Component placing device, flux supply device, component placing system, and component placing method

Abstract

To provide a component mounting device, a flux transfer device, a component mounting system, and a component mounting method which improve work efficiency.SOLUTION: The component mounting apparatus includes a component supply section for supplying a component to be mounted on a substrate, a first stage for holding the substrate, a mounting head for mounting the component on the substrate, a first flux supply device having a first flux supply unit for supplying flux to be adhered to the component, and a beam provided with a moving mechanism for moving the mounting head between a first position where the mounting head receives the component and the first stage. The mounting head includes a tool for holding the component, and a first elevating mechanism for elevating the tool with respect to the first flux supply unit and the first stage. The first flux supply device includes a first suspension tool for suspending the first flux supply unit from the beam. The first flux supply unit is disposed between the first position and the first stage.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a component mounting device, a flux supply device, a component mounting system, and a component mounting method. [Background technology]

[0002] Conventionally, in component mounting devices that mount electronic components such as ICs on a substrate, flux is applied to remove oxides and dirt from the bumps on the underside of the chip-type electronic components or from the electrode parts on the substrate where soldering will be performed before the components are soldered to the substrate.

[0003] For example, Patent Document 1 describes that the underside of an electronic component is brought into contact with a flux reservoir of a flux transfer device to apply flux to solder bumps. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-199326 Summary of the Invention [Problem to be solved by the invention]

[0005] After receiving the components, the mounting head that mounts the components onto the board immerses them in the flux stored in the flux transfer device to apply the flux to the components. To do this, the mounting head must raise and lower each component toward the flux transfer device, which requires time for the flux transfer process. Therefore, there is a need to improve the efficiency of the flux transfer process.

[0006] Therefore, an object of the present disclosure is to provide a component mounting device, a flux supply device, a component mounting system, and a component mounting method that reduce the working time. [Means for solving the problem]

[0007] The component mounting apparatus of the present disclosure includes a component supply unit that supplies components to be mounted on a substrate, a first stage that holds the substrate, a mounting head that mounts the components on the substrate, a first flux supply device having a first flux supply unit that supplies flux to be applied to the components, a first position where the mounting head receives the components, and a beam equipped with a movement mechanism that moves the mounting head between the first stage and the first position. The mounting head includes a tool that holds the components and a first lifting mechanism that raises and lowers the tool relative to the first flux supply unit and the first stage. The first flux supply device includes a first suspender that suspends the first flux supply unit from the beam. The first flux supply unit is disposed between the first position and the first stage.

[0008] The flux supply device of the present disclosure includes a flux supply unit having a second stage formed with a recess for storing flux to be supplied to a component or a transfer pin, a support part that supports the flux supply unit, and a hanging tool that extends upward from the support part and is attached to an end located opposite the support part for hanging the flux supply unit on a member separate from the flux supply unit.

[0009] A component mounting system according to the present disclosure includes a flux supply device having a flux supply unit that supplies flux to components, a mounting head that mounts the flux-coated components onto a substrate, a lifting mechanism that raises and lowers the mounting head relative to the flux supply unit, an inclination adjustment unit that can adjust the flux supply unit to a predetermined inclination relative to the mounting head, a height information acquisition unit that acquires height information of the flux supply unit, and an adjustment amount calculation unit that calculates an adjustment amount necessary to set the flux supply unit to a desired inclination based on multiple pieces of height information for the flux supply unit. The flux supply unit is suspended from a beam that movably supports the mounting head.

[0010] The component mounting method of the present disclosure includes the steps of: moving a second stage, which has a recess formed therein for storing flux to be supplied to the component or transfer pin, to a supply position where the second stage can supply flux to the component or transfer pin; measuring the height of each of the predetermined locations on the recess by lowering a jig attached to the mounting head that mounts the component or the transfer head using an elevation mechanism and bringing it into contact with multiple predetermined locations on the recess of the second stage that has moved to the supply position; and calculating the amount of adjustment required to optimize the tilt of the second stage relative to the mounting head or transfer head based on the heights of the multiple predetermined locations. The flux supply unit having the second stage is suspended from a beam that movably supports the mounting head or transfer head. [Effects of the Invention]

[0011] According to the present disclosure, it is possible to provide a component mounting device, a component mounting system, a flux transfer device, and a component mounting method that improve work efficiency. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a side view showing a schematic configuration of a component mounting device according to a first embodiment. [Figure 2] A side view of the component mounting device with the mounting head positioned at the flux application position. [Figure 3] A side view of the component mounting device in which the mounting head is applying flux to the component that has been picked up [Figure 4] A side view of the component mounting device in a state where the mounting head is transporting a component with flux attached to it toward the mounting position. [Figure 5] A side view of the component mounting device with the mounting head located at the mounting position. [Figure 6] A side view of the component mounting device in a state where the mounting head is mounting a component onto a board. [Figure 7] Front perspective view of the flux supply device [Figure 8] An explanatory diagram showing the configuration around the support part of the sling [Figure 9] FIG. 10 is an explanatory diagram showing a side view of the stage support member with the support portion of the hanger seen through; [Figure 10] FIG. 10 is an explanatory diagram showing a stage support member having a large inclination angle relative to the support portion of the hanger. [Figure 11] FIG. 1 is a front view of the component placement device showing the stage of the flux supply device in the supply position. [Figure 12] A front view of the component mounting device showing the stage of the flux supply device in the standby position. [Figure 13] FIG. 1 is a block diagram showing a functional configuration of a component mounting device according to a first embodiment. [Figure 14] Perspective view of the jig [Figure 15] Plan view of flux supply device [Figure 16] An explanatory diagram showing adjustment instructions displayed on the touch panel [Figure 17] Flowchart for adjusting the flatness of the stage of the flux supply unit [Figure 18] An explanatory diagram explaining the rotation state of the jig [Figure 19] An explanatory diagram explaining the rotation state of the jig [Figure 20] FIG. 10 is a side view showing a schematic configuration of a component mounting device according to a second embodiment. [Figure 21] FIG. 10 is a block diagram showing the functional configuration of a component mounting device according to a second embodiment. [Figure 22] A side view of the component mounting device with the transfer head positioned at the standby position. [Figure 23] A side view of the component mounting device with the transfer head positioned at the flux application position. [Figure 24] A side view of the component mounting device with flux being applied to the tip of the pin of the transfer head. [Figure 25] A side view of the component mounting device in a state where a transfer head with flux attached to the tip of the pin is being transported to the mounting position [Figure 26] A side view of the component mounting device with the transfer head transferring flux onto the board. [Figure 27]FIG. 10 is a side view showing a schematic configuration of a component mounting device according to a modified example of the second embodiment. [Figure 28] A side view of the component mounting device in a state where a transfer head with flux attached to the tip of the pin is being transported to the mounting position [Figure 29] A side view of the component mounting device with the transfer head transferring flux onto the board. [Figure 30] Block diagram showing the general configuration of the component mounting system DETAILED DESCRIPTION OF THE INVENTION

[0013] A component mounting apparatus according to a first aspect of the present disclosure includes a component supply unit that supplies components to be mounted on a substrate, a first stage that holds the substrate, a mounting head that mounts the components on the substrate, a first flux supply device having a first flux supply unit that supplies flux to be applied to the components, a first position where the mounting head receives the components, and a beam equipped with a movement mechanism that moves the mounting head between the first stage and the mounting head. The mounting head includes a tool that holds the components and a first lifting mechanism that raises and lowers the tool relative to the first flux supply unit and the first stage. The first flux supply device includes a first suspender that suspends the first flux supply unit from the beam. The first flux supply unit is disposed between the first position and the first stage.

[0014] Even if there is no space to place the first flux supply unit on the side of the first stage that holds the substrate, the first flux supply unit can be placed between the first position where the mounting head receives the component and the first stage because the first flux supply unit is suspended from the beam by the first suspender. Also, when applying flux to the component, the access distance is shorter if the first flux supply unit is lowered onto the first flux supply unit suspended from the beam than if it were lowered to the vicinity of the first stage, thereby reducing the time required for component mounting.

[0015] According to a second aspect of the present disclosure, in the component mounting device of the first aspect, the first flux supply unit is capable of moving back and forth between a supply position where flux can be supplied to the component and a standby position where flux cannot be supplied.

[0016] According to a third aspect of the present disclosure, the component mounting device of the second aspect is provided with a camera that captures images of components supported by the mounting head, and the camera is positioned below the first flux supply device so as to overlap the first flux supply unit at the supply position in a plan view.

[0017] According to a fourth aspect of the present disclosure, in the component mounting device of the second or third aspect, the first hanger has a support portion that supports the first flux supply unit, an extension portion that extends from the support portion toward the beam, and a fixing portion that is provided at an end of the extension portion that is located opposite the support portion and is fixed to the beam.

[0018] According to a fifth aspect of the present disclosure, in the component mounting device of the fourth aspect, the extending portion includes a first extending member and a second extending member provided on both sides of the first flux supply unit, respectively. Fixing members for fixing the first flux supply unit to the beam are provided on a first end of the first extending member located opposite the support portion side and a second end of the second extending member located opposite the support portion side.

[0019] According to a sixth aspect of the present disclosure, in the component mounting device of the fourth or fifth aspect, the support part includes a first support member that supports the first flux supply unit from below. The component mounting device further includes an inclination adjustment part that is provided on the first flux supply unit and that is capable of adjusting the inclination of the first flux supply unit by rotating the first flux supply unit about the first support member as a central axis.

