Resin composition

Abstract

To provide a resin composition providing a cured product exhibiting excellent dielectric characteristics and excellent adhesiveness.SOLUTION: A resin composition comprising (1A) a polymer having a structural unit represented by the following formula (A-1) and a structural unit represented by the following formula (A-2), (B) an epoxy resin, and (C) an inorganic filler. (In the formulae (A-1) and (A-2), R1 each independently represents a monovalent organic group having an atom selected from a carbon atom, a hydrogen atom, an oxygen atom, a nitrogen atom, a silicone atom, and a sulfuric atom as a constituent atom, a molecular weight of R1 is 250 or more, R1 does not have an ethylenically unsaturated group, and R1 does not include at least one of a triazin skeleton or a bisphenol skeleton which may be hydrogenated. Each A independently represents a divalent organic group having a bisphenol skeleton which may be hydrogenated. ) SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a resin composition, and further to a resin sheet, a printed wiring board, and a semiconductor device obtained by using the resin composition, as well as a method for producing the resin composition. [Background technology]

[0002] A known manufacturing technique for printed wiring boards is a build-up method in which insulating layers and conductor layers are alternately stacked. Examples of insulating materials used for such insulating layers include the resin composition disclosed in Patent Document 1. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2018-53092 Summary of the Invention [Problem to be solved by the invention]

[0004] As an insulating material for printed wiring boards, a cured product of a resin composition in which various polymers are added to a curable resin and an inorganic filler is sometimes used. However, the present inventors have found that when the resin composition is heated during curing, problems such as an increase in the dielectric constant and dielectric loss tangent, and a decrease in adhesion between the insulating layer and the conductor layer (copper foil) may arise.

[0005] The present invention has been made in view of the above problems, and has an object to provide a resin composition that provides a cured product that exhibits excellent dielectric properties and excellent adhesion. [Means for solving the problem]

[0006] As a result of extensive research, the present inventors have found that the above problems can be solved by a resin composition containing a polymer having a specific structure, an epoxy resin, and an inorganic filler, and have completed the present invention.

[0007] That is, the present invention includes the following. [1] (1A) A polymer having a structural unit represented by the following formula (A-1) and a structural unit represented by the following formula (A-2): (B) epoxy resin, and (C) Inorganic filler, A resin composition comprising: [ka] (In formula (A-1) and formula (A-2), R 1 are each independently a monovalent organic group having constituent atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 1 The molecular weight of R is 250 or more. 1 does not have an ethylenically unsaturated group, and R 1 does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. Each A independently represents a divalent organic group having an optionally hydrogenated bisphenol skeleton. [2] The resin composition according to [1], wherein the component (1A) is a polymer having a structural unit represented by the following formula (A-3): [ka] (In formula (A-3), R 1 are each independently a monovalent organic group having constituent atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 1 The molecular weight of R is 250 or more. 1 does not have an ethylenically unsaturated group, and R 1 does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. Each A independently represents a divalent organic group having an optionally hydrogenated bisphenol skeleton. [3] In formula (A-1), R 1 are each independently a monovalent organic group having no reactive substituent. [4] In formula (A-1), R 1 are each independently a monovalent organic group that does not contain both a triazine skeleton and an optionally hydrogenated bisphenol skeleton. [5] In formula (A-1), R 1 are each independently a monovalent organic group selected from the group consisting of a saturated aliphatic group, an aromatic group, and a combination of a saturated aliphatic group and an aromatic group. [6] In formula (A-1), R 1 The resin composition according to any one of [1] to [5], wherein each of the groups independently represents a monovalent organic group selected from a substituted amino group and a substituted oxy group. [7] The resin composition according to any one of [1] to [6], wherein in formula (A-2), A's each independently represent a divalent organic group having as constituent atoms atoms selected from carbon atoms, hydrogen atoms, oxygen atoms, nitrogen atoms, fluorine atoms, and silicon atoms. [8] The resin composition according to any one of [1] to [7], wherein in formula (A-2), A is a divalent organic group having a bisphenol skeleton. [9] The resin composition according to any one of [1] to [8], wherein in formula (A-2), A is a divalent organic group represented by the following formula (A-4): [ka] (In formula (A-4), ring Ar 1 each independently represents an aromatic carbon ring having 6 to 10 carbon atoms which may have a substituent. 1 represents a single bond or a divalent group having 1 to 200 constituent atoms and containing atoms selected from carbon, hydrogen, oxygen, nitrogen, fluorine, silicon, and sulfur atoms. * represents a bond.

[10] In formula (A-4), ring Ar 1is an aromatic carbon ring having 6 to 10 carbon atoms which may have a substituent selected from an alkyl group having 1 to 10 carbon atoms and an aryl group having 1 to 10 carbon atoms.

[11] In formula (A-4), X 1 is an alkylene group having 1 to 20 carbon atoms which may have an oxygen atom, an arylene group having 1 to 20 carbon atoms, or a divalent group having 2 to 30 carbon atoms which is a combination thereof.

[12] The resin composition according to any one of [1] to

[11] , wherein in formula (A-2), A is a divalent organic group represented by the following formula (A-5): [ka] (In formula (A-5), ring Ar 2 each independently represents an aromatic carbon ring having 6 to 10 carbon atoms which may have a substituent. 2 R represents a divalent group having 1 to 200 constituent atoms, the constituent atoms of which are selected from carbon atoms, hydrogen atoms, and oxygen atoms. 4 R each independently represents an alkylene group having 1 to 20 carbon atoms, an arylene group having 1 to 20 carbon atoms, or a divalent group having 2 to 30 carbon atoms and consisting of a combination thereof. 5 and R 6 each independently represents an alkyl group having 1 to 20 carbon atoms or an aryl group having 1 to 20 carbon atoms. 5 and R 6 may be linked to form a ring. * represents a bond.

[13] In formula (A-5), X 2 is an oxygen atom, an alkylene group having 1 to 50 carbon atoms, an arylene group having 1 to 20 carbon atoms which may have an alkyl group having 1 to 6 carbon atoms as a substituent, or a divalent group having 2 to 60 carbon atoms consisting of a combination thereof.

[14] In formula (A-5), X 2 is a divalent group having an aromatic hydrocarbon ring and having 6 to 100 carbon atoms.

[15] The resin composition according to any one of [1] to

[14] , wherein the component (1A) further has a structural unit represented by the following formula (A-6): [ka] (In formula (A-6), R 2 are each independently a monovalent organic group having constituent atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 2 The molecular weight of R is less than 250. 2 does not have an ethylenically unsaturated group, and R 2 does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton.

[16] The resin composition according to any one of [2] to

[15] , wherein the component (1A) further has a structural unit represented by the following formula (A-7): [ka] (In formula (A-7), R 2 are each independently a monovalent organic group having constituent atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 2 The molecular weight of R is less than 250. 2 does not have an ethylenically unsaturated group, and R 2 does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. Each A independently represents a divalent organic group having an optionally hydrogenated bisphenol skeleton.

[17] In formula (A-6), R 2 The resin composition according to

[15] or

[16] , wherein

[18] In formula (A-6), R 2 The resin composition according to any one of

[15] to

[17] , wherein is a naphthoxy group.

[19] The resin composition according to any one of

[15] to

[18] , wherein in the component (1A), the number of repeating structural units represented by formula (A-1) is N1, the number of repeating structural units represented by formula (A-2) is N2, the number of repeating structural units represented by formula (A-6) is N6, and if other structural units are present, the number of repeating other structural units is N0, in which case the ratio α defined by the following formula (1) is 0.9 to 1:

number

[20] The resin composition according to any one of

[15] to

[19] , wherein, in the component (1A), when the number of repeating structural units represented by formula (A-1) is N1 and the number of repeating structural units represented by formula (A-6) is N6, the ratio of N6 to N1 (N6 / N1) is 0.1 to 20.

[21] The resin composition according to any one of [1] to

[20] , wherein the component (1A) has two or more structural units represented by formula (A-2) where A is different, and the two or more A's include a divalent group represented by the following formula (A-4) and a divalent group represented by the following formula (A-5): [ka] (In the formula (A-4) and the formula (A-5), the ring Ar 1 and ring Ar 2 X each independently represents an aromatic carbon ring having 6 to 10 carbon atoms which may have a substituent. 1 represents an alkylene group having 1 to 20 carbon atoms, which may have an oxygen atom, an arylene group having 1 to 20 carbon atoms, or a divalent group having 2 to 30 carbon atoms and consisting of a combination thereof. 2 R represents an oxygen atom, an alkylene group having 1 to 50 carbon atoms, an arylene group having 1 to 20 carbon atoms which may have an alkyl group having 1 to 6 carbon atoms as a substituent, or a divalent group having 2 to 60 carbon atoms consisting of a combination thereof. 4 R each independently represents an alkylene group having 1 to 20 carbon atoms, an arylene group having 1 to 20 carbon atoms, or a divalent group having 2 to 30 carbon atoms and consisting of a combination thereof. 5 and R 6each independently represents an alkyl group having 1 to 20 carbon atoms or an aryl group having 1 to 20 carbon atoms. 5 and R 6 may be linked to form a ring. * represents a bond.

[22] The resin composition according to

[21] , wherein, in A of the component (1A), the ratio of M5 to M4 (M5 / M4) is 0.05 to 5, where M5 is the number of divalent groups represented by formula (A-5) and M4 is the number of divalent groups represented by formula (A-4).

[23] The resin composition according to any one of [1] to

[22] , wherein the component (1A) is a polymer having a structure represented by the following formula (A-8): [ka] (In formula (A-8), n1 represents an integer of 1 or more, and n2 represents an integer of 0 or more. R 1 , R 2 and R are each independently a monovalent organic group having constituent atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 1 The molecular weight of R is 250 or more. 2 The molecular weight of R is less than 250. 1 , R 2 and R does not have an ethylenically unsaturated group, and R 1 , R 2 and R do not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. Each A independently represents a divalent organic group having an optionally hydrogenated bisphenol skeleton.

[24] The resin composition according to

[23] , wherein in formula (A-8), n1+n2 is 1 to 110.

[25] The resin composition according to any one of [1] to

[24] , wherein the weight average molecular weight of the component (1A) is 1,000 to 50,000.

[26] The resin composition according to any one of [1] to

[25] , further comprising (D) a curing agent.

[27] The resin composition according to

[26] , wherein the component (D) contains an active ester curing agent.

[28] The resin composition according to any one of [1] to

[27] , further comprising (E) a curing accelerator.

[29] The resin composition according to any one of [1] to

[28] , further comprising (F) a radical polymerization resin.

[30] The resin composition according to any one of [1] to

[29] , further comprising (G) a radical polymerization initiator.

[31] The resin composition according to any one of [1] to

[30] , wherein the content of the component (1A) is 1 to 30 mass % when the total amount of non-volatile components in the resin composition is 100 mass %.

[32] The resin composition according to any one of [1] to

[31] , wherein the content of component (C) is 50 to 75 mass % when the total amount of non-volatile components in the resin composition is 100 mass %.

[33] The resin composition according to any one of [1] to

[32] , wherein the mass ratio of the component (1A) to the component (C) [component (1A) / component (C)] is 0.01 to 1.

[34] (2A) A polymer formed by reacting cyanuric acid chloride, an optionally hydrogenated bisphenol, a compound represented by the following formula (X-1), and a monophenol: (B) epoxy resin, and (C) Inorganic filler, A resin composition comprising: [ka] (In formula (X-1), R 1 is a monovalent organic group having atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms as constituent atoms, and R 1 The molecular weight of R is 250 or more. 1 does not have an ethylenically unsaturated group, and R 1 does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton.

[35] (1) A step of reacting cyanuric chloride, an optionally hydrogenated bisphenol, a compound represented by the following formula (X-1), and a monophenol to obtain a polymer; (2) mixing the polymer obtained in step (1), the epoxy resin, and the inorganic filler; A method for producing a resin composition comprising: [ka] (In formula (X-1), R 1 is a monovalent organic group having atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms as constituent atoms, and R 1 The molecular weight of R is 250 or more. 1 does not have an ethylenically unsaturated group, and R 1 does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton.

[36] A resin sheet comprising a support and a resin composition layer provided on the support, the resin composition layer comprising the resin composition according to any one of [1] to

[34] .

[37] A printed wiring board comprising an insulating layer formed from a cured product of the resin composition according to any one of [1] to

[34] .

[38] A semiconductor device comprising the printed wiring board according to

[37] . [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a resin composition that produces a cured product exhibiting excellent dielectric properties and excellent adhesion, a resin sheet, a printed wiring board, and a semiconductor device obtained using the resin composition, and a method for producing the resin composition. DETAILED DESCRIPTION OF THE INVENTION

[0009] The present invention will be described in detail below with reference to embodiments and examples. However, the present invention is not limited to the embodiments and examples described below, and can be implemented with any modifications within the scope of the claims and their equivalents.

[0010] [Terminology] In the following description, unless otherwise specified, the expressions "XX to YY" or "XX to YY" representing a numerical range mean a numerical range including the lower and upper limits, which are the endpoints. When a numerical range is described in stages, the upper and lower limits of each numerical range can be combined in any way.

[0011] In the following description, "dielectric constant" refers to "relative dielectric constant" unless otherwise specified.

[0012] In the following description, unless otherwise specified, the term "optionally substituted" in reference to a compound or group means both a case where the hydrogen atoms of the compound or group are not substituted with a substituent and a case where some or all of the hydrogen atoms of the compound or group are substituted with a substituent. Furthermore, when the number of constituent atoms or carbon atoms of the compound or group is stated, the number of constituent atoms or carbon atoms does not include the number of constituent atoms or carbon atoms of substituents, unless otherwise specified.

[0013] In the following description, the term "organic group" refers to a group containing at least carbon atoms as skeletal atoms, and may be linear, branched, or cyclic. In this specification, unless otherwise specified, the number of skeletal atoms in an organic group is preferably 1 to 3,000, more preferably 1 to 1,000, even more preferably 1 to 100, still more preferably 1 to 50, and particularly preferably 1 to 30 or 1 to 20. Examples of organic groups include groups containing one or more skeletal atoms (including at least a carbon atom) selected from carbon atoms, oxygen atoms, nitrogen atoms, and sulfur atoms.

[0014] In the following description, the term "aromatic ring" refers to a ring conforming to Hückel's rule, in which the number of electrons contained in the π-electron system on the ring is 4r+2 (r is a natural number), and includes monocyclic aromatic rings and fused aromatic rings in which two or more monocyclic aromatic rings are fused. Unless otherwise specified, the aromatic ring is preferably a monocyclic aromatic ring. The aromatic ring may be an aromatic carbocyclic ring having only carbon atoms as ring-constituting atoms, or an aromatic heterocyclic ring having heteroatoms such as oxygen atoms, nitrogen atoms, and sulfur atoms as ring-constituting atoms in addition to carbon atoms. Unless otherwise specified, the aromatic ring is preferably an aromatic carbocyclic ring. The number of carbon atoms in the aromatic ring is preferably 3 or more, more preferably 4 or more or 5 or more, and even more preferably 6 or more, unless otherwise specified, and the upper limit is preferably 24 or less, more preferably 18 or less or 14 or less, and even more preferably 10 or less. The number of carbon atoms does not include the number of carbon atoms of substituents.

[0015] Examples of the monocyclic aromatic ring include a benzene ring, a furan ring, a thiophene ring, a pyrrole ring, a pyrazole ring, an oxazole ring, an isoxazole ring, a furazan ring, a thiazole ring, an isothiazole ring, a thiadiazole ring, an imidazole ring, a triazole ring, a tetrazole ring, a pyridine ring, a pyridazine ring, a pyrimidine ring, a pyrazine ring, and a pyridazine ring. Examples of fused aromatic rings in which two or more monocyclic aromatic rings are fused include a naphthalene ring, an anthracene ring, a phenanthrene ring, a benzofuran ring, an isobenzofuran ring, an indole ring, an isoindole ring, a benzothiophene ring, a benzimidazole ring, an indazole ring, a benzoxazole ring, a benzisoxazole ring, a benzothiazole ring, a quinoline ring, an isoquinoline ring, a quinoxaline ring, an acridine ring, a quinazoline ring, a cinnoline ring, a phthalazine ring, a pyridothiazole ring, a benzotriazole ring, an imidazopyridine ring, a triazopyridine ring, a purine ring, etc. Unless otherwise specified, the aromatic ring is preferably a benzene ring or a naphthalene ring, more preferably a benzene ring.

[0016] In the following description, the polymer of the present invention may be explained using a structural formula. Specifically, the following formulas (XA-1) to (XA-4) represent the polymer of the present invention having a repeating unit XA where X A When two or more types of structures can be present, the formulas (XA-1) to (XA-4) also include embodiments in which the two or more types of structures are copolymerized. There are no limitations on the type of copolymerization, and examples include random copolymerization, alternating copolymerization, block copolymerization, graft copolymerization, and ordered copolymerization. Furthermore, when it is stated that "has a structural unit" or "has a structure," unless otherwise specified, it is understood that the specified repeating unit X can be present in any form within the scope that does not impair the effects of the present invention. A In addition, embodiments having other structural units are also included. [ka] (In the formula, X A represents a repeating unit, and X E1 and X E2 represents the terminal group. n represents the number of repeats.)

[0017] Repeating unit X A However, there are two types of repeating units X A1 and X A2 If it contains X A1 and X A2 In this case, X may be expressed in any of the following formulas (XA-5) to (XA-8). A1 and X A2 There are no limitations on the type and order of copolymerization, and examples include random copolymerization, alternating copolymerization, block copolymerization, graft copolymerization, and ordered copolymerization. For example, "a polymer having a structure represented by the following formula (XA-9)" means "a polymer having a structure selected from formulas (XA-9-1) to (XA-9-6), or a mixture thereof." In the case of general n1 and n2, a polymer having a structure represented by formula (XA-5) is n1+n2 C n1 There are several possible combination sequences (where "C" is the combination symbol). [ka] (In the formula, X A1 and X A2 represents two types of repeating units, and XE1 and X E2 represents a terminal group. n1 and n2 represent the number of repeats.) [ka] (In the formula, X A1 and X A2 represents two types of repeating units, and X E1 and X E2 represents a terminal group.)

[0018] Furthermore, when the polymer of the present invention is expressed in the form of formula (XA-9), an example of its partial structure may be expressed in the form of the following formula (XA-10). The notation in the form of formula (XA-10) is an example, and as mentioned above, "a polymer having a structure represented by formula (XA-9)" means "a polymer having a structure selected from formulas (XA-9-1) to (XA-9-6), or a mixture thereof," and "-X A2 -X A1 -X A1 -X E2 " is not limited to the embodiment having the bonding order ". [ka] (In the formula, X A1 and X A2 represents two types of repeating units, and X E2 represents a terminal group.)

[0019] The polymer of the present invention is a polymer obtained by mixing two kinds of bifunctional monomers X B and X C (X B Comrade, X C They don't react with each other, but X B and X C reacts), X B As X B1 and X B2 There are two types: X C As X C1 and X C2When two types of polymers exist, the polymer is represented by any one of formulas (XBC-1) to (XBC-4), but may be simplified and represented by any one of formulas (XBC-5) to (XBC-8). B and X C As long as the bonds alternate, -X B1 -X C1 -, -X B1 -X C2 -, -X B2 -X C1 -and-X B2 -X C2 There are no limitations on the type and order of copolymerization, and examples include random copolymerization, alternating copolymerization, block copolymerization, graft copolymerization, and ordered copolymerization. For example, "a polymer having a structure represented by formula (XBC-9)" means "a polymer having a structure selected from formulas (XBC-9-1) to (XBC-9-9), or a mixture thereof." b1 , n b2 , n c1 and n c2 In this case, the order of bonds in the polymer represented by formula (XBC-5) is nb1+nb2 C nb1 × nc1+nc2 C nc1 (Note that "C" is a combination symbol.) [ka] (In the formula, X B1 , X B2 , X C1 and X C2 represents four types of repeating units, and X E1 and X E2 represents a terminal group. 11 , n 12 , n 21 and n 22 represents the number of repetitions.) [ka] (In the formula, X B1 , X B2 , X C1 and X C2 represents four types of repeating units, and XE1 and X E2 represents a terminal group. b1 , n b2 , n c1 and n c2 represents the number of repetitions.) [ka] (In the formula, X B1 , X B2 , X C1 and X C2 represents four types of repeating units, and X E1 and X E2 represents a terminal group.)

[0020] In the following description, the components (1A) and (2A) may be collectively referred to as the “component (A).” The resin composition of the first embodiment and the resin composition of the second embodiment may be collectively referred to as the “resin composition.”

[0021] [Resin composition of the first embodiment] The resin composition of the first embodiment of the present invention contains (1A) a polymer having a first specific structure, (B) an epoxy resin, and (C) an inorganic filler. The first specific structure will be described later. By incorporating the components (1A) to (C) in combination into the resin composition, a cured product exhibiting excellent dielectric properties and excellent adhesion can be obtained. "Adhesion" in the present invention refers to the adhesion between an insulating layer and a conductor layer formed from a cured product of the resin composition of the present invention. The present inventors have confirmed that adhesion is particularly excellent when the conductor layer is copper. Examples of adhesion between an insulating layer and copper include "substrate adhesion" and "plating adhesion." "Substrate adhesion" refers to the adhesion between an insulating layer and a conductor layer (copper) when they are bonded by lamination. "Plating adhesion" refers to the adhesion between an insulating layer and a conductor layer (copper) when the conductor layer (copper) is formed on an insulating layer by plating. In one embodiment of the present invention, both "substrate adhesion" and "plating adhesion" can be achieved. The resin composition of the first embodiment may further contain optional components in addition to the components (1A) to (C). Examples of optional components include a (D) curing agent, a (E) curing accelerator, a (F) radical polymerization resin, a (G) radical polymerization initiator, a (H) organic solvent, and (I) other additives. Each component contained in the resin composition of the first embodiment will be described in detail below.

[0022] <(1A) Polymer Having First Specific Structure> The resin composition according to a first embodiment of the present invention contains a polymer (polymer having a first specific structure) having a structural unit represented by the following formula (A-1) and a structural unit represented by the following formula (A-2). The optionally hydrogenated bisphenol skeleton represented by A in formula (A-2) is a rigid skeleton, and therefore, it is believed that the inclusion of the structural unit represented by formula (A-2) in the (1A) component improves thermal stability and inhibits thermal oxidative degradation due to heating during curing of the resin composition. Furthermore, it is believed that the inclusion of the rigid skeleton represented by A in formula (A-2) in the (1A) component reduces the influence of molecular motion due to high frequency waves, resulting in a cured product exhibiting excellent dielectric properties. The structural unit represented by formula (A-1) is preferably bonded to a structural unit represented by formula (A-2), and the structural unit represented by formula (A-2) is preferably bonded to a structural unit represented by formula (A-1). The (1A) component may be used singly or in combination of two or more. [ka] (In formula (A-1) and formula (A-2), R 1 are each independently a monovalent organic group having constituent atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 1 The molecular weight of R is 250 or more. 1 does not have an ethylenically unsaturated group, and R 1 does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. Each A independently represents a divalent organic group having an optionally hydrogenated bisphenol skeleton.

[0023] In formula (A-1), R 1 are each independently a monovalent organic group having constituent atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 1 The molecular weight of R is 250 or more. 1 does not have an ethylenically unsaturated group, and R 1 does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton.

[0024] R 1 The molecular weight of R is 250 or more. 1 Since R does not have an ethylenically unsaturated group, the dielectric constant and dielectric loss tangent of the cured product of the resin composition can be reduced. 1 The molecular weight of R is 250 or more. 1 This means that the compound is bulky, and it is presumed that the dielectric constant is reduced because the free volume increases due to the presence of bulky substituents. 1 does not have an ethylenically unsaturated group, the substituent R 1 It is presumed that the degree of freedom of molecular motion is maintained because R is not crosslinked, resulting in a decrease in the dielectric loss tangent. It is also presumed that the degree of freedom of molecular motion is maintained, resulting in an increase in free volume, which is also a factor in the decrease in the dielectric constant. 1 The molecular weight of R is preferably 300 or more, more preferably 400 or more or 500 or more, even more preferably 600 or more or 700 or more, and particularly preferably 800 or more or 850 or more. 1 There is no particular upper limit to the molecular weight of R, but it may be 10,000 or less, 9,000 or less, 8,000 or less, 7,000 or less, 6,000 or less, 5,000 or less, 4,000 or less, 3,000 or less, 2,000 or less, 1,500 or less, 1,200 or less, etc. 1 R is preferably a monovalent organic group that does not have a reactive substituent. 1 does not have a reactive substituent and has a molecular weight of 250 or more. 1 This means that the polarity of the copolymer is low, and the dielectric loss tangent of the cured product can be further reduced.

[0025] R 1 However, the absence of at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton means that the formula (A-1) represents a linear structure. 1 is preferably a monovalent organic group that does not contain both a triazine skeleton and an optionally hydrogenated bisphenol skeleton.

[0026] R 1The constituent atoms of R are atoms selected from carbon atoms, hydrogen atoms, oxygen atoms, nitrogen atoms, silicon atoms, and sulfur atoms, and are preferably atoms selected from carbon atoms, hydrogen atoms, oxygen atoms, nitrogen atoms, and silicon atoms. 1 By containing an oxygen atom or a nitrogen atom, the adhesion between the cured product (insulating layer) and the conductor layer can be further improved.

[0027] R 1 The number of constituent atoms of R is preferably 1 to 200. 1 The lower limit of the number of constituent atoms of R is more preferably 5 or more, 10 or more, or 15 or more, even more preferably 20 or more or 25 or more, and particularly preferably 30 or more or 35 or more. In one embodiment, it may be 40 or more, 50 or more, 60 or more, 70 or more, 80 or more, 90 or more, 100 or more, 110 or more, 120 or more, etc. 1 The upper limit of the number of constituent atoms is more preferably 180 or less or 160 or less, even more preferably 150 or less or 140 or less, and particularly preferably 130 or less or 125 or less.

[0028] R 1 The number of carbon atoms in R is preferably 1 to 50. 1 The lower limit of the number of carbon atoms in R is more preferably 2 or more, 4 or more, 6 or more, or 8 or more, even more preferably 10 or more or 12 or more, and particularly preferably 14 or more, 16 or more, or 18 or more. In one embodiment, it may be 20 or more, 22 or more, 24 or more, 26 or more, 28 or more, 30 or more, etc. 1 The upper limit of the number of carbon atoms is more preferably 48 or less, 46 or less, or 44 or less, even more preferably 42 or less, 40 or less, or 38 or less, and particularly preferably 36 or less, 34 or less, or 32 or less.

[0029] In formula (A-1), R 1are each independently preferably a monovalent organic group selected from the group consisting of a saturated aliphatic group, an aromatic group, and a combination of a saturated aliphatic group and an aromatic group. The aromatic group also includes an aryloxy group, an arylamino group, an arylthio group, etc., in which an oxygen atom, a nitrogen atom, a sulfur atom, etc. is bonded to an aromatic ring. The aromatic group is preferably an aromatic carbocyclic group. The aromatic carbocyclic group means an aromatic group in which the backbone atom on the aromatic ring is a carbon atom. That is, in one embodiment, R 1 is more preferably each independently a monovalent organic group selected from the group consisting of a saturated aliphatic group, an aromatic carbocyclic group, and a combination of a saturated aliphatic group and an aromatic carbocyclic group.

[0030] In formula (A-1), R 1 are each independently preferably a monovalent organic group selected from a substituted amino group and a substituted oxy group, and more preferably a substituted amino group. A "substituted amino group" refers to an amino group (-NH2) in which one or two hydrogen atoms have been substituted with a substituent. A "substituted oxy group" refers to a hydroxy group (-OH) in which a hydrogen atom has been substituted with a substituent.

[0031] Examples of substituted amino groups include "alkylamino groups" in which at least one of the substituents is an alkyl group, and "arylamino groups" in which at least one of the substituents is an aryl group, with alkylamino groups being preferred. Examples of substituted oxy groups include "alkoxy groups" in which the substituent is an alkyl group, and "aryloxy groups" in which the substituent is an aryl group, with aryloxy groups being preferred. The alkyl and aryl groups may further have a substituent.

[0032] The substituted amino group includes a "mono-substituted amino group" in which one hydrogen atom of the amino group (-NH2) is substituted with a substituent, and a "bis-substituted amino group" in which two hydrogen atoms of the amino group (-NH2) are substituted with substituents, and a mono-substituted amino group is preferred. As the mono-substituted amino group, a monoalkylamino group in which the substituent is an alkyl group is preferred. That is, in one embodiment, R 1 is preferably a monoalkylamino group.

[0033] In one embodiment, in formula (A-1), R 1 are each independently a monovalent organic group having a silsesquioxane structure. Examples of the silsesquioxane structure include a random structure, a ladder structure having a ladder skeleton, and a cage structure. The random structure or the cage structure is preferred, and the cage structure is more preferred.

[0034] A random structure refers to a structure in which the arrangement of silsesquioxane structures is irregular and incomplete. A typical random structure is a structure represented by the following formula (B-3). A typical ladder structure is a structure represented by the following formula (B-4). There are two types of cage structures: a fully condensed cage structure and an incompletely condensed cage structure. A fully condensed cage structure contains multiple cyclic structures composed of silsesquioxane structures, and these multiple cyclic structures form a closed space or can form a closed space after a reaction. An incompletely condensed cage structure refers to a structure in which at least one part of the fully condensed cage structure is not closed. Typical fully condensed cage structures include a T8 structure having eight silicon atoms represented by the following formula (B-5), a T10 structure having ten silicon atoms represented by the following formula (B-6), and a T12 structure having twelve silicon atoms represented by the following formula (B-7). A typical incompletely condensed cage structure is a structure represented by the following formula (B-8). [ka] (In formulas (B-3) to (B-8), R b each independently represents an alkyl group, an amino group, a hydroxy group, a glycidyl group, an epoxy group, a thiol group, an alkoxy group, a (meth)acryloyl group, or a combination thereof.

