Indoor installation type electric apparatus
The integration of a cooling device in the exhaust path of electrical equipment allows for easy retrofitting, addressing the need for enhanced cooling in existing installations, reducing room temperature, and improving operational stability and energy efficiency.
Patent Information
- Application Number
- JP2024117195
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-07-22
- Publication Date
- 2026-02-03
AI Technical Summary
Existing cooling methods for electrical equipment, such as those described in Patent Document 1, require integration during manufacturing and cannot be retrofitted to existing installations, failing to address the need for enhanced cooling due to rising ambient temperatures or equipment life extension.
An indoor installation type electrical equipment with a cooling device integrated into the exhaust path of an exhauster, allowing for the addition of cooling functionality through a simple configuration, such as a water-cooling system that can be installed later without modifying the existing equipment.
This solution enables easy retrofitting of cooling capabilities to electrical equipment, reducing room temperature and improving operational stability, reducing energy consumption, and extending equipment life without requiring additional air conditioning.
Smart Images

Figure 2026016129000001_ABST
Abstract
Description
[Technical Field]
[0001] The present invention relates to indoor electrical equipment. [Background technology]
[0002] It is known that electrical equipment often needs to be cooled to cope with heat generated during operation. As an example, Patent Document 1 discloses the provision of a water-cooling unit to cool IGBTs when cooling a semiconductor power converter. [Prior art documents] [Patent documents]
[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-33182 Summary of the Invention [Problem to be solved by the invention]
[0004] The method described in Patent Document 1 requires that a water-cooling unit be provided in advance when designing and manufacturing an electrical device, such as a semiconductor power converter.
[0005] However, in recent years, there has been a growing need to provide cooling capabilities to electrical equipment that has already been installed and used. One example of this is the need for cooling electrical equipment that has previously been adequate due to rising ambient temperatures caused by global warming, which means that cooling methods are no longer sufficient. Another example is the need to retroactively strengthen the cooling capabilities of electrical equipment in order to extend the life of the equipment.
[0006] However, the method of Patent Document 1 does not take into consideration the possibility of adding a cooling function, such as water-cooling performance, later on, and is therefore unable to meet such new needs.
[0007] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an electrical device having a cooling device that can be added later, or an electrical device having a cooling device that is realized with a simple configuration. [Means for solving the problem]
[0008] An example of a means for solving the above problem is as follows.
[0009] An indoor installation type electrical equipment that exhausts air that has flowed in through an air intake port using an exhauster, the indoor installation type electrical equipment having a cooling device in the middle of an exhaust path of the exhauster. [Effects of the Invention]
[0010] According to the present invention, it is possible to easily provide a cooling function to indoor electrical equipment.
[0011] Further means and effects of the present invention will become apparent throughout the entire specification below. [Brief explanation of the drawings]
[0012] [Figure 1A] FIG. 1 is an explanatory diagram of the background of the present invention. [Figure 1B] FIG. 1 is an explanatory diagram of the background of the present invention. [Figure 2A] FIG. 1 is a diagram illustrating the concept of an embodiment of the present invention. [Figure 2B] FIG. 1 is a diagram illustrating the concept of an embodiment of the present invention. [Figure 3A] FIG. 1 is a diagram illustrating the concept of an embodiment of the present invention. [Figure 3B] FIG. 1 is a diagram illustrating the concept of an embodiment of the present invention. [Figure 4A] 1 is a schematic cross-sectional view illustrating an embodiment of the present invention. [Figure 4B] 1 is a schematic cross-sectional view illustrating an embodiment of the present invention. [Figure 5] 1 is a schematic cross-sectional view illustrating an embodiment of the present invention. [Figure 6] 1 is a schematic cross-sectional view illustrating an embodiment of the present invention. [Figure 7] 1 is a schematic cross-sectional view illustrating an embodiment of the present invention. [Figure 8] 1 is a schematic cross-sectional view illustrating an embodiment of the present invention. [Figure 9] 1 is a schematic cross-sectional view illustrating an embodiment of the present invention. [Figure 10] 1 is a schematic cross-sectional view illustrating an embodiment of the present invention. [Figure 11] 1 is a schematic cross-sectional view illustrating an embodiment of the present invention. [Figure 12] 1 is a schematic cross-sectional view illustrating an embodiment of the present invention. [Figure 13A] 1 is a schematic three-dimensional explanatory diagram of an embodiment of the present invention; [Figure 13B] FIG. 2 is an explanatory diagram of a piping arrangement according to an embodiment of the present invention. [Figure 14A] 1 is a schematic side view illustrating an embodiment of a cooling device of the present invention. [Figure 14B] 1 is a schematic plan view illustrating an embodiment of a cooling device of the present invention. [Figure 14C] 1 is a schematic plan view illustrating an embodiment of a cooling device of the present invention. [Figure 14D] 1 is a schematic side view illustrating an embodiment of a cooling device of the present invention. [Figure 14E] 1 is a schematic side view illustrating an embodiment of a cooling device of the present invention. [Figure 14F] 1 is a schematic plan view illustrating an embodiment of a cooling device of the present invention. [Figure 14G] 1 is a schematic plan view illustrating an embodiment of a cooling device of the present invention. [Figure 14H] 1 is a schematic plan view illustrating an embodiment of a cooling device of the present invention. [Figure 14I] 1 is a schematic plan view illustrating an embodiment of a cooling device of the present invention. [Figure 14J] 1 is a schematic plan view illustrating an embodiment of a cooling device of the present invention. [Figure 15A] FIG. 2 is a schematic plan view illustrating an example of the internal structure of the cooling device of the present invention. [Figure 15B] FIG. 2 is a schematic plan view illustrating an example of the internal structure of the cooling device of the present invention. [Figure 15C] FIG. 2 is a schematic plan view illustrating an example of the internal structure of the cooling device of the present invention. [Figure 15D] FIG. 2 is a schematic plan view illustrating an example of the internal structure of the cooling device of the present invention. [Figure 15E] FIG. 2 is a schematic plan view illustrating an example of the internal structure of the cooling device of the present invention. [Figure 16A] FIG. 2 is a schematic explanatory diagram of the connection concept of the cooling device of the present invention. [Figure 16B] FIG. 2 is a schematic explanatory diagram of the connection concept of the cooling device of the present invention. [Figure 16C] FIG. 2 is a schematic explanatory diagram of the connection concept of the cooling device of the present invention. [Figure 17A] 3 is a schematic explanatory diagram of a water droplet prevention body of the cooling device of the present invention. FIG. [Figure 17B] 3 is a schematic explanatory diagram of a water droplet prevention body of the cooling device of the present invention. FIG. [Figure 17C] 10 is a schematic explanatory view of another example of a water droplet prevention body for a cooling device according to the present invention. FIG. [Figure 17D] 10 is a schematic explanatory view of another example of a water droplet prevention body for a cooling device according to the present invention. FIG. [Figure 17E] FIG. 1 is a schematic explanatory diagram of an example of a porous water barrier of the present invention. [Figure 17F] FIG. 1 is a schematic explanatory diagram of an example of a porous water barrier of the present invention. [Figure 17G] FIG. 2 is a schematic explanatory diagram of the water blocking behavior of the porous water barrier of the present invention. [Figure 17H] FIG. 2 is a schematic explanatory diagram of a water-repellent layer. [Figure 17I] 10 is a schematic explanatory view of another example of a water droplet prevention body for a cooling device according to the present invention. FIG. [Figure 18] FIG. 2 is a schematic explanatory diagram of an example of control according to the present invention. DETAILED DESCRIPTION OF THE INVENTION
[0013] Hereinafter, embodiments of the present invention will be described with reference to the drawings as needed. [Example]
[0014] FIG. 1A is an explanatory diagram of the background of the present invention. 1 is an electrical device, and 10 is a fan for exhausting air heated by built-in devices inside the electrical device. An example is an exhaust fan. Note that the fan 10 may be built into the electrical device 1.