[0020] According to a seventh aspect of the present disclosure, in the component mounting device of the sixth aspect, the support portion further includes a pair of second support members provided on both sides of the first flux supply unit and supporting both end portions of the first support member. The inclination adjustment portion includes a first height adjustment portion supported by one of the pair of second support members and capable of changing the height of the first flux supply unit relative to one of the pair of second support members, and a second height adjustment portion supported by the other of the pair of second support members and capable of changing the height of the first flux supply unit relative to the other of the pair of second support members.

[0021] According to an eighth aspect of the present disclosure, in the component mounting device of the seventh aspect, the first flux supply unit includes a second stage having a recess formed therein for storing flux, and a stage support member that supports the second stage from below so that the second stage can move between a supply position and a standby position. The first height adjustment unit and the second height adjustment unit are provided on the stage support member, facing each other, on both sides of the second stage. The first height adjustment unit is also supported by one of the second support members so as to change the height of the stage support member relative to one of the second support members. The second height adjustment unit is also supported by the other second support member so as to change the height of the stage support member relative to the other second support member.

[0022] According to a ninth aspect of the present disclosure, the component mounting device of any of the sixth to eighth aspects further includes a height measuring jig attachable to a tip of the mounting head, a height information acquiring unit that acquires height information of the first flux supply unit based on the height of the jig that has contacted the first flux supply unit by the first lifting mechanism, and an adjustment amount calculating unit that calculates an adjustment amount for adjusting the tilt adjusting unit to tilt the first flux supply unit at a desired angle based on heights of multiple points on the first flux supply unit.

[0023] According to a tenth aspect of the present disclosure, in the component mounting device of the ninth aspect, the first flux supply unit includes a second stage having a recess formed therein for storing flux, and a drive unit that moves the second stage between a supply position and a standby position. The height information acquisition unit acquires the height of the recess based on the height of a jig that contacts the recess of the second stage moved to the supply position. The adjustment amount calculation unit calculates an adjustment amount for adjusting the tilt adjustment unit to set the recess at a desired tilt based on the acquired heights of multiple points in the recess.

[0024] According to an eleventh aspect of the present disclosure, the component mounting device of the ninth or tenth aspect further comprises a display unit that displays the adjustment amount calculated by the adjustment amount calculation unit.

[0025] According to a twelfth aspect of the present disclosure, the component mounting device of any one of the first to eleventh aspects further comprises a transfer head that is movably arranged between the first flux supply device and the first stage and has a plurality of transfer pins for transferring the flux supplied from the first flux supply device onto the substrate.

[0026] According to a thirteenth aspect of the present disclosure, the component mounting apparatus of any one of the first to eleventh aspects further includes a second flux supply device having a second flux supply unit that supplies flux to be transferred to a substrate, and a transfer head that is provided movably between the second flux supply device and the first stage and has a plurality of transfer pins for transferring the flux supplied from the second flux supply unit to the substrate. The second flux supply device has a second suspender that suspends the second flux supply unit from a beam.

[0027] A flux supplying device according to a fourteenth aspect of the present disclosure includes a flux supplying unit having a second stage formed with a recess for storing flux to be supplied to a component or a transfer pin, a support part for supporting the flux supplying unit, and a hanger extending upward from the support part and attached to an end opposite the support part for suspending the flux supplying unit from a member separate from the flux supplying unit.

[0028] According to a fifteenth aspect of the present disclosure, in the flux supply device of the fourteenth aspect, the hanger has an extension portion extending upward from the support portion, and a fixing portion provided at an end of the extension portion located opposite the support portion and fixed to a member separate from the flux supply unit.

[0029] According to a sixteenth aspect of the present disclosure, in the flux supply device of the fourteenth or fifteenth aspect, the support portion includes a first support member that supports the flux supply unit from below and a pair of second support members that are provided on both sides of the flux supply unit and supported by both ends of the first support member. The flux supply unit includes a first height adjustment portion supported on one of the pair of second support members to change the height of the flux supply unit relative to one of the pair of second support members, and a second height adjustment portion supported on the other of the pair of second support members to change the height of the flux supply unit relative to the other of the pair of second support members.

[0030] A component mounting system according to a seventeenth aspect of the present disclosure includes a flux supply device having a flux supply unit that supplies flux to components, a mounting head that mounts the flux-coated components onto a substrate, a lifting mechanism that raises and lowers the mounting head relative to the flux supply unit, an inclination adjustment unit that can adjust the flux supply unit to a predetermined inclination relative to the mounting head, a height information acquisition unit that acquires height information about the flux supply unit, and an adjustment amount calculation unit that calculates an adjustment amount necessary to adjust the flux supply unit to a desired inclination based on multiple pieces of height information about the flux supply unit. The flux supply unit is suspended from a beam that movably supports the mounting head.

[0031] A component mounting method according to an eighteenth aspect of the present disclosure includes the steps of: moving a second stage, having a recess formed therein for storing flux to be supplied to the component or the transfer pin, to a supply position where the flux can be supplied to the component or the transfer pin; lowering a jig attached to the mounting head for mounting the component or the transfer head for transferring flux to the transfer pin by an elevation mechanism to bring the jig into contact with multiple predetermined locations in the recess of the second stage moved to the supply position and measuring the height of each predetermined location in the recess; and calculating an adjustment amount for optimizing the tilt of the second stage relative to the mounting head or the transfer head based on the heights of the multiple predetermined locations. A flux supply unit having the second stage is suspended from a beam that movably supports the mounting head or the transfer head.

[0032] Hereinafter, exemplary embodiments of a component mounting device, a flux supply device, a component mounting system, and a component mounting method according to the present disclosure will be described with reference to the accompanying drawings. The present disclosure is not limited to the specific configurations of the following embodiments, and configurations based on similar technical ideas are also included in the present disclosure.

[0033] [Embodiment 1] (Overall composition) A component mounting apparatus 1 according to an embodiment of the present disclosure will be described below with reference to FIGS. 1 to 6. FIG. 1 is a side view showing a schematic configuration of a component mounting apparatus 1 including a flux supplying apparatus 15 according to an embodiment of the present disclosure. FIG. 2 is a side view of the component mounting apparatus 1 in a state where the mounting head 12 is positioned at a flux application position Pc. FIG. 3 is a side view of the component mounting apparatus 1 in a state where the mounting head 12 is applying flux to a component 203 that has been picked up. FIG. 4 is a side view of the component mounting apparatus 1 in a state where the mounting head 12 is transporting the component 203 to which flux has been applied toward a mounting position Pa. FIG. 5 is a side view of the component mounting apparatus 1 in a state where the mounting head 12 is positioned at a mounting position Pa. FIG. 6 is a side view of the component mounting apparatus 1 in a state where the mounting head 12 is mounting a component 203 on a substrate 201.

[0034] 1, the component mounting device 1 includes a component supply unit 11, a mounting head 12, a stage 13, a flux supply unit 15, and a beam 17. The component mounting device 1 further includes a camera 18, a control unit 19, a touch panel 20, a base 21, a component supply unit movement unit 23, a pickup head 31, a stage movement unit 25, and a stage tilt adjustment unit 29.

[0035] The component mounting device 1 mounts components 203, such as semiconductor chips, on a substrate 201 serving as a workpiece. A stage 13 that holds the substrate 201 and a component supply unit 11 are arranged on a base 21, aligned in the Y-axis direction.

[0036] The component supply unit 11 supplies components 203. The component supply unit 11 is provided on the component supply unit movement unit 23. The component supply unit movement unit 23 is controlled by the control unit 19 and moves the component supply unit 11 in the X and Y directions. The component supply unit movement unit 23 is, for example, a combination of a rack and pinion, or a combination of a motor and a ball screw that can be driven in the X and Y directions, and a combination of a motor and a spur gear for θ-axis rotation. A plurality of components 203 are held above the component supply unit 11. The components 203 are held above the component supply unit 11 in a state where they are placed on a tray or attached to an adhesive sheet.

[0037] The stage 13 is provided above the stage moving unit 25. The stage moving unit 25 is controlled by the control unit 19 and moves the stage 13 in the X and Y directions. The stage 13 carries in the substrate 201, for example, by a transport rail, and positions and holds the substrate 201 at a position where the component 203 is to be mounted. The stage 13 also carries out the substrate 201 on which the component 203 is mounted to the next process, for example, by a transport rail.

[0038] Inside the stage 13, there are provided a stage heating unit 27 that heats the held substrate 201 and a temperature sensor (not shown) that measures the temperature of the heated stage 13. The stage heating unit 27 is controlled by the control unit 19, and heats the stage 13 to a specified temperature. The temperature measured by the thermometer inside the stage 13 is sent to the control unit 19.

[0039] The stage tilt adjustment unit 29 is provided inside the stage movement unit 25, and can adjust the tilt of the mounting head 12 relative to the head surface by rotating the stage 13 around two axes (X-axis and Y-axis) that are perpendicular to the surface of the stage 13. The stage tilt adjustment unit 29 has, for example, a cam mechanism provided at each of the four corners of the stage 13, and a linear cam provided for each cam mechanism moves left and right to move the cam followers up and down, with each mechanism moving up and down independently.

