Aluminum alloy sheet for magnetic disk, aluminum alloy blank for magnetic disk, and aluminum alloy substrate for magnetic disk

The aluminum alloy composition with controlled elements and intermetallic compounds addresses the challenge of rigidity and thermal deformation in magnetic disks, enhancing their performance and stability during high-speed operations.

JP2026010161APending Publication Date: 2026-01-21KOBE STEEL LTD
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Patent Information

Application Number
JP2025177692
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-06-26
Filing Date
2025-10-22
Publication Date
2026-01-21

AI Technical Summary

Technical Problem

Existing aluminum alloy plates for magnetic disks face challenges in achieving both good rigidity and suppressing thermal deformation during magnetic film sputtering, which are crucial for maintaining the performance and flatness of hard disk drives.

Method used

An aluminum alloy composition containing specific amounts of Mg, Cr, Be, Si, Fe, Mn, Ni, Cu, and Zn, along with a controlled number density of intermetallic compounds, is used to enhance rigidity and stress relaxation resistance, thereby reducing thermal deformation.

Benefits of technology

The alloy composition provides high rigidity and effective suppression of thermal deformation, ensuring improved performance and flatness of magnetic disks by maintaining Young's modulus above 70 GPa and stress relaxation rate below 90%, thus stabilizing the disks during high-speed rotation.

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Abstract

To provide an aluminum alloy sheet for a magnetic disk, an aluminum alloy sheet blank for the magnetic disk, and an aluminum alloy sheet substrate for the magnetic disk, having satisfactory rigidity and capable of suppressing thermal deformation during magnetic film sputtering.SOLUTION: An aluminum alloy sheet for a magnetic disk, comprising: 0.1 to 7.0 mass% of Mg; 0.005 to 1.0 mass% of Cr; 3 to 100 mass ppm of Be; 0.20 mass% or less of Si; 0.05 to 5.9 mass% of at least one or more of Fe, Mn, and Ni in total; and a balance of Al and impurities.SELECTED DRAWING: None
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Description

[Technical Field]

[0001] The present invention relates to an aluminum alloy plate for a magnetic disk, an aluminum alloy blank for a magnetic disk, and an aluminum alloy substrate for a magnetic disk. [Background technology]

[0002] With the digitization of information and the spread of the Internet, large amounts of digital data are being handled, leading to a demand for larger capacity hard disk drives (HDDs), particularly in data centers.To achieve this, thinner magnetic disks are being considered in order to increase the number of magnetic disks per HDD.

[0003] However, when attempting to improve the data transfer rate, particularly at a high rotation speed, during rotation of the magnetic disk, the thinner the magnetic disk, the higher the probability of occurrence of minute vibrations.

[0004] One of the means for suppressing vibrations of such a thinned magnetic disk is to increase the rigidity of the substrate. For example, in Patent Documents 1 and 2, in order to improve the rigidity of the substrate, a chemical composition is adopted in which a specific amount of at least one of Fe, Mn, and Ni is added to an aluminum alloy plate, thereby increasing the rigidity of the magnetic disk substrate itself.

[0005] Furthermore, with regard to substrates for magnetic disks, the index of "flatness" is extremely important because it greatly affects the performance of hard disk drives (HDDs) that use the substrate. During the production process of substrates, there is concern about deformation due to thermal strain, which adversely affects the flatness of the substrate and can lead to the production of non-standard products. Currently, in light of resource depletion, recycling of various things is progressing, and recycling of metals, which are consumed in large quantities, has been carried out for some time. The above-mentioned non-standard products can also be reused through recycling, but it is important to suppress the generation of non-standard products by suppressing thermal distortion. For example, Patent Document 3 describes an aluminum alloy plate for magnetic disks that has a specific chemical composition, a gradient in the number of compounds in the plate thickness direction that is equal to or greater than a specific value, and excellent flatness.

[0006] Here, as shown in Patent Document 4, it is known that thermal distortion occurs around the gripping portion of a magnetic disk substrate due to thermal expansion that occurs during magnetic film sputtering. Therefore, to obtain a magnetic disk with excellent flatness, it is necessary to suppress deformation of the magnetic disk substrate due to thermal distortion.

[0007] From the viewpoint of suppressing deformation due to thermal strain, for example, Patent Document 5 describes that an aluminum alloy sheet for a cap having a specific chemical composition and having a difference in proof stress in a direction parallel to rolling before and after heat treatment of a specific value or more can exhibit excellent stress relaxation resistance and suppress thermal deformation. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Patent No. 7132289 [Patent Document 2] Patent No. 6684139 [Patent Document 3] Japanese Patent Application Publication No. 2023-004878 [Patent Document 4] Japanese Patent Publication No. 2022-010156 [Patent Document 5] Patent Publication No. 2021-011621 Summary of the Invention [Problem to be solved by the invention]

[0009] Thus, while good rigidity and suppression of thermal deformation are both important for an aluminum alloy plate for a magnetic disk, there remains room for further study on an aluminum alloy plate for a magnetic disk that satisfies both of these requirements.

[0010] The present invention has been made in view of the above-mentioned problems, and aims to provide an aluminum alloy plate for magnetic disks, an aluminum alloy plate blank for magnetic disks, and an aluminum alloy plate substrate for magnetic disks, which have good rigidity and can suppress thermal deformation during magnetic film sputtering. [Means for solving the problem]

[0011] As a result of extensive research, the inventors discovered that by using a specific alloy composition, an aluminum alloy plate for magnetic disks can be obtained that has good rigidity and can suppress thermal deformation during magnetic film sputtering, and thus created the present invention.