[0015] 100 is a room. Here, it includes not only rooms in buildings or structures, but also enclosed spaces and containers installed outdoors.
[0016] The electrical appliance 1 inevitably generates heat during its operation. If the electrical appliance 1 continues to operate while sealed in the room 100, the temperature of the room 100 will continue to rise and eventually exceed the operating range of the electrical appliance 1.
[0017] To avoid this, it is common practice to forcibly cool the inside of the room 100, particularly in devices that incorporate semiconductor devices, such as power conversion devices and servers.
[0018] 101 is an indoor unit of an air conditioner, 102 is an outdoor unit of an air conditioner, and 103 is an air conditioner piping.
[0019] FIG. 1B shows how air circulates in room 100 when the air conditioner is in operation. Air flows from the room into electrical equipment 1 as inflow air 50. After cooling the inside of electrical equipment 1, the inflow air is warmed by exhaust fan 10 and released into the room as exhaust air 51. This warmed air is diffused and equalized within the room, and indoor air 110 is drawn into air conditioner indoor unit 101. The indoor air is cooled by a heat exchanger in air conditioner indoor unit 101 and is blown out into the room as cooled air 111 to cool the room 100.
[0020] At this time, the air conditioner indoor unit 101 cools the entire room 100, and therefore consumes a large amount of power.
[0021] On the other hand, Patent Document 1 directly water-cools the heat generating parts inside the electrical equipment, thereby reducing the amount of heat emitted from the electrical equipment into the room. However, this method must be incorporated into the electrical equipment 1 in advance when it is manufactured, and it is extremely difficult to add cooling performance to the electrical equipment 1 after it has been installed.
[0022] In recent years, there has been a growing need to retrofit electrical equipment that has already been installed and in use with cooling capabilities. One example is the rise in ambient temperature due to global warming, which has led to situations where cooling the interior of a room using an air conditioner alone, which was previously sufficient, is no longer sufficient to cool the electrical equipment. Another example is the need to retrofit electrical equipment with stronger cooling capabilities in order to extend the life of the electrical equipment.
[0023] FIG. 2A is an explanatory diagram illustrating the basic concept of the present invention and corresponds to FIG. 1A. The difference from FIG. 1A is that a cooling device 20 is provided for the electrical appliance 1. This will be explained using FIG. 2B, which corresponds to FIG. 1A. In FIG. 2B, exhaust air 51 passes through the newly installed cooling device 20 before being discharged into the room 100. By installing the cooling device 20 in association with the exhaust fan 10 of the electrical appliance 1 and locating the cooling device 20 on the exhaust path of the exhaust fan 10, it is possible to add cooling functionality to the electrical appliance 1 with a simple configuration. For example, by retrofitting the cooling device 20, the temperature of the exhaust air discharged from the electrical appliance 1 into the room 100 can be reduced, thereby suppressing a temperature rise in the room 100. Furthermore, the air taken into the electrical appliance 1 as inlet air 50 for cooling the appliance can be lower in temperature than in the case of FIG. 1B because the temperature rise in the room 100 is suppressed. This improves the cooling performance of the electrical appliance 1 itself. This can also contribute to improving the operational stability of the electrical appliance 1. From another perspective, the cooling by the cooling device 20 can suppress the temperature rise in the room 100, thereby suppressing the operating temperature and operating rate of the air conditioner, which also contributes to reducing the total energy consumption of the air conditioner and electrical appliances, so the present application can be said to be an invention that addresses global environmental issues.
[0024] The effect of suppressing the temperature rise in room 100 by installing cooling device 20 can be achieved even in a room without an air conditioner, as shown in Fig. 3A, which corresponds to Fig. 2A. Fig. 3B is a diagram corresponding to Fig. 2B, in which exhaust air 51 merges with circulating air 112 in the room, becomes one with it, and is then taken into electrical appliance 1 as new inflow air 50. In this case, it is desirable to provide an outdoor ventilation fan (not shown) in room 100.
[0025] Therefore, the present invention does not require that an air conditioner be installed in room 100. However, in order for electrical appliance 1 to achieve the cooling performance improvement effect, the cooled exhaust air from electrical appliance 1 needs to circulate within room 100 and then be taken in by electrical appliance 1 again, and therefore electrical appliance 1 needs to be an indoor-installation type electrical appliance.
[0026] FIG. 4A is a schematic cross-sectional view illustrating the flow of air inside the electric device 1. As shown in FIG.
[0027] Inflow air 50 passes through an air intake 2 provided in the electrical device 1 and is introduced into the interior of the electrical device 1. At this time, from the viewpoint of the cooling efficiency of the built-in devices, it is desirable to configure the inflow air 50 so that it hits, for example, a semiconductor device 3, which is one of the heat sources. Thereafter, the inflow air 50 is sucked outward by the exhaust fan 10 as internal airflow 52, and passes through the cooling device 20 and is released into the room as exhaust air 51.
[0028] 4B shows an example in which the positional relationship between the exhaust fan 10 and the cooling device 20 is upside down compared to that in FIG. 4A. In this case, the exhaust fan 10 exhausts the air inside the electrical device 1 into the room after passing through the cooling device 20.
[0029] The exhauster 10 may be installed above the electrical device 1 or may be built into the housing of the electrical device 1. Alternatively, multiple exhausters may be interposed on the air exhaust path. Alternatively, the exhauster 10 may be configured to be installed on the ceiling of the electrical device 1. In this case, the exhauster 10 may be configured in advance as an integrated unit that protrudes above the ceiling surface of the electrical device 1.
[0030] It is desirable that the cooling device 20 be located above the ceiling or top surface of the electrical equipment 1. This makes it possible to add or later install the cooling device 20 to the electrical equipment 1 without any special modifications to the electrical equipment 1.
[0031] 5 shows an example in which a partition wall 60 is provided inside the electric device 1. This allows the flow of cooling air inside the electric device 1 to be guided, thereby realizing more efficient internal cooling.