[0040] The component 203 is held on the component supply unit 11 with the bumps formed on the back surface of the component 203 facing upward. A pickup head 31 is disposed above the component supply unit 11. The pickup head 31 picks up and removes the component 203 from the component supply unit 11. The pickup head 31 rotates around the X-axis as its rotation axis by a pickup head drive unit (not shown) controlled by the control unit 19, and further moves to a transfer position Pb, which will be described later. That is, the pickup head 31 holds the component 203 at the transfer position Pb with the bumps facing downward.

[0041] A mounting head 12 is disposed above the pickup head 31 and the component supply unit 11. The mounting head 12 holds a supplied component 203 and mounts it on a substrate 201 supported by the stage 13. The mounting head 12 is moved in the Y-axis direction by a mounting head moving mechanism 33 controlled by the control unit 19. The mounting head moving mechanism 33 is provided on the beam 17. The mounting head moving mechanism 33 includes, for example, a rail 34 disposed on the beam 17 along the Y-axis direction, and a linear motor (not shown) that moves the mounting head 12. The drive amount of the linear motor is controlled by the control unit 19, and the mounting head 12 can move the beam 17 along the rail 34 by the drive amount of the linear motor.

[0042] The beam 17 is a member extending in the Y-axis direction and movably supports the mounting head 12 and the flux supply device 15. Although not shown in Fig. 1, both ends of the beam 17 in the Y-axis direction are supported, for example, by a housing that surrounds the components of the component mounting device 1. The lower surface of the beam 17 is disposed, for example, approximately parallel to a horizontal plane.

[0043] A tool 35 for suction-holding the component 203 is provided at the bottom end of the mounting head 12. The mounting head 12 receives the component 203 by suction-pushing the tool 35 from the pickup head 31 at the transfer position Pb. The mounting head moving mechanism 33 moves the mounting head 12 from the transfer position Pb to a flux application position Pc where flux is applied to the underside of the component 203.

[0044] The mounting head 12 is provided with a component heating unit 37 that heats the component 203 picked up by the tool 35, and a tool temperature sensor 39 that measures the temperature of the tool 35 heated by the component heating unit 37. The component heating unit 37 is controlled by the control unit 19, and heats the tool 35 to a specified temperature. The temperature of the tool 35 measured by the tool temperature sensor 39 is sent to the control unit 19.

[0045] The mounting head 12 is provided with a tool lifting mechanism 41 that raises and lowers the tool 35. The mounting head 12 also has a pressure sensor 43 that measures the load with which the tool lifting mechanism 41 presses the tool 35, which holds the component 203, against the substrate 201.

[0046] The tool lifting mechanism 41 is driven and controlled by the mounting control unit 93 of the control unit 19, and lowers the tool 35 so that the tool 35 mounts the component 203 on the substrate 201 with a specified load. The tool lifting mechanism 41 includes, for example, a linear motor that raises and lowers the tool 35, and an encoder that measures the amount of drive of the linear motor. The load measured by the pressure sensor 43 is transmitted to the control unit 19.

[0047] The mounting head 12 may be provided with an ultrasonic oscillator 45 that ultrasonically vibrates the tool 35. The ultrasonic oscillator 45 is driven and controlled by the control unit 19, and when mounting the component 203 on the substrate 201 by ultrasonic bonding, the ultrasonic oscillator 45 ultrasonically vibrates the tool 35 at specified ultrasonic power, amplitude, and frequency. When mounting the component 203 on the substrate 201 by thermocompression bonding only, the ultrasonic oscillator 45 does not need to be provided in the mounting head 12.

[0048] Touch panel 20, which is communicatively connected to control unit 19, displays an operation menu and information on the operating status of component mounting device 1 on its display screen, and operation buttons displayed on the display screen can be used to input data to control unit 19 and operate component mounting device 1. Touch panel 20 may be a portable terminal or may be installed on component mounting device 1. Instead of touch panel 20, a combination of a liquid crystal monitor and an input unit such as operation buttons, a keyboard, and a mouse may be used.

[0049] The camera 18 captures an image of the component 203 supported by the mounting head 12. The camera 18 is disposed between the component supply unit 11 and the stage 13, for example, at the flux application position Pc. The camera 18 is disposed below the flux supply device 15 so as to overlap with the flux supply unit 51 at the supply position Pd in ​​a plan view.

[0050] Therefore, when the mounting head 12 supporting the component 203 is located at the flux application position Pc and the flux supply unit 51 is located at the standby position Pe, the mounting head 12 that has received the component 203 is located directly above the camera 18. The camera 18 captures an image of the component 203 held by the tool 35 and transmits the captured image to the control unit 19. When an image of the underside of the component 203 after the flux 3 has been applied to the component 203 is captured, the control unit 19 recognizes the shape of the captured component 203 and the amount of rotation from the reference position, and further recognizes the state of flux application. During the component mounting operation in which the mounting head 12 mounts the component 203 on the board 201, the control unit 19 corrects the orientation of the component 203 based on the image of the component 203 captured by the camera 18.

[0051] Note that before the flux 3 is applied to the component 203, an image of the underside of the component 203 may be captured, and the control unit 19 may recognize the state of the underside of the component 203. The camera 18 may be disposed at a position away from directly below the flux supply device 15.

[0052] Next, the movement of the mounting head 12 will be described with reference to Figures 2 to 6. When the mounting head 12, which has picked up the component 203, arrives at the flux application position Pc from the transfer position Pb as shown in Figure 2, the mounting head 12 lowers the tool 35 using the tool lifting mechanism 41 to apply the flux 3 to the bumps on the back surface of the component 203 as shown in Figure 3. In this specification, the flux 3 may include not only the flux itself but also a solder paste containing flux.

[0053] After the flux 3 is applied to the rear surface of the component 203, the mounting head 12 raises the component 203 using the tool lifting mechanism 41, as shown in Fig. 4, and the mounting head moving mechanism 33 moves the mounting head 12 from the flux application position Pc to the mounting position Pa where the stage 13 holds the substrate 201. When the mounting head 12, which has picked up the component 203, arrives at the mounting position Pa as shown in Fig. 5, the mounting head 12 lowers the tool 35 using the tool lifting mechanism 41 to mount the component 203 on the substrate 201 as shown in Fig. 6.

[0054] (Configuration of flux supply device) Next, the flux supply device 15 will be described with reference to Figures 6 and 7. Figure 7 is a perspective view of the flux supply device 15.

[0055] The flux supply device 15 supplies flux to be attached to the component 203. The flux supply device 15 includes a flux supply unit 51 that supplies flux, a suspender 52 that suspends the flux supply unit 51 from the beam 17, and an inclination adjustment unit 77 that can adjust the inclination angle of the flux supply unit 51.

[0056] The flux supply unit 51 includes a stage 53 , a drive unit 54 , a flux supply unit 55 , a stage support member 56 , and a pair of rails 57 .

[0057] The stage support member 56 supports the stage 53 from below so that the stage 53 can move between a supply position Pd and a standby position Pe (see FIGS. 11 and 12). A pair of rails 57 is disposed on the substantially rectangular stage support member 56. The stage 53 is disposed on the pair of rails 57 so that it can slide.

[0058] The stage 53 supplies flux to the mounting head 12. The stage 53 is, for example, a rectangular plate made of metal or resin, and has a recess 58 on one end side. The flux is stored in the recess 58.

[0059] The driving unit 54 reciprocates the stage 53 between a supply position Pd and a standby position Pf. The driving unit 54 includes a driving motor 59, a ball screw 60, and a fixed block 61.

[0060] The drive motor 59 rotates the ball screw 60 forward and backward, causing a fixed block 61, which is a nut engaged with the ball screw 60, to move back and forth. The fixed block 61 is fixed to the other end of the stage 53. Therefore, the stage 53 moves back and forth as the ball screw 60 rotates.

[0061] The flux supply unit 55 supplies flux to the recess 58 of the stage 53. The flux supply unit 55 includes a flux reservoir 62 and a pair of arms 63.

[0062] The flux reservoir 62 has a hollow cylindrical through-hole and has openings at both the bottom and top. The flux reservoir 62 stores flux therein. The bottom opening of the flux reservoir 62 is blocked by the top surface of the stage 53, so that the flux inside the flux reservoir 62 does not leak out. A pair of arms 63 are connected to the flux reservoir 62, and the outer ends of the arms 63 are fixed to the stage support member 56.

[0063] The suspending device 52 comprises a support portion 64 that supports the flux supply unit 51, an extension portion 65 that extends from the support portion 64 toward the beam 17, and a fixing portion 67 that is provided at the end of the extension portion 65 opposite the support portion 64 and is fixed to the beam 17.

[0064] The fixed portion 67, the extending portion 65, and the supporting portion 64 are integrated and fixed to the beam 17 by welding or screwing, and therefore each maintains a fixed posture relative to the beam 17. The fixed portion 67 is fixed to the beam 17 by a fastening member such as a bolt or a clamp mechanism, for example, and fixes the flux supply unit 51 to the beam 17 via the extending portion 65 and the supporting portion 64. Note that the suspending device 52 may be configured so that the extending portion 65 is directly fixed to the beam 17 by a bolt without using the fixed portion 67.

[0065] The extending portion 65 suspends and supports the supporting portion 64. The extending portion 65 includes a first extending member 69 and a second extending member 71 provided on both sides of the flux supply unit 51. Fixing portions 67 for fixing the flux supply unit 51 to the beam are provided on a first end 70 of the first extending member 69 located opposite the supporting portion 64 side, and on a second end 72 of the second extending member located opposite the supporting portion 64 side. Supporting the flux supply unit 51 with two extending members makes it possible to hold the flux supply unit 51 more stably.

