Component mounting system and board holding method

Abstract

To provide a component mounting system and a substrate holding method capable of performing component mounting work while precisely detecting the height of a lifting body with an inexpensive configuration.SOLUTION: A component mounting system includes an elevating body 41 which ascends and descends below a carried-in substrate, and a height detection part 45 which detects the height of the elevating body 41. The height detection unit 45 includes a mark member 52 including a plurality of slits 52J disposed along the arc line EK about the rotation shaft 52S, a rotation operation member 54 that moves up and down together with the lift 41 to rotate the mark member 52, and a mark detection unit 55 that detects that the slit 52S moving in a track along the arc line EK with the rotation of the mark member 52 passes through a detection position KP set on the track. And a height calculation part 52S for calculating the height of the elevating body 41 on the basis of a count part 16e for counting the number of the slit 52S detected by the mark detection part 55 and the counted number of the slit 16f.SELECTED DRAWING: Figure 11

Description

[Technical Field]

[0001] The present disclosure relates to a component mounting system and a board holding method for mounting components onto a board carried in by a transport conveyor. [Background technology]

[0002] A component mounting system for mounting components onto a substrate transports the substrate onto which the components are to be mounted using a transport conveyor, holds the substrate, and then mounts the components on the substrate. A known mechanism for holding the substrate includes, for example, a pair of fixed clampers disposed above a pair of movable clampers that support both ends of the substrate from below, and a lifting body is raised from below the substrate to push up the pair of movable clampers, and both ends of the substrate are lifted by the movable clampers and brought into contact with the fixed clampers (for example, see Patent Document 1 listed below). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-149433 Summary of the Invention [Problem to be solved by the invention]

[0004] In the device described in Patent Document 1, if a foreign object gets caught between the ascending lifting body and the fixed clamper or the transport rail, the upward movement of the lifting body may be restricted before the movable clamper presses the substrate against the fixed clamper, resulting in the risk of component mounting being performed without the substrate being properly held (clamped). To avoid this situation, it is sufficient to detect whether the height of the lifting body when the substrate is clamped is different from its actual height. This requires highly accurate detection of the height of the lifting body, and the use of a conventionally known laser displacement sensor is effective. However, laser displacement sensors are generally expensive, which increases the manufacturing costs of the component mounting system.

[0005] Therefore, an object of the present disclosure is to provide a component mounting system and a substrate holding method that can perform component mounting work while accurately detecting the height of a lifting body with an inexpensive configuration. [Means for solving the problem]

[0006] a counting unit that counts the number of marks detected by the mark detection unit; and a calculation unit that calculates the height of the lifting / lowering body based on the number of marks counted by the counting unit. The height detection unit is configured to rotate freely around a rotation axis extending in a direction intersecting the lifting / lowering direction of the lifting / lowering body, and to mount components on the substrate supported by a substrate support unit provided on the lifting / lowering body. The height detection unit is configured to rotate a marking member having a plurality of marks arranged along an arc line centered on the rotation axis, a rotation operation member that rises and falls together with the lifting / lowering body and rotates the marking member, a mark detection unit that detects when the mark, which moves on a trajectory along the arc line as the marking member rotates, passes a detection position set on the trajectory, a counting unit that counts the number of marks detected by the mark detection unit, and a calculation unit that calculates the height of the lifting / lowering body based on the number of marks counted by the counting unit.

[0007] The substrate holding method of the present disclosure includes a lifting body that rises and falls below a substrate carried in by a transport conveyor, a height detection unit that detects the height of the lifting body, a control unit that controls the lifting and lowering of the lifting and lowering body based on the height of the lifting and lowering body detected by the height detection unit, a mounting head that mounts components on the substrate supported by a substrate support unit provided on the lifting and lowering body that rises from below the substrate, a movable clamper that is pushed up by the rising lifting and lowering body to lift up an end of the carried-in substrate, and a fixed clamper that is positioned above the movable clamper and against which an upper surface of the end of the substrate lifted by the movable clamper abuts, wherein the height detection unit is rotatable about a rotation axis that extends in a direction intersecting the lifting and lowering direction of the lifting and lowering body, and has a mark member that is provided with a plurality of marks arranged along an arc line centered on the rotation axis, and a mounting head that rises and lowers together with the lifting and lowering body to mount components on the substrate supported by a substrate support unit provided on the lifting and lowering body a mark detection unit that detects when the mark, which moves in a trajectory along the arc line as the mark member rotates, passes a detection position set on the trajectory; a counting unit that counts the number of marks detected by the mark detection unit; and a calculation unit that calculates the height of the lifting body based on the number of marks counted by the counting unit, the method including: a clamp height detection step that detects a clamp height, which is the height of the lifting body when the substrate is clamped, using the height detection unit; and a determination step that determines whether clamping of the substrate has been completed normally by comparing the clamp height detected in the clamp height detection step with a normal clamp height, which is the height of the lifting body when the substrate is normally clamped. [Effects of the Invention]