[0032] Next, a more detailed example of the cooling device 20 of the present invention will be described. Note that the following description of the cooling device 20 in this application also claims the invention of the cooling device alone, as long as the cooling device alone contains novel content in the technical concept.
[0033] There are various means for realizing the cooling device 20. One point is that efficient cooling can be achieved by arranging the cooling device 20 adjacent to the exhaust fan 10. Therefore, the case where the cooling device 20 is realized by an electrical cooling means is also included as an example of the cooling device 20.
[0034] However, as a more efficient cooling means, the following description will be focused on the case where the cooling device 20 is realized by a water-cooling method.
[0035] Fig. 6 is a diagram corresponding to Fig. 4A, omitting the illustration of the internal devices of the electrical device 1. A water supply pipe 70 and a drainage pipe 80 are connected to the cooling device 20. Water is supplied to the water supply pipe 70 as supply water 71, and is supplied to the cooling device 20. The cooling device 20 uses the water to cool the discharge air 51. As a result, the temperature of the water increases through heat exchange, and the water then passes through the drainage pipe 80 and is discharged as drainage 81.
[0036] The advantage of using water for cooling is that it reduces the energy consumed for cooling compared to electrical cooling. This is because, even if water from a tap is used as the water supply 71, it is extremely rare for the water temperature to exceed 35°C. Therefore, simply by letting the water flow stably, it can be used as a low-temperature medium for heat exchange.
[0037] 6 and other figures, the drain pipe 80 appears to be above the water supply pipe 70, but this is a functional representation, and in reality, it is desirable that the water supply pipe 70 and the drain pipe 80 be installed on the same plane. This is because the movement of cooling water inside the cooling device 20 can be regulated two-dimensionally, and the cooling operation can be stabilized.
[0038] However, this does not exclude the water supply pipe 70 and the drainage pipe 80 from being arranged above each other.
[0039] FIG. 7 shows an example in which a booster pump 90 is provided midway along the water supply pipe 70, as compared to FIG. 6. This reduces fluctuations in the amount of water supplied to the water supply pipe 70 and supplied to the cooling device 20. It is also desirable to install the cooling device 20 on the ceiling of the electrical equipment 1 or above the ceiling. This is an appropriate structure in terms of cooling, but it also means that the cooling device 20 is located in a position with high potential energy. Therefore, by providing the booster pump 90, it is possible to suppress the effects of this potential energy, and stabilize the cooling performance of the cooling device 20.
[0040] 91 is a valve that allows for bypassing and draining the water in the event that a blockage or malfunction occurs in one of the pipes and the water needs to be drained.
[0041] Reference numeral 92 denotes a flow meter, which measures the amount of water circulating through the cooling device 20, or being supplied to or discharged from the cooling device 20. This makes it possible to confirm and monitor whether a predetermined amount of water is being supplied to the cooling device 20.
[0042] The flow meter 92 may be provided in the water supply pipe 70 or in the drainage pipe 80, or in both, or may be built into the cooling device 20.
[0043] 8 shows an example in which a sensor 93 is provided on the piping system in contrast to FIG. 7. Various types of sensors can be used, such as a water thermometer, a pressure gauge, and a thermometer. Some or all of these sensors can be provided as appropriate depending on the required accuracy of management of the cooling device 20.
[0044] In this case, the sensor may be located in the water supply pipe 70 or the drain pipe 80, or in both pipes.
[0045] As an example, the cooling device 20 may be called a radiator in the case of a water-cooled system as shown in FIGS. 6 to 8. However, the term "radiator" is generally used to refer to a device that flows high-temperature water through it and dissipates heat to cool the flowing water. In contrast, the cooling device 20 of the present application transfers heat from the surrounding air to the water flowing inside the cooling device 20, thereby transferring heat to the flowing water or ultimately heating the flowing water. Therefore, the function of a so-called radiator is reversed. Therefore, the cooling device 20 of the present invention can also be called a reverse radiator in a sense.
[0046] Next, an example of the inside of the electric device 1 will be described. The electric device is not limited to the electric device described below as long as it has a device that generates heat inside, but this is for the purpose of facilitating understanding and providing an additional explanation of an example of the inside configuration of the electric device 1.
[0047] 9, 10, 11 and 12 show examples in which the electric device 1 is a power conversion device or an inverter device.
[0048] 9 illustrates a case where there are multiple semiconductor devices 3, but the present invention is not limited to this. Also, although an air intake 2 is provided for each semiconductor device 3, it is of course possible to provide one air intake 2 for multiple semiconductor devices 3.
[0049] The inflow air 50 introduced into the electric device 1 from the air intake 2 cools the semiconductor device 3 and then flows to the rear of the electric device 1. As an example, it is desirable to arrange the devices so that the device that generates the most heat is cooled first. In FIG. 9, the flow path is configured so that the transformer 4 is cooled by the air that has cooled the semiconductor device 3.
[0050] The type of semiconductor device 3 is not particularly limited, but includes cases where so-called power semiconductors such as SiC and IGBT are used in addition to Si-based semiconductors. In particular, in power converters and inverters, power semiconductors such as SiC and IGBT are used in the semiconductor device 3, which results in a large amount of heat generation from the semiconductor device 3. In addition, cooling is very important. Therefore, the present invention is suitable for application to such power converters and inverters.
[0051] FIG. 10 is an example of the electric device 1 as viewed from the right side of FIG. 9, and also serves as an example of the front internal structure of the electric device 1. In FIG.
[0052] The electrical device 1 may have a control device 5 in addition to the semiconductor device 3. In such a case, for example, a path for the inflow air 50 to cool the semiconductor device 3 via the control device 5 may be provided.
[0053] 10 also illustrates a case where there are a plurality of exhaust fans 10 and a plurality of cooling devices 20. Of course, the present invention is not limited to a case where there are a plurality of exhaust fans 10 and cooling devices 20, as shown in FIG. 10. However, if the electrical equipment 1 is large in scale, it is desirable to provide a plurality of exhaust fans 10 and cooling devices 20.
[0054] 10, the exhaust fans 10 and the cooling devices 20 are in an approximately 1:1 correspondence. However, a configuration in which one cooling device 20 corresponds to a plurality of exhaust fans 10 may also be used. Alternatively, a configuration in which a plurality of cooling devices 20 correspond to a plurality of exhaust fans 10 may also be used.
[0055] However, when the cooling device 20 is retrofitted to improve the cooling performance of the electrical equipment 1 later, it is desirable that one cooling device 20 corresponds to one exhauster 10, from the viewpoint of reducing the effort required for installation and improving the cooling device 20. Furthermore, when there is a margin for cooling efficiency and priority is given to reducing the effort required for installation, one cooling device 20 may correspond to multiple exhausters 10.
[0056] FIG. 11 is a diagram corresponding to FIG. 9. The difference from FIG. 9 is that there is no semiconductor device 3, and the transformer 4 is provided inside the electric device 1. This is the most basic power conversion device. The present invention naturally includes cases where the electric device 1 includes such a configuration.