[0066] The support part 64 supports the flux supply unit 51 in such a way that the tilt thereof is adjustable. The support part 64 includes a first support member 73 that supports the flux supply unit 51 from below, and a pair of second support members 75. The first support member 73 extends in the width direction (Y-axis direction) of the stage 53, and the stage 53 is supported together with the stage support member 56 on a protrusion 74 provided in the center of the first support member 73 (see FIG. 9).

[0067] A pair of second support members 75 are provided on both sides of the flux supply unit 51 in the width direction and support both ends of the first support member 73. Each second support member 75 extends in the longitudinal direction of the stage 53, and the stage 53 is disposed between the pair of second support members 75. One end of the first support member 73 in the Y-axis direction, the first extension member 69, and one of the second support members 75 are fixed by fastening members such as bolts, and the other end of the first support member 73 in the Y-axis direction, the second extension member 71, and the other second support member 75 are fixed by fastening members such as bolts.

[0068] The inclination adjustment part 77 is provided on the flux supply unit 51 and adjusts the inclination angle of the flux supply unit 51 by slightly rotating the flux supply unit 51 around the first support member 73 extending in the width direction (Y-axis direction) as a central axis. In this way, the inclination adjustment part 77 can adjust the inclination of the flux supply unit 51 with respect to the head surface of the mounting head 12, and can adjust the flatness of the flux supply unit 51.

[0069] The inclination adjustment unit 77 includes a first micrometer head 79 as a first height adjustment unit supported by one of the pair of second support members 75 so as to be able to change the height of the flux supply unit 51 relative to one of the pair of second support members 75, and a second micrometer head 81 as a second height adjustment unit supported by the other second support member 75 so as to be able to change the height of the flux supply unit 51 relative to the other of the pair of second support members 75. By adjusting the first and second micrometer heads 79, 81, the inclination of the flux supply unit 51 can be adjusted, thereby improving the work efficiency of the worker.

[0070] The first and second micrometer heads 79, 81 are fixed to the stage support member 56, facing each other, on both sides of the stage 53. The first micrometer head 79 is also supported by one of the second support members 75, allowing the height of the stage support member 56 relative to one of the second support members 75 to be changed. The second micrometer head 81 is also supported by the other second support member 75, allowing the height of the stage support member 56 relative to the other second support member 75 to be changed. The first and second micrometer heads 79, 81 rotate the stage support member 56 relative to the first support member 73 by varying the distance from the second support member 75, which has a constant inclination (height). This allows the tilt angle of the stage support member 56 to be adjusted easily and accurately.

[0071] Next, the tilt adjustment of the flux supply unit 51 by the tilt adjustment part 77 will be described with reference to Figs. 8 to 10. Fig. 8 is a side view of the periphery of the support part 64 of the suspender 52. Fig. 9 is an explanatory diagram showing a side view of the stage support member 56 seen through the support part 64 of the suspender 52. Fig. 10 is an explanatory diagram showing the stage support member 56 with a large tilt angle relative to the support part 64 of the suspender 52.

[0072] The first micrometer head 79 has a thimble 83, a spindle 85, and a sleeve 87. When an operator rotates the thimble 83, the length of the spindle 85 can be adjusted, and the length of the spindle 85 can be read from the scale on the sleeve 87.

[0073] Holder 80, which supports first micrometer head 79, and holder 89, which is disposed apart from holder 80 in the X-axis direction, each have a plate 91 connected to their respective lower portions, which are fixed to the side surface of stage support member 56 by, for example, screws 92. Holder 80 is fixed to second support member 75 by screws 88 via a biasing member such as a spring, and holder 89 is similarly fixed to second support member 75 by screws 90 via a biasing member such as a spring.

[0074] The tip of the spindle 85 of the first micrometer head 79 contacts the upper surface of one of the second support members 75. Because the holder 80 is biased toward the second support member 75, shortening the length of the spindle 85 reduces the height of the holder 80 relative to the second support member 75, causing the recessed portion 58 side of the stage support member 56 to tilt downward with the protrusion 74 on the first support member 73 as a fulcrum. Increasing the length of the spindle 85 increases the height of the holder 80 relative to the second support member 75, causing the recessed portion 58 side of the stage support member 56 to tilt upward with the protrusion 74 on the first support member 73 as a fulcrum, as shown in FIG. 10 . Note that FIG. 10 exaggerates the tilt of the stage support member 56 to make it easier to understand. Similarly, on the other side of the second support member 75, the tilt of the stage support member 56 can be adjusted by rotating the thimble 83 of the second micrometer head 81. In this way, the tilt of the stage support member 56 and the stage 53 around the Y axis can be adjusted at three points: the protrusion 74 of the first support member 73 and the tips of the spindles 85 of the first and second micrometer heads 79, 81.

[0075] Next, the supply position and standby position of the stage 53 of the flux supply device 15 will be described with reference to Figures 11 and 12. Figure 11 is a side view of the component mounting device 1 showing the stage 53 of the flux supply device 15 at the supply position. Figure 12 is a side view of the component mounting device 1 showing the stage 53 of the flux supply device 15 at the standby position.

[0076] The flux supply device 15, which is positioned at the flux application position Pc in the Y-axis direction, moves the stage 53 back and forth in the X-axis direction between the supply position Pd and the standby position Pe. As shown in FIG. 11 , when the stage 53 is positioned at the supply position Pd, the recess 58 of the stage 53 is positioned below the tool 35 of the mounting head 12, which is positioned at the flux application position Pc. Furthermore, the camera 18 is positioned below the recess 58 of the stage 53. Therefore, when the mounting head 12, which has picked up the component 203, descends, flux can be applied to the underside of the component 203. Furthermore, when the stage 53 is positioned at the supply position Pd, the camera 18 cannot capture an image of the component 203 picked up by the tool 35.

[0077] As shown in FIG. 12, when the stage 53 is located at the standby position Pe, the camera 18 can capture an image of the component 203 that is being sucked by the tool 35 of the mounting head 12 that is located at the flux application position Pc.

[0078] Next, the control unit 19 will be described with reference to Fig. 13. The control unit 19 is communicatively connected to the touch panel 20, the component supply unit moving unit 23, the stage moving unit 25, the stage tilt adjusting unit 29, the mounting head moving mechanism 33, the component heating unit 37, the tool temperature sensor 39, the tool lifting mechanism 41, the pressure sensor 43, the ultrasonic oscillator 45, the driving unit 54, and the tilt adjusting unit 77.

[0079] The control unit 19 is configured to control the component mounting device 1. The control unit 19 is a circuit including semiconductor elements, and includes, for example, a general-purpose processor such as a CPU, MPU, FPGA, DSP, or ASIC that executes a program to realize a predetermined function. The control unit 19 has a storage unit 95 such as a memory, a hard disk, or an SSD, and realizes its function by executing a program stored in the storage unit 95.

[0080] The control unit 19 includes a mounting control unit 93 , a storage unit 95 , a height information acquisition unit 97 , and an adjustment amount calculation unit 99 .

[0081] The mounting control unit 93 controls the operation of the component supply unit moving unit 23, the stage moving unit 25, the stage tilt adjustment unit 29, the mounting head moving mechanism 33, the tool lifting mechanism 41, and the drive unit 54 based on the production program 96 in the memory unit 95.

[0082] The production program 96 is a program required to operate the component mounting device 1. The production program 96 also includes information such as the component mounting positions (coordinates) on the substrate 201, the names and mounting order of the components 203 to be mounted there, and the tilt angle of the flux supply unit 51 for each component 203.

[0083] The height information acquiring unit 97 detects the height of at least three points on the stage 53 of the flux supply unit 51. For example, the height information acquiring unit 97 acquires the height of each of the four corners of a recess 58 arranged on the stage 53 as described below.

[0084] The adjustment amount calculation unit 99 detects the flatness of the stage 53 based on the detected heights of at least three points on the stage 53 and assists in bringing the stage 53 closer to a plane parallel to the beam 17 by reducing the variation in height to zero. The adjustment amount calculation unit 99 calculates the adjustment amount to be performed by the tilt adjustment unit 77 to level the recess 58 of the stage 53 based on the height of the flux supply unit 51, for example, the heights of the four corners of the recess 58 arranged on the stage 53. That is, the adjustment amount calculation unit 99 calculates the adjustment amount so that the inclination of the stage 53 becomes perpendicular to the mounting head 12. The operator adjusts the height of the stage 53 of the flux supply unit 51 using the tilt adjustment unit 77 based on the calculated adjustment amount. The operator then moves the stage 53 closer to being perpendicular to the mounting head 12, which is moving up and down.

[0085] The adjustment amount calculation unit 99 displays the calculated adjustment amount in the tilt adjustment unit 77 on the touch panel 20 as a display unit for the operator.

[0086] Next, we will explain how to calculate the adjustment amount by the tilt adjustment unit 77. The control unit 19 adjusts the flatness of the flux supply unit 51 by executing a flatness adjustment mode. In this flatness adjustment mode, a dedicated jig 101 is used to measure the flatness of the recess 58 of the stage 53 of the flux supply unit 51.

