Automatic test equipment and interface device therefor

Abstract

To provide an interface device and an automatic testing device capable of improving heat insulation even when an internal space is limited.SOLUTION: The interface device 200 is provided between the test head 130 and the DUT1. The interface device 200 includes a printed circuit board, a front end module 300, a connection member 290, a frame, and a pipe 500. The DUT1 is electrically connected to the printed board. The connection member 290 electrically connects the front end module 300 and the printed circuit board. The frame fixes the front end module 300 in the accommodation space 3. One end of the pipe 500 is connected to the fluid supply path at the end portion of the interface device 200 on the test head 130 side, and the other end is disposed on the printed circuit board side in the accommodation space 3.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to an interface device for automatic test equipment. [Background technology]

[0002] Automatic test equipment (ATE) is used to test various semiconductor devices such as memories, CPUs (Central Processing Units), etc. The ATE supplies test signals to the semiconductor device under test (hereafter referred to as the device under test (DUT)), measures the response of the DUT to the test signals, and determines whether the DUT is good or bad, or identifies any defects.

[0003] In recent years, the speed of DRAM (Dynamic Random Access Memory) has been increasing. The GDDR (Graphics Double Data Rate) memory installed in graphics cards has achieved a transmission speed of 21 Gbps using the NRZ (Non Return to Zero) method in the GDDR6X standard.

[0004] The next-generation GDDR7 memory will use PAM4 (Pulse Amplitude Modulation 4), which will increase transmission speeds to 40Gbps. NRZ data rates are also increasing year by year, and in the next generation, speeds will be increased to around 28Gbps. When transmission speeds exceed 20Gbps, it becomes difficult to perform accurate measurements using memory testers that use conventional architectures.

[0005] Patent Document 1 discloses that pin electronics ICs, which were previously provided in test heads equipped with power supply circuits, etc., are modularized and built into an interface device as a front-end module. The interface device is a device that relays the electrical connection between the test head and the DUT. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 2024-14522 Summary of the Invention [Problem to be solved by the invention]

[0007] The technology disclosed in Patent Document 1 allows the pin electronics IC to be located in close proximity to the DUT, shortening the transmission distance of test signals to be supplied to the DUT and signals from the DUT (referred to as device signals) and enabling high-speed transmission. However, the technology disclosed in Patent Document 1 requires the front-end module to be located within the interface device, which can easily hinder the flow of fluids such as dry air within the interface device, making it difficult to insulate it from the outside. In particular, since DUTs are often tested in various temperature environments, insufficient insulation can result in, for example, condensation inside the interface device due to a drop in temperature on the DUT side, or the temperature from the interface device can put a strain on temperature control of the DUT.

[0008] The present disclosure has been made in light of such a situation, and one of its exemplary purposes is to provide an interface device and automatic test equipment that can improve thermal insulation even when the internal space is limited. [Means for solving the problem]

[0009] An interface device according to one embodiment of the present disclosure is provided between a test head and a device under test (DUT). The interface device includes a printed circuit board, a front-end module, a connecting member, a frame, and piping. The DUT is electrically connected to the printed circuit board. The front-end module is a modularized pin electronics IC (Integrated Circuit). The connecting member electrically connects the front-end module to the printed circuit board. The frame fixes the front-end module within the accommodation space. One end of the piping is connected to a fluid supply path at the end of the interface device on the test head side, and the other end is located on the printed circuit board side within the accommodation space.

[0010] Any combination of the above components, or mutual substitution of components or expressions between methods, devices, etc. are also valid aspects of the present invention. [Effects of the Invention]

[0011] According to certain aspects of the present disclosure, improved thermal insulation can be achieved even when interior space is limited. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a diagram illustrating an ATE according to an embodiment. [Figure 2] 1 is an enlarged cross-sectional view of a portion of an interface device according to an embodiment. [Figure 3] 3 is a perspective view of the interface device shown in FIG. 2 as seen from above. FIG. [Figure 4] FIG. 3 is a cross-sectional view of the interface device shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0013] (Outline of the embodiment) A summary of some exemplary embodiments of the present disclosure is provided. This summary is intended to provide a simplified overview of some concepts of one or more embodiments in order to provide a basic understanding of the embodiments as a prelude to the more detailed description that follows. It is not intended to limit the scope of the invention or disclosure. This summary is not an exhaustive overview of all possible embodiments, and is not intended to identify key elements of all embodiments or to delineate the scope of some or all aspects. For convenience, the term "one embodiment" may refer to one embodiment (example or variant) or multiple embodiments (examples or variants) disclosed herein.

