404, holders 430a and 430b, and substrate P are driven in the −Y direction while maintaining the height (Z coordinate position) shown in FIG. 4(b). At this time, it is sufficient that at least one of cam follower 420a and cam follower 420b is in contact with first guide 410a. To prevent substrate P from shifting in the horizontal direction during the driving, the acceleration of Y driver 402 can be set so that the frictional force at the contact surface between substrate P and holders 430a and 430b is greater than the inertial force associated with driving.

[0035] 4(d), when Y drive unit 402 is further driven in the -Y direction, cam follower 420a is driven along the sliding surface of first guide 410a, and cam follower 420b deviates from the sliding surface of first guide 410a. In other words, only cam follower 420a is in contact with the sliding surface of first guide 410a.

[0036] As shown in FIG. 4( e), when Y driver 402 is further driven in the −Y direction, cam follower 420a is driven along the sliding surface of first guide 410a, and base 404 and Z driver 405 are driven in the −Z direction along Z guide 403. At this time, if the drive amount in the −Z direction is set so that the upper surfaces of holders 430a and 430b are positioned lower than the upper surfaces of the pins of buffer table 70, substrate P is released from the substrate unloading mechanism and transferred to buffer table 70. While holders 430a and 430b are holding substrate P during driving, substrate P, base 404, and Z driver 405 are driven with acceleration in the −Z direction, reducing the normal force on substrate P and the frictional force. At this time, the acceleration of Y driver 402 can be set so that substrate P does not move horizontally on holders 430a and 430b.

[0037] That is, first guide 410a is configured so that holding portions 430a and 430b can be lowered as Y driving portion 402 is driven.

[0038] As shown in Figure 4(f), when Y driver 402 is further driven in the -Y direction, cam follower 420a, like cam follower 420b, also deviates from the sliding surface of first guide 410a. Then, base 404 and Z driver 405 are driven in the -Z direction along Z guide 403 by their own weight. Thereafter, at least one of cam follower 420a and cam follower 420b comes into contact with the sliding surface of second guide 410b, causing base 404 and Z driver 405 to move to a position lower than the height in the Z direction shown in Figure 4(e).

[0039] The foregoing is the description of the outgoing operation. Next, the return operation will be described with reference to Figures 4(g) to 4(j). The return operation is an operation in which the substrate unloading mechanism, having handed over the substrate to buffer 70, returns to its origin position.

[0040] As shown in Figure 4(g), when the Y drive unit 402 is driven in the +Y direction, the cam followers 420a and 420b are driven along the sliding surface of the second guide 410b, and the base 404 and the Z drive unit 405 are driven in the +Y direction while maintaining the height shown in Figure 4(f).

[0041] As shown in Figure 4(h), when Y drive unit 402 is further driven in the +Y direction, cam follower 420a is driven along the sliding surface of second guide 410b, and base 404 and Z drive unit 405 are driven in the +Z direction along Z guide 403. At this time, cam follower 420b comes into contact with the lower surface of first guide 410a, and cam follower 420b receives an external force in the -Z direction, so that cam follower 420b and deflection Z drive unit 422 are driven in the -Z direction along deflection Z guide 421, as shown in Figure 3(b). Due to the driving of cam follower 420b and deflection Z drive unit 422, base 404 and Z drive unit 405 can be driven in the +Z direction even if cam follower 420b comes into contact with the lower surface of first guide 410a.

[0042] As shown in FIG. 4(i), when Y drive unit 402 is further driven in the +Y direction, cam follower 420a is driven along the sliding surface of second guide 410b, and base 404 and Z drive unit 405 are driven in the +Z direction along Z guide 403. At this time, cam follower 420b separates from the lower surface of first guide 410a, and cam follower 420a and deflection Z drive unit 422 are driven in the +Z direction along deflection Z guide 421 by deflection spring 423. Then, by coming into contact with mechanical stopper 424, cam follower 420b returns to its original position, as shown in FIG. 3(a).

