Substrate processing system

Abstract

To provide a technique capable of suppressing a decrease in operation rate of a substrate processing system.SOLUTION: A substrate processing system according to an aspect of the present disclosure comprises a batch processing section for processing a plurality of substrates in a batch, a single-wafer processing section for processing the substrates one by one, an interface section for transferring the substrates from the batch processing section to the single-wafer processing section, and a control circuit, wherein the interface section has a substrate holding section for holding the substrates, a processing liquid supply section for supplying a processing liquid for suppressing drying of an upper surface of the substrate held by the substrate holding section, and an image pickup section for picking up an image of the upper surface of the substrate, and, the control circuit determines whether or not the processing liquid supply unit supplies the processing liquid to the upper surface of the substrate based on the image captured by the imaging unit.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present disclosure relates to a substrate processing system. [Background technology]

[0002] A substrate processing system is known that includes a batch processing unit, a single wafer processing unit, and an interface unit. The batch processing unit processes a lot containing multiple substrates at once. The single wafer processing unit processes each substrate in the lot one by one. The interface unit transfers substrates from the batch processing unit to the single wafer processing unit. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2023-129235 [Patent Document 2] Japanese Patent Publication No. 2023-121707 [Patent Document 3] Japanese Patent Application Publication No. 2023-121571 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique that can suppress a decrease in the availability of a substrate processing system. [Means for solving the problem]

[0005] A substrate processing system according to one aspect of the present disclosure comprises a batch processing unit that processes multiple substrates at once, a single-wafer processing unit that processes substrates one by one, an interface unit that transfers the substrates from the batch processing unit to the single-wafer processing unit, and a control circuit, wherein the interface unit has a substrate holding unit that holds the substrate, a processing liquid supply unit that supplies a processing liquid to the upper surface of the substrate held by the substrate holding unit to prevent the upper surface from drying, and an imaging unit that images the upper surface of the substrate, and the control circuit determines whether the processing liquid supply unit will supply the processing liquid to the upper surface of the substrate based on the image captured by the imaging unit. [Effects of the Invention]

[0006] According to the present disclosure, it is possible to suppress a decrease in the availability rate of a substrate processing system. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic plan view showing a substrate processing system according to an embodiment. [Figure 2] FIG. 2 is a diagram illustrating a second transfer table according to the first example of the embodiment. [Figure 3] FIG. 3 is a flowchart showing a substrate processing method according to an embodiment. [Figure 4] FIG. 4 is a flowchart showing an example of the surface determination control. [Figure 5] FIG. 5 is a cross-sectional view (1) showing an example of the surface determination control. [Figure 6] FIG. 6 is a cross-sectional view (2) showing an example of the surface determination control. [Figure 7] FIG. 7 is a cross-sectional view (3) showing an example of the surface determination control. [Figure 8] FIG. 8 is a diagram showing an example of an image of the top surface of a substrate having lyophilic properties. [Figure 9] FIG. 9 is a diagram showing an example of an image of the top surface of a substrate having lyophobic properties. [Figure 10] FIG. 10 is a diagram showing a second transfer table according to the second example of the embodiment. [Figure 11] FIG. 11 is a diagram showing a second transfer table according to a third example of the embodiment. [Figure 12] FIG. 12 is a flowchart showing an example of the tilt determination control. [Figure 13] FIG. 13 is a cross-sectional view (1) showing an example of tilt determination control. [Figure 14] FIG. 14 is a cross-sectional view (2) showing an example of tilt determination control. [Figure 15] FIG. 15 is a cross-sectional view (3) showing an example of tilt determination control. [Figure 16] FIG. 16 is a cross-sectional view (4) showing an example of tilt determination control. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In all the accompanying drawings, the same or corresponding reference numerals are used to designate the same or corresponding members or components, and redundant descriptions will be omitted.

[0009] In the following description, an XYZ Cartesian coordinate system is used, but this coordinate system is defined for the purpose of explanation and does not limit the attitude of the substrate processing system 1. The XY plane view is referred to as a planar view, and when viewed from an arbitrary point, the positive side of the Z axis may be referred to as the upper side, and the negative side of the Z axis may be referred to as the lower side.

[0010] [Substrate Processing System] A substrate processing system 1 according to an embodiment will be described with reference to Fig. 1. Fig. 1 is a schematic plan view showing a substrate processing system 1 according to an embodiment.

[0011] As shown in FIG. 1, the substrate processing system 1 includes a loading / unloading section 2, a first interface section 3, a batch processing section 4, a second interface section 5, a single wafer processing section 6, and a control circuit 9.

[0012] The loading / unloading section 2 serves as both a loading section and an unloading section, thereby enabling a reduction in size of the substrate processing system 1. The loading / unloading section 2 includes a load port 21, a stocker 22, a loader 23, and a cassette transport device 24.

[0013] The load port 21 is arranged on the negative side of the X-axis of the loading / unloading section 2. Multiple (for example, four) load ports 21 are arranged along the Y-axis. The number of load ports 21 is not particularly limited. A cassette C is placed on the load port 21. The cassette C stores multiple (for example, 25) substrates W. The cassette C is loaded into and unloaded from the load port 21. Inside the cassette C, the substrates W are held horizontally and at a second pitch P2 (P2 = N × P1) that is N times the first pitch P1 along the Z-axis. N is a natural number greater than or equal to 2, and is 2 in this embodiment, but may be 3 or greater.

[0014] A plurality of stockers 22 (for example, four) are arranged along the Y axis at the center of the X axis of the load / unload section 2. A plurality of stockers 22 (for example, two) are arranged adjacent to the first interface section 3 along the Y axis on the positive side of the X axis of the load / unload section 2. The stockers 22 may be arranged in multiple tiers along the Z axis. The stockers 22 temporarily store cassettes C containing substrates W before cleaning processing, cassettes C that have been emptied after the substrates W have been removed, etc. The number of stockers 22 is not particularly limited.

[0015] The loader 23 is adjacent to the first interface unit 3. The loader 23 is arranged on the positive side of the X-axis of the loading / unloading unit 2. A cassette C is placed on the loader 23. The loader 23 is provided with a lid opening / closing mechanism (not shown) for opening and closing the lid of the cassette C. A plurality of loaders 23 may be provided. The loaders 23 may be arranged in multiple stages along the Z-axis.

[0016] The cassette transfer device 24 transfers the cassette C between the load port 21, the stocker 22, and the loader 23. The cassette transfer device 24 is, for example, an articulated transfer robot.

[0017] The first interface section 3 is disposed on the X-axis positive side of the load / unload section 2. The first interface section 3 transports substrates W between the load / unload section 2, the batch processing section 4, and the single wafer processing section 6. The first interface section 3 has a substrate transfer device 31, a lot formation section 32, and a first delivery table 33.

