System and method for joining metal-based composite materials
The method addresses the inefficiencies in joining metal matrix composites by using a lower-melting-point alloy and controlled heating with compression, resulting in a stable and shaped joint with minimal oxide formation.
Patent Information
- Application Number
- JP2025096708
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-06-25
- Filing Date
- 2025-06-10
- Publication Date
- 2026-01-14
AI Technical Summary
Existing methods for joining metal matrix composites face challenges such as distortion, separation, oxide layer formation, and lack of control over the final shape, leading to partial bonding and inefficient welding processes.
A method involving the use of a bonding alloy with a melting temperature lower than the substrates, combined with controlled heating and compression, to fuse metal-based composite substrates without distortion, using support members and actuators to maintain alignment and pressure.
Achieves a reliable and stable joint with controlled shape and bonding, minimizing oxide formation and ensuring complete fusion of the substrates within a short time frame.
Smart Images
Figure 2026004236000001_ABST
Abstract
Description
[Technical Field]
[0001] SUMMARY OF THE DISCLOSURE Embodiments of the present disclosure generally relate to systems and methods for preparing and joining metal matrix composite materials. [Background technology]
[0002] Metal matrix composites are semi-metallic materials (not just metals) that contain a matrix made of a metal (aluminum, copper, steel, etc.) and composite fibers (aluminum oxide fibers, carbon fibers, metal fibers, polymer fibers, etc.). In various assemblies, it is necessary to connect two metal matrix composites.
[0003] However, known joining methods have various drawbacks, such as the inability to maintain the original shape of the metal-based composite. For another example, the metal and base material may separate during the welding process, which can significantly distort the base material, while the molten metal may drip or flow due to gravity. Furthermore, known joining processes typically do not allow for control of the final shape of the resulting joint. Also, large temperature variations across the joint can result in partial bonding, or the rapid formation of an oxide layer that can prevent or inhibit welding of the surfaces together. Summary of the Invention
[0004] What is needed is a system and method for efficiently and effectively joining metal-based composite materials together.
[0005] With this need in mind, some embodiments of the present disclosure provide a method that includes disposing a bonding alloy between a first metal-based composite substrate and a second metal-based composite substrate, and heating the assembly for a predetermined time to a melting temperature of the bonding alloy to provide an assembly, the melting temperature of the bonding alloy being lower than the melting temperatures of the first metal-based composite substrate and the second metal-based composite substrate.
[0006] In at least one embodiment, the method also includes compressing the assembly during the heating.
[0007] The first metal-based composite substrate and the second metal-based composite substrate each include a metal matrix and composite fibers. For example, the metal matrix can be formed of aluminum and the composite fibers can be formed of aluminum oxide. The first metal-based composite substrate and the second metal-based composite substrate each can have a thickness of 0.01 inches.
[0008] In at least one embodiment, the joining alloy is formed of an aluminum alloy. For example, the joining alloy is formed of aluminum 4047. In at least one embodiment, prior to the heating, the joining alloy has a uniform thickness. By way of example, the uniform thickness may be 0.008 inches.
[0009] In at least one embodiment, the method also includes disposing a first support member between the first metal-based composite substrate and a first heating element, and disposing a second support member between the second metal-based composite substrate and a second heating element. The first heating element and the second heating element provide the heating. The first support member and the second support member can be formed of stainless steel.
[0010] In at least one embodiment, the predetermined time is less than 15 seconds.
[0011] In at least one embodiment, the method also includes treating the first metal-based composite substrate, the second metal-based composite substrate, and the bonding alloy prior to the placing, wherein the treating can be or include an acid treatment.
[0012] In at least one embodiment, the heating is controlled by a control unit. [Brief explanation of the drawings]
[0013] [Figure 1] 1 is a simplified schematic diagram of a system for bonding a first metal-based composite substrate to a second metal-based composite substrate, according to one embodiment of the present disclosure. [Figure 2] 1 is a flowchart of a method according to one embodiment of the present disclosure. [Figure 3] FIG. 1 is an isometric side view of an assembly between a first heating element and a second heating element according to one embodiment of the present disclosure. [Figure 4] FIG. 1 is a side perspective view of a system according to one embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION
[0014] The above summary of the invention, as well as the following detailed description of certain embodiments, will be better understood when read in conjunction with the accompanying drawings. In this specification, the use of an element or step in the singular does not necessarily exclude the presence of a plurality of such elements or steps. Furthermore, references to "one embodiment" are not intended to exclude the existence of other embodiments that incorporate features recited in that embodiment. Furthermore, unless otherwise specified, an embodiment "comprising" or "having" one or more elements having a particular condition may additionally include other elements that do not have that condition.