[0043] As shown in FIG. 4(j), when Y driver 402 is driven in the -Y direction, cam follower 420a is driven along the sliding surface of second guide 410b. The shapes of first guide 410a and second guide 410b can be designed so that the amount of drive in the -Y direction at this time can be such that cam follower 420b can be driven until it contacts the sliding surface of first guide 410a. By driving further in the -Y direction, the substrate discharge mechanism can be returned to the origin position shown in FIG. 4(a).

[0044] 4(b) is also referred to as a holding step in which substrate P is held by holders 430a and 430b. Also, FIGS. 4(c) to 4(e) are also referred to as a driving step in which holders 430a and 430b are driven by driving Y drive unit 402 in a linear direction (-Y direction). In this embodiment, the Y drive unit is driven in a predetermined direction (-Y direction), and then driven in the opposite direction (+Y direction) to the predetermined direction, whereby base 404 carries out the substrate and then returns it to the origin. A method including these steps is also referred to as a substrate moving method.

[0045] In this embodiment, two cam followers are arranged so that when the substrate unloading mechanism performs a substrate unloading operation, the driving of cam followers 420a and 420b is not hindered and the substrate unloading mechanism can return to its origin. Cam follower 420a has the role of driving base 404 in the +Z direction as shown in FIGS. 4(g) to 4(i), and cam follower 420b has the role of maintaining the position of base 404 in the Z direction as shown in FIG. 4(j). Note that the number of cam followers is not limited to two, and three or more may be arranged as long as the above-described operation is possible. The arrangement and shape of first guide 410a and second guide 410b are not limited to those shown in FIG. 2, and other arrangements and shapes may be used as long as the above-described operation can be realized.

[0046] In this embodiment, by controlling the Y drive unit 402 with the drive control unit 80, it is possible to drive not only in the horizontal direction but also in the vertical direction. In other words, there is no need to provide a separate Z direction drive unit, and the moving mounting unit of the substrate stage can be configured simply. As a result, the difficulty of design and the risk of dust generation can be reduced.

[0047] Second Embodiment In the first embodiment, a configuration was described in which the cam follower 420b comes into contact with the lower surface of the first guide 410a during the substrate unloading operation, thereby allowing the substrate unloading mechanism to return to the origin position. In this embodiment, an example different from the first embodiment will be described. Matters not mentioned in this embodiment will follow the first embodiment.

[0048] Next, the substrate unloading operation of this embodiment will be described with reference to Fig. 5. Figs. 5(a) to 5(h) are views showing the substrate unloading operation. In the first embodiment, base 404 was configured to always receive a force in the -Z direction due to its own weight, but in this embodiment, base 404 is configured to always receive a force in the direction opposite to gravity (+Z direction) by compression coil spring 460. That is, as Y drive unit 402 is driven in the Y direction, cam followers 420a and 420b are driven along the lower surfaces of first guide 450a and second guide 450b, rather than their upper surfaces.

[0049] Compression coil spring 460 is connected to the upper surface of Y drive unit 402 and the lower surface of base 404. With this configuration, base 404 and Z drive unit 405 are constantly subjected to a force in the +Z direction by compression coil spring 460 along Z guide 403. First guide 450a and second guide 450b are guide rails having sliding surfaces for cam followers 420a and 420b, and the force of compression coil spring 460 is applied to the contact surfaces between cam followers 420a, 420b and first guide 450a and second guide 450b. Compression coil spring 460 is one of the guide mechanisms.

[0050] In this embodiment, as shown in Figures 5(d) to (f), base 404 is driven in the -Z direction, and two cam followers are required to maintain the height in the Z direction. In this embodiment, cam follower 420b plays a role in driving base 404 in the -Z direction as shown in Figures 5(d) and (e), and cam follower 420a plays a role in maintaining the position of base 404 in the Z direction as shown in Figure 5(f). Also, cam follower 420a comes into contact with the upper surface of second guide 450b, but can avoid second guide 450b using the configuration described below.

