Door opening detection sensor

Abstract

To provide a door opening detection sensor capable of enhancing detection accuracy of an opening history of a door.SOLUTION: The door opening detection sensor detects opening of a door that can be opened and closed with respect to an object to be moved. The open-door detection sensor includes a base material attached across the object to be moved and the door, an antenna for wireless communication provided on the base material, an IC chip electrically connected to the antenna, a detection wiring formed on a first main surface of the base material and electrically connected to the IC chip, an adhesive layer for attaching a second main surface opposite to the first main surface of the base material to the door and the object to be moved, a peeling layer for weakening an adhesive strength between the second main surface of the base material and the adhesive layer, a connection wiring formed on the second main surface of the base material, and a conduction portion provided in an interlayer connection portion penetrating the base material from the first main surface to the second main surface and electrically connecting the detection wiring and the connection wiring. At least a part of the peeling layer is formed between the second main surface of the base material and the connection wiring.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a door opening detection sensor. [Background technology]

[0002] A system has been proposed that uses an RFID tag to detect the open / closed state of a door (see, for example, Patent Document 1). This system includes an RFID tag installed on the side edge surface of the door and a reader that can communicate with the RFID tag. This system can determine whether the door is open or closed based on whether the reader can communicate with the RFID tag. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2017-218766 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in this system, the accuracy of detecting the door opening history can be low.

[0005] An object of one aspect of the present invention is to provide a door-opening detection sensor that can improve the accuracy of detecting the door opening history. [Means for solving the problem]

[0006] One aspect of the present invention provides a door-opening detection sensor that detects the opening of a door that can be opened and closed relative to an object to be operated, the door-opening detection sensor comprising: a substrate attached across the object to be operated and the door; an antenna for wireless communication provided on the substrate; an IC chip electrically connected to the antenna; detection wiring formed on a first main surface of the substrate and electrically connected to the IC chip; an adhesive layer that attaches a second main surface of the substrate opposite the first main surface to the door and the object to be operated; a peel-off layer that weakens the adhesive strength between the second main surface of the substrate and the adhesive layer; connection wiring formed on the second main surface of the substrate; and a conductive portion provided in an interlayer connection portion that penetrates the substrate from the first main surface to the second main surface, which provides electrical conductivity between the detection wiring and the connection wiring, wherein at least a portion of the peel-off layer is formed between the second main surface of the substrate and the connection wiring.

[0007] It is preferable that a plurality of the release layers are formed, and the release layers are formed at intervals in the longitudinal direction of the connection wiring. [Effects of the Invention]

[0008] According to one aspect of the present invention, it is possible to provide a door-opening detection sensor that can improve the accuracy of detecting the door opening history. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 2 is a plan view of one surface of the door opening detection sensor according to the embodiment. [Figure 2] 10 is a plan view of the other surface of the door opening detection sensor according to the embodiment. FIG. [Figure 3] 1 is a schematic cross-sectional view of a door opening detection sensor according to an embodiment. [Figure 4] 1 is a schematic diagram showing an installation state of a door-opening detection sensor according to an embodiment. FIG. [Figure 5] FIG. 2 is a cross-sectional view showing an installation state of the door-opening detection sensor according to the embodiment. [Figure 6] 5A and 5B are schematic diagrams illustrating the operation of the door open detection sensor according to the embodiment. [Figure 7] 5A and 5B are cross-sectional views showing the operation of the door open detection sensor according to the embodiment. [Figure 8] 5A and 5B are cross-sectional views showing the operation of the door open detection sensor according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, the door open detection sensor of the embodiment will be specifically described with reference to the drawings.

[0011] [Door open detection sensor] Fig. 1 is a plan view of one side of the door-opening detection sensor 100 according to the embodiment. Fig. 2 is a plan view of the other side of the door-opening detection sensor 100. Fig. 3 is a schematic cross-sectional view of the door-opening detection sensor 100. In Fig. 2, adhesive layers 5 and 6 are not shown. Fig. 3 is a cross-sectional view taken along line II shown in Fig. 1.

