Cooling system and cooling method of cooling system

Abstract

To provide a cooling system capable of suppressing an increase in the temperature of cooling air discharged to the outside of a housing, and a cooling method of the cooling system.SOLUTION: The cooling system includes a liquid-cooled target component provided in the housing, an air-cooled target component provided in the housing, a first heat exchanger provided outside the housing and configured to cool the cooling liquid discharged from the liquid-cooled target component, a pump provided outside the housing and configured to send out the cooling liquid cooled by the first heat exchanger to the liquid-cooled target component, and cooling air provided inside the housing and into which the cooling air and the cooling liquid flowing through the liquid-cooled target component before being sent out by the pump are introduced. A second heat exchanger configured to exchange heat between the cooling air and the cooling liquid, wherein the cooling air is released to the outside of the housing after passing through the second heat exchanger.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a cooling system and a method for cooling a cooling system. [Background technology]

[0002] Heat-generating components such as electronic components can experience deterioration in their characteristics and shortened lifespan due to temperature rise. For this reason, cooling of these heat-generating components is being carried out. For example, a cooling system that cools liquid-cooled components and air-cooled components installed in a single housing is known (see, for example, Patent Documents 1 and 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] US Patent Application Publication No. 2023 / 0023542 [Patent Document 2] JP 2023-84244 A Summary of the Invention [Problem to be solved by the invention]

[0004] In order to cool liquid-cooled components installed inside a housing, a heat exchanger and pump installed outside the housing can be used to send coolant to the liquid-cooled components. In this case, if air-cooled components are installed inside the housing, the cooling air that cools the air-cooled components may be discharged outside the housing at a high temperature. If high-temperature cooling air is discharged outside the housing, the temperature in the room where the housing is installed may rise, which may increase the load on the air conditioner that adjusts the room temperature to an appropriate temperature.

[0005] One aspect of the present invention is to prevent the temperature of cooling air discharged to the outside of the housing from becoming too high. [Means for solving the problem]

[0006] In one aspect, the cooling system comprises a liquid-cooled component provided within a housing, an air-cooled component provided within the housing, a first heat exchanger provided outside the housing for cooling the cooling liquid discharged from the liquid-cooled component, a pump provided outside the housing for sending the cooling liquid cooled by the first heat exchanger to the liquid-cooled component, and a second heat exchanger provided within the housing into which cooling air that cools the air-cooled component and the cooling liquid sent by the pump before flowing through the liquid-cooled component are introduced, and which exchanges heat between the cooling air and the cooling liquid, and the cooling air is released outside the housing after passing through the second heat exchanger.

[0007] In one aspect, a cooling method for a cooling system includes a housing into which liquid-cooled components, air-cooled components, and a cooling liquid for cooling the liquid-cooled components and cooling air for cooling the air-cooled components are introduced, and a second heat exchanger for exchanging heat between the cooling liquid and the cooling air, and the cooling air is released outside the housing after passing through the second heat exchanger.When changing from a configuration in which the cooling liquid is circulated by a first pump provided inside the housing to a configuration in which the cooling liquid cooled by the first heat exchanger provided outside the housing is circulated by a second pump provided outside the housing, the cooling method switches from a first setting in which the cooling liquid discharged from the liquid-cooled components was introduced into the second heat exchanger to a second setting in which the cooling liquid delivered by the second pump is introduced into the second heat exchanger before flowing through the liquid-cooled components. [Effects of the Invention]

[0008] One aspect is that it is possible to prevent the temperature of the cooling air discharged outside the housing from becoming too high. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1(a) is a plan view of the cooling system according to the first embodiment, and FIG. 1(b) is a side view of the housing as seen from the −Y direction of FIG. 1(a). [Figure 2]FIG. 2(a) is a diagram showing a heat exchanger in the first embodiment, and FIG. 2(b) is a diagram showing a cooling water circulator in the first embodiment. [Figure 3] FIG. 3 is a diagram showing an overall view of an open-loop cooling system. [Figure 4] FIG. 4(a) is a plan view of the closed-loop cooling system, and FIG. 4(b) is a side view of the housing as seen from the −Y direction of FIG. 4(a). [Figure 5] FIG. 5(a) is a plan view of a cooling system according to a comparative example, and FIG. 5(b) is a side view of the housing as seen from the −Y direction of FIG. 5(a). [Figure 6] FIG. 6 is a diagram showing the flow of the coolant in the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments of the present invention will be described with reference to the drawings. [Example]

[0011] Fig. 1(a) is a plan view of a cooling system 100 according to a first embodiment, and Fig. 1(b) is a side view of the housing 11 as viewed from the -Y direction of Fig. 1(a). In Fig. 1(a), the solid arrows indicate the path of the coolant 50 sent from the heat exchanger 30 to the water-cooling device 12. The dotted arrows indicate the path of the coolant 50, which has cooled the water-cooling device 12, from the water-cooling device 12 to the heat exchanger 30.

