Plating apparatus, control device, program, and plating solution management method

Abstract

To provide a plating apparatus which suppresses the deposition of a metal salt in a plating tank when a plating solution is stored, a control device, a program, and a method for managing the plating solution.SOLUTION: The plating apparatus 100 includes a plating bath 11 in which a plating solution 2 is stored, a precipitation bath 21 which has a cooling device 22 for cooling the plating solution 2 supplied from the plating bath 11 to precipitate a metal salt and in which the metal salt precipitated by the cooling device 22 is stored, a first flow path 23 for supplying the plating solution 2 from the plating bath 11 to the precipitation bath 21, and a second flow path 24 for supplying the plating solution 2 in which the metal salt is precipitated from the precipitation bath 21 to the plating bath 11.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a plating apparatus, a control device, a program, and a plating solution management method. [Background technology]

[0002] Conventionally, plating devices have been known that perform plating processing on objects to be plated by immersing the objects in a plating solution. The plating device forms a plating film on the surface of the object to be plated by reducing metal ions in the plating solution and precipitating the metal. In order to form a uniform plating film on the surface of the object to be plated, it is necessary to maintain the plating solution at an appropriate temperature. For example, the plating device disclosed in Patent Document 1 is composed of a plating tank in which the plating solution is stored and a thermostatic tank in which the plating solution is maintained at a constant temperature. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-042433 Summary of the Invention [Problem to be solved by the invention]

[0004] The plating apparatus of Patent Document 1 has a problem in that when storing the plating solution after plating is completed, the temperature of the plating solution drops when the thermostatic bath is stopped, causing metal ions in the plating solution to precipitate as metal salts in the plating bath. If metal salts precipitate in the plating bath, they may adhere to the object to be plated, deteriorating the quality of the plating process.

[0005] The present disclosure has been made to solve the above-mentioned problems, and aims to provide a plating apparatus, a control device, a program, and a plating solution management method that suppress the precipitation of metal salts in a plating tank when the plating solution is stored. [Means for solving the problem]

[0006] The plating apparatus according to the present disclosure includes a plating tank in which a plating solution is stored, a cooling device that cools the plating solution supplied from the plating tank to precipitate metal salts, and a precipitation tank in which the metal salts precipitated by the cooling device are stored, a first flow path for supplying the plating solution from the plating tank to the precipitation tank, and a second flow path for supplying the plating solution in which the metal salts have been precipitated from the precipitation tank to the plating tank.

[0007] The control device according to the present disclosure includes a supply control unit that supplies plating solution from a plating tank in which the plating solution is stored to a precipitation tank, and a precipitation control unit that cools the plating solution supplied to the precipitation tank using a cooling device possessed by the precipitation tank to precipitate metal salts in the precipitation tank, and the supply control unit controls the supply of the plating solution in which the metal salts have been precipitated by the precipitation control unit from the precipitation tank to the plating tank.

[0008] The program according to the present disclosure enables a computer to perform the following functions: supplying plating solution from a plating tank in which the plating solution is stored to a precipitation tank; cooling the plating solution supplied to the precipitation tank using a cooling device provided in the precipitation tank to precipitate metal salts in the precipitation tank; and supplying the plating solution in which the metal salts have been precipitated from the precipitation tank to the plating tank.

[0009] The plating solution management method according to the present disclosure includes the steps of supplying the plating solution from a plating tank in which the plating solution is stored to a precipitation tank, cooling the plating solution supplied to the precipitation tank using a cooling device provided in the precipitation tank to precipitate metal salts in the precipitation tank, and supplying the plating solution in which the metal salts have been precipitated from the precipitation tank to the plating tank. [Effects of the Invention]

[0010] The plating apparatus, control device, program, and plating solution management method according to the present disclosure can prevent metal salts from precipitating in a plating tank when storing a plating solution. [Brief explanation of the drawings]

[0011] [Figure 1]1 is a schematic diagram illustrating a configuration of a plating apparatus according to a first embodiment of the present disclosure. [Figure 2] 1 is a system block diagram illustrating a control device according to a first embodiment of the present disclosure. [Figure 3] 1 is a hardware configuration diagram illustrating a control device according to a first embodiment of the present disclosure. [Figure 4] 3 is a flowchart showing the steps of a plating solution management method according to the first embodiment of the present disclosure. [Figure 5] 4 is a flowchart showing a processing procedure of a deposition step according to the first embodiment of the present disclosure. [Figure 6] 10 is a flowchart showing a processing procedure of a circulation step according to the first embodiment of the present disclosure. [Figure 7] 10 is a flowchart showing a processing procedure of a storage step according to the first embodiment of the present disclosure. [Figure 8] 4 is a flowchart showing a processing procedure of a dissolving step according to the first embodiment of the present disclosure. [Figure 9] FIG. 1 is a schematic diagram illustrating an example of a plating apparatus according to a first modification of the first embodiment of the present disclosure. [Figure 10] 10 is a flowchart showing a processing procedure of a dissolving step according to Modification 1 of Embodiment 1 of the present disclosure. [Figure 11] FIG. 10 is a configuration diagram schematically illustrating another example of a plating apparatus according to Modification 1 of Embodiment 1 of the present disclosure. [Figure 12] FIG. 10 is a schematic diagram illustrating a plating apparatus according to a second modification of the first embodiment of the present disclosure. [Figure 13] 10 is a flowchart showing a processing procedure of a dissolving step according to a second modification of the first embodiment of the present disclosure. [Figure 14] FIG. 10 is a schematic diagram illustrating a plating apparatus according to a second embodiment of the present disclosure. [Figure 15] FIG. 10 is a schematic diagram illustrating a configuration of a plating apparatus according to a third embodiment of the present disclosure. [Figure 16] FIG. 10 is a schematic diagram illustrating a configuration of a plating apparatus according to a third embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0012] The following describes an example of a plating apparatus, a control apparatus, a program, and a plating solution management method according to the present disclosure, with reference to the drawings. In the drawings, the same or corresponding parts are designated by the same reference numerals, and their description will not be repeated.

[0013] In the following, an apparatus, program, and method applicable to electroplating will be described as an example of the plating apparatus, control device, program, and plating solution management method according to the present disclosure. Note that the plating apparatus, control device, program, and plating solution management method according to the present disclosure may be an apparatus, program, and method applicable to wet plating, in which an object to be plated is plated by immersing the object in a plating solution, and are not limited to applications to electroplating.

[0014] Embodiment 1 <Configuration of plating equipment> First, the configuration of a plating apparatus 100 according to a first embodiment of the present disclosure will be described with reference to Fig. 1. Fig. 1 is a schematic diagram illustrating the configuration of the plating apparatus 100.

[0015] The plating apparatus 100 is an electroplating apparatus that performs a plating process on the object 1 to be plated by applying an electric current while the object 1 is immersed in a plating solution 2 and reducing metal ions in the plating solution 2 on the surface of the object 1 to be plated. As shown in FIG. 1, the plating apparatus 100 includes a plating mechanism 10 for performing a plating process on the object 1 to be plated, a storage mechanism 20 for suppressing the deposition of metal salts in a plating tank 11 when the plating solution 2 is stored, and a control device 70 for controlling the storage mechanism 20.

[0016] First, the configuration of the plating mechanism 10 will be described with reference to Fig. 1. As shown in Fig. 1, the plating mechanism 10 includes a plating tank 11, an anode electrode 12, a power source 13, an overflow wall 14, a circulation channel 17, a circulation channel pump 31, a circulation channel on-off valve 41, a circulation channel filter 18, and a plating tank heating device 51.

[0017] The plating tank 11 is a tank that stores the plating solution 2. Specifically, the plating tank 11 is a tank for performing a plating process on the object to be plated 1. The plating tank 11 is open at the top and stores the plating solution 2 inside. Note that a lid (not shown) that can be opened and closed may be installed above the plating tank 11 to prevent the solution from splashing outside the tank.

[0018] 1 shows a state in which an object to be plated 1 is held inside a plating tank 11. When plating the object to be plated 1 using the plating apparatus 100, the object to be plated 1 is held inside the plating tank 11 so that the surface to be plated of the object to be plated 1 is immersed in a plating solution 2 stored inside the plating tank 11.

[0019] 1 shows an example in which one object to be plated 1 is held inside the plating tank 11, but the number of objects to be plated 1 held inside the plating tank 11 is not limited to one. The number of objects to be plated 1 held inside the plating tank 11 may be two or more. 1 shows an example in which the object 1 to be plated has a plate shape, but the shape of the object 1 to be plated is not limited to a plate shape. Depending on the shape of the object 1 to be plated, there may be locations where electric field concentration occurs. If electric field concentration occurs due to the shape of the object 1 to be plated, an electric field shield, an auxiliary anode, and an auxiliary cathode may be provided inside the plating tank 11 to prevent electric field concentration.

[0020] The plating solution 2 is a liquid containing metal ions. The composition of the plating solution 2 is determined depending on the metal to be deposited on the plating surface of the substrate 1. For example, when nickel plating is performed, nickel sulfamate can be used as the plating solution 2. More specifically, the plating solution 2 can be a liquid containing nickel sulfamate at a nickel concentration of 30-130 g / L, nickel chloride at a nickel concentration of 1-15 g / L, and boric acid at a concentration of 5-50 g / L. When copper plating is performed, copper sulfate can be used as the plating solution 2. More specifically, the plating solution 2 can be a liquid containing copper sulfate at a copper concentration of 25-125 g / L and sulfuric acid at a copper concentration of 50-250 g / L. When tin plating is performed, tin methanesulfonate can be used as the plating solution 2. More specifically, a liquid containing tin methanesulfonate at a tin concentration of 30 to 130 g / L and methanesulfonic acid at a concentration of 20 to 200 g / L can be used. The plating solution 2 used in the plating apparatus according to the present disclosure is not limited to the above, and may be any liquid containing metal ions. Depending on the properties required for the plating process, the plating solution may also contain additives such as an anode dissolution accelerator, a pH adjuster, a pH buffer, a complexing agent, a brightener, a leveling agent, an accelerator, a suppressor, and a stress adjuster.

[0021] The anode electrode 12 is held vertically inside the plating tank 11 at a position opposite to the position where the object to be plated is held. The anode electrode 12 is made of metal, and an anode electrode suitable for the plating solution 2 and the object to be plated 1 is used. The anode electrode 12 may be a soluble electrode or an insoluble electrode. The shape of the anode electrode 12 may be, for example, a plate shape, a mesh shape, a chip shape using an anode basket, a spherical shape, or the like.

[0022] The power supply 13 is used to supply electricity for plating the object to be plated 1. When plating the object to be plated 1, the positive electrode of the power supply 13 is connected to the anode electrode 12, and the negative electrode of the power supply 13 is connected to the object to be plated 1.

[0023] The object 1 to be plated is plated using a plating tank 11, an anode electrode 12, and a power supply 13 provided in the plating mechanism 10. Specifically, while the object 1 to be plated is immersed in a plating solution 2, the object 1 to be plated and the anode electrode 12 are connected to the power supply 13 and electricity is applied, causing an electrochemical reaction in the plating solution 2 stored in the plating tank 11, and the object 1 to be plated is plated.

[0024] The overflow wall 14 is provided inside the plating tank 11 and is a partition wall that divides the interior of the plating tank 11 into a first space 15 and a second space 16. The first space 15 is a space in which the object to be plated 1 and the anode electrode 12 are held and immersed in the plating solution 2, and the second space 16 is a space that receives the plating solution 2 that overflows from the first space 15. Inside the plating tank 11 with the overflow wall 14 provided, the stored plating solution 2 overflows from the first space 15 around the upper edge of the overflow wall 14 and flows into the second space 16.

[0025] The circulation flow path 17 is a flow path for causing the plating solution 2 to flow out of the plating tank 11 and return to the plating tank 11. Specifically, the circulation flow path 17 is a flow path for returning the plating solution 2 that has flowed from the first space 15 to the second space 16 inside the plating tank 11 back to the first space 15. The circulation flow path 17 connects an outlet (not shown) provided in the second space 16 of the plating tank 11 to an inlet (not shown) provided in the first space 15 of the plating tank 11. The outlet provided in the second space 16 of the plating tank 11 is preferably provided on the bottom surface of the plating tank 11 so that the plating solution 2 flows out by utilizing gravity.

[0026] A circulation flow path pump 31 is provided in the circulation flow path 17. When the circulation flow path pump 31 is driven, the plating solution 2 flows out of the plating tank 11 and returns to the plating tank 11. Specifically, when the circulation flow path pump 31 is driven, the plating solution 2 stored in the second space 16 of the plating tank 11 is supplied to the first space 15 of the plating tank 11 via the circulation flow path 17. When the amount of plating solution 2 stored in the first space 15 of the plating tank 11 increases due to the supply of the plating solution 2, the plating solution 2 stored in the first space 15 of the plating tank 11 overflows the upper edge of the overflow wall 14 and is received in the second space 16 of the plating tank 11. In this way, the circulation flow path 17 and the circulation flow path pump 31 enable the plating solution 2 stored in the plating tank 11 to be circulated.

[0027] When plating the object 1 to be plated, metal ions in the plating solution 2 are reduced on the surface of the object 1 to be plated, causing the metal to precipitate, and as the metal precipitation progresses, the metal ions in the vicinity of the surface of the object 1 to be plated decrease. The overflow wall 14, circulation flow path 17, and circulation flow path pump 31 provided in the plating mechanism 10 circulate the plating solution 2 stored in the plating tank 11, so that the metal ion concentration of the plating solution 2 stored in the plating tank 11 can be maintained uniform.