[0012] 1, the door-opening detection sensor 100 includes a substrate 1, an antenna 2, an IC chip 3, detection wiring 34, 36, adhesive layers 5, 6 (see FIG. 3), a cover member 7, a peeling layer 8, a connection wiring 33, and conductive portions 38, 39. The door-opening detection sensor 100 is an RFID (Radio Frequency Identification) tag.

[0013] The left-right direction in Fig. 1 is the X direction. One side of the X direction (the right side in Fig. 1) is the +X side. The direction opposite the +X side is the -X side. The up-down direction in Fig. 1 is the Y direction. The Y direction is perpendicular to the X direction. One side of the Y direction (the top side in Fig. 1) is the +Y side. The direction opposite the +Y side is the -Y side. The Z direction is perpendicular to the X and Y directions. One side of the Z direction is the +Z side. The direction opposite the +Z side is the -Z side. Viewing from the Z direction is called planar view.

[0014] The substrate 1 includes a first substrate portion 11 and a second substrate portion 12 . The first substrate portion 11 is formed in a rectangular shape in a plan view. The first main surface 11a is the surface on the +Z side of the first substrate portion 11. The second main surface 11b is the surface on the -Z side of the first substrate portion 11 (see FIG. 3). The second main surface 11b is the surface opposite to the first main surface 11a.

[0015] The second substrate portion 12 is formed in a rectangular shape in a plan view. The first main surface 12a is the +Z side surface of the second substrate portion 12. The second main surface 12b is the -Z side surface of the second substrate portion 12 (see FIG. 3). The second main surface 12b is the surface opposite to the first main surface 12a.

[0016] The first substrate portion 11 and the second substrate portion 12 are integrally formed. The first substrate portion 11 extends to the +X side from the center in the length direction (Y direction) of the second substrate portion 12. The substrate 1 is T-shaped in plan view.

[0017] 5, the first substrate portion 11 is attached to the first main surface 101c of the door 101 by a first adhesive layer 5 (adhesive layer). The first adhesive layer 5 is formed, for example, in an area including the end (first end 11c) on the +X side of the first substrate portion 11. The first attachment portion 13 (attachment portion) is an area of ​​the first substrate portion 11 that is attached to the door 101 by the first adhesive layer 5. The first attachment portion 13 is, for example, a partial area including the first end 11c of the first substrate portion 11.

[0018] The second substrate portion 12 is attached to the first main surface 102c of the object to be moved 102 by a second adhesive layer 6 (adhesive layer). The second adhesive layer 6 is formed, for example, over the entire area of ​​the second substrate portion 12. The second adhesive portion 14 (adhesive portion) is the area of ​​the second substrate portion 12 that is attached to the object to be moved 102 by the second adhesive layer 6. The second adhesive portion 14 is, for example, the entire area of ​​the second substrate portion 12.

[0019] The substrate 1 (i.e., the first substrate portion 11 and the second substrate portion 12) is, for example, a resin substrate, a paper substrate, etc. Materials for the resin substrate include polyester resins such as polyethylene terephthalate (PET), polyolefin resins, polyethylene fluoride resins, polyamide resins, vinyl polymers, acrylic resins, polystyrene, polycarbonate, etc.

[0020] The substrate 1 (at least the first substrate portion 11) is preferably flexible. The substrate 1 (at least the first substrate portion 11) is preferably flexurally elastic.

[0021] 1, the antenna 2 is capable of wireless communication (contactless communication) with the outside. The antenna 2 is an antenna for wireless communication. The antenna 2 has two radiating portions 21 and 22. The antenna 2 is formed on the first main surface 12a of the second base portion 12.

[0022] The two radiating portions 21, 22 extend in directions away from each other along the longitudinal direction (Y direction) of the second base material portion 12. The two radiating portions 21, 22 are located symmetrically with respect to the center of the longitudinal direction of the second base material portion 12. The radiating portions 21, 22 gradually become wider in the extending direction (direction away from each other).

[0023] The antenna 2 can be formed from, for example, a conductive ink such as a polymer-type conductive ink or a silver ink composition. The antenna 2 may also be formed from, for example, a metal foil, a metal thin film formed by plating or the like, a metal thin film formed by metal vapor deposition or the like, a metal plate, or the like.