[0087] 14, the flatness measurement jig 101 is a square flat plate having one protrusion 102 protruding downward from a part of the bottom surface. The jig 101 can be attached to and detached from the bottom surface of the tool 35 by means of a claw member 103 fixed to the tool 35, with the protrusion 102 facing downward. Therefore, before starting the flatness adjustment mode, the operator attaches the jig 101 to the tool 35.

[0088] The height information acquisition unit 97 drives and controls the tool lifting mechanism 41 to lower the jig 101 to which the jig 101 is attached, so that the protrusion 102 comes into contact with the recess 58 of the stage 53. By reading the value of the encoder of the tool lifting mechanism 41 to determine the amount of descent at this time, the height of the recess 58 can be acquired.

[0089] In this embodiment, the protrusion 102 is attached by rotating it 90 degrees, 180 degrees, and 270 degrees from the initial position (0 degrees) of the protrusion 102 in the state shown in Fig. 14. By detecting the height of the recess 58 when the position of the protrusion 102 is 0 degrees, 90 degrees, 180 degrees, and 270 degrees, the heights of the four corners of the recess 58 can be detected.

[0090] As shown in Figure 15, the stage 53 is supported by the protrusion 74 of the first support member 73, and its height is adjusted by the first and second micrometer heads 79, 81. If the coordinate A (0,0,0) of the protrusion 74 is set as the origin, the tip of the second micrometer head 81 and the tip of the first micrometer head 79 are symmetrical with respect to the Y axis, and therefore the coordinate B of the tip of the second micrometer head 81 and the coordinate C of the tip of the first micrometer head 79 can be expressed as (-Xa, -Ya, Zb) and (-Xa, -Ya, Zc), respectively. Here, Xa and Ya are predetermined values, and Zb and Zc are adjustable variables.

[0091] The coordinates of the four corners of recess 58 of stage 53 can also be expressed as P1 (-Xb, -Yb, Zp1), P2 (-Xb, -Yb, Zp2), P3 (Xb, -Yc, Zp3), and P4 (Xb, -Yb, Zp4). Points P1 and P4, and points P2 and P3 are symmetrical with respect to the Y axis, and Xb, Yb, and Yc are predetermined values, so Zp1 to Zp4 are variables that change depending on the height.

[0092] Therefore, when the heights of the points P1 to P4 are measured using the jig 101, for example, the following detection results can be obtained. Zp1=0.100 (5) Zp2=0.200 (6) Zp3=0.300 (7) Zp4=0.400 (8) The storage unit 95 already stores data on the amount of change in the tilt of the recess 58 of the stage 53 when Zc (or Zb) is changed while Zb (or Zc) is a constant value. For example, the storage unit 95 stores the amounts of change in Zp1, Zp2, Zp3, and Zp4 when Zc is changed when Zb = 0 mm. Specifically, if Zc = 0.3 mm when Zb = 0 mm, data such as Zp1 = 0.00 mm, Zp2 = 0.04 mm, Zp3 = 0.06 mm, and Zp4 = 0.09 mm is stored; or if Zc = 0.0 mm when Zb = 0 mm, data such as Zp1 = 0.00 mm, Zp2 = 0.00 mm, Zp3 = 0.01 mm, and Zp4 = 0.01 mm is stored. From these data, it can be seen that the inclination of the recess 58 of the stage 53 is smaller for the values ​​of Zp1 to 4 at Zc = 0.0 mm than for the values ​​of Zp1 to 4 at Zc = 0.3 mm, so when Zc = 0.3 mm, adjusting the first micrometer head 79 toward Zc = 0.0 mm reduces the inclination of the recess 58 of the stage 53.

[0093] The adjustment amount calculation unit 99 notifies the operator of the calculated adjustment amounts of the first and second micrometer heads 79, 81 by displaying them on the touch panel 20 as shown in Fig. 16. The operator can adjust the tilt angle of the stage 53 of the flux supply unit 51 to an optimum angle by rotating the first and second micrometer heads 79, 81 in accordance with the notified adjustment amounts.

[0094] (Stage flatness adjustment method) Next, the flow of adjusting the flatness of the stage 53 will be described with reference to Fig. 17. Fig. 17 is a flowchart of the adjustment of the flatness of the stage 53 of the flux supply unit 51.

[0095] When the operator selects the flatness adjustment mode from the operation menu of the touch panel 20, a selection signal is sent to the control unit 19. The control unit 19 moves the mounting head 12 to the flux application position Pc.

[0096] In step S1, the control unit 19 moves the stage 53, in which the recessed portion 58 is formed, from the standby position Pe to a supply position Pd where the flux 3 can be supplied to the component 203.

[0097] In step S2, the height information acquisition unit 97 of the control unit 19 displays guidance on the touch panel 20 to attach the jig 101 to the tool 35 of the mounting head 12 at an initial angle of 0 degrees. When the worker attaches the jig 101 to the tool 35, he or she inputs an attachment completion signal on the touch panel 20, and a signal indicating attachment completion is sent to the control unit 19. The height information acquisition unit 97 also resets a counter that counts the number of measurements to zero.

[0098] 18 , the height information acquiring unit 97 causes the tool lifting mechanism 41 to lower the jig 101 attached to the tool 35, so that the protrusion 102 of the jig 101 comes into contact with point P1 of the recess 58 of the stage 53. The height information acquiring unit 97 recognizes the contact between the protrusion 102 and the recess 58 by monitoring the change in the pressure value detected by the pressure sensor 43, and detects the height Zp1 at this time. When the height information acquiring unit 97 detects the height Zp1 of point P1, it increments the counter value by 1, and causes the tool lifting mechanism 41 to raise the jig 101.

[0099] In step S3, the height information acquisition unit 97 determines whether or not it has acquired the heights of all the predetermined locations on the stage 53. In this embodiment, the heights of four points in the recess 58 of the stage 53 are acquired, so it determines whether or not the counter value is equal to a threshold value, which is the value of all the measurements, and which is 4 in this embodiment. If the counter value is not equal to the threshold value, that is, if it determines that the heights of all the predetermined locations have not been acquired (No in step S3), the height information acquisition unit 97 returns to step S2.

[0100] In the second step S2, the height information acquisition unit 97 displays a guide on the touch panel 20 to attach the jig 101 to the tool 35 of the mounting head 12 at a rotation angle of 90 degrees. When the worker rotates the jig 101 by 90 degrees and attaches it to the tool 35, the worker inputs an attachment completion on the touch panel 20, and a signal indicating the attachment completion is sent to the control unit 19.

[0101] When the height information acquiring unit 97 receives a signal indicating completion of attachment, it similarly causes the tool lifting mechanism 41 to lower the jig 101, brings the protrusion 102 of the jig 101 into contact with point P2 of the recess 58 of the stage 53, and detects the height Zp2 at this time. When the height information acquiring unit 97 detects the height Zp2 of point P2, it increments the counter value by 1 and causes the tool lifting mechanism 41 to raise the jig 101.

[0102] In step S3, the height information acquisition unit 97 determines whether it has acquired the heights of all the specified locations on the stage 53, and if the counter value is not equal to the threshold value, that is, if it determines that it has not acquired the heights of all the specified locations (No in step S3), it returns to step S2 again.

[0103] In step S2 for the third time, the height information acquisition unit 97 displays a guide on the touch panel 20 to attach the jig 101 to the tool 35 of the mounting head 12 at a rotation angle of 180 degrees. When the worker rotates the jig 101 by another 90 degrees and attaches it to the tool 35 as shown in FIG. 19 , the worker inputs an attachment completion signal on the touch panel 20, and a signal indicating attachment completion is sent to the control unit 19.

[0104] Similarly, the height information acquisition unit 97 detects height Zp3, and then detects height Zp4 through steps S3 and S2. Again in step S3, if the height information acquisition unit 97 determines that the counter value is equal to the threshold value, that is, that the heights of all predetermined locations have been acquired (Yes in step S3), the process proceeds to step S4.

[0105] In step S4, the adjustment amount calculation unit 99 calculates the inclination (flatness) of the stage 53 based on all of the acquired heights Zp1 to Zp4 of the stage 53.

[0106] In step S5, the control unit 19 determines whether the calculated tilt of the stage 53 is within a specified value stored in the memory unit 95. This specified value is information included in the production program 96 and varies depending on the type of component 203. For example, as the chip size of the component 203 increases, even a slight tilt can cause the chip to contact the stage 53 unevenly, requiring stricter parallelism and a smaller specified value. Furthermore, some types of components 203 have bumps that are unevenly arranged. For such components, the stage 53 can be adjusted by tilting it slightly in the direction of the uneven bumps. If the control unit 19 determines that the calculated tilt of the stage 53 is within the specified value, the tilt of the stage 53 is within the allowable range, and the control unit 19 terminates the flatness adjustment mode for the stage 53 of the flux supply unit 51.

[0107] In step S 6 , the adjustment amount calculation unit 99 calculates the adjustment amount for the tilt of the stage 53 .

[0108] In step S7, the adjustment amount calculation unit 99 displays on the touch panel 20 the adjustment amount for adjusting the tilt of the stage 53 by the first and second micrometer heads 79 and 81.

[0109] In step S8, the operator adjusts the first and second micrometer heads 79, 81 according to the adjustment amount displayed on the touch panel 20, thereby reducing the tilt of the stage 53 and improving the flatness of the stage 53, thereby making the stage 53 parallel to the tool 35 of the mounting head 12.

