Method and apparatus for manufacturing electronic component

Abstract

To provide a method and an apparatus for manufacturing an electronic component which can be miniaturized.SOLUTION: A method for manufacturing an electronic component including an element body 110 having a first end surface 115 and a second end surface 116 opposite to each other in a length direction, and an external electrode provided on each of the first end surface and the second end surface, the method including a step of immersing the element body in a first conductive paste layer 51, which is a precursor of the external electrode, from the first end surface side; The method includes a step of moving the element body part relative to the first conductive paste layer in the in-plane direction of the first end face, a step of pulling up the element body part from the first conductive paste layer while or after the element body part is moved relative to the first conductive paste layer in the in-plane direction of the first end face, and a step of immersing the element body part in a second conductive paste layer, which is a precursor of the external electrode, from the first end face side after the element body part is pulled up from the first conductive paste layer.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] The present disclosure relates to a method and an apparatus for manufacturing electronic components. [Background technology]

[0002] Conventionally, electronic components have been known that include a substantially rectangular parallelepiped element body in which dielectric layers and internal electrode layers are alternately stacked, and external electrodes provided on a pair of end faces of the element body in the longitudinal direction. JP 2017-73435 A (Patent Document 1) discloses a multilayer ceramic capacitor as one such electronic component.

[0003] The external electrodes not only cover the end faces of the element body, but also extend from these end faces to each of the four outer peripheral surfaces of the element body. The multilayer ceramic capacitor is mounted on a substrate, for example, via solder joined to the external electrodes. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-73435 Summary of the Invention [Problem to be solved by the invention]

[0005] In recent years, miniaturization has become an important issue for electronic components such as multilayer ceramic capacitors. From the perspective of miniaturizing electronic components, it is necessary to configure the thickness of external electrodes as small as possible.

[0006] Therefore, the present disclosure has been made to solve the above-mentioned problems, and aims to provide a method and an apparatus for manufacturing electronic components that can be made smaller. [Means for solving the problem]

[0007] A method for manufacturing an electronic component according to the present disclosure includes a step of immersing the element part from the first end face into a first conductive paste layer that is a precursor of the external electrode, a step of moving the element part relative to the first conductive paste layer in an in-plane direction of the first end face while the element part is immersed in the first conductive paste layer from the first end face, a step of lifting the element part from the first conductive paste layer while the element part is being moved relative to the first conductive paste layer in the in-plane direction of the first end face, and a step of lifting the element part from the first conductive paste layer after the element part has been lifted from the first conductive paste layer.

[0008] In the method for manufacturing an electronic component according to the present disclosure, the second conductive paste layer may have a thickness greater than the thickness of the first conductive paste layer.

[0009] In the method for manufacturing an electronic component based on the present disclosure, in a step of moving the element body portion relative to the first conductive paste layer in the in-plane direction of the first end face, the element body portion may be moved relative to the first conductive paste layer in a first direction perpendicular to the longitudinal direction.

[0010] In the method for manufacturing an electronic component based on the present disclosure, in the step of moving the element body portion relative to the first conductive paste layer in the in-plane direction of the first end face, the element body portion may further be moved relative to the first conductive paste layer in a second direction perpendicular to each of the longitudinal direction and the first direction.

[0011] An electronic component manufacturing apparatus according to the present disclosure includes an element body part having a first end face and a second end face opposing each other in the longitudinal direction, and external electrodes provided on each of the first end face and the second end face. The electronic component manufacturing apparatus according to the present disclosure includes a holding unit, a paste layer holding mechanism, a vertical drive mechanism, a horizontal drive mechanism, and a control unit. The holding unit holds the element body part so that the first end face faces vertically downward. The first conductive paste layer and the second conductive paste layer are both precursors of the external electrodes. The paste layer holding mechanism holds the first conductive paste layer and the second conductive paste layer. The vertical drive mechanism moves the holding unit in the vertical direction. The horizontal drive mechanism moves the holding unit in the horizontal direction. The control unit controls the operation of the vertical drive mechanism and the horizontal drive mechanism. The control unit moves the holding unit using the vertical drive mechanism to immerse the element part from the first end face side into the first conductive paste layer, moves the holding unit using the horizontal drive mechanism so that the first end face moves horizontally while the element part is immersed in the first conductive paste layer from the first end face side, moves the holding unit using the vertical drive mechanism so that the element part is lifted up from the first conductive paste layer while or after the first end face moves horizontally, and after the element part has been lifted up from the first conductive paste layer, moves the holding unit using the vertical drive mechanism to immerse the element part from the first end face side into the second conductive paste layer.

[0012] In the electronic component manufacturing apparatus according to the present disclosure, the second conductive paste layer may have a thickness greater than the thickness of the first conductive paste layer.

[0013] In the electronic component manufacturing apparatus according to the present disclosure, the paste layer holding mechanism may have a flat plate portion, in which case the first conductive paste layer may be provided on the flat plate portion, and the second conductive paste layer may be provided on the flat plate portion in place of the first conductive paste layer after the element body portion is lifted up from the first conductive paste layer.

[0014] In the electronic component manufacturing apparatus according to the present disclosure, the paste layer holding mechanism may have a first flat plate portion and a second flat plate portion separate from the first flat plate portion, in which case the first conductive paste layer may be provided on the first flat plate portion, and the second conductive paste layer may be provided on the second flat plate portion. [Effects of the Invention]

[0015] According to the present disclosure, it is possible to provide a method and an apparatus for manufacturing an electronic component that allows miniaturization. [Brief explanation of the drawings]