[0008] According to the present disclosure, component mounting work can be performed while the height of the lifting body is precisely detected with an inexpensive configuration. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a simplified configuration diagram of a component mounting system according to an embodiment of the present disclosure. [Figure 2] 1 is a perspective view of a component mounting device included in a component mounting system according to an embodiment of the present disclosure. [Figure 3] 1 is a perspective view of a substrate transport and holding unit included in a component mounting device according to an embodiment of the present disclosure. [Figure 4] 1 is a side view of a substrate transport and holding unit included in a component mounting device according to an embodiment of the present disclosure. [Figure 5] 1 is an exploded perspective view of a portion of a substrate transport and holding unit included in a component mounting device according to an embodiment of the present disclosure. [Figure 6] 1A, 1B, and 1C are explanatory views illustrating the operation of a substrate transport and holding unit provided in a component mounting device according to an embodiment of the present disclosure. [Figure 7] 10A and 10B are explanatory diagrams illustrating a clamping operation of a substrate by a substrate transport and holding unit included in a component mounting device according to an embodiment of the present disclosure. [Figure 8] 10A and 10B are explanatory diagrams illustrating a clamping operation by a substrate transport and holding unit included in a component mounting device according to an embodiment of the present disclosure. [Figure 9] FIG. 2 is a block diagram showing a control system of the component mounting device according to the embodiment of the present disclosure. [Figure 10] 10A and 10B are explanatory diagrams illustrating a clamping operation of a substrate (with foreign matter) by a substrate transport and holder according to an embodiment of the present disclosure. [Figure 11] FIG. 2 is a perspective view of a height detection unit included in the component mounting device according to the embodiment of the present disclosure. [Figure 12] 10A and 10B are explanatory diagrams illustrating the operation of a lift sensor provided in a component mounting device according to an embodiment of the present disclosure. [Figure 13] 10 is a flowchart showing a procedure for a substrate holding operation by a substrate transport and holding unit according to an embodiment of the present disclosure. [Figure 14] 10(a), (b), (c), and (d) are explanatory diagrams illustrating the operation of a height detection unit according to a first modified example of an embodiment of the present disclosure. [Figure 15] 10(a), (b), (c), and (d) are explanatory diagrams illustrating the operation of a height detection unit according to a second modified example of an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. Fig. 1 shows a component mounting system 1 according to one embodiment of the present disclosure. From the upstream side, the component mounting system 1 includes a printing device 2, a component mounting device 3, an inspection device 4, and a reflow device 5. The printing device 2, the component mounting device 3, the inspection device 4, and the reflow device 5 sequentially transfer a board KB in this order, and each perform a required operation on the board KB.

[0011] The printing device 2 carries in the board KB and prints solder on the top surface of the board KB. After the solder printing is completed, the printing device 2 carries the board KB downstream.

[0012] The component mounting device 3 receives the board KB from the printing device 2, mounts the components BH on the board KB, and carries it out downstream. Details of the component mounting device 3 will be described later.

[0013] The inspection device 4 receives the board KB from the component mounting device 3, inspects each component BH mounted on the board KB by capturing images with a camera, etc., and then transports it downstream. The reflow device 5 receives the board KB from the inspection device 4 and performs a solder reflow process while transporting it downstream. The solder reflow process fixes the components BH mounted by the component mounting device 3 onto the board KB. The mounted board JK is completed when the board KB passes through the reflow device 5 (Figure 1).

[0014] The component mounting device 3 will now be described. As described above, the component mounting device 3 is a device that mounts components BH on a board KB. As shown in FIG. 2, the component mounting device 3 includes a base 11, a board transport holder 12, a plurality of part feeders 13, a head moving mechanism 14, and a mounting head 15. For ease of explanation, the left-right direction of the component mounting device 3 as seen from the operator OP is defined as the X direction, and the front-to-back direction of the component mounting device 3 as seen from the operator OP is defined as the Y direction. The up-down direction is defined as the Z direction.

[0015] 2, board transport and holding unit 12 supports both Y-direction ends of board KB from below, transports it in the X-direction, and holds it after carrying it into a predetermined work position. Multiple part feeders 13 are each detachably attached to feeder bases 11F located at the Y-direction ends of base 11. Each part feeder 13 supplies parts BH to part pick-up position 13T.

[0016] 2, the head moving mechanism 14 includes a fixed beam 14a and a moving beam 14b. The fixed beam 14a extends in the Y direction and is fixed to the base 11. The moving beam 14b extends in the X direction and has one end attached to the fixed beam 14a. The moving beam 14b is movable in the Y direction along the fixed beam 14a.

[0017] 2, the mounting head 15 is attached to a moving beam 14b and is movable in the X direction along the moving beam 14b. The mounting head 15 moves in a horizontal plane (XY plane) in the space above the base 11 by the movement of the moving beam 14b in the Y direction relative to the fixed beam 14a and the movement of the mounting head 15 itself in the X direction relative to the moving beam 14b.

[0018] 2, the mounting head 15 has multiple nozzles 15N extending downward. The mounting head 15 generates a vacuum suction force at the bottom end of each nozzle 15N, and picks up the component BH supplied to the component removal position 13T by each part feeder 13 by adsorbing it to the nozzle 15N.

[0019] 3 and 4, the substrate transport holder 12 includes a conveyor stand 21 provided on the base 11, and two front and rear transport conveyors 22 provided on the conveyor stand 21. Each transport conveyor 22 extends in the X direction as a whole, and the two transport conveyors 22 are arranged parallel to each other in the Y direction (front-rear direction). The left and right ends (X direction) of each transport conveyor 22 are fixed to the conveyor stand 21 by fixtures 23, respectively.

[0020] 3 and 4, the transport conveyor 22 includes a base member 31 that spreads out along the XZ plane and extends in the X direction, a pair of transport belts 33 that transport the substrate KB in the X direction on the inner surface of the base member 31 (the surface on which the two opposing base members 31 face each other), a movable clamper 34 that is provided on the inner surface of each of the two base members 31 so as to be movable in the Z direction, and a fixed clamper 35 that is provided at the upper end of each of the two base members 31. Each fixed clamper 35 is positioned to protrude above (directly above) the movable clamper 34 below it.

[0021] 3 and 5, elongated holes 36 extending in the vertical direction are provided at the left and right ends of each of the two front and rear movable clampers 34, penetrating in the plate thickness direction (Y direction). A screw member 37 attached to the inside of the corresponding base member 31 passes through each elongated hole 36. Therefore, the movable clamper 34 is guided by the two left and right elongated holes 36, allowing it to move freely in the vertical direction (Z direction) relative to the base member 31. In FIGS. 3, 4 and 5, two post members 34P are provided to protrude downward from each of the left and right ends of the lower end of the movable clamper 34.

[0022] The movable clamper 34 can be raised and lowered between a hanging position (Figures 6(a) and (b)) in which the upper edge of the elongated hole 36 abuts against the screw member 37 and hangs down under its own weight, and a position raised from the hanging position relative to the screw member 37.