[0051] Here, the configuration of cam followers 420a and 420b in this embodiment will be described in detail with reference to Figure 6. The difference from the first embodiment is that cam follower 420a is connected to avoiding Z drive unit 422, cam follower 420b is connected to 404, and avoiding spring 425 is connected to avoiding Z drive unit 422 and base 404. Another difference from the first embodiment is that a force in the -Z direction is always applied to Z drive unit 422, changing the orientation of mechanical stopper 424 so that the upper surface of mechanical stopper 424 and the lower surface of avoiding Z drive unit 422 come into contact.

[0052] Mechanical stopper 424 is installed to compress deflection spring 425 so that mechanical stopper 424 and deflection Z drive unit 422 are always in contact. With the above configuration, when an external force in the +Z direction is applied to cam follower 420a, deflection spring 425 is compressed as shown in FIG. 6(b), and cam follower 420a and deflection Z drive unit 422 are driven in the +Z direction. When the external force is removed, compressed deflection spring 425 and gravity drive cam follower 420a and deflection Z drive unit 422 in the -Z direction, and they come to rest at a position where deflection Z drive unit 422 and mechanical stopper 424 come into contact. With the configuration of FIG. 6 in this way, when no external force is applied or when the external force is removed, cam follower 420a and deflection Z drive unit 422 always remain in the same position in the Z direction.

[0053] Returning to the explanation of Figures 5(a) to 5(h), as shown in Figure 5(a), the standby position of the substrate carry-out mechanism is located below the upper surface of the mounting table 20. This position is also called the origin position.

[0054] 5(b), when Y driving unit 402 is further driven in the -Y direction, cam follower 420a receives the force of compression coil spring 460 in the +Z direction and is driven in the +Z direction along the lower surface of guide rail 450a. Then, base 404 connected to cam follower 420a and Z driving unit 405 connected to base 404 are driven in the +Z direction along Z guide 403. The amount of drive in the Z direction in this drive depends on the shape of first guide 450a, and as in the first embodiment, the shape can be designed so that the upper surfaces of holders 430a and 430b are higher than the upper surface of mounting table 20.

[0055] As shown in FIG. 5(c), when Y drive portion 402 is further driven in the −Y direction, cam followers 420a and 420b slide on the lower surface of first guide 450a.

[0056] 5(d), when Y driving unit 402 is further driven in the -Y direction, cam follower 420b is driven along the sliding surface of guide rail 450a, and base 404 and Z driving unit 405 are driven in the -Z direction along Z guide 403. At this time, the upper surfaces of holders 430a and 430b are positioned lower than the upper surfaces of the pins of buffer table 70, causing substrate P to separate from the substrate unloading mechanism and be delivered to buffer table 70. As in the first embodiment, the normal force on substrate P is reduced and the amount of friction is reduced, so the acceleration of Y driving unit 402 can be set so that substrate P does not move in the horizontal direction.

[0057] During the above-described driving, cam follower 420a comes into contact with the upper surface of second guide 450b, and cam follower 420a receives an external force in the +Z direction, so that cam follower 420a and Z deflection drive unit 422 are driven in the +Z direction along Z deflection guide 421, as shown in Figure 6(b). Due to the above-described driving of cam follower 420a and Z deflection drive unit 422, base 404 and Z drive unit 405 can be driven in the -Z direction even if cam follower 420a comes into contact with the upper surface of second guide 450b.

[0058] As shown in Figure 5(e), when Y drive unit 402 is further driven in the -Y direction, cam follower 420b is driven along the sliding surface of first guide 450a, and base 404 and Z drive unit 405 are further driven in the -Z direction along Z guide 403. At this time, cam follower 420a separates from the upper surface of second guide 450b, and cam follower 420a and deflection Z drive unit 422 are driven in the -Z direction along deflection Z guide 421 by deflection spring 425 and its own weight. Then, cam follower 420a comes into contact with mechanical stopper 424 as shown in Figure 6(a), returning to its original position.