[0015] FIG. 1 is a simplified schematic diagram of a system 100 for bonding a first metal-based composite substrate 102 to a second metal-based composite substrate 104, according to one embodiment of the present disclosure. The metal-based composite substrates 102 and 104 can be various structures, such as panels, straps, beams, etc. In at least one example, the metal-based composite substrates 102 and 104 are configured to form a portion of an aircraft, such as a wing or fuselage. The metal-based composite substrates 102 and 104 are semi-metallic materials (not simply metals) that include a matrix formed of a metal (e.g., aluminum, copper, steel) and composite fibers (e.g., aluminum oxide fibers, carbon fibers, ceramic fibers, metal fibers, polymer fibers, etc.). The metal-based composite substrates 102 and 104 include a metal matrix 106 and composite fibers 108. In at least one example, the first metal-based composite substrate 102 and the second metal-based composite substrate 104 are formed of 40-50% aluminum and 50-60% aluminum oxide. For example, the metal matrix 106 may be formed of aluminum and the composite fibers 108 may be formed of aluminum oxide. Optionally, the metal matrix 106 may be formed of another metal, such as copper or steel, and the composite fibers 108 may be formed of another material, such as carbon fiber.
[0016] The first metal composite substrate 102 has a first thickness 103, and the second metal composite substrate 104 has a second thickness 105. The first thickness 103 and the second thickness 105 may be equal. Optionally, the first thickness 103 may be different from the second thickness 105. As an example, the first thickness 103 and the second thickness 105 are each 0.01 inches. Optionally, the thicknesses 103 and 105 may be less than 0.01 inches, such as 0.001 inches, or may be greater than or equal to 0.01 inches, such as 0.02 inches.
[0017] A bonding alloy 110 is disposed between the first metal-based composite substrate 102 and the second metal-based composite substrate 104. The bonding alloy 110 is configured to secure the first metal-based composite substrate 102 to the second metal-based composite substrate 104, forming a bond therebetween. The bonding alloy 110 is selected to have a melting temperature slightly lower than the melting points of the first metal-based composite substrate 102 and the second metal-based composite substrate 104. By way of example, the bonding alloy 110 may be formed of an aluminum alloy. As a further example, the bonding alloy 110 may be formed of aluminum 4047, which has a melting point in the range of 577-582°C. Optionally, the bonding alloy 110 may be formed of various other metal alloys.
[0018] In at least one embodiment, prior to the melting / deposition process, the joining alloy 110 has a uniform thickness throughout. This uniform thickness 111 reduces the amount of oxides that are incorporated into the weld, leading to an efficient and effective deposition process.
[0019] Joining alloy 110 has a thickness 111, which may be less than (or optionally greater than) first thickness 103 and second thickness 105. For example, thickness 111 is 0.008 inches. Optionally, thickness 111 may be less than 0.008 inches (e.g., 0.007 inches) or may be greater than or equal to 0.008 inches (e.g., 0.00825 inches). Note that the thicknesses shown in FIG. 1 are not drawn to scale.
[0020] A first support member 112 is disposed between the first metal-based composite substrate 102 and the first heating element 114. Similarly, a second support member 116 is disposed between the second metal-based composite substrate 104 and the second heating element 118. In at least one example, the first support member 112 and the second support member 116 are metal members. As a further example, the first support member 112 and the second support member 116 are strips of stainless steel, such as stainless steel foil.
[0021] In at least one example, the first heating element 114 and the second heating element 118 are cartridge heaters. For example, the first heating element 114 and the second heating element 118 can each be a 1-inch square copper block cartridge heater. Optionally, the first heating element 114 and the second heating element 118 can be different types of heaters made from different materials. As another example, instead of separate, independent heating elements, the system 100 can use an oven to provide heat. As another example, an electric coil heater can be used.
[0022] In at least one embodiment, a first actuator 120 (e.g., a vice, a motor, etc.) is coupled to the first heating element 114, and a second actuator 122 (e.g., a vice, a motor, etc.) is coupled to the second heating element 118. The first actuator 120 is configured to move the first heating element 114, such as in the direction of arrow A, and the second actuator 122 is configured to move the second heating element 118, such as in the direction of arrow A. In at least one example, the first actuator 120 and the second actuator 122 are part of a vice. Optionally, the system 100 need not include the first actuator 120 and / or the second actuator 122.