[0023] 3 and 4, a lifting body 41 having a shape extending along the XY plane is provided below the two front and rear transport conveyors 22. An upwardly extending flange portion 41F is formed on each of the left and right sides of the lifting body 41. A plate-shaped member 42 is attached to the upper surface of the lifting body 41, and a plurality of support pins 43 serving as substrate support portions are provided on the upper surface of the plate member 42 and extend upward.

[0024] 4, an air cylinder 44 is provided on the conveyor base 21. The lifting body 41 is raised and lowered within a lifting area below the work position.

[0025] 3, the flange portion 41F located on the left side of the lifting body 41 is located below the post member 34P located on the left side of the front movable clamper 34 and the post member 34P located on the left side of the rear movable clamper 34. The flange portion 41F located on the right side of the lifting body 41 is located below the post member 34P located on the right side of the front movable clamper 34 and the post member 34P located on the right side of the rear movable clamper 34.

[0026] When the lifting body 41 is located at the lower limit height, which is the lower limit height of the lifting range (FIG. 6(a)), the movable clamper 34 is located in the hanging position, and the flange portion 41F of the lifting body 41 is located downward and spaced apart from the post member 34P located above it. When the lifting body 41 rises from the lower limit height, the flange portion 41F of the lifting body 41 abuts against the post member 34P from below (FIG. 6(b)), pushing the movable clamper 34 up against the base member 31. Then, when the upper end 34T of the movable clamper 34 abuts against the lower surface of the fixed clamper 35 from below, the lifting body 41 can no longer move upward and reaches the upper limit height, which is the upper limit height of the liftable range (FIG. 6(c)).

[0027] As shown in FIG. 7(a), when both ends of the substrate KB are supported by the transport conveyor 22, the lifting body 41 starts rising from the lower limit height, and after the flange portion 41F abuts against the post member 34P from below (FIG. 7(b)), the flange portion 41F pushes up the movable clamper 34. Then, the upper end 34T of the movable clamper 34 abuts (presses against) the lower surface of the substrate KB, and the upper ends of the support pins 43 abut against the lower surface of the substrate KB (FIG. 8(a)), and the movable clamper 34 and the support pins 43 push up the substrate KB. As a result, the substrate KB moves to a position higher than the substrate transport plane HM, which is the plane of transport of the substrate KB by the transport conveyor 22, and both ends of the substrate KB abut against the lower surfaces of the fixed clampers 35 (FIG. 8(b)). As a result, both ends of the substrate KB are sandwiched and held (clamped) between the pair of movable clampers 34 and the pair of fixed clampers 35.

[0028] The height of the lifting body 41 when both ends of the substrate KB are clamped between the pair of movable clampers 34 and the pair of fixed clampers 35 in this manner is hereinafter referred to as the "clamp height." By being pushed up to the clamp height, the substrate KB reaches a height at which components BH can be mounted. When the movable clamper 34 is positioned in the clamp position, there is no gap in the Z direction between the upper end 34T of the movable clamper 34 and the lower surface of the fixed clamper 35 (FIG. 8(b)), so that substrates KB of various thicknesses can be held by the substrate transport and holding unit 12.

[0029] Here, the height of the lifting body 41 when positioned at the clamping height (FIG. 8(b)) is lower than the height of the lifting body 41 when positioned at the upper limit height (FIG. 6(c)) by the thickness TH of the clamped substrate KB (FIG. 8(b)). Since the thickness TH of the substrate KB at this time differs depending on the type of substrate KB being clamped, the clamping height of the lifting body 41 will differ depending on the type of substrate KB (specifically, the greater the thickness TH of the substrate KB, the lower the clamping height of the lifting body 41).

[0030] Figure 9 shows the control system of the component mounting device 3. In Figure 9, a control unit 16 provided in the component mounting device 3 controls the operations of the board transport and holding unit 12, the multiple part feeders 13, the head moving mechanism 14, and the mounting head 15. The board transport and holding unit 12 is controlled by the control unit 16 to carry in a board KB and hold the board KB. The head moving mechanism 14 is controlled by the control unit 16 to move the mounting head 15 within a horizontal plane. Each part feeder 13 is controlled by the control unit 16 to supply a part BH to a part removal position 13T. The mounting head 15 is controlled by the control unit 16 to pick up a part BH onto a nozzle 15N and to remove the picked-up part BH from the nozzle 15N.

[0031] 9, control unit 16 includes mounting operation execution control unit 16a and memory unit 16b. Memory unit 16b stores an operation program for the component mounting operation to be executed by component mounting device 3, and mounting operation execution control unit 16a operates board transport and holding unit 12, parts feeder 13, head moving mechanism 14, and mounting head 15 based on the operation program to perform the component mounting operation of mounting components BH on board KB.

[0032] In the component mounting operation, first, the board transport and holding unit 12 operates to receive the board KB sent from the device (printing device 2) on the upstream process side of the component mounting device 3. Then, the board KB is carried into the work position and held there (Fig. 2).

[0033] Once the board KB is held, each part feeder 13 supplies a component BH to the component take-out position 13T, and the head movement mechanism 14 moves the mounting head 15 back and forth between a position above the part feeder 13 and a position above the board KB. As the mounting head 15 moves between a position above the part feeder 13 and a position above the board KB, it picks up the component BH supplied by the part feeder 13 with the nozzle 15N and releases the component BH from the nozzle 15N above the board KB.

[0034] Once all of the components BH to be mounted on the board KB have been mounted by the above-mentioned operation of the mounting head 15, the board transport and holding unit 12 is activated to transport the board KB to the downstream process device (inspection device 4), thereby completing the component mounting work for one board KB.

[0035] In the component mounting device 3, the upper surface of the lifting body 41 does not normally come into contact with the lower end of the base member 31 while the lifting body 41 is rising. Therefore, the lifting of the lifting body 41 is not restricted except by the upper surface of the substrate KB coming into contact with the fixed clamper 35.