[0018] The substrate transfer device 31 transports substrates W between a cassette C placed on the loader 23, the lot formation unit 32, and a first delivery table 33. The substrate transfer device 31 is made up of a multi-axis (e.g., six-axis) arm robot, and has a substrate holding arm 31a at its tip. The substrate holding arm 31a has multiple holding claws (not shown) that can hold multiple substrates W (e.g., 25 substrates W). The substrate holding arm 31a can assume any position and posture in three-dimensional space while holding substrates W with the holding claws.

[0019] The lot forming section 32 is disposed on the X-axis positive side of the first interface section 3. The lot forming section 32 holds a plurality of substrates W at a first pitch P1 and forms a lot L.

[0020] The first delivery table 33 is adjacent to the single wafer processing unit 6. The first delivery table 33 is arranged on the Y-axis positive side of the first interface unit 3. The first delivery table 33 receives the substrate W from the fourth transport device 61 and temporarily stores it until it is handed over to the load / unload unit 2.

[0021] The batch processing unit 4 is disposed on the positive side of the X-axis of the first interface unit 3. The load / unload unit 2, the first interface unit 3, and the batch processing unit 4 are disposed in this order, from the negative side of the X-axis toward the positive side of the X-axis. The batch processing unit 4 processes a lot L including a plurality of substrates W (for example, 50 or 100 substrates) arranged at a first pitch P1 at a time. One lot L is made up of substrates W in, for example, M cassettes C. M is a natural number equal to or greater than 2. M may be the same natural number as N, or may be a natural number different from N. The batch processing unit 4 has a chemical liquid tank 41, a rinse liquid tank 42, a first transport device 43, a processing tool 44, and a drive device 45.

[0022] The chemical liquid tank 41 and the rinse liquid tank 42 are arranged along the X-axis. For example, the chemical liquid tank 41 and the rinse liquid tank 42 are arranged in this order from the positive side of the X-axis to the negative side of the X-axis. The chemical liquid tank 41 and the rinse liquid tank 42 are also collectively referred to as a processing tank. The number of chemical liquid tanks 41 and rinse liquid tanks 42 is not limited to that shown in FIG. 1. For example, although one set of chemical liquid tank 41 and rinse liquid tank 42 is shown in FIG. 1, multiple sets may be provided.

[0023] The chemical tank 41 stores a chemical in which the lot L is immersed. The chemical is, for example, a phosphoric acid aqueous solution (H3PO4). The phosphoric acid aqueous solution selectively etches and removes the silicon nitride film out of the silicon oxide film and the silicon nitride film. The chemical is not limited to a phosphoric acid aqueous solution. The chemical may be DHF (dilute hydrofluoric acid), BHF (a mixture of hydrofluoric acid and ammonium fluoride), dilute sulfuric acid, SPM (a mixture of sulfuric acid, hydrogen peroxide, and water), SC1 (a mixture of ammonia, hydrogen peroxide, and water), SC2 (a mixture of hydrochloric acid, hydrogen peroxide, and water), TMAH (a mixture of tetramethylammonium hydroxide and water), a plating solution, or the like. The chemical may be for a stripping process or a plating process. The number of chemicals is not particularly limited, and multiple chemicals may be used.

[0024] The rinse liquid tank 42 stores a first rinse liquid in which the lot L is immersed. The first rinse liquid is pure water that removes chemicals from the substrate W, and is, for example, DIW (deionized water).

[0025] The first transfer device 43 has a guide rail 43a and a first transfer arm 43b. The guide rail 43a is disposed on the negative side of the Y axis relative to the processing tank. The guide rail 43a extends along the X axis from the first interface unit 3 to the batch processing unit 4. The first transfer arm 43b moves along the guide rail 43a. The first transfer arm 43b may move along the Z axis or rotate around the Z axis. The first transfer arm 43b transfers lots L in a batch between the first interface unit 3 and the batch processing unit 4.

[0026] The processing tool 44 receives and holds the lot L from the first transport arm 43b. The processing tool 44 holds the plurality of substrates W at a first pitch P1 along the Y axis, and holds each of the plurality of substrates W vertically.

[0027] The driving device 45 moves the processing tool 44 along the X-axis and the Z-axis. The processing tool 44 immerses the lot L in the chemical liquid stored in the chemical liquid tank 41, then immerses the lot L in the first rinse liquid stored in the rinse liquid tank 42, and then transfers the lot L to the first transfer device 43.

[0028] Although the number of units including the processing tool 44 and the driving device 45 is one in this embodiment, there may be more than one. In the latter case, one unit immerses the lot L in the chemical liquid stored in the chemical liquid tank 41, and another unit immerses the lot L in the first rinse liquid stored in the rinse liquid tank 42. In this case, the driving device 45 only needs to move the processing tool 44 along the Z axis, and does not need to move the processing tool 44 along the X axis.

[0029] The second interface unit 5 is disposed on the Y-axis positive side of the batch processing unit 4. The second interface unit 5 transports substrates W between the batch processing unit 4 and the single wafer processing unit 6. The second interface unit 5 has an immersion tank 51, a second transport device 52, a third transport device 53, and a second delivery table 54.

[0030] The immersion tank 51 is positioned outside the movement range of the first transport arm 43b. For example, the immersion tank 51 is positioned offset toward the positive side of the Y axis relative to the processing tank. The immersion tank 51 stores a second rinse liquid in which the lot L is immersed. The second rinse liquid is, for example, DIW (deionized water). The substrate W is held in the second rinse liquid until it is lifted up from the second rinse liquid by the third transport device 53. Because the substrate W is located below the liquid surface of the second rinse liquid, the surface tension of the second rinse liquid does not act on the substrate W, preventing the concave-convex pattern of the substrate W from collapsing.

[0031] The second transfer device 52 has a Y-axis driving device 52a, a Z-axis driving device 52b, and a second transfer arm 52c.

[0032] The Y-axis drive device 52a is disposed on the X-axis positive side of the second interface unit 5. The Y-axis drive device 52a extends along the Y-axis from the second interface unit 5 to the batch processing unit 4. The Y-axis drive device 52a moves the Z-axis drive device 52b and the second transfer arm 52c along the Y-axis. The Y-axis drive device 52a may include a ball screw.

[0033] The Z-axis drive device 52b is movably attached to the Y-axis drive device 52a. The Z-axis drive device 52b moves the second transport arm 52c along the Z-axis. The Z-axis drive device 52b may include a ball screw.

[0034] The second transfer arm 52c is movably attached to the Z-axis driver 52b. The second transfer arm 52c receives and holds the lot L from the first transfer arm 43b. The second transfer arm 52c holds multiple substrates W at a first pitch P1 along the Y-axis, and holds each of the multiple substrates W vertically. The second transfer arm 52c is moved along the Y-axis and Z-axis by the Y-axis driver 52a and Z-axis driver 52b. The second transfer arm 52c is configured to be movable between multiple positions including a delivery position, an immersion position, and a standby position.