[0023] To bond the first metal-based composite substrate 102 to the second metal-based composite substrate 104, the first heating element 114 and the second heating element 118 are activated to apply heat for a predetermined time to melt the bonding alloy 110. Specifically, the first heating element 114 and the second heating element 118 generate heat up to the melting temperature of the bonding alloy 110, such as 577-582°C. As the bonding alloy 110 melts, it is welded to the metal matrix 106 of each of the first metal-based composite substrate 102 and the second metal-based composite substrate 104. Because the bonding alloy 110 melts at a temperature below the melting points of the first metal-based composite substrate 102 and the second metal-based composite substrate 104, the bonding alloy diffuses and fuses with (but does not displace) the first metal-based composite substrate 102 and the second metal-based composite substrate 104. The first heating element 114 and the second heating element 118 are activated to generate heat to melt the joining alloy 110 for a predetermined period of time, such as 10 seconds or less, thereby providing a reliable and stable assembly 130, which includes a first metal-based composite substrate 102 joined to a second metal-based composite substrate 104 by the joining alloy 110.
[0024] In at least one embodiment, actuators 120 and 122 can be operated to move first heating element 114 and second heating element 118 away from assembly 130 at a predetermined rate to control the cooling of assembly 130. Optionally, system 100 may not include actuators, and methods of the present disclosure may not include moving heating elements away from assembly 130.
[0025] As described herein, the system 100 is configured to join a first metal-based composite substrate 102 and a second metal-based composite substrate 104, each of which may be a strip of metal-based composite, for example, aluminum / aluminum ceramic, to form a lap joint. The first metal-based composite substrate 102 and the second metal-based composite substrate 104 are held in place, such as by a first support member 112 and a second support member 116, throughout the joining process (such as by welding or fusing by applying heat to a joining alloy 110).
[0026] In at least one example, prior to the bonding process, the first metal-based composite substrate 102, the second metal-based composite substrate 104, and the bonding alloy 110 (and, optionally, the first support member 112 and the second support member 116) are treated to remove oxides or other contaminants. In a further example, these components (such as aluminum components) can be acid-treated to remove oxides or other contaminants. For example, these components can be washed with a mildly thixotropic acidic liquid, such as Ardrox® 1250B. Cleaning these components with Ardrox® 1250B has been found to improve the welding process for the first metal-based composite substrate 102 and the second metal-based composite substrate 104.
[0027] The first and second support members 112, 116 provide a geometry-specific fixture, securing the strips in place and preventing joint movement other than slight movement toward each other. The first and second support members 112, 116 also provide a compliant fixture, securing the assembly 130 under controlled, adjustable pressure. In at least one embodiment, the first and second support members 112, 116 are heated by the first and second heating elements 114, 118, respectively, to a temperature near the melting point of the joining alloy 110. Actuators 120, 122 are then actuated to compress and thereby fuse the joining alloy 110 to the first and second metal composite substrates 102, ...
[0028] The pressure applied during compression allows the desired amount of contact between the joining alloy 110 and the first and second metal composite substrates 102, 104. Upon heating, the joining alloy 110 tends to melt and extrude from the joint, which can reduce the overall thickness of the joining alloy 110. A predetermined initial pressure is applied, but this initial pressure ensures that the compressive force on the joining alloy 110 at its final thickness is not zero. This initial pressure depends on the stiffness of the overall assembly 130. Under the initial pressure, the assembly 130 compresses a distance perpendicular to the joining alloy 110 that is greater than the reduction in thickness of the joining alloy 110. Therefore, if this compression amount is equal to or greater than the initial thickness of the joining alloy 110, a desirable bond is achieved. In at least one example, a compression pressure of 10 pounds per square inch can be applied. Optionally, the compression pressure can be less than 10 pounds per square inch (such as 5 pounds per square inch) or greater than 10 pounds per square inch (such as 12 pounds per square inch).
