Electronic component

Abstract

To suppress inclination at the time of mounting in a surface mounting chip type electronic component.SOLUTION: The electronic device 100 includes the magnetic element body 110 having the mounting surface 115, the coil C embedded in the magnetic element body 110, and the bump conductors B1 and B2 connected to the coil C and exposed from the mounting surface 115 of the magnetic element body 110. The mounting surface 115 of the magnetic element body 110 includes cutout portions 131132 and at least partially overlapping the bump conductors B1 and B2. When excessive solder is generated at the time of mounting, the excessive solder is accommodated in the notch portion 131,132.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to electronic components. [Background technology]

[0002] Patent Document 1 discloses a surface-mount chip-type electronic component having a structure in which a coil is embedded in an element body. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2024-027519 Summary of the Invention [Problem to be solved by the invention]

[0004] When this type of electronic component is surface-mounted on a circuit board, variations in the amount of solder can cause the electronic component to tilt on the circuit board.

[0005] In the present disclosure, a technique for suppressing tilt during mounting of a surface-mounted chip-type electronic component is described. [Means for solving the problem]

[0006] An electronic component according to one aspect of the present disclosure comprises a base body having a mounting surface, a passive element embedded in the base body, and a bump conductor connected to the passive element and exposed from the mounting surface of the base body, wherein the mounting surface of the base body has a cutout portion that at least partially overlaps with the bump conductor. [Effects of the Invention]

[0007] According to the present disclosure, a technique is provided for suppressing tilting of a surface-mounted chip-type electronic component during mounting. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic perspective view showing the appearance of an electronic component 100 according to an embodiment of the technology disclosed herein. [Figure 2] FIG. 2 is a schematic plan view for explaining the pattern shape of the conductor layer L1. [Figure 3] FIG. 3 is a schematic plan view for explaining the pattern shape of the conductor layer L2. [Figure 4] FIG. 4 is a schematic plan view for explaining the pattern shape of the conductor layer L3. [Figure 5] FIG. 5 is a schematic perspective view of electronic component 100 as viewed from mounting surface 115 side. [Figure 6] FIG. 6(a) is a schematic plan view of the electronic component 100 as viewed from the mounting surface 115 side, and FIG. 6(b) is a schematic cross-sectional view taken along line AA shown in FIG. 6(a). [Figure 7] FIG. 7 is a schematic cross-sectional view showing a state in which electronic component 100 is mounted on circuit board 200. As shown in FIG. [Figure 8] FIG. 8 is a schematic plan view for explaining an example of a method for forming the notches 131 and 132. As shown in FIG. [Figure 9] FIG. 9 is a schematic perspective view of electronic component 100A according to the first modified example, as viewed from mounting surface 115 side. [Figure 10] FIG. 10 is a schematic plan view of electronic component 100A according to the first modified example, as viewed from mounting surface 115 side. [Figure 11] FIG. 11 is a schematic perspective view of electronic component 100B according to the second modification, as viewed from mounting surface 115 side. [Figure 12] FIG. 12(a) is a schematic plan view of electronic component 100B according to a second modified example, as viewed from mounting surface 115, and FIG. 12(b) is a schematic cross-sectional view taken along line AA shown in FIG. 12(a). [Figure 13] FIG. 13 is a schematic perspective view of electronic component 100C according to the third modification, as viewed from mounting surface 115 side. [Figure 14]FIG. 14(a) is a schematic plan view of an electronic component 100C according to a third modified example, as viewed from the mounting surface 115 side, and FIG. 14(b) is a schematic cross-sectional view taken along line AA shown in FIG. 14(a). DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the technology according to the present disclosure will be described in detail with reference to the accompanying drawings.

[0010] FIG. 1 is a schematic perspective view showing the appearance of an electronic component 100 according to an embodiment of the technology disclosed herein.

[0011] 1 includes a magnetic body 110 and a coil C embedded in the magnetic body 110. The magnetic body 110 has a mounting surface 115 and a top surface 116 that form an XY plane and are located opposite each other, side surfaces 111 and 112 that form an XZ plane and are located opposite each other, and side surfaces 113 and 114 that form a YZ plane and are located opposite each other. The side surfaces 111 and 112 are perpendicular to the mounting surface 115, the side surfaces 113 and 114 are perpendicular to the mounting surface 115, and the top surface 116. The mounting surface 115 has cutouts 131 and 132, which will be described later.

