Marker head and laser processing device

Abstract

To provide a technique for miniaturizing a laser beam machining apparatus.SOLUTION: A marker head for marking a workpiece includes a laser oscillator that oscillates a laser beam and a scanner that scans a surface of the workpiece with the laser beam, and at least one optical path changing member that changes a traveling direction of the laser beam is provided on an optical path of the laser beam from the laser oscillator to the scanner.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a marker head and a laser processing device. [Background technology]

[0002] BACKGROUND ART Marking is sometimes performed on an object to be processed using a laser processing device that includes a marker head as a component (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2024-28470 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique for miniaturizing a laser processing device. [Means for solving the problem]

[0005] According to one aspect of the present disclosure, a laser oscillator that emits laser light; a scanner that scans the laser light on the surface of a workpiece; A marker head for marking the workpiece, comprising: At least one optical path changing member that changes the traveling direction of the laser light is provided on the optical path of the laser light from the laser oscillator to the scanner. A marker head is provided.

[0006] According to another aspect of the present disclosure, A laser processing apparatus having the marker head and a controller that controls the operation of the marker head, The marker head and the controller are disposed separately. A laser processing apparatus is provided. [Effects of the Invention]

[0007] According to the present disclosure, a technique for miniaturizing a laser processing device can be provided. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a diagram showing a schematic configuration example of a laser processing apparatus 500 according to a first embodiment of the present disclosure. [Figure 2] FIG. 2 is a diagram showing a schematic configuration example of the marker head 100 provided in the laser processing apparatus 500 according to the first embodiment of the present disclosure. [Figure 3] FIG. 3 is a diagram showing a schematic configuration example of a conventional marker head 5. As shown in FIG. [Figure 4] FIG. 4 is a diagram showing a schematic configuration example of a laser processing apparatus 500A according to the second embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0009] Embodiments of the present disclosure will be described in detail with reference to the drawings. All drawings used in the following description are schematic, and the dimensional relationships, ratios, etc. of elements shown in the drawings do not necessarily correspond to the actual ones. Furthermore, the dimensional relationships, ratios, etc. of elements between multiple drawings do not necessarily correspond to the actual ones. In each embodiment and modified example, the same components or components having substantially the same functions are designated by the same reference numerals, and redundant description will be omitted.

[0010] First Embodiment (1) Example of laser processing equipment configuration As shown in FIG. 1, the laser processing apparatus 500 includes a marker head 100, a workpiece storage unit 200, and a controller 300. The marker head 100 irradiates the workpiece W with laser light to perform marking or other operations on the workpiece W. The workpiece storage unit 200 stores the workpiece W in a three-dimensional space. The controller 300 controls the operation of each component constituting the laser processing apparatus 500. Note that marking includes processing such as printing or engraving characters or the like by locally discoloring, deforming, or melting the surface of the workpiece W. Also, as shown in FIG. 1, the laser processing apparatus 500 includes the marker head 100 and the controller 300 as separate units.

[0011] (2) Marker head configuration example As shown in FIG. 2, the marker head 100 includes, for example, a laser oscillator 10, a beam expander 20, a combiner 30, a scanner 40, and an optical path changing member 50.

[0012] The laser oscillator 10 oscillates (emits) a laser beam for marking the workpiece W. The wavelength of the laser beam is not particularly limited, but the laser beam in this embodiment has a wavelength of, for example, 300 to 450 nm.

[0013] The beam expander 20 expands the beam diameter of the laser light emitted from the laser oscillator 10. There are no particular limitations on the beam diameter, but in this embodiment, for example, laser light having a beam diameter of 0.2 to 0.6 mm is expanded to have a beam diameter of 1 to 8 mm.

[0014] The combiner 30 superimposes the laser light that has passed through the beam expander 20 and a guide laser light for indicating the marking location on the same optical axis. The guide laser light is emitted from a guide laser light source (not shown) and has a wavelength of, for example, 400 to 760 nm. Hereinafter, the laser light and the guide laser light may be collectively referred to as "laser light."

[0015] The scanner 40 scans the laser light that has passed through the combiner 30 over the surface of the workpiece W. For example, the scanner 40 is a two-dimensional scanner that scans the surface of the workpiece W with the laser light without adjusting the focal length of the laser light.

[0016] The optical path changing member 50 changes the traveling direction (optical path) of the laser light emitted from the laser oscillator 10 by reflecting or refracting the laser light. As the optical path changing member 50, for example, a mirror or a prism can be used.

[0017] When comparing the sizes of the components of the laser oscillator 10, the beam expander 20, the combiner 30, and the scanner 40, if the scanner 40 is a two-dimensional scanner, the largest of these components is the laser oscillator 10. In this embodiment, as an example, a case will be described in which the laser oscillator 10 is the largest. Note that, here, the laser oscillator 10 being the largest refers to, for example, a case in which the surface of the laser oscillator 10 has the largest area or the surface of the laser oscillator 10 has the longest side among the components.