[0028] 1 shows an example of a plating tank 11 provided with an overflow wall 14, but the plating tank 11 does not have to be provided with an overflow wall 14. When it is necessary to maintain a constant liquid level of the plating solution 2 in which the object to be plated 1 is immersed, it is desirable to provide the plating tank 11 with an overflow wall 14. Furthermore, since the liquid level of the plating solution 2 can be maintained constant by using a plating tank 11 provided with an overflow wall 14, the current density distribution around the object to be plated 1 can be strictly controlled and the film thickness distribution can be maintained constant.

[0029] The circulation flow path 17 is provided with a circulation flow path on-off valve 41 upstream of the circulation flow path pump 31. The circulation flow path on-off valve 41 adjusts the amount of plating solution 2 flowing into the circulation flow path pump 31.

[0030] Furthermore, a circulation flow path filter 18 is provided in the circulation flow path 17 downstream of the circulation flow path pump 31. The circulation flow path filter 18 is installed to filter the plating solution 2 flowing through the circulation flow path 17 and to separate foreign matter in the plating solution 2 from the plating solution 2. The circulation flow path filter 18 is preferably installed downstream of the circulation flow path 17 to prevent foreign matter from entering the plating tank 11, but may also be installed upstream of the circulation flow path pump 31.

[0031] The plating tank temperature raising device 51 is a temperature raising device for raising the temperature of the plating solution 2 flowing in the plating treatment mechanism 10. In detail, the plating tank temperature raising device 51 is a device for raising the temperature of the plating solution 2 stored in the plating tank 11 to a temperature suitable for plating treatment.

[0032] FIG. 1 shows an example in which a plating tank heating device 51 is provided in the circulation flow path 17. The plating tank heating device 51 is, for example, an indirect heating type heater that stores hot water therein and is configured to heat the plating solution 2 flowing through the circulation flow path 17 by using the hot water. The circulation flow path pump 31 and the plating tank heating device 51 are driven to heat the plating solution 2 stored in the plating tank 11. Specifically, the circulation flow path pump 31 and the plating tank heating device 51 are driven to cause the plating solution 2 stored in the plating tank 11 to flow out from the plating tank 11 into the circulation flow path 17, where it is heated while passing through the circulation flow path 17 and then returned to the plating tank 11. The circulation flow path pump 31 and the plating tank temperature raising device 51 can raise the temperature of the plating solution 2 stored in the plating tank 11 to a temperature suitable for plating processing and maintain it at that temperature.

[0033] The plating tank heating device 51 is only required to be capable of heating the plating solution 2 stored in the plating tank 11, and may be an indirect heating heater provided on the outer periphery of the plating tank 11 or an immersion heater provided inside the plating tank 11.

[0034] The plating tank 11, overflow wall 14, and circulation channel 17 are made of materials that do not dissolve, change shape, or undergo chemical reaction in the plating solution 2 at a temperature suitable for plating processing. The plating tank 11, overflow wall 14, and circulation channel 17 are made of, for example, polyvinyl chloride or stainless steel.

[0035] As described above, according to the plating treatment mechanism 10, in order to perform plating treatment on the object to be plated 1, the plating solution 2 is stored in the plating tank 11, the plating solution 2 stored inside the plating tank 11 is circulated, and the plating solution 2 can be heated to the treatment temperature.

[0036] Next, the configuration of the storage processing mechanism 20 will be described with reference to Fig. 1. As shown in Fig. 1, the storage processing mechanism 20 is composed of a precipitation tank 21, a cooling device 22, a first flow path 23, a second flow path 24, a second flow path pump 32, a first flow path opening / closing valve 42, a second flow path opening / closing valve 43, a second flow path filter 25, a heating device 52, a metal member 26, an ultrasonic generator 27, a liquid level meter 61, and a concentration analyzer 62.

[0037] The precipitation tank 21 is a tank in which the plating solution 2 supplied from the plating tank 11 is stored. The precipitation tank 21 has a cooling device 22. The cooling device 22 is a device that cools the plating solution 2 supplied from the plating tank 11 and precipitates metal ions in the plating solution 2 as metal salts. The metal salts precipitated by the cooling device 22 are stored in the precipitation tank 21.

[0038] 1 shows an example in which the volume of the precipitation tank 21 is smaller than the volume of the plating tank 11. When the volume of the precipitation tank 21 is smaller than the volume of the plating tank 11, a portion of the plating solution 2 stored in the plating tank 11 is supplied to the precipitation tank 21 and stored therein.

[0039] The cooling device 22 cools the plating solution 2 supplied from the plating tank 11 to lower the temperature of the plating solution 2, thereby reducing the solubility of metal salts in the plating solution 2 and intentionally precipitating the metal salts inside the precipitation tank 21. The cooling device 22 is, for example, an air-cooled chiller or an immersion cooler. FIG. 1 shows an example in which the cooling device 22 is provided inside the precipitation tank 21. The installation position of the cooling device 22 may be any position that allows it to cool the plating solution 2 supplied from the plating tank 11, and the cooling device 22 may be provided on the outer periphery of the precipitation tank 21.

[0040] Here, the metal salt precipitated from the plating solution 2 by the cooling device 22 is precipitated inside the precipitation tank 21 on the wall surface of the cooling device 22 and the inner wall surface of the precipitation tank 21, which have low temperatures. The precipitated metal salt does not flow out of the precipitation tank 21 together with the plating solution 2, but remains contained inside the precipitation tank 21.

[0041] The deposition tank 21 is disposed below the plating tank 11 in the direction of gravity, and the plating tank 11 and the deposition tank 21 are connected by a first flow path 23 and a second flow path 24 .

[0042] The first flow path 23 is a flow path for supplying the plating solution 2 from the plating tank 11 to the precipitation tank 21. Specifically, the first flow path 23 connects an outlet (not shown) provided in the plating tank 11 to an inlet (not shown) provided in the precipitation tank 21. Here, the inlet provided in the precipitation tank 21 is located lower in the direction of gravity than the outlet provided in the plating tank 11. The plating solution 2 flowing through the first flow path 23 is supplied from the plating tank 11 to the precipitation tank 21 by gravity. Furthermore, the outlet provided in the plating tank 11 is desirably provided on the bottom surface of the plating tank 11 so that the plating solution 2 flows out by utilizing gravity.

[0043] The second flow path 24 is a flow path for supplying the plating solution 2 in which the metal salt has been precipitated from the precipitation tank 21 to the plating tank 11. Specifically, it connects an outlet (not shown) provided in the precipitation tank 21 to an inlet (not shown) provided in the plating tank 11. The outlet provided in the precipitation tank 21 is preferably provided in the lower part of the precipitation tank 21 to prevent the plating solution 2 from remaining in the precipitation tank 21.

[0044] A second flow path pump 32 is provided in the second flow path 24. When the second flow path pump 32 is driven, the plating solution 2 in which the metal salt has been precipitated is supplied from the precipitation tank 21 to the plating tank 11. The second flow path pump 32 is preferably a gas-liquid pump to prevent the plating solution 2 from remaining in the second flow path 24.

[0045] The first flow path 23 is provided with a first flow path on-off valve 42 that opens and closes the first flow path 23. When the first flow path on-off valve 42 is closed, the plating solution 2 is not supplied from the plating tank 11 to the precipitation tank 21. When the first flow path on-off valve 42 is open, the plating solution 2 is supplied from the plating tank 11 to the precipitation tank 21. In detail, when the first flow path on-off valve 42 is opened, the plating solution 2 stored in the plating tank 11 flows downward in the direction of gravity through the first flow path 23 and is supplied from the plating tank 11 to the precipitation tank 21.

[0046] The second flow path 24 is provided with a second flow path on-off valve 43 that opens and closes the second flow path 24. The second flow path on-off valve 43 is provided between the precipitation tank 21 and the second flow path pump 32. When the second flow path on-off valve 43 is closed, the plating solution 2 does not reach the second flow path pump 32. When the second flow path on-off valve 43 is open, the plating solution 2 reaches the second flow path pump 32. Therefore, when the second flow path on-off valve 43 is open and the second flow path pump 32 is driven, the plating solution 2 in which the metal salt has been precipitated is supplied from the precipitation tank 21 to the plating tank 11.

[0047] Furthermore, the first flow path on-off valve 42 and the second flow path on-off valve 43 are opened, and the second flow path pump 32 is driven, whereby the plating solution 2 is circulated between the plating tank 11 and the precipitation tank 21. Therefore, after the metal salt is precipitated from the plating solution 2 by the cooling device 22, the first flow path on-off valve 42 and the second flow path on-off valve 43 are opened, and the second flow path pump 32 is driven, whereby the plating solution 2 from which the metal salt has been precipitated is circulated between the plating tank 11 and the precipitation tank 21.

[0048] Additionally, a second flow path filter 25 is provided in the second flow path 24 downstream of the second flow path pump 32. The second flow path filter 25 is provided to filter the plating solution 2 flowing through the second flow path 24 and to separate foreign matter in the plating solution 2 from the plating solution 2. The second flow path filter 25 is preferably provided downstream of the second flow path 24 to prevent foreign matter from entering the plating tank 11, but may also be provided upstream of the second flow path pump 32.

[0049] The temperature raising device 52 is a device for raising the temperature of the plating solution 2 flowing through the storage processing mechanism 20. In detail, the temperature raising device 52 is a device for raising the temperature of the plating solution 2 in which a metal salt has been precipitated, thereby dissolving the metal salt contained in the precipitation tank 21.

[0050] The temperature raising device 52 raises the temperature of the plating solution 2 stored in the precipitation tank 21. FIG. 1 shows an example in which the temperature raising device 52 is provided inside the precipitation tank 21. The temperature raising device 52 is, for example, an immersion heater, and is configured to raise the temperature of the plating solution 2 stored in the precipitation tank 21. By raising the temperature of the plating solution 2 stored in the precipitation tank 21 with the temperature raising device 52, the metal salt contained in the precipitation tank 21 can be dissolved.

[0051] The temperature raising device 52 may be installed at any position where it can raise the temperature of the plating solution 2 stored in the deposition tank 21, and may be installed on the outer periphery of the deposition tank 21.

[0052] A metal member 26 with good thermal conductivity is provided inside the deposition tank 21. The metal member 26 is provided to expand the area of ​​good thermal conductivity that comes into contact with the plating solution 2. Inside the deposition tank 21, metal salts deposit from areas where the temperature of the plating solution 2 is low. Therefore, when the cooling device 22 is operated, metal salts deposit preferentially from the contact surfaces between the plating solution 2 and the inner wall surfaces of the deposition tank 21 and the cooling device 22, where the temperature of the plating solution 2 is likely to decrease. Because the metal member 26 has good thermal conductivity and is likely to decrease in temperature when the cooling device 22 is operated, metal salts deposit preferentially at the contact surfaces between the metal member 26 and the plating solution 2. In other words, the metal member 26 increases the areas where metal salts are likely to deposit by the amount of contact surface between the metal member 26 and the plating solution 2, thereby enabling efficient deposition of metal salts. Furthermore, when the heating device 52 is operated to dissolve the metal salts deposited by the cooling device 22, the metal member 26 with good thermal conductivity is likely to become hot. Therefore, the metal member 26 allows the metal salt to be dissolved efficiently. The metal member 26 is made of a metal, such as stainless steel, that has excellent thermal conductivity and does not react with the plating solution 2. The metal member 26 is preferably installed adjacent to the cooling device 22.

[0053] Furthermore, an ultrasonic generator 27 is installed inside the precipitation tank 21. The ultrasonic generator 27 is installed to promote dissolution of the metal salts precipitated inside the precipitation tank 21. When dissolving the metal salts, the ultrasonic generator 27 generates ultrasonic waves, which accelerates dissolution of the metal salts and shortens the time required to return to the original metal ion concentration. The ultrasonic generator 27 is, for example, a throw-in type ultrasonic vibrator installed inside the precipitation tank 21, or an ultrasonic generator built into the precipitation tank 21. The ultrasonic generator 27 may be any device that can transmit ultrasonic vibrations to the plating solution 2 stored inside the precipitation tank 21. Note that the ultrasonic generator 27 is preferably installed near the cooling device 22 or the metal member 26 in order to transmit ultrasonic vibrations preferentially to the plating solution 2 around the metal salt.

[0054] A level meter 61 is installed inside the precipitation tank 21. The level meter 61 is a device that measures the amount of plating solution 2 stored inside the precipitation tank 21. The result of measuring the amount of plating solution 2 by the level meter 61 can be used as a criterion for determining whether the solution transfer process in the precipitation step and dissolution step described below is complete. The level meter 61 is a device that measures the amount of plating solution 2 stored inside the precipitation tank 21, for example, by a float type, ultrasonic type, radio wave type, or the like. The installation location and measurement method of the level meter 61 are not limited as long as it can measure the amount of plating solution 2 stored inside the precipitation tank 21. The level meter 61 may be a device that is provided in the first flow path 23 and measures the amount of plating solution 2 stored inside the precipitation tank 21 by measuring the amount of plating solution 2 from the plating tank 11 that flows through the first flow path 23.

[0055] A concentration analyzer 62 is installed inside the precipitation tank 21. The concentration analyzer 62 is a device that measures the metal ion concentration of the plating solution 2 stored inside the precipitation tank 21. The measurement result of the metal ion concentration of the plating solution 2 by the concentration analyzer 62 can be used as a criterion for determining the completion of the precipitation step and dissolution step described below. The concentration analyzer 62 is an analyzer that performs analysis by, for example, an ion electrode method, X-ray fluorescence analysis, automatic titration analysis, or absorptiometry, and is selected depending on the metal ions in the plating solution 2.