[0035] In formulas (B-3) to (B-8), R beach independently represents an alkyl group, an amino group, a hydroxy group, a glycidyl group, an epoxy group, a thiol group, an alkoxy group, a (meth)acryloyl group, or a combination thereof. b may be the same or different from each other.

[0036] R b The alkyl group represented by may be linear, branched, or cyclic. The alkyl group is preferably an alkyl group having 1 to 6 carbon atoms, more preferably an alkyl group having 1 to 4 carbon atoms, and even more preferably an alkyl group having 3 or 4 carbon atoms. Examples of the alkyl group include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a s-butyl group, a t-butyl group, an n-pentyl group, an isopentyl group, a hexyl group, a cyclopentyl group, and a cyclohexyl group. A methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a s-butyl group, or a t-butyl group is preferred, an n-propyl group, an isopropyl group, an n-butyl group, or an isobutyl group is more preferred, and an n-propyl group or an isobutyl group is even more preferred.

[0037] R b The alkoxy group represented by is preferably an alkoxy group having 1 to 6 carbon atoms, more preferably an alkoxy group having 1 to 3 carbon atoms, and even more preferably a methoxy group or an ethoxy group.

[0038] R b Examples of "combinations of these" include the following: [ka] (In the formula, * represents a bond.)

[0039] R 1 is, for example, a monovalent organic group having a silsesquioxane structure represented by any one of the above formulas (B-3) to (B-8), the substituent R b The monovalent group obtained by removing one hydrogen atom from 1 It can be said that:

[0040] Identification of whether the silsesquioxane structure has a random structure, a ladder structure, or a cage structure can be carried out according to a known method. As a specific identification method, for example, it can be carried out according to the method described in JP-A-2022-3126.

[0041] R 1 The mono-substituted amino group in R includes a monovalent group in which one hydrogen atom has been removed from the amino group of a primary amine. 1 Specific examples of mono-substituted amino groups that satisfy the above requirement include monovalent groups represented by the following formulae (Y-1-1) to (Y-1-9), with the monovalent group represented by formula (Y-1-1) or the monovalent group represented by formula (Y-1-5) being preferred, and the monovalent group represented by formula (Y-1-1) being more preferred. The monovalent groups represented by formulae (Y-1-1) to (Y-1-5) also qualify as monoalkylamino groups, and the monovalent groups represented by formulae (Y-1-6) to (Y-1-9) also qualify as monoarylamino groups. [ka] (In the formula, * represents a bond.)

[0042] R 1 Examples of the bis-substituted amino group in R include a monovalent group in which one hydrogen atom has been removed from the amino group of a secondary amine. 1 Specific examples of bis-substituted amino groups that satisfy the above requirement include monovalent groups represented by the following formulae (Y-2-1) to (Y-2-29). The monovalent groups represented by formulae (Y-2-2) to (Y-2-7) and (Y-2-29) also fall under the category of alkylamino groups, and the monovalent groups represented by formulae (Y-2-8) to (Y-2-29) also fall under the category of arylamino groups. [ka] (In the formula, * represents a bond.)

[0043] R 1Examples of the substituted oxy group in the formula (Y-3) include monovalent groups obtained by removing one hydrogen atom from the hydroxy group of a phenol, and monovalent groups obtained by removing one hydrogen atom from the hydroxy group of an alcohol, with the monovalent group obtained by removing one hydrogen atom from the hydroxy group of a phenol being preferred. A monovalent group obtained by removing one hydrogen atom from the hydroxy group of a phenol corresponds to an aryloxy group. A monovalent group obtained by removing one hydrogen atom from the hydroxy group of an alcohol corresponds to an alkoxy group, and includes monovalent groups obtained by removing one hydrogen atom from the hydroxy group of a primary alcohol, monovalent groups obtained by removing one hydrogen atom from the hydroxy group of a secondary alcohol, and monovalent groups obtained by removing one hydrogen atom from the hydroxy group of a tertiary alcohol, with the monovalent group obtained by removing one hydrogen atom from the hydroxy group of a primary alcohol being preferred. Specific examples of the substituted oxy group include monovalent groups represented by the following formulae (Y-3-1) to (Y-3-23). The monovalent groups represented by formulas (Y-3-1) to (Y-3-10) also fall under the category of aryloxy groups, and the monovalent groups represented by formulas (Y-3-11) to (Y-3-23) also fall under the category of alkoxy groups. [ka] (In the formula, * represents a bond.)

[0044] In formula (A-2), each A independently represents a divalent organic group having an optionally hydrogenated bisphenol skeleton. The optionally hydrogenated bisphenol skeleton is a rigid skeleton, and when component (1A) has the optionally hydrogenated bisphenol skeleton in formula (A-2), the dielectric loss tangent at high frequencies of the cured product can be reduced. In the present invention, "bisphenol" means "a compound having two hydroxyaryl groups in the molecule," and "bisphenol skeleton" means "a skeleton obtained by removing the two hydroxy groups from bisphenol." The term "optionally hydrogenated bisphenol skeleton" encompasses "hydrogenated bisphenol skeleton" and "unhydrogenated bisphenol skeleton." In this specification, when simply referring to a "bisphenol skeleton," it means "unhydrogenated bisphenol skeleton" unless otherwise specified. In one embodiment, A is preferably a divalent organic group having a bisphenol skeleton.

[0045] Examples of the bisphenol in the bisphenol skeleton include bisphenol A, bisphenol AP, bisphenol AF, bisphenol B, bisphenol BP, bisphenol C, bisphenol C2, bisphenol E, bisphenol F, bisphenol G, bisphenol M, bisphenol S, bisphenol P, bisphenol PH, bisphenol TMC, bisphenol Z, bisnaphthol, biphenol, bixylenol, and binaphthol, with bisphenol A, bisphenol F, bisphenol AF, bisphenol TMC, or biphenol being preferred, bisphenol A or bisphenol TMC being more preferred, and bisphenol TMC being even more preferred.

[0046] In one embodiment, in formula (A-2), A is preferably a divalent organic group having constituent atoms selected from carbon, hydrogen, oxygen, nitrogen, fluorine, silicon, sulfur, and chlorine atoms, more preferably a divalent organic group having constituent atoms selected from carbon, hydrogen, oxygen, nitrogen, fluorine, silicon, and chlorine atoms, still more preferably a divalent organic group having constituent atoms selected from carbon, hydrogen, oxygen, nitrogen, fluorine, and silicon atoms, still more preferably a divalent organic group having constituent atoms selected from carbon, hydrogen, oxygen, and nitrogen atoms, still more preferably a divalent organic group having constituent atoms selected from carbon, hydrogen, oxygen, and nitrogen atoms, still more preferably a divalent organic group having constituent atoms selected from carbon, hydrogen, and oxygen atoms, and particularly preferably a divalent organic group having constituent atoms of carbon and hydrogen atoms.

[0047] In one embodiment, the lower limit of the number of constituent atoms of A in formula (A-2) is preferably 20 or more, more preferably 25 or more or 30 or more, even more preferably 35 or more or 40 or more, and particularly preferably 45 or more or 50 or more. In one embodiment, it may be 60 or more, 70 or more, 80 or more, 90 or more, 100 or more, etc. The upper limit of the number of constituent atoms of A is preferably 300 or less or 250 or less, more preferably 200 or less or 180 or less, even more preferably 160 or less or 140 or less, and particularly preferably 120 or less or 110 or less.

[0048] In one embodiment, in formula (A-2), the number of carbon atoms in A is preferably 12 to 100. The lower limit of the number of carbon atoms in A is more preferably 14 or more or 16 or more, even more preferably 18 or more or 20 or more, and particularly preferably 22 or more. In one embodiment, the number may be 25 or more, 28 or more, 30 or more, 35 or more, 40 or more, 45 or more, etc. The upper limit of the number of carbon atoms in A is more preferably 90 or less or 80 or less, more preferably 70 or less or 60 or less, and particularly preferably 50 or less.

[0049] In one embodiment, in formula (A-2), A is preferably a divalent organic group represented by the following formula (A-4). [ka] (In formula (A-4), ring Ar 1 each independently represents an aromatic carbon ring having 6 to 10 carbon atoms which may have a substituent. 1 represents a single bond or a divalent group having 1 to 200 constituent atoms and containing atoms selected from carbon, hydrogen, oxygen, nitrogen, fluorine, silicon, and sulfur atoms. * represents a bond.

[0050] In formula (A-4), ring Ar 1 each independently represents an aromatic carbocyclic ring having 6 to 10 carbon atoms which may have a substituent. 1 are each independently a substituted aromatic carbocyclic ring having 6 to 10 carbon atoms. Examples of the aromatic carbocyclic ring having 6 to 10 carbon atoms include a benzene ring and a naphthalene ring, with a benzene ring being preferred.

[0051] Ring Ar 1Examples of the substituent that the aromatic carbocycle having 6 to 10 carbon atoms in the formula (I) may have include linear, branched, or cyclic alkyl groups having 1 to 10 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, s-butyl, i-butyl, t-butyl, cyclopentyl, and cyclohexyl; halogen atoms, such as fluorine, chlorine, bromine, and iodine; alkoxy groups having 1 to 10 carbon atoms, such as methoxy, ethoxy, propoxy, t-butoxy, and phenoxy; hydroxy groups; halogen-substituted alkyl groups, such as trifluoromethyl; cycloalkyloxy groups; aryl groups; arylalkyl groups; monovalent heterocyclic groups; alkylidene groups; amino groups; silyl groups; acyl groups; acyloxy groups; carboxy groups; sulfo groups; cyano groups; nitro groups; mercapto groups; and oxo groups. The above-mentioned substituents may further have a substituent (hereinafter sometimes referred to as a "secondary substituent"). The substituent may be contained alone or in combination of two or more kinds.

[0052] In one embodiment, the ring Ar 1 is preferably an aromatic carbocyclic ring having 6 to 10 carbon atoms which may have a substituent selected from an alkyl group having 1 to 10 carbon atoms and an aryl group having 1 to 10 carbon atoms, more preferably an aromatic carbocyclic ring having 6 to 10 carbon atoms which may have a substituent selected from an alkyl group having 1 to 10 carbon atoms, and even more preferably an aromatic carbocyclic ring having 6 to 10 carbon atoms which has a substituent selected from an alkyl group having 1 to 10 carbon atoms.

[0053] Ring Ar 1The alkyl group as a substituent in the formula (I) is a chain (straight-chain or branched) alkyl group or a cyclic alkyl group. The alkyl group preferably has 1 to 10 or 1 to 6 carbon atoms, more preferably 1 to 5, even more preferably 1 to 3, and particularly preferably 1. Examples of the chain alkyl group include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, an s-butyl group, a t-butyl group, an n-pentyl group, an isopentyl group, a hexyl group, a 2-ethylhexyl group, an octyl group, and a decyl group. Preferred are a methyl group, an ethyl group, an n-propyl group, an isopropyl group, and a t-butyl group. More preferred are a methyl group or an ethyl group, and even more preferred is a methyl group. Examples of the cyclic alkyl group include a cyclopentyl group, a cyclohexyl group, and a cyclooctyl group. Preferred is a cyclohexyl group.

[0054] An aryl group is an aromatic compound with one hydrogen atom removed from the aromatic ring. 1 The number of carbon atoms in the aryl group as a substituent in the formula (I) is preferably 1 to 10, more preferably 3 to 10, still more preferably 5 to 10, and particularly preferably 6 to 10. Examples of the aryl group include a phenyl group, a naphthyl group, a thienyl group, a pyrrolyl group, a furanyl group, a furyl group, a pyridyl group, a pyridazinyl group, a pyrimidyl group, a pyrazinyl group, a triazinyl group, a pyrrolidyl group, a piperidyl group, a quinolyl group, an isoquinolyl group, and a benzotriazolyl group, among which a phenyl group, a naphthyl group, or a benzotriazolyl group is preferred, a phenyl group or a naphthyl group is more preferred, and a phenyl group is more preferred.

[0055] In formula (A-4), X 1 represents a single bond or a divalent group having 1 to 200 constituent atoms and containing atoms selected from carbon, hydrogen, oxygen, nitrogen, fluorine, silicon and sulfur atoms.

[0056] X 1The constituent atoms of the divalent group in are preferably atoms selected from carbon atom, hydrogen atom, oxygen atom, nitrogen atom, fluorine atom and silicon atom, more preferably atoms selected from carbon atom, hydrogen atom, oxygen atom, nitrogen atom and silicon atom, further preferably atoms selected from carbon atom, hydrogen atom, oxygen atom and nitrogen atom, even more preferably atoms selected from carbon atom, hydrogen atom and oxygen atom, and particularly preferably carbon atom and hydrogen atom.

[0057] In one embodiment, X 1 The lower limit of the number of constituent atoms of the divalent group in X is preferably 1 or more, 2 or more, or 3 or more, more preferably 4 or more or 5 or more, even more preferably 6 or more or 7 or more, and particularly preferably 8 or more. In one embodiment, the number may be 10 or more, 12 or more, 14 or more, 16 or more, 18 or more, 20 or more, 22 or more, 24 or more, etc. 1 The upper limit of the number of constituent atoms of the divalent group in is preferably 200 or less, 160 or less, 140 or less, 120 or less, 100 or less, 90 or less, or 80 or less, more preferably 70 or less or 60 or less, even more preferably 50 or less or 40 or less, and particularly preferably 30 or less or 28 or less.

[0058] X 1 The divalent group in X preferably has 1 to 100 carbon atoms. 1 The lower limit of the number of carbon atoms in the divalent group in X is more preferably 2 or more or 3 or more, further preferably 4 or more or 5 or more, and particularly preferably 6 or more, 7 or more, or 8 or more. 2 The upper limit of the number of carbon atoms in the divalent group in is more preferably 80 or less or 60 or less, further preferably 50 or less or 40 or less, and particularly preferably 35 or less, 30 or less, 25 or less, 20 or less, 15 or less, or 10 or less.

[0059] In one embodiment, in formula (A-4), X 1is preferably an alkylene group having 1 to 20 carbon atoms which may have an oxygen atom, an arylene group having 1 to 20 carbon atoms, or a divalent group having 2 to 30 carbon atoms which is a combination thereof. The "alkylene group which may have an oxygen atom" includes an "alkylene group not having an oxygen atom" and an "oxyalkylene group". In the present invention, when simply referring to an "alkylene group", it means an "alkylene group not having an oxygen atom" unless otherwise specified. Furthermore, "combinations of these" may be combinations of two or more. Furthermore, "combinations of these" include combinations of two or more of "alkylene groups having 1 to 20 carbon atoms which may have an oxygen atom", combinations of two or more of "arylene groups having 1 to 20 carbon atoms", and combinations of two or more of both "alkylene groups having 1 to 20 carbon atoms which may have an oxygen atom" and "arylene groups having 1 to 20 carbon atoms". In one embodiment, X 1 is preferably an alkylene group having 1 to 20 carbon atoms, an arylene group having 1 to 20 carbon atoms, or a divalent group having 2 to 30 carbon atoms consisting of a combination thereof, and more preferably an alkylene group having 1 to 20 carbon atoms.

[0060] X 1The lower limit of the number of carbon atoms in the alkylene group is preferably 1 or more, more preferably 3 or more, more preferably 5 or more, more preferably 6 or more, and particularly preferably 7 or more, more preferably 8 or more. The upper limit of the number of carbon atoms in the alkylene group is preferably 20 or less, more preferably 18 or less, even more preferably 16 or less, more preferably 14 or less, and particularly preferably 12 or less, more preferably 10 or less. Examples of the alkylene group include a methylene group, an ethylene group, an ethylidene group, a 1,2-propylene group, a 1,3-propylene group, a 1,1-propylidene group, a 2,2-propylidene group, a 2,2-butylidene group, a 3-methyl-2,2-butylidene group, a 1,1-cyclopentylidene group, a 1,1-cyclohexylidene group, and a 3,3,5-trimethyl-1,1-cyclohexylidene group. Of these, a methylene group, a 2,2-propylidene group, or a 3,3,5-trimethyl-1,1-cyclohexylidene group is preferred, a 2,2-propylidene group or a 3,3,5-trimethyl-1,1-cyclohexylidene group is more preferred, and a 3,3,5-trimethyl-1,1-cyclohexylidene group is even more preferred.

[0061] X 1 Specific examples of the oxyalkylene group in the formula include those shown below: In the formula, "*" represents a bond, and a represents an integer of 1 to 20. [ka]

[0062] X 1The number of carbon atoms in the arylene group in the formula (I) is preferably 1 to 20. The lower limit of the number of carbon atoms in the arylene group is more preferably 3 or more or 4 or more, even more preferably 5 or more, and particularly preferably 6 or more. The upper limit of the number of carbon atoms in the arylene group is more preferably 16 or less or 12 or less, and even more preferably 10 or less. Examples of the arylene group include a phenylene group, a naphthylene group, a biphenylene group (—C6H4—C6H4—), a thienylene group, a pyrrolylene group, a furanylene group, a furylene group, a pyridylene group, a pyridazinylene group, a pyrimidylene group, a pyrazinylene group, a triazinylene group, a pyrrolylene group, a piperidylene group, a quinolylene group, and an isoquinolylene group. A phenylene group, a naphthylene group, or a biphenylene group is preferred, a phenylene group or a naphthylene group is more preferred, and a phenylene group is even more preferred.

[0063] X 1 In the above formula, the lower limit of the number of carbon atoms in the divalent group formed by a combination of an alkylene group having 1 to 20 carbon atoms, which may have an oxygen atom, and an arylene group having 1 to 20 carbon atoms is 2 or more, preferably 3 or more, 4 or more, or 5 or more, more preferably 6 or more, and particularly preferably 7 or more. The upper limit is preferably 30 or less, more preferably 25 or less, even more preferably 20 or less, and particularly preferably 15 or less or 12 or less. Examples of divalent groups formed by a combination of an alkylene group having 1 to 20 carbon atoms, which may have an oxygen atom, and an arylene group having 1 to 20 carbon atoms include those shown below. [ka] (In the formula, * represents a bond.)

[0064] X 1 In the case where the divalent group in X has two bonds at multiple positions, the bonds may be at any positions. 1 The structure may be such that the hydrogen atoms in the substituents are removed to form bonds. For example, X 1When X is a hexylene group, it may be any of a 1,2-hexylene group, a 1,3-hexylene group, a 1,4-hexylene group, a 1,5-hexylene group, a 1,6-hexylene group (hexamethylene group), a 2,3-hexylene group, a 2,4-hexylene group, a 2,5-hexylene group, a 3,4-hexylene group, etc. 1 When is a phenylene group, it may be a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.

[0065] Specific examples of A represented by formula (A-4) above include divalent organic groups represented by the following formulas (A-4-1) to (A-4-39). A divalent organic group represented by formula (A-4-1), a divalent organic group represented by formula (A-4-26), a divalent organic group represented by formula (A-4-27), a divalent organic group represented by formula (A-4-28), or a divalent organic group represented by formula (A-4-39) is preferred, a divalent organic group represented by formula (A-4-27) or a divalent organic group represented by formula (A-4-28) is more preferred, and a divalent organic group represented by formula (A-4-28) is even more preferred. [ka] (In the formula, * represents a bond.)

[0066] In one embodiment, in formula (A-2), A is preferably a divalent organic group represented by the following formula (A-5). [ka] (In formula (A-5), ring Ar 2 each independently represents an aromatic carbon ring having 6 to 10 carbon atoms which may have a substituent. 2 R represents a divalent group having 1 to 200 constituent atoms, the constituent atoms of which are selected from carbon atoms, hydrogen atoms, and oxygen atoms. 4 R each independently represents an alkylene group having 1 to 20 carbon atoms, an arylene group having 1 to 20 carbon atoms, or a divalent group having 2 to 30 carbon atoms and consisting of a combination thereof. 5 and R 6each independently represents an alkyl group having 1 to 20 carbon atoms or an aryl group having 1 to 20 carbon atoms. 5 and R 6 may be linked to form a ring. * represents a bond.

[0067] In formula (A-5), ring Ar 2 each independently represents an aromatic carbocyclic ring having 6 to 10 carbon atoms which may have a substituent, and the ring Ar 1 is the same as

[0068] In formula (A-5), X 2 represents a divalent group having 1 to 200 constituent atoms, the constituent atoms of which are selected from carbon atoms, hydrogen atoms, and oxygen atoms.

[0069] X 2 The constituent atoms of the divalent group in X are preferably carbon atoms and hydrogen atoms. 2 The lower limit of the number of constituent atoms of X is preferably 1 or more, 2 or more, or 3 or more, more preferably 4 or more or 5 or more, even more preferably 6 or more or 7 or more, and particularly preferably 8 or more or 9 or more. In one embodiment, it may be 10 or more, 15 or more, 20 or more, 25 or more, 30 or more, 35 or more, 40 or more, etc. 2 The upper limit of the number of constituent atoms is preferably 200 or less, 180 or less, or 160 or less, more preferably 140 or less or 120 or less, even more preferably 100 or less or 80 or less, and particularly preferably 60 or less, 50 or less, or 45 or less.

[0070] X 2 The divalent group in X preferably has 1 to 100 carbon atoms. 2 The lower limit of the number of carbon atoms in the divalent group in X is preferably 2 or more or 3 or more, more preferably 4 or more or 5 or more. In one embodiment, the number may be 6 or more, 8 or more, 10 or more, 12 or more, 14 or more, 16 or more, 18 or more, etc. 2 The upper limit of the number of carbon atoms in the divalent group in is more preferably 80 or less or 60 or less, further preferably 50 or less or 40 or less, and particularly preferably 35 or less, 30 or less, 25 or less, or 20 or less.

[0071] In one embodiment, in formula (A-5), X 2 is preferably an oxygen atom, an alkylene group having 1 to 50 carbon atoms, an arylene group having 1 to 20 carbon atoms which may have an alkyl group having 1 to 6 carbon atoms as a substituent, or a divalent group having 2 to 60 carbon atoms consisting of a combination thereof. The "combination of these" may be a combination of two or more of them. Furthermore, the "combination of these" may be a combination of two or more of the same type of "oxygen atom", "alkylene group having 1 to 50 carbon atoms", or "arylene group having 1 to 20 carbon atoms which may have an alkyl group having 1 to 6 carbon atoms as a substituent", or a combination of two or more of different types. In one embodiment, X 2 is preferably an alkylene group having 1 to 50 carbon atoms, an arylene group having 1 to 20 carbon atoms which may have an alkyl group having 1 to 6 carbon atoms as a substituent, or a divalent group having 2 to 60 carbon atoms consisting of a combination thereof, and more preferably a divalent group having 2 to 60 carbon atoms consisting of a combination of an alkylene group having 1 to 50 carbon atoms and an arylene group having 1 to 20 carbon atoms which may have an alkyl group having 1 to 6 carbon atoms as a substituent.

[0072] X 2 The number of carbon atoms in the alkylene group in the formula (I) is preferably 1 to 50 or 1 to 40, more preferably 1 to 30 or 1 to 20, still more preferably 1 to 10 or 1 to 6, and particularly preferably 1 to 5. Examples of the alkylene group include a methylene group, an ethylene group, an ethylidene group, a 1,2-propylene group, a 1,3-propylene group, a 1,4-butylene group, a 1,6-hexylene group, a 2,2,4-trimethyl-1,6-hexylene group, a 1,1-propylidene group, a 2,2-propylidene group, and an alkylene group having a carbon skeleton derived from a dimer acid, with a methylene group or a 2,2-propylidene group being preferred.

[0073] A carbon skeleton derived from a dimer acid refers to a carbon skeleton obtained by removing the two terminal carboxyl groups (-COOH) of a dimer acid, or a carbon skeleton obtained by replacing the two terminal carboxyl groups (-COOH) with methylene groups (-CH2-). Dimer acids are known compounds obtained by dimerizing unsaturated fatty acids (preferably those having 11 to 22 carbon atoms, more preferably those having 14 to 20 carbon atoms, and particularly preferably those having 18 carbon atoms), and their industrial production process is largely standardized in the industry. Dimer acids are particularly readily available, primarily consisting of 36-carbon dimer acids obtained by dimerizing 18-carbon unsaturated fatty acids such as oleic acid and linoleic acid, which are inexpensive and readily available. Furthermore, dimer acids may contain arbitrary amounts of monomer acids, trimer acids, other polymerized fatty acids, etc., depending on the production method, degree of purification, etc. Furthermore, although double bonds remain after the polymerization reaction of unsaturated fatty acids, in this specification, hydrogenated products obtained by further hydrogenation to reduce the degree of unsaturation are also included in the term "dimer acid."

[0074] X 2 The lower limit of the number of carbon atoms in the arylene group is preferably 3 or more or 4 or more, more preferably 5 or more, and even more preferably 6 or more. The upper limit of the number of carbon atoms in the arylene group is more preferably 16 or less or 12 or less, and even more preferably 10 or less or 8 or less. Examples of the arylene group include a phenylene group, a naphthylene group, a biphenylene group (—C6H4—C6H4—), a thienylene group, a pyrrolylene group, a furanylene group, a furylene group, a pyridylene group, a pyridazinylene group, a pyrimidylene group, a pyrazinylene group, a triazinylene group, a pyrrolylene group, a piperidylene group, a quinolylene group, and an isoquinolylene group. A phenylene group, a naphthylene group, or a biphenylene group is preferred, a phenylene group or a naphthylene group is more preferred, and a phenylene group is even more preferred.

[0075] X 2The alkyl group as a substituent in the arylene group is a chain (straight-chain or branched) alkyl group or a cyclic alkyl group. The number of carbon atoms in the alkyl group is preferably 1 to 6, more preferably 1 to 5, still more preferably 1 to 3, and particularly preferably 1 or 2. Examples of the chain alkyl group include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, an s-butyl group, a t-butyl group, an n-pentyl group, an isopentyl group, and a hexyl group. Preferred are a methyl group, an ethyl group, an n-propyl group, or an isopropyl group, more preferably a methyl group or an ethyl group, and even more preferably a methyl group. Examples of the cyclic alkyl group include a cyclopentyl group, a cyclohexyl group, and the like.

[0076] X 2 The lower limit of the number of carbon atoms in the divalent group formed by a combination of an oxygen atom, an alkylene group having 1 to 50 carbon atoms, and an arylene group having 1 to 20 carbon atoms which may have an alkyl group having 1 to 6 carbon atoms as a substituent is 2 or more, preferably 3 or more, 4 or more, or 5 or more, more preferably 6 or more or 7 or more, even more preferably 8 or more, 10 or more, 12 or more, or 14 or more, and particularly preferably 16 or more or 18 or more. The upper limit is preferably 60 or less, 50 or less, 45 or less, or 40 or less, more preferably 35 or less, or 30 or less, even more preferably 28 or less, 25 or less, and particularly preferably 22 or less, or 20 or less. Examples of divalent groups formed by a combination of an alkylene group having 1 to 50 carbon atoms and an arylene group having 1 to 20 carbon atoms which may have an alkyl group having 1 to 6 carbon atoms as a substituent include those shown below. [ka] (In the formula, * represents a bond.)

[0077] In one embodiment, in formula (A-5), X 2 is preferably a divalent group having an aromatic hydrocarbon ring and having 6 to 100 carbon atoms. The aromatic hydrocarbon ring is preferably a benzene ring or a naphthalene ring, and more preferably a benzene ring.

[0078] In one embodiment, in formula (A-5), X 2 is preferably a divalent group having a trimethylindane skeleton, and is preferably a divalent group represented by the following formula (A-9). [ka] (In formula (A-9), R a1 and R a2 Each of n independently represents a substituent. a1 represents a positive integer. a2 Each independently represents an integer of 0 to 4. a3 Each independently represents an integer of 0 to 3. * represents a bond. R a1 If there are multiple, they may be the same or different, and R a2 If there are multiple, they may be the same or different.)

[0079] In formula (A-9), R a1 represents a substituent. a1 The substituent represented by the formula (I) is preferably an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxy group, or a mercapto group. The hydrogen atom of each substituent may be further substituted with a halogen atom.

[0080] Among them, R a1 is more preferably one or more groups selected from the group consisting of alkyl groups having 1 to 4 carbon atoms, cycloalkyl groups having 3 to 6 carbon atoms, and aryl groups having 6 to 10 carbon atoms, and is even more preferably an alkyl group having 1 to 4 carbon atoms.

[0081] In formula (A-9), R a2 represents a substituent. a2The substituent represented by the formula (I) is preferably an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxy group, or a mercapto group. The hydrogen atom of each substituent may be further substituted with a halogen atom.

[0082] Among them, R a2 is more preferably one or more groups selected from the group consisting of alkyl groups having 1 to 4 carbon atoms, cycloalkyl groups having 3 to 6 carbon atoms, and aryl groups having 6 to 10 carbon atoms.

[0083] In formula (A-9), n a1 represents a positive integer. a1 is preferably 1 or more, preferably 10 or less, and more preferably 8 or less.

[0084] In formula (A-9), n a2 Each independently represents an integer of 0 to 4. a2 is preferably 2 or 3, more preferably 2. a2 may be different from each other, but are preferably the same. a2 If is 2 or more, multiple R a1 may be the same or different from each other.