[0029] As previously mentioned, the melting points of the joining alloy 110 and the first and second metal-based composite substrates 102, 104 may be close to but different from each other. Specifically, the melting point of the joining alloy 110 is lower than the melting points of the first and second metal-based composite substrates 102, 104. Heat is generated by the first and second heating elements 114, 118 to effect welding of the unoxidized metal surfaces of the joining alloy 110 to the first and second metal-based composite substrates 102, 104 without flowing out of the assembly 130 during compression.
[0030] In at least one embodiment, the system 100 also includes a control unit 140 in communication with the first heating element 114 and the second heating element 118, such as through one or more wired connections. The control unit 140 is configured to operate the first heating element 114 and the second heating element 118 as described herein. For example, the control unit 140 operates the first heating element 114 and the second heating element 118 to provide uniform heating. The control unit 140 can also communicate with the first actuator 120 and the second actuator 122, such as through one or more wired or wireless connections. The control unit 140 can also be configured to operate the first actuator 120 and the second actuator 122 as described herein. Optionally, the system 100 does not include the control unit 140. Instead, the heating elements (and, optionally, the actuators) can be manually controlled.
[0031] As used herein, terms such as "control unit," "central processing unit," "CPU," and "computer" include any processor-based or microprocessor-based system, including systems using microcontrollers, reduced instruction set computers (RISC), application specific integrated circuits (ASIC), logic circuits, and other circuits or processors having hardware, software, or a combination thereof capable of performing the functions described herein. These terms are merely exemplary and are not intended to limit the definition and / or meaning of these terms. For example, control unit 140 may include one or more processors configured to control operations as described herein.
[0032] The control unit 140 is configured to execute a set of instructions stored in one or more data storage units or elements (such as one or more memories) to process data. For example, the control unit 140 may include or be connected to one or more memories. The data storage units may also store data or other information as desired or needed. The data storage units may be in the form of an information source or a physical storage element within a processing machine.
[0033] The set of instructions may include various commands that instruct the control unit 140 as a processing machine to perform certain operations, such as the methods and processes of various embodiments of the subject matter described herein. The set of instructions may be in the form of a software program. Software may take various forms, such as system software or application software. Furthermore, software may take the form of a collection of individual programs, a subset of a program within a larger program, or a portion of a program. Software may also include modular programming in the form of object-oriented programming. The processing of input data by a processing machine may be in response to user commands, in response to results of previous processing, or in response to requests by other processing machines.
[0034] The figures of the embodiments herein illustrate one or more control or processing units, such as control unit 140. The processing or control unit may represent a circuit, circuitry, or portion thereof, that may be implemented as hardware having associated instructions (e.g., software stored on a tangible, non-transitory computer-readable storage medium, such as a computer hard drive, ROM, RAM, etc.) that perform the operations described herein. The hardware may include state machine circuitry built into the hardware to perform the functions described herein. Optionally, the hardware may include electronic circuitry including one or more logic-based devices, such as a microprocessor, processor, controller, etc., and / or coupled to such devices. Optionally, control unit 140 may represent processing circuitry, such as one or more of a field programmable gate array (FPGA), application specific integrated circuit (ASIC), microprocessor, etc. The circuitry in various embodiments may be configured to execute one or more algorithms to perform the functions described herein. The one or more algorithms, whether or not explicitly shown in a flowchart or method, may include aspects of the embodiments disclosed herein.
[0035] As used herein, the terms "software" and "firmware" are used interchangeably and include any computer program stored in a data storage unit (e.g., one or more memories) for execution by a computer, including RAM memory, ROM memory, EPROM memory, EEPROM memory, and non-volatile RAM (NVRAM) memory. The types of data storage units listed above are exemplary and do not limit the types of memory that can be used to store computer programs.
[0036] 2 is a flowchart of a method according to one embodiment of the present disclosure. Referring to FIGS. 1 and 2, in step 200, the first metal-based composite substrate 102, the second metal-based composite substrate 104, and the bonding alloy 110 (and optionally the first support member 112 and the second support member 116) are treated (e.g., acid treated) to remove oxides and / or contaminants. These elements may be immersed in a liquid (e.g., acid) for 10-20 minutes, rinsed (e.g., once, twice, or more) with water, dried in an inert environment, wiped with a cloth, etc.