[0056] As described above, the storage treatment mechanism 20 can intentionally precipitate metal salts in the precipitation tank 21 in order to prevent the precipitation of metal salts in the plating tank 11 when storing the plating solution 2. Furthermore, the storage treatment mechanism 20 can dissolve the metal salts contained in the precipitation tank 21 to return the plating solution 2 to the state it was in before the metal salts were precipitated.

[0057] Next, the control device 70 will be described. The control device 70 controls the controlled device based on input information input to the control device 70, setting information stored in the control device 70, or acquired information acquired by a data acquisition device. Here, the input information is, for example, an instruction signal for the controlled device. The setting information is, for example, a reference value used for judgment by the control device 70. The data acquisition device is, for example, a liquid level meter 61 and a concentration analyzer 62. The acquired information is, for example, the liquid volume of the plating solution 2 stored in the deposition tank 21 measured by the liquid level meter 61 and the metal ion concentration of the plating solution 2 stored in the deposition tank 21 measured by the concentration analyzer 62. The controlled device is, for example, a circulation flow path pump 31, a second flow path pump 32, a circulation flow path opening / closing valve 41, a first flow path opening / closing valve 42, a second flow path opening / closing valve 43, a cooling device 22, a plating tank heating device 51, a heating device 52, and an ultrasonic generator 27. The control device 70 can perform the plating process, deposition step S100, circulation step S200, storage step S300 and dissolution step S400 described below by controlling the controlled device based on input information input to the control device 70, setting information stored in the control device 70, or acquired information acquired by a data acquisition device.

[0058] The functional configuration of the control device 70 will now be described with reference to Fig. 2. Fig. 2 is a system block diagram of the control device 70. As shown in FIG. 2, the control device 70 includes a communication unit 71, a control unit 72, and a storage unit 73.

[0059] The communication unit 71 performs processing for the control device 70 to communicate signals between the data acquisition device and the control target device. In detail, the communication unit 71 converts a received signal so that the control device 70 can receive information acquired by the data acquisition device, and outputs the converted received signal to the control unit 72. The communication unit 71 also converts a control signal for the control target device output by the control unit 72, and transmits the converted control signal from the control device 70 to the control target device.

[0060] The control unit 72 outputs a control signal for the device to be controlled based on input information input to the control device 70, setting information stored in the control device 70, or acquired information from a data acquisition device received via the communication unit 71. The control unit 72 has a supply control unit 72a, a deposition control unit 72b, a storage control unit 72c, and a dissolution control unit 72d.

[0061] The supply control unit 72a controls the supply of the plating solution 2 in the plating apparatus 100. Specifically, the supply control unit 72a controls the supply of the plating solution 2 from the plating tank 11 in which the plating solution 2 is stored to the precipitation tank 21, controls the supply of the plating solution 2 in which a metal salt has been precipitated by the precipitation control unit 72b from the precipitation tank 21 to the plating tank 11, and controls the circulating of the plating solution 2 in which a metal salt has been precipitated by the precipitation control unit 72b between the plating tank 11 and the precipitation tank 21. Specifically, the supply control unit 72a controls the circulation flow path pump 31, the second flow path pump 32, the circulation flow path opening / closing valve 41, the first flow path opening / closing valve 42, and the second flow path opening / closing valve 43 based on input information input to the control device 70, setting information stored in the control device 70, or acquired information acquired by a data acquisition device.

[0062] The deposition control unit 72b performs control so that the plating solution 2 supplied from the plating tank 11 by the supply control unit 72a is cooled by the cooling device 22 of the deposition tank 21 to deposit metal salts in the deposition tank 21. Specifically, the deposition control unit 72b controls the cooling device 22 based on input information input to the control device 70, setting information stored in the control device 70, or acquired information acquired by a data acquisition device.

[0063] The storage control unit 72c controls the storage of the plating solution 2 in which the metal salt has been precipitated by the precipitation control unit 72b. Specifically, the storage control unit 72c controls the circulation flow path pump 31, the second flow path pump 32, the cooling device 22, and the plating tank heating device 51 based on input information input to the control device 70, setting information stored in the control device 70, or acquired information acquired by the data acquisition device.

[0064] The dissolution control unit 72d controls the plating bath temperature raising device 51 and the temperature raising device 52 to raise the temperature of the plating solution 2, in which the metal salt has been precipitated by the precipitation control unit 72b, thereby dissolving the metal salt contained in the precipitation bath 21. Specifically, the dissolution control unit 72d controls the plating bath temperature raising device 51 and the temperature raising device 52 based on input information input to the control device 70, setting information stored in the control device 70, or acquired information acquired by a data acquisition device.

[0065] The storage unit 73 stores data used by the control unit 72 when performing processing. Here, the data used by the control unit 72 when performing processing is, for example, the input information, setting information, and acquired information described above. The storage unit 73 also stores a program 80 processed by the control unit 72. The control device 70 reads and executes the program 80 stored in the storage unit 73, thereby causing the control unit 72 to control the controlled device and achieving the plating process, deposition step S100, circulation step S200, storage step S300, and dissolution step S400 described below.

[0066] Next, the hardware configuration of the control device 70 will be described with reference to Fig. 3. Fig. 3 is a diagram showing the hardware configuration of the control device 70.

[0067] 3, the control device 70 is configured with an arithmetic unit 701, a storage device 702, an auxiliary storage device 703, a communication device 704, an input device 705, and an output device 706. The arithmetic unit 701, the storage device 702, the auxiliary storage device 703, the communication device 704, the input device 705, and the output device 706 are connected via a signal line 707.

[0068] The arithmetic device 701 is a device that realizes each function of the control unit 72 shown in Fig. 2. The arithmetic device 701 reads out a necessary program 80 from the auxiliary storage device 703 and executes processing to realize each function of the control unit 72 of the control device 70. The arithmetic device 701 is, for example, a processor, and the processor is an IC (Integrated Circuit) that performs arithmetic processing. Specific examples of the processor are, for example, a CPU (Central Processing Unit), a DSP (Digital Signal Processor), and a GPU (Graphics Processing Unit). The arithmetic device 701 may also be a personal computer, a microcomputer board, an FPGA (Field Programmable Gate Array) board, or the like.

[0069] 2, and is the main memory of the control device 70. The main memory temporarily stores calculations of the processing performed by the arithmetic device 701. The storage device 702 is, for example, a RAM (Random Access Memory).

[0070] 2, and is an auxiliary storage device of the control device 70. The auxiliary storage device 703 stores programs necessary to realize each function of the control unit 72 of the control device 70. The auxiliary storage device 703 is, for example, a read-only memory (ROM), a hard disk drive (HDD), or a solid state drive (SSD).

[0071] 2, and is a communication interface of the control device 70. The communication device 704 receives, for example, information acquired by the data acquisition device and inputs it to the arithmetic device 701. In addition, the communication device 704 outputs, for example, a control signal for the control target device processed by the arithmetic device 701 to the control target device.

[0072] The input device 705 is an input interface for the control device 70. The input device 705 is, for example, a touch panel or a keyboard provided in the control device 70. The input device 705 inputs, for example, a control signal for a device to be controlled to the arithmetic device 701.

[0073] The output device 706 is an output interface of the control device 70. The output device 706 outputs, for example, information acquired by the data acquisition device or the operating status of the device to be controlled to a display device (not shown).

[0074] A signal line 707 is a transmission path for transmitting and receiving data between the components shown in FIG.

[0075] <Plating solution management method> Next, a method for managing the plating solution 2 using the plating apparatus 100 according to the first embodiment of the present disclosure will be described. The method for managing the plating solution 2 according to the present disclosure is a method for storing the plating solution 2 after the plating process of the object to be plated 1 is completed. Therefore, before describing the method for managing the plating solution 2, the processing procedure of the plating process using the plating apparatus 100 will be described.

[0076] The following describes an example in which plating using the plating apparatus 100 is performed by the plating mechanism 10 and a plating control unit (not shown) of the control device 70. First, the plating control unit of the control device 70 starts the circulation flow path pump 31 and the plating tank heating device 51. When the circulation flow path pump 31 and the plating tank heating device 51 are started, the temperature of the plating solution 2 stored in the plating tank 11 is raised and the plating solution 2 circulates inside the plating tank 11.

[0077] Next, the plating process control unit of the control device 70 determines whether the plating solution 2 stored in the plating tank 11 has a volume and temperature suitable for plating. Specifically, the plating process control unit of the control device 70 determines that the plating solution 2 stored in the plating tank 11 has a volume and temperature suitable for plating when a preset time has elapsed since the circulation flow path pump 31 and the plating tank heating device 51 were activated. The plating apparatus 100 may also include a plating tank level meter and a plating tank temperature detection device (not shown) that measure the volume and temperature of the plating solution 2 inside the plating tank 11. In this case, the plating process control unit of the control device 70 determines that the plating solution 2 stored in the plating tank 11 has a volume and temperature suitable for plating when the measurement results from the plating tank level meter and the plating tank temperature detection device exceed the preset volume and temperature. The preset time, volume, and temperature used in this determination are stored in the memory unit 73 of the control device 70.

[0078] When the plating process control unit of the control device 70 determines that the plating solution 2 stored in the plating tank 11 has a volume and temperature suitable for plating, the plating process control unit of the control device 70 turns on the power supply 13 while the object to be plated 1 and the anode electrode 12 are immersed in the plating solution 2 inside the plating tank 11. Through the above process, metal ions in the plating solution 2 are reduced on the surface to be plated of the object to be plated 1, and a plating film is formed on the surface to be plated of the object to be plated 1. When the plating process control unit of the control device 70 determines that a plating film of a predetermined thickness has been formed on the object to be plated 1, it turns off the power supply 13 and ends the plating process.

[0079] In the above example, the plating process control unit of the control device 70 turns on the power supply 13 while the object to be plated 1 and the anode electrode 12 are immersed in the plating solution 2. However, the plating process control unit of the control device 70 may immerse the object to be plated 1 and the anode electrode 12 in the plating solution 2 after turning on the power supply 13. The timing for immersing the object to be plated 1 and the anode electrode 12 in the plating solution 2 is determined depending on the metal ions in the object to be plated 1 and the plating solution 2. For example, if the ionization tendency of the object to be plated 1 is greater than the ionization tendency of the metal ions in the plating solution 2, immersing the object to be plated 1 in the plating solution 2 may result in substitution deposition of the metal ions in the plating solution 2. Therefore, the object to be plated 1 and the anode electrode 12 are immersed in the plating solution 2 after turning on the power supply 13.

[0080] As described above, according to the plating process using the plating apparatus 100, the plating process mechanism 10 and the control device 70 circulate and heat the plating solution 2 inside the plating tank 11, thereby uniformly distributing the metal ions in the plating solution 2 inside the plating tank 11 while maintaining the temperature at a level suitable for plating.

[0081] Next, a method for managing the plating solution 2 after the plating process is completed will be described with reference to Fig. 4. Fig. 4 is a flowchart showing the steps of the method for managing the plating solution 2 according to the first embodiment.

[0082] 4, the method for managing the plating solution 2 according to the first embodiment includes a deposition step S100, a circulation step S200, a storage step S300, and a dissolution step S400. The method for managing the plating solution 2 is performed by the storage processing mechanism 20 and the control device 70.

[0083] The precipitation step S100 is a step for suppressing the precipitation of metal salts in the plating tank 11 by reducing the metal ion concentration of the plating solution 2 stored in the plating tank 11 after the plating process of the object to be plated 1 is completed and before the plating solution 2 is stored. The deposition step S100 will be described with reference to Fig. 5. Fig. 5 is a flowchart showing the processing procedure of the deposition step S100 according to the first embodiment.

[0084] The deposition step S100 is started after the plating process is completed. For example, the deposition step S100 is started by the control device 70 when a preset time has elapsed since the power supply 13 was turned off, or when an instruction to start the deposition step S100 is input via the input device 705.

[0085] In the deposition step S100, first, the supply control unit 72a of the control device 70 controls the plating solution 2 to be supplied from the plating tank 11 to the deposition tank 21. Specifically, as shown in FIG. 5, the supply control unit 72a of the control device 70 opens the first flow path opening / closing valve 42 and closes the second flow path opening / closing valve 43 (step S101). Next, the supply control unit 72a of the control device 70 determines whether the supply of the plating solution 2 from the plating tank 11 to the deposition tank 21 has been completed (step S102). The supply control unit 72a of the control device 70 makes this determination based on a supply completion flag from the plating tank 11 to the deposition tank 21. The supply completion flag from the plating tank 11 to the deposition tank 21 is, for example, a flag that is set when a preset liquid transfer time has elapsed since the first flow path opening / closing valve 42 was opened, or a flag that is set when the amount of plating solution 2 stored in the deposition tank 21, measured by the liquid level meter 61, is equal to or greater than a preset amount. When either or both of the above flags are set, the supply control unit 72a of the control device 70 determines that the supply of the plating solution 2 from the plating tank 11 to the precipitation tank 21 has been completed. When it is determined that the supply of the plating solution 2 from the plating tank 11 to the precipitation tank 21 has not been completed (No in step S102), the supply control unit 72a of the control device 70 repeats the determination until it is determined that the supply of the plating solution 2 from the plating tank 11 to the precipitation tank 21 has been completed. When it is determined that the supply of the plating solution 2 from the plating tank 11 to the precipitation tank 21 has been completed (Yes in step S102), the supply control unit 72a of the control device 70 closes the first flow path opening / closing valve 42 to terminate the supply of the plating solution 2 from the plating tank 11 to the precipitation tank 21 (step S103).