[0012] 1(a) and 1(b), the cooling system 100 includes a device unit 10, a heat exchanger 30, and a coolant circulation device 40. The device unit 10 includes a housing 11, a water-cooling device 12 (a component to be liquid-cooled), an air-cooling device 13 (a component to be air-cooled), a radiator 14 (a second heat exchanger), a manifold 15, a connector 16, and one or more fans 17. The water-cooling device 12, the air-cooling device 13, the radiator 14, the manifold 15, the connector 16, and the fan 17 are provided inside the housing 11. The heat exchanger 30 and the coolant circulation device 40 are provided outside the housing 11.

[0013] The water-cooling device 12 is a heat-generating component such as an electronic component that is cooled by the flow of cooling liquid 50 delivered from the heat exchanger 30. The water-cooling device 12 is, for example, an optical module such as a QSFP (Quad Small Form-Factor Pluggable) or a high-power processor such as a DSP (Digital Signal Processor). The cooling liquid 50 is, for example, cooling water, but may be other liquids.

[0014] The air-cooled device 13 is a heat-generating component such as an electronic component that is cooled by cooling air 51 generated by driving the fan 17. The air-cooled device 13 is, for example, a low-power optical device or a low-power integrated circuit such as an FPGA (Field Programmable Gate Array). Therefore, the air-cooled device 13 generates less heat than the water-cooled device 12.

[0015] The reason why the water-cooling device 12 and the air-cooling device 13 are provided inside the housing 11 is as follows. If all the heat-generating components inside the housing 11 were water-cooled, the water-cooling structure would become complicated and large. On the other hand, if all the heat-generating components inside the housing 11 were air-cooled, the heat sinks for cooling the high-power heat-generating components would become large. For this reason, from the perspective of reducing the size and cost of the device, the water-cooling device 12 and the air-cooling device 13 are used in combination.

[0016] The heat exchanger 30 sends out coolant 50 to cool the water-cooling device 12, and sucks in the coolant 50 after it passes through and cools the water-cooling device 12. Thus, the coolant 50 circulates between the heat exchanger 30 and the water-cooling device 12. The heat exchanger 30 is, for example, a CDU (Coolant Distribution Unit). The heat exchanger 30 cools the secondary-side coolant 50 circulating between the heat exchanger 30 and the water-cooling device 12 with primary-side coolant 52 sent from a coolant circulation device 40 such as a chiller.

[0017] 2(a) is a diagram showing a heat exchanger 30 in the first embodiment, and FIG. 2(b) is a diagram showing a cooling water circulator 40 in the first embodiment. As shown in FIG. 2(a), the heat exchanger 30 includes a heat exchanger 31 (first heat exchanger) and a pump 32. The heat exchanger 31 exchanges heat between primary-side cooling water 52, for example, at 15°C to 25°C, introduced from the cooling water circulator 40 and secondary-side cooling liquid 50 introduced from the device unit 10, and cools the cooling liquid 50 with the cooling water 52. The pump 32 sends the cooling liquid 50 cooled by the heat exchanger 31 toward the water-cooling device 12.

[0018] 2(b), the cooling water circulation device 40 includes a heat exchanger 41, a pump 42, and a water tank 43. The heat exchanger 41 is, for example, an air-cooled type, and cools the cooling water 52 circulated through the heat exchange device 30 by exchanging heat with cooling air. The water tank 43 stores the cooling water 52 that has passed through the heat exchanger 41. The pump 42 sends the cooling water 52 stored in the water tank 43 toward the heat exchange device 30.