[0024] The IC chip 3 is not particularly limited as long as it is capable of writing and reading information contactlessly via the antenna 2. Examples of the IC chip 3 include a contactless IC tag, a contactless IC label, and a contactless IC card. The IC chip 3 is mounted on the first main surface 12a of the second substrate portion 12. The IC chip 3 is electrically connected to the antenna 2.

[0025] The detection wirings 34 and 36 include a first detection wiring 34 and a second detection wiring 36. The first detection wiring 34 and the second detection wiring 36 are formed on the first main surfaces 11a, 12a of the first base material portion 11 and the second base material portion 12. One ends of the detection wirings 34, 36 are electrically connected to the IC chip 3.

[0026] The first detection wiring 34 has a first extending portion 34a, a second extending portion 34b, and a third extending portion 34c. The first extending portion 34a extends from the IC chip 3 toward the +X side and reaches the first base member 11. The second extending portion 34b extends from the tip of the first extending portion 34a toward the +Y side. The third extending portion 34c extends from the tip of the second extending portion 34b toward the +X side.

[0027] The second detection wiring 36 has a first extending portion 36a, a second extending portion 36b, and a third extending portion 36c. The first extending portion 36a extends from the IC chip 3 toward the +X side to reach the first base member 11. The second extending portion 36b extends from the tip of the first extending portion 36a toward the -Y side. The third extending portion 36c extends from the tip of the second extending portion 36b toward the +X side.

[0028] The first extending portion 34a of the first detection wiring 34 and the first extending portion 36a of the second detection wiring 36 are arranged in parallel. The first detection wiring 34 and the second detection wiring 36 are formed at an interval from each other in the Y direction.

[0029] The conductive portions 38, 39 include a first conductive portion 38 and a second conductive portion 39. The conductive portions 38, 39 are formed on the first base material portion 11. The first conductive portion 38 and the second conductive portion 39 are formed apart in the Y direction. The first conductive portion 38 is electrically connected to the tip of the third extending portion 34c. The second conductive portion 39 is electrically connected to the tip of the third extending portion 36c.

[0030] The first conductive portion 38 is formed in the first interlayer connection portion 35. The second conductive portion 39 is formed in the second interlayer connection portion 37. The first interlayer connection portion 35 and the second interlayer connection portion 37 are formed to penetrate the first base material 11 from the first main surface 11a to the second main surface 11b of the first base material 11 (see FIG. 3). The first interlayer connection portion 35 and the second interlayer connection portion 37 are, for example, through holes.

[0031] The first conductive portion 38 electrically connects the first detection wiring 34 to the connection wiring 33. The second conductive portion 39 electrically connects the second detection wiring 36 to the connection wiring 33.

[0032] As shown in FIG. 3, the connection wiring 33 is formed on the second main surface 11b of the first base material 11. The connection wiring 33 is provided between the first base material 11 and the first adhesive layer 5. As shown in FIG. 2, the connection wiring 33 is formed linearly along the Y direction. The connection wiring 33 is electrically connected to the first conductive portion 38 and the second conductive portion 39. The connection wiring 33 electrically connects the first conductive portion 38 and the second conductive portion 39.

[0033] 1, the portions including the tip ends (ends on the +X side) of the detection wirings 34, 36, the conductive portions 38, 39, and the connection wiring 33 are formed on the first adhesive part 13. The portions including the base ends (ends on the -X side) of the detection wirings 34, 36 are formed on the second adhesive part 14. Therefore, the detection wirings 34, 36 are formed across the first adhesive part 13 and the second adhesive part 14.

[0034] The detection wirings 34, 36, the conductive portions 38, 39, and the connection wiring 33 are formed of a conductive material. Examples of conductive materials include metals and conductive inks. Examples of metals include copper. Examples of conductive inks include polymer-type conductive inks and silver ink compositions. The detection wirings 34, 36 and the connection wiring 33 can be formed by, for example, printing. The detection wirings 34, 36 and the connection wiring 33 may be formed by, for example, metal foil, a metal thin film formed by plating, or a metal thin film formed by metal vapor deposition, or the like.