[0014] An interface device according to one embodiment is provided between a test head and a device under test (DUT). The interface device includes a printed circuit board, a front-end module, a connecting member, a frame, and piping. The DUT is electrically connected to the printed circuit board. The front-end module is a modularized pin electronics IC (Integrated Circuit). The connecting member electrically connects the front-end module to the printed circuit board. The frame fixes the front-end module within the accommodation space. One end of the piping is connected to a fluid supply path at the end of the interface device on the test head side, and the other end is disposed on the printed circuit board side within the accommodation space.

[0015] With this configuration, even if the front-end module is housed in the housing space of the interface device, the fluid can be sprayed from the pipe toward the printed circuit board on which the DUT is mounted within the housing space, thereby preventing heat exchange between the DUT and the interface device and improving thermal insulation.

[0016] In one embodiment, one end of the pipe may be fixed to the frame, and the other end may not be fixed, so that only one end of the pipe needs to be fixed, making it easy to arrange the pipe even when the space for arranging the pipe within the accommodation space is limited.

[0017] In one embodiment, the piping may extend in a direction perpendicular to the printed circuit board within the accommodation space, which makes it easier to process the piping and minimizes the required length of the piping.

[0018] In one embodiment, the interface device may include a plurality of front-end modules and a plurality of pipes, and the plurality of pipes may be arranged in the gaps between adjacent front-end modules, respectively. This makes it easy to arrange the plurality of pipes evenly within the accommodation space and to spray the fluid evenly onto the printed circuit board, and therefore makes it easy to improve thermal insulation by the layer of fluid formed along the printed circuit board.

[0019] An automatic test apparatus according to one embodiment may include a tester main body, a test head, and an interface device connected to the test head.

[0020] (Embodiment) Preferred embodiments will be described below with reference to the drawings. The same or equivalent components, parts, and processes shown in each drawing will be given the same reference numerals, and redundant explanations will be omitted as appropriate. Furthermore, the embodiments are examples and do not limit the disclosure and invention, and all features and combinations thereof described in the embodiments are not necessarily essential to the disclosure and invention.

[0021] In addition, the dimensions (thickness, length, width, etc.) of each component shown in the drawings may be enlarged or reduced as appropriate for ease of understanding. Furthermore, the dimensions of multiple components do not necessarily represent their relative sizes, and even if a component A is depicted as being thicker than another component B in the drawings, it is possible that component A is thinner than component B.

[0022] In this specification, "a state in which component A is connected to component B" includes not only a case in which component A and component B are directly physically connected to each other, but also a case in which component A and component B are indirectly connected to each other via other components that do not substantially affect the electrical connection between them or that do not impair the function or effect achieved by their connection.

[0023] Similarly, "a state in which component C is connected (provided) between component A and component B" includes not only a case in which component A and component C, or component B and component C, are directly connected, but also a case in which they are indirectly connected via other components that do not substantially affect the electrical connection state between them or that do not impair the function or effect achieved by their combination.

[0024] 1 is a diagram showing an ATE 100 according to an embodiment. The ATE 100 includes a tester (also referred to as a tester main body) 120, a test head 130, a handler 150, and an interface device 200.

[0025] The tester 120 performs overall control of the ATE 100. Specifically, the tester 120 executes a test program, controls the test head 130 and the handler 150, and collects measurement results.

[0026] The handler 150 supplies (loads) the DUT1 to the interface device 200, and unloads the tested DUT1 from the interface device 200. The handler 150 also separates the DUT1 into good and bad products.

[0027] The handler 150 exchanges heat with the DUT 1 to adjust the temperature of the DUT 1. Specifically, the handler 150 heats or cools the DUT 1 according to a set temperature included in a test program executed by the tester 120.

