Current detection device

Abstract

To provide a current detection device capable of achieving miniaturization.SOLUTION: The current detection device includes a first detection conductor and a second detection conductor. The first detection conductor is connected to the first region, and the second detection conductor is connected to the second region.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a current detection device. [Background technology]

[0002] In recent years, as the current used in electronic devices has become larger, there has been active development of so-called power modules, which convert and control power by switching power semiconductors.

[0003] Power modules often use highly heat-dissipating substrates that can handle large currents, such as ceramic substrates called DBC substrates, which are formed by bonding copper directly to an alumina substrate. Components such as power semiconductors and shunt resistors may also be mounted directly on copper-plated wiring (bus bars or lead frames). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2022-066642 [Patent Document 2] Japanese Patent Application Publication No. 2018-170478 Summary of the Invention [Problem to be solved by the invention]

[0005] Patent Document 1 discloses a mounting structure for a shunt resistor device that includes lead wires arranged between adjacent current-carrying patterns. However, such a mounting structure requires space for the lead wires, which increases the distance between the current-carrying patterns. As a result, it is difficult to achieve a compact mounting structure.

[0006] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a current detection device that can be made smaller. [Means for solving the problem]

[0007] In one embodiment, a current detection device is provided, comprising: a resistor having a laminated structure in which a first electrode, a resistive element, and a second electrode are laminated in a thickness direction; a first conductor connected to the first electrode; a second conductor connected to the second electrode; and first and second detection conductors for detecting a voltage, wherein the first detection conductor is connected to a first region on an upper surface of the first electrode or the first conductor, on an opposite side facing an inlet portion of the first conductor; and the second detection conductor is connected to a second region of the second conductor, on a side side of the inlet portion and located on a side of the second electrode.

[0008] In one embodiment, the first region is a region from the center of the first electrode to the opposing side. In one embodiment, the second conductor is a wiring pattern formed on a circuit board, the second electrode and the second conductor are connected by solder, a boundary portion is formed in the second conductor within an area along one side of the second electrode, and the second detection conductor is connected to the side of the boundary portion. In one embodiment, the boundary portion is a through slit, a non-through slit, an insulating film, or a step formed in the second conductor.

[0009] In one embodiment, the boundary portion has a linear portion, and the linear portion extends in a direction perpendicular to one side of the second electrode. In one embodiment, the second detection conductor is connected to the inflow portion side of the boundary portion. [Effects of the Invention]

[0010] By connecting the first sensing conductor to the first region and the second sensing conductor to the second region, the current sensing device can be made smaller. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a perspective view illustrating one embodiment of a resistor. [Figure 2] FIG. 1 is a top view illustrating an embodiment of a power module with a current sensing device including a resistor. [Figure 3] 10 is a perspective view showing wires connecting the first and second voltage detection terminals to the bus bars and the wiring, respectively. FIG. [Figure 4] FIG. 2 is a diagram showing areas in a current detection device where wires are connected. [Figure 5] FIG. 2 is a diagram showing areas in a current detection device where wires are connected. [Figure 6] FIG. 1 is a diagram showing the relationship between the wire connection position and the temperature coefficient of resistance (TCR). [Figure 7] FIG. 1 is a diagram showing the relationship between the wire connection position and the temperature coefficient of resistance (TCR). [Figure 8] FIG. 10 illustrates a boundary portion for preventing solder flow. [Figure 9] 9(a) to 9(d) are diagrams showing examples of the boundary portion. [Figure 10] FIG. 10 is a diagram showing a modified example of the boundary portion. [Figure 11] FIG. 10 is a diagram showing a modified example of the boundary portion. [Figure 12] FIG. 10 is a diagram showing a boundary portion for eliminating the influence of TCR. [Figure 13] FIG. 10 is a diagram showing a modified example of the boundary portion. [Figure 14] 14(a) to 14(d) are diagrams showing modified examples of the boundary portion. [Figure 15] 15(a) and 15(b) are diagrams showing modified examples of the boundary portion. [Figure 16] FIG. 10 is a diagram showing another embodiment of the current detection device. [Figure 17] FIG. 10 is a diagram showing another embodiment of the current detection device. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings described below, identical or corresponding components are designated by the same reference numerals, and duplicated descriptions will be omitted. In the multiple embodiments described below, the configuration of an embodiment that is not particularly described is the same as that of other embodiments, and therefore duplicated descriptions will be omitted.