[0035] As shown in FIG. 3, the release layer 8 is formed on the second main surface 11b of the first base member 11. The release layer 8 is interposed between two contact bodies to reduce the frictional force therebetween. The release layer 8 is formed between the second main surface 11b of the first base member 11 and the first adhesive layer 5 to weaken the adhesive strength (peel strength) between the second main surface 11b of the first base member 11 and the first adhesive layer 5. The release layer 8 is formed from a silicone material (e.g., silicone resin), fluororesin, wax, liquid paraffin, oils and fats, fatty acid esters, or the like. One or more of these materials can be used as the material for the release layer 8.

[0036] As shown in FIG. 2, the release layer 8 is formed, for example, in a strip shape along the X direction. In this embodiment, a plurality of release layers 8 are formed. The plurality of release layers 8 are formed at intervals in the Y direction. The plurality of release layers 8 are arranged in parallel. The release layer 8 is formed across the connection wiring 33 in a plan view. The release layer 8 is formed along a direction intersecting with the connection wiring 33.

[0037] The central portion of the release layer 8 in the longitudinal direction overlaps with the connection wiring 33 in a plan view. The central portion of the release layer 8 (the portion overlapping with the connection wiring 33) is interposed between the second main surface 11b of the first base member 11 and the connection wiring 33. The central portion of the release layer 8 is the intermediate position in the longitudinal direction of the release layer 8. The intermediate position is the position between one end and the other end in the longitudinal direction.

[0038] As shown in FIG. 3, the adhesive layers 5 and 6 are formed on the second main surfaces 11b and 12b of the base material 1. The first adhesive layer 5 is the portion of the adhesive layer 5 and 6 formed on the second main surface 11b of the first base material portion 11. The second adhesive layer 6 is the portion of the adhesive layer 5 and 6 formed on the second main surface 12b of the second base material portion 12. The adhesive layers 5 and 6 attach the second main surfaces 11b and 12b of the base material 1 to the door 101 and the operated object 102. The adhesive layers 5 and 6 are formed of, for example, a known adhesive. The door opening detection sensor 100 has the adhesive layers 5 and 6, so it can be attached to the surfaces of the operated object 102 and the door 101.

[0039] The adhesive strength (peel strength) of the first adhesive layer 5 to the door 101 may be stronger than, equal to, or weaker than the adhesive strength (peel strength) of the first adhesive layer 5 to the first base material portion 11.

[0040] The cover member 7 is laminated on the first main surfaces 11a, 12a of the base material 1 (see FIG. 3). The cover member 7 has the same shape as the base material 1. The cover member 7 covers the antenna 2, the IC chip 3, the detection wirings 34, 36, and the conductive portions 38, 39. The cover member 7 is made of, for example, resin, paper, or the like. It is desirable that the cover member 7 be flexible.

[0041] Fig. 4 is a schematic diagram showing an installation state of the door-opening detection sensor 100. Fig. 5 is a cross-sectional view showing an installation state of the door-opening detection sensor 100. As shown in FIGS. 4 and 5, the door 101 (first door) is formed in a plate shape. The door 101 is openable and closable relative to the moved object 102. The door 101 is rotatable, for example, about a rotation axis provided at the second side end (the side end opposite to the first side end 101a). When the door 101 is closed relative to the moved object 102, the end surface 101b of the first side end 101a of the door 101 faces the end surface 102b of the first side end 102a of the moved object 102. The first main surface 101c (main surface) is one surface (the surface on the +Z side) of the door 101. The constituent material of the door 101 may be a non-metallic material (wood, resin, etc.) or a metal.

[0042] The moved object 102 is formed, for example, in a plate shape. The moved object 102 may be a door (second door) that can be opened and closed relative to the door 101. When the moved object 102 is a door, the moved object 102 is rotatable, for example, around a rotation axis provided at a second side edge (the side edge opposite to the first side edge 102a). The moved object 102 may be a door frame that surrounds the door 101. The moved object 102 may be a wall that constitutes a building. The first main surface 102c is one surface (the surface on the +Z side) of the moved object 102. When the door 101 is closed relative to the moved object 102, the first main surface 102c of the moved object 102 is flush with, for example, the first main surface 101c of the door 101. The constituent material of the moved object 102 may be a non-metallic material (wood, resin, etc.) or a metal.

