Substrate processing apparatus

Abstract

To provide a substrate processing apparatus capable of reducing the consumption of a processing liquid.SOLUTION: A substrate processing device 100 includes a processing block PB1 and a transfer block TB. The processing block PB1 includes an upper substrate holding portion 2A, a plurality of processing cup portions 6, a moving mechanism 220A, and an elevating mechanism 210A. The upper substrate holding part 2A holds the substrate W horizontally. The plurality of processing cup portions 6 are arranged in an intersecting direction PB1 that intersects a direction D2 in which the substrate W moves between the transport block TB and the processing block D1. The moving mechanism 220A moves the upper substrate holding part D1 in the crossing direction 2A. The lift mechanism 210A moves the upper substrate holding part 2A up and down. The plurality of processing cup portions 6 include a first processing cup portion 61. The first processing cup portion 61 holds the processing liquid in contact with the substrate W located inside the first processing cup portion 61.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus. [Background technology]

[0002] Known substrate processing apparatuses for processing substrates include batch-type apparatuses that process multiple substrates at once, and single-wafer-type apparatuses that process substrates one by one. Batch-type substrate processing apparatuses process multiple substrates at once by immersing the substrates in a processing liquid. Single-wafer-type substrate processing apparatuses process substrates by holding the substrates horizontally and rotating them, and supplying a processing liquid to the rotating substrates (see, for example, Patent Document 1). Generally, single-wafer-type substrate processing apparatuses can be made smaller than batch-type substrate processing apparatuses, and therefore can consume less processing liquid. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2020-126886 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in single-wafer processing apparatuses, since the processing liquid is continuously supplied to the substrates, the consumption of the processing liquid cannot be reduced significantly when long-term processing is required. Therefore, there is room for further improvement in single-wafer processing apparatuses.

[0005] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a substrate processing apparatus capable of reducing the consumption of processing liquid. [Means for solving the problem]

[0006] According to one aspect of the present invention, a substrate processing apparatus includes a processing block and a transfer block. The processing block processes a substrate. The transfer block is disposed adjacent to the processing block. The transfer block includes a transfer device. The transfer device transfers the substrate between the transfer block and the processing block. The processing block includes an upper substrate holding part, multiple processing cup parts, a movement mechanism, and a lifting mechanism. The upper substrate holding part holds the substrate horizontally. The multiple processing cup parts are aligned in an intersecting direction intersecting the direction in which the substrate moves between the transfer block and the processing block. The movement mechanism moves the upper substrate holding part in the intersecting direction. The lifting mechanism lifts and lowers at least one of the upper substrate holding part and the corresponding processing cup part so that the position of the substrate held by the upper substrate holding part changes from one of the upper positions of the respective processing cup parts to a position inside the corresponding processing cup part. The multiple processing cup parts include a first processing cup part. The first processing cup holds a processing liquid that is in contact with the substrate located inside the first processing cup to process the substrate.

[0007] In one embodiment, the plurality of processing cups include a plurality of first processing cups, each of which has a support portion for supporting the substrate, and the upper substrate holder transfers the different substrates between the support portions of the first processing cups.

[0008] In one embodiment, the substrate processing apparatus further includes a drainage unit. The processing liquid includes a chemical liquid. The substrate is processed with the chemical liquid in the first processing cup. The drainage unit drains the chemical liquid from the first processing cup. The upper substrate holding unit has an upper nozzle unit that ejects a rinse liquid toward the substrate. The upper nozzle unit ejects the rinse liquid toward the substrate located inside the first processing cup from which the chemical liquid has been ejected by the drainage unit.

[0009] In one embodiment, the upper substrate holding unit includes an upper holding unit and an upper rotating unit. The upper holding unit holds the substrate horizontally. The upper rotating unit rotates the substrate integrally with the upper holding unit. After the discharge of the rinse liquid stops, the upper rotating unit rotates the substrate positioned inside the first processing cup unit to dry the substrate.

[0010] In one embodiment, the upper nozzle portion ejects gas toward the substrate when drying the substrate.

[0011] In one embodiment, the processing cup further includes a second processing cup. The second processing cup receives rinse liquid discharged from the substrate. The lifting mechanism changes the position of the processed substrate, which is the substrate processed in the first processing cup, from a position inside the first processing cup to a position above the first processing cup. The moving mechanism moves the upper substrate holding part, which holds the processed substrate, to an opposing position facing the second processing cup. The lifting mechanism changes the position of the processed substrate from a position above the second processing cup to a position inside the second processing cup.

[0012] In one embodiment, the upper substrate holder has an upper nozzle that discharges the rinse liquid toward the processed substrate located inside the second processing cup.

[0013] In one embodiment, the upper substrate holding unit includes an upper holding unit and an upper rotating unit. The upper holding unit holds the substrate horizontally. The upper rotating unit rotates the substrate integrally with the upper holding unit. After the discharge of the rinse liquid stops, the upper rotating unit rotates the processed substrate located inside the second processing cup unit to dry the processed substrate.

[0014] In one embodiment, the upper nozzle portion ejects gas toward the processed substrate when drying the processed substrate.

[0015] In one embodiment, the plurality of processing cups include a plurality of the first processing cups and one of the second processing cups. The processing liquid includes a chemical liquid. The substrate is processed in each of the first processing cups with a different type of chemical liquid. The movement mechanism moves the upper substrate holder according to a processing procedure that indicates a procedure for processing the substrate.

[0016] In one embodiment, each of the first processing cup parts includes a support part for supporting the substrate.

[0017] In one embodiment, the plurality of processing cups includes a plurality of the first processing cups and a plurality of the second processing cups. The processing liquid includes a chemical liquid. The substrate is processed in each of the first processing cups with a different type of chemical liquid. The plurality of first processing cups and the plurality of second processing cups are arranged according to a processing sequence that indicates a procedure for processing the substrate.

[0018] In one embodiment, each of the first processing cups has a support portion for supporting the substrate, and the second processing cup sandwiched between the first processing cups has a support portion for supporting the substrate.

[0019] In one embodiment, the processing sequence includes a final rinse process and a drying process for drying the substrate. The rinse process refers to a process for washing the chemical solution off the substrate processed in the first processing cup. The first processing cups include a third processing cup in which the process just before the final rinse process is performed. The second processing cups include a fourth processing cup in which the final rinse process and the drying process are performed. The upper substrate holding unit includes a first upper substrate holding unit and a second upper substrate holding unit. The moving mechanism includes a first moving mechanism and a second moving mechanism. The first moving mechanism moves the first upper substrate holding unit between the processing cups other than the fourth processing cup. The second moving mechanism moves the second upper substrate holding unit between the third processing cup and the fourth processing cup.

[0020] In one embodiment, the substrate processing apparatus further includes a control unit. The upper substrate holding unit includes an upper holding unit and an upper rotation unit. The upper holding unit holds the substrate. The upper rotation unit rotates the substrate integrally with the upper holding unit. The control unit controls the rotation of the substrate by the upper rotation unit. The movement mechanism moves the upper substrate holding unit holding the processed substrate in the intersecting direction. When the lifting mechanism changes the position of the processed substrate from a position inside the first processing cup unit to a position above the first processing cup unit and the movement mechanism moves the upper substrate holding unit holding the processed substrate in the intersecting direction, the control unit controls the rotation speed of the processed substrate or stops the rotation of the processed substrate to maintain a puddle state in which a liquid film of the processing liquid is supported on the upper surface of the processed substrate.

[0021] In one embodiment, the substrate processing apparatus further includes a control unit. The upper substrate holding unit has an upper holding unit, an upper rotation unit, and an upper nozzle unit. The upper holding unit holds the substrate. The upper rotation unit rotates the substrate integrally with the upper holding unit. The upper nozzle unit ejects the rinse liquid. The control unit controls the rotation of the substrate by the upper rotation unit. The upper nozzle unit ejects the rinse liquid toward the processed substrate located inside the first processing cup unit to form a liquid film of the rinse liquid on the upper surface of the processed substrate. The movement mechanism moves the upper substrate holding unit holding the processed substrate in the intersecting direction. The control unit controls the rotation speed of the processed substrate or stops the rotation of the processed substrate to maintain a puddle state in which a liquid film of the rinse liquid is supported on the upper surface of the processed substrate when the lifting mechanism changes the position of the processed substrate from a position inside the first processing cup portion to a position above the first processing cup portion and the moving mechanism moves the upper substrate holding portion that holds the processed substrate in the intersecting direction.

[0022] In one embodiment, the substrate processing apparatus further includes a moving nozzle and a nozzle movement unit. The second processing cup unit has a lower holding unit, a lower rotation unit, and a guard unit. The lower holding unit holds the substrate horizontally. The lower rotation unit rotates the substrate integrally with the lower holding unit. The guard unit surrounds the substrate held in the lower holding unit and receives chemical liquid discharged from the substrate. The upper substrate holding unit transfers the substrate to the lower holding unit after being processed in the first processing cup unit. The moving nozzle ejects the chemical liquid toward the substrate held in the lower holding unit. The nozzle movement unit moves the moving nozzle horizontally. The moving nozzle ejects the chemical liquid while moving in the horizontal direction.

[0023] In one embodiment, the processing block includes a plurality of the upper substrate holding units, a plurality of the movement mechanisms, and a plurality of the lifting mechanisms, the plurality of movement mechanisms corresponding to the plurality of upper substrate holding units, and the plurality of lifting mechanisms corresponding to at least one of the plurality of upper substrate holding units and the plurality of processing cup units.

[0024] In one embodiment, the substrate processing apparatus further includes a lid member, the first processing cup having an upper surface opening through which the substrate passes, and the lid member covering the upper surface opening.

[0025] In one embodiment, the substrate processing apparatus further includes a cylindrical member. The upper substrate holding unit includes an upper base member and an upper gripping member. The upper gripping member is attached to the upper base member and grips the substrate horizontally. The first processing cup has an inner periphery. The inner periphery forms an upper opening through which the substrate passes. When the substrate is positioned inside the first processing cup, a side surface of the upper base member faces the inner periphery. The cylindrical member is positioned in the gap between the inner periphery and the upper base member when the substrate is positioned inside the first processing cup.

[0026] In one embodiment, the upper substrate holding section includes an upper base member and an upper gripping member. The upper gripping member is attached to the upper base member and grips the substrate horizontally. The first processing cup section includes an inner peripheral edge and an annular inner wall. The inner peripheral edge forms an upper opening through which the substrate passes. The inner wall is located below the inner peripheral edge. When the substrate is positioned inside the first processing cup section, the side surface of the upper base member covers the gap between the inner peripheral edge and the inner wall.

[0027] In one embodiment, the first processing cup includes an immersion tank that stores the processing liquid, and the substrate is immersed in the processing liquid in the immersion tank.

[0028] In one embodiment, the upper substrate holding unit has an upper holding unit and an upper rotating unit. The upper holding unit holds the substrate horizontally. The upper rotating unit rotates the substrate integrally with the upper holding unit. The immersion tank has a lower brush member that contacts the underside of the substrate. The upper rotating unit rotates the substrate immersed in the processing liquid and in contact with the lower brush member.

[0029] In one embodiment, the substrate processing apparatus further includes a brush processing unit. The brush processing unit brushes the upper surface of the substrate immersed in the processing liquid. The first processing cup unit has a lower substrate holding unit. The lower substrate holding unit holds the substrate horizontally inside the immersion tank. The upper substrate holding unit transfers the substrate to the lower substrate holding unit. The brush processing unit has an upper brush member and a brush rotation unit. The upper brush member contacts the upper surface of the substrate held by the lower substrate holding unit. The brush rotation unit rotates the upper brush member. The brush rotation unit rotates the upper brush member while the upper brush member is in contact with the upper surface of the substrate immersed in the processing liquid.

[0030] In one embodiment, the first processing cup unit has a lower substrate holding unit. The lower substrate holding unit holds the substrate horizontally inside the immersion tank. The upper substrate holding unit has an upper base member, an upper gripping member, an upper brush member, and an upper rotating unit. The upper gripping member is provided on the upper base member. The upper gripping member grips the substrate. The upper brush member is provided on the upper base member. The upper brush member contacts the upper surface of the substrate held by the lower substrate holding unit. The upper rotating unit rotates the upper brush member and the upper gripping member together with the upper base member. The upper substrate holding unit transfers the substrate from the upper gripping member to the lower substrate holding unit. The upper rotating unit rotates the upper brush member when it is in contact with the upper surface of the substrate immersed in the processing liquid.

[0031] In one embodiment, the substrate processing apparatus further includes an undiluted liquid supply unit, the processing liquid includes a chemical liquid, the immersion tank stores the chemical liquid, and the undiluted liquid supply unit supplies the undiluted chemical liquid to the immersion tank.

[0032] In one embodiment, the first processing cup includes a support portion and a ring-shaped member, the support portion supports the substrate, and the ring-shaped member holds a liquid film of the processing liquid in contact with an upper surface of the substrate supported by the support portion.

[0033] In one embodiment, the first processing cup includes a support portion, a lower base member, and a lower nozzle portion. The support portion supports the substrate. The lower base member faces the lower surface of the substrate supported by the support portion. The lower nozzle portion is provided on the lower base member. The lower nozzle portion ejects the processing liquid. The processing liquid ejected from the lower nozzle portion is held in the gap between the lower surface of the substrate and the lower base member and comes into contact with the lower surface of the substrate. [Effects of the Invention]

[0034] According to the substrate processing apparatus of the present invention, the consumption of processing liquid can be reduced. [Brief explanation of the drawings]

[0035] [Figure 1] 1 is a schematic plan view of a substrate processing apparatus according to a first embodiment. [Figure 2] 1 is a block diagram of a substrate processing apparatus according to a first embodiment. [Figure 3] 1 is a schematic view showing a configuration of a first processing block included in the substrate processing apparatus of Embodiment 1. FIG. [Figure 4] FIG. 2 is an enlarged cross-sectional view schematically showing the configuration of a moving unit, an upper substrate holding unit, and an immersion tank as viewed from the front side. [Figure 5] 1 is a diagram showing a part of the configuration of a substrate processing apparatus according to a first embodiment. [Figure 6] FIG. 3 is a diagram showing an example of an operation flow of the substrate processing apparatus according to the first embodiment. [Figure 7] 1(a) to 1(f) are diagrams schematically illustrating an example of the operation of the substrate processing apparatus according to the first embodiment. [Figure 8] FIG. 10 is a diagram showing the operation of the first processing block when processing one substrate. [Figure 9] FIG. 10 is a diagram showing the operation of the first processing block when processing one substrate. [Figure 10] FIG. 10 is a diagram showing the operation of the first processing block when processing one substrate. [Figure 11] FIG. 10 is a diagram showing the operation of the first processing block when processing one substrate. [Figure 12] FIG. 10 is a diagram showing the operation of the first processing block when processing one substrate. [Figure 13] FIG. 10 is a diagram showing the operation of the first processing block when processing one substrate. [Figure 14] FIG. 10 is a diagram showing the operation of the first processing block when processing one substrate. [Figure 15] FIG. 10 is a diagram showing the operation of the first processing block when processing one substrate. [Figure 16] FIG. 10 is a diagram showing the operation of the first processing block when processing one substrate. [Figure 17] FIG. 10 is a diagram showing the operation of the first processing block when processing one substrate. [Figure 18] FIG. 10 is a diagram showing the operation of the first processing block when processing one substrate. [Figure 19] FIG. 10 is a diagram showing the operation of the first processing block when processing one substrate. [Figure 20] FIG. 10 is a schematic plan view of a substrate processing apparatus according to a first modified example. [Figure 21] 10 is a schematic diagram showing a configuration of a first processing block included in a substrate processing apparatus according to a second modification. FIG. [Figure 22] FIG. 11 is a schematic plan view of a substrate processing apparatus according to a third modified example. [Figure 23] FIG. 10 is a schematic plan view of a substrate processing apparatus according to a second embodiment. [Figure 24]10 is a schematic view showing the configuration of a first processing block included in the substrate processing apparatus of Embodiment 2. FIG. [Figure 25] FIG. 10 is a schematic plan view of a substrate processing apparatus according to a third embodiment. [Figure 26] FIG. 10 is a schematic view showing the configuration of a first processing block included in the substrate processing apparatus of Embodiment 3. [Figure 27] FIG. 10 is a diagram showing a process of immersing a substrate in a first chemical liquid. [Figure 28] 10 is another schematic view showing the configuration of the first processing block included in the substrate processing apparatus of Embodiment 3. FIG. [Figure 29] 10 is a still another schematic view showing the configuration of the first processing block included in the substrate processing apparatus of Embodiment 3. FIG. [Figure 30] FIG. 10 is a diagram showing an example of the flow of operations of the substrate processing apparatus according to the third embodiment. [Figure 31] 10(a) to 10(d) are diagrams schematically illustrating an example of the operation of the substrate processing apparatus according to the third embodiment. [Figure 32] FIG. 10 is a diagram showing a process of lifting the substrate from the first chemical liquid. [Figure 33] FIG. 10 is a diagram showing a process of lifting the substrate from the first chemical liquid. [Figure 34] 10(a) to 10(f) are diagrams schematically illustrating an example of the operation of the substrate processing apparatus of Modification 4. FIG. [Figure 35] 10(a) to 10(f) are diagrams schematically illustrating an example of the operation of the substrate processing apparatus according to the fifth modification. [Figure 36] 13(a) to 13(d) are diagrams schematically illustrating an example of the operation of the substrate processing apparatus of the sixth modification. [Figure 37] FIG. 20 is a schematic plan view of a substrate processing apparatus according to a seventh modified example. [Figure 38] FIG. 20 is a schematic plan view of a substrate processing apparatus according to an eighth modification. [Figure 39] 13 is a cross-sectional view schematically showing the configuration of a first processing block included in a substrate processing apparatus according to a ninth modification. FIG. [Figure 40] FIG. 22 is a schematic plan view of a substrate processing apparatus according to a tenth modification. [Figure 41]FIG. 23 is a block diagram of a substrate processing apparatus according to a tenth modification. [Figure 42] 13 is a cross-sectional view schematically showing the configuration of a first processing block included in a substrate processing apparatus according to a tenth modification. FIG. [Figure 43] 13 is a cross-sectional view schematically showing the configuration of a first processing block included in a substrate processing apparatus according to an eleventh modification. FIG. [Figure 44] 13 is a cross-sectional view schematically showing the configuration of a first processing block included in a substrate processing apparatus according to a twelfth modification. FIG. [Figure 45] 23 is a cross-sectional view schematically showing the configuration of a first processing block included in a substrate processing apparatus according to a thirteenth modification. FIG. [Figure 46] FIG. 10 is a cross-sectional view schematically showing the configuration of a first processing block included in a substrate processing apparatus according to a fourth embodiment. [Figure 47] 10 is another cross-sectional view schematically showing the configuration of the first processing block included in the substrate processing apparatus of Embodiment 4. FIG. [Figure 48] 10 is yet another cross-sectional view schematically showing the configuration of the first processing block included in the substrate processing apparatus of Embodiment 4. FIG. [Figure 49] 10 is yet another cross-sectional view schematically showing the configuration of the first processing block included in the substrate processing apparatus of Embodiment 4. FIG. [Figure 50] FIG. 10 is a diagram illustrating another example of puddle processing. [Figure 51] FIG. 10 is a diagram illustrating another example of puddle processing. [Figure 52] FIG. 10 is a diagram illustrating another example of puddle processing. [Figure 53] FIG. 10 is a schematic plan view of a substrate processing apparatus according to a fifth embodiment. [Figure 54] FIG. 10 is a block diagram of a substrate processing apparatus according to a fifth embodiment. [Figure 55] 10(a) to 10(d) are diagrams schematically illustrating an example of the operation of the substrate processing apparatus according to the fifth embodiment. [Figure 56] FIG. 10 is a schematic view showing the configuration of a first processing block included in a substrate processing apparatus according to a fifth embodiment. [Figure 57] FIG. 13 is a schematic plan view of a substrate processing apparatus according to a sixth embodiment. [Figure 58] FIG. 13 is a block diagram of a substrate processing apparatus according to a sixth embodiment. [Figure 59] FIG. 13 is a schematic view showing the configuration of a first processing block included in the substrate processing apparatus of Embodiment 6. [Figure 60] FIG. 13 is a schematic view showing the configuration of a first processing block included in the substrate processing apparatus of Embodiment 7. [Figure 61] 13 is a schematic view showing the configuration of a first processing block included in the substrate processing apparatus of Embodiment 8. FIG. [Figure 62] 13 is a schematic view showing the configuration of a first processing block included in the substrate processing apparatus of Embodiment 9. FIG. [Figure 63] FIG. 22 is a schematic view showing the configuration of a first processing block included in the substrate processing apparatus of the tenth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0036] Hereinafter, embodiments of the substrate processing apparatus of the present invention will be described with reference to the drawings (FIGS. 1 to 63). However, the present invention is not limited to the following embodiments, and can be implemented in various forms without departing from the spirit of the present invention. Note that where explanations are redundant, they may be omitted as appropriate. Furthermore, in the drawings, the same or equivalent parts are designated by the same reference numerals, and explanations thereof will not be repeated.

[0037] The "substrate" to be processed in the substrate processing apparatus according to the present invention can be a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display, a glass substrate for a plasma display, a substrate for an FED (Field Emission Display), a substrate for an optical disk, a substrate for a magnetic disk, or a substrate for a magneto-optical disk. The following description of an embodiment of the present invention will be primarily focused on a case where a disk-shaped semiconductor wafer is the substrate to be processed. However, the substrate processing apparatus according to the present invention can be similarly applied to various substrates other than the semiconductor wafers described above. Furthermore, the shape of the substrate is not limited to a disk shape, and the substrate processing apparatus according to the present invention can be applied to substrates of various shapes.

[0038] In this specification, for ease of understanding, the front-rear direction, left-right direction, and up-down direction are defined. The front-rear direction and left-right direction are parallel to the horizontal direction, and the up-down direction is parallel to the vertical direction. In this embodiment, for example, the side where multiple load ports LP are arranged relative to the load-unload block IB is the front side, and the side where the transport block TB is arranged relative to the load-unload block IB is the rear side (see FIG. 1). Also, the side where the first processing block PB1 is arranged relative to the transport block TB is the right side, and the side where the second processing block PB2 is arranged relative to the transport block TB is the left side (see FIG. 1). Also, the side where the support arm 201A is arranged relative to the upper substrate holder 2A is the upper side, and the side where the support plate 11 is arranged relative to the immersion tank 61a is the lower side (see FIG. 3).

[0039] [Embodiment 1] First, a first embodiment of the present invention will be described with reference to Figures 1 to 22. Figure 1 is a schematic plan view of a substrate processing apparatus 100 of the first embodiment. Figure 2 is a block diagram of the substrate processing apparatus 100 of the first embodiment.

[0040] The substrate processing apparatus 100 is a single-wafer processing apparatus that processes substrates W one by one using a processing liquid. For example, the substrate processing apparatus 100 performs at least one of the following substrate processing on the substrates W: etching, surface treatment, property imparting, film formation, at least partial film removal, and cleaning. The processing liquid includes a chemical liquid and a rinse liquid.

[0041] The chemical solution includes, for example, dilute hydrofluoric acid (DHF), hydrofluoric acid (HF), hydrofluoric nitric acid (a mixture of hydrofluoric acid and nitric acid (HNO3)), buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), phosphoric acid (H3PO4), sulfuric acid, acetic acid, nitric acid, hydrochloric acid, ammonia water, hydrogen peroxide water, organic acids (e.g., citric acid, oxalic acid), organic alkalis (e.g., TMAH: tetramethylammonium hydroxide), sulfuric acid hydrogen peroxide water mixture (SPM), ammonia hydrogen peroxide water mixture (SC1), hydrochloric acid hydrogen peroxide water mixture (SC2), isopropyl alcohol (IPA), surfactants, or corrosion inhibitors.

[0042] The rinse liquid is water such as pure water. The pure water may be, for example, deionized water (DIW). More specifically, the rinse liquid may be ultrapure water. In this embodiment, the rinse liquid is DIW.

[0043] As shown in FIG. 1, the substrate processing apparatus 100 includes a plurality of load ports LP, a load / unload block IB, a transfer block TB, a first processing block PB1, a second processing block PB2, and a controller 101.

[0044] A cassette CA is placed on each load port LP. The cassette CA accommodates one or more stacked substrates W. The cassette CA may be, for example, a FOUP (Front Opening Unified Pod), a SMIF (Standard Mechanical Interface) pod, or an OC (Open Cassette).

[0045] The load ports LP are arranged adjacent to the front side of the loader / unloader block IB. Substrates W are loaded into the loader / unloader block IB from cassettes CA. Also, substrates W are unloaded from the loader / unloader block IB to the cassettes CA.

[0046] The transport block TB is disposed adjacent to the rear side of the load-in / load-out block IB. Substrates W are loaded into the transport block TB from the load-in / load-out block IB. The substrates W are unloaded from the transport block TB to the load-in / load-out block IB.

[0047] In this embodiment, the loading / unloading block IB has an indexer robot IR, and the transport block TB has a transport robot TR.

[0048] The indexer robot IR transports the substrate W between the cassette CA and the load / unload block IB. The indexer robot IR also transports the substrate W between the load / unload block IB and the transport block TB. Specifically, the indexer robot IR transports the substrate W between the cassette CA and the transport robot TR.

[0049] The transport robot TR transports the substrate W between the load / unload block IB and the transport block TB. The transport robot TR also transports the substrate W between the transport block TB and the first processing block PB1 and the second processing block PB2. Specifically, the transport robot TR transports the substrate W between the indexer robot IR and the first processing block PB1 and the second processing block PB2. The transport robot TR is an example of a "transport device."

[0050] In addition, a mounting table (path) on which the substrate W is temporarily placed may be provided between the indexer robot IR and the transport robot TR, and the device may be configured to indirectly transfer the substrate W between the indexer robot IR and the transport robot TR via the mounting table.

[0051] The first processing block PB1 is disposed adjacent to the right side of the transport block TB. The second processing block PB2 is disposed adjacent to the left side of the transport block TB. In other words, the transport block TB is disposed adjacent to the first processing block PB1 and the second processing block PB2. The transport block TB is also disposed between the first processing block PB1 and the second processing block PB2. The substrate processing apparatus 100 may include a plurality of first processing blocks PB1 stacked vertically and a plurality of second processing blocks PB2 stacked vertically.

[0052] The transport robot TR transports the substrate W received from the indexer robot IR into the first processing block PB1 or the second processing block PB2. The first processing block PB1 and the second processing block PB2 process the substrate W using a processing solution. The transport robot TR unloads the substrate W processed in the first processing block PB1 from the first processing block PB1 and hands it over to the indexer robot IR. Similarly, the transport robot TR unloads the substrate W processed in the second processing block PB2 from the second processing block PB2 and hands it over to the indexer robot IR.

[0053] The first processing block PB1 has a processing chamber 9, an upper substrate holding part 2A, and a plurality of substrate processing units PU. Each of the plurality of substrate processing units PU includes a processing cup part 6. The moving part 200A includes a support arm 201A. In the first embodiment, the first processing block PB1 further includes a mounting table 7 and a rail member 8. Similarly, the second processing block PB2 has a processing chamber 9, an upper substrate holding part 2A, a plurality of substrate processing units PU (processing cup parts 6), a moving part 200A (support arm 201A), a mounting table 7, and a rail member 8. The configuration of the second processing block PB2 is substantially the same as that of the first processing block PB1. Therefore, the following description will focus on the configuration of the first processing block PB1, and the description of the second processing block PB2 will be omitted as appropriate.

[0054] The processing chamber 9 has a substantially box-like shape. In the first embodiment, the processing chamber 9 accommodates the upper substrate holder 2A, the plurality of processing cups 6, the support arm 201A, the mounting table 7, and the rail member 8.

[0055] The processing chamber 9 has a sidewall 91. The sidewall 91 refers to the wall that constitutes the processing chamber 9 on the transfer block TB side. Specifically, the sidewall 91 of the first processing block PB1 is the left sidewall. The sidewall 91 of the second processing block PB2 is the right sidewall. The sidewall 91 has a loading / unloading opening 9a (see FIG. 8). The loading / unloading opening 9a is an opening formed in the sidewall 91. The transfer robot TR accesses the interior of the first processing block PB1 through the loading / unloading opening 9a of the first processing block PB1. Similarly, the transfer robot TR accesses the interior of the second processing block PB2 through the loading / unloading opening 9a of the second processing block PB2.

[0056] 1, the loading / unloading opening 9a (see FIG. 8) is provided at a position adjacent to the mounting table 7 in the left-right direction. The transport robot TR loads a substrate W into the first processing block PB1 through the loading / unloading opening 9a and places the substrate W on the mounting table 7.

[0057] The mounting table 7 supports the substrate W. The mounting table 7 may support the substrate W horizontally. Specifically, the mounting table 7 has a plurality of support portions 7a and a support base 7b. Each of the support portions 7a protrudes from the upper surface of the support base 7b. The support portions 7a may be cylindrical, for example. The transport robot TR places the substrate W on the plurality of support portions 7a. As a result, the substrate W is supported by the plurality of support portions 7a. Specifically, the plurality of support portions 7a are arranged on the same circumference and support the peripheral edge of the substrate W.

[0058] The substrate processing unit PU processes the substrate W in cooperation with the upper substrate holder 2A. The multiple processing cup parts 6 are arranged side by side in the first direction D1. In the first embodiment, the mounting table 7 and the multiple processing cup parts 6 are arranged side by side in the first direction D1. Note that, although the first processing block PB1 has three processing cup parts 6 (three substrate processing units PU) in the first embodiment, the number of processing cup parts 6 (substrate processing units PU) is not limited to three. The first processing block PB1 may have two or more processing cup parts 6 (substrate processing units PU). For example, the first processing block PB1 may have four or more processing cup parts 6 (substrate processing units PU).

[0059] The first direction D1 is a direction intersecting with the second direction D2 in which the substrate W moves between the transport block TB and the first processing block PB1. The second direction D2 includes the direction in which the substrate W moves from the transport block TB to the inside of the first processing block PB1 (the load direction) and the direction in which the substrate W moves from the first processing block PB1 to the inside of the transport block TB (the unload direction). The first direction D1 is an example of an "intersecting direction."

[0060] The first direction D1 includes a direction approaching the load / unload block IB and a direction away from the load / unload block IB. In other words, the first direction D1 includes a direction approaching the load port LP and a direction away from the load port LP. In the first embodiment, of the mounting table 7 and the multiple processing cup units 6, the mounting table 7 is disposed closest to the loading / unloading block IB. In other words, the mounting table 7 is disposed forward of the multiple processing cup units 6.

[0061] Specifically, the first direction D1 is parallel to the front-rear direction, and the second direction D2 is parallel to the left-right direction. Therefore, the first direction D1 is perpendicular to the second direction D2.

[0062] The upper substrate holding part 2A holds the substrate W horizontally. Specifically, the upper substrate holding part 2A has a plurality of upper chuck members 31. The plurality of upper chuck members 31 grip the substrate W. The substrate W is held horizontally by the plurality of upper chuck members 31 gripping the substrate W. Specifically, the plurality of upper chuck members 31 are arranged on the same circumference and grip the peripheral edge of the substrate W. The upper chuck members 31 are an example of an "upper gripping member."

[0063] The moving unit 200A moves the upper substrate holding unit 2A in a first direction D1. The support arm 201A supports the upper substrate holding unit 2A. The rail member 8 guides the lifting mechanism 210A (see FIG. 2) connected to the support arm 201A in the first direction D1 (front-rear direction). Therefore, the upper substrate holding unit 2A is freely movable in the first direction D1 (front-rear direction).

