Gas supply apparatus and processing apparatus

Abstract

To provide a gas supply device for supplying a plurality of types of gases to a plasma generation chamber, in which even when a combustible or corrosive gas leaks from a flow path, the gas is prevented from coming into contact with equipment constituting the flow path.SOLUTION: The gas supplying device 10A includes a first vessel 20 that stores a flammable or corrosive first gas, a second vessel 21 that stores a second gas of a gas type different from that of the first gas, a first flow path 22 through which the first gas flows, a second flow path 23 through which the second gas flows, a first vessel housing chamber 31 that houses the first vessel 20, and a casing 11 having a flow path housing chamber 32 that houses the first flow path 22 and the second flow path 23. The first container housing chamber 31 and the flow path housing chamber 32 are formed by partitioning the inside of the housing 11 by a partition wall 14, and both the first container housing chamber 31 and the flow path housing chamber 32 are forcibly exhausted.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a gas supply device that supplies a plurality of types of gases to a plasma generation chamber in which plasma is generated, and a processing apparatus that includes the gas supply device and performs a predetermined processing on an object. [Background technology]

[0002] In semiconductor manufacturing processes, processing equipment such as ion implantation equipment and plasma processing equipment, which include a plasma generation chamber in which plasma is generated, is used. Such processing equipment generally includes a gas supply device that supplies raw material gases, which serve as raw materials for plasma, to the plasma generation chamber. An example of such a gas supply device is the gas supply system disclosed in Patent Document 1.

[0003] The gas supply system disclosed in Patent Document 1 is used in semiconductor manufacturing process equipment such as an ion implanter, and includes a gas cabinet connected to the semiconductor manufacturing process equipment. The gas cabinet contains multiple gas cylinders for storing gases such as hydrides and halides, and a gas distribution system for supplying these gases to an ion source provided in the ion implanter. The cabinet is also configured to maintain a negative pressure inside for enhanced safety, allowing gases inside the cabinet to be forcibly exhausted to the outside.

[0004] In the gas supply device of Patent Document 1, the inside of the cabinet that houses the gas cylinder is under negative pressure. However, the cabinet of such a gas supply device generally houses devices such as a mass flow controller that monitors the flow rate of gas flowing through the piping and a pressure sensor that monitors the gas pressure in the piping. Because such devices generate static electricity, if the gas supply device supplies a flammable gas such as hydrogen and the gas leaks from the flow path, the devices may become a source of ignition.

[0005] Furthermore, if the gas supply device uses a corrosive gas, such as a gas containing chlorine, and the corrosive gas leaks from the flow path of the gas distribution system, the gas may corrode the equipment inside the cabinet. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Special Publication 2003-532034 Summary of the Invention [Problem to be solved by the invention]

[0007] A gas supply device used in a processing device such as an ion implantation device supplies multiple types of gases to a plasma generation chamber in which plasma is generated. When a flammable gas is supplied to the plasma generation chamber in such a gas supply device, it is necessary to prevent the flammable gas from coming into contact with equipment that could potentially become an ignition source in the event of a leak of the flammable gas.

[0008] Furthermore, in such a gas supply device, when a corrosive gas is supplied to the plasma generation chamber, it is also useful to prevent the corrosive gas from coming into contact with the equipment in the event of a leak of the corrosive gas, thereby suppressing corrosion of the equipment.

[0009] The present invention relates to a gas supply device that supplies multiple types of gases to a plasma generation chamber in which plasma is generated, and a processing device that is equipped with the gas supply device, and aims to prevent flammable or corrosive gas from coming into contact with equipment that makes up the flow path in a situation where the gas leaks from the flow path. [Means for solving the problem]

[0010] The gas supply device of the present invention is a gas supply device that supplies multiple types of gases to a plasma generation chamber in which plasma is generated, and includes a first container that stores a first gas that is flammable or corrosive, a second container that stores a second gas that is a different gas type from the first gas, a first flow path through which the first gas flows, a second flow path through which the second gas flows, a first container accommodating chamber that accommodates the first container, and a flow path accommodating chamber that accommodates the first flow path and the second flow path, and the housing has one or more partition walls that divide the interior of the housing into multiple spaces, the first container accommodating chamber and the flow path accommodating chamber are formed by dividing the interior of the housing by the partition walls, and both the first container accommodating chamber and the flow path accommodating chamber are forcibly evacuated.