[0086] Next, the deposition control unit 72b of the control device 70 cools the plating solution 2 supplied from the plating tank 11 using the cooling device 22 of the deposition tank 21, thereby depositing metal salts in the deposition tank 21. Specifically, first, the deposition control unit 72b of the control device 70 activates the cooling device 22 (step S104). Then, the deposition control unit 72b of the control device 70 determines whether the cooling of the plating solution 2 stored in the deposition tank 21 by the cooling device 22 has been completed (step S105). The deposition control unit 72b of the control device 70 makes the determination based on a cooling completion flag. The cooling completion flag is, for example, a flag that is set when a preset cooling time has elapsed since the cooling device 22 was activated, or a flag that is set when the metal ion concentration of the plating solution 2 stored in the deposition tank 21, measured by the concentration analyzer 62, becomes equal to or lower than a preset metal ion concentration. When either or both of the above flags are set, the precipitation control unit 72b of the control device 70 determines that the cooling of the plating solution 2 stored in the precipitation tank 21 by the cooling device 22 has been completed. When it is determined that the cooling of the plating solution 2 in the precipitation tank 21 by the cooling device 22 has not been completed (No in step S105), the precipitation control unit 72b of the control device 70 repeats the determination until it is determined that the cooling of the plating solution 2 in the precipitation tank 21 by the cooling device 22 has been completed. When it is determined that the cooling of the plating solution 2 in the precipitation tank 21 by the cooling device 22 has been completed (Yes in step S105), the precipitation control unit 72b of the control device 70 stops the cooling device 22 (step S106).

[0087] Next, the supply control unit 72a of the control device 70 controls the plating solution 2, in which the metal salt has been precipitated by the cooling device 22, to be supplied from the precipitation tank 21 to the plating tank 11. Specifically, the supply control unit 72a of the control device 70 opens the second flow path opening / closing valve 43 (step S107) and then starts the second flow path pump 32 (step S108). The supply control unit 72a of the control device 70 then determines whether the supply of the plating solution 2 from the precipitation tank 21 to the plating tank 11 has been completed (step S109). The supply control unit 72a of the control device 70 makes this determination based on a supply completion flag from the precipitation tank 21 to the plating tank 11. The supply completion flag from the precipitation tank 21 to the plating tank 11 is, for example, a flag that is set when a preset liquid transfer time has elapsed since the second flow path opening / closing valve 43 was opened, or a flag that is set when the amount of plating solution 2 in the precipitation tank 21 measured by the liquid level meter 61 is equal to or less than a preset liquid level. When either or both of the above flags are set, the supply control unit 72a of the control device 70 determines that the supply of the plating solution 2 from the precipitation tank 21 to the plating tank 11 has been completed. When it is determined that the supply of the plating solution 2 from the precipitation tank 21 to the plating tank 11 has not been completed (No in step S109), the supply control unit 72a of the control device 70 repeats the determination until it is determined that the supply of the plating solution 2 from the precipitation tank 21 to the plating tank 11 has been completed. When it is determined that the supply of the plating solution 2 from the precipitation tank 21 to the plating tank 11 has been completed (Yes in step S109), the supply control unit 72a of the control device 70 stops the second flow path pump 32 (step S110), and then closes the second flow path opening / closing valve 43 to terminate the supply of the plating solution 2 from the precipitation tank 21 to the plating tank 11 (step S111).

[0088] Next, the supply control unit 72a of the control device 70 determines whether or not to repeatedly perform the above steps S101-S111 (step S112). The supply control unit 72a of the control device 70 makes this determination based on a repetition completion flag. The repetition completion flag is, for example, a flag that is set when a predetermined time has elapsed since the start of the deposition step S100, a flag that is set when a predetermined number of repetitions have been completed, or a flag that is set when the metal ion concentration of the plating solution 2 stored in the plating tank 11 measured by a plating tank concentration analyzer (not shown) becomes equal to or lower than a predetermined metal ion concentration. When any or all of the above flags are set, the supply control unit 72a of the control device 70 determines that the adjustment of the metal ion concentration in the plating solution 2 stored in the plating tank 11 has been completed and that it is not necessary to repeatedly perform the above steps S101-S111. If it is determined that the above steps S101-S111 need to be repeated (No in step S112), the supply control unit 72a of the control device 70 causes the plating solution 2 to be supplied again from the plating tank 11 to the precipitation tank 21 (step S101).

[0089] As described above, the precipitation step S100 includes the steps of supplying the plating solution 2 from the plating tank 11 storing the plating solution 2 to the precipitation tank 21 (S101-S103), cooling the plating solution 2 supplied to the precipitation tank 21 by the cooling device 22 of the precipitation tank 21 to precipitate metal salts in the precipitation tank 21 (S104-S106), supplying the plating solution 2 from which the metal salts have been precipitated from the precipitation tank 21 to the plating tank 11 (S107-S111), and repeating the above steps to adjust the metal ion concentration in the plating solution 2 stored in the plating tank 11 (S112). The precipitation step S100 including the above steps allows the metal ion concentration of the plating solution 2 stored in the plating tank 11 to be reduced. Therefore, according to the deposition step S100, deposition of metal salts in the plating tank 11 can be suppressed even when the circulation flow path pump 31 and the plating tank heating device 51 are stopped, i.e., even at a static low temperature.

[0090] 5 shows an example in which the plating solution 2 in which the metal salt has been precipitated is finally supplied from the precipitation tank 21 to the plating tank 11 and stored in the plating tank 11, but the plating solution 2 in which the metal salt has been precipitated may also be stored in the precipitation tank 21. That is, when the supply control unit 72a of the control device 70 determines that it is not necessary to repeatedly perform the above steps S101-S111 (Yes in step S112), the supply control unit 72a of the control device 70 may supply the plating solution 2 in which the metal salt has been precipitated from the plating tank 11 to the precipitation tank 21.

[0091] 4, after completing the deposition step S100, the control device 70 performs the circulation step S200. The circulation step S200 is a step for circulating the plating solution 2, whose metal ion concentration has been reduced in the deposition step S100, between the plating tank 11 and the deposition tank 21, thereby preventing the plating solution 2 with a high metal ion concentration from remaining in the first flow path 23, the second flow path 24, and the second flow path pump 32. The circulation step S200 will be described with reference to Fig. 6. Fig. 6 is a flowchart showing the processing procedure of the circulation step S200 according to the first embodiment.

[0092] In the circulation step S200, the supply control unit 72a of the control device 70 circulates the plating solution 2, in which the metal salt has been precipitated by the cooling device 22, between the plating tank 11 and the precipitation tank 21. Specific processing procedures are the same as steps S101-S103 and steps S107-S111 of the precipitation step S100. As shown in FIG. 6, first, the supply control unit 72a of the control device 70 opens the first flow path opening / closing valve 42 and closes the second flow path opening / closing valve 43 (step S201). Next, the supply control unit 72a of the control device 70 determines whether the supply of the plating solution 2 from the plating tank 11 to the precipitation tank 21 has been completed (step S202). The method of determination by the supply control unit 72a of the control device 70 is the same as that of step S102 of the precipitation step S100. If it is determined that the supply of the plating solution 2 from the plating tank 11 to the precipitation tank 21 is not complete (No in step S202), the supply control unit 72a of the control device 70 repeats this determination until it is determined that the supply of the plating solution 2 from the plating tank 11 to the precipitation tank 21 is complete. If it is determined that the supply of the plating solution 2 from the plating tank 11 to the precipitation tank 21 is complete (Yes in step S202), the supply control unit 72a of the control device 70 closes the first flow path opening / closing valve 42 to terminate the supply of the plating solution 2 from the plating tank 11 to the precipitation tank 21 (step S203). Next, the supply control unit 72a of the control device 70 opens the second flow path opening / closing valve 43 (step S204) and then starts the second flow path pump 32 (step S205). Then, the supply control unit 72a of the control device 70 determines whether the supply of the plating solution 2 from the precipitation tank 21 to the plating tank 11 is complete (step S206). The determination method by the supply control unit 72a of the control device 70 is the same as that in step S109 of the deposition step S100. If it is determined that the supply of the plating solution 2 from the deposition tank 21 to the plating tank 11 is not complete (No in step S206), the supply control unit 72a of the control device 70 repeats the determination until it is determined that the supply of the plating solution 2 from the deposition tank 21 to the plating tank 11 is complete.If it is determined that the supply of plating solution 2 from the precipitation tank 21 to the plating tank 11 has been completed (Yes in step S206), the supply control unit 72a of the control device 70 stops the second flow path pump 32 (step S207), and then closes the second flow path opening / closing valve 43 to terminate the supply of plating solution 2 from the precipitation tank 21 to the plating tank 11 (step S208).

[0093] As described above, the circulation step S200 is a step of circulating the plating solution 2, in which the metal salt has been precipitated by the cooling device 22, between the plating tank 11 and the precipitation tank 21. Specifically, the circulation step S200 includes the steps of supplying the plating solution 2, in which the metal salt has been precipitated, from the plating tank 11 to the precipitation tank 21 (S201-S203) and the steps of supplying the plating solution 2, in which the metal salt has been precipitated, from the precipitation tank 21 to the plating tank 11 (S204-S208). According to the circulation step S200 including the above steps, by circulating the plating solution 2 in which the metal salt has been precipitated, i.e., the plating solution 2 in which the metal ion concentration has been reduced, between the plating tank 11 and the precipitation tank 21, it is possible to prevent the plating solution 2 with a high metal ion concentration from remaining in the first flow path 23, the second flow path 24, and the second flow path pump 32. Therefore, the method for managing the plating solution 2, which includes the precipitation step S100 and the circulation step S200, can prevent metal salts from precipitating in the plating tank 11 when the plating solution 2 is stored, as well as prevent metal salts from precipitating in the first flow path 23, the second flow path 24, and the second flow path pump 32. In other words, the method for managing the plating solution 2, which includes the precipitation step S100 and the circulation step S200, can prevent metal salts from precipitating in the configuration of the plating apparatus 100 excluding the precipitation tank 21.

[0094] 6 shows an example of the circulation step S200 in which steps (S201-S203) of supplying the plating solution 2 in which the metal salt has been precipitated from the plating tank 11 to the precipitation tank 21 are followed by steps (S204-S208) of supplying the plating solution 2 in which the metal salt has been precipitated from the precipitation tank 21 to the plating tank 11. The circulation step S200 may be any as long as it can circulate the plating solution 2 in which the metal salt has been precipitated between the plating tank 11 and the precipitation tank 21. After the step of supplying the plating solution 2 in which the metal salt has been precipitated from the precipitation tank 21 to the plating tank 11, a step of supplying the plating solution 2 in which the metal salt has been precipitated from the plating tank 11 to the precipitation tank 21 may be performed. Furthermore, the circulation step S200 may be performed by repeating the above steps several times.

[0095] 4, after completing the circulation step S200, the control device 70 performs the storage step S300. The storage step S300 is a step for storing the plating solution 2 whose metal ion concentration has been reduced by the deposition step S100. The storage step S300 will be described with reference to Fig. 7. Fig. 7 is a flowchart showing the processing procedure of the storage step S300 according to the first embodiment.

[0096] In the storage step S300, the storage control unit 72c of the control device 70 stores the plating solution 2 in which the metal salt has been precipitated, with the circulation flow pump 31 and the plating tank heating device 51 stopped. Specifically, as shown in FIG. 7, the storage control unit 72c of the control device 70 first determines whether the circulation flow pump 31 and the plating tank heating device 51 are stopped (step S301). If the circulation flow pump 31 and the plating tank heating device 51 are not stopped (No in step S301), the storage control unit 72c of the control device 70 stops the circulation flow pump 31 and the plating tank heating device 51 (step S302). If the circulation flow pump 31 and the plating tank heating device 51 are stopped (No in step S301), the storage control unit 72c of the control device 70 ends the storage step S300.

[0097] As described above, the storage step S300 is a step in which the circulation flow path pump 31 and the plating tank heating device 51 are stopped to store the plating solution 2 in which the metal salt has been precipitated. The method for managing the plating solution 2 including the precipitation step S100 and the storage step S300 not only prevents the precipitation of metal salts in the plating tank 11 when the plating solution 2 is stored, but also enables the plating solution 2 to be stored in an energy-saving manner.

[0098] The plating solution 2 in which the metal salt has been precipitated is stored in the plating tank 11 or the precipitation tank 21. Since the plating tank 11 does not contain metal salts, it is preferable to store the plating solution 2 in which the metal salt has been precipitated in the plating tank 11, which does not have the possibility of the metal salts dissolving in the plating solution 2 in which the metal salt has been precipitated due to changes in the outside temperature.

[0099] The dissolution step S400 is a step for dissolving the metal salt contained in the precipitation tank 21 and returning the plating solution 2 to the metal ion concentration before the metal salt was precipitated before resuming the plating process of the object to be plated 1. The dissolving step S400 will be described with reference to Fig. 8. Fig. 8 is a flowchart showing the processing procedure of the dissolving step S400 according to the first embodiment.

[0100] The dissolving step S400 is started before resumption of the plating process of the object to be plated 1. For example, when the duration of the storing step S300 exceeds a preset time, or when an instruction to start the dissolving step S400 is input via the input device 705, the dissolving step S400 is started by the control device 70.