[0064] The upper substrate holding part 2A moves in a first direction D1 (front-rear direction) in the space above the mounting table 7 and the multiple processing cup parts 6. In the first embodiment, the upper substrate holding part 2A moves between a facing position group including a facing position facing the mounting table 7 and facing positions P1 (see FIG. 9) facing each of the multiple processing cup parts 6. The facing position facing the mounting table 7 refers to a position facing the mounting table 7 in the vertical direction. Specifically, the facing position facing the mounting table 7 is a position above the mounting table 7. Similarly, the facing position P1 facing the processing cup part 6 refers to a position facing the processing cup part 6 in the vertical direction. Specifically, the facing position P1 facing the processing cup part 6 is a position above the processing cup part 6. Hereinafter, the facing position facing the mounting table 7 may be referred to as the "facing position of the mounting table 7." Similarly, the facing position P1 facing the processing cup part 6 may be referred to as the "facing position of the processing cup part 6."

[0065] In this embodiment, the upper substrate holding part 2A is movable up and down. The upper substrate holding part 2A descends from a position facing the mounting table 7 to a transfer position P11 (see FIG. 8) to grip the substrate W supported on the mounting table 7. The upper substrate holding part 2A also descends from a position P1 facing one of the processing cups 6 (see FIG. 9) to move the substrate W to a position inside the corresponding processing cup 6. The transfer position P11 indicates a position in the vertical direction.

[0066] The multiple processing cup parts 6 include a first processing cup part 61. In embodiment 1, all of the processing cup parts 6 are first processing cup parts 61. The substrate W is processed inside the first processing cup part 61. In other words, substrate processing is performed inside the first processing cup part 61. More specifically, the first processing cup part 61 holds a processing liquid in contact with the substrate W located inside the first processing cup part 61 to process the substrate W.

[0067] The control device 101 controls the operation of each part of the substrate processing apparatus 100. For example, the control device 101 controls the load port LP, the indexer robot IR, the transport robot TR, the upper substrate holder 2A, and the moving part 200A. The control device 101 includes a control part 102 and a memory part 103.

[0068] The control unit 102 controls the operation of each unit of the substrate processing apparatus 100 based on various information stored in the storage unit 103. The control unit 102 has, for example, a processor. The processor of the control unit 102 includes a CPU (Central Processing Unit) or an MPU (Micro Processing Unit). Alternatively, the control unit 102 may have a general-purpose computing unit or a dedicated computing unit.

[0069] The memory unit 103 stores various information for controlling the operation of the substrate processing apparatus 100. For example, the memory unit 103 stores data and computer programs. The data includes various recipe data. The recipe data includes process recipes. The process recipes are data that define processing procedures. The processing procedures indicate procedures for processing the substrate W. The control unit 102 controls the operation of each part of the substrate processing apparatus 100 in accordance with the processing procedures. The processing of the substrate W includes chemical processing, rinsing processing, and drying processing. For example, when processing the substrate W using one type of chemical liquid, the chemical processing, rinsing processing, and drying processing are performed on one substrate W in this order.

[0070] The storage unit 103 includes a main storage device. The main storage device includes, for example, a semiconductor memory. The storage unit 103 may further include an auxiliary storage device. The auxiliary storage device includes, for example, at least one of a semiconductor memory and a hard disk drive. The storage unit 103 may also include removable media.

[0071] Next, the substrate processing apparatus 100 of the first embodiment will be described with reference to FIGS.

[0072] The moving part 200A is controlled by the control part 102 to move the upper substrate holding part 2A. In this embodiment, the moving part 200A has a moving mechanism 220A and an elevating mechanism 210A. The moving mechanism 220A and the elevating mechanism 210A are controlled by the control part 102.

[0073] The lifting mechanism 210A raises and lowers the upper substrate holding part 2A by raising and lowering the support arm 201A. For example, the lifting mechanism 210A raises and lowers the upper substrate holding part 2A between a position facing the mounting table 7 and a transfer position P11 (see FIG. 8) by raising and lowering the support arm 201A. The transfer position P11 is a position where the substrate W is transferred between the mounting table 7 and the upper substrate holding part 2A. The lifting mechanism 210A also lowers the support arm 201A to lower the upper substrate holding part 2A so that the position of the substrate W held by the upper substrate holding part 2A changes from one of the upper positions above the multiple processing cups 6 to a position inside the corresponding processing cup 6.

[0074] The moving mechanism 220A moves the support arm 201A in a first direction D1 (front-rear direction) by moving the lifting mechanism 210A along the rail member 8. As a result, the upper substrate holding part 2A moves in the first direction D1 (front-rear direction). In the first embodiment, the moving mechanism 220A moves the upper substrate holding part 2A between a facing position group including a facing position of the mounting table 7 and facing positions P1 (see FIG. 9) of each of the plurality of processing cup parts 6.

[0075] Next, the substrate processing apparatus 100 of embodiment 1 will be described with reference to Figures 1 to 4. Figure 3 is a schematic diagram showing the configuration of a first processing block PB1 included in the substrate processing apparatus 100 of embodiment 1. Figure 3 is a schematic cross-sectional view of the moving part 200A and the immersion tank 61a as viewed from the front. Figure 4 is an enlarged view showing a schematic cross-sectional view of the moving part 200A and the immersion tank 61a as viewed from the front.

[0076] 3, in the first embodiment, the first processing block PB1 includes, in addition to the upper substrate holder 2A, mounting table 7, rail members 8, processing chamber 9, multiple first processing cups 61, and moving section 200A described with reference to FIGS. 1 and 2, a support plate 11, a first liquid supply section 12, a second liquid supply section 13, a first drainage section 14, a second drainage section 15, and an exhaust section 17. Specifically, each of the substrate processing units PU described with reference to FIG. 1 includes the first processing cups 61, the second liquid supply section 13, the first drainage section 14, the second drainage section 15, and the exhaust section 17. In other words, the first processing block PB1 includes the second liquid supply section 13, the first drainage section 14, the second drainage section 15, and the exhaust section 17 for each first processing cup 61.

[0077] In addition to the upper substrate holding portion 2A, multiple processing cup portions 6, the mounting table 7, and the rail member 8, the processing chamber 9 further accommodates a moving portion 200A, a support plate 11, part of the first liquid supply portion 12, part of the second liquid supply portion 13, part of the first drainage portion 14, part of the second drainage portion 15, and part of the exhaust portion 17.

[0078] Support plate 11 supports a plurality of processing cup portions 6 (see FIG. 1). In embodiment 1, support plate 11 also supports mounting table 7 (see FIG. 1). Specifically, each processing cup portion 6 is supported in a horizontal position by support plate 11. Mounting table 7 is similarly supported in a horizontal position by support plate 11. Support plate 11 may be fixed to a side wall of processing chamber 9, for example, or may be supported by a support column. Support plate 11 divides the interior of processing chamber 9 into an upper space and a lower space.

[0079] The upper substrate holding part 2A is located below the support arm 201 A. The upper substrate holding part 2A has an upper holding part 3, an upper rotating part 4, and an upper nozzle part 5A.

[0080] The upper holding unit 3 horizontally holds the substrate W. Specifically, the upper holding unit 3 further includes an upper spin base 32 in addition to the plurality of upper chuck members 31 described with reference to Fig. 1. The upper spin base 32 is an example of an "upper base member."

[0081] The multiple upper chuck members 31 described with reference to FIG. 1 are provided on the upper spin base 32. Specifically, the upper spin base 32 is substantially disk-shaped and supports the multiple upper chuck members 31 in a horizontal position. The multiple upper chuck members 31 are arranged on the periphery of the upper spin base 32 and protrude downward from the upper spin base 32. The multiple upper chuck members 31 grip the substrate W below the upper spin base 32. Therefore, the substrate W is held horizontally by the multiple upper chuck members 31 below the upper spin base 32. The operation of the multiple upper chuck members 31 is controlled by the control unit 102.

[0082] The upper rotation unit 4 rotates the substrate W integrally with the upper holding unit 3. The operation of the upper rotation unit 4 is controlled by the control unit 102. The upper rotation unit 4 has, for example, an upper shaft 41 and an upper motor body 42.

[0083] The lower end of the upper shaft 41 is coupled to the upper spin base 32. The upper shaft 41 protrudes upward from the upper spin base 32. The upper end of the upper shaft 41 is rotatably supported by the support arm 201A. A portion of the upper shaft 41 may be housed inside the support arm 201A.

[0084] The upper motor body 42 rotates the upper shaft 41. As a result, the upper spin base 32 rotates. The operation of the upper motor body 42 is controlled by the control unit 102. The upper motor body 42 is, for example, an electric motor. The upper motor body 42 may be housed inside the support arm 201A.

[0085] The upper nozzle unit 5A ejects the processing liquid downward. Specifically, the upper nozzle unit 5A has a tip. The upper nozzle unit 5A ejects the processing liquid from the tip surface of the upper nozzle unit 5A. In this embodiment, the tip of the upper nozzle unit 5A protrudes from the lower surface of the upper spin base 32. Note that the tip surface of the upper nozzle unit 5A may be flush with the lower surface of the upper spin base 32. Alternatively, the tip of the upper nozzle unit 5A may be located inside the upper spin base 32.

[0086] In the first embodiment, the first processing cup 61 includes an immersion tank 61a. The immersion tank 61a stores a processing liquid. Specifically, the immersion tank 61a is a container-like structure with an open top, and the processing liquid is stored in the internal space of the immersion tank 61a. The substrate W is immersed in a horizontal position in the processing liquid stored in the immersion tank 61a. More specifically, the immersion tank 61a stores at least a chemical liquid and a rinse liquid. By immersing the substrate W in the chemical liquid in the immersion tank 61a, the upper surface Wa and lower surface Wb of the substrate W are processed by the chemical liquid.

[0087] The immersion tank 61a may have an outer shape, for example, a substantially circular shape in plan view. The top surface of the immersion tank 61a has an opening. The immersion tank 61a may have a cylindrical shape with a bottom. Specifically, the immersion tank 61a has a bottom wall portion 611, a side wall portion 612, and an inner wall portion 613.

[0088] The bottom wall 611 may be, for example, substantially disk-shaped. The side wall 612 protrudes upward from the bottom wall 611. The side wall 612 is annular. The side wall 612 may be, for example, annular. The side wall 612 may be connected to the peripheral edge of the bottom wall 611. The upper end of the side wall 612 forms the top opening of the immersion tank 61a. In other words, the upper end of the side wall 612 constitutes the edge (inner peripheral edge) of the top opening of the immersion tank 61a. The substrate W passes through the top opening of the immersion tank 61a and moves inside the immersion tank 61a. The substrate W also passes through the top opening of the immersion tank 61a and moves outside the immersion tank 61a.

[0089] The inner wall portion 613 is provided inside the side wall portion 612 and protrudes upward from the bottom wall portion 611. The inner wall portion 613 is provided at a position away from the side wall portion 612. The upper end of the inner wall portion 613 is located lower than the upper end of the side wall portion 612. The inner wall portion 613 is annular. The inner wall portion 613 may have, for example, a circular ring shape. The processing liquid is stored inside the inner wall portion 613. Therefore, the substrate W is immersed in the processing liquid inside the inner wall portion 613. The processing liquid overflowing from the inner wall portion 613 flows out between the inner wall portion 613 and the side wall portion 612.

[0090] The immersion tank 61b has a lower nozzle section 5B. The lower nozzle section 5B ejects the processing liquid upward. Specifically, the lower nozzle section 5B has a tip. The lower nozzle section 5B ejects the processing liquid from the tip surface of the lower nozzle section 5B. In this embodiment, the tip of the lower nozzle section 5B protrudes from the bottom wall section 611 of the immersion tank 61a. The tip surface of the lower nozzle section 5B may be flush with the upper surface of the bottom wall section 611. Alternatively, the tip of the lower nozzle section 5B may be located inside the bottom wall section 611.

[0091] The first liquid supply unit 12 supplies a processing liquid to the upper nozzle unit 5A. In the first embodiment, the first liquid supply unit 12 selectively supplies one of a chemical liquid and a rinse liquid (DIW in this embodiment) to the upper nozzle unit 5A. Specifically, the first liquid supply unit 12 has a chemical liquid piping unit 121, a rinse liquid piping unit 122, a common piping unit 123, a first opening / closing valve 125, and a second opening / closing valve 126.

[0092] The chemical liquid piping section 121, the rinse liquid piping section 122, and the common piping section 123 are tubular members through which fluids flow. A first on-off valve 125 is provided in the chemical liquid piping section 121. A second on-off valve 126 is provided in the rinse liquid piping section 122. The first on-off valve 125 and the second on-off valve 126 can be opened and closed freely. The opening and closing operations of the first on-off valve 125 and the second on-off valve 126 are controlled by the control section 102.

[0093] The chemical liquid is supplied to the upstream end of the chemical liquid piping section 121. The downstream end of the chemical liquid piping section 121 is connected to the common piping section 123. The first on-off valve 125 opens and closes the flow path in the chemical liquid piping section 121. When the first on-off valve 125 opens, the chemical liquid flows through the chemical liquid piping section 121 to the common piping section 123. As a result, the chemical liquid is supplied to the common piping section 123. When the first on-off valve 125 closes, the flow of the chemical liquid through the chemical liquid piping section 121 stops. As a result, the supply of the chemical liquid to the common piping section 123 stops.

[0094] The rinse liquid is supplied to the upstream end of the rinse liquid piping section 122. The downstream end of the rinse liquid piping section 122 is connected to the common piping section 123. The second on-off valve 126 opens and closes the flow path in the rinse liquid piping section 122. When the second on-off valve 126 opens, the rinse liquid flows through the rinse liquid piping section 122 to the common piping section 123. As a result, the rinse liquid is supplied to the common piping section 123. When the second on-off valve 126 closes, the flow of the rinse liquid through the rinse liquid piping section 122 stops. As a result, the supply of the rinse liquid to the common piping section 123 stops.

[0095] The downstream end of the common pipe 123 is connected to the upper nozzle 5A. The control unit 102 controls the first on-off valve 125 and the second on-off valve 126 to selectively allow one of the chemical liquid and the rinse liquid to flow into the common pipe 123. Therefore, the common pipe 123 selectively supplies one of the chemical liquid and the rinse liquid to the upper nozzle 5A. When the chemical liquid is supplied to the upper nozzle 5A via the common pipe 123, the chemical liquid is ejected from the upper nozzle 5A. Similarly, when the rinse liquid is supplied to the upper nozzle 5A via the common pipe 123, the rinse liquid is ejected from the upper nozzle 5A.

[0096] The second liquid supply unit 13 supplies a processing liquid to the lower nozzle unit 5B. In the first embodiment, the second liquid supply unit 13 selectively supplies one of a chemical liquid and a rinse liquid (DIW in this embodiment) to the lower nozzle unit 5B. Specifically, the second liquid supply unit 13 has a chemical liquid piping unit 131, a rinse liquid piping unit 132, a common piping unit 133, a first opening / closing valve 135, and a second opening / closing valve 136. The configuration of the second liquid supply unit 13 is similar to that of the first liquid supply unit 12, and therefore a detailed description thereof will be omitted.

[0097] The first drainage unit 14 discharges the processing liquid stored in the immersion tank 61a to the outside of the immersion tank 61a. In this embodiment, the first drainage unit 14 discharges the processing liquid stored inside the inner wall unit 613 to the outside of the first processing block PB1.

[0098] Specifically, the first drainage section 14 includes a common pipe section 141 , a drainage pipe section 142 , a recovery pipe section 143 , a first opening / closing valve 145 , and a second opening / closing valve 146 .

[0099] The common piping section 141, the drainage piping section 142, and the recovery piping section 143 are tubular members through which fluid flows. A first opening / closing valve 145 is provided in the drainage piping section 142. A second opening / closing valve 146 is provided in the recovery piping section 143. The first opening / closing valve 145 and the second opening / closing valve 146 can be opened and closed freely. The opening and closing operations of the first opening / closing valve 145 and the second opening / closing valve 146 are controlled by the control section 102.

[0100] The upstream end of the common piping section 141 is connected to the bottom wall 611 of the immersion tank 61a inside the inner wall 613 and communicates with the internal space of the immersion tank 61a. The processing liquid stored inside the inner wall 613 flows into the upstream end of the common piping section 141. The upstream end of the drainage piping section 142 is connected to the downstream end of the common piping section 141. The downstream end of the drainage piping section 142 is connected to a drain tank (not shown). The drain tank is installed outside the first processing block PB1.

[0101] The first on-off valve 145 opens and closes the flow path in the drainage piping section 142. When the first on-off valve 145 opens, the processing liquid stored inside the inner wall section 613 is discharged to the drainage piping section 142 via the common piping section 141. The processing liquid that flows from the immersion tank 61a through the common piping section 141 into the drainage piping section 142 is collected in a drain tank (not shown) via the drainage piping section 142. The drain tank stores the processing liquid discharged from the immersion tank 61a. The processing liquid discharged from the immersion tank 61a may be guided by the drainage piping section 142 to a waste liquid facility in a factory where the substrate processing apparatus 100 is installed.

[0102] The upstream end of the recovery piping section 143 is connected to the downstream end of the common piping section 141. The downstream end of the recovery piping section 143 is connected to the chemical tank 18, which will be described later with reference to FIG. 5. The second on-off valve 146 opens and closes the flow path in the recovery piping section 143. When the second on-off valve 146 opens, the processing liquid stored inside the inner wall section 613 is discharged to the recovery piping section 143 via the common piping section 141. The processing liquid that flows into the recovery piping section 143 from the immersion tank 61a via the common piping section 141 is recovered in the chemical tank 18 via the recovery piping section 143.

[0103] When discharging the processing liquid stored inside the inner wall portion 613 from the immersion tank 61a, the control unit 102 opens one of the first opening / closing valve 145 and the second opening / closing valve 146 and closes the other. When storing the processing liquid inside the inner wall portion 613, the control unit 102 closes both the first opening / closing valve 145 and the second opening / closing valve 146.

[0104] The second drainage unit 15 drains the processing liquid collected between the inner wall 613 and the side wall 612 of the immersion tank 61a from the immersion tank 61a. Specifically, the second drainage unit 15 has a drainage pipe 151 and an on-off valve 152. The drainage pipe 151 is a tubular member through which a fluid flows. The on-off valve 152 is provided in the drainage pipe 151. The on-off valve 152 can be opened and closed freely. The opening and closing operation of the on-off valve 152 is controlled by the control unit 102.

[0105] The upstream end of the drainage pipe 151 is connected to the bottom wall 611 of the immersion tank 61a between the inner wall 613 and the side wall 612, and communicates with the inner space of the immersion tank 61a. The processing liquid collected between the inner wall 613 and the side wall 612 flows into the drainage pipe 151. The downstream end of the drainage pipe 151 is connected to a drain tank (not shown). Therefore, the processing liquid collected between the inner wall 613 and the side wall 612 of the immersion tank 61a is discharged to the outside of the first processing block PB1.

[0106] The on-off valve 152 opens and closes the flow path in the drainage pipe section 151. When the on-off valve 152 opens, the processing liquid collected between the inner wall section 613 and the side wall section 612 is discharged through the drainage pipe section 151 to a drain tank (not shown).

[0107] The exhaust unit 17 exhausts gas from the space inside the immersion tank 61a to the outside of the first processing block PB1. Specifically, the exhaust unit 17 has an exhaust piping unit 171. The exhaust piping unit 171 is a tubular member through which a fluid flows.

[0108] The upstream end of the exhaust piping section 171 is connected to the side wall 612 of the immersion tank 61a and communicates with the space inside the immersion tank 61a. The downstream end of the exhaust piping section 171 may be connected to, for example, an exhaust device (not shown) provided in a factory in which the substrate processing apparatus 100 is installed. The exhaust device constantly sucks gas from the exhaust piping section 171 from the downstream end of the exhaust piping section 171. As a result, gas is sucked from the space inside the immersion tank 61a to the upstream end of the exhaust piping section 171.

[0109] The gas drawn to the upstream end of the exhaust piping section 171 flows through the exhaust piping section 171 and is sucked into an exhaust device (not shown). As a result, the gas inside the immersion tank 61a is exhausted to the outside of the first processing block PB1.

[0110] As shown in FIGS. 3 and 4, in this embodiment, the rail members 8 include a first rail member 8a, a second rail member 8b, a third rail member 8c, a fourth rail member 8d, and a fifth rail member 8e.

[0111] The first rail member 8a and the second rail member 8b are fixed to the upper surface of the support plate 11. The third rail member 8c and the fourth rail member 8d are fixed to the lower surface of the support plate 11. The fifth rail member 8e is fixed to the floor surface of the processing chamber 9 (see FIG. 3).

[0112] The moving unit 200A includes a support arm 201A, a lifting mechanism 210A, and a moving mechanism 220A. The lifting mechanism 210A includes a housing 211, an upper plate 212, a lower plate 213, a screw shaft 214, a nut 215, an electric motor 216, a drive belt 217, and an elastic member 218.

[0113] The housing 211 is disposed below the support plate 11. The third rail member 8c and the fourth rail member 8d engage with an upper wall portion of the housing 211. The fifth rail member 8e engages with a lower wall portion of the housing 211. Therefore, the housing 211 is guided in the first direction D1 (see FIG. 1) by the third rail member 8c, the fourth rail member 8d, and the fifth rail member 8e.

[0114] The lower plate 213 is disposed on the upper surface of the support plate 11. The lower plate 213 is engaged with the first rail member 8a and the second rail member 8b. Therefore, the lower plate 213 is guided in the first direction D1 (see FIG. 1) by the first rail member 8a and the second rail member 8b.

[0115] A through-hole through which the threaded shaft 214 is inserted is formed in the upper wall of the housing 211. The threaded shaft 214 extends in the vertical direction and protrudes from the inside of the housing 211 upward.

[0116] An elongated hole 11a extending in a first direction D1 (see FIG. 1) is formed in the support plate 11. The screw shaft 214 protruding from the housing 211 is inserted into the elongated hole 11a of the support plate 11.

[0117] The lower plate 213 is a plate-like member having a through-hole in the center. In other words, the lower plate 213 is annular in plan view. The lower plate 213 is disposed at a position where the through-hole of the lower plate 213 overlaps with the elongated hole 11a of the support plate 11. The screw shaft 214 protruding from the elongated hole 11a of the support plate 11 is inserted into the through-hole of the lower plate 213. The first rail member 8a is disposed to the right of the elongated hole 11a of the support plate 11. The second rail member 8b is disposed to the left of the elongated hole 11a of the support plate 11.

[0118] The upper plate 212 is fixed to the lower surface of the support arm 201A. Like the lower plate 213, the upper plate 212 is a plate-like member having a through-hole in the center. In other words, the upper plate 212 is annular in plan view. The upper plate 212 is disposed at a position where the through-hole of the upper plate 212 overlaps with the through-hole of the lower plate 213 in plan view. The upper end of the screw shaft 214 protruding from the through-hole of the lower plate 213 is inserted into the through-hole of the upper plate 212 and fixed to the support arm 201A.

[0119] The screw shaft 214 is covered by the telescopic member 218 between the support plate 11 and the support arm 201A. Specifically, the upper end of the telescopic member 218 is fixed to the upper plate 212. The lower end of the telescopic member 218 is fixed to the lower plate 213. The screw shaft 214 protruding from the support plate 11 is housed inside the telescopic member 218. As a result, the screw shaft 214 protruding from the support plate 11 is covered by the telescopic member 218. The telescopic member 218 is freely expandable and contractible in the vertical direction. The telescopic member 218 is, for example, a bellows.

[0120] The screw shaft 214 and the nut 215 constitute a ball screw mechanism. More specifically, a screw groove is formed on the outer circumferential surface of the screw shaft 214. The nut 215 is housed in the housing 211. The nut 215 has a plurality of balls that contact the screw groove of the screw shaft 214. When the nut 215 rotates around the central axis of the screw shaft 214, the screw shaft 214 moves up and down. As a result, the support arm 201A moves up and down, and the upper substrate holding part 2A moves up and down.

[0121] The electric motor 216 is housed in the housing 211. The electric motor 216 generates a driving force that rotates the nut 215. In other words, the electric motor 216 generates a driving force that moves the screw shaft 214 in the up and down direction. Specifically, the electric motor 216 has a motor body 216a that can rotate forward and backward, a motor shaft 216b, and a motor pulley 216c. The motor body 216a may be fixed to, for example, an inner wall surface of the housing 211. The motor body 216a rotates the motor shaft 216b. The motor pulley 216c is fixed to, for example, the tip of the motor shaft 216b.

[0122] The drive belt 217 is housed in the housing 211. The drive belt 217 is wound around the outer circumferential surfaces of the motor pulley 216c and the nut 215. The drive belt 217 transmits the rotational force of the motor pulley 216c to the nut 215. The rotation of the motor pulley 216c causes the nut 215 to rotate.

[0123] The movement mechanism 220A moves the lifting mechanism 210A in a first direction D1 (see FIG. 1). When the movement mechanism 220A moves the lifting mechanism 210A in the first direction D1 (see FIG. 1), the upper substrate holding part 2A moves in the first direction D1 (see FIG. 1). The movement mechanism 220A may, for example, have a ball screw mechanism and an electric motor that drives the ball screw mechanism, similar to the lifting mechanism 210A.

[0124] Next, the upper substrate holding unit 2A will be described with reference to Fig. 4. As shown in Fig. 4, the multiple upper chuck members 31 are arranged so that the center of the substrate W faces the center of the upper spin base 32. Therefore, when the upper holding unit 3 (the multiple upper chuck members 31) holds the substrate W, the center of the substrate W faces the center of the upper spin base 32.

[0125] The upper rotating unit 4 rotates the substrate W and the upper holding unit 3 together around a first rotation axis AX1 that extends in the vertical direction. More specifically, the first rotation axis AX1 passes through the center of the upper spin base 32. Therefore, the upper spin base 32 rotates around the center of the upper spin base 32. As a result, the substrate W rotates around the center of the substrate W.

[0126] The tip surface of the upper nozzle unit 5A faces the center of the substrate W held by the upper holding unit 3. Therefore, the processing liquid is discharged from the upper nozzle unit 5A toward the center of the substrate W. Specifically, the upper substrate holding unit 2A has a through hole 41a. The through hole 41a passes through the upper shaft 41 and the upper spin base 32 in the vertical direction along the first rotation axis AX1. The upper nozzle unit 5A is housed in the through hole 41a.

[0127] The upper substrate holding unit 2A further includes an upper chuck driving mechanism 50 that rotates the plurality of upper chuck members 31. For example, the upper chuck driving mechanism 50 includes a driving magnet 51, a driven magnet 52, and a lifting plate 53.

[0128] The drive magnet 51 is disposed inside the support arm 201A. The drive magnet 51 may be annular in plan view. In this case, the drive magnet 51 is disposed so as to surround the first rotation axis AX1. Alternatively, the upper chuck drive mechanism 50 may have a plurality of drive magnets 51. In this case, the plurality of drive magnets 51 are disposed around one circumference so as to surround the first rotation axis AX1.

[0129] The driven magnet 52 and the lifting plate 53 are disposed inside the upper spin base 32. The lifting plate 53 is annular in plan view. The lifting plate 53 is disposed so as to surround the periphery of the first axis of rotation AX1. The lifting plate 53 is biased upward by a biasing member (not shown).

[0130] The driven magnet 52 is fixed to the lift plate 53. The driven magnet 52 is disposed directly below the drive magnet 51. The driven magnet 52 may be annular in plan view. In this case, the driven magnet 52 is disposed so as to surround the first rotation axis AX1. Alternatively, the upper chuck drive mechanism 50 may have a plurality of driven magnets 52. In this case, the plurality of driven magnets 52 are disposed around one circumference so as to surround the first rotation axis AX1.

[0131] The drive magnet 51 moves up and down by an elevator mechanism (not shown). The elevator mechanism that raises and lowers the drive magnet 51 is controlled by the control unit 102. As the drive magnet 51 rises and lowers, the driven magnet 52 and the elevator plate 53 rise and lower.

[0132] The lifting plate 53 is provided with a cam or link mechanism that rotates each upper chuck member 31 between a holding position and a non-holding position. Therefore, when the lifting plate 53 moves up and down, each upper chuck member 31 rotates between the holding position and the non-holding position. When each of the plurality of upper chuck members 31 rotates from the non-holding position to the holding position, the substrate W is gripped by the plurality of upper chuck members 31. When each of the plurality of upper chuck members 31 rotates from the holding position to the non-holding position, the grip of the substrate W by the plurality of upper chuck members 31 is released.

[0133] Next, the immersion tank 61a will be described with reference to Fig. 4. As shown in Fig. 4, the side wall portion 612 includes an upper wall portion 612a and a lower wall portion 612b. The lower wall portion 612b extends upward from the bottom wall portion 611. The upper wall portion 612a is inclined inwardly from the upper end of the lower wall portion 612b.

[0134] In this embodiment, the upper wall portion 612a (inclined portion) extends to a position facing the inner wall portion 613 in the vertical direction. The upper end of the upper wall portion 612a (the upper end of the side wall portion 612) is located higher than the upper end of the inner wall portion 613. The upper end of the upper wall portion 612a (the upper end of the side wall portion 612) faces the inner wall portion 613 in the vertical direction. Therefore, a gap (space) is formed between the upper end of the upper wall portion 612a (the upper end of the side wall portion 612) and the upper end of the inner wall portion 613.

[0135] The immersion tank 61a further has a plurality of supports 614. The supports 614 protrude from the bottom wall 611 of the immersion tank 61a. Specifically, the supports 614 are arranged inside the inner wall 613. The supports 614 may be cylindrical, for example. The supports 614 support the substrate W. Specifically, the supports 614 are arranged on the same circumference and support the peripheral edge of the substrate W. The supports 614 support the substrate W horizontally.

[0136] The upper end of each support portion 614 is located lower than the upper end of the inner wall portion 613. In other words, the height of each support portion 614 from the bottom wall portion 611 is lower than the height of the inner wall portion 613 from the bottom wall portion 611. The substrate W supported by the multiple support portions 614 is immersed in the processing liquid stored inside the inner wall portion 613.

[0137] The upper substrate holding part 2A (upper holding part 3) transfers the substrate W between the plurality of supports 614. Specifically, the upper substrate holding part 2A (upper holding part 3) places the substrate W on the plurality of supports 614. As a result, the substrate W is supported by the plurality of supports 614. Furthermore, the upper substrate holding part 2A (upper holding part 3) grips the peripheral edge of the substrate W supported by the plurality of supports 614 with the plurality of upper chuck members 31. As a result, the substrate W is held by the upper substrate holding part 2A (upper holding part 3).

[0138] Next, the substrate processing apparatus 100 of embodiment 1 will be described with reference to Fig. 5. Fig. 5 is a diagram showing a part of the configuration of the substrate processing apparatus 100 of embodiment 1. As shown in Fig. 5, the substrate processing apparatus 100 further includes a chemical liquid tank 18, a circulation pipe 181, a circulation pump 182, a circulation heater 183, and a circulation filter 184.

[0139] The chemical liquid is stored in the chemical liquid tank 18. The circulation pipe 181 is a tubular member through which a fluid flows. One end and the other end of the circulation pipe 181 are connected to the chemical liquid tank 18. The circulation pump 182 is provided in the circulation pipe 181. The circulation pump 182 sends the chemical liquid so that the chemical liquid flows inside the circulation pipe 181 from one end to the other end of the circulation pipe 181. As a result, the chemical liquid circulates through the circulation pipe 181 via the chemical liquid tank 18. The circulation pump 182 is controlled by the control unit 102.

[0140] One end of a recovery pipe 143 is further connected to the chemical tank 18. The other end of the recovery pipe 143 is connected to the bottom wall 611 of the immersion tank 61a via the common pipe 141. Therefore, when the second on-off valve 146 is opened, the chemical discharged from the immersion tank 61a is recovered into the chemical tank 18 via the common pipe 141 and the recovery pipe 143.

[0141] The circulation heater 183 is provided in the circulation pipe 181. The circulation heater 183 heats the chemical liquid circulating through the circulation pipe 181 to a target temperature. The circulation filter 184 is provided in the circulation pipe 181. The circulation filter 184 removes foreign matter from the chemical liquid circulating through the circulation pipe 181.