[0012] That is, the present invention relates to the following. [1] Mg: 0.1~7.0% by mass, Cr:0.005~1.0% by mass, Be: contains 3 to 100 mass ppm, Si: 0.20% by mass or less, The total of at least one of Fe, Mn, and Ni: 0.05 to 5.9 mass%; An aluminum alloy plate for magnetic disks, with the remainder consisting of Al and impurities. [2] the Fe: 0 to 1.00 mass %; the Mn: 0 to 1.4 mass %, and The aluminum alloy plate for magnetic disks according to [1], containing at least one of the Ni: 0 to 3.5 mass %. [3] The aluminum alloy plate for magnetic disks according to [1] or [2], further containing at least one of Cu: 1.0 mass % or less and Zn: 1.0 mass % or less. [4] The number density of intermetallic compounds on the surface with a maximum length of 0.05 μm or more and 0.33 μm or less is 1.0 × 10 6 pieces / mm 2The aluminum alloy plate for magnetic disks according to [1] or [2], which is as described above. [5] [1] or [2], wherein the aluminum alloy plate for magnetic disks has a Young's modulus of 70 GPa or more. [6] The aluminum alloy plate for magnetic disks according to [1] or [2], which has a stress relaxation rate of 90% or less. [7] An aluminum alloy blank for magnetic disks obtained from the aluminum alloy plate for magnetic disks according to [1] or [2]. [8] An aluminum alloy substrate for magnetic disks obtained from the aluminum alloy blank for magnetic disks according to [7]. [Effects of the Invention]

[0013] According to the present invention, it is possible to provide an aluminum alloy plate for magnetic disks, an aluminum alloy plate blank for magnetic disks, and an aluminum alloy plate substrate for magnetic disks that have good rigidity and can suppress thermal deformation during magnetic film sputtering. [Brief explanation of the drawings]

[0014] [Figure 1] 1(a) and 1(b) are diagrams for explaining the measurement of the stress relaxation rate in the examples. [Figure 2] FIG. 2 is a diagram showing a COMPO image (magnification: 10,000 times) of the aluminum alloy blank No. 1 in the example, obtained by photographing with a scanning electron microscope (FE-SEM). [Figure 3] FIG. 3 is a diagram showing a COMPO image (magnification: 10,000 times) of the aluminum alloy blank No. 3 in the example, obtained by photographing with a scanning electron microscope (FE-SEM). DETAILED DESCRIPTION OF THE INVENTION

[0015] An aluminum alloy plate for a magnetic disk, an aluminum alloy blank for a magnetic disk, and an aluminum alloy substrate for a magnetic disk according to one embodiment of the present invention will be described below. In the following description, the aluminum alloy plate for magnetic disk, the aluminum alloy blank for magnetic disk, and the aluminum alloy substrate for magnetic disk according to this embodiment may be simply referred to as the "aluminum alloy plate," the "blank," and the "substrate," respectively.

[0016] [Aluminum alloy plates for magnetic disks] The aluminum alloy plate for magnetic disk according to this embodiment contains 0.1 to 7.0 mass% Mg, 0.005 to 1.0 mass% Cr, 3 to 100 mass ppm Be, 0.20 mass% or less Si, 0.05 to 5.9 mass% total of at least one of Fe, Mn, and Ni, with the balance being Al and impurities. The aluminum alloy plate for magnetic disk according to this embodiment may also contain Cu and Zn. Hereinafter, each component of the aluminum alloy plate for a magnetic disk according to this embodiment will be described in detail.

[0017] (Mg: 0.1 mass% or more and 7.0 mass% or less) Mg is an essential constituent element in the aluminum alloy plate for a magnetic disk according to this embodiment, and is contained in the aluminum alloy plate in order to obtain good yield strength. If the Mg content in the aluminum alloy sheet is less than 0.1% by mass, the above effect cannot be obtained. On the other hand, if the Mg content in the aluminum alloy sheet exceeds 7.0% by mass, the rigidity decreases. Therefore, the Mg content is set to 0.1% by mass or more and 7.0% by mass or less. From the viewpoint of improving yield strength, the Mg content is preferably 0.5 mass% or more, 1.0 mass% or more, 1.5 mass% or more, 1.7 mass% or more, 2.0 mass% or more, 2.2 mass% or more, or 2.5 mass% or more. From the viewpoint of suppressing a decrease in rigidity, the Mg content is preferably 6.5 mass% or less, 6.0 mass% or less, 5.5 mass% or less, 5.0 mass% or less, 4.5 mass% or less, 4.0 mass% or less, or 3.5 mass% or less.

[0018] (Cr: 0.005 mass% or more and 1.0 mass% or less) Cr is an essential constituent element in the aluminum alloy plate for a magnetic disk according to this embodiment, and is contained in the aluminum alloy plate in order to obtain good yield strength. If the Cr content in the aluminum alloy sheet is less than 0.005% by mass, the above effect cannot be obtained. On the other hand, if the Cr content exceeds 1.0% by mass, the intermetallic compounds become coarse, which may cause edge cracks and reduce rollability. Therefore, the Cr content is set to 0.005% by mass or more and 1.0% by mass or less. From the viewpoint of improving yield strength, the Cr content is preferably 0.01 mass% or more, 0.03 mass% or more, 0.05 mass% or more, 0.08 mass% or more, or 0.1 mass% or more, and from the viewpoint of ensuring rollability, it is preferably 0.9 mass% or less, 0.8 mass% or less, 0.7 mass% or less, 0.6 mass% or less, 0.5 mass% or less, 0.4 mass% or less, 0.3 mass% or less, or 0.2 mass% or less.