[0085] In formula (A-9), n a3 represents an integer of 0 to 3. a3 When there are a plurality of n, they may be different from each other, but are preferably the same. a3 is preferably 0.

[0086] X represented by the above formula (A-9) 2 Specific examples of the above include the following: [ka] (In the formula, * represents a bond.)

[0087] X 2 In the case where the divalent group in X has two bonds at multiple positions, the bonds may be at any positions. 2 The structure may be such that the hydrogen atoms in the substituents are removed to form bonds. For example, X 2 When X is a hexylene group, it may be any of a 1,2-hexylene group, a 1,3-hexylene group, a 1,4-hexylene group, a 1,5-hexylene group, a 1,6-hexylene group (hexamethylene group), a 2,3-hexylene group, a 2,4-hexylene group, a 2,5-hexylene group, a 3,4-hexylene group, etc. 2 When is a phenylene group, it may be a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.

[0088] In formula (A-5), R 4 each independently represents an alkylene group having 1 to 20 carbon atoms, an arylene group having 1 to 20 carbon atoms, or a divalent group having 2 to 30 carbon atoms consisting of a combination thereof. "Combinations of these" may be combinations of two or more. "Combinations of these" also include combinations of two or more "alkylene groups having 1 to 20 carbon atoms", combinations of two or more "arylene groups having 1 to 20 carbon atoms", and combinations of two or more including both "alkylene groups having 1 to 20 carbon atoms" and "arylene groups having 1 to 20 carbon atoms". In one embodiment, R 4 are each independently preferably an alkylene group having 1 to 20 carbon atoms or an arylene group having 1 to 20 carbon atoms, more preferably an alkylene group having 1 to 20 carbon atoms.

[0089] R 4The alkylene group in the formula (I) is a chain (straight-chain or branched) alkylene group or a cyclic alkylene group. The alkylene group preferably has 1 to 20 carbon atoms. The lower limit of the number of carbon atoms of the alkylene group is more preferably 2 or more. The upper limit of the number of carbon atoms of the alkylene group is more preferably 18 or less or 16 or less, even more preferably 14 or less or 12 or less, and particularly preferably 10 or less, 8 or less, 6 or less, 4 or less, or 3 or less. Examples of the chain alkylene group include a methylene group, an ethylene group, a propylene group, a butylene group, an isobutylene group, a pentylene group, a hexylene group, a heptylene group, an octylene group, a nonylene group, and a decylene group. A methylene group, an ethylene group, a propylene group, or a butylene group is preferred, and an ethylene group is more preferred. Examples of the cyclic alkylene group include a cyclopropylene group, a cyclobutylene group, a cyclopentylene group, a cyclohexylene group, a decahydronaphthalene group, a norbornanylene group, a dicyclopentanylene group, and an adamantanylene group, with a cyclohexylene group being preferred.

[0090] R 4 The arylene group in the formula (I) is a group obtained by removing two hydrogen atoms on an aromatic ring from an aromatic compound. The number of carbon atoms in the arylene group is preferably 1 to 20. The lower limit of the number of carbon atoms in the arylene group is preferably 3 or more or 4 or more, more preferably 5 or more, and even more preferably 6 or more. The upper limit of the number of carbon atoms in the arylene group is more preferably 16 or less or 12 or less, and even more preferably 10 or less or 8 or less. Examples of the arylene group include a phenylene group, a naphthylene group, a biphenylene group (—C6H4—C6H4—), a thienylene group, a pyrrolylene group, a furanylene group, a furylene group, a pyridylene group, a pyridazinylene group, a pyrimidylene group, a pyrazinylene group, a triazinylene group, a pyrrolylene group, a piperidylene group, a quinolylene group, and an isoquinolylene group. A phenylene group, a naphthylene group, or a biphenylene group is preferred, a phenylene group or a naphthylene group is more preferred, and a phenylene group is even more preferred.

[0091] R 4In the above formula, the lower limit of the number of carbon atoms in the divalent group formed by a combination of an alkylene group having 1 to 20 carbon atoms and an arylene group having 1 to 20 carbon atoms is 2 or more, preferably 3 or more, 4 or more, or 5 or more, more preferably 6 or more, and particularly preferably 7 or more. The upper limit is preferably 30 or less, more preferably 25 or less, even more preferably 20 or less, and particularly preferably 15 or less or 12 or less. Examples of divalent groups formed by a combination of an alkylene group having 1 to 20 carbon atoms and an arylene group having 1 to 20 carbon atoms include those shown below. [ka] (In the formula, * represents a bond.)

[0092] R 4 When the divalent group in the formula (I) has two bonds at multiple positions, the bonds may be at any positions. For example, R 4 When R is a hexylene group, it may be any of a 1,2-hexylene group, a 1,3-hexylene group, a 1,4-hexylene group, a 1,5-hexylene group, a 1,6-hexylene group (hexamethylene group), a 2,3-hexylene group, a 2,4-hexylene group, a 2,5-hexylene group, a 3,4-hexylene group, etc. 4 When is a phenylene group, it may be a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.

[0093] Among these, R 4 As the alkyl group, an ethylene group, a phenylene group or a xylylene group is preferred, and an ethylene group is more preferred.

[0094] In formula (A-5), R 5 and R 6 each independently represents an alkyl group having 1 to 20 carbon atoms or an aryl group having 1 to 20 carbon atoms. 5 and R 6 are each preferably independently an alkyl group having 1 to 20 carbon atoms.

[0095] R5 and R 6 The alkyl group in the formula (I) is a chain (straight-chain or branched) alkyl group or a cyclic alkyl group. The number of carbon atoms in the alkyl group is preferably 1 to 20 or 1 to 10, more preferably 1 to 6, even more preferably 1 to 5 or 1 to 3, and particularly preferably 1 or 2. Examples of the chain alkyl group include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, an s-butyl group, a t-butyl group, an n-pentyl group, an isopentyl group, a hexyl group, a 2-ethylhexyl group, an octyl group, and a decyl group. Preferred are a methyl group, an ethyl group, an n-propyl group, or an isopropyl group, more preferably a methyl group or an ethyl group, and even more preferably an ethyl group. Examples of the cyclic alkyl group include a cyclopentyl group, a cyclohexyl group, and a cyclooctyl group.

[0096] R 5 and R 6 The number of carbon atoms in the aryl group in the formula (I) is preferably 1 to 20 or 1 to 10, more preferably 3 to 10, further preferably 5 to 10, and particularly preferably 6 to 10. Examples of the aryl group include a phenyl group, a naphthyl group, a thienyl group, a pyrrolyl group, a furanyl group, a furyl group, a pyridyl group, a pyridazinyl group, a pyrimidyl group, a pyrazinyl group, a triazinyl group, a pyrrolidyl group, a piperidyl group, a quinolyl group, and an isoquinolyl group, and a phenyl group or a naphthyl group is preferred, and a phenyl group is more preferred.

[0097] In formula (A-5), R 5 and R 6 may be linked to form a ring, and preferably are linked to form a ring. Examples of the ring formed include a 5-membered ring, a 6-membered ring, and a 7-membered ring, with a 6-membered ring being preferred. When forming a ring, one hydrogen atom may be removed from the above-mentioned "alkyl group having 1 to 20 carbon atoms or aryl group having 1 to 20 carbon atoms" to form a divalent group, and each of these may be bonded to two nitrogen atoms in formula (A-5) to form a structure.

[0098] In one embodiment, in formula (A-2), A is preferably a divalent organic group represented by the following formula (A-10): That is, in the divalent organic group represented by the above formula (A-5), R 5 and R 6 A preferred embodiment in which the groups are linked to form a ring is a divalent organic group represented by the following formula (A-10). [ka] (In formula (A-10), ring Ar 2 each independently represents an aromatic carbon ring having 6 to 10 carbon atoms which may have a substituent. 2 represents a divalent group having 1 to 200 constituent atoms, the constituent atoms of which are selected from carbon atoms, hydrogen atoms, and oxygen atoms. * represents a bond.

[0099] In formula (A-10), ring Ar 2 each independently represents an aromatic carbocyclic ring having 6 to 10 carbon atoms which may have a substituent, and the ring Ar 2 is the same as

[0100] In formula (A-10), X 2 represents a divalent group having 1 to 200 constituent atoms selected from carbon atoms, hydrogen atoms, and oxygen atoms, and X in formula (A-5) 2 is the same as

[0101] Specific examples of A represented by the above formula (A-5) include divalent organic groups represented by the following formulas (A-5-1) to (A-5-17), and the divalent organic group represented by formula (A-5-1) or the divalent organic group represented by formula (A-5-3) is preferred, and the divalent organic group represented by formula (A-5-3) is more preferred. The divalent organic groups represented by the following formulas (A-5-1) to (A-5-13) also correspond to specific examples of the divalent organic group represented by formula (A-10). In addition, the divalent organic groups represented by formulas (A-5-1) to (A-5-13) and (A-5-16) can be used in combination with R in formula (A-5). 5 and R 6 corresponds to a specific example where they are linked to form a ring. [ka] (In the formula, * represents a bond.) [ka] (In the formula, * represents a bond.) [ka] (In the formula, * represents a bond.)

[0102] In one embodiment, the component (1A) preferably has two or more structural units represented by formula (A-2) in which A is different, and more preferably, the two or more As include a divalent group represented by formula (A-4) above and a divalent group represented by formula (A-5) above.

[0103] In component (1A), when the number of divalent groups represented by formula (A-5) is M5 and the number of divalent groups represented by formula (A-4) is M4, the ratio of M5 to M4 (M5 / M4) is preferably 0.05 to 5. By having the ratio (M5 / M4) within the above range, the dielectric loss tangent of the cured product can be further reduced, thereby further improving the adhesion between the cured product (insulating layer) and the conductor layer. The lower limit of the ratio (M5 / M4) is more preferably 0.08 or 0.1 or more, even more preferably 0.12 or 0.15 or more, and particularly preferably 0.18 or more, 0.2 or more, 0.25 or more, or 0.3 or more. The upper limit of the ratio (M5 / M4) is more preferably 4 or 3 or less, even more preferably 2 or 1 or less, and particularly preferably 0.8 or less, 0.6 or less, 0.5 or less, or 0.4 or less.

[0104] In addition to the structural unit represented by the formula (A-1) and the structural unit represented by the formula (A-2), the component (1A) preferably further comprises a structural unit represented by the following formula (A-6): The structural unit represented by the formula (A-6) is preferably bonded to the structural unit represented by the formula (A-2). In one embodiment, the structural unit represented by the formula (A-2) is preferably bonded to the structural unit represented by the formula (A-6). [ka] (In formula (A-6), R 2 are each independently a monovalent organic group having constituent atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 2 The molecular weight of R is less than 250. 2 does not have an ethylenically unsaturated group, and R 2 does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton.

[0105] In formula (A-6), R 2 are each independently a monovalent organic group having constituent atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 2 The molecular weight of R is less than 250. 2 does not have an ethylenically unsaturated group, and R 2 does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton.

[0106] In one embodiment, R 2 The molecular weight of is preferably 240 or less or 230 or less, more preferably 220 or less or 210 or less, even more preferably 200 or less, 190 or less or 180 or less, and particularly preferably 170 or less, 160 or less or 150 or less.

[0107] R 2 However, the absence of at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton means that the formula (A-6) represents a linear structure. 2 is preferably a monovalent organic group that does not contain both a triazine skeleton and an optionally hydrogenated bisphenol skeleton.

[0108] R 2The constituent atoms of R are atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon and sulfur atoms, more preferably atoms selected from carbon, hydrogen, oxygen, nitrogen and silicon atoms, still more preferably atoms selected from carbon, hydrogen, oxygen and nitrogen atoms, and particularly preferably atoms selected from carbon, hydrogen and oxygen atoms. 2 By containing an oxygen atom or a nitrogen atom, the adhesion between the cured product (insulating layer) and the conductor layer can be further improved.

[0109] R 2 The number of constituent atoms of R is preferably 1 to 50. 2 The lower limit of the number of constituent atoms of R is more preferably 2 or more, 4 or more, 6 or more, or 8 or more, further preferably 10 or more or 12 or more, and particularly preferably 14 or more or 16 or more. 2 The upper limit of the number of constituent atoms is more preferably 48 or less or 46 or less, even more preferably 44 or less or 42 or less, and particularly preferably 40 or less or 38 or less. In one embodiment, it may be 35 or less, 30 or less, 25 or less, 20 or less, etc.

[0110] R 2 The number of carbon atoms in R is preferably 1 to 20. 2 The lower limit of the number of carbon atoms in R is more preferably 2 or more or 3 or more, further preferably 4 or more or 5 or more, and particularly preferably 6 or more, 7 or more, 8 or more, or 9 or more. 2 The upper limit of the number of carbon atoms is more preferably 18 or less, even more preferably 16 or less, and particularly preferably 14 or less or 12 or less.

[0111] In formula (A-6), R 2are each independently preferably a monovalent organic group selected from the group consisting of a saturated aliphatic group, an aromatic group, and a combination of a saturated aliphatic group and an aromatic group. The aromatic group also includes an aryloxy group, an arylamino group, an arylthio group, etc., in which an oxygen atom, a nitrogen atom, a sulfur atom, etc. is bonded to an aromatic ring. The aromatic group is preferably an aromatic carbocyclic group. The aromatic carbocyclic group means an aromatic group in which the backbone atom on the aromatic ring is a carbon atom. That is, in one embodiment, R 2 is more preferably each independently a monovalent organic group selected from the group consisting of a saturated aliphatic group, an aromatic carbocyclic group, and a combination of a saturated aliphatic group and an aromatic carbocyclic group.

[0112] In formula (A-6), R 2 are each independently preferably a monovalent organic group selected from a substituted amino group and a substituted oxy group, and more preferably a substituted oxy group. A "substituted amino group" refers to an amino group (-NH2) in which one or two hydrogen atoms have been substituted with a substituent. A "substituted oxy group" refers to a hydroxy group (-OH) in which a hydrogen atom has been substituted with a substituent.

[0113] Substituted amino groups include "alkylamino groups" in which at least one of the substituents is an alkyl group, and "arylamino groups" in which at least one of the substituents is an aryl group, with alkylamino groups being preferred. Substituted oxy groups include "alkoxy groups" in which the substituent is an alkyl group, and "aryloxy groups" in which the substituent is an aryl group, with aryloxy groups being preferred. Preferred aryloxy groups are phenoxy groups or naphthoxy groups. Naphthoxy groups include 1-naphthoxy groups and 2-naphthoxy groups, with 1-naphthoxy groups being preferred. The alkyl groups and aryl groups may further have a substituent.

[0114] Substituted amino groups include "mono-substituted amino groups" in which one hydrogen atom of the amino group (-NH2) is substituted with a substituent, and "bis-substituted amino groups" in which two hydrogen atoms of the amino group (-NH2) are substituted with substituents, with mono-substituted amino groups being preferred. As the mono-substituted amino group, a mono-alkylamino group in which the substituent is an alkyl group is preferred. R 2 Examples of the mono-substituted amino group in the formula (I) include a monovalent group in which one hydrogen atom has been removed from the amino group of a primary amine.

[0115] That is, in one embodiment, R 2 is preferably an aryloxy group or a monoalkylamino group, more preferably an aryloxy group, further preferably a phenoxy group or a naphthoxy group, and particularly preferably a naphthoxy group.

[0116] R 2 Specific examples of include monovalent groups represented by the following formulae (Y-4-1) to (Y-4-37). Of these, a monovalent group represented by formula (Y-4-9), a monovalent group represented by formula (Y-4-10), a monovalent group represented by formula (Y-4-11), or a monovalent group represented by formula (Y-4-12) is preferred, a monovalent group represented by formula (Y-4-9) or a monovalent group represented by formula (Y-4-12) is more preferred, and a monovalent group represented by formula (Y-4-9) is even more preferred. The monovalent groups represented by formulae (Y-4-1) to (Y-4-10) and (Y-4-16) to (Y-4-37) also qualify as aryloxy groups. The monovalent groups represented by formulae (Y-4-11) to (Y-4-13) also qualify as monoalkylamino groups. [ka] (In the formula, * represents a bond.)

[0117] In the component (1A), when the number of repeats of the structural unit represented by formula (A-1) is N1, the number of repeats of the structural unit represented by formula (A-2) is N2, the number of repeats of the structural unit represented by formula (A-6) is N6, and if other structural units are present, the number of repeats of the other structural units is N0, the ratio α defined by the following formula (1) is preferably 0.9 to 1. The lower limit of α is more preferably 0.91 or more, 0.92 or more, or 0.93 or more, even more preferably 0.94 or more, 0.95 or more, or 0.96 or more, and particularly preferably 0.97 or more, 0.98 or more, or 0.99 or more.

number

[0118] In one embodiment, when N1 is the number of repeating structural units represented by formula (A-1) in component (1A) and N6 is the number of repeating structural units represented by formula (A-6), the ratio of N6 to N1 (N6 / N1) is preferably 0.1 to 20. The lower limit of the ratio (N6 / N1) is preferably 0.2 or 0.4 or more, more preferably 0.6 or 0.8 or more, even more preferably 1 or 1.2 or more, and particularly preferably 1.4 or more, 1.6 or 1.8 or more. The upper limit of the ratio (N6 / N1) is preferably 18 or 16 or less, more preferably 14 or 12 or less, even more preferably 10 or 8 or less, and particularly preferably 6 or 4 or less, 3 or 2.5 or less.

[0119] In one embodiment, the component (1A) is preferably a polymer having a structural unit represented by the following formula (A-3). [ka] (In formula (A-3), R 1 are each independently a monovalent organic group having constituent atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 1 The molecular weight of R is 250 or more. 1 does not have an ethylenically unsaturated group, and R 1does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. Each A independently represents a divalent organic group having an optionally hydrogenated bisphenol skeleton.

[0120] In formula (A-3), R 1 are each independently a monovalent organic group having constituent atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 1 The molecular weight of R is 250 or more. 1 does not have an ethylenically unsaturated group, and R 1 does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. 1 is R in formula (A-1) 1 is the same as

[0121] In formula (A-3), each A independently represents a divalent organic group having a bisphenol skeleton which may be hydrogenated, and is the same as A in formula (A-2).

[0122] In one embodiment, the component (1A) preferably has a structural unit represented by the following formula (A-7) in addition to the structural unit represented by the above formula (A-3). [ka] (In formula (A-7), R 2 are each independently a monovalent organic group having constituent atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 2 The molecular weight of R is less than 250. 2 does not have an ethylenically unsaturated group, and R 2 does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. Each A independently represents a divalent organic group having an optionally hydrogenated bisphenol skeleton.

[0123] In formula (A-7), R 2are each independently a monovalent organic group having constituent atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 2 The molecular weight of R is less than 250. 2 does not have an ethylenically unsaturated group, and R 2 does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. 2 is R in formula (A-6) 2 is the same as

[0124] In formula (A-7), each A independently represents a divalent organic group having a bisphenol skeleton which may be hydrogenated, and is the same as A in formula (A-2).

[0125] In one embodiment, the component (1A) is preferably a polymer having a structure represented by the following formula (A-8). [ka] (In formula (A-8), n1 represents an integer of 1 or more, and n2 represents an integer of 0 or more. R 1 , R 2 and R are each independently a monovalent organic group having constituent atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 1 The molecular weight of R is 250 or more. 2 The molecular weight of R is less than 250. 1 , R 2 and R does not have an ethylenically unsaturated group, and R 1 , R 2 and R do not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. Each A independently represents a divalent organic group having an optionally hydrogenated bisphenol skeleton.

[0126] In formula (A-8), n1 represents an integer of 1 or more. The upper limit of n1 is preferably 110 or less, 100 or less, 90 or less, 80 or less, 70 or less, 60 or less, 50 or less, or 40 or less, more preferably 35 or less, or 30 or less, even more preferably 25 or less, or 20 or less, and particularly preferably 15 or less, or 10 or less.

[0127] In formula (A-8), n2 represents an integer of 0 or greater. The lower limit of n2 is preferably 1 or greater. The upper limit of n2 is preferably 110 or less, 100 or less, 90 or less, 80 or less, 70 or less, 60 or less, 50 or less, or 40 or less, more preferably 35 or less, or 30 or less, even more preferably 25 or less, or 20 or less, and particularly preferably 15 or less, or 10 or less.

[0128] The sum of n1 and n2 (n1+n2) is preferably 1 to 110. The upper limit of n1+n2 is more preferably 100 or less, 90 or less, 80 or less, 70 or less, 60 or less, 50 or less, 40 or less, 35 or less, or 30 or less, even more preferably 25 or less, or 20 or less, and particularly preferably 15 or less, or 10 or less.

[0129] In formula (A-8), R 1 , R 2 and R are each independently a monovalent organic group having constituent atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, and R 1 The molecular weight of R is 250 or more. 2 The molecular weight of R is less than 250. 1 , R 2 and R does not have an ethylenically unsaturated group, and R 1 , R 2 and R does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. 1 is R in formula (A-1) 1 The same as R in formula (A-8) 2 is R in formula (A-6) 2 A preferred embodiment of R in formula (A-8) is the same as R in formula (A-1). 1 and R in formula (A-6).2 That is, R may have either a molecular weight of 250 or more or a molecular weight of less than 250. In formula (A-8), by having R at the terminal portion, n1 and n2 in formula (A-8) can be adjusted to an appropriate range.

[0130] Specific examples of the component (1A) include polymers represented by the following formulas (A-8-1) to (A-8-4). [ka] [ka] [ka] [ka]

[0131] The weight-average molecular weight of component (1A) is preferably 1,000 to 50,000. The lower limit of the weight-average molecular weight is more preferably 1,200 or more, even more preferably 1,400 or more, 1,500 or more, or 2,000 or more, and even more preferably 2,500 or more, 3,000 or more, 3,500 or more, or 4,000 or more. The upper limit of the weight-average molecular weight is more preferably 45,000 or less, 40,000 or less, 35,000 or less, 30,000 or less, 25,000 or less, 20,000 or less, 15,000 or less, or 12,000 or less, and even more preferably 10,000 or less, or 9,000 or less. In one embodiment, it may be 7,500 or less, 6,000 or less, etc. The weight-average molecular weight of the resin can be measured as a polystyrene-equivalent value by gel permeation chromatography (GPC).

[0132] The content of component (1A) in the resin composition is preferably 1% by mass or more, more preferably 3% by mass or more or 5% by mass or more, even more preferably 6% by mass or more, 8% by mass or more or 10% by mass or more, and particularly preferably 12% by mass or more or 14% by mass or more, based on 100% by mass of the nonvolatile components in the resin composition, from the viewpoint of significantly achieving the effects of the present invention. The upper limit is preferably 30% by mass or less or 28% by mass or less, more preferably 26% by mass or less or 24% by mass or less, even more preferably 22% by mass or less or 20% by mass or less, and particularly preferably 18% by mass or less. In one embodiment, the content of component (1A) is preferably 1 to 30% by mass, based on 100% by mass of the nonvolatile components in the resin composition. In the present invention, the "nonvolatile components" in the resin composition refer to all components constituting the resin composition other than the organic solvent, as described below.

[0133] The content of component (1A) in the resin composition, when the resin components in the resin composition are taken as 100% by mass, is preferably 2% by mass or more or 5% by mass or more, more preferably 10% by mass or more, 15% by mass or more or 20% by mass or more, even more preferably 25% by mass or more, 30% by mass or more or 35% by mass or more, and particularly preferably 40% by mass or more, 45% by mass or more or 50% by mass or more, based on the resin components in the resin composition as 100% by mass. The upper limit is preferably 90% by mass or less, more preferably 85% by mass or less or 80% by mass or less, even more preferably 75% by mass or less or 70% by mass or less, and particularly preferably 65% ​​by mass or less or 60% by mass or less. In the present invention, the "resin components" in the resin composition refers to the non-volatile components constituting the resin composition, excluding inorganic fillers.

[0134] <(1A) Method for producing polymer having first specific structure> There are no limitations on the method for producing component (1A). Component (1A) can be obtained, for example, by reacting cyanuric chloride, an optionally hydrogenated bisphenol, a compound represented by the following formula (X-1), and a monophenol. [ka] (In formula (X-1), R 1 is a monovalent organic group having atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms as constituent atoms, and R 1 The molecular weight of R is 250 or more. 1 does not have an ethylenically unsaturated group, and R 1 does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton.

[0135] Cyanuric acid chloride is a compound represented by the following formula (X-4). [ka]

[0136] In formula (X-1), R 1 is a monovalent organic group having atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms as constituent atoms, and R 1 The molecular weight of R is 250 or more. 1 does not have an ethylenically unsaturated group, and R 1 does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. 1 is R in formula (A-1) 1 is the same as

[0137] Specific examples of the compound represented by formula (X-1) include a compound represented by the following formula (X-1-1) and a compound represented by the following formula (X-1-2). The compound represented by formula (X-1-1) can be synthesized, for example, by reacting cyanuric chloride with a compound represented by formula (X-9). The compound represented by formula (X-1-2) can be synthesized, for example, by reacting cyanuric chloride with tritylamine. Specifically, the compound can be synthesized by the method described in "ACS Chemical Biology, 2017, 12(10), pp. 2552-2528," the method described in "Chemistry of Materials, 2018, 30(7), pp. 2424-2435," or the method described in "Journal of Peptide Science, 2008, 14(5), pp. 596-609." [ka] [ka]

[0138] The bisphenols which may be hydrogenated include hydrogenated bisphenols and non-hydrogenated bisphenols, and non-hydrogenated bisphenols (hereinafter simply referred to as "bisphenols") are preferred. The bisphenols which may be hydrogenated are preferably compounds represented by the following formula (X-2): [ka] (In formula (X-2), A represents a divalent organic group having a bisphenol skeleton which may be hydrogenated.)

[0139] In formula (X-2), A represents a divalent organic group having a bisphenol skeleton which may be hydrogenated, and is the same as A in formula (A-2).

[0140] In formula (X-2), when A is a divalent organic group represented by formula (A-10) above, i.e., when the optionally hydrogenated bisphenol is a compound represented by formula (X-6) below, the compound can be synthesized by reacting 1-(hydroxyaryl)piperazine (a compound represented by formula (X-7) below) with bismaleimide (a compound represented by formula (X-8) below). Specifically, the compound can be synthesized by the production method described in "International Journal of Polymeric Materials and Polymeric Biomaterials, 2013, 62(8), pp. 455-461." [ka] (In the formulas (X-6), (X-7) and (X-8), the ring Ar 2 each independently represents an aromatic carbon ring having 6 to 10 carbon atoms which may have a substituent. 2 represents a divalent group having 1 to 200 constituent atoms, the constituent atoms of which are selected from carbon atoms, hydrogen atoms, and oxygen atoms. * represents a bond.

[0141] In one embodiment of the production of component (1A), it is preferable to use two or more optionally hydrogenated bisphenols represented by formula (X-2) in which different As are used, and it is more preferable that the two or more As include a divalent group represented by formula (A-4) above and a divalent group represented by formula (A-5) above.

[0142] The monophenols preferably contain, as constituent atoms, atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms, more preferably atoms selected from carbon, hydrogen, oxygen, nitrogen, and silicon atoms, still more preferably atoms selected from carbon, hydrogen, oxygen, and nitrogen atoms, and particularly preferably atoms selected from carbon, hydrogen, and oxygen atoms.

[0143] The molecular weight of the monophenols is preferably 250 or less, less than 250, 240 or less, or 230 or less, more preferably 220 or less or 210 or less, even more preferably 200 or less, 190 or less, or 180 or less, and particularly preferably 170 or less, 160 or less, or 150 or less.

[0144] The monophenols preferably have no ethylenically unsaturated groups, and more preferably have no reactive substituents.

[0145] The number of carbon atoms in the monophenols is preferably 6 to 20. The lower limit of the number of carbon atoms in the monophenols is more preferably 7 or more, even more preferably 8 or more, and particularly preferably 9 or more. The upper limit of the number of carbon atoms in the monophenols is more preferably 18 or less, even more preferably 16 or less, and particularly preferably 14 or less or 12 or less.

[0146] The number of constituent atoms of the monophenols is preferably 13 to 50. The lower limit of the number of constituent atoms of the monophenols is more preferably 14 or more, even more preferably 15 or more, and particularly preferably 16 or more. The upper limit of the number of constituent atoms of the monophenols is more preferably 48 or less or 46 or less, even more preferably 44 or less or 42 or less, and particularly preferably 40 or less, 38 or less, 35 or less, 30 or less, 25 or less, or 20 or less.

[0147] Examples of the monophenols include phenol which may have a substituent and naphthol which may have a substituent. In one embodiment, the monophenol is preferably naphthol. Examples of the naphthol include 1-naphthol and 2-naphthol, and 1-naphthol is preferred.

[0148] The reaction of cyanuric chloride, optionally hydrogenated bisphenols, the compound represented by formula (X-1), and monophenols may proceed in a solvent-free system or in an organic solvent system. Examples of organic solvents used in the reaction include ether solvents such as diethyl ether, tetrahydrofuran (THF), and dibutyl ether; ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; acetate ester solvents such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, and carbitol acetate; carbitol solvents such as cellosolve and butyl carbitol; aromatic hydrocarbon solvents such as toluene and xylene; and amide solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methyl-2-pyrrolidone. These organic solvents may be used alone or in combination.

[0149] In the above reaction, a base may be used. Examples of the base include alkali metal hydroxides such as sodium hydroxide (caustic soda) and potassium hydroxide; alkali metal carbonates such as sodium carbonate and potassium carbonate; alkali metal hydrogen carbonates such as sodium hydrogen carbonate and potassium hydrogen carbonate; and tertiary amines such as triethylamine, pyridine, and N,N-dimethyl-4-aminopyridine (DMAP). The base may be used alone or in combination of two or more.