[0016] [Figure 1] 1 is a perspective view schematically illustrating the appearance of a multilayer ceramic capacitor manufactured according to a method for manufacturing a multilayer ceramic capacitor according to an embodiment. [Figure 2] FIG. 2 is a schematic cross-sectional view of the multilayer ceramic capacitor shown in FIG. [Figure 3] FIG. 2 is a schematic cross-sectional view of the multilayer ceramic capacitor shown in FIG. [Figure 4] FIG. 2 is a flowchart showing a method for manufacturing a multilayer ceramic capacitor according to an embodiment. [Figure 5] FIG. 5 is a detailed flow diagram of step S8 in the manufacturing flow shown in FIG. [Figure 6] FIG. 6 is a schematic cross-sectional view for explaining step S811 of the manufacturing flow shown in FIG. 5. [Figure 7] FIG. 6 is a schematic cross-sectional view for explaining step S811 of the manufacturing flow shown in FIG. 5. [Figure 8] FIG. 6 is a schematic cross-sectional view for explaining step S812 of the manufacturing flow shown in FIG. 5. [Figure 9] FIG. 6 is a schematic cross-sectional view for explaining step S813 of the manufacturing flow shown in FIG. 5. [Figure 10] FIG. 6 is a schematic plan view for explaining the direction in which the element body part moves in step S813 of the manufacturing flow shown in FIG. 5. [Figure 11] FIG. 6 is a schematic cross-sectional view for explaining step S814 of the manufacturing flow shown in FIG. 5. [Figure 12] FIG. 6 is a schematic cross-sectional view for explaining step S815 of the manufacturing flow shown in FIG. 5. [Figure 13] FIG. 6 is a schematic cross-sectional view for explaining step S816 of the manufacturing flow shown in FIG. 5. [Figure 14] FIG. 6 is a schematic cross-sectional view for explaining step S816 of the manufacturing flow shown in FIG. 5. [Figure 15] FIG. 6 is a schematic cross-sectional view for explaining step S817 of the manufacturing flow shown in FIG. 5. [Figure 16] 6 is a schematic cross-sectional view illustrating step S82 of the manufacturing flow shown in FIG. 5. FIG. [Figure 17] 6 is a schematic cross-sectional view illustrating step S82 of the manufacturing flow shown in FIG. 5. FIG. [Figure 18] 6 is a schematic cross-sectional view illustrating step S82 of the manufacturing flow shown in FIG. 5. FIG. [Figure 19] FIG. 5 is a schematic cross-sectional view illustrating step S9 of the manufacturing flow shown in FIG. [Figure 20] FIG. 5 is a schematic cross-sectional view illustrating step S9 of the manufacturing flow shown in FIG. [Figure 21] FIG. 10 is a schematic plan view of the multilayer ceramic capacitor for explaining measurement positions of the thickness dimension of the external electrodes in a verification test. [Figure 22] 1 is a table showing test conditions and test results in a verification test. [Figure 23] 1 is a table showing test conditions and test results in a verification test. [Figure 24] 10 is a schematic plan view illustrating the direction in which the element body part is moved in the method for manufacturing the multilayer ceramic capacitor according to the first modified example. FIG. [Figure 25] 10 is a schematic plan view illustrating the direction in which the element body part is moved in the method for manufacturing the multilayer ceramic capacitor according to the second modified example. FIG. [Figure 26]It is a schematic plan view for explaining the moving direction of the element body part in the method for manufacturing a multilayer ceramic capacitor according to the third modification example. [Figure 27] It is a schematic bottom view showing the configuration of the holding part used in the method for manufacturing a multilayer ceramic capacitor according to the fourth modification example. [Figure 28] It is a schematic cross-sectional view of the holding part shown in FIG. 27. [Figure 29] It is a schematic cross-sectional view showing the configurations of the first flat plate part and the second flat plate part used in the method for manufacturing a multilayer ceramic capacitor according to the fourth modification example.

Embodiments for Carrying Out the Invention

[0017] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The embodiments shown below exemplify a method for manufacturing a multilayer ceramic capacitor as a method for manufacturing an electronic component. Note that the method for manufacturing an electronic component according to the present embodiment shown below is also applicable to a method for manufacturing a multilayer ceramic inductor, a multilayer ceramic thermistor, or the like.

[0018] In the embodiments shown below, the same or common parts are denoted by the same reference numerals in the drawings, and the description thereof will not be repeated. In the drawings, the length direction of the element body part is indicated by L, the width direction of the element body part is indicated by W, and the stacking direction of the element body part is indicated by T. The element body part will be described in detail later.

[0019] (Embodiment) <A. Configuration of Multilayer Ceramic Capacitor> FIG. 1 is a perspective view schematically showing the appearance of a multilayer ceramic capacitor manufactured according to the method for manufacturing a multilayer ceramic capacitor according to the embodiment. FIG. 2 is a schematic cross-sectional view taken along line II-II of the multilayer ceramic capacitor shown in FIG. 1. FIG. 3 is a schematic cross-sectional view taken along line III-III of the multilayer ceramic capacitor shown in FIG. 1. First, referring to FIGS. 1 to 3, the configuration of a multilayer ceramic capacitor 100 manufactured according to the method for manufacturing a multilayer ceramic capacitor according to the present embodiment will be described.

[0020] As shown in FIGS. 1 to 3, the multilayer ceramic capacitor 100 according to this embodiment includes an element body 110 and external electrodes.

[0021] The element body 110 has a substantially rectangular parallelepiped shape. The element body 110 has a first main surface 111 and a second main surface 112 that face in the stacking direction T, a first side surface 113 and a second side surface 114 that face in the width direction W that is perpendicular to the stacking direction T, and a first end surface 115 and a second end surface 116 that face in the length direction L that is perpendicular to the stacking direction T and the width direction W.

[0022] The element body 110 has, for example, a length of 0.2 mm to 3.2 mm, a width of 0.1 mm to 2.5 mm, and a thickness of 0.1 mm to 2.5 mm. Note that tolerances are taken into account in the above sizes.

[0023] The external electrodes are composed of a first external electrode 120 and a second external electrode 130. The first external electrode 120 is provided on the first end surface 115. The second external electrode 130 is provided on the second end surface 116.

[0024] The first external electrode 120 includes an end face side first external electrode 121 and a side face side first external electrode 122 .

[0025] The end face-side first external electrode 121 is a portion provided over the entire first end face 115. The side face-side first external electrode 122 is a portion extending from the first end face 115 to each of the first main face 111, the second main face 112, the first side face 113, and the second side face 114. More specifically, the side face-side first external electrode 122 covers a portion of the first main face 111 located on the first end face 115 side, a portion of the second main face 112 located on the first end face 115 side, a portion of the first side face 113 located on the first end face 115 side, and a portion of the second side face 114 located on the first end face 115 side.

[0026] The second external electrode 130 includes an end face side second external electrode 131 and a side face side second external electrode 132 .

[0027] The end face-side second external electrode 131 is a portion provided over the entire second end face 116. The side face-side second external electrode 132 is a portion extending from the second end face 116 to each of the first main face 111, the second main face 112, the first side face 113, and the second side face 114. More specifically, the side face-side second external electrode 132 covers a portion of the first main face 111 located on the second end face 116 side, a portion of the second main face 112 located on the second end face 116 side, a portion of the first side face 113 located on the second end face 116 side, and a portion of the second side face 114 located on the second end face 116 side.

[0028] The first external electrode 120 and the second external electrode 130 include a base electrode layer 160 and a plating layer 170. The plating layer 170 covers the base electrode layer 160.

[0029] The base electrode layer 160 includes at least one of a baked layer, a resin layer, a thin film layer, etc. In this embodiment, the base electrode layer 160 is formed of a baked layer.

[0030] The baking layer contains a glass component and a metal component. The metal component is one metal component selected from the group consisting of Ni, Cu, Ag, Pd, and Au, or an alloy containing this metal, such as an alloy of Ag and Pd. The glass component contains at least one of Si and Zn.

[0031] The baked layer may be a single layer or a plurality of laminated layers. The baked layer may be a layer formed by baking after applying a conductive paste to the element body 110, or may be a layer formed by firing simultaneously with the internal electrode layer 118.

[0032] The plating layer 170 is disposed on the base electrode layer 160. The material constituting the plating layer 170 may be one metal selected from the group consisting of Ni, Cu, Ag, Pd, and Au, or an alloy containing such a metal. As an example, the material constituting the plating layer 170 may be an alloy of Ag and Pd.

[0033] According to the method for manufacturing the multilayer ceramic capacitor of this embodiment, the multilayer ceramic capacitor 100 can be configured so that the thickness of the first external electrode 120 and the thickness of the second external electrode 130 described above are considerably small, which will be described in more detail later.