[0019] (Be: 3 mass ppm or more and 100 mass ppm or less) Be is an essential element in the aluminum alloy plate for magnetic disks according to this embodiment, and has the effect of forming an oxide film during casting to suppress the formation of Mg oxides. It also has the effect of improving the hot rolling property and formability of the aluminum alloy, and further has the effect of weakening the adhesion between blanks by suppressing oxidation during corrective annealing, thereby suppressing deterioration of flatness due to external force during subsequent peeling, thereby achieving excellent flatness. If the Be content is less than 3 ppm by mass, the effect of adding Be cannot be fully obtained. On the other hand, if the Be content exceeds 100 ppm by mass, Be-containing compounds become coarse, which may cause edge cracks and reduce rollability. Therefore, the Be content is set to 3 ppm by mass or more and 100 ppm by mass or less. The Be content is preferably 4 ppm by mass or more, 5 ppm by mass or more, 8 ppm by mass or more, or 10 ppm by mass or more from the viewpoint of fully obtaining the effects of the addition of Be, and is preferably 80 ppm by mass or less, 50 ppm by mass or less, 30 ppm by mass or less, or 20 ppm by mass or less from the viewpoint of ensuring rollability.

[0020] (Si: 0.20% by mass or less) Si is usually mixed into aluminum alloys as an unavoidable impurity in base metal, forming elemental Si or Al-Fe-Si intermetallic compounds. If the Si content exceeds 0.20 mass%, the Young's modulus decreases, and the elemental Si and Al-Fe-Si intermetallic compounds become coarse, resulting in poor rollability. Therefore, the Si content is set to 0.20 mass% or less (including 0.00 mass%). In order to prevent a decrease in Young's modulus and rollability, the Si content is preferably 0.18% by mass or less, 0.15% by mass or less, 0.13% by mass or less, 0.10% by mass or less, 0.08% by mass or less, 0.05% by mass or less, 0.04% by mass or less, 0.03% by mass or less, or 0.02% by mass or less. The lower the Si content, the more desirable it is; even a 0% by mass content does not impair the properties of the present invention; however, high-purity raw materials (such as aluminum ingots and intermediate alloy ingots) are required, resulting in higher costs. Therefore, a Si content of 0.004% by mass or more is industrially preferable.

[0021] (Total of Fe, Mn, and Ni: 0.05 to 5.9 mass%) Fe, Mn, and Ni are components that contribute to improving rigidity and stress relaxation resistance. Therefore, the aluminum alloy sheet for a magnetic disk according to this embodiment contains at least one selected from the group consisting of Fe, Mn, and Ni. That is, the aluminum alloy sheet for a magnetic disk according to this embodiment may contain Fe, Mn, or Ni alone, or two of Fe and Mn, Mn and Ni, or Ni and Fe, or may contain all of Fe, Mn, and Ni, and is not particularly limited as long as the total content thereof is 0.05 to 5.9 mass%. In order to obtain good rigidity and stress relaxation resistance, the total content of Fe, Mn, and Ni is preferably 0.10% by mass or more, 0.2% by mass or more, 0.3% by mass or more, 0.5% by mass or more, 0.8% by mass or more, or 1.0% by mass or more. On the other hand, if these elements are contained in excess, the compounds may become coarse and the plating properties may be deteriorated. Therefore, the total content is preferably 5.5% by mass or less, 5.0% by mass or less, 4.5% by mass or less, 4.0% by mass or less, 3.5% by mass or less, 3.0% by mass or less, 2.5% by mass or less, 2.0% by mass or less, or 1.5% by mass or less.

[0022] The aluminum alloy plate for a magnetic disk according to this embodiment preferably contains at least one of Fe: 0 to 1.00 mass %, Mn: 0 to 1.4 mass %, and Ni: 0 to 3.5 mass %.

[0023] (Fe: 1.00% by mass or less) Fe is contained in aluminum alloy sheets to obtain good rigidity and stress relaxation resistance. On the other hand, if the Fe content in the aluminum alloy sheet exceeds 1.00 mass%, the compounds may become coarse and the platability may be reduced. Therefore, the Fe content is set to 1.00 mass% or less (including 0 mass%). From the viewpoint of suppressing deterioration of plating ability, the Fe content is preferably 0.90% by mass or less, 0.80% by mass or less, 0.70% by mass or less, 0.60% by mass or less, or 0.50% by mass or less. From the viewpoint of obtaining good rigidity and stress relaxation resistance, the Fe content is preferably 0.01% by mass or more, 0.02% by mass or more, 0.05% by mass or more, 0.10% by mass or more, 0.15% by mass or more, 0.25% by mass or more, 0.30% by mass or more, 0.35% by mass or more, or 0.40% by mass or more.