[0012] The magnetic element body 110 has a longitudinal direction in the X direction, a lateral direction in the Y direction, and a thickness direction in the Z direction. The size in the thickness direction of the magnetic element body 110 is, for example, half or less of the width in the lateral direction, making it thin. As an example, the width Wx of the magnetic element body 110 in the longitudinal direction is 1.0 mm, the width Wy of the magnetic element body 110 in the lateral direction is 0.8 mm, and the thickness Wz of the magnetic element body 110 is 0.3 mm. Thus, the electronic component 100 according to this embodiment is small for an electronic component using a magnetic element body 110, and is characterized by a particularly thin thickness Wz.

[0013] The magnetic element 110 is made of a composite magnetic material containing a magnetic filler and a resin binder. Examples of the magnetic filler material include metal magnetic materials such as sendust, permalloy, iron, Fe-Si-Cr based magnetic alloys, Fe-Si-Al-Cr based magnetic alloys, and Fe-Al-Cr based magnetic alloys.

[0014] Coil C is composed of multiple conductor layers stacked in the Z direction.

[0015] FIG. 2 is a schematic plan view for explaining the pattern shape of the conductor layer L1.

[0016] As shown in FIG. 2 , the conductor layer L1 has a coil pattern 10, a connection pattern 11, and dummy connection patterns 12 and 13. The coil pattern 10 is a pattern that wraps around for approximately one turn, and one end 10A of the coil pattern 10 is located near a corner 31 without being exposed from the side surfaces 111 and 113 of the magnetic body 110. The connection pattern 11 and the dummy connection patterns 12 and 13 are patterns that are provided independently from the coil pattern 10 within the plane. The connection pattern 11 is located near a corner 32 without being exposed from the side surfaces 111 and 114 of the magnetic body 110. The dummy connection pattern 12 is located near a corner 33 without being exposed from the side surfaces 112 and 113 of the magnetic body 110. The dummy connection pattern 13 is located near a corner 34 without being exposed from the side surfaces 112 and 114 of the magnetic body 110. An insulating resin 30 is provided between the coil pattern 10, the connection pattern 11, and the dummy connection patterns 12, 13 and the magnetic body 110, thereby preventing direct contact between them.

[0017] The magnetic body 110, which is located in the same plane as the conductor layer L1, includes, in a plan view seen from the Z direction, a region 121 surrounded by the coil pattern 10 and a region 122 located outside the coil pattern 10 in a plan view seen from the Z direction. The region 122 constitutes a part of the side surfaces 111 to 114.

[0018] FIG. 3 is a schematic plan view for explaining the pattern shape of the conductor layer L2.

[0019] As shown in FIG. 3 , the conductor layer L2 has a coil pattern 20, a connection pattern 21, and dummy connection patterns 22 and 23. The coil pattern 20 is a pattern that wraps around for approximately 3 / 4 turns, and one end 20A of the coil pattern 20 is located near a corner 32 without being exposed from the side surfaces 111 and 114 of the magnetic body 110. The connection pattern 21 and the dummy connection patterns 22 and 23 are patterns that are provided independently from the coil pattern 20 within the plane. The connection pattern 21 is located near a corner 31 without being exposed from the side surfaces 111 and 113 of the magnetic body 110. The dummy connection pattern 22 is located near the corner 32 without being exposed from the side surfaces 112 and 113 of the magnetic body 110. The dummy connection pattern 23 is located near the corner 34 without being exposed from the side surfaces 112 and 114 of the magnetic body 110. An insulating resin 30 is provided between the coil pattern 20, the connection pattern 21, and the dummy connection patterns 22, 23 and the magnetic body 110, thereby preventing direct contact between them.

[0020] One end 20A of the coil pattern 20 is connected to the connection pattern 11 located on the conductor layer L1 via a via conductor 41 provided to penetrate the insulating resin 30. The other end 20B of the coil pattern 20 is connected to the other end 10B of the coil pattern 10 located on the conductor layer L1 via a via conductor 42 provided to penetrate the insulating resin 30. The connection pattern 21 is connected to one end 10A of the coil pattern 10 located on the conductor layer L1 via a via conductor 43 provided to penetrate the insulating resin 30. The dummy connection patterns 22 and 23 are connected to dummy connection patterns 12 and 13 located on the conductor layer L1 via via conductors 44 and 45 provided to penetrate the insulating resin 30, respectively.