[0011] In this configuration, the first container housing chamber for housing the first container and the flow path housing chamber for housing the first flow path and the second flow path are formed by dividing the interior of the housing by a partition wall, and the gas in the first container housing chamber and the gas in the flow path housing chamber are both forcibly exhausted. Therefore, if flammable or corrosive gas leaks from the first container, the gas will be discharged to the outside without flowing into the flow path storage chamber as the first container storage chamber is forcibly evacuated. Furthermore, if flammable or corrosive gas leaks from the first flow path in the flow path accommodating chamber, the gas will be discharged to the outside without remaining in the flow path accommodating chamber as the flow path accommodating chamber is forcibly evacuated.

[0012] The housing may further include a second storage chamber that is formed by dividing the interior of the housing with the partition wall and that stores the second container.

[0013] In this configuration, the second container housing chamber is formed by dividing the interior of the housing with a partition wall. In this case, the first container, the first flow path and the second flow path, and the second container are housed in the first container housing chamber, the flow path housing chamber, and the second container housing chamber, respectively, which are formed by dividing the interior of the housing.

[0014] The flow path accommodating chamber may have a first flow path region in which the first flow paths are concentrated and a second flow path region in which the second flow paths are concentrated, the first flow path region being located downstream of the second flow path region in a path along which the flow path accommodating chamber is exhausted, and the flow path accommodating chamber may be forcibly exhausted from the downstream side of the first flow path region in the path.

[0015] In this configuration, the first flow path region where the first flow paths are concentrated is located downstream of the second flow path region where the second flow paths are concentrated, so that even if the first gas leaks from the first flow paths, the gas is discharged to the outside of the flow path accommodating chamber without passing through the second flow path region.

[0016] Furthermore, the gas supply device of the present invention may be configured such that the first gas is flammable, a first device that is a potential ignition source and that constitutes the first flow path is disposed in the first flow path region, and a second device that is a potential ignition source and that constitutes the second flow path is disposed in the second flow path region.

[0017] In this configuration, if the first gas is flammable, the first and second devices, which could potentially become ignition sources if the first gas leaks from the first flow path, are disposed in the first and second flow path regions, respectively. Here, the first flow path region is located downstream of the second flow path region along the path through which the flow path housing chamber is evacuated. Therefore, gas leaking from the first flow path is discharged to the outside without passing through the second flow path region or remaining in the first flow path region. In other words, in this configuration, even if flammable gas leaks from the first flow path, the gas is prevented from coming into contact with the first and second devices, improving safety.

[0018] The gas supply device of the present invention may further include one or more partition members that divide the first flow path region into a region in which the first device is arranged and a region in which the first device is not arranged.

[0019] In this configuration, the partition member divides the first flow path region into a region where the first device is located and a region where the first device is not located. Therefore, even if a flammable first gas leaks in the region where the first device is not located, the partition member prevents the gas from flowing into the region including the first device, which is a potential ignition source. As a result, safety is further improved in the event of a leak of the first gas from the first flow path.

[0020] The processing apparatus of the present invention is a processing apparatus that performs a predetermined processing on an object, comprising a plasma generation chamber in which plasma is generated, and a gas supply device that supplies multiple types of gas to the plasma generation chamber, wherein the gas supply device comprises a first container that stores a first gas that is flammable or corrosive, a second container that stores a second gas that is a different gas type from the first gas, a first flow path through which the first gas flows, a second flow path through which the second gas flows, a first container accommodating chamber that accommodates the first container, and a flow path accommodating chamber that accommodates the first flow path and the second flow path, and the housing has one or more partition walls that divide the interior of the housing into multiple spaces, the first container accommodating chamber and the flow path accommodating chamber are formed by dividing the interior of the housing by the partition walls, and both the first container accommodating chamber and the flow path accommodating chamber are forcibly evacuated. [Effects of the Invention]

[0021] The gas supply device and the gas supply apparatus of the present invention can prevent flammable gas or corrosive gas from contacting devices that form the flow path when the gas leaks from the flow path. [Brief explanation of the drawings]

[0022] [Figure 1] 1 is a schematic diagram illustrating a gas supply device and a processing device according to an embodiment of the present invention. [Figure 2] FIG. 2 is a perspective view showing a gas supply device in the same embodiment. [Figure 3] FIG. 2 is a front view showing the gas supply device in the embodiment with the partition member removed. [Figure 4] FIG. 2 is a front view showing the gas supply device in the same embodiment with a partition member attached. [Figure 5] 4 is a longitudinal cross-sectional view of the gas supply device taken along line X1-X1 in FIG. 3 in the embodiment. [Figure 6] 5 is a longitudinal cross-sectional view of the gas supply device taken along line X2-X2 in FIG. 4 in the embodiment. [Figure 7]FIG. 10 is a schematic diagram showing a modified example of the gas supply device in the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0023] A gas supply device 10A according to one embodiment of the present invention and a processing device 100 including the gas supply device 10A will be described. Note that Figures 1 to 7 are created for the purpose of understanding the present invention, and the shapes, length ratios, and scale ratios of the components in the figures do not necessarily match.