[0019] As shown in FIGS. 1(a) and 1(b), the heat exchanger 30 is connected to the connector 16 via pipes 60a and 60b. The connector 16 has, for example, four pairs of connection ports 18 and 19. The pipe 60a is connected to the heat exchanger 30 via a single pipe, branches into four pipes between the heat exchanger 30 and the connector 16, and is connected to the four connection ports 18 on one side of the pair of connection ports 18 and 19 on the connector 16. Similarly, the pipe 60b is connected to the heat exchanger 30 via a single pipe, branches into four pipes between the heat exchanger 30 and the connector 16, and is connected to the other four connection ports 19 on the connector 16. The heat exchanger 30 delivers the coolant 50 to the pipe 60a. The heat exchanger 30 draws the coolant 50 from the pipe 60b. The number of pairs of connection ports 18 and 19 is not limited to four, but may be one or more than four.

[0020] The connector 16 is connected to the manifold 15. The manifold 15 is connected to the radiator 14. The radiator 14 has a flow path 62. The manifold 15 has a flow path 61 and a flow path 65. One end of the flow path 61 of the manifold 15 is connected to the flow path 62 of the radiator 14, and the other end branches into four paths that are connected to the four connection ports 18 of the connector 16. Therefore, the flow path 61 merges the coolant 50 that flows in parallel to each other and is introduced into the four connection ports 18 of the connector 16, and causes the coolant 50 to flow into the flow path 62 of the radiator 14. In this way, the coolant 50 delivered by the heat exchanger 30 is introduced into the radiator 14 via the connector 16 and the manifold 15. A flow path 63 that connects the radiator 14 and the water-cooling device 12 is provided in the housing 11. Therefore, the coolant 50 that has passed through the flow path 62 of the radiator 14 flows through the flow path 63 and is introduced into the water-cooling device 12.

[0021] The coolant 50 that has passed through the water-cooling device 12 and cooled the water-cooling device 12 is discharged into a flow path 64 provided in the housing 11. The flow path 64 is connected to one end of a flow path 65 of the manifold 15. The other end of the flow path 65 is branched into four paths that are connected to the four connection ports 19 of the connector 16. Therefore, the coolant 50 discharged from the water-cooling device 12 into the flow path 64 flows through the pipe 60b via the manifold 15 and the connection ports 19 of the connector 16, and enters the heat exchanger 30.

[0022] When the fan 17 is driven, cooling air 51 is generated that flows inside the housing 11. The cooling air 51 hits the heat sink that is in contact with the air-cooling device 13. Therefore, the air-cooling device 13 is cooled by the cooling air 51. The cooling air 51 is introduced into the radiator 14, which is arranged downstream of the air-cooling device 13 in the flow of the cooling air 51. After passing through the radiator 14, the cooling air 51 is discharged to the outside of the housing 11 via the fan 17. No components to be cooled are provided between the fan 17 and the radiator 14, or downstream of the fan 17 in the flow of the cooling air 51. The cooling air 51 is discharged directly from the fan 17 to the outside of the housing 11.

[0023] A cooling system in which the heat exchanger 30 and the cooling water circulator 40 are provided outside the housing 11, as in the first embodiment, is called an open-loop cooling system. FIG. 3 is a diagram showing an overall view of an open-loop cooling system. As shown in FIG. 3, a rack 70 accommodating a plurality of device units 10, the heat exchanger 30, and an air conditioner 71 are provided indoors. The cooling water circulator 40 is provided outdoors. The air conditioner 71 is provided to adjust the temperature of a room 72 in which the rack 70 is installed to an appropriate temperature. Although the example shown is one in which the heat exchanger 30 is provided in the room 72 without being housed in the rack 70, the heat exchanger 30 may also be housed in the rack 70.

[0024] In the open-loop cooling system, the cooling water circulation device 40 is installed outdoors, and the heat received by the coolant 50 when cooling the water-cooled device 12 is released outdoors from the cooling water circulation device 40. This has the advantage of suppressing the temperature rise in the room 72 where the device unit 10 is installed, thereby reducing the load on the air conditioner 71.

[0025] In addition to open-loop cooling systems, closed-loop cooling systems are also known. Closed-loop cooling systems have a pump installed inside a housing that contains a water-cooled device, and the pump circulates a coolant that cools the water-cooled device.