[0036] However, for example, as shown in Figure 10(a), if there is a foreign object IB between the lifting body 41 and the base member 31 and the vertical dimension SP of the foreign object IB is of a certain size, the foreign object IB on the lifting body 41 will come into contact with the lower end 31T of the base member 31 before the upper surface of the substrate KB comes into contact with the fixed clamper 35 (Figure 10(b)). This will prevent the lifting body 41 from rising, and the upward movement of the lifting body 41 will stop even though the upper surface of the substrate KB is not in contact with the fixed clamper 35. In this state, normal component mounting cannot be performed.

[0037] For this reason, the component mounting device 3 in this embodiment is equipped with a height detection unit 45 (Figure 9) that detects the height of the lifting body 41, and by detecting the height of the lifting body 41 when a foreign object IB has become trapped as described above, it is possible to detect a state in which normal clamping of the substrate KB is prevented (clamping failure) (the height detection unit 45 will be described later).

[0038] When the elevation of the lifting body 41 stops during clamping of the substrate KB, the height detection unit 45 detects the height of the lifting body 41 at that time as the clamp height. When the clamp height is detected by the height detection unit 45, the determination unit 16c (FIG. 9) provided in the control unit 16 compares the detected clamp height with the normal clamp height to determine whether the substrate KB has come into contact with the fixed clamper 35. Here, the "normal clamp height" refers to the height of the lifting body 41 when the upper surface of the edge of the substrate KB comes into contact with the fixed clamper 35, and this data is stored in the memory unit 16b of the control unit 16 along with data on the thickness TH for each type of substrate KB.

[0039] In the above determination, if the clamp height detected by the height detection unit 45 is the same as the normal clamp height (or within an allowable range based on a predetermined normal clamp height), the determination unit 16c determines that the clamping operation has completed normally. On the other hand, if the clamp height detected by the height detection unit 45 is lower than the normal clamp height, the determination unit 16c determines that the substrate KB did not abut against the fixed clamper 35 and that an abnormality occurred during the clamping process of the substrate KB, so that the clamping operation did not complete normally. Note that the normal clamp height data used in this determination is data on the normal clamp height corresponding to the thickness TH of the substrate KB to be clamped.

[0040] If the determining unit 16c determines that the clamping operation has not ended normally, the notification control unit 16d (FIG. 9) of the control unit 16 notifies the operator OP of the error via the notification means 60 (FIG. 9) provided in the component mounting device 3. This allows the operator OP to detect that an abnormality has occurred in the clamping process and to take necessary measures, such as removing the foreign object IB. Here, examples of the notification means include a display device such as a touch panel, a buzzer, a lamp, etc.

[0041] Here, we will explain the configuration of height detection unit 45. Height detection unit 45 is configured to have a sensor unit 50 (FIGS. 2 and 11) provided between lifting body 41 and conveyor base 21, a counting unit 16e provided in control unit 16, and a height calculation unit 16f as a calculation unit.

[0042] In FIG. 11, the sensor unit 50 includes a base body 51, a mark member 52, a biasing spring 53, a rotation operation member 54, a mark detection unit 55, a lower sensor 56, and an upper sensor 57.

[0043] 11, the base body 51 has a shape that extends along the YZ plane as a whole. The base body 51 has two legs 51K that are bent at the bottom and extend horizontally, and these two legs 51K are attached to the upper surface of the conveyor base 21.

[0044] 11, a rotation shaft 52J extending in a direction (here, the X direction) intersecting the movement direction (Z direction) of the lifting body 41 is provided at the top of the base body 51 in the vertical direction (i.e., the Z direction, which is the lifting direction of the lifting body 41). The marking member 52 is attached to the rotation shaft 52J and is rotatable in the YZ plane around the rotation shaft 52J. In this embodiment, the direction in which the marking member 52 rotates counterclockwise in FIGS. 12(a) and 12(b) (arrow R1 shown in FIG. 12(a)) is referred to as the "counterclockwise direction," and the direction in which the marking member 52 rotates clockwise in FIGS. 12(a) and 12(b) (arrow R2 shown in FIG. 12(a)) is referred to as the "clockwise direction."

[0045] The mark member 52 has a sector shape, and its arc-shaped outer edge is positioned along an arc line EK (FIG. 11) centered on the rotation axis 52J. Although the mark member 52 has a sector shape here, this is not limited to this and may be semicircular or the like.

[0046] 11, the mark member 52 has a plurality of slits 52S. These slits 52S are arranged at equal intervals at discrete positions along the arc line EK of the mark member 52. Each slit 52S has a shape that opens at the outer edge of an arc that follows the arc line EK and extends toward the rotation shaft 52J. Each of these slits 52S functions as a "mark" in the mark member 52.

[0047] 11, a pin-shaped spring attachment portion 51B extending in the direction in which rotation shaft 52J extends (Y direction) is provided at the lower center of base body 51. Mark member 52 also has a pin-shaped engaged portion 52H extending in the X direction. Engaged portion 52H is provided above spring attachment portion 51B at a position facing the outer edge (slit 52S) of mark member 52 across rotation shaft 52J.

[0048] The biasing spring 53 is a tension spring. Both ends of the biasing spring 53 are attached to the spring attachment portion 51B and the engaged portion 52H (FIG. 11). The engaged portion 52H is constantly pulled toward the spring attachment portion 51B (i.e., downward) by the biasing force of the biasing spring 53.

[0049] 11, a stopper pin 51S protruding in the X direction is provided at a position below rotation axis 52J of base body 51. When no upward pulling force is acting on engaged portion 52H of mark member 52, mark member 52 is biased in the clockwise direction by biasing spring 53, with linear lower edge 52E abutting stopper pin 51S from above (FIG. 11). In this state, the clockwise rotation range of mark member 52 is restricted, and this position of mark member 52 is hereinafter referred to as the "rotation restricted position."