[0024] FIG. 1 is a schematic diagram showing a gas supply device 10A according to this embodiment and a processing apparatus 100 including the gas supply device 10A. The processing apparatus 100 is an apparatus that includes a plasma generation chamber 111 described below and performs a predetermined process on a target object T. Specifically, the processing apparatus 100 of this embodiment is an ion implantation apparatus that is used in a semiconductor manufacturing process and implants ions into the target object T, which is a wafer.

[0025] As shown in FIG. 1, the processing apparatus 100 includes an ion source 110, an extraction electrode 120 for extracting an ion beam IB from the ion source 110, a mass analysis magnet 130 for mass-separating the ion beam IB and allowing it to pass, and a processing chamber 140 into which the ion beam IB is guided.

[0026] The processing apparatus 100 also includes a gas supply device 10A that can supply multiple types of gases to a plasma generation chamber 111 provided in the ion source 110. The gas supply device 10A can switch the type of gas supplied to the plasma generation chamber 111, and can also supply two or more types of gases to the plasma generation chamber 111 simultaneously.

[0027] The ion source 110 has a plasma generation chamber 111 and a cathode 112 that is heated and supplies thermoelectrons to the plasma generation chamber 111. The plasma generation chamber 111 is also formed with a gas inlet 113 for introducing gas supplied from the gas supply device 10A into the plasma generation chamber 111, and an extraction opening 114 for extracting the ion beam IB to the outside.

[0028] In the plasma generation chamber 111, plasma is generated from a raw material gas introduced from a gas inlet 113 and thermoelectrons emitted from a cathode 112. Then, an ion beam IB is extracted from the plasma generated in the plasma generation chamber 111 through an extraction opening 114. The ion beam IB extracted from the plasma generation chamber 111 is mass-separated by passing through a mass analysis magnet 130, and the ion beam IB containing predetermined ions is introduced into a processing chamber 140.

[0029] A target object T is placed in the processing chamber 140, and ions are implanted into the target object T by irradiating the target object T with an ion beam IB in the processing chamber 140. The processing apparatus 100 in this embodiment has the same configuration as an ion implantation apparatus commonly used in semiconductor manufacturing processes, except for being equipped with the gas supply apparatus 10A in this embodiment, and therefore a detailed description of the processing apparatus 100 will be omitted.

[0030] In this embodiment, the processing apparatus 100 is not limited to an ion implantation apparatus. The processing apparatus 100 may be any apparatus provided with a plasma generation chamber in which plasma is generated. For example, the processing apparatus 100 may be a plasma processing apparatus that irradiates the target T with plasma generated in the plasma generation chamber 111 without mass separation. The processing apparatus 100 may also be one that performs surface treatment on metal materials, plastic materials, etc. using plasma or an ion beam IB. In other words, the target T is not limited to a wafer, and may be a metal material or a plastic material.

[0031] FIG. 2 is a perspective view of the gas supply device 10A in this embodiment. 1 and 2, gas supply device 10A includes housing 11 made up of first box 12 and second box 13. As shown in Fig. 2, first box 12 is made up of a first main body 12a having a rectangular parallelepiped shape overall and one open side, and a first door 12b that opens and closes the opening of first main body 12a. Second box 13 is made up of a second main body 13a having a rectangular parallelepiped shape overall and one open side, and a second door 13b that opens and closes the opening of second main body 13a.

[0032] If the side of first body 12a on which the opening is formed is considered to be the front of first body 12a, and the side of second body 13a on which the opening is formed is considered to be the front of second body 13a, housing 11 is configured so that the wall portion that forms the back surface of first body 12a comes into contact with the wall portion that forms the side surface of second body 13a.

[0033] The gas supply device 10A includes one first container 20 for storing a flammable or corrosive first gas, and three second containers 21 for storing second gases that are different from the first gas. Note that the number of first containers 20 and the number of second containers 21 included in the gas supply device 10A are not limited to a specific number.