[0026] Fig. 4(a) is a plan view of the closed-loop cooling system 200, and Fig. 4(b) is a side view of the housing 11 as viewed from the -Y direction of Fig. 4(a). In Fig. 4(a), the solid arrows indicate the path that the coolant 50 sent from the pump 25 takes to reach the water-cooling device 12. The dotted arrows indicate the path that the coolant 50 takes from the water-cooling device 12 after cooling the water-cooling device 12 to the pump 25.

[0027] 4(a) and 4(b), in the closed-loop cooling system, the heat exchanger 30 and the cooling water circulator 40 are not provided outside the housing 11. One or more pumps 25 are provided inside the housing 11 instead of the connector 16. The pumps 25 deliver the cooling liquid 50 to be introduced into the water-cooling device 12.

[0028] The coolant 50 delivered by the pump 25 flows through a flow path 65 of the manifold 15 and a flow path 64 in the housing 11, and is introduced into the water-cooled device 12. In this way, the coolant 50 is introduced into the water-cooled device 12 without passing through the radiator 14. After passing through the water-cooled device 12 and cooling it, the coolant 50 flows through a flow path 63 in the housing 11 and enters a flow path 62 of the radiator 14. The radiator 14 exchanges heat between the coolant 50 discharged from the water-cooled device 12 and the cooling air 51. Since the temperature of the coolant 50 that has cooled the water-cooled device 12 is higher than that of the cooling air 51, the coolant 50 is cooled by the cooling air 51. The coolant 50 cooled by the radiator 14 flows through a flow path 61 of the manifold 15 and is drawn into the pump 25. The other configurations are the same as those in the first embodiment, and therefore description thereof will be omitted.

[0029] In a closed-loop cooling system, the coolant 50, whose temperature has increased by cooling the water-cooling device 12, is cooled by the cooling air 51 in the radiator 14 before flowing into the pump 25. This is because if the coolant 50 at a high temperature flows into the pump 25, the pump 25 becomes more susceptible to breakdowns, shortening the life of the pump 25.

[0030] [Comparative Example] A comparative example will be described in which the closed-loop cooling system shown in FIGS. 4(a) and 4(b) is changed to an open-loop cooling system.

[0031] Fig. 5(a) is a plan view of a cooling system 500 according to a comparative example, and Fig. 5(b) is a side view of the housing 11 as viewed from the -Y direction of Fig. 5(a). As in Fig. 1(a), Fig. 5(a) also shows with solid arrows the path along which the coolant 50 sent from the heat exchanger 30 reaches the water-cooling device 12. The path along which the coolant 50, having cooled the water-cooling device 12, reaches the heat exchanger 30 from the water-cooling device 12 is shown with dotted arrows.

[0032] As shown in Figures 5(a) and 5(b), pump 25 of the closed-loop cooling system shown in Figures 4(a) and 4(b) is replaced with connector 16. Pipes 60a and 60b connected to heat exchanger 30 are connected to connection ports 18 and 19 of connector 16. This allows the closed-loop cooling system to be converted into an open-loop cooling system.

[0033] In the comparative example, even when the open-loop system is used, the flow direction of the coolant 50 is the same as in the closed-loop system. That is, in the comparative example, the coolant 50 discharged from the heat exchanger 30 flows from the connection port 19 of the connector 16 into the flow path 65 of the manifold 15. The coolant 50 flows from the flow path 65 through a flow path 64 and is introduced into the water-cooled device 12. After passing through the water-cooled device 12 and cooling it, the coolant 50 flows through a flow path 63 and is introduced into the flow path 62 of the radiator 14. The coolant 50 that has passed through the flow path 62 flows through a flow path 61 of the manifold 15, then flows from the connection port 18 of the connector 16 through a pipe 60a and is drawn into the heat exchanger 30.

[0034] As described above, in the comparative example, the coolant 50 that has passed through the water-cooling device 12 and cooled the water-cooling device 12 is introduced into the flow path 62 of the radiator 14, so the temperature of the coolant 50 in the radiator 14 is higher than the temperature of the cooling air 51. For example, even when the cooling air 51, whose temperature has increased by cooling the air-cooling device 13, passes through the radiator 14, the water-cooling device 12 generates more heat than the air-cooling device 13, so the temperature of the coolant 50 in the radiator 14 is higher than that of the cooling air 51. When the coolant 50 and the cooling air 51 exchange heat in the radiator 14, the temperature of the cooling air 51 is increased by the coolant 50. Therefore, the high-temperature cooling air 51 is released to the outside of the housing 11.