[0050] 11, the rotation operation member 54 has a shape that extends in the vertical direction (Z direction), and is slidable (movable up and down) in the vertical direction relative to the base body 51. A horizontal connecting portion 54F is formed at the upper end of the rotation operation member 54. The connecting portion 54F is connected to an end portion of the upper surface of the lifting body 41, and when the lifting body 41 moves up and down, the rotation operation member 54 moves up and down (moves up and down) relative to the base body 51. In other words, the rotation operation member 54 moves up and down together with the lifting body 41.

[0051] 11 and 12(a) and (b), the lower end of the rotation operation member 54 is provided with a hook-shaped engagement portion 54K that protrudes to the left in Fig. 11. A dog 54D that protrudes to the right in Fig. 11 (the opposite direction from the engagement portion 54K) is formed at a position slightly above the engagement portion 54K of the rotation operation member 54.

[0052] The engaging portion 54K is located below the engaged portion 52H provided on the mark member 52. When the lifting body 41 rises from the lower limit height of the lifting range and reaches the reference height H0 (FIG. 12(a)), the engaging portion 54K comes into contact with the engaged portion 52H. When the lifting body 41 continues to rise after the engaging portion 54K comes into contact with the engaged portion 52H, the flange portion 41F of the lifting body 41 comes into contact with the post member 34P of the movable clamper 34 (FIG. 7(b)).

[0053] When the lifting body 41 rises after the engaging portion 54K comes into contact with the engaged portion 52H, the engaged portion 52H is pulled up by the lifting body 41 via the engaging portion 54K of the rotation operation member 54 and rotates counterclockwise (FIG. 12(a) → FIG. 12(b)). That is, the marking member 52 rotates after the rising lifting body 41 reaches the reference height H0. The marking member 52 rotated counterclockwise in this manner continues to rotate counterclockwise until the lifting body 41 reaches the clamp height.

[0054] Conversely, when the lifting body 41 descends from the clamp height, the rotation operation member 54 descends together with the lifting body 41. This causes the engaging portion 54K to descend, and coupled with the downward bias of the engaged portion 52H by the biasing spring 53, the mark member 52 rotates clockwise (FIG. 12(b) → FIG. 12(a)). Then, when the lifting body 41 descends to the reference height H0, the lower edge 52E of the mark member 52 abuts against the stopper pin 51S, and the clockwise rotation of the mark member 52 is restricted (FIG. 12(a)). Thereafter, the lifting body 41 descends below the reference height H0 (FIG. 12(a) → FIG. 11), but the engaging portion 54K moves downward away from the engaged portion 52H, so the mark member 52 remains positioned at the rotation restriction position.

[0055] When the lifting body 41 (i.e., the turning operation member 54) is moving up or down in a region higher than the reference height H0, the engaging portion 54K of the turning operation member 54 and the engaged portion 52H of the marking member 52 are in contact with each other, and when the turning operation member 54 moves up or down, the marking member 52 rotates around the rotation axis 52J accordingly. That is, in this embodiment, the amount of lifting or lowering movement of the lifting or lowering body 41 can be detected by converting it into the amount of rotational movement of the marking member 52 and detecting it. At this time, the amount of rotational movement of the slit 52S along the arc line EK in accordance with the rotation of the marking member 52 (amount of rotational movement) is much greater than the amount of lifting or lowering movement of the lifting or lowering body 41 in the lifting or lowering direction (amount of lifting or lowering movement). Therefore, the amount of lifting or lowering movement of the lifting or lowering body 41 can be substantially increased.

[0056] The mark detection unit 55 is provided on the side of the mark member 52 on the base body 51. The mark detection unit 55 is made up of an optical sensor, and projects inspection light 55L in the direction in which the rotation shaft 52J extends (Y direction), and receives the inspection light 55L (FIGS. 12(a) and 12(b)).

[0057] 11, a detection position KP is set on the orbit along the arc line EK on which the mark member 52 is arranged. The mark detection unit 55 is installed at a position where the emitted and received inspection light 55L passes through the detection position KP. Therefore, when the mark member 52 rotates, each slit 52S passes through the detection position KP, and the mark detection unit 55 detects the slits 52S when the inspection light 55L is turned on and off.

[0058] In this way, the slit 52S is detected by crossing the inspection light 55L due to the rotation of the mark member 52, but because the mark member 52 rotates due to the elevation of the engaged portion 52H, even if the amount of elevation of the engaged portion 52H is the same, the amount of rotational movement (rotation angle) of the mark member 52 differs depending on the height region in which the elevation is performed. In detail, the amount of rotational movement of the mark member 52 when the engaged portion 52H is elevated or lowered a certain distance in a region to the side of the rotation shaft 52J (at substantially the same height as the rotation shaft 52J) is smaller than the amount of rotational movement of the mark member 52 when the engaged portion 52H is elevated or lowered the same certain distance in a region lower than the rotation shaft 52J (or higher than the rotation shaft 52J).

[0059] For this reason, if the intervals between the slits 52S aligned along the arc line EK of the mark member 52 were all constant, the number of slits 52S detected by the mark detection unit 55 when the lifting body 41 moves by a unit lifting movement amount would vary depending on the height to which the engaged portion 52H is raised or lowered. For this reason, in this embodiment, the number of slits 52S increases the further away from the center of the row of slits 52S (the closer to the end of the row of slits 52S), so that the number of slits 52S detected by the mark detection unit 55 when the lifting body 41 is raised or lowered a certain distance is constant regardless of the height range to which the engaged portion 52H is raised or lowered.

[0060] 11 and 12(a) and (b), the lower sensor 56 and the upper sensor 57 are both optical sensors, and are arranged next to each other in the vertical direction on the right edge of the rotation operation member 54. The lower sensor 56 is located at the bottom of the base body 51 and detects the dog 54D when the lifting body 41 is at its lowest height, thereby detecting that the lifting body 41 is at its lowest height. The upper sensor 57 detects the dog 54D just before the raised lifting body 41 reaches the reference height H0, that is, when the engaging portion 54K reaches the height just before it abuts the engaged portion 52H of the mark member 52 from below, thereby detecting that the lifting body 41 is at the reference height H0 or a position higher than the reference height H0.