[0034] In this embodiment, the first gas is a flammable gas, such as hydrogen gas. The second gas is a non-flammable gas, such as BF3 gas, PF3 gas, or PH3 gas. Hereinafter, to facilitate understanding of this embodiment, the first gas may be referred to as a flammable gas, and the second gas may be referred to as a non-flammable gas.

[0035] Furthermore, the one first container 20 provided in the gas supply device 10A may be referred to as a flammable gas cylinder 20a, and the three second containers 21 may be referred to as a first non-flammable gas cylinder 21a, a second non-flammable gas cylinder 21b, and a third non-flammable gas cylinder 21c, respectively. Furthermore, the non-flammable gases stored in the first non-flammable gas cylinder 21a, the second non-flammable gas cylinder 21b, and the third non-flammable gas cylinder 21c may be referred to as a first non-flammable gas, a second non-flammable gas, and a third non-flammable gas, respectively.

[0036] It should be noted that the first container 20 and the second container 21 are not limited to being gas cylinders. For example, when the first gas is hydrogen, the first container 20 may be a container containing a hydrogen storage alloy therein.

[0037] The gas supply device 10A includes a first flow path 22 having one end connected to a first container 20 and the other end connected to an ion source 110. A first gas stored in the first container 20 flows through the first flow path 22 and is supplied to a plasma generation chamber 111 of the ion source 110.

[0038] Similarly, the gas supply device 10A includes three second flow paths 23, one end of which is connected to each second container 21 and the other end of which is connected to the ion source 110. The second gas stored in each second container 21 flows through the second flow paths 23 and is supplied to the plasma generation chamber 111 of the ion source 110. In this embodiment, the second flow paths 23, one end of which is connected to the first non-flammable gas cylinder 21a, the second non-flammable gas cylinder 21b, and the third non-flammable gas cylinder 21c, may be referred to as the first non-flammable gas flow path 23a, the second non-flammable gas flow path 23b, and the third non-flammable gas flow path 23c, respectively.

[0039] That is, the gas supply device 10A of this embodiment includes a first non-flammable gas flow path 23a, a second non-flammable gas flow path 23b, and a third non-flammable gas flow path 23c, each of which has one end connected to a first non-flammable gas cylinder 21a, a second non-flammable gas cylinder 21b, and a third non-flammable gas cylinder 21c, and the other end connected to the ion source 110.

[0040] The first non-combustible gas flows through the first non-combustible gas flow path 23a and is supplied to the plasma generation chamber 111 of the ion source 110. Similarly, the second non-combustible gas and the third non-combustible gas flow through the second non-combustible gas flow path 23b and the third non-combustible gas flow path 23c, respectively, and are supplied to the plasma generation chamber 111 of the ion source 110.

[0041] 3 is a front view of the gas supply device 10A, showing a state in which a partition member 17, which will be described later, has been removed. 2 and 3, the gas supply device 10A has a first container housing chamber 31, which is an area on one side formed by dividing the interior of a first main body 12a by a first partition wall 14 described later, and which houses a first container 20. In this embodiment, a flammable gas cylinder 20a is housed in the first container housing chamber 31.

[0042] The gas supply device 10A also has a flow path accommodating chamber 32, which is the other side region formed by dividing the interior of the first body 12a by the first partition wall 14, and which accommodates a partial region of the first flow path 22 and a partial region of each second flow path 23. Specifically, the flow path accommodating chamber 32 of this embodiment accommodates a partial region of the flammable gas flow path 22a, a partial region of the first non-flammable gas flow path 23a, a partial region of the second non-flammable gas flow path 23b, and a partial region of the third non-flammable gas flow path 23c.

[0043] As shown in Figures 1 and 2, the gas supply device 10A has a second container housing chamber 35 that houses three second containers 21, namely, a first non-flammable gas cylinder 21a, a second non-flammable gas cylinder 21b, and a third non-flammable gas cylinder 21c.

[0044] In the gas supply device 10A of this embodiment, as shown in FIG. 1, the internal space of the housing 11 is partitioned by a second partition wall 15, thereby forming a second container storage chamber .

[0045] In this embodiment, the second container storage chamber 35 is formed by the second main body 13a, and the second partition wall 15 in this embodiment is a wall portion that brings the first main body 12a and the second main body 13a into contact with each other.