[0059] As shown in FIG. 5(f), when Y driver 402 is driven in the +Y direction, cam follower 420b is driven along the sliding surface of first guide 450a, and base 404 and Z driver 405 are driven in the +Y direction. Even if cam follower 420b contacts the sliding surface of first guide 450a and separates from the sliding surface of second guide 450b, base 404 and Z driver 405 can be driven in the +Y direction while maintaining their height in the Z direction in FIG. 5(e). To enable this driving, the distance in the Y direction between first guide 450a and second guide 450b can be designed to be larger than the diameters of cam followers 420a and 420b but smaller than the distance in the Y direction between cam followers 420a and 420b. By setting the Z-direction position of the sliding surface of the second guide 450b at the same position as the lowest surface of the sliding surface of the first guide 450a, or at a position lower than that position, the base 404 can be driven without the upper surfaces of the holding portions 430a, 430b coming into contact with the lower surface of the substrate P.

[0060] As shown in FIG. 5(g), when Y drive portion 402 is further driven in the +Y direction, cam followers 420a and 420b slide on the lower surface of second guide 450b.

[0061] 5(h), when Y drive unit 402 is further driven in the +Y direction, cam followers 420a and 420b deviate from the sliding surface of second guide 450b. Then, compressed compression spring 460 drives base 404 and Z drive unit 405 in the +Z direction along Z guide 403 until cam follower 420a or 420b contacts the sliding surface of first guide 450a. This driving allows base 404 to return to the origin position.

[0062] Y drive unit 402 can be, for example, a linear motor, a ball screw, or a wire drive. Fig. 7 is a diagram showing an example of wire drive. Wire 82 is connected to Y drive unit 402, and wire 82 is configured to drive Y drive unit 402 by the rotation of drum 83. Y drive unit 402 forms motor 81 for rotating drum 83, and motor 81 is controlled by drive control unit 80.

[0063] In this embodiment, by controlling the Y drive unit 402 with the drive control unit 80, it is possible to drive not only in the horizontal direction but also in the vertical direction. In other words, there is no need to provide a separate Z direction drive unit, and the moving mounting unit of the substrate stage can be configured simply. As a result, the difficulty of design and the risk of dust generation can be reduced.

[0064] <Third embodiment> In this embodiment, a substrate carry-out mechanism having a different configuration from that of the first and second embodiments will be described. Matters not mentioned in this embodiment will follow those of the second embodiment.

[0065] The substrate unloading operation of this embodiment will be described with reference to Figure 8. Figures 8(a) to (k) are views showing the substrate unloading operation. The difference from the second embodiment is that four cam followers 420a to 420d are provided on the base 404. Note that this embodiment is configured with six guides, and the respective guides are referred to as first guide 450a, first guide 450b, third guide 481, fourth guide 483, fifth guide 482, and sixth guide 484.

[0066] Bearing unit 470 in FIG. 8(a) is configured on Z drive unit 405 and base 404. It is mounted so that the X-axis serves as the axis of rotation. This configuration allows base 404 to rotate in the pitching direction (X-axis as the axis of rotation) relative to Z drive unit 405. Portions of base 404 that are distant in the -Y direction from bearing unit 470 and compression spring 460 (specifically, the portions where cam followers 420c and 420d in FIG. 8 are installed) are subjected to gravity due to their own weight in the -Z direction with bearing unit 470 as the center of rotation. The weight is supported by the contact surfaces between cam follower 420c and third guide 481 and fourth guide 483, or the contact surfaces between cam follower 420d and third guide 481, fifth guide 482, and sixth guide 484. The third guide 481 and the fourth guide 483 are installed in the X drive unit 30, and the fifth guide 482 and the sixth guide 484 are installed in the buffer table .

[0067] In the first and second embodiments, the base 404 is supported by a cantilever, and vibrations in the Z direction while the base 404 is being unloaded from the substrate can become a problem. On the other hand, in this embodiment, the configuration allows the cam followers 420a to 420d to support both ends of the base 404, and therefore the vibrations can be reduced.