[0061] As described above, in this embodiment, the sensor unit 50 is rotatable around a rotation axis 52J extending in a direction (X direction) intersecting the movement direction of the lifting body 41, and is configured to include a mark member 52 having a plurality of marks (slits 52S) arranged along an arc line EK centered on the rotation axis 52J, a rotation operating member 54 that moves together with the lifting body 41 in the movement direction of the lifting body 41 (up and down direction) to rotate the mark member 52, and a mark detection unit 55 that detects the slits 52S, which move in an orbit along the arc line EK as the mark member 52 rotates, passing through a detection position KP set on that orbit.

[0062] The counting unit 16e counts the number of slits 52S detected by the mark detecting unit 55. The height calculating unit 16f calculates the height of the lifting / lowering body 41 based on the number of slits 52S counted by the counting unit 16e. More specifically, the height calculating unit 16f calculates the amount of change in the height of the lifting / lowering body 41 based on the number of slits 52S counted by the counting unit 16e, and calculates the height of the lifting / lowering body 41 based on the calculated amount of change in the height of the lifting / lowering body 41.

[0063] To explain this in more detail, when the ascending body 41 ascends, after the ascending body 41 passes the reference height H0, the counting unit 16e counts the number of times that the slits 52S of the mark member 52, which rotates counterclockwise as the ascending body 41 ascends, cross the inspection light 55L of the mark detection unit 55. The height calculation unit 16f then obtains the upward movement amount HT ( FIG. 12(b) ), which is the amount of change in the height of the ascending body 41, from the relationship between the number of slits 52S counted by the counting unit 16e and the vertical movement amount (unit movement amount) of the ascending body 41 corresponding to one slit 52S stored in the memory unit 16b of the control unit 16, and calculates the height of the ascending body 41 by adding the obtained upward movement amount HT to the known reference height H0.

[0064] When the lifting body 41 is descending, the counting unit 16e counts the number of times that the slits 52S of the mark member 52, which rotates clockwise as the lifting body 41 descends, cross the inspection light 55L of the mark detection unit 55. The height calculation unit 16f then calculates the downward movement amount, which is the amount of change in the height of the lifting body 41, from the relationship between the number of slits 52S counted by the counting unit 16e and the unit movement amount of the lifting body 41 in the vertical direction corresponding to one slit 52S, and calculates the height of the lifting body 41 by subtracting the calculated downward movement amount from the height of the lifting body 41 immediately before it started to descend.

[0065] Thus, the height of the lifting body 41 detected by the height detection unit 45 is the height range within which the rotation operation member 54 can rotate the marking member 52, and is limited to when the lifting body 41 is at a height higher than the reference height H0. Even when the lifting body 41 is at a height lower than the reference height H0, for example, in order to be able to detect the height of the lifting body 41 from the lower limit height, the engaging portion 54K and the engaged portion 52H must be engaged (or connected) when the lifting body 41 is positioned at the lower limit height. However, this would require the marking member 52 to be quite large, which is not practical. In this embodiment, by providing an area where the height of the lifting body 41 cannot be detected (the area from the lower limit height to the reference height H0), the marking member 52 can be made smaller, and thus the height detection unit 45 (sensor unit 50) can be made more compact.

[0066] As described above, in this embodiment, the amount of vertical movement of the lifting body 41 is converted into the amount of rotational movement of the marking member 52, thereby substantially increasing the amount of vertical movement of the lifting body 41. Therefore, in the component mounting device 3 (component mounting system 1) of this embodiment, it is possible to increase the number of slits 52S per distance along the arc line EK of the marking member 52, which corresponds to a unit distance in the up-down direction of the lifting body 41, and thereby improve the accuracy (resolution) of reading the amount of vertical movement of the lifting body 41.

[0067] In this embodiment, the magnification factor when the vertical movement of the lifting body 41 is converted into the rotational movement of the mark member 52 depends on the distance from the rotation axis 52J of the mark member 52 to the mark (slit 52S) (i.e., the radius of the arc line EK), and increases as the radius of the arc line EK increases. The larger the magnification factor, the more slits 52S can be increased. Therefore, by using a mark member 52 with a larger radius of the arc line EK and a larger number of slits 52S, the vertical movement of the lifting body 41 can be detected with high accuracy, even when using an inexpensive mark detection unit 55 with low reading accuracy. In this embodiment, multiple mark members 52 with different radii of the arc line EK on which the marks (slits 52S) are arranged are provided in advance, and these multiple mark members 52 can be freely replaced (i.e., are interchangeable). Therefore, by replacing the mark member 52 as needed, the vertical movement of the lifting body 41 can be detected with accuracy appropriate to the situation.

[0068] 13 is a flowchart showing the flow of the control of the holding operation (substrate holding method) of the substrate KB by the substrate transport and holding unit 12. In this control, first, the pair of transport belts 33 are run from a state in which the lifting body 41 is positioned at the lowest height, thereby transporting the substrate KB to the working position (step ST1).

[0069] Once the substrate KB has been carried into the work position, the control unit 16 operates the lift cylinder 44 to control the elevation of the lift body 41. To do this, the control unit 16 first operates the lift cylinder 44 to start raising the lift body 41 (step ST2), and while monitoring the height of the lift body 41 detected by the height detection unit 45, determines whether the height of the lift body 41 has remained unchanged for a certain period of time (step ST3). If the height of the lift body 41 has remained unchanged for a certain period of time, it determines that the lift of the lift body 41 has stopped, and detects the height of the lift body 41 in that state as the clamp height (step ST4, clamp height detection step).

[0070] When the control unit 16 detects the clamp height, it compares the detected clamp height with the normal clamp height data stored in the memory unit 16b (step ST5), and determines whether the clamping of the substrate KB has been completed normally based on whether the clamp height is smaller than the normal clamp height (step ST6, a determination step).