[0013] Fig. 1 is a perspective view showing one embodiment of a resistor. As shown in Fig. 1, resistor 10 has a laminated structure in which elements are laminated in the thickness direction. Resistor 10 has plate-shaped first electrode 12 and second electrode 13, and plate-shaped resistive element 11 disposed between first electrode 12 and second electrode 13.

[0014] The resistor 10 is a shunt resistor with a vertical structure (laminated structure) used for current detection. In the embodiment shown in Fig. 1, the resistive element 11 has a square or rectangular shape, but the shape of the resistive element 11 can be designed arbitrarily.

[0015] The material of the first electrode 12 and the second electrode 13 is a highly conductive metal material such as Cu. The material of the resistor 11 is a metal material suitable for current detection, such as a Cu-Ni, Cu-Mn, or Ni-Cr material, or a composite material containing a metal.

[0016] Fig. 2 is a top view showing one embodiment of a power module equipped with a current detection device including a resistor. As shown in Fig. 2, a current detection device 100 is connected to a power module 200. The current detection device 100 includes a plate-shaped bus bar 20 (first conductor). A current to be measured flows through the bus bar 20. The bus bar 20 as the first conductor is connected to the resistor 10 by, for example, soldering. The bus bar 20 is, for example, a U-terminal, V-terminal, or W-terminal of a three-phase alternating current.

[0017] 2, power module 200 includes plate-shaped bus bars 21 and 22. Bus bar 21 is a negative terminal, and bus bar 22 is a positive terminal. Current detecting device 100 (or power module 200) includes plate-shaped wiring 23 (second conductor), wiring 24, and wiring 25.

[0018] The wires 23 to 25 are wiring patterns formed on a circuit board, and are, for example, thick copper patterns made of copper. A current to be measured flows through the wire 23. The wire 23 as a second conductor is connected to the resistor 10 (more specifically, the second electrode 13) by, for example, soldering. In this way, the resistor 10 is connected to the bus bar 20 and the wires 23 in the vertical direction.

[0019] The power module 200 includes one or more power devices 30. The power devices 30 are connected to the wirings 23 to 25 directly or via bonding wires 40. The bonding wires 40 are made of metal (for example, Au, Ag, Cu, Al, etc.).

[0020] The power module 200 includes a rectangular case 45. The inside of the case 45 is connected to the outside of the case 45 via the bus bars 20-22.

[0021] The power module 200 includes an insulating substrate 26. The insulating substrate 26 is made of, for example, ceramics. In one embodiment, the insulating substrate 26 may be made of a material such as silicon nitride, aluminum nitride, alumina, or zirconia. In one embodiment, the insulating substrate 26 may be made of glass epoxy, polyimide, or Teflon (registered trademark).

[0022] The power module 200 includes a first voltage detection terminal 51 and a second voltage detection terminal 52. A voltage signal for measuring a current is output to the outside via the first voltage detection terminal 51 and the second voltage detection terminal 52.

[0023] The current detecting device 100 includes a bonding wire (first detecting conductor) 41 and a bonding wire (second detecting conductor) 42 for detecting voltage. The first voltage detecting terminal 51 is connected to the bus bar 20 via the bonding wire 41. The second voltage detecting terminal 52 is connected to the wiring 23 via the bonding wire 42. Hereinafter, the bonding wires 41 and 42 may be simply referred to as the wires 41 and 42.

[0024] 3 is a perspective view showing wires connecting the first and second voltage detection terminals to the busbars and wiring, respectively. As shown in FIG. 3, one end of wire 41 serving as a first detection conductor is connected to the upper surface of busbar 20 serving as a first conductor. The other end of wire 41 is connected to first voltage detection terminal 51. One end of wire 42 serving as a second detection conductor is connected to wiring 23 serving as a second conductor. The other end of wire 42 is connected to second voltage detection terminal 52.

[0025] Figures 4 and 5 are diagrams showing areas in the current detection device where wires are connected. Figure 4 is a front view of the current detection device 100, and Figure 5 is a plan view of the current detection device 100. Note that the bus bar 20 is not shown in Figure 5.