[0068] The relationship in the X direction between cam followers 420c and 420d and third to sixth guides 481 to 484 is shown in Figure 9. Figure 9 shows the substrate unloading unit 40 of Figure 8 as viewed from the +Z direction. As shown in Figure 9, cam followers 420c and 420d are positioned at positions offset in the X direction. In this embodiment, cam follower 420c is positioned in the -X direction, and cam follower 420d is positioned in the +X direction. Third guide 481 has a sliding surface that is wide in the X direction so that it can come into contact with both cam followers 420c and 420d. Fifth guide 482 and sixth guide 484 have sliding surfaces that only come into contact with cam follower 420d, and fourth guide 483 has a sliding surface that only comes into contact with cam follower 420c.

[0069] Cam follower 420c has the role of supporting the base 404's own weight when it is on the stage side, and cam follower 420d has the role of supporting the base's own weight when it is on the stage side and on the buffer table 70. They are also arranged so that they can return to their origin when performing the substrate unloading operation as shown in FIGS. 8(i) to (k). The configuration shown in FIG. 10 is such that cam follower 420d can avoid third guide 481 as shown in FIGS. 8(i) and 8(j). The configurations in FIGS. 10(a) and 10(b) are similar to those of the second embodiment, although the arrangement positions are different.

[0070] Returning to the description of Fig. 8, in the following description, the same content as in the second embodiment will be omitted, and only the points unique to this embodiment will be described.

[0071] As shown in FIG. 8(a), when Y drive portion 402 is driven in the −Y direction, cam follower 420d is driven along the sliding surface of third guide 481 in the −Y direction.

[0072] As shown in FIG. 8(b), when Y drive portion 402 is further driven in the −Y direction, cam follower 420d is driven in the +Z direction along the sliding surface of third guide 481.

[0073] As shown in FIG. 8(c), when Y driver 402 is further driven in the -Y direction, cam follower 420d drives along the sliding surface of third guide 481. Because the sliding surfaces of third guide 481 and fifth guide 482 are discontinuous, there is a moment when cam follower 420d moves away from the sliding surface of the guide as Y driver 402 drives in the -Y direction. However, because cam follower 420c is in contact with third guide 481, the weight of base 404 and substrate P can be supported by this contact surface. The distance in the Y direction between third guide 481 and fifth guide 482 and the distance between cam followers 420c and 420d are adjusted so that cam follower 420c and third guide 481 come into contact and cam follower 420d and fifth guide 482 installed on buffer stand 70 come into contact. As a result, the base 404, the holders 430a and 430b, and the substrate P are driven in the -Y direction while maintaining the height in the Z direction in FIG. 8(b).

[0074] As shown in FIG. 8( d ), when Y drive portion 402 is further driven in the −Y direction, cam follower 420 d is driven along the sliding surface of fifth guide 482 .

[0075] As shown in Figure 8(e), when Y drive unit 402 is further driven in the -Y direction, cam follower 420d is driven in the -Z direction along the sliding surface of fifth guide 482. If the weight of base 404 is supported by the contact surface between cam follower 420d and fifth guide 482 until substrate P is delivered to buffer stage 70, the orientation of substrate P can be kept horizontal, preventing significant deviation in the placement position of substrate P and damage to substrate P. However, to avoid interfering with the drive of cam follower 420d in the +Y direction in Figures 8(f) and 8(g), the clearance between the bottom surface of fifth guide 482 and the top surface of sixth guide 484 is designed to be larger than the outermost diameter of cam follower 420d.

[0076] As shown in FIG. 8(f), when Y drive section 402 is further driven in the −Y direction, cam follower 420d separates from the sliding surface of fifth guide 482, falls due to its own weight, and comes into contact with sixth guide 484.

[0077] 8(g), when Y drive unit 402 is driven in the +Y direction, cam follower 420d is driven along the sliding surface of sixth guide 484. As Y drive unit 402 is driven in the +Y direction, there is a moment when cam follower 420d moves away from the sliding surface of sixth guide 484. At this time, the Y-direction distance between fourth guide 483 and sixth guide 484 and the Y-direction distance between cam followers 420c and 420d are adjusted so that cam follower 420c comes into contact with the sliding surface of fourth guide 483.