[0057] FIG. 12 is an explanatory diagram showing an example in which the electric device 1 is a larger-scale power conversion device or inverter device.
[0058] The electrical device 1 includes a semiconductor device 3, a control device 5, and a transformer 4. The air intake 2 appears to be only on the side in FIG. 12, but it may also be provided on the front of the electrical device 1, or may be provided only on the front side of the electrical device 1.
[0059] It can be seen that a plurality of cooling devices 20 are installed for a plurality of air exhausters 10. In this way, the present invention can also be applied to a combination of a plurality of air exhausters 10 and a plurality of cooling devices 20.
[0060] 12 shows an example in which the semiconductor device 3, the control device 5, and the transformer 4 are configured as separate blocks. In this way, they may have a unit structure. Alternatively, as shown in FIG. 11, multiple electrical devices may be combined to ultimately configure the electrical device 1.
[0061] FIG. 13A is an explanatory diagram for clearly showing, from the outside, the three-dimensional arrangement of a power converter or an inverter device as an example of the electric device 1. In FIG.
[0062] 13A shows a structure in which multiple electrical devices 1 are grouped together to form the electrical device 1 as a whole. In addition, in FIG. 13A, multiple large air intakes 2 are shown on the front surface of the electrical device 1. Note that the air intakes 2 may have multiple sizes and shapes.
[0063] It can be seen that the air introduced into the electric device 1 from the air intake 2 is exhausted upward from the electric device 1 by the exhaust fan 10. It can also be seen that the air then passes through the cooling device 20 and is cooled or its temperature is lowered before being exhausted upward.
[0064] 13A, the exhaust fan 10 is installed to protrude from the ceiling surface of the electric device 1, and the cooling device 20 is provided above the ceiling surface of the electric device 1, above the exhaust fan 10.
[0065] However, this also includes a case where the exhaust fan 10 is built into the electrical appliance 1 and the ceiling surface of the electrical appliance 1 is flat. In this case, the cooling device 20 is still provided above the ceiling surface of the electrical appliance 1, above the exhaust fan 10.
[0066] The present invention also includes a case where the cooling device 20 is placed on the ceiling surface of the electrical device 1 or above the ceiling surface, and the exhaust fan 10 is further provided above that. In this case, the exhaust fan 10 sucks in air from inside the electrical device 1 through the cooling device 20, passes through the cooling device 20, cools the air, and then exhausts it into the room by the exhaust fan 10. Therefore, the exhaust fan still functions as a fan.
[0067] Fig. 13B is a view of the electrical device 1 of Fig. 13A as seen from the left side, and is intended to show an example of the connection positions of the water supply pipe 70 and the drainage pipe 80 relative to the cooling device 20.
[0068] 13B shows that the water supply pipe 70 and the drainage pipe 80 are connected horizontally to the cooling device 20. The connection position is not limited to being horizontal, but a horizontal position is preferable from the viewpoint of ease of construction and efficiency of water circulation inside the cooling device 20.
[0069] 13B shows a state in which both the water supply pipe 70 and the drain pipe 80 are supplied from the left side of FIG. 13A. However, the installation direction of the pipes is not limited to this. For example, the water supply pipe 70 and the drain pipe 80 may be connected to the cooling device 20 from the left side of FIG. 13B, that is, the water supply pipe 70 and the drain pipe 80 may be arranged on the rear side of the drawing in FIG. 13A. In particular, if the water supply pipe 70 and the drain pipe 80 are arranged on the rear side, there is an advantage that when there are multiple cooling devices 20, the piping installation and attachment work for each cooling device is easier.
[0070] Next, we will explain how to install the cooling device 20. Such installation considerations are important, especially when installing the cooling device 20 later, in order to ensure ease of construction.
[0071] FIG. 14A is an explanatory diagram of the cooling device 20 as viewed from the side when the cooling device 20 is being installed. It can be seen that the cooling device 20 is provided with legs 21. FIG. 14B is a diagram of FIG. 14A as viewed from below. The legs 21 are provided at the four corners of the cooling device 20. This allows the cooling device 20 to be installed on the electrical device 1 simply by placing the cooling device 20 on the ceiling panel of the electrical device 1.
[0072] FIG. 14C is a diagram corresponding to FIG. 14B, showing the case where a stand is used. When viewed from below, it can be seen that stand legs 21A are provided at the four corners of stand installation surface 21B. FIG. 14D is a diagram corresponding to FIG. 14A. It can be seen that cooling device 20 is loaded on top of stand installation surface 21B, and is supported by stand legs 21A. In this way, by using a stand, cooling device 20 can be installed later simply by loading it, so that installation on electrical equipment 1 of various shapes can be accommodated by simply modifying the stand. This achieves ease of installation and improves mass production of cooling device 20.
[0073] Fig. 14E is a diagram showing a case where part of the pedestal leg 21A extends upward beyond the pedestal installation surface 21B. In this case, Fig. 14F is a diagram corresponding to Fig. 14C, and Fig. 14G is a diagram seen from above after the cooling device 20 has been installed.
[0074] In this way, by providing a portion of the pedestal legs 21A above the pedestal installation surface 21B, the pedestal itself can have the function of preventing lateral movement or displacement of the cooling device 20. Therefore, the cooling device 20 is completely fixed in position simply by placing it on the pedestal, further simplifying the installation work.
[0075] The stand may also be called a rack.
[0076] 14H shows an example in which the air tunnel 22 is provided so as to cover the sides of both the exhaust fan 10 and the cooling device 20. In this case, the air tunnel 22 may be fixed to the cooling device 20 in advance. In this case, installation of the cooling device 20 is completed simply by placing the air tunnel 22 on the ceiling surface of the electrical equipment 1. In particular, in cases in which the exhaust fan 10 protrudes from the ceiling surface of the electrical equipment 1 and is configured as an integral part of the electrical equipment 1, installation and positioning of the cooling device 20 can be completed simply by placing the air tunnel 22, which is slightly larger than the exhaust fan 10, on the outside, thereby simplifying the installation work.
[0077] The advantage of using such an air tunnel 22 instead of a leg is that it can suppress lateral leakage of the airflow from the exhaust fan 10 to the cooling device 20, thereby increasing the amount of exhaust air passing through the cooling device 20, thereby more efficiently reducing the temperature of the exhaust.
[0078] The wind tunnel 22 may also be called a hood.
[0079] 14I is a top view of FIG. 14H, and it can be seen that an air channel 22 is provided to surround the cooling device 20.
[0080] 14J shows an example of a configuration in which the positional relationship between the exhaust fan 10 and the cooling device 20 of FIG. 14H is reversed. Even in this case, the amount of exhaust air passing through the cooling device 20 can be increased because the lateral leakage of the airflow drawn from the electrical equipment 1 by the exhaust fan 10 passing through the cooling device 20 can be suppressed. Therefore, even when the positional relationship between the exhaust fan 10 and the cooling device 20 is reversed, the temperature of the exhaust air can be reduced more efficiently.