[0034] As shown in Figures 2 and 3, the body part 110 includes a first outer layer 117a made of a dielectric layer and including a first main surface 111, a second outer layer 117b made of a dielectric layer and including a second main surface 112, and a plurality of internal electrode layers 118 stacked alternately with the dielectric layers between the first outer layer 117a and the second outer layer 117b.

[0035] In this embodiment, the dielectric layer constituting the first outer layer 117a and the dielectric layer constituting the second outer layer 117b are made of substantially the same ceramic material system. Substantially the same ceramic material system means that the blending ratios of the raw ceramic materials are substantially the same, and the range of variation in ceramic composition due to variations in blending ratios and processing steps is included in the range of substantially the same ceramic material system.

[0036] The multiple internal electrode layers 118 are composed of first internal electrode layers 118a and second internal electrode layers 118b. Inside the element body 110, the first internal electrode layers 118a and the second internal electrode layers 118b are alternately stacked along the stacking direction T. Each of the multiple first internal electrode layers 118a and the multiple second internal electrode layers 118b is arranged parallel to the length direction L and the width direction W. A dielectric layer 119 is arranged between the first internal electrode layer 118a and the second internal electrode layer 118b adjacent to each other in the stacking direction T. In other words, the first internal electrode layer 118a and the second internal electrode layer 118b adjacent to each other in the stacking direction T face each other with the dielectric layer 119 sandwiched therebetween.

[0037] The first internal electrode layer 118a is drawn to a first end surface 115. The first end surface 115 is covered with a first external electrode 120. The first external electrode 120 is electrically connected to the first internal electrode layer 118a. The second internal electrode layer 118b is drawn to a second end surface 116. The second end surface 116 is covered with a second external electrode 130. The second external electrode 130 is electrically connected to the second internal electrode layer 118b.

[0038] Although Figures 2 and 3 show an example in which seven first internal electrode layers 118a and seven second internal electrode layers 118b are provided, the number of each of the first internal electrode layers 118a and the second internal electrode layers 118b is not particularly limited to seven.

[0039] Each of the first internal electrode layer 118a and the second internal electrode layer 118b contains one kind of metal selected from the group consisting of Ni, Cu, Ag, Pd, and Au, or an alloy containing the metal. Examples of such an alloy include an alloy of Ag and Pd. In the present embodiment, each of the first internal electrode layer 118a and the second internal electrode layer 118b contains Ni as a main component. Each of the first internal electrode layer 118a and the second internal electrode layer 118b may further contain dielectric particles of the same composition system as the ceramic contained in the dielectric layer 119. Also, each of the first internal electrode layer 118a and the second internal electrode layer 118b may contain Sn at the interface with the dielectric layer 119.

[0040] The plurality of dielectric layers 119 includes an outer layer dielectric layer located between the internal electrode layer 118 positioned closest to the first main surface 111 in the stacking direction T and the first main surface 111, and between the internal electrode layer 118 positioned closest to the second main surface 112 in the stacking direction T and the second main surface 112, and an inner layer dielectric layer located between the internal electrode layers 118 adjacent to each other in the stacking direction T.

[0041] For each of the plurality of dielectric layers 119, as the ceramic material, a dielectric ceramic containing components such as BaTiO3, CaTiO3, SrTiO3, or CaZrO3 can be used. Also, those obtained by adding sub-components such as Mn compounds, Fe compounds, Cr compounds, and Co compounds to these main components may be used.

[0042] The element body 110 includes an inner layer portion C. The inner layer portion C has a capacitance by laminating the first internal electrode layer 118a in a portion facing the second internal electrode layer 118b adjacent in the stacking direction T and the second internal electrode layer 118b in a portion facing the first internal electrode layer 118a adjacent in the stacking direction T in the stacking direction T.

[0043] <B. Method for Manufacturing a Multilayer Ceramic Capacitor> FIG. 4 is a flow diagram showing a method for manufacturing a multilayer ceramic capacitor according to an embodiment. FIG. 5 is a detailed flow diagram of step S8 of the manufacturing flow shown in FIG. 4. FIGS. 6 to 9 and 11 to 18 are schematic cross-sectional views illustrating each step of the manufacturing flow shown in FIG. 5. FIG. 10 is a schematic plan view illustrating the movement direction of the element body part in step S813 of the manufacturing flow shown in FIG. 5. FIGS. 19 and 20 are schematic cross-sectional views illustrating step S9 of the manufacturing flow shown in FIG. 4. Hereinafter, a method for manufacturing a multilayer ceramic capacitor 100 according to this embodiment will be described with reference to FIGS. 4 to 20. Note that detailed illustrations of the internal structure of element body part 110 are omitted in FIGS. 8, 9, 11, and 13 to 20.

[0044] First, as shown in Fig. 4, a ceramic dielectric slurry is prepared (step S1). In detail, a ceramic dielectric powder, an additive powder, a binder resin, a dissolving liquid, etc. are dispersed and mixed. In this way, the ceramic dielectric slurry is prepared.

[0045] The ceramic dielectric powder is, for example, dielectric particles with a perovskite structure such as BaTiO3, CaTiO3, SrTiO3, CaZrO3, or CaHfO3. The additive powder is, for example, composed of at least one of Si compounds, Mg compounds, Mn compounds, Fe compounds, Cr compounds, Ni compounds, and Co compounds. Examples of binder resins that can be used include polyurethane resins, urea resins, melamine resins, epoxy resins, vinyl acetate resins, acrylic resins, and water-based polymers such as polyvinyl alcohol (PVA) and polyvinyl butyral (PVB). These may be used alone or in combination. The ceramic dielectric slurry may be either solvent-based or water-based. When the ceramic dielectric slurry is used as a water-based paint, the ceramic dielectric slurry is prepared by mixing a water-soluble binder and dispersant with the dielectric raw material dissolved in water.

[0046] Next, a ceramic dielectric sheet is formed (step S2). Specifically, the ceramic dielectric slurry is formed into a sheet on a carrier film using a die coater, gravure coater, microgravure coater, or the like, and then dried. This forms a ceramic dielectric sheet. From the viewpoint of miniaturization and high capacitance of the multilayer ceramic capacitor, the thickness of the ceramic dielectric sheet is preferably 0.4 μm or more and 0.8 μm or less.

[0047] Next, a mother sheet is formed (step S3). Specifically, a conductive paste is applied to a ceramic dielectric sheet in a predetermined pattern. This results in a mother sheet having a predetermined internal electrode pattern on the ceramic dielectric sheet. The conductive paste contains Ni powder, a solvent, a dispersant, a binder, etc., and is prepared to have a constant viscosity. PVA, PVB, etc., is used as the binder. The conductive paste can be applied by screen printing, inkjet printing, gravure printing, etc. From the viewpoint of miniaturization and high capacity of the multilayer ceramic capacitor, the thickness of the internal electrode pattern is preferably 0.3 μm or more and 0.8 μm or less. In addition to mother sheets having internal electrode patterns, ceramic dielectric sheets that have not been subjected to step S3 can also be prepared as mother sheets.

