Illumination device, semiconductor manufacturing apparatus, semiconductor device inspection apparatus, semiconductor device manufacturing method, and semiconductor device inspection method

Abstract

To provide a technique capable of improving uniformity of irradiation intensity at a relative position with a surface light-emitting surface.SOLUTION: The lighting device includes a plurality of light sources each having a planar light-emitting surface, and an optical path control plate for controlling an optical path of irradiation light from the planar light-emitting surface. The irradiation light controlled by the light path control plate is emitted.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present disclosure relates to a semiconductor manufacturing apparatus, and is applicable to, for example, a die bonder that emits illumination light from an illumination device having a surface-emitting surface. [Background technology]

[0002] A die bonder, as a semiconductor manufacturing device, is a device that bonds a die onto a substrate or onto an already bonded die.

[0003] In die bonders, a lighting device may irradiate an object to be imaged with light, a recognition camera may capture an image of the object, and the captured image may be processed to perform positioning, appearance inspection, etc. For example, an oblique lighting device or a coaxial lighting device having a surface light-emitting surface may be used as the lighting device (for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2022-52009 Summary of the Invention [Problem to be solved by the invention]

[0005] When a lighting device having a surface-emitting surface is used, the irradiation intensity may vary depending on the relative position with respect to the surface-emitting surface.

[0006] An object of the present disclosure is to provide a technology that can improve the uniformity of the illumination intensity at a position relative to the surface light-emitting surface. Other objects and novel features will become apparent from the description of this specification and the accompanying drawings. [Means for solving the problem]

[0007] The illumination device includes a plurality of light sources each having a surface-emitting surface, and a light path control plate that controls the light path of the irradiated light from the surface-emitting surface. The irradiated light is controlled by the light path control plate. [Effects of the Invention]

[0008] According to the present disclosure, it is possible to improve the uniformity of the irradiation intensity at a position relative to the surface light-emitting surface. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a top view showing an outline of a die bonder according to an embodiment. [Figure 2] FIG. 2 is a diagram illustrating the schematic configuration when viewed from the direction of arrow A in FIG. [Figure 3] FIG. 3 is a side view showing an outline of the preform part shown in FIG. [Figure 4] FIG. 4 is a block diagram showing a schematic configuration of a control system of the die bonder shown in FIG. [Figure 5] FIG. 5 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder shown in FIG. [Figure 6] FIG. 6 is a schematic diagram showing an imaging device and an illumination device according to the embodiment. [Figure 7] FIG. 7 is a schematic top view showing an example of an optical path of surface emission in the lighting device shown in FIG. [Figure 8] Figure 8(a) is a schematic perspective view showing a first example of the optical path control plate shown in Figures 6 and 7. Figure 8(b) is a diagram specifically showing the optical path control of Figure 8(a). Figure 8(c) is a schematic perspective view showing a second example of the optical path control plate shown in Figures 6 and 7. Figure 8(d) is a schematic perspective view showing a third example of the optical path control plate shown in Figures 6 and 7. [Figure 9] FIG. 9 is a schematic perspective view showing an imaging device and an illumination device in the first modified example. [Figure 10] FIG. 10 is a schematic perspective view showing an example of an optical path of surface emission in the illumination device in the first modified example shown in FIG. [Figure 11]FIG. 11 is a schematic perspective view showing an imaging device and an illumination device in the second modified example. [Figure 12] FIG. 12 is a schematic perspective view showing an example of an optical path of surface emission in the illumination device in the second modified example shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments and modifications will be described with reference to the drawings. However, in the following description, the same components will be assigned the same reference numerals, and repeated description may be omitted. Note that, to clarify the description, the drawings may show the width, thickness, shape, etc. of each part more schematically than in the actual embodiment. Furthermore, the dimensional relationships and ratios of each element between multiple drawings do not necessarily match.

[0011] The configuration of a die bonder as one aspect of semiconductor manufacturing equipment will be described with reference to Figures 1, 2, and 3. Figure 1 is a top view showing an outline of the die bonder in an embodiment. Figure 2 is a diagram explaining the outline of the configuration as seen from the direction of arrow A in Figure 1. Also, Figure 3 is a side view showing an outline of the preform section shown in Figure 1.

[0012] The die bonder 1 broadly comprises a wafer supply unit 10, a pickup unit 20, an intermediate stage unit 30, a preform unit 90, a bonding unit 40, a transport unit 50, a substrate supply unit 60, a substrate unloading unit 70, and a control unit (controller) 80. The Y2-Y1 direction is the front-to-rear direction of the die bonder 1, the X2-X1 direction is the left-to-right direction, and the Z1-Z2 direction is the up-to-down direction. The wafer supply unit 10 is located on the front side of the die bonder 1, and the bonding unit 40 is located on the rear side.

[0013] The wafer supply unit 10 includes a wafer cassette lifter 11 , a wafer holder 12 , and a peeling unit 13 .

[0014] A wafer cassette lifter 11 moves a wafer cassette (not shown) storing multiple wafer rings WR up and down to the wafer transport height. A wafer correction chute (not shown) aligns the wafer rings WR supplied from the wafer cassette lifter 11. A wafer extractor (not shown) removes the wafer rings WR from the wafer cassette and supplies them to the wafer holder 12, or removes them from the wafer holder 12 and stores them in the wafer cassette.

[0015] A wafer W is adhered (attached) to a dicing tape DT, and the wafer W is divided into a plurality of dies D. The dicing tape DT is held by a wafer ring WR. The wafer W is, for example, a semiconductor wafer or a glass wafer, and the dies D are semiconductor chips, glass chips, or MEMS (Micro Electro Mechanical Systems).