[0021] The magnetic body 110, which is located in the same plane as the conductor layer L2, includes, in a plan view seen from the Z direction, a region 123 surrounded by the coil pattern 20 and a region 124 located outside the coil pattern 20 in a plan view seen from the Z direction. The region 124 constitutes a part of the side surfaces 111 to 114.

[0022] FIG. 4 is a schematic plan view for explaining the pattern shape of the conductor layer L3.

[0023] As shown in FIG. 4, the conductor layer L3 has bump conductors B1 and B2 and dummy bump conductors DB1 and DB2. The bump conductor B1 is connected to the connection pattern 21 located on the conductor layer L2 through a via conductor 51 provided to penetrate the insulating resin 30. The bump conductor B2 is connected to one end 20A of the coil pattern 20 located on the conductor layer L2 through a via conductor 52 provided to penetrate the insulating resin 30. As a result, one end of the coil C is connected to the bump conductor B1, and the other end of the coil C is connected to the bump conductor B2. The dummy bump conductors DB1 and DB2 are connected to the dummy connection patterns 22 and 23 located on the conductor layer L2, respectively, through via conductors 53 and 54 provided to penetrate the insulating resin 30. The dummy bump conductors DB1 and DB2 are not connected to the coil C inside the magnetic base body 110.

[0024] Bump conductor B1 is located near corner 31 without being exposed from side surfaces 111, 113 of the magnetic body 110. Bump conductor B2 is located near corner 32 without being exposed from side surfaces 111, 114 of the magnetic body 110. Dummy bump conductor DB1 is located near corner 33 without being exposed from side surfaces 112, 113 of the magnetic body 110. Dummy bump conductor DB2 is located near corner 34 without being exposed from side surfaces 112, 114 of the magnetic body 110. The surfaces of bump conductors B1, B2 and dummy bump conductors DB1, DB2 are all exposed from the mounting surface 115.

[0025] Fig. 5 is a schematic perspective view of electronic component 100 according to this embodiment as viewed from the mounting surface 115. Fig. 6(a) is a schematic plan view of electronic component 100 as viewed from the mounting surface 115, and Fig. 6(b) is a schematic cross-sectional view taken along line AA in Fig. 6(a).

[0026] As shown in FIGS. 5 and 6, slit-shaped cutouts 131 and 132 are provided on the mounting surface 115 of the magnetic body 110. The slits that form the cutouts 131 and 132 extend in the Y direction, with the width direction being the X direction. The cutout 131 is provided along one side of the mounting surface 115 located at the boundary with the side surface 113, and extends over the magnetic body 110, bump conductor B1, and dummy bump conductor DB1. The cutout 132 is provided along another side of the mounting surface 115 located at the boundary with the side surface 114, and extends over the magnetic body 110, bump conductor B2, and dummy bump conductor DB2. The cutout 131 is a portion where part of the magnetic body 110, part of the bump conductor B1, and part of the dummy bump conductor DB1 have been removed. The cutout portion 132 is a portion where another part of the magnetic body 110, part of the bump conductor B2, and part of the dummy bump conductor DB2 have been removed. Therefore, the bottom surfaces 131a and 132a of the cutout portions 131 and 132 are recessed from the mounting surface 115 in the +Z direction.

[0027] The depth of the cutout portions 131, 132 in the Z direction is smaller than the thickness of the bump conductors B1, B2 and the dummy bump conductors DB1, DB2 in the Z direction. Therefore, the bump conductor B1 and the dummy bump conductor DB1 are also exposed at the bottom surface 131a of the cutout portion 131, and the bump conductor B2 and the dummy bump conductor DB2 are also exposed at the bottom surface 132a of the cutout portion 132. The bottom surfaces 131a, 132a of the cutout portions 131, 132 may be flat surfaces that form the XY plane, may be inclined relative to the XY plane, or may be curved surfaces.