[0046] In this embodiment, the back surface of first body 12a and the side surface of second body 13a are in contact with each other, so that first body 12a and second body 13a are substantially integrated to form housing 11. Therefore, in this embodiment, the internal space of first body 12a and the internal space of second body 13a are considered to be formed by partitioning the internal space of housing 11 by the walls that bring first body 12a and second body 13a into contact with each other.

[0047] As shown in Figures 2 and 3, the first partition wall 14 is composed of a bottom portion 14a on which the flammable gas cylinder 20a is placed, a ceiling portion 14b arranged horizontally so as to face the ceiling wall 13c of the first main body 12a, which is part of the housing 11, and a side portion 14c connecting the bottom portion 14a and the ceiling portion 14b and arranged vertically.

[0048] The gas supply device 10A includes an exhaust duct 16 connected to a first vent port 13d formed in the ceiling wall 13c of the housing 11. A through-hole (not shown) is formed in the bottom of the first main body 12a to allow gas to flow in from outside the housing 11. The gas supply device 10A is configured to forcibly exhaust air from the inside of the housing 11 through the exhaust duct 16 while the gas supply device 10A is operating, and the insides of the first container accommodating chamber 31 and the flow path accommodating chamber 32 are both under negative pressure.

[0049] More specifically, while the gas supply device 10A is operating, the gas in the first container housing chamber 31 flows from below toward the first vent port 13d and is forcibly exhausted through the first vent port 13d.

[0050] Furthermore, a second vent hole 14d is formed in the ceiling portion 14b of the first partition wall 14, and the second vent hole 14d is positioned lower than the first vent hole 13d. Therefore, while the gas supply device 10A is operating, the gas in the flow path accommodating chamber 32 flows from the bottom to the top, passes through the second vent hole 14d and the first vent hole 13d in this order, and is then forcibly exhausted to the outside through the exhaust duct 16.

[0051] Furthermore, in the gas supply device 10A, a through-hole may be formed in the second partition wall 15, which communicates the internal space of the first container accommodating chamber 31 with the internal space of the second container accommodating chamber 35. In this case, the inside of the second container accommodating chamber 35 is also brought to a negative pressure. That is, the gas in the second container accommodating chamber 35 enters the first container accommodating chamber 31 through the through-hole, and is then forcibly exhausted to the outside through the exhaust duct 16.

[0052] 2 and 3, the flow path accommodating chamber 32 has a first flow path region 33 where a part of the first flow path 22, i.e., a part of the flammable gas flow path 22a in this embodiment, is gathered together. The flow path accommodating chamber 32 also has a second flow path region 34 where a part of the second flow path 23, i.e., a part of the first non-flammable gas flow path 23a, the second non-flammable gas flow path 23b, and the third non-flammable gas flow path 23c in this embodiment, are gathered together.

[0053] The gas supply device 10A includes at least one first device 24a that is a potential ignition source and that forms part of the first flow path 22. The gas supply device 10A also includes at least one second device 24b that is a potential ignition source and that forms part of the second flow path 23. In this embodiment, each of the three second flow paths 23, i.e., the first non-flammable gas flow path 23a, the second non-flammable gas flow path 23b, and the third non-flammable gas flow path 23c, includes at least one second device 24b.

[0054] The first device 24a and the second device 24b are devices that generate static electricity during operation, such as a mass flow controller that controls the gas flow rate or a pressure sensor that monitors the gas pressure in the piping. The first device 24a and the second device 24b are not limited to a mass flow controller or a pressure sensor, and may be, for example, a pressure switch, a flow meter, a solenoid valve, or an electric valve.

[0055] In this embodiment, the first devices 24a that form part of the first flow path 22 are all arranged to be included in the first flow path region 33. In other words, all potential ignition sources that form part of the first flow path 22 are located within the first flow path region 33.

[0056] Further, the second devices 24b that form part of the second flow path 23 are all arranged to be included in the second flow path region 34. In other words, all potential ignition sources that form part of the second flow path 23 are located within the second flow path region 34.

[0057] The flow path accommodating chamber 32 may be considered to be divided into a first flow path region 33 in which one or more first devices 24a are arranged to be concentrated, and a second flow path region 34 in which one or more second devices 24b are arranged to be concentrated.

[0058] In the gas supply device 10A of this embodiment, the first flow path region 33 is located downstream of the second flow path region 34, ie, above the second flow path region 34, in the path along which the flow path accommodating chamber 32 is exhausted.

[0059] As shown in FIGS. 2 and 4, the gas supply device 10A further includes one or more partition members 17 that partition the first flow path region 33 into a device installation region 36a where the first device 24a is installed and a device non-installation region 36b where the first device 24a is not installed.