[0101] In the dissolving step S400, first, the supply control unit 72a of the control device 70 supplies the plating solution 2 in which the metal salt has been precipitated from the plating tank 11 to the precipitation tank 21. The specific processing procedure is the same as that of S101-S103 in the precipitation step. First, the supply control unit 72a of the control device 70 opens the first flow path opening / closing valve 42 and closes the second flow path opening / closing valve 43 (step S401). Next, the supply control unit 72a of the control device 70 determines whether the supply of the plating solution 2 from the plating tank 11 to the precipitation tank 21 has been completed (step S403). The method of determination by the supply control unit 72a of the control device 70 is the same as that of step S102 in the precipitation step S100. If it is determined that the supply of the plating solution 2 from the plating tank 11 to the precipitation tank 21 is not complete (No in step S402), the supply control unit 72a of the control device 70 repeats the determination until it is determined that the supply of the plating solution 2 from the plating tank 11 to the precipitation tank 21 is complete. If it is determined that the supply of the plating solution 2 from the plating tank 11 to the precipitation tank 21 is complete (Yes in step S402), the supply control unit 72a of the control device 70 closes the first flow path opening / closing valve 42 to terminate the supply of the plating solution 2 from the plating tank 11 to the precipitation tank 21 (step S403).

[0102] Next, the dissolution control unit 72d of the control device 70 uses the heating device 52 to heat the plating solution 2 in which the metal salt has been precipitated, thereby dissolving the metal salt contained in the precipitation tank 21. Specifically, first, the dissolution control unit 72d of the control device 70 activates the heating device 52 and the ultrasonic generator 27 (step S404). Then, the dissolution control unit 72d of the control device 70 determines whether the dissolution of the metal salt contained in the precipitation tank 21 by the heating device 52 has been completed (step S405). The dissolution control unit 72d of the control device 70 makes this determination based on a dissolution completion flag. The dissolution completion flag is, for example, a flag that is set when a preset dissolution time has elapsed since the heating device 52 was activated, or a flag that is set when the metal ion concentration of the plating solution 2 in the precipitation tank 21, measured by the concentration analyzer 62, is equal to or greater than a preset metal ion concentration. When either or both of the above flags are set, the dissolution control unit 72d of the control device 70 determines that the dissolution of the metal salt precipitated in the precipitation tank 21 by the temperature raising device 52 is complete. When it is determined that the dissolution of the metal salt precipitated in the precipitation tank 21 by the temperature raising device 52 is not complete (No in step S405), the dissolution control unit 72d of the control device 70 repeats the determination until it is determined that the dissolution of the metal salt precipitated in the precipitation tank 21 by the temperature raising device 52 is complete. When it is determined that the dissolution of the metal salt precipitated in the precipitation tank 21 by the temperature raising device 52 is complete (Yes in step S405), the dissolution control unit 72d of the control device 70 stops the temperature raising device 52 and the ultrasonic generator 27 (step S406).

[0103] Next, the supply control unit 72a of the control device 70 controls the temperature raising device 52 to supply the plating solution 2, in which the metal salt has been dissolved, from the precipitation tank 21 to the plating tank 11. Specifically, the supply control unit 72a of the control device 70 opens the second flow path opening / closing valve 43 (step S407) and then starts the second flow path pump 32 (step S408). Then, the supply control unit 72a of the control device 70 determines whether the supply of the plating solution 2 from the precipitation tank 21 to the plating tank 11 has been completed (step S409). The determination method by the supply control unit 72a of the control device 70 is the same as that in step S109 of the precipitation step S100. If it is determined that the supply of the plating solution 2 from the precipitation tank 21 to the plating tank 11 has not been completed (No in step S409), the supply control unit 72a of the control device 70 repeats the determination until it is determined that the supply of the plating solution 2 from the precipitation tank 21 to the plating tank 11 has been completed. If it is determined that the supply of plating solution 2 from the precipitation tank 21 to the plating tank 11 has been completed (Yes in step S409), the supply control unit 72a of the control device 70 stops the second flow path pump 32 (step S410), and then closes the second flow path opening / closing valve 43 to terminate the supply of plating solution 2 from the precipitation tank 21 to the plating tank 11 (step S411).

[0104] Next, the supply control unit 72a of the control device 70 determines whether or not to repeatedly perform the above steps S401-S411 (step S412). The supply control unit 72a of the control device 70 makes this determination based on a repetition completion flag. The repetition completion flag is, for example, a flag that is set when a predetermined time has elapsed since the start of the dissolving step S400, a flag that is set when a predetermined number of repetitions have been completed, or a flag that is set when the metal ion concentration of the plating solution 2 stored in the plating tank 11 measured by a plating tank concentration analyzer (not shown) is equal to or greater than a predetermined metal ion concentration. When any or all of the above flags are set, the supply control unit 72a of the control device 70 determines that the adjustment of the metal ion concentration in the plating solution 2 stored in the plating tank 11 has been completed and that it is not necessary to repeatedly perform the above steps S401-S411. If it is determined that the above steps S401-S411 need to be repeated (No in step S412), the supply control unit 72a of the control device 70 causes the plating solution 2 to be supplied again from the plating tank 11 to the precipitation tank 21 (step S401).

[0105] As described above, the dissolving step S400 includes the steps of supplying the plating solution 2 in which the metal salt has been precipitated from the plating tank 11 to the precipitation tank 21 (S401-S403), the steps of raising the temperature of the plating solution 2 in which the metal salt has been precipitated by the heating device 52 that heats the plating solution 2 stored in the precipitation tank 21 to dissolve the metal salt contained in the precipitation tank 21 (S404-S406), the steps of supplying the plating solution 2 in which the metal salt has been dissolved from the precipitation tank 21 to the plating tank 11 (S407-S411), and the step of adjusting the metal ion concentration in the plating solution 2 stored in the plating tank 11 by repeating the above steps (S412).The dissolving step S400 including the above steps dissolves the metal salt contained in the precipitation tank 21 and can return the metal ion concentration in the plating solution 2 to the concentration before the metal salt was precipitated. Therefore, according to the method for managing the plating solution 2 including the precipitation step S100 and the dissolution step S400, in addition to suppressing the precipitation of metal salts in the plating tank 11 when storing the plating solution 2, the plating solution 2 can be used continuously.

[0106] 8 shows the dissolving step S400 in the case where the plating solution 2 in which the metal salt has been precipitated in the storage step S300 is stored in the plating tank 11. In the case where the plating solution 2 in which the metal salt has been precipitated in the storage step S300 is stored in the precipitation tank 21, the dissolving step S400 starts from step S404 in FIG.

[0107] In the precipitation step S100 and the dissolution step S400, the circulation flow path pump 31 and the plating tank heating device 51 may be started before the start of each step to circulate and heat the plating solution 2 stored inside the plating tank 11. By starting the circulation flow path pump 31 and the plating tank heating device 51, the metal ion concentration of the plating solution 2 stored inside the plating tank 11 can be kept uniform, and the precipitation of metal salts inside the plating tank 11 can be further suppressed.

[0108] In the above example, the plating solution management method is implemented by the control device 70 controlling the controlled device based on input information input to the control device 70, setting information stored in the control device 70, or acquired information acquired by a data acquisition device, but the present invention is not limited to this. The plating solution management method may also be implemented by a human controlling the controlled device based on preset setting information and acquired information acquired by a data acquisition device.

[0109] <Action and effect> The functions and effects of the plating apparatus 100, the control device 70, the program 80, and the plating solution management method according to the first embodiment of the present disclosure will be described.

[0110] The plating apparatus 100 according to the first embodiment of the present disclosure includes a plating tank 11 in which a plating solution 2 is stored, a cooling device 22 that cools the plating solution 2 supplied from the plating tank 11 to precipitate metal salts, a precipitation tank 21 that stores the metal salts precipitated by the cooling device 22, a first flow path 23 for supplying the plating solution 2 from the plating tank 11 to the precipitation tank 21, and a second flow path 24 for supplying the plating solution 2 in which the metal salts have been precipitated from the precipitation tank 21 to the plating tank 11.

[0111] The control device 70 according to the first embodiment of the present disclosure includes a supply control unit 72a that supplies the plating solution 2 from the plating tank 11 in which the plating solution 2 is stored to the precipitation tank 21, and a precipitation control unit 72b that cools the plating solution 2 supplied to the precipitation tank 21 using a cooling device 22 provided in the precipitation tank 21 to precipitate metal salts in the precipitation tank 21. The supply control unit 72a controls the supply of the plating solution 2 in which the metal salts have been precipitated by the precipitation control unit 72b from the precipitation tank 21 to the plating tank 11.

[0112] The program 80 according to the first embodiment of the present disclosure enables a computer to perform the following functions: supplying the plating solution 2 from the plating tank 11 in which the plating solution 2 is stored to the precipitation tank 21; cooling the plating solution 2 supplied to the precipitation tank 21 using the cooling device 22 provided in the precipitation tank 21 to precipitate metal salts in the precipitation tank 21; and supplying the plating solution 2 in which the metal salts have been precipitated from the precipitation tank 21 to the plating tank 11.

[0113] The plating solution management method according to the first embodiment of the present disclosure includes the steps of supplying the plating solution 2 from the plating tank 11 in which the plating solution 2 is stored to the precipitation tank 21, cooling the plating solution 2 supplied to the precipitation tank 21 using a cooling device 22 provided in the precipitation tank 21 to precipitate metal salts in the precipitation tank 21, and supplying the plating solution 2 from which the metal salts have been precipitated from the precipitation tank 21 to the plating tank 11.

[0114] According to the plating apparatus 100, the control device 70, the program 80, and the plating solution management method according to the first embodiment of the present disclosure, it is possible to intentionally precipitate metal salts in the precipitation tank 21, thereby reducing the metal ion concentration of the plating solution 2 stored in the plating tank 11. Therefore, when the plating solution 2 is stored, it is possible to prevent metal salts from precipitating in the plating tank 11.

[0115] The plating apparatus 100, control device 70, program 80, and plating solution management method according to the first embodiment of the present disclosure are particularly effective when storing a plating solution 2 containing a high concentration of metal ions. In plating processes, a plating solution 2 containing a high concentration of metal ions can improve the film formation rate. When storing a plating solution 2 containing a high concentration of metal ions, if the plating solution 2 containing a high concentration of metal ions near its solubility at the processing temperature is left in a low-temperature, static environment, metal salts and additives may precipitate, potentially causing clogging or pump failure. The plating apparatus 100, program, and plating solution management method according to the first embodiment of the present disclosure can prevent metal salts from precipitating in the components of the plating apparatus 100, excluding the precipitation tank 21. This allows the metal ion concentration to be increased to near the saturated solubility of metal salts at the processing temperature, thereby further improving the film formation rate.

[0116] Furthermore, plating apparatus 100 according to the first embodiment of the present disclosure further includes a temperature raising device 52 that raises the temperature of plating solution 2 in which metal salts have been precipitated, thereby dissolving the metal salts contained in precipitation tank 21. Plating apparatus 100 that further includes temperature raising device 52 can dissolve the metal salts contained in precipitation tank 21 and return plating solution 2 to the metal ion concentration before the metal salts were precipitated. Therefore, plating apparatus 100 that further includes temperature raising device 52 can prevent metal salts from being precipitated in plating tank 11 when plating solution 2 is stored, and can also store plating solution 2 so that it can be used continuously.

[0117] Furthermore, the plating apparatus 100 according to the first embodiment of the present disclosure further includes a metal member 26 inside the precipitation tank 21. The plating apparatus 100 further including the metal member 26 can efficiently precipitate and dissolve the metal salt.

[0118] Plating apparatus 100 according to the first embodiment of the present disclosure further includes a second flow path pump 32 provided in second flow path 24, a first flow path on-off valve 42 provided in first flow path 23 for opening and closing first flow path 23, and a second flow path on-off valve 43 provided between precipitation tank 21 and second flow path pump 32 for opening and closing second flow path 24. Deposition tank 21 is disposed lower in the direction of gravity than plating tank 11, and plating solution 2 is supplied from plating tank 11 to precipitation tank 21 by opening first flow path on-off valve 42, and plating solution 2 having a metal salt precipitated therein is supplied from precipitation tank 21 to plating tank 11 by opening second flow path on-off valve 43 and driving second flow path pump 32. According to the plating apparatus 100, the plating solution 2 can be supplied from the plating tank 11 to the precipitation tank 21 by utilizing gravity, without disposing a pump in the first flow path 23. The plating solution 2 may pass through the first flow path 23 before metal salts are precipitated, and if a pump is disposed, plating solution 2 with a high metal ion concentration may remain in the pump. According to the plating apparatus 100, the plating solution 2 with a high metal ion concentration does not remain in the pump, and metal salts are not generated in the pump, which would cause clogging of the first flow path 23. Therefore, the frequency of maintenance of the plating apparatus 100 can be reduced.

[0119] Plating apparatus 100 according to the first embodiment of the present disclosure further includes a second flow path pump 32 provided in second flow path 24, a first flow path on-off valve 42 provided in first flow path 23 for opening and closing first flow path 23, and a second flow path on-off valve 43 provided between precipitation tank 21 and second flow path pump 32 for opening and closing second flow path 24. When first flow path on-off valve 42 and second flow path on-off valve 43 are opened and second flow path pump 32 is driven, plating solution 2 having precipitated metal salts circulates between plating tank 11 and precipitation tank 21. According to the plating apparatus 100, the plating solution 2, in which the metal ion concentration has been reduced by intentionally precipitating metal salts in the precipitation tank 21, can be circulated between the plating tank 11 and the precipitation tank 21. By passing the plating solution 2 with a low metal ion concentration through the same area as the plating solution 2 before the metal salts were precipitated, it is possible to prevent the plating solution 2 with a high metal ion concentration from remaining. Therefore, according to the plating apparatus 100, the precipitation of metal salts can be suppressed in the configuration of the plating apparatus 100 excluding the precipitation tank 21.