[0048] Next, a plurality of mother sheets are stacked (step S4). In detail, a predetermined number of mother sheets, each consisting of only a ceramic dielectric sheet and without an internal electrode pattern, are stacked to a thickness of, for example, 10 μm or more and 30 μm or less. A predetermined number of mother sheets, each having an internal electrode pattern, are stacked on top of these. The number of stacked mother sheets, each having an internal electrode pattern, is, for example, 1 sheet or more and 1000 sheets or less. A predetermined number of mother sheets, each consisting of only a ceramic dielectric sheet and without an internal electrode pattern, are stacked on top of these to a thickness of, for example, 10 μm or more and 30 μm or less. In this way, a mother sheet group is formed.

[0049] Next, the mother sheet group is pressed together to form a dielectric block (step S5). Specifically, the mother sheet group is pressed in the stacking direction using a hydrostatic press or a rigid press, and is pressed together. This forms the dielectric block. At this time, the ceramic dielectric sheets are pressed at a predetermined temperature, so that the ceramic dielectric sheets adhere to each other. Furthermore, a ceramic dielectric sheet of a certain thickness is placed on the outermost layer in the stacking direction and pressed. This makes it possible to protect the dielectric sheet on which the internal electrode patterns are formed.

[0050] Next, the dielectric block is divided into chips (step S6). Specifically, the dielectric block is divided into a matrix shape by press-cutting, dicing, or laser cutting, thereby being separated into a plurality of chips. When dividing the dielectric block, the dielectric block may be divided in a softened state by heating.

[0051] Next, the chip is fired (step S7). Specifically, the chip is heated to fire the dielectric material and conductive material contained in the chip, forming the element part 110. The firing temperature is, for example, 900°C or higher and 1300°C or lower. The firing temperature is set appropriately depending on the dielectric material and conductive material.

[0052] Next, external electrodes are formed (step S8). As shown in Fig. 5, step S8 includes steps S81 to S83, which will be described below.

[0053] First, the first external electrode 120 is formed (Step S81). Step S81 further includes steps S811 to S819, which will be described below.

[0054] First, as shown in FIGS. 5 to 7, a first conductive paste layer 51, which is a precursor of an external electrode, is formed on a paste layer holding mechanism (step S811). In detail, the paste layer holding mechanism is configured to be able to hold a paste layer and has a flat plate portion 60. The first conductive paste layer 51 is applied onto the flat plate portion 60 by a paste application mechanism 10. The first conductive paste layer 51 and a second conductive paste layer 53, which will be described later, are formed into layers of conductive paste in which conductive particles are mixed with a binder, a solvent, a dispersant, etc. The flat plate portion 60 is made of, for example, a metal material. The surface of the flat plate portion 60 extends horizontally.

[0055] The paste application mechanism 10 has a squeegee 11 and a blade 12 positioned opposite each other. The squeegee 11 and the blade 12 each have a substantially plate-like shape.

[0056] The end of the squeegee 11 that faces the flat plate portion 60 is in contact with the flat plate portion 60. The end of the blade 12 that faces the flat plate portion 60 is positioned slightly away from the flat plate portion 60. This provides a gap G between the end of the blade 12 and the flat plate portion 60. The space between the squeegee 11 and the blade 12 forms a storage space 10a for storing the conductive paste.

[0057] The paste application mechanism 10, with the conductive paste that constitutes the first conductive paste layer 51 stored in the accommodation space 10a, is moved relative to the flat plate portion 60 in the in-plane direction of the flat plate portion 60. As a result, the conductive paste pushed out from the gap G is applied onto the flat plate portion 60, and the first conductive paste layer 51 is provided on the flat plate portion 60.

[0058] It should be noted that the flat plate portion 60 may be moved instead of the paste application mechanism 10, or both the paste application mechanism 10 and the flat plate portion 60 may be moved. The thickness H1 of the first conductive paste layer 51 can be changed as appropriate by changing the vertical dimension of the gap G.

[0059] The paste application mechanism 10 is also used to scrape the first conductive paste layer 51 off the flat plate portion 60, which will be described in detail later.

[0060] Next, as shown in FIGS. 5 and 8, the element body 110 is immersed in a first conductive paste layer 51 (step S812).

[0061] In detail, first, the plurality of element bodies 110 are held by the holding part 20 so that the first end face 115 of each of the plurality of element bodies 110 faces the first conductive paste layer 51. The holding part 20 is for holding the element body parts 110 so that one of the pair of end faces of the element body parts 110 faces downward in the vertical direction. Note that in Figures 9 to 11 and 13 to 15, which will be described later, only one of the plurality of element bodies 110 is shown.

[0062] The holding part 20 includes a base layer 21 and an adhesive layer 22 provided on a main surface of the base layer 21. The base layer 21 is made of, for example, a metal material. The adhesive layer 22 is made of, for example, silicone rubber. In this embodiment, the second end surface 116 of the element part 110 is attached to the adhesive layer 22, whereby the element part 110 is held by the holding part 20 so that the first end surface 115 faces vertically downward.

[0063] An actuator 23 is attached to the holding unit 20. The actuator 23 can move the holding unit 20 in any direction based on a signal from the control unit 90. More specifically, the actuator 23 is driven so that the holding unit 20 can move in three orthogonal axial directions: the length direction L, the width direction W, and the stacking direction T. In this embodiment, the actuator 23 corresponds to both a vertical drive mechanism that moves the holding unit 20 in the vertical direction and a horizontal drive mechanism that moves the holding unit 20 in the horizontal direction. The actuator 23 is configured by, for example, a servo motor, a stepping motor, a robo cylinder, or the like, but the type of actuator 23 is not particularly limited to these.

[0064] The control unit 90 controls the operation of the actuator 23. The control unit 90 has, as its main components, a CPU (Central Processing Unit) 91, a memory 92, an input / output device (not shown) for inputting and outputting various signals, and the like.

[0065] The CPU 91 executes programs. The memory 92 includes a ROM (Read Only Memory) and a RAM (Random Access Memory). The ROM stores data in a non-volatile manner. The RAM stores data generated by the CPU 91 executing programs in a volatile manner.

[0066] The components of the control unit 90 are interconnected by a data bus. Processing in the CPU 91 is realized by the various pieces of hardware and software executed by the CPU 91. Such software is pre-stored in ROM / RAM. The control unit 90 is supplied with power from an internal power supply (not shown) or an external power supply (not shown). Connection to the external power supply is made, for example, using an AC adapter (not shown).

[0067] The control unit 90 drives the actuator 23 to immerse the element body 110 in the first conductive paste layer 51 from the first end face 115 side so that the first end face 115 of the element body 110 approximately reaches the bottom 52 of the first conductive paste layer 51 (see Figure 9 described below).

[0068] The first end face 115 substantially reaching the bottom 52 means not only that the first end face 115 abuts against the surface of the flat plate portion 60, but also that the first end face 115 is positioned slightly spaced apart from the surface of the flat plate portion 60. This is because, due to dimensional tolerances in the length direction L of the element body portion 110, etc., it is conceivable that the first end faces 115 of some of the multiple element body portions 110 abut against the surface of the flat plate portion 60, while the first end faces 115 of the remaining element body portions 110 do not abut against the surface of the flat plate portion 60.

[0069] Next, as shown in FIGS. 5, 9, and 10, the element body part 110 is moved relatively to the first conductive paste layer 51 in the in-plane direction of the first end face 115 (step S813).