[0024] (Mn: 1.4% by mass or less) Mn is contained in aluminum alloy sheets to obtain good rigidity and stress relaxation resistance. On the other hand, if the Mn content in the aluminum alloy sheet exceeds 1.4 mass%, the compounds may become coarse and the platability may be reduced. Therefore, the Mn content is set to 1.4 mass% or less (including 0 mass%). From the viewpoint of suppressing deterioration of plating ability, the Mn content is preferably 1.3 mass% or less, 1.2 mass% or less, 1.1 mass% or less, 1.0 mass% or less, 0.9 mass% or less, 0.8 mass% or less, 0.7 mass% or less, or 0.6 mass% or less. From the viewpoint of obtaining good rigidity and stress relaxation resistance, the Mn content is preferably 0.05 mass% or more, 0.1 mass% or more, 0.2 mass% or more, 0.3 mass% or more, 0.4 mass% or more, or 0.5 mass% or more.

[0025] (Ni: 3.5% by mass or less) Ni is contained in aluminum alloy sheets to obtain good rigidity and stress relaxation resistance. On the other hand, if the Ni content in the aluminum alloy sheet exceeds 3.5 mass%, the compounds may become coarse and the plating property may be deteriorated. Therefore, the Ni content is set to 3.5 mass% or less (including 0 mass%). From the viewpoint of suppressing deterioration of plating property, the Ni content is preferably 3.0 mass% or less, 2.5 mass% or less, 2.0 mass% or less, 1.5 mass% or less, 1.0 mass% or less, 0.9 mass% or less, 0.8 mass% or less, 0.7 mass% or less, 0.6 mass% or less, or 0.5 mass% or less. From the viewpoint of obtaining good rigidity and stress relaxation resistance, the Ni content is preferably 0.1 mass% or more, 0.2 mass% or more, 0.3 mass% or more, or 0.4 mass% or more.

[0026] (Cu: 1.0 mass% or less, Zn: 1.0 mass% or less) Cu and Zn are components that broaden the solid-liquid coexistence region and contribute to reducing the frequency of molten metal leakage during casting. They are also components that have the effect of uniformly precipitating zinc in zincate treatment, and also contribute to improving plating smoothness. On the other hand, excessive Cu or Zn may actually deteriorate the plating smoothness. Furthermore, the smoothness of the electroless Ni-P plating film formed on the surface may be reduced. Therefore, the aluminum alloy sheet for magnetic disks according to this embodiment preferably further contains at least one of Cu: 1.0% by mass or less and Zn: 1.0% by mass or less. From the viewpoint of suppressing deterioration of plating smoothness, the Cu content is preferably 1.0 mass% or less, 0.75 mass% or less, 0.50 mass% or less, 0.35 mass% or less, 0.25 mass% or less, 0.20 mass% or less, 0.10 mass% or less, or 0.05 mass% or less. Furthermore, Cu does not have to be contained, but if it is contained, from the viewpoint of reliably obtaining the effects of adding Cu, it is preferably 0.005 mass% or more. From the viewpoint of preventing a decrease in plating smoothness, the Zn content is preferably 1.0 mass% or less, 0.75 mass% or less, 0.50 mass% or less, 0.35 mass% or less, 0.25 mass% or less, 0.20 mass% or less, 0.10 mass% or less, or 0.05 mass% or less. Zn does not necessarily have to be contained, but if it is contained, it is preferably 0.005 mass% or more from the viewpoint of reliably obtaining the effects of adding Zn.

[0027] (balance: Al and impurities) The aluminum alloy sheet according to this embodiment may contain elements other than those mentioned above as impurities depending on the selection of the raw materials used for melting during ingot production. Specific examples of impurity elements include Ti, Zr, V, B, Na, K, Ca, Pb, P, Sn, Ag, Bi, In, Ge, Sr, and Cd. Among these, Ti, Zr, and V are restricted to 0.10% by mass or less, and B, Na, K, Ca, Pb, P, Sn, Ag, Bi, In, Ge, Sr, and Cd are restricted to 0.05% by mass or less. Within these ranges, these elements do not impair the effects of this embodiment, not only when they are contained as unavoidable impurities, but also when they are intentionally added, for example, by increasing the blending ratio of scrap containing these elements. When each element shown as an impurity element is inevitably contained (i.e., when it is an unavoidable impurity), it is preferable that the content of each element is 0.005 mass% or less, and the total content of each element is 0.015 mass% or less. Furthermore, when the chemical composition does not contain the above-mentioned Si, Fe, Mn, Ni, Cu, and Zn, the content of each of these as unavoidable impurities is preferably 0.005 mass % or less.

[0028] <Young's modulus: 70 GPa or more> Young's modulus is the ratio of stress to strain when a material behaves elastically, and in the present invention, it affects the generation of vibration when a thinned magnetic disk is rotated in an HDD. When the Young's modulus of an aluminum alloy plate is 70 GPa or more, it has high rigidity, and can reliably suppress vibration of the thinned magnetic disk. Therefore, the Young's modulus of the aluminum alloy plate for magnetic disks according to this embodiment is preferably 70 GPa or more. From the viewpoint of further suppressing vibration of the thinned magnetic disk, the higher the Young's modulus, the better. For example, the Young's modulus is preferably 71 GPa or more, more preferably 72 GPa or more, and even more preferably 73 GPa or more. The Young's modulus can be adjusted by adjusting the contents of Mg, Si, Fe, Mn, and Ni to the amounts described in this specification. The Young's modulus can be measured, for example, in accordance with JIS Z 2280:1993 (Testing method for high-temperature Young's modulus of metallic materials) by preparing a test piece measuring 60 mm x 10 mm x 1 mm in thickness, with the longitudinal direction parallel to the rolling direction, and using the test piece. Specifically, in accordance with the method specified in the JIS, the measurement can be performed by the free resonance method in an air atmosphere at room temperature (e.g., 25°C). The test apparatus used is preferably a JE-RT model manufactured by Nippon Technoplus Co., Ltd.