[0028] Of the bump conductors B1, B2 and the dummy bump conductors DB1, DB2, the surfaces that do not overlap with the cutout portions 131, 132 may be flush with the mounting surface 115. The step surfaces 131b, 132b that form the edge portions of the cutout portions 131, 132 may be vertical surfaces extending in the YZ directions. The bump conductor B1 and the dummy bump conductor DB1 are also exposed at the step surface 131b, and the bump conductor B2 and the dummy bump conductor DB2 are also exposed at the step surface 132b.

[0029] FIG. 7 is a schematic cross-sectional view showing a state in which electronic component 100 according to this embodiment is mounted on circuit board 200. As shown in FIG.

[0030] 7, when electronic component 100 according to this embodiment is mounted on circuit board 200, bump conductors B1 and B2 are connected to land patterns 201 and 202 on circuit board 200, respectively, via solder 203. Dummy bump conductors DB1 and DB2 are also connected to other land patterns (not shown) on circuit board 200, respectively, via solder 203. Providing such dummy bump conductors DB1 and DB2 increases the bonding strength between electronic component 100 and circuit board 200 and stabilizes the posture of electronic component 100 on circuit board 200.

[0031] When mounting electronic component 100 on circuit board 200, solder 203 is supplied to land patterns 201 and 202 in advance, but the amount of solder 203 supplied varies to some extent. However, electronic component 100 according to this embodiment has cutouts 131 and 132 provided at positions overlapping bump conductors B1 and B2 and dummy bump conductors DB1 and DB2, respectively. Therefore, even if there is a difference in the amount of solder 203 supplied to land patterns 201 and 202, excess solder 203 is accommodated in cutouts 131 and 132, making it difficult for electronic component 100 to tilt on circuit board 200. Furthermore, accommodating excess solder 203 in cutouts 131 and 132 prevents the excess solder 203 from spreading, reducing the likelihood of short circuits between adjacent land patterns and improving reliability in high-density mounting.

[0032] Moreover, in electronic component 100 according to this embodiment, bump conductors B1, B2 and dummy bump conductors DB1, DB2 are not exposed from any of side surfaces 111-114 of magnetic body 110, and the entire periphery of the surface exposed on mounting surface 115 is surrounded by magnetic body 110, making it difficult for solder 203 to wrap around to side surfaces 111-114. This reduces the likelihood of short-circuiting with adjacent land patterns, improving reliability in high-density mounting.

[0033] FIG. 8 is a schematic plan view for explaining an example of a method for forming the notches 131 and 132. As shown in FIG.

[0034] As shown in Fig. 8, a large number of electronic components 100 according to this embodiment are obtained by dicing aggregate substrate 101. Then, before dicing aggregate substrate 101 into individual components, a region of mounting surface 115 having width B in the X direction is half-diced in the Y direction along the boundary between two electronic components 100 adjacent in the X direction. Thereafter, by dicing aggregate substrate 101 into individual electronic components 100, electronic components 100 having cutouts 131 and 132 can be fabricated. Using this method, cutouts 131 and 132 can be easily formed.

[0035] Fig. 9 is a schematic perspective view of electronic component 100A according to the first modified example, as viewed from mounting surface 115. Fig. 10 is a schematic plan view of electronic component 100A according to the first modified example, as viewed from mounting surface 115. The cross-sectional structure taken along line AA shown in Fig. 10 is the same as the structure shown in Fig. 6(b).

[0036] 9 and 10, electronic component 100A according to the first modified example differs from electronic component 100 according to the above embodiment in that four notches 141 to 144 are provided instead of notches 131 and 132. The other basic structure is the same as that of electronic component 100 according to the above embodiment, and therefore the same elements are denoted by the same reference numerals and redundant explanations will be omitted.

[0037] The cutouts 141 and 143 are provided at different positions in the Y direction on one side of the mounting surface 115 located at the boundary with the side surface 113, and a portion of each overlaps with the bump conductor B1 and the dummy bump conductor DB1. In other words, the cutout 141 is a portion where a portion of the magnetic base body 110 and a portion of the bump conductor B1 have been removed, and the cutout 143 is a portion where another portion of the magnetic base body 110 and a portion of the dummy bump conductor DB1 have been removed. The cutouts 142 and 144 are provided at different positions in the Y direction on one side of the mounting surface 115 located at the boundary with the side surface 114, and a portion of each overlaps with the bump conductor B2 and the dummy bump conductor DB2. In other words, cutout portion 142 is a portion where another part of magnetic base body 110 and part of bump conductor B2 have been removed, and cutout portion 144 is a portion where another part of magnetic base body 110 and part of dummy bump conductor DB2 have been removed.