[0070] In detail, when the element body 110 is immersed in the first conductive paste layer 51 from the first end face 115 side, the control unit 90 drives the actuator 23, thereby moving the element body 110 so that the element body 110 is moved in the WT plane direction of the first end face 115 relative to the first conductive paste layer 51.

[0071] 10, the element body 110 is moved alternately in the W direction and the T direction, thereby moving circularly so as to describe a rectangular (square in this embodiment) orbit in the WT plane. By moving the element body 110 in this manner, it becomes possible to uniformly wet the first main surface 111, the second main surface 112, the first side surface 113, and the second side surface 114 with the first conductive paste layer 51. In this embodiment, one of the W direction and the T direction corresponds to the first direction, and the other corresponds to the second direction.

[0072] By immersing element body 110 in first conductive paste layer 51 in this manner, a portion of first conductive paste layer 51 is applied to first end face 115 .

[0073] Next, as shown in FIGS. 5 and 11, the element part 110 is lifted up from the first conductive paste layer 51 (step S814).

[0074] In detail, the control unit 90 drives the actuator 23, thereby moving the element body part 110 so that the element body part 110 is lifted up from the first conductive paste layer 51 while the element body part 110 is moved relative to the first conductive paste layer 51 in the WT plane direction of the first end surface 115. In this embodiment, the element body part 110 is lifted up from the first conductive paste layer 51 obliquely upward.

[0075] A first layer 161, which is a precursor of the base electrode layer 160 of the first external electrode 120, is applied to the first end surface 115 of the element body 110 thus pulled up from the first conductive paste layer 51. A majority of the first layer 161 constitutes the portion corresponding to the end surface-side first external electrode 121, and the remaining part of the first layer 161 constitutes the portion corresponding to the side surface-side first external electrode 122.

[0076] Next, as shown in FIG. 5, second conductive paste layer 53, which is a precursor of the external electrodes, is formed on flat plate portion 60 (step S815).

[0077] 12, first, the excess of the first conductive paste layer 51 remaining on the flat plate portion 60 is scraped off by the squeegee 11 of the paste application mechanism 10. The first conductive paste layer 51 scraped off in this manner is removed from the flat plate portion 60 and is collected so as to be stored again in the storage space 10a of the paste application mechanism 10.

[0078] Next, instead of the conductive paste that constitutes the first conductive paste layer 51, the conductive paste that constitutes the second conductive paste layer 53 is stored in the accommodation space 10a. In this state, the paste application mechanism 10 is moved relative to the flat plate portion 60 along the in-plane direction of the flat plate portion 60. As a result, the paste pushed out from the gap G is applied onto the flat plate portion 60, and the second conductive paste layer 53 is provided on the flat plate portion 60.

[0079] Here, the height dimension of the gap G is changed so that the thickness dimension H2 of the second conductive paste layer 53 (see FIG. 13 described later) is larger than the thickness dimension H1 (see FIG. 7) of the first conductive paste layer 51. For example, the dimension H1 is set to be 30% or more and 50% or less of the dimension H2.

[0080] Next, as shown in FIGS. 5, 13 and 14, the element body 110 is immersed in a second conductive paste layer 53 (step S816).

[0081] In detail, after the element body portion is pulled up from the first conductive paste layer 51, the control unit 90 drives the actuator 23, thereby immersing the element body portion 110 from the first end face 115 side into the second conductive paste layer 53 so that the first end face 115 of the element body portion 110 approximately reaches the bottom 54 of the second conductive paste layer 53.

[0082] By immersing element body 110 in second conductive paste layer 53 in this manner, a portion of second conductive paste layer 53 is applied to first end face 115 .

[0083] In addition, when the element body 110 is immersed in the second conductive paste layer 53 in this manner, the element body 110 may be moved relative to the second conductive paste layer 53 in the in-plane direction of the first end face 115, as in the above-mentioned step S813.

[0084] Next, as shown in FIGS. 5 and 15, the element part 110 is lifted up from the second conductive paste layer 53 (step S817).

[0085] In detail, the control unit 90 drives the actuator 23 to move the element body 110 so that the element body 110 is lifted up from the second conductive paste layer 53. In the present embodiment, the element body 110 is lifted up vertically from the second conductive paste layer 53.

[0086] In this way, the element body 110 is pulled up from the second conductive paste layer 53, and the second layer 162, which is a precursor of the base electrode layer 160 of the first external electrode 120, is applied by wetting the first end face 115, the first main face 111, the second main face 112, the first side face 113, and the second side face 114. The second layer 162 applied in this way covers the first layer 161 described above.

[0087] Here, the second layer 162 is applied to the element body 110 so that the majority of it constitutes the portion corresponding to the side surface side first external electrode 122. As a result, the base electrode layer 160 of the end surface side first external electrode 121 is mainly constituted by the first layer 161, and the base electrode layer 160 of the side surface side first external electrode 122 is mainly constituted by the second layer 162.

[0088] In addition, one method for distributing the second layer 162 more unevenly toward the first main surface 111, the second main surface 112, the first side surface 113, and the second side surface 114 than toward the first end surface 115 is, for example, to optimize the viscosity of the second conductive paste layer 53.

[0089] By applying the second layer 162 to the first end face 115 in the manner described above, even if the thickness of the first layer 161 is insufficient compared to the thickness required for the base electrode layer 160 of the first external electrode 120, the second layer 162 can compensate for the insufficient thickness.

[0090] After step S817, the element body may be repeatedly immersed in the conductive paste.

[0091] 5, the first layer 161 and the second layer 162 are baked (step S818). Specifically, the first layer 161 and the second layer 162 applied to the first end face 115 and its surrounding area are heated, for example, in a drying oven, to form a baked layer that constitutes the base electrode layer 160. The baking temperature is, for example, 700°C or higher and 900°C or lower. The baking temperature can be changed as appropriate depending on the dielectric material and the conductive material.

[0092] 5, a plating layer 170 is then formed on the surface of the baked layer (step S819). As a result, the first external electrode 120 is formed on the first end face 115.

[0093] 5 and 16 to 18, the element body part 110 is inverted (step S82). In detail, first, a holding part 20 is prepared that has substantially the same configuration as the holding part 20 that holds the element body part 110, but is configured separately from the holding part 20. For ease of explanation, the holding part 20 that holds the element body part 110 will also be referred to as a first holding part, and the holding part 20 that is configured separately from the first holding part will also be referred to as a second holding part.

[0094] 16, the second holding part is positioned with respect to the first holding part so that the adhesive layer 22 of the second holding part faces the first external electrode 120. Next, the first holding part is moved relative to the second holding part so that the first and second holding parts approach each other. This presses the first external electrode 120 against the adhesive layer 22 of the second holding part.

[0095] Next, as shown in FIG. 17, the first holding part, the second holding part and the element part 110 are turned upside down as a whole.

[0096] 18, the first holding part is moved relative to the second holding part so that the first holding part and the second holding part are separated from each other. Here, the adhesive strength of the adhesive layer 22 of the second holding part is configured to be stronger than the adhesive strength of the adhesive layer 22 of the first holding part. As a result, the element part 110, with the first external electrode 120 attached to the adhesive layer 22 of the second holding part, is peeled off from the adhesive layer 22 of the first holding part.