[0081] Next, the configuration of water piping inside the cooling device 20 when the cooling device 20 is a water-cooling type will be described.
[0082] 15A is a schematic illustration of an example of the internal configuration of cooling device 20. Water supply pipe 70 and drainage pipe 80 are each connected to internal water pipe 120 by connector 150. Internal water pipe 120 directly or indirectly connects water supply pipe 70 and drainage pipe 80, forming a water circulation system inside cooling device 20.
[0083] Reference numeral 121 denotes a cooling fin. For example, it is made up of many thin metal plates, each connected to the internal water pipe 120. The reason for using many thin metal plates is to increase the contact area with the air, thereby increasing the contact area with the air for the purpose of heat exchange.
[0084] As air flows through the cooling device 20, heat is removed from the air or heat is exchanged by the cooling fins 121. As a result, the temperature of the air decreases, and at the same time, the temperature of the water in the internal water piping increases. This allows the cooling of the exhaust air in the cooling device 20.
[0085] 15B shows an example in which the internal water piping 120 has multiple folds inside the cooling device 20. By providing multiple folds in this way and increasing the extension length of the internal water piping 120 inside the cooling device 20, an increase in the contact area with air is realized.
[0086] Figure 15C is an example in which cooling fins 121 are also provided in addition to Figure 15B. This has the effect of increasing the extension length of the internal water piping 120 and the effect of increasing the contact area of the cooling fins 121. Furthermore, the contact area between the cooling fins 121 and the internal water piping 120 itself can also be increased, which further improves the efficiency of heat transfer from the cooling fins 121 to the internal water piping 120. Note that although the cooling fins 121 are shown as being long in Figure 15C, they may also be configured as a collection of many short cooling fins, as shown in Figure 15A.
[0087] Fig. 15D shows another example of a configuration for increasing the extension length of the internal water piping 120. Note that various types of cooling fins 121 can be used, such as the type shown in Fig. 15A, the type shown in Fig. 15C, or other types.
[0088] A feature of Figure 15D is that, instead of bending one internal water pipe multiple times, a multiple-branch structure is used as a means for increasing the extension length of the internal water pipe 120. This has the advantage of making it easier to manufacture the internal water pipe 120 and reducing manufacturing costs compared to the multiple-bending method shown in Figure 15B. Another advantage is that, particularly when the cooling device 20 becomes larger, it is possible to easily accommodate size increases and make an appropriate design.
[0089] 15E shows an example in which a water tank 122 is provided at the other end of the internal water piping. This prevents excessive concentration of water pressure at the other end where each water piping is connected, particularly in an internal water piping that branches into multiple parts, improving the reliability of the internal water piping and reducing resistance in the entire process from water inflow to outflow. Therefore, even if the water pressure of the water supplied from the water supply piping is low, stable cooling of the water flow can be achieved.
[0090] 15A to 15E, the water supply pipe 70 and the drain pipe 80 are shown as being provided on the same side of the cooling device 20. However, the water supply pipe 70 and the drain pipe 80 may be arranged on different sides of the cooling device 20 as needed.
[0091] For example, if the water supply pipe 70 and the drain pipe 80 are provided on opposing sides, the water will flow one way through the internal water pipe 120, which will suppress the viscous resistance of the water and stabilize the water flow. Also, if the water supply pipe 70 and the drain pipe 80 are provided on sides that intersect at right angles, the water supply side and the drain side of the electrical device 1 can be separated on a side-by-side basis, which will simplify the installation of the pipes, for example.
[0092] 15A, for example, the internal water piping 120 connects the inlet side and the outlet side inside the cooling device 20. However, as shown in FIG. 16A, the cooling water may be drawn out to the outside of the rectangular body of the cooling device 20 via the internal water piping, and then returned to the inside of the rectangular body of the cooling device 20 again via the circulation connection piping 125.
[0093] One advantage of such a structure is that when multiple cooling devices 20 are installed, the cooling devices 20 can be easily connected in series.
[0094] 16B shows an example of direct connection of the cooling devices 20, in which two cooling devices 20 are connected by inter-unit connection piping 126. According to this configuration, water introduced from the first unit is subsequently introduced into the second unit, then returns to the first unit, and is finally discharged from the first unit.
[0095] This has the advantage that the number and length of water pipes exposed to the outside can be reduced, and the system can be installed later even in electrical equipment that is not in a good surrounding environment.
[0096] Also, although FIG. 16B shows an example in which two units are used, the same concept can be applied to the direct connection of a larger number of units.
[0097] In this case, it is desirable that the inter-unit connection pipe 126 has a bendable structure to facilitate easy connection, such as a metal bellows pipe or a resin pipe.
[0098] Next, FIG. 16C shows an example in which units are connected in parallel.
[0099] The water supply pipe 70 and the drain pipe 80 each branch, and water is supplied to and discharged from the second unit via the disassembly pipe 85. Using the same concept, increasing the number of branches can accommodate parallel connection of a larger number of units. With this configuration, although the extension distance of the piping increases due to the branch pipes, it has the advantage of being able to match the conditions of the water supplied to each unit, thereby avoiding performance differences in cooling performance between units due to differences in cooling water temperature. In other words, it is possible to realize a cooling device 20 in which variations in cooling performance between each unit are suppressed.
[0100] So far, the configuration of the cooling device 20 and the technical concept, configuration, and effects of the installation of the cooling device 20 in the electrical equipment 1 have been explained.
[0101] These inventions are based on a Columbus-like idea that is easy to install and has reliable effects.
[0102] However, when it comes to practical use, it is desirable to conduct more in-depth studies when using water as the cooling device 20. This is because, as long as water is used and a temperature difference is generated, there is a risk of problems occurring due to the humidity of the surrounding air and the moisture contained therein causing condensation.
[0103] For example, in the configuration of Fig. 2A, if condensation occurs in the cooling device 20, it is conceivable that the condensation will drip and reach the exhauster 10. This cannot completely eliminate the risk of rust or malfunction of the exhauster 10. Furthermore, if the condensation reaches the inside of the electrical device 1 directly or indirectly via the exhauster 10, it cannot completely eliminate the risk of causing a short circuit or the like in the internal components of the electrical device 1.
[0104] Therefore, the more the electrical equipment 1 is an equipment that handles particularly high voltages or an equipment that incorporates precision semiconductor devices, etc., the more desirable it is to avoid the risk of condensation in advance in order to ensure the reliability of the electrical equipment 1 when the cooling device 20 is installed.
[0105] An example of a dew condensation countermeasure according to the present invention will be described below.
[0106] 17A shows the technical idea of providing a porous water barrier 130 between the cooling device 20 and the exhaust fan 10. The porous water barrier 130 is required to be porous, i.e., have a large number of holes to allow airflow to pass through. At the same time, it is required to be watertight, i.e., to prevent dripping condensation from passing underneath.