[0037] In step 202, a bonding alloy 110 is disposed between the first metal-based composite substrate 102 and the second metal-based composite substrate 104. For example, the bonding alloy 110 is sandwiched between at least a portion of the first metal-based composite substrate 102 and at least a portion of the second metal-based composite substrate 104. In step 204, heat is applied (e.g., via the first heating element 114 and the second heating element 118) to melt the bonding alloy 110 and fuse it to the first metal-based composite substrate 102 and the second metal-based composite substrate 104. As previously described, the heating elements 114 and 118 are controlled, such as by the control unit 140, to generate heat to a temperature that melts the bonding alloy but does not melt the first metal-based composite substrate 102 or the second metal-based composite substrate 104. The heat is applied for a predetermined time, such as less than 10 seconds. In step 206, the first metal composite substrate 102, the bonding alloy 110, and the second metal composite substrate 104 are compressed together (e.g., by actuators 120 and 122, a vice, etc.) to form a secure and stable assembly 130.
[0038] As described herein, the method includes disposing a bonding alloy 110 between a first metal-based composite substrate 102 and a second metal-based composite substrate 104 to provide an assembly 130. The method also includes heating the assembly 130 for a predetermined period of time to a melting temperature of the bonding alloy 110, which is lower than the melting temperatures of the first metal-based composite substrate 102 and the second metal-based composite substrate 104. In at least one embodiment, the method also includes compressing the assembly 130 during heating.
[0039] Figure 3 is an isometric side view of an assembly 130 between a first heating element 114 and a second heating element 118, according to one embodiment of the present disclosure. Support members are not shown in Figure 3. A joining alloy 110 is sandwiched between a first end 150 of the first metal-based composite substrate 102 and a second end 152 of the second metal-based composite substrate 104 to form a lap joint 154.
[0040] FIG. 4 is a side perspective view of system 100 according to one embodiment of the present disclosure. First actuator 120 and second actuator 122 can be part of a vice 123 configured to compress assembly 130 together. As previously described, first heating element 114 and second heating element 118 are configured to heat assembly 130 to a predetermined temperature, e.g., 577-582°C, to melt joining alloy 110 and thereby fuse first metal composite substrate 102 to second metal composite substrate 104. Optionally, the temperature can be less than 577°C or greater than 582°C, depending on the melting points of first metal composite substrate 102 and second metal composite substrate 104. By way of example, the temperature can be 600°C. First heating element 114 and second heating element 118 are activated to apply heat for a predetermined period of time, e.g., 10-15 seconds.
[0041] Furthermore, the present disclosure includes examples according to the following appendices.
[0042] Clause 1. Disposing a joining alloy between a first metallic composite substrate and a second metallic composite substrate to provide an assembly; and The method includes heating the assembly to a melting temperature of the joining alloy for a predetermined period of time, the melting temperature of the joining alloy being lower than the melting temperatures of the first metal-based composite substrate and the second metal-based composite substrate.
[0043] Clause 2. The method of clause 1, further comprising compressing the assembly during said heating.
[0044] Appendix 3. The method of Appendix 1 or 2, wherein the first metal-based composite substrate and the second metal-based composite substrate each include a metal matrix and composite fibers.
[0045] Appendix 4. The method of Appendix 3, wherein the metal matrix is formed of aluminum and the composite fibers are formed of aluminum oxide.
[0046] Appendix 5. The method of any one of Appendixes 1 to 4, wherein the first metal-based composite substrate and the second metal-based composite substrate each have a thickness of 0.01 inches.
[0047] Appendix 6. The method according to any one of Appendixes 1 to 5, wherein the joining alloy is formed of an aluminum alloy.
[0048] Appendix 7. The method according to any one of Appendixes 1 to 6, wherein the joining alloy is formed of aluminum 4047.
[0049] Appendix 8. The method of any one of Appendixes 1 to 7, wherein the joining alloy has a uniform thickness before the heating.
[0050] Clause 9. The method of clause 8, wherein the uniform thickness is 0.008 inches.
[0051] Clause 10. Disposing a first support member between the first metallic composite substrate and a first heating element; and further comprising disposing a second support member between the second metal-based composite substrate and a second heating element; 10. The method of any one of claims 1 to 9, wherein the first heating element and the second heating element provide the heating.
[0052] Clause 11. The method of clause 10, wherein the first support member and the second support member are formed of stainless steel.
[0053] Appendix 12. The method according to any one of Appendixes 1 to 11, wherein the predetermined time is less than 15 seconds.
[0054] Appendix 13. The method of any one of Appendixes 1 to 12, further comprising acid treating the first metal-based composite substrate, the second metal-based composite substrate, and the joining alloy prior to the placing.