[0150] The reaction temperature for the above reaction is preferably 10° C. or higher, more preferably 15° C. or higher, even more preferably 20° C. or higher, 25° C. or higher, or 30° C. or higher, and particularly preferably 35° C. or higher, 40° C. or higher, or 45° C. The upper limit of the reaction temperature is preferably 100° C. or lower or 90° C. or lower, more preferably 80° C. or lower or 70° C. or lower, and even more preferably 60° C. or lower.

[0151] The reaction time for the above reaction is preferably 0.1, 0.3, or 0.5 hours or more, more preferably 1 or 2 hours or more, even more preferably 3 or 4 hours or more, and particularly preferably 5 or 6 hours or more. The upper limit of the reaction time is preferably 48 hours or less, 40 hours or less, 32 hours or less, 24 hours or less, or 20 hours or less, more preferably 16 hours or less, 12 hours or less, and even more preferably 10 hours or less.

[0152] After the reaction, the resulting polymer may be purified. For example, after the reaction, a purification step such as washing with water or microfiltration may be performed to remove by-product salts and excess starting materials from the system. Specifically, after the reaction, an amount of water necessary to dissolve the by-product salts is added, and the mixture is allowed to stand and separated, and the aqueous layer is discarded. At this time, an organic solvent for extraction such as ethyl acetate may be added. If necessary, an acid is added for neutralization, and water washing is repeated. Thereafter, the polymer is purified by microfiltration to remove impurities through a dehydration step using a chemical or azeotropic method, and then, if necessary, the organic solvent is removed by distillation to obtain a polymer. The organic solvent may be used as is as the organic solvent for the resin composition without completely removing it. Alternatively, a solvent (poor solvent) in which the polymer has low solubility may be added to precipitate the polymer, and the resulting solid may be filtered for purification. The solid obtained by filtration is preferably dried under reduced pressure to volatilize the solvent.

[0153] <(B) Epoxy resin> The resin composition according to the first embodiment of the present invention contains (B) an epoxy resin. The epoxy resin is a curable resin having an epoxy group and an epoxy equivalent of 5,000 g / eq. or less. The (B) epoxy resin may be used alone or in combination of two or more.

[0154] The type of (B) epoxy resin is not particularly limited as long as it has one or more (preferably two or more) epoxy groups in one molecule. Examples of (B) epoxy resins include bixylenol-type epoxy resins, bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, bisphenol S-type epoxy resins, bisphenol AF-type epoxy resins, dicyclopentadiene-type epoxy resins, trisphenol-type epoxy resins, naphthol novolac-type epoxy resins, phenol novolac-type epoxy resins, tert-butyl-catechol-type epoxy resins, naphthalene-type epoxy resins, naphthol-type epoxy resins, anthracene-type epoxy resins, glycidylamine-type epoxy resins, glycidyl ester-type epoxy resins, cresol novolac-type epoxy resins, phenol aralkyl-type epoxy resins, biphenyl-type epoxy resins, biphenyl aralkyl-type epoxy resins, linear Examples of the epoxy resin include aliphatic epoxy resins, epoxy resins having a butadiene structure, alicyclic epoxy resins, heterocyclic epoxy resins, spiro ring-containing epoxy resins, cyclohexane-type epoxy resins, cyclohexanedimethanol-type epoxy resins, naphthylene ether-type epoxy resins, trimethylol-type epoxy resins, tetraphenylethane-type epoxy resins, isocyanurate-type epoxy resins, phenolphthalimidine-type epoxy resins, glycerol-type epoxy resins, alkyleneoxy skeleton-containing epoxy resins, fluorene structure-containing epoxy resins, and halogenated epoxy resins. Bisphenol A-type epoxy resins, naphthalene-type epoxy resins, and biphenyl-type epoxy resins are preferred, with naphthalene-type epoxy resins and biphenyl-type epoxy resins being more preferred. The (B) epoxy resin may be used alone or in combination of two or more. In one embodiment, the (B) component preferably contains an epoxy resin having an aromatic skeleton.

[0155] The resin composition of the present invention preferably contains, as component (B), an epoxy resin having two or more epoxy groups per molecule. From the viewpoint of significantly achieving the desired effects of the present invention, the proportion of the epoxy resin having two or more epoxy groups per molecule relative to 100% by mass of the epoxy resin (B) is preferably 50% by mass or more, more preferably 60% by mass or more, and particularly preferably 70% by mass or more.

[0156] (B) Epoxy resins include epoxy resins that are liquid at a temperature of 20°C (hereinafter sometimes referred to as "liquid epoxy resins") and epoxy resins that are solid at a temperature of 20°C (hereinafter sometimes referred to as "solid epoxy resins"). The resin composition of the present invention may contain, as component (B), only a liquid epoxy resin, only a solid epoxy resin, or a combination of a liquid epoxy resin and a solid epoxy resin. In one embodiment, the resin composition of the present invention preferably contains a combination of a liquid epoxy resin and a solid epoxy resin.

[0157] The liquid epoxy resin is preferably a liquid epoxy resin having two or more epoxy groups in one molecule.

[0158] Examples of liquid epoxy resins include glycerol-type epoxy resins, bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, bisphenol AF-type epoxy resins, naphthalene-type epoxy resins, glycidyl ester-type epoxy resins, glycidylamine-type epoxy resins, phenol novolac-type epoxy resins, alicyclic epoxy resins having an ester skeleton, cyclohexanedimethanol-type epoxy resins, cyclic aliphatic glycidyl ethers, epoxy resins having a butadiene structure, dicyclopentadiene-type epoxy resins, alkyleneoxy-skeleton-containing epoxy resins, and fluorene-structure-containing epoxy resins. Bisphenol A-type epoxy resins or naphthalene-type epoxy resins are preferred, and naphthalene-type epoxy resins are more preferred.

[0159] Specific examples of liquid epoxy resins include "EX-992L" manufactured by Nagase ChemteX Corporation, "YX7400" manufactured by Mitsubishi Chemical Corporation, "HP4032", "HP4032D", and "HP4032SS" (naphthalene-type epoxy resins) manufactured by DIC Corporation; "828US", "jER828EL", "828EL", "825", and "Epikote 828EL" manufactured by Mitsubishi Chemical Corporation, and "850S" (bisphenol A-type epoxy resin) manufactured by DIC Corporation; and "jER8" manufactured by Mitsubishi Chemical Corporation. 07, 1750 (bisphenol F type epoxy resin); Mitsubishi Chemical Corporation's jER152 (phenol novolac type epoxy resin); Mitsubishi Chemical Corporation's 630, 630LSD, and 604 (glycidylamine type epoxy resin); ADEKA Corporation's ED-523T (glycirol type epoxy resin); ADEKA Corporation's EP-3950L and EP-3980S (glycidylamine type epoxy resin); ADEKA Corporation's EP-4088S (dicyclopentadiene type epoxy resin); Nippon Steel Chemical & Material Corporation's ZX-1059 (mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin); Nagase ChemteX Corporation's EX-721 (glycidyl ester type epoxy resin); Nagase ChemteX Corporation's EX-991L (alkyleneoxy skeleton-containing epoxy resin); Daicel Corporation's Celloxide 2021P (alicyclic epoxy resin with ester skeleton) epoxy resins); "PB-3600" manufactured by Daicel Corporation, "JP-100" and "JP-200" manufactured by Nippon Soda Co., Ltd. (epoxy resins having a butadiene structure); "ZX1658" and "ZX1658GS" (liquid 1,4-glycidylcyclohexane-type epoxy resins) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "EG-280" (fluorene structure-containing epoxy resin) manufactured by Osaka Gas Chemicals Co., Ltd.; and "EX-201" (resorcinol-type epoxy resin) manufactured by Nagase ChemteX Corporation. These may be used alone or in combination of two or more.

[0160] As the solid epoxy resin, a solid epoxy resin having two or more epoxy groups in one molecule is preferred, and an aromatic solid epoxy resin having three or more epoxy groups in one molecule is more preferred.

[0161] Examples of solid epoxy resins include bixylenol-type epoxy resins, naphthalene-type epoxy resins, naphthalene-type tetrafunctional epoxy resins, naphthol novolac-type epoxy resins, cresol novolac-type epoxy resins, dicyclopentadiene-type epoxy resins, trisphenol-type epoxy resins, naphthol-type epoxy resins, biphenyl-type epoxy resins, biphenylaralkyl-type epoxy resins, naphthylene ether-type epoxy resins, anthracene-type epoxy resins, bisphenol A-type epoxy resins, bisphenol AF-type epoxy resins, phenolaralkyl-type epoxy resins, tetraphenylethane-type epoxy resins, phenolphthalimidine-type epoxy resins, and fluorene-structure-containing epoxy resins, of which biphenylaralkyl-type epoxy resins or biphenyl-type epoxy resins are preferred, and biphenyl-type epoxy resins are more preferred.

[0162] Specific examples of solid epoxy resins include "HP4032H" (naphthalene-type epoxy resin) manufactured by DIC Corporation; "HP-4700" and "HP-4710" (naphthalene-type tetrafunctional epoxy resins) manufactured by DIC Corporation; "N-690" and "N-695" (cresol novolac-type epoxy resins) manufactured by DIC Corporation; "HP-7200", "HP-7200HH", "HP-7200H", and "HP-7200L" (dicyclopentadiene-type epoxy resins) manufactured by DIC Corporation; and "EXA-7311", "EXA-7311-G3", and "EXA-7311-G4" manufactured by DIC Corporation. "EXA-7311-G4S", "HP-6000", "HP-6000L" (naphthylene ether type epoxy resin); "EPPN-502H" (trisphenol type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC-7000L" (naphthol novolac type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC-3000", "NC-3000L", "NC-3000FH", "NC-3100" (biphenyl type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC-3000H" (biphenyl aralkyl type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "ESN4" manufactured by Nippon Steel Chemical & Material Co., Ltd. 75V, ESN4100V (naphthalene-type epoxy resin); Nippon Steel Chemical & Material's "ESN485" (naphthol-type epoxy resin); Nippon Steel Chemical & Material's "ESN375" (dihydroxynaphthalene-type epoxy resin); Mitsubishi Chemical's "YX4000H", "YX4000", "YX4000HK", and "YL7890" (bixylenol-type epoxy resin); Mitsubishi Chemical's "YL6121" (biphenyl-type epoxy resin); Mitsubishi Chemical's "YX8800" (anthracene-type epoxy resin); Mitsubishi Chemical's Examples include "YX7700" (phenol aralkyl type epoxy resin); "PG-100" and "CG-500" manufactured by Osaka Gas Chemicals Co., Ltd.; "YL7760" (bisphenol AF type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YL7800" (fluorene structure-containing epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER1010" (bisphenol A type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER1031S" (tetraphenylethane type epoxy resin) manufactured by Mitsubishi Chemical Corporation; and "WHR991S" (phenolphthalimidine type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.These may be used alone or in combination of two or more.

[0163] The epoxy equivalent of the (B) epoxy resin is preferably 50 to 5,000 g / eq. The lower limit of the epoxy equivalent is more preferably 60 g / eq. or more, even more preferably 80 g / eq. or more, and particularly preferably 110 g / eq. or more. The upper limit of the epoxy equivalent is preferably 3,000 g / eq. or less, more preferably 2,000 g / eq. or less, even more preferably 1,000 g / eq. or less, and particularly preferably 500 g / eq. or less, 400 g / eq. or less, or 300 g / eq. or less. The epoxy equivalent is the mass of the epoxy resin containing one equivalent of epoxy groups, and can be measured according to JIS K7236.

[0164] The weight average molecular weight (Mw) of the (B) epoxy resin is preferably 100 to 5,000, more preferably 250 to 3,000, and even more preferably 400 to 1,500. The weight average molecular weight (Mw) of the epoxy resin can be measured by the GPC method as a polystyrene-equivalent value.

[0165] The content of component (B) in the resin composition, when the total nonvolatile components in the resin composition is taken as 100% by mass, is preferably 1% by mass or more, more preferably 2% by mass or more or 3% by mass or more, even more preferably 4% by mass or more or 5% by mass or more, and particularly preferably 6% by mass or more, from the viewpoint of significantly achieving the effects of the present invention. In one embodiment, it may be 7% by mass or more, 8% by mass or more, etc. The upper limit is preferably 50% by mass or less, more preferably 40% by mass or less or 30% by mass or less, even more preferably 25% by mass or less or 20% by mass or less, and particularly preferably 15% by mass or less, 12% by mass or less, or 11% by mass or less. In one embodiment, it may be 10% by mass or less, 9% by mass or less, etc.

[0166] The content of component (B) in the resin composition, when the resin components in the resin composition are taken as 100% by mass, is preferably 2.5% by mass or 5% by mass or more, more preferably 7.5% by mass or 10% by mass or more, even more preferably 12.5% ​​by mass or 15% by mass or more, particularly preferably 17.5% by mass or more, 20% by mass or more, or 22% by mass or more, and the upper limit is preferably 70% by mass or less, more preferably 50% by mass or less, 45% by mass or less, even more preferably 40% by mass or less, 35% by mass or less, and particularly preferably 30% by mass or less, or 28% by mass or less, from the viewpoint of significantly achieving the effects of the present invention.

[0167] The total content of components (1A) and (B), when the total nonvolatile components in the resin composition is taken as 100% by mass, is preferably 2.5% by mass or 5% by mass or more, more preferably 7.5% by mass or 10% by mass or more, even more preferably 12.5% ​​by mass or 15% by mass or more, and particularly preferably 17.5% by mass or more, 20% by mass or more, or 22.5% by mass or more, and the upper limit is preferably 75% by mass or 70% by mass or less, more preferably 60% by mass or 50% by mass or less, even more preferably 45% by mass or 40% by mass or less, and particularly preferably 35% by mass or less, 30% by mass or less, or 25% by mass or less, from the viewpoint of significantly achieving the effects of the present invention.

[0168] From the viewpoint of significantly achieving the effects of the present invention, the mass ratio of component (B) to component (1A) [component (B) / component (1A)] is preferably at least 0.001 or 0.01, more preferably at least 0.02 or 0.05, even more preferably at least 0.08 or 0.1, and particularly preferably at least 0.2 or 0.3. The upper limit is preferably 100 or 80, more preferably 50, 30, or 20, even more preferably 10, 8, or 5, and particularly preferably 4, 3, or 2.

[0169] <(C) Inorganic filler> The resin composition according to the first embodiment of the present invention contains an inorganic filler (C). By including an inorganic filler (C) in the resin composition, the dielectric loss tangent of the cured product can be further reduced.

[0170] Inorganic compounds can be used as the (C) inorganic filler material. Examples of (C) inorganic fillers include silica, alumina, aluminosilicate, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium titanate zirconate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. Among these, silica is preferred. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica. Furthermore, spherical silica is preferred. The (C) inorganic filler may be used alone or in combination of two or more kinds in any ratio.

[0171] (C) Examples of commercially available inorganic fillers include "SP60-05" and "SP507-05" manufactured by Nippon Steel Chemical & Material Co., Ltd.; "YC100C," "YA050C," "YA050C-MJE," "YA010C," "SC2500SQ," "SO-C4," "SO-C2," "SO-C1," "SC2300-SVJ," "SC2050-SXF," and "180nmSX-C1" manufactured by Admatechs Co., Ltd.; "UFP-30," "DAW-03," and "FB-105FD" manufactured by Denka Co., Ltd.; "Silfil NSS-3N," "Silfil NSS-4N," and "Silfil NSS-5N" manufactured by Tokuyama Corporation; and "CellSpheres" and "MGH-005" manufactured by Taiheiyo Cement Corporation.

[0172] The average particle size of the (C) inorganic filler is preferably 10 μm or less, more preferably 5 μm or less, even more preferably 2 μm or less, even more preferably 1 μm or less, and particularly preferably 0.7 μm or less or 0.6 μm or less, from the viewpoint of achieving low surface roughness of the cured product (insulating layer) and facilitating the formation of fine wiring. The lower limit of the average particle size of the (C) inorganic filler is not particularly limited, but is preferably 0.01 μm or more, more preferably 0.05 μm or more, even more preferably 0.1 μm or more, and particularly preferably 0.15 μm or more, 0.2 μm or more, 0.3 μm or more, or 0.4 μm or more. The average particle size of the (C) inorganic filler can be measured by a laser diffraction / scattering method based on Mie scattering theory. Specifically, the particle size distribution of the inorganic filler is prepared on a volume basis using a laser diffraction / scattering particle size distribution analyzer, and the median diameter is used as the average particle size. The measurement sample can be prepared by weighing 100 mg of inorganic filler and 10 g of methyl ethyl ketone into a vial and dispersing them ultrasonically for 10 minutes. The wavelength of the light source used in the laser diffraction particle size distribution analyzer can be blue or red, and the measurement can be performed using a flow cell system. An example of a laser diffraction particle size distribution analyzer is the "LA-960" manufactured by Horiba, Ltd.

[0173] The specific surface area of ​​the (C) inorganic filler is not particularly limited, but is preferably 0.1 m 2 / g or more, more preferably 0.5m 2 / g or more, more preferably 1m 2 / g or more or 3m 2 The upper limit of the specific surface area of ​​the inorganic filler (C) is not particularly limited, but is preferably 100 m 2 / g or less, more preferably 70m 2 / g or less, more preferably 50m 2 / g or less, particularly preferably 40m 2 / g or less, 30m 2 / g or less, 20m 2 / g or less or 10m 2The specific surface area of ​​the inorganic filler can be calculated according to the BET method by adsorbing nitrogen gas onto the surface of a sample using a specific surface area measuring device (Macsorb HM-1210 manufactured by Mountech Co., Ltd.) and then using the BET multipoint method.

[0174] The inorganic filler (C) is preferably surface-treated with a surface treatment agent. The surface treatment can improve the moisture resistance and dispersibility of the inorganic filler (C). Examples of the surface treatment agent include vinyl-based silane coupling agents such as vinyltrimethoxysilane and vinyltriethoxysilane; epoxy-based silane coupling agents such as 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, and 3-glycidoxypropyltriethoxysilane; and styryl-based silane coupling agents such as p-styryltrimethoxysilane. coupling agents; methacrylic silane coupling agents such as 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, and 3-methacryloxypropyltriethoxysilane; acrylic silane coupling agents such as 3-acryloxypropyltrimethoxysilane; N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, and 3-aminopropyltriethoxysilane; Amino-based silane coupling agents such as propyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethylbutylidene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane, N-phenyl-8-aminooctyltrimethoxysilane, and N-(vinylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane; isocyanurate-based silane coupling agents such as tris(trimethoxysilylpropyl)isocyanurate; ureido-based silane coupling agents such as ureidopropyltrialkoxysilane; mercapto-based silane coupling agents such as 3-mercaptopropylmethyldimethoxysilane and 3-mercaptopropyltrimethoxysilane; isocyanate-based silane coupling agents such as 3-isocyanatepropyltriethoxysilane; acid anhydride-based silane coupling agents such as 3-trimethoxysilylpropylsuccinic anhydride; sulfide-based silane coupling agents such as bis(triethoxysilylpropyl)tetrasulfide;Examples of suitable surface treatment agents include silane coupling agents such as methyltrimethoxysilane and phenyltrimethoxysilane, non-silane coupling alkoxysilane compounds such as methyltrimethoxysilane and phenyltrimethoxysilane, organosilazane compounds, and titanate-based coupling agents. The surface treatment agents may be used alone or in combination of two or more in any ratio. In one embodiment, the inorganic filler (C) is preferably surface-treated with an amino-based silane coupling agent, and more preferably surface-treated with N-phenyl-3-aminopropyltrimethoxysilane.

[0175] The degree of surface treatment with the surface treatment agent is preferably within a predetermined range from the viewpoint of improving the dispersibility of the inorganic filler. Specifically, 100 parts by mass of the inorganic filler is preferably surface-treated with 0.2 to 5 parts by mass of the surface treatment agent, more preferably 0.2 to 3 parts by mass, and even more preferably 0.3 to 2 parts by mass.

[0176] The degree of surface treatment with the surface treatment agent can be evaluated by the amount of carbon per unit surface area of ​​the inorganic filler. From the viewpoint of improving the dispersibility of the inorganic filler, the amount of carbon per unit surface area of ​​the inorganic filler is set to 0.02 mg / m 2 More than 0.1 mg / m is preferable. 2 More preferably, 0.2 mg / m or more 2 More preferably, the upper limit is 1 mg / m 2 Less than 0.8 mg / m is preferred 2 Less than 0.5 mg / m is more preferable. 2 The following is even more preferred:

[0177] (C) The amount of carbon per unit surface area of ​​the inorganic filler can be measured after the surface-treated inorganic filler is washed with a solvent (e.g., methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the inorganic filler that has been surface-treated with a surface treatment agent, and ultrasonic cleaning is performed at 25°C for 5 minutes. After removing the supernatant and drying the solid content, the amount of carbon per unit surface area of ​​the inorganic filler can be measured using a carbon analyzer. An "EMIA-320V" manufactured by Horiba, Ltd., or the like can be used as the carbon analyzer.

[0178] The content of component (C) in the resin composition, relative to 100% by mass of the nonvolatile components in the resin composition, is preferably 30% by mass or more or 40% by mass or more, more preferably 45% by mass or more or 50% by mass or more, even more preferably 52% by mass or more or 54% by mass or more, and particularly preferably 56% by mass or more, 58% by mass or more, or 60% by mass or more, from the viewpoint of further reducing the dielectric loss tangent of the cured product. The upper limit is preferably 90% by mass or less, more preferably 85% by mass or less, even more preferably 80% by mass or less or 75% by mass or less, and particularly preferably 72% by mass or less, from the viewpoint of further improving the adhesion between the cured product (insulating layer) and the conductor layer. In one embodiment, the content of component (C) is preferably 50 to 75% by mass, relative to 100% by mass of the nonvolatile components in the resin composition.

[0179] The total content of components (1A), (B), and (C) in the resin composition is preferably 40% by mass or more, more preferably 50% by mass or more or 60% by mass or more, even more preferably 70% by mass or more or 75% by mass or more, and particularly preferably 80% by mass or more, 85% by mass or more, or 90% by mass or more, based on 100% by mass of the nonvolatile components in the resin composition. There is no particular upper limit, but it may be 100% by mass, or may be 99% by mass or less, 98% by mass or less, 96% by mass or less, 95% by mass or less, etc.

[0180] The mass ratio of component (1A) to component (C) [component (1A) / component (C)] is preferably 0.001 or more or 0.01 or more, more preferably 0.02 or more or 0.05 or more, and even more preferably 0.08 or more, from the viewpoint of further improving the adhesion between the cured product (insulating layer) and the conductor layer. The upper limit is preferably 10 or less or 8 or less, more preferably 5 or less or 3 or less, even more preferably 2 or less, 1 or less or 0.8 or less, and particularly preferably 0.6 or less, from the viewpoint of further reducing the dielectric loss tangent of the cured product. In one embodiment, the mass ratio [component (1A) / component (C)] is preferably 0.01 to 1.

[0181] From the viewpoint of further improving the adhesion between the cured product (insulating layer) and the conductor layer, the mass ratio of the (B) component to the (C) component [(B) component / (C) component] is preferably 0.001 or more or 0.002 or more, more preferably 0.005 or more or 0.008 or more, even more preferably 0.01 or more or 0.02 or more, and particularly preferably 0.05 or more, 0.08 or more or 0.09 or more. The upper limit is preferably 20 or less or 15 or less, more preferably 10 or less, 8 or less or 5 or less, even more preferably 2 or less, 1 or less or 0.8 or less, and particularly preferably 0.5 or less, 0.4 or less or 0.3 or less.

[0182] <(D) Curing agent> The resin composition of the first embodiment of the present invention may contain a (D) curing agent as an optional component, and preferably contains a (D) curing agent. The (D) curing agent has the function of reacting with the (B) epoxy resin to cure the resin composition. The (D) curing agent may be used alone or in combination of two or more types.

[0183] Even when the resin composition of the first embodiment of the present invention contains the component (1A), the epoxy resin (B), and the component (C), it can be cured by a reaction between the epoxy groups of the epoxy resin (B). However, by including the curing agent (D), the curing reaction proceeds more efficiently, resulting in a cured product that exhibits better dielectric properties and better adhesion. That is, in one embodiment, the curing agent (D) preferably includes an epoxy resin curing agent, and the curing agent (D) is more preferably an epoxy resin curing agent.

[0184] The reactive group equivalent of the (D) curing agent is preferably 50 g / eq. to 3,000 g / eq., more preferably 100 g / eq. to 1,000 g / eq., even more preferably 100 g / eq. to 500 g / eq., and particularly preferably 100 g / eq. to 300 g / eq. The reactive group equivalent is the mass of the (D) curing agent per equivalent of the reactive group.

[0185] Examples of the (D) curing agent include active ester curing agents, carbodiimide curing agents, phenolic curing agents, naphthol curing agents, acid anhydride curing agents, amine curing agents, benzoxazine curing agents, cyanate ester curing agents, thiol curing agents, etc. Among these, from the viewpoint of significantly obtaining the effects of the present invention, the (D) curing agent preferably contains one or more selected from phenolic curing agents, active ester curing agents, and carbodiimide curing agents, more preferably contains one or more selected from active ester curing agents and carbodiimide curing agents, still more preferably contains an active ester curing agent, and particularly preferably contains both an active ester curing agent and a carbodiimide curing agent.

[0186] The active ester curing agent is not particularly limited, but a compound having one or more active ester groups per molecule can be used. Among these, preferred active ester curing agents are compounds having two or more highly reactive ester groups per molecule, such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds. The active ester compound is preferably one obtained by a condensation reaction between a carboxylic acid compound and / or a thiocarboxylic acid compound and a hydroxy compound and / or a thiol compound. From the viewpoint of improving heat resistance, active ester compounds obtained from a carboxylic acid compound and a hydroxy compound are preferred, and active ester compounds obtained from a carboxylic acid compound and a phenol compound and / or a naphthol compound are more preferred.

[0187] Examples of the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid.

[0188] Examples of phenol compounds and / or naphthol compounds include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, phenolphthaline, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucin, benzenetriol, dicyclopentadiene-type diphenol compounds, and phenol novolak. Here, "dicyclopentadiene-type diphenol compounds" refers to diphenol compounds obtained by condensing one dicyclopentadiene molecule with two phenol molecules.

[0189] Specific examples of the active ester curing agent include dicyclopentadiene-type active ester compounds, naphthalene-type active ester compounds containing a naphthalene structure, active ester compounds containing an acetylated product of phenol novolac, and active ester compounds containing a benzoylated product of phenol novolac, and among these, at least one selected from dicyclopentadiene-type active ester compounds and naphthalene-type active ester compounds is more preferred. As the dicyclopentadiene-type active ester compound, an active ester compound containing a dicyclopentadiene-type diphenol structure is preferred.

[0190] Commercially available active ester curing agents include "EXB9451," "EXB9460," "EXB9460S," "HPC-8000L-65TM," "HPC-8000-65T," "EXB-8000H," and "EXB-8000L-65TM" (manufactured by DIC Corporation) as active ester compounds containing a dicyclopentadiene-type diphenol structure; and "EXB-9416-70BK," "EXB-8100L-65T," "HPC-8150-62T," "EXB-8150L-65T," "EXB-8100L-65T," and "EXB-8" (manufactured by DIC Corporation) as active ester compounds containing a naphthalene structure. Examples of activated ester compounds that contain phosphorus include "EXB9401" (manufactured by DIC Corporation); an activated ester compound that is an acetylated product of phenol novolac is "DC808" (manufactured by Mitsubishi Chemical Corporation); activated ester compounds that are benzoylated products of phenol novolac include "YLH1026," "YLH1030," and "YLH1048" (manufactured by Mitsubishi Chemical Corporation) and "EXB-8500-65T" (manufactured by DIC Corporation); and activated ester compounds that contain a styryl group and a naphthalene structure include "PC1300-02-65T" and "PC1300-02-65MA" (manufactured by Air Water Inc.).

[0191] The carbodiimide curing agent is a compound having one or more carbodiimide groups (-N=C=N-) in one molecule, and the carbodiimide curing agent is preferably a compound having two or more carbodiimide groups in one molecule. Examples of the carbodiimide curing agent include aliphatic biscarbodiimides such as tetramethylene-bis(t-butylcarbodiimide) and cyclohexane-bis(methylene-t-butylcarbodiimide); aromatic biscarbodiimides such as phenylene-bis(xylylcarbodiimide); aliphatic polycarbodiimides such as polyhexamethylenecarbodiimide, polytrimethylhexamethylenecarbodiimide, polycyclohexylenecarbodiimide, poly(methylenebiscyclohexylenecarbodiimide), and poly(isophoronecarbodiimide); poly(phenylenecarbodiimide), poly(naphthalenecarbodiimide), and the like. and polycarbodiimides such as aromatic polycarbodiimides such as poly(methylenebis(methylphenylene)carbodiimide), poly(tolylenecarbodiimide), poly(methyldiisopropylphenylenecarbodiimide), poly(triethylphenylenecarbodiimide), poly(diethylphenylenecarbodiimide), poly(triisopropylphenylenecarbodiimide), poly(diisopropylphenylenecarbodiimide), poly(xylylenecarbodiimide), poly(tetramethylxylylenecarbodiimide), poly(methylenediphenylenecarbodiimide), and poly[methylenebis(methylphenylene)carbodiimide]. These may be used alone or in combination of two or more.