[0107] Breathable and water-repellent materials have been known for clothing and other items in the past, but these are not designed to allow large amounts of air to pass through, and therefore only allow limited breathability, such as the transmission of moisture emitted from the human body.
[0108] Therefore, the present invention has come up with the invention of a unique porous water barrier 130. This porous water barrier 130 is positioned as a very important element, if not essential, in realizing the cooling device 20 or the electrical device 1 of the present invention with high reliability.
[0109] Fig. 17E is an enlarged plan view of an example of porous water barrier 130. As an example, fiber or resin 131 is woven into a mesh pattern. Holes 132 are formed between the weave. Fig. 17F is an enlarged plan view of another example of porous water barrier 130. As an example, a plate portion 133 made of fiber, resin, metal, or the like, and a large number of holes 132 are formed.
[0110] The reason why porous water barrier 130 of the present invention can simultaneously allow a large amount of air to pass through and prevent the permeation of dripping condensation water will be explained with reference to Figure 17G. For the sake of explanation, the example of plate portion 133 and hole portion 132 in Figure 17F will be explained, but the same principle applies to the case of Figure 17E.
[0111] The porous water barrier 130 of the present invention focuses on the objective of preventing dripping water from passing through below. Water has the characteristic of having a relatively large surface tension. By utilizing this property, even if condensation falls onto the porous water barrier 130, a configuration can be achieved in which the holes 132 are small and numerous, so that the water droplets 135 do not fall below the holes 132 due to the surface tension of the water. In this way, by focusing solely on water and specializing in preventing the penetration of water droplets, a porous water barrier 130 can be realized that allows the passage of large amounts of air while preventing the penetration of dripping condensation water.
[0112] At the same time, we also devised a method to further improve this fall prevention function.
[0113] Figure 17H shows an example in which the fiber or resin 131 of Figure 17E is coated with a water-repellent layer 136. Of course, this also includes the case where the same technical idea is applied to the plate portion 133 of Figure 17G. The presence of the water-repellent layer 136 further prevents water droplets 135 from falling downward from the porous water barrier plate 130 due to the surface tension of the water.
[0114] As an example of the fiber or resin 131, a polyester mesh or a nylon mesh can be used. Of course, this does not exclude general fibers or resins. However, it is desirable that the fiber or resin 131 itself has low hydrophilicity. Furthermore, similar materials can be used for the plate portion 133 made of fiber, resin, metal, etc.
[0115] The water-repellent layer 136 can be applied to the original material by, for example, fluorine treatment. However, this does not exclude other water-repellent treatments. By providing the water-repellent layer 136, even if the original material is, for example, a hydrophilic material or a metal, the surface can be made water-repellent, which has the advantage of improving flexibility in material selection.
[0116] The water-repellent treatment may be performed at the material stage or after the holes 132 are formed. However, in view of the risk of the water-repellent layer being partially removed or lost during the weaving process or the hole-making process, it is more desirable to perform the water-repellent treatment after the weaving process or the hole-making process.
[0117] Figure 17B is a diagram corresponding to Figure 17A, and differs from Figure 17A in that the porous water barrier 130 is tilted. As a result, even if condensation drips from the cooling device 20 onto the porous water barrier 130, the water droplets on the porous water barrier 130 can be guided and discharged in a predetermined direction due to the tilt of the porous water barrier 130. This makes it possible to prevent the water droplets from continuously remaining on the surface of the porous water barrier 130.
[0118] Furthermore, because airflow constantly flows from the holes 132 in a direction that lifts the water droplets 135, the lifted water droplets 135 can be guided and discharged to the less tilted side of the porous water barrier 130 according to the inclination of the porous water barrier 130. At this time, if the porous water barrier 130 is made of a thin or flexible material, the airflow hitting the porous water barrier 130 will cause the porous water barrier 130 to repeatedly undergo slight vertical displacement. This vertical movement imparts kinetic energy to the water droplets 135, making it possible to more smoothly collect and discharge them on the lower side of the porous water barrier 130.
[0119] Figure 17C shows an example in which multiple porous water barriers 130 are stacked. This means that even if a malfunction occurs in the upper porous water barrier 130A, the lower porous water barrier 130B can maintain the water barrier effect. This is a fail-safe for water barrier protection, so to speak. This improves reliability.
[0120] 17D shows an example in which the holes of the upper-layer porous water barrier 130A and the upper-layer porous water barrier 130B of the lower layer are staggered. In this way, if it is assumed from the beginning that the functions of airflow passage and water barrier will be achieved through multiple layers, it is possible to use a structure in which a metal plate or resin is simply bent for the upper-layer porous water barrier 130A and the upper-layer porous water barrier 130B of the lower layer.
[0121] In other words, in the case of Figure 17D, the mountain-valley shape of the drawing extends linearly from the front side to the rear side of the drawing. In such a case, the cost of the porous water barrier can be reduced. Of course, the porous water barriers of the configurations of Figures 17E and 17F may also be configured so that the holes are offset from each other.
[0122] When the positions of the exhaust fan 10 and the cooling device 20 are reversed, the porous water barrier 130 is provided below the cooling device 20. The purpose of the porous water barrier 130 is to prevent water droplets dripping downward from the cooling device 20 from falling below it.
[0123] 17A to 17D or 17I, the porous water shield 130 may be provided below the cooling device 20 so as to be positioned below the water pipes and fins inside the cooling device 20.
[0124] The electrical equipment 1 equipped with the cooling device 20 of the present invention, or the cooling device 20 of the present invention, is easy to install and can be easily added to or retrofitted to existing electrical equipment. This makes it easy to improve the operational stability of the electrical equipment. Furthermore, installation is easy, and subsequent maintenance is also easy. This makes it possible to realize a cooling device or electrical equipment using a cooling device with low running costs.
[0125] In particular, when the cooling device 20 is water-cooled, ease of maintenance is extremely important. This is because the water-cooling path inevitably contains components that require maintenance, such as packing, connectors, and sealing tape. Therefore, a configuration that is difficult to maintain is a major obstacle to the introduction of a water-cooled cooling device 20. However, the cooling device of the present invention, or an electrical device using a cooling device, has the advantage that it can be easily accessed and maintained from the outside, allowing the cooling device 20 to be introduced with peace of mind.
[0126] Another advantage is that maintenance is easy. When the cooling device 20 is water-cooled, purified water, for example, water purified through an ion exchange resin or an impurity removal filter, is usually used to prevent corrosion of the pipes and components in the water path. This is to prevent corrosion and reduce the frequency of maintenance. However, the cooling device 20 of the present invention, or the electrical device 1 using the cooling device 20, has the characteristic of being easy to maintain.
[0127] By utilizing this feature, it becomes possible to accept an increase in the frequency of maintenance, which is the exact opposite of conventional methods. In this case, it becomes possible to use water with a lower degree of purification than conventional water for cooling or for water supplied to the cooling device 20 from the water supply pipe 70. One example is to use ordinary tap water as is.