[0120] Variation 1. A first modification of the first embodiment will be described. In the first embodiment, a plating apparatus 100 has been described in which a temperature raising device 52, which raises the temperature of the plating solution 2 stored in the precipitation tank 21, raises the temperature of the plating solution 2 from which metal salts have been precipitated, thereby dissolving the metal salts contained in the precipitation tank 21. In the first modification of the first embodiment, a plating apparatus 101 will be described in which temperature raising devices 53 and 54, which raise the temperature of the plating solution 2 circulated between the plating tank 11 and the precipitation tank 21 by the second flow path pump 32, dissolve the metal salts contained in the precipitation tank 21.

[0121] The configuration of a plating apparatus 101 according to a first modification of the first embodiment will be described with reference to Fig. 9. Fig. 9 is a schematic diagram showing an example of the plating apparatus 101.

[0122] 9, the plating apparatus 101 according to the first modification of the first embodiment includes a temperature raising device 53 that raises the temperature of the plating solution 2 circulating between the plating tank 11 and the precipitation tank 21. The temperature raising device 53 is an example of a temperature raising device that raises the temperature of the plating solution 2 in which a metal salt has been precipitated, thereby dissolving the metal salt contained in the precipitation tank 21, and corresponds to the temperature raising device 52 included in the plating apparatus 100 according to the first embodiment.

[0123] 9 shows an example in which a temperature raising device 53 is provided in the second flow path 24. The temperature raising device 53 is, for example, an indirect heating type heater in which hot water is stored, and is configured to raise the temperature of the plating solution 2 flowing through the second flow path 24 by using the hot water. The second flow path pump 32 and the temperature raising device 53 are driven to raise the temperature of the plating solution 2 stored in the precipitation tank 21. As shown in FIG. 9, when the second flow path pump 32 and the temperature raising device 53 are driven, the plating solution 2 stored in the precipitation tank 21 flows out from the precipitation tank 21 to the second flow path 24, is heated while passing through the second flow path 24, and returns to the precipitation tank 21 via the plating tank 11 and the first flow path 23. The second flow path pump 32 and the temperature raising device 53 can raise the temperature of the plating solution 2 stored in the deposition tank 21, thereby dissolving the metal salt contained in the deposition tank 21.

[0124] The temperature raising device 53 may be provided in the first flow path 23 as long as it can raise the temperature of the plating solution 2 circulating between the plating tank 11 and the precipitation tank 21. The temperature raising device 53 also includes the plating tank 11 and the temperature raising device 52 and plating tank temperature raising device 51 provided inside the plating tank 11. For example, when the temperature raising device 53 is provided in the first flow path 23, the second flow path pump 32 and the temperature raising device 53 are driven, causing the plating solution 2 stored in the precipitation tank 21 to flow from the precipitation tank 21 to the second flow path 24, flow through the plating tank 11 and the first flow path 23, be heated while passing through the first flow path 23, and return to the precipitation tank 21.

[0125] Next, a method for managing the plating solution 2 using the plating apparatus 101 according to Modification 1 of Embodiment 1 will be described. The method for managing the plating solution 2 using the plating apparatus 101 differs from the method for managing the plating solution 2 using the plating apparatus 100 according to Embodiment 1 in the dissolving step S400. The dissolving step S400 according to Modification 1 of Embodiment 1 will be described with reference to FIG.

[0126] 10 , in the dissolving step S400 according to the first modification of the first embodiment, first, the supply control unit 72a of the control device 70 circulates the plating solution 2, in which the metal salt has been precipitated by the cooling device 22, between the plating tank 11 and the precipitation tank 21. Specifically, first, the supply control unit 72a of the control device 70 opens the first flow path opening / closing valve 42 and the second flow path opening / closing valve 43 (step S413). Next, the supply control unit 72a of the control device 70 starts the second flow path pump 32 (step S414).

[0127] Next, the dissolution control unit 72d of the control device 70 heats the plating solution 2 in which the metal salt has been precipitated by the cooling device 22, thereby dissolving the metal salt contained in the precipitation tank 21. Specifically, the dissolution control unit 72d of the control device 70 activates the heating device 52 and the ultrasonic generator 27 (step S415). Next, the dissolution control unit 72d of the control device 70 determines whether the dissolution of the metal salt by the heating device 52 has been completed (step S416). The dissolution control unit 72d of the control device 70 makes this determination based on a dissolution completion flag. The dissolution completion flag is, for example, a flag that is set when a predetermined dissolution time has elapsed since the heating device 52 was activated, or a flag that is set when the metal ion concentration of the plating solution 2 in the precipitation tank 21 measured by the concentration analyzer 62 has reached or exceeded a predetermined metal ion concentration. The dissolution control unit 72d of the control device 70 determines that the dissolution of the metal salt precipitated in the precipitation tank 21 by the heating device 52 has been completed when either or both of the above flags are set. If it is determined that the dissolution of the metal salt precipitated in the precipitation tank 21 by the heating device 52 is not complete (No in step S416), the dissolution control unit 72d of the control device 70 repeats the determination until it is determined that the dissolution of the metal salt precipitated in the precipitation tank 21 by the heating device 52 is complete.If it is determined that the dissolution of the metal salt precipitated in the precipitation tank 21 by the heating device 52 is complete (Yes in step S416), the dissolution control unit 72d of the control device 70 stops the heating device 52 and the ultrasonic generator 27 (step S417).

[0128] Next, the supply control unit 72a of the control device 70 supplies the plating solution 2 having the metal salt dissolved therein to the plating tank 11. Specifically, the supply control unit 72a of the control device 70 closes the first flow path 23 for supplying the plating solution 2 from the plating tank 11 to the precipitation tank 21, and then stops the circulation of the plating solution 2 between the plating tank 11 and the precipitation tank 21, thereby supplying the plating solution 2 having the metal salt dissolved therein from the precipitation tank 21 to the plating tank 11. First, the supply control unit 72a of the control device 70 closes the first flow path opening / closing valve 42 (step S418). Next, the supply control unit 72a of the control device 70 determines whether the supply of the plating solution 2 from the precipitation tank 21 to the plating tank 11 has been completed (step S419). The method of determination by the supply control unit 72a of the control device 70 is the same as that of step S109 in the precipitation step S100. If it is determined that the supply of the plating solution 2 from the precipitation tank 21 to the plating tank 11 has not been completed (No in step S419), the supply control unit 72a of the control device 70 repeats the determination until it is determined that the transfer of the plating solution 2 from the precipitation tank 21 to the plating tank 11 has been completed. If it is determined that the supply of the plating solution 2 from the precipitation tank 21 to the plating tank 11 has been completed (Yes in step S419), the supply control unit 72a of the control device 70 stops the second flow path pump 32 (step S420) and then closes the second flow path opening / closing valve 43 (step S421).

[0129] As described above, the dissolving step S400 according to the first modification of the first embodiment of the present disclosure includes the steps of circulating the plating solution 2 in which the metal salt has been precipitated between the plating tank 11 and the precipitation tank 21 (S413-S414), raising the temperature of the plating solution 2 in which the metal salt has been precipitated by the heating device 52 that heats the plating solution 2 circulated between the plating tank 11 and the precipitation tank 21 to dissolve the metal salt contained in the precipitation tank 21 (S415-S417), and supplying the plating solution 2 in which the metal salt has been dissolved to the plating tank 11 (S418-S421). According to the dissolving step S400 according to the first modification of the first embodiment that includes the above steps, the metal salt contained in the precipitation tank 21 can be dissolved by raising the temperature of the plating solution 2 circulating between the plating tank 11 and the precipitation tank 21.

[0130] The plating apparatus 101 according to the first modification of the first embodiment of the present disclosure further includes a second flow path pump 32 provided in the second flow path 24, a first flow path on-off valve 42 provided in the first flow path 23 and configured to open and close the first flow path 23, a second flow path on-off valve 43 provided between the precipitation tank 21 and the second flow path pump 32 and configured to open and close the second flow path 24, and temperature raising devices 52 and 53 configured to raise the temperature of the plating solution 2 in which the metal salt has been precipitated to dissolve the metal salt contained in the precipitation tank 21. With the first flow path on-off valve 42 and the second flow path on-off valve 43 open and the second flow path pump 32 driven, the plating solution 2 in which the metal salt has been precipitated circulates between the plating tank 11 and the precipitation tank 21. The temperature raising devices 52 and 53 raise the temperature of the plating solution 2 circulating between the plating tank 11 and the precipitation tank 21. According to the plating apparatus 101, the plating solution 2 is heated while being circulated between the plating tank 11 and the precipitation tank 21, thereby making it possible to uniformize the temperature distribution of the plating solution 2 and the metal ion concentration distribution in the plating solution 2. Therefore, according to the plating apparatus 101, the metal salt contained in the precipitation tank 21 can be dissolved more efficiently than in the plating apparatus 100 of the first embodiment.

[0131] The temperature increasing device 53 may be integrated with a plating tank temperature increasing device 51 for increasing the temperature of the plating solution 2 stored in the plating tank 11. FIG. 11 shows a temperature increasing device 54 in which the temperature increasing device 53 for dissolving the metal salt contained in the precipitation tank 21 and the plating tank temperature increasing device 51 for increasing the temperature of the plating solution 2 stored in the plating tank 11 are integrated. As shown in FIG. 11, the temperature increasing device 54 is provided at a position where it can increase the temperatures of the circulation flow path 17 and the second flow path 24. When the plating apparatus 101 includes the temperature increasing device 54 instead of the temperature increasing device 53, the temperature increasing device 54 is operated in steps other than the storage step S300. Specifically, the temperature increasing device 54 is not started or stopped in steps S415 and S417 in FIG. 11.

[0132] Variation 2. Modification 2 of Embodiment 1 will be described. Modification 1 of Embodiment 1 described plating apparatus 101 in which heating devices 53, 54 that heat plating solution 2 circulated between plating tank 11 and precipitation tank 21 by second flow path pump 32 dissolve metal salt contained in precipitation tank 21. Modification 2 of Embodiment 1 described plating apparatus 102 in which heating device 55 that heats plating solution 2 that has precipitated metal salts is used to return to precipitation tank 21, and that flows out of precipitation tank 21 and returns to precipitation tank 21 by second flow path pump 32, dissolves metal salt contained in precipitation tank 21.

[0133] The configuration of a plating apparatus 102 according to Modification 2 of Embodiment 1 will be described with reference to Fig. 12. Fig. 12 is a schematic diagram of the plating apparatus 102.

[0134] As shown in FIG. 12, a plating apparatus 102 further includes a deposition tank circulation path 28 and a switching valve 44 in addition to the components of the plating apparatus 101 according to the first modification of the first embodiment.

[0135] The precipitation tank circulation flow path 28 is a flow path for returning the plating solution 2 containing deposited metal salts flowing out of the precipitation tank 21 to the precipitation tank 21. Specifically, the precipitation tank circulation flow path 28 is provided by branching off from the second flow path 24 downstream of the second flow path pump 32. The precipitation tank circulation flow path 28 connects the branch point of the second flow path 24 and the precipitation tank circulation flow path 28 to an inlet (not shown) provided in the precipitation tank 21.

[0136] The switching valve 44 is a valve provided at the branch point of the second flow path 24 and the precipitation tank circulation flow path 28. The switching valve 44 can switch the flow path of the plating solution 2 in which metal salts have been precipitated downstream of the branch point of the second flow path 24 and the precipitation tank circulation flow path 28 between the second flow path 24 and the precipitation tank circulation flow path 28.

[0137] The flow path of the plating solution 2 in which the metal salt has been precipitated is switched to the second flow path 24 by the switching valve 44, and the second flow path pump 32 is driven, whereby the plating solution 2 in which the metal salt has been precipitated is supplied from the precipitation tank 21 to the plating tank 11. Furthermore, the flow path of the plating solution 2 in which the metal salt has been precipitated is switched to the precipitation tank circulation flow path 28 by the switching valve 44, and the second flow path pump 32 is driven, whereby the plating solution 2 in which the metal salt has been precipitated flows out of the precipitation tank 21 and returns to the precipitation tank. The second flow path 24, the precipitation tank circulation flow path 28, and the second flow path pump 32 allow the plating solution 2 stored in the precipitation tank 21 to be circulated.

[0138] The temperature raising device 55 provided in the plating apparatus 102 raises the temperature of the plating solution 2 that flows out of the precipitation tank 21 and returns to the precipitation tank, thereby dissolving the metal salt contained in the precipitation tank 21. The temperature raising device 55 is provided, for example, downstream of the switching valve 44 in the second flow path 24. The temperature raising device 55 only needs to be able to raise the temperature of the plating solution 2 that flows out of the precipitation tank 21 and returns to the precipitation tank, and may be provided in the precipitation tank circulation flow path 28 or inside the precipitation tank 21.

[0139] Next, a method for managing the plating solution 2 using the plating apparatus 102 according to Modification 2 of Embodiment 1 will be described. The method for managing the plating solution 2 using the plating apparatus 102 differs from the method for managing the plating solution 2 using the plating apparatus 100 according to Embodiment 1 in the dissolving step S400. The dissolving step S400 according to Modification 2 of Embodiment 1 will be described with reference to FIG.

[0140] 13 , in the dissolving step S400 according to the second modification of the first embodiment, first, the supply control unit 72a of the control device 70 supplies the plating solution 2 in which the metal salt has been precipitated from the plating tank 11 to the precipitation tank 21. The specific processing procedure is the same as that of the dissolving steps S401-S403 according to the first embodiment.