[0110] The component mounting device 1 may automatically adjust the tilt of the stage 53 by adjusting the first and second micrometer heads 79, 81 based on the adjustment amount instructed by the adjustment amount calculation unit 99, so that the stage 53 is parallel to the tool 35 of the mounting head 12. The automatic adjustment of the stage tilt may be achieved, for example, by coupling a motor to the first and second micrometer heads 79, 81 to move them automatically, or by moving them using a motor and a sliding mechanism without using the first and second micrometer heads 79, 81. After this, the process is executed again from step S2 to check whether the tilt of the stage 53 is within the allowable range.

[0111] (effect) As described above, the component mounting apparatus 1 of the first embodiment includes the component supply unit 11 that supplies the components 203 to be mounted on the substrate 201, the stage 13 that holds the substrate 201, the mounting head 12 that mounts the components 203 on the substrate 201, the flux supply device 15 having the flux supply unit 51 that supplies the flux 3 to be adhered to the components 203, the transfer position Pb as a first position where the mounting head 12 receives the components 203, and the beam 17 provided with a movement mechanism that moves the mounting head 12 between the stage 13 and the mounting head 12. The mounting head 12 includes the tool 35 that holds the components 203 and the first lifting mechanism that raises and lowers the tool 35 relative to the flux supply unit 51 and the stage 13. The flux supply device 15 includes the suspender 52 that suspends the flux supply unit 51 from the beam 17. The flux supply unit 51 is disposed between the transfer position Pb and the stage 13.

[0112] Even if there is no space to place the flux supply unit 51 on the side of the stage 13 that holds the substrate 201, the flux supply unit 51 can be placed between the stage 13 and the transfer position Pb where the mounting head 12 receives the component 203, because the flux supply unit 51 is suspended from the beam 17 by the suspender 52. Also, when applying the flux 3 to the component 203, the access distance is shorter if the flux supply unit 51 is lowered onto the flux supply unit 51 suspended from the beam 17 than if it is lowered to the vicinity of the stage 13, and therefore the component mounting operation time can be shortened.

[0113] The flux supply unit 51 can move between a supply position Pd, where it can supply flux 3 to the component 203, and a standby position Pe, where it cannot. This allows the mount head 12 to move at any height between the component supply unit 11 and the stage 13 when the flux supply unit 51 is located at the standby position Pe. Because the flux supply unit 51 can move between the supply position Pd and the standby position Pe while suspended from the beam 17, the camera 18 for component recognition can be positioned directly below the supply position Pd. Because the movement of the mount head 12 in the Y-axis direction between flux transfer and component recognition is zero or only a small amount, the time required for component mounting on the board 201 can be shortened. If the flux supply unit 51 were not suspended, the camera 18 and the flux supply unit 51 would need to be positioned far apart in the Y-axis direction, and the mount head 12 would need to move in the Y-axis direction between flux transfer and component recognition, which would increase the time required for component mounting.

[0114] The support part 64 also includes a first support member 73 that supports the flux supply unit 51 from below. The component mounting device 1 further includes an inclination adjustment part 77 that is attached to the flux supply unit 51 and that is capable of adjusting the inclination of the flux supply unit 51 by rotating the flux supply unit 51 around the first support member 73 as a central axis. This improves the flatness of the stage 53 of the flux supply unit 51, and therefore the flux 3 can be applied precisely only to the bump surfaces of the chip-type components 203.

[0115] The component mounting device 1 further includes a height measuring jig 101 that can be attached to the tip of the mounting head 12, a height information acquiring unit 97 that acquires height information of the flux supply unit 51 based on the height of the jig 101 that has come into contact with the flux supply unit 51 by the tool lifting mechanism 41, and an adjustment amount calculating unit 99 that calculates an adjustment amount for adjusting the inclination adjusting unit 77 to tilt the flux supply unit 51 to a desired angle based on the heights of multiple points on the flux supply unit 51.

[0116] By using the height measurement jig 101, height information for multiple locations on the flux supply unit 51 can be obtained, improving the accuracy of tilt adjustment of the flux supply unit 51. Furthermore, because the adjustment amount calculation unit 99 calculates the adjustment amount, the adjustment amount can be easily obtained without the need for an operator to perform calculations. Here, the desired tilt of the flux supply unit 51 is, for example, an absolute value of 10 μm or less in flatness measurement of the stage 53. Because the adjustment amount calculation unit 99 calculates the tilt adjustment amount appropriate for the type of component 203, the operator can determine the adjustment amount in a short time, improving the efficiency of flux transfer work.

[0117] The flux supply unit 51 also includes a stage 53 having a recess 58 formed therein for storing the flux 3, and a drive unit 54 that moves the stage 53 between a supply position Pd and a standby position Pe. A height information acquisition unit 97 acquires the height of the recess 58 based on the height of the jig 101 that has come into contact with the recess 58 of the stage 53 that has moved to the supply position Pd. An adjustment amount calculation unit 99 calculates an adjustment amount for adjusting the inclination adjustment unit 77 to set the recess 58 at a desired inclination, based on the acquired heights of multiple points on the recess 58.

[0118] The adjustment amount calculation unit 99 calculates the adjustment amount for adjusting the inclination adjustment unit 77 based on the heights of multiple points in the recess 58 where the flux 3 is stored, thereby further improving the parallelism between the bottom surface of the recess 58 and the component 203 being lowered toward the recess 58.

[0119] The component mounting device 1 also includes a touch panel 20 as a display unit that displays the adjustment amount calculated by the adjustment amount calculation unit 99. This allows the operator to know the adjustment amount for adjusting the tilt of the flux supply unit 51, and thus allows the operator to adjust the tilt of the flux supply unit 51 by operating the tilt adjustment unit 77. This allows the tool 35 of the mounting head 12 and the flux supply unit 51 to be appropriately parallel to each other.

[0120] The flux supply device 15 of the first embodiment also includes a flux supply unit 51 having a stage 53 in which a recess 58 is formed to store the flux 3 to be supplied to the component 203, a support part 64 that supports the flux supply unit 51, and a hanger 52 that extends upward from the support part 64 and is attached to an end portion located opposite the support part 64 for suspending the flux supply unit 51 from a member other than the flux supply unit 51.

[0121] As the component mounting apparatus 1 becomes more sophisticated, even if there is no longer enough space to place the flux supply device 15 on the side of the stand on which the stages 13 and 53 are arranged, the flux supply device 15 can be placed by the suspending device 52 in an unused space above the stand within the component mounting apparatus 1. Furthermore, by suspending the flux supply device 15, the time it takes for the component 203 to access the recess 58 of the flux supply unit 51 can be shortened, thereby improving work efficiency.

[0122] The suspending device 52 also has an extending portion 65 extending upward from the support portion 64, and a fixing portion 67 provided at the first and second ends 70, 72 located opposite the support portion 64 and fixed to a member separate from the flux supply unit 51, for example, to the beam 17.

[0123] The support section 64 also has a first support member 73 that supports the flux supply unit 51 from below, and a pair of second support members 75 that are provided on both sides of the flux supply unit 51 and supported by both end portions of the first support member 73. The flux supply unit 51 includes a first micrometer head 79 that is supported by one of the pair of second support members 75 so as to be able to change the height of the flux supply unit 51 relative to one of the pair of second support members 75, and a second micrometer head 81 that is supported by the other of the pair of second support members 75 so as to be able to change the height of the flux supply unit 51 relative to the other of the pair of second support members 75.

[0124] By adjusting the height of the flux supply unit 51 relative to a pair of second support members 75 supported by both ends of a first support member 73 that supports the flux supply unit 51 from below, the inclination angle of the flux supply unit 51 relative to the beam 17 (horizontal plane) can be adjusted more easily and with high precision.

[0125] The component mounting method of the first embodiment also includes a moving step (step S1) of moving a stage 53, which has a recess 58 formed therein for storing flux 3 to be supplied to the component 203, to a supply position Pd where the flux 3 can be supplied to the component 203, a measuring step (step S2) of lowering a jig 101 attached to the mounting head 12 that mounts the component 203 by the tool lifting mechanism 41 and bringing the jig 101 into contact with a plurality of predetermined locations of the recess 58 of the stage 53 that has moved to the supply position Pd to measure the height of each of the predetermined locations of the recess, and a calculation step (step S6) of calculating an adjustment amount for tilting the stage 53 at a desired angle relative to the mounting head 12 based on the heights of the plurality of predetermined locations. The flux supply unit 51 having the stage 53 is suspended from a beam 17 that movably supports the mounting head 12.

[0126] In the measurement process, the height information acquisition unit 97 detects the height of the stage 53 of the flux supply unit 51 at at least three locations that are positioned on a non-linear line in the horizontal direction, and the adjustment amount calculation unit 99 calculates the tilt of the stage 53 based on the detection results, thereby supporting the adjustment of the tilt of the stage 53 relative to the component 203 supported by the tool 35 of the mounting head 12 that descends perpendicularly to the beam 17. In addition, the tilt of the flux supply unit 51 can be adjusted depending on the type of component 203. Because the amount of tilt adjustment appropriate for the type of component 203 is calculated, the operator can know the adjustment amount in a short time, thereby improving the efficiency of the flux transfer work.