[0016] The wafer holder 12 is moved in the X1-X2 and Y1-Y2 directions by an XY table and a drive unit (not shown), and moves the die D to be picked up to the position of the peeling unit 13. The wafer holder 12 rotates the wafer ring WR in the XY plane by a drive unit (not shown). The peeling unit 13 is moved in the Z1-Z2 directions by a drive unit (not shown). The peeling unit 13 peels the die D from the dicing tape DT.

[0017] The pickup unit 20 has a pickup head 21, a Y drive unit 23, and a wafer recognition camera 24. The pickup head 21 is provided with a collet 22 that suction-holds the peeled die D at its tip. The pickup head 21 picks up the die D from the wafer supply unit 10 and places it on the intermediate stage 31. The Y drive unit 23 moves the pickup head 21 in the Y1-Y2 direction. The pickup unit 20 has various drive units (not shown) that raise and lower the pickup head 21, rotate it, and move it in the X1-X2 direction. The wafer recognition camera 24 determines the pickup position of the die D to be picked up from the wafer W and inspects the surface of the die D.

[0018] The intermediate stage unit 30 has an intermediate stage 31 on which the die D is placed, and a stage recognition camera 34 for recognizing the die D on the intermediate stage 31. The intermediate stage 31 has suction holes (not shown) that adsorb the placed die D. The placed die D is temporarily held on the intermediate stage 31.

[0019] The preform unit 90 has a preform head 91, a drive unit 93, a preform camera 94 as an imaging device, and a preform stage 96. The preform head 91 is composed of a syringe 92 with a nozzle. The syringe 92 stores a resin paste (hereinafter simply referred to as "paste") as an adhesive, and the paste is discharged from the nozzle. The preform head 91 applies the paste to a substrate S that has been transported to the preform stage 96 by the transport unit 50. The drive unit 93 moves the preform head 91 in the X1-X2 direction, the Y1-Y2 direction, and the Z1-Z2 direction. The substrate S is, for example, a wiring board, a lead frame formed from a thin metal plate, a glass substrate, etc.

[0020] The preform camera 94 captures an image of the surface to which the paste is to be applied by the preform head 91, and grasps the application position. The preform stage 96 rises when applying the paste to the substrate S, and supports the substrate S from below. The preform stage 96 has suction holes (not shown) for vacuum-adsorbing the substrate S, and can fix the substrate S in place.

[0021] The bonding section 40 includes a bond head 41, a Y-axis drive unit 43, a substrate recognition camera 44, and a bond stage 46. The bond head 41 is provided with a collet 42 that suction-holds a die D at its tip. The Y-axis drive unit 43 moves the bond head 41 in the Y1-Y2 direction. The substrate recognition camera 44 captures an image of a position recognition mark (not shown) in a package area P of the substrate S to determine the bond position. Here, the substrate S has multiple product areas (hereinafter referred to as package areas P) that will ultimately become a single package. A position recognition mark is provided for each package area P. The bond stage 46 is raised when the die D is placed on the substrate S and supports the substrate S from below. The bond stage 46 has suction holes (not shown) for vacuum-adsorbing the substrate S, allowing the substrate S to be fixed in place. The bond stage 46 also has a heating unit (not shown) for heating the substrate S. The bonding section 40 has driving sections (not shown) for raising and lowering the bond head 41, rotating it, and moving it in the X1-X2 direction and the Y1-Y2 direction.

[0022] With this configuration, the bond head 41 corrects the pickup position and posture based on the imaging data of the stage recognition camera 34, and picks up the die D from the intermediate stage 31. Then, based on the imaging data of the substrate recognition camera 44, the bond head 41 bonds (places and adheres) the die D onto the package area P of the transported substrate S, where the paste has been applied.

[0023] The transport unit 50 has transport claws 51 that grip and transport the substrate S, and a pair of transport lanes (chutes) 52 along which the substrate S moves. The substrate S moves in the X1-X2 direction by driving nuts (not shown) of the transport claws 51 provided on the transport lane 52 with ball screws (not shown) provided along the transport lane 52. With this configuration, the substrate S moves from the substrate supply unit 60 along the transport lane 52 to the bonding position, and after bonding, moves to the substrate unloading unit 70 and hands the substrate S over to the substrate unloading unit 70.

[0024] The substrate supply unit 60 removes the substrate S, which has been stored in a transport jig and carried in, from the transport jig and supplies it to the transport unit 50. The substrate unloading unit 70 stores the substrate S, which has been carried in by the transport unit 50, in the transport jig.

[0025] The control system of the die bonder 1 will be described with reference to Fig. 4. Fig. 4 is a block diagram showing a schematic configuration of the control system of the die bonder shown in Fig. 1.

[0026] The control system 8 comprises a control unit 80, a drive unit 86, a signal unit 87, and an optical system 88. The control unit 80 broadly comprises a control and arithmetic unit 81 mainly composed of a CPU (Central Processing Unit), a storage unit 82, an input / output unit 83, a bus line 84, and a power supply unit 85. The storage unit 82 comprises a main storage unit 82a and an auxiliary storage unit 82b. The main storage unit 82a is composed of RAM (Random Access Memory) that stores processing programs and the like. The auxiliary storage unit 82b is composed of an HDD (Hard Disk Drive) or SSD (Solid State Drive) that stores control data, image data, and the like required for control.