[0035] The transfer position is a position where the first transfer arm 43b and the second transfer arm 52c transfer the lot L. The transfer position is on the negative side of the Y axis and the positive side of the Z axis.

[0036] The immersion position is a position where the lot L is immersed in the immersion tank 51. The immersion position is a position on the positive side of the Y axis and on the negative side of the Z axis from the delivery position.

[0037] The standby position is a position where the second transport arm 52c waits when the lot L is not being transferred or immersed in the immersion tank 51. The standby position is directly below the transfer position (negative side of the Z axis) and does not interfere with the movement of the first transport arm 43b. In this case, the second transport arm 52c can move to the transfer position simply by moving upward (positive side of the Z axis), thereby improving throughput. The standby position may be the same position as the immersion position. In this case, particles that may be generated by the operation of the first transport device 43 can be prevented from adhering to the second transport arm 52c. The standby position may be a position directly above the immersion position (positive side of the Z axis). In this way, by setting the standby position at a position different from the transfer position, contact between the first transport arm 43b and the second transport arm 52c can be prevented.

[0038] The second transfer device 52 moves the second transfer arm 52c to the immersion position or the standby position while the first transfer device 43 is operating, thereby preventing contact between the first transfer arm 43b and the second transfer arm 52c.

[0039] The third transfer device 53 is a multi-axis (e.g., six-axis) arm robot having a third transfer arm 53a at its tip. The third transfer arm 53a has holding claws (not shown) capable of holding one substrate W. The third transfer arm 53a can assume any position and posture in three-dimensional space while holding the substrate W with the holding claws. The third transfer device 53 transfers the substrate W between the second transfer arm 52c, which is in the immersion position, and the second transfer table 54. At this time, the immersion tank 51 is positioned outside the movement range of the first transfer arm 43b, so the first transfer arm 43b and the third transfer arm 53a do not interfere with each other. This allows one of the first transfer device 43 and the third transfer device 53 to operate independently, regardless of the operating state of the other. Therefore, the first transfer device 43 and the third transfer device 53 can be operated at any timing, thereby shortening the time required to transport the substrate W. As a result, the productivity of the substrate processing system 1 is improved.

[0040] The third transfer device 53 has an imaging unit 53b. The imaging unit 53b is attached to, for example, the third transfer arm 53a. The imaging unit 53b images the top surface of the substrate W transferred by the third transfer arm 53a and acquires a first top surface image, which is an image of the top surface of the substrate W. The imaging unit 53b transmits the acquired first top surface image to the control circuit 9. The imaging unit 53b may include a camera and generate an image using the camera. The imaging unit 53b may include a laser light source and a camera and generate an image using a light-section method. The imaging unit 53b only needs to be able to image the top surface of the substrate W transferred by the third transfer arm 53a, and may be attached to a side wall, ceiling, etc. of the second interface unit 5. In the example of FIG. 1, there is one imaging unit 53b, but there may be two or more imaging units 53b. The imaging unit 53b is an example of a first imaging unit.

[0041] The second delivery stage 54 is adjacent to the single wafer processing unit 6. The second delivery stage 54 is arranged on the negative side of the X-axis of the second interface unit 5. The second delivery stage 54 receives the substrate W from the third transfer device 53 and temporarily stores it until it is delivered to the single wafer processing unit 6. The substrate W taken out of the immersion bath 51 is placed on the second delivery stage 54. It is preferable that the surface of the substrate W placed on the second delivery stage 54 is wet with, for example, the second rinse liquid. In this case, the surface tension of the second rinse liquid does not act on the substrate W, and collapse of the concave-convex pattern of the substrate W can be suppressed. The number of second delivery stages 54 may be one or more. Details of the second delivery stage 54 will be described later.

[0042] The single wafer processing unit 6 is disposed on the negative side of the X axis of the second interface unit 5. The single wafer processing unit 6 is disposed on the positive side of the Y axis of the carry-in / out unit 2, the first interface unit 3, and the batch processing unit 4. The single wafer processing unit 6 processes substrates W one by one. The single wafer processing unit 6 has a fourth transfer device 61, a liquid processing device 62, and a drying device 63.

[0043] The fourth transport device 61 includes a guide rail 61a, a fourth transport arm 61b, and an imaging unit 61c.

[0044] The guide rail 61a is disposed on the Y-axis negative side of the single wafer processing unit 6. The guide rail 61a extends along the X-axis in the single wafer processing unit 6.

[0045] The fourth transport arm 61b moves along the guide rail 61a. The fourth transport arm 61b rotates around the Z axis. The fourth transport arm 61b transports substrates W between the second transfer table 54, the liquid processing device 62, the drying device 63, and the first transfer table 33. The number of fourth transport arms 61b may be one or more, and in the latter case, the fourth transport device 61 transports multiple (e.g., five) substrates W at a time.

[0046] The imaging unit 61c is attached to the fourth transport arm 61b. The imaging unit 61c images the top surface of the substrate W transported by the fourth transport arm 61b, and acquires a second top surface image, which is an image of the top surface of the substrate W. The imaging unit 61c transmits the acquired second top surface image to the control circuit 9. The imaging unit 61c may include a camera and generate an image using the camera. The imaging unit 61c may include a laser light source and a camera and generate an image using a light-section method. The imaging unit 61c may be attached to a side wall, ceiling, etc. of the single-wafer processing unit 6 as long as it can image the top surface of the substrate W transported by the fourth transport arm 61b. In the example of FIG. 1, there is one imaging unit 61c, but there may be two or more imaging units 61c.

[0047] The liquid processing device 62 is disposed on the X-axis positive side and the Y-axis positive side of the single wafer processing device 6. The liquid processing device 62 is a single wafer type, and processes substrates W one by one with a processing liquid. The liquid processing device 62 is disposed in multiple stages (for example, three stages) along the Z axis. This allows multiple substrates W to be processed simultaneously with the processing liquid. There may be multiple processing liquids, and for example, pure water such as DIW and a drying liquid having a surface tension lower than that of pure water. The drying liquid may be, for example, an alcohol such as IPA (isopropyl alcohol).