[0026] 4 and 5, the current flowing through the current detection device 100 (see dotted arrows) flows horizontally in the busbar 20 and diagonally up and down in the resistor 10. More specifically, the current flowing diagonally up and down flows from the busbar 20 toward the wiring 23 in a direction away from the end side EC of the wiring 23. The current then flows horizontally in the wiring 23.

[0027] Hereinafter, in this specification, the starting point where the current from the busbar 20 flows into the resistor 10 is defined as an inflow portion CI, and the ending point where the current flows out of the resistor 10 is defined as an outflow portion CO (see FIGS. 4 and 5).

[0028] As shown in Figures 4 and 5, the current detection device 100 has a first region WBR1 located on the upper surface (connection site with the first electrode 12) of the bus bar 20 connected to the resistor 10 (more specifically, the first electrode 12), and a second region WBR2 formed on the wiring 23 and located to the side of the resistor 10 (more specifically, the second electrode 13).

[0029] The first region WBR1 is a specific region formed on the bus bar 20 for connecting the wire 41. The second region WBR2 is a specific region formed on the wiring 23 for connecting the wire 42.

[0030] In this embodiment, the wire 41 is connected to the bus bar 20, but the wire 41 may also be connected to the first electrode 12. In this case, the first region WBR1 is a region formed on the first electrode 12 for connecting the wire 41. In this manner, the first region WBR1 is formed on the bus bar 20 (or the first electrode 12). The specific ranges of the first region WBR1 and the second region WBR2 will be described below.

[0031] 5, the longitudinal direction of the current detection device 100 (more specifically, the resistor 10) is defined as the x-direction, and the direction perpendicular to the x-direction is defined as the y-direction. In this case, the first region WBR1 has a width a extending along the x-direction.

[0032] 5, the width a of the first region WBR1 is half the length of the entire length of the resistor 10 in the x direction. In one embodiment, more preferably, the width a may be one-third the length of the entire length of the resistor 10 in the x direction. Note that the first region WBR1 extends over the entire length of the resistor 10 in the y direction.

[0033] 4 and 5, the first region WBR1 is located on the opposite side of the inlet portion CI. The current detection device 100 (i.e., the busbar 20 and / or the resistor 10) has an opposing side EA located on the opposite side of the inlet portion CI (see FIG. 5), and the first region WBR1 is located on the opposing side EA side. For example, the first region WBR1 is a region from the center of the first electrode 12 to the opposing side EA.

[0034] The wire 41 is connected to the first region WBR1 on the opposing side EA side facing the inlet portion CI. Therefore, a connection position WBPa of the wire 41 with respect to the first region WBR1 is located at a position spaced apart from the inlet portion CI.

[0035] The second region WBR2 is disposed on a side of the inlet portion CI. More specifically, the current detection device 100 (i.e., the busbar 20 and / or the resistor 10) has a side edge EB disposed on a side of the inlet portion CI (see FIG. 5). The second region WBR2 is disposed on the side of the side edge EB and is located on a side of the second electrode 13. When the current detection device 100 is viewed from above, the side edge EB extends perpendicular to the opposing side EA.

[0036] The current detection device 100 has a width b extending in the x direction from the end side EC of the wiring 23 to an extension line (not shown) of the opposing side EA. The second region WBR2 is disposed within the range of the width b. In the embodiment shown in FIG. 5, the second region WBR2 is a region having a length shorter than the width b, but the second region WBR2 may also be a region having a length equal to the width b.

[0037] The wire 42 is connected to the second region WBR2 located on the side edge EB side of the inlet portion CI and on the side of the second electrode 13. Therefore, the connection position WBPb of the wire 42 to the second region WBR2 is located at a position opposite to the outlet portion CO (more specifically, at a position adjacent to the inlet portion CI).

[0038] In this embodiment, the connection position WBPb is located on the inlet portion CI side of the center portion of the wiring 23 in the width b. In another embodiment, the connection position WBPb may be located on the end side EC side of the position of the width b corresponding to the inlet portion CI.

[0039] According to this embodiment, the current detection device 100 is configured such that the wire 41 is connected to the first region WBR1 and the wire 42 is connected to the second region WBR2. The first region WBR1 and the second region WBR2 are arranged adjacent to each other in the y direction (i.e., width direction) perpendicular to the x direction (i.e., longitudinal direction) of the current detection device 100.