[0192] Commercially available carbodiimide curing agents include, for example, Carbodilite V-03 (carbodiimide group equivalent: 216 g / eq.), Carbodilite V-05 (carbodiimide group equivalent: 262 g / eq.), Carbodilite V-07 (carbodiimide group equivalent: 200 g / eq.), and Carbodilite V-09 (carbodiimide group equivalent: 200 g / eq.), all manufactured by Nisshinbo Chemical Inc.; and Stavaxol P (carbodiimide group equivalent: 302 g / eq.) manufactured by Lanxess AG.

[0193] As the phenol-based curing agent and naphthol-based curing agent, from the viewpoint of heat resistance and water resistance, a phenol-based curing agent having a novolac structure or a naphthol-based curing agent having a novolac structure is preferred. Furthermore, from the viewpoint of further improving the adhesive strength with the conductor layer, a nitrogen-containing phenol-based curing agent or a nitrogen-containing naphthol-based curing agent is preferred, and a triazine skeleton-containing phenol-based curing agent or a triazine skeleton-containing naphthol-based curing agent is more preferred. Among these, from the viewpoint of highly satisfying heat resistance, water resistance, and adhesive strength with the conductor layer, a triazine skeleton-containing phenol novolac resin is preferred. These may be used alone or in combination of two or more.

[0194] Specific examples of phenol-based curing agents and naphthol-based curing agents include "MEH-7700," "MEH-7810," and "MEH-7851" manufactured by Meiwa Chemical Industry Co., Ltd.; "NHN," "CBN," and "GPH" manufactured by Nippon Kayaku Co., Ltd.; "SN170," "SN180," "SN190," "SN475," "SN485," "SN495," "SN-495V," "SN375," and "SN395" manufactured by Nippon Steel Chemical & Material Co., Ltd.; and "TD-2090," "LA-7052," "LA-7054," "LA-1356," "LA-3018-50P," and "EXB-9500" manufactured by DIC Corporation.

[0195] The acid anhydride curing agent may be a curing agent having one or more acid anhydride groups in one molecule, and a curing agent having two or more acid anhydride groups in one molecule is preferred. Specific examples of the acid anhydride curing agent include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, hydrogenated methylnadic anhydride, trialkyltetrahydrophthalic anhydride, dodecenyl succinic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trimellitic anhydride, pyromellitic anhydride, and benzophenonetetracarboxylic dianhydride. Examples of suitable acid anhydrides include anhydrides, biphenyltetracarboxylic dianhydride, naphthalenetetracarboxylic dianhydride, oxydiphthalic dianhydride, 3,3'-4,4'-diphenylsulfonetetracarboxylic dianhydride, 1,3,3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-C]furan-1,3-dione, ethylene glycol bis(anhydrotrimellitate), and polymeric acid anhydrides such as styrene-maleic acid resins, which are copolymers of styrene and maleic acid. These may be used alone or in combination of two or more.

[0196] Commercially available acid anhydride curing agents include "HNA-100," "MH-700," "MTA-15," "DDSA," and "OSA" manufactured by New Japan Chemical Co., Ltd.; "YH-306" and "YH-307" manufactured by Mitsubishi Chemical Corporation; "HN-2200" and "HN-5500" manufactured by Resonac Corporation; and "EF-30," "EF-40," "EF-60," and "EF-80" manufactured by Cray Valley Chemical Industries, Ltd. These may be used alone or in combination of two or more.

[0197] Examples of amine-based curing agents include curing agents having one or more, preferably two or more, amino groups in one molecule. The amino group of the amine-based curing agent is preferably a primary amino group or a secondary amino group, more preferably a primary amino group. Examples of amine-based curing agents include aliphatic amines, polyether amines, alicyclic amines, and aromatic amines, and among these, aromatic amines are preferred from the viewpoint of achieving the desired effects of the present invention. The amine-based curing agent is preferably a primary amine or a secondary amine, more preferably a primary amine.

[0198] Specific examples of amine-based curing agents include 4,4'-methylenebis(2,6-dimethylaniline), 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, m-phenylenediamine, m-xylylenediamine, diethyltoluenediamine, 4,4'-diaminodiphenyl ether, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, and 2,2-bis(3-amino-4-hydroxyphenyl)propane. propane, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethanediamine, 2,2-bis(4-aminophenyl)propane, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, bis(4-(4-aminophenoxy)phenyl)sulfone, bis(4-(3-aminophenoxy)phenyl)sulfone, and the like. Commercially available amine-based curing agents may be used, and examples thereof include "SEIKACURE-S" manufactured by Seika Corporation, "KAYABOND C-200S," "KAYABOND C-100," "KAYAHARD AA," "KAYAHARD AB," and "KAYAHARD AS" manufactured by Nippon Kayaku Co., Ltd., "Epicure W" manufactured by Mitsubishi Chemical Corporation, and "DTDA" manufactured by Sumitomo Seika Chemicals Co., Ltd. These may be used alone or in combination of two or more.

[0199] Specific examples of benzoxazine curing agents include "JBZ-OP100D" and "ODA-BOZ" manufactured by JFE Chemical Corporation, "HFB2006M" manufactured by Showa Polymer Co., Ltd., and "Pd" and "Fa" manufactured by Shikoku Chemicals Corporation. These may be used alone or in combination of two or more.

[0200] Examples of cyanate ester curing agents include bifunctional cyanate resins such as bisphenol A dicyanate, polyphenol cyanate, oligo(3-methylene-1,5-phenylene cyanate), 4,4'-methylenebis(2,6-dimethylphenyl cyanate), 4,4'-ethylidene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis(4-cyanate)phenylpropane, 1,1-bis(4-cyanatephenylmethane), bis(4-cyanate-3,5-dimethylphenyl)methane, 1,3-bis(4-cyanatephenyl-1-(methylethylidene))benzene, bis(4-cyanatephenyl)thioether, and bis(4-cyanatephenyl)ether; multifunctional cyanate resins derived from phenol novolac and cresol novolac; and prepolymers in which these cyanate resins are partially converted to triazine. Commercially available cyanate ester curing agents include "PT-30" and "PT-60" (phenol novolac type multifunctional cyanate ester resin), "ULL-950S" (multifunctional cyanate ester resin), "BA-230" and "BA-230S75" (prepolymer in which part or all of bisphenol A dicyanate is triazinized to form a trimer), all manufactured by Arxada. These may be used alone or in combination of two or more.

[0201] Examples of thiol-based curing agents include trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptobutyrate), tris(3-mercaptopropyl)isocyanurate, etc. These may be used alone or in combination of two or more.

[0202] The ratio of the amount of epoxy resin to the curing agent, expressed as the ratio of [total number of epoxy groups in the epoxy resin] to [total number of active groups in the curing agent], is preferably in the range of 1:0.01 to 1:10, more preferably 1:0.3 to 1:5, and even more preferably 1:0.5 to 1:3. Here, the "number of epoxy groups in the epoxy resin" refers to the sum of all values ​​obtained by dividing the mass of the non-volatile components of the epoxy resin present in the resin composition by the epoxy equivalent. Furthermore, the "number of active groups in the curing agent" refers to the sum of all values ​​obtained by dividing the mass of the non-volatile components of the curing agent present in the resin composition by the active group equivalent. By setting the ratio of the amount of the curing agent to the epoxy resin within this range, the effects of the present invention can be significantly achieved.

[0203] When the resin composition of the first embodiment of the present invention contains a (D) curing agent, the content of the (D) curing agent in the resin composition, relative to 100% by mass of the nonvolatile components in the resin composition, is preferably 1% by mass or more, more preferably 2% by mass or more, even more preferably 3% by mass or more or 4% by mass or more, and particularly preferably 5% by mass or more or 6% by mass or more, from the viewpoint of significantly achieving the effects of the present invention. In one embodiment, the content may be 7% by mass or more, 8% by mass or more, 9% by mass or more, etc. The upper limit is preferably 30% by mass or less, more preferably 25% by mass or less, even more preferably 20% by mass or less or 18% by mass or less, and particularly preferably 16% by mass or less or 14% by mass or less. In one embodiment, the content may be 12% by mass or less, 10% by mass or less, etc.

[0204] When the resin composition of the first embodiment of the present invention contains a (D) curing agent, the content of the (D) curing agent in the resin composition, based on 100% by mass of the resin components in the resin composition, is preferably 2.5% by mass or more or 5% by mass or more, more preferably 7.5% by mass or more or 10% by mass or more, even more preferably 12.5% ​​by mass or more or 15% by mass or more, and particularly preferably 17.5% by mass or more or 20% by mass or more, from the viewpoint of significantly achieving the effects of the present invention. In one embodiment, the content may be 22.5% by mass or more, 25% by mass or more, 27.5% by mass or more, 30% by mass or more, etc. The upper limit is preferably 70% by mass or less, more preferably 60% by mass or less, even more preferably 50% by mass or less or 45% by mass or less, and particularly preferably 40% by mass or less or 36% by mass or less. In one embodiment, the content may be 34% by mass or less, 32% by mass or less, etc.

[0205] When the resin composition of the first embodiment of the present invention contains a (D) curing agent, the mass ratio of the (D) component to the (1A) component [(D) component / (1A) component] is, from the viewpoint of significantly obtaining the effects of the present invention, preferably 0.001 or more, more preferably 0.01 or more or 0.05 or more, even more preferably 0.08 or more or 0.1 or more, and particularly preferably 0.2 or more or 0.3 or more. The upper limit is preferably 100 or less or 80 or less, more preferably 50 or less or 20 or less, even more preferably 15 or less, 10 or less or 8 or less, and particularly preferably 5 or less, 4 or less, or 3 or less.

[0206] When the resin composition of the first embodiment of the present invention contains a (D) curing agent, the mass ratio of the (D) component to the (B) component [(D) component / (B) component] is, from the viewpoint of significantly obtaining the effects of the present invention, preferably 0.01 or more or 0.02 or more, more preferably 0.05 or more or 0.08 or more, even more preferably 0.1 or more or 0.2 or more, and particularly preferably 0.5 or more or 0.8 or more. The upper limit is preferably 100 or less or 80 or less, more preferably 50 or less or 20 or less, even more preferably 15 or less, 10 or less or 8 or less, and particularly preferably 5 or less, 3 or less, or 2 or less.

[0207] When the resin composition of the first embodiment of the present invention contains a (D) curing agent, the mass ratio of the (D) component to the (C) component [(D) component / (C) component] is, from the viewpoint of significantly obtaining the effects of the present invention, preferably at least 0.001 or at least 0.002, more preferably at least 0.005 or at least 0.008, even more preferably at least 0.01 or at least 0.02, and particularly preferably at least 0.05 or at least 0.08. The upper limit is preferably at most 20 or at most 15, more preferably at most 10, at most 8, or at most 5, even more preferably at most 2, at most 1, or at most 0.8, and particularly preferably at most 0.5, at most 0.4, or at most 0.3.

[0208] <(E) Curing accelerator> The resin composition of the first embodiment of the present invention may contain, and preferably contains, a curing accelerator (E) as an optional component. The curing accelerator (E) functions as a curing catalyst that accelerates the curing of the epoxy resin (B) and / or the curing agent (D).

[0209] Examples of the (E) curing accelerator include phosphorus-based curing accelerators, urea-based curing accelerators, guanidine-based curing accelerators, imidazole-based curing accelerators, metal-based curing accelerators, and amine-based curing accelerators. The (E) curing accelerator preferably contains an amine-based curing accelerator or an imidazole-based curing accelerator, and more preferably contains an imidazole-based curing accelerator. The (E) curing accelerators may be used alone or in combination of two or more.

[0210] Examples of the amine curing accelerator include trialkylamines such as triethylamine and tributylamine, pyridines such as 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, and 1,8-diazabicyclo(5,4,0)-undecene, among which pyridines are preferred, and 4-dimethylaminopyridine is more preferred. These may be used alone or in combination of two or more.

[0211] As the amine-based curing accelerator, commercially available products may be used, such as "MY-25" manufactured by Ajinomoto Fine-Techno Co., Ltd. and "DMAP" manufactured by Koei Chemical Industry Co., Ltd.

[0212] Examples of the phosphorus-based curing accelerator include aliphatic phosphonium salts such as tetrabutylphosphonium bromide, tetrabutylphosphonium chloride, tetrabutylphosphonium acetate, tetrabutylphosphonium decanoate, tetrabutylphosphonium laurate, bis(tetrabutylphosphonium)pyromellitate, tetrabutylphosphonium hydrogenhexahydrophthalate, tetrabutylphosphonium 2,6-bis[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenolate, and di-tert-butylmethylphosphonium tetraphenylborate; methyltriphenylphosphonium bromide, ethyltriphenylphosphonium bromide, propyltriphenylphosphonium bromide, butyltriphenylphosphonium bromide, benzyltriphenylphosphonium chloride, tetraphenylphosphonium bromide, p-tolyltriphenylphosphonium tetra-p-tolylborate, and tetraphenylphosphonium bromide. aromatic phosphonium salts such as tetraphenylborate, tetraphenylphosphonium tetra-p-tolylborate, triphenylethylphosphonium tetraphenylborate, tris(3-methylphenyl)ethylphosphonium tetraphenylborate, tris(2-methoxyphenyl)ethylphosphonium tetraphenylborate, (4-methylphenyl)triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, and butyltriphenylphosphonium thiocyanate; aromatic phosphine-borane complexes such as triphenylphosphine-triphenylborane; aromatic phosphine-quinone adducts such as triphenylphosphine-p-benzoquinone adduct; aliphatic phosphines such as tributylphosphine, tri-tert-butylphosphine, trioctylphosphine, di-tert-butyl(2-butenyl)phosphine, di-tert-butyl(3-methyl-2-butenyl)phosphine, and tricyclohexylphosphine;Dibutylphenylphosphine, di-tert-butylphenylphosphine, methyldiphenylphosphine, ethyldiphenylphosphine, butyldiphenylphosphine, diphenylcyclohexylphosphine, triphenylphosphine, tri-o-tolylphosphine, tri-m-tolylphosphine, tri-p-tolylphosphine, tris(4-ethylphenyl)phosphine, tris(4-propylphenyl)phosphine, tris(4-isopropylphenyl)phosphine, tris(4-butylphenyl)phosphine, tris(4-tert-butylphenyl)phosphine, tris(2,4-dimethylphenyl)phosphine, tris(2,5-dimethylphenyl)phosphine, tris(2,6-dimethylphenyl)phosphine Examples of aromatic phosphines include tris(3,5-dimethylphenyl)phosphine, tris(2,4,6-trimethylphenyl)phosphine, tris(2,6-dimethyl-4-ethoxyphenyl)phosphine, tris(2-methoxyphenyl)phosphine, tris(4-methoxyphenyl)phosphine, tris(4-ethoxyphenyl)phosphine, tris(4-tert-butoxyphenyl)phosphine, diphenyl-2-pyridylphosphine, 1,2-bis(diphenylphosphino)ethane, 1,3-bis(diphenylphosphino)propane, 1,4-bis(diphenylphosphino)butane, 1,2-bis(diphenylphosphino)acetylene, and 2,2'-bis(diphenylphosphino)diphenyl ether. These may be used alone or in combination of two or more.

[0213] Examples of the urea-based curing accelerator include 1,1-dimethylurea; aliphatic dimethylureas such as 1,1,3-trimethylurea, 3-ethyl-1,1-dimethylurea, 3-cyclohexyl-1,1-dimethylurea, and 3-cyclooctyl-1,1-dimethylurea; 3-phenyl-1,1-dimethylurea, 3-(4-chlorophenyl)-1,1-dimethylurea, 3-(3,4-dichlorophenyl)-1,1-dimethylurea, 3-(3-chloro-4-methylphenyl)-1,1-dimethylurea, 3-(2-methylphenyl)-1,1-dimethylurea, 3-(4-methylphenyl)-1,1-dimethylurea, and 3-(3,4-dimethylphenyl)-1,1-dimethylurea. and aromatic dimethylureas such as toluenebis(dimethylurea), 3-(4-isopropylphenyl)-1,1-dimethylurea, 3-(4-methoxyphenyl)-1,1-dimethylurea, 3-(4-nitrophenyl)-1,1-dimethylurea, 3-[4-(4-methoxyphenoxy)phenyl]-1,1-dimethylurea, 3-[4-(4-chlorophenoxy)phenyl]-1,1-dimethylurea, 3-[3-(trifluoromethyl)phenyl]-1,1-dimethylurea, N,N-(1,4-phenylene)bis(N',N'-dimethylurea), and N,N-(4-methyl-1,3-phenylene)bis(N',N'-dimethylurea) [toluenebisdimethylurea]. These may be used alone or in combination of two or more.

[0214] Examples of guanidine curing accelerators include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7-methyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene, 1-methylbiguanide, 1-ethylbiguanide, 1-n-butylbiguanide, 1-n-octadecylbiguanide, 1,1-dimethylbiguanide, 1,1-diethylbiguanide, 1-cyclohexylbiguanide, 1-allylbiguanide, 1-phenylbiguanide, and 1-(o-tolyl)biguanide. These may be used alone or in combination of two or more.

[0215] Examples of imidazole-based curing accelerators include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, and 1-cyanoethyl-2-methylimidazole. , 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6 -[2'-Undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazoline Examples of imidazole compounds include imidazole compounds such as 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, and 2-phenylimidazoline, as well as adducts of imidazole compounds with epoxy resins, with 1-benzyl-2-phenylimidazole being preferred.

[0216] Commercially available imidazole curing accelerators include, for example, "1B2PZ," "2E4MZ," "2MZA-PW," "2MZ-OK," "2MA-OK," "2MA-OK-PW," "2P4MZ," "2PHZ," "2PHZ-PW," "Cl1Z," "Cl1Z-CN," "Cl1Z-CNS," and "C11Z-A" manufactured by Shikoku Chemical Industry Co., Ltd.; and "P200-H50" manufactured by Mitsubishi Chemical Corporation. These may be used alone or in combination of two or more.

[0217] Examples of metal-based curing accelerators include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of organometallic complexes include organic cobalt complexes such as cobalt(II) acetylacetonate and cobalt(III) acetylacetonate, organic copper complexes such as copper(II) acetylacetonate, organic zinc complexes such as zinc(II) acetylacetonate, organic iron complexes such as iron(III) acetylacetonate, organic nickel complexes such as nickel(II) acetylacetonate, and organic manganese complexes such as manganese(II) acetylacetonate. Examples of organometallic salts include zinc octoate, tin octoate, zinc naphthenate, cobalt naphthenate, tin stearate, and zinc stearate. These may be used alone or in combination of two or more.

[0218] When the resin composition of the first embodiment of the present invention contains a curing accelerator (E), the content of the component (E) in the resin composition is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.001% by mass or more, more preferably 0.002% by mass or more, even more preferably 0.005% by mass or more or 0.008% by mass or more, and particularly preferably 0.01% by mass or more or 0.02% by mass or more, based on 100% by mass of the non-volatile components in the resin composition. The upper limit is preferably 5% by mass or less, more preferably 2% by mass or less or 1% by mass or less, even more preferably 0.8% by mass or less or 0.5% by mass or less, and particularly preferably 0.2% by mass or less or 0.15% by mass or less.

[0219] When the resin composition of the first embodiment of the present invention contains a curing accelerator (E), the content of the component (E) in the resin composition, based on 100% by mass of the resin components in the resin composition, is preferably 0.001% by mass or more or 0.002% by mass or more, more preferably 0.005% by mass or more or 0.008% by mass or more, even more preferably 0.01% by mass or more or 0.02% by mass or more, particularly preferably 0.03% by mass or more, 0.04% by mass or more, or 0.05% by mass or more, from the viewpoint of significantly achieving the effects of the present invention. The upper limit is preferably 10% by mass or less or 8% by mass or less, more preferably 5% by mass or less or 2% by mass or less, even more preferably 1% by mass or less, 0.8% by mass or less or 0.6% by mass or less, and particularly preferably 0.5% by mass or less, 0.4% by mass or less, or 0.3% by mass or less.

[0220] When the resin composition of the first embodiment of the present invention contains a curing accelerator (E), the mass ratio of the component (E) to the component (1A) [component (E) / component (1A)] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.0001 or more, more preferably 0.0002 or more or 0.0005 or more, even more preferably 0.0008 or more or 0.001 or more, and particularly preferably 0.002 or more or 0.003 or more. The upper limit is preferably 1 or less or 0.5 or less, more preferably 0.1 or less or 0.08 or less, even more preferably 0.05 or less, 0.02 or less or 0.01 or less, and particularly preferably 0.008 or less, 0.006 or less or 0.005 or less.

[0221] When the resin composition of the first embodiment of the present invention contains a curing accelerator (E), the mass ratio of the component (E) to the component (B) [component (E) / component (B)] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.0001 or more, more preferably 0.0002 or more or 0.0005 or more, even more preferably 0.0008 or more or 0.001 or more, and particularly preferably 0.0015 or more or 0.002 or more. The upper limit is preferably 1 or less or 0.8 or less, more preferably 0.5 or less or 0.2 or less, even more preferably 0.1 or less or 0.08 or less, and particularly preferably 0.05 or less or 0.02 or less.

[0222] When the resin composition of the first embodiment of the present invention contains the curing accelerator (E), the mass ratio of the component (E) to the component (C) [component (E) / component (C)] is preferably 1×10 -5 More preferably, 2×10 -5 or more or 5 x 10 -5 More preferably, 8 × 10 -5 or more or 1 x 10 -4 More preferably, 2 × 10 -4 or more or 4 x 10 -4 The upper limit is preferably 1×10 -1 or less or 8 x 10 -2 Less than or equal to 5 × 10 -2 or less or 2 x 10 -2 or less, more preferably 1 × 10 -2 or less or 8 x 10 -3 Below 5 × 10, particularly preferably -3 or less or 3 x 10 -3 The following is the result.

[0223] When the resin composition of the first embodiment of the present invention contains a (D) curing agent and a (E) curing accelerator, the mass ratio of the (E) component to the (D) component [(E) component / (D) component] is, from the viewpoint of significantly obtaining the effects of the present invention, preferably 0.0001 or more, more preferably 0.0002 or more, even more preferably 0.0005 or more or 0.0008 or more, and particularly preferably 0.001 or more or 0.0015 or more. The upper limit is preferably 1 or less or 0.8 or less, more preferably 0.5 or less or 0.2 or less, even more preferably 0.1 or less or 0.08 or less, and particularly preferably 0.05 or less or 0.02 or less.

[0224] <(F) Radical polymerization resin> The resin composition of the first embodiment of the present invention may contain a (F) radical polymerization resin as an optional component, and preferably contains a (F) radical polymerization resin from the viewpoint of further reducing the dielectric constant and dielectric loss tangent of the cured product. By including a (F) radical polymerization resin in the resin composition, the crosslink density of the cured product can also be further improved. The (F) component may be used alone or in combination of two or more.

[0225] The (F) radical polymerization resin may have an ethylenically unsaturated bond. The (F) radical polymerization resin may have a radical polymerizable group, such as an unsaturated hydrocarbon group such as a vinyl group, an allyl group, a 3-cyclohexenyl group, a 3-cyclopentenyl group, a p-vinylphenyl group, a m-vinylphenyl group, or an o-vinylphenyl group; or an α,β-unsaturated carbonyl group such as an acryloyl group, a methacryloyl group, or a maleimide group (2,5-dihydro-2,5-dioxo-1H-pyrrol-1-yl group). The (F) radical polymerization resin preferably has two or more radical polymerizable groups.

[0226] Examples of (F) radical polymerization resins include (meth)acrylic radical polymerization resins, styrene radical polymerization resins, allyl radical polymerization resins, maleimide radical polymerization resins, etc. The term "(meth)acrylic radical polymerization resin" refers to a resin having an acryloyl group and / or a methacryloyl group.

[0227] The (meth)acrylic radical polymerization resin is, for example, a compound having one or more, preferably two or more, acryloyl groups and / or methacryloyl groups. Examples of the (meth)acrylic radical polymerization resin include cyclohexane-1,4-dimethanol di(meth)acrylate, cyclohexane-1,3-dimethanol di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,9-octanediol di(meth)acrylate, 1,6-octanedi ...8-octanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,9-octanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,8 Low molecular weight (molecular weight less than 1000) aliphatic (meth)acrylic acid ester compounds such as nanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, glycerin tri(meth)acrylate, and pentaerythritol tetra(meth)acrylate; dioxane glycol di(meth)acrylate, 3,6-dioxa-1,8-octanediol di(meth)acrylate, Examples of the ether-containing (meth)acrylic acid ester compounds include low molecular weight (molecular weight less than 1000) ether-containing (meth)acrylic acid ester compounds such as bis(meth)acrylate, 3,6,9-trioxaundecane-1,11-diol di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, 9,9-bis[4-(2-acryloyloxyethoxy)phenyl]fluorene, ethoxylated bisphenol A di(meth)acrylate, and propoxylated bisphenol A di(meth)acrylate; low molecular weight (molecular weight less than 1000) isocyanurate-containing (meth)acrylic acid ester compounds such as tris(3-hydroxypropyl)isocyanurate tri(meth)acrylate, tris(2-hydroxyethyl)isocyanurate tri(meth)acrylate, and ethoxylated isocyanuric acid tri(meth)acrylate; and high molecular weight (molecular weight 1000 or more) acrylic acid ester compounds such as (meth)acrylic-modified polyphenylene ether resins.Among these, as the (meth)acrylic radical polymerization resin, a low molecular weight (molecular weight less than 1000) ether-containing (meth)acrylic acid ester compound is preferred, dioxane glycol di(meth)acrylate is more preferred, and dioxane glycol diacrylate is even more preferred.

[0228] Commercially available (meth)acrylic radical polymerization resins include, for example, "A-DOG" (dioxane glycol diacrylate) manufactured by Shin-Nakamura Chemical Co., Ltd., "DCP-A" (tricyclodecane dimethanol diacrylate) and "DCP" (tricyclodecane dimethanol dimethacrylate) manufactured by Kyoeisha Chemical Co., Ltd., "KAYARAD R-684" (tricyclodecane dimethanol diacrylate) and "KAYARAD R-604" (dioxane glycol diacrylate) manufactured by Nippon Kayaku Co., Ltd., and "SA-9000" and "SA-9000-111" (methacrylic-modified polyphenylene ether) manufactured by SABIC.

[0229] The styrene-based radical polymerization resin is, for example, a compound having one or more, preferably two or more, vinyl groups directly bonded to an aromatic carbon atom. Examples of the styrene-based radical polymerization resin include low-molecular-weight (molecular-weight less than 1000) styrene-based compounds such as divinylbenzene, 2,4-divinyltoluene, 2,6-divinylnaphthalene, 1,4-divinylnaphthalene, 4,4'-divinylbiphenyl, 1,2-bis(4-vinylphenyl)ethane, 2,2-bis(4-vinylphenyl)propane, and bis(4-vinylphenyl)ether; and high-molecular-weight (molecular-weight 1000 or more) styrene-based compounds such as vinylbenzyl-modified polyphenylene ether resin and styrene-divinylbenzene copolymer. Among these, the styrene-based radical polymerization resin is preferably a high-molecular-weight (molecular-weight 1000 or more) styrene-based compound, and more preferably a vinylbenzyl-modified polyphenylene ether resin.

[0230] Commercially available styrene-based radical polymerization resins include, for example, "ODV-XET(X03)", "ODV-XET(X04)", and "ODV-XET(X05)" (styrene-divinylbenzene copolymers) manufactured by Nippon Steel Chemical & Material Co., Ltd., and "OPE-2St", "OPE-2St 1200", and "OPE-2St 2200" (vinylbenzyl-modified polyphenylene ether resins) manufactured by Mitsubishi Gas Chemical Company, Inc.

[0231] The allyl radical polymerization resin is, for example, a compound having one or more, preferably two or more, allyl groups. Examples of the allyl radical polymerization resin include aromatic carboxylic acid allyl ester compounds such as diallyl diphenate, triallyl trimellitate, diallyl phthalate, diallyl isophthalate, diallyl terephthalate, diallyl 2,6-naphthalenedicarboxylate, and diallyl 2,3-naphthalenecarboxylate; isocyanuric acid allyl ester compounds such as 1,3,5-triallyl isocyanurate and 1,3-diallyl-5-glycidyl isocyanurate; 2,2-bis[3-allyl-4-(glycidyloxy)phenyl]propanol; benzoxazine-containing aromatic allyl compounds such as bis[3-allyl-4-(3,4-dihydro-2H-1,3-benzoxazin-3-yl)phenyl]methane; ether-containing aromatic allyl compounds such as 1,3,5-triallyl ether benzene; allylsilane compounds such as diallyldiphenylsilane; and resins represented by the following formula (F-1) obtained by reacting ortho-allylphenol, dicyclopentadiene-phenol copolymer resin, and isophthalic acid chloride. [ka] (In formula (F-1), the wavy line represents a structure obtained by reacting isophthalic acid chloride with a phenol polyaddition resin and / or ortho-allylphenol.)

[0232] Among these, the allyl radical polymerization resin is preferably an aromatic carboxylic acid allyl ester compound or a resin represented by the above formula (F-1), and more preferably diallyl diphenate or a resin represented by the above formula (F-1).