[0071] If the control unit 16 determines in step ST6 that the clamping of the substrate KB has not been completed normally, it determines that an abnormality has occurred in the process of clamping the substrate KB, and after notifying the operator OP of the error via the notification means 60 (step ST7, notification process), it interrupts the clamping operation of the substrate KB (step ST8).On the other hand, if the control unit 16 determines in step ST7 that the clamping operation of the substrate KB has been completed normally, it terminates the clamping operation of the substrate KB.

[0072] As described above, component mounting system 1 (component mounting device) 3 in this embodiment includes memory unit 16b that stores data on the normal clamp height, which is the height of lifting body 41 when substrate KB is clamped properly; determination unit 16c that determines whether substrate KB has been clamped properly by comparing the clamp height, which is the height of lifting body 41 detected by height detection unit 45 when substrate KB is clamped, with the normal clamp height; and notification means 60 that issues an error notification if determination unit 16c determines that substrate KB has not been clamped properly. The component mounting device 3's substrate holding method detects the clamp height, which is the height of lifting body 41 when substrate KB is clamped (clamp height detection step), and compares the detected clamp height with the normal clamp height, which is the height of lifting body 41 when substrate KB is clamped properly, to determine whether clamping of substrate KB has been completed properly (determination step). If it is determined that substrate KB has not been clamped properly, an error notification is issued (notification step).

[0073] Therefore, if the board KB is not clamped properly, an error is notified to the operator OP via the notifying means 60, and the operator OP is urged to take notice, so that the operator OP can notice that a clamping error has occurred and can take the necessary measures. Therefore, it is possible to prevent the component mounting operation from being performed in a state in which the board KB in this embodiment is not held properly.

[0074] 14 and 15 show modified examples of the sensor unit 50 constituting the height detection unit 45. Both of the two modified examples (first and second modified examples) shown here enable highly accurate reading of the elevation movement amount of the lift-and-lower body 41 by doubling the reading accuracy (resolution) of the rotational movement amount of the mark member 52, and use two mark detection units 55. The combinations of the presence and absence of the slits 52S detected by each of the two mark detection units 55 are then configured to change in accordance with the rotation of the mark member 52, from (a) "absent, absent" → (b) "absent, present" → (c) "present, present" → (d) "present, absent" → (a) "absent, absent" → ... or (a) "absent, absent" → (d) "present, absent" → (c) "present, present" → (b) "absent, present" → (a) "absent, absent" → ..., and the number of changes in the combinations is counted, and the height of the lift-and-lower body 41 is calculated based on the number of changes in the counted combinations of the presence and absence of the marks.

[0075] 14 shows a first modified example. In the figure, the inspection light 55L of the upper mark detection unit 55 is indicated by the symbol "L1," and the inspection light 55L of the lower mark detection unit 55 is indicated by the symbol "L2." Furthermore, a white circle "◯" indicates a state in which the mark detection unit 55 detects that there is a slit 52S at the detection position KP, and a black circle "●" indicates a state in which there is no slit 52S at the detection position KP. The width of the slit 52S and the spacing between adjacent slits 52S are equal.

[0076] In the first modified example, when the mark member 52 rotates in a direction in which the slit 52S moves downward, the combination of the presence or absence of the slit 52S detected by the upper mark detection unit 55 and the presence or absence of the slit 52S detected by the lower mark detection unit 55 changes as follows in Fig. 14: (a) "absent, absent" → (b) "absent, present" → (c) "present, present" → (d) "present, absent" → (a) "absent, absent" → ... Conversely, when the mark member 52 rotates in a direction in which the slit 52S moves upward, the combination of the presence or absence of the slit 52S detected by the upper mark detection unit 55 and the presence or absence of the slit 52S detected by the lower mark detection unit 55 changes as follows in Fig. 14: (a) "absent, absent" → (d) "present, absent" → (c) "present, present" → (b) "absent, present" → (a) "absent, absent" → ...

[0077] Fig. 15 shows a second modified example. In the second modified example, when the mark member 52 rotates in a direction in which the slit 52S moves downward, the combination of the presence or absence of the slit 52S detected by the upper mark detection unit 55 and the presence or absence of the slit 52S detected by the lower mark detection unit 55 changes in Fig. 15 from "absent, absent" → (d) "present, absent" → (c) "present, present" → (b) "absent, present" → (a) "absent, absent" → ... Conversely, when the mark member 52 rotates in a direction in which the slit 52S moves upward, the combination of the presence or absence of the slit 52S detected by the upper mark detection unit 55 and the presence or absence of the slit 52S detected by the lower mark detection unit 55 changes in Fig. 15 from (a) "absent, absent" → (d) "absent, present" → (c) "present, present" → (b) "present, absent" → (a) "absent, absent" → ... In the first and second modified examples, the accuracy (resolution) of reading the rotational movement amount can be doubled compared to when there is one mark detection unit 55.

[0078] As described above, in the component mounting system 1 of this embodiment, the height detection unit 45, which detects the height of the lifting body 41, converts the amount of lifting movement of the lifting body 41 into the amount of rotational movement of the marking member 52, and effectively magnifies and detects the amount of lifting movement of the lifting body 41. This makes it possible to increase the number of slits 52S per distance along the arc line EK of the marking member 52, which corresponds to a unit distance in the up-down direction of the lifting body 41, thereby improving the accuracy (resolution) of reading the amount of lifting movement of the lifting body 41. Therefore, according to this embodiment, the component mounting operation can be performed while accurately detecting the height of the lifting body 41 with an inexpensive configuration.

[0079] Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above and various modifications are possible. For example, in the above-described embodiments, the mark member 52 is fan-shaped, but the mark member 52 does not necessarily have to be fan-shaped and may be semicircular or have another shape.

[0080] Furthermore, in the above-described embodiment, the mark provided on the mark member 52 is a slit 52S that opens at the arc-shaped outer edge of the mark member 52, but this may also be a hole that does not open at the outer edge of the mark member 52. Furthermore, the mark may be, for example, a colored mark, and the mark detection unit 55 may detect the presence or absence of the mark by detecting the color of the mark at the detection position.