[0078] As shown in FIG. 8(h), when Y drive portion 402 is driven in the +Y direction, cam follower 420c is driven along the sliding surface of fourth guide 483.

[0079] As shown in Figure 8(i), when Y drive unit 402 is further driven in the +Y direction, cam follower 420b moves away from the sliding surface of the second guide, as in the second embodiment, and compression spring 460 drives Z drive unit 405 in the +Z direction along Z guide 403. Meanwhile, cam follower 420c is driven along the sliding surface of fourth guide 483, thereby also driving base 404 in the +Z direction. At this time, cam follower 420d comes into contact with the lower surface of third guide 481 and receives a force in the -Z direction, but as shown in Figure 10(b), avoiding Z drive unit 422 and cam follower 420d are driven in the -Z direction along avoiding Z guide 421.

[0080] As shown in Figure 8(j), when Y drive unit 402 is further driven in the +Y direction, cam follower 420b comes into contact with the sliding surface of first guide 450a, thereby supporting the +Z direction force of compression spring 460, and cam follower 420c is driven along fourth guide 483. At this time, cam follower 420d moves away from the lower surface of third guide 481, is no longer subjected to the -Z direction force, and is driven in the +Z direction by tension spring 423 to a position where avoiding Z drive unit 422 and mechanical stopper 424 come into contact, as shown in Figure 10(a). As a result of this drive, the Z direction position of avoiding Z drive unit 422 comes into contact with mechanical stopper 424, allowing base 404 to return to the same position as in Figure 8(a).

[0081] As shown in FIG. 8(k), when Y drive unit 402 is driven in the -Y direction, cam follower 420b is driven along the sliding surface of first guide 450a, and cam follower 420c is driven along the sliding surface of fourth guide 483. When driven further in the -Y direction than this, cam follower 420c moves away from the sliding surface of fourth guide 483. Therefore, the Y-direction distance between cam followers 420c and 420d or the Y-direction distance between third guide 481 and fourth guide 483 can be adjusted so that cam follower 420d contacts the sliding surface of third guide 481. This driving allows base 404 to return to the original position shown in FIG. 8(a).

[0082] In this embodiment, by controlling the Y drive unit 402 with the drive control unit 80, it is possible to drive not only in the horizontal direction but also in the vertical direction. In other words, there is no need to provide a separate Z direction drive unit, and the moving mounting unit of the substrate stage can be configured simply. As a result, the difficulty of design and the risk of dust generation can be reduced.

[0083] Furthermore, in this embodiment, the base 404 can be driven stably, so that the posture of the substrate P can be kept horizontal, preventing the placement position of the substrate P from shifting significantly and preventing damage to the substrate P.

[0084] Here, FIG. 11 shows the substrate carry-out mechanism and the entire stage as viewed from above when substrate P is placed on buffer table 70. In the first to third embodiments, as shown in FIG. 11, mounting table 20 is divided in the X direction, and the substrate carry-out mechanism is arranged so that it can be driven in the +Z direction through the gaps between the divided mounting table 20. When substrate P is carried out by the substrate carry-out mechanism, the amount of deformation of substrate P in the Z direction is determined by the number of bases 404 and their locations in the X and Y directions, and the number of holders 430a, 430b, their contact area with substrate P, and their locations in the X and Y directions. Furthermore, the amount of drive of bases 404 and Z drive unit 405 in the +Z direction can be greater than the amount of deformation of substrate P.

[0085] 11 , the X direction position of X driver 30 may wait at the position where it has been driven to the maximum in the +X direction, and an X mechanical stopper may be provided to prevent X driver 30 from moving in the +X direction. By performing the substrate unloading operation of base 404 at this standby position, even if the stage runs out of control due to an error or the like, substrate P and X bar mirror 90 will not interfere with each other, and therefore the transfer position of substrate P in the Y direction may be set to a position that overlaps with the Y direction position of X bar mirror 90. By setting this transfer position to this position, the Y direction drive stroke of base 404 can be reduced, and an increase in the external size of X driver 30 in the Y direction can be avoided.