[0141] Next, the supply control unit 72a of the control device 70 causes the plating solution 2 in which the metal salt has been precipitated to flow out of the precipitation tank 21 and return it to the precipitation tank. Specifically, first, the supply control unit 72a of the control device 70 switches the switching valve 44 to the precipitation tank circulation flow path 28 (step S422). Next, the supply control unit 72a of the control device 70 opens the second flow path opening / closing valve 43 (step S423). Then, the supply control unit 72a of the control device 70 starts the second flow path pump 32 (step S424).

[0142] Next, the dissolution control unit 72d of the control device 70 heats the plating solution 2 in which the metal salt has been precipitated, thereby dissolving the metal salt contained in the precipitation tank 21. Specifically, the dissolution control unit 72d of the control device 70 activates the temperature raising device 55 and the ultrasonic generator 27 (step S425). Next, the dissolution control unit 72d of the control device 70 determines whether or not the dissolution of the metal salt by the temperature raising device 55 has been completed (step S426). The determination method by the dissolution control unit 72d of the control device 70 is the same as that in step S416 of the dissolution step S400 according to the first modification of the first embodiment. If it is determined that the dissolution of the metal salt precipitated in the precipitation tank 21 by the temperature raising device 55 has not been completed (No in step S426), the dissolution control unit 72d of the control device 70 repeats the determination until it is determined that the dissolution of the metal salt precipitated in the precipitation tank 21 by the temperature raising device 55 has been completed. If it is determined that the dissolution of the metal salt precipitated in the precipitation tank 21 by the heating device 55 is completed (Yes in step S426), the dissolution control unit 72d of the control device 70 stops the heating device 55 and the ultrasonic generator 27 (step S427).

[0143] Next, the supply control unit 72a of the control device 70 supplies the plating solution 2 having the metal salt dissolved therein to the plating tank 11. Specifically, first, the supply control unit 72a of the control device 70 switches the switching valve 44 to the second flow path 24 (step S428). Next, the supply control unit 72a of the control device 70 determines whether the supply of the plating solution 2 from the precipitation tank 21 to the plating tank 11 has been completed (step S429). The determination method by the supply control unit 72a of the control device 70 is the same as that in step S419 of the dissolving step S400 according to the first modification of the first embodiment. If it is determined that the supply of the plating solution 2 from the precipitation tank 21 to the plating tank 11 has not been completed (No in step S429), the supply control unit 72a of the control device 70 repeats the determination until it is determined that the supply of the plating solution 2 from the precipitation tank 21 to the plating tank 11 has been completed. If it is determined that the supply of plating solution 2 from the precipitation tank 21 to the plating tank 11 has been completed (Yes in step S429), the supply control unit 72a of the control device 70 stops the second flow path pump 32 (step S430) and then closes the second flow path opening / closing valve 43 (step S431).

[0144] As described above, the dissolving step S400 according to the second modification of the first embodiment of the present disclosure includes the steps of (S422-S424) causing the plating solution 2 in which the metal salt has been precipitated to flow out from the precipitation tank 21 and return to the precipitation tank 21, (S425-S427) raising the temperature of the plating solution 2 in which the metal salt has been precipitated by the heating device 55 that raises the temperature of the plating solution 2 that flows out from the precipitation tank 21 and returns to the precipitation tank 21, thereby dissolving the metal salt contained in the precipitation tank 21, and (S428-S431) supplying the plating solution 2 in which the metal salt has been dissolved to the plating tank 11. According to the dissolving step S400 according to the second modification of the first embodiment, which includes the above steps, the metal salt contained in the precipitation tank 21 can be dissolved by raising the temperature of the plating solution 2 that flows out from the precipitation tank 21 and returns to the precipitation tank 21. By circulating the plating solution 2 in the deposition tank circulation flow path 28 while raising the temperature, the temperature distribution of the plating solution 2 and the metal ion concentration distribution in the plating solution 2 can be made uniform.

[0145] The plating apparatus 102 according to the second modification of the first embodiment of the present disclosure further includes a second flow path pump 32 provided in the second flow path 24, a first flow path on-off valve 42 provided in the first flow path 23 for opening and closing the first flow path 23, a second flow path on-off valve 43 provided between the precipitation tank 21 and the second flow path pump 32 for opening and closing the second flow path 24, a precipitation tank circulation flow path 28 branching off from the second flow path 24 downstream of the second flow path pump 32 for returning the plating solution 2 in which the metal salt has been precipitated to the precipitation tank 21, and a switching valve 44 for switching the flow path of the plating solution 2 in which the metal salt has been precipitated to either the second flow path 24 or the precipitation tank circulation flow path 28. Then, the flow path of the plating solution 2 in which the metal salt has been precipitated is switched to the precipitation tank circulation flow path 28 by the switching valve 44, and the second flow path pump 32 is driven, causing the plating solution 2 in which the metal salt has been precipitated to flow out of the precipitation tank 21 and return to the precipitation tank 21, and the temperature raising device 55 raises the temperature of the plating solution that flows out of the precipitation tank 21 and returns to the precipitation tank 21. According to the plating apparatus 102, the plating solution 2 is heated while circulating in the second flow path 24 and the precipitation tank circulation flow path 28, thereby making it possible to uniformize the temperature distribution of the plating solution 2 and the metal ion concentration distribution in the plating solution 2. Therefore, according to the plating apparatus 102, the metal salt contained in the precipitation tank 21 can be dissolved more efficiently than in the plating apparatus 100 of the first embodiment. Furthermore, since the flow path from which the plating solution flows back to the precipitation tank 21 is shorter than the flow path circulating between the plating tank 11 and the precipitation tank 21, the temperature loss during heating is reduced, and the metal salt contained in the precipitation tank 21 can be dissolved more efficiently.

[0146] Embodiment 2 In the first embodiment of the present disclosure, a plating apparatus 100 is described that includes a precipitation tank 21 having a volume smaller than that of the plating tank 11. In the second embodiment of the present disclosure, a plating apparatus 200 is described that includes a precipitation tank 221 having a volume equal to or larger than that of the plating tank 11. In the second embodiment, the same components as those in the first embodiment of the present disclosure are designated by the same reference numerals, and descriptions of the same or corresponding parts will be omitted. Hereinafter, a plating apparatus 200 according to the second embodiment will be described with reference to the drawings. The second embodiment of the present disclosure relates to the plating apparatus 200, a control device 270 that manages the plating solution 2 using the plating apparatus 200, a program that causes a computer to execute processing related to the management of the plating solution 2 using the plating apparatus 200, and a method for managing the plating solution using the plating apparatus 200.

[0147] First, the configuration of a plating apparatus 200 according to a second embodiment of the present disclosure will be described with reference to Fig. 14. Fig. 14 is a schematic diagram of the plating apparatus 200.

[0148] 14, the plating apparatus 200 includes a precipitation tank 221 having a volume equal to or greater than the volume of the plating tank 11. When the plating solution 2 stored in the plating tank 11 is supplied to the precipitation tank 221, all of the plating solution 2 stored in the plating tank 11 can be supplied to the precipitation tank 221 at one time.

[0149] Next, a method for managing the plating solution 2 using the plating apparatus 200 according to the second embodiment of the present disclosure will be described.

[0150] The method for managing the plating solution 2 using the plating apparatus 200 according to the second embodiment of the present disclosure differs from the method for managing the plating solution 2 using the plating apparatus 100 according to the first embodiment in the precipitation step S100 and the dissolution step S400. In the method for managing the plating solution 2 using the plating apparatus 200 according to the second embodiment of the present disclosure, all of the plating solution 2 stored in the plating tank 11 can be supplied to the precipitation tank 221 at one time, eliminating the need for step S112 in the precipitation step shown in FIG. 5 , in which the supply control unit 72a of the control device 70 determines whether to repeatedly perform steps S101-S111. Furthermore, in the method for managing the plating solution 2 using the plating apparatus 200 according to the second embodiment of the present disclosure, all of the plating solution 2 stored in the plating tank 11 can be supplied to the precipitation tank 221 at one time, eliminating the need for step S412 in the dissolution step S400 shown in FIG. 8 , in which the supply control unit 72a of the control device 70 determines whether to repeatedly perform steps S401-S411.

[0151] As described above, the precipitation tank 21 included in the plating apparatus 200 according to the second embodiment of the present disclosure has a volume equal to or greater than the volume of the plating tank 11. According to the plating apparatus 200 including the precipitation tank 21 having a volume equal to or greater than the volume of the plating tank 11, the plating solution 2 stored in the plating tank 11 can be supplied to the precipitation tank 21 all at once. Therefore, it is not necessary to repeatedly perform the steps of supplying the plating solution 2 from the plating tank 11 to the precipitation tank 21, cooling the plating solution 2 supplied to the precipitation tank 21 by the cooling device 22 included in the precipitation tank 21 to precipitate metal salts in the precipitation tank 21, and supplying the plating solution 2 in which the metal salts have been precipitated from the precipitation tank 21 to the plating tank 11, and thus the metal salts can be efficiently precipitated in the precipitation tank 21. Furthermore, there is no need to repeatedly perform the steps of supplying the plating solution 2 from the plating tank 11 to the precipitation tank 21, heating the plating solution 2 supplied to the precipitation tank 21 using the heating device 52 provided in the precipitation tank 21 to dissolve the metal salt contained in the precipitation tank 21, and supplying the plating solution 2 with the dissolved metal salt from the precipitation tank 21 to the plating tank 11, and therefore the metal salt can be efficiently dissolved in the precipitation tank 21.

[0152] Embodiment 3 In the second embodiment of the present disclosure, a plating apparatus 200 including a plating tank 11 and a precipitation tank 221 has been described. In the third embodiment of the present disclosure, a plating apparatus 300 including a stock tank 311 capable of increasing the volume of plating solution 2 will be described. In the third embodiment, the same components as those in the first embodiment of the present disclosure are designated by the same reference numerals, and descriptions of the same or corresponding parts will be omitted. Hereinafter, a plating apparatus 300 according to the third embodiment will be described with reference to the drawings. The third embodiment of the present disclosure relates to the plating apparatus 300, a control device 370 that manages the plating solution 2 using the plating apparatus 300, a program that causes a computer to execute processing related to the management of the plating solution 2 using the plating apparatus 300, and a method for managing the plating solution using the plating apparatus 300.

[0153] The configuration of a plating apparatus 300 according to a third embodiment of the present disclosure will be described with reference to Fig. 15. Fig. 15 is a schematic diagram of the plating apparatus 300.

[0154] As shown in FIG. 15, the plating apparatus 300 according to the third embodiment of the present disclosure further includes a stock tank 311, a connection flow path 317, and a connection flow path opening / closing valve 341 in addition to the plating apparatus 200 according to the second embodiment.

[0155] The stock tank 311 is a tank that stores the plating solution 2, similar to the plating tank 11. In other words, the stock tank 311 is a type of the plating tank 11. Specifically, the stock tank 311 is a tank for increasing the volume of the plating solution 2 that can be stored in the plating apparatus 300, and stores the plating solution 2 supplied from the plating tank 11. Increasing the volume of the plating solution 2 makes it less susceptible to the effects of trace amounts of impurity components, and therefore, when storing the plating solution 2 for a long period of time, it is possible to reduce the frequency of maintenance of the plating solution 2.

[0156] The stock tank 311 is provided below the plating tank 11 in the direction of gravity. The stock tank 311 is also provided in the circulation flow path 17. Specifically, the stock tank 311 is provided in the circulation flow path 17 between the circulation flow path on-off valve 41 and the circulation flow path pump 31. The circulation flow path 17 upstream of the stock tank 311 connects an outlet (not shown) provided in the plating tank 11 to an inlet (not shown) provided in the stock tank 311, and the circulation flow path 17 downstream of the stock tank 311 connects an outlet (not shown) provided in the stock tank 311 to an inlet (not shown) provided in the plating tank 11. Here, the inlet (not shown) provided in the stock tank 311 is located below the outlet (not shown) provided in the plating tank 11 in the direction of gravity. Therefore, when the circulation flow path on-off valve 41 is opened, the plating solution 2 stored in the plating tank 11 flows downward by gravity through the circulation flow path 17 upstream of the stock tank 311 and is supplied to the stock tank 311.

[0157] The connection flow path 317 is a flow path for supplying the plating solution 2 from the first space 15 of the plating tank 11 to the stock tank 311. The connection flow path 317 is provided with a connection flow path on-off valve 341 that opens and closes the connection flow path 317. By opening the connection flow path on-off valve 341 and the circulation flow path on-off valve 41, all of the plating solution 2 stored in the plating tank 11 can be supplied to the stock tank 311.

[0158] As described above, when the circulation flow path opening / closing valve 41 or the connection flow path opening / closing valve 341 is opened and the circulation flow path pump 31 is driven, the plating solution 2 circulates between the plating tank 11 and the stock tank 311.

[0159] The configuration, excluding the stock tank 311, the connection flow path 317, and the connection flow path on-off valve 341, is the same as that of the plating apparatus 200 according to the second embodiment. The first flow path 23 is a flow path for supplying the plating solution 2 stored in the plating tank 11 and the stock tank 311 from the plating tank 11 to the precipitation tank 221, and connects the plating tank 11 to the precipitation tank 221. The plating solution 2 supplied to the precipitation tank 221 via the first flow path 23 is cooled by the cooling device 22 of the precipitation tank 21, causing the metal salt to precipitate. The second flow path 24 is a flow path for supplying the plating solution 2 from which the metal salt has been precipitated from the precipitation tank 221 to the plating tank 11, and connects the precipitation tank 221 to the plating tank 11. By precipitating metal salts in the precipitation tank 221, the plating solution 2 with a reduced metal ion concentration flows through the second flow path 24 and is supplied to the plating tank 11, and then flows through the circulation flow path 17 or the connecting flow path 317 and is supplied to the stock tank 311.