[0081] Furthermore, in the above-described embodiment, the rotation operating member 54 is configured to rise and fall together with the lifting body 41 by connecting the connecting portion 54F at its upper end to the lifting body 41, but the rotation operating member 54 does not have to be directly connected to the lifting body 41, and may be indirectly connected to the lifting body 41 via another member.

[0082] Furthermore, in the above-described embodiment, the elements of the memory unit 16b, the judgment unit 16c, the notification control unit 16d, the counting unit 16e, and the height calculation unit 16f are all provided in the component mounting device 3, but all or part of these elements may be provided in a device other than the component mounting device 3 of the component mounting system 1. [Industrial Applicability]

[0083] A component mounting system and a substrate holding method are provided that are inexpensively configured and capable of performing component mounting work while accurately detecting the height of a lifting body. [Explanation of symbols]

[0084] 1. Component mounting system 3. Parts mounting equipment 12 Substrate transport holder 15 Mounting head 16 Control Unit 16b Storage section 16c Judgment section 16d Notification control section 16e Counting section 16f Height calculation unit (calculation unit) 22 Transport conveyor 34 Movable clamper 35 Fixed clamper 41 Elevating body 41F flange 43 Support pin (board support part) 44 Lifting cylinder 45 Height detection unit 50 Sensor unit 51 Base body 52 Marking material 52J rotating shaft 52S Slit (Mark) 52H Engaged part 53 bias spring 54 Rotation operation member 54K Engagement part 54D Dog 55 Mark detection unit 55L inspection light 56 Downward sensor 57 Upper sensor 60 Notification means EK Arc Line TH Thickness H0 Reference height KP detection position BH parts KB board

Claims

1. A component mounting system comprising: a lifting body that rises and falls below a substrate carried in by a transport conveyor; a height detection unit that detects the height of the lifting body; a control unit that controls the elevation of the lifting body based on the height of the lifting body detected by the height detection unit; and a mounting head that mounts components onto the substrate supported by a substrate support unit provided on the lifting body that has risen from below the substrate, The height detection unit a marking member that is rotatable about a rotation axis extending in a direction intersecting the ascending / descending direction of the elevating body and that has a plurality of marks arranged along an arc line centered on the rotation axis; a rotation operation member that moves up and down together with the lifting body to rotate the mark member; a mark detector that detects when the mark, which moves on a path along the arc line as the mark member rotates, passes through a detection position set on the path; a counting unit that counts the number of the marks detected by the mark detecting unit; a calculation unit that calculates the height of the lifting body based on the number of the marks counted by the counting unit; A component mounting system equipped with

2. 2. The component mounting system according to claim 1, wherein the calculation unit calculates the amount of change in height of the lifting / lowering body based on the number of the marks counted by the counting unit, and calculates the height of the lifting / lowering body based on the calculated amount of change in height of the lifting / lowering body.

3. 2. The component mounting system according to claim 1, wherein the mark is a slit or a hole, and the mark detection unit is an optical sensor that projects an inspection light onto the detection position.

4. 2. The component mounting system according to claim 1, wherein the rotation operation member has an engaging portion, and the mark member is rotated by moving up and down while the engaging portion is engaged with an engaged portion provided on the mark member.

5. 5. The component mounting system according to claim 4, wherein the rotation operating member is configured to cause the engaging portion to engage with the engaged portion when the ascending lift body reaches a predetermined reference height, and the mark member rotates after the ascending lift body reaches the reference height.

6. 2. The component mounting system according to claim 1, further comprising a plurality of marking members each having a different radius of the arc line, and the plurality of marking members are replaceable.

7. 2. The component mounting system according to claim 1, further comprising: a movable clamper that is pushed up by the ascending lifting body to lift the edge of the substrate that has been brought in; and a fixed clamper that is positioned above the movable clamper and against which the upper surface of the edge of the substrate that has been lifted by the movable clamper abuts.

8. 8. The component mounting system of claim 7, further comprising: a memory unit that stores data on a normal clamping height, which is the height of the lifting body when the substrate is clamped normally; and a determination unit that determines whether the substrate is clamped normally by comparing the clamping height, which is the height of the lifting body detected by the height detection unit when the substrate is clamped, with the normal clamping height.

9. 9. The component mounting system according to claim 8, further comprising a notification unit that notifies an error when the determining unit determines that the substrate has not been clamped properly.

10. a controller for controlling the elevation of the lifting body based on the height of the lifting body detected by the height detector; a mounting head for mounting components on the substrate supported by a substrate support unit provided on the lifting body that rises from below the substrate; a movable clamper that is pushed up by the rising lifting body to lift an end of the substrate that has been carried in; and a fixed clamper that is positioned above the movable clamper and against which an upper surface of the end of the substrate lifted by the movable clamper abuts, and the height detector is configured to detect a height of the lifting body in a direction perpendicular to the elevation direction. a mark member rotatable about a rotation axis extending in a direction perpendicular to the axis of rotation and having a plurality of marks arranged along an arc line centered on the rotation axis; a rotation operation member that moves up and down together with the lifting body to rotate the mark member; a mark detection unit that detects the marks that move on a path along the arc line as the mark member rotates and pass through detection positions set on the path; a counting unit that counts the number of marks detected by the mark detection unit; and a calculation unit that calculates the height of the lifting body based on the number of marks counted by the counting unit, a clamp height detection step of detecting a clamp height, which is the height of the lifting body when the substrate is clamped, by the height detection unit; a determination step of determining whether clamping of the substrate has been completed normally by comparing the clamp height detected in the clamp height detection step with a normal clamp height, which is the height of the lifting body when the substrate is normally clamped; A substrate holding method comprising:

11. 11. The substrate holding method according to claim 10, further comprising a notifying step of notifying an error when it is determined in the determining step that the substrate has not been clamped normally.

Images