[0028] The interface device 200 is provided between the test head 130 and the DUT 1. The interface device 200 includes a socket board 210, a connection member 290, a front-end module 300, a motherboard 230, and piping 500.

[0029] In this embodiment, multiple pin electronics ICs (PE-ICs) 400 are provided in the interface device 200, not in the test head 130. The pin electronics ICs 400 are application specific integrated circuits (ASICs) that integrate drivers that generate test signals and comparators that receive device signals. The test signals and device signals are NRZ signals or PAM4 signals.

[0030] More specifically, the pin electronics ICs 400 are modularized, and this module is called a front-end module 300. The interface device 200 includes a plurality of front-end modules 300.

[0031] The socket board 210 is provided with a plurality of sockets 212. The DUTs 1 are attached to the sockets 212. The front-end module 300 and the socket board 210 are electrically connected via a connection member 290.

[0032] The motherboard 230 is located between the socket board 210 and the test head 130. The motherboard 230 includes a frame 234 (see FIG. 2, etc.) that fixes the front-end module 300 in the accommodation space 3. The frame 234 will be described in detail later.

[0033] One end of the piping 500 (the lower end in FIG. 1 ) is connected to an air supply tube 510 at the end of the interface device 200 on the test head 130 side. The air supply tube 510 constitutes a fluid supply path for supplying a fluid such as dry air to the interface device 200. At least a portion of the air supply tube 510 is disposed, for example, inside the test head 130. The material of the air supply tube 510 is not particularly limited, but may be, for example, a highly flexible material such as a rubber tube.

[0034] The other end of the piping 500 (the upper end in FIG. 1) is arranged on the socket board 210 side (can also be referred to as the socket PCB 214 side described below; the same applies below) within the accommodation space 3. Specifically, the other end of the piping 500 is arranged at a position within the accommodation space 3 closer to the socket board 210 than the test head 130, for example, in the vicinity of the socket board 210. The piping 500 is arranged in the gap between multiple front-end modules 300 within the accommodation space 3. The piping 500 has at least enough rigidity to be able to stand on its own. The material of the piping 500 is not particularly limited, but may be, for example, metal, hard resin, etc., from the viewpoint of ensuring rigidity.

[0035] The above is the configuration of ATE100.

[0036] According to this ATE100, even in a configuration in which the front-end module 300 is accommodated in the accommodation space 3 of the interface device 200, it is possible to spray fluid from the other end of the piping 500 toward the socket board 210 side on which the DUT 1 is mounted, within the accommodation space 3. This prevents heat exchange between the DUT 1 and the interface device 200, thereby improving thermal insulation. Furthermore, because the fluid can be sprayed from the other end of the piping 500 arranged on the socket board 210 side within the accommodation space 3, the strength with which the fluid is sprayed can be lower than when the fluid is sprayed from, for example, the test head 130 side within the accommodation space 3, and it is also possible to reduce the risk of the sprayed fluid diffusing before reaching the socket board 210.

[0037] As described above, the handler 150 heats or cools the DUT 1 in accordance with the test program. In this case, if the thermal insulation between the DUT 1 and the interface device 200 is insufficient, for example, condensation may occur inside the interface device 200 due to the effect of a temperature drop from the DUT 1 side caused by the handler 150, or the effect of the temperature from the interface device 200 may impose a burden on the handler 150's temperature control of the DUT 1. The above problems can be solved by improving the thermal insulation between the DUT 1 and the interface device 200.

[0038] FIG. 2 is an enlarged cross-sectional view of a portion of an interface device 200A according to one embodiment. FIG. 2 shows only the configuration related to one DUT 1. In this embodiment, the interface device 200A includes a motherboard 230, a socket board 210 detachably attached to the motherboard 230, a front-end module 300A, wiring 220 as an example of a connecting member 290, and piping 500A. The socket board 210 includes a socket 212, a socket printed circuit board (socket PCB) 214, and a motherboard-side connector 216. The socket 212 is mounted on the socket PCB 214. That is, the DUT 1 is electrically connected to the socket PCB 214. The socket PCB 214 is also simply referred to as a printed circuit board.