[0128] Chlorine is always contained in tap water for sterilization purposes, which can cause corrosion. Traditionally, when highly purified water is used, the chlorine is removed by prior purification before it can be used as cooling water. However, with the present invention, by simplifying maintenance, increasing the frequency of maintenance, and assuming part replacement, tap water can be used as cooling water as is.
[0129] This will significantly reduce or even eliminate water treatment costs. Furthermore, because the water treatment equipment itself is no longer necessary, it will be possible to create cooling systems or electrical equipment that uses cooling systems with extremely low running costs, even assuming maintenance. Even though the maintenance frequency has been improved, it will only be reduced from 10 years to 5 years, so it will not become unacceptably frequent.
[0130] It also makes it possible to use industrial water, which is even cheaper than tap water. Although industrial water may contain more impurities and ionic components than tap water, it can still be used as cooling water, provided that proper maintenance is performed.
[0131] Of course, it is also possible to recycle water outside the room, for example by using water that has been treated in a water treatment facility within a factory, thereby contributing to the conservation of water resources. Also, it is possible to recycle water in a closed system by cooling the wastewater 81 with evaporative heat or the like in a radiator outside the room 100 and then using it again as supply water 71. In this case, contamination from the piping and other parts of the circulation route gradually progresses to the water, so the water quality gradually deteriorates, but by taking the reverse approach of assuming maintenance, such water use is possible. [Example]
[0132] This embodiment is an embodiment for explaining an example of control for improving the cooling performance of an electric device 1 provided with a cooling device 20.
[0133] Fig. 18 is a diagram corresponding to Fig. 12 of the first embodiment. The difference from Fig. 12 is that a sensor 93 is provided in one or both of the water supply pipe 70 and the drain pipe 80, or in the cooling device 20 itself. Various types of sensors can be applied, such as a flow meter, a water thermometer, a pressure gauge, and a thermometer. Some or all of these sensors can be provided as appropriate depending on the required management accuracy of the cooling device 20.
[0134] The measured or detected value of this sensor 93 is input as a measured value 305 to a cooling operation control device 301. The cooling operation control device 301 issues one or both of an instruction 306 to the control device and an instruction 307 to the exhaust fan 10.
[0135] As an example of control, for example, if the sensor 93 detects a decrease in the water flow rate, this means a decrease in the capacity of the cooling device 20. If the operation of the electric appliance 1 continues in this state, the temperature in the room will eventually rise and may exceed the operating temperature range of the electric appliance 1. Therefore, the cooling operation control device 301 will increase the cooling capacity as needed by issuing an instruction 306 to the control device to set an upper limit on the operating capacity of the electric appliance 1 or by issuing an instruction 307 to the exhaust fan 10 to increase the exhaust air volume of the exhaust fan.
[0136] Also, although not shown, the cooling operation control device 301 can issue instructions to the pressure pump to increase the amount of water supplied to the cooling device 20, thereby controlling the cooling device 20 to restore or increase its cooling capacity.
[0137] The above examples illustrate the ideas and concepts of the present invention. Of course, the scope of the present invention also includes examples that are realized by combining the examples. Furthermore, as long as the disclosed ideas and concepts are used, any modifications or similar examples are also included within the scope of the present invention.
[0138] Furthermore, one example of the present invention described using the above embodiments can also be expressed as follows.
[0139] <Part 1> An indoor installation type electrical equipment that exhausts air that has flowed in through an air intake port using an exhauster, the indoor installation type electrical equipment having a cooling device in the middle of an exhaust path of the exhauster. <Item 2> The indoor installation type electrical equipment according to <Item 1>, wherein the cooling device is water-cooled. <Item 3> The indoor-installation type electrical equipment according to <Item 1>, wherein the indoor-installation type electrical equipment has an air intake, the air intake being on a side surface and the exhaust fan being on an upper surface. <Item 4> An indoor installation type electrical device according to <Item 2>, having a first connector to which a water supply pipe that supplies cooling water to the cooling device is connected, and a second connector to which a drainage pipe that discharges wastewater from the cooling device is connected. <Item 5> The indoor installation type electrical equipment according to <Item 4>, having an internal water pipe that forms a water path inside the cooling device. <Item 6> An indoor installation type electrical device having a plurality of the cooling devices and having inter-unit connection piping connecting adjacent cooling devices. <Item 7> The indoor installation type electrical equipment according to <Item 5> or <Item 6>, which has a circulation connection pipe connecting the water supply side and the drainage side of the cooling device. <Item 8> The indoor installation type electrical equipment according to <Item 5>, having cooling fins corresponding to the internal water piping. <Item 9> The indoor installation type electrical equipment according to <Item 2>, wherein the cooling device is installed with a space between it and the exhaust fan by a stand, rack, legs, or wind tunnel. <Item 10> The indoor installation type electrical equipment according to <Item 9>, which has a porous water shielding plate below the cooling device or below the water piping and heat dissipation fins inside the cooling device. <Item 11> The indoor installation type electrical device according to <Item 10>, wherein the porous water barrier plate has an inclination. <Item 12> The indoor installation type electrical device according to <Item 11>, wherein the porous water barrier plate is composed of a plurality of layers. <Item 13> The indoor-installation electrical device according to <Item 12>, wherein the porous water barrier plate has a first layer and a second layer, and the positions of the holes in the first layer and the second layer are offset. <Item 14> The indoor-installation electrical device according to <Item 12>, wherein the porous water barrier plate has a first layer and a second layer, and the corresponding relationship between the groove portions and the tops of the first layer and the second layer is shifted. <Item 15> The indoor-installation electrical device according to any one of Items 10 to 14, wherein the porous water barrier is a fiber or resin mesh material, a woven material, or a material having a plate portion and holes. <Item 16> The indoor installation type electrical device according to <Item 15>, wherein the porous water shielding plate is provided with water repellency. <Item 17> The indoor installation type electrical device according to <Item 16>, wherein the water repellency is imparted by a fluorine treatment. <No. 18> An indoor-installed electrical equipment according to <No. 4>, which has a sensor in the water supply pipe, the drainage pipe, or the cooling device, and which judges the cooling status of the cooling device based on information from the sensor, and which has a cooling operation control device that issues a control command to the control device of the indoor-installed electrical equipment or the exhaust fan. <Item 19> The indoor installation type electrical equipment according to <Item 5>, wherein the internal water piping is branched into a plurality of pipes inside the cooling device. <Item 20> The indoor installation type electrical device according to <Item 19>, wherein the internal water piping has a tank that joins with the branched ends.
[0140] The present invention also uses various new technical concepts in the cooling device itself. To list some of them, the present invention can be expressed as follows from the viewpoint of the cooling device. <1> A cooling device that allows ventilation from the bottom to the top and can lower the temperature of the air passing through during the ventilation.