[0097] As a result, the element part 110 is held by the second holding part so that the second end face 116 faces downward in the vertical direction.

[0098] 5, the second external electrode 130 is formed on the second end surface 116 (step S83). Step S83 further includes steps corresponding to the above-described steps S811 to S819, but the contents of these steps are basically the same as steps S811 to S819, so a description thereof will be omitted.

[0099] Next, as shown in FIGS. 4, 19, and 20, the multilayer ceramic capacitor 100 is recovered (step S9). Specifically, first, a recovery blade 30 is prepared. Next, the recovery blade 30 is relatively moved with respect to the second holding portion in a state where the tip of the recovery blade 30 is directed to the surface of the adhesive layer 22 of the second holding portion. As a result, the recovery blade 30 is inserted into the gap between the adhesive layer 22 and the first external electrode 120, so that the multilayer ceramic capacitor 100 is removed from the second holding portion. Thereby, it becomes possible to recover the multilayer ceramic capacitor 100.

[0100] By going through the steps described above, the multilayer ceramic capacitor 100 can be manufactured according to the manufacturing method of the multilayer ceramic capacitor according to the present embodiment.

[0101] <C. Parentheses> Here, in the manufacturing method of the multilayer ceramic capacitor according to the present embodiment, as described above, when the external electrode is provided on the element body portion 110, the first end surface 115 of the element body portion 110 substantially reaches the bottom 52 of the first conductive paste layer 51. The element body portion 110 is immersed in the first conductive paste layer 51 from the first end surface 115 side, and in this state, the element body portion 110 is relatively moved in the in-plane direction of the WT of the first end surface 115 with respect to the first conductive paste layer 51. Then, during this movement, the element body portion 110 is pulled up from the first conductive paste layer 51, and thereafter, the element body portion 110 is immersed in the second conductive paste layer 53 from the first end surface 115 side so that the first end surface 115 substantially reaches the bottom 54 of the second conductive paste layer 53.

[0102] By providing the external electrode on the element body portion 110 in this way, it is possible to reduce the thickness of the first external electrode 121 on the end surface side that covers the first end surface 115 of the element body portion 110. As described above, when the first end surface 115 substantially reaches the bottom 52 of the first conductive paste layer 51 and the element body portion 110 is relatively moved in the in-plane direction of the WT of the first end surface 115 with respect to the first conductive paste layer 51, it is effectively suppressed that the first conductive paste layer 51 is excessively applied to the first end surface 115.

[0103] In other words, even if a portion of the first conductive paste layer 51 is applied in excess to the first end surface 115 within the first conductive paste layer 51, the element body portion 110 will move relative to the first conductive paste layer 51 as described above, causing this excess applied portion of the first conductive paste layer 51 to be rubbed against the flat plate portion 60, thereby causing this excess applied portion of the first conductive paste layer 51 to be peeled off from the first end surface 115.

[0104] As a result, it is possible to reduce the thickness of the end face-side first external electrode 121 that covers the first end face 115 of the element body 110. This effect is also achieved in the end face-side second external electrode 131 that covers the second end face 116 of the element body 110.

[0105] Therefore, by configuring as described above, it is possible to provide a method and apparatus for manufacturing electronic components that can be made smaller.

[0106] Furthermore, as described above, by moving the element body 110 relative to the first conductive paste layer 51 in the WT-plane direction of the first end face 115 with the first end face 115 substantially reaching the bottom 52 of the first conductive paste layer 51, it is possible to effectively prevent so-called bubble entrapment, in which air bubbles are trapped in the gap between the first end face 115 and the end-face-side first external electrode 121. This is because air bubbles that are unintentionally trapped in the gap are pushed out of the gap by the relative movement of the element body 110 with respect to the first conductive paste layer 51.

[0107] The effects achieved by the method for manufacturing the multilayer ceramic capacitor according to the present embodiment described above have been confirmed by verification tests to be described later.

[0108] In the above-described embodiment, the case where the holding unit 20 is configured to be movable by attaching the actuator 23 to the holding unit 20 has been exemplified and described. However, the flat plate portion 60 may be configured to be movable in an arbitrary direction by attaching the actuator 23 to the flat plate portion 60. Even in this case, the base body portion 110 can be relatively moved with respect to the first conductive paste layer 51 and the second conductive paste layer 53.

[0109] Also, in the above-described embodiment, in step S814, the case where the base body portion 110 is lifted from the first conductive paste layer 51 while being relatively moved in the WT plane direction of the first end face 115 with respect to the first conductive paste layer 51 has been exemplified and described. However, after the base body portion 110 is relatively moved in the WT plane direction of the first end face 115 with respect to the first conductive paste layer 51, the base body portion 110 may be lifted from the first conductive paste layer 51.

[0110] <D. Verification Test> In this verification test, in order to clarify the effects achieved by the manufacturing method of the multilayer ceramic capacitor according to the present embodiment, verification was performed by comparing the thickness dimensions etc. of the external electrodes of a multilayer ceramic capacitor manufactured based on the manufacturing method of the multilayer ceramic capacitor according to the present embodiment (hereinafter, also referred to as the multilayer ceramic capacitor according to the example) with the thickness dimensions etc. of the external electrodes of a multilayer ceramic capacitor manufactured based on the manufacturing method of the multilayer ceramic capacitor according to the comparative example (hereinafter, also referred to as the multilayer ceramic capacitor according to the comparative example).

[0111] FIG. 21 is a schematic plan view of a multilayer ceramic capacitor for explaining the measurement positions of the thickness dimensions of the external electrodes in the verification test. FIGS. 22 and 23 are tables showing the test conditions and test results in the verification test.

[0112] The method for manufacturing a multilayer ceramic capacitor according to the comparative example differs from the method for manufacturing a multilayer ceramic capacitor according to the present embodiment only in that it does not include the above-mentioned steps S811 to S814 (see FIG. 5). In other respects, the method for manufacturing a multilayer ceramic capacitor according to the comparative example is the same as the method for manufacturing a multilayer ceramic capacitor according to the present embodiment. That is, in the method for manufacturing a multilayer ceramic capacitor according to the comparative example, the pair of end faces of element body part 110 are immersed in the conductive paste layer only once.

[0113] In this verification test, multilayer ceramic capacitors according to Examples 1 to 19 and 21 to 39, each having different test conditions, were prepared. As shown in Fig. 22, Examples 1 to 19 differ from each other in the movement length d (see Fig. 10) of the element portion in the WT plane direction in step S813. As shown in Fig. 23, Examples 21 to 39 differ from each other in the layer thickness ratio r, which is the ratio (i.e., H1 / H2) of the thickness dimension H1 (see Fig. 8) of the first conductive paste layer 51 in step S812 to the thickness dimension H2 (see Fig. 13) of the second conductive paste layer 53 in step S816.

[0114] The element portions of the multilayer ceramic capacitors according to the examples and comparative examples each have a length of 3.2 mm, a width of 2.5 mm, and a thickness of 2.5 mm. There were five samples of each of the multilayer ceramic capacitors according to examples 1 to 19 and 21 to 39 and the multilayer ceramic capacitor according to the comparative example.