[0142] One end of chemical liquid pipe section 121 is connected to circulation pipe 181. The other end of chemical liquid pipe section 121 is connected to upper nozzle section 5A via common pipe section 123. When first on-off valve 125 is opened, the chemical liquid that has flowed from circulation pipe 181 into chemical liquid pipe section 121 flows through chemical liquid pipe section 121 and common pipe section 123 toward upper nozzle section 5A. As a result, the chemical liquid is discharged from upper nozzle section 5A.

[0143] Similarly, one end of chemical liquid piping section 131 is connected to circulation piping 181. The other end of chemical liquid piping section 131 is connected to lower nozzle section 5B via common piping section 133. When first on-off valve 135 is opened, the chemical liquid that has flowed from circulation piping 181 into chemical liquid piping section 131 flows through chemical liquid piping section 131 and common piping section 133 toward lower nozzle section 5B. As a result, the chemical liquid is ejected from lower nozzle section 5B.

[0144] As described above with reference to FIGS. 1 to 5 , according to the first embodiment, the chemical liquid can be supplied to the upper nozzle unit 5A and the lower nozzle unit 5B from the same circulation pipe 181. Specifically, the substrate processing apparatus 100 of the first embodiment processes a single substrate W by immersing the substrate W in a horizontal position in the chemical liquid. Therefore, it is not necessary to continuously supply the chemical liquid to the substrate W. Therefore, the flow rate of the chemical liquid supplied to the upper nozzle unit 5A and the lower nozzle unit 5B (the amount of the chemical liquid flowing per unit time) can be reduced compared to a configuration in which the chemical liquid is continuously supplied to the substrate W. As a result, the chemical liquid can be supplied to the upper nozzle unit 5A and the lower nozzle unit 5B from the same circulation pipe 181.

[0145] Furthermore, according to the first embodiment, the chemical liquid can be supplied to the upper nozzle portion 5A and the lower nozzle portion 5B from the same circulation pipe 181, which allows the device to be made smaller.

[0146] Next, an example of the operation of the substrate processing apparatus 100 of embodiment 1 will be described with reference to FIGS. 1 to 6 and 7(a) to 7(f). FIG. 6 is a diagram showing an example of the flow of the operation of the substrate processing apparatus 100 of embodiment 1. Specifically, FIG. 6 shows an example of the flow of the process executed by the control unit 102 when the first processing block PB1 processes three substrates W (the first substrate W1, the second substrate W2, and the third substrate W3). FIGS. 7(a) to 7(f) are diagrams schematically showing an example of the operation of the substrate processing apparatus 100 of embodiment 1. Specifically, FIGS. 7(a) to 7(f) show an example of the operation of the first processing block PB1 when the first processing block PB1 processes three substrates W (the first substrate W1, the second substrate W2, and the third substrate W3). In the following, the three immersion tanks 61a included in the first processing block PB1 may be referred to as the "first immersion tank 61a1," "second immersion tank 61a2," and "third immersion tank 61a3," in order from the front (in order from closest to the mounting table 7).

[0147] The process shown in Fig. 6 includes steps S1 to S18. The process shown in Fig. 6 begins when the transport robot TR places the first substrate W1 on the mounting table 7. As shown in Figs. 6 and 7(a), the control unit 102 controls the transport robot TR to place the first substrate W1 on the mounting table 7, and then controls the movement unit 200A (elevation mechanism 210A and movement mechanism 220A) and the upper substrate holding unit 2A (upper chuck drive mechanism 50) to grip the first substrate W1 placed on the mounting table 7 with the multiple upper chuck members 31. As a result, the first substrate W1 is held horizontally by the upper substrate holding unit 2A (upper holding unit 3) (step S1).

[0148] As shown in FIGS. 6 and 7(b), when the first substrate W1 is held by the upper substrate holding unit 2A (upper holding unit 3), the control unit 102 controls the moving unit 200A (elevating mechanism 210A and moving mechanism 220A) to immerse the first substrate W1, which is held horizontally by the upper substrate holding unit 2A (upper holding unit 3), in the chemical solution stored in the first immersion tank 61a1 (step S2). As a result, the upper surface Wa and lower surface Wb of the first substrate W1 are treated with the chemical solution. Specifically, the moving unit 200A moves the first substrate W1, which is held by the upper substrate holding unit 2A (upper holding unit 3), to a position where it contacts the upper surfaces of the plurality of supports 614 provided in the first immersion tank 61a1.

[0149] When the first substrate W1 held by the upper substrate holding part 2A (upper holding part 3) is immersed in the chemical solution in the first immersion tank 61a1, the control part 102 controls the upper substrate holding part 2A (upper chuck driving mechanism 50) to release the grip of the first substrate W1 by the multiple upper chuck members 31. As a result, the first substrate W1 is supported by the supports 614 of the first immersion tank 61a1, and the first substrate W1 is left in the first immersion tank 61a1 (step S3). The first substrate W1 left in the first immersion tank 61a1 is immersed in the chemical solution.

[0150] The control unit 102 controls the transport robot TR to place the second substrate W2 on the mounting table 7 while the first substrate W1 is moving from the mounting table 7 to the inside of the first immersion tank 61a1, or after the first substrate W1 has moved to the inside of the first immersion tank 61a1.

[0151] When the transfer robot TR places the second substrate W2 on the mounting table 7, the control unit 102 causes the upper substrate holding part 2A (upper holding part 3) to hold the second substrate W2 (step S4), similar to step S1.

[0152] When the second substrate W2 is held by the upper substrate holding part 2A (upper holding part 3), the control part 102 immerses the second substrate W2 in the chemical solution stored in the second immersion tank 61a2 (step S5), similar to step S2. As a result, the upper surface Wa and the lower surface Wb of the second substrate W2 are treated with the chemical solution.

[0153] When the second substrate W2 held by the upper substrate holding part 2A (upper holding part 3) is immersed in the chemical solution in the second immersion tank 61a2, the control part 102 causes the second substrate W2 to remain in the second immersion tank 61a2 (step S6), as in step S3.

[0154] The control unit 102 controls the transport robot TR to place the third substrate W3 on the mounting table 7 while the second substrate W2 is moving from the mounting table 7 to the inside of the second immersion tank 61a2, or after the second substrate W2 has moved to the inside of the second immersion tank 61a2.

[0155] When the transport robot TR places the third substrate W3 on the mounting table 7, the control unit 102 causes the upper substrate holding unit 2A (upper holding unit 3) to hold the third substrate W3 (step S7), similar to steps S1 and S4.

[0156] When the third substrate W3 is held by the upper substrate holding part 2A (upper holding part 3), the control part 102 immerses the third substrate W3 in the chemical solution stored in the third immersion tank 61a3 (step S8), similar to steps S2 and S5, so that the upper surface Wa and lower surface Wb of the third substrate W3 are treated with the chemical solution.

[0157] When the third substrate W3 held by the upper substrate holding part 2A (upper holding part 3) is immersed in the chemical solution in the third immersion tank 61a3, the control part 102 causes the third substrate W3 to remain in the third immersion tank 61a3 (step S9), similar to steps S3 and S6. As a result, as shown in Fig. 7(c), the first substrate W1, the second substrate W2, and the third substrate W3 are immersed in the chemical solutions in the first immersion tank 61a1, the second immersion tank 61a2, and the third immersion tank 61a3, respectively, and chemical solution treatments are performed on the first substrate W1, the second substrate W2, and the third substrate W3 in parallel.

[0158] 6 and 7(d), when the time that has elapsed since the first substrate W1 was immersed in the chemical solution reaches or exceeds a predetermined time (predetermined chemical solution processing time), the control unit 102 controls the moving unit 200A (lifting mechanism 210A and moving mechanism 220A) and the upper substrate holding unit 2A (upper chuck driving mechanism 50) to cause the first substrate W1, which is supported by the plurality of supports 614 of the first immersion tank 61a1, to be gripped by the plurality of upper chuck members 31. Then, the control unit 102 controls the first processing block PB1 so that a rinse process is performed on the first substrate W1 inside the first immersion tank 61a1 (step S10).

[0159] The rinsing process refers to a process of rinsing the chemical liquid from the upper surface Wa and the lower surface Wb of the substrate W. In the first embodiment, the control unit 102 causes the upper nozzle unit 5A and the lower nozzle unit 5B to eject a rinsing liquid toward the upper surface Wa and the lower surface Wb of the substrate W, thereby rinsing the chemical liquid from the upper surface Wa and the lower surface Wb of the substrate W. In detail, the control unit 102 controls the moving unit 200A (lifting mechanism 210A), the upper substrate holding unit 2A (upper motor body 42), the first liquid supply unit 12 (second on-off valve 126), the second liquid supply unit 13 (second on-off valve 136), and the first drainage unit 14 (first on-off valve 145 or second on-off valve 146) to perform the rinsing process.

[0160] When the time that has elapsed since the start of the rinsing process of the first substrate W1 reaches or exceeds a predetermined time (predetermined rinsing process time), the control unit 102 controls the first processing block PB1 so that a drying process of the first substrate W1 is performed inside the first immersion tank 61a1 (step S11).

[0161] The drying process refers to a process for drying the substrate W. In the first embodiment, the control unit 102 controls the upper rotation unit 4 (upper motor main body 42) to rotate the substrate W at high speed, thereby drying the substrate W.

[0162] 6 and 7(e), when the time that has elapsed since the start of the drying process of the first substrate W1 reaches or exceeds a predetermined time (predetermined drying process time), the control unit 102 controls the upper rotation unit 4 (upper motor main body 42) to stop the rotation of the first substrate W1. Then, the control unit 102 controls the movement unit 200A (lifting mechanism 210A and movement mechanism 220A) and the upper substrate holding unit 2A (upper chuck drive mechanism 50) to place the first substrate W1 on the mounting table 7. Once the first substrate W1 has been placed on the mounting table 7, the control unit 102 controls the transfer robot TR to unload the first substrate W1 from the first processing block PB1 (step S12).

[0163] As shown in Figures 6 and 7(e), when the time that has elapsed since the second substrate W2 was immersed in the chemical solution reaches or exceeds a predetermined time (predetermined chemical solution processing time), the control unit 102 controls the first processing block PB1 so that a rinse process is performed on the second substrate W2 inside the second immersion tank 61a2, as in step S10 (step S13).

[0164] When the time that has elapsed since the start of the rinsing process of the second substrate W2 reaches or exceeds a predetermined time (predetermined rinsing process time), the control unit 102 controls the first processing block PB1 so that a drying process of the second substrate W2 is performed inside the second immersion tank 61a2, as in step S11 (step S14).

[0165] When the time that has elapsed since the start of the drying process of the second substrate W2 reaches or exceeds a predetermined time (predetermined drying process time), the control unit 102 causes the second substrate W2 to be unloaded from the first processing block PB1 (step S15), similar to step S12.

[0166] When the time that has elapsed since the third substrate W3 was immersed in the chemical solution reaches or exceeds a predetermined time (predetermined chemical solution processing time), the control unit 102 controls the first processing block PB1 so that a rinse process is performed on the third substrate W3 inside the third immersion tank 61a3, similar to steps S10 and S13 (step S16).

[0167] When the time that has elapsed since the start of the rinsing process of the third substrate W3 reaches or exceeds a predetermined time (predetermined rinsing process time), the control unit 102 controls the first processing block PB1 so that a drying process of the third substrate W3 is performed inside the third immersion tank 61a3, similar to steps S11 and S14 (step S17).

[0168] When the time that has elapsed since the start of the drying process of the third substrate W3 reaches or exceeds a predetermined time (predetermined drying process time), the control unit 102 causes the third substrate W3 to be unloaded from the first processing block PB1 (step S18), similar to steps S12 and S15, thereby completing the operation shown in FIG.

[0169] 1 to 6 and 7(a) to 7(f), according to the first embodiment, the first processing block PB1 has a plurality of immersion tanks 61a, which allows chemical processing of a plurality of substrates W in parallel.

[0170] Next, the operation of the substrate processing apparatus 100 of embodiment 1 will be described with reference to Figures 1 to 19. Figures 8 to 19 are views showing the operation of the first processing block PB1 when processing one substrate W. Note that Figure 8 schematically shows a cross section of the moving part 200A as viewed from the front. Also, Figures 9 to 19 schematically show cross sections of the moving part 200A and the immersion tank 61a as viewed from the front.

[0171] 8 shows the upper chuck members 31 gripping the substrate W placed on the mounting table 7. As shown in FIG. 8, when the substrate W is placed on the mounting table 7, the control unit 102 controls the moving mechanism 220A to move the upper substrate holding part 2A to a position facing the mounting table 7, and then controls the lifting mechanism 210A to lower the upper substrate holding part 2A to the delivery position P11. The control unit 102 then controls the upper chuck drive mechanism 50 to grip the substrate W with the plurality of upper chuck members 31. Note that when the substrate W placed on the mounting table 7 is held by the upper substrate holding part 2A, the first opening / closing valve 125 and the second opening / closing valve 126 of the first liquid supply unit 12 are in a closed state.

[0172] The configuration of the first processing block PB1 will now be described with reference to Fig. 8. As shown in Fig. 8, a sidewall 91 of the first processing block PB1 has an inlet / outlet port 9a. The first processing block PB1 also has a shutter 92 and a shutter drive mechanism 93.

[0173] The loading / unloading port 9a is an opening formed in a sidewall 91 of the first processing block PB1. The substrate W is loaded from the outside to the inside of the first processing block PB1 through the loading / unloading port 9a. The substrate W is also unloaded from the inside to the outside of the first processing block PB1 through the loading / unloading port 9a.

[0174] The shutter 92 is a plate-shaped member that opens and closes the loading / unloading opening 9a. The shutter drive mechanism 93 is controlled by the control unit 102 to move the shutter 92 between a closed position and an open position. The closed position indicates a position where the shutter 92 covers the loading / unloading opening 9a and closes the loading / unloading opening 9a. The open position indicates a position where the shutter 92 opens the loading / unloading opening 9a.

[0175] After the substrate W is placed on the mounting table 7 and the hand (not shown) of the transport robot TR exits the first processing block PB1, the control unit 102 controls the shutter drive mechanism 93 to move the shutter 92 from the open position to the closed position, thereby closing the loading / unloading opening 9a.

[0176] Fig. 9 shows the upper substrate holding part 2A that has moved to position P1 opposite one of the immersion tanks 61a. As shown in Fig. 9, the control part 102 causes the plurality of upper chuck members 31 to grip the substrate W placed on the mounting table 7, and then controls the lifting mechanism 210A and the moving mechanism 220A to move the upper substrate holding part 2A to position P1 opposite one of the immersion tanks 61a. When the upper substrate holding part 2A is located at position P1 opposite the immersion tank 61a, the substrate W held by the upper substrate holding part 2A is located above the immersion tank 61a. At this time, the first opening / closing valve 125 and the second opening / closing valve 126 of the first liquid supply section 12 and the first opening / closing valve 135 and the second opening / closing valve 136 of the second liquid supply section 13 are in a closed state, and one of the first opening / closing valve 145 and the second opening / closing valve 146 of the first liquid drainage section 14 and the opening / closing valve 152 of the second liquid drainage section 15 are in an open state.

[0177] 10 shows the upper substrate holder 2A lowered from the opposing position P1 in the immersion tank 61a to the first processing position P2. Note that the first processing position P2 indicates a position in the up-down direction.

[0178] 10, the control unit 102 moves the upper substrate holding unit 2A to a position P1 facing the immersion tank 61a, and then controls the lifting mechanism 210A to lower the upper substrate holding unit 2A from the position P1 facing the immersion tank 61a to a first processing position P2. When the upper substrate holding unit 2A lowers to the first processing position P2, the substrate W lowers from a position above the immersion tank 61a to a position inside the immersion tank 61a. More specifically, when the upper substrate holding unit 2A is located at the first processing position P2, the substrate W is located inside the inner wall 613. Furthermore, when the upper substrate holding unit 2A is located at the first processing position P2, the substrate W is located above the multiple supports 614.

[0179] 11 shows the first processing block PB1 when the chemical liquid is stored in the immersion tank 61a. As shown in FIG. 11, after the upper substrate holder 2A is moved to the first processing position P2, the control unit 102 switches the first opening / closing valve 125 of the first liquid supply unit 12 and the first opening / closing valve 135 of the second liquid supply unit 13 from a closed state to an open state, and closes the first opening / closing valve 145 and the second opening / closing valve 146 of the first drainage unit 14. The control unit 102 also controls the upper rotation unit 4 (upper motor body 42) to rotate the substrate W. As a result, the chemical liquid is ejected from the upper nozzle unit 5A toward the center of the upper surface Wa of the substrate W, and the chemical liquid is ejected from the lower nozzle unit 5B toward the center of the lower surface Wb of the substrate W. The chemical liquid flowing down from the upper surface Wa and the lower surface Wb of the substrate W is stored inside the inner wall 613.

[0180] Furthermore, by discharging the chemical liquid from the upper nozzle unit 5A and the lower nozzle unit 5B toward the rotating substrate W, the chemical liquid quickly spreads over the entire upper surface Wa and lower surface Wb of the substrate W. As a result, for example, it is possible to prevent the processing time with the chemical liquid from differing between the center and the outer periphery of the substrate W. Furthermore, by discharging the chemical liquid from the upper nozzle unit 5A and the lower nozzle unit 5B, it is possible to prevent the processing time with the chemical liquid from differing between the upper surface Wa and lower surface Wb of the substrate W.

[0181] FIG. 12 shows the substrate W immersed in the chemical solution stored in the immersion tank 61a. Specifically, the substrate W is immersed in the chemical solution stored inside the inner wall portion 613. Specifically, as shown in FIG. 12, when the liquid level of the chemical solution rises to a position above the upper surface Wa of the substrate W, the control unit 102 switches the first opening / closing valve 125 of the first liquid supply unit 12 and the first opening / closing valve 135 of the second liquid supply unit 13 from the open state to the closed state, thereby stopping the discharge of the chemical solution from the upper nozzle unit 5A and the lower nozzle unit 5B. As a result, the substrate W is immersed in the chemical solution inside the immersion tank 61a. For example, the control unit 102 may stop the discharge of the chemical solution when a predetermined time has elapsed since the upper nozzle unit 5A and the lower nozzle unit 5B started to discharge the chemical solution.

[0182] When the control unit 102 stops the discharge of the chemical solution, it controls the upper rotation unit 4 (upper motor main body 42) to stop the rotation of the substrate W. Then, the control unit 102 controls the lifting mechanism 210A to lower the upper substrate holding unit 2A from the first processing position P2 to the second processing position P3. The second processing position P3 indicates a position in the up-down direction. The second processing position P3 is a position where the substrate W comes into contact with the upper surfaces of the multiple supports 614.

[0183] The timing to stop the discharge of the chemical liquid is not particularly limited as long as it is the timing when the liquid level of the chemical liquid rises to a position above the upper surface Wa of the substrate W. For example, the discharge of the chemical liquid may be stopped after the chemical liquid starts to overflow the inner wall portion 613. Furthermore, the timing to stop the rotation of the substrate W is not particularly limited as long as it is before the upper substrate holding portion 2A reaches the second processing position P3 (before the substrate W comes into contact with the upper surfaces of the multiple supports 614).

[0184] Fig. 13 shows the substrate W left in the immersion tank 61a. As shown in Fig. 13, the control unit 102 moves the upper substrate holding unit 2A from the first processing position P2 to the second processing position P3, and then controls the upper chuck drive mechanism 50 to release the grip of the substrate W by the multiple upper chuck members 31. After releasing the grip of the substrate W by the multiple upper chuck members 31, the control unit 102 controls the lifting mechanism 210A to lift the upper substrate holding unit 2A from the second processing position P3 to the opposing position P1 in the immersion tank 61a.

[0185] Fig. 14 shows the first processing block PB1 before the discharge of the chemical solution starts. As shown in Fig. 14, before the discharge of the chemical solution starts, the control unit 102 controls the moving unit 200A (elevating mechanism 210A and moving mechanism 220A) to move the upper substrate holding unit 2A to the second processing position P3. Then, the control unit 102 controls the upper chuck driving mechanism 50 to cause the plurality of upper chuck members 31 to grip the substrate W supported by the plurality of supports 614.

[0186] Fig. 15 shows the first processing block PB1 while the chemical solution is being discharged. As shown in Fig. 15, after the control unit 102 causes the multiple upper chuck members 31 to grip the substrate W, it controls the lifting mechanism 210A to raise the upper substrate holding unit 2A from the second processing position P3 to the first processing position P2. Then, the control unit 102 switches one of the first opening / closing valve 145 and the second opening / closing valve 146 of the first drainage unit 14 from a closed state to an open state. As a result, the chemical solution is discharged from the immersion tank 61a.

[0187] Furthermore, while the chemical liquid is being discharged, the control unit 102 controls the upper rotation unit 4 (upper motor main body 42) to rotate the substrate W, and switches the first opening / closing valve 125 of the first liquid supply unit 12 and the first opening / closing valve 135 of the second liquid supply unit 13 from a closed state to an open state. As a result, while the chemical liquid is being discharged, the chemical liquid is discharged from the upper nozzle unit 5A and the lower nozzle unit 5B toward the upper surface Wa and the lower surface Wb of the rotating substrate W, so that the chemical liquid spreads over the upper surface Wa and the lower surface Wb of the substrate W. This prevents the substrate W from drying, thereby preventing the pattern from collapsing and the generation of particles. Note that the total flow rate of the chemical liquid discharged from the upper nozzle unit 5A and the lower nozzle unit 5B is less than the flow rate of the chemical liquid discharged through the first drainage unit 14.

[0188] 16 is a diagram showing the first step of the rinse process. As shown in Fig. 16, when a predetermined time has elapsed since the start of discharge of the chemical liquid, the control unit 102 switches the first on-off valve 125 of the first liquid supply unit 12 and the first on-off valve 135 of the second liquid supply unit 13 from an open state to a closed state, and switches the second on-off valve 126 of the first liquid supply unit 12 and the second on-off valve 136 of the second liquid supply unit 13 from a closed state to an open state. As a result, the rinse liquid is discharged from the upper nozzle unit 5A and the lower nozzle unit 5B toward the upper surface Wa and the lower surface Wb of the rotating substrate W, so that the rinse liquid spreads over the upper surface Wa and the lower surface Wb of the substrate W, and the chemical liquid adhering to the upper surface Wa and the lower surface Wb of the substrate W is washed away from the substrate W by the rinse liquid.

[0189] Fig. 17 is a diagram showing the second step of the rinse process. As shown in Fig. 17, when a predetermined time has elapsed since the start of discharge of the rinse liquid, the control unit 102 closes the first opening / closing valve 145 and the second opening / closing valve 146 of the first drainage unit 14. As a result, the rinse liquid is stored inside the inner wall portion 613, and the substrate W is immersed in the rinse liquid. The control unit 102 continues to rotate the substrate W from the first step to the second step of the rinse process.

[0190] In this embodiment, even after the space inside the inner wall portion 613 is filled with the rinse liquid, the upper nozzle portion 5A and the lower nozzle portion 5B continue to discharge the rinse liquid. Therefore, the rinse liquid overflows the inner wall portion 613 and flows into the space between the side wall portion 612 and the inner wall portion 613. As a result, the surface that forms the space between the side wall portion 612 and the inner wall portion 613 is cleaned by the overflowing rinse liquid. The rinse liquid collected in the space between the side wall portion 612 and the inner wall portion 613 is discharged from the immersion tank 61a via the second drain portion 15.

[0191] When a predetermined time has elapsed since the start of storing the rinse liquid, the control unit 102 switches the second opening / closing valve 146 of the first drainage unit 14 from the closed state to the open state, causing the rinse liquid to be discharged from the immersion tank 61a.

[0192] As with the discharge of the chemical liquid, while the rinsing liquid is being discharged, the control unit 102 rotates the substrate W and causes the upper nozzle unit 5A and the lower nozzle unit 5B to discharge the rinsing liquid. This process prevents the substrate W from drying, and can prevent pattern collapse and particle generation.

[0193] Fig. 18 is a diagram showing the third step of the rinsing process. As shown in Fig. 18, after the rinsing liquid is discharged, the control unit 102 controls the lifting mechanism 210A to lift the upper substrate holding part 2A from the first processing position P2 to the third processing position P4. Note that the third processing position P4 indicates a position in the up-down direction.

[0194] Specifically, the control unit 102 raises the upper substrate holding unit 2A to the third processing position P4 while continuing the discharge of the rinsing liquid from the upper nozzle unit 5A and the lower nozzle unit 5B and the rotation of the substrate W. This processing prevents the substrate W from drying, thereby making it possible to prevent pattern collapse and particle generation. Note that the timing at which the upper substrate holding unit 2A starts to rise is not particularly limited, as long as it is after the liquid level of the rinsing liquid has dropped to a position lower than the lower surface Wb of the substrate W.

[0195] When the upper substrate holder 2A rises from the first processing position P2 to the third processing position P4, the substrate W rises to a position where the side surface of the substrate W faces the side wall 612 in the horizontal direction. More specifically, the side surface of the substrate W faces a position between the upper end of the inner wall 613 and the upper end of the side wall 612 in the horizontal direction. Therefore, the rinsing liquid splashed from the substrate W in the third step of the rinsing process is received by the side wall 612. As a result, the rinsing liquid is collected in the space between the side wall 612 and the inner wall 613. The rinsing liquid collected in the space between the side wall 612 and the inner wall 613 is discharged from the immersion tank 61a via the second drain 15.

[0196] 19 is a diagram showing the drying process. As shown in FIG. 19, when a predetermined time has elapsed since the upper substrate holding part 2A was moved to the third processing position P4, the control part 102 switches the second opening / closing valve 126 of the first liquid supply part 12 and the second opening / closing valve 136 of the second liquid supply part 13 from the open state to the closed state. Then, the control part 102 controls the upper rotation part 4 (upper motor main body 42) to increase the rotation speed of the substrate W. As a result, the rinse liquid is blown off the substrate W by centrifugal force, and the substrate W is dried. When a predetermined time has elapsed since the rotation speed of the substrate W was increased, the control part 102 controls the upper rotation part 4 (upper motor main body 42) to stop the rotation of the substrate W.

[0197] 8 to 19, in the first embodiment, a chemical liquid process, a rinse process, and a drying process are performed on one substrate W inside one immersion tank 61a. Specifically, the upper nozzle unit 5A and the lower nozzle unit 5B eject a rinse liquid toward the substrate W located inside the immersion tank 61a from which the chemical liquid has been discharged by the first drainage unit 14. After the ejection of the rinse liquid stops, the upper rotation unit 4 increases the rotation speed of the substrate W located inside the immersion tank 61a to dry the substrate W.

[0198] 1 to 19, the first embodiment has been described above. According to the first embodiment, a single substrate W in a horizontal position is immersed in the chemical solution stored in the immersion tank 61a to process the substrate W, thereby reducing the consumption of the chemical solution. Furthermore, according to the first embodiment, the substrates W are immersed in the chemical solution one by one, thereby suppressing the generation of particles compared to a batch-type apparatus in which multiple substrates W are immersed simultaneously in the chemical solution in one processing tank.

[0199] Furthermore, according to the first embodiment, the substrates W are supported on the supports 614 of the immersion tank 61a and immersed in the chemical solution, so that chemical solution processing can be performed in parallel on a plurality of substrates W. This reduces the waiting time for the timing to start the chemical solution processing.

[0200] In the first embodiment, the upper substrate holding unit 2A is raised and lowered, but the processing cup unit 6 may be raised and lowered, or the upper substrate holding unit 2A and the processing cup unit 6 may be raised and lowered together. Similarly, the mounting table 7 may be raised and lowered, or the mounting table 7 and the upper substrate holding unit 2A may be raised and lowered together. That is, each of the first processing block PB1 and the second processing block PB2 may have an elevating mechanism that raises and lowers the processing cup unit 6 individually, and an elevating mechanism that raises and lowers the mounting table 7.

[0201] Specifically, in the first embodiment, upper substrate holding part 2A is raised and lowered so that the position of substrate W held by upper substrate holding part 2A changes from one of the upper positions of processing cup part 6 to a position inside the corresponding processing cup part 6, but the corresponding processing cup part 6 may be raised and lowered, or the corresponding processing cup part 6 and upper substrate holding part 2A may be raised and lowered so that the position of substrate W held by upper substrate holding part 2A changes from one of the upper positions of processing cup part 6 to a position inside the corresponding processing cup part 6. The same applies to mounting table 7.

[0202] In the first embodiment, the substrate W is immersed in the rinse liquid in the second step of the rinse process (see FIG. 17), but the second step of the rinse process may be omitted. Alternatively, the third step of the rinse process may be omitted, or the first and third steps of the rinse process may be omitted.

[0203] Furthermore, in the first embodiment, the first drainage section 14 has the recovery pipe section 143 and the second opening / closing valve 146, but the recovery pipe section 143 and the second opening / closing valve 146 may be omitted.

[0204] [Variation 1] Next, the substrate processing apparatus 100 of Modification 1 will be described with reference to Fig. 20. However, only differences from the embodiment described with reference to Figs. 1 to 19 will be described, and a description of the same matters as in the embodiment described with reference to Figs. 1 to 19 will be omitted. Fig. 20 is a schematic plan view of the substrate processing apparatus 100 of Modification 1.

[0205] 1 to 19, each of the first processing block PB1 and the second processing block PB2 has one upper substrate holding part 2A, but the number of upper substrate holding parts 2A is not limited to 1. Each of the first processing block PB1 and the second processing block PB2 may have multiple upper substrate holding parts 2A.

[0206] For example, as shown in Fig. 20, each of the first processing block PB1 and the second processing block PB2 may have two upper substrate holding parts 2A, or each of the first processing block PB1 and the second processing block PB2 may have three or more upper substrate holding parts 2A.

[0207] Specifically, the first processing block PB1 and the second processing block PB2 may each include a plurality of upper substrate holding units 2A, a plurality of rail members 8 corresponding to the upper substrate holding units 2A, and a moving unit 200A corresponding to each upper substrate holding unit 2A. The lifting mechanism 210A of the moving unit 200A raises and lowers the corresponding upper substrate holding unit 2A. Furthermore, the moving mechanism 220A of the moving unit 200A moves the corresponding upper substrate holding unit 2A between a group of facing positions including a position facing the mounting table 7 and a facing position P1 of each of the plurality of processing cup units 6.

[0208] When one of the plurality of upper substrate holding units 2A is moved in the first direction D1, the vertical position of the support arm 201A supporting the upper substrate holding unit 2A moved in the first direction D1 is different from the vertical positions of the other support arms 201A. Therefore, it is possible to prevent the plurality of support arms 201A from interfering with each other.

[0209] According to the first modification, the rinsing process and the drying process can be performed in parallel on a plurality of substrates W. This reduces the waiting time for the timing to start the rinsing process and the drying process.

[0210] [Variation 2] Next, the substrate processing apparatus 100 of Modification 2 will be described with reference to Fig. 21. However, only the differences from the embodiment described with reference to Figs. 1 to 20 will be described, and the same points as those in the embodiment described with reference to Figs. 1 to 20 will not be described. Fig. 21 is a schematic diagram showing the configuration of a first processing block PB1 included in the substrate processing apparatus 100 of Modification 2. Fig. 21 also shows a schematic cross section of a moving part 200A and an immersion tank 61a as viewed from the front.

[0211] In the embodiment described with reference to Figures 1 to 20, the same type of chemical solution is stored in each immersion tank 61a, but different types of chemical solution may be stored in one immersion tank 61a and another immersion tank 61a.

[0212] 21 differs from the substrate processing apparatus 100 described with reference to Figures 1 to 20 in that the first liquid supply unit 12 can supply two types of chemical liquids to the upper nozzle unit 5A. The substrate processing apparatus 100 shown in Figure 21 also differs from the substrate processing apparatus 100 described with reference to Figures 1 to 20 in that the second liquid supply unit 13 can supply two types of chemical liquids to the lower nozzle unit 5B.