[0086] In the first to third embodiments, the base 404 and the Z drive unit 405 are fixed only to the Z guide 403, and therefore, ω Z Therefore, when driving at high speed, the base 404 and the Z drive unit 405 rotate in the ω direction due to the acceleration and disturbance. z 12, the base 404 and the substrate holder 20 may collide with each other, which may result in damage to the components or the generation of dust. Z Any number of stoppers 100 may be installed on the stage side and the buffer table 70. ZThe clearance between the stopper 100 and the end face of the base 404 is made smaller than the clearance between the end face of the base 404 and the end face of the substrate holding part 20. This prevents the base 404 and the Z driving part 405 from colliding with the substrate holding part 20 even when they are rotated by θ due to an external force, and prevents the base 404 and the Z driving part 405 from colliding with the substrate holding part 20. Z Collision with stopper 100. ω Z The stopper 100 is a rotating body such as a roller, and it is desirable that the contact surface is made of a low-dust generating material such as ultra-high molecular weight polyethylene. Z When the stopper 100 collides, it collides with the corner of the base 404, so the impact force is large and the substrate unloading section 40 and ω Z This may damage the stopper or apply external force to the stage. In order to mitigate the impact force, it is desirable to form the tip of the base 404 in the -Y direction into a tapered shape as shown in FIG.

[0087] In the first to third embodiments, when the cam followers 420a, 420b and the guides are disposed on only one side of the Y central axis of the base 404, the base 404 is Y As a result, the edges of the cam followers 420a and 420b come into contact with the sliding surfaces of the guides, and the Z guide 403 is tilted in the ω direction. Y A force in the direction of the arrow A is applied. Therefore, by symmetrically arranging cam followers 420a, 420b and each guide, tilt of base 404 can be suppressed. Cam followers 420c, 420d and each guide in the third embodiment may be arranged on one side of the center of the Y axis of base 404 or on both sides symmetrically. Furthermore, since a heavy weight can cause breakage, it is desirable that base 404 be made of a material with high specific rigidity, such as carbon fiber reinforced plastic (CFRP) or aluminum.

[0088] Fig. 14 is a flowchart showing the substrate carry-out operation and the steps before and after it in the first to third embodiments. Each step is executed by controlling each part of the substrate stage 6 by the drive control unit 80. Fig. 14 is a flowchart showing the flow from the completion of exposure processing of a substrate to the start of exposure processing of the next substrate.

[0089] In step S1, the substrate stage 6 moves to the substrate unloading position. In step S2, the substrate is unloaded by the substrate unloading mechanism to the outside of the exposure apparatus (e.g., to a buffer table) (unloading process). Instead of the buffer table, the substrate may be unloaded directly to the manufacturing equipment for the next process (e.g., a developing device). In step S3, the substrate transport mechanism is stored inside the substrate stage 6. In step S4, the next substrate is placed on the mounting table 20. In step S5, the substrate stage 6 moves to the exposure start position.

[0090] <Embodiments of manufacturing methods of articles> The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing articles such as flat panel displays (FPDs), semiconductor devices, sensors, and optical elements. The method for manufacturing an article according to this embodiment includes a step of forming a latent image pattern on a photosensitive material coated on a substrate by exposure using the above-described exposure apparatus to obtain an exposed substrate (exposure step), a step of unloading the exposed substrate (unloading step), and a step of developing the exposed substrate to obtain a developed substrate (development step). The unloading step is performed by the above-described substrate unloading mechanism. Furthermore, this manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The method for manufacturing an article according to this embodiment is advantageous over conventional methods in at least one of article performance, quality, productivity, and production cost.