[0027] The input / output device 83 includes a monitor 83a that displays the device status and information of the die bonder 1, a touch panel 83b that inputs operator instructions, a pointing device such as a mouse 83c that operates the monitor 83a, and an image capture device 83d that captures image data from an optical system 88. The input / output device 83 also includes a motor control device 83e and an I / O signal control device 83f. The motor control device 83e controls a drive unit 86, such as the XY table of the wafer supply unit 10 and the XYZ drive axes of the bond head table of the bonding unit 40. The I / O signal control device 83f receives signals from and controls a signal unit 87. The signal unit 87 includes various sensors, switches and volumes that control the brightness of lighting devices, etc. The control / arithmetic unit 81 receives and calculates necessary data via a bus line 84, controls the pickup head 21, etc., and sends information to the monitor 83a, etc.

[0028] The control and arithmetic unit 81 stores image data captured by the optical system 88 in the storage device 82 via the image capture device 83d. The optical system 88 includes a wafer recognition camera 24, a stage recognition camera 34, a substrate recognition camera 44, a preform camera 94, and a lighting device. The cameras used in the optical system 88 digitize light intensity and color. Using software programmed based on the stored image data, the control and arithmetic unit 81 positions the die D and substrate S, inspects the paste application pattern, and inspects the surfaces of the die D and substrate S. Based on the calculated positions of the die D and substrate S, the control and arithmetic unit 81 drives the driver 86 via the motor control device 83e using software. Through this process, the control and arithmetic unit 81 positions the die D on the wafer holder 12 and the intermediate stage 31, and the substrate S on the preform stage 96 and the bond stage 46, and operates the drivers of the wafer supply unit 10, the pickup unit 20, and the bonding unit 40 to bond the die D onto the package area P of the substrate S.

[0029] A part of the manufacturing process of a semiconductor device using the die bonder 1 (a method for manufacturing a semiconductor device) will be described with reference to Fig. 5. Fig. 5 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder shown in Fig. 1. In the following description, the operation of each part constituting the die bonder 1 is controlled by a control unit 80.

[0030] (Wafer loading: process S1) A wafer cassette containing wafer rings WR is loaded into wafer cassette lifter 11. Wafer rings WR are supplied (carried in) to wafer holder 12 from the loaded wafer cassette.

[0031] (Substrate loading: Process S2) The transport jig storing the substrate S is loaded into the substrate supply section 60. In the substrate supply section 60, the substrate S stored in the transport jig is taken out of the transport jig. Then, the substrate S is supplied (carried in) to the preform section 90 via the transport section 50.

[0032] (Pickup: Process S3) After step S1, the wafer holder 12 is moved so that the desired die D can be picked up from the dicing tape DT. The die D is imaged by the wafer recognition camera 24, and the die D is positioned and its surface inspected based on the image data acquired by the image capture. The image data is processed to calculate the amount of deviation (in the X, Y, and θ directions) of the die D on the wafer holder 12 from the die position reference point of the die bonder 1, and the die is positioned accordingly. Note that the die position reference point is previously set to a predetermined position on the wafer holder 12 as the initial setting for the device. The image data is processed to inspect the surface of the die D.

[0033] The positioned die D is peeled off from the dicing tape DT by the peeling unit 13 and the pickup head 21. The die D peeled off from the dicing tape DT is attracted to and held by a collet 22 provided on the pickup head 21, and is transported to and placed on the intermediate stage 31.

[0034] The die D on the intermediate stage 31 is imaged by the stage recognition camera 34, and the die D is positioned and its surface inspected based on the image data acquired by the image capture. The image data is processed to calculate the amount of deviation (in the X, Y, and θ directions) of the die D on the intermediate stage 31 from the die position reference point of the die bonder 1, and the die is positioned accordingly. Note that the die position reference point is previously held at a predetermined position on the intermediate stage 31 as the initial setting of the device. The image data is processed to inspect the surface of the die D.

[0035] After transporting the die D to the intermediate stage 31, the pickup head 21 is returned to the wafer supply unit 10. Following the procedure described above, the next die D is peeled off from the dicing tape DT, and thereafter, the dies D are peeled off one by one from the dicing tape DT following the same procedure.

[0036] (Preform: Process S4) After step S2, the substrate S is transported to the preform stage 96 by the transport unit 50. The surface of the substrate S before application is imaged by the preform camera 94, and the application surface is confirmed based on the image data acquired by the image capture, and the position where the paste should be applied is determined. If there are no problems with the surface to be applied, the position where the paste should be applied on the substrate S supported by the preform stage 96 is confirmed and positioned.

[0037] The applied paste is imaged by the preform camera 94. Whether the paste has been applied accurately is confirmed based on the image acquired by imaging, and an inspection (visual inspection) of the applied paste is performed. That is, the visual inspection confirms whether the applied paste has been applied in a predetermined amount in a predetermined shape at a predetermined position on the substrate S. The inspection contents include, for example, the presence or absence of paste, the applied area, and the applied shape (excess or shortage, overflow).

[0038] (Bond: Process S5) If there are no problems with the coating, the substrate S is transported to the bond stage 46 by the transport unit 50. The substrate S placed on the bond stage 46 is imaged by the substrate recognition camera 44, and image data is acquired by the image capture. The image data is processed to calculate the amount of deviation (X, Y, and θ directions) of the substrate S from the substrate position reference point of the die bonder 1. Note that the substrate position reference point is previously held at a predetermined position of the bonding unit 40 as the initial setting for the device.

[0039] The suction position of the bond head 41 is corrected based on the amount of deviation of the die D on the intermediate stage 31 calculated in step S3, and the die D is suctioned by the collet 42. The bond head 41 that has suctioned the die D from the intermediate stage 31 bonds the die D to a predetermined position on the substrate S supported by the bond stage 46. The substrate recognition camera 44 captures an image of the die D bonded to the substrate S, and based on the image data acquired by the image capture, an inspection is performed to determine whether the die D has been bonded to the desired position, etc.