[0127] [Embodiment 2] Next, a component mounting device 1A according to a second embodiment will be described with reference to Fig. 20 and Fig. 21. Fig. 20 is a side view showing a schematic configuration of the component mounting device 1A according to the second embodiment. Fig. 21 is a block diagram showing a functional configuration of the component mounting device 1A according to the second embodiment. The component mounting device 1A according to the second embodiment has a configuration in which a flux transfer device 111 is added to the component mounting device 1 according to the first embodiment. In this respect and other configurations other than those described below, the component mounting device 1A according to the second embodiment and the component mounting device 1 according to the first embodiment are the same, and therefore detailed description thereof will be omitted.

[0128] (Flux transfer device) The flux transfer device 111 transfers flux 3 to an electrode portion on which a component 203 is mounted on a substrate 201 held on a stage 13. The flux transfer device 111 includes a transfer head 113 to which one ends of a plurality of transfer pins 112 are fixed, a transfer head moving mechanism 114, and a transfer head lifting mechanism 115.

[0129] The transfer head 113 has a plurality of transfer pins 112 and a base 117 that supports the plurality of transfer pins 112. The transfer head 113 is a member that holds the flux 3 at the tips of the transfer pins 112 and transfers it onto the surface of the substrate 201.

[0130] The base 117 is a block made of metal or resin. The base 117 is rotatable around the X-axis and the Y-axis, and is adjusted so as to be parallel to the stage 13. The multiple transfer pins 112 each protrude downward from the lower surface of the base 117 at the same predetermined angle, for example, protruding vertically.

[0131] The transfer pins 112 adhere flux 3 to the tips of the transfer pins 112 and transfer the flux 3 to predetermined electrode portions of the substrate 201. The transfer pins 112 have a columnar structure. The multiple transfer pins 112 are arranged in a predetermined pattern that corresponds to the pattern of each electrode portion where the component 203 is mounted on the substrate 201. The transfer pins 112 are made of resin or metal.

[0132] The transfer head moving mechanism 114 moves the transfer head 113 in the horizontal direction (Y-axis direction) to a standby position Pf, a mounting position Pa, and a flux deposition position Pc. The transfer head moving mechanism 114 includes a rail 34 arranged on the beam 17 along the Y-axis direction, and a linear motor (not shown) that moves the transfer head 113. The drive amount of the linear motor is controlled by the control unit 19, and the transfer head 113 can move on the beam 17 along the rail 34 by the drive amount of the linear motor.

[0133] The transfer head lifting mechanism 115 raises and lowers the transfer head 113 relative to the stage 13 and the flux supply device 15. Therefore, the transfer head lifting mechanism 115 raises and lowers the transfer head 113 in the vertical direction at the mounting position Pa and the flux application position Pc, respectively. The transfer head lifting mechanism 115 has, for example, a linear motor (not shown) that raises and lowers the transfer head 113, an arm (not shown) that is moved in the vertical direction by the linear motor, and an encoder (not shown) that detects the drive amount of the motor. The detected amount by the encoder is sent to the control unit 19, and the control unit 19 can calculate the height of the transfer head 113.

[0134] As shown in Figure 22, when the mounting head 12 is located away from the mounting position Pa and before the component 203 is mounted on the substrate 201, the mounting control unit 93 moves the transfer head 113 toward the flux deposition position Pc using the transfer head moving mechanism 114.

[0135] 23, when the transfer head 113 arrives at the flux application position Pc, the mounting control unit 93 starts the operation of applying flux to the transfer pins 112 of the transfer head 113. As shown in Fig. 24, the mounting control unit 93 controls the drive of the transfer head lifting mechanism 115 to lower the transfer head 113 toward the flux supply unit 51, and when the tip of the transfer pin 112 comes into contact with the flux 3 supplied by the flux supply device 15, the flux 3 is applied to the tip of the transfer pin 112.

[0136] 25, the mounting control unit 93 drives and controls the transfer head lifting mechanism 115 to lift the transfer head 113 holding the flux 3, and then causes the transfer head moving mechanism 114 to move the transfer head 113 above the stage 13 at the mounting position Pa. As shown in FIG. 26, at the mounting position Pa, the mounting control unit 93 controls the transfer head lifting mechanism 115 to lower the transfer head 113 toward the substrate 201. When the transfer head 113 comes into contact with the substrate 201, the flux 3 is transferred onto the substrate 201.

[0137] (effect) As described above, the component mounting device 1A of embodiment 2 further includes a transfer head 113 that is movable between the flux supply device 15 and the stage 13 and has a plurality of transfer pins 112 for transferring the flux 3 supplied from the flux supply device 15 onto the substrate 201.

[0138] The component mounting apparatus 1A of the second embodiment is provided with the transfer head 113, and is therefore able to transfer the flux 3 onto the substrate 201. The flux supply device 15 that supplies the flux 3 to be adhered to the component 203 held by the mounting head 12 is also used as the flux supply device that supplies the flux 3 to be adhered to the transfer pins 112 of the transfer head 113, thereby achieving cost reduction for the component mounting apparatus 1A.

[0139] Next, a component mounting apparatus 1B according to a modification of the second embodiment will be described with reference to Figs. 27 to 29. Fig. 27 is a side view showing a schematic configuration of the component mounting apparatus 1B according to the modification of the second embodiment. The component mounting apparatus 1B according to the second embodiment has a configuration in which another flux supply device 15B is added in addition to the flux supply device 15 to the component mounting apparatus 1A according to the second embodiment. In this respect and other configurations other than those described below, the component mounting apparatus 1B according to the modification of the second embodiment and the component mounting apparatus 1A according to the second embodiment are common to each other, and therefore detailed description thereof will be omitted.

[0140] The component mounting device 1B includes a flux supply device 15 corresponding to the mounting head 12 and a flux supply device 15B corresponding to the transfer head 113. The flux supply device 15 and the flux supply device 15B have the same configuration, and the flux supply device 15B includes a suspender 52B having the same configuration as the suspender 52 and a flux supply unit 51B having the same configuration as the flux supply unit 51.

[0141] 27, when the transfer head 113 is located at the standby position Pf, the mounting control unit 93 starts an operation of depositing flux onto the transfer pins 112 of the transfer head 113. The mounting control unit 93 controls and drives the transfer head lifting mechanism 115 to lower the transfer head 113 toward the flux supply unit 51B, and when the tips of the transfer pins 112 come into contact with the flux 3 supplied by the flux supply device 15, the flux 3 is deposited onto the tips of the transfer pins 112.

[0142] Next, the mounting control unit 93 drives and controls the transfer head lifting mechanism 115 to lift the transfer head 113 holding the flux 3, and then, as shown in Fig. 28, moves the transfer head 113 above the stage 13 at the mounting position Pa using the transfer head moving mechanism 114. As shown in Fig. 29, at the mounting position Pa, the mounting control unit 93 controls the transfer head lifting mechanism 115 to lower the transfer head 113 toward the substrate 201. When the transfer head 113 comes into contact with the substrate 201, the flux 3 is transferred onto the substrate 201.

[0143] (effect) As described above, the component mounting apparatus 1B of the modified example of the second embodiment further includes the flux supply device 15B having the flux supply unit 51B that supplies the flux 3 to be transferred to the substrate 201, and the transfer head 113 that is provided movably between the flux supply device 15B and the stage 13 and that has a plurality of transfer pins 112 for transferring the flux 3 supplied from the flux supply unit 51B to the substrate 201. The flux supply device 15B includes a suspender 52B that suspends the flux supply unit 51B from the beam 17.

[0144] The operation of attaching flux 3 to the component 203 held by the mounting head 12 and the operation of attaching flux 3 to the transfer pins 112 of the transfer head 113 can be performed independently and in parallel, which simplifies the control sequence and shortens the work time required for component mounting.

[0145] Although the present disclosure has been fully described in connection with the preferred embodiments with reference to the accompanying drawings, various variations and modifications will be apparent to those skilled in the art. Such variations and modifications should be understood to be included within the scope of the present disclosure as defined by the appended claims, unless they depart therefrom. Furthermore, changes in the combination and order of elements in each embodiment may be made without departing from the scope and spirit of the present disclosure.

[0146] In the above-described embodiment, the control unit 19 included in the component mounting device 1 calculates the adjustment amount of the tilt of the flux supply unit 51, but this is not limiting. The management device 153 communicably connected to the component mounting device 1 may have the height information acquisition unit 97 and the adjustment amount calculation unit 99 and calculate the adjustment amount of the tilt of the flux supply unit 51. The calculated adjustment amount is transmitted from the management device 153 to the control unit 19 of the component mounting device 1, and the adjustment amount is displayed on the touch panel 20 as in the first embodiment.

[0147] The component mounting system 151 includes a component mounting device 1 and a management device 153 that can access the control unit 19 of the component mounting device 1. The component mounting system 151 may include a plurality of component mounting devices 1, and the management device 153 may be accessible to a plurality of control units 19. The management device 153 accesses the control unit 19 to collect information on the mounting status of the component mounting device 1.

[0148] The management device 153 collectively manages the production information of the component mounting device 1. The management device 153 is, for example, a host computer, and can be configured with circuits such as a microcomputer, a CPU, an MPU, a GPU, a DSP, an FPGA, or an ASIC. The functions of the management device 153 are realized by combining hardware and software. The management device 153 realizes predetermined functions by reading data and programs stored in a storage unit and performing various arithmetic processing.