[0048] The drying device 63 is disposed adjacent to the liquid processing device 62 on the negative side of the X axis. In this case, the end face of the single wafer processing device 6 on the positive side of the Y axis can be disposed flush or approximately flush with the end face of the second interface unit 5 on the positive side of the Y axis. This results in almost no dead space, thereby reducing the footprint of the substrate processing system 1. In contrast, if the drying device 63 is disposed adjacent to the liquid processing device 62 on the positive side of the Y axis, the end face of the single wafer processing device 6 on the positive side of the Y axis would protrude beyond the end face of the second interface unit 5 on the positive side of the Y axis, which could result in dead space. The drying device 63 is a single wafer processing device and dries each substrate W one by one with a supercritical fluid. The drying devices 63 are disposed in multiple stages (e.g., three stages) along the Z axis. This allows multiple substrates W to be dried simultaneously.

[0049] Both the liquid processing apparatus 62 and the drying apparatus 63 do not have to be of the single wafer type; the liquid processing apparatus 62 may be of the single wafer type and the drying apparatus 63 of the batch type. The drying apparatus 63 may dry a plurality of substrates W all at once using a supercritical fluid. The number of substrates W processed all at once in the drying apparatus 63 may be equal to or greater than the number of substrates W processed all at once in the liquid processing apparatus 62, but may also be less. Apparatus other than the liquid processing apparatus 62 and the drying apparatus 63 may be arranged in the single wafer processing apparatus 6.

[0050] The control circuit 9 is, for example, a computer. The control circuit 9 includes an arithmetic unit 91 such as a CPU (Central Processing Unit) and a storage unit 92 such as a memory. The storage unit 92 stores programs that control various processes executed in the substrate processing system 1. The control circuit 9 controls the operation of the substrate processing system 1 by causing the arithmetic unit 91 to execute the programs stored in the storage unit 92.

[0051] The control circuit 9 includes electronic circuits such as a CPU, an FPGA (Field Programmable Gate Array), or an ASIC (Application Specific Integrated Circuit), and performs the various control operations described in this specification by executing instruction codes stored in a memory or by being a circuit designed for a specific application.

[0052] In the substrate processing system 1, the substrate W is transported from the load / unload section 2 to the first interface section 3, the batch processing section 4, the second interface section 5 and the single wafer processing section 6 in this order, and then returns to the load / unload section 2.

[0053] [Second delivery table in the first example] The second delivery table 54 according to the first example will be described with reference to Fig. 2. Fig. 2 is a diagram showing the second delivery table 54 according to the first example of the embodiment. Fig. 2(a) is a plan view, and Fig. 2(b) is a cross-sectional view. Fig. 2(b) corresponds to a cross-sectional view taken along line IIb-IIb in Fig. 2(a).

[0054] 2, the second transfer table 54 according to the first example includes a substrate holder 70 and a pure water supply unit 80. The pure water supply unit 80 is omitted from FIG. 2(a).

[0055] The substrate holding unit 70 has a liquid receiving unit 71 and a plurality of pins 72. The liquid receiving unit 71 has a bottom plate 71a and a wall portion 71b. The bottom plate 71a has a disk shape. The wall portion 71b is provided in a ring shape on the bottom plate 71a. The plurality of pins 72 are provided on the bottom plate 71a. In the example of FIG. 2, there are three pins 72, but there may be four or more. The surface including the upper end of each pin 72 is horizontal. The upper end of each pin 72 is located higher than the upper end of the wall portion 71b. The plurality of pins 72 support the substrate W from below above the bottom plate 71a. A first liquid film LF1, which is a liquid film of the second rinse liquid, may be formed on the upper surface of the substrate W.

[0056] The pure water supply unit 80 has a nozzle 81, a pure water supply line 82, and a return line 83. The pure water supply line 82 is connected to the nozzle 81. The nozzle 81 discharges pure water supplied through the pure water supply line 82. A branch point 85 is provided in the pure water supply line 82, and the return line 83 is connected to the branch point 85. Even when pure water is not being discharged from the nozzle 81, pure water flows through the portion of the pure water supply line 82 upstream of the branch point 85 and the return line 83. The pure water supply unit 80 configured in this manner supplies pure water to the upper surface of the substrate W. The pure water supply unit 80 is an example of a processing liquid supply unit.

[0057] [Operation of the Substrate Processing System] The operation of the substrate processing system 1 according to the embodiment, i.e., the substrate processing method, will be described with reference to Figures 1 and 3. Figure 3 is a flowchart showing the substrate processing method according to the embodiment. The processing shown in Figure 3 is performed under the control of a control circuit 9.

[0058] First, a cassette C containing a plurality of substrates W is loaded into the load / unload section 2 and placed on the load port 21. Inside the cassette C, the substrates W are held horizontally and at a second pitch P2 (P2 = N × P1) along the Z axis. N is a natural number of 2 or more, and is 2 in this embodiment, but may be 3 or more.

[0059] Next, the cassette transport device 24 transports the cassette C from the load port 21 to the loader 23. The lid of the cassette C transported to the loader 23 is opened by the lid opening / closing mechanism.

[0060] Next, the substrate transfer device 31 receives the substrates W accommodated in the cassette C (S1 in FIG. 3), and transports them to the lot formation section 32.

[0061] Next, the lot formation unit 32 holds multiple substrates W at a first pitch P1 (P1=P2 / N) to form a lot L (S2 in FIG. 3). One lot L is made up of, for example, substrates W in M ​​cassettes C. Because the pitch of the substrates W narrows from the second pitch P2 to the first pitch P1, the number of substrates W to be processed at one time can be increased.

[0062] Next, the first transfer device 43 receives the lot L from the lot formation unit 32 and transfers it to the processing tool 44.

[0063] Next, the processing tool 44 descends from above the chemical liquid tank 41, immerses the lot L in the chemical liquid, and performs chemical processing (S3 in FIG. 3). Thereafter, the processing tool 44 ascends to lift the lot L out of the chemical liquid, and then moves toward the negative side of the X axis above the rinse liquid tank 42.

[0064] Next, the processing tool 44 descends from above the rinse liquid tank 42, immerses the lot L in the first rinse liquid, and performs rinse liquid processing (S3 in FIG. 3). Thereafter, the processing tool 44 ascends to lift the lot L out of the first rinse liquid. Next, the first transfer device 43 receives the lot L from the processing tool 44 and transfers it to the second transfer device 52.

[0065] Next, the second transfer arm 52c of the second transfer device 52 moves to the positive side of the Y axis and descends from above the immersion tank 51 to immerse the lot L in the second rinse liquid (S4 in FIG. 3). The multiple substrates W in the lot L are held in the second rinse liquid until they are lifted up from the second rinse liquid by the third transfer device 53. Because the substrates W are present below the liquid surface of the second rinse liquid, the surface tension of the second rinse liquid does not act on the substrates W, preventing the concave-convex pattern of the substrates W from collapsing.

[0066] Next, the third transfer device 53 transfers the substrates W of the lot L held by the second transfer arm 52c in the second rinse liquid to the second transfer table 54. The third transfer device 53, for example, transfers the substrates W one by one to the second transfer table 54. On the second transfer table 54, pure water is discharged onto the upper surface of the substrate W to prevent the upper surface of the substrate W from drying out and causing the concave-convex pattern to collapse, and a second liquid film LF2, which is a liquid film of pure water, is formed.