[0040] After bonding the die D to the substrate S, the bond head 41 is returned to the intermediate stage 31. Following the procedure described above, the next die D is picked up from the intermediate stage 31 and bonded to the substrate S. This is repeated until a die D is bonded to all package areas P of the substrate S.

[0041] (Substrate unloading: Process S6) The transfer section 50 transfers the substrate S with the die D bonded thereto from the bonding section 40 to the substrate transfer section 70. In the substrate transfer section 70, the substrate S is taken out and stored in a transfer jig, and then the substrate S is transferred out. The transfer jig storing the substrate S is transferred out of the die bonder 1.

[0042] As described above, the die D is mounted on the substrate S and is carried out from the die bonder 1. Thereafter, for example, a transport jig storing the substrate S on which the die D is mounted is transported to a wire bonding process, where the electrodes of the die D are electrically connected to the electrodes of the substrate S via Au wires or the like. Then, the substrate S is transported to a molding process, where the die D and the Au wires are sealed with molding resin (not shown), thereby completing a semiconductor package.

[0043] It is desirable to arrange each attachment point, such as the bonding section 40 and the preform section 90, close to each other to shorten the transportation time. The optical system at each attachment point has an optimized illumination system (e.g., a coaxial illumination device, an oblique illumination device, etc.), which will be described later. Note that the optical system 88 shown in FIG. 4 includes a pickup optical system and a stage optical system in addition to the preform optical system and the bonding optical system. The pickup optical system includes a wafer recognition camera 24 and an illumination system used therefor. The stage optical system includes a stage recognition camera 34 and an illumination system used therefor.

[0044] Next, an illumination device in an embodiment will be described with reference to Figs. 6 to 8. Fig. 6 is a schematic diagram showing an imaging device and an illumination device in an embodiment. Fig. 6 shows an example of an imaging device and an illumination device provided in the bonding section 40 of the die bonder 1, for example. The imaging device 110 is composed of a recognition camera 111 and a lens 112, and is disposed above an illumination device 122, which will be described later. The illumination device 122 includes an LED substrate 122c on which LEDs 122e, which are light sources, are arranged in a grid pattern, a diffusion plate 122d attached to the LED substrate 122c (the surface of the diffusion plate 122d forms the surface light-emitting surface 122a), and an optical path control film (hereinafter referred to as optical path control plate) 122b provided on the surface light-emitting surface 122a to control the optical path of light irradiated from the surface light-emitting surface 122a. Similarly, illumination device 123 includes an LED substrate 123c on which LEDs 123e, which are light sources, are arranged in a grid pattern, a diffuser plate 123d attached to LED substrate 123c (the surface of diffuser plate 123d forms surface-emitting surface 123a), and a light path control plate 123b provided on surface-emitting surface 123a. These illumination devices 122 and 123 are arranged in opposing directions diagonally above substrate S, i.e., between the X1 and Z1 directions and between the X2 and Z1 directions, and each has the function of oblique illumination, irradiating light onto imaging object 301. Furthermore, these illumination devices 122 and 123 are illumination devices of the same type and shape.

[0045] FIG. 7 is a top view schematic diagram showing an example of the optical path of surface-emitting light in the illumination device shown in FIG. 6. FIG. 7 shows an example of the optical path of light emitted from illumination devices 122 and 123 toward the X1-axis and X2-axis sides, respectively, as viewed from the imaging device side, i.e., from the Z1-axis side of the schematic diagram shown in FIG. 6. As shown in FIG. 7, illumination devices 122 and 123 are configured so that the length in the Y-axis direction is greater than the width (length in the Y-axis direction) of substrate S. The imaging object 301 is, for example, a paste applied to attachment region B. Multiple imaging objects 301 are provided along the Y-axis, which is the first direction. The illumination surfaces of illumination devices 122 and 123 for oblique illumination extend along this first direction, and illumination light is applied to the multiple imaging objects 301. The imaging object 301 may also be a die or a substrate. The field of view of imaging device 110 is, for example, a range that covers at least one attachment region B, and imaging device 110 is configured to be movable in the Y-axis direction of substrate S. This makes it possible to capture images of all attachment regions B in the Y-axis direction of the substrate S.

[0046] The diffusion plates 122d and 123d including the surface light-emitting surfaces 122a and 123a of the lighting devices 122 and 123 are attached to the LED substrates 122c and 123c, respectively, and are made of, for example, a thin glass plate with at least one side made opaque from a transparent plate glass.

[0047] Light path control plates 122b, 123b are configured to change and increase the directivity of the illumination light emitted from surface-emitting surfaces 122a, 123a, so that the illumination direction of light in a first direction onto the surface of image capture object 301 is uniform, as shown by the light paths indicated by the arrows in Fig. 7. Light that illuminates image capture object 301 at a small angle passes through light path control plates 122b, 123b, and light that illuminates at a large angle is absorbed by light absorption layer 122f, which will be described later. By attaching light path control plates 122b, 123b to surface-emitting surfaces 122a, 123a, respectively, it is possible to avoid variations in brightness due to the position on image capture object 301.

[0048] As shown in Figs. 8(a) and 8(c) described below, optical path control plates 122b and 123b have at least one louver structure selected from stripe, honeycomb, cylindrical and polygonal shapes.