[0213] In the example shown in FIG. 21 , first liquid supply unit 12 selectively supplies any one of a first chemical liquid, a second chemical liquid, and a rinse liquid to upper nozzle unit 5A. Specifically, as shown in FIG. 21 , first liquid supply unit 12 further includes chemical liquid piping unit 124 and a third on-off valve 127. Hereinafter, chemical liquid piping unit 121 may be referred to as "first chemical liquid piping unit 121," and chemical liquid piping unit 124 may be referred to as "second chemical liquid piping unit 124." Second chemical liquid piping unit 124 is a tubular member through which a fluid flows. Third on-off valve 127 can be opened and closed freely, similar to first on-off valve 125 and second on-off valve 126.

[0214] 21 , a first chemical liquid is supplied to the upstream end of first chemical liquid piping section 121. A second chemical liquid, which is a different type from the first chemical liquid, is supplied to the upstream end of second chemical liquid piping section 124. The downstream end of second chemical liquid piping section 124 is connected to common piping section 123, similar to first chemical liquid piping section 121. Third opening / closing valve 127 is provided in second chemical liquid piping section 124. Third opening / closing valve 127 is controlled by control section 102 to open and close the flow path inside second chemical liquid piping section 124.

[0215] Second liquid supply unit 13 selectively supplies any one of the first chemical liquid, the second chemical liquid, and the rinse liquid to lower nozzle unit 5B. Specifically, as shown in Fig. 21, second liquid supply unit 13 further includes chemical liquid piping unit 134 and third opening / closing valve 137. The configuration of second liquid supply unit 13 is similar to that of first liquid supply unit 12, and therefore a detailed description thereof will be omitted.

[0216] According to Modification 2, chemical liquid processing using the first chemical liquid and chemical liquid processing using the second chemical liquid can be performed in parallel. Furthermore, according to Modification 2, one of the first chemical liquid and the second chemical liquid can be selectively stored in one immersion tank 61a. Therefore, the chemical liquid processing to be performed in one immersion tank 61a can be selected between chemical liquid processing using the first chemical liquid and chemical liquid processing using the second chemical liquid.

[0217] 21, a configuration has been illustrated in which the first liquid supply unit 12 is capable of supplying two types of chemical liquid to the upper nozzle unit 5A, but the first liquid supply unit 12 may be capable of supplying three or more types of chemical liquid to the upper nozzle unit 5A. Similarly, the second liquid supply unit 13 may be capable of supplying three or more types of chemical liquid to the lower nozzle unit 5B. For example, different types of chemical liquid may be stored in multiple immersion tanks 61a.

[0218] [Variation 3] Next, the substrate processing apparatus 100 of Modification 3 will be described with reference to Fig. 22. However, only differences from the embodiment described with reference to Figs. 1 to 21 will be described, and a description of the same matters as in the embodiment described with reference to Figs. 1 to 21 will be omitted. Fig. 22 is a schematic plan view of the substrate processing apparatus 100 of Modification 3.

[0219] In the embodiment described with reference to Figures 1 to 21, the first processing block PB1 and the second processing block PB2 each have one load / unload port 9a, but the first processing block PB1 and the second processing block PB2 may each have multiple load / unload ports 9a.

[0220] For example, as shown in Fig. 22, each of the first processing block PB1 and the second processing block PB2 may have a plurality of loading / unloading ports 9a corresponding to the respective immersion tanks 61a. Specifically, each loading / unloading port 9a is provided at a position adjacent to the corresponding immersion tank 61a in the left-right direction. In this case, as shown in Fig. 22, the mounting table 7 may be omitted.

[0221] When the first processing block PB1 and the second processing block PB2 each have multiple loading / unloading ports 9a, the transport robot TR is movable in a first direction D1 (front-rear direction). Specifically, the substrate processing apparatus 100 further includes a movement mechanism for moving the transport robot TR in the first direction D1 (front-rear direction). The movement mechanism for moving the transport robot TR may include, for example, a ball screw mechanism and a reversible electric motor. The controller 102 controls the movement mechanism to move the transport robot TR between positions adjacent to each loading / unloading port 9a in the left-right direction.

[0222] Furthermore, if the first processing block PB1 and the second processing block PB2 each have multiple loading / unloading openings 9a, the substrate W is transferred directly between the upper substrate holding part 2A and the transport robot TR through one of the multiple loading / unloading openings 9a.

[0223] [Embodiment 2] Next, a second embodiment of the present invention will be described with reference to Figures 23 and 24. However, differences from the embodiment described with reference to Figures 1 to 22 will be described, and a description of the same points as in the embodiment described with reference to Figures 1 to 22 will be omitted. The second embodiment differs from the embodiment described with reference to Figures 1 to 22 in that a cleaning tank 63 is included in the multiple processing cup units 6.

[0224] 23 is a schematic plan view of the substrate processing apparatus 100 of the second embodiment. As shown in FIG. 23, the plurality of processing cup units 6 includes a cleaning tank 63. The cleaning tank 63 may be disposed, for example, at the rearmost position among the plurality of processing cup units 6. However, the position of the cleaning tank 63 is not particularly limited. For example, the cleaning tank 63 may be disposed at the frontmost position among the plurality of processing cup units 6. In other words, the cleaning tank 63 may be disposed adjacent to (at the rear of) the mounting table 7.

[0225] Specifically, each of the first processing block PB1 and the second processing block PB2 further includes a cleaning unit CU. The cleaning unit CU cleans the upper chuck members 31. The cleaning unit CU includes a cleaning tank 63. The cleaning tank 63 is a tank for cleaning the upper chuck members 31 of the upper substrate holding part 2A. A rinse liquid (here, DIW) is stored in the cleaning tank 63.

[0226] 24 is a schematic diagram showing the configuration of the first processing block PB1 included in the substrate processing apparatus 100 of embodiment 2. Specifically, FIG. 24 shows the configuration of the cleaning unit CU. FIG. 24 also shows a schematic cross section of the moving part 200A and the cleaning tank 63 as viewed from the front. As shown in FIG. 24, the cleaning unit CU further includes a liquid supply part 13a and a drain part 14a in addition to the cleaning tank 63.

[0227] The cleaning tank 63 is a container-like container with an open top. The upper chuck member 31 is immersed in the rinse liquid stored in the cleaning tank 63 without holding the substrate W. As a result, the upper chuck member 31 is cleaned by the rinse liquid. In this embodiment, the control unit 102 rotates the upper spin base 32 while the upper chuck member 31 is immersed in the rinse liquid. This process can improve the cleaning effect on the upper chuck member 31.

[0228] The cleaning tank 63 has a bottom wall 611, a side wall 612, and a lower nozzle 5B. The cleaning tank 63 has the same structure as the immersion tank 61a described with reference to Figures 1 to 22, except that it does not have the inner wall 613 and the plurality of support members 614, and therefore a detailed description thereof will be omitted.

[0229] Liquid supply unit 13a is controlled by control unit 102 to supply a rinse liquid to lower nozzle unit 5B of cleaning tank 63. Specifically, liquid supply unit 13a has rinse liquid piping unit 131a and an open / close valve 135a.

[0230] The rinsing liquid pipe section 131a is a tubular member through which a fluid flows. The opening and closing valve 135a is provided in the rinsing liquid pipe section 131a. The opening and closing valve 135a can be freely opened and closed. The opening and closing operation of the opening and closing valve 135a is controlled by the control section 102.

[0231] The rinse liquid is supplied to the upstream end of the rinse liquid piping section 131a. The downstream end of the rinse liquid piping section 131a is connected to the lower nozzle section 5B of the cleaning tank 63. The on-off valve 135a opens and closes the flow path in the rinse liquid piping section 131a. When the on-off valve 135a is opened, the rinse liquid flows through the rinse liquid piping section 131a and is supplied to the cleaning tank 63. As a result, the rinse liquid is stored in the cleaning tank 63. When the on-off valve 135a is closed, the flow of the rinse liquid via the rinse liquid piping section 131a stops. As a result, the supply of the rinse liquid to the cleaning tank 63 stops.

[0232] The drain unit 14a discharges the rinse liquid stored in the cleaning tank 63 to the outside of the cleaning tank 63. In this embodiment, the drain unit 14a discharges the rinse liquid stored in the cleaning tank 63 to the outside of the first processing block PB1. Specifically, the drain unit 14a includes a drain pipe 141a and an open / close valve 145a.

[0233] The drainage pipe section 141a is a tubular member through which a fluid flows. The on-off valve 145a is provided in the drainage pipe section 141a. The on-off valve 145a can be opened and closed freely. The opening and closing operation of the on-off valve 145a is controlled by the control section 102.

[0234] The upstream end of the drainage pipe 141a is connected to the bottom wall 611 of the cleaning tank 63 and communicates with the internal space of the cleaning tank 63. The downstream end of the drainage pipe 141a is connected to a drain tank (not shown). The open / close valve 145a opens and closes the flow path in the drainage pipe 141a. When the open / close valve 145a is opened, the rinse liquid stored in the cleaning tank 63 is discharged into the drain tank (not shown) via the drainage pipe 141a.

[0235] Here, the flow of the process executed by the control unit 102 when cleaning the plurality of upper chuck members 31 will be described.

[0236] The control unit 102 controls the moving mechanism 220A to move the upper substrate holding part 2A to a position P1 facing the cleaning tank 63, and then controls the lifting mechanism 210A to lower the upper substrate holding part 2A from the position P1 facing the cleaning tank 63 to a cleaning position P5. As a result, the multiple upper chuck members 31 of the upper substrate holding part 2A are immersed in the rinse liquid in the cleaning tank 63. The cleaning position P5 indicates a position in the up-down direction.

[0237] The control unit 102 lowers the upper substrate holding unit 2A from the opposing position P1 to the cleaning position P5 of the cleaning tank 63, and then controls the upper rotating unit 4 (upper motor body 42) to rotate the upper spin base 32. As a result, the plurality of upper chuck members 31 rotate in the rinse liquid.

[0238] When a predetermined time has elapsed since the start of rotation of the plurality of upper chuck members 31, the control unit 102 controls the upper rotation unit 4 (upper motor body 42) to stop the rotation of the upper spin base 32 (the plurality of upper chuck members 31). Then, the control unit 102 controls the lifting mechanism 210A to lift the upper substrate holding unit 2A from the cleaning position P5 to a position P1 facing the cleaning tank 63.

[0239] 23 and 24, the second embodiment of the present invention has been described. According to the second embodiment, the amount of chemical liquid consumed can be reduced, similarly to the embodiments described with reference to FIGS. 1 to 22. Furthermore, according to the second embodiment, the upper chuck member 31 can be cleaned, and therefore the chemical liquid and the like adhering to the upper chuck member 31 can be removed from the upper chuck member 31. Therefore, the substrate W can be gripped by the clean upper chuck member 31.

[0240] For example, as described with reference to FIG. 21 , if at least one of the multiple immersion tanks 61a stores a different type of chemical liquid from those stored in the other immersion tanks 61a, when a substrate W is immersed in a first chemical liquid and then the next substrate W is immersed in a second chemical liquid, the first chemical liquid adhering to the upper chuck member 31 may be mixed with the second chemical liquid. In contrast, according to the second embodiment, after the substrate W is immersed in the first chemical liquid, the upper chuck member 31 can be cleaned in the cleaning tank 63. Therefore, the next substrate W can be gripped by the cleaned upper chuck member 31 and immersed in the second chemical liquid. This reduces the possibility of the first chemical liquid being mixed with the second chemical liquid. As a result, the possibility of the substrate W being contaminated can be reduced.

[0241] In the second embodiment, the plurality of upper chuck members 31 are immersed in the rinse liquid stored in the cleaning tank 63 to clean the plurality of upper chuck members 31, but the configuration for cleaning the plurality of upper chuck members 31 is not limited to this configuration. For example, a spray cleaning nozzle may be provided in the cleaning tank 63. In this case, the rinse liquid is sprayed from the spray cleaning nozzle toward the plurality of upper chuck members 31 located inside the cleaning tank 63 to clean the plurality of upper chuck members 31. For example, when cleaning the plurality of upper chuck members 31, the upper spin base 32 may be rotated, and the rinse liquid may be sprayed from one spray cleaning nozzle toward the rotating plurality of upper chuck members 31.

[0242] [Embodiment 3] Next, a third embodiment of the present invention will be described with reference to Figures 25 to 38. However, only the differences from the embodiment described with reference to Figures 1 to 24 will be described, and a description of the same points as in the embodiment described with reference to Figures 1 to 24 will be omitted. The third embodiment differs from the embodiment described with reference to Figures 1 to 24 in that the multiple processing cups 6 include a second processing cup 62.

[0243] 25 is a schematic plan view of the substrate processing apparatus 100 of the third embodiment. As shown in FIG. 25, in the third embodiment, the multiple processing cups 6 include multiple first processing cups 61 and multiple second processing cups 62. The first processing cups 61 and the second processing cups 62 are arranged alternately in the first direction D1 (front-rear direction). One of the second processing cups 62 may be located at the rearmost position among the multiple processing cups 6. The second processing cup 62 receives the processing liquid discharged from the substrate W held by the upper substrate holding unit 2A.

[0244] Specifically, the plurality of first processing cup sections 61 include two immersion tanks 61b. The plurality of second processing cup sections 62 include one rinse cup section 62a and one rinse-dry cup section 62b. Hereinafter, one of the two immersion tanks 61b may be referred to as the "first immersion tank 61b1." The other of the two immersion tanks 61b may be referred to as the "second immersion tank 61b2." The two immersion tanks 61b (the first immersion tank 61b1 and the second immersion tank 61b2), one rinse cup section 62a, and one rinse-dry cup section 62b are arranged in the following order from the front: first immersion tank 61b1, rinse cup section 62a, second immersion tank 61b2, rinse-dry cup section 62b. The first immersion tank 61b1, the rinse cup unit 62a, the second immersion tank 61b2, and the rinse and dry cup unit 62b are arranged in accordance with the processing procedure. The rinse and dry cup unit 62b is disposed at the rearmost position among the plurality of processing cup units 6.

[0245] A chemical liquid is stored in the immersion tank 61b. More specifically, different types of chemical liquids are stored in the two immersion tanks 61b. The rinse cup section 62a receives the rinse liquid discharged from the substrate W held by the upper substrate holding section 2A. Similarly, the rinse-dry cup section 62b receives the rinse liquid discharged from the substrate W held by the upper substrate holding section 2A.

[0246] Specifically, the first processing block PB1 and the second processing block PB2 each have a first substrate processing unit PU1, a second substrate processing unit PU2, a third substrate processing unit PU3, and a fourth substrate processing unit PU4. The first substrate processing unit PU1 has an immersion tank 61b (first immersion tank 61b1). The second substrate processing unit PU2 has a rinse cup unit 62a. The third substrate processing unit PU3 has an immersion tank 61b (second immersion tank 61b2). The fourth substrate processing unit PU4 has a rinse / dry cup unit 62b.

[0247] A first chemical liquid is stored in the immersion tank 61b (first immersion tank 61b1) of the first substrate processing unit PU1. The substrates W are immersed in the first chemical liquid. That is, chemical liquid processing using the first chemical liquid (first chemical liquid processing) is performed in the immersion tank 61b of the first substrate processing unit PU1.

[0248] The second substrate processing unit PU2 cooperates with the upper substrate holding part 2A to perform a rinse process inside the rinse cup part 62a, so that the rinse cup part 62a receives the rinse liquid discharged from the substrate W held by the upper substrate holding part 2A.

[0249] The immersion tank 61b (second immersion tank 61b2) of the third substrate processing unit PU3 stores a second chemical liquid that is different from the first chemical liquid. The substrates W are immersed in the second chemical liquid. That is, in the immersion tank 61b of the third substrate processing unit PU3, chemical liquid processing using the second chemical liquid (second chemical liquid processing) is performed.

[0250] The fourth substrate processing unit PU4 cooperates with the upper substrate holding part 2A to perform rinsing and drying processes inside the rinse-dry cup part 62b, so that the rinse liquid discharged from the substrate W held by the upper substrate holding part 2A is received by the rinse-dry cup part 62b.

[0251] In the third embodiment, two loading / unloading openings 9a (see FIG. 8) are provided in a sidewall 91 of the first processing block PB1. One of the two loading / unloading openings 9a is provided at a position adjacent to the immersion bath 61b (first immersion bath 61b1) of the first substrate processing unit PU1 in the left-right direction. The other of the two loading / unloading openings 9a is provided at a position adjacent to the rinse-drying cup section 62b in the left-right direction. The sidewall 91 of the second processing block PB2 also has two loading / unloading openings 9a, similar to the first processing block PB1.

[0252] The substrate W is loaded into the first processing block PB1 through the loading / unloading port 9a located adjacent to the first immersion bath 61b1. In other words, the loading / unloading port 9a located adjacent to the first immersion bath 61b1 is the "loading entrance." On the other hand, the substrate W processed by the first processing block PB1 is unloaded to the outside of the first processing block PB1 through the loading / unloading port 9a located adjacent to the rinse-dry cup section 62b. In other words, the loading / unloading port 9a located adjacent to the rinse-dry cup section 62b is the "unloading exit."

[0253] In the third embodiment, the transport robot TR is movable in a first direction D1 (front-rear direction). Specifically, the substrate processing apparatus 100 further includes a movement mechanism that moves the transport robot TR in the first direction D1 (front-rear direction). The movement mechanism that moves the transport robot TR may include, for example, a ball screw mechanism and a reversible electric motor. The control unit 102 controls the movement mechanism to move the transport robot TR between positions facing the respective loading / unloading ports 9a.

[0254] Next, the first liquid supply part 12 and the first substrate processing unit PU1 included in the substrate processing apparatus 100 of embodiment 3 will be described with reference to Fig. 26. Fig. 26 is a schematic diagram showing the configuration of the first processing block PB1 included in the substrate processing apparatus 100 of embodiment 3. In detail, Fig. 26 shows the configuration of the first liquid supply part 12 and the first substrate processing unit PU1. Fig. 26 also shows a schematic cross section of the moving part 200A and the first immersion tank 61b1 as viewed from the front side.

[0255] 26, in the third embodiment, the first liquid supply unit 12 selectively supplies one of the first chemical liquid, the second chemical liquid, and the rinse liquid (here, DIW) to the upper nozzle unit 5A. The configuration of the first liquid supply unit 12 shown in FIG. 26 is similar to the configuration of the first liquid supply unit 12 described with reference to FIG. 21, and therefore a detailed description thereof will be omitted.

[0256] The first substrate processing unit PU1 has a second liquid supply part 13b1, a first drainage part 14b1, a second drainage part 15b1, and an exhaust part 17 in addition to the first immersion tank 61b1.

[0257] The first immersion tank 61b1 has a bottom wall 611, a side wall 612, an inner wall 613, and a lower nozzle 5B. The first immersion tank 61b1 has the same structure as the immersion tank 61a described with reference to Figures 3 and 4, except that it does not have the multiple support members 614, and therefore a detailed description thereof will be omitted.

[0258] The second liquid supply unit 13b1 selectively supplies one of the first chemical liquid and a rinse liquid (here, DIW) to the lower nozzle 5B of the first immersion tank 61b1. The configuration of the second liquid supply unit 13b1 is similar to that of the second liquid supply unit 13 described with reference to Figure 3, and therefore a detailed description thereof will be omitted. The first chemical liquid is supplied to the upstream end of the chemical liquid piping unit 131 of the second liquid supply unit 13b1.

[0259] The first drainage section 14b1 discharges the processing liquid (first chemical liquid) stored in the first immersion tank 61b1 to the outside of the first immersion tank 61b1. The configuration of the first drainage section 14b1 is similar to that of the first drainage section 14 described with reference to FIG. 3, and therefore a detailed description thereof will be omitted. The downstream end of the recovery pipe section 143 of the first drainage section 14b1 is connected to the first chemical liquid tank. Therefore, the first chemical liquid discharged from the first immersion tank 61b1 can be recovered in the first chemical liquid tank. However, the first chemical liquid discharged from the first immersion tank 61b1 does not have to be recovered in the first chemical liquid tank. In this case, the recovery pipe section 143 and the second opening / closing valve 146 of the first drainage section 14b1 may be omitted.

[0260] The configuration of the second drainage section 15b1 is similar to the configuration of the second drainage section 15 described with reference to FIG. 3, and therefore a description thereof will be omitted.

[0261] In the third embodiment, the substrate W is immersed in the first chemical liquid in the first immersion tank 61b1 while being held by the upper substrate holding part 2A (upper holding part 3). The control part 102 may control the upper rotation part 4 (upper motor main body 42) to rotate the substrate W while the substrate W is immersed in the first chemical liquid.

[0262] Next, the process of immersing the substrate W in the first chemical liquid will be described with reference to Fig. 27. Fig. 27 is a diagram showing the process of immersing the substrate W in the first chemical liquid. Fig. 27 schematically shows a cross section of the moving part 200A and the first immersion tank 61b1 as viewed from the front side.

[0263] In the first embodiment, after the substrate W is moved inside the immersion tank 61a, the chemical liquid is discharged from the upper nozzle portion 5A and the lower nozzle portion 5B to store the chemical liquid in the immersion tank 61a, thereby immersing the substrate W in the chemical liquid, but in the third embodiment, the first chemical liquid is stored in the first immersion tank 61b1 before the substrate W is immersed in the first chemical liquid. Therefore, the substrate W is submerged in the first chemical liquid stored in the first immersion tank 61b1, thereby immersing the substrate W in the first chemical liquid.

[0264] 27, before the substrate W is immersed in the first chemical liquid, the upper substrate holder 2A is located at a position P1 facing the first immersion tank 61b1. Therefore, before the substrate W is immersed in the first chemical liquid, the substrate W is located at a position above the first immersion tank 61b1 and faces the liquid surface of the first chemical liquid in the first immersion tank 61b1.

[0265] When the substrate W is immersed in the first chemical liquid, the control unit 102 controls the upper rotation unit 4 (upper motor body 42) to rotate the substrate W. The control unit 102 also switches the first opening / closing valve 135 of the second liquid supply unit 13b1 from a closed state to an open state to discharge the first chemical liquid from the lower nozzle unit 5B of the first immersion tank 61b1. Therefore, the first chemical liquid overflows from the inner wall unit 613.

[0266] The control unit 102 controls the lifting mechanism 210A to lower the upper substrate holding unit 2A from the opposing position P1 in the first immersion tank 61b1 to the fourth processing position P6 (see FIG. 26). As a result, the substrate W is immersed in the first chemical liquid. In this way, by rotating the substrate W and discharging the first chemical liquid from the lower nozzle unit 5B, the substrate W can be submerged in the first chemical liquid. Note that the fourth processing position P6 indicates a position in the vertical direction.

[0267] Note that the first chemical liquid may be discharged from the upper nozzle unit 5A when the substrate W is immersed in the first chemical liquid. Specifically, when the substrate W moves to a position inside the first immersion tank 61b1, the control unit 102 may switch the first opening / closing valve 125 of the first liquid supply unit 12 from a closed state to an open state, thereby discharging the first chemical liquid from the upper nozzle unit 5A.

[0268] Next, a process of lifting the substrate W from the first chemical liquid will be described. In the first embodiment, after the substrate W is treated with the chemical liquid, the chemical liquid is discharged from the immersion tank 61a, and a rinsing process and a drying process are performed in the immersion tank 61a from which the chemical liquid has been discharged. In contrast, in the third embodiment, the first chemical liquid is not discharged from the first immersion tank 61b1, and the substrate W is lifted from the first chemical liquid. Note that the first chemical liquid is discharged from the first immersion tank 61b1, for example, when the first immersion tank 61b1 is cleaned.

[0269] Specifically, when the substrate W is lifted up from the first chemical liquid, the control unit 102 controls the upper rotation unit 4 (upper motor main body 42) to rotate the substrate W. The control unit 102 also switches the first opening / closing valve 135 of the second liquid supply unit 13b1 from a closed state to an open state to discharge the first chemical liquid from the lower nozzle unit 5B of the first immersion tank 61b1. Therefore, the first chemical liquid overflows from the inner wall unit 613. The control unit 102 controls the lifting mechanism 210A to lift the upper substrate holding unit 2A from the fourth processing position P6 (see FIG. 26) to a position P1 facing the first immersion tank 61b1. In this way, the substrate W can be lifted up from the first chemical liquid by discharging the first chemical liquid from the lower nozzle unit 5B of the first immersion tank 61b1 while rotating the substrate W.

[0270] When the substrate W is pulled up from the first chemical liquid, the control unit 102 may switch the first opening / closing valve 125 of the first liquid supply unit 12 from the closed state to the open state, thereby discharging the first chemical liquid from the upper nozzle unit 5A. In this case, before the substrate W moves to the outside (upward) of the first immersion tank 61b1, the control unit 102 switches the first opening / closing valve 125 of the first liquid supply unit 12 from the open state to the closed state, thereby stopping the discharging of the first chemical liquid from the upper nozzle unit 5A.

[0271] Next, the third substrate processing unit PU3 included in the substrate processing apparatus 100 of embodiment 3 will be described with reference to Fig. 28. Fig. 28 is another schematic diagram showing the configuration of the first processing block PB1 included in the substrate processing apparatus 100 of embodiment 3. In detail, Fig. 28 shows the configuration of the third substrate processing unit PU3. Note that Fig. 28 also shows a schematic cross section of the moving part 200A and the second immersion tank 61b2 as viewed from the front side.

[0272] 28, the third substrate processing unit PU3 has, in addition to the second immersion tank 61b2, a second liquid supply unit 13b2, a first drainage unit 14b2, a second drainage unit 15b2, and an exhaust unit 17. The structure of the second immersion tank 61b2 is similar to that of the first immersion tank 61b1, and therefore a description thereof will be omitted.

[0273] Second liquid supply unit 13b2 selectively supplies either the second chemical liquid or a rinse liquid (here, DIW) to lower nozzle 5B of second immersion tank 61b2. The configuration of second liquid supply unit 13b2 is similar to that of second liquid supply unit 13 described with reference to Figure 3, and therefore a detailed description thereof will be omitted. The second chemical liquid is supplied to the upstream end of chemical liquid piping 131 of second liquid supply unit 13b2.

[0274] The first drainage section 14b2 discharges the processing liquid (second chemical liquid) stored in the second immersion tank 61b2 to the outside of the second immersion tank 61b2. The configuration of the first drainage section 14b2 is similar to that of the first drainage section 14 described with reference to FIG. 3, so a detailed description thereof will be omitted. The downstream end of the recovery pipe section 143 of the first drainage section 14b2 is connected to the second chemical liquid tank. Therefore, the second chemical liquid discharged from the second immersion tank 61b2 can be recovered in the second chemical liquid tank. However, the second chemical liquid discharged from the second immersion tank 61b2 does not have to be recovered in the second chemical liquid tank. In this case, the recovery pipe section 143 and the second opening / closing valve 146 of the first drainage section 14b2 may be omitted.

[0275] The configuration of the second drainage section 15b2 is similar to the configuration of the second drainage section 15 described with reference to FIG. 3, and therefore a description thereof will be omitted.

[0276] In the third embodiment, the substrate W is immersed in the second chemical liquid in the second immersion tank 61b2 while being held by the upper substrate holding part 2A (upper holding part 3). The control part 102 may control the upper rotation part 4 (upper motor main body 42) to rotate the substrate W while the substrate W is immersed in the second chemical liquid.

[0277] In the third embodiment, the second chemical liquid is stored in the second immersion tank 61b2 before the substrate W is immersed in the second chemical liquid. Therefore, the substrate W is submerged in the second chemical liquid stored in the second immersion tank 61b2 to immerse the substrate W in the second chemical liquid. The process of immersing the substrate W in the second chemical liquid is similar to the process of immersing the substrate W in the first chemical liquid, and therefore a detailed description thereof will be omitted.

[0278] Furthermore, in the third embodiment, after the substrate W is treated with the second chemical liquid, the second chemical liquid is not discharged from the second immersion tank 61b2. Therefore, the substrate W is pulled up from the second chemical liquid. The process of pulling up the substrate W from the second chemical liquid is similar to the process of pulling up the substrate W from the first chemical liquid, and therefore a detailed description thereof will be omitted.

[0279] Next, the second substrate processing unit PU2 included in the substrate processing apparatus 100 of embodiment 3 will be described with reference to Fig. 29. Fig. 29 is yet another schematic diagram showing the configuration of the first processing block PB1 included in the substrate processing apparatus 100 of embodiment 3. In detail, Fig. 29 shows the configuration of the second substrate processing unit PU2. Note that Fig. 29 also shows a schematic cross section of the moving part 200A and the rinse cup part 62a as viewed from the front side.

[0280] 29, the second substrate processing unit PU2 has a rinse cup part 62a, as well as a second liquid supply part 13c, a drain part 14c, and an exhaust part 17. The rinse cup part 62a has a bottom wall part 611, a side wall part 612, and a lower nozzle part 5B. The rinse cup part 62a has the same structure as the immersion tank 61a described with reference to FIGS. 3 and 4, except that it does not have an inner wall part 613 and a plurality of support parts 614, and therefore a detailed description thereof will be omitted.

[0281] The second liquid supply unit 13c supplies a rinse liquid (here, DIW) to the lower nozzle unit 5B of the rinse cup unit 62a. Specifically, the second liquid supply unit 13c has a rinse liquid piping unit 131c and an open / close valve 135c. Note that the configuration of the second liquid supply unit 13c is similar to the configuration of the liquid supply unit 13a described with reference to FIG. 24, and therefore a detailed description thereof will be omitted.

[0282] The drainage unit 14c discharges the rinse liquid collected in the rinse cup unit 62a to the outside of the rinse cup unit 62a. In the third embodiment, the drainage unit 14c discharges the rinse liquid collected in the rinse cup unit 62a to the outside of the first processing block PB1. Specifically, the drainage unit 14c includes a drainage pipe 141c and an open / close valve 145c. The configuration of the drainage unit 14c is similar to the configuration of the drainage unit 14a described with reference to FIG. 24, and therefore a detailed description thereof will be omitted.

[0283] In the third embodiment, the rinse cup portion 62a performs a rinse process on the substrate W after immersion in the first chemical liquid (the substrate W after the first chemical liquid process).

[0284] 26, the substrate W is immersed in the first chemical liquid in the first immersion tank 61b1 while being held by the upper substrate holding part 2A (upper holding part 3). When a predetermined time (predetermined first chemical liquid processing time) has elapsed since the substrate W was immersed in the first chemical liquid, the control part 102 controls the moving part 200A to move the substrate W from the first immersion tank 61b1 to the rinse cup part 62a.

[0285] More specifically, the control unit 102 executes a lifting process to raise the upper substrate holding unit 2A holding the substrate W from the fourth processing position P6 (see FIG. 26) to a position P1 facing the first immersion tank 61b1. As a result, the substrate W after being processed in the first immersion tank 61b1 is raised from a position inside the first immersion tank 61b1 to a position above the first immersion tank 61b1.

[0286] The control unit 102 raises the upper substrate holding unit 2A to position P1 facing the first immersion tank 61b1, and then controls the movement mechanism 220A to move the upper substrate holding unit 2A from position P1 facing the first immersion tank 61b1 to position P1 facing the rinse cup unit 62a. The control unit 102 then controls the lifting mechanism 210A to lower the upper substrate holding unit 2A from position P1 facing the rinse cup unit 62a to the third processing position P4. As a result, the substrate W after the first chemical liquid processing moves to a position inside the rinse cup unit 62a.

[0287] When the substrate W moves to a position inside the rinse cup unit 62a, the control unit 102 controls the upper rotation unit 4 (upper motor main body 42) to rotate the substrate W. The control unit 102 also switches the second opening / closing valve 126 of the first liquid supply unit 12 and the opening / closing valve 135c of the second liquid supply unit 13c from a closed state to an open state, causing the upper nozzle unit 5A and the lower nozzle unit 5B of the rinse cup unit 62a to discharge the rinse liquid toward the upper surface Wa and lower surface Wb of the rotating substrate W. As a result, a rinse process is performed on the substrate W after the first chemical liquid process inside the rinse cup unit 62a. More specifically, the rinse liquid spreads over the upper surface Wa and lower surface Wb of the substrate W, and the first chemical liquid adhering to the upper surface Wa and lower surface Wb of the substrate W is washed away from the substrate W by the rinse liquid.