[0039] The front-end module 300A includes a plurality of printed circuit boards (pin electronics PCBs) 310 on which a plurality of pin electronics ICs 400 are mounted. The plurality of pin electronics PCBs 310 are arranged in a direction perpendicular to the surfaces (front and back surfaces) of the DUT 1, in other words, the surface S1 of the socket board 210. In this embodiment, the socket board 210 is horizontal to the ground, and therefore the plurality of pin electronics PCBs 310 are arranged parallel to the direction of gravity.

[0040] The front-end module 300A further includes a plate-shaped cooling device (hereinafter referred to as a cold plate) 320. The cold plate 320 has a flow path through which a coolant flows.

[0041] The multiple pin electronics PCBs 310 a , 310 b and the cold plate 320 are stacked such that the pin electronics IC 400 is thermally coupled to the cold plate 320 .

[0042] The motherboard 230 includes a socket board-side connector 232, a frame 234, and a relay connector 236. The front-end module 300A is fixed to the frame 234. The relay connector 236 is electrically and mechanically coupled to the test head-side connector 132. The socket board-side connector 232 is mechanically coupled to the motherboard-side connector 216 of the socket board 210. The frame 234 constitutes most of the motherboard 230, excluding the socket board-side connector 232 and the relay connector 236, even in parts not shown with reference numerals.

[0043] The wiring 220, which is an example of the connection member 290, is a cable (also called an FPC cable) made of a flexible printed circuit (FPC) instead of a conventional coaxial cable. The connection member 290 may be a coaxial cable. Only control signals for the pin electronics IC 400 are transmitted through the wiring 224 between the pin electronics PCB 310 and the relay connector 236, and test signals and device signals are not transmitted. Therefore, the wiring 224 may be a coaxial cable.

[0044] One end (the lower end in FIG. 2) of pipe 500A is fixed to frame 234 via fixing member 520. On the other hand, the other end (the upper end in FIG. 2) of pipe 500A is not fixed. That is, pipe 500A stands on its own in storage space 3 with only one end fixed.

[0045] The pipe 500A extends straight without curving, and extends in a direction perpendicular to the socket board 210 within the accommodation space 3. In this example, the socket board 210 is parallel to the ground, and the pipe 500A is arranged to extend parallel to the direction of gravity. Dry air can be blown from the other end of the pipe 500A toward the socket board 210.

[0046] One end of the pipe 500A is connected to the air supply tube 510 by a joint 530 at the end of the interface device 200A on the test head 130 side (the lower end of the interface device 200A in FIG. 2).

[0047] 3 is a perspective view of the interface device 200A as seen from above, in which the socket board 210 and some of the front-end modules 300A have been removed in order to explain the arrangement of the piping 500A in the accommodation space 3.

[0048] A plurality of pipes 500A are provided in the interface device 200A. The plurality of pipes 500A are arranged approximately evenly within the accommodation space 3 in a top view seen from the socket board 210 side. In the example shown in FIG. 3, the plurality of pipes 500A are arranged one by one in the gaps between adjacent front-end modules 300A among the plurality of front-end modules 300A. Also, in the example shown in FIG. 3, the gaps between adjacent front-end modules 300A include gaps where one pipe 500A is arranged and gaps where no pipe 500A is arranged, and these gaps are arranged alternately.

[0049] 3, the multiple front-end modules 300A are arranged with almost no gaps between them in the accommodation space 3. Therefore, the arrangement positions of the multiple pipes 500A may be set to positions that do not interfere with the front-end modules 300A, depending on the positions where each front-end module 300A is expected to be accommodated, as defined by the frame 234. In this case, the pipes 500A may be accommodated in the interface device 200A before the front-end modules 300A are accommodated. This allows the pipes 500A to be arranged even when the gap between adjacent front-end modules 300A is small.

[0050] Fig. 4 is a cross-sectional view of the interface device 200A. Like Fig. 3, Fig. 4 shows a state in which some of the front-end modules 300A have been removed.