[0049] The control unit 200 controls the LEDs 122e and 123e so that the lighting devices 122 and 123 emit light from two directions. The light may be emitted from the two directions simultaneously, or at different timings. The intensity or amount of light emitted from the two directions may be the same or different. Furthermore, the control unit 200, as will be described later, captures an image of the surface of the object 301 to be imaged using the imaging device 110, records the captured image, and performs an appearance inspection (surface inspection and position inspection) based on the recorded image. The imaging device 110, the lighting devices 122 and 123, and the control unit 200 constitute an inspection device.

[0050] Next, the surface light emission used in the present disclosure will be described. When the light irradiated from the surface light emitting surface is diffused light, it is possible to capture an image of the object 301 without creating a shadow in the Y1-Y2 direction even if the surface of the object has an uneven shape.

[0051] On the other hand, the intensity distribution of the light reaching the image capture object 301 in the first direction varies depending on the position on the surface of the image capture object 301. This is because, in a surface-emitting lighting device, diffused light is irradiated from every point on the surface-emitting surface onto all of the image capture objects 301 within the width direction of the substrate S, regardless of the distance from the image capture object 301. As a result, the image of the image capture object 301 captured by the imaging device 110 varies in brightness, reducing the accuracy of positioning and inspection results. For this reason, it is necessary to control the irradiation angle in the horizontal direction, i.e., the light path.

[0052] Next, with reference to FIG. 7, optical path control plates 122b and 123b that can achieve uniformity of the irradiation angle and control of the optical path in this surface emission will be described.

[0053] For visual inspection or positioning, light is irradiated from the surface-emitting surfaces 122a and 123a onto the image capturing object 301 formed in the attachment area B on the substrate S. Without the light path control plates 122b and 123b, light from a certain point on the surface-emitting surface is irradiated across the entire width of the substrate S, and the light intensity varies depending on the position of the image capturing object. For example, the image capturing object 301a located at the extreme end in the Y1 direction has a higher light intensity on the Y2 direction side than on the Y1 direction side. Similarly, the image capturing object 301b located at the extreme end in the Y2 direction has a higher light intensity in the Y1 direction than on the Y2 direction side. As shown in FIG. 7, by providing the light path control plates 122b and 123b on the surface-emitting surfaces 122a and 123a, respectively, the light path is controlled, so that the surface of each image capturing object 301 is irradiated with light only from the nearby surface-emitting surfaces 122a and 123a. This allows the light intensity and range of irradiation direction on the Y1 and Y2 sides of each image capture object 301 to be approximately equal. In addition, by irradiating from both the X1 and X2 directions, no shadow is cast on the image capture object 301 in the X1-X2 direction, stabilizing the brightness during image capture. In other words, the brightness of the image of any image capture object 301 within the width direction of the substrate S is constant regardless of its relative position with respect to the surface-emitting surfaces 122a, 123a. As a result, stable accuracy is achieved in visual inspection and positioning.

[0054] Next, specific examples of the light absorption layers that are components of the light path control plates 122b and 123b will be described. FIG. 8(a) is a perspective schematic diagram showing a first example of the light path control plate shown in FIGS. 6 and 7, FIG. 8(b) is a diagram specifically illustrating the light path control of FIG. 8(a), and FIG. 8(c) is a perspective schematic diagram showing a second example of the light path control plate shown in FIGS. 6 and 7. FIG. 8(a) shows a first example, a striped louver structure in which the light absorption layers 122f of the light path control plate 122b used in this embodiment are arranged parallel to the surface-emitting surface 122a at regular intervals, for example, approximately perpendicular to the surface-emitting surface 122a. By using this structure, as shown in FIG. 8(b), the illumination light (diffused light) emitted from the surface-emitting surface 122a is irradiated onto the image capture target 301 from the same direction with a constant angle control. In other words, of the light from a certain point on the surface-emitting surface 122a, only the angle-controlled light that has passed through the light path control plates 122b and 123b reaches the image capture target 301.

[0055] Fig. 8(c) shows a second example of a honeycomb louver structure incorporated into a hexagonal prism light absorbing layer 122g (honeycomb pattern). As with the light absorbing layer 122f described above, this structure also makes it possible to prevent the diffusion of light from the surface emitting surface 122a indicated by the arrows in Fig. 8(b).

[0056] 8(a) and 8(c), such as a cylindrical louver structure or a polygonal louver structure other than a hexagon, in which the light absorbing layers 122f intersect, an optical path is secured, and films are laminated, it goes without saying that the same effect can be obtained. Of course, depending on the type of light source and the object to be imaged, these light absorbing layers may be configured to be angled rather than substantially perpendicular to the surface emitting surfaces 122a and 123a.

[0057] Figure 8(d) is a perspective schematic diagram showing a third example of the light path control plate shown in Figures 6 and 7. Prism sheet 122h shown in Figure 8(d) can also be used, which has periodic grooves formed therein that can change the angle of diffused light and is made of, for example, acrylic or glass. Prism sheet 122h can change the directionality of diffused light. Of course, a similar effect can be achieved with any component, such as a lens or filter, that prevents diffused light from irradiating areas other than the object being imaged (hereinafter referred to as stray light) and controls or converges the viewing angle.

[0058] Furthermore, this prism sheet 122h may be a single layer, or may be multi-layered so that, for example, the optical path control plates intersect in order to further converge the diffused light.

[0059] 8(a) to (d) are explained using the illumination device 122 shown in FIGS. 6 and 7 as an example, but the same can be applied to the illumination device 123 and other surface-emitting oblique illumination devices.

[0060] Thus, an embodiment of the present disclosure has been described for the bonding section 40 of the die bonder 1, but it goes without saying that from the standpoint of visual inspection and bonding positioning work, it can be similarly applied to the pickup section 20, intermediate stage section 30 and preform section 90.