[0288] The first chemical liquid and the rinse liquid discharged from the rotating substrate W are received by and collected in the rinse cup portion 62a. The processing liquid collected in the rinse cup portion 62a is discharged from the rinse cup portion 62a via the drain portion 14c.

[0289] The fourth substrate processing unit PU4 has the same configuration as the second substrate processing unit PU2, and therefore a detailed description thereof will be omitted.

[0290] In the third embodiment, the rinse-dry cup part 62b performs a rinse process on the substrate W after immersion in the second chemical liquid. The rinse process in the rinse-dry cup part 62b is the same as the rinse process in the rinse cup part 62a, and therefore a description thereof will be omitted.

[0291] In the third embodiment, the rinse-dry cup portion 62b performs a drying process on the substrate W. The drying process is the same as the drying process described with reference to Fig. 19, and therefore a description thereof will be omitted.

[0292] Next, an example of the operation of the substrate processing apparatus 100 of embodiment 3 will be described with reference to FIGS. 25 to 30 and 31(a) to 31(d). FIG. 30 is a diagram showing an example of the flow of the operation of the substrate processing apparatus 100 of embodiment 3. Specifically, FIG. 30 shows an example of the flow of the process executed by the control unit 102 when the first processing block PB1 processes one substrate W. FIGS. 31(a) to 31(d) are diagrams schematically showing an example of the operation of the substrate processing apparatus 100 of embodiment 3. Specifically, FIGS. 31(a) to 31(d) show an example of the operation of the first processing block PB1 when the first processing block PB1 processes one substrate W.

[0293] The process shown in Fig. 30 includes steps S21 to S28. One substrate W is processed in accordance with the process procedure by the process shown in Fig. 30. Specifically, one substrate W is subjected to a first chemical liquid process, a rinse process, a second chemical liquid process, a rinse process, and a drying process in this order.

[0294] 30 starts when the transport robot TR loads the substrate W into the first processing block PB1. The transport robot TR loads the substrate W into the first processing block PB1 through a loading / unloading opening 9a (loading entrance) provided at a position adjacent to the first immersion tank 61b1 in the left-right direction.

[0295] As shown in FIGS. 30 and 31(a), the control unit 102 controls the transport robot TR to load the substrate W into the first processing block PB1, and then controls the moving unit 200A (lifting mechanism 210A and moving mechanism 220A) and the upper substrate holding unit 2A (upper chuck driving mechanism 50) to grip the substrate W supported by the hand of the transport robot TR with the plurality of upper chuck members 31. As a result, the upper substrate holding unit 2A receives the substrate W from the transport robot TR (step S21). Furthermore, as the plurality of upper chuck members 31 grip the substrate W, the substrate W is held horizontally by the upper substrate holding unit 2A (upper holding unit 3). In the third embodiment, the upper substrate holding unit 2A receives the substrate W from the transport robot TR above the first immersion tank 61b1.

[0296] When the upper substrate holding part 2A holds the substrate W, the control part 102 submerges the substrate W in the first chemical liquid in the first immersion tank 61b1 to immerse the substrate W in the first chemical liquid (step S22), as described with reference to Fig. 27. By immersing the substrate W in the first chemical liquid, the first chemical liquid treatment is performed on the substrate W.

[0297] When the time that has elapsed since the substrate W was immersed in the first chemical liquid reaches or exceeds a predetermined time (predetermined first chemical liquid processing time), the control unit 102 moves the substrate W after the first chemical liquid processing from the first immersion tank 61b1 to the rinse cup unit 62a (step S23).

[0298] More specifically, in the third embodiment, the upper substrate holding part 2A holds the substrate W during the first chemical liquid treatment. Therefore, at the end of the first chemical liquid treatment, the upper substrate holding part 2A holds the substrate W that has been treated in the first immersion tank 61b1. Therefore, when the time that has elapsed since the substrate W was immersed in the first chemical liquid reaches or exceeds a predetermined time (predetermined first chemical liquid treatment time), the control part 102 first performs a pull-up process. As a result, the upper substrate holding part 2A rises to position P1 opposite the first immersion tank 61b1, and the substrate W that has been treated with the first chemical liquid moves to a position above the first immersion tank 61b1.

[0299] The control unit 102 may perform the shaking-off process by raising the upper substrate holding unit 2A to the third processing position P4 (see FIG. 29) before raising the upper substrate holding unit 2A to the opposing position P1 of the first immersion tank 61b1. The shaking-off process is a process in which the processing liquid is discharged from the substrate W by rotating the substrate W to an extent that the substrate W does not dry out.

[0300] 31(b), the control unit 102 raises the upper substrate holding unit 2A to position P1 facing the first immersion tank 61b1, and then controls the movement mechanism 220A to move the upper substrate holding unit 2A from position P1 facing the first immersion tank 61b1 to position P1 facing the rinse cup unit 62a. Then, the control unit 102 controls the lifting mechanism 210A to lower the upper substrate holding unit 2A from position P1 facing the rinse cup unit 62a to the third processing position P4 (see FIG. 29). As a result, the substrate W moves from above the rinse cup unit 62a to inside the rinse cup unit 62a.

[0301] After moving the substrate W into the rinse cup portion 62a, the control portion 102 performs the rinse process as described with reference to FIG. 29 (step S24).

[0302] 30 and 31(c), when the time that has elapsed since the start of the rinsing process reaches or exceeds a predetermined time (predetermined rinsing process time), the control unit 102 moves the substrate W after the rinsing process from the rinse cup unit 62a to the second immersion tank 61b2 and immerses the substrate W in the second chemical liquid in the second immersion tank 61b2 (step S25). By immersing the substrate W in the second chemical liquid, the second chemical liquid process is performed on the substrate W.

[0303] More specifically, the control unit 102 controls the lifting mechanism 210A to lift the upper substrate holding unit 2A from the third processing position P4 (see FIG. 29) to a position P1 facing the rinse cup unit 62a, and then controls the moving mechanism 220A to move the upper substrate holding unit 2A from the position P1 facing the rinse cup unit 62a to the position P1 facing the second immersion tank 61b2. Then, the control unit 102 submerges the substrate W in the second chemical liquid in the second immersion tank 61b2, as in step S22, to immerse the substrate W in the second chemical liquid.

[0304] The control unit 102 may perform the shaking-off process before raising the upper substrate holding unit 2A to the position P1 facing the rinse cup unit 62a.

[0305] As shown in Figures 30 and 31(d), when the time that has elapsed since the substrate W was immersed in the second chemical liquid reaches or exceeds a predetermined time (predetermined second chemical liquid processing time), the control unit 102 moves the substrate W after the second chemical liquid processing from the second immersion tank 61b2 to the rinse-dry cup section 62b (step S26), as in step S23.

[0306] After moving the substrate W into the rinse-dry cup part 62b, the control part 102 performs the rinse process as described with reference to Fig. 29 (step S27). Specifically, while rotating the substrate W, the control part 102 causes the upper nozzle part 5A and the lower nozzle part 5B of the rinse-dry cup part 62b to eject the rinse liquid toward the upper surface Wa and the lower surface Wb of the substrate W positioned inside the rinse-dry cup part 62b.

[0307] When the time that has elapsed since the start of the rinsing process of the substrate W reaches or exceeds a predetermined time (predetermined rinsing process time), the control unit 102 executes the drying process (step S28) as described with reference to Fig. 19. Specifically, the control unit 102 stops the discharge of the rinsing liquid and then increases the rotation speed of the substrate W positioned inside the rinse-dry cup unit 62b.

[0308] When the time that has elapsed since the start of the drying process reaches or exceeds a predetermined time (predetermined drying time), the control unit 102 stops the rotation of the substrate W and ends the drying process, thereby drying the substrate W.

[0309] When the drying process is completed, the control unit 102 controls the lifting mechanism 210A to raise the upper substrate holding unit 2A to a position P1 facing the rinse-dry cup unit 62b. After raising the upper substrate holding unit 2A to the position P1 facing the rinse-dry cup unit 62b, the control unit 102 causes the hand of the transport robot TR to enter the first processing block PB1 through the loading / unloading opening 9a (unloading opening) located adjacent to the rinse-dry cup unit 62b. The control unit 102 then controls the upper chuck driving mechanism 50 to release the substrate W from the multiple upper chuck members 31, causing the hand of the transport robot TR to support the substrate W, and then controls the transport robot TR to withdraw the hand of the transport robot TR to the outside of the first processing block PB1. As a result, the substrate W processed by the first processing block PB1 is unloaded from the first processing block PB1, and the processing shown in FIG. 30 is completed.

[0310] As described above with reference to Figures 30 and 31(a) to 31(d), the multiple processing cup units 6 are lined up according to the processing procedure. The control unit 102 controls the movement unit 200A to move the upper substrate holding unit 2A according to the processing procedure. Therefore, in the third embodiment, when processing one substrate W, the upper substrate holding unit 2A moves sequentially from the front side to the rear side. Therefore, according to the third embodiment, the movement sequence of the upper substrate holding unit 2A is unlikely to become complicated.

[0311] Next, with reference to Figures 32 and 33, an example of a process for moving a substrate W from one processing cup part 6 to another processing cup part 6 will be described, taking as an example a case where the substrate W is moved from the first immersion tank 61b1 to the rinse cup part 62a. Figures 32 and 33 are views showing a process for lifting the substrate W out of the first chemical liquid. Note that Figures 32 and 33 schematically show cross sections of the moving part 200A and the first immersion tank 61b1 as viewed from the front.

[0312] As shown in FIG. 32, when the substrate W is pulled up from the first chemical liquid by the pulling-up process, the control unit 102 switches the first opening / closing valve 125 of the first liquid supply unit 12 from a closed state to an open state, causing the first chemical liquid to be ejected from the upper nozzle unit 5A.

[0313] When the control unit 102 raises the upper substrate holding unit 2A to the third processing position P4, it switches the first opening / closing valve 125 of the first liquid supply unit 12 from an open state to a closed state to stop the upper nozzle unit 5A from discharging the first chemical liquid, and performs a puddle process to support a liquid film of the first chemical liquid on the upper surface Wa of the substrate W.

[0314] Specifically, the control unit 102 controls the upper rotation unit 4 (upper motor main body 42) to reduce the rotation speed of the substrate W to a rotation speed at which the first chemical liquid is not discharged from the substrate W. For example, the control unit 102 may reduce the rotation speed of the substrate W to 10 rpm. As a result, a liquid film of the first chemical liquid is supported on the upper surface Wa of the substrate W. Hereinafter, the state in which the processing liquid is supported on the upper surface Wa of the substrate W may be referred to as a "puddle state."

[0315] Once the control unit 102 has caused a liquid film of the first chemical liquid to be supported on the upper surface Wa of the substrate W, it controls the lifting mechanism 210A to move the upper substrate holding unit 2A from the third processing position P4 to an opposing position P1 in the first immersion tank 61b1 while maintaining the paddle state, as shown in Fig. 33. In other words, the control unit 102 raises the substrate W from inside the first immersion tank 61b1 to a position above the first immersion tank 61b1 while rotating the substrate W at a rotational speed that causes a liquid film of the first chemical liquid to be maintained on the upper surface Wa of the substrate W.

[0316] Thereafter, while maintaining the puddle state, the control unit 102 controls the moving unit 200A to move the substrate W from a position above the first immersion tank 61b1 to a position inside the rinse cup unit 62a.

[0317] The timing at which the upper nozzle unit 5A starts discharging the first chemical liquid is not particularly limited, as long as it is before the substrate W moves above (outside) the first immersion tank 61b1. For example, the control unit 102 may start discharging the first chemical liquid from the upper nozzle unit 5A while the substrate W is immersed in the first chemical liquid.

[0318] Furthermore, in the puddle process described with reference to Figures 32 and 33, the rotation speed of the substrate W was reduced to a rotation speed at which the first chemical liquid was not discharged from the substrate W to form a puddle state, but the control unit 102 may also stop the rotation of the substrate W and cause a liquid film of the first chemical liquid to be supported on the upper surface Wa of the substrate W.

[0319] 32 and 33, by supporting a liquid film of the first chemical liquid on the upper surface Wa of the substrate W, it is possible to prevent the upper surface Wa of the substrate W from drying while the substrate W is being moved from the first immersion tank 61b1 to the rinse cup part 62a. As a result, it is possible to prevent the pattern from collapsing and the generation of particles.

[0320] In the example shown in Figures 32 and 33, the substrate W is moved from the first immersion tank 61b1 to the rinse cup section 62a with a liquid film of the first chemical liquid supported (held) on the upper surface Wa of the substrate W, but the substrate W may also be moved from the first immersion tank 61b1 to the rinse cup section 62a with a liquid film of the rinse liquid supported (held) on the upper surface Wa of the substrate W.

[0321] Similarly, when the substrate W is moved from the rinse cup section 62a to the second immersion tank 61b2, a liquid film of the rinse liquid or the second chemical liquid may be supported (held) on the upper surface Wa of the substrate W, and when the substrate W is moved from the second immersion tank 61b2 to the rinse drying cup section 62b, a liquid film of the second chemical liquid or the rinse liquid may be supported (held) on the upper surface Wa of the substrate W.

[0322] The third embodiment of the present invention has been described above with reference to Figures 25 to 33. According to the third embodiment, similar to the embodiments described with reference to Figures 1 to 24, a single substrate W in a horizontal position is immersed in a chemical solution stored in an immersion tank 61b to process the substrate W, thereby reducing the consumption of the chemical solution.

[0323] Furthermore, according to the third embodiment, the substrate W can be immersed in the chemical solution by submerging it in the chemical solution stored in the immersion tank 61b. Therefore, it is not necessary to drain the chemical solution from the immersion tank 61b every time a substrate W is processed, which further reduces the amount of chemical solution consumed. However, the chemical solution may be drained from the immersion tank 61b every time a substrate W is processed.

[0324] In the third embodiment, the first processing block PB1 and the second processing block PB2 each have one upper substrate holding part 2A, but the number of upper substrate holding parts 2A is not limited to 1. The first processing block PB1 and the second processing block PB2 may each have multiple upper substrate holding parts 2A.

[0325] Furthermore, in the third embodiment, the first liquid supply unit 12 is configured to be able to supply two types of chemical liquid to the upper nozzle unit 5A, but the first liquid supply unit 12 may be configured to be able to supply three or more types of chemical liquid to the upper nozzle unit 5A. Similarly, the second liquid supply units 13b1 and 13b2 may be configured to be able to supply two or three or more types of chemical liquid to the lower nozzle unit 5B.

[0326] Furthermore, in the third embodiment, the plurality of processing cups 6 include two first processing cups 61, but the number of first processing cups 61 is not limited to two. For example, the plurality of processing cups 6 may include one first processing cup 61, or three or more first processing cups 61. Specifically, in the third embodiment, the plurality of processing cups 6 include two immersion tanks 61b, but the plurality of processing cups 6 may include one immersion tank 61b, or three or more immersion tanks 61b.

[0327] Furthermore, in the third embodiment, the plurality of processing cup units 6 include two second processing cup units 62, but the number of second processing cup units 62 is not limited to two. For example, the plurality of processing cup units 6 may include one second processing cup unit 62, or three or more second processing cup units 62. Specifically, in the third embodiment, the plurality of processing cup units 6 include one rinse cup unit 62a and one rinse-drying cup unit 62b, but the plurality of processing cup units 6 may include only one rinse-drying cup unit 62b as the second processing cup unit 62. Alternatively, the plurality of processing cup units 6 may include two or more rinse cup units 62a and one rinse-drying cup unit 62b, or two or more rinse cup units 62a and two or more rinse-drying cup units 62b.

[0328] In addition, in the third embodiment, the first immersion tank 61b1 has the inner wall portion 613, but the inner wall portion 613 of the first immersion tank 61b1 may be omitted. In this case, one of the first drainage portion 14b1 and the second drainage portion 15b1 may be omitted.

[0329] Similarly, in the third embodiment, the second immersion tank 61b2 has the inner wall portion 613, but the inner wall portion 613 of the second immersion tank 61b2 may be omitted. In this case, one of the first drainage portion 14b2 and the second drainage portion 15b2 may be omitted.

[0330] Furthermore, in embodiment 3, when the rinsing process is performed inside the rinse cup portion 62a, the substrate W is not immersed in the rinsing liquid, but as described with reference to Figure 17, the rinsing process may include a step of immersing the substrate W in the rinsing liquid.

[0331] Similarly, in embodiment 3, when the rinsing process was performed inside the rinse drying cup portion 62b, the substrate W was not immersed in the rinsing liquid, but as described with reference to Figure 17, the rinsing process may include a step of immersing the substrate W in the rinsing liquid.

[0332] In the third embodiment, the rinse cup portion 62a does not have the inner wall portion 613, but the rinse cup portion 62a may have the inner wall portion 613. Similarly, the rinse-drying cup portion 62b may have the inner wall portion 613.

[0333] In addition, in embodiment 3, the first processing block PB1 and the second processing block PB2 are not provided with a mounting table 7, but as in the embodiment described with reference to Figures 1 to 22, each of the first processing block PB1 and the second processing block PB2 may have a mounting table 7.

[0334] In addition, in the third embodiment, the first processing block PB1 and the second processing block PB2 are not provided with a cleaning unit CU, but each of the first processing block PB1 and the second processing block PB2 may have a cleaning unit CU, as in the second embodiment. That is, the plurality of processing cups 6 may include a cleaning tank 63. Alternatively, the plurality of upper chuck members 31 may be cleaned in the rinse cup portion 62a or the rinse-dry cup portion 62b.

[0335] [Variation 4] Next, the substrate processing apparatus 100 of Modification 4 will be described with reference to Figures 34(a) to 34(f). However, differences from the embodiment described with reference to Figures 1 to 33 will be described, and a description of the same aspects as the embodiment described with reference to Figures 1 to 33 will be omitted. Figures 34(a) to 34(f) are diagrams schematically showing an example of the operation of the substrate processing apparatus 100 of Modification 4. In detail, Figures 34(a) to 34(f) show an example of the operation of the first processing block PB1 when the first processing block PB1 processes one substrate W.

[0336] 25 to 33, the processing cup units 6 include a rinse cup unit 62a and a rinse-dry cup unit 62b, but the rinse cup unit 62a may be omitted. Also, in the embodiment described with reference to Figures 25 to 33, the processing cup units 6 include two immersion tanks 61b, but the processing cup units 6 may include three or more immersion tanks 61b.

[0337] In Modification 4, as shown in Figure 34(a), the multiple processing cup units 6 include three immersion tanks 61b (first immersion tank 61b1 to third immersion tank 61b3) and one rinse-dry cup unit 62b. Hereinafter, using the configuration shown in Figures 34(a) to 34(f) as an example, an example of the operation of the substrate processing apparatus 100 when the multiple processing cup units 6 include one rinse-dry cup unit 62b (second processing cup unit 62) will be described.

[0338] 34(a), the control unit 102 causes the upper substrate holding unit 2A to hold the substrate W that has been carried into the first processing block PB1 by the transport robot TR. Then, the control unit 102 causes the substrate W to be immersed in the first chemical liquid in the first immersion tank 61b1.

[0339] 34(b), when a predetermined time (predetermined first chemical liquid processing time) has elapsed since the substrate W was immersed in the first chemical liquid, the control unit 102 moves the substrate W from the first immersion tank 61b1 to the rinse-dry cup unit 62b. Then, while rotating the substrate W, the control unit 102 causes the upper nozzle unit 5A and the lower nozzle unit 5B of the rinse-dry cup unit 62b to eject a rinse liquid, thereby performing a rinse process on the substrate W after the first chemical liquid processing inside the rinse-dry cup unit 62b.

[0340] As shown in Figure 34(c), when a predetermined time (predetermined rinse processing time) has elapsed since starting the rinse processing on the substrate W after the first chemical liquid processing, the control unit 102 terminates the rinse processing and immerses the rinsed substrate W from the rinse drying cup section 62b into the second chemical liquid in the second immersion tank 61b2.

[0341] 34(d), when a predetermined time (predetermined second chemical liquid processing time) has elapsed since the substrate W was immersed in the second chemical liquid, the control unit 102 moves the substrate W from the second immersion tank 61b2 to the rinse-dry cup unit 62b. Then, while rotating the substrate W, the control unit 102 causes the upper nozzle unit 5A and the lower nozzle unit 5B of the rinse-dry cup unit 62b to eject a rinse liquid, thereby performing a rinse process on the substrate W after the second chemical liquid processing inside the rinse-dry cup unit 62b.

[0342] As shown in Figure 34(e), when a predetermined time (predetermined rinse processing time) has elapsed since starting the rinse processing on the substrate W after the second chemical liquid processing, the control unit 102 terminates the rinse processing and immerses the rinsed substrate W from the rinse drying cup section 62b into the third chemical liquid in the third immersion tank 61b3.

[0343] 34(f), when a predetermined time (predetermined third chemical liquid processing time) has elapsed since the substrate W was immersed in the third chemical liquid, the control unit 102 moves the substrate W from the third immersion tank 61b3 to the rinse-dry cup unit 62b. Then, while rotating the substrate W, the control unit 102 causes the upper nozzle unit 5A and the lower nozzle unit 5B of the rinse-dry cup unit 62b to eject a rinse liquid, thereby performing a rinse process on the substrate W after the third chemical liquid processing inside the rinse-dry cup unit 62b.

[0344] When a predetermined time (predetermined rinse time) has elapsed since the start of the rinse process on the substrate W after the third chemical liquid process, the control unit 102 ends the rinse process and performs a drying process inside the rinse-dry cup unit 62b.

[0345] The substrate processing apparatus 100 of Modification 4 has been described above with reference to Fig. 34. According to Modification 4, a larger number of immersion tanks 61b can be arranged in a limited space. Therefore, substrates W can be processed using three or more types of chemical solutions.

[0346] [Variation 5] Next, the substrate processing apparatus 100 of Modification 5 will be described with reference to Figures 35(a) to 35(f). However, only differences from the embodiment described with reference to Figures 1 to 33 and 34(a) to 34(f) will be described, and descriptions of the same aspects as the embodiment described with reference to Figures 1 to 33 and 34(a) to 34(f) will be omitted. Figures 35(a) to 35(f) are diagrams schematically showing an example of the operation of the substrate processing apparatus 100 of Modification 5. In detail, Figures 35(a) to 35(f) show an example of the operation of the first processing block PB1 when the first processing block PB1 processes one substrate W.

[0347] In the embodiment described with reference to Figures 25 to 33 and 34(a) to 34(f), the immersion tank 61b and the rinse cup section 62a are not provided with the support section 614, but the immersion tank 61b and the rinse cup section 62a may have the support section 614. Below, using the configuration shown in Figures 35(a) to 35(f) as an example, an example of the operation of the substrate processing apparatus 100 when the first immersion tank 61b1, the rinse cup section 62a, and the second immersion tank 61b2 are provided with the support section 614 will be described.

[0348] In Modification 5, the first processing cup 61 has a support portion 614. Of the second processing cups 62, the second processing cup 62 sandwiched between the first processing cups 61 has the support portion 614. In other words, all second processing cups 62 except for the second processing cup 62 arranged at the rearmost position among the multiple processing cups 6 have the support portion 614. However, each second processing cup 62 may have the support portion 614. In the example shown in FIGS. 35(a) to 35(f), the first immersion tank 61b1, the rinse cup 62a, and the second immersion tank 61b2 have the support portion 614. In this case, as shown in FIG. 35(a), the control unit 102 immerses the first substrate W1 in the first chemical liquid in the first immersion tank 61b1 and then leaves the first substrate W1 in the first chemical liquid in the first immersion tank 61b1.

[0349] Specifically, as described with reference to FIG. 27, the control unit 102 submerges the first substrate W1 in the first chemical solution while rotating the first substrate W1. Then, the control unit 102 controls the upper rotation unit 4 (upper motor main body 42) to stop the rotation of the first substrate W1 before the first substrate W1 contacts the upper surfaces of the multiple supports 614 in the first immersion tank 61b1. After stopping the rotation of the first substrate W1, the control unit 102 controls the lifting mechanism 210A to lower the upper substrate holding unit 2A to the second processing position P3 described with reference to FIG. 12. As a result, the substrate W contacts the upper surfaces of the multiple supports 614. Thereafter, the control unit 102 performs a process similar to that described with reference to FIG. 13 to leave the first substrate W1 in the first chemical solution in the first immersion tank 61b1.

[0350] 35(b), when the time that has elapsed since the first substrate W1 was immersed in the first chemical liquid reaches or exceeds a predetermined time (predetermined first chemical liquid processing time), the control unit 102 causes the first substrate W1 to remain in the rinse liquid in the rinse cup portion 62a. Note that the rinse cup portion 62a may have an inner wall portion 613.

[0351] Specifically, the control unit 102 controls the moving unit 200A and the upper chuck driving mechanism 50 to cause the upper substrate holding unit 2A (upper holding unit 3) to hold the first substrate W1. Then, the control unit 102 performs a lifting process to lift the first substrate W1 from the first chemical solution while rotating the first substrate W1. More specifically, the control unit 102 controls the upper chuck driving mechanism 50 to cause the upper chuck members 31 to grip the first substrate W1, which is supported by the supports 614 of the first immersion tank 61b1. Then, the control unit 102 controls the lifting mechanism 210A to lift the upper substrate holding unit 2A, and after the first substrate W1 has separated from the upper surfaces of the supports 614 of the first immersion tank 61b1, controls the upper rotation unit 4 (upper motor main body 42) to rotate the first substrate W1.

[0352] The control unit 102 moves the upper substrate holding unit 2A to a facing position P1 in the first immersion tank 61b1, and then controls the moving unit 200A to move the first substrate W1 to a position inside the rinse cup unit 62a. Specifically, the control unit 102 moves the upper substrate holding unit 2A to a facing position P1 of the rinse cup unit 62a, and then lowers the upper substrate holding unit 2A to the first processing position P2 described with reference to FIG. 10. Then, similar to the processing described with reference to FIGS. 16 and 17, the control unit 102 ejects a rinse liquid from the upper nozzle unit 5A and the lower nozzle unit 5B of the rinse cup unit 62a toward the rotating first substrate W1. As a result, the first substrate W1 is immersed in the rinse liquid (first and second steps of the rinse processing).

[0353] 16 and 17, the control unit 102 immerses the first substrate W1 in the rinse liquid and then controls the upper rotation unit 4 (upper motor main body 42) to stop the rotation of the substrate W. The control unit 102 then lowers the upper substrate holding unit 2A to the second processing position P3 described with reference to FIG. 12. As a result, the first substrate W1 comes into contact with the upper surface of the support portion 614 of the rinse cup unit 62a. Thereafter, the control unit 102 executes a process similar to that described with reference to FIG. 13, thereby leaving the first substrate W1 in the rinse liquid in the rinse cup unit 62a.

[0354] As shown in Figure 35(c), after the control unit 102 leaves the first substrate W1 in the rinse cup section 62a, it performs a process similar to the process performed when leaving the first substrate W1 in the first chemical liquid in the first immersion tank 61b1, thereby leaving the second substrate W2 in the first chemical liquid in the first immersion tank 61b1.

[0355] As shown in FIG. 35(d), after the control unit 102 leaves the second substrate W2 in the first chemical liquid in the first immersion tank 61b1, it controls the moving unit 200A and the upper chuck driving mechanism 50 to cause the upper substrate holding unit 2A (upper holding unit 3) to hold the first substrate W1. Then, the control unit 102 controls the lifting mechanism 210A to raise the upper substrate holding unit 2A and release the first substrate W1 from the upper surface of the support unit 614 of the rinse cup unit 62a, and then switches the opening / closing valve 145c of the drain unit 14c from the closed state to the open state. As a result, the rinse liquid is discharged from the rinse cup unit 62a. For example, the control unit 102 may discharge the rinse liquid after raising the upper substrate holding unit 2A from the second processing position P3 to the first processing position P2 described with reference to FIG. 10.

[0356] While the rinsing liquid is being discharged, the control unit 102 rotates the first substrate W1 and causes the upper nozzle unit 5A and the lower nozzle unit 5B of the rinse cup unit 62a to discharge the rinsing liquid. This process prevents the first substrate W1 from drying, thereby preventing pattern collapse and particle generation.

[0357] After discharging the rinsing liquid, the control unit 102 raises the upper substrate holding part 2A to the third processing position P4 (see FIG. 29) while continuing to discharge the rinsing liquid and rotate the first substrate W1. Then, as described with reference to FIG. 29, the control unit 102 performs the rinsing process (third step of the rinsing process). Note that the control unit 102 may perform the rinsing process while maintaining the position of the upper substrate holding part 2A at the first processing position P2.

[0358] As shown in Figure 35(e), when the time that has elapsed since the start of the third step of the rinsing process reaches or exceeds a predetermined time, the control unit 102 performs a process similar to the process that was performed when the first substrate W1 was left in the first chemical liquid in the first immersion tank 61b1, thereby leaving the first substrate W1 in the second chemical liquid in the second immersion tank 61b2.

[0359] As shown in Figure 35(f), after the control unit 102 has left the first substrate W1 in the second chemical liquid in the second immersion tank 61b2, when the time that has elapsed since the second substrate W2 was immersed in the first chemical liquid becomes equal to or greater than a predetermined time (predetermined first chemical liquid processing time), the control unit 102 leaves the second substrate W2 in the rinse liquid in the rinse cup unit 62a by performing a process similar to the process that left the first substrate W1 in the rinse liquid in the rinse cup unit 62a.

[0360] After the second substrate W2 is left in the rinse liquid in the rinse cup section 62a, when the time that has elapsed since the first substrate W1 was immersed in the second chemical liquid reaches or exceeds a predetermined time (predetermined second chemical liquid treatment time), the control section 102 moves the first substrate W1 from the second immersion tank 61b2 to the rinse and dry cup section 62b, where the first substrate W1 is subjected to rinsing and drying treatments. After drying the first substrate W1, the control section 102 unloads the first substrate W1 from the first treatment block PB1. Thereafter, the control section 102 processes the second substrate W2 in the same manner as the first substrate W1, and unloads the second substrate W2 from the first treatment block PB1.

[0361] Modification 5 has been described above with reference to Figures 35(a) to 35(f). According to Modification 5, processing of the next substrate W can be started before processing of one substrate W is completed. This makes it possible to reduce the waiting time for the timing to start chemical liquid processing.

[0362] [Variation 6] Next, the substrate processing apparatus 100 of Modification 6 will be described with reference to Figures 36(a) to 36(d). However, only differences from the embodiment described with reference to Figures 1 to 33, Figures 34(a) to 34(f), and Figures 35(a) to 35(f) will be described, and descriptions of the same aspects as the embodiment described with reference to Figures 1 to 33, Figures 34(a) to 34(f), and Figures 35(a) to 35(f) will be omitted. Figures 36(a) to 36(d) are diagrams schematically illustrating an example of the operation of the substrate processing apparatus 100 of Modification 6. In detail, Figures 36(a) to 36(d) illustrate an example of the operation of the first processing block PB1 when the first processing block PB1 processes one substrate W.

[0363] In the sixth modification, the processing cups 6 include three immersion tanks 61b (first immersion tank 61b1 to third immersion tank 61b3) and one rinse-drying cup 62b, similar to the fourth modification. Also, in the sixth modification, each of the three immersion tanks 61b (first immersion tank 61b1 to third immersion tank 61b3) has a plurality of support portions 614.

[0364] 36(a), in Modification 6, the first to third immersion tanks 61b1 to 61b3 each have a support portion 614, so that the first to third substrates W1 to W3 can be left in the first to third immersion tanks 61b1 to 61b3, respectively. Therefore, the first to third substrates W1 to W3 can be immersed in the chemical solution in parallel. The chemical solutions stored in the first to third immersion tanks 61b1 to 61b3 may be the same type of chemical solution, or different types of chemical solution.