[0233] Commercially available allyl radical polymerization resins include, for example, "TAIC" (1,3,5-triallyl isocyanurate) manufactured by Nippon Kasei Chemical Industry Co., Ltd., "DAD" (diallyl diphenate) manufactured by Nisshoku Techno Fine Chemical Co., Ltd., "TRIAM-705" (triallyl trimellitate) manufactured by Fujifilm Wako Pure Chemical Industries, Ltd., "DAND" (2,3-naphthalene carboxylic acid diallyl) manufactured by Nisshoku Techno Fine Chemical Co., Ltd., "ALP-d" (bis[3-allyl-4-(3,4-dihydro-2H-1,3-benzoxazin-3-yl)phenyl]methane) manufactured by Shikoku Chemical Industry Co., Ltd., "RE-810NM" (2,2-bis[3-allyl-4-(glycidyloxy)phenyl]propane) manufactured by Nippon Kayaku Co., Ltd., and "DA-MGIC" (1,3-diallyl-5-glycidyl isocyanurate) manufactured by Shikoku Chemical Industry Co., Ltd.

[0234] The maleimide radical polymerization resin is, for example, a compound having one or more, preferably two or more, maleimide groups. The maleimide radical polymerization resin may be an aliphatic maleimide compound containing an aliphatic amine skeleton, or an aromatic maleimide compound containing an aromatic amine skeleton. Commercially available maleimide radical polymerization resins include, for example, "SLK-2600" manufactured by Shin-Etsu Chemical Co., Ltd.; "BMI-1500," "BMI-1700," "BMI-3000J," "BMI-689," and "BMI-2500" (dimer diamine structure-containing maleimide compounds) manufactured by Designer Molecules Inc.; "BMI-6100" (aromatic maleimide compound) manufactured by Designer Molecules Inc.; "MIR-5000-60T" and "MIR-3000-70MT" (biphenylaralkyl maleimide compounds) manufactured by Nippon Kayaku Co., Ltd.; "BMI-70" and "BMI-80" manufactured by K.I. Chemical Industry Co., Ltd.; and "BMI-2300" and "BMI-TMH" manufactured by Daiwa Kasei Kogyo Co., Ltd. Furthermore, as the maleimide radical polymerization resin, a maleimide resin (maleimide compound containing an indane ring skeleton) disclosed in the Japan Institute of Invention and Innovation's Disclosure Technical Bulletin No. 2020-500211 may be used.

[0235] The ethylenically unsaturated bond equivalent of the (F) radical polymerization resin is preferably 20 g / eq. to 3,000 g / eq., more preferably 50 g / eq. to 2,500 g / eq., even more preferably 70 g / eq. to 2,000 g / eq., and particularly preferably 90 g / eq. to 1,500 g / eq. The ethylenically unsaturated bond equivalent represents the mass of the radical polymerization resin per equivalent of ethylenically unsaturated bond.

[0236] The weight average molecular weight (Mw) of the (F) radical polymerization resin is preferably 40,000 or less, more preferably 10,000 or less, even more preferably 5,000 or less, and particularly preferably 3,000 or less. The lower limit is not particularly limited, but can be, for example, 150 or more.

[0237] When the resin composition of the first embodiment of the present invention contains a radical polymerization resin (F), the content of component (F) in the resin composition, based on 100% by mass of the nonvolatile components in the resin composition, is preferably 0.1% by mass or more or 1% by mass or more, more preferably 2% by mass or more or 3% by mass or more, even more preferably 4% by mass or more or 5% by mass or more, and particularly preferably 6% by mass or more, 7% by mass or more, or 7.5% by mass or more, from the viewpoint of significantly achieving the effects of the present invention. In one embodiment, the content may be 8% by mass or more, 9% by mass or more, 10% by mass or more, etc. The upper limit is preferably 30% by mass or less, more preferably 25% by mass or less, even more preferably 20% by mass or less or 18% by mass or less, and particularly preferably 15% by mass or less or 12% by mass or less. In one embodiment, the content may be 11% by mass or less, etc.

[0238] When the resin composition of the first embodiment of the present invention contains a radical polymerization resin (F), the content of the component (F) in the resin composition, based on 100% by mass of the resin components in the resin composition, is preferably 0.1% by mass or more or 1% by mass or more, more preferably 2.5% by mass or more or 5% by mass or more, even more preferably 7.5% by mass or more, 10% by mass or more or 12.5% ​​by mass or more, and particularly preferably 15% by mass or more, 17.5% by mass or more, or 20% by mass or more, from the viewpoint of significantly achieving the effects of the present invention. In one embodiment, the content may be 22.5% by mass or more, 25% by mass or more, etc. The upper limit is preferably 60% by mass or less, more preferably 55% by mass or less or 50% by mass or less, even more preferably 45% by mass or less or 40% by mass or less, and particularly preferably 35% by mass or less or 30% by mass or less. In one embodiment, the content may be 28% by mass or less, 26% by mass or less, etc.

[0239] When the resin composition of the first embodiment of the present invention contains a radical polymerization resin (F), the mass ratio of component (F) to component (1A) [component (F) / component (1A)] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.01 or more or 0.05 or more, more preferably 0.1 or more or 0.2 or more, even more preferably 0.5 or more or 0.8 or more, and particularly preferably 1 or more or 1.2 or more. In one embodiment, it may be 1.4 or more, 1.6 or more, etc. The upper limit is preferably 100 or less or 80 or less, more preferably 50 or less or 20 or less, even more preferably 15 or less, 10 or less or 8 or less, and particularly preferably 5 or less, 3 or less, 2 or less, or 1.8 or less.

[0240] When the resin composition of the first embodiment of the present invention contains a radical polymerization resin (F), the mass ratio of component (F) to component (B) [component (F) / component (B)] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.01 or more or 0.02 or more, more preferably 0.05 or more or 0.08 or more, even more preferably 0.1 or more or 0.2 or more, and particularly preferably 0.5 or more or 0.7 or more. In one embodiment, it may be 0.8 or more, 0.9 or more, etc. The upper limit is preferably 100 or less or 80 or less, more preferably 50 or less or 20 or less, even more preferably 15 or less, 10 or less or 8 or less, and particularly preferably 5 or less, 3 or less, 2 or less, 1.5 or less, or 1.2 or less.

[0241] When the resin composition according to the first embodiment of the present invention contains a radical polymerization resin (F), the mass ratio of the component (F) to the component (C) [component (F) / component (C)] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.001 or more or 0.002 or more, more preferably 0.005 or more or 0.008 or more, even more preferably 0.01 or more, 0.02 or more or 0.05 or more, and particularly preferably 0.08 or more, 0.1 or more or 0.12 or more. In one embodiment, it may be 0.14 or more, 0.16 or more, or the like. The upper limit is preferably 20 or less or 15 or less, more preferably 10 or less, 8 or less or 5 or less, even more preferably 2 or less, 1 or less or 0.8 or less, and particularly preferably 0.5 or less, 0.3 or less or 0.2 or less. In one embodiment, it may be 0.18 or less, or the like.

[0242] When the resin composition of the first embodiment of the present invention contains a (D) curing agent and a (F) radical polymerization resin, the mass ratio of the (F) component to the (D) component [(F) component / (D) component] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.01 or more or 0.02 or more, more preferably 0.05 or more or 0.08 or more, even more preferably 0.1 or more or 0.2 or more, and particularly preferably 0.4 or more or 0.5 or more. In one embodiment, it may be 0.6 or more, 0.7 or more, 0.8 or more, etc. The upper limit is preferably 50 or less or 20 or less, more preferably 15 or less or 10 or less, even more preferably 8 or less or 5 or less, and particularly preferably 3 or less, 2 or less, or 1 or less.

[0243] When the resin composition of the first embodiment of the present invention contains a curing accelerator (E) and a radical polymerization resin (F), the mass ratio of the component (E) to the component (F) [component (E) / component (F)] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.0001 or more, more preferably 0.0002 or more or 0.0005 or more, even more preferably 0.0008 or more or 0.001 or more, and particularly preferably 0.0015 or more or 0.002 or more. The upper limit is preferably 1 or less or 0.5 or less, more preferably 0.1 or less or 0.08 or less, even more preferably 0.05 or less or 0.02 or less, and particularly preferably 0.01 or less, 0.008 or less, 0.005 or less, or 0.004 or less.

[0244] <(G) Radical Polymerization Initiator> The resin composition of the first embodiment of the present invention may contain a (G) radical polymerization initiator as an optional component. When the resin composition contains a (F) radical polymerization resin, it is preferable to also contain a (G) radical polymerization initiator. When the resin composition of the first embodiment of the present invention contains a (F) radical polymerization resin, the (F) radical polymerization resin can be polymerized and cured by thermal radicals generated by heating or the like even without the (G) radical polymerization initiator. However, by including a (G) radical polymerization initiator, the polymerization reaction proceeds more efficiently, resulting in a cured product that exhibits better dielectric properties and better adhesion. The (G) radical polymerization initiator may be used alone or in combination of two or more types.

[0245] From the viewpoint of providing a cured product exhibiting better dielectric properties, the one-hour half-life temperature of the radical polymerization initiator (G) is preferably 100°C or higher, more preferably 110°C or higher, and even more preferably 120°C or higher. The upper limit is preferably 250°C or lower, more preferably 200°C or lower, and even more preferably 180°C or lower. The one-hour half-life indicates that it takes one hour for the amount of the polymerization initiator to be reduced to half, and the one-hour half-life temperature indicates the decomposition temperature of the radical polymerization initiator at which the one-hour half-life is obtained.

[0246] The radical polymerization initiator may be a compound capable of generating radicals upon heating, such as a peroxide radical polymerization initiator, an azo compound radical polymerization initiator, a persulfate compound radical polymerization initiator, or a redox radical polymerization initiator.

[0247] Examples of the peroxide radical polymerization initiator include hydroperoxide compounds such as 1,1,3,3-tetramethylbutyl hydroperoxide, p-menthane hydroperoxide, diisopropylbenzene hydroperoxide, cumene hydroperoxide, and tert-butyl hydroperoxide; tert-butylcumyl peroxide, di-tert-butyl peroxide, di-tert-hexyl peroxide, di-tert-amyl peroxide, dicumyl peroxide, and 1,4-bis(1-tert-butyl peroxide). Dialkyl peroxide compounds such as α,α'-di(tert-butylperoxy)diisopropylbenzene, 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane, 2,5-dimethyl-2,5-di(benzoylperoxy)hexane, 2,2-di(tert-butylperoxy)butane, di(2-tert-butylperoxyisopropyl)benzene, 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexyne-3, and 2,3-dimethyl-2,3-diphenylbutane; dialkyl peroxide compounds such as dialkyl peroxide; diacyl peroxide compounds such as dicyclohexyl peroxide, didecanoyl peroxide, dicyclohexyl peroxydicarbonate, and bis(4-tert-butylcyclohexyl) peroxydicarbonate; tert-butyl peroxyacetate, tert-butyl peroxybenzoate, tert-hexyl peroxybenzoate, tert-butyl peroxyisopropyl monocarbonate, tert-butyl peroxy-2-ethylhexanoate, tert-butyl peroxyneodecanoate, and tert-hexyl peroxyisopropyl peroxyester compounds such as isopropyl monocarbonate, tert-butyl peroxylaurate, (1,1-dimethylpropyl) 2-ethylperhexanoate, tert-butyl-2-ethylperhexanoate (also known as t-butylperoxy-2-ethylhexanoate), tert-butyl-3,5,5-trimethylperhexanoate, tert-butylperoxy-2-ethylhexyl monocarbonate, tert-butylperoxymaleic acid, and n-butyl-4,4-di(tert-butylperoxy)valerate; and the like.

[0248] The peroxide-based radical polymerization initiator is preferably any one of a hydroperoxide compound and a dialkyl peroxide compound, more preferably a dialkyl peroxide compound, further preferably di-tert-amyl peroxide, di-tert-hexyl peroxide or dicumyl peroxide, and particularly preferably di-tert-amyl peroxide or di-tert-hexyl peroxide.

[0249] Examples of the azo compound radical polymerization initiator include 2,2'-azobisisobutyronitrile, 2,2'-azobis(2-methylbutyronitrile), 2,2'-azobis(2-methylpropionitrile), 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-azobis(2,4,4-trimethylpentane), 2,2'-azobis(2-methylpropane), 1,1'-azobis(cyclohexanecarbonitrile), and dimethyl-2,2'-azobisisobutyrate, with 2,2'-azobisisobutyronitrile being preferred.

[0250] Examples of the persulfate compound radical polymerization initiator include potassium persulfate.

[0251] Commercially available radical polymerization initiators can be used. Examples of commercially available radical polymerization initiators include "Perhexyl I", "Perbutyl 355", "Perbutyl L", "Perbutyl O", "Perbutyl ND", "Perbutyl I", "Perbutyl E", "Perhexyl Z", "Perhexa 25Z", "Perbutyl A", "Perhexa 22", "Perbutyl Z", "Perhexa V", "Perbutyl P", "Percumyl D", "Perhexyl D", "Perhexa 25B", "Perbutyl C", "Perbutyl D", "Permenta H", "Perhexyne 25B", "Percumyl D", "Percumyl P", "Perocta H", "Percumyl H", "Perbutyl H", and "Nofumer BC", all manufactured by NOF Corporation; and "Luperox DTA" manufactured by Arkema Yoshitomi Co., Ltd.

[0252] When the resin composition of the first embodiment of the present invention contains a (G) radical polymerization initiator, the content of the (G) component in the resin composition, relative to 100% by mass of the nonvolatile components in the resin composition, is preferably 0.0001% by mass or more or 0.0002% by mass or more, more preferably 0.0005% by mass or more or 0.0008% by mass or more, even more preferably 0.001% by mass or more, 0.002% by mass or more or 0.005% by mass or more, particularly preferably 0.008% by mass or more, 0.01% by mass or more or 0.02% by mass or more, from the viewpoint of significantly achieving the effects of the present invention. The upper limit is preferably 5% by mass or less or 2% by mass or less, more preferably 1% by mass or less, 0.8% by mass or less or 0.5% by mass or less, even more preferably 0.2% by mass or less, 0.1% by mass or less or 0.08% by mass or less, and particularly preferably 0.06% by mass or less, 0.05% by mass or less or 0.04% by mass or less.

[0253] When the resin composition of the first embodiment of the present invention contains a (G) radical polymerization initiator, the content of the (G) component in the resin composition, relative to 100% by mass of the resin components in the resin composition, is preferably 0.0001% by mass or more or 0.0005% by mass or more, more preferably 0.001% by mass or more or 0.002% by mass or more, even more preferably 0.005% by mass or more, 0.008% by mass or more or 0.01% by mass or more, particularly preferably 0.02% by mass or more, 0.04% by mass or more or 0.05% by mass or more, from the viewpoint of significantly achieving the effects of the present invention. The upper limit is preferably 10% by mass or less or 5% by mass or less, more preferably 2% by mass or less or 1% by mass or less, even more preferably 0.8% by mass or less or 0.5% by mass or less, particularly preferably 0.2% by mass or less, 0.1% by mass or less or 0.08% by mass or less.

[0254] When the resin composition of the first embodiment of the present invention contains a radical polymerization initiator (G), the mass ratio of the component (G) to the component (1A) [component (G) / component (1A)] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.0001 or more, more preferably 0.0002 or more or 0.0005 or more, even more preferably 0.0008 or more or 0.001 or more, and particularly preferably 0.002 or more or 0.003 or more. The upper limit is preferably 1 or less or 0.5 or less, more preferably 0.1 or less or 0.08 or less, even more preferably 0.05 or less, 0.02 or less or 0.01 or less, and particularly preferably 0.008 or less, 0.006 or less or 0.005 or less.

[0255] When the resin composition of the first embodiment of the present invention contains a (G) radical polymerization initiator, the mass ratio of the (G) component to the (B) component [(G) component / (B) component] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.0001 or more, more preferably 0.0002 or more or 0.0005 or more, even more preferably 0.0008 or more or 0.001 or more, and particularly preferably 0.0015 or more or 0.002 or more. The upper limit is preferably 1 or less or 0.5 or less, more preferably 0.1 or less or 0.08 or less, even more preferably 0.05 or less, 0.02 or less or 0.01 or less, and particularly preferably 0.008 or less, 0.005 or less, or 0.003 or less.

[0256] When the resin composition of the first embodiment of the present invention contains a radical polymerization initiator (G), the mass ratio of the component (G) to the component (C) [component (G) / component (C)] is preferably 1×10 -5 More preferably, 2×10 -5 or more or 5 x 10 -5 More preferably, 8 × 10 -5 or more or 1 x 10 -4 More preferably, 2 × 10 -4 or more or 4 x 10 -4 The upper limit is preferably 1×10 -1 or less or 5 x 10 -2 Less than 1×10, more preferably -2 or less or 8 x 10-3 Less than 5 × 10, more preferably -3 or less or 2 x 10 -3 Below 1 × 10, particularly preferably -3 Below, 8 x 10 -4 or less or 5 x 10 -4 The following is the result.

[0257] When the resin composition of the first embodiment of the present invention contains a (D) curing agent and a (G) radical polymerization initiator, the mass ratio of the (G) component to the (D) component [(G) component / (D) component] is, from the viewpoint of significantly obtaining the effects of the present invention, preferably 0.0001 or more, more preferably 0.0002 or more, even more preferably 0.0005 or more or 0.0008 or more, and particularly preferably 0.001 or more or 0.0015 or more. The upper limit is preferably 1 or less or 0.5 or less, more preferably 0.1 or less or 0.08 or less, even more preferably 0.05 or less, 0.02 or less or 0.01 or less, and particularly preferably 0.008 or less, 0.005 or less, or 0.003 or less.

[0258] When the resin composition of the first embodiment of the present invention contains a curing accelerator (E) and a radical polymerization initiator (G), the mass ratio of the component (G) to the component (E) [component (G) / component (E)] is, from the viewpoint of significantly achieving the effects of the present invention, preferably at least 0.01 or 0.02, more preferably at least 0.05 or 0.08, even more preferably at least 0.1 or 0.2, and particularly preferably at least 0.5 or 0.8. The upper limit is preferably 100 or 80, more preferably 50 or 20, even more preferably 10 or 8 or 5, and particularly preferably 2 or 1.5 or 1.2.

[0259] When the resin composition of the first embodiment of the present invention contains a radical polymerization resin (F) and a radical polymerization initiator (G), the mass ratio of the component (G) to the component (F) [component (G) / component (F)] is, from the viewpoint of significantly achieving the effects of the present invention, preferably 0.0001 or more, more preferably 0.0002 or more or 0.0005 or more, even more preferably 0.0008 or more or 0.001 or more, and particularly preferably 0.0015 or more or 0.002 or more. The upper limit is preferably 1 or less or 0.5 or less, more preferably 0.1 or less or 0.08 or less, even more preferably 0.05 or less or 0.02 or less, and particularly preferably 0.01 or less, 0.008 or less, 0.005 or less, or 0.004 or less.

[0260] <(H) Organic Solvent> The resin composition of the first embodiment of the present invention may contain an organic solvent (H) as an optional component, and preferably contains an organic solvent (H). By adding an organic solvent (H) to the resin composition, a resin composition varnish with an appropriate viscosity can be obtained. The organic solvent (H) may be used alone or in combination of two or more.

[0261] Examples of the (H) organic solvent include organic solvents composed of atoms selected from carbon atoms, oxygen atoms, nitrogen atoms, phosphorus atoms, sulfur atoms, halogen atoms, and hydrogen atoms. From the viewpoint of safety, the (H) organic solvent is preferably an organic solvent composed of atoms selected from carbon atoms, oxygen atoms, and hydrogen atoms, and more preferably an organic solvent composed of carbon atoms, oxygen atoms, and hydrogen atoms.

[0262] Examples of (H) organic solvents include glycol-based organic solvents, glycol ether-based organic solvents, glycol ether ester-based organic solvents, ketone-based organic solvents, ester-based organic solvents, ether-based organic solvents, alcohol-based organic solvents, aliphatic hydrocarbon-based organic solvents, aromatic organic solvents, nitrogen-based organic solvents, sulfur-based organic solvents, and halogen-based organic solvents. Examples of nitrogen-based organic solvents include amide-based organic solvents, urea-based organic solvents, and nitrile-based organic solvents. From the viewpoint of safety, (H) organic solvents are preferably ester-based organic solvents, ketone-based organic solvents, glycol-based organic solvents, glycol ether-based organic solvents, glycol ether ester-based organic solvents, or aromatic organic solvents, more preferably ester-based organic solvents, glycol ether ester-based organic solvents, ketone-based organic solvents, or aromatic organic solvents, even more preferably ketone-based organic solvents or aromatic organic solvents, and particularly preferably ketone-based organic solvents.

[0263] Examples of glycol-based organic solvents include ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, and trimethylene glycol.

[0264] Examples of glycol ether organic solvents include cellosolves such as ethylene glycol monomethyl ether (also known as methyl cellosolve), ethylene glycol monoethyl ether (also known as cellosolve), ethylene glycol monopropyl ether (also known as propyl cellosolve), ethylene glycol monobutyl ether (also known as butyl cellosolve), ethylene glycol monoisobutyl ether (also known as isobutyl cellosolve), ethylene glycol mono-tert-butyl ether (also known as tert-butyl cellosolve), and ethylene glycol monohexyl ether; diethylene glycol monomethyl ether (also known as methyl carbitol), diethylene glycol monoethyl ether ( carbitols such as diethylene glycol monopropyl ether (also known as propyl carbitol) and diethylene glycol monobutyl ether (DB) (also known as butyl carbitol); propylene glycol ethers such as propylene glycol monomethyl ether (PGM), propylene glycol monoethyl ether, propylene glycol monopropyl ether and propylene glycol monobutyl ether; and dipropylene glycol ethers such as dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monopropyl ether and dipropylene glycol monobutyl ether.

[0265] Examples of glycol ether ester organic solvents include cellosolve esters such as ethylene glycol monomethyl ether acetate (also known as methyl cellosolve acetate), ethylene glycol monoethyl ether acetate (also known as cellosolve acetate), and ethylene glycol monobutyl ether acetate (also known as butyl cellosolve acetate); carbitol esters such as diethylene glycol monoethyl ether acetate (EDGAc) (also known as carbitol acetate) and diethylene glycol monobutyl ether acetate (also known as butyl carbitol acetate); propylene glycol ether esters such as propylene glycol monomethyl ether acetate (PGMEAc) and propylene glycol monoethyl ether acetate; and dipropylene glycol ether esters such as dipropylene glycol monomethyl ether acetate, with carbitol esters being preferred and more preferred than diethylene glycol monoethyl ether acetate.

[0266] Examples of ketone-based organic solvents include aliphatic acyclic ketones such as acetone, methyl ethyl ketone (MEK), diethyl ketone, 2-pentanone, methyl isobutyl ketone, 2-hexanone, 2-heptanone (MAK), and diisobutyl ketone; aliphatic cyclic ketones such as cyclopentanone, cyclohexanone (Anone), and 2-methylcyclohexanone; and aromatic ketones such as acetophenone, with methyl ethyl ketone (MEK) or cyclohexanone being preferred. The lower limit of the number of carbon atoms in the ketone-based organic solvent is preferably 2 or more, more preferably 3 or more, and even more preferably 4 or more. The upper limit of the number of carbon atoms in the ketone-based organic solvent is preferably 10 or less, more preferably 8 or less, and even more preferably 6 or less.

[0267] Ester-based organic solvents are organic solvents having an ester structure that do not fall under the category of glycol ether ester-based organic solvents. Examples include fatty acid alkyl esters such as methyl acetate, ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate, sec-butyl acetate, tert-butyl acetate, n-pentyl acetate, isopentyl acetate, ethyl propionate, propyl propionate, and isopropyl propionate; hydroxy acid alkyl esters such as methyl lactate, ethyl lactate, and butyl lactate; keto acid alkyl esters such as methyl acetoacetate and ethyl acetoacetate; lactones such as γ-butyrolactone and α-acetyl-γ-butyrolactone; and aromatic esters such as methyl benzoate and ethyl benzoate. Lactones are preferred as ester-based organic solvents. Furthermore, the number of carbon atoms in the ester-based organic solvent is preferably 3 to 9.

[0268] The ether-based organic solvent is an organic solvent having an ether structure that does not fall under the category of glycol ether-based organic solvents or glycol ether ester-based organic solvents, and examples thereof include aliphatic acyclic ethers such as dimethyl ether, diethyl ether, methyl ethyl ether, diisopropyl ether, dibutyl ether, methyl tert-butyl ether, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, and triethylene glycol dimethyl ether; aliphatic cyclic ethers such as tetrahydrofuran, 1,4-dioxane, and 1,3-dioxolane; and aromatic ethers such as anisole and phenetole. The number of carbon atoms in the ether-based organic solvent is preferably 2 to 9.

[0269] Alcohol-based organic solvents are organic solvents having an alcohol structure that does not fall under the category of glycol-based organic solvents and glycol ether-based organic solvents, and examples thereof include aliphatic acyclic alcohols such as methanol, ethanol, n-propanol, isopropanol, n-butyl alcohol, isobutyl alcohol, sec-butyl alcohol, tert-butyl alcohol, n-pentyl alcohol, isopentyl alcohol, sec-pentyl alcohol, tert-pentyl alcohol, neopentyl alcohol, n-hexyl alcohol, n-heptyl alcohol, isoheptyl alcohol, n-octyl alcohol, and 2-ethylhexyl alcohol; aliphatic cyclic alcohols such as cyclohexanol; and aromatic alcohols such as benzyl alcohol and phenethyl alcohol.

[0270] Examples of aliphatic hydrocarbon organic solvents include n-pentane, n-hexane, 2-methylpentane (also known as isohexane), n-heptane, n-octane, cyclopentane, cyclohexane, methylcyclohexane, ethylcyclohexane, decalin, etc. The aliphatic hydrocarbon organic solvent preferably has 5 to 10 carbon atoms.

[0271] Examples of aromatic organic solvents include C benzene, toluene, o-xylene, m-xylene, p-xylene, and ethylbenzene. 6-8 Aromatic hydrocarbons: C9 aromatic hydrocarbons such as 1,2,3-trimethylbenzene, 1,3,5-trimethylbenzene (also known as mesitylene), 1,2,4-trimethylbenzene, 4-ethyltoluene, 3-ethyltoluene, and 2-ethyltoluene; C1 aromatic hydrocarbons such as 1,2-diethylbenzene, 1,3-diethylbenzene, 1,4-diethylbenzene, 3-ethyl-o-xylene, 4-ethyl-o-xylene, 2-ethyl-p-xylene, 1,2,3,5-tetramethylbenzene, and tetralin. 10 Aromatic hydrocarbons include aromatic heterocyclic compounds such as pyridine, furan, and thiophene, and toluene is preferred. The aromatic organic solvent preferably has 6 to 10 carbon atoms.

[0272] Examples of amide-based organic solvents include aliphatic acyclic amides such as N,N-dimethylacetamide and N,N-dimethylformamide, lactams such as N-methyl-2-pyrrolidone and N-cyclohexyl-2-pyrrolidone, and phosphoric acid amides such as hexamethylphosphoramide. The number of carbon atoms in the amide-based organic solvent is preferably 2 to 10.

[0273] Examples of urea-based organic solvents include tetramethylurea and 1,3-dimethyl-2-imidazolinone.

[0274] Examples of the nitrile organic solvent include acetonitrile, propionitrile, benzonitrile, etc. The nitrile organic solvent preferably has 2 to 10 carbon atoms.

[0275] An example of the sulfur-based organic solvent is dimethyl sulfoxide.

[0276] Examples of halogen-based organic solvents include chloroform, methylene chloride, carbon tetrachloride, 1,2-dichloroethane, etc. The halogen-based organic solvent preferably has 1 to 10 carbon atoms.

[0277] Among these, as the (H) organic solvent, γ-butyrolactone, methyl ethyl ketone (MEK), cyclopentanone, cyclohexanone, propylene glycol, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, or toluene is preferred, methyl ethyl ketone (MEK), cyclohexanone, diethylene glycol monoethyl ether acetate, γ-butyrolactone, or toluene is more preferred, methyl ethyl ketone (MEK), cyclohexanone, or toluene is even more preferred, and methyl ethyl ketone (MEK) or cyclohexanone is particularly preferred.

[0278] When the resin composition of the first embodiment of the present invention contains an organic solvent (H), the content of component (H) in the resin composition, when all components in the resin composition are taken as 100% by mass, is preferably 1% by mass or more or 2% by mass or more, more preferably 5% by mass or more or 8% by mass or more, even more preferably 10% by mass or more or 12% by mass or more, and particularly preferably 15% by mass or more. The upper limit is preferably 50% by mass or less, more preferably 45% by mass or less or 40% by mass or less, even more preferably 35% by mass or less or 30% by mass or less, and particularly preferably 25% by mass or less or 20% by mass or less.