[0061] Furthermore, in the embodiment, the angle of diffused light is controlled by light path control plates 122b and 123b, but it is also possible to make the light parallel depending on the shape, thickness, direction and slit pitch of the light path control plates.

[0062] According to this embodiment, the difference in light intensity and brightness depending on the relative position between the surface emitting surface and the object to be imaged is reduced, the dependency on the pattern position and shape on the die D is reduced, and the surface image of the object to be imaged 301 becomes clearer.

[0063] According to this embodiment, the difference in light intensity and brightness due to the relative position between the surface emitting surface and the object to be imaged is reduced, so that the inspection device becomes less dependent on the surface shape or surface condition of the die D, enabling more detailed surface inspection.

[0064] Furthermore, according to this embodiment, the uniformity of the illumination of the diffused light from the surface emitting surface onto the object to be imaged on the die D is improved, which increases the accuracy of positioning determination and leads to an improvement in the operating rate of the die bonder 1.

[0065] <Modification> Below, several representative modified examples of the embodiments are given. In the following description of the modified examples, the same reference numerals as those in the above-described embodiments may be used for parts having the same configurations and functions as those described in the above-described embodiments. Furthermore, the description of such parts may be appropriately cited within the scope of technical inconsistency. Furthermore, a part of the above-described examples and all or part of the multiple modified examples may be appropriately applied in combination within the scope of technical inconsistency.

[0066] (First Modification) FIG. 9 is a schematic diagram showing an imaging device and an illumination device in the first modified example.

[0067] The imaging device 110 has a configuration similar to that of the embodiment. The illumination device 400 includes an LED substrate 401c on which LEDs 401e serving as light sources are arranged in a grid pattern between the lens 112 and the imaging target 301, a diffuser 401d attached to the LED substrate 401c (the surface of the diffuser 401d forms the surface-emitting surface 401a), and a light path control plate 401b provided on the surface-emitting surface 401a to control the light path of the light irradiated from the surface-emitting surface 401a, and arranged substantially perpendicular to the imaging target 301. A half mirror (semi-transmitting mirror, beam splitter) 402 is also provided inside the tube. The light path control plate 401b has, for example, a striped louver structure in which light absorption layers 401f of the light path control plate 401b are arranged parallel to the surface-emitting surface 401a and substantially perpendicular to the Z-axis direction. The LED substrate 401c, the diffuser 401d, and the light path control plate 401b are preferably made of the same materials and have the same configuration as those of the embodiment. In this way, the illumination device 400 of the first modified example has the function of coaxial epi-illumination (coaxial illumination) of a surface-emitting light source.

[0068] The control unit 200 controls the LED 401e to emit light from the surface light-emitting surface 401a. Furthermore, the control unit 200 performs imaging of the surface of the imaging target 301 using the imaging device 110, recording of the captured image, and visual inspection (surface inspection and position inspection) based on the recorded image. The imaging device 110, lighting device 400, and control unit 200 constitute an inspection device.

[0069] FIG. 10 is a perspective schematic diagram showing an example of the optical path of the surface light emitted by the illumination device of the first modified example shown in FIG. 9 . The diffused light from the surface light-emitting surface 401a, as shown by the arrow in FIG. 10 , reaches the semi-transparent mirror 402 by changing and enhancing the directivity of the diffused light, for example, by a light path control plate 401b having the same structure and material as the embodiment, suppressing the generation of stray light, and maintaining a uniform irradiation direction. The light is then reflected by the semi-transparent mirror 402 along the same optical axis as the recognition camera 111 and irradiated onto the image capture object 301. The light irradiated onto the image capture object 301 along the same optical axis as the recognition camera 111 is reflected by the image capture object 301, and the reflected light passes through the semi-transparent mirror 402 to reach the recognition camera 111, forming an image of the image capture object 301. Because the illumination is along the same optical axis as the recognition camera 111, it is possible to obtain an image with high accuracy of the surface condition of the image capture object 301, i.e., the surface roughness and unevenness. The object 301 to be imaged is, for example, a die, a substrate, a paste applied on a substrate, or the like.

[0070] When surface emission is used, in addition to the stray light described above, light directly irradiated from the diffuser plate 401d (light not reflected by the semi-transparent mirror 402) exists as leaked light. This causes the amount of light irradiated on the image capture object 301 to vary depending on the location (brightness varies). For this reason, by attaching a light path control plate 401b to the surface emission surface 401a, the light path to the semi-transparent mirror 402 can be controlled; in other words, uniformity of intensity can be maintained regardless of the LED 401e, the light-emitting position within the surface emission surface 401a, or the relative positions of the light source and the image capture object 301.

[0071] The degree of diffusion of light from the surface-emitting surface 401a increases as the distance from the light path control plate 401b increases, and the light intensity also tends to decrease. Therefore, in order to improve the uniformity of the irradiation direction, ensure brightness, and improve the uniformity of the light amount, it is structurally desirable for the surface-emitting surface 401a and the light path control plate 401b to be in contact. This is because if there is a space between the surface-emitting surface 401a and the light path control plate 401b, the stripe pitch will effectively become smaller, reducing the amount of light transmitted through the light path control plate 401b. However, although the brightness will decrease, a distance between them is acceptable. Furthermore, depending on the type of light source and the inspection pattern of the object to be imaged, the light absorption layer 401f of the light path control plate 401b may be configured to be at an angle other than approximately perpendicular to the surface-emitting surface 401a.