[0067] Next, the fourth transfer device 61 receives the substrate W from the second delivery table 54 and transfers it to the liquid treatment device 62.

[0068] Next, the liquid processing device 62 processes the substrates W one by one with a liquid (S5 in FIG. 3). The liquid may be a plurality of liquids, for example, pure water such as DIW and a drying liquid having a lower surface tension than pure water. The drying liquid may be, for example, alcohol such as IPA. The liquid processing device 62 supplies pure water and the drying liquid in this order onto the upper surface of the substrate W, forming a liquid film of the drying liquid.

[0069] Next, the fourth transfer device 61 receives the substrate W from the liquid treatment device 62 and holds the substrate W horizontally with the film of drying liquid facing upward. The fourth transfer device 61 transfers the substrate W from the liquid treatment device 62 to the drying device 63.

[0070] Next, the drying device 63 dries the substrates W one by one with a supercritical fluid (S5 in FIG. 3). The drying liquid can be replaced with the supercritical fluid, and collapse of the uneven pattern on the substrate W due to the surface tension of the drying liquid can be suppressed. Since the supercritical fluid requires a pressure-resistant container, single-wafer processing is performed rather than batch processing in order to miniaturize the pressure-resistant container.

[0071] In this embodiment, the drying apparatus 63 is of a single-wafer type, but as described above, it may be of a batch type. The batch-type drying apparatus 63 dries multiple substrates W on which a liquid film has been formed all at once with a supercritical fluid. While the single-wafer type drying apparatus 63 has one transport arm for holding the substrates W, the batch-type drying apparatus 63 has multiple transport arms.

[0072] In this embodiment, the drying device 63 dries the substrate W by supercritical drying, but the drying method is not particularly limited. Any drying method that can prevent the concavo-convex pattern of the substrate W from collapsing may be used, for example, spin drying, scan drying, or water-repellent drying. In spin drying, the liquid treatment device 62 rotates the substrate W and uses centrifugal force to spin off the drying liquid from the substrate W, thereby removing the drying liquid from the top surface of the substrate W. In scan drying, the substrate W is rotated while the supply position of the drying liquid is moved from the center of the substrate W toward the periphery of the substrate W, and the liquid film is shaken off from the substrate W by centrifugal force. In scan drying, the supply position of a drying gas, such as nitrogen gas, may also be moved from the center of the substrate W toward the periphery of the substrate W to follow the supply position of the drying liquid.

[0073] Next, the fourth transfer device 61 receives the substrate W from the drying device 63 and transfers it to the first delivery table 33.

[0074] Next, the substrate transfer device 31 receives the substrate W from the first delivery table 33 and stores it in the cassette C (S6 in FIG. 3). The cassette C is carried out from the carry-in / out section 2 with the plurality of substrates W stored therein.

[0075] Incidentally, when the substrate W is transported from the batch processing unit 4 to the single wafer processing unit 6 in the substrate processing system 1, pure water is discharged onto the upper surface of the substrate W on the second delivery table 54 to form a second liquid film LF2. At this time, if the upper surface of the substrate W transported onto the second delivery table 54 is lyophobic (hydrophobic), the pure water discharged onto the upper surface of the substrate W may be repelled by the upper surface of the substrate W and may fall from the substrate W during transportation. In this case, maintenance of the substrate processing system 1 is performed. This reduces the availability of the substrate processing system 1.

[0076] For example, when a monitor substrate with a silicon nitride film formed on its surface is etched with a phosphoric acid solution to evaluate the etching characteristics of the silicon nitride film, some of the lot L may contain bare silicon substrates as dummy substrates. In this case, the top surfaces of some of the substrates in lot L may become lyophobic. This is because the top surfaces of the monitor substrates etched with a phosphoric acid solution become lyophilic (hydrophilic), while the top surfaces of the bare silicon substrates etched with a phosphoric acid solution become lyophobic. For example, if dummy substrates used in different processes are reused, the top surfaces of some of the substrates in lot L may become lyophobic. For example, if an irregular event occurs during the processing of product substrates, the top surfaces of the substrates may become lyophobic.

[0077] Below, we will explain a technology that can prevent pure water from dripping from a substrate W having a lyophobic upper surface when the substrate W is transported from the batch processing unit 4 to the single-wafer processing unit 6, thereby preventing a decrease in the operating rate of the substrate processing system 1.

[0078] [Surface Determination Control] 4 to 9, an example of control for determining whether or not the pure water supply unit 80 supplies pure water to the top surface of the substrate W based on the first top surface image (hereinafter referred to as "surface determination control") will be described. The surface determination control is performed when the substrate W immersed in the immersion tank 51 of the second interface unit 5 is transported to the single-wafer processing unit 6. FIG. 4 is a flowchart showing an example of the surface determination control. FIGS. 5 to 7 are cross-sectional views showing an example of the surface determination control. The processing shown in FIG. 4 is performed under control by the control circuit 9.

[0079] In step S101, the third transfer device 53 takes out the substrates W of the lot L held by the second transfer arm 52c in the second rinse liquid in the immersion tank 51.

[0080] In step S102, the third transfer device 53 holds the substrate W in a horizontal position with the third transfer arm 53a and transfers it to the second transfer table 54. At this time, a first liquid film LF1, which is a liquid film of the second rinse liquid, is formed on the upper surface of the substrate W. When the third transfer device 53 transfers the substrate W, the imaging unit 53b images the upper surface of the substrate W being transferred by the third transfer arm 53a and acquires a first upper surface image, which is an image of the upper surface of the substrate W. The imaging unit 53b transmits the acquired first upper surface image to the control circuit 9. Thus, in step S102, the imaging unit 53b images the upper surface of the substrate W before it is transferred to the second transfer table 54.

[0081] In step S103, the control circuit 9 determines whether the top surface of the substrate W is lyophilic or lyophobic based on the first top surface image. For example, the control circuit 9 calculates the ratio of the area covered with the first liquid film LF1 to the entire area of ​​the top surface of the substrate W in the first top surface image (hereinafter referred to as the "first area ratio"), and determines whether the top surface of the substrate W is lyophilic or lyophobic based on whether the calculated first area ratio is equal to or greater than a threshold. If the first area ratio is equal to or greater than the threshold, the control circuit 9 determines that the top surface of the substrate W is lyophilic. If the first area ratio is less than the threshold, the control circuit 9 determines that the top surface of the substrate W is lyophobic. The threshold is, for example, 100%. The threshold may be a value less than 100%, for example, 90%. The control circuit 9 may store the first area ratio in association with information identifying the substrate W (for example, a substrate ID). In this case, it becomes easier to identify the cause if a product defect occurs.