[0029] <Stress relaxation rate: 90% or less> The present inventors have conducted extensive research into deformation of aluminum alloy plates for magnetic disks during magnetic film sputtering and have found that deformation can be suppressed by improving stress relaxation resistance. If the stress relaxation rate is 90% or less, deformation can be suppressed even when stress caused by thermal distortion during magnetic film sputtering is applied to the substrate during thinning. Therefore, the stress relaxation rate of the aluminum alloy plate for magnetic disks according to this embodiment is preferably 90% or less. From the viewpoint of further suppressing deformation of the thinned substrate, the lower the stress relaxation rate, the better. For example, the stress relaxation rate is more preferably 85% or less, even more preferably 80% or less, and particularly preferably 75% or less. The lower limit of the stress relaxation rate is not particularly limited, but is, for example, 0% or more, 20% or more, 50% or more, 60% or more, or 70% or more. The stress relaxation rate can be adjusted by adjusting the contents of Fe, Mn, and Ni as described herein. In addition to the above contents of Fe, Mn, and Ni, the stress relaxation rate can also be adjusted by adjusting the treatment conditions in the homogenization heat treatment step to the ranges described below and adjusting the number density of intermetallic compounds having a maximum length of 0.05 μm or more and 0.33 μm or less to the ranges described below.

[0030] The stress relaxation rate can be measured as follows. A test piece 10 mm wide x 60 mm long is cut out so that the longitudinal direction is parallel to the rolling direction. Then, the span length (x) in Figure 1(a) is determined using the following equations (2) and (3) so that the bending stress in the following equation (1) is constant, and the following test is carried out. The specimen is placed in an atmospheric furnace with a bending stress applied (as shown in Figure 1(a)) and subjected to a heat treatment (300°C x 1 hour) simulating a magnetic film sputtering process. It is then removed from the furnace and the deformation amount a before the bending stress is removed is measured. The bending stress is then removed (as shown in Figure 1(b)) and the deformation amount b after the bending stress is removed is measured. The ratio of the deformation amount b after unloading the bending stress to the deformation amount a before unloading the bending stress (b / a × 100[%]) is defined as the stress relaxation rate.

[0031] σ=M / Z (1) σ: Bending stress [N / mm 2 ] M: Bending moment [N·mm] Z: Section modulus (Z [mm 3 ]=(w×t 2 ) / 6) w: Plate width [mm], t: Plate thickness [mm]

[0032] M = P × x (2) M: Bending moment [N·mm] P: Tip load [N] x: span length [mm]

[0033] P=(3×E×I×δ) / x 3 ···(3) P: Tip load [N] E: Young's modulus [N / mm 2] I: Moment of inertia (I [mm 4 ]=(w×t 3 ) / 12) w: Plate width [mm], t: Plate thickness [mm] δ: Deflection (2 [mm]) x: span length [mm]

[0034] <Number density of intermetallic compounds with a maximum length of 0.05 μm or more and 0.33 μm or less: 1.0 × 10 6 End> The greater the number density of intermetallic compounds in the aluminum alloy having a maximum length of 0.05 μm or more and 0.33 μm or less, the better the stress relaxation resistance properties that can be obtained. Intermetallic compounds having a maximum length of less than 0.05 μm or more than 0.33 μm do not have an effect on the stress relaxation resistance properties. The number density of intermetallic compounds having a maximum length of 0.05 μm or more and 0.33 μm or less on the surface of the aluminum alloy plate for magnetic disks according to this embodiment is 1.0×10 6 pieces / mm 2 More than 1.5 × 10 is preferable. 6 pieces / mm 2 More preferably, 2.0 x 10 6 pieces / mm 2 More preferably, 2.5 × 10 6 pieces / mm 2 More preferably, 3.0 x 10 6 pieces / mm 2 More than 3.5 × 10 is particularly preferable. 6 pieces / mm 2 The upper limit is not particularly limited, but for example, 1.0 × 10 8 pieces / mm 2 Below, 1.0 x 10 7 pieces / mm 2 The following is the result.

[0035] Examples of intermetallic compounds include Mg-Si intermetallic compounds, Al-Fe intermetallic compounds, Al-Mn intermetallic compounds, Al-Ni intermetallic compounds, Al-Fe-Mn intermetallic compounds, Al-Fe-Ni intermetallic compounds, Al-Mn-Ni intermetallic compounds, Al-Fe-Mn-Ni intermetallic compounds, Al-Cr intermetallic compounds, Al-Ti intermetallic compounds, and Al-Zr intermetallic compounds. Also included in this case are Al-Fe-Cr intermetallic compounds in which a portion of the above-mentioned Al-Fe intermetallic compounds is substituted, and Al-Mn-Cr intermetallic compounds in which a portion of the Al-Mn intermetallic compounds is substituted, etc. When Cu and Zn are contained in the amounts specified in the present invention, examples of the alloy include Al-Cu intermetallic compounds and Al-Zn intermetallic compounds.