[0038] In electronic component 100A having such a structure, as in electronic component 100 according to the above embodiment, excess solder is accommodated in cutouts 141-144, making electronic component 100A less likely to tilt on the circuit board. Moreover, compared to electronic component 100 according to the above embodiment, the volume of magnetic body 110 removed by cutouts 141-144 is smaller, making it possible to suppress a decrease in inductance of coil C.

[0039] Fig. 11 is a schematic perspective view of electronic component 100B according to the second modified example, as viewed from the mounting surface 115. Fig. 12(a) is a schematic plan view of electronic component 100B according to the second modified example, as viewed from the mounting surface 115, and Fig. 12(b) is a schematic cross-sectional view taken along line AA in Fig. 12(a).

[0040] 11 and 12, electronic component 100B according to the second modification differs from electronic component 100A according to the first modification in that electronic component 100B has cutouts 151 to 154 instead of cutouts 141 to 144. The other basic structure is the same as that of electronic component 100A according to the first modification, and therefore the same elements are denoted by the same reference numerals and redundant explanations will be omitted.

[0041] The cutout portions 151 to 154 are the same as the cutout portions 141 to 144 described above in that they are provided at positions overlapping the bump conductor B1, the bump conductor B2, the dummy bump conductor DB1, and the dummy bump conductor DB2, respectively, but differ from the cutout portions 141 to 144 described above in that they are provided at positions away from the side surface 113 or 114 of the magnetic body 110. In other words, the cutout portions 151 to 154 are provided only on the mounting surface 115 and are not exposed from the side surface 113 or 114.

[0042] Electronic component 100B having this structure can also achieve the same effects as electronic component 100A according to the first modification. Moreover, because notches 151-154 are not connected to side surfaces 113 and 114, the spread of excess solder onto side surfaces 113 and 114 is more effectively suppressed.

[0043] Fig. 13 is a schematic perspective view of electronic component 100C according to the third modified example, as viewed from mounting surface 115. Fig. 14(a) is a schematic plan view of electronic component 100C according to the third modified example, as viewed from mounting surface 115, and Fig. 14(b) is a schematic cross-sectional view taken along line AA in Fig. 14(a).

[0044] 13 and 14, electronic component 100C according to the third modification differs from electronic component 100B according to the second modification in that electronic component 100C has cutouts 161 to 164 instead of cutouts 151 to 154. The other basic structure is the same as that of electronic component 100B according to the second modification, and therefore the same elements are denoted by the same reference numerals and redundant explanations will be omitted.

[0045] The cutout portions 161 to 164 are the same as the cutout portions 151 to 154 described above in that they are provided at positions overlapping with the bump conductor B1, the bump conductor B2, the dummy bump conductor DB1, and the dummy bump conductor DB2, respectively. However, they differ from the cutout portions 151 to 154 described above in that they are provided at positions surrounded by the bump conductor B1, the bump conductor B2, the dummy bump conductor DB1, and the dummy bump conductor DB2, respectively, without cutting out the magnetic base body 110.

[0046] Electronic component 100C having this structure can also achieve the same effects as electronic component 100B according to the second modification. Moreover, since notches 161-164 do not reduce the volume of magnetic body 110, the inductance of coil C does not decrease.

[0047] The above describes embodiments of the technology according to the present disclosure, but the technology according to the present disclosure is not limited to the above embodiments, and various modifications are possible within the scope of the gist of the technology, and it goes without saying that these modifications are also included within the scope of the technology according to the present disclosure.

[0048] For example, while the electronic component 100 described above has a structure in which a coil C is embedded in a magnetic base body 110, the present invention is not limited to this and can be applied to electronic components having a structure in which other passive elements, such as capacitors, are embedded in the base body. If the passive element is not a coil, the material of the base body does not need to be magnetic, and a non-magnetic material, such as resin, may be used as the material of the base body.

[0049] The technology according to the present disclosure includes, but is not limited to, the following configuration examples.