[0018] One or more of the above-described optical path changing members 50 are provided on the optical path L from the laser oscillator 10 to the scanner 40. This allows for flexibility in the arrangement of the laser oscillator 10, the beam expander 20, the combiner 30, and the scanner 40. For example, as shown in FIG. 2, the beam expander 20, the combiner 30, and the scanner 40 can be arranged around the periphery of the laser oscillator 10. In this case, at least a portion of the optical path L is configured to surround at least a portion of the periphery of the laser oscillator 10 (see FIG. 2). Specifically, in a side view, at least a portion of the optical path L is configured to overlap at least a portion of the laser oscillator 10. Note that it is preferable to arrange each of the components of the beam expander 20, the combiner 30, and the scanner 40 as close to the laser oscillator 10 as possible, within a range in which these components and the function of the laser oscillator 10 can be fully exerted.

[0019] (3) Effects of the First Embodiment According to this embodiment, one or more of the following effects can be obtained.

[0020] (a) In this embodiment, at least one optical path changing member 50 that changes the traveling direction of the laser light is provided on the optical path L from the laser oscillator 10 to the scanner 40. This allows for flexibility in the arrangement of the laser oscillator 10, beam expander 20, combiner 30, and scanner 40. As a result, the overall size of the marker head 100 can be reduced. Note that, as shown in FIG. 3 , in a conventional marker head 5, for example, the laser oscillator 1, beam expander 2, combiner 3, and scanner 4 are arranged in series in one direction. A marker head 5 configured in this way can be large and difficult to handle.

[0021] (b) In this embodiment, at least a part of the optical path L surrounds at least a part of the outer periphery of the laser oscillator 10, so that the size of the entire marker head 100 can be reduced.

[0022] (c) In this embodiment, if at least a portion of the optical path L is configured to overlap at least a portion of the laser oscillator 10 in a side view, the increase in thickness of the marker head 100 can be reduced. Also, in this embodiment, if at least a portion of the optical path L is configured to overlap at least a portion of the laser oscillator 10 in a plan view, the footprint of the marker head 100 can be reduced.

[0023] (d) Furthermore, in the laser processing device 500 of this embodiment, the marker head 100 and the controller 300 are configured as separate units, which makes them easy to transport and handle.

[0024] (e) In addition, in this embodiment, the footprint of the marker head 100 can be further reduced by arranging each component of the beam expander 20, combiner 30, and scanner 40 close to the laser oscillator 10 within a range that allows these components and the functions of the laser oscillator 10 to be fully performed.

[0025] (4) Variations The marker head 100 in this embodiment can be modified as shown in the following modified examples. These modified examples can be combined in any desired manner.

[0026] (Variation 1) Of the components of the marker head 100, namely the laser oscillator 10, the beam expander 20, the combiner 30, and the scanner 40, the scanner 40 may be the largest component.

[0027] Regarding the configuration in which at least a portion of the optical path L surrounds at least a portion of the outer periphery of the scanner 40, in the above-described embodiment, in the description that the optical path L is configured to surround at least a portion of the outer periphery of the laser oscillator 10, "laser oscillator 10" shall be read as "scanner 40."

[0028] According to this modification, the same effects as those obtained by the above-described embodiment can be obtained.

[0029] (Variation 2) 2 shows a configuration in which the beam expander 20, the combiner 30, and the scanner 40 are respectively distributed on three of the faces of the laser oscillator 10, but this embodiment is not limited to this. For example, the beam expander 20, the combiner 30, and the scanner 40 may be concentrated on one of the faces of the laser oscillator 10, and the components can be freely arranged depending on the size of the components, etc.

[0030] According to this modification, the same effects as those obtained by the above-described embodiment can be obtained.

[0031] Second Embodiment In the first embodiment, an example is described in which the beam expander 20, the combiner 30, and the scanner 40 are arranged on the outer periphery of the laser oscillator 10. In the second embodiment, an example is described in which the laser oscillator 10, the combiner 30, and the scanner 40A are arranged on the outer periphery of the workpiece storage section 200.

[0032] (1) Example of laser processing equipment configuration 4 is a diagram showing a schematic configuration example of a laser processing apparatus 500A according to Embodiment 2. As shown in FIG. 4, the laser processing apparatus 500A has a marker head 100A, a workpiece storage unit 200, and a controller 300.

[0033] (2) Marker head configuration example The marker head 100A according to this embodiment includes a laser oscillator 10, a combiner 30, a scanner 40A, and an optical path changing member 50, as an example.

[0034] The marker head 100A is configured such that the laser oscillator 10 is arranged on one surface of the work accommodating section 200, and the scanner 40A is arranged on another surface of the work accommodating section 200 that is different from the one surface. As shown in Fig. 4, for example, the laser oscillator 10 may be arranged on a side surface of the work accommodating section 200, and the scanner 40A may be arranged on a surface other than the side surface of the work accommodating section 200. In this case, it is preferable that the laser oscillator 10 is arranged so that the area of ​​the laser oscillator 10 and the work accommodating section 200 projected in the vertical direction is minimized.

[0035] (3) Effects of the Second Embodiment According to this embodiment, one or more of the following effects can be obtained.