[0035] 3, in the open-loop cooling system, the cooling water circulation device 40 is installed outdoors, which is expected to have the advantage of suppressing the temperature rise in the room 72 and reducing the load on the air conditioner 71. However, in the comparative example, the temperature of the cooling air 51 increases as a result of heat exchange with the coolant 50 in the radiator 14, and the heated cooling air 51 is released into the room 72. This may cause the temperature of the room 72 to rise, increasing the load on the air conditioner 71.

[0036] Therefore, when changing the closed-loop cooling system of FIG. 4(a) to an open-loop cooling system, in the first embodiment, the flow direction of the coolant 50 is reversed from that of the closed-loop cooling system, as shown in FIG. 1(a). That is, when changing from the closed-loop system in which the coolant 50 is circulated by the pump 25 (first pump) inside the housing 11 to the open-loop system in which the coolant 50 is circulated by the heat exchanger 30 (second pump) outside the housing 11, the following is done: The first setting (FIG. 4(a)), in which the coolant 50 discharged from the water-cooling device 12 is introduced into the radiator 14, is switched to the second setting (FIG. 1(a)), in which the coolant 50 delivered by the heat exchanger 30 is introduced into the radiator 14 before flowing through the water-cooling device 12.

[0037] As a result, the radiator 14 is introduced with the cooling air 51 and the coolant 50 delivered from the heat exchanger 30 before flowing through the water-cooling device 12. Because the temperature of the coolant 50 before flowing through the water-cooling device 12 is low, the cooling air 51 is cooled by the coolant 50 through heat exchange between the cooling air 51 and the coolant 50 in the radiator 14. The cooling air 51 is discharged to the outside of the housing 11 after passing through the radiator 14, preventing high-temperature cooling air 51 from being discharged to the outside of the housing 11. This prevents a temperature rise in the room 72 and an increase in the load on the air conditioner 71. Furthermore, with minimal changes and / or modifications, a closed-loop cooling system can be converted to an open-loop cooling system, which has the advantage of preventing a temperature rise in the room 72. Furthermore, the closed-loop cooling system and the open-loop cooling system can share components, thereby reducing costs.

[0038] 1(a) and 1(b), the cooling air 51 passes through the radiator 14 and is then discharged to the outside of the housing 11 without hitting the components to be cooled. This makes it possible to prevent high-temperature cooling air 51 from being discharged to the outside from the housing 11.

[0039] 1(a) and 1(b), the fan 17 and the radiator 14 are provided adjacent to each other without any components to be cooled in between. The cooling air 51 is discharged directly from the fan 17 to the outside of the housing 11. This prevents the high-temperature cooling air 51 from being discharged to the outside from the housing 11.

[0040] 1(a) and 1(b), the housing 11 is provided with a connector 16 having a plurality of connection ports 18 connected to pipes 60a through which the coolant 50 flows. The coolant 50 delivered from the heat exchanger 30 passes through the pipes 60a and is introduced into the plurality of connection ports 18 in parallel. This increases the flow rate of the coolant 50 introduced into the water-cooling device 12, thereby improving the cooling performance of the water-cooling device 12.

[0041] 1(a), a manifold 15 is provided between the connector 16 and the radiator 14. The manifold 15 has a flow path 61 that joins the coolant 50 flowing in parallel into the multiple connection ports 18 of the connector 16 and introduces the combined flow into the radiator 14. This simplifies the design of the radiator 14 because the radiator 14 only needs to be provided with a single flow path 62 through which the coolant 50 flows. Furthermore, because the length of the flow path 62 can be increased, the temperature of the cooling air 51 can be effectively lowered by the coolant 50 flowing through the flow path 62.

[0042] In addition, in the first embodiment, when changing the closed-loop cooling system 200 of Figures 4(a) and 4(b) to the open-loop cooling system 100 of Figures 1(a) and 1(b), the pump 25 is replaced with the connector 16 to which the heat exchanger 30 is connected. This allows the closed-loop cooling system 200 to be easily changed to the open-loop cooling system 100, which has the advantage of suppressing the temperature rise in the room 72.

[0043] In addition, in the first embodiment, the connector 16 in Figures 1(a) and 1(b) can be replaced with the pump 25 in Figures 4(a) and 4(b), which allows the open-loop cooling system 100 in Figure 1(a) to be changed to the closed-loop cooling system 200 in Figure 4(a).