[0050] An electronic component according to one aspect of the present disclosure includes an element body having a mounting surface, a passive element embedded in the element body, and a bump conductor connected to the passive element and exposed from the mounting surface of the element body, the mounting surface of the element body having a notch at least partially overlapping the bump conductor, whereby excess solder is contained in the notch.

[0051] In the electronic component, the depth of the notch may be smaller than the thickness of the bump conductor, which allows the bump conductor to be exposed at the bottom of the notch.

[0052] In the above electronic component, the cutout portion may be provided across the bump conductor and the element body. This allows the cutout portion to accommodate a larger amount of solder. In this case, the cutout portion may be configured as a slit formed along one side of the mounting surface of the element body. This makes it easier to form the cutout portion.

[0053] In the electronic component described above, the cutout may be provided at a position surrounded by the bump conductors without cutting out the element body, which prevents the cutout from reducing the volume of the element body.

[0054] In the electronic component, the element body may further have first and second side surfaces that are perpendicular to the mounting surface and located opposite each other, and third and fourth side surfaces that are perpendicular to the mounting surface and the first side surface and located opposite each other, and the bump conductor may be entirely surrounded by the element body on the mounting surface without being exposed from any of the first to fourth side surfaces. This makes it difficult for solder to wrap around the side surfaces of the element body, thereby improving reliability in high-density mounting.

[0055] In the electronic component, the bump conductors may further include dummy bump conductors that are not connected to the passive element, and the cutouts may overlap the dummy bump conductors, thereby increasing the bonding strength between the electronic component and the circuit board and stabilizing the position of the electronic component on the circuit board.

[0056] In the electronic component described above, the passive element may be a coil, the bump conductor may include a first bump conductor connected to one end of the coil and a second bump conductor connected to the other end of the coil, and the notch may overlap the first and second bump conductors. This makes it possible to provide a surface-mount chip coil component with high mounting reliability. In this case, the element body may be made of a composite magnetic material containing a magnetic filler and a resin binder. This makes it possible to obtain a higher inductance. [Explanation of symbols]

[0057] 10,20 coil pattern 10A, 20A One end of the coil pattern 10B, 20B Other end of coil pattern 11,21 Connection Pattern 12,13,22,23 Dummy connection pattern 30 Insulating resin 31~34 Corner 41~45, 51~54 Via conductors 100,100A~100C Electronic Components 101 Collective board 110 Magnetic element 111~114 Side 115 Mounting surface 116 Top surface 121~124 area 131, 132, 141-144, 151-154, 161-164 Notch 131a, 132a Bottom surface of notch 131b, 132b Step surface of notch 200 Circuit Boards 201,202 Land Pattern 203 Solder B1, B2 bump conductor C coil DB1, DB2 dummy bump conductor L1~L3 conductor layers

Claims

1. an element body having a mounting surface; a passive element embedded in the element body; a bump conductor connected to the passive element and exposed from the mounting surface of the element body; Equipped with the mounting surface of the element body has a notch at least part of which overlaps with the bump conductor; Electronic components.

2. The depth of the notch is smaller than the thickness of the bump conductor. The electronic component according to claim 1 .

3. the notch is provided across the bump conductor and the element body; The electronic component according to claim 1 .

4. the notch portion is configured by a slit formed along one side of the mounting surface of the element body. The electronic component according to claim 3 .

5. the notch is provided at a position surrounded by the bump conductor without cutting out the element body; The electronic component according to claim 1 .

6. the element body further has first and second side surfaces that are orthogonal to the mounting surface and positioned opposite to each other, and third and fourth side surfaces that are orthogonal to the mounting surface and the first side surface and positioned opposite to each other, the bump conductor is not exposed from any of the first to fourth side faces, and is entirely surrounded by the element body on the mounting surface; The electronic component according to claim 1 .

7. the bump conductors further include dummy bump conductors that are not connected to the passive element; the notch portion overlaps with the dummy bump conductor; The electronic component according to claim 1 .

8. the passive element is a coil, the bump conductors include a first bump conductor connected to one end of the coil and a second bump conductor connected to the other end of the coil; the notch portion overlaps with the first and second bump conductors; The electronic component according to any one of claims 1 to 7.

9. The element body is made of a composite magnetic material containing a magnetic filler and a resin binder. The electronic component according to claim 8.

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