[0040] Therefore, compared to the mounting structure disclosed in Patent Document 1, the current detecting device 100 can arrange the connection position WBPa of the wire 41 and the connection position WBPb of the wire 42 closer to each other. As a result, the current detecting device 100 can be made smaller.

[0041] 6 and 7 are diagrams showing the relationship between the wire connection position and the temperature coefficient of resistance (TCR). Fig. 7 shows the TCR when the connection position WBPa of wire 41 is changed from position A1 to A4 and the connection position WBPb of wire 42 is changed from position B1 to B5. Note that TCR is an index that indicates the rate of change in resistance value due to temperature.

[0042] Since the current flows mainly along the current path formed in the current detection device 100 (see the dotted arrows in FIGS. 4 and 5), the current density is high near the current path and decreases with increasing distance from the current path. Therefore, the TCR in the current detection device 100 can be changed by changing the connection position WBPa of the wire 41.

[0043] When the connection position WBPa of the wire 41 is determined to be position A1, the TCR changes in the negative direction compared to the TCR when the connection position WBPa is determined to be on the inflow portion CI side, for example, position A4. Similarly, when the connection position WBPb of the wire 42 is determined to be position B5, the TCR changes in the negative direction compared to the TCR when the connection position WBPb is determined to be on the outflow portion CO side, for example, position B1.

[0044] As is clear from Figures 6 and 7, the TCR can be reduced by determining the connection position WBPa at a position spaced apart from the inlet section CI (more specifically, the first region WBR1) and determining the connection position WBPb at a position spaced apart from the outlet section CO (more specifically, the second region WBR2).

[0045] Although not shown, in one embodiment, the TCR can be further reduced by reducing the distance c (see FIG. 5) between the side edge EB and the connection position WBPb. Therefore, the TCR can be adjusted by moving the connection position WBPb closer to the side edge EB.

[0046] As described above, the wiring 23 is connected to the second electrode 13 by soldering. However, such a connection may cause the solder to wet and spread to the second region WBR2 side (i.e., the solder may flow out) due to the close contact between the resistor 10 and the wiring 23.

[0047] If the solder flows out into the second region WBR2, the solder may interfere with bonding of the wire 42, and as a result, the current detection device 100 may not be able to obtain sufficient current measurement accuracy. Therefore, in the embodiment shown below, the configuration of the current detection device 100 that can obtain sufficient current measurement accuracy will be described with reference to the drawings.

[0048] Fig. 8 is a diagram showing a boundary portion for preventing solder flow. As shown in Fig. 8, the current detection device 100 has a boundary portion BD formed in the wiring 23 serving as the second conductor. The boundary portion BD is formed in a region Ra along one side (more specifically, side EB) of the second electrode 13.

[0049] The region Ra is formed between the resistor 10 on the wiring 23 and the second region WBR2. The wire 42 as the second detection conductor is connected to the side of the boundary BD (i.e., the second region WBR2 adjacent to the region Ra).

[0050] 9(a) to 9(d) are diagrams showing an example of a boundary portion. In the embodiment shown in Fig. 9(a), the boundary portion BD is an insulating resin member printed on the wiring 23. The boundary portion BD as a resin member is a protrusion extending from above the wiring 23, and corresponds to a barrier that prevents the solder from flowing out.

[0051] 9(b), the boundary portion BD is a concave non-through slit formed in the wiring 23. By forming the non-through slit, the solder flows into the non-through slit but does not flow into the second region WBR2. As a result, the non-through slit can prevent the solder from flowing out into the second region WBR2.

[0052] 9(c), the boundary portion BD is an insulating film (oxide film) formed on the wiring 23. The boundary portion BD as an insulating film is formed by irradiating a specific portion of the wiring 23 with a laser to oxidize a part of the wiring 23. Such an oxide film is difficult for solder to wet, and therefore prevents the solder from flowing out into the second region WBR2.

[0053] In the embodiment shown in Fig. 9(d), the boundary portion BD is a through slit formed in the wiring 23. The boundary portion BD as a through slit penetrates all the way to the insulating substrate 26. The through slit prevents the solder from flowing out into the second region WBR2, similar to the non-through slit described with reference to Fig. 9(b).