[0115] In this verification test, the thickness of each external electrode of the multilayer ceramic capacitors according to the example and comparative example was measured, and the presence or absence of bubble entrapment was confirmed. Regarding the thickness of the external electrodes, as shown in FIG. 21 , the thickness t1 (also referred to as the central thickness t1) of the end face-side first external electrode 121 at the center in the width direction W, and the thickness t2 (also referred to as the outer thickness t2) of the end face-side first external electrode 121 at the portion corresponding to the end of the inner layer portion C in the width direction W were measured, and the difference Δt between them (i.e., t1 - t2) was calculated. The central thickness t1 was the average value of the values ​​measured for five samples. The same was true for the outer thickness t2.

[0116] 22 and 23 show thickness evaluations obtained by comparing the difference Δt of the example with the difference Δt of the comparative example. When the difference Δt of the example is equal to or greater than the difference Δt of the comparative example, the thickness evaluation is expressed as "poor." When the difference Δt of the example is smaller than the difference Δt of the comparative example, the thickness evaluation is expressed as "good." Of these, when the difference Δt of the example is 20 μm or less, the thickness evaluation is expressed as "excellent."

[0117] If bubble inclusion occurred, the bubble inclusion evaluation was expressed as "poor." If bubble inclusion did not occur, the bubble inclusion evaluation was expressed as "good."

[0118] Furthermore, if the moving length d is 10 mm or more, the productivity evaluation is expressed as "poor." If the moving length d is less than 10 mm, the bubble trapping evaluation is expressed as "good." This is because if the moving length d is considerably long, the areas of the flat plate portion, first conductive paste layer, second conductive paste layer, etc. required to manufacture one multilayer ceramic capacitor become large, resulting in a decrease in the production capacity of the multilayer ceramic capacitor manufacturing equipment.

[0119] Furthermore, if the thickness evaluation is "poor", the overall evaluation is expressed as "poor". If the thickness evaluation is "good" or "excellent" and at least one of the bubble entrapment evaluation and the productivity evaluation is "poor", the overall evaluation is expressed as "passable". If the thickness evaluation, bubble entrapment evaluation, and productivity evaluation are all "good", the overall evaluation is expressed as "good". If the thickness evaluation is "excellent" and both the bubble entrapment evaluation and the productivity evaluation are "good", the overall evaluation is expressed as "excellent".

[0120] 22 and 23, the multilayer ceramic capacitors according to the examples other than Example 21 were given an overall evaluation of "fair," "good," or "excellent." Therefore, it was confirmed that by manufacturing a multilayer ceramic capacitor based on the manufacturing method for a multilayer ceramic capacitor according to the present embodiment, it is possible to reduce the thickness of the external electrodes, and therefore to reduce the size of the multilayer ceramic capacitor.

[0121] Furthermore, when the movement length d was set to 5 mm or more and the layer thickness ratio r was set to 40% as in Examples 7 to 19, the thickness evaluation was "excellent," and it was confirmed that the thicknesses of the end face side first external electrode 121 and the end face side second external electrode 131 were thinned overall and that these thicknesses were made fairly uniform in the width direction W and the stacking direction T. The same was true when the movement length d was set to 15 mm or more and the layer thickness ratio r was set to 30% or more and 50% or less as in Examples 27 to 31.

[0122] Furthermore, when the movement length d was set to 5 mm or more and 9 mm or less and the layer thickness ratio r was set to 40% as in Examples 7 to 11, it was confirmed that the thicknesses of the end face side first external electrode 121 and the end face side second external electrode 131 were thinned overall and that these thicknesses were made fairly uniform in the width direction W and the stacking direction T. Furthermore, it was confirmed that a method for manufacturing a multilayer ceramic capacitor could be achieved that suppressed the occurrence of bubble entrapment and had excellent productivity.

[0123] (First to third modified examples) 24 to 26 are schematic plan views illustrating the direction in which the element body portion is moved in the manufacturing method of the multilayer ceramic capacitor according to the first to third modified examples, respectively. Hereinafter, the manufacturing method of the multilayer ceramic capacitor according to the first to third modified examples based on the above-described embodiment will be described with reference to FIGS.

[0124] As shown in Figures 24 to 26, the methods for manufacturing a multilayer ceramic capacitor according to the first to third modified examples differ from the method for manufacturing a multilayer ceramic capacitor according to the above-mentioned embodiment in the direction in which the element body 110 is moved in step S813.

[0125] 24, in the first modified example, the element body 110 is reciprocated in the W direction and then reciprocated in the T direction. Note that the order of the reciprocating movements in the W direction and the T direction may be reversed.

[0126] 25, in the second modification, the element body 110 is reciprocated in a first inclined direction that is inclined with respect to both the W direction and the T direction, and then is reciprocated in a second inclined direction that is inclined with respect to both the W direction and the T direction and intersects with the first inclined direction. Note that the first inclined direction and the second inclined direction are preferably perpendicular to each other.

[0127] As shown in FIG. 26, in the third modified example, the element body 110 is moved in a circular motion so as to describe a substantially circular orbit within the WT plane.

[0128] Even when configured in this manner, effects similar to those described in the above-mentioned embodiments can be obtained, and a method and apparatus for manufacturing electronic components can be provided that enable miniaturization.

[0129] (Fourth Modification) Fig. 27 is a schematic bottom view showing the configuration of a holding portion used in the method for manufacturing a multilayer ceramic capacitor according to the fourth modified example. Fig. 28 is a schematic cross-sectional view taken along line XXVIII-XXVIII of the holding portion shown in Fig. 27. Fig. 29 is a schematic cross-sectional view showing the configurations of a first flat plate portion and a second flat plate portion used in the method for manufacturing a multilayer ceramic capacitor according to the fourth modified example. Hereinafter, with reference to Figs. 27 to 29, a method for manufacturing a multilayer ceramic capacitor according to the fourth modified example based on the above-described embodiment will be described.

[0130] As shown in Figures 27 to 29, the manufacturing method of the multilayer ceramic capacitor according to the fourth modified example differs from the manufacturing method of the multilayer ceramic capacitor according to the above-mentioned embodiment in that the configuration of the holding portion is different and the paste layer holding mechanism has a first flat portion 61 and a second flat portion 62 instead of the flat portion 60.

[0131] 27 and 28, the holding part 20A includes a base layer 24 having a plurality of through holes 24a arranged in a lattice pattern, and a substantially cylindrical adhesive part 25 inserted into each of the plurality of through holes 24a. A plurality of element parts 110 are inserted into each of the plurality of adhesive parts 25. The base layer 24 is made of, for example, a metal material. The adhesive part 25 is made of, for example, silicone rubber.

[0132] The outer size of adhesive portion 25 is configured to be slightly larger than the size of through hole 24a. Therefore, adhesive portion 25 is inserted into through hole 24a in a state where it is slightly compressed in the in-plane direction of the cross section perpendicular to its axial direction, and is thereby fixed to through hole 24a. Alternatively, the outer size of adhesive portion 25 may be made approximately the same as the size of through hole 24a, and adhesive portion 25 may be fixed to through hole 24a by the adhesive force of the surface of adhesive portion 25.