[0072] The first modified example also provides the same effects as the embodiment. As described above, there is no difference in the intensity and brightness of light on the image capture object 301, so it is possible to improve the uniformity of the irradiation intensity and ensure brightness at the relative positions of the surface light-emitting surface 401a and the image capture object 301. As a result, the accuracy of the surface inspection and positioning determination of the image capture object 301 is improved, leading to an improvement in the operating rate of the die bonder.

[0073] (Second Modification) FIG. 11 is a schematic diagram showing an imaging device and an illumination device in the second modified example.

[0074] The imaging device 110 has the same configuration as those in the embodiment and the first modified example. The illumination device 500 includes an LED substrate 501c on which LEDs 501e serving as light sources are arranged in a grid pattern, and a diffuser 501d attached to the LED substrate 501c (the surface of the diffuser 501d forms a surface-emitting surface 501a) arranged substantially perpendicular to the imaging object 301 between the lens 112 and the imaging object 301. A half mirror (semi-transmitting mirror, beam splitter) 502 is also provided inside the tube. The LED substrate 501c and the diffuser 501d are preferably made of the same material and have the same configuration as those in the embodiment and the first modified example. Thus, the illumination device 500 of the second modified example has the function of coaxial epi-illumination (coaxial illumination) of a surface-emitting light source, similar to that of the first modified example.

[0075] As in the first modified example, the control unit 200 controls the LED 501e to emit light from the surface light-emitting surface 501a. Furthermore, the control unit 200 performs an image capture of the surface of the image capture target 301 by the image capture device 110, records the captured image, and performs an appearance inspection (surface inspection and position inspection) based on the recorded image. The image capture device 110, the lighting device 500, and the control unit 200 constitute an inspection device.

[0076] Furthermore, in the lighting device 500 of the second variant, a light-shielding plate 503 serving as an optical path control plate is provided between the surface-emitting surface 501a attached to the LED 501e, which is the light source, and the object to be imaged 301, specifically in a manner covering a portion of the opening at the front lower part of the surface-emitting surface 501a.

[0077] The second modified example differs from illumination device 400 of the embodiment and the first modified example in that a light path control plate is not provided on surface light-emitting surface 501a and that light-shielding plate 503 is provided. In other words, the structure is such that diffused light is directly irradiated from surface light-emitting surface 501a.

[0078] 12 is a perspective schematic diagram showing an example of the optical path of the surface emission in the illumination device in the second modified example shown in FIG. 11. The diffused light from the surface emission surface 501a is configured such that, as shown in the example of the optical path indicated by the arrows in FIG. 12, leakage light, which is the diffused light from the surface emission surface 501a that does not reach the semi-transmitting mirror 502, is prevented from reaching the image capture object 301 by the light blocking plate 503. As described in the embodiment and the first modified example so far, the light path control plates 122b, 123b, and 401b contribute to suppressing the diffusion angle of the diffused light due to surface emission. However, the light blocking plate 503 does not suppress this, but instead controls the optical path so that the diffused light does not reach the image capture object 301. In other words, the diffused light that is not irradiated on the light blocking plate 503 is reflected by the semi-transmitting mirror 502.

[0079] Therefore, it is preferable that the light blocking plate 503 is made of, for example, a finely porous substance with a large surface area, or even a black polyurethane resin film, rather than a material that reflects light back into the lighting device 500. Of course, even if it is made of a material that reflects light, it can be used as the light blocking plate 503 as long as it reduces the intensity of that light.

[0080] According to this second modified example, although some light does not reach the image capturing object 301 due to the presence of the light shielding plate 503 as shown in Fig. 12, it is possible to significantly reduce the effects of stray light and leaked light on imaging of the image capturing object 301, and it is possible to irradiate the image capturing object 301 using only the light reflected by the semi-transparent mirror 502 of the surface-emitting surface 501a. In other words, only selected diffused light that is not affected by other diffused light is irradiated onto the image capturing object 301, making it possible to improve the uniformity of the irradiation intensity at the relative positions of the surface-emitting surface 501a and the image capturing object 301.

[0081] The disclosure made by the present inventors has been specifically described above based on embodiments and modified examples, but it goes without saying that the present disclosure is not limited to the above embodiments and modified examples, and various modifications are possible.

[0082] In the embodiment, in order to improve the uniformity of the illumination intensity at the relative positions of image capture object 301 and surface light-emitting surfaces 122a and 123a, illumination devices 122 and 123 are used, which are oblique illumination devices equipped with light path control plates 122b and 123b, respectively, that illuminate image capture object 301 from two diagonal directions above image capture object 301. However, for example, if there is only one image capture object 301 in the imaging area, there is also a method of uniforming the illumination intensity for image capture object 301 without using light path control plates 122b and 123b of the embodiment. It is also possible to divide surface light-emitting surfaces 122a and 123a of illumination device 122 and illumination device 123 into areas (not shown), and perform lighting control by control unit 200 on only the areas near image capture objects 301a and 301b, respectively, so that image capture object 301 can be illuminated.

[0083] With this method, the light-emitting position can be adjusted according to the position of the image capture object 301. In other words, the divided areas of each of the surface-emitting surfaces 122a and 123a and the image capture object 301 are set, for example, linearly. With this setting, the arrangement is symmetrical with respect to the image capture object 301, so that diffused light is emitted from the divided illuminated areas only on both ends of the image capture object 301. As a result, the illumination intensity at the relative positions is uniform, and the appearance shape and brightness of the image are consistent. Furthermore, since there is no influence of diffused light from areas other than the illuminated areas, the diffused light diffusing from the surface-emitting surfaces 122a and 123a can be efficiently and intensively irradiated onto the image capture object 301. In other words, the image capture device, the control unit, and the inspection device can perform clearer image capture, recording of the captured image, and appearance inspection (surface inspection and position inspection) based on the recorded image. Furthermore, since optical path control plates 122b, 123b, 401b used in the embodiment and the first modified example, and light blocking plate 503 used in the second modified example are not used, this leads to reduced costs associated with the device and improved maintenance efficiency associated with device operation.