[0082] In this embodiment, the control circuit 9 first binarizes the first top surface image, calculates the ratio of the number of black pixels to the total number of pixels including black and white (hereinafter referred to as the "black ratio"), and determines whether the top surface of the substrate W is lyophilic or lyophobic based on whether the calculated black ratio is equal to or greater than a threshold. If the black ratio is equal to or greater than the threshold, the control circuit 9 determines that the top surface of the substrate W is lyophilic. If the black ratio is less than the threshold, the control circuit 9 determines that the top surface of the substrate W is lyophobic. The threshold is, for example, 100%. The threshold may be a value less than 100%, for example, 90%. The control circuit 9 may store the black ratio in association with information for identifying the substrate W (for example, a substrate ID). In this case, it becomes easier to identify the cause if a product defect occurs.

[0083] FIG. 8 is a diagram showing an example of a top surface image of a substrate W having lyophilic properties. FIG. 9 is a diagram showing an example of a top surface image of a substrate W having lyophobic properties. In each of FIGS. 8 and 9, the diagram on the left shows the first top surface image before binarization, and the diagram on the right shows the first top surface image after binarization. In the example of FIG. 8, the first liquid film LF1 is formed over the entire top surface of the substrate W, and the black ratio of the first top surface image after binarization is 100%. In this case, the control circuit 9 determines that the top surface of the substrate W is lyophilic. In the example of FIG. 9, the first liquid film LF1 is formed in a partial region of the top surface of the substrate W, and the black ratio of the first top surface image after binarization is 1%. In this case, the control circuit 9 determines that the top surface of the substrate W is lyophobic.

[0084] If it is determined in step S103 that the upper surface of the substrate W is lyophilic, the control circuit 9 advances the process to step S104. If it is determined in step S103 that the upper surface of the substrate W is lyophobic, the control circuit 9 advances the process to step S121. That is, if the upper surface of the substrate W is lyophobic, the second liquid film LF2 is not formed on the upper surface of the substrate W. In this case, it is possible to prevent liquid droplets from falling from the upper surface of the substrate W when the fourth transfer device 61 transfers the substrate W from the substrate holding part 70 to the liquid treatment device 62, thereby reducing the frequency of maintenance. This makes it possible to prevent a decrease in the availability of the substrate processing system 1.

[0085] In step S104, the third transfer device 53 transfers the substrate W held by the third transfer arm 53a to the second delivery table 54, and places the substrate W on the three pins 72 as shown in FIG.

[0086] 6, the nozzle 81 ejects pure water toward the upper surface of the substrate W. As a result, a second liquid film LF2, which is a liquid film of pure water, is formed on the upper surface of the substrate W. After the second liquid film LF2 is formed on the upper surface of the substrate W, the nozzle 81 stops ejecting pure water onto the substrate W.

[0087] In step S106, the control circuit 9 determines whether or not the liquid processing apparatus 62 is able to accept the substrate W. For example, if there is no substrate W in the liquid processing apparatus 62, the control circuit 9 determines that the liquid processing apparatus 62 is able to accept the substrate W. For example, if there is a substrate W in the liquid processing apparatus 62, the control circuit 9 determines that the liquid processing apparatus 62 is not able to accept the substrate W.

[0088] If it is determined in step S106 that liquid processing apparatus 62 is able to accept substrate W (YES in step S106), control circuit 9 proceeds to step S107. If it is determined in step S106 that liquid processing apparatus 62 is not able to accept substrate W (NO in step S106), control circuit 9 causes substrate W to wait on second transfer table 54 until liquid processing apparatus 62 becomes able to accept substrate W.

[0089] In step S107, the control circuit 9 determines whether a predetermined waiting time has elapsed since the substrate W was transferred to the second transfer table 54. The predetermined waiting time is set in advance, for example, by a processing recipe. The predetermined waiting time may be 0 seconds. In other words, step S107 may be omitted.

[0090] If it is determined in step S107 that the predetermined waiting time has elapsed (YES in step S107), the control circuit 9 proceeds to step S108. If it is determined in step S107 that the predetermined waiting time has not elapsed (NO in step S107), the control circuit 9 keeps the substrate W waiting on the second delivery table 54 until the predetermined waiting time has elapsed.

[0091] In step S121, the third transfer device 53 transfers the substrate W held by the third transfer arm 53a to the second delivery table 54, and places the substrate W on the three pins 72 as shown in FIG.

[0092] In step S122, the control circuit 9 determines whether or not the liquid processing apparatus 62 is able to accept the substrate W. For example, if there is no substrate W in the liquid processing apparatus 62, the control circuit 9 determines that the liquid processing apparatus 62 is able to accept the substrate W. For example, if there is a substrate W in the liquid processing apparatus 62, the control circuit 9 determines that the liquid processing apparatus 62 is not able to accept the substrate W.

[0093] If it is determined in step S122 that the liquid processing device 62 is able to accept the substrate W (YES in step S122), the control circuit 9 proceeds to step S108. That is, if the liquid processing device 62 is able to accept the substrate W, the control circuit 9 changes the transfer schedule so that the fourth transfer device 61 immediately transfers the substrate W from the substrate holding unit 70 to the liquid processing device 62 without waiting for the specified waiting time to elapse. In this case, it is easy to prevent the uneven pattern of the substrate W from collapsing. The transfer schedule is a chronological list of the transfer destinations and transfer orders of each substrate W.

[0094] If it is determined in step S122 that liquid processing apparatus 62 is not able to receive substrate W (NO in step S122), control circuit 9 causes substrate W to wait on second transfer table 54 until liquid processing apparatus 62 becomes able to receive substrate W.

[0095] In step S108, as shown in FIG. 7, the fourth transfer device 61 transfers the substrate W supported by the three pins 72 from the second transfer table 54 and transfers it to the liquid treatment device 62, thereby completing the treatment.

[0096] As described above, according to the embodiment, the control circuit 9 determines whether the top surface of the substrate W is lyophilic or lyophobic based on the first top surface image captured by the imaging unit 53b. If it is determined that the top surface of the substrate W is lyophobic, the fourth transfer device 61 transports the substrate W from the substrate holding unit 70 to the liquid treatment device 62 without supplying pure water from the pure water supply unit 80 to the top surface of the substrate W. In this case, droplets are prevented from falling from the top surface of the substrate W when the fourth transfer device 61 transports the substrate W from the substrate holding unit 70 to the liquid treatment device 62, thereby reducing the frequency of maintenance. This prevents a decrease in the availability of the substrate processing system 1.