[0279] <(I) Other additives> The resin composition of the first embodiment of the present invention may further contain (I) other additives as optional components to the extent that the object of the present invention is not impaired. Examples of such additives include thermoplastic resins such as phenoxy resins; organic fillers such as rubber particles; organometallic compounds such as organocopper compounds, organozinc compounds, and organocobalt compounds; colorants such as phthalocyanine blue, phthalocyanine green, iodine green, diazo yellow, crystal violet, titanium oxide, and carbon black; polymerization inhibitors such as hydroquinone, catechol, pyrogallol, and phenothiazine; leveling agents such as silicone-based leveling agents and acrylic polymer-based leveling agents; thickeners such as bentone and montmorillonite; antifoaming agents such as silicone-based antifoaming agents, acrylic-based antifoaming agents, fluorine-based antifoaming agents, and vinyl resin-based antifoaming agents; ultraviolet absorbers such as benzotriazole-based ultraviolet absorbers; adhesion improvers such as urea silanes; triazole-based adhesion promoters and tetrazole-based adhesion promoters. Examples of suitable additives include adhesion promoters such as adhesion promoters and triazine-based adhesion promoters; antioxidants such as hindered phenol-based antioxidants; fluorescent brighteners such as stilbene derivatives; surfactants such as fluorine-based surfactants and silicone-based surfactants; flame retardants such as phosphorus-based flame retardants (e.g., phosphate ester compounds, phosphazene compounds, phosphinic acid compounds, and red phosphorus), nitrogen-based flame retardants (e.g., melamine sulfate), halogen-based flame retardants, and inorganic flame retardants (e.g., antimony trioxide); dispersants such as phosphate ester-based dispersants, polyoxyalkylene-based dispersants, acetylene-based dispersants, silicone-based dispersants, anionic dispersants, and cationic dispersants; and stabilizers such as borate-based stabilizers, titanate-based stabilizers, aluminate-based stabilizers, zirconate-based stabilizers, isocyanate-based stabilizers, carboxylic acid-based stabilizers, and carboxylic anhydride-based stabilizers. These additives may be used alone or in combination of two or more. The content of the additives may be determined depending on the properties required of the resin composition. Furthermore, the components (1A) to (H) may have the functions of a thermoplastic resin, an organic filler, an organometallic compound, a colorant, a polymerization inhibitor, a leveling agent, a thickener, an antifoaming agent, an ultraviolet absorber, an adhesion improver, an adhesion imparting agent, an antioxidant, a fluorescent brightener, a flame retardant, a dispersant, a stabilizer, etc. In such cases, such components are considered to be part of the components (1A) to (H) rather than the component (I).

[0280] [Resin composition of second embodiment] A resin composition according to a second embodiment of the present invention contains (2A) a polymer having a second specific structure, (B) an epoxy resin, and (C) an inorganic filler. The second specific structure will be described later. By incorporating the components (2A) to (C) in combination into the resin composition, a cured product exhibiting excellent dielectric properties and excellent adhesion can be obtained. The resin composition according to the second embodiment may further contain optional components in addition to the components (2A) to (C). Examples of optional components include (D) a curing agent, (E) a curing accelerator, (F) a radical polymerization resin, (G) a radical polymerization initiator, (H) an organic solvent, and (I) other additives. Each component contained in the resin composition according to the second embodiment will be described below.

[0281] <(2A) Polymer Having a Second Specific Structure> The resin composition according to a second embodiment of the present invention contains (2A) a polymer (polymer having a second specific structure) formed by reacting cyanuric chloride, an optionally hydrogenated bisphenol, a compound represented by the following formula (X-1), and a monophenol. Because optionally hydrogenated bisphenols have a rigid skeleton, the inclusion of a skeleton derived from the optionally hydrogenated bisphenol in component (2A) is believed to improve thermal stability and inhibit thermal oxidative degradation due to heating during curing of the resin composition. Furthermore, the inclusion of a rigid skeleton derived from the optionally hydrogenated bisphenol in component (2A) is believed to reduce the influence of molecular motion due to high frequencies, resulting in a cured product exhibiting excellent dielectric properties. The component (2A) may be used singly or in combination of two or more. [ka] (In formula (X-1), R 1 is a monovalent organic group having atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms as constituent atoms, and R 1 The molecular weight of R is 250 or more.1 does not have an ethylenically unsaturated group, and R 1 does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton.

[0282] In formula (X-1), R 1 is a monovalent organic group having atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms as constituent atoms, and R 1 The molecular weight of R is 250 or more. 1 does not have an ethylenically unsaturated group, and R 1 does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. 1 is R in formula (A-1) 1 is the same as

[0283] The optionally hydrogenated bisphenols related to component (2A) are the same as the optionally hydrogenated bisphenols described in the section <(1A) Method for producing polymer having first specific structure> in component (1A) above.

[0284] The monophenols related to the component (2A) are the same as the monophenols described in the section <(1A) Production method for polymer having first specific structure> for the component (1A) above.

[0285] <(2A) Method for producing a polymer having a second specific structure> The method for producing (2A) the polymer having the second specific structure is the same as the method for producing (1A) the polymer having the first specific structure.

[0286] <(B) Epoxy resin> The resin composition according to the second embodiment of the present invention contains an epoxy resin (B). The epoxy resin (B) according to the second embodiment is the same as the epoxy resin (B) according to the first embodiment.

[0287] <(C) Inorganic filler> The resin composition according to the second embodiment of the present invention contains an inorganic filler (C). The inorganic filler (C) according to the second embodiment is the same as the inorganic filler (C) according to the first embodiment.

[0288] <(D) Curing agent> The resin composition according to the second embodiment of the present invention may contain a curing agent (D), and preferably contains a curing agent (D). The curing agent (D) according to the second embodiment is the same as the curing agent (D) according to the first embodiment.

[0289] <(E) Curing accelerator> The resin composition according to the second embodiment of the present invention may contain a curing accelerator (E), and preferably contains a curing accelerator (E). The curing accelerator (E) according to the second embodiment is the same as the curing accelerator (E) according to the first embodiment.

[0290] <(F) Radical polymerization resin> The resin composition according to the second embodiment of the present invention may contain a radical polymerization resin (F). The radical polymerization resin (F) according to the second embodiment is the same as the radical polymerization resin (F) according to the first embodiment.

[0291] <(G) Radical Polymerization Initiator> The resin composition according to the second embodiment of the present invention may contain a radical polymerization initiator (G). The radical polymerization initiator (G) according to the second embodiment is the same as the radical polymerization initiator (G) according to the first embodiment.

[0292] <(H) Organic Solvent> The resin composition according to the second embodiment of the present invention may contain, and preferably contains, an organic solvent (H). The organic solvent (H) according to the second embodiment is the same as the organic solvent (H) according to the first embodiment.

[0293] <(I) Other additives> The resin composition according to the second embodiment of the present invention may contain (I) other additives. The (I) other additives according to the second embodiment are the same as the (I) other additives according to the first embodiment.

[0294] [Method of producing resin composition] The method for producing the resin composition of the present invention comprises: (1) a step of reacting cyanuric chloride, an optionally hydrogenated bisphenol, a compound represented by the following formula (X-1), and a monophenol to obtain a polymer; and (2) mixing the polymer obtained in step (1), the epoxy resin, and the inorganic filler; Includes. [ka] (In formula (X-1), R 1 is a monovalent organic group having atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms as constituent atoms, and R 1 The molecular weight of R is 250 or more. 1 does not have an ethylenically unsaturated group, and R 1 does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton.

[0295] <Process (1)> In step (1), a polymer is obtained by reacting cyanuric chloride, an optionally hydrogenated bisphenol, a compound represented by the above formula (X-1), and a monophenol.

[0296] In formula (X-1), R 1 is a monovalent organic group having atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms as constituent atoms, and R 1 The molecular weight of R is 250 or more. 1 does not have an ethylenically unsaturated group, and R 1 does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton. 1is R in formula (A-1) 1 is the same as

[0297] The optionally hydrogenated bisphenols used in step (1) are the same as the optionally hydrogenated bisphenols described in the section <(1A) Method for producing polymer having first specific structure> in the component (1A) above.

[0298] The monophenols used in step (1) are the same as those described in the section <(1A) Production method for polymer having first specific structure> in the component (1A) above.

[0299] The solvent, use of base, reaction temperature, reaction time, purification, etc. in step (1) are the same as those described in the section <(1A) Production method for polymer having first specific structure> for component (1A) above.

[0300] <Process (2)> In step (2), the polymer obtained in step (1), the epoxy resin, and the inorganic filler are mixed. The mixture can be prepared by kneading or stirring using a kneading means such as a triple roll mill, ball mill, bead mill, or sand mill, or a stirring means such as a super mixer, planetary mixer, or high-speed rotary mixer, as needed. In step (2), the above components (D) to (I) may be added and mixed as needed.

[0301] When a resin diluted with a solvent is used as a component of the resin composition of the present invention, the solid resin obtained by removing the solvent may be used, or the resin diluted with the solvent may be used as is, with the solvent portion being used as (H) organic solvent.

[0302] <Physical properties and applications of resin compositions> In one embodiment, a cured product of the resin composition of the present invention is characterized by a low dielectric constant (Dk). For example, when measured at 5.8 GHz and 23°C as described in the section "Test Example 1: Measurement of Dielectric Properties (Dielectric Constant, Dielectric Loss Tangent)" below, the dielectric constant (Dk) of a cured product of the resin composition of the present invention may be preferably 3.5 or less, 3.4 or less, 3.3 or less, 3.2 or less, 3.15 or less, 3.1 or less, 3.05 or less, or 3.0 or less. The lower limit is not particularly limited, but may be 1.0 or more, 1.1 or more, or 1.5 or more, for example.

[0303] In one embodiment, a cured product of the resin composition of the present invention is characterized by a low dielectric dissipation factor (Df). For example, when measured at 5.8 GHz and 23°C as described in the section "Test Example 1: Measurement of Dielectric Properties (Dielectric Constant, Dielectric Dissipation Factor)" below, the dielectric dissipation factor (Df) of the cured product of the resin composition of the present invention may be preferably 0.010 or less, 0.008 or less, 0.006 or less, 0.005 or less, 0.004 or less, 0.0035 or less, 0.003 or less, 0.0028 or less, 0.0027 or less, 0.0026 or less, 0.0025 or less, 0.0024 or less, 0.0023 or less, 0.0022 or less, or 0.0021 or less. The lower limit is not particularly limited, but may be 0.0001 or more, 0.001 or more, etc.

[0304] In one embodiment, a cured product of the resin composition of the present invention exhibits excellent substrate adhesion (high copper foil peel strength). For example, when measured as described in the section "Test Example 2: Measurement of Substrate Adhesion (Copper Foil Peel Strength)" below, the load during copper foil peel strength measurement can be preferably 0.3 kgf / cm or more, 0.35 kgf / cm or more, 0.4 kgf / cm or more, 0.45 kgf / cm or more, 0.5 kgf / cm or more, or 0.55 kgf / cm or more. The upper limit is not particularly limited, but can be 10 kgf / cm or less, 1 kgf / cm or less, etc.

[0305] In one embodiment, a cured product of the resin composition of the present invention exhibits excellent plating adhesion (high peel strength between the insulating layer and the plated conductor layer). For example, when measured as described in the section <Test Example 3: Measurement of Peel Strength of Plated Conductor Layer> below, the load when measuring the peel strength between the insulating layer and the plated conductor layer can be preferably 0.2 kgf / cm or more, 0.25 kgf / cm or more, 0.3 kgf / cm or more, 0.32 kgf / cm or more, 0.34 kgf / cm or more, 0.36 kgf / cm or more, 0.38 kgf / cm or more, 0.4 kgf / cm or more, 0.42 kgf / cm or more, or 0.44 kgf / cm or more. The upper limit is not particularly limited, but can be 10 kgf / cm or less, 1 kgf / cm or less, etc.

[0306] The resin composition of the present invention can provide a cured product having excellent dielectric properties and adhesion. Therefore, the resin composition of the present invention can be suitably used as a resin composition for insulating purposes. Specifically, the resin composition can be suitably used as a resin composition for forming an insulating layer (a resin composition for forming an insulating layer) to form a conductor layer (including a rewiring layer) formed on the insulating layer.

[0307] Furthermore, in the multilayer printed wiring board described below, the resin composition can be suitably used as a resin composition for forming an insulating layer of the multilayer printed wiring board (resin composition for forming an insulating layer of a multilayer printed wiring board) and as a resin composition for forming an interlayer insulating layer of the printed wiring board (resin composition for forming an interlayer insulating layer of a printed wiring board).

[0308] Furthermore, for example, when a semiconductor chip package is manufactured through the following steps (1) to (6), the resin composition of the present invention can be suitably used as a resin composition for a rewiring formation layer (resin composition for forming a rewiring formation layer) as an insulating layer for forming a rewiring layer, and as a resin composition for encapsulating a semiconductor chip (resin composition for encapsulating a semiconductor chip). When a semiconductor chip package is manufactured, a rewiring layer may be further formed on the encapsulating layer. (1) a step of laminating a temporary fixing film on a substrate; (2) a step of temporarily fixing a semiconductor chip on a temporary fixing film; (3) forming an encapsulation layer on the semiconductor chip; (4) peeling the substrate and the temporary fixing film from the semiconductor chip; (5) forming a rewiring formation layer as an insulating layer on the surface of the semiconductor chip from which the base material and the temporary fixing film have been peeled off; and (6) A step of forming a rewiring layer as a conductor layer on the rewiring formation layer.

[0309] [Resin sheet] The resin sheet of the present invention includes a support and a resin composition layer provided on the support and including the resin composition of the present invention.

[0310] The thickness of the resin composition layer is preferably 50 μm or less, more preferably 40 μm or less, and even more preferably 30 μm or less, from the viewpoint of making the printed wiring board thinner and being able to provide a cured product of the resin composition that has excellent insulating properties even when the cured product is thin. The lower limit of the thickness of the resin composition layer is not particularly limited, but can usually be 5 μm or more.

[0311] Examples of the support include films made of plastic materials, metal foils, and release paper, with films made of plastic materials and metal foils being preferred.

[0312] When a film made of a plastic material is used as the support, examples of the plastic material include polyesters such as polyethylene terephthalate (hereinafter sometimes abbreviated as "PET") and polyethylene naphthalate (hereinafter sometimes abbreviated as "PEN"), polycarbonate (hereinafter sometimes abbreviated as "PC"), acrylics such as polymethyl methacrylate (PMMA), cyclic polyolefins, triacetyl cellulose (TAC), polyether sulfide (PES), polyether ketone, polyimide, etc. Among these, polyethylene terephthalate and polyethylene naphthalate are preferred, with inexpensive polyethylene terephthalate being particularly preferred.

[0313] When a metal foil is used as the support, examples of the metal foil include copper foil and aluminum foil, with copper foil being preferred. The copper foil may be a foil made of a single metal, copper, or an alloy of copper and another metal (e.g., tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.).

[0314] The surface of the support that is to be bonded to the resin composition layer may be subjected to a matte treatment, a corona treatment, or an antistatic treatment.

[0315] The support may also be a support with a release layer, which has a release layer on the surface that bonds to the resin composition layer. Examples of the release agent used in the release layer of the support with a release layer include one or more release agents selected from the group consisting of alkyd resins, polyolefin resins, urethane resins, and silicone resins. Commercially available release agents include "SK-1," "AL-5," and "AL-7" manufactured by Lintec Corporation. The support with a release layer may also be a commercially available product, such as "Purex" manufactured by Toyobo Co., Ltd. or "Uni-Peel" manufactured by Unitika Ltd., which are PET films having a release layer primarily composed of an alkyd resin-based release agent or a polyolefin resin-based release agent.

[0316] The thickness of the support is not particularly limited, but is preferably in the range of 5 μm to 75 μm, more preferably 10 μm to 60 μm. When a support with a release layer is used, it is preferable that the thickness of the entire support with a release layer is in the above range.

[0317] In one embodiment, the resin sheet may further include other layers as necessary. Examples of such other layers include a protective film conforming to the support and provided on the surface of the resin composition layer that is not bonded to the support (i.e., the surface opposite the support). The thickness of the protective film is not particularly limited, but is, for example, 1 μm to 40 μm. By laminating the protective film, adhesion of dust and the like to the surface of the resin composition layer and scratches can be suppressed.

[0318] The resin sheet can be produced, for example, by preparing a resin varnish by dissolving a liquid (varnish-like) resin composition in its original form or dissolving the resin composition in an organic solvent, applying the resin varnish to a support using a die coater or the like, and then drying the applied resin varnish to form a resin composition layer.

[0319] Examples of organic solvents include ketones such as acetone, methyl ethyl ketone (MEK), and cyclohexanone; acetate esters such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, and carbitol acetate; carbitols such as cellosolve and butyl carbitol; aromatic hydrocarbons such as toluene and xylene; and amide solvents such as dimethylformamide, dimethylacetamide (DMAc), and N-methylpyrrolidone. The organic solvents may be used alone or in combination of two or more.

[0320] Drying may be carried out by known methods such as heating or hot air blowing. Drying conditions are not particularly limited, but drying is carried out so that the content of organic solvent in the resin composition layer becomes 10% by mass or less, preferably 5% by mass or less. Although this varies depending on the boiling point of the organic solvent in the resin varnish, for example, when a resin varnish containing 30% by mass to 60% by mass of organic solvent is used, the resin composition layer can be formed by drying at 50°C to 150°C for 3 to 10 minutes.

[0321] The resin sheet can be stored in a rolled state. When the resin sheet has a protective film, it can be used by peeling off the protective film.

[0322] [Printed wiring board] The printed wiring board of the present invention includes an insulating layer formed from a cured product of the resin composition of the present invention.

[0323] The printed wiring board can be produced, for example, by using the above-mentioned resin sheet by a method including the following steps (I) and (II). (I) A step of laminating the resin sheet on the inner layer substrate so that the resin composition layer of the resin sheet is bonded to the inner layer substrate. (II) Step of thermally curing the resin composition layer to form an insulating layer

[0324] The "inner layer substrate" used in step (I) is a member that will become the substrate of a printed wiring board, and examples thereof include glass epoxy substrates, metal substrates, polyester substrates, polyimide substrates, BT resin substrates, and thermosetting polyphenylene ether substrates. The substrate may have a conductor layer on one or both sides, and this conductor layer may be patterned. An inner layer substrate having a conductor layer (circuit) formed on one or both sides of the substrate may be referred to as an "inner layer circuit board." Furthermore, the "inner layer substrate" of the present invention also includes intermediate products on which an insulating layer and / or a conductor layer is to be further formed during the production of a printed wiring board. When the printed wiring board is a circuit board with built-in components, an inner layer substrate with built-in components may be used.

[0325] The inner layer substrate and the resin sheet can be laminated, for example, by thermocompression bonding the resin sheet to the inner layer substrate from the support side. Examples of a member for thermocompression bonding the resin sheet to the inner layer substrate (hereinafter also referred to as a "thermocompression bonding member") include a heated metal plate (such as a SUS end plate) or a metal roll (SUS roll). Note that rather than pressing the thermocompression bonding member directly onto the resin sheet, it is preferable to press it via an elastic material such as heat-resistant rubber so that the resin sheet can sufficiently conform to the surface irregularities of the inner layer substrate.

[0326] The lamination of the inner layer substrate and the resin sheet may be carried out by a vacuum lamination method. In the vacuum lamination method, the thermocompression temperature is preferably in the range of 60°C to 160°C, more preferably 80°C to 140°C, the thermocompression pressure is preferably in the range of 0.098MPa to 1.77MPa, more preferably 0.29MPa to 1.47MPa, and the thermocompression time is preferably in the range of 20 seconds to 400 seconds, more preferably 30 seconds to 300 seconds. The lamination is preferably carried out under reduced pressure conditions of 26.7hPa or less.

[0327] The lamination can be performed using a commercially available vacuum laminator, such as a vacuum pressure laminator manufactured by Meiki Seisakusho Co., Ltd., a vacuum applicator manufactured by Nikko Materials Co., Ltd., or a batch vacuum pressure laminator.

[0328] After lamination, the laminated resin sheets may be smoothed under normal pressure (atmospheric pressure), for example, by pressing a thermocompression member from the support side. The pressing conditions for the smoothing treatment may be the same as the thermocompression conditions for lamination. The smoothing treatment may be performed using a commercially available laminator. Note that lamination and smoothing treatment may be performed consecutively using the commercially available vacuum laminator.

[0329] The support may be removed between step (I) and step (II), or may be removed after step (II).

[0330] In step (II), the resin composition layer is thermally cured to form an insulating layer. The conditions for thermally curing the resin composition layer are not particularly limited, and conditions typically employed for forming insulating layers for printed wiring boards may be used.

[0331] For example, although the thermal curing conditions for the resin composition layer vary depending on the type of resin composition, the curing temperature is preferably 120° C. to 240° C., more preferably 150° C. to 220° C., and even more preferably 170° C. to 210° C. The curing time is preferably 5 minutes to 120 minutes, more preferably 10 minutes to 100 minutes, and even more preferably 15 minutes to 100 minutes.

[0332] Before thermally curing the resin composition layer, the resin composition layer may be preheated at a temperature lower than the curing temperature. For example, prior to thermally curing the resin composition layer, the resin composition layer may be preheated at a temperature of 50°C or higher but lower than 120°C (preferably 60°C or higher but 115°C or lower, more preferably 70°C or higher but 110°C or lower) for 5 minutes or longer (preferably 5 to 150 minutes, more preferably 15 to 120 minutes, and even more preferably 15 to 100 minutes).

[0333] When manufacturing a printed wiring board, the following steps may be further performed: (III) drilling holes in the insulating layer, (IV) roughening the insulating layer, and (V) forming a conductor layer. These steps (III) and (V) may be performed according to various methods known to those skilled in the art and used in manufacturing printed wiring boards. When the support is removed after step (II), the removal of the support may be performed between steps (II) and (III), between steps (III) and (IV), or between steps (IV) and (V). Furthermore, if necessary, the formation of the insulating layer and the conductor layer in steps (II) to (V) may be repeated to form a multilayer wiring board.

[0334] Step (III) is a step of drilling holes in the insulating layer, thereby forming holes such as via holes and through holes in the insulating layer. Step (III) may be performed using, for example, a drill, a laser, plasma, or the like, depending on the composition of the resin composition used to form the insulating layer. The dimensions and shape of the holes may be determined appropriately depending on the design of the printed wiring board.

[0335] Step (IV) is a step of roughening the insulating layer. Smear removal is usually also performed in this step (IV). The procedure and conditions for the roughening treatment are not particularly limited, and known procedures and conditions commonly used in forming insulating layers for printed wiring boards can be employed. For example, the insulating layer can be roughened by performing a swelling treatment with a swelling liquid, a roughening treatment with an oxidizing agent, and a neutralization treatment with a neutralizing liquid, in this order. The swelling liquid used for the roughening treatment is not particularly limited, but examples include alkaline solutions and surfactant solutions. Alkaline solutions are preferred, and sodium hydroxide solutions and potassium hydroxide solutions are more preferred. Commercially available swelling liquids include "Swelling Dip Securigant SBU" and "Swelling Dip Securigant P" manufactured by Atotech Japan. The swelling treatment with a swelling liquid is not particularly limited, but can be performed by immersing the insulating layer in a swelling liquid at 30°C to 90°C for 1 to 20 minutes. To minimize swelling of the resin in the insulating layer, the insulating layer is preferably immersed in a swelling solution at 40°C to 80°C for 5 to 15 minutes. The oxidizing agent used in the roughening treatment is not particularly limited, but examples include alkaline permanganate solutions prepared by dissolving potassium permanganate or sodium permanganate in an aqueous solution of sodium hydroxide. Roughening treatment using an oxidizing agent such as an alkaline permanganate solution is preferably performed by immersing the insulating layer in an oxidizing agent solution heated to 60°C to 100°C for 10 to 30 minutes. The concentration of permanganate in the alkaline permanganate solution is preferably 5% to 10% by mass. Commercially available oxidizing agents include alkaline permanganate solutions such as "Concentrate Compact P," "Concentrate Compact CP," and "Dosing Solution Securigant P" manufactured by Atotech Japan. The neutralizing solution used in the roughening treatment is preferably an acidic aqueous solution, and a commercially available product such as "Reduction Solution Securigant P" manufactured by Atotech Japan Co., Ltd. Treatment with a neutralizing solution can be carried out by immersing the surface that has been roughened with an oxidizing agent in the neutralizing solution at 30°C to 80°C for 1 minute to 30 minutes.From the viewpoint of workability, a preferred method is to immerse the object that has been subjected to roughening treatment with an oxidizing agent in a neutralizing solution at 40°C to 70°C for 5 to 20 minutes.

[0336] In one embodiment, the arithmetic mean roughness (Ra) of the insulating layer surface after roughening treatment is preferably 300 nm or less, more preferably 250 nm or less, and even more preferably 200 nm or less. There is no particular lower limit, but it is preferably 30 nm or more, more preferably 40 nm or more, and even more preferably 50 nm or more. The arithmetic mean roughness (Ra) of the insulating layer surface can be measured using a non-contact surface roughness meter.

[0337] Step (V) is a step of forming a conductor layer, and the conductor layer is formed on the insulating layer. The conductor material used for the conductor layer is not particularly limited. In a preferred embodiment, the conductor layer contains one or more metals selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin, and indium. The conductor layer may be a single metal layer or an alloy layer. Examples of alloy layers include layers formed from alloys of two or more metals selected from the above group (e.g., nickel-chromium alloys, copper-nickel alloys, and copper-titanium alloys). Among these, from the viewpoints of versatility in forming the conductor layer, cost, ease of patterning, etc., a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of a nickel-chromium alloy, a copper-nickel alloy, or a copper-titanium alloy is preferred, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of a nickel-chromium alloy is more preferred, and a single metal layer of copper is even more preferred.

[0338] The conductor layer may have a single layer structure or a multi-layer structure in which two or more single metal layers or alloy layers made of different types of metals or alloys are laminated. When the conductor layer has a multi-layer structure, the layer in contact with the insulating layer is preferably a single metal layer of chromium, zinc, or titanium, or an alloy layer of a nickel-chromium alloy.

[0339] The thickness of the conductor layer depends on the desired design of the printed wiring board, but is generally 3 μm to 35 μm, preferably 5 μm to 30 μm.

[0340] In one embodiment, the conductor layer may be formed by plating. For example, a conductor layer having a desired wiring pattern can be formed by plating the surface of the insulating layer using a conventionally known technique such as a semi-additive method or a full-additive method. From the viewpoint of ease of production, it is preferable to form the conductor layer by a semi-additive method. An example of forming the conductor layer by a semi-additive method will be described below.

[0341] First, a plating seed layer is formed on the surface of an insulating layer by electroless plating. Next, a mask pattern is formed on the formed plating seed layer, exposing a portion of the plating seed layer corresponding to the desired wiring pattern. After a metal layer is formed on the exposed plating seed layer by electrolytic plating, the mask pattern is removed. Thereafter, unnecessary plating seed layer is removed by etching or the like, thereby forming a conductor layer having the desired wiring pattern.

[0342] [Semiconductor Devices] The semiconductor device of the present invention includes the printed wiring board of the present invention. The semiconductor device of the present invention can be manufactured using the printed wiring board of the present invention.

[0343] Examples of semiconductor devices include various semiconductor devices used in electrical appliances (for example, computers, mobile phones, digital cameras, and televisions) and vehicles (for example, motorcycles, automobiles, trains, ships, and aircraft).

[0344] The semiconductor device of the present invention can be manufactured by mounting a component (semiconductor chip) on a conductive portion of a printed wiring board. The "conductive portion" refers to a portion of the printed wiring board that transmits an electrical signal, and the portion may be either on the surface or embedded. The semiconductor chip is not particularly limited as long as it is an electrical circuit element made of a semiconductor material.

[0345] The method of mounting a semiconductor chip when manufacturing a semiconductor device is not particularly limited as long as the semiconductor chip functions effectively, but specific examples include wire bonding mounting, flip chip mounting, bumpless buildup layer (BBUL) mounting, anisotropic conductive film (ACF) mounting, non-conductive film (NCF) mounting, etc. Here, the "bumpless buildup layer (BBUL) mounting method" refers to "a mounting method in which a semiconductor chip is directly embedded in a recess in a printed wiring board and the semiconductor chip is connected to the wiring on the printed wiring board." [Example]

[0346] The present invention will be described in more detail below with reference to examples. The present invention is not limited to these examples. In the following, "parts" and "%" representing amounts mean "parts by mass" and "% by mass", respectively, unless otherwise specified. Furthermore, "M" means "mol / L."