[0365] As shown in Figure 36(b), in variant example 6, when the time that has elapsed since the first substrate W1 was immersed in the chemical solution in the first immersion tank 61b1 becomes equal to or greater than a predetermined time (predetermined chemical solution processing time), the control unit 102 moves the first substrate W1 from the first immersion tank 61b1 to the rinse-dry cup section 62b, performs rinsing and drying processes on the first substrate W1, and then transports the first substrate W1 out of the first processing block PB1.

[0366] Similarly, when the time that has elapsed since the second substrate W2 was immersed in the chemical solution in the second immersion tank 61b2 reaches or exceeds a predetermined time (predetermined chemical solution treatment time), the control unit 102 moves the second substrate W2 from the second immersion tank 61b2 to the rinse-dry cup unit 62b, performs rinsing and drying treatments on the second substrate W2, and then unloads the second substrate W2 from the first processing block PB1, as shown in Fig. 36(c). Furthermore, when the time that has elapsed since the third substrate W3 was immersed in the chemical solution in the third immersion tank 61b3 reaches or exceeds a predetermined time (predetermined chemical solution treatment time), the control unit 102 moves the third substrate W3 from the third immersion tank 61b3 to the rinse-dry cup unit 62b, performs rinsing and drying treatments on the third substrate W3, and then unloads the third substrate W3 from the first processing block PB1, as shown in Fig. 36(d).

[0367] Modification 6 has been described above with reference to Figures 36(a) to 36(d). According to Modification 6, chemical liquid processing can be performed in parallel on a plurality of substrates W. This reduces the wait time for the timing to start chemical liquid processing.

[0368] [Variation 7] Next, the substrate processing apparatus 100 of Modification 7 will be described with reference to Figure 37. However, only differences from the embodiment described with reference to Figures 1 to 33, Figures 34(a) to 34(f), Figures 35(a) to 35(f), and Figures 36(a) to 36(d) will be described, and descriptions of the same aspects as the embodiment described with reference to Figures 1 to 33, Figures 34(a) to 34(f), Figures 35(a) to 35(f), and Figures 36(a) to 36(d) will be omitted. Figure 37 is a schematic plan view of the substrate processing apparatus 100 of Modification 7.

[0369] In the embodiment described with reference to Figures 1 to 33, each of the first processing block PB1 and the second processing block PB2 is provided with one set of processing cup sections 6 corresponding to the processing procedure for the substrate W, but each of the first processing block PB1 and the second processing block PB2 may be provided with multiple sets of processing cup sections 6 corresponding to the processing procedure for the substrate W.

[0370] 37, each of the first processing block PB1 and the second processing block PB2 is provided with two sets of processing cups 6 corresponding to the processing procedures for the substrate W. Specifically, in the seventh modification, one set of processing cups 6 includes one immersion bath 61b and one rinse-dry cup 62b. Then, using one set of processing cups 6, chemical processing, rinsing processing, and drying processing are performed on the substrate W in this order. The processing cups 6 in each set are arranged in accordance with the processing procedures for the substrate W, as described with reference to FIGS. 25 to 33.

[0371] Specifically, the processing cups 6 include two immersion tanks 61b (a first immersion tank 61b1 and a second immersion tank 61b2) and two rinse-dry cups 62b (a first rinse-dry cup 62b1 and a second rinse-dry cup 62b2). The immersion tanks 61b and the rinse-dry cups 62b are arranged alternately in a first direction D1 (front-rear direction).

[0372] Furthermore, when multiple sets of processing cup sections 6 corresponding to the processing procedures for substrates W are provided, a substrate W loading entrance and a substrate W unloading exit are provided for each set of processing cup sections 6. In Modification 7, a substrate W loading entrance is provided at each position adjacent to each immersion tank 61b. Similarly, a substrate W unloading exit is provided at each position adjacent to each rinse-dry cup section 62b. In other words, the side wall 91 of the first processing block PB1 has two loading entrances and two unloading exits. Similarly, the side wall 91 of the second processing block PB2 has two loading entrances and two unloading exits.

[0373] Furthermore, when multiple sets of processing cups 6 corresponding to the processing procedures for substrates W are provided, an upper substrate holding part 2A may be provided for each set of processing cups 6. In Modification 7, the first processing block PB1 and the second processing block PB2 each have two upper substrate holding parts 2A. More specifically, the first processing block PB1 and the second processing block PB2 each have two upper substrate holding parts 2A, rail members 8 corresponding to each upper substrate holding part 2A, and moving parts 200A corresponding to each upper substrate holding part 2A.

[0374] Each of the first processing block PB1 and the second processing block PB2 has a plurality of sets of processing cups 6 corresponding to the processing procedures for the substrates W, and an upper substrate holder 2A corresponding to each set of processing cups 6, so that each of the first processing block PB1 and the second processing block PB2 can process a plurality of substrates W in parallel. For example, according to Modification 7, each of the first processing block PB1 and the second processing block PB2 can process two substrates W in parallel.

[0375] [Variation 8] Next, the substrate processing apparatus 100 of Modified Example 8 will be described with reference to Fig. 38. However, only differences from the embodiment described with reference to Figs. 1 to 37 will be described, and a description of the same matters as in the embodiment described with reference to Figs. 1 to 37 will be omitted. Fig. 38 is a schematic plan view of the substrate processing apparatus 100 of Modified Example 8.

[0376] 25 to 37, each of the first processing block PB1 and the second processing block PB2 has a first upper substrate holding part 2A1 and a second upper substrate holding part 2A2. The second upper substrate holding part 2A2 holds the substrate W when the final rinsing process and drying process included in the processing procedure for the substrate W are performed.

[0377] In detail, the first processing block PB1 and the second processing block PB2 each have a first upper substrate holding part 2A1, a rail member 81 corresponding to the first upper substrate holding part 2A1, a first moving part 200A1 corresponding to the first upper substrate holding part 2A1, a second upper substrate holding part 2A2, a rail member 82 corresponding to the second upper substrate holding part 2A2, and a second moving part 200A2 corresponding to the second upper substrate holding part 2A2.

[0378] Like the moving section 200A, the first moving section 200A1 includes a support arm 201A, a lifting mechanism 210A, and a moving mechanism 220A. The support arm 201A and the lifting mechanism 210A of the first moving section 200A1 are guided in the first direction D1 by a rail member 81. The configuration of the first moving section 200A1 is similar to the configuration of the moving section 200A described with reference to FIGS. 1, 3, and 4, and therefore a detailed description thereof will be omitted. Similarly, the configuration of the rail member 81 is similar to the configuration of the rail member 8 described with reference to FIGS. 1, 3, and 4, and therefore a detailed description thereof will be omitted.

[0379] Similar to the moving section 200A, the second moving section 200A2 includes a support arm 201A, a lifting mechanism 210A, and a moving mechanism 220A. The support arm 201A and the lifting mechanism 210A of the second moving section 200A2 are guided in the first direction D1 by a rail member 82. The configuration of the second moving section 200A2 is similar to the configuration of the moving section 200A described with reference to FIGS. 1, 3, and 4, and therefore a detailed description thereof will be omitted. Similarly, the configuration of the rail member 82 is similar to the configuration of the rail member 8 described with reference to FIGS. 1, 3, and 4, and therefore a detailed description thereof will be omitted.

[0380] In Modification 8, as described with reference to FIGS. 25 to 33, a plurality of first processing cup parts 61 and a plurality of second processing cup parts 62 are arranged in the first direction D1 (front-rear direction) in accordance with the processing procedure for the substrate W.

[0381] Specifically, in Modification 8, the multiple processing cup sections 6 include three immersion tanks 61b (first immersion tank 61b1 to third immersion tank 61b3), two rinse cup sections 62a (first rinse cup section 62a1 and second rinse cup section 62a2), and one rinse-dry cup section 62b. The first immersion tanks 61b1 to third immersion tank 61b3, the first rinse cup section 62a1 and second rinse cup section 62a2, and rinse-dry cup section 62b are arranged in the following order: first immersion tank 61b1, first rinse cup section 62a1, second immersion tank 61b2, second rinse cup section 62a2, third immersion tank 61b3, and rinse-dry cup section 62b. The first immersion tanks 61b1 to third immersion tanks 61b3 store first to third chemical liquids, respectively.

[0382] In Modification 8, the substrate W is subjected to a first chemical liquid treatment, a rinse treatment, a second chemical liquid treatment, a rinse treatment, a third chemical liquid treatment, a rinse treatment, and a drying treatment in this order. In the third immersion tank 61b3, the treatment just before the final rinse treatment (third chemical liquid treatment) is performed. In the rinse-dry cup section 62b, the final rinse treatment and a drying treatment are performed. The third immersion tank 61b3 is an example of a "third treatment cup section." The rinse-dry cup section 62b is an example of a "fourth treatment cup section."

[0383] The first upper substrate holding part 2A1 is movable between respective opposing positions P1 of the first immersion tank 61b1, the first rinse cup part 62a1, the second immersion tank 61b2, the second rinse cup part 62a2, and the third immersion tank 61b3. The movement mechanism 220A of the first moving part 200A1 moves the first upper substrate holding part 2A1 between respective opposing positions P1 of the first immersion tank 61b1, the first rinse cup part 62a1, the second immersion tank 61b2, the second rinse cup part 62a2, and the third immersion tank 61b3.

[0384] The second upper substrate holding part 2A2 is movable between a position P1 facing the third immersion tank 61b3 and a position P1 facing the rinse-dry cup part 62b. The movement mechanism 220A of the second moving part 200A2 moves the second upper substrate holding part 2A2 between the position P1 facing the third immersion tank 61b3 and the position P1 facing the rinse-dry cup part 62b.

[0385] According to Modification 8, the plurality of upper chuck members 31 of the second upper substrate holding part 2A2 do not come into contact with the first chemical liquid or the second chemical liquid, but only with the third chemical liquid. This reduces the possibility that another chemical liquid (the first chemical liquid or the second chemical liquid) will adhere to the substrate W after the third chemical liquid processing, causing the third chemical liquid and the other chemical liquid to mix on the substrate W. This reduces the possibility that the substrate W will be contaminated.

[0386] [Variation 9] Next, a substrate processing apparatus 100 according to Modification 9 will be described with reference to Figure 39. However, only differences from the embodiment described with reference to Figures 1 to 38 will be described, and a description of the same aspects as the embodiment described with reference to Figures 1 to 38 will be omitted. Modification 9 differs from the embodiment described with reference to Figures 25 to 38 in that a lower brush 616 is provided in the immersion tank 61b.

[0387] Fig. 39 is a cross-sectional view schematically showing the configuration of a first processing block PB1 included in the substrate processing apparatus 100 of Modification 9. In detail, Fig. 39 shows the configuration of a first substrate processing unit PU1.

[0388] 39, the first immersion tank 61b1 may have a lower brush 616. The lower brush 616 comes into contact with the lower surface Wb of the substrate W to clean the lower surface Wb of the substrate W. The lower brush 616 is an example of a "lower brush member."

[0389] Specifically, the lower brush 616 is fixed to the upper surface of the bottom wall 611 of the first immersion tank 61b1. The lower brush 616 comes into contact with the lower surface Wb of the substrate W to clean the lower surface Wb of the substrate W while the substrate W is immersed in the processing liquid stored in the first immersion tank 61b1.

[0390] The lower brush 616 may include, for example, a porous material such as a sponge. Alternatively, the lower brush 616 may include, for example, a resin such as polyvinyl alcohol (PVA). Alternatively, the lower brush 616 may be configured by combining a plurality of members. Alternatively, the lower brush 616 may include a plurality of bristles.

[0391] The shape of the lower brush 616 is not particularly limited. For example, the lower brush 616 may be strip-shaped or linear in plan view. In this case, the lower brush 616 may extend from the center of the bottom wall portion 611 toward the outside in the radial direction of the bottom wall portion 611. Alternatively, the lower brush 616 may be approximately fan-shaped in plan view. In this case, the pivot point of the fan may be located at the center of the bottom wall portion 611. Alternatively, the lower brush 616 may be circular in plan view.

[0392] When the lower surface Wb of the substrate W is cleaned by the lower brush 616, the control unit 102 controls the lifting mechanism 210A to lower the upper substrate holding unit 2A to a position where the lower surface Wb of the substrate W comes into contact with the lower brush 616. Then, the control unit 102 controls the upper rotation unit 4 (upper motor main body 42) to rotate the upper spin base 32, thereby rotating the substrate W. As a result, the substrate W in contact with the lower brush 616 rotates, and the lower surface Wb of the substrate W is cleaned by the lower brush 616.

[0393] The processing liquid stored in the first immersion tank 61b1 when the substrate W is cleaned by the lower brush 616 may be the first chemical liquid or a rinse liquid.

[0394] Modification 9 has been described above with reference to Fig. 39. According to Modification 9, the lower surface Wb of the substrate W can be cleaned by the lower brush 616. Note that, with reference to Fig. 39, a configuration in which the lower surface Wb of the substrate W is cleaned by the lower brush 616 has been described using the first immersion tank 61b1 as an example, but if the substrate processing apparatus 100 is provided with multiple immersion tanks 61b, each immersion tank 61b may have the lower brush 616, or at least one of the multiple immersion tanks 61b may have the lower brush 616. The same applies to other embodiments.

[0395] [Variation 10] Next, a substrate processing apparatus 100 according to Modification 10 will be described with reference to Figures 40 to 42. However, differences from the embodiment described with reference to Figures 1 to 39 will be described, and a description of the same aspects as in the embodiment described with reference to Figures 1 to 39 will be omitted. Modification 10 differs from the embodiment described with reference to Figures 25 to 39 in that an exhaust shutoff unit 71 is provided in each of the first processing block PB1 and the second processing block PB2.

[0396] Fig. 40 is a schematic plan view of a substrate processing apparatus 100 of Modification 10. Fig. 41 is a block diagram of the substrate processing apparatus 100 of Modification 10. As shown in Fig. 40, each of the first processing block PB1 and the second processing block PB2 includes a processing chamber 9, an upper substrate holding part 2A, an exhaust blocking part 71, a first substrate processing unit PU1 to a fourth substrate processing unit PU4, a moving part 200A, a moving part 200B, a rail member 81, and a rail member 83.

[0397] The moving section 200B has a support arm 201B. The support arm 201B supports the exhaust cutoff section 71. As shown in Fig. 41, the moving section 200B has a lifting mechanism 210B and a moving mechanism 220B, similar to the moving section 200A. The configurations of the lifting mechanism 210B and the moving mechanism 220B are the same as those of the lifting mechanism 210A and the moving mechanism 220A, and therefore detailed description thereof will be omitted.

[0398] 1, 3, and 4, rail member 81 guides lifting mechanism 210A coupled to support arm 201A in first direction D1 (front-rear direction). Similarly, rail member 83 guides lifting mechanism 210B coupled to support arm 201B in first direction D1 (front-rear direction). The configuration of rail member 83 is similar to the configuration of rail member 8 described with reference to FIGS. 1, 3, and 4, and therefore detailed description thereof will be omitted.

[0399] When the upper substrate holding unit 2A is moved in the first direction D1, the positions of the support arm 201A and the support arm 201B in the vertical direction are different from each other. Similarly, when the exhaust cutoff unit 71 is moved in the first direction D1, the positions of the support arm 201A and the support arm 201B in the vertical direction are different from each other. Therefore, it is possible to prevent the support arm 201A and the support arm 201B from interfering with each other.

[0400] Fig. 42 is a cross-sectional view schematically showing the configuration of the first processing block PB1 included in the substrate processing apparatus 100 of Modification 10. In detail, Fig. 42 shows a cross section of the moving section 200A, part of the moving section 200B, the exhaust blocking section 71, and the first immersion tank 61b1 as viewed from the front side.

[0401] 42, in Modification 10, the first substrate processing unit PU1 further includes a heater 615 for heating the processing liquid. The heater 615 heats the first chemical liquid in the first immersion bath 61b1.

[0402] Specifically, the heater 615 may heat the first immersion tank 61b1, thereby heating the first chemical liquid stored in the first immersion tank 61b1. For example, the heater 615 may be disposed inside the bottom wall portion 611 of the first immersion tank 61b1. The heater 615 may be disposed so as to surround the lower nozzle portion 5B.

[0403] The control unit 102 controls the heater 615 to heat the first chemical liquid in the first immersion tank 61b1 to a predetermined temperature. Specifically, the control unit 102 controls the on / off of the heater 615 to maintain the first chemical liquid in the first immersion tank 61b1 at a predetermined temperature.

[0404] By providing the heater 615, it is possible to prevent the temperature of the first chemical liquid in the first immersion tank 61b1 from decreasing. Therefore, even when performing immersion treatment for a long period of time, it is possible to prevent the temperature of the first chemical liquid from decreasing. Furthermore, by heating the first chemical liquid in the first immersion tank 61b1 to a predetermined temperature, it is possible to treat the substrates W with the first chemical liquid at a constant temperature, for example.

[0405] The exhaust cutoff part 71 is cylindrical. The exhaust cutoff part 71 is an example of a "cylindrical member." The exhaust cutoff part 71 extends in the vertical direction. For example, the exhaust cutoff part 71 is cylindrical. When the substrate W is immersed in the first chemical liquid in the first immersion tank 61b1, the exhaust cutoff part 71 is located in the gap between the inner peripheral edge 612c of the first immersion tank 61b1 and the upper spin base 32. The inner peripheral edge 612c of the first immersion tank 61b1 forms an upper opening of the first immersion tank 61b1. The inner peripheral edge 612c of the first immersion tank 61b1 is formed by the upper end of the side wall part 612.

[0406] Before immersing the substrate W in the first chemical liquid in the first immersion tank 61b1, the control unit 102 controls the moving unit 200B to move the exhaust cutoff unit 71 into the first immersion tank 61b1. Thereafter, the control unit 102 controls the moving unit 200A to move the upper substrate holder 2A to the fourth processing position P6 (see FIG. 26), thereby immersing the substrate W in the first chemical liquid in the first immersion tank 61b1. As a result, when the substrate W is immersed in the first chemical liquid in the first immersion tank 61b1, the exhaust cutoff unit 71 is positioned in the gap between the inner periphery 612c of the first immersion tank 61b1 and the upper spin base 32.

[0407] Specifically, the diameter of the exhaust gas blocking portion 71 is larger than the diameter of the upper spin base 32 and smaller than the diameter of the upper end (inner peripheral edge portion 612c) of the side wall portion 612. In the tenth modification, the diameter of the exhaust gas blocking portion 71 is smaller than the diameter of the upper end of the inner wall portion 613.

[0408] The vertical dimension of the exhaust gas blocking portion 71 is larger than the vertical dimension of the gap SP formed between the upper end (inner peripheral edge portion 612c) of the side wall portion 612 and the upper end of the inner wall portion 613. The control portion 102 controls the moving portion 200B to move the exhaust gas blocking portion 71 to a position that covers the gap SP.

[0409] Modification 10 has been described above with reference to FIGS. 40 to 42 . According to Modification 10, gap SP is covered by exhaust gas blocking unit 71 during chemical treatment, thereby preventing a decrease in the temperature of the chemical solution stored inside inner wall portion 613. Specifically, when gap SP is open, gas in the space above the surface of the chemical solution stored inside inner wall portion 613 is drawn into gap SP by exhaust unit 17. As a result, the airflow drawn into gap SP may cause a decrease in the temperature of the chemical solution stored inside inner wall portion 613. In contrast, according to Modification 10, exhaust gas blocking unit 71 covers gap SP, making it difficult for airflow to be drawn into gap SP. Alternatively, the flow rate of the airflow drawn into gap SP can be reduced. Therefore, according to Modification 10, a decrease in the temperature of the chemical solution stored inside inner wall portion 613 can be prevented.

[0410] 42, the configuration for heating the processing liquid in the immersion tank 61b has been described using the configuration for heating the first chemical liquid in the first immersion tank 61b1 as an example, but when multiple immersion tanks 61b are provided, the substrate processing apparatus 100 may be provided with multiple heaters 615 corresponding to the multiple immersion tanks 61b, or may be provided with at least one heater 615 corresponding to at least one of the multiple immersion tanks 61b. The same applies to other embodiments.

[0411] [Variation 11] Next, the substrate processing apparatus 100 of Modification 11 will be described with reference to Figure 43. However, only differences from the embodiment described with reference to Figures 1 to 42 will be described, and a description of the same points as in the embodiment described with reference to Figures 1 to 42 will be omitted. Modification 11 differs from the embodiment described with reference to Figures 25 to 39 in that a support arm 201A supports an exhaust shutoff unit 71.

[0412] Fig. 43 is a cross-sectional view schematically showing the configuration of the first processing block PB1 included in the substrate processing apparatus 100 of Modification 11. In detail, Fig. 43 shows a cross section of the moving part 200A, the exhaust blocking part 71, and the first immersion tank 61b1 as viewed from the front side.

[0413] As shown in FIG. 43, in Modification 11, the exhaust blocker 71 is coupled to the support arm 201A. That is, the support arm 201A supports the exhaust blocker 71. The exhaust blocker 71 discharges downward from the support arm 201A. The exhaust blocker 71 is provided in a position surrounding the upper substrate holding part 2A. The exhaust blocker 71 covers the gap SP when the upper substrate holding part 2A is located at the fourth processing position P6 (see FIG. 26). Therefore, when the substrate W is immersed in the first chemical liquid in the first immersion tank 61b1, the gap SP is covered by the exhaust blocker 71.

[0414] Modification 11 has been described above with reference to Fig. 43. According to Modification 11, similarly to Modification 10, gap SP is covered by exhaust blocking portion 71 during chemical treatment, and therefore, a decrease in the temperature of the chemical stored inside inner wall portion 613 can be suppressed.

[0415] [Variation 12] Next, the substrate processing apparatus 100 of Modification 12 will be described with reference to Fig. 44. However, only the differences from the embodiment described with reference to Figs. 1 to 43 will be described, and a description of the same points as in the embodiment described with reference to Figs. 1 to 43 will be omitted. Modification 12 differs from the embodiment described with reference to Figs. 25 to 39 in the diameter of the upper spin base 32.

[0416] Fig. 44 is a cross-sectional view schematically showing the configuration of the first processing block PB1 included in the substrate processing apparatus 100 of Modification 12. In detail, Fig. 44 shows a cross section of the moving part 200A and the first immersion tank 61b1 as viewed from the front side.

[0417] As shown in FIG. 44, in Modification 12, the diameter of the upper spin base 32 is slightly smaller than the diameter of the upper end (inner peripheral edge 612c) of the side wall 612. The diameter of the upper spin base 32 is also slightly smaller than the diameter of the upper end of the inner wall 613. The vertical dimension of the side surface of the upper spin base 32 is larger than the vertical dimension of the gap SP. The side surface of the upper spin base 32 covers the gap SP when the upper substrate holder 2A is located at the fourth processing position P6 (see FIG. 26). Therefore, when the substrate W is immersed in the first chemical liquid in the first immersion bath 61b1, the gap SP is covered by the side surface of the upper spin base 32.

[0418] Modification 12 has been described above with reference to Fig. 44. According to Modification 12, the gap SP is covered by the side surface of the upper spin base 32 during chemical solution treatment, and therefore, a decrease in the temperature of the chemical solution stored inside the inner wall portion 613 can be suppressed.

[0419] [Variation 13] Next, the substrate processing apparatus 100 of Modification 13 will be described with reference to Figure 45. However, only the differences from the embodiment described with reference to Figures 1 to 44 will be described, and a description of the same points as in the embodiment described with reference to Figures 1 to 44 will be omitted. Modification 13 differs from the embodiment described with reference to Figures 25 to 44 in that the concentration of the processing liquid stored in the immersion tank 61b is adjusted.

[0420] Fig. 45 is a cross-sectional view schematically showing the configuration of a first processing block PB1 included in the substrate processing apparatus 100 of Modification 13. In detail, Fig. 45 shows the configuration of a first substrate processing unit PU1.

[0421] As shown in FIG. 45, in variant 13, second liquid supply section 13b1 further includes concentrate piping section 138 and fourth on-off valve 139. Concentrate piping section 138 is a tubular member through which a fluid flows. A concentrate of the first chemical liquid is supplied to the upstream end of concentrate piping section 138. The downstream end of concentrate piping section 138 is connected to common piping section 133. Fourth on-off valve 139 is provided in concentrate piping section 138. The configuration of fourth on-off valve 139 is similar to that of first on-off valve 135, and therefore a description thereof will be omitted.

[0422] When adjusting the concentration of the first chemical liquid in the first immersion tank 61b1, the control unit 102 switches the fourth on-off valve 139 from a closed state to an open state. As a result, an undiluted solution of the first chemical liquid is supplied from the lower nozzle unit 5B into the first immersion tank 61b1, and the concentration of the first chemical liquid in the first immersion tank 61b1 is adjusted. In the thirteenth modification, the second liquid supply unit 13b1 constitutes an "undiluted solution supply unit."

[0423] In addition, in Modification 13, the first substrate processing unit PU1 further includes a concentration detection unit 19. The concentration detection unit 19 detects the concentration of the first chemical liquid in the first immersion tank 61b1. The control unit 102 controls the second liquid supply unit 13b1 based on the concentration of the first chemical liquid detected by the concentration detection unit 19, thereby adjusting the concentration of the first chemical liquid in the first immersion tank 61b1.

[0424] Specifically, the concentration detection unit 19 has a common pipe 191, a drainage pipe 192, a recovery pipe 193, a first on-off valve 195, a second on-off valve 196, and a concentration sensor 197. Note that the configurations of the common pipe 191, the drainage pipe 192, the recovery pipe 193, the first on-off valve 195, and the second on-off valve 196 are similar to the configurations of the common pipe 141, the drainage pipe 142, the recovery pipe 143, the first on-off valve 145, and the second on-off valve 146 included in the first drainage unit 14b1, and therefore a description thereof will be omitted.

[0425] The concentration sensor 197 detects the concentration of the first chemical liquid in the first immersion tank 61b1. More specifically, the concentration sensor 197 is provided in the common piping section 191 and detects the concentration of the first chemical liquid flowing through the common piping section 191. The concentration sensor 197 transmits a signal indicating the detected concentration of the first chemical liquid to the control section 102. As a result, the control section 102 acquires the concentration of the first chemical liquid.

[0426] The control unit 102 executes a concentration detection process. The concentration detection process refers to a process of causing the concentration detection unit 19 to detect the concentration of the first chemical liquid. Specifically, the control unit 102 switches the first opening / closing valve 195 or the second opening / closing valve 196 from a closed state to an open state. As a result, the concentration of the first chemical liquid is detected by the concentration sensor 197. For example, the control unit 102 may execute the concentration detection process periodically. Alternatively, the control unit 102 may execute the concentration detection process based on an instruction from an operator. Note that the length of time during which the first opening / closing valve 195 or the second opening / closing valve 196 is kept open is set to a length of time that allows the concentration sensor 197 to detect the concentration. For example, the length of time during which the first opening / closing valve 195 or the second opening / closing valve 196 is kept open may be set in advance.

[0427] When the control unit 102 acquires the concentration of the first chemical liquid in the first immersion tank 61b1, the control unit 102 determines whether or not to execute a concentration adjustment process based on the acquired concentration of the first chemical liquid. When the control unit 102 determines to execute the concentration adjustment process, the control unit 102 controls the second liquid supply unit 13b1.

[0428] For example, when the concentration of the first chemical liquid is lower than a predetermined range, the control unit 102 determines to execute a concentration adjustment process and switches the fourth on-off valve 139 of the second liquid supply unit 13b1 from a closed state to an open state. As a result, the undiluted first chemical liquid is supplied to the first immersion tank 61b1, and the concentration of the first chemical liquid in the first immersion tank 61b1 increases. The control unit 102 may determine the length of time for which the fourth on-off valve 139 of the second liquid supply unit 13b1 is kept open, based on the concentration of the first chemical liquid obtained from the concentration sensor 197 (concentration detection unit 19).

[0429] Furthermore, if the concentration of the first chemical liquid is higher than the predetermined range, the control unit 102 determines to execute a concentration adjustment process, switches the second opening / closing valve 136 of the second liquid supply unit 13b1 from a closed state to an open state, and discharges DIW from the lower nozzle unit 5B. As a result, the concentration of the first chemical liquid in the first immersion tank 61b1 decreases. The control unit 102 may determine the length of time for which the second opening / closing valve 136 of the second liquid supply unit 13b1 is kept open, based on the concentration of the first chemical liquid obtained from the concentration sensor 197 (concentration detection unit 19).

[0430] In addition, when the control unit 102 performs the concentration adjustment process during a period when the upper substrate holding unit 2A is not holding a substrate W, it may control the moving unit 200A to immerse the multiple upper chuck members 31 in the first chemical liquid, and control the upper rotating unit 4 to rotate the multiple upper chuck members 31 in the first chemical liquid, thereby agitating the first chemical liquid in the first immersion tank 61b1.

[0431] Modification 13 has been described above with reference to Figure 45. According to Modification 13, the concentration of the chemical liquid in the immersion tank 61b can be maintained within a predetermined range, thereby enabling the substrates W to be processed with high precision.

[0432] Note that, with reference to Figure 45, a configuration for adjusting the concentration of the first chemical liquid in the first immersion tank 61b1 has been described; however, if the substrate processing apparatus 100 is provided with multiple immersion tanks 61b, a configuration for adjusting the concentration of the chemical liquid may be provided for each immersion tank 61b, or a configuration for adjusting the concentration of the chemical liquid may be provided for at least one immersion tank 61b among the multiple immersion tanks 61b.

[0433] [Embodiment 4] Next, a fourth embodiment of the present invention will be described with reference to Figures 46 to 52. However, differences from the embodiment described with reference to Figures 1 to 45 will be described, and a description of the same points as in the embodiment described with reference to Figures 1 to 45 will be omitted. The fourth embodiment differs from the embodiment described with reference to Figures 25 to 45 in the configuration of the fourth substrate processing unit PU4.

[0434] Fig. 46 is a cross-sectional view schematically showing the configuration of the first processing block PB1 included in the substrate processing apparatus 100 of Embodiment 4. In detail, Fig. 46 shows the configuration of the fourth substrate processing unit PU4.

[0435] 46, in the fourth embodiment, the first processing block PB1 further includes a first gas supply unit 16. The first gas supply unit 16 supplies gas to the upper nozzle unit 5A. The first gas supply unit 16 is controlled by the control unit 102.

[0436] The gas is, for example, an inert gas. The inert gas is, for example, nitrogen gas or argon gas. When the gas is supplied from the first gas supply unit 16 to the upper nozzle unit 5A, the gas is ejected from the upper nozzle unit 5A. Specifically, when drying the substrate W, the control unit 102 causes the gas to be ejected from the upper nozzle unit 5A toward the upper surface Wa of the substrate W.

[0437] The first gas supply unit 16 has a gas supply pipe 161 and an on-off valve 162. The gas supply pipe 161 is a tubular member through which a fluid flows. The on-off valve 162 is provided in the gas supply pipe 161. The on-off valve 162 can be opened and closed freely. The opening and closing operation of the on-off valve 162 is controlled by the control unit 102.

[0438] Gas is supplied to the upstream end of the gas supply pipe 161. The downstream end of the gas supply pipe 161 is connected to the upper nozzle section 5A. The on-off valve 162 opens and closes the flow path in the gas supply pipe 161. When the on-off valve 162 is opened, gas is supplied to the upper nozzle section 5A. As a result, gas is ejected from the upper nozzle section 5A. When the on-off valve 162 is closed, the flow of gas through the gas supply pipe 161 stops. As a result, the ejection of gas from the upper nozzle section 5A stops.

[0439] In the fourth embodiment, the fourth substrate processing unit PU4 includes a rinse-dry cup part 62c, a third liquid supply part 500, a second gas supply part 510, and a third drainage part 520. The rinse-dry cup part 62c includes a lower substrate holding part 2B and a cup part 621.