[0084] Furthermore, in the embodiments and variant examples, examples of lighting devices and inspection devices in a die bonder 1, which is a semiconductor manufacturing device, have been described, but it goes without saying that these lighting devices and inspection devices can be used independently without being incorporated into the semiconductor manufacturing device.

[0085] In the embodiment, an example has been described in which paste is applied to the substrate S using the preform section 90, but the adhesive for adhering the die D to the substrate S may be a film-like adhesive material called a die attach film (DAF) that is attached between the wafer W and the dicing tape DT instead of the paste applied by the syringe 92.

[0086] In addition, in the embodiment, an intermediate stage section 30 is provided between the pickup section 20 and the bonding section 40, and the die D picked up from the pickup section 20 by the pickup head 21 is placed on the intermediate stage 31, and the die D is picked up again from the intermediate stage 31 by the bond head 41 and bonded to the transported substrate S. However, it is also possible to bond the die D picked up by the pickup section 20 to the substrate S using the bond head 41.

[0087] Furthermore, in the embodiment, die surface inspection recognition is performed after die position recognition, but die position recognition may be performed after die surface inspection recognition.

[0088] Furthermore, although the embodiment includes one pickup head 21 and one bond head 41, there may be two or more of each. Furthermore, although the embodiment includes an intermediate stage 31, the intermediate stage 31 may be omitted.

[0089] In addition, although bonding is performed with the front surface of the die D facing up in the embodiment, after picking up the die D, the die D may be turned over and bonded with the back surface of the die D facing up. This device is called a flip-chip bonder.

[0090] In the embodiment, a die bonder has been described as an example, but the present invention can also be applied to semiconductor manufacturing equipment that places a picked-up die on a tray.

[0091] Furthermore, although the embodiment has been described with reference to a semiconductor manufacturing device, the present invention can also be applied to a mounting device that mounts electronic components on a printed circuit board. [Explanation of symbols]

[0092] 122, 123... Lighting equipment 122a, 123a... Surface emitting surface 122b, 123b... Optical path control film (optical path control plate) 122e, 123e...LED (light source)

Claims

1. a plurality of light sources each having a surface emitting surface; a light path control plate provided on the surface light emitting surface of each of the plurality of light sources to control an optical path of the irradiated light from the surface light emitting surface, An illumination device that emits the irradiation light controlled by the light path control plate.

2. 2. The lighting device of claim 1, the light path control plate is provided on the surface light emitting surface, The illumination device is an oblique illumination device in which the illumination light controlled by the light path control plate is emitted from opposite directions.

3. 2. The lighting device of claim 1, a semi-transparent mirror provided inside the tube onto which the irradiation light is irradiated; the light path control plate is provided on the surface light emitting surface, The illumination device is a coaxial illumination device in which the irradiation light controlled by the light path control plate is reflected by the semi-transparent mirror.

4. 2. The lighting device of claim 1, a semi-transparent mirror provided inside the tube onto which the irradiation light is irradiated; the optical path control plate is a light blocking plate provided between the surface light emitting surface and an image capturing object, The illumination device is a coaxial illumination device in which the irradiated light that is not irradiated onto the light shielding plate is reflected by the semi-transparent mirror.

5. 2. The lighting device of claim 1, The light path control plate is a member that changes the directivity of the light emitted from the light source.

6. The lighting device according to claim 2 or 3, The light path control plate has at least one louver structure selected from the group consisting of a stripe shape, a honeycomb shape, a cylindrical shape, and a polygonal shape, which gives directionality to the irradiated light.

7. The lighting device of claim 1; an imaging device that captures an image of an object to be imaged; A semiconductor manufacturing device comprising:

8. 8. The semiconductor manufacturing apparatus according to claim 7, The optical path control plate is a member that changes the directivity of the irradiated light from the light source.

9. 8. The semiconductor manufacturing apparatus according to claim 7, a plurality of the imaging objects are provided along a first direction; The surface light emitting surface of the oblique illuminator of the illumination device extends along the first direction, and the illumination light is irradiated onto the plurality of imaging targets.

10. 8. The semiconductor manufacturing apparatus according to claim 7, The semiconductor manufacturing apparatus, wherein the optical path control plate has at least one louver structure selected from the group consisting of a stripe shape, a honeycomb shape, a cylindrical shape, and a polygonal shape, which gives directionality to the irradiated light.

11. 8. The semiconductor manufacturing apparatus according to claim 7, The semiconductor manufacturing device, wherein the object to be imaged is the substrate, the die, or a paste applied to the substrate.

12. The lighting device of claim 1; an imaging device that captures an image of an object to be imaged; An inspection device for a semiconductor device comprising:

13. The lighting device of claim 1; An imaging device that captures an image of an object to be imaged. a step of irradiating the image capture target with the irradiation light controlled by the light path control plate; inspecting the object to be imaged based on the image obtained by the imaging device; A method for manufacturing a semiconductor device comprising:

14. The lighting device of claim 1; An inspection method for a semiconductor device including an imaging device that images an imaging target, a step of irradiating the image capture target with the irradiation light controlled by the light path control plate; inspecting the object to be imaged based on the image obtained by the imaging device; A semiconductor device inspection method comprising:

Images