[0036] The maximum length and number density of the intermetallic compounds can be measured as follows. The surface of the measurement sample was cut with a diamond cutting tool to create a mirror surface, and this surface was observed using an FE-SEM (JEOL Ltd. JSM-7001F, accelerating voltage 5 kV) at a magnification of 10,000x, with six fields of view and an observation area of ​​0.0006 mm. 2 The image is then photographed as a composite image, which is called a COMPO image. From the COMPO image, the matrix portion, i.e., the portion that appears whiter than the parent phase, is considered to be an intermetallic compound, and their maximum length is measured using particle analysis software ImageJ (ver. 1.53q). The maximum length of an intermetallic compound refers to the maximum distance between any two points on the outline of an intermetallic compound particle. The number of intermetallic compounds between 0.05 μm and 0.33 μm in size is then counted using the particle analysis software, and the number density per unit area is calculated.

[0037] [Method of manufacturing aluminum alloy sheets for magnetic disks] Next, an example of a method for manufacturing an aluminum alloy plate for a magnetic disk according to this embodiment will be described. The alloy sheet according to this embodiment can be manufactured using manufacturing methods and equipment under conditions generally used for manufacturing aluminum alloy sheets for magnetic disks, with the exception of some conditions in the homogenization heat treatment and hot rolling processes. For example, the aluminum alloy sheet can be manufactured using a manufacturing method including, in this order, a casting process in which raw materials are melted and the resulting molten aluminum alloy, adjusted to a predetermined chemical composition, is cast into an aluminum alloy ingot by semi-continuous casting or the like; a homogenization heat treatment process in which the cast aluminum alloy ingot is chamfered and subjected to homogenization heat treatment; a hot rolling process in which the homogenized heat-treated aluminum alloy ingot is hot-rolled to obtain a hot-rolled sheet; and a cold rolling process in which the hot-rolled sheet is cold-rolled. If necessary, intermediate annealing may be performed before or during the cold rolling process. Each step will be described in detail below.

[0038] (Casting process) In the casting step, the raw materials are melted at 700 to 800° C. to produce a molten aluminum alloy, which is then preferably cast into an aluminum alloy ingot at 700 to 800° C. by a known semi-continuous casting method such as DC casting.

[0039] (Homogenization heat treatment process) In the homogenization heat treatment step, the cast aluminum alloy ingot is subjected to surface grinding and then subjected to homogenization heat treatment. The amount of surface grinding can be, for example, 2 to 40 mm per side. The homogenization heat treatment is preferably carried out by holding the aluminum alloy sheet at a temperature of 400 to 600° C. for 4 to 50 hours, from the viewpoint of adjusting the stress relaxation rate of the aluminum alloy sheet to 90% or less. Specifically, by performing the homogenization heat treatment at a temperature of 400°C or higher and for a time of 4 hours or longer, the formation of intermetallic compounds having a size of 0.05 μm to 0.33 μm among the intermetallic compounds in the aluminum alloy formed during the homogenization treatment is promoted, thereby obtaining good stress relaxation resistance properties and enabling sufficient homogenization of the structure, thereby reducing the variation in stress relaxation resistance properties of the resulting aluminum alloy sheet. The homogenization heat treatment temperature is preferably 420°C or higher, 440°C or higher, 450°C or higher, 460°C or higher, 480°C or higher, 500°C or higher, or 520°C or higher. On the other hand, by performing the homogenization heat treatment at a temperature of 600°C or lower, melting of the surface of the aluminum alloy ingot can be prevented. The homogenization heat treatment temperature is more preferably 580°C or lower, and even more preferably 540°C or lower. Although there is no upper limit to the duration of the homogenization heat treatment, from the viewpoint of economic efficiency in the manufacturing process, it is preferably 48 hours or less, more preferably 30 hours or less, even more preferably 24 hours or less, and particularly preferably 18 hours or less. From the viewpoint of promoting the formation of intermetallic compounds, the lower limit of the duration of the homogenization heat treatment is preferably 6 hours or more, more preferably 8 hours or more, and even more preferably 10 hours or more.

[0040] (Hot rolling process) In the hot rolling step, the aluminum alloy ingot that has been subjected to the homogenization heat treatment is hot rolled to obtain a hot rolled sheet. The starting temperature of the hot rolling is preferably 490°C or higher from the viewpoint of adjusting the stress relaxation rate of the aluminum alloy sheet to 90% or less, and the finishing temperature of the hot rolling is preferably 300 to 350°C. Specifically, by setting the starting temperature of hot rolling to 480°C or higher, the rolling load during hot rolling can be reduced, and an increase in the number of hot rolling passes can be suppressed. The starting temperature of hot rolling is more preferably 490°C or higher, and even more preferably 500°C or higher. On the other hand, from the viewpoint of suppressing cracking during hot rolling, the starting temperature of hot rolling is preferably 550°C or lower, and more preferably 520°C or lower. Furthermore, the thickness of the hot-rolled sheet obtained by hot rolling can be set to, for example, 3 mm or less.

[0041] (Cold rolling process) In the cold rolling step, the obtained hot-rolled sheet is cold-rolled to obtain a cold-rolled sheet. The thickness of the cold-rolled sheet is, for example, preferably 0.3 to 1.3 mm, and more preferably 0.70 mm or less, 0.69 mm or less, 0.65 mm or less, 0.60 mm or less, 0.55 mm or less, 0.50 mm or less, 0.45 mm or less, 0.40 mm or less, or 0.35 mm or less. By undergoing these steps in order, the aluminum alloy plate according to this embodiment can be obtained.