[0440] The lower substrate holding part 2B horizontally holds the substrate W. Furthermore, the lower substrate holding part 2B rotates the substrate W while holding the substrate W. The lower substrate holding part 2B is controlled by the control part 102.

[0441] In the fourth embodiment, the lower substrate holding part 2B has a clamping-type chuck mechanism. The lower substrate holding part 2B holds the substrate W by clamping an edge of the substrate W. Specifically, the lower substrate holding part 2B has a lower holding part 3B, a lower rotating part 4B, and a lower nozzle part 5B.

[0442] The lower holding unit 3B horizontally holds the substrate W. Specifically, the lower holding unit 3B has a plurality of lower chuck members 21 and a lower spin base 22. The lower spin base 22 is an example of a "lower base member."

[0443] The multiple lower chuck members 21 are provided on the lower spin base 22. Specifically, the lower spin base 22 is substantially disk-shaped and supports the multiple lower chuck members 21 in a horizontal position. The multiple lower chuck members 21 are arranged on the periphery of the lower spin base 22 and protrude upward from the lower spin base 22. The multiple lower chuck members 21 grip the substrate W above the lower spin base 22. Therefore, the substrate W is held horizontally above the lower spin base 22.

[0444] More specifically, the plurality of lower chuck members 21 grip the peripheral edge of the substrate W. The plurality of lower chuck members 21 grip the substrate W, thereby holding the substrate W horizontally. The operation of the plurality of lower chuck members 21 is controlled by the control unit 102. The lower chuck members 21 are an example of a "lower gripping member."

[0445] The lower rotation part 4B rotates the substrate W integrally with the lower holding part 3B. The operation of the lower rotation part 4B is controlled by the control part 102. The lower rotation part 4B has, for example, a lower shaft 23 and a lower motor main body 24.

[0446] The lower shaft 23 is a hollow shaft. The lower shaft 23 extends in the vertical direction along the third rotation axis AX3. The upper end of the lower shaft 23 is coupled to the lower spin base 22.

[0447] The lower motor body 24 rotates the lower shaft 23. As a result, the lower spin base 22 rotates. The operation of the lower motor body 24 is controlled by the control unit 102. The lower motor body 24 is, for example, an electric motor.

[0448] The lower nozzle portion 5B is housed in the inner space of the lower shaft 23. The tip of the lower nozzle portion 5B protrudes from the upper surface of the lower spin base 22.

[0449] The cup portion 621 is annular in plan view. The outer shape of the cup portion 621 may be circular in plan view. The cup portion 621 is disposed around the lower substrate holding portion 2B and surrounds the lower substrate holding portion 2B. The cup portion 621 receives the processing liquid discharged from the substrate W.

[0450] Specifically, cup portion 621 includes guard portion 621a that can be raised and lowered, and a cup lifting mechanism (not shown).

[0451] The guard part 621a has an annular shape in a plan view. The outer shape of the guard part 621a may be circular in a plan view. The cup lifting mechanism is controlled by the control unit 102 to raise and lower the guard part 621a between a liquid receiving position and a retracted position. The liquid receiving position is a position above the retracted position. When the guard part 621a is positioned at the liquid receiving position, the guard part 621a surrounds the substrate W and receives the processing liquid discharged from the substrate W. When the guard part 621a is positioned at the retracted position, the guard part 621a is positioned below the upper surface of the lower spin base 22.

[0452] The third liquid supply unit 500 supplies the processing liquid to the lower nozzle unit 5B. The third liquid supply unit 500 is controlled by the control unit 102. In the fourth embodiment, the third liquid supply unit 500 selectively supplies one of a fourth chemical liquid and a rinse liquid (DIW in this embodiment) to the lower nozzle unit 5B. Specifically, the third liquid supply unit 500 has a chemical liquid piping unit 501, a rinse liquid piping unit 502, a common piping unit 503, a first opening / closing valve 504, and a second opening / closing valve 505. The configuration of the third liquid supply unit 500 is similar to that of the second liquid supply unit 13 shown in FIG. 3, and therefore a detailed description thereof will be omitted.

[0453] The second gas supply unit 510 supplies gas to the lower nozzle unit 5B. The second gas supply unit 510 is controlled by the control unit 102. The gas is, for example, an inert gas. The inert gas is, for example, nitrogen gas or argon gas.

[0454] When gas is supplied from the second gas supply unit 510 to the lower nozzle unit 5B, the gas is ejected from the lower nozzle unit 5B. Specifically, when drying the substrate W, the control unit 102 causes the lower nozzle unit 5B to eject gas toward the lower surface Wb of the substrate W. Similar to the first gas supply unit 16, the second gas supply unit 510 has a gas supply piping unit 511 and an opening / closing valve 512. The configuration of the second gas supply unit 510 is similar to the configuration of the first gas supply unit 16, and therefore description thereof will be omitted.

[0455] The third drainage section 520 discharges the processing liquid collected by the cup section 621 to the outside of the cup section 621 (rinse-dry cup section 62c). More specifically, the third drainage section 520 discharges the processing liquid collected by the cup section 621 to the outside of the first processing block PB1. Similar to the drainage section 14c shown in FIG. 29, the third drainage section 520 has a drainage piping section 521 and an open / close valve 522. The upstream end of the drainage piping section 521 is connected to the bottom wall (not shown) of the cup section 621 and communicates with the inner space of the cup section 621. The configuration of the third drainage section 520 is similar to the configuration of the drainage section 14c shown in FIG. 29, and therefore a detailed description thereof will be omitted.

[0456] In the fourth embodiment, the upper substrate holding part 2A transfers the substrate W to and from the lower substrate holding part 2B. More specifically, the control part 102 controls the moving part 200A to move the upper substrate holding part 2A to a transfer position P7. The transfer position P7 indicates a position where the substrate W held by the upper substrate holding part 2A can be gripped by the plurality of lower chuck members 21. When the control part 102 moves the upper substrate holding part 2A to the transfer position P7, the control part 102 causes the plurality of lower chuck members 21 to grip the substrate W, and then releases the grip of the substrate W by the plurality of upper chuck members 31. As a result, the substrate W is held horizontally by the lower substrate holding part 2B.

[0457] After releasing the upper substrate holding part 2A from its grip on the substrate W, the control part 102 controls the moving part 200A (lifting mechanism 210A) to raise the upper substrate holding part 2A from the delivery position P7 to the position P1 facing the rinse drying cup part 62c.

[0458] Next, the substrate processing apparatus 100 of the fourth embodiment will be described with reference to Fig. 47. Fig. 47 is another cross-sectional view schematically showing the configuration of the first processing block PB1 included in the substrate processing apparatus 100 of the fourth embodiment.

[0459] 47, the fourth substrate processing unit PU4 further includes a fourth liquid supply part 530 and a first nozzle moving part 25. The fourth liquid supply part 530 includes a first moving nozzle 531.

[0460] The fourth liquid supply unit 530 discharges the fourth chemical liquid from the first moving nozzle 531 toward the upper surface Wa of the substrate W held by the lower substrate holding unit 2B, thereby supplying the fourth chemical liquid to the upper surface Wa of the substrate W (fourth chemical liquid processing). The fourth liquid supply unit 530 is controlled by the control unit 102.

[0461] Specifically, the fourth liquid supply unit 530 further includes a chemical liquid piping unit 532 and an on-off valve 533 in addition to the first moving nozzle 531. The chemical liquid piping unit 532 is a tubular member through which a fluid flows. The on-off valve 533 is provided in the chemical liquid piping unit 532. The on-off valve 533 can be opened and closed freely. The opening and closing operation of the on-off valve 533 is controlled by the control unit 102.

[0462] A fourth chemical liquid is supplied to the upstream end of chemical liquid piping section 532. The downstream end of chemical liquid piping section 532 is connected to first moving nozzle 531. Opening / closing valve 533 opens and closes the flow path in chemical liquid piping section 532. When opening / closing valve 533 is opened, the fourth chemical liquid is supplied to first moving nozzle 531. As a result, the fourth chemical liquid is ejected from first moving nozzle 531. When opening / closing valve 533 is closed, the flow of the fourth chemical liquid via chemical liquid piping section 532 is stopped. As a result, the ejection of the fourth chemical liquid by first moving nozzle 531 is stopped.

[0463] The first nozzle moving unit 25 is controlled by the control unit 102 to move the first moving nozzle 531 in the horizontal direction. Specifically, the first nozzle moving unit 25 moves the first moving nozzle 531 between a position above the substrate W held by the lower substrate holding unit 2B and a first retracted position. The first retracted position is a position outside the rinse-dry cup unit 62c.

[0464] In detail, while the fourth chemical liquid is being discharged from the first moving nozzle 531, the control unit 102 moves the first moving nozzle 531 above the substrate W. Therefore, the first moving nozzle 531 discharges the fourth chemical liquid toward the substrate W while moving in the space above the substrate W.

[0465] For example, first nozzle moving unit 25 may move first movable nozzle 531 along an arc-shaped movement trajectory. Control unit 102 may cause first movable nozzle 531 to reciprocate along the arc-shaped movement trajectory while discharging the fourth chemical liquid from first movable nozzle 531. First nozzle moving unit 25 may have, for example, a nozzle arm that supports first movable nozzle 531, and a turning mechanism that turns the nozzle arm around a rotation axis (not shown) that extends in the vertical direction. The turning mechanism includes, for example, an electric motor that can rotate forward and backward.

[0466] Next, the substrate processing apparatus 100 of the fourth embodiment will be described with reference to Fig. 48. Fig. 48 is yet another cross-sectional view schematically showing the configuration of the first processing block PB1 included in the substrate processing apparatus 100 of the fourth embodiment.

[0467] 48, the fourth substrate processing unit PU4 further includes a fifth liquid supply part 540 and a second nozzle movement part 26. The fifth liquid supply part 540 includes a second movement nozzle 541.

[0468] The fifth liquid supply unit 540 discharges a rinse liquid from a second movable nozzle 541 toward an upper surface Wa of the substrate W held by the lower substrate holding unit 2B, thereby supplying the rinse liquid to the upper surface Wa of the substrate W (rinsing process). The fifth liquid supply unit 540 is controlled by the control unit 102. Specifically, in addition to the second movable nozzle 541, the fifth liquid supply unit 540 further includes a rinse liquid piping unit 542 and an opening / closing valve 543. The configuration of the fifth liquid supply unit 540 is substantially the same as the configuration of the fourth liquid supply unit 530 described with reference to FIG. 47, and therefore description thereof will be omitted.

[0469] The second nozzle moving unit 26 is controlled by the control unit 102 to move the second moving nozzle 541 in the horizontal direction. More specifically, the second nozzle moving unit 26 moves the second moving nozzle 541 between a discharge position facing the center of the substrate W held by the lower substrate holding unit 2B and a second retracted position. The second retracted position is a position outside the rinse drying cup unit 62c. The control unit 102 moves the second moving nozzle 541 from the second retracted position to the discharge position, and causes the second moving nozzle 541 located at the discharge position to discharge the rinse liquid toward the upper surface Wa of the substrate W. Note that the configuration of the second nozzle moving unit 26 is substantially the same as the configuration of the first nozzle moving unit 25 described with reference to FIG. 47 , and therefore description thereof will be omitted.

[0470] Next, an example of the operation of the substrate processing apparatus 100 when processing the substrate W in the rinse-dry cup portion 62c will be described with reference to FIGS.

[0471] 30 and 31(a) to 31(d), when the time that has elapsed since the substrate W was immersed in the second chemical liquid in the second immersion tank 61b2 reaches or exceeds a predetermined time (predetermined second chemical liquid processing time), the control unit 102 moves the substrate W from the second immersion tank 61b2 to the rinse-dry cup unit 62c. Then, the control unit 102 causes the lower substrate holding unit 2B to hold the substrate W that has been processed with the second chemical liquid.

[0472] When the control unit 102 moves the substrate W from the second immersion bath 61b2 to the rinse-dry cup unit 62c, the control unit 102 may perform the puddle process as described with reference to FIGS.

[0473] After causing the lower substrate holding part 2B to hold the substrate W processed with the second chemical liquid, the control part 102 raises the upper substrate holding part 2A to a position P1 facing the rinse-dry cup part 62c.

[0474] The control unit 102 raises the upper substrate holding unit 2A to a position P1 facing the rinse-dry cup unit 62c, and then controls the lower rotation unit 4B (lower motor main body 24) to rotate the substrate W. Thereafter, the control unit 102 moves the second moving nozzle 541 from the second retracted position to the discharge position, and causes the second moving nozzle 541 to discharge the rinse liquid toward the upper surface Wa of the rotating substrate W, and also causes the lower nozzle unit 5B of the rinse-dry cup unit 62c to discharge the rinse liquid toward the lower surface Wb of the rotating substrate W. As a result, the second chemical liquid is washed away from the substrate W.

[0475] The control unit 102 stops the discharge of the rinse liquid when the time elapsed since the start of the rinse process reaches or exceeds a predetermined time (predetermined rinse process time). Then, the control unit 102 moves the second movable nozzle 541 from the discharge position to the second retracted position, and moves the first movable nozzle 531 from the first retracted position to above the substrate W. Thereafter, the control unit 102 discharges the fourth chemical liquid from the first movable nozzle 531 toward the upper surface Wa of the rotating substrate W, and discharges the fourth chemical liquid from the lower nozzle unit 5B of the rinse drying cup unit 62c toward the lower surface Wb of the rotating substrate W. The control unit 102 also horizontally moves the first movable nozzle 531, which is discharging the fourth chemical liquid. As a result, the substrate W is treated with the fourth chemical liquid (fourth chemical liquid treatment).

[0476] When the time that has elapsed since the start of the fourth chemical liquid processing reaches or exceeds a predetermined time (predetermined fourth chemical liquid processing time), the control unit 102 stops the discharge of the fourth chemical liquid. Then, the control unit 102 moves the first movable nozzle 531 from above the substrate W to the first retracted position, and moves the second movable nozzle 541 from the second retracted position to the discharge position. Thereafter, the control unit 102 executes a rinse process. As a result, the fourth chemical liquid is washed away from the substrate W.

[0477] Next, the drying process performed in the rinse drying cup section 62c will be described with reference to Fig. 49. Fig. 49 is yet another cross-sectional view schematically showing the configuration of the first processing block PB1 included in the substrate processing apparatus 100 of the fourth embodiment.

[0478] As shown in Figure 49, when drying the substrate W in the rinse-dry cup part 62c, the control part 102 lowers the upper substrate holding part 2A from the opposing position P1 of the rinse-dry cup part 62c to a drying position P8. The drying position P8 is a position between the transfer position P7 (see Figure 39) and the opposing position P1. When the control part 102 lowers the upper substrate holding part 2A to the drying position P8, gas is ejected from the upper nozzle part 5A and the lower nozzle part 5B of the rinse-dry cup part 62c toward the upper surface Wa and lower surface Wb of the rotating substrate W. As a result, the substrate W is dried.

[0479] Next, with reference to Figures 50 to 52, another example of puddle processing performed when moving a substrate W from the first processing cup part 61 to the second processing cup part 62 will be described, taking as an example the case where the substrate W is moved from the second immersion tank 61b2 to the rinse-dry cup part 62c. Figures 50 to 52 are views showing another example of puddle processing. Figures 50 to 52 schematically show cross sections of the transfer part 200A and the second immersion tank 61b2 as viewed from the front.

[0480] As shown in FIG. 50, the control unit 102 drains the second chemical liquid from the second immersion tank 61b2 before moving the substrate W from the second immersion tank 61b2 to the rinse-dry cup unit 62c.

[0481] Furthermore, while the second chemical liquid is being discharged, the control unit 102 rotates the substrate W and causes the upper nozzle unit 5A and the lower nozzle unit 5B of the second immersion tank 61b2 to discharge the second chemical liquid toward the upper surface Wa and lower surface Wb of the rotating substrate W. This process prevents the substrate W from drying, thereby preventing the pattern from collapsing and the generation of particles.

[0482] 51, when a predetermined time has elapsed since the start of discharge of the second chemical liquid, the control unit 102 stops the discharge of the second chemical liquid from the upper nozzle unit 5A and the discharge of the second chemical liquid from the lower nozzle unit 5B of the second immersion tank 61b2. Thereafter, the control unit 102 causes the upper nozzle unit 5A and the lower nozzle unit 5B of the second immersion tank 61b2 to discharge the rinse liquid toward the upper surface Wa and lower surface Wb of the rotating substrate W. As a result, a liquid film of the rinse liquid is formed on the upper surface Wa of the substrate W. In other words, the upper nozzle unit 5A discharges the rinse liquid toward the substrate W that has been processed with the second chemical liquid and is located inside the second immersion tank 61b2 (first processing cup unit 61), thereby forming a liquid film of the rinse liquid on the upper surface Wa of the substrate W.

[0483] After starting the discharge of the rinsing liquid, the control unit 102 raises the upper substrate holding unit 2A to the third processing position P4 while continuing the discharge of the rinsing liquid and the rotation of the substrate W. This processing prevents the substrate W from drying, and can prevent the collapse of the pattern and the generation of particles.

[0484] As described with reference to Figures 32 and 33, when the control unit 102 raises the upper substrate holding part 2A to the third processing position P4, it stops the discharge of the rinsing liquid and performs a puddle process to support a liquid film of the rinsing liquid on the upper surface Wa of the substrate W.

[0485] Specifically, the control unit 102 controls the upper rotation unit 4 (upper motor main body 42) to reduce the rotation speed of the substrate W to a rotation speed at which the rinsing liquid is not discharged from the substrate W. For example, the control unit 102 may reduce the rotation speed of the substrate W to 10 rpm. As a result, a liquid film of the rinsing liquid is supported on the upper surface Wa of the substrate W.

[0486] After the control unit 102 causes a liquid film of rinsing liquid to be supported on the upper surface Wa of the substrate W, it moves the upper substrate holding unit 2A from the third processing position P4 to the opposite position P1 of the second immersion tank 61b2 while maintaining the puddle state, as shown in Figure 52.

[0487] Thereafter, the control unit 102 moves the upper substrate holding unit 2A from the position P1 facing the second immersion tank 61b2 to the delivery position P7 (see FIG. 39) while maintaining the puddle state.

[0488] In the puddle process described with reference to Figures 50 to 52, the rotation speed of the substrate W is reduced to a rotation speed at which the rinsing liquid is not discharged from the substrate W to form a puddle state, but the control unit 102 may also stop the rotation of the substrate W and cause a liquid film of the rinsing liquid to be supported on the upper surface Wa of the substrate W.

[0489] 50 to 52, by supporting a liquid film of the rinse liquid on the upper surface Wa of the substrate W, it is possible to prevent the upper surface Wa of the substrate W from drying while the substrate W is being moved from the second immersion bath 61b2 (first processing cup part 61) to the rinse drying cup part 62c (second processing cup part 62). As a result, it is possible to prevent the pattern from collapsing and particles from being generated.

[0490] The fourth embodiment of the present invention has been described above with reference to Figures 46 to 52. According to the fourth embodiment, similar to the embodiments described with reference to Figures 1 to 45, a single substrate W in a horizontal position is immersed in a chemical solution stored in an immersion tank 61b to process the substrate W, thereby reducing the consumption of the chemical solution.

[0491] Furthermore, according to the fourth embodiment, the substrate W can be processed by discharging the chemical liquid onto the substrate W while moving the first moving nozzle 531, so that the substrate W can be processed with higher precision.

[0492] In the fourth embodiment, the lower substrate holding part 2B has a clamping type chuck mechanism, but the mechanism by which the lower substrate holding part 2B holds the substrate W is not limited to a clamping type chuck mechanism. For example, the lower substrate holding part 2B may have a vacuum type chuck mechanism.

[0493] In addition, in the fourth embodiment, the second gas supply unit 510 supplies gas to the lower nozzle unit 5B, but the second gas supply unit 510 may supply gas to a gap around the lower nozzle unit 5B. In this case, gas is ejected from around the lower nozzle unit 5B toward the lower surface Wb of the substrate W.

[0494] In addition, in the fourth embodiment, when the rinse process is performed on the substrate W inside the rinse drying cup part 62c, the rinse liquid is discharged from the second moving nozzle 541, but the rinse liquid may be discharged from the upper nozzle part 5A. In this case, the fifth liquid supply part 540 and the second nozzle moving part 26 may be omitted.

[0495] In addition, in embodiment 4, the lower substrate holding portion 2B held the substrate W when performing a rinse process on the substrate W inside the rinse drying cup portion 62c, but when performing a rinse process by ejecting a rinse liquid from the upper nozzle portion 5A, the substrate W may be held by the upper substrate holding portion 2A.

[0496] Furthermore, in the fourth embodiment, the lower substrate holding part 2B holds the substrate W when drying the substrate W, but the upper substrate holding part 2A may hold the substrate W instead.

[0497] In addition, in the fourth embodiment, gas is ejected from the upper nozzle part 5A and the lower nozzle part 5B of the rinse-dry cup part 62c when drying the substrate W, but the substrate W may be dried by increasing the rotation of the substrate W. In this case, the first gas supply part 16 and the second gas supply part 510 may be omitted.

[0498] [Embodiment 5] Next, a fifth embodiment of the present invention will be described with reference to Figures 53 to 56. However, only differences from the embodiment described with reference to Figures 1 to 52 will be described, and a description of the same aspects as the embodiment described with reference to Figures 1 to 52 will be omitted. Figure 53 is a schematic plan view of a substrate processing apparatus 100 according to the fifth embodiment. Figure 54 is a block diagram of the substrate processing apparatus 100 according to the fifth embodiment.

[0499] As shown in FIG. 53, each of the first processing block PB1 and the second processing block PB2 has a mounting table 7, a processing chamber 9, an upper substrate holding part 2A, a brush processing part 73, a substrate processing unit PU, a cleaning unit CU, a moving part 200A, a moving part 200C, a rail member 81, and a rail member 84.

[0500] The substrate processing unit PU has a first processing cup part 61. Specifically, the first processing cup part 61 includes an immersion tank 61c. The immersion tank 61c stores a processing liquid. The substrate W is immersed in the processing liquid stored in the immersion tank 61c. The brush processing part 73 brushes the upper surface Wa of the substrate W immersed in the processing liquid in the immersion tank 61c.

[0501] The moving unit 200C has a support arm 201C. The support arm 201C supports the brush processing unit 73. As shown in FIG. 54, the moving unit 200C has a lifting mechanism 210C and a moving mechanism 220C, similar to the moving unit 200A. The configurations of the lifting mechanism 210C and the moving mechanism 220C are the same as those of the lifting mechanism 210A and the moving mechanism 220A, and therefore detailed description thereof will be omitted. The rail member 84 guides the lifting mechanism 210C coupled to the support arm 201C in the first direction D1 (front-rear direction). The configuration of the rail member 84 is the same as that of the rail member 8 described with reference to FIGS. 1, 3, and 4, and therefore detailed description thereof will be omitted.

[0502] When the upper substrate holding part 2A and the brush processing part 73 are moved in the first direction D1, the positions of the support arm 201A and the support arm 201C in the vertical direction are different from each other, so that the support arm 201A and the support arm 201C can be prevented from interfering with each other.

[0503] Next, an example of the operation of the substrate processing apparatus 100 of embodiment 5 will be described with reference to Figures 53, 54, and 55(a) to 55(d). Figures 55(a) to 55(d) are diagrams schematically showing an example of the operation of the substrate processing apparatus 100 of embodiment 5. In detail, Figures 55(a) to 55(d) show an example of the operation of the first processing block PB1 when the first processing block PB1 processes one substrate W.

[0504] The control unit 102 controls the transport robot TR to place the substrate W on the mounting table 7, and then causes the substrate W placed on the mounting table 7 to be gripped by the plurality of upper chuck members 31. As a result, the upper substrate holding unit 2A (upper holding unit 3) holds the substrate W horizontally.

[0505] As shown in FIG. 55(a), when the substrate W is held by the upper substrate holding part 2A, the control part 102 controls the moving part 200A to immerse the substrate W in the processing liquid in the immersion tank 61c. Then, the control part 102 causes the substrate W to be transferred between the upper substrate holding part 2A and the lower substrate holding part 2C, which will be described later with reference to FIG. 56. Specifically, the control part 102 causes the lower chuck members 302, which will be described later with reference to FIG. 56, to grip the substrate W. Thereafter, the control part 102 controls the upper chuck driving mechanism 50 to release the grip of the substrate W by the multiple upper chuck members 31. As a result, the substrate W, immersed in the processing liquid in the immersion tank 61c, is held horizontally by the lower substrate holding part 2C.

[0506] As shown in Figure 55(b), when the control unit 102 releases the grip of the substrate W by the multiple upper chuck members 31, it controls the moving unit 200A to immerse the multiple upper chuck members 31 in the rinse liquid stored in the cleaning tank 63, and controls the moving unit 200C to move the brush processing unit 73 to a position where it will contact the substrate W in the immersion tank 61c.

[0507] 55(c), when the control unit 102 brings the brush processing unit 73 into contact with the upper surface Wa of the substrate W, it performs brush processing to clean the upper surface Wa of the substrate W. Specifically, it rotates the upper brush 731, which will be described later with reference to Fig. 56. Note that the control unit 102 may perform cleaning processing of the upper chuck member 31 in parallel with the brush processing.

[0508] When the time that has elapsed since the start of the brush process reaches or exceeds a predetermined time (predetermined brush process time), the control unit 102 ends the brush process. Specifically, the control unit 102 stops the rotation of the upper brush 731, which will be described later with reference to FIG. 56.

[0509] 55(d), when the brush treatment is completed, the control unit 102 controls the moving unit 200C to retract the brush processing unit 73 from the immersion tank 61c, and also controls the moving unit 200A and the upper chuck drive mechanism 50 to grip the brush-processed substrate W with the plurality of upper chuck members 31. Note that the control unit 102 may retract the brush processing unit 73 into the cleaning tank 63 and clean an upper brush 731, which will be described later with reference to FIG.

[0510] After causing the upper chuck members 31 to grip the brushed substrate W, the control unit 102 controls the moving unit 200A and the upper chuck driving mechanism 50 to place the brushed substrate W on the mounting table 7.

[0511] Next, the substrate processing unit PU and the brush processing unit 73 will be described with reference to Fig. 56. Fig. 56 is a schematic diagram showing the configuration of the first processing block PB1 included in the substrate processing apparatus 100 of embodiment 5. Fig. 56 schematically shows a cross section of the moving part 200A, a part of the moving part 200C, and the immersion tank 61c as viewed from the front side.

[0512] 56, the substrate processing unit PU has a first processing cup 61, a second liquid supply unit 13, a first drainage unit 14, a second drainage unit 15, and an exhaust unit 17. The first processing cup 61 includes an immersion tank 61c, a lower substrate holding unit 2C, and a lower chuck drive mechanism 310.

[0513] The immersion tank 61c has a bottom wall 611, a side wall 612, and an inner wall 613. The immersion tank 61c shown in Figure 56 does not have a lower nozzle 5B. The upstream end of the common piping 133 of the second liquid supply unit 13 is connected to the bottom wall 611 inside the inner wall 613, and communicates with the internal space of the immersion tank 61c.

[0514] The lower substrate holding part 2C is disposed inside the inner wall part 613 and horizontally holds the substrate W immersed in the processing liquid stored inside the inner wall part 613. The processing liquid stored in the immersion tank 61c when the substrate W is cleaned by the brush processing part 73 may be a chemical liquid or a rinse liquid.

[0515] Specifically, the lower substrate holding part 2C has a base 301 and a plurality of lower chuck members 302. The plurality of lower chuck members 302 are provided on the base 301. The base 301 is an example of a "lower base member." The plurality of lower chuck members 302 grip the peripheral edge of the substrate W. The substrate W is held horizontally by the plurality of lower chuck members 302 gripping the substrate W. The lower chuck members 302 are an example of a "lower gripping member."

[0516] More specifically, the base 301 is substantially disk-shaped and supports a plurality of lower chuck members 302 in a horizontal position. The base 301 is disposed inside the inner wall portion 613. The upper surface of the base 301 extends along a horizontal plane. The substrate W is placed on the upper surface of the base 301. That is, the lower surface Wb of the substrate W contacts the upper surface of the base 301. The height of the base 301 from the bottom wall portion 611 is lower than the height of the inner wall portion 613 from the bottom wall portion 611. The substrate W placed on the upper surface of the base 301 is immersed in a processing liquid stored inside the inner wall portion 613.

[0517] The plurality of lower chuck members 302 are arranged on the periphery of the base 301. The plurality of lower chuck members 302 grip the substrate W placed on the upper surface of the base 301.

[0518] The substrate W may be held horizontally at a position above the upper surface of the base 301. In other words, the plurality of lower chuck members 302 may grip the substrate W above the base 301. In this case, the substrate W is transferred between the upper chuck members 31 of the upper substrate holding part 2A and the lower chuck members 302 of the lower substrate holding part 2C.

[0519] The lower chuck driving mechanism 310 drives the plurality of lower chuck members 302 to cause the plurality of lower chuck members 302 to grip the substrate W. The lower chuck driving mechanism 310 also drives the plurality of lower chuck members 302 to release the grip of the substrate W by the plurality of lower chuck members 302. The lower chuck driving mechanism 310 is controlled by the control unit 102. That is, the operations of the plurality of lower chuck members 302 are controlled by the control unit 102.

[0520] Specifically, the lower chuck member 302 has a chuck pin 302a, a driven part 302b, and a connecting shaft 302c. The lower chuck driving mechanism 310 has a driving magnet 311, a driven magnet 312, a lifting plate 313, and a lifting mechanism 314.

[0521] The chuck pin 302a protrudes from the base 301. The chuck pin 302a has a pin-shaped portion and a contact portion that is provided at the tip of the pin-shaped portion and that comes into contact with the peripheral edge of the substrate W.

[0522] The driven part 302b and the connecting shaft 302c are disposed inside the base 301. Inside the base 301, an accommodation space is formed to accommodate the plurality of driven parts 302b and the plurality of connecting shafts 302c.

[0523] The base end of a chuck pin 302a is fixed to the connecting shaft 302c. The chuck pin 302a protrudes upward from the connecting shaft 302c. A driven part 302b is fixed to the connecting shaft 302c. The driven part 302b extends from the connecting shaft 302c toward the center of the base 301. The connecting shaft 302c extends horizontally.

[0524] The driven part 302b is free to swing up and down around the connecting shaft 302c. Because the driven part 302b is fixed to the connecting shaft 302c, when the driven part 302b swings, the connecting shaft 302c rotates. Furthermore, because the base end of the chuck pin 302a is fixed to the connecting shaft 302c, when the connecting shaft 302c rotates, the chuck pin 302a swings in the radial direction of the substrate W around the connecting shaft 302c. In other words, the driven part 302b and the chuck pin 302a swing together.

[0525] Specifically, when the driven part 302b rotates downward around the connecting shaft 302c, the chuck pin 302a rotates radially inward of the substrate W around the connecting shaft 302c, and the contact portion of the chuck pin 302a comes into contact with the peripheral edge of the substrate W. Each of the plurality of chuck pins 302a rotates radially inward of the substrate W around the corresponding connecting shaft 302c, thereby gripping the substrate W by the plurality of chuck pins 302a.

[0526] Furthermore, when the driven part 302b rotates upward around the connecting shaft 302c, the chuck pin 302a rotates radially outward from the substrate W around the connecting shaft 302c, and the contact portion of the chuck pin 302a moves away from the peripheral edge of the substrate W. As each of the plurality of chuck pins 302a rotates radially outward from the substrate W around the corresponding connecting shaft 302c, the substrate W is released from the grip of the plurality of chuck pins 302a.

[0527] The lower chuck drive mechanism 310 swings the driven part 302b around the connecting shaft 302c. More specifically, a drive magnet 311 is disposed below the driven part 302b. The driven magnet 312 is fixed to the driven part 302b. The lifting plate 313 supports the drive magnet 311. The lifting mechanism 314 is controlled by the control unit 102 to raise and lower the lifting plate 313. When the lifting mechanism 314 raises and lowers the lifting plate 313, the drive magnet 311 rises and lowers, approaching or moving away from the driven magnet 312. As a result, the driven part 302b swings around the connecting shaft 302c.