[0347] <Synthesis Example 1: Synthesis of Polymer A> 0.74 g of cyanuric chloride was dissolved in 100 ml of THF, and then 3.56 g of 4,4'-(3,3,5-trimethylcyclohexylidene)bis[2-methylphenol], 2.05 g of a compound represented by the following formula (X-1-1), and 0.58 g of 1-naphthol were added and heated to 50°C. 7.5 ml of 2 M aqueous sodium hydroxide solution was added and stirred at 50°C for 8 hours. 42 ml of water and 1 M hydrochloric acid were added to adjust the pH to 3.7, and the organic solvent was distilled off under reduced pressure. 100 ml of ethyl acetate was added and the mixture was extracted and separated. The organic layer was washed with 50 ml of water, dehydrated with anhydrous magnesium sulfate, and the organic solvent was distilled off under reduced pressure. 70 ml of methanol was added to precipitate a solid. The resulting solid was separated and dried under reduced pressure at 50°C to obtain 2.94 g (yield 61%) of the target polymer A (N6 / N1=2.0, M5 / M4=0, weight average molecular weight Mw=4,237). [ka] [ka] [ka]

[0348] <Synthesis Example 2: Synthesis of Polymer B> 0.65 g of cyanuric chloride was dissolved in 100 ml of THF, followed by the addition of 2.34 g of 4,4'-(3,3,5-trimethylcyclohexylidene)bis[2-methylphenol], 1.79 g of the compound represented by the above formula (X-1-1), 1.84 g of maleimide-modified bisphenol represented by the following formula (X-5), and 0.51 g of 1-naphthol, and the mixture was heated to 50°C. 7.5 ml of 2 M aqueous sodium hydroxide solution was added and the mixture was stirred at 50°C for 8 hours. 42 ml of water and 1 M hydrochloric acid were added to adjust the pH to 3.6, and the organic solvent was distilled off under reduced pressure. 100 ml of ethyl acetate was added and the mixture was extracted and separated. The organic layer was washed with 50 ml of water, dehydrated with anhydrous magnesium sulfate, and the organic solvent was further distilled off under reduced pressure. 70 ml of methanol was added to precipitate a solid. The resulting solid was separated and dried under reduced pressure at 50°C to obtain 3.43 g (yield 64%) of the target polymer B (N6 / N1=2.0, M5 / M4=0.33, weight average molecular weight Mw=8,266). [ka] [ka] [ka]

[0349] <Synthesis Example 3: Synthesis of Polymer C> 0.74 g of cyanuric chloride was dissolved in 100 ml of THF, followed by the addition of 1.60 g of 4,4'-(3,3,5-trimethylcyclohexylidene)bis[2-methylphenol], 2.05 g of the compound represented by the above formula (X-1-1), 1.66 g of maleimide-modified bisphenol represented by the following formula (X-6), and 0.58 g of 1-naphthol, and the mixture was heated to 50°C. 8.0 ml of 2 M aqueous sodium hydroxide solution was added, and the mixture was stirred at 50°C for 8 hours. 42 ml of water and 1 M hydrochloric acid were added to adjust the pH to 3.6, and the organic solvent was distilled off under reduced pressure. 100 ml of ethyl acetate was added, and the mixture was extracted and separated. The organic layer was washed with 50 ml of water, dehydrated with anhydrous magnesium sulfate, and the organic solvent was further distilled off under reduced pressure. 70 ml of methanol was added to precipitate a solid. The resulting solid was separated and dried under reduced pressure at 50°C to obtain 4.38 g (72% yield) of the target polymer C (N6 / N1=2.0, M5 / M4=0.33, weight average molecular weight Mw=8,194). [ka] [ka] [ka]

[0350] <Synthesis Example 4: Synthesis of Polymer D> 0.74 g of cyanuric chloride was dissolved in 100 ml of THF, followed by the addition of 2.14 g of 4,4'-(3,3,5-trimethylcyclohexylidene)bis[2-methylphenol], 1.63 g of a compound represented by the following formula (X-1-2), 1.68 g of maleimide-modified bisphenol represented by the above formula (X-5), and 0.58 g of 1-naphthol, and the mixture was heated to 50°C. 10.0 ml of 2 M aqueous sodium hydroxide solution was added and the mixture was stirred at 50°C for 8 hours. 40 ml of water and 1 M hydrochloric acid were added to adjust the pH to 3.7, and the organic solvent was distilled off under reduced pressure. 100 ml of ethyl acetate was added and the mixture was extracted and separated. The organic layer was washed with 50 ml of water, dehydrated with anhydrous magnesium sulfate, and the organic solvent was distilled off under reduced pressure. 70 ml of methanol was added to precipitate a solid. The resulting solid was separated and dried under reduced pressure at 50°C to obtain 2.94 g (yield 49%) of the target polymer D (N6 / N1=1.0, M5 / M4=0.33, weight average molecular weight Mw=4,124). [ka] [ka] [ka]

[0351] <Comparative Synthesis Example 1: Synthesis of Polymer E> 2.65 g of 9,9-bis(4-hydroxy-3-methylphenyl)fluorene was dissolved in acetone in a reaction vessel. Then, 0.922 g of cyanuric acid chloride, 0.301 g of amine-modified silicone oil (KF-8010, manufactured by Shin-Etsu Chemical Co., Ltd.), and 0.553 g of 3-aminopropyltriethoxysilane (KBE-903, manufactured by Shin-Etsu Chemical Co., Ltd.) were added and reacted overnight at 50°C. Ethyl acetate was then added for extraction, and insoluble materials were removed by filtration. The filtrate was then washed with water and dehydrated with anhydrous magnesium sulfate, followed by evaporation of the solvent. The residue was crystallized with methanol to obtain Polymer E, which has the following hyperbranched structure. The weight-average molecular weight of Polymer E was measured to be 8,800. The glass transition temperature of Polymer E was measured to be 92°C. [ka]

[0352] <Synthesis Example 5: Synthesis of Maleimide Resin F> A maleimide resin F represented by the following formula [Mw / Mn = 1.81, t'' = 1.47 (mainly 1, 2, or 3)] (non-volatile content 62% by mass) was obtained by the method described in Synthesis Example 1 of the Japan Institute of Invention and Innovation's Technical Journal Publication No. 2020-500211. [ka]

[0353] <Synthesis Example 6: Synthesis of vinyl resin G> A reaction vessel was charged with 89 parts by mass of ortho-allylphenol, 110 parts by mass of dicyclopentadiene-phenol copolymer resin (softening point 85°C, hydroxyl equivalent weight approximately 165 g / eq.), and 1,000 parts by mass of toluene. The contents were dissolved under reduced pressure and nitrogen substitution. Subsequently, 135 parts by mass of isophthalic acid chloride was added and dissolved. Next, 0.5 parts by mass of tetrabutylammonium bromide was added, and 309 parts by mass of 20% aqueous sodium hydroxide solution was added dropwise over 3 hours while purging the vessel with nitrogen. The temperature in the system was controlled below 60°C. The mixture was then stirred for 1 hour. After the reaction was complete, the reaction mixture was separated and the aqueous layer was removed. This procedure was repeated until the pH of the aqueous layer reached 7. Toluene and other components were distilled off under heating and reduced pressure to obtain vinyl resin G. Vinyl resin G is represented by the following formula, where s is an integer greater than or equal to 0, and the average value of r calculated from the charge ratio is 1. The wavy line indicates a structure obtained by reacting isophthalic acid chloride with a polyaddition reaction resin of phenol and / or ortho-allylphenol. [ka]

[0354] <Synthesis Example 7: Synthesis of active ester compound H> A flask equipped with a thermometer, dropping funnel, condenser, distillation column, and stirrer was charged with 320 g (2.0 mol) of 2,7-dihydroxynaphthalene, 184 g (1.7 mol) of benzyl alcohol, and 5.0 g of p-toluenesulfonic acid monohydrate. The mixture was stirred at room temperature while blowing in nitrogen. The temperature was then raised to 150 °C, and the mixture was stirred for 4 hours while distilling off the generated water. After the reaction was completed, 900 g of methyl isobutyl ketone and 5.4 g of 20% aqueous sodium hydroxide solution were added for neutralization. The aqueous layer was then removed by separation, and the organic layer was washed three times with 280 g of water. The methyl isobutyl ketone was removed under reduced pressure to obtain 460 g of benzyl-modified naphthalene compound H'. The resulting benzyl-modified naphthalene compound H' was a black solid with a hydroxyl equivalent of 180 g / eq.

[0355] A flask equipped with a thermometer, dropping funnel, condenser, distillation column, and stirrer was charged with 203.0 g of isophthalic acid chloride (molar number of acid chloride groups: 2.0 mol) and 1,400 g of toluene. The system was then purged with nitrogen under reduced pressure and dissolved. Next, 113.9 g (0.67 mol) of orthophenylphenol and 240 g of benzyl-modified naphthalene compound H' (molar number of phenolic hydroxyl groups: 1.33 mol) were charged and the system was then purged with nitrogen under reduced pressure and dissolved. Next, 0.70 g of tetrabutylammonium bromide was dissolved. While purging with nitrogen gas, the system was maintained at 60°C or below, and 400 g of 20% aqueous sodium hydroxide solution was added dropwise over 3 hours. The reaction was then allowed to proceed under these conditions with stirring for 1.0 hour.

[0356] After the reaction was completed, the mixture was allowed to stand for separation, and the aqueous layer was removed. Furthermore, water was added to the toluene layer in which the product was dissolved, and the mixture was stirred and mixed for 15 minutes, and the mixture was allowed to stand for separation, and the aqueous layer was removed. This procedure was repeated until the pH of the aqueous layer reached 7. Water was then removed by decanting, and active ester compound H was obtained in the form of a toluene solution containing 62% by mass of non-volatile components. The active ester group equivalent of the obtained active ester compound H was 238 g / eq. Active ester compound H has a structure represented by the following formula (in the formula, it is mainly composed of compounds in which n is an integer of 0 to 5 and m is an integer of 0 to 15).

[0357] [ka]

[0358] [Examples 1 to 8, Comparative Examples 1 to 5] <Preparation of Resin Composition> Each component was weighed out in the parts by mass shown in Table 1, and then mixed with 15 parts of MEK (methyl ethyl ketone) and 15 parts of cyclohexanone. The mixture was uniformly dispersed using a high-speed rotating mixer to obtain a resin composition (resin varnish).

[0359] <Preparation of resin sheet> As a support, a polyethylene terephthalate film ("Lumirror R80" manufactured by Toray Industries, Inc., thickness 38 μm, softening point 130° C.) that had been subjected to a release treatment with an alkyd resin-based release agent ("AL-5" manufactured by Lintec Corporation) was prepared.

[0360] Each of the resin compositions obtained in Examples 1 to 8 and Comparative Examples 1 to 5 was uniformly applied onto the support using a die coater so that the thickness of the resin composition layer after drying would be 40 μm, and the resulting layer was dried at 70°C to 95°C for 3 minutes to form a resin composition layer on the support.

[0361] Next, the rough surface of a polypropylene film ("Alphan MA-411" manufactured by Oji F-Tex Co., Ltd., thickness 15 μm) was attached as a protective film to the surface of the resin composition layer not bonded to the support, thereby obtaining a resin sheet having the support, the resin composition layer, and the protective film in this order.

[0362] <Test Example 1: Measurement of dielectric properties (dielectric constant, dielectric loss tangent)> The protective film was peeled off from the resin sheets prepared in the Examples and Comparative Examples, and the resin composition layer was thermally cured by heating at 200°C for 90 minutes, after which the support was peeled off. The resulting cured product was cut into a piece 2 mm wide and 80 mm long to prepare a test piece for evaluation.

[0363] The dielectric constant and dielectric loss tangent of each test piece were measured using an Agilent Technologies HP8362B by the cavity resonance perturbation method at a measurement frequency of 5.8 GHz and a measurement temperature of 23°C. Measurements were performed on three test pieces, and the average values ​​were calculated. The dielectric constant and dielectric loss tangent were evaluated according to the following evaluation criteria. Dielectric constant ○: Dielectric constant is 3.1 or less ×: Dielectric constant is greater than 3.1 ·Dielectric tangent ○: Dielectric tangent is 0.003 or less ×: Dielectric tangent is greater than 0.003

[0364] <Test Example 2: Measurement of substrate adhesion (copper foil peel strength)> (1) Copper foil surface preparation The shiny side of Mitsui Mining & Smelting Co., Ltd.'s "3EC-III" (electrolytic copper foil, 35 μm) was etched 1 μm using MEC's ​​"CZ8101" to roughen the copper surface, and then anti-rust treatment (CL8300) was applied. This copper foil is called CZ-treated copper foil. It was then heat-treated in an oven at 130°C for 30 minutes. This resulted in a CZ-treated copper foil.

[0365] (2) Preparation of inner layer board A glass cloth-based epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.4 mm, Panasonic "R1515A") with an inner layer circuit formed on it was etched on both sides by 1 μm using MEC "CZ8101" to roughen the copper surface. It was then heated in an oven at 130°C for 30 minutes. This produced an inner layer substrate.

[0366] (3) Lamination of resin composition layer The protective film was peeled off from the resin sheets prepared in the Examples and Comparative Examples to expose the resin composition layer. Using a batch-type vacuum pressure laminator (Nikko Materials Co., Ltd., two-stage build-up laminator "CVP700"), the resin composition layer was laminated on both sides of the inner layer substrate so that it was in contact with the inner layer substrate. Lamination was performed by reducing the pressure for 30 seconds to 13 hPa or less, followed by pressure bonding at 120°C and a pressure of 0.74 MPa for 30 seconds. Next, a heat press was performed at 100°C and a pressure of 0.5 MPa for 60 seconds. The treated side of CZ copper foil was laminated onto the resin composition layer under the same conditions as above. The resin composition layer was then cured at 200°C for 90 minutes to form an insulating layer, thereby producing an evaluation substrate.

[0367] (4) Measurement of copper foil peel strength (substrate adhesion) The prepared evaluation substrate was cut into small pieces measuring 150 x 30 mm. A cutter was used to make a 10 mm wide, 100 mm long cut in the copper foil portion of each small piece, and one end of the copper foil was peeled off and gripped with a gripper. The peel strength was determined by measuring the load (kgf / cm) when 35 mm was peeled off vertically at a rate of 50 mm / min at room temperature. A tensile tester (TSE "AC-50C-SL") was used for the measurement. The measurement was performed in accordance with the Japanese Industrial Standard (JIS C6481). The adhesion to the substrate was evaluated according to the following criteria. ○: Load measurement value is 0.45kgf / cm or more ×: The measured load is less than 0.45 kgf / cm

[0368] <Test Example 3: Measurement of peel strength of plated conductor layer> (1) Preparation of inner layer board A glass cloth-based epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.8 mm, Panasonic "R1515A") with an inner layer circuit formed on it was etched on both sides by 1 μm using MEC "CZ8101" to roughen the copper surface. It was then heated in an oven at 130°C for 30 minutes. This produced an inner layer substrate.

[0369] (2) Lamination of resin sheets The resin sheets produced in the Examples and Comparative Examples were laminated onto both sides of an inner layer substrate using a batch-type vacuum pressure laminator (a two-stage build-up laminator "CVP700" manufactured by Nikko Materials Co., Ltd.) so that the resin composition layer was in contact with the inner layer substrate. Lamination was performed by reducing the pressure to 13 hPa or less for 30 seconds, followed by pressure bonding at 100°C and a pressure of 0.74 MPa for 30 seconds. Next, a heat press was performed at 100°C and a pressure of 0.5 MPa for 60 seconds.

[0370] (3) Hardening of the resin sheet The resin sheet laminated to the inner layer substrate was heated under curing conditions of 100°C for 30 minutes and then 180°C for 30 minutes to thermally cure the resin composition layer, forming an insulating layer and obtaining a substrate for evaluating plated copper adhesion.

[0371] (4) Roughening treatment The substrate was immersed in a swelling solution (Atotech Japan's "Swelling Dip Securigant P," containing diethylene glycol monobutyl ether) at 60°C for 10 minutes. The sample substrate was then immersed in a roughening solution (Atotech Japan's "Concentrate Compact P," an aqueous solution of 60 g / L KMnO4 and 40 g / L NaOH) at 80°C for 20 minutes. The sample substrate was then immersed in a neutralizing solution (Atotech Japan's "Reduction Solution Securigant P") at 40°C for 5 minutes. The sample substrate was then dried at 80°C for 30 minutes to obtain a roughened substrate for evaluation of plated copper adhesion.

[0372] (5) Semi-additive plating The roughened substrate for evaluating plated copper adhesion was immersed in an electroless plating solution containing palladium chloride (PdCl2) at 40°C for 5 minutes, and then in an electroless copper plating solution at 25°C for 20 minutes. The roughened substrate was then annealed by heating at 150°C for 30 minutes. An etching resist was formed on the annealed roughened substrate, and a pattern was formed by etching. Copper sulfate electroplating was then performed to form a 25 μm thick conductor layer on the surface of the insulating layer. Next, an annealing treatment was performed by heating at 180°C for 30 minutes, yielding a substrate for evaluating plated copper adhesion having a conductor layer on an insulating layer.

[0373] (6) Evaluation of adhesion to the plated conductor layer The peel strength between the insulating layer and the plated conductor layer was measured in accordance with the Japanese Industrial Standard (JIS C6481). Specifically, the plated copper adhesion evaluation board obtained above was cut into small pieces 30 mm wide and 100 mm long. A cutter was used to make a 10 mm-wide cut in the conductor layer of each small piece, enclosing a rectangular section. One end of this rectangular section was peeled off and gripped with a gripping tool (TSE Autocom type testing machine "AC-50C-SL"), and the load (kgf / cm) was measured when 35 mm was peeled off vertically at a rate of 50 mm / min at room temperature (normal temperature), to determine the peel strength (plating peel strength). Plating adhesion was evaluated according to the following criteria. ○: Load measurement value is 0.35 kgf / cm or more ×: The measured load is less than 0.35 kgf / cm

[0374] The results of Examples 1 to 8 and Comparative Examples 1 to 5 are shown in Table 1. [Table 1]

[0375] The details of each component listed in Table 1 are as follows: <Polymer> Polymers A to E: Polymers synthesized in Synthesis Examples 1 to 4 and Comparative Synthesis Example 1 YX7553BH30: Phenoxy resin (manufactured by Mitsubishi Chemical Corporation, a 1:1 solution of MEK and cyclohexanone with a non-volatile content of 30% by mass)

[0376] <(B) Epoxy resin> HP4032SS: Naphthalene-type epoxy resin (DIC Corporation, epoxy equivalent weight: approx. 144 g / eq.) NC-3000L: Biphenyl-type epoxy resin (Nippon Kayaku Co., Ltd., epoxy equivalent: approx. 269 g / eq.)

[0377] <(C) Inorganic filler> SO-C2: Spherical silica (Admatechs "SO-C2", average particle size 0.5 μm, specific surface area 5.8 m) 2 / g) was surface-treated with a silane coupling agent (N-phenyl-3-aminopropyltrimethoxysilane, Shin-Etsu Chemical Co., Ltd. "KBM-573").

[0378] <(D) Curing agent> Active ester compound H: the active ester compound synthesized in Synthesis Example 7 V-03: Carbodiimide curing agent (Nisshinbo Chemical Co., Ltd., active group equivalent weight approximately 216 g / eq., toluene solution with 50% non-volatile content)

[0379] <(E) Curing accelerator> 1B2PZ: Imidazole-based curing accelerator (1-benzyl-2-phenylimidazole, manufactured by Shikoku Chemicals Corporation)

[0380] <(F) Radical polymerization resin> OPE-2St: Vinylbenzyl-modified polyphenylene ether resin (Mitsubishi Gas Chemical Company, toluene solution with 65% non-volatile content) MIR-3000-70MT: Aromatic maleimide resin (manufactured by Nippon Kayaku Co., Ltd., MEK / toluene mixed solution with 70% non-volatile content) BMI-689: Aliphatic maleimide resin (Designer Molecules Inc., N-alkyl bismaleimide with a dimer diamine-derived skeleton) Maleimide resin F: Maleimide resin synthesized in Synthesis Example 5 DAD: Diallyl diphenate (manufactured by Nisshoku Techno Fine Chemical Co., Ltd.) A-DOG: Dioxane glycol diacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd.) Vinyl resin G: Vinyl resin synthesized in Synthesis Example 6

[0381] <(G) Radical Polymerization Initiator> Luperox DTA: Di-t-amyl peroxide (Arkema Yoshitomi Co., Ltd.) Perhexyl D: Di-t-hexyl peroxide (NOF Corporation)

[0382] As shown in Table 1, in Examples 1 to 8, which contain component (A) having the structure specified in the present application, epoxy resin (B), and inorganic filler (C), excellent dielectric properties were exhibited and cured products with excellent adhesion to both the substrate and plating were obtained.

Claims

1. (1A) A polymer having a structural unit represented by the following formula (A-1) and a structural unit represented by the following formula (A-2): (B) an epoxy resin, and (C) inorganic filler, A resin composition comprising: 【Chemistry 1】 (In formula (A-1) and formula (A-2), R １ are each independently a monovalent organic group having an atom selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms as constituent atoms, and R １ The molecular weight of R is 250 or more, １ does not have an ethylenically unsaturated group, and R １ does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton; and each A independently represents a divalent organic group having an optionally hydrogenated bisphenol skeleton.

2. The resin composition according to claim 1, wherein the component (1A) is a polymer having a structural unit represented by the following formula (A-3): 【Chemistry 2】 (In formula (A-3), R １ are each independently a monovalent organic group having an atom selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms as constituent atoms, and R １ The molecular weight of R is 250 or more, １ does not have an ethylenically unsaturated group, and R １ does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton; and each A independently represents a divalent organic group having an optionally hydrogenated bisphenol skeleton.

3. In formula (A-1), R １ The resin composition according to claim 1 , wherein each of the groups independently represents a monovalent organic group having no reactive substituent.

4. In formula (A-1), R １ The resin composition according to claim 1 , wherein each of the groups independently represents a monovalent organic group that does not contain both a triazine skeleton and an optionally hydrogenated bisphenol skeleton.

5. In formula (A-1), R １ The resin composition according to claim 1 , wherein each independently represents a monovalent organic group selected from the group consisting of a saturated aliphatic group, an aromatic group, and a combination of a saturated aliphatic group and an aromatic group.

6. In formula (A-1), R １ The resin composition according to claim 1 , wherein each of the groups independently represents a monovalent organic group selected from a substituted amino group and a substituted oxy group.

7. In formula (A-2), each A is independently a divalent organic group having an atom selected from carbon atom, hydrogen atom, oxygen atom, nitrogen atom, fluorine atom, and silicon atom as a constituent atom. The resin composition according to claim 1.

8. The resin composition according to claim 1, wherein in formula (A-2), A is a divalent organic group having a bisphenol skeleton.

9. The resin composition according to claim 1, wherein in formula (A-2), A is a divalent organic group represented by the following formula (A-4): 【Transformation 3】 (In formula (A-4), ring Ar １ Each of X independently represents an aromatic carbon ring having 6 to 10 carbon atoms which may have a substituent. １ represents a single bond or a divalent group having 1 to 200 constituent atoms and containing atoms selected from carbon, hydrogen, oxygen, nitrogen, fluorine, silicon, and sulfur atoms. * represents a bond.

10. In formula (A-4), ring Ar １ is an aromatic carbon ring having 6 to 10 carbon atoms which may have a substituent selected from an alkyl group having 1 to 10 carbon atoms and an aryl group having 1 to 10 carbon atoms.

11. In formula (A-4), X １ is an alkylene group having 1 to 20 carbon atoms which may have an oxygen atom, an arylene group having 1 to 20 carbon atoms, or a divalent group having 2 to 30 carbon atoms which is a combination thereof.

12. The resin composition according to claim 1, wherein in formula (A-2), A is a divalent organic group represented by the following formula (A-5): 【Chemistry 4】 (In formula (A-5), ring Ar ２ Each of X independently represents an aromatic carbon ring having 6 to 10 carbon atoms which may have a substituent. ２ R represents a divalent group having 1 to 200 constituent atoms selected from carbon atoms, hydrogen atoms, and oxygen atoms. ４ R each independently represents an alkylene group having 1 to 20 carbon atoms, an arylene group having 1 to 20 carbon atoms, or a divalent group having 2 to 30 carbon atoms consisting of a combination thereof. ５ and R ６ each independently represents an alkyl group having 1 to 20 carbon atoms or an aryl group having 1 to 20 carbon atoms. ５ and R ６ may be linked to form a ring. * represents a bond.)

13. In formula (A-5), X ２ is an oxygen atom, an alkylene group having 1 to 50 carbon atoms, an arylene group having 1 to 20 carbon atoms which may have an alkyl group having 1 to 6 carbon atoms as a substituent, or a divalent group having 2 to 60 carbon atoms consisting of a combination thereof.

14. In formula (A-5), X ２ The resin composition according to claim 12, wherein is a divalent group having an aromatic hydrocarbon ring and having 6 to 100 carbon atoms.

15. The resin composition according to claim 1, wherein the component (1A) further has a structural unit represented by the following formula (A-6): 【Transformation 5】 (In formula (A-6), R ２ are each independently a monovalent organic group having an atom selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms as constituent atoms, and R ２ has a molecular weight of less than 250, and R ２ does not have an ethylenically unsaturated group, and R ２ does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton.

16. The resin composition according to claim 2, wherein the component (1A) further has a structural unit represented by the following formula (A-7): 【Transformation 6】 (In formula (A-7), R ２ are each independently a monovalent organic group having an atom selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms as constituent atoms, and R ２ has a molecular weight of less than 250, and R ２ does not have an ethylenically unsaturated group, and R ２ does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton; and each A independently represents a divalent organic group having an optionally hydrogenated bisphenol skeleton.

17. In formula (A-6), R ２ The resin composition according to claim 15, wherein is an aryloxy group.

18. In formula (A-6), R ２ The resin composition according to claim 15, wherein is a naphthoxy group.

19. In the component (1A), the number of repetitions of the structural unit represented by formula (A-1) is N １ , the number of repetitions of the structural unit represented by formula (A-2) is N ２ , the number of repetitions of the structural unit represented by formula (A-6) is N ６ , when other structural units are present, the number of repetitions of the other structural units is N ０ The resin composition according to claim 15, wherein the ratio α defined by the following formula (1) is 0.9 to 1: [Equation 1]

20. In the component (1A), the number of repetitions of the structural unit represented by formula (A-1) is N １ , the number of repetitions of the structural unit represented by formula (A-6) is N ６ When N １ N for ６ The ratio (N ６ / N １ ) is 0.1 to 20. The resin composition according to claim 15.

21. The resin composition according to claim 1, wherein the component (1A) has two or more structural units represented by formula (A-2) in which A is different, and the two or more A's include a divalent group represented by the following formula (A-4) and a divalent group represented by the following formula (A-5): 【Transformation 7】 (In formula (A-4) and formula (A-5), ring Ar １ and ring Ar ２ each independently represents an aromatic carbon ring having 6 to 10 carbon atoms which may have a substituent. １ represents an alkylene group having 1 to 20 carbon atoms, which may have an oxygen atom, an arylene group having 1 to 20 carbon atoms, or a divalent group having 2 to 30 carbon atoms consisting of a combination thereof. ２ represents an oxygen atom, an alkylene group having 1 to 50 carbon atoms, an arylene group having 1 to 20 carbon atoms which may have an alkyl group having 1 to 6 carbon atoms as a substituent, or a divalent group having 2 to 60 carbon atoms consisting of a combination thereof. ４ R each independently represents an alkylene group having 1 to 20 carbon atoms, an arylene group having 1 to 20 carbon atoms, or a divalent group having 2 to 30 carbon atoms consisting of a combination thereof. ５ and R ６ each independently represents an alkyl group having 1 to 20 carbon atoms or an aryl group having 1 to 20 carbon atoms. ５ and R ６ may be linked to form a ring. * represents a bond.)

22. The number of divalent groups represented by formula (A-5) in A of component (1A) is M ５ , the number of divalent groups represented by formula (A-4) is M ４ When M ４ M against ５ The ratio (M ５ / M ４ 22. The resin composition according to claim 21, wherein the saturation coefficient (S) is 0.05 to 5.

23. The resin composition according to claim 1, wherein the component (1A) is a polymer having a structure represented by the following formula (A-8): 【Transformation 8】 (In formula (A-8), n １ represents an integer of 1 or more, and n ２ represents an integer of 0 or more. １ , R ２ and R are each independently a monovalent organic group having an atom selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms as constituent atoms, and R １ The molecular weight of R is 250 or more, ２ has a molecular weight of less than 250, and R １ , R ２ and R does not have an ethylenically unsaturated group, and R １ , R ２ and R does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton; and each A independently represents a divalent organic group having an optionally hydrogenated bisphenol skeleton.

24. In formula (A-8), n １ +n ２ The resin composition according to claim 23, wherein is 1 to 110.

25. 2. The resin composition according to claim 1, wherein the weight average molecular weight of component (1A) is 1,000 to 50,000.

26. The resin composition according to claim 1 , further comprising (D) a curing agent.

27. The resin composition according to claim 26, wherein component (D) comprises an active ester-based curing agent.

28. The resin composition according to claim 1 , further comprising (E) a curing accelerator.

29. The resin composition according to claim 1 , further comprising (F) a radical polymerization resin.

30. The resin composition according to claim 1 , further comprising (G) a radical polymerization initiator.

31. The resin composition according to claim 1, wherein the content of the component (1A) is 1 to 30 mass % when the total amount of nonvolatile components in the resin composition is 100 mass %.

32. The resin composition according to claim 1, wherein the content of the component (C) is 50 to 75% by mass, where the total amount of nonvolatile components in the resin composition is 100% by mass.

33. 2. The resin composition according to claim 1, wherein the mass ratio of the component (1A) to the component (C) [component (1A) / component (C)] is 0.01 to 1.

34. (2A) A polymer formed by reacting cyanuric chloride, an optionally hydrogenated bisphenol, a compound represented by the following formula (X-1), and a monophenol: (B) an epoxy resin, and (C) inorganic filler, A resin composition comprising: 【Chemistry 9】 (In formula (X-1), R １ is a monovalent organic group having atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms as constituent atoms, and R １ The molecular weight of R is 250 or more, １ does not have an ethylenically unsaturated group, and R １ does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton.

35. (1) a step of reacting cyanuric chloride, an optionally hydrogenated bisphenol, a compound represented by the following formula (X-1), and a monophenol to obtain a polymer; and (2) mixing the polymer obtained in step (1), an epoxy resin, and an inorganic filler; A method for producing a resin composition comprising: 【Chemistry 10】 (In formula (X-1), R １ is a monovalent organic group having atoms selected from carbon, hydrogen, oxygen, nitrogen, silicon, and sulfur atoms as constituent atoms, and R １ The molecular weight of R is 250 or more, １ does not have an ethylenically unsaturated group, and R １ does not contain at least one of a triazine skeleton and an optionally hydrogenated bisphenol skeleton.

36. A resin sheet comprising a support and a resin composition layer provided on the support, the resin composition comprising the resin composition according to any one of claims 1 to 34.

37. A printed wiring board comprising an insulating layer formed from a cured product of the resin composition according to any one of claims 1 to 34.

38. A semiconductor device comprising the printed wiring board according to claim 37.

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