[0133] The inner size of adhesive portion 25 is configured to be slightly smaller than the outer size of the outer shape in the WT plane of body portion 110. Therefore, body portion 110 inserted into adhesive portion 25 is fixed to through-hole 24a via adhesive portion 25 by the compressive force of adhesive portion 25.

[0134] Here, the multiple element bodies 110 are fixed in the through holes 24a so that the lengths of their protrusions from the respective through holes 24a are the same. This makes it possible to accommodate dimensional tolerances in the length direction of the element bodies 110. Therefore, in step S812 or step S816 described above, it becomes possible to bring the first end faces 115 of more element bodies 110 into contact with the bottom 52 of the first conductive paste layer 51 or the bottom 54 of the second conductive paste layer 53.

[0135] When removing the multilayer ceramic capacitor 100 held by the holding portion 20A, a recovery pin or the like may be used instead of the above-described recovery blade 30. In this case, the multilayer ceramic capacitor 100 can be recovered by pushing the multilayer ceramic capacitor 100 out of the through-hole 24a with the recovery pin or the like.

[0136] 29, in this modification, the first conductive paste layer 51 is provided on a first flat plate portion 61, and the second conductive paste layer 53 is provided on a second flat plate portion 62 that is separate from the first flat plate portion 61. This eliminates the need to scrape off the excess first conductive paste layer 51 remaining on the first flat plate portion 61 after the element portion 110 is lifted up from the first conductive paste layer 51, and as a result, it becomes possible to efficiently manufacture multilayer ceramic capacitors.

[0137] Even when configured in this manner, effects similar to those described in the above-mentioned embodiments can be obtained, and a method and apparatus for manufacturing electronic components can be provided that enable miniaturization.

[0138] (Other forms, etc.) In the above-described embodiments and modifications of the present disclosure, a multilayer ceramic capacitor has been used as an example of an electronic component, and a manufacturing method and a manufacturing apparatus thereof have been described, but the manufacturing methods and manufacturing apparatuses for electronic components shown in the present embodiments and modifications may also be applied to manufacturing methods and manufacturing apparatuses for electronic components such as multilayer ceramic inductors or multilayer ceramic thermistors, etc. However, in the case of a multilayer ceramic inductor, the internal electrodes are formed of coil-shaped conductors.

[0139] Furthermore, the shape, configuration, size, number, material, etc. of each part shown in the above-mentioned embodiment of the present disclosure and its modified examples can be modified in various ways as long as they do not deviate from the spirit of the present disclosure.

[0140] Furthermore, the characteristic configurations shown in the above-described embodiments of the present disclosure and their modifications can naturally be combined with each other within the scope of the present disclosure.

[0141] As such, the above-described embodiments and their modifications disclosed herein are illustrative in all respects and are not limiting. The technical scope of the present invention is defined by the claims, and includes all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0142] 10 Paste application mechanism, 10a Storage space, 11 Squeegee, 12 Blade, 20, 20A Holding portion, 21 Base layer, 22 Adhesive layer, 23 Actuator, 24 Base layer, 24a Through hole, 25 Adhesive portion, 30 Recovery blade, 51 First conductive paste layer, 52 Bottom, 53 Second conductive paste layer, 54 Bottom, 60 Flat plate portion, 61 First flat plate portion, 62 Second flat plate portion, 90 Control unit, 91 CPU, 92 Memory, 100 Multilayer ceramic capacitor, 110 Body portion, 111 First main surface, 112 Second main surface, 113 First side surface, 114 Second side surface, 115 First end surface, 116 Second end surface, 117a First outer layer, 117b Second outer layer, 118 Internal electrode layer, 118a First internal electrode layer, 118b Second internal electrode layer, 119 dielectric layer, 120 first external electrode, 121 end face side first external electrode, 122 side face side first external electrode, 130 second external electrode, 131 end face side second external electrode, 132 side face side second external electrode, 160 base electrode layer, 161 first layer, 162 second layer, 170 plating layer, C internal layer portion, G gap.

Claims

1. 1. A method for manufacturing an electronic component including: an element body having a first end face and a second end face opposing each other in a longitudinal direction; and external electrodes provided on each of the first end face and the second end face, a step of immersing the element body from the first end surface side into a first conductive paste layer that is a precursor of the external electrodes; a step of moving the element body portion relative to the first conductive paste layer in an in-plane direction of the first end face while the element body portion is immersed in the first conductive paste layer from the first end face side; a step of lifting the element body from the first conductive paste layer while or after the element body is being moved relative to the first conductive paste layer in the in-plane direction of the first end face; and after the element body is lifted up from the first conductive paste layer, immersing the element body from the first end face side into a second conductive paste layer that is a precursor of the external electrode.

2. 2. The method for manufacturing an electronic component according to claim 1, wherein the second conductive paste layer has a thickness greater than that of the first conductive paste layer.

3. 3. The method for manufacturing an electronic component according to claim 1, wherein in the step of moving the element body portion relative to the first conductive paste layer in the in-plane direction of the first end face, the element body portion is moved relative to the first conductive paste layer in a first direction perpendicular to the length direction.

4. 4. The method for manufacturing an electronic component according to claim 3, wherein in the step of moving the element body portion relative to the first conductive paste layer in the in-plane direction of the first end face, the element body portion is further moved relative to the first conductive paste layer in a second direction perpendicular to both the length direction and the first direction.

5. An apparatus for manufacturing an electronic component, comprising: an element body having a first end face and a second end face opposing each other in a longitudinal direction; and external electrodes provided on each of the first end face and the second end face, a holding part that holds the element part so that the first end surface faces downward in the vertical direction; a paste layer holding mechanism that holds a first conductive paste layer that is a precursor of the external electrode and a second conductive paste layer that is a precursor of the external electrode; a vertical drive mechanism that moves the holding portion in a vertical direction; a horizontal drive mechanism that moves the holding unit in a horizontal direction; a control unit for controlling the vertical drive mechanism and the horizontal drive mechanism, the control unit causes the vertical drive mechanism to move the holding unit, thereby immersing the element part from the first end face side into the first conductive paste layer; causes the horizontal drive mechanism to move the holding unit so that the first end face moves horizontally while the element part is immersed in the first conductive paste layer from the first end face side; causes the vertical drive mechanism to move the holding unit so that the element part is lifted up from the first conductive paste layer while or after the first end face moves horizontally; and after the element part has been lifted up from the first conductive paste layer, causes the vertical drive mechanism to move the holding unit, thereby immersing the element part from the first end face side into the second conductive paste layer.

6. 6. The electronic component manufacturing apparatus according to claim 5, wherein the second conductive paste layer has a thickness greater than that of the first conductive paste layer.

7. the paste layer holding mechanism has a flat plate portion, the first conductive paste layer is provided on the flat plate portion, 7. The electronic component manufacturing apparatus according to claim 5, wherein the second conductive paste layer is provided on the flat portion in place of the first conductive paste layer after the element body portion is lifted up from the first conductive paste layer.

8. the paste layer holding mechanism has a first flat plate portion and a second flat plate portion separate from the first flat plate portion, the first conductive paste layer is provided on the first flat plate portion, 7. The electronic component manufacturing apparatus according to claim 5, wherein the second conductive paste layer is provided on the second flat plate portion.

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