[0528] Specifically, the drive magnet 311 and the lift plate 313 are disposed inside the bottom wall portion 611. Inside the bottom wall portion 611, an accommodation space for accommodating the drive magnet 311 and the lift plate 313 is formed.

[0529] The drive magnet 311 is annular in plan view. For example, the drive magnet 311 may be annular. The drive magnet 311 is fixed to the upper surface of the lift plate 313. The lift plate 313 may be circular, for example. The actuator of the lift mechanism 314 includes, for example, a cylinder. The lift mechanism 314 moves the lift plate 313 in the up and down direction.

[0530] The driven magnet 312 is disposed directly above the drive magnet 311. The driven magnet 312 is also disposed so as to repel the drive magnet 311. Specifically, the driven magnet 312 and the drive magnet 311 are disposed so that the surfaces facing each other have the same polarity.

[0531] When the lifting mechanism 314 lifts the lifting plate 313, the drive magnet 311 lifts and approaches the driven magnet 312. As a result, the driven magnet 312 repels the drive magnet 311 and lifts, and the driven part 302b rotates upward around the connecting shaft 302c. Therefore, the chuck pin 302a rotates radially outward of the substrate W around the connecting shaft 302c. On the other hand, when the lifting mechanism 314 lowers the lifting plate 313, the drive magnet 311 lowers and moves away from the driven magnet 312. As a result, the driven magnet 312 lowers due to its own weight, and the driven part 302b rotates downward around the connecting shaft 302c. Therefore, the chuck pin 302a rotates radially inward of the substrate W around the connecting shaft 302c.

[0532] Next, a description will be given of the brush processing section 73. As shown in Figure 56, the brush processing section 73 has an upper brush 731, a brush holder 732, a shaft 733, and a motor body 734.

[0533] The brush holder 732 holds an upper brush 731. The upper brush 731 protrudes downward from the brush holder 732. The upper brush 731 comes into contact with the upper surface Wa of the substrate W to clean the upper surface Wa of the substrate W. The upper brush 731 is an example of an "upper brush member." Specifically, the upper brush 731 comes into contact with the upper surface Wa of the substrate W held by the lower substrate holding part 2C. Therefore, the upper brush 731 comes into contact with the upper surface Wa of the substrate W immersed in the processing liquid in the immersion tank 61c.

[0534] The shape of the upper brush 731 is not particularly limited. For example, the upper brush 731 may be strip-shaped or linear, or may be roughly fan-shaped in a plan view. Alternatively, the upper brush 731 may be circular in a plan view. The configuration of the upper brush 731 is similar to that of the lower brush 616 described with reference to FIG. 39 , and therefore a description thereof will be omitted.

[0535] In this embodiment, the shaft 733 and the motor body 734 form a "brush rotation unit." The brush rotation unit rotates the upper brush 731. The control unit 102 controls the brush rotation unit to rotate the upper brush 731 when the upper brush 731 is in contact with the upper surface Wa of the substrate W immersed in the processing liquid.

[0536] Specifically, the lower end of shaft 733 is coupled to the center of brush holder 732. Shaft 733 protrudes upward from brush holder 732. Shaft 733 extends along a fourth rotation axis AX4 that extends in the vertical direction. The upper end of shaft 733 is rotatably supported by support arm 201C. A portion of shaft 733 may be housed inside support arm 201C.

[0537] The motor body 734 rotates the shaft 733 about the fourth rotation axis AX4. As a result, the upper brush 731 rotates about the fourth rotation axis AX4. The operation of the motor body 734 is controlled by the control unit 102. The motor body 734 is, for example, an electric motor. The motor body 734 may be housed inside the support arm 201A.

[0538] The fifth embodiment of the present invention has been described above with reference to Figures 53 to 56. According to the fifth embodiment, it is possible to reduce the amount of chemical liquid consumed, as in the embodiments described with reference to Figures 1 to 52. Furthermore, according to the fifth embodiment, it is possible to clean the upper surface Wa of the substrate W by the brush processing unit 73.

[0539] In the fifth embodiment, the processing cup units 6 each include one immersion tank 61c, but the processing cup units 6 may each include a plurality of immersion tanks 61c.

[0540] In addition, in the fifth embodiment, the plurality of processing cup units 6 does not include the second processing cup unit 62, but the plurality of processing cup units 6 may include at least one second processing cup unit 62.

[0541] In addition, in the fifth embodiment, the mounting table 7 is provided in each of the first processing block PB1 and the second processing block PB2, but the mounting table 7 may be omitted.

[0542] In addition, in the fifth embodiment, the first processing block PB1 and the second processing block PB2 are each provided with a cleaning unit CU, but the cleaning unit CU may be omitted.

[0543] In addition, in the fifth embodiment, one upper substrate holding part 2A is provided in each of the first processing block PB1 and the second processing block PB2, but multiple upper substrate holding parts 2A may be provided in each of the first processing block PB1 and the second processing block PB2. Similarly, multiple brush processing parts 73 may be provided in each of the first processing block PB1 and the second processing block PB2.

[0544] [Embodiment 6] Next, a sixth embodiment of the present invention will be described with reference to Figures 57 to 59. However, only differences from the embodiment described with reference to Figures 1 to 56 will be described, and a description of the same aspects as the embodiment described with reference to Figures 1 to 56 will be omitted. Figure 57 is a schematic plan view of a substrate processing apparatus 100 according to the sixth embodiment. Figure 58 is a block diagram of the substrate processing apparatus 100 according to the sixth embodiment.

[0545] 57, each of the first processing block PB1 and the second processing block PB2 includes a mounting table 7, a processing chamber 9, an upper substrate holder 2A, a blocking unit 72, a plurality of substrate processing units PU, a moving unit 200A, a moving unit 200D, a rail member 81, and a rail member 85. Here, two substrate processing units PU are provided in the first processing block PB1. Similarly, two substrate processing units PU are provided in the second processing block PB2.

[0546] The substrate processing unit PU has a first processing cup part 61. Specifically, the first processing cup part 61 includes an immersion tank 61a. The substrate W is left in the immersion tank 61a while being immersed in a processing liquid stored in the immersion tank 61a.

[0547] The moving unit 200D has a support arm 201D. The support arm 201D supports the blocking unit 72. As shown in FIG. 58, the moving unit 200D has a lifting mechanism 210D and a moving mechanism 220D, similar to the moving unit 200A. The configurations of the lifting mechanism 210D and the moving mechanism 220D are the same as those of the lifting mechanism 210A and the moving mechanism 220A, and therefore detailed description thereof will be omitted. The rail member 85 guides the lifting mechanism 210D coupled to the support arm 201D in the first direction D1 (front-rear direction). The configuration of the rail member 85 is the same as that of the rail member 8 described with reference to FIGS. 1, 3, and 4, and therefore detailed description thereof will be omitted.

[0548] When the upper substrate holding part 2A and the blocking part 72 are moved in the first direction D1, the positions of the support arm 201A and the support arm 201D in the up-down direction are different from each other, so that the support arm 201A and the support arm 201D can be prevented from interfering with each other.

[0549] Next, the substrate processing unit PU and the blocking part 72 will be described with reference to Fig. 59. Fig. 59 is a schematic diagram showing the configuration of the first processing block PB1 included in the substrate processing apparatus 100 of embodiment 6. Fig. 59 schematically shows a cross section of the moving part 200A, a part of the moving part 200D, and the immersion tank 61a as viewed from the front side.

[0550] 59, the substrate processing unit PU has an immersion tank 61a, a heater 615, a second liquid supply unit 13, a first drainage unit 14, a second drainage unit 15, and an exhaust unit 17. The blocking unit 72 has a cover member 72a, an exhaust blocking unit 72b, and a connecting unit 72c. The connecting unit 72c connects the cover member 72a to the support arm 201D. The connecting unit 72c may be, for example, a rod-shaped member.

[0551] The control unit 102 controls the moving unit 200A and the upper chuck driving mechanism 50 to leave the substrate W on the multiple supports 614 of the immersion tank 61a, and then controls the moving unit 200D to move the blocking unit 72 to a position where the top opening of the immersion tank 61a is covered by the lid member 72a. Therefore, when the substrate W is immersed in the chemical solution in the immersion tank 61a, the top opening of the immersion tank 61a is covered by the lid member 72a. Note that when the lid member 72a covers the top opening of the immersion tank 61a, the lid member 72a may be in contact with the inner periphery 612c of the immersion tank 61a (the upper end of the side wall 612) or may be slightly spaced from the inner periphery 612c of the immersion tank 61a (the upper end of the side wall 612).

[0552] The shape of the lid member 72a is not particularly limited as long as it is a shape that covers the top opening of the immersion tank 61a. For example, the lid member 72a may be disk-shaped. In this case, the diameter of the lid member 72a is larger than the diameter of the top opening of the immersion tank 61a.

[0553] The exhaust cutoff part 72b is coupled to the lid member 72a. That is, the lid member 72a supports the exhaust cutoff part 72b. The exhaust cutoff part 72b discharges downward from the lid member 72a. The exhaust cutoff part 72b covers the gap SP when the lid member 72a is positioned to cover the top opening of the immersion tank 61a. Therefore, when the substrate W is immersed in the chemical solution in the immersion tank 61a, the gap SP is covered by the exhaust cutoff part 72b. The configuration of the exhaust cutoff part 72b is similar to the configuration of the exhaust cutoff part 71 described with reference to Figures 42 and 43, so a detailed description thereof will be omitted.

[0554] Embodiment 6 of the present invention has been described above with reference to FIGS. 57 to 59. According to embodiment 6, the consumption of chemical liquid can be reduced, similarly to the embodiments described with reference to FIGS. 1 to 56. Furthermore, according to embodiment 6, the top opening of immersion tank 61a can be covered with lid member 72a. Therefore, a decrease in the temperature of the chemical liquid stored in immersion tank 61a can be suppressed.

[0555] Specifically, when the top opening of the immersion tank 61a is open, gas above the immersion tank 61a is drawn into the inside of the immersion tank 61a. As a result, the temperature of the chemical solution in the immersion tank 61a may decrease due to the airflow drawn into the inside of the immersion tank 61a from above the immersion tank 61a. In contrast, according to the sixth embodiment, the top opening of the immersion tank 61a is covered by the lid member 72a, making it difficult for airflow to be drawn into the inside of the immersion tank 61a from above the immersion tank 61a. Alternatively, the flow rate of the airflow drawn into the inside of the immersion tank 61a from above the immersion tank 61a can be reduced. Therefore, according to the sixth embodiment, a decrease in the temperature of the chemical solution in the immersion tank 61a can be suppressed.

[0556] Furthermore, according to the sixth embodiment, the gap SP is covered by the exhaust blocking portion 72b during chemical treatment, as in the tenth and eleventh modifications. Therefore, a decrease in the temperature of the chemical in the immersion tank 61a (the chemical stored inside the inner wall portion 613) can be further suppressed.

[0557] In the sixth embodiment, the first processing block PB1 and the second processing block PB2 are not provided with cleaning units CU, but each of the first processing block PB1 and the second processing block PB2 may have a cleaning unit CU. In other words, the processing cups 6 may include cleaning tanks 63.

[0558] In addition, in the sixth embodiment, the first processing block PB1 and the second processing block PB2 each have two substrate processing units PU, but each of the first processing block PB1 and the second processing block PB2 may have one substrate processing unit PU or three or more substrate processing units PU. In other words, the multiple processing cups 6 may include one immersion tank 61a or three or more immersion tanks 61a.

[0559] In addition, in the sixth embodiment, the plurality of processing cup parts 6 does not include the second processing cup part 62, but the plurality of processing cup parts 6 may include at least one second processing cup part 62.

[0560] In addition, in the sixth embodiment, the mounting table 7 is provided in each of the first processing block PB1 and the second processing block PB2, but the mounting table 7 may be omitted.

[0561] In addition, in the sixth embodiment, one upper substrate holding part 2A is provided in each of the first processing block PB1 and the second processing block PB2, but multiple upper substrate holding parts 2A may be provided in each of the first processing block PB1 and the second processing block PB2. Similarly, multiple blocking parts 72 may be provided in each of the first processing block PB1 and the second processing block PB2.

[0562] [Embodiment 7] Next, a seventh embodiment of the present invention will be described with reference to Figure 60. However, differences from the embodiment described with reference to Figures 1 to 59 will be described, and a description of the same matters as in the embodiment described with reference to Figures 1 to 59 will be omitted. In the seventh embodiment, the configuration of the first processing cup part 61 differs from the embodiment described with reference to Figures 1 to 59.

[0563] Fig. 60 is a schematic diagram showing the configuration of the first processing block PB1 included in the substrate processing apparatus 100 of Embodiment 7. In detail, Fig. 60 shows a schematic cross section of the moving part 200A and the immersion tank 61d as viewed from the front side.

[0564] 60, in the seventh embodiment, each of the first processing block PB1 and the second processing block PB2 includes an upper substrate holder 2A, rail members 8 (first rail member 8a to fifth rail member 8e), a support plate 11, a first liquid supply unit 12, a first gas supply unit 16, a drying liquid supply unit 110, a moving unit 200A, and a substrate processing unit PU. The substrate processing unit PU includes an immersion tank 61d, a second liquid supply unit 13, a first drainage unit 14, a second drainage unit 15, a fourth drainage unit 230, and an exhaust unit 17. The upper nozzle unit 5A selectively discharges any one of a chemical liquid, a rinsing liquid (here, DIW), a drying liquid, and a gas.

[0565] The drying liquid supply unit 110 is controlled by the control unit 102 to supply drying liquid to the upper nozzle unit 5A. When the drying liquid is supplied from the drying liquid supply unit 110 to the upper nozzle unit 5A, the drying liquid is ejected from the upper nozzle unit 5A. When the substrate W is held by the upper substrate holding unit 2A, the control unit 102 causes the upper nozzle unit 5A to eject the drying liquid. Therefore, the drying liquid is supplied toward the upper surface Wa of the substrate W held by the upper substrate holding unit 2A. The drying liquid is, for example, IPA (isopropyl alcohol).

[0566] Specifically, the drying liquid supply unit 110 has a drying liquid piping unit 111 and an on-off valve 112. The drying liquid piping unit 111 is a tubular member through which a fluid flows. The on-off valve 112 is provided in the drying liquid piping unit 111. The on-off valve 112 can be opened and closed freely. The opening and closing operation of the on-off valve 112 is controlled by the control unit 102.

[0567] The drying liquid is supplied to the upstream end of the drying liquid piping section 111. The downstream end of the drying liquid piping section 111 is connected to the upper nozzle section 5A. The on-off valve 112 opens and closes the flow path in the drying liquid piping section 111. When the on-off valve 112 is opened, the drying liquid is supplied to the upper nozzle section 5A. When the on-off valve 112 is closed, the supply of the drying liquid to the upper nozzle section 5A stops.

[0568] The immersion tank 61d has a bottom wall 611, a side wall 612, an inner wall 613, a plurality of support members 614, an intermediate wall 617, and a lower nozzle member 5B. The immersion tank 61d differs from the immersion tank 61a described with reference to Figures 3 and 4 in that it has the intermediate wall 617.

[0569] The intermediate wall portion 617 is provided between the side wall portion 612 and the inner wall portion 613. In other words, the intermediate wall portion 617 is located inside the side wall portion 612. The intermediate wall portion 617 is located outside the inner wall portion 613. The intermediate wall portion 617 is provided at a position away from the side wall portion 612 and the inner wall portion 613.

[0570] The intermediate wall portion 617 protrudes upward from the bottom wall portion 611. The intermediate wall portion 617 is annular. The intermediate wall portion 617 may have, for example, a circular ring shape. The upper end of the intermediate wall portion 617 is located between the upper end of the side wall portion 612 and the upper end of the inner wall portion 613. In other words, the upper end of the intermediate wall portion 617 is located lower than the upper end of the side wall portion 612. Furthermore, the upper end of the intermediate wall portion 617 is located higher than the upper end of the inner wall portion 613.

[0571] The intermediate wall portion 617 may have a shape similar to that of the side wall portion 612. Specifically, the intermediate wall portion 617 may include an upper wall portion and a lower wall portion, similar to the side wall portion 612 (see FIG. 4).

[0572] In the seventh embodiment, the second drainage section 15 drains the treatment liquid collected between the inner wall section 613 and the intermediate wall section 617 from the immersion tank 61d. Specifically, the upstream end of the drainage piping section 151 is connected to the bottom wall section 611 of the immersion tank 61d between the inner wall section 613 and the intermediate wall section 617, and communicates with the inner space of the immersion tank 61d.

[0573] The fourth drainage section 230 drains the treatment liquid collected between the intermediate wall section 617 and the side wall section 612 from the immersion tank 61d. Specifically, the fourth drainage section 230, like the second drainage section 15, has a drainage piping section 231 and an open / close valve 232. The upstream end of the drainage piping section 231 is connected to the bottom wall section 611 of the immersion tank 61d between the intermediate wall section 617 and the side wall section 612, and communicates with the internal space of the immersion tank 61d. The configuration of the fourth drainage section 230 is similar to that of the second drainage section 15, and therefore a detailed description thereof will be omitted.

[0574] Next, an example of the operation of the substrate processing apparatus 100 of embodiment 7 will be described. For example, in embodiment 7, similarly to embodiment 1, chemical liquid processing is performed on the substrate W. Specifically, the substrate W is immersed in the chemical liquid stored inside the inner wall portion 613.

[0575] When a predetermined time (predetermined chemical solution processing time) has elapsed since the substrate W was immersed in the chemical solution, the control unit 102 executes the rinsing process described with reference to Figures 16 to 18. In the seventh embodiment, in the third step of the rinsing process, the substrate W is raised to a position between the upper end of the inner wall portion 613 and the upper end of the intermediate wall portion 617.

[0576] When a predetermined time has elapsed since the substrate W was raised to a position between the upper end of the inner wall portion 613 and the upper end of the intermediate wall portion 617, the control portion 102 executes the liquid film replacement process.

[0577] Specifically, the control unit 102 switches the second opening / closing valve 126 of the first liquid supply unit 12 and the second opening / closing valve 136 of the second liquid supply unit 13 from an open state to a closed state, and also switches the opening / closing valve 112 of the drying liquid supply unit 110 from a closed state to an open state. As a result, the discharge of the rinsing liquid stops, and the drying liquid is discharged from the upper nozzle unit 5A, so that the liquid film on the upper surface Wa of the substrate W is replaced with a liquid film of the drying liquid.

[0578] When a predetermined time has elapsed since the start of the liquid film replacement process, the control unit 102 controls the lifting mechanism 210A to raise the upper substrate holding part 2A to the fifth processing position P9. As a result, the substrate W is raised to a position between the upper end of the middle wall part 617 and the upper end of the side wall part 612. Note that the fifth processing position P9 indicates a position in the vertical direction.

[0579] When the control unit 102 raises the upper substrate holding unit 2A to the fifth processing position P9, it switches the opening / closing valve 112 of the drying liquid supply unit 110 from the open state to the closed state, thereby stopping the discharge of the drying liquid.

[0580] When the control unit 102 stops the discharge of the drying liquid, it switches the on-off valve 162 of the first gas supply unit 16 from the closed state to the open state, causing gas to be ejected from the upper nozzle unit 5A toward the rotating substrate W. As a result, the substrate W is dried.

[0581] The seventh embodiment of the present invention has been described above with reference to Fig. 60. According to the seventh embodiment, the consumption of chemical liquid can be reduced, similarly to the embodiments described with reference to Figs.

[0582] Furthermore, according to the seventh embodiment, the chemical liquid treatment is performed on the substrate W inside the inner wall portion 613. Furthermore, the rinsing treatment after the chemical liquid treatment is performed on the substrate W at a position lower than the upper end of the intermediate wall portion 617. On the other hand, the drying treatment on the substrate W is performed at a position between the upper end of the intermediate wall portion 617 and the upper end of the side wall portion 612. Therefore, since the drying treatment is performed at a position higher than the positions where the chemical liquid treatment and the rinsing treatment are performed, it is difficult for the chemical liquid mist to adhere to the substrate W.

[0583] [Embodiment 8] Next, an eighth embodiment of the present invention will be described with reference to Fig. 61. However, only differences from the embodiment described with reference to Figs. 1 to 60 will be described, and a description of the same matters as in the embodiment described with reference to Figs. 1 to 60 will be omitted.

[0584] Fig. 61 is a schematic diagram ...

Claims

1. a processing block for processing a substrate; a transport block disposed adjacent to the processing block; Equipped with the transport block has a transport device that transports the substrate between the transport block and the processing block; The processing block comprises: an upper substrate holding portion that holds the substrate horizontally; a plurality of processing cups arranged in a direction intersecting a direction in which the substrate moves between the transport block and the processing block; a moving mechanism that moves the upper substrate holding part in the intersecting direction; a lifting mechanism that lifts and lowers at least one of the upper substrate holding portion and the corresponding processing cup portion so that the position of the substrate held by the upper substrate holding portion changes from one upper position of the upper positions of the processing cup portions to an inner position of the corresponding processing cup portion; and the plurality of processing cups includes a first processing cup; The first processing cup holds a processing liquid that is in contact with the substrate located inside the first processing cup, and processes the substrate.

2. the plurality of processing cups includes a plurality of first processing cups, each of the first processing cups having a support portion for supporting the substrate; The substrate processing apparatus of claim 1 , wherein the upper substrate holding part transfers the different substrates between the upper substrate holding part and the respective support parts of the first processing cup part.

3. the treatment liquid includes a chemical solution, the substrate is processed with the chemical solution in the first processing cup; the substrate processing apparatus further includes a drainage unit that drains the chemical solution from the first processing cup unit, the upper substrate holding part has an upper nozzle part that ejects a rinse liquid toward the substrate, The substrate processing apparatus according to claim 2 , wherein the upper nozzle ejects the rinse liquid toward the substrate positioned inside the first processing cup from which the chemical liquid has been discharged by the drainage part.

4. The upper substrate holding portion is an upper holding portion that holds the substrate horizontally; an upper rotating part that rotates the substrate integrally with the upper holding part; and The substrate processing apparatus according to claim 3 , wherein the upper rotation unit rotates the substrate positioned inside the first processing cup unit to dry the substrate after the discharge of the rinse liquid has stopped.

5. The substrate processing apparatus according to claim 4 , wherein the upper nozzle portion ejects gas toward the substrate when drying the substrate.

6. The processing cup further includes a second processing cup; the second processing cup receives the rinse liquid discharged from the substrate; the lifting mechanism changes the position of the processed substrate, which is the substrate processed in the first processing cup, from a position inside the first processing cup to a position above the first processing cup; the moving mechanism moves the upper substrate holding part that holds the processed substrate to an opposing position facing the second processing cup part; The substrate processing apparatus of claim 1 , wherein the lifting mechanism changes the position of the processed substrate from a position above the second processing cup to a position inside the second processing cup.

7. the upper substrate holding part has an upper nozzle part that discharges the rinse liquid, The substrate processing apparatus of claim 6 , wherein the upper nozzle ejects the rinse liquid toward the processed substrate located inside the second processing cup.

8. The upper substrate holding portion is an upper holding portion that holds the substrate horizontally; an upper rotating part that rotates the substrate integrally with the upper holding part; and The substrate processing apparatus according to claim 7 , wherein the upper rotation unit rotates the processed substrate positioned inside the second processing cup unit to dry the processed substrate after the discharge of the rinse liquid has stopped.

9. The substrate processing apparatus according to claim 8 , wherein the upper nozzle unit ejects gas toward the processed substrate when drying the processed substrate.

10. the plurality of processing cup portions include a plurality of the first processing cup portions and one of the second processing cup portions; the treatment liquid includes a chemical solution, the substrate is processed in each of the first processing cup parts with different types of chemical solutions; The substrate processing apparatus according to claim 6 , wherein the movement mechanism moves the upper substrate holding part in accordance with a processing procedure that indicates a procedure for processing the substrate.

11. The substrate processing apparatus of claim 10 , wherein each of the first processing cup portions includes a support portion for supporting the substrate.

12. the plurality of processing cup portions include a plurality of first processing cup portions and a plurality of second processing cup portions; the treatment liquid includes a chemical solution, the substrate is processed in each of the first processing cup parts with different types of chemical solutions; The substrate processing apparatus of claim 6 , wherein the plurality of first processing cup parts and the plurality of second processing cup parts are arranged in accordance with a processing sequence that indicates a procedure for processing the substrate.

13. each of the first processing cups having a support portion for supporting the substrate; The substrate processing apparatus of claim 12 , wherein the second processing cup sandwiched between the first processing cups includes a support portion that supports the substrate.

14. The process sequence includes a final rinse step and a drying step for drying the substrate; the rinsing process refers to a process of washing the chemical solution off the substrate that has been processed in the first processing cup part, the plurality of first processing cup portions include a third processing cup portion in which a process immediately before the final rinsing process is performed; the plurality of second processing cups include a fourth processing cup in which the final rinsing process and the drying process are performed; the upper substrate holding portion includes a first upper substrate holding portion and a second upper substrate holding portion; The moving mechanism includes: a first moving mechanism that moves the first upper substrate holding part between the plurality of processing cup parts other than the fourth processing cup part; a second moving mechanism that moves the second upper substrate holding part between the third processing cup part and the fourth processing cup part; The substrate processing apparatus of claim 12 , comprising:

15. The upper substrate holding portion is an upper holding part that holds the substrate; an upper rotating part that rotates the substrate integrally with the upper holding part; and the substrate processing apparatus further includes a control unit that controls the rotation of the substrate by the upper rotation unit, the moving mechanism moves the upper substrate holding part that holds the processed substrate in the intersecting direction; 10. The substrate processing apparatus of claim 6, wherein the control unit controls the rotation speed of the processed substrate or stops the rotation of the processed substrate to maintain a puddle state in which a liquid film of the processing liquid is supported on the upper surface of the processed substrate when the lifting mechanism changes the position of the processed substrate from a position inside the first processing cup portion to a position above the first processing cup portion and the moving mechanism moves the upper substrate holding portion that holds the processed substrate in the intersecting direction.

16. The upper substrate holding portion is an upper holding part that holds the substrate; an upper rotating part that rotates the substrate integrally with the upper holding part; an upper nozzle portion that discharges the rinse liquid; and the substrate processing apparatus further includes a control unit that controls the rotation of the substrate by the upper rotation unit, the upper nozzle portion ejects the rinse liquid toward the processed substrate positioned inside the first processing cup portion to form a liquid film of the rinse liquid on an upper surface of the processed substrate; the moving mechanism moves the upper substrate holding part that holds the processed substrate in the intersecting direction; 10. The substrate processing apparatus according to claim 6, wherein the control unit controls the rotation speed of the processed substrate or stops the rotation of the processed substrate to maintain a puddle state in which a liquid film of the rinse liquid is supported on an upper surface of the processed substrate when the lifting mechanism changes the position of the processed substrate from a position inside the first processing cup section to a position above the first processing cup section and the moving mechanism moves the upper substrate holding section that holds the processed substrate in the intersecting direction.

17. The second processing cup portion is a lower holding portion that holds the substrate horizontally; a lower rotation unit that rotates the substrate integrally with the lower holding unit; a guard portion that surrounds the substrate held by the lower holding portion and receives chemical liquid discharged from the substrate; and the upper substrate holding part transfers the substrate after being processed in the first processing cup part to the lower holding part; The substrate processing apparatus includes: a moving nozzle that ejects the chemical solution toward the substrate held by the lower holding unit; a nozzle moving unit that moves the moving nozzle in a horizontal direction; Further provided with The substrate processing apparatus according to claim 6 , wherein the moving nozzle discharges the chemical solution while moving in the horizontal direction.

18. The processing block comprises: A plurality of the upper substrate holding portions; A plurality of the movement mechanisms; A plurality of the lifting mechanisms; and the plurality of moving mechanisms correspond to the plurality of upper substrate holding units; The substrate processing apparatus according to claim 1 , wherein the plurality of lifting mechanisms correspond to at least one of the plurality of upper substrate holding units and the plurality of processing cup units.

19. the first processing cup has an upper opening through which the substrate passes; The substrate processing apparatus according to claim 1 , further comprising a lid member that covers the upper opening.

20. The upper substrate holding portion is an upper base member; an upper gripping member provided on the upper base member and configured to horizontally grip the substrate; and the first processing cup has an inner periphery that defines an upper opening through which the substrate passes; When the substrate is positioned inside the first processing cup, a side surface of the upper base member is positioned opposite the inner peripheral edge portion, The substrate processing apparatus according to any one of claims 1 to 9, further comprising a cylindrical member positioned in the gap between the inner peripheral edge and the upper base member when the substrate is positioned inside the first processing cup portion.

21. The upper substrate holding portion is an upper base member; an upper gripping member provided on the upper base member and configured to horizontally grip the substrate; and The first processing cup portion is an inner peripheral edge portion that forms an upper opening through which the substrate passes; an annular inner wall portion located below the inner peripheral edge portion; and 10. The substrate processing apparatus according to claim 1, wherein the side surface of the upper base member covers the gap between the inner peripheral edge and the inner wall when the substrate is positioned inside the first processing cup portion.

22. the first processing cup includes an immersion tank that stores the processing liquid, The substrate processing apparatus according to claim 1 , wherein the substrate is immersed in the processing liquid in the immersion tank.

23. The upper substrate holding portion is an upper holding portion that holds the substrate horizontally; an upper rotating part that rotates the substrate integrally with the upper holding part; and the immersion tank has a lower brush member that contacts the lower surface of the substrate; The substrate processing apparatus according to claim 22 , wherein the upper rotating unit rotates the substrate immersed in the processing liquid and in contact with the lower brush member.

24. a brush processing unit that brushes the upper surface of the substrate immersed in the processing liquid; the first processing cup has a lower substrate holding portion that holds the substrate horizontally inside the immersion tank; the upper substrate holding part transfers the substrate to the lower substrate holding part, The brush processing unit includes: an upper brush member that contacts an upper surface of the substrate held by the lower substrate holding portion; a brush rotation unit that rotates the upper brush member; and 23 . The substrate processing apparatus according to claim 22 , wherein the brush rotation unit rotates the upper brush member when the upper brush member is in contact with the upper surface of the substrate immersed in the processing liquid.

25. the first processing cup has a lower substrate holding portion that holds the substrate horizontally inside the immersion tank; The upper substrate holding portion is an upper base member; an upper gripping member provided on the upper base member and configured to grip the substrate; an upper brush member provided on the upper base member and in contact with an upper surface of the substrate held by the lower substrate holding portion; an upper rotating portion that rotates the upper brush member and the upper gripping member integrally with the upper base member; and the upper substrate holding portion transfers the substrate from the upper gripping member to the lower substrate holding portion; 23 . The substrate processing apparatus according to claim 22 , wherein the upper rotating unit rotates the upper brush member when the upper brush member is in contact with the upper surface of the substrate immersed in the processing liquid.

26. the treatment liquid includes a chemical solution, The immersion tank stores the chemical solution, The substrate processing apparatus according to claim 22 , further comprising an undiluted solution supply unit that supplies an undiluted solution of the chemical to the immersion tank.

27. The first processing cup portion is a support portion that supports the substrate; a ring-shaped member for holding a liquid film of the processing liquid in contact with the upper surface of the substrate supported by the support; The substrate processing apparatus according to claim 1 , further comprising:

28. The first processing cup portion is a support portion that supports the substrate; a lower base member facing a lower surface of the substrate supported by the support portion; a lower nozzle portion provided on the lower base member; and the lower nozzle portion ejects the treatment liquid, 10. The substrate processing apparatus according to claim 1, wherein the processing liquid ejected from the lower nozzle portion is held in a gap between the lower surface of the substrate and the lower base member and contacts the lower surface of the substrate.

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