[0051] The multiple pipes 500A are arranged at approximately equal intervals in the cross-sectional view shown in FIG. 4. As described above, dry air is blown toward the socket board 210 from the other end (the upper end in FIG. 4) of each pipe 500A. As a result, an airflow in which the dry air flows along the underside of the socket board 210 is generated in the upper space 5 of the accommodation space 3 facing the socket board 210. This airflow enters between the socket board 210 and the front-end module 300A, thereby impeding heat exchange between the socket board 210 and the front-end module 300A. In other words, it is possible to prevent heat from the front-end module 300A from being transferred to the socket board 210, and it is also possible to prevent heat from the socket board 210 from being transferred to the front-end module 300A.

[0052] A flow rate adjusting unit 540 that adjusts the flow rate of dry air is connected to each air supply tube 510. This makes it possible to adjust the flow rate of dry air discharged from each pipe 500A.

[0053] The above is the configuration of the interface device 200A.

[0054] The interface device 200 may take a variety of forms, and the present disclosure is applicable to any of them.

[0055] SBC (Socket Board Change) type The SBC type is an interface device in which the socket board 210 is replaced depending on the type of DUT.

[0056] CLS (Cable Less) type The CLS type is an interface device in which the interface device 200 can be separated into an upper DSA (Device Specific Adapter) and a lower motherboard, and the DSA is replaced depending on the type of DUT. When the interface device 200 according to this embodiment is applied to the CLS type, two methods are possible.

[0057] One is to place the front-end module 300 on the motherboard side, which is advantageous from the viewpoint of cost because the front-end module 300 can be shared for testing different DUTs.

[0058] Another option is to place the front-end module 300 on the DSA side. In this case, a front-end module 300 is provided for each DSA, which increases the cost of the device. However, this allows the front-end module 300 to be placed closer to the DUT, which is advantageous from the perspective of high-speed testing.

[0059] CCN (Cable Connection) type The CCN type is an interface device in which the entire interface device 200 is replaced depending on the type of DUT. When the interface device 200 according to the present embodiment is applied to the CCN type, it becomes possible to bring the front-end module 300 as close as possible to the DUT, which is advantageous from the viewpoint of high-speed testing.

[0060] Wafer motherboard The interface device 200 may be a wafer motherboard used for wafer-level testing, in which case the interface device 200 may include a probe card instead of a socket board.

[0061] The above-described embodiment is merely an example, and it will be understood by those skilled in the art that various modifications are possible in the combination of the components and the processing steps. Such modifications will be described below.

[0062] Although specific terms have been used to describe the embodiments of the present disclosure, this description is merely an example to facilitate understanding and does not limit the scope of the present disclosure or the claims. The scope of the present invention is defined by the claims, and therefore, embodiments, examples, and modifications not described herein are also included within the scope of the present invention. These modifications will be described below.

[0063] (Variation) In the embodiment, the interface device 200 has been described in which the socket board 210 is parallel to the ground, but the present disclosure is not limited thereto. For example, the socket board 210 may be perpendicular to the ground. In this case, the horizontal direction in FIGS. 2 and 4 corresponds to the direction of gravity. [Explanation of symbols]

[0064] 1 DUT, 3 accommodation space, 120 tester, 130 test head, 200,200A interface device, 210 socket board, 212 socket, 234 frame, 290 connection member, 300,300A front end module, 400 pin electronics IC, 500,500A piping, 520 fixing member, 530 fitting.

Claims

1. An interface device provided between a test head and a device under test (DUT), a printed circuit board to which the DUT is electrically connected; a front-end module in which pin electronics ICs (Integrated Circuits) are modularized; a connection member that electrically connects the front-end module and the printed circuit board; a frame that fixes the front end module within an accommodation space; a pipe having one end connected to a fluid supply path at an end of the interface device on the test head side and the other end disposed on the printed circuit board side within the accommodation space; An interface device comprising:

2. The interface device according to claim 1 , wherein the one end of the piping is fixed to the frame and the other end is not fixed.

3. The interface device according to claim 1 , wherein the piping extends in the accommodation space along a direction perpendicular to the printed circuit board.

4. a plurality of the front end modules and a plurality of the pipes; the plurality of pipes are arranged one by one in the gaps between adjacent front end modules among the plurality of front end modules; 10. The interface device of claim 1.

5. The tester body and A test head, an interface device according to any one of claims 1 to 4, which is connected to the test head; An automatic test device comprising:

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