[0160] Although the above example shows that the plating solution 2 stored in the plating tank 11 and the stock tank 311 is supplied from the plating tank 11 to the precipitation tank 221, it may also be supplied from the stock tank 311 to the precipitation tank 221. Furthermore, although the above example shows that the plating solution 2 in which a metal salt has been precipitated is supplied from the precipitation tank 221 to the plating tank 11, it may also be supplied from the precipitation tank 221 to the stock tank 311. In other words, the first flow path may be a flow path for supplying the plating solution 2 from the stock tank 311 to the precipitation tank 221, and the second flow path may be a flow path for supplying the plating solution 2 in which a metal salt has been precipitated from the precipitation tank 221 to the stock tank 311. FIG. 16 shows an example of a plating apparatus 301 including a first flow path 323 that is a flow path for supplying the plating solution 2 from the stock tank 311 to the precipitation tank 221 and a second flow path 324 that is a flow path for supplying the plating solution 2 from the precipitation tank 21 to the stock tank 311.

[0161] 16, the first flow path 323 is a flow path for supplying the plating solution 2 from the stock tank 311 to the precipitation tank 221. Specifically, the first flow path 323 connects an outlet (not shown) provided in the bottom surface of the stock tank 311 to an inlet (not shown) provided in the precipitation tank 221. Here, the inlet provided in the precipitation tank 221 is located lower in the direction of gravity than the outlet provided in the stock tank 311. The plating solution 2 flowing through the first flow path 323 is supplied from the stock tank 311 to the precipitation tank 221 by gravity. Furthermore, the outlet provided in the stock tank 311 is preferably provided in the bottom surface of the stock tank 311 so that the plating solution 2 flows out by utilizing gravity.

[0162] The second flow path 324 is a flow path for supplying the plating solution 2 in which the metal salt has been precipitated from the precipitation tank 21 to the stock tank 311. Specifically, it connects an outlet (not shown) provided in the precipitation tank 21 to an inlet (not shown) provided in the stock tank 311. The outlet provided in the precipitation tank 21 is preferably provided in the lower part of the precipitation tank 21 to prevent the plating solution 2 from remaining in the precipitation tank 21.

[0163] The stock tank 311 may be provided with a stock tank heating device 56 therein. The stock tank heating device 56 is a device for heating the plating solution 2 supplied to the stock tank 311. When the stock tank heating device 56 is provided, temperature unevenness in the plating tank 311 is less likely to occur, improving the quality of the plating process.

[0164] According to the plating apparatus 300, control device 370, program, and plating solution management method of embodiment 3 of the present disclosure, in the plating apparatus 300 equipped with the stock tank 311, when the plating solution 2 is stored, the precipitation of metal salts in the plating tank 11 and the stock tank 311 can be suppressed.

[0165] Although the present disclosure has been described above based on the embodiments, the present disclosure is not limited to the embodiments. Furthermore, appropriate combinations, modifications, or omissions of the embodiments are also within the scope of the technical ideas shown in the embodiments.

[0166] Various aspects of the present disclosure are summarized below as appendices.

[0167] (Appendix 1) a plating tank in which a plating solution is stored; a precipitation tank having a cooling device that cools the plating solution supplied from the plating tank to precipitate metal salts, and that contains the metal salts precipitated by the cooling device; a first flow path for supplying a plating solution from the plating tank to the deposition tank; a second flow path for supplying a plating solution containing a deposited metal salt from the deposition tank to the plating tank; A plating apparatus comprising: (Appendix 2) The plating apparatus further includes a temperature raising device for raising the temperature of the plating solution in which the metal salt has been precipitated, to dissolve the metal salt contained in the precipitation tank. 10. The plating apparatus of claim 1. (Appendix 3) The deposition tank further includes a metal member therein. 10. The plating apparatus of claim 1 or 2. (Appendix 4) The deposition tank has a volume equal to or greater than the volume of the plating tank. 4. The plating apparatus according to claim 1, wherein the plating apparatus is a plating apparatus having a first surface and a second surface. (Appendix 5) a second flow path pump provided in the second flow path; a first flow path opening / closing valve provided in the first flow path and configured to open and close the first flow path; a second flow path on-off valve provided between the precipitation tank and the second flow path pump, for opening and closing the second flow path; Furthermore, the deposition tank is disposed lower than the plating tank in the direction of gravity, the first flow path on-off valve is opened, so that the plating solution is supplied from the plating tank to the precipitation tank; The second flow path opening / closing valve is opened and the second flow path pump is driven, whereby the plating solution in which the metal salt has been precipitated is supplied from the precipitation tank to the plating tank. 5. The plating apparatus according to any one of claims 1 to 4. (Appendix 6) a second flow path pump provided in the second flow path; a first flow path opening / closing valve provided in the first flow path and configured to open and close the first flow path; a second flow path on-off valve provided between the precipitation tank and the second flow path pump, for opening and closing the second flow path; Furthermore, the first flow path opening / closing valve and the second flow path opening / closing valve are opened, and the second flow path pump is driven, whereby the plating solution in which the metal salt has been precipitated is circulated between the plating tank and the precipitation tank. 6. The plating apparatus according to any one of claims 1 to 5. (Appendix 7) The plating apparatus further includes a temperature raising device for raising the temperature of the plating solution in which the metal salt has been precipitated, to dissolve the metal salt contained in the precipitation tank, the temperature raising device raises the temperature of the plating solution circulating between the plating tank and the precipitation tank; 7. The plating apparatus of claim 6. (Appendix 8) a second flow path pump provided in the second flow path; a first flow path opening / closing valve provided in the first flow path and configured to open and close the first flow path; a second flow path on-off valve provided between the precipitation tank and the second flow path pump, for opening and closing the second flow path; a precipitation tank circulation flow path that branches off from the second flow path downstream of the second flow path pump and returns the plating solution in which the metal salt has been precipitated to the precipitation tank; a switching valve for switching a flow path of the plating solution in which the metal salt has been deposited to the second flow path or the deposition tank circulation flow path; a temperature raising device for raising the temperature of the plating solution in which the metal salt has been precipitated, thereby dissolving the metal salt contained in the precipitation tank; Furthermore, the flow path of the plating solution in which the metal salt has been precipitated is switched to the precipitation tank circulation flow path by the switching valve, and the second flow path pump is driven, so that the plating solution in which the metal salt has been precipitated flows out of the precipitation tank and returns to the precipitation tank; The temperature raising device raises the temperature of the plating solution that flows out of the deposition tank and returns to the deposition tank. 6. The plating apparatus according to any one of claims 1 to 5. (Appendix 9) a supply control unit that supplies the plating solution from a plating tank in which the plating solution is stored to a deposition tank; a deposition control unit that cools the plating solution supplied to the deposition tank using a cooling device provided in the deposition tank to deposit metal salts in the deposition tank, the supply control unit controls the supply of the plating solution in which the metal salt has been precipitated by the precipitation control unit from the precipitation tank to the plating tank. Control device. (Appendix 10) On the computer, A function of supplying plating solution from a plating tank in which the plating solution is stored to a deposition tank; a function of cooling the plating solution supplied to the deposition tank by a cooling device provided in the deposition tank to deposit metal salts in the deposition tank; a function of supplying a plating solution in which a metal salt has been precipitated from the precipitation tank to the plating tank; A program to achieve this. (Appendix 11) supplying the plating solution from a plating tank storing the plating solution to a precipitation tank; a step of cooling the plating solution supplied to the precipitation tank by a cooling device provided in the precipitation tank to precipitate a metal salt in the precipitation tank; supplying the plating solution containing the metal salt from the deposition tank to the plating tank; A plating solution management method comprising: [Explanation of symbols]

[0168] 1. Plated object 2. Plating solution 10 Plating process mechanism 11 Plating tank 12 Anode electrode 13 Power supply 14 Overflow Wall 15 1st space 16 Second space 17 Circulation flow path 18 Circulation flow path filter 20 Storage and Processing Organization 21, 221 Precipitation tank 22 Cooling device 23, 323 First channel 24, 324 Second flow path 25 Second flow path filter 26 Metallic parts 27 Ultrasonic generator 28 Precipitation tank circulation flow path 31 Circulation flow path pump 32 Second flow path pump 41 Circulation flow path on-off valve 42 First flow path on-off valve 43 Second flow path on-off valve 44 Switching valve 51 Plating tank heating device 52, 53, 54, 55 Heating device 56 Stock tank heating device 61 Liquid level gauge 62 Concentration analyzer 70, 270, 370 control device 71 Communications Department 72 Control Unit 72a Supply control section 72b Deposition control section 72c Storage Control Section 72d Melting Control Section 73 Memory section 80 Programs 100, 101, 102, 200, 300, 301 Plating equipment 311 Stock Tank 341 Connection flow path on-off valve 701 Arithmetic equipment 702 Storage device 703 Auxiliary storage 704 Communication equipment 705 Input Device 706 Output Device 707 Signal Line

Claims

1. a plating tank in which a plating solution is stored; a precipitation tank having a cooling device that cools the plating solution supplied from the plating tank to precipitate metal salts, and that contains the metal salts precipitated by the cooling device; a first flow path for supplying a plating solution from the plating tank to the deposition tank; a second flow path for supplying a plating solution containing a deposited metal salt from the deposition tank to the plating tank; A plating apparatus comprising:

2. The plating apparatus further includes a temperature raising device for raising the temperature of the plating solution in which the metal salt has been precipitated, to dissolve the metal salt contained in the precipitation tank. The plating apparatus according to claim 1 .

3. The deposition tank further includes a metal member therein. The plating apparatus according to claim 1 .

4. The deposition tank has a volume equal to or greater than the volume of the plating tank. The plating apparatus according to claim 1 .

5. a second flow path pump provided in the second flow path; a first flow path opening / closing valve provided in the first flow path and configured to open and close the first flow path; a second flow path on-off valve provided between the precipitation tank and the second flow path pump, for opening and closing the second flow path; Furthermore, the deposition tank is disposed lower than the plating tank in the direction of gravity, the first flow path on-off valve is opened, whereby the plating solution is supplied from the plating tank to the precipitation tank; the second flow path opening / closing valve is opened and the second flow path pump is driven, whereby the plating solution in which the metal salt has been precipitated is supplied from the precipitation tank to the plating tank. The plating apparatus according to claim 1 .

6. a second flow path pump provided in the second flow path; a first flow path opening / closing valve provided in the first flow path and configured to open and close the first flow path; a second flow path on-off valve provided between the precipitation tank and the second flow path pump, for opening and closing the second flow path; Furthermore, the first flow path opening / closing valve and the second flow path opening / closing valve are opened, and the second flow path pump is driven, whereby the plating solution in which the metal salt has been precipitated is circulated between the plating tank and the precipitation tank. The plating apparatus according to claim 1 .

7. The plating apparatus further includes a temperature raising device for raising the temperature of the plating solution in which the metal salt has been precipitated, to dissolve the metal salt contained in the precipitation tank, the temperature raising device raises the temperature of the plating solution circulating between the plating tank and the precipitation tank; The plating apparatus according to claim 6.

8. a second flow path pump provided in the second flow path; a first flow path opening / closing valve provided in the first flow path and configured to open and close the first flow path; a second flow path on-off valve provided between the precipitation tank and the second flow path pump, for opening and closing the second flow path; a precipitation tank circulation flow path that branches off from the second flow path downstream of the second flow path pump and returns the plating solution in which the metal salt has been precipitated to the precipitation tank; a switching valve for switching a flow path of the plating solution in which the metal salt has been deposited to the second flow path or the deposition tank circulation flow path; a temperature raising device for raising the temperature of the plating solution in which the metal salt has been precipitated, thereby dissolving the metal salt contained in the precipitation tank; Furthermore, the flow path of the plating solution in which the metal salt has been precipitated is switched to the precipitation tank circulation flow path by the switching valve, and the second flow path pump is driven, whereby the plating solution in which the metal salt has been precipitated flows out of the precipitation tank and returns to the precipitation tank; The temperature raising device raises the temperature of the plating solution that flows out of the deposition tank and returns to the deposition tank. The plating apparatus according to claim 1 .

9. a supply control unit that supplies the plating solution from a plating tank in which the plating solution is stored to a deposition tank; a deposition control unit that cools the plating solution supplied to the deposition tank using a cooling device provided in the deposition tank to deposit metal salts in the deposition tank, the supply control unit controls the supply of the plating solution in which the metal salt has been precipitated by the precipitation control unit from the precipitation tank to the plating tank. Control device.

10. On the computer, A function of supplying plating solution from a plating tank in which the plating solution is stored to a deposition tank; a function of cooling the plating solution supplied to the deposition tank by a cooling device provided in the deposition tank to deposit metal salts in the deposition tank; a function of supplying a plating solution in which a metal salt has been precipitated from the precipitation tank to the plating tank; A program to achieve this.

11. supplying the plating solution from a plating tank storing the plating solution to a precipitation tank; cooling the plating solution supplied to the precipitation tank by a cooling device provided in the precipitation tank to precipitate metal salts in the precipitation tank; supplying the plating solution containing the metal salt from the deposition tank to the plating tank; A plating solution management method comprising:

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