[0097] When the fourth transfer device 61 transports the substrate W, the imaging unit 61c may image the top surface of the substrate W transported by the fourth transport arm 61b, and acquire a second top surface image, which is an image of the top surface of the substrate W. The imaging unit 61c may transmit the acquired second top surface image to the control circuit 9. The control circuit 9 may determine whether the substrate W is tilted based on the second top surface image, and change the operation of the fourth transfer device 61 according to the determination result. The operation of the fourth transfer device 61 includes, for example, the transport speed of the fourth transfer device 61. The operation of the fourth transfer device 61 may also include the entry height of the fourth transport arm 61b when the fourth transfer device 61 transports the substrate W to the liquid treatment device 62 with the fourth transport arm 61b. In this case, the substrate W can be transported to a desired position in the liquid treatment device 62. For example, if the upper surface of the substrate W is lyophobic, even if the substrate W is not tilted when placed on the second transfer table 54, the first liquid film LF1 on the upper surface of the substrate W may flow when the fourth transfer device 61 transports the substrate W, causing the substrate W to tilt.

[0098] [Second delivery table in the second example] A second example of the second transfer table 54 will be described with reference to Fig. 10. Fig. 10 is a diagram showing the second transfer table 54 according to the second example of the embodiment. Fig. 10(a) is a plan view, and Fig. 10(b) is a cross-sectional view. Fig. 10(b) corresponds to a cross-sectional view taken along line Xb-Xb in Fig. 10(a). In Fig. 10(a), the pure water supply unit 80 and the imaging unit 75 are omitted.

[0099] As shown in FIG. 10 , the second transfer table 54 may have an imaging unit 75. The imaging unit 75 is provided above the substrate holder 70. The imaging unit 75 images the top surface of the substrate W supported by the pins 72 and acquires a first top surface image, which is an image of the top surface of the substrate W. The imaging unit 75 images the top surface of the substrate W supported by the pins 72, for example, before the pure water supply unit 80 supplies pure water to the substrate W. The imaging unit 75 transmits the acquired first top surface image to the control circuit 9. The imaging unit 75 has the same configuration as the imaging unit 53b, for example. The control circuit 9 may perform control to determine whether or not the pure water supply unit 80 supplies pure water to the top surface of the substrate W based on the first top surface image acquired by the imaging unit 75. The imaging unit 75 is an example of a first imaging unit.

[0100] [Second delivery platform in the third example] A second transfer table 54 according to a third example will be described with reference to Fig. 11. Fig. 11 is a diagram showing a second transfer table 54 according to a third example of the embodiment. Fig. 11(a) is a plan view, and Fig. 11(b) is a cross-sectional view. Fig. 11(b) corresponds to a cross-sectional view taken along line XIb-XIb in Fig. 11(a). In Fig. 11(a), the pure water supply unit 80 and the laser displacement meter 76 are omitted.

[0101] As shown in FIG. 11 , the second transfer table 54 may have laser displacement meters 76. The laser displacement meters 76 are provided, for example, at a front position (a position on the negative side of the X-axis) when the fourth transfer arm 61b enters and at a rear position (a position on the positive side of the X-axis) when the fourth transfer arm 61b enters. Each laser displacement meter 76 is provided above the substrate holder 70. Each laser displacement meter 76 measures the height of the upper surface of the substrate W supported by the pins 72. For example, each laser displacement meter 76 measures the height of the upper surface of the substrate W supported by the pins 72 after the pure water supply unit 80 supplies pure water to the substrate W. Each laser displacement meter 76 transmits the measured height of the upper surface of the substrate W to the control circuit 9. The control circuit 9 calculates the inclination of the substrate W supported by the pins 72 based on the height of the upper surface of the substrate W measured by the two laser displacement meters 76. In the example of FIG. 11 , two laser displacement meters 76 are provided, but three or more laser displacement meters 76 may be provided. The laser displacement meter 76 is an example of a sensor.

[0102] The sensor may be an imaging unit configured to be able to capture an image of the substrate W supported by the pins 72. In this case, the control circuit 9 can calculate the inclination of the substrate W supported by the pins 72 based on the image of the substrate W captured by the imaging unit. The sensor may be a weight sensor built into each pin 72. In this case, the control circuit 9 can calculate the inclination of the substrate W supported by the pins 72 by comparing the weights measured by the weight sensors built into each pin 72.

[0103] [Tilt judgment control] 12 to 16, an example of control (hereinafter referred to as "tilt determination control") that changes the operation of the fourth transport device 61 based on the tilt of the substrate W supported by the pins 72 will be described. The tilt determination control is performed when transporting a substrate W immersed in the immersion tank 51 of the second interface unit 5 to the single-wafer processing unit 6. FIG. 12 is a flowchart showing an example of the tilt determination control. FIGS. 13 to 16 are cross-sectional views showing an example of the tilt determination control. The processing shown in FIG. 12 is performed under control by the control circuit 9.

[0104] In step S201, the third transfer device 53 takes out the substrates W of the lot L held by the second transfer arm 52c in the second rinse liquid in the immersion tank 51.

[0105] In step S202, the third transfer device 53 transfers the substrate W to the second delivery table 54 with the third transfer arm 53a, and places the substrate W on the three pins 72, as shown in Fig. 13. At this time, a first liquid film LF1, which is a liquid film of the second rinse liquid, is formed on the upper surface of the substrate W.

[0106] 14, the nozzle 81 ejects pure water toward the upper surface of the substrate W. As a result, a second liquid film LF2, which is a liquid film of pure water, is formed on the upper surface of the substrate W. After the second liquid film LF2 is formed on the upper surface of the substrate W, the nozzle 81 stops ejecting pure water onto the substrate W.

[0107] 15, in step S204, each laser displacement meter 76 measures the height of the top surface of the substrate W supported by the three pins 72. Each laser displacement meter 76 transmits the measured height of the top surface of the substrate W to the control circuit 9. The control circuit 9 calculates the inclination of the substrate W supported by the pins 72 based on the height of the top surface of the substrate W measured by the multiple laser displacement meters 76.

[0108] In step S205, the control circuit 9 determines whether or not the liquid processing apparatus 62 is able to accept the substrate W. For example, if there is no substrate W in the liquid processing apparatus 62, the control circuit 9 determines that the liquid processing apparatus 62 is able to accept the substrate W. For example, if there is a substrate W in the liquid processing apparatus 62, the control circuit 9 determines that the liquid processing apparatus 62 is not able to accept the substrate W.

[0109] If it is determined in step S205 that liquid processing apparatus 62 is able to accept substrate W (YES in step S205), control circuit 9 proceeds to step S206. If it is determined in step S205 that liquid processing apparatus 62 is not able to accept substrate W (NO in step S205), control circuit 9 causes substrate W to wait on second transfer table 54 until liquid processing apparatus 62 becomes able to accept substrate W.