[0141] Furthermore, this cooling device, which allows ventilation from bottom to top and can lower the temperature of the air passing through during this ventilation, is a very unusual configuration. This is because so-called air conditioners are basically configured to blow air downward from top to bottom, or from top to bottom. Even built-in air conditioners blow air downward. Therefore, the configuration of ventilation from bottom to top, while lowering the temperature of the air passing through, is a unique and extremely distinctive configuration of this invention. <Part 2> The cooling device is a water-cooled cooling device. <Part 3> A cooling device according to <Item 2>, having a first connector to which a water supply pipe that supplies cooling water to the cooling device is connected, and a second connector to which a drainage pipe that discharges wastewater from the cooling device is connected. <Part 4> The cooling device according to <Item 3>, further comprising an internal water pipe that forms a water path inside the cooling device. <Part 5> The cooling device according to <Item 2>, further comprising inter-unit connection piping that connects adjacent cooling devices when a plurality of the cooling devices are installed. <Item 6> The cooling device according to <Item 5>, having a circulation connection pipe connecting the water supply side and the water discharge side of the cooling device. <7> The cooling device according to <4>, having cooling fins corresponding to the internal water piping. <Item 8> The cooling device according to <Item 2>, wherein the cooling device is installed with a space between it and the exhaust fan by a stand, rack, legs, or wind tunnel. <Item 9> The cooling device according to <Item 8>, which has a porous water shield below the cooling device or below the water piping and heat dissipation fins inside the cooling device. <Item 10> The cooling device according to <Item 9>, wherein the porous water barrier plate has an inclination. <Item 11> The indoor installation type electrical device according to <Item 9>, wherein the porous water barrier plate is composed of a plurality of layers. <Item 12> The cooling device according to <Item 11>, wherein the porous water barrier has a first layer and a second layer, and the positions of the holes in the first layer and the second layer are offset. <Item 13> A cooling device according to <Item 11>, wherein the porous water barrier has a first layer and a second layer, and the corresponding relationship between the groove portions and the tops is shifted between the first layer and the second layer. <Item 14> A cooling device described in any one of Items 9 to 13, wherein the porous water barrier is a fiber or resin mesh material, a woven material, or a material having a plate portion and holes. <Item 15> The cooling device according to <Item 14>, wherein the porous water barrier plate is provided with water-repellent properties. <Item 16> The cooling device according to <Item 15>, wherein the water-repellent properties are imparted by fluorine treatment. <No. 17> A cooling device according to <No. 3>, which has a sensor in the water supply pipe, the drainage pipe, or the cooling device, and has a cooling operation control device that determines the cooling status based on information from the sensor and issues control commands to electrical equipment in which the cooling device is installed. <No. 18> The cooling device according to <No. 4>, wherein the internal water piping branches into multiple parts inside the cooling device. <Item 19> The cooling device according to <Item 18>, wherein the internal water piping has a tank that merges at the end of its branch. [Explanation of symbols]
[0142] 1: Electrical equipment 2: Air intake 3: Semiconductor device 4: Trance 5: Control equipment 10:Exhauster 20: Cooling device 21: Legs 21A: Frame legs 21B: Mounting surface 22: Wind tunnel 50: Inlet air 51: Exhaust air 52: Internal airflow 60: Compartment wall 70: Water supply piping 71: Water supply 80:Drainage piping 81: Drainage 85: Branch piping 90: Pressure pump 91: Valve 92:Flowmeter 93: Sensor 100: Room 101: Air conditioner indoor unit 102: Air conditioner outdoor unit 103: Air conditioner piping 110: Indoor air 111: Cooling air 112: Circulating air 120: Internal water piping 121: Cooling fin 122: Water tank 125: Circulation connection piping 126: Inter-unit connection piping 130: Porous water barrier 130A: First ventilation and water shielding plate 130B: Second ventilation and water shielding plate 131: Fiber or resin 132: Hole 133: Board part 135: Water drop 136: Water-repellent layer 150: Connector 301: Refrigeration operation control equipment 305: Measurement value 306: Instructions to control devices 307: Instructions for the exhaust fan
Claims
1. An indoor installation type electrical equipment that exhausts air that has flowed in through an air intake port using an exhauster, the indoor installation type electrical equipment having a cooling device in the middle of an exhaust path of the exhauster.
2. 2. The indoor electrical equipment according to claim 1, wherein the cooling device is a water-cooled type.
3. 2. The indoor-installed electrical equipment according to claim 1, wherein the indoor-installed electrical equipment has an air intake, the air intake being on a side surface, and the air exhauster being on a top surface.
4. 3. The indoor electrical equipment according to claim 2, further comprising a first connector to which a water supply pipe for supplying cooling water to the cooling device is connected, and a second connector to which a drainage pipe for discharging drain water from the cooling device is connected.
5. 5. The indoor electrical equipment according to claim 4, further comprising an internal water pipe that forms a water path inside the cooling device.
6. 6. The indoor electrical equipment according to claim 5, further comprising a plurality of the cooling devices, and an inter-unit connection pipe connecting adjacent cooling devices.
7. 7. The indoor installation type electrical equipment according to claim 5, further comprising a circulation connection pipe connecting a water supply side and a water discharge side of the cooling device.
8. 6. The indoor installation type electrical equipment according to claim 5, further comprising cooling fins corresponding to the internal water piping.
9. 3. The indoor installation type electrical equipment according to claim 2, wherein the cooling device is installed on a stand, a rack, legs, or an air tunnel with a space between the cooling device and the air exhauster.
10. 10. The indoor electrical equipment according to claim 9, further comprising a porous water shielding plate below the cooling device or below the water pipes and heat dissipation fins inside the cooling device.
11. The indoor electrical device according to claim 10, wherein the porous water barrier plate has an inclination.
12. The indoor electrical device according to claim 11, wherein the porous water barrier plate is made up of a plurality of layers.
13. 13. The indoor-installation electrical device according to claim 12, wherein the porous water barrier has a first layer and a second layer, and the positions of the holes in the first layer and the second layer are offset.
14. 13. The indoor electrical device according to claim 12, wherein the porous water barrier plate has a first layer and a second layer, and the grooves and the peaks of the first layer and the second layer are misaligned in correspondence with each other.
15. 15. The indoor installation type electrical device according to claim 10, wherein the porous water shielding plate is made of a mesh material of fiber or resin, a woven material, or a material having a plate portion and holes.
16. The indoor electrical device according to claim 15, wherein the porous water shielding plate is provided with water repellency.
17. The indoor electrical device according to claim 16, wherein the water repellency is imparted by a fluorine treatment.
18. The indoor-installed electrical equipment according to claim 4, further comprising a sensor in the water supply pipe or the drainage pipe, which determines the cooling status of the cooling device based on information from the sensor, and which issues a control command to the indoor-installed electrical equipment control device or the exhaust fan.
19. The indoor electrical equipment according to claim 5, wherein the internal water pipe is branched into a plurality of pipes inside the cooling device.
20. 20. The indoor electrical device according to claim 19, wherein the internal water piping has a tank that joins the branched ends of the internal water piping.
Citation Information
Patent Citations
Cooling system of semiconductor power converter
JP2015033182A