[0043] The "main surface" refers to the widest surface of the plate-like body, specifically the front surface and back surface of the plate-like body. The end surface refers to the surface formed on the edge of the plate-like body, and is usually a surface perpendicular to the main surface.

[0044] The door 101 is opened by rotating it relative to the operated body 102. The door 101 is opened by rotating either the door 101 or the operated body 102, or both. To open the door 101, for example, only the door 101 may be rotated, or only the operated body 102 may be rotated, or both the door 101 and the operated body 102 may be rotated.

[0045] The door-open detection sensor 100 is installed across the operated object 102 and the door 101. The base material 1 is attached across the operated object 102 and the door 101. In other words, the base material 1 is provided from one side of the operated object 102 to the other side of the door 101.

[0046] If the door 101 is made of metal, a non-metallic spacer (not shown) may be provided between the adhesive layer 5 and the door 101 in order to ensure communication performance by keeping the door-opening detection sensor 100 a certain distance away from the door 101. Similarly, if the operated object 102 is made of metal, a non-metallic spacer (not shown) may be provided between the adhesive layer 6 and the operated object 102 in order to ensure communication performance by keeping the door-opening detection sensor 100 a certain distance away from the operated object 102. The spacer may be formed of, for example, a non-conductive resin.

[0047] [Door open detection sensor operation] The operation of the door-open detection sensor 100 will be described with reference to Figs. 4 to 8. In Figs. 4 and 5, the door 101 is in a state where it is closed relative to the object to be moved 102. The first base material portion 11 (first adhesive portion 13) is attached to the first main surface 101c of the door 101 by an adhesive layer 5. The second base material portion 12 (second adhesive portion 14) is attached to the first main surface 102c of the object to be moved 102 by an adhesive layer 6. In the state shown in Figs. 4 and 5, the detection wirings 34, 36, the conductive portions 38, 39, and the connection wiring 33 are electrically connected, and therefore are in a state of sufficient conductivity (high conductivity state).

[0048] 6 and 7, the door 101 is opened by rotating the operated object 102 in the +Z direction relative to the door 101. The rotation of the operated object 102 (opening operation of the door 101) separates the first adhesive portion 13 and the second adhesive portion 14. "The first adhesive portion 13 and the second adhesive portion 14 separate" means that at least one of the first adhesive portion 13 and the second adhesive portion 14 moves in a direction away from the other from a state in which the first adhesive portion 13 and the second adhesive portion 14 are attached to the door 101 and the operated object 102, respectively.

[0049] As shown in Fig. 7, as the operated object 102 moves, the first substrate portion 11 moves in a direction away from the door 101. The peel layer 8 weakens the adhesive strength between the first substrate portion 11 and the first adhesive layer 5, so the first substrate portion 11 (first attachment portion 13) in the portion including the peel layer 8 peels off from the first adhesive layer 5. In Fig. 7, the first adhesive layer 5 has peeled off from the first main surface 101c except for a portion that has peeled off from the first substrate portion 11.

[0050] A portion of the release layer 8 is formed between the first base member 11 and the connection wiring 33 (see FIG. 5). Therefore, in the release layer 8, at least a portion of the connection wiring 33 is peeled off from the first base member 11 together with the first adhesive layer 5. As a result, the connection wiring 33 is separated from the conductive portions 38, 39, and the connection wiring 33 and the conductive portions 38, 39 enter a low conductivity state (e.g., a non-conductive state). The "low conductivity state" is a state in which the conductivity is lower (i.e., a state in which the electrical resistance is higher) than in the normal state (see FIGS. 4 and 5).

[0051] 8, in this embodiment, as the moved body 102 further rotates, the first adhesive layer 5 peels off from the door 101 while the connection wiring 33 remains separated from the conductive portions 38 and 39. The peeled area of ​​the first adhesive layer 5 (the area peeled off from the first base material portion 11) becomes wider than in the state of FIG. 7. Note that the portion of the first adhesive layer 5 attached to the door 101 may be separated from the other portions while remaining attached to the door 101.