[0110] In step S206, the control circuit 9 determines whether a predetermined waiting time has elapsed since the substrate W was transferred to the second transfer table 54. The predetermined waiting time is set in advance, for example, by a processing recipe. The predetermined waiting time may be 0 seconds. In other words, step S206 may be omitted.

[0111] If it is determined in step S206 that the predetermined waiting time has elapsed (YES in step S206), the control circuit 9 proceeds to step S207. If it is determined in step S206 that the predetermined waiting time has not elapsed (NO in step S206), the control circuit 9 keeps the substrate W waiting on the second delivery table 54 until the predetermined waiting time has elapsed.

[0112] In step S207, the control circuit 9 determines whether the tilt of the substrate W calculated in step S204 is within the normal range. If the tilt of the substrate W is within the normal range in step S207 (YES in step S207), the control circuit 9 proceeds to step S208. If the tilt of the substrate W is not within the normal range in step S207 (NO in step S207), the control circuit 9 proceeds to step S209.

[0113] In step S208, the fourth transfer device 61 performs normal operation, and the process ends. The normal operation includes the fourth transfer device 61 unloading the substrate W supported by the three pins 72 from the second transfer table 54 and transporting it to the liquid processing device 62, as shown in FIG.

[0114] In step S209, the fourth transfer device 61 performs a corrective operation, and the process ends. The corrective operation includes, for example, an operation in which the fourth transfer device 61 unloads the substrate W supported by the three pins 72 from the second transfer table 54 and transports it to the liquid treatment device 62 while the entry height of the fourth transfer arm 61b is changed relative to normal operation. In this case, if the substrate W supported by the three pins 72 is tilted, the fourth transfer arm 61b can be prevented from contacting the substrate W. This prevents damage to the substrate W. This suppresses a decrease in the operating rate of the substrate processing system 1. The corrective operation may also include an operation in which the fourth transfer device 61 unloads the substrate W supported by the three pins 72 from the second transfer table 54 and transports it to the liquid treatment device 62 while the transport speed of the substrate W by the fourth transfer arm 61b is changed to be slower relative to normal operation. The corrective operation may also include an operation to stop the substrate W supported by the three pins 72 from being unloaded from the second transfer table 54.

[0115] As described above, according to the embodiment, the control circuit 9 performs control to calculate the tilt of the substrate W based on the height of the upper surface of the substrate W measured by the laser displacement meter 76, and control to change the operation of the fourth transfer device 61 based on the calculated tilt of the substrate W. In this case, when the substrate W supported by the three pins 72 is tilted, it is possible to prevent the fourth transfer arm 61b from coming into contact with the substrate W. This makes it possible to prevent damage to the substrate W. As a result, it is possible to suppress a decrease in the operating rate of the substrate processing system 1.

[0116] When the fourth transfer device 61 transports the substrate W, the imaging unit 61c may image the top surface of the substrate W transported by the fourth transport arm 61b, and acquire a second top surface image, which is an image of the top surface of the substrate W. The imaging unit 61c may transmit the acquired second top surface image to the control circuit 9. The control circuit 9 may determine whether the substrate W is tilted based on the second top surface image, and change the operation of the fourth transfer device 61 according to the determination result. The operation of the fourth transfer device 61 includes, for example, the transport speed of the fourth transfer device 61. The operation of the fourth transfer device 61 may also include the entry height of the fourth transport arm 61b when the fourth transfer device 61 transports the substrate W to the liquid treatment device 62 with the fourth transport arm 61b. In this case, the substrate W can be transported to a desired position in the liquid treatment device 62.

[0117] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive, and the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0118] 1. Substrate Processing System 4 Batch Processing Unit 5 Second interface section 6 Single wafer processing section 9 Control Circuit 53b Imaging unit 54 Second Delivery Platform 70 Board holding part 75 Imaging unit 80 Pure water supply section W substrate

Claims

1. a batch processing unit that processes a plurality of substrates at once; a single wafer processing section for processing substrates one by one; an interface unit that transfers the substrate from the batch processing unit to the single wafer processing unit; a control circuit; Equipped with The interface unit a substrate holder for holding the substrate; a processing liquid supply unit that supplies a processing liquid to an upper surface of the substrate held by the substrate holder to prevent the upper surface from drying; an imaging unit that images the top surface of the substrate; and the control circuit performs control to determine whether or not the processing liquid supply unit supplies the processing liquid to the upper surface of the substrate based on the image captured by the imaging unit. Substrate processing system.

2. the control circuit performs control to determine whether the upper surface of the substrate has lyophilicity or lyophobicity based on the image captured by the imaging unit; the control circuit controls the processing liquid supply unit not to supply the processing liquid to the upper surface of the substrate when the upper surface of the substrate is lyophobic. The substrate processing system of claim 1 .

3. the control circuit controls the processing liquid supply unit to supply the processing liquid to the upper surface of the substrate when the upper surface of the substrate has lyophilicity; The substrate processing system of claim 2 .

4. the control circuit performs control to determine whether the upper surface of the substrate is lyophilic or lyophobic with respect to the processing liquid, based on a ratio of an area covered with the processing liquid to an entire area of ​​the upper surface of the substrate in the image captured by the imaging unit. The substrate processing system of claim 2 .

5. the control circuit controls the imaging unit to capture an image of the top surface of the substrate before the substrate is held by the substrate holding unit. The substrate processing system of claim 1 .

6. the control circuit controls the imaging unit to capture an image of the top surface of the substrate held by the substrate holding unit. The substrate processing system of claim 1 .

7. The treatment liquid is pure water. The substrate processing system according to claim 1 .

8. a batch processing unit that processes a plurality of substrates at once; a single wafer processing section for processing substrates one by one; an interface unit that transfers the substrate from the batch processing unit to the single wafer processing unit; a control circuit; Equipped with The interface unit a substrate holder for holding the substrate; a processing liquid supply unit that supplies a processing liquid to an upper surface of the substrate held by the substrate holder to prevent the upper surface from drying; a sensor for measuring a state of the substrate held by the substrate holder; and the single wafer processing unit has a transport device that receives the substrate from the substrate holding unit, The control circuit Control of calculating the tilt of the substrate based on the state of the substrate measured by the sensor; and performing control to change the operation of the transport device based on the calculated tilt of the substrate. Substrate processing system.

9. the control circuit controls the sensor to measure the state of the substrate to which the processing liquid has been supplied. The substrate processing system of claim 8 .

10. the operation of the transport device includes an entry height of the transport arm when the transport device receives the substrate by the transport arm; The substrate processing system of claim 8 .

11. The operation of the transport device includes a transport speed of the transport device. The substrate processing system of claim 8 .

12. The treatment liquid is pure water. The substrate processing system according to any one of claims 8 to 11.

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