[0055] Appendix 14. The method of any one of Appendixes 1 to 13, wherein the heating is controlled by a control unit.
[0056] Appendix 15. A method for manufacturing a first metal-based composite substrate, a second metal-based composite substrate, and a bonding alloy, wherein each of the first metal-based composite substrate and the second metal-based composite substrate comprises a metal matrix and composite fibers; After said processing, disposing said bonding alloy between said first metal-based composite substrate and said second metal-based composite substrate to provide an assembly; heating the assembly to a melting temperature of the joining alloy for a predetermined time, the melting temperature of the joining alloy being lower than the melting temperatures of the first metal-based composite substrate and the second metal-based composite substrate; compressing the assembly during said heating.
[0057] Clause 16. The method of clause 15, wherein the metal matrix is formed of aluminum, the composite fibers are formed of aluminum oxide, the first metal composite substrate and the second metal composite substrate each have a thickness of 0.01 inches, and the joining alloy is formed of aluminum 4047 having a uniform thickness.
[0058] Clause 17. The method of clause 16, wherein the uniform thickness is 0.008 inches.
[0059] Clause 18. Disposing a first support member between the first metallic composite substrate and a first heating element; and further comprising disposing a second support member between the second metal-based composite substrate and a second heating element; 18. The method of any one of claims 15 to 17, wherein the first heating element and the second heating element provide the heating, and the first support member and the second support member are formed of stainless steel.
[0060] Appendix 19. The method according to any one of Appendixes 15 to 18, wherein the predetermined time is less than 15 seconds.
[0061] Appendix 20. A first metal-based composite substrate, a second metal-based composite substrate, and a bonding alloy are acid-treated, each of the first metal-based composite substrate and the second metal-based composite substrate including a metal matrix and composite fibers, the metal matrix being formed of aluminum, the composite fibers being formed of aluminum oxide, each of the first metal-based composite substrate and the second metal-based composite substrate having a thickness of 0.01 inches, and the bonding alloy being formed of aluminum 4047 having a uniform thickness; After the acid treatment, disposing the bonding alloy between the first metal-based composite substrate and the second metal-based composite substrate to provide an assembly; disposing a first support member between the first metallic composite substrate and a first heating element; a second support member is disposed between the second metallic composite substrate and the second heating element, the first support member and the second support member being formed of stainless steel; heating the assembly by the first heating element and the second heating element for a predetermined time to a melting temperature of the joining alloy, the melting temperature of the joining alloy being lower than the melting temperatures of the first metal-based composite substrate and the second metal-based composite substrate; compressing the assembly during said heating.
[0062] As described herein, embodiments of the present disclosure provide systems and methods for efficiently and effectively joining metal-based composite materials together.
[0063] Although various spatial and directional terms such as top, bottom, lower, middle, side, horizontal, vertical, front, etc. may be used to describe the embodiments of the present disclosure, these terms are used only with reference to the orientation shown in the drawings. These orientations may be flipped, rotated, or otherwise changed, such that an upper portion may become a lower portion and vice versa, a horizontal orientation may become a vertical orientation, etc.
[0064] As used herein, a structure, limitation, or element that is "configured" to perform a task or operation is one that is specifically structurally shaped, constructed, or adapted in a manner that corresponds to that task or operation. For clarity and avoidance of doubt, something that is merely capable of being modified to perform that task or operation is not "configured to perform a task or operation" as used herein.
[0065] It should be noted that the above description is illustrative, not limiting. For example, the above-described embodiments (and / or aspects thereof) may be used in combination with each other. Furthermore, many modifications may be made to adapt a particular situation or material to the teachings of the various embodiments of the present disclosure without departing from their scope. While the dimensions and types of materials described herein are intended to define aspects of the various embodiments of the present disclosure, these examples are by no means limiting, but are exemplary. Many other embodiments will be apparent to those skilled in the art upon reading the above description. Therefore, the scope of the various embodiments of the present disclosure should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The terms "including" and "in which," as used in the appended claims and the detailed description herein, are used as plain English expressions equivalent to "comprising" and "wherein," respectively. In addition, the terms "first," "second," "third," etc., are used merely as labels and do not impose numerical requirements on the objects referred to thereby.