[0042] [Aluminum alloy blanks for magnetic disks] The aluminum alloy blank for a magnetic disk according to this embodiment is obtained from the aluminum alloy plate for a magnetic disk. Specifically, the blank can be manufactured by further undergoing, in this order, a punching step in which the aluminum alloy plate obtained after the cold rolling step is punched into a circular shape, and a correction annealing step in which the circular substrate obtained in the punching step is subjected to correction annealing, for example, by annealing while applying a load to flatten it. The chemical composition of the resulting blank will not change from the aluminum alloy plate described above and will have the same composition. Furthermore, the respective property values ​​of the blank, such as Young's modulus, stress relaxation rate, and number density of intermetallic compounds, are equivalent to the respective property values ​​of the aluminum alloy sheet. Therefore, the property values ​​determined for the aluminum alloy sheet can be regarded as the property values ​​of the blank. Conversely, the property values ​​determined for the blank can also be regarded as the property values ​​of the aluminum alloy sheet.

[0043] (Punching process) In the punching process, the aluminum alloy plate is tempered as necessary, and then punched into a ring shape so that it can be used for, for example, a substrate for a 3.5-inch HDD with an inner diameter of 24 mm and an outer diameter of 96 mm, or a substrate for a 2.5-inch HDD with an inner diameter of 19 mm and an outer diameter of 66 mm.

[0044] (Straightening annealing process) In the correction annealing step, the annular substrates are preferably stacked, sandwiched between spacers having high flatness, and annealed while applying a load to the substrates to flatten them. The annealing temperature is 250 to 500°C, and the holding time can be, for example, about 3 to 5 hours. The temperature rising rate in the corrective annealing can be, for example, about 80°C / hour on average, and is preferably 1000°C / hour or less at the fastest. The temperature can be lowered (cooled) by, for example, opening the door of the annealing furnace.

[0045] Regarding the temperature rise in the corrective annealing, even if the temperature is raised stepwise, the effect of this embodiment is not impaired. For example, as described in paragraphs 0068 and 0069 of Japanese Patent No. 5815153, the temperature may be raised at a plurality of temperature rise rates, i.e., stepwise, so that the temperature rise rate in a specific temperature range is a predetermined rate or a predetermined rate or more, and the temperature rise rate outside the specific temperature range is a different rate. In this embodiment, the annealing temperature for the corrective annealing is assumed to be in the practical temperature range of 250 to 400° C., within the above-mentioned range of general annealing temperatures. By going through these steps in order, the blank according to this embodiment can be obtained.

[0046] [Aluminum alloy substrates for magnetic disks] The aluminum alloy substrate for magnetic disk according to this embodiment is obtained from the aluminum alloy blank for magnetic disk. Specifically, the substrate can be manufactured by carrying out a cutting process (end surface processing) to cut the end faces of the blank and a grinding process (mirror finish) to grind the surface (main surface) of the blank. The chemical composition of the resulting substrate will not change from the blank described above and will have the same composition. Furthermore, the characteristic values ​​of the substrate, such as Young's modulus, stress relaxation rate, and number density of intermetallic compounds, are equivalent to the characteristic values ​​of the blank. Therefore, the characteristic values ​​determined for the aluminum alloy sheet or the blank can be regarded as the characteristic values ​​of the substrate. Conversely, the characteristic values ​​determined for the substrate can also be regarded as the characteristic values ​​of the aluminum alloy sheet or the blank.

[0047] The aluminum alloy plate, blank, and substrate according to this embodiment can be obtained by the above-mentioned methods, but other processes may be performed between or before or after each process, as long as they do not adversely affect each process.

[0048] [Magnetic disk manufacturing method] The magnetic disk can be manufactured using manufacturing methods and equipment generally used for manufacturing magnetic disks. For example, the surface of a substrate is acid-etched to form an electroless Ni-P plating film, and the surface of the electroless Ni-P plating film is then polished. Next, an underlayer, a magnetic layer, a protective film, and other layers are formed on the surface of the substrate, thereby manufacturing the magnetic disk. [Example]

[0049] The present invention will be specifically described below with reference to examples of the present invention, but the technical scope of the present invention is not limited thereto.

[0050] (Preparation of test materials) The test materials Nos. 1 to 3 were manufactured using aluminum alloys having the chemical compositions shown in Table 1 under the following conditions.

[0051] First, slabs were produced by DC casting using a mold with the same thickness as the ingot (500 mm for Nos. 1 and 2, and 535 mm for No. 3). Both sides of the resulting slabs (thickness direction) were then chamfered by 16 mm. They were then subjected to a homogenization heat treatment at 535°C for 8 hours. Nos. 1 and 3 were then hot-rolled (starting temperature: approximately 500°C, finishing temperature: approximately 330°C) to a thickness of 2.3 mm, and No. 2 to a thickness of 2.0 mm. No. 1 was then cold-rolled to a thickness of 0.55 mm, and Nos. 2 and 3 to a thickness of 0.52 mm. The blanks were then punched out to approximately 98mm diameter using a press, then sandwiched between spacers and subjected to corrective annealing (heating to 200-280°C at a rate of 50°C / h or more, followed by holding at 300-400°C for no more than 7 hours) to produce blanks (O-tempered material) of the respective thicknesses.

[0052] For each of the produced test materials, the number density, Young's modulus, and stress relaxation rate of the intermetallic compounds having a maximum length of 0.05 μm or more and 0.33 μm or less were evaluated as follows.