[0036] (a) The laser oscillator 10 is arranged on one surface of the workpiece accommodating section 200, and the scanner 40A is arranged on another surface of the workpiece accommodating section 200, which is different from the one surface, thereby making it possible to reduce the size of the laser processing apparatus 500A. For example, if the scanner 40A is a three-dimensional scanner that not only scans the surface of the workpiece W with laser light but also adjusts the focal length of the laser light, the scanner 40A may be larger in size than a two-dimensional scanner. Even in this case, the laser oscillator 10 and the scanner 40A can be arranged separately on different surfaces of the workpiece accommodating section 200, as described above, thereby making it possible to reduce the overall size of the laser processing apparatus 500A.

[0037] (b) Furthermore, in this embodiment, for example, the laser oscillator 10 is disposed on a side surface of the workpiece accommodating section 200, and the scanner 40A is disposed on a surface other than the side surface of the workpiece accommodating section 200. This makes it possible to configure a laser processing apparatus 500A that has an excellent balance between width and height when viewed from the front.

[0038] (c) Furthermore, in this embodiment, the laser oscillator 10 is arranged so that the area of ​​the laser oscillator 10 and the workpiece accommodation section 200 projected in the vertical direction is minimized. This allows the footprint of the marker head 100A to be reduced.

[0039] (d) Furthermore, in this embodiment, when the scanner 40A is a three-dimensional scanner, the focal length adjustment mechanism of the scanner 40A, which adjusts the focal length of the laser light, has the function of expanding the beam diameter of the laser light incident on the scanner 40A. Therefore, the marker head 100A does not need to be provided with a separate beam expander 20. This allows the marker head 100A to be made smaller.

[0040] (4) Variations The marker head 100A in this embodiment can be modified as shown in the following modified examples.

[0041] (Variation 1) For example, the scanner 40A may be disposed on a side surface of the workpiece accommodating section 200, and the laser oscillator 10 may be disposed on a surface other than the side surface of the workpiece accommodating section 200.

[0042] According to this modification, the same effects as those obtained by the above-described embodiment can be obtained.

[0043] In the first modification, it is preferable to arrange the scanner 40A so that the area of ​​the scanner 40A and the workpiece accommodation section 200 projected in the vertical direction is minimized. In this way, the footprint of the laser processing apparatus 500A can be reduced. [Explanation of symbols]

[0044] 500,500A laser processing equipment 100,100A marker head 10 Laser oscillator 40,40A scanner 50 Optical path changing member L optical path double work

Claims

1. a laser oscillator that emits laser light; a scanner that scans the laser light on the surface of a workpiece; A marker head for marking the workpiece, comprising: At least one optical path changing member that changes the traveling direction of the laser light is provided on an optical path of the laser light from the laser oscillator to the scanner. Marker head.

2. At least a part of the optical path of the laser light surrounds at least a part of the outer periphery of the laser oscillator. The marker head according to claim 1 .

3. At least a part of the optical path of the laser light surrounds at least a part of the outer periphery of the scanner. The marker head according to claim 1 .

4. A beam expander that expands the beam diameter of the laser light emitted from the laser oscillator and a combiner that superimposes the laser light and a guide laser light for indicating a marking location on the workpiece are provided on an optical path of the laser light from the laser oscillator to the scanner. The marker head according to claim 2 or 3.

5. In a side view, at least a part of the optical path of the laser light is configured to overlap at least a part of the laser oscillator. The marker head according to claim 2 .

6. In a plan view, at least a part of the optical path of the laser light is configured to overlap at least a part of the laser oscillator. The marker head according to claim 2 .

7. In a side view, at least a part of the optical path of the laser light is configured to overlap at least a part of the scanner. The marker head according to claim 3 .

8. In a plan view, at least a part of the optical path of the laser light is configured to overlap at least a part of the scanner. The marker head according to claim 3 .

9. the scanner two-dimensionally scans the laser beam on the surface of the workpiece without adjusting the focal length of the laser beam; The marker head according to claim 1 .

10. the laser oscillator is disposed on one surface of a workpiece accommodating section that accommodates the workpiece, and the scanner is disposed on another surface different from the one surface of the workpiece accommodating section; The marker head according to claim 1 .

11. one of the laser oscillator and the scanner is disposed on a side surface of the workpiece accommodating section, and the other of the laser oscillator and the scanner is disposed on a surface other than the side surface of the workpiece accommodating section; The marker head according to claim 10.

12. The laser oscillator is arranged so that an area obtained by projecting the laser oscillator and the workpiece accommodating section in a vertical direction is minimized. The marker head according to claim 11 .

13. The scanner is arranged so that an area obtained by projecting the scanner and the work accommodating section in a vertical direction is minimized. The marker head according to claim 11 .

14. The scanner two-dimensionally scans the laser light on the surface of the workpiece and also adjusts the focal length of the laser light. The marker head according to claim 10.

15. 10. A laser processing apparatus comprising: the marker head according to claim 1; and a controller that controls the operation of the marker head, The marker head and the controller are disposed separately. Laser processing equipment.

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