[0066] This written description uses examples to disclose various embodiments of the present disclosure, including the best mode, and also enables those skilled in the art to practice various embodiments of the present disclosure, including making and using any devices or systems, and performing the incorporated methods. The patentable scope of various embodiments of the present disclosure is defined by the claims, and may include other embodiments that occur to those skilled in the art. Such other embodiments should be considered within the scope of the claims if they have elements that do not differ from the literal language of the claims, or if they include equivalent elements that have only insubstantial differences from the literal language of the claims.
Claims
1. disposing a bonding alloy between a first metal-based composite substrate and a second metal-based composite substrate to provide an assembly; The method includes heating the assembly to a melting temperature of the joining alloy for a predetermined period of time, the melting temperature of the joining alloy being lower than the melting temperatures of the first metal-based composite substrate and the second metal-based composite substrate.
2. The method of claim 1 further comprising compressing the assembly during the heating.
3. The method of claim 1 , wherein the first metal-based composite substrate and the second metal-based composite substrate each comprise a metal matrix and composite fibers.
4. The method of claim 3 , wherein the metal matrix is formed of aluminum and the composite fibers are formed of aluminum oxide.
5. 10. The method of claim 1, wherein the first metal-based composite substrate and the second metal-based composite substrate each have a thickness of 0.01 inches.
6. The method of claim 1 , wherein the bonding alloy is formed of an aluminum alloy.
7. The method of claim 1 , wherein the bonding alloy is formed of aluminum 4047.
8. The method of claim 1 , wherein the bonding alloy has a uniform thickness prior to the heating.
9. The method of claim 8, wherein the uniform thickness is 0.008 inches.
10. disposing a first support member between the first metallic composite substrate and a first heating element; and further comprising disposing a second support member between the second metallic composite substrate and a second heating element; The method of claim 1 , wherein the first heating element and the second heating element provide the heating.
11. The method of claim 10 , wherein the first support member and the second support member are formed from stainless steel.
12. The method of claim 1 , wherein the predetermined time is less than 15 seconds.
13. The method of claim 1 , further comprising acid treating the first metal-based composite substrate, the second metal-based composite substrate, and the bonding alloy prior to said placing.
14. The method of claim 1 , wherein the heating is controlled by a control unit.
15. treating a first metal-based composite substrate, a second metal-based composite substrate, and a bonding alloy, each of the first metal-based composite substrate and the second metal-based composite substrate including a metal matrix and composite fibers; After said processing, disposing said bonding alloy between said first metal-based composite substrate and said second metal-based composite substrate to provide an assembly; heating the assembly to a melting temperature of the joining alloy for a predetermined time, the melting temperature of the joining alloy being lower than the melting temperatures of the first metal-based composite substrate and the second metal-based composite substrate; compressing the assembly during said heating.
16. 16. The method of claim 15, wherein the metal matrix is formed of aluminum, the composite fibers are formed of aluminum oxide, the first metal-based composite substrate and the second metal-based composite substrate each have a thickness of 0.01 inches, and the bonding alloy is formed of aluminum 4047 having a uniform thickness.
17. 17. The method of claim 16, wherein the uniform thickness is 0.008 inches.
18. disposing a first support member between the first metallic composite substrate and a first heating element; and further comprising disposing a second support member between the second metallic composite substrate and a second heating element; 16. The method of claim 15, wherein the first heating element and the second heating element provide the heating, and the first support member and the second support member are formed from stainless steel.
19. The method of claim 15, wherein the predetermined time is less than 15 seconds.
20. a first metal-based composite substrate, a second metal-based composite substrate, and a bonding alloy are acid-treated, each of the first metal-based composite substrate and the second metal-based composite substrate including a metal matrix and composite fibers, the metal matrix being formed of aluminum, the composite fibers being formed of aluminum oxide, each of the first metal-based composite substrate and the second metal-based composite substrate having a thickness of 0.01 inches, and the bonding alloy being formed of aluminum 4047 having a uniform thickness; After the acid treatment, disposing the bonding alloy between the first metal-based composite substrate and the second metal-based composite substrate to provide an assembly; disposing a first support member between the first metallic composite substrate and a first heating element; a second support member is disposed between the second metallic composite substrate and the second heating element, the first support member and the second support member being formed of stainless steel; heating the assembly with the first heating element and the second heating element for a predetermined time to a melting temperature of the joining alloy, the melting temperature of the joining alloy being lower than the melting temperatures of the first metal-based composite substrate and the second metal-based composite substrate; compressing the assembly during said heating.