[0091] Although the preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist of the present invention. For example, the present invention may be applied to a substrate stage of a substrate processing apparatus such as a semiconductor manufacturing apparatus (a film forming apparatus, a sputtering apparatus, an annealing apparatus, etc.), an organic EL deposition apparatus, or a nanoimprint apparatus. [Explanation of symbols]

[0092] 6 Substrate stage 402 Y drive unit (drive unit) 410a, 450a First guide (guide mechanism) 410b, 450b Second guide (guide mechanism) 420a, 420b Cam follower (guide mechanism) 430a, 430b holding part P board

Claims

1. A substrate stage having a carry-out mechanism for carrying out a substrate, The carrying-out mechanism includes: a holder for holding the substrate; a driving unit that is drivable in a first direction parallel to a contact surface of the substrate where the holding unit and the substrate come into contact; a drive control unit that controls the drive unit; a first guide that guides movement of the holding portion; and the holding unit is connected to move in accordance with the driving of the driving unit, When the drive control unit controls the drive unit to drive in the first direction, the first guide guiding the holder to raise the holder, thereby causing the holder to receive the substrate from the first mounting table on which the substrate is placed; guiding the holder along the first direction to move the substrate placed on the holder; guiding the holding unit so as to lower the holding unit, thereby transferring the substrate placed on the holding unit to a second mounting table provided outside the substrate stage; A substrate stage characterized by:

2. 2. The substrate stage according to claim 1, wherein the first guide has a shape including a guide extending in the first direction and a guide extending in a direction different from the first direction.

3. Further, a second guide is provided to guide the movement of the holding portion, the driving unit is drivable in a second direction opposite to the first direction, 2. The substrate stage according to claim 1, wherein the second guide guides the holding portion to move in the second direction and in a direction different from the second direction when the drive control portion controls the drive portion to drive in the second direction.

4. the first guide guides the holder to move while the holder holds the substrate; the second guide guides the holder to move in a state where the holder is not holding the substrate.

4. The substrate stage according to claim 3.

5. 4. The substrate stage according to claim 3, wherein the second guide is disposed below the first guide.

6. the ejection mechanism further includes a cam follower provided in the holding portion, 4. The substrate stage according to claim 3, wherein the cam follower slides on the sliding surface of the first guide, so that the holding portion moves in accordance with the driving of the driving portion.

7. 7. The substrate stage according to claim 6, wherein there are a plurality of cam followers, and at least one of the plurality of cam followers is configured to be capable of being driven up and down.

8. 7. The substrate stage according to claim 6, wherein the cam follower slides on the upper surface of the first guide due to the weight of the holding portion.

9. the ejection mechanism further includes a coil spring connected to the holding portion, 7. The substrate stage according to claim 6, wherein the coil spring applies a force to the holding portion in a direction opposite to the direction of gravity, causing the cam follower to slide along the underside of the first guide.

10. When the drive unit is driven in the first direction with the holding unit at the origin position, the cam follower slides on the slide surface of the first guide, and then moves from the first guide to the second guide, The substrate stage according to claim 6, wherein the drive unit is driven in the second direction, so that the cam follower slides along the sliding surface of the second guide, and then the holding unit returns to the origin position.

11. 11. A substrate moving method, comprising: unloading a substrate from a substrate stage by a substrate stage unloading mechanism according to claim 1.

12. A substrate processing apparatus having the substrate stage according to any one of claims 1 to 10, The substrate processing apparatus, wherein the unloading mechanism unloads the substrate processed by the substrate processing apparatus to the outside of the substrate processing apparatus.

13. An exposure apparatus having the substrate stage according to any one of claims 1 to 10, a projection optical system for exposing the pattern of the original onto the substrate; The exposure apparatus, wherein the unloading mechanism unloads the substrate exposed by the projection optical system to the outside of the exposure apparatus.

14. an exposure step of exposing a substrate using the exposure apparatus according to claim 13 to obtain an exposed substrate; a carrying-out step of carrying out the exposed substrate by the carrying-out mechanism; a developing step of developing the exposed substrate to obtain a developed substrate, A method for manufacturing an article, comprising manufacturing an article from the developed substrate.

Citation Information

Patent Citations

  • Object carry-out method, object exchange method, object holding apparatus, object exchange system, exposure apparatus, manufacturing method for flat panel display, and device manufacturing method

    JP2015146045A