[0052] Because the first substrate portion 11 is flexible, the first substrate portion 11 that has peeled off from the door 101 is likely to bend. Therefore, even when the operated object 102 and the door 101 are closed, the first substrate portion 11 is unlikely to return to the same configuration as the installed state (see FIGS. 4 and 5 ) (a configuration in which the entire area of ​​the first attachment portion 13 is in contact with the first adhesive layer 5). Therefore, reconnection between the connection wiring 33 and the conductive portions 38, 39 is unlikely to occur (i.e., it is unlikely to return to a high conductivity state). In this way, the first substrate portion 11 has a structure (reconnection prevention structure) that makes it unlikely for reconnection between the connection wiring 33 and the conductive portions 38, 39 to occur after they have entered a low conductivity state. Therefore, it can be said that the connection wiring 33 and the conductive portions 38, 39 irreversibly enter a low conductivity state.

[0053] When the connection wiring 33 and the conductive parts 38, 39 are in a low conductivity state, the electrical resistance between the connection wiring 33 and the conductive parts 38, 39 increases. This allows the door-open detection sensor 100 to detect the opening history of the door 101. The door-open detection sensor 100 can transmit the detection result to an external device (e.g., a reader / writer) by wireless communication via the antenna 2. For example, the antenna 2 can transmit flag information based on the comparison result between the electrical resistance between the connection wiring 33 and the conductive parts 38, 39 and a threshold value.

[0054] [Effects of the door opening detection sensor according to the embodiment] According to the door-opening detection sensor 100 of this embodiment, a portion of the peel-off layer 8 is formed between the first base material portion 11 and the connection wiring 33 (see FIG. 5). Therefore, when the door 101 is opened, at least a portion of the connection wiring 33 is peeled off from the first base material portion 11 together with the first adhesive layer 5. This places the connection wiring 33 in a low conduction state with the conductive portions 38 and 39. Therefore, the opening history of the door 101 can be detected with high accuracy.

[0055] The multiple peeling layers 8 are formed at intervals in the longitudinal direction of the connection wiring 33. This can appropriately suppress the ease of peeling of the first adhesive layer 5. Therefore, when the door 101 is not open, the first adhesive layer 5 is unlikely to peel off from the base material 1. This can reduce the likelihood of false detection of door opening due to peeling of the first adhesive layer 5.

[0056] As shown in FIG. 2, the peeling layer 8 is formed in a direction intersecting the connection wiring 33. The peeling layer 8 overlaps with the connection wiring 33 at the center portion (middle position) in the longitudinal direction. Therefore, the peeling layer 8 extends to both sides (-X side and +X side) of the connection wiring 33. Therefore, as shown in FIGS. 7 and 8, when the door 101 is opened, the first adhesive layer 5 peels off from the first base member 11 over a wide range. This makes it easier to peel the connection wiring 33 from the first base member 11. This improves the ability to detect the opening history of the door 101.

[0057] In the door-opening detection sensor 100, when the first adhesive layer 5 is peeled off from the first base material portion 11, the connection wiring 33 separates from the conductive portions 38, 39, resulting in a low conductivity state (e.g., a non-conductive state) between the connection wiring 33 and the conductive portions 38, 39. This improves the performance of detecting the opening history of the door 101.

[0058] The first base material 11 is flexible. Since the first base material 11 is likely to bend after peeling from the first adhesive layer 5 (see FIG. 6), it can be said that the first base material 11 has a structure (reconnection restricting structure) that makes it difficult for reconnection to occur after the connection wiring 33 and the conductive parts 38, 39 become in a low conduction state. Therefore, even after the door 101 is closed, it is possible to detect the opening history of the door 101.

[0059] In the door-opening detection sensor 100, the connection wiring 33 and the conductive parts 38, 39 enter a low conductivity state as the first base material part 11 peels off from the first adhesive layer 5, and so are unlikely to reconnect even when the door 101 is closed (i.e., are unlikely to return to a high conductivity state). Therefore, the opening history of the door 101 can be detected with high accuracy.

[0060] The above describes an embodiment of the present invention, but each configuration and their combination in the embodiment is an example, and additions, omissions, substitutions, and other modifications of the configuration are possible within the scope that does not deviate from the spirit of the present invention.