[0054] 10 and 11 are diagrams showing modified examples of the boundary. In the embodiment shown in FIG. 10, the boundary BD has an L-shape when the wiring 23 is viewed from above. More specifically, a portion of the boundary BD extends parallel to the x-direction of the resistor 10 and is disposed between the resistor 10 and the second region WBR2. The other portion of the boundary BD extends parallel to the y-direction of the resistor 10 and extends away from the side edge EB.

[0055] In this way, the L-shaped boundary portion BD arranged around the second region WBR2 can prevent the solder from flowing out into the second region WBR2. The specific structure (except for the shape) of the boundary portion BD is not particularly limited. For example, the boundary portion BD has the same structure as that described with reference to Figures 9(a) to 9(d) (i.e., the resin member, the non-penetrating slit, the insulating film, or the penetrating slit).

[0056] In the embodiment shown in FIG. 11, the boundary portion BD is a convex step (chip, pad) formed on the wiring 23. The second region WBR2 is formed on the boundary portion BD. By forming the second region WBR2 on the convex boundary portion BD, it is possible to prevent the solder from coming into contact with the second region WBR2. The boundary portion BD as a step is made of a metal such as copper, and is soldered to the wiring 23. In one embodiment, a coating such as tin may be formed on the surface of the boundary portion BD.

[0057] Indeed, by providing the boundary portion BD between the resistor 10 and the second region WBR2 as in the above-described embodiment, it is possible to prevent the solder from interfering with the bonding of the wire 41. On the other hand, in order to prevent the solder from flowing out to the connection position WBPb, it is possible to determine the connection position WBPb outside the region where the solder flows out. In other words, it is possible to sufficiently separate the connection position WBPb from the resistor 10.

[0058] However, in this case, the metal (e.g., copper) of the wiring 23 may adversely affect the TCR. Therefore, in the following embodiment, the configuration of a current detection device 100 that can eliminate the effect of the TCR will be described with reference to the drawings.

[0059] Fig. 12 is a diagram showing a boundary portion for eliminating the influence of TCR. In the embodiment shown in Fig. 12, the current detection device 100 includes a boundary portion BD formed in a region Rb of the wiring 23 along one side of the second electrode 13. The wire 42 is connected to the side of the boundary portion BD.

[0060] The region Rb is disposed at a position farther away from the side edge EB of the resistor 10 than the second region WBR2. A boundary portion BD formed in the region Rb extends parallel to the x direction of the current detection device 100. In this embodiment, the boundary portion BD is a slit (a non-penetrating slit or a penetrating slit) formed in the wiring 23. By forming the boundary portion BD, the TCR can be improved.

[0061] 13 is a diagram showing a modified example of the boundary portion. In the embodiment shown in Fig. 13, the boundary portion BD has an L-shape when the wiring 23 is viewed from above. More specifically, a portion of the boundary portion BD extends parallel to the x-direction of the resistor 10 and is disposed between the resistor 10 and the second region WBR2, and another portion of the boundary portion BD extends in the y-direction of the resistor 10 and in a direction close to the side edge EB.

[0062] 14(a) to 14(d) are diagrams showing modified examples of the boundary portion. In the embodiment shown in FIG. 14(a), the boundary portion BD extends parallel to the y direction of the resistor 10. The second region WBR2 is adjacent to the boundary portion BD in the x direction. Therefore, the wire 42 is connected to the inlet portion CI side of the boundary portion BD. The boundary portion BD having such a shape can achieve the same effect as the boundary portion BD according to the embodiment shown in FIGS. 12 and 13.

[0063] 14(b), the boundary portion BD has an L-shape when viewed from above the wiring 23, and a portion of the boundary portion BD extending in the x-direction of the resistor 10 is connected to the end side EC of the wiring 23. The other portion of the boundary portion BD extends parallel to the y-direction. The second region WBR2 is surrounded by the L-shaped boundary portion BD. Therefore, the wire 42 is connected to the inflow portion CI side of the boundary portion BD.

[0064] 14(c), the boundary portion BD has a U-shape when the wiring 23 is viewed from above. The U-shaped boundary portion BD is disposed so that its opening (i.e., the portion where no slit is formed) faces the resistor 10. The second region WBR2 is surrounded by the boundary portion BD.