[0060] In this embodiment, the partition member 17 is arranged along the vertical direction, the equipment placement area 36a is formed on the opening side of the first main body 12a, and the equipment non-placement area 36b is formed on the back side of the first main body 12a.

[0061] The partition member 17 in this embodiment is a single plate material, and is configured to be detachable from the housing 11. The partition member 17 is formed with a through-hole 17a so that the partition member 17 can be attached and detached without interfering with the first device 24a.

[0062] When the first door 12b is open, the inside of the first main body 12a, i.e., the first container housing chamber 31 and the flow path housing chamber 32, are exposed to the outside. This allows an operator to replace the first container 20 (the flammable gas cylinder 20a in this embodiment) and inspect or replace parts of the piping members, first device 24a, second device 24b, etc. that constitute the second flow path 23 (the first non-flammable gas flow path 23a, the second non-flammable gas flow path 23b, and the third non-flammable gas flow path 23c in this embodiment).

[0063] In this case, when the first door 12b is open, the equipment placement area 36a is on the opening side of the first main body 12a, so the worker can inspect, replace, etc. the first equipment 24a. On the other hand, the presence of the partition member 17 prevents the worker from inspecting, replacing, etc. the components present in the equipment non-placement area 36b.

[0064] Therefore, when an operator inspects or replaces a component in the non-equipment area 36b, the operator first removes the partition member 17. Then, when the operator has finished the inspection or replacement, the partition member 17 is attached to the housing 11 again.

[0065] Furthermore, the first flow path 22 and the second flow path 23 are configured by connecting a plurality of piping members with a plurality of joints. Figures 2 to 4 schematically show a first joint 25a that is a joint that configures the first flow path 22 and a second joint 25b that is a joint that configures the second flow path 23. The first flow path 22 includes a plurality of first joints 25a, but only one of them is shown in Figures 2 to 4. Similarly, each first flow path 22 includes a plurality of second joints 25b, but only one of them is shown in Figures 2 to 4.

[0066] As shown in FIG. 6, the gas supply device 10A of this embodiment is configured so that all of the first fittings 25a arranged in the flow path accommodating chamber 32 are located in an equipment non-arrangement area 36b where the first equipment 24a is not arranged.

[0067] In addition, the second ventilation port 14d is positioned above the non-equipment placement area 36b, and the gas in the flow path storage chamber 32 always passes through the through hole 17a of the partition member 17, the second ventilation port 14d, and the first ventilation port 13d in that order, and is then discharged to the outside through the exhaust duct 16.

[0068] Therefore, for example, flammable gas leaking from first joint 25a is discharged to the outside through second vent 14d without entering equipment arrangement area 36a where first device 24a is arranged. Therefore, even if flammable gas leaks from first joint 25a, the gas is prevented from coming into contact with first device 24a and second device 24b, ensuring the safety of gas supply device 10A and processing device 100.

[0069] In the gas supply device 10A and processing device 100 of this embodiment, a first container storage chamber 31 that stores the first container 20 and a flow path storage chamber 32 that stores a portion of the first flow path 22 and a portion of the second flow path 23 are formed by dividing the interior of the first main body 12a of the housing 11 by a first partition wall 14.

[0070] While the gas supply device 10A is operating, a negative pressure is maintained within the first container housing chamber 31 and the flow path housing chamber 32. The gas within the first container housing chamber 31 passes through a first vent port 13d formed in the ceiling wall 13c of the housing 11 and is then discharged to the outside through the exhaust duct 16. Therefore, even if the first gas leaks from, for example, the first container 20 or a joint that constitutes the first flow path 22 and is disposed within the first container housing chamber 31, the gas will not enter the flow path housing chamber 32 or remain within the first container housing chamber 31 as the first container housing chamber 31 is forcibly evacuated, and will be discharged to the outside.

[0071] Furthermore, in the flow path accommodating chamber 32, for example, if the first gas leaks from the first fitting 25a that constitutes the first flow path 22, the gas will be discharged to the outside without remaining in the flow path accommodating chamber 32 as the flow path accommodating chamber 32 is forcibly evacuated.

[0072] When the first gas stored in the first container 20 is flammable, as described above, the leaked first gas does not enter the flow path housing chamber 32 from the first container housing chamber 31 and is discharged to the outside without remaining in the flow path housing chamber 32, thereby preventing the gas from coming into contact with the first device 24a and the second device 24b. This improves the safety of the gas supply device 10A and the processing device 100.