[0053] (Number density of intermetallic compounds with a maximum length of 0.05 μm or more and 0.33 μm or less) The surface of the test material was cut with a diamond cutting tool to create a mirror finish, and this surface was observed using an FE-SEM (JEOL Ltd. JSM-7001F, accelerating voltage 5 kV) at 10,000x magnification, with 6 fields of view and an observation area of ​​0.0006 mm 2 The image was photographed as a COMPO image, and a composition image called a COMPO image was obtained. From the COMPO image, the matrix portion, i.e., the portion appearing whiter than the parent phase, was considered to be an intermetallic compound, and their maximum length was measured using particle analysis software ImageJ (ver. 1.53q). The number of intermetallic compounds with a size of 0.05 μm or more and 0.33 μm or less was then counted using the particle analysis software, and the number density per unit area was calculated.

[0054] (Young's modulus) Young's modulus was measured in accordance with JIS Z 2280:1993 (Testing method for high-temperature Young's modulus of metallic materials). Test pieces measuring 60 mm x 10 mm x thickness mm were cut out from the test material, with the longitudinal direction parallel to the rolling direction. The thickness of test piece No. 1 was 0.55 mm, and Nos. 2 and 3 were 0.52 mm. The measurements were carried out using a test device, model JE-RT, manufactured by Nippon Technoplus Co., Ltd., in an air atmosphere at room temperature (25°C) by the free resonance method. Those with a Young's modulus of 70 GPa or more were evaluated as "○", and those with a Young's modulus of less than 70 GPa were evaluated as "×". ○ indicates pass, and × indicates fail.

[0055] (Stress relaxation rate) Test pieces measuring 10 mm wide and 60 mm long were cut out from the test material so that the longitudinal direction was parallel to the rolling direction. The span length (x) in Figure 1(a) was determined for each test material using the following equations (2) and (3) so that the bending stress in the following equation (1) would be constant, and the following test was carried out. The specimen was placed in an atmospheric furnace with a bending stress applied (as shown in Figure 1(a)), and subjected to a heat treatment (300°C x 1 hour) simulating a magnetic film sputtering process. After that, it was removed from the furnace, and the deformation amount a before the bending stress was removed was measured. After that, the bending stress was removed (as shown in Figure 1(b)), and the deformation amount b after the bending stress was removed was measured. The ratio of the deformation amount b after unloading the bending stress to the deformation amount a before unloading the bending stress (b / a × 100[%]) was taken as the stress relaxation rate, and samples with a stress relaxation rate of 90% or less were evaluated as "Good" indicating excellent deformation suppression during magnetic film sputtering, while samples with a stress relaxation rate of more than 90% were evaluated as "Poor" indicating poor deformation suppression during magnetic film sputtering.

[0056] σ=M / Z (1) σ: Bending stress [N / mm 2 ] M: Bending moment [N·mm] Z: Section modulus (Z [mm 3 ]=(w×t 2 ) / 6) w: Plate width [mm], t: Plate thickness [mm]

[0057] M = P × x (2) M: Bending moment [N·mm] P: Tip load [N] x: span length [mm]

[0058] P=(3×E×I×δ) / x 3 ···(3) P: Tip load [N] E: Young's modulus [N / mm 2 ] I: Moment of inertia (I [mm 4 ]=(w×t 3 ) / 12) w: Plate width [mm], t: Plate thickness [mm] δ: Deflection (2 [mm]) x: span length [mm]

[0059] The evaluation results of the alloy composition (chemical composition), number density of intermetallic compounds, Young's modulus, and stress relaxation rate for each test material are shown in Table 1. Note that underlines in the table indicate that the specific features of the present invention are not met.

[0060] [Table 1]

[0061] As is clear from the results in Table 1, Nos. 1 and 2, which satisfy the specifications of the present invention, have good rigidity, excellent stress relaxation resistance, and are capable of suppressing thermal deformation during magnetic film sputtering. On the other hand, No. 3, in which the total of Fe, Mn and Ni did not satisfy the requirements of the present invention, was inferior to Nos. 1 and 2 in rigidity and stress relaxation resistance.

Claims

1. Mg: 0.1 to 7.0% by mass, Cr: 0.005 to 1.0% by mass, Be: 3 to 100 mass ppm; Si: 0.20% by mass or less, the total content of at least one of Fe, Mn, and Ni: 0.05 to 5.9 mass%; The balance of the aluminum alloy plate for magnetic disks is aluminum and impurities.

2. Fe: 0 to 1.00 mass%, Mn: 0 to 1.4 mass%, and 2. The aluminum alloy plate for magnetic disks according to claim 1, further comprising at least one of the following: Ni: 0 to 3.5 mass %.

3. 3. The aluminum alloy plate for magnetic disks according to claim 1, further comprising at least one of Cu: 1.0% by mass or less and Zn: 1.0% by mass or less.

4. The number density of intermetallic compounds on the surface having a maximum length of 0.05 μm or more and 0.33 μm or less is 1.0×10 6 pieces / mm 2 3. The aluminum alloy sheet for magnetic disks according to claim 1 or 2.

5. 3. The aluminum alloy sheet for magnetic disks according to claim 1, wherein the Young's modulus is 70 GPa or more.

6. 3. The aluminum alloy sheet for magnetic disks according to claim 1, wherein the stress relaxation rate is 90% or less.

7. An aluminum alloy blank for magnetic disks obtained from the aluminum alloy plate for magnetic disks according to claim 1 or 2.

8. An aluminum alloy substrate for a magnetic disk obtained from the aluminum alloy blank for a magnetic disk according to claim 7.

Citation Information

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