[0061] 7, in the door-opening detection sensor 100, when a portion of the first adhesive layer 5 peels off from the first base material portion 11, the connection wiring 33 and the conductive portions 38, 39 enter a low conduction state, but it is sufficient that at least a portion of the adhesive layer peels off from the base material. The adhesive layer may peel off only a portion or all of the adhesive layer from the base material.

[0062] The portion where the release layer overlaps with the connection wiring is not limited to the central portion in the length direction of the release layer, but may be a portion corresponding to the intermediate position (a position excluding both ends). The portion where the release layer overlaps with the connection wiring may be a portion outside the intermediate position. In other words, the portion where the release layer overlaps with the connection wiring may be the end portion of the connection wiring.

[0063] In the door-opening detection sensor 100, only a portion (the central portion) of the peeling layer 8 overlaps with the connection wiring 33, but the configuration of the peeling layer is not particularly limited. The entire peeling layer may overlap with the connection wiring. That is, the entire peeling layer may be formed between the second main surface of the base member and the connection wiring. It is sufficient that at least a portion of the peeling layer is formed between the second main surface of the base member and the connection wiring.

[0064] In the door open detection sensor 100, a part of the peeling layer 8 is located so as to overlap the connection wiring 33 in a plan view, but the peeling layer may be formed in a position away from the connection wiring in a plan view. In the door open detection sensor 100, a plurality of peel-off layers 8 are formed, but the number of peel-off layers may be one. That is, the number of peel-off layers may be one or more.

[0065] In the door-opening detection sensor 100, the peeling layer 8 is formed in a direction perpendicular to the connection wiring 33, but the direction in which the peeling layer is formed is not particularly limited. The peeling layer may be formed in a direction that intersects with the connection wiring. For example, the crossing angle of the peeling layer with respect to the connection wiring may be an angle greater than 0° and less than 90°.

[0066] 7 and 8, in the door-open detection sensor 100, when the door 101 is opened, the connection wiring 33 separates from the conductive portions 38, 39, thereby bringing the connection wiring 33 and the conductive portions 38, 39 into a low conduction state, but it is sufficient that the connection wiring 33 and the conductive portions 38, 39 are brought into a low conduction state as a result of the door-opening operation. In other words, the connection wiring 33 and the conductive portions 38, 39 may be brought into a low conduction state without being separated.

[0067] The antenna 2 in the door-opening detection sensor 100 shown in FIG. 1 has radiating portions 21 and 22, but the shape of the antenna is not particularly limited. [Explanation of symbols]

[0068] REFERENCE SIGNS LIST 1...base material, 2...antenna, 3...IC chip, 5...first adhesive layer (adhesive layer), 6...second adhesive layer (adhesive layer), 11a, 12a...first main surface, 11b, 12b...second main surface, 8...peeling layer, 33...connection wiring, 34...first detection wiring (detection wiring), 35...first interlayer connection portion (interlayer connection portion), 36...second detection wiring (detection wiring), 37...second interlayer connection portion (interlayer connection portion), 38...first conductive portion (conductive portion), 39...second conductive portion (conductive portion), 100...door opening detection sensor, 101...door, 102...operated body

Claims

1. A door open detection sensor that detects the opening of a door that can be opened and closed relative to an operated object, a base material attached across the operated body and the door; an antenna for wireless communication provided on the substrate; an IC chip electrically connected to the antenna; a detection wiring formed on a first main surface of the base material and electrically connected to the IC chip; an adhesive layer that attaches a second main surface of the base material opposite to the first main surface to the door and the object to be moved; a release layer that weakens the adhesive strength between the second main surface of the base material and the adhesive layer; a connection wiring formed on the second main surface of the base material; a conductive portion provided in an interlayer connection portion that penetrates the base material from the first main surface to the second main surface, and that electrically connects the detection wiring and the connection wiring; Equipped with At least a portion of the release layer is formed between the second main surface of the base material and the connection wiring. Door open detection sensor.

2. The release layer is formed in plurality, The plurality of release layers are formed at intervals in the longitudinal direction of the connection wiring. The door opening detection sensor according to claim 1.

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