[0073] The first gas stored in the first container 20 may be a corrosive gas. Even in this case, the leaked first gas is prevented from coming into contact with the first device 24a and the second device 24b, thereby preventing corrosion of the first device 24a and the second device 24b. Examples of corrosive gases include, but are not limited to, chlorine-containing gases and fluorine-containing gases.

[0074] Furthermore, in gas supply device 10A, second container accommodating chamber 35 is formed by dividing housing 11 with second partition wall 15. Therefore, flammable gas cylinder 20a, flammable gas flow path 22a, first non-flammable gas flow path 23a, second non-flammable gas flow path 23b, third non-flammable gas flow path 23c, first non-flammable gas cylinder 21a, second non-flammable gas cylinder 21b, third non-flammable gas cylinder 21c are accommodated in first container accommodating chamber 31, flow path accommodating chamber 32, and second container accommodating chamber 35, respectively, which are formed by dividing the interior of one housing 11.

[0075] In addition, in the gas supply device 10A, the flow path accommodating chamber 32 is divided into a first flow path region 33 in which a portion of the first flow path 22 is concentrated, and a second flow path region 34 in which a portion of the second flow path 23 (in this embodiment, the first non-flammable gas flow path 23a, the second non-flammable gas flow path 23b, and a portion of the third non-flammable gas flow path 23c) is concentrated.

[0076] The first flow path region 33 is located downstream of the second flow path region 34 in the path through which the flow path accommodating chamber 32 is exhausted. Furthermore, the flow path accommodating chamber 32 is forcibly exhausted from an exhaust duct 16 connected above the first flow path region 33 in the path through which the flow path accommodating chamber 32 is exhausted.

[0077] Therefore, even if the first gas leaks from the first flow path region 33, the gas is discharged to the outside of the housing 11 through the exhaust duct 16 located above the housing 11 without passing through the second flow path region 34.

[0078] That is, the first gas leaking from the first flow path region 33 is prevented from entering the second flow path region 34 located downstream of the second flow path region 34 in the exhaust path of the second flow path region 34. Therefore, if the first gas is a flammable gas, the first gas is prevented from coming into contact with the second device 24b and igniting. Furthermore, if the second gas is a corrosive gas, the piping members in the second flow path region 34 and the second device 24b are prevented from corroding.

[0079] Furthermore, in the gas supply device 10A, the partition member 17 divides the first flow path region 33 into a component-installed region 36a including the first component 24a and a component-free region 36b including no potential ignition source. Therefore, if the first gas is flammable, even if the first gas leaks in the component-free region 36b, the flammable gas is prevented from flowing into the component-free region 36b including the potential ignition source. This further enhances safety in the event of a leak of the first gas from the first flow path 22.

[0080] Furthermore, even if the first gas is a corrosive gas, the gas supply device 10A is provided with the partition member 17, which prevents the first gas from coming into contact with the first device 24a and the second device 24b, thereby preventing corrosion of the first device 24a and the second device 24b.

[0081] FIG. 7 is a schematic diagram showing a gas supply apparatus 10B which is a modified example of the gas supply apparatus 10A. The main difference between gas supply apparatus 10B and gas supply apparatus 10A is that all first containers 20 and second containers 21 are housed in housing 11. Hereinafter, the main difference will be explained, and the same components as those in gas supply apparatus 10A will be given the same reference numerals as those in gas supply apparatus 10A, and explanations thereof will be omitted.

[0082] 7, in this modification, the gas supply device 10B includes a third partition wall 18 that divides the first container storage chamber 31 into two regions, in addition to the first partition wall 14. The gas supply device 10B has a first storage region 31a and a second storage region 31b formed by the third partition wall 18.

[0083] A first container 20 is disposed in each of the first and second storage areas 31a and 31b. A flammable gas is stored in the first container 20 disposed in the first storage area 31a, and a corrosive gas is stored in the first container 20 disposed in the second storage area 31b. Hereinafter, the first container 20 disposed in the first storage area 31a may be referred to as a flammable gas container 20b, and the first container 20 disposed in the second storage area 31b may be referred to as a corrosive gas container 20c. The first storage area 31a and the second storage area 31b may each be provided with a first container 20 for storing a different type of corrosive gas. For example, the first container 20 provided in the first storage area 31a may store a chlorine-containing gas, and the first container 20 provided in the second storage area 31b may store a chlorine-containing gas.