[0044] In the first embodiment, the heat exchanger 30 may not be provided, and the pipes 60a and 60b may be connected to the cooling water circulator 40. In this case, the heat exchanger 41 of the cooling water circulator 40 in FIG. 2(b) serves as a first heat exchanger that cools the cooling liquid 50 discharged from the water-cooling device 12. The pump 42 serves as a pump (second pump) that sends the cooling liquid 50 cooled by the heat exchanger 41 to the water-cooling device 12. [Example]

[0045] FIG. 6 is a diagram showing the flow of coolant 50 in the second embodiment. As shown in FIG. 6, in the second embodiment, a plurality of water-cooling devices 12 are provided in a housing 11. A manifold 20 is provided between the radiator 14 and the water-cooling devices 12. The manifold 20 has a flow path 68 and a flow path 69. One end of the flow path 68 is connected to the flow path 62 of the radiator 14, and the other end is branched into three paths, each of which is connected to a flow path 63. As a result, the coolant 50 that has passed through the flow path 62 of the radiator 14 is branched into multiple paths by the manifold 20, flows through the multiple flow paths 63, and is introduced into the multiple water-cooling devices 12.

[0046] The coolant 50 that has passed through each of the multiple water-cooling devices 12 and cooled the water-cooling devices 12 is discharged into a flow path 64 connected to each of the multiple water-cooling devices 12. The multiple flow paths 64 are connected to a flow path 69 of the manifold 20. The flow paths 69 are combined into one and connected to one end of a flow path 67 inside the housing 11. The other end of the flow path 67 is connected to a flow path 65 of the manifold 15. As a result, the coolant 50 discharged into the multiple flow paths 64 from each of the multiple water-cooling devices 12 is combined into one in the manifold 20 and then flows into the manifold 15. The other configuration is the same as in Example 1, so a description thereof will be omitted.

[0047] As in the second embodiment, a plurality of water-cooling devices 12 may be provided in the housing 11. In this case, it is preferable to provide a manifold 20 that distributes the coolant 50 that has passed through the radiator 14 to the plurality of water-cooling devices 12.

[0048] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and various modifications and variations are possible within the scope of the gist of the present invention as defined in the claims.

[0049] In addition, the following supplementary notes are provided in relation to the above description. (Supplementary Note 1) A cooling system comprising: liquid-cooled components provided within a housing; air-cooled components provided within the housing; a first heat exchanger provided outside the housing for cooling the cooling liquid discharged from the liquid-cooled components; a pump provided outside the housing for sending the cooling liquid cooled by the first heat exchanger to the liquid-cooled components; and a second heat exchanger provided within the housing into which cooling air that cools the air-cooled components and the cooling liquid sent out by the pump before flowing through the liquid-cooled components are introduced, and which exchanges heat between the cooling air and the cooling liquid, wherein the cooling air is released to the outside of the housing after passing through the second heat exchanger. (Supplementary Note 2) The cooling system according to Supplementary Note 1, wherein the cooling air passes through the second heat exchanger and is then discharged outside the housing without hitting any components to be cooled. (Supplementary Note 3) The cooling system according to Supplementary Note 1 or 2, wherein the cooling air impinges on a component to be cooled before passing through the second heat exchanger. (Appendix 4) A cooling system as described in Appendix 1 or 2, further comprising a fan disposed within the housing for generating the cooling air, the fan and the second heat exchanger being disposed adjacent to each other without passing through a component to be cooled, and the cooling air being discharged directly from the fan to the outside of the housing. (Appendix 5) A cooling system as described in Appendix 1 or 2, further comprising a connector provided in the housing and having a plurality of connection ports to which pipes through which the cooling liquid flows are connected, and the cooling liquid discharged from the pump flows through the pipes and flows into the plurality of connection ports in parallel with each other. (Appendix 6) A cooling system as described in Appendix 5, comprising a manifold provided between the connector and the second heat exchanger, having a flow path that merges the cooling liquids flowing in parallel into the multiple connection ports into one and flows into the second heat exchanger. (Appendix 7) A cooling system as described in Appendix 1 or 2, in which a plurality of liquid-cooled components are provided in the housing and which is equipped with a manifold that distributes the cooling liquid that has passed through the second heat exchanger to the plurality of liquid-cooled components. (Appendix 8) A cooling method for a cooling system comprising liquid-cooled components, air-cooled components, and a second heat exchanger into which a cooling liquid for cooling the liquid-cooled components and cooling air for cooling the air-cooled components are introduced within a housing, and which exchanges heat between the cooling liquid and the cooling air, wherein the cooling air is discharged outside the housing after passing through the second heat exchanger, wherein when changing from a configuration in which the cooling liquid is circulated by a first pump provided within the housing to a configuration in which the cooling liquid cooled by the first heat exchanger provided outside the housing is circulated by a second pump provided outside the housing, the cooling method switches from a first setting in which the cooling liquid discharged from the liquid-cooled components was introduced into the second heat exchanger to a second setting in which the cooling liquid delivered by the second pump is introduced into the second heat exchanger before flowing through the liquid-cooled components. (Appendix 9) A cooling method for a cooling system described in Appendix 8, wherein switching from the first setting to the second setting is performed by replacing the first pump with a connector to which the second pump is connected. (Appendix 10) A cooling method for a cooling system according to Appendix 9, wherein the second setting can be switched to the first setting by replacing the connector with the first pump. [Explanation of symbols]