[0065] 14(d), the boundary portion BD also has a U-shape. The boundary portion BD is disposed so that its opening faces the end side EC. In this embodiment, the second region WBR2 is also surrounded by the boundary portion BD.

[0066] 15(a) and 15(b) are diagrams showing modified examples of the boundary portion. In Fig. 15(a), the resistor 10 before being mounted on the wiring 23 is virtually depicted by a dotted line. As shown in Fig. 15(a) and 15(b), the boundary portion BD may have a straight portion that extends to below the resistor 10 when the resistor 10 is mounted on the wiring 23.

[0067] The straight line portion serving as the boundary portion BD extends in a direction (i.e., parallel to the end side EC) perpendicular to one side (i.e., the side edge EB) of the second electrode 13, and the boundary portion BD is connected to an end surface of the wiring 23. The second region WBR2 is disposed between the boundary portion BD and the end side EC. Therefore, the wire 42 is connected to the inflow portion CI side of the boundary portion BD.

[0068] 16 and 17 are diagrams showing other embodiments of the current detection device. In the above-described embodiments, the current detection device 100 includes the bus bar 20 as the first conductor, but in one embodiment, the current detection device 100 may include a clip terminal 400 (see FIG. 16) or a plurality of bonding wires 500 (see FIG. 17) instead of the bus bar 20. The plurality of bonding wires 500 are connected to an inlet portion CI as a starting end portion of the current detection device 100.

[0069] According to the present invention, it is possible to make products smaller and lighter, and reduce the amount of material used. This allows the devices used to be smaller and lighter, contributing to a reduction in energy consumption. This invention can contribute to the achievement of Goal 3 "Good health and well-being," Goal 7 "Affordable and clean energy," and Goal 12 "Responsible consumption and production" of the Sustainable Development Goals (SDGs) led by the United Nations.

[0070] The above-described embodiments have been described for the purpose of enabling a person of ordinary skill in the art to practice the present invention. Various modifications of the above-described embodiments would be obvious to a person skilled in the art, and the technical concept of the present invention may be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is to be interpreted in the broadest scope in accordance with the technical concept defined by the claims. [Explanation of symbols]

[0071] 10 resistor 11 Resistor 12 1st electrode 13 Second electrode 20 Busbar (first conductor) 21,22 Busbar 23 Wiring (second conductor) 24,25 Wiring 26 Insulating substrate 30 Power Devices 40 Bonding Wire 41 Bonding wire (first detection conductor) 42 Bonding wire (second detection conductor) 45 cases 51 First voltage detection terminal 52 Second voltage detection terminal 100 Current detection device 200 Power Module BD border EA Opposite side EB side EC edge CI inlet CO outflow part WBR1 1st area WBR2 2nd area WBPa connection position WBPb connection position a width b Width c distance Ra area Rb area

Claims

1. A current detection device, a resistor having a laminated structure in which a first electrode, a resistive element, and a second electrode are laminated in a thickness direction; a first conductor connected to the first electrode; a second conductor connected to the second electrode; a first detection conductor and a second detection conductor for detecting a voltage; the first detection conductor is connected to a first region on an upper surface of the first electrode or the first conductor, the first region being on an opposing side facing an inlet portion of the first conductor; A current detection device, wherein the second detection conductor is connected to a second region of the second conductor that is located on a lateral side of the inlet portion and on a side of the second electrode.

2. The current detection device according to claim 1 , wherein the first region is a region extending from a center of the first electrode to the opposing side.

3. the second conductor is a wiring pattern formed on a circuit board, the second electrode and the second conductor are connected by solder; the second conductor has a boundary portion formed in a region along one side of the second electrode, The current detection device according to claim 1 , wherein the second detection conductor is connected to a side of the boundary portion.

4. The current detection device according to claim 3 , wherein the boundary portion is a through slit, a non-through slit, an insulating film, or a step formed in the second conductor.

5. the boundary portion has a straight line portion, The current detection device according to claim 3 , wherein the linear portion extends in a direction perpendicular to one side of the second electrode.

6. The current detection device according to claim 5 , wherein the second detection conductor is connected to a portion closer to the inflow portion than the boundary portion.

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