[0084] In this modified example, ventilation holes (not shown) are formed below the first storage area 31a and the second storage area 31b, and the gas in the first storage area 31a and the second storage area 31b passes through the first ventilation hole 13d and is forcibly discharged to the outside through the exhaust duct 16.

[0085] In addition, two second containers 21 are housed in the flow path housing chamber 32, and the gas in the flow path housing chamber 32 passes through the second ventilation port 14d and the first ventilation port 13d in sequence, and is forcibly discharged to the outside through the exhaust duct 16.

[0086] Two first flow paths 22, one end of which is connected to the flammable gas container 20b and one end of which is connected to the corrosive gas container 20c, are arranged in the flow path accommodating chamber 32 so that a portion of each of the first flow paths 22 is gathered in a first flow path region 33. Two second flow paths 23, each connected to two second containers 21 arranged in the flow path accommodating chamber 32, are arranged so that a portion of each of the second flow paths 23 is gathered in a second flow path region 34.

[0087] In this modification, the first flow path region 33 is also located upstream of the second flow path region 34 in the exhaust path of the flow path accommodating chamber 32, and even if the first gas leaks from the flow path accommodating chamber 32, the gas is discharged to the outside without remaining in the flow path accommodating chamber 32. Therefore, the leaked first gas is prevented from coming into contact with devices arranged in the flow path accommodating chamber 32.

[0088] Furthermore, the present invention is not limited to the above-described embodiment and modified examples, and it goes without saying that various modifications are possible without departing from the spirit of the present invention. [Explanation of symbols]

[0089] 10A gas supply device 11. Housing 14 First Partition Wall 17 Partition member 17a Through hole 20 First Container 21 Second Container 22 First Channel 23 Second Channel 24a First Device 24b Secondary Equipment 31 First Container Storage Room 32 Channel chamber 33 First flow area 34 Second flow area 100 Processing equipment 110 Ion Source 111 Plasma Generation Chamber

Claims

1. A gas supply device that supplies a plurality of types of gases to a plasma generation chamber in which plasma is generated, a first container for storing a first flammable or corrosive gas; a second container for storing a second gas that is a different gas species from the first gas; a first flow path through which the first gas flows; a second flow path through which the second gas flows; a housing having a first container accommodating chamber that accommodates the first container and a flow path accommodating chamber that accommodates the first flow path and the second flow path; Equipped with the housing has one or more partition walls that divide the interior of the housing into a plurality of spaces, the first container accommodating chamber and the flow path accommodating chamber are formed by dividing the interior of the housing by the partition wall, Both the first container housing chamber and the flow path housing chamber are forcibly evacuated. Gas supply equipment.

2. The gas supply device according to claim 1 , wherein the housing further includes a second container accommodating chamber that is formed by dividing the interior of the housing with the partition wall and that accommodates the second container.

3. the flow path accommodating chamber has a first flow path region in which the first flow paths are collected, and a second flow path region in which the second flow paths are collected, the first flow path region is located downstream of the second flow path region in a path through which the flow path accommodating chamber is exhausted, 3. The gas supply device according to claim 1, wherein the flow path accommodating chamber is forcibly exhausted from a downstream side of the first flow path region with respect to the path.

4. the first gas is flammable, a first device that is a potential ignition source and that constitutes the first flow path is disposed in the first flow path region; The gas supply device according to claim 3 , wherein a second device that is a potential ignition source and that constitutes the second flow path is disposed in the second flow path region.

5. 5. The gas supply device according to claim 4, further comprising one or more partition members that partition the first flow path region into a region in which the first device is disposed and a region in which the first device is not disposed.

6. A processing apparatus for performing a predetermined processing on an object, the processing apparatus comprising: a plasma generation chamber in which plasma is generated; and a gas supply device for supplying a plurality of types of gases to the plasma generation chamber, The gas supply device a first container for storing a first gas that is flammable or corrosive; a second container for storing a second gas that is a different gas species from the first gas; a first flow path through which the first gas flows; a second flow path through which the second gas flows; a housing having a first container accommodating chamber that accommodates the first container and a flow path accommodating chamber that accommodates the first flow path and the second flow path; Equipped with the housing has one or more partition walls that divide the interior of the housing into a plurality of spaces, the first container accommodating chamber and the flow path accommodating chamber are formed by dividing the interior of the housing by the partition wall, Both the first container housing chamber and the flow path housing chamber are forcibly evacuated. Processing equipment.

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