[0050] 10...device unit, 11...chassis, 12...water-cooled device (liquid-cooled component), 13...air-cooled device (air-cooled component), 14...radiator (second heat exchanger), 15...manifold, 16...connector, 17...fan, 18...connection port, 19...connection port, 25...pump (first pump), 30...heat exchanger, 31...heat exchanger (first heat exchanger), 32...pump (second pump), 40...cooling water circulation device, 50...coolant, 51...cooling air, 52...cooling water, 60a, 60b...piping, 61...flow path, 62...flow path, 63...flow path, 64...flow path, 65...flow path, 67...flow path, 68...flow path, 69...flow path, 70...rack, 71...air conditioner, 72...room, 100, 200, 500...cooling system

Claims

1. a liquid-cooled component provided within the housing; an air-cooled component provided in the housing; a first heat exchanger provided outside the housing and configured to cool the cooling liquid discharged from the liquid-cooled component; a pump provided outside the housing and configured to send the cooling liquid cooled by the first heat exchanger to the liquid-cooled component; a second heat exchanger provided in the housing, into which cooling air for cooling the air-cooled components and the cooling liquid delivered by the pump before flowing through the liquid-cooled components are introduced, and which exchanges heat between the cooling air and the cooling liquid; The cooling air is discharged to the outside of the housing after passing through the second heat exchanger.

2. The cooling system according to claim 1 , wherein the cooling air passes through the second heat exchanger and is then discharged to the outside of the housing without hitting any component to be cooled.

3. The cooling system according to claim 1 , wherein the cooling air blows against a component to be cooled before passing through the second heat exchanger.

4. a connector provided in the housing and having a plurality of connection ports to which pipes through which the cooling liquid flows are connected; The cooling system according to claim 1 or 2, wherein the coolant discharged from the pump flows through the piping and into the plurality of connection ports in parallel with one another.

5. 5. The cooling system according to claim 4, further comprising a manifold provided between the connector and the second heat exchanger, the manifold having a flow path that merges the cooling liquids flowing in parallel into the multiple connection ports into one flow path and flows into the second heat exchanger.

6. A cooling method for a cooling system including liquid-cooled components, air-cooled components, and a second heat exchanger into which a cooling liquid for cooling the liquid-cooled components and cooling air for cooling the air-cooled components are introduced, and which exchanges heat between the cooling liquid and the cooling air, the cooling air passing through the second heat exchanger and then being released to the outside of the housing, the method comprising: A cooling method for a cooling system, when changing from a configuration in which the cooling liquid is circulated by a first pump provided within the housing to a configuration in which the cooling liquid cooled by a first heat exchanger provided outside the housing is circulated by a second pump provided outside the housing, the method switches from a first setting in which the cooling liquid discharged from the liquid-cooled component is introduced into the second heat exchanger to a second setting in which the cooling liquid delivered by the second pump is introduced into the second heat exchanger before flowing through the liquid-cooled component.

7. The cooling method for a cooling system according to claim 6 , wherein the switching from the first setting to the second setting is performed by replacing the first pump with a connector to which the second pump is connected.

8. The cooling method of claim 7, wherein the second setting can be switched to the first setting by replacing the connector with the first pump.

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