[0149] The component mounting system 151 includes a flux supply device 15 having a flux supply unit 51 that supplies flux 3 to a component 203, a mounting head 12 that mounts the component 203 with the flux 3 attached onto the substrate 201, a lifting mechanism that raises and lowers the mounting head 12 relative to the flux supply unit 51, an inclination adjustment unit 77 that can adjust the flux supply unit 51 to a desired inclination relative to the mounting head 12, a height information acquisition unit 97 that acquires height information of the flux supply unit 51, and an adjustment amount calculation unit 99 that calculates an adjustment amount for adjusting the flux supply unit 51 to a desired inclination based on multiple pieces of height information of the flux supply unit 51.

[0150] This allows the tilt of the flux supply unit 51 to be adjusted according to the type of component 203. Since the adjustment amount calculation unit 99 calculates the tilt adjustment amount suitable for the type of component 203, the operator can know the adjustment amount in a short time, thereby improving the efficiency of the flux transfer work.

[0151] Any of the various embodiments and modifications described above may be combined as appropriate to achieve the effects of each. [Industrial Applicability]

[0152] The component mounting device, flux transfer device, component mounting system, and component mounting method according to the present disclosure are applicable to component mounting devices, flux transfer devices, component mounting systems, and component mounting methods that apply flux to components or substrates. [Explanation of symbols]

[0153] 1. 1A component mounting device 3. Flux 11 Parts Supply Department 12 Mounting head 13 Stages 15, 15B Flux supply device 17 Beam 18 Camera 19 Control Unit 20 Touch Panel 21 Foundation 23 Parts supply section moving section 25 Stage moving part 27 Stage heating section 29 Stage tilt adjustment unit 31 Pickup head 33 Mounting head movement mechanism 34 Rail 35 Tools 37 Parts heating section 39 Tool Temperature Sensor 41 Tool lifting mechanism 43 Pressure Sensor 45 Ultrasonic oscillator 51 Flux supply unit 52, 52B Lifting equipment 53 Stages 54 Drive unit 55 Flux supply unit 56 Stage support member 57 Rail 58 Recess 59 Drive motor 60 ball screw 61 Fixed Block 117 62 Flux reservoir 63 Arm 64 Support part 65 Extension 67 Fixed part 69 First extension member 70 First end 71 Second extension member 72 Second end 73 First support member 74 Protrusion 75 Second support member 77 Tilt adjustment part 79 1st micrometer head 80 Holder 81 Second micrometer head 83 Thimble 85 Spindle 87 Sleeve 89 Holder 91 Plate 93 Onboard control unit 95 Memory section 97 Height information acquisition unit 99 Adjustment amount calculation section 101 Jig 102 Protrusion 103 Nails 111 Flux transfer device 112 Transfer pin 113 Transfer head 114 Transfer head movement mechanism 115 Transfer head lifting mechanism 116 Pressure Sensor 117 Base 201 Substrate 203 parts Pa mounting position Pb delivery position Pc Flux attachment position Pd supply position Pe, Pf standby position

Claims

1. a component supply unit that supplies components to be mounted on a board; a first stage for holding the substrate; a mounting head that mounts the component onto the substrate; a first flux supply device having a first flux supply unit that supplies flux to be applied to the component; a beam provided with a movement mechanism for moving the mounting head between a first position where the mounting head receives the component and the first stage, The mounting head includes: a tool for holding the part; a first lifting mechanism that lifts and lowers the tool relative to the first flux supply unit and the first stage, the first flux supply device includes a first suspender that suspends the first flux supply unit from the beam; the first flux supply unit is disposed between the first position and the first stage; Parts mounting device.

2. the first flux supply unit is movable between a supply position where the flux can be supplied to the component and a standby position where the flux cannot be supplied; The component mounting device according to claim 1 .

3. a camera for capturing an image of the component supported by the mounting head; the camera is disposed below the first flux supply device so as to overlap with the first flux supply unit at the supply position in a plan view; The component mounting device according to claim 2 .

4. The first suspender includes: a support portion that supports the first flux supply unit; an extension portion extending from the support portion toward the beam; a fixing portion provided at an end of the extension portion opposite to the support portion side and fixed to the beam, The component mounting device according to claim 2 .

5. the extending portion includes a first extending member and a second extending member provided on both sides of the first flux supply unit, a fixing member for fixing the first flux supply unit to the beam is provided at a first end of the first extension member located on the opposite side to the support portion side and at a second end of the second extension member located on the opposite side to the support portion side; The component mounting device according to claim 4.

6. the support portion includes a first support member that supports the first flux supply unit from below, the component mounting device further includes an inclination adjustment unit provided on the first flux supply unit and capable of adjusting an inclination of the first flux supply unit by rotating the first flux supply unit about the first support member as a central axis. The component mounting device according to claim 4.

7. the support portion further includes a pair of second support members provided on both sides of the first flux supply unit and supporting both end portions of the first support member, The tilt adjustment unit is a first height adjustment unit supported by one of the pair of second support members so as to be able to change the height of the first flux supply unit relative to one of the pair of second support members; a second height adjustment part supported by the other second support member of the pair of second support members so as to change the height of the first flux supply unit relative to the other second support member, The component mounting device according to claim 6.

8. The first flux supply unit a second stage having a recess formed therein for storing the flux; a stage support member that supports the second stage from below so that the second stage can move between the supply position and the standby position, the first height adjustment unit and the second height adjustment unit are provided on the stage support member on both sides of the second stage, facing each other; the first height adjustment unit is also supported by the one second support member so as to be able to change the height of the stage support member relative to the one second support member; the second height adjustment unit is also supported by the other second support member so as to be able to change the height of the stage support member relative to the other second support member; The component mounting device according to claim 7.

9. a height measuring jig that can be attached to the tip of the mounting head; a height information acquiring unit that acquires height information of the first flux supply unit based on a height of the jig that has come into contact with the first flux supply unit by the first lifting mechanism; an adjustment amount calculation unit that calculates an adjustment amount for adjusting the inclination adjustment unit to make the first flux supply unit have a desired inclination, based on heights of a plurality of points of the first flux supply unit. The component mounting device according to claim 6.

10. The first flux supply unit a second stage having a recess formed therein for storing the flux; a drive unit that moves the second stage between the supply position and the standby position, the height information acquisition unit acquires a height of the recess based on a height of the jig that has come into contact with the recess of the second stage that has moved to the supply position; the adjustment amount calculation unit calculates an adjustment amount for adjusting the inclination adjustment unit to make the recess have a desired inclination, based on the acquired heights of a plurality of points in the recess. The component mounting device according to claim 9.

11. The apparatus further includes a display unit that displays the adjustment amount calculated by the adjustment amount calculation unit. The component mounting device according to claim 9.

12. a transfer head provided movably between the first flux supply device and the first stage, the transfer head having a plurality of transfer pins for transferring the flux supplied from the first flux supply device onto the substrate; 12. The component mounting device according to claim 1.

13. a second flux supply device having a second flux supply unit that supplies the flux to be transferred to the substrate; a transfer head that is movably provided between the second flux supply device and the first stage and that includes a plurality of transfer pins for transferring the flux supplied from the second flux supply unit onto the substrate, the second flux supply device has a second suspender that suspends the second flux supply unit from the beam; 12. The component mounting device according to claim 1.

14. a flux supply unit having a second stage formed with a recess for storing flux to be supplied to the component or the transfer pin; a support portion that supports the flux supply unit; a hanger extending upward from the support portion and at an end portion located on the opposite side to the support portion, for hanging the flux supply unit from a member other than the flux supply unit; Flux supply device.

15. The sling is an extension portion extending upward from the support portion; a fixing portion provided at an end of the extension portion opposite to the support portion and fixed to a member separate from the flux supply unit, The flux supply device according to claim 14.

16. The support portion is a first support member that supports the flux supply unit from below; a pair of second support members provided on both sides of the flux supply unit and supported by both ends of the first support member; The flux supply unit includes: a first height adjustment unit supported by one of the pair of second support members so as to be able to change the height of the flux supply unit relative to the one of the pair of second support members; a second height adjustment unit supported by the other second support member of the pair of second support members so as to change the height of the flux supply unit relative to the other second support member, The flux supply device according to claim 15.

17. a flux supply device having a flux supply unit that supplies flux to the component; a mounting head that mounts the component to which the flux is attached onto a substrate; a lifting mechanism for lifting the mounting head relative to the flux supply unit; an inclination adjustment unit that can adjust the flux supply unit to a predetermined inclination with respect to the mounting head; a height information acquiring unit that acquires height information of the flux supply unit; an adjustment amount calculation unit that calculates an adjustment amount necessary to tilt the flux supply unit at a desired angle based on a plurality of height information of the flux supply unit; Equipped with The flux supply unit is suspended from a beam that movably supports the mounting head. Parts mounting system.

18. a moving step of moving a second stage formed with a recess for storing flux to be supplied to a component or a transfer pin to a supply position where the flux can be supplied to the component or the transfer pin; a measuring step of lowering a jig attached to a mounting head that mounts the component or a transfer head that transfers the flux to the transfer pins by an elevation mechanism, and bringing the jig into contact with a plurality of predetermined locations of the recessed portion of the second stage that has moved to the supply position, thereby measuring the height of each of the predetermined locations of the recessed portion; a calculation step of calculating an adjustment amount for optimizing the inclination of the second stage relative to the mounting head or the transfer head based on the heights of the plurality of predetermined locations, the flux supply unit having the second stage is suspended from a beam that movably supports the mounting head or the transfer head; Parts mounting method.

Images